"Automotive Power Module Packaging: Current Status and Future Trends."

Yuhang Yang et al. (2020)

> Home

Details and statistics

DOI: 10.1109/ACCESS.2020.3019775

access: open

type: Journal Article

metadata version: 2020-10-06

- view
  - electronic edition via DOI (open access)
  authority control:
- export record
  dblp key:
  - journals/access/YangDRME20
- ask others
- share record
  persistent URL:
  - https://dblp.org/rec/journals/access/YangDRME20
Yuhang Yang, Lea Dorn-Gomba, Romina Rodriguez, Christopher Mak, Ali Emadi:
Automotive Power Module Packaging: Current Status and Future Trends. IEEE Access 8: 160126-160144 (2020)

manage site settings

To protect your privacy, all features that rely on external API calls from your browser are turned off by default. You need to opt-in for them to become active. All settings here will be stored as cookies with your web browser. For more information see our F.A.Q.