3-Axis Fully-Integrated Capacitive Tactile Sensor with Flip-Bonded CMOS on LTCC Interposer †
<p>Conceptual figure of the 3-axis integrated tactile sensors on a flexible and stretchable bus line: (<b>a</b>) System diagram; (<b>b</b>) Physical implementation.</p> "> Figure 2
<p>Structure of the 3-axis integrated tactile sensor.</p> "> Figure 3
<p>(<b>a</b>) Electrode layout; Working principles for (<b>b</b>) normal force <span class="html-italic">F</span><sub>Z</sub> and (<b>c</b>) <span class="html-italic">X</span>-Axis shear force <span class="html-italic">F</span><sub>X</sub>.</p> "> Figure 4
<p>(<b>a</b>) Optical micrograph of the complementary metal-oxide semiconductor (CMOS) substrate; (<b>b</b>) Schematic diagram of the capacitive readout circuit; Time responses of (<b>c</b>) the voltage of the sensor capacitor <span class="html-italic">V</span><sub>C</sub> and (<b>d</b>) the oscillation output voltage <span class="html-italic">V</span><sub>out</sub>.</p> "> Figure 5
<p>Finite element method (FEM) simulation results: Diaphragm deflection by (<b>a</b>) normal force <span class="html-italic">F</span><sub>Z</sub> of 1 N and (<b>b</b>) <span class="html-italic">X</span>-Axis shear force <span class="html-italic">F</span><sub>X</sub> of 1 N applied to the positive direction; Calculated change of 3-axis output values by (<b>c</b>) <span class="html-italic">F</span><sub>Z</sub> and (<b>d</b>) <span class="html-italic">F</span><sub>X</sub>.</p> "> Figure 6
<p>Fabrication process of the 3-axis integrated tactile sensor: (<b>a</b>) Received CMOS substrate; (<b>b</b>) Thick SiO<sub>2</sub> film deposition; (<b>c</b>) Planarization and back grinding; (<b>d</b>) Pad opening; (<b>e</b>) Au electroplating; (<b>f</b>) Planarization of Au bumps and an Au sealing frame; (<b>g</b>) Formation of a ground (GND) electrode and rewiring; (<b>h</b>) Formation of 3-axis capacitor electrodes and rewiring; (<b>i</b>) Au-Au thermo-compression bonding; (<b>j</b>) Formation of a diaphragm; (<b>k</b>) Formation of bonding pads; (<b>l</b>) Surface mounting on a glass substrate with interconnections by an anisotropic conductive film (ACF).</p> "> Figure 7
<p>Surface profile of the multi-project wafer (MPW) before and after planarization.</p> "> Figure 8
<p>Fabrication results: Optical micrographs of (<b>a</b>) CMOS substrate with Au bumps, an Au sealing frame and a GND electrode and (<b>b</b>) low temperature cofired ceramic (LTCC) interposer substrate with 3-axis sensing electrodes; (<b>c</b>) Front side and (<b>d</b>) back side views of a fabricated tactile sensor; (<b>e</b>) Surface-mounted tactile sensor on a glass substrate with interconnections.</p> "> Figure 9
<p>(<b>a</b>) Experimental system diagram; (<b>b</b>) Digital signal output waveform from the fabricated 3-axis integrated tactile sensor.</p> "> Figure 10
<p>Measurement setup for applying (<b>a</b>) normal force and (<b>b</b>) shear force.</p> "> Figure 11
<p>Change of output value of the 3-axis integrated tactile sensor by (<b>a</b>) normal force <span class="html-italic">F</span><sub>Z</sub>; (<b>b</b>) shear force <span class="html-italic">F</span><sub>X</sub> and (<b>c</b>) shear force <span class="html-italic">F</span><sub>Y</sub>.</p> "> Figure 12
<p>Response of the 3-axis integrated tactile sensor as a function of temperature.</p> ">
Abstract
:1. Introduction
2. Design
2.1. Sensor Structure
2.2. Working Principle
2.3. FEM Simulation
3. Fabrication
4. Experiments and Results
4.1. Experimental Method
4.2. Results
5. Conclusions
Acknowledgments
Author Contributions
Conflicts of Interest
References
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Force | Sensitivity [Count/mN] | Noise [Count] | Hysteresis [%] | Average Cross-Axis Sensitivity [%] | ||
---|---|---|---|---|---|---|
X-Axis | Y-Axis | Z-Axis | ||||
FX (−1 to 1 N) | 15.1 | 12.4 | ≤ 1.7 | - | 5.5 | 9.0 |
FY (−1 to 1 N) | 14.1 | 7.6 | ≤ 1.1 | 5.2 | - | 7.2 |
FZ (0 to 1.3 N 1) | ≥ 34.5 | 3.5 | ≤ 0.3 | 8.2 | 10.4 | - |
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Asano, S.; Muroyama, M.; Nakayama, T.; Hata, Y.; Nonomura, Y.; Tanaka, S. 3-Axis Fully-Integrated Capacitive Tactile Sensor with Flip-Bonded CMOS on LTCC Interposer. Sensors 2017, 17, 2451. https://doi.org/10.3390/s17112451
Asano S, Muroyama M, Nakayama T, Hata Y, Nonomura Y, Tanaka S. 3-Axis Fully-Integrated Capacitive Tactile Sensor with Flip-Bonded CMOS on LTCC Interposer. Sensors. 2017; 17(11):2451. https://doi.org/10.3390/s17112451
Chicago/Turabian StyleAsano, Sho, Masanori Muroyama, Takahiro Nakayama, Yoshiyuki Hata, Yutaka Nonomura, and Shuji Tanaka. 2017. "3-Axis Fully-Integrated Capacitive Tactile Sensor with Flip-Bonded CMOS on LTCC Interposer" Sensors 17, no. 11: 2451. https://doi.org/10.3390/s17112451