"Thermal analysis of semiconductor devices and materials - Why should I not ..."

Martin Kuball et al. (2019)

> Home

Details and statistics

DOI: 10.1109/BCICTS45179.2019.8972763

access: closed

type: Conference or Workshop Paper

metadata version: 2022-10-02

- view
  - electronic edition via DOI
  - unpaywalled version
  authority control:
- export record
  dblp key:
  - conf/bcicts/KuballPGO19
- ask others
- share record
  persistent URL:
  - https://dblp.org/rec/conf/bcicts/KuballPGO19
Martin Kuball, James W. Pomeroy, Filip Gucmann, Bahar Oner:
Thermal analysis of semiconductor devices and materials - Why should I not trust a thermal simulation ? BCICTS 2019: 1-5

manage site settings

To protect your privacy, all features that rely on external API calls from your browser are turned off by default. You need to opt-in for them to become active. All settings here will be stored as cookies with your web browser. For more information see our F.A.Q.