"Physical Model for Power Supply Noise and Chip/Package Co-Design in ..."

Gang Huang et al. (2007)

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DOI: 10.1109/CICC.2007.4405859

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type: Conference or Workshop Paper

metadata version: 2021-10-14

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Gang Huang, Deepak C. Sekar, Azad Naeemi, Kaveh Shakeri, James D. Meindl:
Physical Model for Power Supply Noise and Chip/Package Co-Design in Gigascale Systems with the Consideration of Hot Spots. CICC 2007: 841-844

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