"Power-safe application of tdf patterns to flip-chip designs during wafer test."

Wei Zhao et al. (2013)

> Home

Details and statistics

DOI: 10.1145/2491477.2491487

access: closed

type: Journal Article

metadata version: 2018-11-06

- view
  - electronic edition via DOI
  - unpaywalled version
  authority control:
- export record
  dblp key:
  - journals/todaes/ZhaoMTC13
- ask others
- share record
  persistent URL:
  - https://dblp.org/rec/journals/todaes/ZhaoMTC13
Wei Zhao, Junxia Ma, Mohammad Tehranipoor, Sreejit Chakravarty:
Power-safe application of tdf patterns to flip-chip designs during wafer test. ACM Trans. Design Autom. Electr. Syst. 18(3): 43:1-43:20 (2013)

manage site settings

To protect your privacy, all features that rely on external API calls from your browser are turned off by default. You need to opt-in for them to become active. All settings here will be stored as cookies with your web browser. For more information see our F.A.Q.