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An investigation of haptic feedback effects in telepresent microassembly

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Abstract

New manufacturing techniques are being continuously developed to facilitate producing micro parts and products. However, the assembly of these parts becomes very demanding when it comes to manual assembly, e.g. the assembly of prototypes or small batch sizes. The implementation of telepresence technology for such a task segment is a promising solution. This paper discusses the influences of haptic feedback for telepresent micro assembly. Furthermore, an experiment for haptic learning is described.

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Acknowledgments

This work was supported in part by the German Research Foundation (DFG) within the Collaborative Research Center SFB 453 on “High-Fidelity Telepresence and Teleaction”.

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  1. Institute for Machine Tools and Industrial Management, Technische Universität München, Boltzmannstr. 15, 85748, Garching, Germany

    Gunther Reinhart & Andrea Reiter

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  1. Gunther Reinhart
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  2. Andrea Reiter
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Correspondence to Andrea Reiter.

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Reinhart, G., Reiter, A. An investigation of haptic feedback effects in telepresent microassembly. Prod. Eng. Res. Devel. 5, 581–586 (2011). https://doi.org/10.1007/s11740-011-0332-z

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  • DOI: https://doi.org/10.1007/s11740-011-0332-z

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