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2020 – today
- 2023
[j10]Wei Wang
, Gongbo Zhou, Guoqing Ma, Xiaodong Yan, Ping Zhou, Zhenzhi He, Tianbing Ma:
A Novel Competitive Temporal Convolutional Network for Remaining Useful Life Prediction of Rolling Bearings. IEEE Trans. Instrum. Meas. 72: 1-12 (2023)- [j9]Xiaodong Yan, Gongbo Zhou, Ping Zhou, Wei Wang, Lianfeng Han, Zhenzhi He:
A Power Allocation Method for Wireless Sensor Networks Based on Data Priority: A Case Study of Scraper Chain Tension Monitoring Network. IEEE Trans. Instrum. Meas. 72: 1-11 (2023) - [c1]Xiaodong Yan, Gongbo Zhou, Ping Zhou, Wei Wang, Lianfeng Han, Zhenzhi He:
A Transmission Power Distribution Method Based on Lyapunov for Scraper Chain Tension Monitoring Network. ISCC 2023: 588-593 - 2021
- [j8]Zhenzhi He, Xiaodong Yan, Yuan Sun, Wei Wang, Gongbo Zhou, Ping Zhou, Chaoquan Tang, Fan Jiang:
A Novel Wear Detection Method Based on FPC: A Case Study on the Hoisting Cage Sliding Sleeve. IEEE Trans. Instrum. Meas. 70: 1-11 (2021) - [j7]Ping Zhou, Gongbo Zhou, Houlian Wang, Dongxu Wang, Zhenzhi He:
Automatic Detection of Industrial Wire Rope Surface Damage Using Deep Learning-Based Visual Perception Technology. IEEE Trans. Instrum. Meas. 70: 1-11 (2021) - 2020
- [j6]Libo Zhao, Zhenzhi He, Zengxiang Wang, Lei Su, Xiangning Lu:
Simulation and Experimental Investigation on Active Thermography Test of the Solder Balls. IEEE Trans. Ind. Informatics 16(3): 1617-1624 (2020)
2010 – 2019
- 2019
- [j5]Panpan Yang, Gongbo Zhou, Zhencai Zhu, Chaoquan Tang, Zhenzhi He, Penghui Wang:
Linear Permanent Magnet Eddy Current Brake for Overwinding Protection. IEEE Access 7: 33922-33931 (2019) - 2018
- [j4]Xiangning Lu, Zhenzhi He, Lei Su, Mengying Fan, Fan Liu, Guanglan Liao, Tielin Shi:
Detection of Micro Solder Balls Using Active Thermography Technology and K-Means Algorithm. IEEE Trans. Ind. Informatics 14(12): 5620-5628 (2018) - 2017
- [j3]Fan Liu, Lei Su, Mengying Fan, Jian Yin, Zhenzhi He, Xiangning Lu:
Using scanning acoustic microscopy and LM-BP algorithm for defect inspection of micro solder bumps. Microelectron. Reliab. 79: 166-174 (2017) - [j2]Hongdi Zhou, Tielin Shi, Guanglan Liao, Jianping Xuan, Jie Duan, Lei Su, Zhenzhi He, Wuxing Lai:
Weighted Kernel Entropy Component Analysis for Fault Diagnosis of Rolling Bearings. Sensors 17(3): 625 (2017) - 2016
- [j1]Mengying Fan, Li Wei, Zhenzhi He, Wei Wei, Xiangning Lu:
Defect inspection of solder bumps using the scanning acoustic microscopy and fuzzy SVM algorithm. Microelectron. Reliab. 65: 192-197 (2016)
Coauthor Index
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