| Display title | Wafer backgrinding |
| Default sort key | Wafer backgrinding |
| Page length (in bytes) | 2,330 |
| Namespace ID | 0 |
| Page ID | 26422563 |
| Page content language | en - English |
| Page content model | wikitext |
| Indexing by robots | Allowed |
| Number of page watchers | Fewer than 30 watchers |
| Number of redirects to this page | 3 |
| Counted as a content page | Yes |
| Wikidata item ID | Q7959420 |
| Local description | Used to reduce the thickness of a microchip, for die stacking or for thin devices |
| Page views in the past 30 days | |
| Edit | Allow all users (no expiry set) |
| Move | Allow all users (no expiry set) |
| Page creator | Paramaggarwal (talk | contribs) |
| Date of page creation | 13:13, 4 March 2010 |
| Latest editor | ComputerUserUser (talk | contribs) |
| Date of latest edit | 19:30, 1 January 2024 |
| Total number of edits | 36 |
| Recent number of edits (within past 30 days) | 0 |
| Recent number of distinct authors | 0 |
| Hidden categories (2) | This page is a member of 2 hidden categories (help):
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| Transcluded templates (20) | Pages transcluded onto the current version of this page (help):
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| Wikidata entities used in this page | |
