HCD-CP500MD

SERVICE MANUAL AEP Model

UK Model
Ver. 1.4 2006.12
E Model
Australian Model
Chinese Model

HCD-CP500MD is the Amplifier, MD deck,

CD player, Tape player and Tuner section
in CMT-CP500MD.

Model Name Using Similar Mechanism New

CD CD Mechanism Type CDM55F-K4BD43
Section Base Unit Type BU-K4BD43
Optical Pick-up Type KSM-213DHAP
Model Name Using Similar Mechanism New
MD
MD Mechanism Type MDM-7B
Section
Optical Pick-up Type KMS-260B
Tape deck Model Name Using Similar Mechanism New
Section Tape Transport Mechanism Type Mech deck

SPECIFICATIONS
Amplifier section Specifications (continued) Tape player section
AEP, UK model: Inputs Recording system 4-track 2-channel stereo
DIN power output (rated): 30 + 30 W ANALOG IN (phono jacks): Frequency response 50 – 13,000 Hz (±3 dB),
(6 ohms at 1 kHz, DIN) Sensitivity 250 mV, using a Sony TYPE I
Continuous RMS power output (reference): impedance 47 kilohms cassette
35 + 35 W DIGITAL OPTICAL IN (Supported sampling Wow and flutter ±0.15% W. Peak (IEC)
(6 ohms at 1 kHz, 10% frequencies: 32 kHz, 44.1 kHz and 48 kHz) 0.1% W. RMS (NAB)
THD) ±0.2% W. Peak (DIN)
Music power output (reference): Outputs
85 + 85 W PHONES (stereo minijack): MD deck section
Accepts headphones with System MiniDisc digital audio
Other models: an impedance of 8 ohms
The following measured at 230 V AC, 60 Hz system
or more Laser Semiconductor laser
DIN power output (rated): 30 + 30 W SPEAKER: Accepts impedance of 6 to
(6 ohms at 1 kHz, DIN) (λ =780 nm)
16 ohms Emission duration:
Continuous RMS power output (reference):
35 + 35 W continuous
CD player section Sampling frequency 44.1 kHz
(6 ohms at 1 kHz, 10%
THD) System Compact disc and digital Frequency response 5 Hz – 20 kHz
The following measured at 220 V AC, 60 Hz audio system
DIN power output (rated): 24 + 24 W Laser Semiconductor laser — Continued on next page —
(6 ohms at 1 kHz, DIN) (λ = 780 nm)
Continuous RMS power output (reference): Emission
27 + 27 W duration: continuous
(6 ohms at 1 kHz, 10% Wavelength 780 – 790 nm
THD) Frequency response 2 Hz – 20 kHz (±0.5 dB)

MICRO HI-FI COMPONENT SYSTEM

9-873-216-05 Sony Corporation
2006L16-1 Personal Audio Division
© 2006.12 Published by Sony Techno Create Corporation
HCD-CP500MD

Tuner section
FM stereo, FM/AM superheterodyne tuner
FM tuner section
Tuning range 87.5 – 108.0 MHz
(50-kHz step)
Antenna FM wire antenna
Antenna terminals 75 ohm unbalanced
Intermediate frequency 10.7 MHz
AM tuner section
Tuning range
AEP and UK model: 531 – 1,602 kHz
(with the tuning interval
set at 9 kHz)
Other models: 530 – 1,710 kHz
(with the tuning interval
set at 10 kHz)
531 – 1,602 kHz
(with the tuning interval
set at 9 kHz)
Antenna AM loop antenna, external
antenna terminal
Intermediate frequency 450 kHz
General
Power requirements
Chinese model: 220 V AC, 50/60 Hz
AEP and UK model: 230 V AC, 50/60 Hz
Australian and Hong Kong model:
220 – 240 V AC,
50/60 Hz
Other models: 110 – 120 V or 220 –
240 V AC , 50/60 Hz
Adjustable with voltage
selector

Power consumption
AEP and UK model: See the nameplate
0.5 W (in the standby
mode)
Other models: See the nameplate

Dimensions (w/h/d) Approx. 190 × 252 ×

335 mm incl. projecting
parts and controls

Mass Approx. 7.0 kg

Supplied accessories Remote commander (1)

AM loop antenna (1)
FM wire antenna (1)
Batteries (2)

Design and specifications are subject to change

without notice.

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 HCD-CP500MD

TABLE OF CONTENTS

1. SERVICING NOTES ······················································ 4

Self-diagnosis display
2. GENERAL ·········································································· 9
This system has a Self-diagnosis display
function to let you know if there is a system 3. DISASSEMBLY ······························································ 11
malfunction. The display shows a code made
4. TEST MODE ··································································· 20
up of three letters and a message alternately to
show you the problem. To solve the problem 5. MECHANICAL ADJUSTMENTS ···························· 26
refer to the following list. If any problem
persists, consult your nearest Sony dealer. 6. ELECTRICAL ADJUSTMENTS ······························ 26

7. DIAGRAMS
7-1. CIRCUIT BOARDS LOCATIONS ··································· 41
7-2. BLOCK DIAGRAM – CD SECTION – ··························· 42
BLOCK DIAGRAM – MAIN SECTION – ······················ 43
BLOCK DIAGRAM – MD SECTION – ·························· 44
BLOCK DIAGRAM – PANEL SECTION – ···················· 45
7-3. PRINTED WIRING BOARD – CD BOARD – ················ 46
7-4. SCHEMATIC DIAGRAM – CD BOARD – ····················· 47
7-5. PRINTED WIRING BOARD – BD BOARD – ················ 48
7-6. SCHEMATIC DIAGRAM – BD BOARD (1/2) – ············ 49
7-7. SCHEMATIC DIAGRAM – BD BOARD (2/2) – ············ 50
7-8. PRINTED WIRING BOARDS – AUDIO SECTION – ···· 51
C11/Protected 7-9. SCHEMATIC DIAGRAM – AUDIO SECTION (1/2) – ··· 52
7-10. SCHEMATIC DIAGRAM – AUDIO SECTION (2/2) – ··· 53
The MD is protected against erasure. 7-11. PRINTED WIRING BOARD – TC BOARD – ················· 54
Remove the MD and slide the tab to close the 7-12. SCHEMATIC DIAGRAM – TC BOARD – ······················ 55
slot (see page 16). 7-13. PRINTED WIRING BOARD – DIGITAL BOARD – ······ 56
7-14 SCHEMATIC DIAGRAM – DIGITAL BOARD – ··········· 57
C12/Cannot Copy 7-15. PRINTED WIRING BOARDS – CONTROL SECTION – ··· 58
You tried to record a CD or MD with a format that 7-16 SCHEMATIC DIAGRAM – CONTROL BOARD – ········ 59
the system does not support, such as a CD-ROM. 7-17. PRINTED WIRING BOARD – POWER BOARD – ········ 60
7-18. SCHEMATIC DIAGRAM – POWER BOARD – ············· 60
p Remove the disc and turn off the system once,
7-19. IC BLOCK DIAGRAMS ·················································· 61
then turn it on again. 7-20. IC Pin Function Description ·············································· 63
C13/REC Error
8. EXPLODED VIEWS ····················································· 71
Recording could not be performed properly.
p Move the system to a stable place, and start 9. ELECTRICAL PARTS LIST ····································· 78
recording over from the beginning.
The MD is dirty or scratched, or the MD does not
meet the standards.
p Replace the MD and start recording over from
the beginning.
C13/Read Error
The MD deck cannot read the disc information
properly.
p Remove the MD once, then load it again.
C14/Toc Error
The MD deck cannot read the disc information
properly.
p Replace the MD.
p Erase all the recorded contents of the MD using
All Erase Function (see page 27).
C41/Cannot Copy
The sound source is a copy of commercially
available music software.
p The Serial Copy Management System prevents
making a digital copy (see page 47).

3
HCD-CP500MD
SECTION 1
SERVICING NOTE
NOTES ON HANDLING THE OPTICAL PICK-UP SAFETY-RELATED COMPONENT WARNING!!
BLOCK OR BASE UNIT
COMPONENTS IDENTIFIED BY MARK 0 OR DOTTED LINE WITH
The laser diode in the optical pick-up block may suffer electrostatic MARK 0 ON THE SCHEMATIC DIAGRAMS AND IN THE PARTS
break-down because of the potential difference generated by the LIST ARE CRITICAL TO SAFE OPERATION. REPLACE THESE
charged electrostatic load, etc. on clothing and the human body. COMPONENTS WITH SONY PARTS WHOSE PART NUMBERS
During repair, pay attention to electrostatic break-down and also APPEAR AS SHOWN IN THIS MANUAL OR IN SUPPLEMENTS
use the procedure in the printed matter which is included in the PUBLISHED BY SONY.
repair parts.
The flexible board is easily damaged and should be handled with
care.

FOR CD
NOTES ON LASER DIODE EMISSION CHECK
The laser beam on this model is concentrated so as to be focused on
the disc reflective surface by the objective lens in the optical pick-
up block. Therefore, when checking the laser diode emission,
observe from more than 30 cm away from the objective lens.

FOR MD
NOTES ON LASER DIODE EMISSION CHECK
Never look into the laser diode emission from right above when
checking it for adjustment. It is feared that you will lose your sight.

Laser component in this product is capable

of emitting radiation exceeding the limit for
Class 1.

This appliance is classified as a CLASS 1 LASER product. The

CLASS 1 LASER PRODUCT MARKING is located on the rear
exterior.
This caution
label is
located inside
the unit.

CAUTION
Use of controls or adjustments or performance of procedures
other than those specified herein may result in hazardous radiation
exposure.

Notes on chip component replacement

• Never reuse a disconnected chip component.
• Notice that the minus side of a tantalum capacitor may be
damaged by heat.

Flexible Circuit Board Repairing

• Keep the temperature of soldering iron around 270˚C
during repairing.
• Do not touch the soldering iron on the same conductor of the
circuit board (within 3 times).
• Be careful not to apply force on the conductor when soldering
or unsoldering.

4
 HCD-CP500MD

DRAWING OUT THE TRAY DURING POWER OUT

Tray

Move the cam block in the direction

of the arrow with a finger.

CLEANING THE OPTICAL PICK-UP (CD PLAYER)

CD mechanism deck Floating screw

Optical pick-up block

Clean the lens block

with applicator.

5
HCD-CP500MD

SERVICE POSITION OF THE MD MECHANISM DECK

MD mechanism deck
(MDM-7B) CN304 MAIN board

MD DIGITAL board

CN1001

BD board

CN301

CN801

SERVICE POSITION OF THE CD MECHANISM DECK

MAIN board

LOADING board CN308

CD mechanism deck CN1
(CDM55F-K4BD43) CN302

CD board

CN101

6
 HCD-CP500MD

SERVICE POSITION OF THE TAPE MECHANISM DECK

Tape mechanism deck

CN303

CN301

7
HCD-CP500MD

JIG FOR CHECKING BD (MD) BOARD WAVEFORM

The special jig (J-2501-196-A) is useful for checking the waveform of the BD (MD) board. The names of terminals and the checking items
to be performed are shown as follows.

GND : Ground
I+3V : For measuring IOP (Check the deterioration of the optical pick-up laser)
IOP : For measuring IOP (Check the deterioration of the optical pick-up laser)
TE : TRK error signal (Traverse adjustment)
VC : Reference level for checking the signal
RF : RF signal (Check jitter)
FE : Focus error signal

CN105

IOP
TE
VC
I+3V
GND
FE
RF

1
I+3V I+3V
IOP Iop
GND GND for
TE TE MDM-7B
FE FE
VC VC
RF RF
7

8
 HCD-CP500MD
SECTION 2
GENERAL

1 2 3 4 56 78

wj 9
q;
wh
qa
wg
qs
wf
wd qd
ws qf
qg
qh

wa w; ql qk qj

BASS wd (40) PHONES jack wa TREBLE ws (40)

CD EJECT Z qh (8, 9, 16, 50) PLAY MODE DIRECTION wj TUNER BAND qs (34, 35, 50)
CD x qj (9, 10, 17, 38) (9, 10, 13 – 15, 24, 37 – 39) TUNING MODE wj (34, 35)
CD u qk (9, 10) PUSH OPEN/CLOSE Z 6 (37) TUNING –/+ qa (34, 35)
DSG wh (40) REC MODE 3 (20, 50) VOLUME w; (41)
ENTER/START 5 (17, 18, 38, Remote sensor 1 BUTTON DESCRIPTIONS
39) REPEAT 2 (9, 13, 34)
FUNCTION wf (9, 10, 13, 14, 19, STEREO/MONO 2 (35) . > qa (9, 10, 13 – 15)
22, 23, 37, 39, 43) SYNCHRO 4 (17, 18, 38) m M qa (9, 13, 37)
MD EJECT Z ql (13, 24) TAPE REC z 0 (39) @/1 (power) wg (7, 16, 24, 35, 41,
MD REC z qg (19, 22, 23) TAPE Y 7 (37 –39) 43, 50)
MD u qd (13 – 15, 19) TAPE x 8 (18, 37 – 39)
MD x qf (13, 15, 17 – 20, 38, TAPE X 9 (37, 39)
39)

9
HCD-CP500MD

Setting the time

1 Turn on the system.
123 2 Press CLOCK/TIMER SET on the
remote.
If you are setting the clock for the first time,
go to step 5.

wh 4 3 Press . or > on the remote

repeatedly until “CLOCK SET?”
5 appears in the display.
wg
wf 6 4 Press ENTER/YES on the remote.
The hour indication flashes.
wd 5 Press . or > on the remote
7 repeatedly to set the hour.

ws 8 6 Press ENTER/YES or CURSORt on

the remote.
9 The minute indication flashes.
wa 0
w; 7 Press . or > on the remote
qa repeatedly to set the minute.
ql qs 8 Press ENTER/YES on the remote.
qk The clock will begin operating.
qj qd To reset the system clock
Start over from step 1.
qh
qg qf

BASS/TRE 5 (40) Number buttons 7 (9, 10, 12, 14,

CD qj (9 – 11) 15, 25, 35)
CLEAR 8 (10, 14, 15, 25, 36) PLAY MODE wh (9, 10, 13 – 15,
CLOCK/TIMER SELECT 2 24, 32)
(42, 43) REPEAT wg (9, 13)
CLOCK/TIMER SET 4 (7, 41, SCROLL ws (12, 15, 26)
42) SLEEP 1 (40)
CURSOR T/t 9 (7, 12, 25) TAPE qh
DISPLAY wa (8, 10, 11, 15, 19, TUNER BAND ql (34, 35)
36) VOLUME +/– qd (41)
DSG qf (40)
ENTER/YES 6 (7, 10, 12, 14, BUTTON DESCRIPTIONS
20 – 23, 25 – 34, 36, 41 – 43)
FUNCTION qg (9, 10, 13, 14, 19, @/1 (power) 3 (7, 16, 24, 35, 41,
22, 23, 37, 39, 43) 43)
MD qk (13, 14, 25, 27 – 30, 32) m M 9 (28, 30)
MENU/NO wf (12, 21 – 24, 26 – . > 0 (7, 11, 12, 21 – 23,
34) 25 – 34, 40 – 42)
NAME EDIT/SELECT wd (11, N qa (9, 10, 13, 15, 23)
12, 24, 25, 36) x qs (23)
X w; (9, 13, 28)

10
 HCD-CP500MD
SECTION 3
DISASSEMBLY
• The equipment canbe removed using the following procedure.

Set

Upper cover and case (L), (R)

(Page 11)

Tape mechanism deck Front panel section Back panel and MAIN board
(Page 12) (Page 12) (Page 14)

Panel section MD mechanism POWER board CD mechanism deck

(Page 13) deck section (Page 14) section
(Page 15) (Page 18)

Tray, gear and D cam CD base unit (CDM55)

MD base unit section (CDM55) (Page 19)
(Page 15) (Page 18)
Optical pick-up (CD)
BD board Over write head (HR901) block section (KSM-213 DHAP)
(Page 16) (Page 17) (Page 19)

Motor section Optical pick-up (MD)

(Page 16) (Page 17)

Note: Follow the disassembly procedure in the numerical order given.

3-1. UPPER COVER AND CASE (L), (R)

9 Upper cover
(Remove in the direction 7 screw
of the arrow.) (+ BTP 3 x 8)

2 screw
(+ BTP 3 x 8)
3 Case (L)
(Remove in the direction
of the arrow.)

q; Flat cable (18 core)

(CN301)

1 Two screws
(Case 3 TP 2) 5 screw
(+ BTP 3 x 8)

8 Two screws
(+ KTP 3 x 8)

4 Two screws
6 Case (R) (Case 3 TP 2)
(Remove in the direction
of the arrow.)

11
HCD-CP500MD

3-2. TAPE MECHANISM DECK

Top panel

6 Tape mechanism deck

1 Flat cable
(12 core) (CN302) 5 Four screws
(+BTP 3 x 8)
3 Connector (CN301)

4 TC board

2 Three screws
(+BVTT 2.6 x 5)

3-3. FRONT PANEL SECTION

3 Flat cable (25 core)

(CN301)
1 Two screws
(+BTP 3 x 8)
2 Earth wire
9 Front panel section

7 Screw
(+KTP 3 x 8)

4 Flat cable (25 core)

(CN304)
5 Connector (C306)

8 Two screws 6 Screw

(+BTP 3 x 8) (+KTP 3 x 8)

12
 HCD-CP500MD

3-4. PANEL SECTION

4 Three screws (+BTP 3 x 8)

5 MD cover

6 Two screws (+BTP 3 x 8)

qa MD-INDICATE board
ql CONTROL board
q; Screw
(+BVTP 2.6 x 8)
7 MD block qj Eighteen screws
(+BVTP 2.6 x 8)

8 Connector
(CN806)
qf CD-PRISM
board

Front panel

2 Two knobs
(BASS/TREBLE)
qk Flat cable (25 core)
(CN801)

qs Screw (+BVTP 2.6 x 8)

qd Prism retainer board

3 Hexagon nut 9 Connector

(CN808) qg Four screws
(+BVTP 2.6 x 8)
1 Knob(VOL)
qh HEAD PHONE board

13
HCD-CP500MD

3-5. BACK PANEL AND MAIN BOARD

5 Eight screws
(+BTP 3 x 8)
2 Connector (CN551)
qa OPTICAL board

0 Optical retainer board

9 Screw
(+BTP 3 x 8)

1 Connector (CN902)

6 Back panel

7 Two screws
(+BTP 3 x 12)

8 MAIN board

3 Connector
(CN308)

4 Flat cable (22 core)

(CN302)

3-6. POWER BOARD

2 Connector (CN901)
6 POWER board

4 Power retainer board

5 Four screws
(+BVTP 4 x 8)
3 Screw
(+BTP 3 x

1 Cord stopper

14
 HCD-CP500MD

3-7. MD MECHANISM DECK SECTION

1 Flat cable (17 core)

3 Two screws (CN103)
(+BTP 3 x 8)

2 Flat cable (27 core)

4 DIGITAL board (CN102)

6 MD cover

8 MD mechanism deck

7 MD cover

5 Two screws
(+BTP 3 x 8)

3-8. MD BASE UNIT

3 Holder assy

1 Spring

2 Hook

15
HCD-CP500MD

3-9. BD BOARD

1 Remove the solders

(Two portion)
2 Remove the solders (SLED motor)
(Two portion)
(SPINDLE motor)

6 Flexible board
(CN101) M102

M101
3 Remove the solders
(Two portion) M103
(LOADING motor)
S102

4 Remove the solders

7 Connector (CN104) (Three portion)

5 Two screws
(+BTP2 x 6) 8 BD board

3-10. MOTOR SECTION

1 Lever (head)
3 Spring (spindle), tortion

2 Belt (CDM55)

8 Two screws
4 Two screws (+PWH 1.7 x 3.5)
(+PWH 1.7 x 3.5)

9 Sled motor
(M102)
5 Loading motor 7 Spindle motor
(M103) (M101)
6 Three screws
(TAPPING M1.7)

16
 HCD-CP500MD

3-11. OVER WRITE HEAD (HR901)

1 Screw (P 1.7 x 6)

2 Over write head

(HR901)

3-12. OPTICAL PICK-UP (MD)

8 Optical pick-up (for MD)

6 Main shaft

3 Screw (+BTP 2 x 6)

7 Flexible board 4 Base (BU-A)

5 Screw (+KTP2 x 6)

1 Screw (+BTP 2 x 6)

2 Base (BU-D)

17
HCD-CP500MD

3-13. CD MECHANISM DECK SECTION

1 Two screws
2 MPEG braket (+BTP 3 x 8)

3 Screw
(+BTP 3 x 8)

5 Connector (CN1)

6 CD mechanism deck
(Two claws)

4 Flat cable (22core)

(CN101)

3-14. TRY, GEAR AND D CAM SECTION (CDM55)

4 Belt (CDM55)
5 Spacer (55)
6 Pulley (LDG)
8 Gear (B)

9 Gear (A)
7 Roller

0 Cam (CDM55)

2 Push the claw in tne

direction of the arrow C. C

1 Pull out the tray in the arrow direction A,

A
B and release the lock while pressing
this claw in the arrow direction B.

3 Pull out the tray. B Release

18
 HCD-CP500MD

3-15. CD BASE UNIT (CDM55)

2Remove the HOLDER (BU)

1 Floating screw assembly in the direction
(PTPWH M2.6) of the arrow A.

3 Chassis (F)

3-16. OPTICAL PICK-UP (CD) BLOCK SECTION

(KSM-213DHAP)
2 Two screws
@ (+PTPWH M2.6)
qs Optical pick-up (CD) block
@ (KSM-213DHAP)
8 Two insulators

3 Two screws
@ (+PTPWH M2.6)
q; Remove the four solders.

1 Flat cable (16 core)

7Two insulators

qa CD board

5 Two springs 9 screw

(+ BTP 2.6 x 6)

4 Holder (213D)

6 Two springs

19
HCD-CP500MD
SECTION 4
TEST MODE

Note 1: About “R”

As this unit has only a few buttons, some operations require the use of remote commander (RM-SCP500/provided with unit: 1-476-754-11)
buttons. These operations are indicated as “R” in this manual.
Example: MENU/NO “R” ...Press the [MENU/NO] button of the remote commander.
Note 2: Incorrect operations may be performed if the MD test mode is not entered properly.
In this case, press the ?/1 button to turn the power off, and retry to enter the MD test mode.

[Cold Reset]
• The cold reset clears all data including preset data stored in the RAM to initial conditions. Execute this mode when returning the set to
the customers.

Procedure:
1. Press ?/1 button to turn the set ON.
2. Press three buttons BAND , REC MODE and Z (CD) simultaneously.
3. Press ?/1 button again, the LCD displays “Initialize” and the set is reset.
• Initialized conditions
FUNCTION : TUNER FM 87.5MHz
VOLUME : MIN
DSG : ON

[PANEL Test Mode]

• This mode is used to check the software version, LCD, LED and keyboard.

Procedure:
1. Press three bottons x (TAPE) , REC MODE and Z (CD) simultaneously.
2. LEDs and LCD are all turned on.
3. When you want to enter the software version display mode, press REPEAT/STEREO/MONO .The model name and destination are
displayed and “MD” and “CD” segments flash.
4. Each time REPEAT/STEREO/MONO is pressed, the display changes MC, GC, CD, CDD, CDMA,CDMB, BDA, BDB, ST, TA, TM,
TC and MD in this order, and returns to the top of the version display.
5. When REC MODE is pressed while the version numbers are being displayed, year, month and day of the software creation appear.
When REC MODE is pressed again, the display returns to the software version display. When REPEAT/STEREO/MONO is
pressed while year, month and day of the software creation are being displayed, the year, month and day of creation of the software
versions are displayed in the same order of version display.
6. Press PLAYMODE/DIRECTION button, and the key check mode is activated. In the key check mode, the LCD displays “K 0 J 0 V 0”.
Each time a button is pressed, “K 0” value increases. However, once a button is pressed, it is no longer taken into account. “J 0” value
increases like 1, 2, 3.... if rotating BASS or TREBLE knob clockwise, or it decreases like 0, 9, 8.... if rotating counter-clockwise.
“V 0” value increases like 1, 2, 3.... if rotating VOLUME knob clockwise, or it decreases like 0, 9, 8.... if rotating counter-clockwise.
7. To exit from this mode, press three buttons in the same manner as step 1, or disconnect the power cord.

[MC Test Mode]

• This mode is used to check operations of the respective sections of Amplifier, Tuner, CD and Tape.

Procedure:
1. Press the ?/1 button to turn on the set.
2. Press the three buttons x (TAPE), REC MODE and z REC (MD) simultaneously.
3. The “MD” and “TAPE” segments flash.
4. When the VOLUME knob is rotated clockwise even slightly, the sound volume increases to its maximum and a message “VOLUME
MAX” appears for two seconds. then the display returns to the original display.
5. When the VOLUME knob is rotated counter-clockwise even slightly, the sound volume decreases to its minimum and a message
“VOLUME MIN” appears for two seconds, then the display returns to the original display.
6. To exit from this mode, press three button BAND , REC MODE and Z (CD) (TAPE) simultaneously or disconnect the power cord.

20
 HCD-CP500MD

MD SECITON
1. PRECAUTIONS FOR USE OF TEST MODE
• As operations related to loading will be performed regardless of the test mode operations being performed, be sure to check that the disc
is stopped before setting and removing it.
Even if the Z (MD) button is pressed while the disc is rotating during continuous playback, continuous recording, etc., the disc will not
stop rotating.
Therefore, it will be ejected while rotating.
Be sure to press the Z (MD) button after pressing the MENU/NO “R” button and the rotation of disc is stopped.

1-1. Recording laser emission mode and operating buttons

• Continuous recording mode (CREC 1MODE)
• Laser power check mode (LDPWR CHECK)
• Laser power adjustment mode (LDPWR ADJUST)
• Comparison with initial Iop value written in nonvolatile memory (Iop Compare)
• Write current Iop value in read nonvolatile memory using microprocessor (Iop NV Save)
• Traverse (MO) check (EF MO CHECK)
• Traverse (MO) adjustment (EF MO ADJUST)
• When pressing the z MD button.

2. SETTING THE TEST MODE

The following are two methods of entering the test mode.
Procedure : 1. Press the ?/1 button to turn the power on.
2. Press the [FUNCTION] button to set the MD function.
3. Press three buttons of ENTER/START , > , and z REC (MD) simultaneously.
When the test mode is set, “[Check]” will be displayed. Pressing the . “R” or > “R” button between the following three
groups; ···Tt [Check] Tt [Service] Tt [Develop] Tt ···.

Note: Do not use the test mode in the [Develop] group.

If used, the unit may not operate normally.
If the [Develop] group is set accidentally, press the MENU/NO “R” button immediately to exit the [Develop] group.

3. RELEASING THE TEST MODE

Press the [REPEAT STEREO/MONO] button twice to display “Initialize”, then release the MD test mode.

4. BASIC OPERATIONS OF THE TEST MODE

All operations are performed using the . “R” , > “R” , ENTER/YES “R” and MENU/NO “R” .
The functions of these buttons are as follows.

Function name Function

. “R” , > “R” buttons Changes parameters and modes
ENTER/YES “R” button Proceeds onto the next step. Finalizes input
MENU/NO “R” button Returns to previous step. Stops operations

21
HCD-CP500MD

5. SELECTING THE TEST MODE

There are 26 types of test modes as shown below. The groups can be switched by pressing the . “R” or > “R” button. After selecting the
group to be used, press the ENTER/YES “R” button. After setting a certain group, pressing the . “R” or > “R” button switches modes
shown below.
Refer to “Group” in the table for details can be selected.
All items used for servicing can be treated using group [Service]. So be carefully not to enter other groups by mistake.
Note: Do not use the test mode in the [Develop] group.
If used, the unit may not operate normally.
If the [Develop] group is set accidentally, press the MENU/NO “R” button immediately to exit the [Develop] group.

Group
Display No. Details Mark
Check Service
AUTO CHECK C01 Automatic self-diagnosis
Err Display C02 Error history display, clear
TEMP ADJUST C03 Temperature compensation offset adjustment
LDPWR ADJUST C04 Laser power adjustment
Iop Write C05 Iop data writing
Iop NV Save C06 Writes current Iop value in read nonvolatile memory using microprocessor
EF MO ADJUST C07 Traverse (MO) adjustment
EF CD ADJUST C08 Traverse (CD) adjustment
FBIAS ADJUST C09 Focus bias adjustment
AG Set (MO) C10 Auto gain output level adjustment (MO)
AG Set (CD) C11 Auto gain output level adjustment (CD)
TEMP CHECK C12 Temperature compensation offset check
LDPWR CHECK C13 Laser power check
EF MO CHECK C14 Traverse (MO) check
EF CD CHECK C15 Traverse (CD) check
FBIAS CHECK C16 Focus bias check
ScurveCHECK C17 S-curve check
VERIFYMODE C18 Nonvolatile memory check
DETRK CHECK C19 Detrack check
0920 CHECK C25 Most circumference check
Iop Read C26 Iop data display
Iop Compare C27 Comparison with initial Iop value written in nonvolatile memory
ADJ CLEAR C28 Initialization of nonvolatile memory for adjustment values
INFORMATION C31 Display of microprocessor version, etc.
CPLAY 1MODE C34 Continuous playback mode
CREC 1MODE C35 Continuous recording mode

• For details of each adjustment mode, refer to “5. Electrical Adjustments”.

For details of “Err Display”, refer to “Self-Diagnosis Function” on page 3.
• If a different mode has been selected by mistake, press the MENU/NO “R” button to release that mode.
• Modes with (×) in the Mark column are not used for servicing and therefore are not described in detail. If these modes are set acciden-
tally, press the MENU/NO “R” button to release the mode immediately.

22
 HCD-CP500MD

5-1. Operating the Continuous Playback Mode

1. Entering the continuous playback mode
(1) Set the disc in the unit. (Whichever recordable discs or discs for playback only are available)
(2) Press the . “R” or > “R” button to display “CPLAY 1MODE” (C34).
(3) Press the ENTER/YES “R” button to change the display to “CPLAY1MID”.
(4) When access completes, the display changes to “C = AD = )”.
Note: The numbers “ ” displayed show you error rates and ADER.
2. Changing the parts to be played back
(1) Press the ENTER/YES “R” button during continuous playback to change the display as below.
“CPLAY 1MID” t “CPLAY 1OUT” t “CPLAY 1IN”

When pressed another time, the parts to be played back can be moved.
(2) When access completes, the display changes to “C = AD = )”.
Note: The numbers “ ” displayed show you error rates and ADER.
3. Ending the continuous playback mode
(1) Press the MENU/NO “R” button. The display will change to “CPLAY 1MODE” (C34).
(2) Press the Z (MD) button and take out the disc.
Note: The playback start addresses for IN, MID, and OUT are as follows.
IN : 40h cluster
MID : 300h cluster
OUT : 700h cluster

5-2. Operating the Continuous Recording Mode (Use only when performing self-recording/palyback check)
1. Entering the continuous recording mode
(1) Set a recordable disc in the unit.
(2) Press the . “R” or > “R” button to display “CREC 1MODE” (C35).
(3) Press the ENTER/YES “R” button to change the display to “CREC 2MID”.
(4) When access completes, the display changes to “CREC (1 )” and “REC” is displayed.
Note: The numbers “ ” displayed shows you the recording position addresses.
2. Changing the parts to be recorded
(1) When the ENTER/YES “R” button is pressed during continuous recording, the display changes as below.
“CREC 1MID” t “CREC 1OUT” t “CREC 1IN”

When pressed another time, the parts to be recorded can be changed. “REC” goes off.
(2) When access completes, the display changes to “CREC (1 )” and “REC” is displayed.
Note: The numbers “ ” displayed shows you the recording position addresses.
3. Ending the continuous recording mode
(1) Press the MENU/NO “R” button. The display changes to “CREC 1MODE” (C35) and “REC” goes off.
(2) Press the Z (MD) button and take out the disc.
Note 1: The recording start addresses for IN, MID, and OUT are as follows.
IN : 40h cluster
MID : 300h cluster
OUT : 700h cluster
Note 2: The MENU/NO “R” button can be used to stop recording anytime.
Note 3: Do not perform continuous recording for long periods of time above 5 minutes.
Note 4: During continuous recording, be careful not to apply vibration.

6. FUNCTIONS OF OTHER BUTTONS

Function Contents
N X MD Sets continuous playback when this is pressed in the STOP state. When this is pressed during continu-
ous playback, playback position moves.
x (MD) Stops continuous playback and continuous recording
M “R” The sled moves to the outer circumference only when this is pressed
m “R” The sled moves to the inner circumference only when this is pressed
PLAY MODE Switches the spindle servo mode (CLV S y CLV A)
REC MODE Switches the displayed digit each time the button is pressed
MD Z Ejects the disc
REPEAT STEREO/MONO Releases the test mode

23
HCD-CP500MD

8. AUTOMATIC SELF-DIAGNOSIS FUNCTION

This test mode performs CREC and CPLAY automatically for mainly checking the characteristics of the optical pick-up.
To perform this test mode, the laser power must first be checked.
Perform AUTO CHECK after the laser power check and Iop Compare.

Procedure:
1. Press the . “R” or > “R” button to display “AUTO CHECK” (C01).
2. Press the ENTER/YES “R” button. If “LDPWR ” is displayed, it means that the laser power check has not been performed.
In this case, perform the laser power check and Iop Compare, and then repeat from enter the MD test mode.
3. If a disc is in the mechanical deck, it will be ejected forcibly.
“DISC IN” will be displayed in this case. Load a test disc (MDW-74/GA-1) which can be recorded.
4. If a disc is loaded at step 3, the check will start automatically.
5. When “XX CHECK” is displayed, the item corresponding to XX will be performed.
When “06 CHECK” completes, the disc loaded at step 3 will be ejected. “DISC IN” will be displayed. Load the check disc (TDYS-1).
6. When the disc is loaded in step 5, the check will automatically be resumed from “07 CHECK”.
7. After completing to “0C CHECK” of test item 12, check OK or NG will be displayed. If all items are OK, “CHK ALL OK” will be
displayed. If any item is NG, it will be displayed as “NG:xxxx”.

When “CHK ALL OK” is displayed, it means that the optical pick-up is normal. Check the operations of other parts (spindle motor, sled
motor, etc.).
When displayed as “NG:xxxx”, it means that the optical pick-up is faulty. In this case, replace the optical pick-up.

9. INFORMATION
Display the software version.

Procedure:
1. Press the . “R” or > “R” button to display “INFORMATION” (C31).
2. Press the ENTER/YES “R” button.
3. The software version will be displayed.
4. Press the MENU/NO “R” button to end this mode.

10. IOP DATA RECORDING AND DISPLAY WHEN OPTICAL PICK-UP AND NON-VOLATILE MEMORY (IC195 OF BD
BOARD) ARE REPLACED

The IOP value labeled on the optical pick-up can be recorded in the non-volatile memory. By recording the value, it will eliminate the need
to look at the value on the label of the optical pick-up. When replacing the optical pick-up or non-volatile memory (IC195 of BD (MD)
board), record the IOP value on the optical pick-up according to the following procedure.

Record Procedure:
1. Press the ?/1 button to turn the power on.
2. Press the [FUNCTION] button to set the MD function.
3. Press three buttons of [ENTER/START], > and z REC (MD) simultaneously to enter the MD test mode and display “[Check]”.
4. Press the . “R” or > “R” button to display “[Service]”.
5. Press the ENTER/YES “R” button to display “AUTO CHECK”, and press the > “R” button to display “Iop Write”.
6. Press the ENTER/YES “R” button.
7. The display becomes “Ref= @@@.@” (@ is an arbitrary number) and the numbers which can be changed will blink.
8. Input the IOP value written on the optical pick-up.
To select the number : Press the . “R” or > “R” button.
To select the digit : Press the [REC MODE] button.
9. When the ENTER/YES “R” button is pressed, the display becomes “Measu=@@@.@” (@ is an arbitrary number).
10. As the adjustment results are recorded for the step 9 value. Leave it as it is and press the ENTER/YES “R” button.
11. “Complete!” will be displayed momentarily. The value will be recorded in the non-volatile memory and the display will become “Iop
Write”.
12. Press the [REPEAT STEREO/MONO] button twice to complete. “Initialize” will be displayed and release the MD test mode.

Display Precedure:
1. Press the ?/1 button to turn the power on.
2. Press the [FUNCTION] button to set the MD function.
3. Press three buttons of [ENTER/START], > and z REC (MD) simultaneously to enter the MD test mode and display “[Check]”.
4. Press the . “R” or > “R” button to display “[Service]”.
5. Press the ENTER/YES “R” button to display “AUTO CHECK”, and press the > “R” button to display “Iop Read”.
6. Press the ENTER/YES “R” button.
7. “@@.@/##.#” is displayed and the recorded contents are displayed.
@@.@ : Indicates the Iop value labeled on the pick-up.
##.# : Indicates the Iop value after adjustment.
8. Press the [REPEAT STEREO/MONO] button twice to complete. “Initialize” will be displayed and release the MD test mode.

24
 HCD-CP500MD

11. WHEN MEMORY NG IS DISPLAYED

If the nonvolatile memory data is abnormal, “E001 MEMORY NG” will be displayed so that the MD deck does not continue operations. In
this case, set the test mode promptly and perform the following procedure.

Procedure:
1. Enter the MD test mode.
2. Normally a message for selecting the test mode will be displayed. However if the nonvolatile memory is abnormal, the following will be
displayed “INIT EEP?”.
3. Press the x (MD) and Z (MD) buttons simultaneously.
4. Press the . “R” or > “R” button to display “MDM-7B”.
5. Press the REC MODE button. If the nonvolatile memory is successfully overwritten, the normal MD test mode will be set and a message
to select the MD test mode will be displayed.

12. CHECKS PRIOR TO PARTS REPLACEMENT AND ADJUSTMENTS IN MD

Before performing repairs, perform the following checks to determine the faulty locations up to a certain extent.
Details of the procedures are described in “Section 6 Electrical Adjustments”.
Criteria for Determination
(Unsatisfactory if specified value is not satisfied) Measure if unsatisfactory

Laser power check • 0.9 mW power • Clean the optical pick-up

(6-2 : See page 31) Specified value : figure1 • Adjust again
• 7.0 mW power • Replace the optical pick-up
Specified value : figure2
Iop (at 7.0mW) • Replace the optical pick-up
• Labeled on the optical pick-up
Iop value ± 10mA
Auto check • Unsatisfactory if displayed as “NG : XXXX”NG • Replace the optical pick-up
(6-4 : See page 32) (XXXX are arbitrary numbers)
Temperature • Unsatisfactory if displayed as “T=@@ (##) [NG]” • Check for disconnection of the circuits around
compensation NG D101 (BD board)
offset check (@@, ## are both arbitrary numbers) • Check the signals around IC101, IC151, CN102,
(6-1 : See page 31) CN103 (BD board)

Note:
The criteria for determination above is intended merely to determine if satisfactory or not, and does not serve as the specified value for adjustments.
When performing adjustments, use the specified values for adjustments.

Figure1:
KMS-260B 0.85 to 0.91 mW
SPECIFIED VALUE
KMS-260E 0.90 to 0.96 mW

Figure2:
KMS-260B 6.8 to 7.2 mW
SPECIFIED VALUE
KMS-260E 7.0 to 7.5 mW

CD SECITON
[CD SERVO Test Mode]
• Use this mode when checking CD servo.

Procedure:
1. Press ?/1 button to turn the set ON.
2. Select the function “CD”.
3. Press three buttons X (TAPE), REC MODE and Z (CD) simultaneously.
4. Press the appropriate button for the following tests.
Button Function Button Function
Z(CD) TEST 1 PLAY MODE DIRECTION TEST 6
x(CD) TEST 2 u(CD) TEST 7
> TEST 3 x(MD) TEST 8
. TEST 4 x(TAPE) TEST 9
REPEAT/STEREO/MONO TEST 5
5. To exit from this mode, turn off the set.

25
HCD-CP500MD
SECTION 5 SECTION 6
MECHANICAL ADJUSTMENTS ELECTRICAL ADJUSTMENTS
Precaution DECK SECTION 0 dB=0.775V
1. Clean the following parts with a denatured alcohol-moistened
swab: 1. Demagnetize the record/playback head with a head demagnetizer.
record/playback heads pinch rollers 2. Do not use a magnetized screwdriver for the adjustments.
erase head rubber belts 3. After the adjustments, apply suitable locking compound to the
capstan idlers parts adjusted.
2. Demagnetize the record/playback head with a head 4. The adjustments should be performed with the rated power
demagnetizer. supply voltage unless otherwise noted.
3. Do not use a magnetized screwdriver for the adjustments. 5. The adjustments should be performed in the order given in this
4. The adjustments should be performed with the rated power service manual. (As a general rule, playback circuit adjustment
supply voltage unless otherwise noted. should be completed before performing recording circuit
adjustment.)
Torque Measurement 6. The adjustments should be performed for both L-CH and R-
Mode Torque meter Meter reading CH.
7. Switches and controls should be set as follows unless otherwise
3.04 – 6.96 N • m
specified.
FWD CQ-102C (31 to 71 g • cm)
(0.43 – 0.98 oz • inch) Tape Signal Used for
0.20 – 0.58 N • m P-4-A100 10 kHz, –10 dB Azimuth Adjustment
FWD
CQ-102C (2 to 6 g • cm) WS-48B 3 kHz, 0 dB Tape Speed Adjustment
back tension
(0.02 – 0.08 oz • inch) P-4-L300 315 Hz, 0 dB Level Adjustment
3.04 – 6.96 N • m
REV CQ-102RC (31 to 71 g • cm) Note: Standard Volume Point is +10 dBs at SPEAKER Output Level (6Ω
(0.43 – 0.98 oz • inch) load resistance) during playbacking P-4-L300 Test Tape.
(DSG OFF, TREBLE/BASS CENTER)
0.20 – 0.58 N • m
REV
CQ-102RC (2 to 6 g • cm) Record/Playback Head Azimuth Adjustment
back tension
(0.02 – 0.08 oz • inch)
6.97 – 14.02 N • m Procedure:
FF/REW CQ-201B (71 to 143 g • cm) 1. Mode : Playback
(0.98 – 1.99 oz • inch)
0.98 N • m or more test tape
FWD tension CQ-403A (100 g or more) P-4-A100
(3.53 oz or more) (10kHz, –10dB) SJ301
level meter
SPEAKER
0.98 N • m or more Output Terminal
REV tension CQ-403R (100 g or more)
(3.53 oz or more) set +
–
6Ω

2. Turn the adjustment screw and check output peaks. If the peaks
do not match for L-CH and R-CH, turn the adjustment screw
so that outputs match within 1 dB of peak.

L-CH
output
peak within
level
1 dB within 1dB

R-CH
peak
screw
position
screw
L-CH R-CH position
peak peak

26
 HCD-CP500MD

3. Mode: Playback Sample Value of Wow and flutter

W.RMS (JIS) less than 0.35%
(test tape: WS-48B)
test tape
P-4-A100 SJ301
(10kHz, –10dB) SPEAKER Record Level Check
Output Terminal oscilloscope
Procedure:
GND
L
1. Press FUNCTION button to select ANALOG IN. (This step
set 6Ω is not necessary if the above test mode has already been set.)
R
2. Insert a tape into deck, press the z REC (TAPE) button, and
then press the X (TAPE) button to start recording.
6Ω 3. Mode: Record
R-ch
ANALOG IN
1) 60 Hz
Waveform of oscilloscope
2) 5 kHz 109 mV (–17 dB)
3) 10 kHz
AF OSC
blank tape
600 Ω CS-123
in phase 45° 90° 135° 180°
attenuator
good wrong
set

4. After the adjustments, apply suitable locking compound to the

parts adjusted. 4. Mode: Playback

Adjustment Location:
recorded level meter
position SJ301
Adjustment point SPEAKER

set

6Ω

5. The playback output level should be –4.5 ±3 dB (60 Hz),

1 ±3 dB (8 kHz) and –3 ±3 dB (10 kHz).

(Top view)

Tape Speed Check

Procedure:

1. MODE : Playback.

test tape
WS-48B
frequency
(3kHz, 0dB) SJ301 counter
SPEAKER
Output Terminal

set

6Ω

2. Insert the WS-48B into deck.

3. Press the Y button of deck.
4. Check the reading of frequency counter becomes 3000 ± 90
Hz.

27
HCD-CP500MD

CD SECTION RF PLL Free-run Frequency

Note : Procedure :
1. CD Block is basically designed to operate without adjustment. 1. Connect frequency counter to TP (XPCK) with lead wire.
Therefore, check each item in order given.
2. Use YEDS-18 disc (3-702-101-01) unless otherwise indicated. frequency counter
3. Use an oscilloscope with more than 10MΩ impedance. CD BOARD
4. Clean the object lens by an applicator with neutral detergent
TP (XPCK) +
when the signal level is low than specified value with the –
following checks.

RF Level Check 2. Turned Power switch on.

3. Put the disc (YEDS-18) in to play the number five track.
oscilloscope Confirm that reading on frequency counter is 4.3218MHz.
CD BOARD
Test Point Location :
TP(RFAC)
TP(DVC 1.65V)
[CD BOARD] — SIDE B —

Procedure :
1. Connect oscilloscope to TP (RFAC) and TP (DVC 1.65V).
2. Turned Power switch on.
3. Load a disc (YEDS-18) and playback the number five track.
4. Confirm that oscilloscope waveform is clear and check RF signal
level is correct or not.

Note: Clear RF signal waveform means that the shape “◊” can be
clearly distinguished at the center of the waveform.

VOLT/DIV : 200mV
TIME/DIV : 500ns TP
(DVC 1.65V) TP
(TE)
level : 1.1 ± 0.3Vp-p
TP
IC101
IC103 (XPCK)
TP
(RFAC)
E-F Balance (1 Track jump) Check

Oscilloscope
CD BOARD

TP (TE)
TP (DVC 1.65V)

Procedure:
1. Connect oscilloscope to TP (TE) and TP (DVC 1.65V).
2. Turned Power switch on.
3. Load a disc (YEDS-18) and playback the number five track.
4. Press the u button. (Becomes the 1track jump mode.)
5. Confirm that the level B and A (DC voltage) on the oscilloscope
waveform.

Center of
waveform

A (DC voltage)
0V

level=1.3 ±0.6Vp-p Symmetry

A
Specification level: B x 100=less than ±22%

28
 HCD-CP500MD

MD SECTION
Note 1:About “R”
As this unit has only a few buttons, some operations require the use of remote commander (RM-SCP500/provided with unit: 1-476-754-11)
buttons. These operations are indicated as “R” in this manual.
Example: MENU/NO “R” ...Press the [MENU/NO] button of the remote commander.
Note 2:Incorrect operations may be performed if the MD test mode is not entered properly.
In this case, press the ?/1 button to turn the power off, and retry to enter the MD test mode.

1. PARTS REPLACEMENT AND ADJUSTMENT

If malfunctions caused by optical pick-up such as sound skipping are suspected, follow the following check.

Check before replacement

Start

6-2. NG
Laser Power Check
(See page 31)

OK

6-3. NG
Iop Compare
(See page 31)

OK

6-4. NG
Auto Check Replace optical pick-up or MDM-7B
(See page 32)

OK

Other faults are suspected.

Check the mechanism parts (spindle motor, sled motor, etc.).

29
HCD-CP500MD

2. PRECAUTIONS FOR CHECKING LASER DIODE 4. PRECAUTIONS FOR ADJUSTMENTS

EMISSION 1. When replacing the following parts, perform the adjustments
To check the emission of the laser diode during adjustments, never and checks with the mark in the order shown in the following
view directly from the top as this may lose your eye-sight. table.
2. Set the MD test mode when performing adjustments.
3. PRECAUTIONS FOR USE OF OPTICAL PICK- After completing the adjustments, exit the MD test mode.
UP (KMS-260B/260E) Perform the adjustments and checks in “Group Service” of the
As the laser diode in the optical pick-up is easily damaged by static MD test mode.
electricity, solder the laser tap of the flexible board when using it. 3. Perform the adjustments to be needed in the order shown.
Before disconnecting the connector, desolder first. Before connecting 4. Use the following tools and measuring devices.
the connector, be careful not to remove the solder. Also take adequate • Check Disc (TDYS-1) (Part No. : 4-963-646-01)
measures to prevent damage by static electricity. Handle the flexible • Test Disk (MDW-74/GA-1) (Part No. : 4-229-747-01)
board with care as it breaks easily. • Laser power meter LPM-8001 (Part No. : J-2501-046-A)
or
MD Laser power meter 8010S (Part No. : J-2501-145-A)*1
pick-up • Oscilloscope (Measure after performing CAL of prove.)
flexible board
• Digital voltmeter
• Thermometer
• Jig for checking BD board waveform
(Part No. : J-2501-196-A)
5. When observing several signals on the oscilloscope, etc.,
make sure that VC and ground do not connect inside the
oscilloscope.
(VC and ground will become short-circuited.)
6. Using the above jig enables the waveform to be checked without
laser tap the need to solder.
(Refer to Servicing Notes on page 8.)
7. As the disc used will affect the adjustment results, make sure
that no dusts nor fingerprints are attached to it.
Optical pick-up flexible board
*1 Laser power meter
When performing laser power checks and adjustment (electrical
adjustment), use of the new MD laser power meter 8010S (Part
No. J-2501-145-A) instead of the conventional laser power
meter is convenient.
It sharply reduces the time and trouble to set the laser power
meter sensor onto the objective lens of optical pick-up.

Parts to be replaced
Optical
Adijustment IC101 IC102 IC151 IC190 IC195 D101
Pick-up

7. Initial setting of adjustment value × × × × ×

8. Recording of Iop information × × × × ×
9. Temperature compensation
offset adjustment
× × × ×
10. Laser power adjustment × × × ×
11. Iop NV Save × × ×
12. Traverse adjustment × × ×
13. Focus bias adjustment × × ×
16. Auto gain adjustment × × ×
6-4. AUTO CHECK × ×

30
 HCD-CP500MD

5. USING THE CONTINUOUSLY RECORDED DISC Procedure:

* This disc is used in focus bias adjustment and error rate check. 1. Set the laser power meter on the objective lens of the optical
The following describes how to create a continuous recording pick-up. (When it cannot be set properly, press the m “R” button
disc. or M“R” button to move the optical pick-up.)
1. Insert a disc (blank disc) commercially available. Connect the digital volt meter to CN105 pin 1 (I+3V) and
2. Press the . “R” or > “R” button and display “CREC 1MODE” CN105 pin 2 (IOP).
(C35). 2. Then, press the .“R” or >“R” button and display
3. Press the ENTER/YES “R” button again to display “CREC 1 “LDPWR CHECK” (C13).
MID”. 3. Press the ENTER/YES “R” button once and display “LD
Display “CREC 1(0300)” and start to recording. 0.9mW$ ”. Check that the reading of the laser power meter
4. Complete recording within 5 minutes. becomes specified value.
5. Press the MENU/NO “R” button and stop recording .
6. Press the Z (MD) button and remove the disc. KMS-260B 0.85 to 0.91 mW
SPECIFIED VALUE
KMS-260E 0.90 to 0.96 mW
The above has been how to create a continuous recorded data for
the focus bias adjustment and error rate check. 4. Press the ENTER/YES “R” button once more and display “ LD
Note: Be careful not to apply vibration during continuous recording. 8.4mW$ ”. Check that the reading the laser power meter and
digital volt meter satisfy the specified value.
6. CHECKS PRIOR TO REPAIRS
These checks are performed before replacing parts according to Specified Value:
“approximate specifications” to determine the faulty locations. For Laser power meter reading :
details, refer to “Checks Prior to Parts Replacement and Adjustments
in MD” (see page 25). KMS-260B 6.8 to 7.2 mW
KMS-260E 7.0 to 7.5 mW
6-1. Temperature Compensation Offset Check
When performing adjustments, set the internal temperature and room Digital voltmeter reading : Optical pick-up displayed value ± 10%
temperature to 22 to 28ºC.
(Optical pick-up label)
Procedure:
KMS260B For details of the method for
1. Press the . “R” or > “R” button to display “TEMP
checking this value, refer to
CHECK” (C12). 20101
“8. Recording and Displaying
2. Press the ENTER/YES “R” button. H0576 the Iop Information”
3. “T=@@(##) [OK]” should be displayed. If “T=@@ (##) [NG]”
is displayed, it means that the results are bad. lOP=57.6 mA in this case
(@@ indicates the current value set, and ## indicates the value lOP (mA) = Digital voltmeter reading (mV)/1 (Ω)
written in the non-volatile memory.)
5. Press the MENU/NO “R” button and display “LDPWR CHECK”
6-2. Laser Power Check (C13) and stop the laser emission.
Before starting adjustment; (The MENU/NO “R” button is effective at all times to stop the
The laser power adjustment value changes depending upon the types laser emission.)
of the optical pick-up (KMS-260B or KMS-260E).
Check the type of the optical pick-up before starting adjustment. Note: After step 4, each time the ENTER/YES “R” button is pressed, the
(See the illustrations “The method of ideutifying the optical pick- display will be switched to “LD 0.7W$ ”and “LD 6.2mW$ ”.
up” on page 35 Nothing needs to be performed here.
Before checking, check the Iop value of the optical pick-up.
(Refer to 8. Recording and Displaying the Iop Information (see page Checking Location: BD (MD) board (see page 38)
34)
6-3. Iop Compare
Connection: The current Iop value at laser power 7 mW output and reference
Iop value (set at shipment) written in the nonvolatile memory are
laser compared, and the rate of increase/decrease will be displayed in
power meter percentage.

Note: Perform this function with the optical pick-up set at room tempera-
Optical pick-up ture.
objective lens
Procedure:
1. Press the .“R” or > “R” button to display “Iop Compare”
(C27).
digital voltmeter 2. Press the ENTER/YES “R” button and start measurements.
BD (MD) board 3. When measurements complete, the display changes to “± xx%
yy”.
CN105 pin 1 (I+3V) + xx is the percentage of increase/decrease, and OK or NG is
CN105 pin 2 (IOP) –
displayed at yy to indicate whether the percentage of increase/
decrease is within the allowable range.
4. Press the MENU/NO “R” button to end.

31
HCD-CP500MD

6-4. Auto Check 6-6. Traverse Check

This test mode performs CREC and CPLAY automatically for
mainly checking the characteristics of the optical pick-up. To perform Note 1:Data will be erased during MO reading if a recorded disc is
this test mode, the laser power must first be checked. Perform Auto used in this adjustment.
Check after the laser power check and Iop compare. Note 2:If the traverse waveform is not clear, connect the oscilloscope
as shown in the following figure so that it can be seen more
clearly.
Procedure: oscilloscope
1. Press the . “R” or > “R” button to display “AUTO (DC range)
CHECK” (C01). BD (MD) board
2. Press the ENTER/YES “R” button. If “LDPWR ” is 330 k Ω
CN105 pin 4 (TE) +
displayed, it means that the laser power check has not been –
performed. In this case, perform the laser power check and Iop CN105 pin 6 (VC)
10 pF
Compare, and then repeat from enter the MD test mode.
3. If a disc is in the mechanical deck, it will be ejected forcibly.
“DISC IN” will be displayed in this case. Load a test disc (MDW- Connection:
74/GA-1) which can be recorded. oscilloscope
4. If a disc is loaded at step 3, the check will start automatically. (DC range)
5. When “XX CHECK” is displayed, the item corresponding to BD (MD) board
XX will be performed.
CN105 pin 4 (TE) + V: 0.1 V/div
When “06 CHECK” completes, the disc loaded at step 3 will be
CN105 pin 6 (VC) – H: 10 ms/div
ejected. “DISC IN” will be displayed. Load the check disc
(TDYS-1).
6. When the disc is loaded in the step 5, the check will automatically Procedure:
be resumed from “07 CHECK”. 1. Connect an oscilloscope to CN105 pin 4 (TE) and CN105 pin
7. After completing to “0C CHECK” of test item 12, check OK or 6 (VC) on the BD (MD) board.
NG will be displayed. If all items are OK, “CHK ALL OK” will 2. Load a disc (any available on the market). (Refer to Note 1)
be displayed. If any item is NG, it will be displayed as 3. Press the M “R” button to move the optical pick-up outside
“NG:xxxx”. the pit.
4. Press the . “R” or > “R” button to display “EF MO
When “CHK ALL OK” is displayed, it means that the optical pick- CHECK”(C14).
up is normal. Check the operations of other parts (spindle motor, 5. Press the ENTER/YES “R” button to display “EFB = MO-
sled motor, etc.). R”.
When displayed as “NG:xxxx”, it means that the optical pick-up is (Laser power READ power/Focus servo ON/tracking servo OFF/
faulty. In this case, replace the optical pick-up. spindle (S) servo ON)
6. Observe the waveform of the oscilloscope, and check that the
6-5. Other Checks specified value is satisfied. Do not press the . “R” or
All the following checks are performed by the Auto Check mode. > “R” button.
They therefore need not be performed in normal operation. (Read power traverse checking)
6-6. Traverse Check
6-7. Focus Bias Check Traverse Waveform
6-8. C PLAY Check
A
6-9. Self-Recording/Playback Check
VC
B

Specified value : Below 10% offset value

Offset value (%) = IA – BI X 100

2 (A + B)
7. Press the ENTER/YES “R” button to display “EFB = MO-
W”.
8. Observe the waveform of the oscilloscope, and check that the
specified value is satisfied. Do not press the . “R” or
> “R” button.
(Write power traverse checking)

Traverse Waveform

A
VC
B

Specified value : Below 10% offset value

Offset value (%) = IA – BI X 100

2 (A + B)

32
 HCD-CP500MD

9. Press the ENTER/YES “R” button to display “EFB = MO- 6-7. Focus Bias Check
P”. Change the focus bias and check the focus tolerance amount.
Then, the optical pick-up moves to the pit area automatically Procedure:
and servo is imposed. 1. Load the test disc (MDW-74/GA-1).
10. Observe the waveform of the oscilloscope, and check that the 2. Press the . “R” or > “R” button to display “CPLAY 1MODE”
specified value is satisfied. Do not press the . “R” or (C34).
> “R” button. 3. Press the ENTER/YES “R” button to display “CPLAY 1MID”.
4. Press the MENU/NO “R” button when “C = AD = )” is
Traverse Waveform displayed.
5. Press the . “R” or > “R” button to display “FBIAS
A CHECK” (C16).
VC 6. Press the ENTER/YES “R” button to display “ / c = ”.
B The first four digits indicate the C1 error rate, the two digits
after [/] indicate ADER, and the 2 digits after [c =] indicate the
Specified value : Below 10% offset value focus bias value.
Check that the C1 error is below 50 and ADER is below 2.
Offset value (%) = IA – BI X 100 7. Press the ENTER/YES “R” button to display “ / b = ”.
2 (A + B)
Check that the C1 error is about 200 and ADER is below 2.
11. Press the ENTER/YES “R” button to display “EF MO CHECK” 8. Press the ENTER/YES “R” button to display “ / a = ”.
(C14). Check that the C1 error is about 200 and ADER is below 2.
The disc stops rotating automatically. 9. Press the MENU/NO “R” button, then press the Z (MD) button
12. Press the Z (MD) button and take out the disc. and take out the test disc.
13. Load the check disc (TDYS-1).
14. Press the . “R” or > “R” button and display “EF CD 6-8. C PLAY Check
CHECK” (C15).
15. Press the ENTER/YES “R” button to display “EFB = CD”. MO Error Rate Check
Servo is imposed automatically. Procedure:
16. Observe the waveform of the oscilloscope, and check that the 1. Load the test disc (MDW-74/GA-1).
specified value is satisfied. Do not press the . “R” or 2. Press the . “R” or > “R” button to display “CPLAY 1MODE”
> “R” button. (C34).
3. Press the ENTER/YES “R” button to display “CPLAY 1MID”.
Traverse Waveform 4. The display changes to “C = AD = )”.
5. If the C1 error rate is below 50, check that ADER is 00.
A
6. Press the MENU/NO “R” button to stop playback, then press the
VC Z (MD) button and take out the test disc.
B
CD Error Rate Check
Specified value : Below 10% offset value Procedure:
1. Load the check disc (TDYS-1).
Offset value (%) = IA – BI X 100
2 (A + B) 2. Press the . “R” or > “R” button to display “CPLAY 1MODE”
(C34).
17. Press the ENTER/YES “R” button to display “EF CD CHECK” 3. Press the ENTER/YES “R” button to display “CPLAY 1MID”.
(C15). 4. The display changes to “C = AD = )”.
18. Press the Z (MD) button and take out the check disc (TDYS-1). 5. Check that the C1 error rate is below 50.
6. Press the MENU/NO “R” button to stop playback, then press the
Checking Location: BD (MD) board (see page 38) Z (MD) button and take out the check disc.

6-9. Self-Recording/playback Check

Prepare a continuous recording disc using the unit to be repaired
and check the error rate.

Procedure:
1. Load a recordable disc (blank disc).
2. Press the . “R” or > “R” button to display “CREC
1MODE” (C35).
3. Press the ENTER/YES “R” button to display “CREC 1MID”.
4. When recording starts, “REC” and “CREC 1 (@@@@)”
(@@@@ is the address) are displayed.
5. About 1 minute later, press the MENU/NO “R” button to stop
continuous recording.
6. Press the . “R” or > “R” button to display “CPLAY 1
MODE” (C34).
7. Press the ENTER/YES “R” button to display “CPLAY 1MID”.
8. “C = AD = )” will be displayed.
9. Check that the C1 error becomes below 50 and the AD error
below 2.
10. Press the MENU/NO “R” button to stop playback, then press the
Z (MD) button and take out the disc.

33
HCD-CP500MD

7. INITIAL SETTING OF ADJUSTMENT VALUE Procedure:

1. Press the . “R” or > “R” button to display “TEMP
Note: ADJUST” (C03).
Mode which sets the adjustment results recorded in the non-volatile 2. Press the ENTER/YES “R” button to select the “TEMP
memory to the initial setting value. However the results of the tempera- ADJUST” mode.
ture compensation offset adjustment will not change to the initial setting 3. “TEMP = [OK]” and the current temperature data will be
value.
displayed.
If initial setting is performed, perform all adjustments again excluding the
temperature compensation offset adjustment.
4. To save the data, press the ENTER/YES “R” button.
For details of the initial setting, refer to “4. Precautions for Adjustments” When not saving the data, press the MENU/NO “R” button.
(See page 39) and execute the initial setting before the adjustment as re- 5. When the ENTER/YES “R” button is pressed, “TEMP =
quired. SAVE” will be displayed and turned back to “TEMP ADJUST”
(C03) display then. When the MENU/NO “R” button is pressed,
Procedure: “TEMP ADJUST” (C03) will be displayed immediately.
1. Press the . “R” or > “R” button to display “ADJ CLEAR”
(C28). Specified Value:
2. Press the ENTER/YES “R” button. “Complete!” will be The “TEMP = ” should be within “E0 - EF”, “F0 - FF”, “00 -
displayed momentarily and initial setting will be executed, after 0F”, “10 - 1F” and “20 - 2F”.
which “ADJ CLEAR” (C28) will be displayed.
10.LASER POWER ADJUSTMENT
8. RECORDING AND DISPLAYING THE IOP Before starting adjustment;
INFORMATION The laser power adjustment value changes depending upon the types
The IOP data can be recorded in the non-volatile memory. The IOP of the optical pick-up (KMS-260B or KMS-260E).
value on the optical pick-up label and the IOP value after the Check the type of the optical pick-up before starting adjustment.
adjustment will be recorded. Recording these data eliminates the (See the illustrations “The method of identifying the optical pick-
need to read the label on the optical pick-up. up on page 35.)
Check the IOP value of the optical pick-up before adjustments.
Recording Procedure: (Refer to 8. Recording and Displaying the Iop Information)
1. Press the . “R” or > “R” button to display “Iop Write”
(C05), and press the ENTER/YES “R” button. Connection: laser
power meter
2. The display becomes “Ref=@@@.@” (@ is an arbitrary
number) and the numbers which can be changed will blink.
3. Input the IOP value on the optical pick-up label.
To select the number: Press the . “R” or > “R” button. Optical pick-up
objective lens
To select the digit : Press the [REC MODE] button.
4. When the ENTER/YES “R” button is pressed, the display
becomes “Measu=@@@.@” (@ is an arbitrary number). digital voltmeter
5. As the adjustment results are recorded for the step 4 value. Leave BD (MD) board
it as it is and press the ENTER/YES “R” button.
6. “Complete!” will be displayed momentarily. The value will be CN105 pin 1 (I+3V) +
CN105 pin 2 (IOP) –
recorded in the non-volatile memory and the display will become
“Iop Write” (C05).
Procedure:
Display Procedure: 1. Insert the laser power meter probe into the disk insertion slot
1. Press the . “R” or > “R” button to display “IopRead”(C26). and set it on top of the objective lens of the optical pick-up.
2. “@@.@/##.#” is displayed and the recorded contents are (When it cannot be set properly, press the m “R” button
displayed. or M “R” button to move the optical pick-up)
@@.@ indicates the IOP value on the optical pick-up label. Connect the digital voltmeter to CN105 pin 1 (I+3V) and
##.# indicates the IOP value after adjustment CN105pin 2 (IOP) on the BD (MD) board.
3. To end, press the MENU/NO “R” button to display “Iop Read” 2. Press the . “R” or > “R” button to display “LDPWR
(C26). ADJUST” (C04).
(Laser power : For adjustment)
9. TEMPERATURE COMPENSATION OFFSET 3. Press the ENTER/YES “R” button once to display “LD 0.9 mW
ADJUSTMENT $ ”.
Save the temperature data at that time in the non-volatile memory 4. Press the . “R” or > “R” button until the laser power
as 25 ˚C reference data. meter reading matches with the specified value as described in
Note: the following table.
1. Usually, do not perform this adjustment.
2. Perform this adjustment in an ambient temperature of 22 ˚C to 28 ˚C. KMS-260B 0.85 to 0.91 mW
SPECIFIED VALUE
Perform it immediately after the power is turned on when the internal KMS-260E 0.90 to 0.96 mW
temperature of the unit is the same as the ambient temperature of 22 ˚C
to 28 ˚C. Press the ENTER/YES “R” button after setting the range knob
3. When D101 has been replaced, perform this adjustment after the tem-
of the laser power meter, and save the adjustment results. (“LD
perature of this part has become the ambient temperature.
SAVE $ ” will be displayed for a moment)
5. Then “LD 7.0 mW $ ” will be displayed.

34
 HCD-CP500MD

6. Press the . “R” or > “R” button so that the reading 11. Iop NV SAVE
of the laser power meter becomes the specified value, press the Write the reference values in the nonvolatile memory to perform
ENTER/YES “R” button to save it. “Iop compare”. As this involves rewriting the reference values, do
not perform this procedure except when adjusting the laser power
KMS-260B 6.7 to 7.1 mW during replacement of the optical pick-up and when replacing the
SPECIFIED VALUE
KMS-260E 7.2 to 7.3 mW IC102. Otherwise the optical pick-up check may deteriorate.
Note: Do not perform the emission with 7.0 mW more than 15 seconds Note: Perform this function with the optical pick-up set at room temperature.
continuously.
7. Then, press the . “R” or > “R” button to display Procedure:
“LDPWR CHECK” (C13). 1. Press the . “R” or > “R” button to display “Iop NV Save” (C06).
8. Press the ENTER/YES “R” button once to display “LD 0.9mW$ 2. Press the ENTER/YES “R” button and display “Iop [stop]”.
”. Check that the reading of the laser power meter matches 3. After the display changes to “Iop =xxsave?”, press the ENTER/
with the specified value as described in the following table.
YES “R” button.
KMS-260B 0.85 to 0.91 mW 4. After “Complete!” is displayed momentarily, the display changes
SPECIFIED VALUE
KMS-260E 0.90 to 0.96 mW to “Iop 7.0 mW”.
5. After the display changes to “Iop=yysave?”, press the ENTER/
9. Press the ENTER/YES “R” button once more to display “LD YES “R” button.
7.0mW$ ”. Check that the reading the laser power meter and 6. When “Complete!” is displayed, it means that Iop NV saving
digital voltmeter satisfy the specified value.
Note down the digital voltmeter reading value. has been completed.
12. TRAVERSE ADJUSTMENT
Specified Value:
Laser power meter reading : Note 1:Data will be erased during MO reading if a recorded disc is
used in this adjustment.
KMS-260B 6.8 to 7.2 mW Note 2:If the traverse waveform is not clear, connect the oscilloscope
SPECIFIED VALUE
KMS-260E 7.0 to 7.5 mW as shown in the following figure so that it can be seen more
clearly. oscilloscope
Digital voltmeter reading : Value on the optical pick-up label ±10% (DC range)
BD (MD) board
(Optical pick-up label) 330 k Ω
CN105 pin 4 (TE) +
KMS260B For details of the method for –
checking this value, refer to CN105 pin 6 (VC)
20101 10 pF
“8. Recording and Displaying
H0576 the Iop Information” Connection:
oscilloscope
lOP=57.6 mA in this case (DC range)
lOP (mA) = Digital voltmeter reading (mV)/1 (Ω) BD (MD) board
10. Press the MENU/NO “R” button to display “LDPWR CHECK” CN105 pin 4 (TE) +
(C13) and stop the laser emission. V: 0.1 V/div
CN105 pin 6 (VC) – H: 10 ms/div
(The MENU/NO “R” button is effective at all times to stop the
laser emission) Procedure:
11. Press the . “R” or > “R” button to display “Iop Write” 1. Connect an oscilloscope to CN105 pin 4 (TE) and CN105 pin
(C05). 6 (VC) on the BD (MD) board.
12. Press the ENTER/YES “R” button. When the display becomes
Ref=@@@.@ (@ is an arbitrary number), press the ENTER/ 2. Load a disc (any available on the market). (Refer to Note 1)
YES “R” button to display “Measu=@@@.@” (@ is an arbitrary 3. Press the M “R” button to move the optical pick-up outside
number). the pit.
13. The numbers which can be changed will blink. Input the Iop 4. Press the . “R” or > “R” button to display “EF MO
value noted down at step 9. ADJUST” (C07).
To select the number : Press the . “R” or > “R button.
To select the digit : Press the[REC MODE] button. 5. Press the ENTER/YES “R” button to display “EFB = MO-R”.
14. When the ENTER/YES “R” button is pressed, “Complete!” will (Laser power READ power/Focus servo ON/tracking servo OFF/
be displayed momentarily. The value will be recorded in the non- spindle (S) servo ON)
volatile memory and the display will become “Iop Write” (C05). 6. Press the . “R” or > “R” button so that the waveform of
the oscilloscope becomes the specified value.
Note: After step 4, each time the ENTER/YES “R” button is pressed, the
display will be switched to “LD 0.7mW$ ” and “LD 6.2mW$ (When the . “R” or > “R” button is pressed, the of
Nothing needs to be performed here. “EFB= ” changes and the waveform changes) In this adjustment,
waveform varies at intervals of approx. 2%. Adjust the waveform
so that the specified value is satisfied as much as possible.
The method of identifying the optical pick-up (KMS-260B/260E)
(Read power traverse adjustment)

Traverse Waveform
UV adhesive agent = Pink : KMS-260B
White : KMS-260E A
VC
UV adhesive agent B

Specification A = B

7. Press the ENTER/YES “R” button and save the result of

adjustment to the non-volatile memory (“EFB = SAVE” will
Optical pick-up be displayed for a moment. Then “EFB = MO-W” will be
(KMS-260B/260E) displayed).

35
HCD-CP500MD

8. Press the . “R” or > “R” button so that the waveform of 18. Press the ENTER/YES “R” button, display “EFB = SAVE”
the oscilloscope becomes the specified value. for a moment and save the adjustment results in the non-volatile
(When the . “R” or > “R” button is pressed, the of memory.
“EFB= ” changes and the waveform changes) In this Next “EF CD ADJUST” (C08) will be displayed.
adjustment, waveform varies at intervals of approx. 2%. Adjust 19. Press the Z (MD) button and take out the check disc.
the waveform so that the specified value is satisfied as much as
possible. Adjustment Location: BD board (see page 38)
(Write power traverse adjustment)
13. FOCUS BIAS ADJUSTMENT
Traverse Waveform
Procedure:
A 1. Load the continuously-recorded disc. (Refer to “5. USING
VC THE CONTINUOUSLY RECORDED DISC” (See page 31))
B 2. Press the . “R” or > “R” button to display “CPLAY1
MODE” (C34).
Specification A = B 3. Press the ENTER/YES “R” button to display “CPLAY 1MID”.
4. Press the MENU/NO “R” button when “C = AD = )” is
displayed.
5. Press the . “R” or > “R” button to display “FBIAS
9. Press the ENTER/YES “R” button, and save the adjustment ADJUST” (C09).
results in the non-volatile memory. (“EFB = SAVE” will be 6. Press the ENTER/YES “R” button to display “ / a = ”.
displayed for a moment) The first four digits indicate the C1 error rate, the two digits
10. “EFB = MO-P” will be displayed. after “/ ” indicate ADER, and the 2 digits after “a =” indicate
The optical pick-up moves to the pit area automatically and the focus bias value.
servo is imposed. 7. Press the > “R” button and find the focus bias value at which
11. Press the . “R” or > “R” button until the waveform of the C1 error rate becomes about 200 (refer to Note 2).
the oscilloscope moves closer to the specified value. 8. Press the ENTER/YES “R” button to display “ / b = ”.
In this adjustment, waveform varies at intervals of approx. 2%. 9. Press the . “R” button and find the focus bias value at which
Adjust the waveform so that the specified value is satisfied as the C1 error rate becomes about 200.
much as possible. 10. Press the ENTER/YES “R” button to display “ / c = ”.
Traverse Waveform 11. Check that the C1 error rate is below 20 and ADER is 00. Then
press the ENTER/YES “R” button.
A 12. If the “( )” in “ - - ( )” is above 20, press the ENTER/
YES “R” button.
VC
If below 20, press the MENU/NO “R” button and repeat the
B
adjustment from step 2.
13. Press thet Z (MD) button and take out the disc.
Specification A = B Note 1: The relation between the C1 error and focus bias is as shown in
the following figure. Find points A and B in the following figure
using the above adjustment. The focal point position C is auto-
12. Press the ENTER/YES “R” button, and save the adjustment matically calculated from points A and B.
results in the non-volatile memory. (“EFB = SAVE” will be Note 2: As the C1 error rate changes, perform the adjustment using the
displayed for a moment) average vale.
Next “EF MO ADJUST” (C07) is displayed. The disc stops
rotating automatically. C1 error
13. Press the Z (MD) button and take out the disc.
14. Load the check disc (TDYS-1). about
15. Press the . “R” or > “R” button to display “EF CD 200
ADJUST” (C08).
16. Press the ENTER/YES “R” button to display “EFB = CD”.
Servo is imposed automatically.
17. Press the . “R” or > “R” button so that the waveform of Focus bias value
the oscilloscope moves closer to the specified value. B C A
In this adjustment, waveform varies at intervals of approx. 2%.
Adjust the waveform so that the specified value is satisfied as
much as possible.

Traverse Waveform

A
VC
B

Specification A = B

36
 HCD-CP500MD

14. ERROR RATE CHECK 16. AUTO GAIN CONTROL OUTPUT LEVEL
ADJUSTMENT
14-1. CD Error Rate Check Be sure to perform this adjustment when the optical pick-up is
Procedure: replaced.
1. Load the check disc (TDYS-1). If the adjustment results becomes “Adjust NG!”, the optical pick-
2. Press the . “R” or > “R” button and display “CPLAY1 up may be faulty or the servo system circuits may be abnormal.
MODE” (C34).
3. Press the ENTER/YES “R” button twice and display “CPLAY1 16-1. CD Auto Gain Control Output Level Adjustment
MID”. Procedure:
4. The display changes to “C = AD = )”. 1. Load the check disc (TDYS-1).
5. Check that the C1 error rate is below 50. 2. Press the . m “R” or M > “R” button to display “AG
6. Press the MENU/NO “R” button to stop playback, then press the Set (CD)” (C11).
Z (MD) button and take out the check disc. 3. When the ENTER/YES “R” button is pressed, the adjustment
will be performed automatically.
14-2. MO Error Rate Check “Complete!” will then be displayed momentarily when the value
Procedure: is recorded in the non-volatile memory, after which the display
1. Load the continuously-recorded disc. (Refer to “5. USING changes to “AG Set (CD)” (C11).
THE CONTINUOUSLY RECORDED DISC” (See page 31)) 4. Press the Z (MD) button and take out the check disc.
2. Press the . “R” or > “R” button to display “CPLAY1
MODE” (C34). 16-2. MO Auto Gain Control Output Level Adjustment
3. Press the ENTER/YES “R” button to display “CPLAY1MID”. Procedure:
4. The display changes to “C1 = AD = )”. 1. Load the test disc (MDW-74/GA-1).
5. If the C1 error rate is below 50, check that ADER is 00. 2. Press the . “R” or > “R” button to display “AG Set (MO)”
6. Press the MENU/NO “R” button to stop playback, then press the (C10).
Z (MD) button and take out the disc. 3. When the ENTER/YES “R” button is pressed, the adjustment
will be performed automatically.
15. FOCUS BIAS CHECK “Complete!” will then be displayed momentarily when the value
Change the focus bias and check the focus tolerance amount. is recorded in the non-volatile memory, after which the display
changes to “AG Set (MO)” (C10).
Procedure: 4. Press the Z (MD) button and take out the test disc.
1. Load the continuously-recorded disc. (Refer to “5. USING
THE CONTINUOUSLY RECORDED DISC” (See page 31))
2. Press the . “R” or > “R” button to display “CPLAY1
MODE” (C34).
3. Press the ENTER/YES “R” button twice to display “CPLAY1
MID”.
4. Press the MENU/NO “R” button when “C1 = AD = )”
is displayed.
5. Press the . “R” or > “R” button to display “FBIAS
CHECK” (C16).
6. Press the ENTER/YES “R” button to display “ / c = ”.
The first four digits indicate the C1 error rate, the two digits
after “/ ” indicate ADER, and the 2 digits after “c =” indicate
the focus bias value.
Check that the C1 error is below 50 and ADER is below 2.
7. Press the ENTER/YES “R” button and display “ / b=
”.
Check that the C1 error is below 100 and ADER is below 2.
8. Press the ENTER/YES “R” button and display “ / a=
”.
Check that the C1 error is below 100 and ADER is below 2
9. Press the MENU/NO “R” button, then press the Z (MD) button
and take out the disc.

Note: If the C1 error and ADER are above other than the specified
value at points a (step 8. in the above) or b (step 7. in the above),
the focus bias adjustment may not have been carried out prop-
erly. Adjust perform the beginning again.

37
HCD-CP500MD

Adjustment and checking Loacation:

– BD (MD) BOARD (Component Side) – – BD (MD) BOARD (Conductor Side) –

D101
IC101

CN105
CN101 1 1. I+3V
2. IOP
7 3. GND
4. TE
5. FE
6. VC
IC151 7. RF

IC190

Note: It is useful to use the jig for checking the waveform. (Refer to Ser-
vicing Notes on page 8)

38
HCD-CP500MD

MEMO

39
HCD-CP500MD
SECTION 7
DIAGRAMS
7-1. CIRCUIT BOARDS LOCATION

TC board

CONTROL board

MD-INDICATE board

CD-PRISM board

MAIN board

HEAD PHONE board

POWER board
OPTICAL board

DIGITAL board

BD board

LOADING board

CD board

40
 HCD-CP500MD
• Waveforms
THIS NOTE IS COMMON FOR PRINTED WIRING BOARDS AND SCHEMATIC DIAGRAMS.
(In addition to this, the necessary note is printed in each block.) 1 IC101 us XTAO 2 IC1001 w; XOUT 3 IC309 qf X-O
For schematic diagrams. For printed wiring boards.
Note: Note: 4.6 Vp-p 3.4 Vp-p 4 Vp-p
• All capacitors are in µF unless otherwise noted. pF: µµF • X : parts extracted from the component side.
50 WV or less are not indicated except for electrolytics • Y : parts extracted from the conductor side.
30 ns 100 ns 231 ns
and tantalums. • a : Through hole.
VOLT/DIV : 1V AC VOLT/DIV : 1V AC VOLT/DIV : 1V AC
• All resistors are in Ω and 1/4 W or less unless otherwise • b : Pattern from the side which enables seeing. TIME/DIV : 20 nsec TIME/DIV : 40 nsec TIME/DIV : 100 nsec
specified. (The other layers' patterns are not indicated.)
• f : internal component. 4 IC306 qa XCOUT 5 IC306 qd XOUT 6 IC101 ek (RF)
• 2 : nonflammable resistor. Caution:
• 1 : fusible resistor. Pattern face side: Parts on the pattern face side seen from the
3.4Vp-p 4.4 Vp-p
• C : panel designation. (Side B) pattern face are indicated.
Parts face side: Parts on the parts face side seen from the
Note: (Side A) parts face are indicated. 31 µs 63 ns 1.3Vp-p
The components identified by
mark ! or dotted line with mark VOLT/DIV : 1V AC VOLT/DIV : 1V AC
• Indication of transistor TIME/DIV : 20 µsec TIME/DIV : 40 nsec
! are critical for safety.
Replace only with part number
specified. 7 IC101 ef (FE) 8 IC101 wh (TE) 9 IC151 o; (FS4)
(Play mode) (Play mode)
• A : B+ Line.
B C E
• B : B– Line. 3.5Vp-p
• H : adjustment for repair. These are omitted.
• Voltages and waveforms are dc with respect to ground 0.2Vp-p
1.6Vp-p 176.4kHz
under no-signal (detuned) conditions.
• Voltages are taken with a VOM (Input impedance 10 MΩ).
Voltage variations may be noted due to normal produc- B C E
tion tolerances.
These are omitted.
• Waveforms are taken with a oscilloscope.
Voltage variations may be noted due to normal produc-
tion tolerances.
• Circled numbers refer to waveforms.
C
• Signal path.
F : FM Q These are omitted.
g : VIDEO/MD (AUDIO)
B E
E : PB (TAPE)
a : REC (TAPE)
J : CD (Analog)
c : CD (DIGITAL OUT)
p : MD (PB)
l : MD (REC)
• Abbreviation
AUS : Australian model
CH : Chinese model
E51 : Chilean and Peruvian model
HK : Hong Kong model

41 41
HCD-CP500MD
7-2. BLOCK DIAGRAM – CD SECTION –

IC503
IC551 SELECTOR
DIGITAL
1
OPTICAL 3
IN
+5V 2
4 MD
6 DIN
Q102 A SECTION
(Page 44)
5
SWITCH
9
8
IC101
OPTICAL PICK-UP IC103 DIGITAL SERVO, 12
10
BLOCK DIGITAL SIGNAL PROCESSOR 11
RF AMP
13
VC 27 VC
RFC 26
VCC +5V 25 VFC D OUT 64
A 6 A RFAC 15 50 RFAC
B 7 B RFDCO 28 43 RFDC
C 8 C IC306(1/3)
D 9 D FE 16 39 FE MASTER CONTROL
E 10 E TE 18 41 TE
F 11 F 40 SE CTRL1(1-2)
Q101 XTSL 69 3 XTSL OPT-SEL 21
LD
LD 1 LD SW 12 +3.3V
DRIVE
DATA
FEI 17 DATA 4 34 CD-DATA
GND CLK
CLOK 6 27 CD-CLK
RFDCI 29 26 SSTP XLT
XLAT 5 22 XLT
S101
PD 2 PD LIMIT
VR IN
SWITCH SQSO
IC702 SQSO 76 32 SQ-DATA-IN
MOTOR/COIL DRIVE SENS
SENS 7 23 SENS
SCLK
F+ 14 VO1(+) OPIN1(+) 2 33 FFDR SCLK 8 33 SQ-CLK
SQCK 77
F- 13 VO1(-) OPIN1(-) 3 34 FRDR SCOR
SCOR 15 19 SCOR

T+ 11 VO2(-) OPIN2(+) 5 31 TFDR

XTAI 71
T- 12 VO2(+) OPIN(2-) 6 32 TRDR X101
33.8MHz
XTAO 72
• Signal Path
15 VO4(+) OPIN4(+) 27 29 SFDR
SLED M
MOTOR : CD (DIGITAL)
16 VO4(-) OPIN4(-) 26 30 SRDR
XRST 2
18 VO3(-) OPIN3(-) 23 25 MDP :DIGITAL IN (OPTICAL)
SPINDLE M
MOTOR LDON
17 VO3(+) 25 LDON
STBY1 9
XRST
STBY2 20 39 CD_XRST

PWM1
28 BU_PWM 1
PWM2
26 BU_PWM 2 Q103,D101
PWM3
24 BU_PWM 3 +3.3V
+3.3V +5V
REG

42 42
 HCD-CP500MD
BLOCK DIAGRAM – MAIN SECTION –
MD-L

MD • R-CH is omitted due to same as L-CH.

IC301 C SECTION
(Page 44) • Signal Path
SOUND PROCESSOR
: FM
LINEOUT1 32 REC-L
: CD
IC101
POWER AMP
9 E1 VOL1 29 : PB
SJ301
OUT1 20 3 + : REC
14
Q101 2 – L
: MD(PLAY)
PJ301 MUTING SPEAKER

MUTE
STBY
R-CH : MD(REC)
L 5 C1 R

ANALOG 9 10 • Abbreviation
IN
E51 : Chilean and Peruvian model
R R-CH
IC302 HK : Hong Kong model
HEADPHONE AMP
3 B1

3 +
1
2 –
7 D1

R-CH J301
PHONES

IC306 (3/3)
MASTER CONTROL Q132

DATA
CLK
MUTING
Q339 Q315,316
15 14 STK-POWER 57
CD8V SWITCH + SWITCH 58 LINE MUTE
AMP_MUTE 54
Q330,331
56 VOL_DATA MUTING
H/P_MUTE 53
SWITCH T902
Q318 55 VOL_CLK MAIN
TRANSFORMER
SWITCH
H/P_CHECK 52
IC316 1 AC CUT D902-905
TUNER UNIT Q319
RESET +B
L-CH B/UP 5V 1 RESET 3 12 RESET
SWITCH (+22.5V)
R-CH R-CH POWER AMP
CK 70 ST-CLK
DO 69 ST-DOUT -B
(-22.5V)
DI 71 ST-DIN Q309-311
CE IC309 AEP,UK 72 ST-CE B+
CD +5V D906-909
RDS DECODER SWITCH
TUNED Q329 68 TUNED
FM-DET AMP 4 MUX RDATA 2 51 RDS-DATA CD-POWER 50 IC303
FM (7.5V) +8V
FM 7.5V XI XO RCLK 16 18 RDS-INT COM8V 3 1
REG
+B (9.5V) TU 9.5V 13 14 IC313
X301 D318
+8V
4.332MHz M +7V 3 1
REG

IC401 MD A3.3V
PB AMP,REC AMP,ALC Q407 IC305 IC314
19 MUTING 38 TC-MUTE +4V +5V
MD 3.3V 1 3 3 1
REG REG
A/B-SW RY901
A IN-L MD BACKUP EXCEPT
24 PB-L MDM5V E51,HK
20 0.22F Q312
23
L B IN-L +10V
M +10V REG
Q303,307,308
REC/PB HEAD B+
TU 9.5V IC311
SWITCH
Q414 +8V
R R-CH CD8V 3 1
48 REC-MUTE TU_ON 67 REG
MUTING Q304-306
B+ E51,HK
FM 7.5V
SWITCH IC310
+12V
REC OUT-L REC IN-L FM_ON 66 COM12V 3
REG
1 S901
16 14
Q902 VOLTAGE
IC402 RELAY SELECTOR
3 1 POWER-ON 2 DRIVER T901
IC315 SUB EXCEPT
D401 D303 TRANSFORMER
P R +5V E51,HK
4 44 REC/PB/PASS TC 5V 3 1
REG
REC/PB T401 D919 D910-13
Q401
REC BIAS +8V B/UP 5V
Q402,403 Q901,903
ERASE BIAS BIAS
ERASE HEAD +5V
X OSC REG AC IN

D917
5V (IC306,Q319) COM8V
D920
0.22F
P.DOWN
MDM_POWER 20
DA MUTE
DA_MUTE 5 MD
MD RESET
MD RESET 49 B SECTION
(Page 44)
D322

43 43
HCD-CP500MD
BLOCK DIAGRAM – MD SECTION –

15 68
IC151 (1/2)
TX VC
IC181, Q181 182 EFMO ADDT
OVER WRITE 100 25
HEAD DRIVE DADTI DADTI
FILI SAMPLING
HR901 SCTX 60 22
RATE
OVER WRITE HEAD PCO XBCKI XBCKI
CONVERTER

FILTER
IC151 (1/2) 59 24
CLTV PLL LRCKI

MEMORY CONTROLLER
DIGITAL SIGNAL PROCESSOR, LRCKI
23

ENCODER/DECODER
62
EFM/ACIRC ENCODER/DECODER,

ENCODER/DECODER

SHOCK PROOF
FILO
SHOCK PROOF MEMORY CONTROLLER, 61

ATRAC
EFM/ACIRC
ATRAC ENCODER/DECODER
DIN0 DIN
19
48 47 IC101 DIGITAL
ASYO DIN1
OPTICAL PICK-UP RF AMP, 53 AUDIO 20

MORFO

MORFI
(KMS-260B) FOCUS/TRACKING ERROR AMP INTERFACE DOUT DOUT
21
ASYI
I I 54 COMPA- DADT
1 RFO AGCI RF AGC RF RFI 26
J RF AMP 46 40 38 57 RATOR XBCK
J & EQ 28
2 LRCK
27
FS256
EQ 29
WBL
X171
VC 3 VC B.P.F. AUX
33 90MHz
OSCI
CLOCK 16
D101 IC152
3T PEAK GENERATOR OSCO
F TEMP TEMP PEAK & 37 17 D-RAM • Signal Path
SENSOR BOTTOM BOTM

D0 – D3
B 15 TEMPR 36 : PLAY (MD)
WBL

49, 48, 50, 51

: REC (MD)

2, 3, 24, 25
DQ1 – DQ4
SUBCODE INTERNAL BUS

ADFG
C B
I J 14 TEMPI ADIP PROCESSOR : CD (DIGITAL)
AT ADFM ADIN ADFG
D A B.P.F. 29 30 32 78 DEMODULATOR/
AMP : CD (ANALOG)
A A DECODER
4

A00 – A07
B ABCD ABCD DIN
CPU MONITOR
5 I-V 35
A

34 – 31, 36 – 39, 45

9 – 12, 15 – 18, 21
E C AMP INTERFACE
AMP CONTROL

A09
6
D FOCUS FE F0CNT SPINDLE

A0 – A7, A9
DETECTOR 7 34 79
ERROR AMP SERVO CD
C
D SECTION

SWDT

MNT0
MNT1
MNT2
MNT3
SPRD

DQSY
SQSY

SRDT
(Page 42)

SENS
SPFD

SCLK
XLAT
XINT
E E TE
8 I-V TRACKING 26
F F AMP SE
9 ERROR AMP 28 94 93 12 11 14 9 8 5 6 7 1 2 3 4 XOE
WBL

LD+3V 43 22 OE
EQ
3T

COMMAND XWE
47 4 WE
Q121, 122 XRAS
ILCC APC LD/PD 46 5 RAS
AUTOMATIC 11 XCAS
AMP SERIAL/PARALLEL Q333 44 23 CAS
POWER CONTROL V-I F0CNT
PD LD CONVERTER, 20 MD RESET , P.DOWN , DA MUTE
CONVERTER MD RESET
DECODER SWITCH B
P.DOWN

DA MUTE
SWDT

LASER DIODE
APCREF

SCLK
XLAT

PD Q101 PD 25 27 32 48 40 38 42 50 58 56 26
IC308 IC1005 MAIN
LASER ON 10
A/D

DATAI
XBCKI
LRCKI
X-CIN 17 SECTION

XINT
DQSY
SQSY

SENS
SRDT
SWDT
SCLK
XLAT

MNT1 (SHCK)
MNT2 (XBUSY)

P.DOWN
SWITCH X1002
12 16 17 18 MD BACKUP 5 RESET 3 CONVERTER (Page 43)
(3.3V) 32kHz
19 RESET X-COUT 18 13 11 12

DATA0
BCK
WS
SWITCH Q1003
VINL 1 REC-L
29 LDON
VINR 3 R-CH
IC141 47 DIG-RST

LD-OUT

SYSCLK
FOCUS/TRACKING COIL DRIVER,

LD-IN
35 WRPWR IC1001 ADPWN 118 7 PW ON
SPINDLE/SLED MOTOR DRIVER
16 14 MOD MASTER CONTROLLER IC195
12 13 EEPROM 8
PSB
SPFD
M101 6 OUT4F IN4R 3 6 5 EEP-WP 60 7 WP
M SPRD 83 10 13 67 65 66 75 74 63 64 M+7V
SCL 66 6 SCL C
RIN
FIN
(SPINDLE) 8 OUT4R IN4F 4 VCC 7
RECP IC1004 SDA(EEP) 61 5 SDA
APCREF

AUX1
ABCD
FE
TE
SE
PEAK
BOTM

XRST

XBCKI

LRCKI
DOUT
LOADING Q1001, 1002

DIN
OUT1

AUTOMATIC MOTOR DRIVE OUT2 VREF 4 REFERENCE MAIN

VOLTAGE SWITCH SECTION
POWER 15 16 33 37 29 (Page 43)
CONTROL 2 10

SPDIFO

SPDIFI

12SBCKOUT

12SLRCKOUT

CLKOUT
SFDR 11 LD-LOW
M102 27 OUT2F IN2F 29 92 S101
(SLED) M SRDR ANALOG MUX M (LIMIT IN) 30 LIMIT-IN Q1004
25 OUT2R IN2R 30 91 S103
M103 (OUT) 51 OUT-SW MUTE 8 SWITCH 12 MUTE VOUTL 18 MD-L
A/D CONVERTER (LOADING) S104
(PLAY)
PWM GENERATOR

49 PLAY-SW 13 SLICER-SEL IC1006

SLICERSEL 10 VOUTR 22 R-CH
DIGITAL SERVO S105
2-AXIS (REC) 43 REC-SW DARST 9 1 RESET D/A
SIGNAL CONVERTER
DEVICE FCS+ FFDR PROCESS FROM CPU DALOCK 116 21 LOCK VDDPLL 32
21 OUT1F IN1F 19 88 S102 67 REFLECT
FRDR INTERFACE
(TRACKING)

23 OUT1R IN1R 18 89 68 PROTECT I2C-CLK

(FOCUS)

XLRF XLAT IOP I2CCLK 36 I2C-DATA,I2C-CLK

80 3 -A 4 133 OP-LEVEL I2C-DATA
AUTO CKRF
81
SCLK I2CDAT 37 D
SEQUENCER DTRF SWDT Q2001,2002
FCS– 82 IC102 SPDIF-CUT 123 +B PANEL
TRK+ TFDR WAVEFORM +3.3V SECTION
12 OUT3F IN3F 14 86 SWITCH
TRK– TRDR IC151 (2/2) Q131 - 134 SHAPPER (Page 45)
10 OUT3R IN3R 15 85 DIGITAL SERVO HF MODULE IC190
LD+3.3V
SIGNAL PROCESSOR SWITCH
LD+3.3 V +3.3V +5V
3 1
MOD REG
HF MODULE

44 44
 HCD-CP500MD
BLOCK DIAGRAM – PANEL SECTION –

IC306(2/3) LCD801
MASTER CONTROL IC801 LIQUID CRYSTAL DISPLAY UNIT

REMOTE
1 4 SIRCS +5V VDD
SENSOR

J302 75 PC POWER XC-IN 10

X801 LCD-DATA 35 SDA
PC LINK Q302 32.768kHz
6 XC-OUT 11
5 I2C-CLK LCD-SCK 37 SCL
SCL S825
4 SWITCH 29 IIC-CLK
+5V 74 POWER KEY
3 LCD-CS 36 CS
Q301
X-IN 15
2 1 SDA I2C-DATA X802
SWITCH 30 IIC-DATA LCD-RS 77 RS
X-OUT 13 16MHz
RV801
CD 8V
ROTARY 82 VOL_A
VOLUME
ENCODER
MD I2C-DATA,I2C-CLK 83 VOL_B Q335,337
SECTION
(Page 44)
D LCD_BACK_LIGHT 76
B+ SWITCH D801-804
(BACK LIGHT)
RV802
8V (LED)
ROTARY 92 BASS-A Q809
BASS
ENCODER
84 BASS-B LED D811,812
DRIVER (CD PRISM)

(DECK BLOCK) RV803 Q803,804

+5V 85 TREBLE-A LED D821

ROTARY
TREBLE DRIVER STANDBY
ENCODER
86 TREBLE-B
REC-R
Q801
REC-L 94 B HALF/REC
LED D810
DSG-LED 88 DRIVER
PACK S801-806 DSG
Q320,321
FUNCTION
MOTOR 89 KEY0
MO +12V KEY Q802
CONTROL 7 CAPM-CNT1
LED D813,814
MD_INDICATOR_LED 87 DRIVER (MD INDICATOR)
PLAY SW 45 B_PLAY S809-815

FUNCTION 90 KEY1 Q805

SENSOR OUT 93 B-SHUT(SENSOR) KEY
LED D822,823
Q322,323 TC_LED 81 DRIVER TAPE
SOLENOID
SOL 12V 6 SOL_CON S817-824
CONTROL
Q806
FUNCTION
91 KEY2 LED
KEY D824,825
MD_LED 80 DRIVER MD

IC307 Q807
LOADING MOTOR DRIVER
S902 LED D826,827
41 OPEN SW CD_LED 79 DRIVER CD
DISC TRAY TRAY-OPEN 43 5 IN1 OUT1 2
OPEN DETECT M901
M
TRAY-CLOSE 42 6 IN2 OUT2 10 DISC TRAY
S901 40 IN SW OPEN/CLOSE Q808

DISC TRAY LED D828

CLOSE DETECT TUNER_LED 78 DRIVER TUNER

45 45
HCD-CP500MD
7-3. PRINTED WIRING BOARD – CD BOARD – • See page 30 for Circuit Boards Location.

R249
C245
C162 S101
R251
(LIMIT IN)

R248
C247
R250
R219

R254
C244
C248
R245 R252
C243
C238 IC702
C242

C239
R246 R244 R152

C240
C237 R253

C151
R247

C241
R241

R151
R240
C112

C120

R111
C121
TP

C102

R103

R104
(DVC1.65V) R109

R242
R243
TP C249
C109

C103
Q102 (TE)

C101

C224
R114 C107
C222 40 21

C104

20
R230 R102 R229 TP

41
R127 R120 (XPCK)
R201

R105

RN201
C221
R113 C215 IC101

C108
C236
C217

C230

R202
C111
R118

R203
C216
TP R215
C227

(RFAC)
IC103
R123

CN101
R122

R204
C235

RN202
Q103 Q101 C212

R207
FB101

C213 C211
C205

R124

60
R218

R206
C204
C203
R216

61 100
C113
R205

C110
R213 C114
R221 R228

L107
C201

R125 R226
C209 CN302
C231

C229
C228

R126
(Page 51)

R212
R227
C119
C202 C118
D101

C234
R217
C117

C115

CN102

• Semiconductor
Location
Ref. No. Location
D101 D-1

IC101 C-6
IC103 C-5
IC702 B-5

Q101 C-5
Q102 B-5
Q103 C-1

46 46
 HCD-CP500MD
7-4. SCHEMATIC DIAGRAM – CD BOARD –

C213
C119
R102 R105 C109

C112
C101 C104
IC103 C118
C120
CN102
C107 R120
C102

R103 R125

C115
C117 R126

R127
R104
R230 C212

C215

C216
R204 C224 R111

C221 C211 R114

R109
R207
C103 Q102

R203
C114
C110
C230
C209

R201
R202
R206
R113
Q101
C217 C111

R118
C227 C108
C113 R124

R227 R122
CN101 C241
C234 R123
C237
R212 C235 R228

L107 C236
R229 R244 C239

R245

R246
C242 C243
R240

C238
R241 R247
R242
R243
C240
IC101
RN201
Q103
C203 R217
C231
C229

C204 R216 C222

RN202
R221
IC702
C201

FB101 C228

(Page 52)
R213

R219
R226 D101

C248
S101
C202 R252
R214
R218

R250

R248
R253
C205
R215 R254 C162
C247
R251 R249 C244
C151
R151
R152

C245

C249

47 47
HCD-CP500MD
7-5. PRINTED WIRING BOARD – BD BOARD – • See page 30 for Circuit Boards Location.

TO TO
DIGITAL BOARD DIGITAL BOARD
CN1003 CN1004
(Page 56) (Page 56)

C181
L183 L180 CN103
L184 M102 CN102
(SLED MOTOR) 1 17
R191 C198

R196
R197
R192 L181

R181

C196
C182

R195
C199 R155
TP118
L182 IC181 IC195
R158
D183
R157 C192

C172 R175
R156

Q182

C171
C160
C158

R183
R160
R161

TP117
C191

C180
C161
L121

D181
R151
R153
C195
C159

Q181
R176

C183

R182
L171 TP120
IC190

R164

R178

L146
C184 C174 R177

L147
C151
C146

R152

C173
R154
R179

R162
R159
HR901 C185

CN104

R163
C186 R165 X171
Q201 R150

TP119
R225

JW207
C152
C193

R166 JW204
JW201

C157
JW205 C144 L142

R185
R184

IC152
C145
L122
JW903

S101
IC151
JW904

(LIMIT IN) L145

L144
S105

IC141
C140 C153

C165
S105
C163
(REC)
Q131
R133 R169
R135
C148

R219
C154 C131
C169
C156

R167
Q134
R136 R168

R123
JW202

C162

C164
C132 C155
S104

R122 R172
L161

Q133

C143
R118
L105

C167
S104 L131 R121 IC102 R125 C168
R134

R120
C118

(PLAY)

R170
Q132 R119
JW203

CN105
R131

R132 R124
TP110 R174
C142 C128

R171
C166
R173
Q101 R138 C121
C133 M101

R127
C111 R130 (SPINDLE MOTOR)
C1401
Q121
L103

C122
R101
C103
C117

L106
R102
R103

R126

C147
C141

C120

Q122
R129
R128
S103

TP142

R142
C116
(OUT) C115 C119

C150
L101 L102
C102

C149
S103

R141
C125
TP116
C110

C114
IC101

R116 C113
CN101

S102

R117

L143
C112
(KMS-260B)

L141
R114
R112
R104

C108

C109
C107
C106
C101

C104

R107
D101

R109
TP115

S102
C105

R113
R115

R111
M103

R110

C194
(LOADING MOTOR)

R108
TP112 R106

R105
• Semiconductor • Semiconductor
Location Location
SIDE A SIDE B
Ref. No. Location Ref. No. Location Ref. No. Location
D101 D-3 D181 A-1 IC181 A-2
D183 A-1 IC190 A-3
Q101 C-3 IC195 A-3
Q131 B-3 IC101 D-1
Q132 C-3 IC102 C-1 Q121 C-1
Q133 B-3 IC141 B-3 Q122 C-1
Q134 B-3 IC151 B-2 Q181 A-1
IC152 B-1 Q182 A-1

48 48
 HCD-CP500MD
7-6. SCHEMATIC DIAGRAM – BD BOARD (1/2) –

Q131
TP172 R136 L131

C118
R133 R131
R121

Q132
R120

R135 R134
C133
R122 R138

Q134

R132
C132
R118 IC102
CN101
C131
TP116
C128
TP115 Q133 R119
TP114 C119 TP144 TP145
TP113 TP129 TP131 C117 R125
C115
TP112

TP138
TP111 TP147

TP133
TP149

TP134
TP110 C116 R124 (Page 50)

TP136
TP109 TP146 R123 TP148
TP108

TP171
TP132
TP107 C101
TP106
L101
L102
L103

TP142
TP105

TP140
TP104 TP141
TP103 C125
TP102
IC101
TP101 TP139
C114
L106 C113
Q101 C1401 JW203 L146
TP128
R104 C112
C104 JW202 C141
L147

TP127 C142
R103 R116
(Page 50)
R117
R102
C143
R105

TP130

TP135
R101 C105 R112 R114

C103 C102 R108 R113 R115

D101 TP137
R109
C110 R110 R111

C109
TP123

C108 R106 R107 M101

C106 C107 L144 TP124
C111
TP122 Q121

L161 L105
TP121 R128
R127 C121
R129 C144 C145

R126 IC141
CN105 R130 C120
Q122
TP125
L142

M102
L145
TP126

L141

L143

(Page 50)

49 49
HCD-CP500MD
7-7. SCHEMATIC DIAGRAM – BD BOARD (2/2) –

S105
L122 C154 TP160 C164
S104

C167 C169 S103 JW201

TP159
C163 S101

R169
C155
R174 C162
TP164 C165

S102

R168
TP163

R167
IC152

R171
C166
CN102

C156
R170
R173
TP162

(Page 49)

TP154
TP153
TP152
TP151
TP150 C157

TP157

C152 R195 R196 R197 (Page 57)

C153 IC151

C195
TP155

C196

IC195

C194
M103
R218

TP156
(Page 49)
TP161

TP158 CN103
IC190 TP170
C193
TP168 L121
R162
R151
C159

R150
C158

C160

C161

TP166

R158
R155
R153

R156
TP165

R179 C192
C151

TP169 C191

JW904

JW903

(Page 57)

(Page 49)

L171

TP143

C174

R182

R177
Q181 IC181

X171 C173

L181
R184
CN104 TP117 TP119 D181
BG1
L184
TP118 TP120 R185 C184
D183
C185

C180
Q182 C181

C183 C182
R183 L182 R181
L180 L183

50 50
 HCD-CP500MD
7-8. PRINTED WIRING BOARDS – AUDIO SECTION – • See page 30 for Circuit Boards Location.

CN801
(Page 58)

S1
C322 TU1
C390 R302 Q335

JW308
C377 CN304
JW482

R371
C1

R358

R357

R353
R356

R352
M901

R355
Q337 R370

JR304
R492
R490
R488 R489
JW462

C233

C133
(AEP,UK)

R369
(AEP,UK)

R479
JW473 R468

C366
JW453 C373

C367

C365
R123

R347
R346
CN1

R487
R327

R491
R493 Q308 Q307 R300
C120

R484
JW454

R483
R482

R480

D310
R486 R122

R481
R494

(AEP,UK)
R485
R900

C323

C324
R476
JW302

R477
R478

R348
R349
R474
R326

R389

JW409
Q329 R467
R362 Q305

JW306
JW303

JW305

JW452
JW304
PJ301

JW451
R475

Q303
C350 JW309
R497 R495

R313
Q318 R466 R350

C347
D322

C380
JW310

C354
Q304
R458 Q306

R351 D311
D323 C325

C314
JW311

C327
JW456

C349
R457
R456
IC306

C326
D324
JW457
JW458

JW419 (AEP,UK) C121

X801 R454 R455 R132

C361
R329

C362
R121

C348
JW313

R404
R401

C391
R453
R330 R319 C359

C382
JW314

C109
R232
JR101
JW459
D325 R403

IC316
JW307

JW342
R402 R452

C221
X301

R409

JW343
R405 R406 JW315 C360
R449 R450 R345
C368

R446
R407

R222
R448 R344 R343

JW344

C356
C803

C209
R437

R435
C801

R436

D331
JW316 C103

JR201
JW328 Q319 C364 R221
C802 R444
FB318

JW345 JW317 R342

R336
JW486 R331
R443 C353 JW318
IC309

X802
Q331
JW400
IC307 R442

C804

R223

C358
FB308 D330

C220

C381
JW463 JW326 L101
R429 CN304
JW491

R445
FB319 FB302 C355 (Page 58)
C370 C805

R439
JW349 FB301 R430 C351 JW327 C203
JW460
R321 R441 R360
C343 FB327 JW329 D332 L201
CN306
R421
R420 R328 C352
Q330

R428
FB321

R422

R427
R424

R366
FB306 R440
R506

R432

C230
CN308

R365
CNP503 C214 R205

R110 R206
JW450

C127
CN301
R423
JW330 IC302 C217 SJ301

R425

R202
CN1001 C344 JW449

R341 R340
JW334
FB304

JW346
JW324 C310

C114
(Page 56)

R208
R106
JW348
R204 FB307 JW448 R243
JR302

JW325

JW350

JW500
R509

R102
R438
JW466 R513 JW447

D321

C304

JW301
R426

C227
• Semiconductor

C128
R433
JW446 R105

C205
R419

JW492
C507

C105
FB314

R104

C117

C305
JW444
FB309

R434
Location

C104

C204
CN551 R203 JW333 JW443 JW338 C301
C312

FB325

C102
(Page 58) R307 JW441 C333

R113
JW339

C202
C302
JW467 CN302

R131
Ref. No. Location Ref. No. Location

C228
C213 JW336
JW493

R231
R103 R212
IC503 R367 R112

R213
C116 JW337
JW332 C240 JR312 C208

C130
JW468 R368 C140
IC301 D303 H-7 IC309 C-7
RB320

JW331 JW429
FB310

FB326 R374 C394 C108

FB323 R373 JW340 C306
JW469 JW440 C393
JW505 D304 I-4 IC310 G-7
FB324

FB303 C363 JW442 JW341 R320

JW475
C215
D305 H-7 IC311 G-6

R304
JW470 R316
CN101 C392 JW504 C115
R372
(Page 46) JW494 D306 F-3 IC313 G-8

C201
R233
D306 JW428 CN303 JW356 JW366
R234 C210

C101
JW320

C118

C111
C113

C112
JW471 JW495 R303 JW361 Q333
JW501 JW425
C232 JW357
C212
JW367 D307 I-4 IC314 H-1

JW427
JW476
CN301 C132 D308 G-4 IC315 G-7

C218
C110

C216
R235 C383
JW477 JW423 JW426 JW321
(Page 54) C211 R143
FB322

R135 R133 JW358 D309 G-4 IC316 C-3

JW478 Q312 R134
JW335
JW480

R107
R108
R207
R201
JW352
D310 B-8 IC503 E-3

JW353
R109
R209
FB313

C125
D311 C-7
JW496
JW424

FB312 C207 R126

JW422

C206
JW421 Q101
C369 C107 Q201 C378

JR301
JW359 C379
D312 H-2 Q101 F-8

JW354
D301
D313
FB311
FB317

JW474
JW432

R136
JW364

R236

FB315 JW420 JW360

Q201 F-8
JW435

TH1
D313 F-3

C106
C313
FB316 C300
R322

Q322 R364 D302

R334

Q323
JW503
JW362 Q339 C123 D314 G-1 Q303 C-8
R333

R361
JW417 JW416 D336 D315 G-1 Q304 C-8

JW368
Q320

Q321 R305 JW385

C342 JW415
D316 G-1 Q305 B-7

D319
JW396 Q315 JW363 JW506
D316

D314

JW507
D315

JW413
JW433

D317 I-4 Q306 C-5

JW347

JW397
JW502

Q316
D308

JW388
D309

JW414
15

R226
IC303 IC311 IC315 IC310 IC313 D318 J-6 Q307 B-8
JW351
R363

JW481

JW319
C308

C329
R317
D319 G-7 Q308 B-7

JW371
IC308

IC101
JW355 JW484
D320 I-4 Q309 H-2

JW370
C339 C332
JW437 JW365 JW373 R130
D321 D-6 Q310 H-3

JW369

R129
JW372
C341 C337 JW412
IC305

C223
C345 D303 D322 C-2 Q311 H-3
JW487

C124
C150

R128
JW383

JW322 R127
JW410 D323 C-2 Q312 H-3
Q310
D324 C-2 Q315 G-7

JR305
JW404

D312 C331 D305 C328

C338 C307

IC314 D325 C-2 Q316 G-6

C330

R314 JW411 JW408

R315

JW374
C374

JW392
C376
Q311
JW464
JW375
D326 I-4 Q318 C-3
Q309
Q319 C-2

JW393
JW407
D330 D-5

JW376
D331 C-8 Q320 G-4
D320
D304

D326

D317
D307
JW485

15 D332 D-7 Q321 G-4

JW381

C316
C336

C321
C335

Q322 G-4
JW498

JW465

JW405

JW377
JW378
IC101 G-9 Q323 G-4
JW389
JW390

JW380
IC201 I-9 Q329 B-6

JW379

R229
JW386
JW406

R230
JW402 JW391
IC301 E-7 Q330 D-6

IC201
JW472

JW394
R228
C224
IC302 D-7 Q331 D-6
C320

JW499
TH2
IC303 G-5 Q333 F-4
C317

JW418
C340 R227 IC305 H-1 Q335 B-5
JW403 C250
JW398 IC306 C-4 Q337 B-5
D318 JW399 C225 IC307 D-5 Q339 G-7
JW401 C319
IC308 G-1
C318

CNP307

C357
JW430
(Page 60)
CN902

51 51
HCD-CP500MD
7-9. SCHEMATIC DIAGRAM – AUDIO SECTION (1/2) –

(Page 47) (Page 55)

CN302 CN303

R513
C509
Q320 Q322
CN304
C507

IC503
R509
FB326 R233 Q335

FB324
R333 Q330
C392 D308 R302

D309
R367
C393 R133
FB323 Q321 C390 C377
C394
R368 Q331
R334

R428

R424
R426
FB325 R372
C373
FB321 R373 R370
R234 R134
FB322 R371
R374 R213

R113
Q323
C333
R307

C240
C140

R212
R112
FB309 FB320 (Page 59)
Q337
C344

C343
C213
C116
C312

CN301
FB319
FB318
FB317
R104 FB316

R136
R204 FB315
FB314
FB313 C132

R495
C107 R497
FB312 C207 R236 R135 C232

R319
R494
R493
R492
R491
R490
R489
R488
R487
R486
R485
R484
R483
R482
R481
R235 R362
FB302 FB311 CNP503

R389
FB310
JR302

FB308
(Page 57) R401 R480
FB306 (Page 59)
R402
FB307
R403 R479
R404 R478
C310 FB303 R405 R477
R406 R476
R407 R475
FB304
R474

C803 R409
C801

R352 X802 C802

TU1 X801

R468
R358
R467
R357 IC306
R466
R356 R355
C804
R353
C314

R419
C233 R420
R222
R421
R122
R422
C133 C120 C220 R423 R458
R123 R457
R223 R425 R456
C380 R455
R427 R454
R453
R321 R429 R452
R349 R430
C367 R328
R348
Q329
C365
C366
R347 R346 C364

IC B/D R345
R350
R433

R437
R438
R439
R440
R441
R442
R443
R444
R445
R446

R448
R449
R450
R434

R435
R436
R432

IC309

R342
C362 R344 R343
C355

C361 D332
X301 FB301

C356
C358 R351
C360

D331

(Page 53)

52 52
 HCD-CP500MD
7-10. SCHEMATIC DIAGRAM – AUDIO SECTION (2/2) –

(Page 52)

CN306

C109 JR101 IC302

(Page 59)
PJ301 R132 C121 R121
C131 C231 C385 C386 TH2
R102 JR305
C221 R221
R232 C117
C114 R202 C805
C209 JR201 C304 R340
C214
SJ301

R110
IC101 C378

R105
R106
R205

R208
C302

R206
C379

C305
IC B/D
C301

C206
C106
C306
C205
C105
C204
C104
C203
C103
C202
C102
C208
C108
C130 R341
C230
C217

R304
R130
JR310 Q101 Q201
IC301 R126 C123

C125
L101

R129 L201
C124
R127
R128 C127 C227
R364 Q315

C128 C228
R305 D319
C150
R231
Q339 R131
C210
C218
C216

C118
C113
C111
C112
C211
C212

Q316
R316
R320

C110

C383 C381
C299
R207

R107

C201 C101 R201 R108

C115 C250 C313

C215 R228 C224

D336
R209 R243 R143 R227 R361
R109 D321
JR301 C300
IC B/D
R226 C223 R229

C225

R230

C340

Q304
D306

Q303

IC201
Q312
Q305 CNP307
Q307
D303
R313 R300
C320
IC310 D326
R365 C316
R303 D325
C363 C319 C317 C318
C323
C322 Q308 R366
C327
D313

C321 C357 C308 R363 (Page 60)

C326 C328
C311 C309 C354 C329
C324

C325 D311 Q306 D310

D304
R331
D307
R326 R327
Q309 D317
D320 D323
D316

D314
D315

CN308
Q319
IC315 S1
IC316
Q310
IC B/D R336
C349 R329
IC308
C368 M901
C345 R330
C347 CN1
C348 D324
C330
IC311 R314 IC303 IC313 IC314 IC305

D305 D330
Q311
R317 D322
D318 R315 C353
Q318 C350
R322

C331 C336 C337 C338 C307 C374 C341 C369

C332 C335 C339 C342 C352
R360
Q333
C351

D312

IC B/D
IC307

53 53
HCD-CP500MD
7-11. PRINTED WIRING BOARD – TC BOARD – • See page 30 for Circuit Boards Location.

CN303
(Page 51)

CN302 CN301
CN303

JW424
JW423

JW422

R416

R422
JW431

R426

R423
R424
JW428
JW430

R433
R425 Q407

JW435
JW429 Q414

C420
C438

C415

C410

C417
C414
R415

R441
C439

C412
R419

C437

R442
JW432

R420
JW403

R421
C436 Q406

R418
R408

R409
C424 R410

C416
C404
R417

JW402
C440
R414

C402

JW405
JW404

R400
Q402
JW412 Q413 IC401

C409
C430
R429

R428
C429

R413
R437

R406
R399

C403
R438 R411

C450

C423
Q403 R407
R412
Q401

R405

C405
R436 JW420
T403 T402 C408
D401
C431 R439
JW427 JW426
R431

C425
R434 R427
C434

C428

IC402
T401

R435 R430
JW409 JW407
C435 R432
C422

C432 R440
R403 C433 CNP1

• Semiconductor HEAD
Location
Ref. No. Location
D401 D-2

IC401 C-4
IC402 D-3

Q401 D-1
Q402 C-2
Q403 D-1
Q406 C-4
Q407 B-4
Q413 C-3
Q414 B-4

54 54
 HCD-CP500MD
7-12. SCHEMATIC DIAGRAM – TC BOARD –

CN303
R417

C439

CN301

R409
IC B/D R419
R420 Q407
C404 C437

C414
C415
R410 R418

C412
C417 R433
CNP1 R421

C436 R408 C410

R415

Q414 (Page 52)

C438

R441
IC401

Q413
C420

R399
C440

R406
C403 C409 R414
R442

R407 R411 C416

CN302
C402 C405
C408 Q406

R400
R405 R412 R413

R422
IC402
R423
R424
R425
R426
R416

D401

R427
R439
C424
R440

C425 C450 C423

T402

C430

R428

T403 R429
C429

Q402
C428 C431

R434

R432
R430 R431
R438
C433

R435 Q401
R437
T401 R403
C435

C434
C432 C422 R436

Q403

55 55
HCD-CP500MD
7-13. PRINTED WIRING BOARD – DIGITAL BOARD – • See page 30 for Circuit Boards Location.

C1020
C1018

R1080
C1019 C1053
R1090

IC1006

C1047
R1006

C1010

C1017

C1009

C1001
R1013
R1005 C1016 R1011

C1046
R1012 C1012
C1011
R2007 C1014
C1003
R2008 Q2002
R1007 C1015 C1013
R1010
C1002

R2006

C1052
C1006
R1002

R1001 Q2001

CN1001
R1003

R1004

C1007
C1005
C1008

IC1005
C1004 Q1004

C1045
R1024 Q1003

R1081
CN301
R1059

R1077
R1058
R1075

C1035
R1030

(Page 51)

R2002

24
R1087

25
R1085
R1029

C1118
X1002
C1024

C1043

R1035
C1042
IC1001 R1068 R1014 C1051
C1023

C1022
R1018 C1050

X1001
R1067

C1021
R1088

C1049
R1017
R1016
R1015
R1071
R1072
R1073
R1076
C1037

R1060

R1082
R1034
R1093

C1044

R2005
C1038

R1091
Q1001
C1025

C1026
C1039

R1092
Q1002

C1040
R1033
C1027 R1094
R1036
IC1004 R1057
C1041
C1034
R1095

R1078

C1048
L1001

CN1004 CN1003

• Semiconductor
Location
Ref. No. Location CN103 CN102
(Page 48) (Page 48)
IC1001 C-4
IC1004 D-5
IC1005 B-2
IC1006 A-2

Q1001 D-6
Q1002 D-7
Q1003 C-3
Q1004 B-3
Q2001 B-3
Q2002 B-3

56 56
 HCD-CP500MD
7-14. SCHEMATIC DIAGRAM – DIGITAL BOARD –

(Page 50)

CN1004
CN1003

C1048

R1092
R1093
R1094

R1095
R1091
IC1004 (Page 50)

IC B/D
L1001

R2005
R1078
R2002
CN1001

C1027

R1036 C1118

R1057 C1026 C1025

C1034

Q1001
R1033

Q1002
R1077
R1034

R1016
R1015

R1014

C1038
C1039 R1001
C1041 C1037 IC B/D
R1017

R1018 R1002
C1035 C1052
C1051 C1045
C1049 (Page 52)
C1050

C1040
C1005 C1001
R1007
Q1003 C1004
R1082 R1076

Q1004

R1080
C1044
R1029 R1075

C1008

R1030

C1003 C1002

C1006

C1007 R1060
R1088
R1059
R1087 R1058
Q2001
C1023
R1073

R1010
C1022 R2008 C1010 C1009
R1071 C1014 C1013

C1021 C1015 C1016

X1001 R2007
R1072
IC1001 R2006
R1035

C1024 Q2002 C1012 C1011

R1085

R1011

R1012 R1005

C1046
R1013
C1047

R1006
IC1006

C1017 IC B/D C1019 R1090

C1020

R1081

C1018

57 57
HCD-CP500MD
7-15. PRINTED WIRING BOARDS – CONTROL SECTION – • See page 30 for Circuit Boards Location.

C235
Q232
R228 FB201 L201

CN304

R139 R239
LCD801 C232

C135
FB301 JW101
R833 7 1 CN306
C841 C132
(Page 51) LP301 FB101 L101 Q132
JW801 R128

R841 JW835
JW827
D823 D822
Q805 D804 D801
JR810 C842
R820
R818

J301
S821 S822 R894
R891
R892
R893

R819
D802

D803
JW839
IC801 CN503
(Page 51)

S820 S823 JW553

R312

C553
S810 S811 S812 S813 S814

Q302

C554
R809 CN551

Q301
JW803 R812

FB551
R337
JW804 R810 R811 R306
R817
R821

JW552
JW551
R813 C551
JW802 JW554
R862 R310
R863 D821
Q804
JR803

S819 S824 R822 R336

IC551 C550
R808

Q801 D810 Q803

R304

R309
JR804
R869

S825

JW836
R868

R305
R847
R848

R861
J302
R835 RV801 S809
R816

JR806
JW805

JW837
JW830

Q808
D828 RV802 RV803
JW822

JW821

JW840
R843
C844

C843

JW820

JW841
R842

S818

JW838 S815
R815

JW808
JR805

JW809 R865

R880
R881
R882
R883

R864
JW814
JW810
JW811
JW813 JW831

JW816
S801,802,804-806,809,
Q806 D825 D824 JW812 810,815,817-825 S803,811-814
D811 D812
JW815 R802
S817 S802 R803

S803
CN808
CN801

R836
R801

S801
• Semiconductor
Location
JW824

Q809

Ref. No. Location Ref. No. Location

R845
JW826

R846
JW825

S804 CNP809 D801 B-7 D828 D-1

CN304
D802 B-7
JW823
R834

(Page 51)
JW829
CNP807 D803 B-3 IC801 B-7
JR807

D804 B-3
JW833

D810 D-4 Q801 C-4

JW817
D821 C-7 Q803 D-7
D822 B-2 Q804 C-7
R804

D823 B-1 Q805 B-1

D824 F-2 Q806 F-1

R885
R886
D827 D826
Q802
D825 F-1 Q807 H-1
CN806

Q807
D814 D813 D826 H-2 Q808 D-1
D827 H-1 Q809 G-2
S806 R805 S805

58 58
 HCD-CP500MD
7-16. SCHEMATIC DIAGRAM – CONTROL SECTION –

RV802 RV803
R891
R834 R835 R836
IC801
R892 RV801
LCD801

R893 R894 S801 S817

S809

R880 R881 R882 R883

S818
S802 S810 R815
R801 R808
D801 D803 R841
S819 C841
S811 R816 C842 R842 C843 C844 R843
R809
S803
R802
S820

R810 S812 R817

S804
D802 R803
S821
D804 R818
R811 S813

S805
R804 S822
S814 R819
R812

S806 S823
R805 R820 R845

R813 S815
R833 S824 R846
R821
R847 R848 CN808

D810
R822
CNP809
S825 D811
Q801 Q809

D812

C132 R128 FB101 L101

R239 R228 FB201 L201

C232 J301
R139

FB301
R863 R864 D822 D824 D826 R868 R869
(Page 53) CN304
C235 R865
R861 R862 D821
Q232
D823 D825 D827 D828
Q132 C135

Q804

Q805 Q806 Q807 Q808

Q803
C553 FB551

R306
CN551
C554
Q302 R305
R337

R304
R312

CNP807
Q301
(Page 52) R885
CN801
D813
R336 R886
CN806
R310

D814

J302
Q802
C550 C551

IC551

(Page 52)

59 59
HCD-CP500MD
7-17. PRINTED WIRING BOARD – POWER BOARD – 7-18. SCHEMATIC DIAGRAM – POWER BOARD –
• See page 30 for Circuit Boards Location.

Q901
D915

R902

C911
C912

Q903
D913
D911

D912

C910
D917

CNP307

R903
D910
(Page 51)

CN902

JW911
D907

D906
R904

C906
C907
D919
D920
R905 T902

R906

JW916
C918

D908
D909

C909
F903

D902
D904
C908

C902
C904

C903

C905
F902
Q902
D905
CN902
F901

D905

D903
FH906

C903
C905

FH907
F904
F904

D903
S901

D905
D918 F903 F905

D908

D906
FH905

C908
Q901 C906
FH908

RY901 Q903

D907
D909
JW914
R902 D918

C909
C907
CN901
RY901
T901
D917
T901

C917

C910
D904

LF901 C911

D912

D910

C916
C914
C904

D915

(EXCEPT E51,HK) (EXCEPT E51,HK)

C902

D913

D911
F905 Q902

C913

C915
(E51,HK)
R903 CN901
(EXCEPT E51,HK) (E51,HK) LF901
JW904
C912
JW905 R904 C918
JW907
D902

D919
T902
R905
JW918

F902

D920
R906

JW908

JW912
S901 JW913
VOLTAGE
F901

SELECTOR

220V-240V

110V-120V
(E51,HK)

• Semiconductor
Location
Ref. No. Location Ref. No. Location
D902 F-5 D913 A-3
D903 D-5 D915 A-4
D904 E-5 D917 A-4
D905 D-5 D918 D-3
D906 B-4 D919 C-3
D907 B-4 D920 C-3
D908 C-4
D909 C-4 Q901 A-4
D910 B-3 Q902 C-3
D911 A-3 Q903 A-4
D912 A-3
60 60
 HCD-CP500MD

7-19. IC BLOCK DIAGRAMS

IC101, 201 TDA7296 IC307 KA3082

THERMAL
BIPOLAR SHUTDOWN
TRANSCONDACTANCE DRIVER OUT
INPUT STAGE
– MOS GAIN & MOS SHORT
+ LEVEL SHIFTING OUTPUT CIRCUIT
STAGE STAGE PROTECTION
PRE DRIVER

BIAS
STANDBY/
MUTE
BOOST- LOGIC TSD
STRAP SWITCH

1 2 3 4 5 6 7 8 9 10
1 2 3 4 5 6 7 8 9 10 11 12 13 14 15

GND
OUT1
VZ1

VCTL

IN1
IN2

VCC1

VCC2
VZ2
OUT2
STBY-GND
IN–

IN+
IN+ MUTE

NC

BOOSTSTRAP

+VS
–VS
STBY

MUTE

NC
NC

+PWVS
OUT
–PWVS
IC309 BU1924F

VDD2
RCLK

VSS2
IC308 M62016L

(NC)

XO

T1

T2
XI
16 15 14 13 12 11 10 9

DIGITAL
TEST
CLOCK
COM
+ INTERRUPT SIGNAL
– GENERATING BLOCK

8TH SWITCHED
CAPACITOR FILTER
COM
+ COMPARATOR
RESET SIGNAL ANTI-ALIASING
FILTER
– GENERATING BLOCK

PLL
PLL BI-PHASE DIFFERENTIAL
1 2 3 4 5 57kHz
RDS/ARI
1187.5Hz DECODER DECODER

GND INT RESET CD VCC

ANALOG

1 2 3 4 5 6 7 8
QUAL

RDATA

VREF

MUX

VDD1

VSS1

VSS3

CMP

IC401 TA8189N
METAL PRE TAPE A REC REC
CH2/A CH2/B NF OUT OUT /TAPE B VCC CG OUT NF IN ALC

24 23 22 21 20 19 18 17 16 15 14 13

CH2 –
– +
CH2
+

A/B

ALC
VREF1 IREF
VREF2

M/N

CH1 CH1
+ +
– –

GND GND
1 2 3 4 5 6 7 8 9 10 11 12
CH1/A CH1/B NF METAL PRE MIX GND1 M/H REC NF REC GND
OUT OUT OUT OUT IN

61
HCD-CP500MD

IC1004 BA6209N

FORWARD
MOTOR /REVERSE MOTOR
DRIVE CONTROL DRIVE

1 2 3 4 5 6 7 8 9 10
GND
OUT1

VZ1

VR

FIN

RIN

VCC1
VCC2
VZ2

OUT2
IC1005 µDA1360TS

16 VDDA
15 VSSA

VINL 1 – CLOCK 14 FSEL

ADC
+ ( ) CONTROL

DC-
VREF 2
DECIMATION CANCELLATION
FILTER FILTER

13 DATAO
VINR 3 – ADC DIGITAL
12 WS
+ ( ) INTERFACE
VREF (N) 4 11 BCK
VREF (P) 5
10 VSSD
SFOR 6
PWON 7 9 VDDD
SYSCLK 8

IC1006 µDA1350AH
SELSTATIC
PREEM0

DATAO
TEST2

TEST1
VDDD
RTCB

WSO
NC
NC

NC

44 43 42 41 40 39 38 37 36 35 34

RESET 1
33 BCKO
VDDD (C) 2
VSSD 3 32 VDDA (PLL)
VSSD (C) 4 31 VSSA (PLL)

L3DATA 5 DATA 30 PREEM1

L3 IEC 958
L3CLOCK 6 OUTPUT
INTERFACE DECODER CLOCK
INTERFACE
AND 29 CLKOUT
DATAI 7 TIMING
DATA
CIRCUIT 28 NC
BCKI 8 INPUT
INTERFACE
WSI 9 27 VDDA
26 VSSA
L3MODE 10 AUDIO FEATURE PROCESSOR 25 VSSA (DAC)
INTERPOLATOR
NC 11 NOISE SHAPER 24 VREF

DAC DAC 23 TC

12 13 14 15 16 17 18 19 20 21 22
MUTE

SELCHAN

NC

SPDIF0

SPDIF1

VDDA (DAC)

VOUT L
SELCLK
SELSPDIF

LOCK

VOUT R

62
 HCD-CP500MD

7-20. IC PIN FUNCTION

• IC101 CXA2523AR RF AMPLLFLER (BD BOARD)
Pin No. Pin Name I/O Description
1 I I I-V converted RF signal I input
2 J I I-V converted RF signal J input
3 VC O Middle point voltage (+1.5V) generation output
4 to 9 A to F I Signal input from the optical pick-up detector
10 PD I Light amount monitor input
11 APC O Laser APC output
12 APCREF I Reference voltage input for setting laser power
13 GND — Ground
14 TEMPI I Temperature sensor connection
15 TEMPR O Reference voltage output for the temperature sensor
16 SWDT I Serial data input from the CXD2662R
17 SCLK I Serial clock input from the CXD2662R
18 XLAT I Latch signal input from the CXD2662R “L”: Latch
19 XSTBY I Stand by signal input “L”: Stand by
20 F0CNT I Center frequency control voltage input of BPF22, BPF3T, EQ from the CXD2662R
21 VREF O Reference voltage output (Not used)
22 EQADJ I/O Center frequency setting pin for the internal circuit EQ
23 3TADJ I/O Center frequency setting pin for the internal circuit BPF3T
24 Vcc — +3V power supply
25 WBLADJ I/O Center frequency setting pin for the internal circuit BPF22
26 TE O Tracking error signal output to the CXD2662R
27 CSLED — External capacitor connection pin for the sled error signal LPF
28 SE O Sled error signal output to the CXD2662R
29 ADFM O FM signal output of ADIP
30 ADIN I ADIP signal comparator input ADFM is connected with AC coupling
31 ADAGC — External capacitor connection pin for AGC of ADIP
32 ADFG O ADIP duplex signal output to the CXD2662R
I3 signal/temperature signal output to the CXD2662R
33 AUX O
(Switching with a serial command)
34 FE O Focus error signal output to the CXD2662R
35 ABCD O Light amount signal output to the CXD2662R
36 BOTM O RF/ABCD bottom hold signal output to the CXD2662R
37 PEAK O RF/ABCD peak hold signal output to the CXD2662R
38 RF O RF equalizer output to the CXD2662R
39 RFAGC — External capacitor connection pin for the RF AGC circuit
40 AGCI I Input to the RF AGC circuit The RF amplifier output is input with AC coupling
41 COMPO O User comparator output (Not used)
42 COMPP I User comparator input (Fixed at “L”)
43 ADDC I/O External capacitor pin for cutting the low band of the ADIP amplifier
44 OPO O User operation amplifier output (Not used)
45 OPN I User operation amplifier inversion input (Fixed at “L”)
46 RFO O RF amplifier output
47 MORFI I Groove RF signal is input with AC coupling
48 MORFO O Groove RF signal output

• Abbreviation
APC: Auto Power Control
AGC: Auto Gain Control

63
HCD-CP500MD

• IC151 CXD2662R DIGITAL SIGNAL PROCESSOR, DIGITAL SERVO SIGNAL PROCESSOR (BD BOARD)
Pin No. Pin Name I/O Description
Function FOK signal output to the system control (monitor output)
1 MNT0 (FOK) O
“H” is output when focus is on (Not used)
2 MNT1 (SHCK) O Track jump detection signal output to the system control (monitor output)
3 MNT2 (XBUSY) O Monitor 2 output to the system control (monitor output)
4 MNT3 (SLOC) O Monitor 3 output to the system control (monitor output) (Not used)
5 SWDT I Writing data signal input from the system control
6 SCLK I (S) Serial clock signal input from the system control
7 XLAT I (S) Serial latch signal input from the system control
8 SRDT O (3) Reading data signal output to the system control
9 SENS O (3) Internal status (SENSE) output to the system control
10 XRST I (S) Reset signal input from the system control “L”: Reset
Subcode Q sync (SCOR) output to the system control
11 SQSY O
“L” is output every 13.3 msec. Almost all, “H” is output
12 DQSY O Digital In U-bit CD format or MD format subcode Q sync (SCOR) output to the system control
13 RECP I Laser power switching input from the system control “H”: Recording, “L”: Playback
14 XINT O Interrupt status output to the system control
15 TX I Recording data output enable input from the system control
16 OSCI I System clock input (512Fs=22.5792 MHz)
17 OSCO O System clock output (512Fs=22.5792 MHz) (Not used)
18 XTSL I System clock frequency setting “L”: 45.1584 MHz, “H”: 22.5792 MHz (Fixed at “H”)
19 DIN0 I Digital audio input (Optical input)
20 DIN1 I Digital audio input (Optical input) (Fixed at “L”)
21 DOUT O Digital audio output (Optical output) (Open)
22 DADTI I Serial data input (Fixed at “L”)
23 LRCKI I LR clock input “H” : Lch, “L” : R ch (Fixed at “L”)
24 XBCKI I Serial data clock input (Fixed at “L”)
25 ADDT I Data input from the A/D converter
26 DADT O Data output to the D/A converter (Not used)
27 LRCK O LR clock output for the A/D and D/A converter (44.1 kHz) (Not used)
28 XBCK O Bit clock output to the A/D and D/A converter (2.8224 MHz) (Not used)
29 FS256 O 11.2896 MHz clock output (Not used)
30 DVDD — +3V power supply (Digital)
31 to 34 A03 to A00 O DRAM address output
35 A10 O DRAM address output (Not used)
36 to 40 A04 to A08 O DRAM address output
41 A11 O DRAM address output (Not used)
42 DVSS — Ground (Digital)
43 XOE O Output enable output for DRAM
44 XCAS O CAS signal output for DRAM
45 A09 O Address output for DRAM
46 XRAS O RAS signal output for DRAM
47 XWE O Write enable signal output for DRAM

* I (S) stands for Schmidt input, I (A) for analog input, O (3) for 3-state output, and O (A) for analog output in the column I/O

64
 HCD-CP500MD

Pin No. Pin Name I/O Description

48 D1 I/O
49 D0 I/O Data input/output for DRAM
50, 51 D2, D3 I/O
52 MVCI I (S) Clock input from an external VCO (Fixed at “L”)
53 ASYO O Playback EFM duplex signal output
54 ASYI I (A) Playback EFM comparator slice level input
55 AVDD — +3V power supply (Analog)
56 BIAS I (A) Playback EFM comparator bias current input
57 RFI I (A) Playback EFM RF signal input
58 AVSS — Ground (Analog)
59 PCO O (3) Phase comparison output for the recording/playback EFM master PLL
60 FILI I (A) Filter input for the recording/playback EFM master PLL
61 FILO O (A) Filter output for the recording/playback EFM master PLL
62 CLTV I (A) Internal VCO control voltage input for the recording/playback EFM master PLL
63 PEAK I (A) Light amount signal peak hold input from the CXA2523AR
64 BOTM I (A) Light amount signal bottom hold input from the CXA2523AR
65 ABCD I (A) Light amount signal input from the CXA2523AR
66 FE I (A) Focus error signal input from the CXA2523AR
67 AUX1 I (A) Auxiliary A/D input
68 VC I (A) Middle point voltage (+1.5V) input from the CXA2523AR
69 ADIO O (A) Monitor output of the A/D converter input signal (Not used)
70 AVDD — +3V power supply (Analog)
71 ADRT I (A) A/D converter operational range upper limit voltage input (Fixed at “H”)
72 ADRB I (A) A/D converter operational range lower limit voltage input (Fixed at “L”)
73 AVSS — Ground (Analog)
74 SE I (A) Sled error signal input from the CXA2523AR
75 TE I (A) Tracking error signal input from the CXA2523AR
76 DCHG I (A) Connected to +3V power supply
77 APC I (A) Error signal input for the laser digital APC (Fixed at “L”)
78 ADFG I (S) ADIP duplex FM signal input from the CXA2523AR (22.05 ± 1 kHz)
79 F0CNT O Filter f0 control output to the CXA2523AR
80 XLRF O Control latch output to the CXA2523AR
81 CKRF O Control clock output to the CXA2523AR
82 DTRF O Control data output to the CXA2523AR
83 APCREF O Reference PWM output for the laser APC
84 TEST0 O PWM output for the laser digital APC (Not used)
85 TRDR O Tracking servo drive PWM output (–)

• Abbreviation
EFM: Eight to Fourteen Modulation
PLL : Phase Locked Loop
VCO: Voltage Controlled Oscillator

65
HCD-CP500MD

Pin No. Pin Name I/O Description

86 TFDR O Tracking servo drive PWM output (+)
87 DVDD — +3V power supply (Digital)
88 FFDR O Focus servo drive PWM output (+)
89 FRDR O Focus servo drive PWM output (–)
90 FS4 O 176.4 kHz clock signal output (X’tal) (Not used)
91 SRDR O Sled servo drive PWM output (–)
92 SFDR O Sled servo drive PWM output (+)
93 SPRD O Spindle servo drive PWM output (–)
94 SPFD O Spindle servo drive PWM output (+)
95 FGIN I (S)
Test input (Fixed at “L”)
96 to 98 TEST1 to TEST3 I
99 DVSS — Ground (Digital)
100 EFMO O EFM output when recording

• Abbreviation
EFM: Eight to Fourteen Modulation

66
 HCD-CP500MD

• IC306 M30622MGA-A44FP MASTER CONTROL (MAIN BOARD)

Pin No. Pin Name I/O Description
1 AC-CUT I AC CUT ON/OFF check signal input (L=ON,H=OFF)
2 POWER-ON O Power relay ON/OFF signal output (H=ON,L=OFF)
3 XTSL O XTSL signal output for IC101
4 SIRCS I Remote control receiver data signal input
5 DA_MUTE O D/A (MD) muting control signal output
6 SOL_CON O Solenoid(TC) control signal output (H=ON,L=OFF)
7 CAPM-CNT1 O Capstan motor control signal output (H=REV,L=FWD,L=STOP)
8 BYTE — Not used (ground)
9 CNVSS — Connected ground
10 XCIN I Sub clock input
11 XCOUT O Sub clock output
12 RESET I System reset signal input
13 XOUT O Main system clock output
14 VSS — Ground
15 XIN I Main system clock input (16MHz)
16 VCC — Power supply (+5V)
17 NMI I Not used (connected to Vcc)
18 RDS-INT I RDS interrupt signal input
19 CD-SCOR I CD Q-data request signal input
20 MDM_POWER O MD P-DOWN control signal output
21 OPT-SEL O Optical select signal output
22 CD-XLT O CD latch signal output
23 CD-SENS I CD sense signal input
24 BU_PWM3 O BU PWM3 signal output
25 LD_ON O CD LD ON signal output
26 BU_PWM2 O BU PWM2 signal output
27 CD-CLK O CD clock signal output
28 BU_PWM1 O BU PWM1 signal output
29 IIC_CLK O IIC clock signal output
30 IIC_DATA O IIC data signal output
31 FLS_SO — Not used (open)
32 SQ-DATA-IN I CD SQ data signal input
33 SQ-CLK O CD SQ clock signal output
34 CD-DATA O CD data signal output
35 LCD-DATA O LCD data signal output
36 LCD-CS O LCD CS signal output
37 LCD-SCK O LCD clock signal output
38 TC-MUTE O Tape deck line muting signal output (H=ON,L=OFF)
39 CD_XRST O CD reset signal output
40 IN SW I Tray close detect signal input
41 OPEN SW I Tray open detect signal input
42 TRAY-CLOSE O Loading motor control signal output
43 TRAY-OPEN O Loading motor control signal output
44 REC/PB/PASS O REC/PB/PASS select signal output
45 B_PLAY I B deck play signal input
46 OPT-SEL — Not used (Fixed at “H”)
47 (DOLBY-ON) — Not used
48 REC MUTE O TC REC muting ON/OFF signal output
49 MD RESET O MD reset signal output
50 CD-POWER O CD power control signal output (H=ON,L=OFF)
51 RDS-DATA I RDS data signal input

67
HCD-CP500MD

Pin No. Pin Name I/O Description

52 H/P_CHECK I Headphone detect signal input
53 H/P_MUTE O Headphone muting control signal output
54 AMP_MUTE O Power amplifier muting control signal output (L=ON,H=OFF)
55 VOL_CLK O Volume clock signal output
56 VOL_DATA O Volume data signal output
57 STK_POWER O Power amplifier ON/OFF signal output (H=ON,L=OFF)
58 LINE-MUTE O Line muting control signal output (H=ON,L=OFF)
59 NC — Not used
60 NC — Not used
61 NC — Not used
62 VCC — Power supply (+5V)
63 NC — Not used
64 VSS — Ground
65 NC — Not used
66 FM_ON O FM ON/OFF signal output (H=ON,L=OFF)
67 TU_ON O Tuner power ON/OFF signal output (H=ON,L=OFF)
68 TUNED I TUNED detect signal input
69 ST_DOUT I Tuner data signal input
70 ST_CLK O Tuner clock output
71 ST_DIN O Tuner data signal output
72 ST_CE O Tuner chip enable output
73 NC — Not used
74 POWER_KEY I Power key detect signal input
75 PC_POWER I PC power detect signal input for PC LINK
76 LCD_BACK_LIGHT O LCD back light LED control signal output
77 LCD-RS O LCD reset signal output
78 TUNER-LED O Tuner LED control signal output
79 CD_LED O CD LED control signal output
80 MD_LED O MD LED control signal output
81 TC_LED O TC LED control signal output
82 VOL_A I Volume signal input from rotary encoder
83 VOL_B I Volume signal input from rotary encoder
84 BASS-B I BASS signal input from rotary encoder
85 TREBLE-A I TREBLE signal input from rotary encoder
86 TREBLE-B I TREBLE signal input from rotary encoder
87 MD_INDICATOR_LED O MD INDICATOR LED control signal output
88 DSG-LED O DSG LED control signal output
89 KEY0 I Key input signal from function switch
90 KEY1 I Key input signal from function switch
91 KEY2 I Key input signal from function switch
92 BASS-A I BASS signal input from rotary encoder
93 B-SHUT(SENSOR) I B deck reel pulse signal input
94 B_HALF/REC I B deck half detect signal input
95 MODEL_IN I Model input
96 AG — Analog ground
97 SPEC_IN I Version select input
98 VREF — Analog voltage reference
99 AVCC — Analog power supply
100 SOFT_TEST O Soft check output (open)

68
 HCD-CP500MD

• IC1001 M30805MG-205GP SYSTEM CONTROL (DIGITAL BOARD)

Pin No. Pin Name I/O Description
1 — — Not used
2 — — Not used
3 LVLI — Not used
4 LVL0 — Not used
5 (TXD3) — Not used
6 (RXD3) — Not used
7 (CLK3) — Not used
8 MUTE O Line out muting output L: Muting
9 DARST O Reset signal output to the D/A converter L: Active
10 SLICERSEL O IEC958 input select signal output to the D/A converter L: CD H: MD
11 LD-LOW O Loading motor voltage control output L: High voltage H: Low voltage
12 LDIN I Loading motor control input H: IN
13 LDOUT O Loading motor control output H: OUT
14 MOD O Laser modulation switching signal output L: OFF H: ON
15 BYTE I Data bus changed input (Connected to ground)
16 CNVSS — Ground
17 X-CIN O Sub clock input (32.768kHz) (Not used)
18 X-COUT O Sub clock output (32.768kHz) (Not used)
19 RESET I System rest input L : ON
20 XOUT O Main clock output (10MHz)
21 VSS0 — Ground
22 XIN I Main clock input (10MHz)
23 VCC0 — Power supply (+3.3V)
24 NMI I Fixed at H (Pull-up)
25 DQSY I Digital in sync input (Record system)
26 P.DOWN I Power down detection input L: Power down
27 SQSY I ADIP (MO) sync or subcode Q (PIT) sync input from CXD2662R (Playback system)
28 NC — Not used
29 LDON O Laser ON/OFF control output H: Laser ON
30 LIMIT-IN I Detection input from the limit switch L: Sled limit-In H: Sled limit-Out
31 C2-PWM-B — Not used
32 XINIT I Interrupt status input from CXD2662R
33 — — Not used
34 XELT I XELT input from DSP IC
35 WR PWR O Write power ON/OFF output L: OFF H: ON
36 IIC CLK I/O IIC serial clock input/output
37 IIC DATA I/O IIC serial data input/output
38 SWDT O Writing data signal output to the serial bus
39 VCC1 — Power supply (+3.3V)
40 SRDT I Reading data signal input from the serial bus
41 VSS1 — Ground
42 SCLK O Clock signal output to the serial bus
43 REC-SW I Detection signal input from the recording position detection switch L: REC
44 CLIP DTO O CLIP serial data output
45 CLIPDTI I CLIP serial data input
46 CLIP CLK O CLIP serial clock output (Not used)
47 DIG-RST O Digital rest signal output to the CXD2662R and motor driver L: Reset
48 SENS I Internal status (SENSE) input from the CXD2662R
49 PLAY-SW I Detection signal input from the playback position detection switch L: PLAY
50 XLAT O Latch signal output to DSP IC
51 OUT-SW I Detection signal input from the loading out detection switch

69
HCD-CP500MD

Pin No. Pin Name I/O Description

52 — — Not used
53 — — Not used
54 — — Not used
55 — O Not used
56 MNT2 (XBUSY) I In the state of executive command from the CXD2662R
57 VSS2 — Ground
58 MNT1 (SHCK) I Track jump signal input from the CXD2662R
59 VCC2 — Power supply (+3.3V)
60 EEP-WP O EEP-ROM write protect signal output L: write possibility
61 SDA (EEP) I/O Data signal input/output pin with the EEP-ROM
62 BCLK/ALE/CLKO — Not used
63 RD/DW O Read signal output (Not used)
64 BHE/CASH — Not used
65 WR/CASL O Write signal output
66 SCL O Clock signal output to the EEP-ROM
67 REFLECT I Disk reflection rate detection input from the reflect detection switch H: Disk with low reflection rate
68 PROTECT I Recording-protection claw detection input from the protection detection switch H: Protect
69 CS0 O Chip select signal output to the Flash ROM
70 CS1 O Not used
71 — O Not used
72 A20 O Address bus signal output to Flash ROM
73 A19 O Address bus signal output to Flash ROM (Not used)
74 VCC3 — Power supply (+3.3V)
75 A18 O Address bus signal output to Flash ROM (Not used)
76 VSS3 — Ground
77 to 85 A17 to A9 O Address bus signal output to Flash ROM
86 to 89 SEL 3 to 0 O Not used
90 WP O Write protect signal to the Flash ROM
91 VCC4 — Power supply (+3.3V)
92 A8 O Address bus signal output to Flash ROM (Not used)
93 VSS4 — Ground
94 to 100 A7 to A1 O Address bus signal output to Flash ROM (Not used)
101 LB — Not used
102 to 113 D15 to D4 I/O Data bus signal input/output to the Flash ROM (Not used)
114 CLIP-SEL O Not used
115 IIC BUSY O IIC cable connect check L: Active
116 DALOCK O LOCK signal input from D/A converter
117 LINE-MUTE O Not used
118 ADP DOWN O Reset signal output to the A/D converter
119 to 122 D3 to D0 I/O Data bus signal input/output to the Flash ROM (Not used)
123 SPDIF-CUT — Jog dial pulse input from the rotary encoder
124 OPT SEL O Optical select signal output
125 to 129 — — Not used
130 VSS5 — Ground
131 — O Not used
132 VCC5 — Power supply (+3.3V)
133 OP-LEVEL I Optical Pick-up voltage (current) detect signal input
134 to 139 — — Not used
140 AVSS — Ground (Analog)
141 — — Not used
142 VREF — Power supply (+3.3V)
143 AVCC — Power supply (+3.3V)
144 NC I Not used

70
 HCD-CP500MD
SECTION 8 Ver. 1.1
EXPLODED VIEWS
NOTE:
• -XX, -X mean standardized parts, so they may • Hardware (# mark) list and accessories and The components identified by mark ! or
have some differences from the original one. packing materials are given in the last of this dotted line with mark ! are critical for safety.
• Items marked “*” are not stocked since they parts list. Replace only with part number specified.
are seldom required for routine service. Some • Abbreviation
delay should be anticipated when ordering these AUS : Australian model
items. CH : Chinese model
• The mechanical parts with no reference number E51 : Chilean and Peruvian model
in the exploded views are not supplied. HK : Hong Kong model

8-1. CASE AND TAPE MECHANISM DECK SECTION

f
#1 #1
6 7
not supplied

#1
8
5
12 13
#1
e
b
e
h b
9
10 CHASSIS
not supplied #1 a SECTION
#3 4 14 c
#1
not supplied
g
not 11
supplied
3 15 16 #1
2
11
#3
#1 not
1 supplied
h #1
#2 MDM-7B
#1
#1 b
b c
g
#3
a f
not supplied 5
#1 #2
#1
FRONT PANEL SECTION

Ref. No. Part No. Description Remarks Ref. No. Part No. Description Remarks
1 A-4725-838-A TC BOARD, COMPLETE 9 4-234-564-01 SPRING (CASSETTE OPEN)
2 1-757-943-11 WIRE (FLAT TYPE)(12CORE) 10 A-4725-834-A DIGITAL BOARD, COMPLETE
3 1-796-101-11 DECK, MECH 11 4-231-555-01 INSULATOR
4 3-926-926-01 GEAR, DAMPER 12 1-757-944-11 WIRE (FLAT TYPE)(17CORE)
5 4-221-580-01 SCREW, CASE 13 1-757-942-11 WIRE (FLAT TYPE)(27CORE)

6 4-234-555-01 SIDE PANEL (L) 14 1-792-767-11 WIRE (FLAT TYPE)(25 CORE)

7 X-4953-835-1 HOLDER ASSY, CASSETTE 15 4-234-554-01 COVER, MD
8 4-234-546-01 PANEL, TOP 16 4-234-556-01 SIDE PANEL (R)

71
HCD-CP500MD
Ver. 1.1

8-2. FRONT PANEL SECTION

64
56
64

57
not
a supplied
LCD801

55
58
59
60
not
supplied
54

64

64
53 not
supplied
65
#1
a
66
52 67

Supplied with 68
RV801
51

Ref. No. Part No. Description Remarks Ref. No. Part No. Description Remarks
51 4-232-471-01 WINDOW, CD 58 4-234-563-01 ADHESIVE (LCD WINDOW)
52 4-232-441-01 KNOB (VOL)
53 4-234-573-01 KNOB (TIBASS) 59 4-217-319-21 PLATE, LCD LIGHT
54 4-234-562-01 WINDOW (LCD) 60 4-234-566-01 LCD SHIEET
55 X-4953-821-1 PANEL SUB ASSY, FRONT (AEP, UK) 64 7-685-134-19 SCREW (DIA.2.6X8)(IT3B), TAPPING
65 1-757-946-11 WIRE (FLAT TYPE)(25 CORE)
55 X-4953-822-1 PANEL SUB ASSY, FRONT (AUS, E51, HK) 66 4-234-559-01 HOLDER (PRISM)
55 X-4953-964-1 PANEL SUB ASSY, FRONT (CH)
56 A-2056-914-A CONTROL BOARD, COMPLETE 67 4-232-451-01 PRISM
(lucluding CD-PRISM board, HEAD PHONE board, 68 4-232-478-01 FOOT
MD-INDICATE board and OPTICAL bpard) LCD801 1-804-393-11 DISPLAY PANEL, LIQUID CRYSTAL
57 4-234-522-01 HOLDER (LCD)

72
 HCD-CP500MD

8-3. CHASSIS SECTION

114
103 105
#1 #1
102
113
104
#1

#1 #1
#1 #1

#4 not supplied
not supplied
101 #4 not supplied

#5
T902
108
107
112

CDM55F-K4BD43
not supplied

not supplied
109
#6
#6

110
not supplied 111

Ref. No. Part No. Description Remarks Ref. No. Part No. Description Remarks
101 4-232-434-01 LID, CD 110 A-4725-837-A MAIN BOARD, COMPLETE (AEP, UK)
102 4-234-551-01 BRACKET, MPEG 110 A-4725-849-A MAIN BOARD, COMPLETE (AUS)
103 A-4725-836-A POWER BOARD, COMPLETE (AEP, UK, AUS, CH)
103 A-4725-850-A POWER BOARD, COMPLETE (E51, HK) 110 A-4726-237-A MAIN BOARD, COMPLETE (CH)
0 104 1-696-169-11 CORD, POWER (AEP, UK, E51, HK) 110 A-4726-248-A MAIN BOARD, COMPLETE (E51)
110 A-4727-454-A MAIN BOARD, COMPLETE (HK)
0 104 1-696-848-41 CORD, POWER (AUS) 111 4-232-478-01 FOOT
0 104 1-782-464-21 CORD, POWER (CH) 112 A-4303-626-A TUNER UNIT (E51, HK)
105 4-234-568-01 PANEL, BACK (AEP, UK, AUS, CH)
105 4-234-568-41 PANEL, BACK (E51, HK) 0 114 1-770-019-11 ADPTOR, CONVERSION PLUG 3P (UK, HK)
106 A-2056-914-A OPTICAL BOARD, COMPLETE 0 T902 1-437-248-21 TRANSFORMER, POWER

107 4-217-350-11 STOPPER, CORD (AEP, UK, AUS, CH, E51, HK)
108 1-757-943-11 WIRE (FLAT TYPE)(22CORE) The components identified by
109 4-217-354-11 BUSHING, INSULATING mark 0 or dotted line with mark
0 are critical for safety.
Replace only with part number
specified.

73
HCD-CP500MD
Ver. 1.2

8-4. MD MECHANISM DECK SECTION-1

(MDM-7B)

162
161
not supplied 164

163

160

165
159

166

#7
not 157
supplied 167

158
168 169
155 157
154
not supplied
156
152

170

153

152
151

Ref. No. Part No. Description Remarks Ref. No. Part No. Description Remarks
∗ 151 4-996-267-01 BASE (BU-D) 161 4-227-012-01 SPRING (HOLDER), TENSION
152 4-231-319-01 SCREW (+BTP)(2X6) 162 A-4680-638-B PLATE (HOLDER) ASSY, RETAINER
153 4-226-994-01 GUIDE (L) 163 4-226-996-01 LIMITTER (EJ)
154 A-4735-075-A HOLDER ASSY 164 4-227-013-01 SPRING (EJ), TENSION
155 X-4952-665-1 SPRING (SHT) ASSY, LEAF 165 4-226-995-01 SLIDER (EJ)

156 4-227-002-01 GEAR, PULEY 166 4-226-997-04 SLIDER

157 3-372-761-01 SCREW (M1.7), TAPPING 167 4-226-998-01 LEVER (CHG)
158 4-227-025-01 BELT (LOADING) 168 4-227-007-01 GEAR (SB)
159 4-228-923-01 LOCK (HOLDER) 169 4-227-006-01 GEAR (SA)
160 4-229-533-01 SPRING (STOPRER), TORSION 170 4-226-999-01 LEVER (HEAD)

74
 HCD-CP500MD
Ver. 1.4

8-5. MD MECHANISM DECK SECTION-2

(MDM-7B)
211

HR901

210
212

213 214 215

209
#8 206
#8

208 211
206
207
202
201 216
201
202
S102
217

M101
204
203

205

M102
202
202
M103

218
201

Ref. No. Part No. Description Remarks Ref. No. Part No. Description Remarks
201 4-231-319-01 SCREW (+BTP)(2X6) 214 4-227-023-01 SPRING (SPINDLE), TORSION
202 3-372-761-01 SCREW (M1.7), TAPPING 215 4-227-008-01 GEAR (SC)
203 4-227-004-01 GEAR (LC) 216 4-227-009-01 GEAR (SD)
204 4-227-005-01 GEAR (LD) 217 4-226-990-01 BASE (BU-A)
205 4-226-989-01 CHASSIS
218 A-4725-473-A BD BOARD, COMPLETE
206 4-232-270-01 SCREW (1.7X2.5), +PWH HR901 1-500-670-11 HEAD, OVER WRITE
207 4-226-993-01 RACK M101 A-4672-898-A MOTOR ASSY, SPINDLE
208 4-227-014-01 SPRING (RACK), COMPRESSION M102 A-4735-076-A MOTOR ASSY, SLED
209 1-678-514-11 FLEXIBLE BOARD M103 A-4735-074-A MOTOR ASSY, LOADING(MD)
0 210 A-4672-541-A OPTICAL PICK-UP KMS-260B
S102 1-771-957-11 SWITCH, PUSH (2KEY)(REFLECT/PROTECT)
211 4-988-560-01 SCREW (+P 1.7X6)
212 4-996-265-01 SHAFT, MAIN
The components identified by
213 4-226-992-01 BASE, SL mark 0 or dotted line with mark
0 are critical for safety.
Replace only with part number
specified.

75
HCD-CP500MD

8-6. CD MECHANISM DECK SECTION-1

(CDM55F-K4BD43)

259

258
260
255 261

254 262
257
264
263
256

253

M901

#9

not supplied

265

252

266

251

BU-K4BD43

267

Ref. No. Part No. Description Remarks Ref. No. Part No. Description Remarks
251 4-925-315-31 DAMPER 260 4-220-234-01 PULEY (LDG)
252 4-224-894-01 TRAY 261 4-220-237-01 GEAR (A)
253 1-676-599-11 LOADING BOARD 262 4-221-815-01 ROLLER
254 4-220-229-01 LEVER (SW) 263 4-231-779-01 CHASSIS (F)
255 4-220-239-01 SPRING, TORSION 264 A-4735-082-A MAGNET ASSY

256 4-220-233-01 CAM (CDM55) 265 A-4735-081-A PULLEY (AT-55F) ASSY

257 4-220-238-01 GEAR (B) 266 4-232-398-01 SHEET (KH)
258 4-227-598-01 SPACER (55) 267 4-985-672-01 SCREW (+PTPWHM2.6), FLOATING
259 4-221-816-01 BELT (CDM55) M901 A-2004-893-A MOTOR (LD) ASSY

76
 HCD-CP500MD

8-7. CD MECHANISM DECK SECTION-2

(BU-K4BD43)

307

306
307
307 308

306
306

307
306

305

304

#9

303

303
303

302 303

301

Ref. No. Part No. Description Remarks Ref. No. Part No. Description Remarks
301 4-221-817-02 SHAFT (BU) 305 1-757-055-11 WIRE (FLAT TYPE)(16 CORE)
302 4-231-780-01 HOLDER (BU) 306 4-229-005-01 INSULATOR (213)
303 4-229-004-01 SPRING (213), COMPRESSION 307 4-985-672-01 SCREW (+PTPWHM2.6), FLOATING
304 A-4476-973-A CD BOARD, COMPLETE 0 308 A-4735-357-A BASE ASSY, OP (KSM-213DHAP/Z-NP)

The components identified by

mark 0 or dotted line with mark
0 are critical for safety.
Replace only with part number
specified.

77
HCD-CP500MD
SECTION 9
BD ELECTRICAL PARTS LIST
NOTE:
• Due to standardization, replacements in the • CAPACITORS: When indicating parts by reference number,
parts list may be different from the parts uF: µF please include the board name.
specified in the diagrams or the components • COILS
used on the set. uH: µH The components identified by mark 0 or
• -XX, -X mean standardized parts, so they • SEMICONDUCTORS dotted line with mark 0 are critical for safety.
may have some difference from the original In each case, u: µ, for example: Replace only with part number specified.
one. uA...: µA... , uPA... , µPA... ,
• Items marked “∗” are not stocked since they uPB... , µPB... , uPC... , µPC... ,
are seldom required for routine service. uPD..., µPD...
Some delay should be anticipated when • Abbreviation
ordering these items. AUS : Australian model.
• RESISTORS CH : Chinese model.
All resistors are in ohms. E51 : Chilean and Peruvian model.
METAL: metal-film resistor HK : Hong Kong model.
METAL OXIDE: Metal Oxide-film resistor
F: nonflammable

Ref. No. Part No. Description Remarks Ref. No. Part No. Description Remarks
A-4725-473-A BD BOARD, COMPLETE C156 1-164-156-11 CERAMIC CHIP 0.1uF 25V
∗∗∗∗∗∗∗∗∗∗∗∗∗∗∗∗∗∗∗ C157 1-164-156-11 CERAMIC CHIP 0.1uF 25V

< CAPACITOR > C158 1-162-927-11 CERAMIC CHIP 100PF 5% 50V

C159 1-162-927-11 CERAMIC CHIP 100PF 5% 50V
C101 1-135-259-11 TANTAL. CHIP 10uF 20.00% 6.3V C160 1-162-927-11 CERAMIC CHIP 100PF 5% 50V
C102 1-135-259-11 TANTAL. CHIP 10uF 20.00% 6.3V C161 1-162-970-11 CERAMIC CHIP 0.01uF 10% 25V
C103 1-162-970-11 CERAMIC CHIP 0.01uF 10% 25V C162 1-162-970-11 CERAMIC CHIP 0.01uF 10% 25V
C104 1-164-227-11 CERAMIC CHIP 0.022uF 10% 25V
C105 1-115-416-11 CERAMIC CHIP 0.001uF 5.00% 25V C163 1-125-891-11 CERAMIC CHIP 0.47uF 10.00% 10V
C164 1-162-927-11 CERAMIC CHIP 100PF 5% 50V
C106 1-162-970-11 CERAMIC CHIP 0.01uF 10% 25V C165 1-162-968-11 CERAMIC CHIP 0.0047uF 10% 50V
C107 1-162-970-11 CERAMIC CHIP 0.01uF 10% 25V C166 1-125-891-11 CERAMIC CHIP 0.47uF 10.00% 10V
C108 1-162-969-11 CERAMIC CHIP 0.0068uF 10% 25V C167 1-164-245-11 CERAMIC CHIP 0.015uF 10.00% 25V
C109 1-164-677-11 CERAMIC CHIP 0.033uF 10.00% 16V
C110 1-163-038-00 CERAMIC CHIP 0.1uF 25V C169 1-164-156-11 CERAMIC CHIP 0.1uF 25V
C173 1-164-156-11 CERAMIC CHIP 0.1uF 25V
C111 1-117-720-11 CERAMIC CHIP 4.7uF 10V C174 1-162-970-11 CERAMIC CHIP 0.01uF 10% 25V
C112 1-110-563-11 CERAMIC CHIP 0.068uF 10.00% 16V C180 1-117-370-11 CERAMIC CHIP 10uF 10V
C113 1-162-968-11 CERAMIC CHIP 0.0047uF 10% 50V C181 1-126-206-11 ELECT CHIP 100uF 20% 6.3V
C114 1-125-837-00 CERAMIC CHIP 1uF 10% 6.3V
C115 1-162-966-11 CERAMIC CHIP 0.0022uF 10% 50V C182 1-163-038-00 CERAMIC CHIP 0.1uF 25V
C183 1-164-156-11 CERAMIC CHIP 0.1uF 25V
C116 1-164-227-11 CERAMIC CHIP 0.022uF 10% 25V C184 1-117-970-11 ELECT CHIP 22uF 20.00% 10V
C117 1-162-970-11 CERAMIC CHIP 0.01uF 10% 25V C185 1-131-872-11 CERAMIC CHIP 1000PF 10% 630V
C118 1-165-176-11 CERAMIC CHIP 0.047uF 10.00% 16V C191 1-126-206-11 ELECT CHIP 100uF 20% 6.3V
C119 1-165-176-11 CERAMIC CHIP 0.047uF 10.00% 16V
C120 1-164-156-11 CERAMIC CHIP 0.1uF 25V C192 1-164-156-11 CERAMIC CHIP 0.1uF 25V
C193 1-126-206-11 ELECT CHIP 100uF 20% 6.3V
C121 1-164-156-11 CERAMIC CHIP 0.1uF 25V C194 1-164-156-11 CERAMIC CHIP 0.1uF 25V
C125 1-117-720-11 CERAMIC CHIP 4.7uF 10V C195 1-164-156-11 CERAMIC CHIP 0.1uF 25V
C128 1-164-156-11 CERAMIC CHIP 0.1uF 25V C196 1-164-156-11 CERAMIC CHIP 0.1uF 25V
C131 1-117-720-11 CERAMIC CHIP 4.7uF 10V
C132 1-164-156-11 CERAMIC CHIP 0.1uF 25V C1401 1-117-720-11 CERAMIC CHIP 4.7uF 10V

C133 1-164-156-11 CERAMIC CHIP 0.1uF 25V < CONNECTOR >

C141 1-126-206-11 ELECT CHIP 100uF 20% 6.3V
C142 1-164-156-11 CERAMIC CHIP 0.1uF 25V CN101 1-766-833-21 CONNECTOR, FFC/FPC (ZIF) 21P
C143 1-164-156-11 CERAMIC CHIP 0.1uF 25V CN102 1-784-835-21 CONNECTOR, FFC (LIF (NON-ZIF)) 27P
C144 1-162-970-11 CERAMIC CHIP 0.01uF 10% 25V CN103 1-784-869-21 CONNECTOR, FFC (LIF (NON-ZIF)) 17P
∗ CN104 1-580-055-21 PIN, CONNECTOR (SMD) 2P
C145 1-164-156-11 CERAMIC CHIP 0.1uF 25V CN105 1-784-859-21 CONNECTOR, FFC (LIF (NON-ZIF)) 7P
C146 1-117-720-11 CERAMIC CHIP 4.7uF 10V
C147 1-117-720-11 CERAMIC CHIP 4.7uF 10V < DIODE >
C151 1-117-370-11 CERAMIC CHIP 10uF 10V
C152 1-164-156-11 CERAMIC CHIP 0.1uF 25V D101 8-719-988-61 DIODE 1SS355TE-17
D181 8-719-080-81 DIODE FS1J6
C153 1-164-156-11 CERAMIC CHIP 0.1uF 25V D183 8-719-080-81 DIODE FS1J6
C154 1-126-206-11 ELECT CHIP 100uF 20% 6.3V
C155 1-164-156-11 CERAMIC CHIP 0.1uF 25V

78
 HCD-CP500MD
BD

Ref. No. Part No. Description Remarks Ref. No. Part No. Description Remarks
< IC > R106 1-216-825-11 METAL CHIP 2.2K 5% 1/16W
R107 1-216-825-11 METAL CHIP 2.2K 5% 1/16W
IC101 8-752-080-95 IC CXA2523AR R108 1-216-833-11 METAL CHIP 10K 5% 1/16W
IC102 8-759-473-51 IC TLV2361CDBV R109 1-216-845-11 METAL CHIP 100K 5% 1/16W
IC141 8-759-836-79 IC BH6519FS-E2 R110 1-216-845-11 METAL CHIP 100K 5% 1/16W
IC151 8-752-404-64 IC CXD2662R
IC152 6-700-052-01 IC MSM51V17400F-50TS-K R111 1-216-833-11 METAL CHIP 10K 5% 1/16W
R112 1-216-829-11 METAL CHIP 4.7K 5% 1/16W
IC181 8-759-481-17 IC MC74ACT08DTR2 R113 1-216-833-11 METAL CHIP 10K 5% 1/16W
IC190 8-759-677-64 IC L88M35T R114 1-216-827-11 METAL CHIP 3.3K 5% 1/16W
IC195 8-759-640-41 IC BR24C08F-E2 R115 1-216-833-11 METAL CHIP 10K 5% 1/16W

< CONDUCTOR > R116 1-216-839-11 METAL CHIP 33K 5% 1/16W

R117 1-216-837-11 METAL CHIP 22K 5% 1/16W
JW201 1-216-295-00 SHORT 0 R118 1-218-855-11 METAL CHIP 2.2K 0.5% 1/16W
JW202 1-216-295-00 SHORT 0 R119 1-218-863-11 METAL CHIP 4.7K 0.5% 1/16W
JW203 1-216-295-00 SHORT 0 R120 1-218-889-11 METAL CHIP 56K 0.5% 1/16W
JW903 1-216-295-00 SHORT 0
JW904 1-216-295-00 SHORT 0 R121 1-218-863-11 METAL CHIP 4.7K 0.5% 1/16W
R122 1-218-855-11 METAL CHIP 2.2K 0.5% 1/16W
< FERRTE BEAD/CONDUCTOR > R123 1-216-819-11 METAL CHIP 680 5% 1/16W
R124 1-216-809-11 METAL CHIP 100 5% 1/16W
L101 1-500-245-11 FERRITE 0uH R125 1-216-815-11 METAL CHIP 330 5% 1/16W
L102 1-500-245-11 FERRITE 0uH
L103 1-500-245-11 FERRITE 0uH R126 1-216-819-11 METAL CHIP 680 5% 1/16W
L105 1-414-235-11 FERRITE 0uH R127 1-216-845-11 METAL CHIP 100K 5% 1/16W
L106 1-500-245-11 FERRITE 0uH R128 1-219-724-11 METAL CHIP 1 1% 1/4W
R129 1-216-298-00 METAL CHIP 2.2 5% 1/10W
L121 1-500-245-11 FERRITE 0uH R130 1-216-829-11 METAL CHIP 4.7K 5% 1/16W
L122 1-500-245-11 FERRITE 0uH
L131 1-500-245-11 FERRITE 0uH R131 1-216-833-11 METAL CHIP 10K 5% 1/16W
L141 1-216-296-11 SHORT 0 R132 1-216-839-11 METAL CHIP 33K 5% 1/16W
L142 1-216-296-11 SHORT 0 R133 1-216-821-11 METAL CHIP 1K 5% 1/16W
R134 1-216-821-11 METAL CHIP 1K 5% 1/16W
L143 1-216-296-11 SHORT 0 R135 1-216-821-11 METAL CHIP 1K 5% 1/16W
L144 1-216-296-11 SHORT 0
L145 1-216-296-11 SHORT 0 R136 1-216-302-00 METAL CHIP 2.7 5% 1/10W
L146 1-469-855-21 FERRITE 0uH R138 1-216-833-11 METAL CHIP 10K 5% 1/16W
L147 1-469-855-21 FERRITE 0uH R150 1-216-833-11 METAL CHIP 10K 5% 1/16W
R151 1-216-833-11 METAL CHIP 10K 5% 1/16W
L161 1-500-245-11 FERRITE 0uH R153 1-216-833-11 METAL CHIP 10K 5% 1/16W
L171 1-500-245-11 FERRITE 0uH
L180 1-469-855-21 FERRITE 0uH R155 1-216-864-11 METAL CHIP 0 5% 1/16W
L181 1-469-855-21 FERRITE 0uH R156 1-216-864-11 METAL CHIP 0 5% 1/16W
L182 1-500-245-11 FERRITE 0uH R158 1-216-809-11 METAL CHIP 100 5% 1/16W
R162 1-216-833-11 METAL CHIP 10K 5% 1/16W
L183 1-216-296-11 SHORT 0 R167 1-216-833-11 METAL CHIP 10K 5% 1/16W
L184 1-216-296-11 SHORT 0
R168 1-216-845-11 METAL CHIP 100K 5% 1/16W
< TRANSISTOR > R169 1-216-855-11 METAL CHIP 680K 5% 1/16W
R170 1-216-827-11 METAL CHIP 3.3K 5% 1/16W
Q101 8-729-403-35 TRANSISTOR UN5113-TX R171 1-216-821-11 METAL CHIP 1K 5% 1/16W
Q121 8-729-403-35 TRANSISTOR UN5113-TX R173 1-216-821-11 METAL CHIP 1K 5% 1/16W
Q122 8-729-101-07 TRANSISTOR 2SB798-T1DK
Q131 8-729-026-53 TRANSISTOR 2SA1576A-T106-QR R174 1-216-811-11 METAL CHIP 150 5% 1/16W
Q132 8-729-903-10 TRANSISTOR FMW1-T-148 R177 1-216-805-11 METAL CHIP 47 5% 1/16W
R179 1-216-295-00 SHORT 0
Q133 8-729-402-93 TRANSISTOR UN5214-TX R181 1-216-841-11 METAL CHIP 47K 5% 1/16W
Q134 8-729-402-93 TRANSISTOR UN5214-TX R182 1-216-841-11 METAL CHIP 47K 5% 1/16W
Q181 8-729-018-75 TRANSISTOR 2SJ278MYTR
Q182 8-729-017-65 TRANSISTOR 2SK1764KYTR R183 1-216-841-11 METAL CHIP 47K 5% 1/16W
R184 1-220-942-11 METAL CHIP 3.3 1% 1/4W
< RESISTOR > R185 1-220-942-11 METAL CHIP 3.3 1% 1/4W
R195 1-216-833-11 METAL CHIP 10K 5% 1/16W
R101 1-216-829-11 METAL CHIP 4.7K 5% 1/16W R196 1-216-833-11 METAL CHIP 10K 5% 1/16W
R102 1-216-853-11 METAL CHIP 470K 5% 1/16W
R103 1-216-863-11 RES-CHIP 3.3M 5% 1/16W R197 1-216-833-11 METAL CHIP 10K 5% 1/16W
R104 1-216-853-11 METAL CHIP 470K 5% 1/16W R218 1-216-864-11 METAL CHIP 0 5% 1/16W
R105 1-216-825-11 METAL CHIP 2.2K 5% 1/16W

79
HCD-CP500MD
BD CD

Ref. No. Part No. Description Remarks Ref. No. Part No. Description Remarks
< SWITCH > C239 1-115-412-11 CERAMIC CHIP 680PF 5.00% 25V

S101 1-762-596-21 SWITCH, PUSH (1 KEY)(LIMIT IN) C240 1-115-412-11 CERAMIC CHIP 680PF 5.00% 25V
S103 1-771-956-21 SWITCH, PUSH (1 KEY)(OUT) C241 1-164-360-11 CERAMIC CHIP 0.1uF 16V
S104 1-771-955-21 SWITCH, PUSH (1 KEY)(PLAY) C242 1-126-204-11 ELECT CHIP 47uF 20% 16V
S105 1-771-955-21 SWITCH, PUSH (1 KEY)(REC) C243 1-164-360-11 CERAMIC CHIP 0.1uF 16V
C244 1-164-360-11 CERAMIC CHIP 0.1uF 16V
< VIBRATOR >
C245 1-126-204-11 ELECT CHIP 47uF 20% 16V
X171 1-781-569-21 OSCILLATOR, CRYSTAL (90MHz) C247 1-164-227-11 CERAMIC CHIP 0.022uF 10% 25V
∗∗∗∗∗∗∗∗∗∗∗∗∗∗∗∗∗∗∗∗∗∗∗∗∗∗∗∗∗∗∗∗∗∗∗∗∗∗∗∗∗∗∗∗∗∗∗∗∗∗∗∗∗∗∗∗∗∗∗∗ C248 1-164-227-11 CERAMIC CHIP 0.022uF 10% 25V
C249 1-164-360-11 CERAMIC CHIP 0.1uF 16V
A-4476-973-A CD BOARD, COMPLETE
∗∗∗∗∗∗∗∗∗∗∗∗∗∗∗∗∗∗∗ < CONNECTOR >

< CAPACITOR > CN101 1-784-873-21 CONNECTOR, FFC (LIF (NON-ZIF)) 22P
CN102 1-794-424-11 CONNECTOR, FCC/FPC 16P
C101 1-164-315-11 CERAMIC CHIP 470PF 5.00% 50V
C102 1-107-826-11 CERAMIC CHIP 0.1uF 10.00% 16V < DIODE >
C103 1-164-315-11 CERAMIC CHIP 470PF 5.00% 50V
C104 1-162-967-11 CERAMIC CHIP 0.0033uF 10% 50V D101 8-719-056-77 DIODE UDZ-TE-17-3.9B
C107 1-162-921-11 CERAMIC CHIP 33PF 5% 50V
< FERRITE BEAD >
C108 1-164-360-11 CERAMIC CHIP 0.1uF 16V
C109 1-164-360-11 CERAMIC CHIP 0.1uF 16V FB101 1-500-445-21 FERRITE 0uH
C110 1-107-826-11 CERAMIC CHIP 0.1uF 10.00% 16V
C111 1-126-204-11 ELECT CHIP 47uF 20% 16V < IC >
C112 1-126-204-11 ELECT CHIP 47uF 20% 16V
IC101 8-752-408-73 IC CXD3068Q
C113 1-126-206-11 ELECT CHIP 100uF 20% 6.3V IC103 8-752-089-73 IC CXA2581N
C114 1-162-964-11 CERAMIC CHIP 0.001uF 10% 50V IC702 8-759-640-22 IC BA5982FM
C115 1-126-204-11 ELECT CHIP 47uF 20% 16V
C117 1-164-360-11 CERAMIC CHIP 0.1uF 16V < COIL >
C118 1-115-156-11 CERAMIC CHIP 1uF 10V
L107 1-500-445-21 FERRITE 0uH
C119 1-115-156-11 CERAMIC CHIP 1uF 10V
C120 1-126-204-11 ELECT CHIP 47uF 20% 16V < TRANSISTOR >
C151 1-107-826-11 CERAMIC CHIP 0.1uF 10.00% 16V
C162 1-164-360-11 CERAMIC CHIP 0.1uF 16V Q101 8-729-049-31 TRANSISTOR 2SB710A-RTX
C201 1-126-204-11 ELECT CHIP 47uF 20% 16V Q102 8-759-068-54 TRANSISTOR KRA102S
Q103 8-729-920-85 TRANSISTOR 2SD1664-T100-QR
C202 1-164-360-11 CERAMIC CHIP 0.1uF 16V
C203 1-162-915-11 CERAMIC CHIP 10PF 0.5PF 50V < RESISTOR >
C204 1-162-915-11 CERAMIC CHIP 10PF 0.5PF 50V
C205 1-164-360-11 CERAMIC CHIP 0.1uF 16V R102 1-216-835-11 METAL CHIP 15K 5% 1/16W
C209 1-162-927-11 CERAMIC CHIP 100PF 5% 50V R103 1-216-845-11 METAL CHIP 100K 5% 1/16W
R104 1-216-835-11 METAL CHIP 15K 5% 1/16W
C211 1-107-826-11 CERAMIC CHIP 0.1uF 10.00% 16V R105 1-216-821-11 METAL CHIP 1K 5% 1/16W
C212 1-162-965-11 CERAMIC CHIP 0.0015uF 10% 50V R109 1-216-846-11 METAL CHIP 120K 5% 1/16W
C213 1-162-967-11 CERAMIC CHIP 0.0033uF 10% 50V
C215 1-117-863-11 CERAMIC CHIP 0.47uF 10.00% 6.3V R111 1-216-846-11 METAL CHIP 120K 5% 1/16W
C216 1-162-970-11 CERAMIC CHIP 0.01uF 10% 25V R113 1-216-826-11 METAL CHIP 2.7K 5% 1/16W
R114 1-218-745-11 RES-CHIP 160K 5% 1/16W
C217 1-126-206-11 ELECT CHIP 100uF 20% 6.3V R115 1-216-839-11 METAL CHIP 33K 5% 1/16W
C221 1-164-360-11 CERAMIC CHIP 0.1uF 16V R118 1-216-833-11 METAL CHIP 10K 5% 1/16W
C222 1-164-360-11 CERAMIC CHIP 0.1uF 16V
C224 1-164-360-11 CERAMIC CHIP 0.1uF 16V R120 1-216-846-11 METAL CHIP 120K 5% 1/16W
C227 1-164-360-11 CERAMIC CHIP 0.1uF 16V R122 1-216-845-11 METAL CHIP 100K 5% 1/16W
R123 1-216-797-11 METAL CHIP 10 5% 1/16W
C228 1-115-156-11 CERAMIC CHIP 1uF 10V R124 1-216-798-11 RES-CHIP 12 5% 1/16W
C229 1-164-360-11 CERAMIC CHIP 0.1uF 16V R125 1-216-839-11 METAL CHIP 33K 5% 1/16W
C230 1-126-206-11 ELECT CHIP 100uF 20% 6.3V
C231 1-126-206-11 ELECT CHIP 100uF 20% 6.3V R126 1-216-839-11 METAL CHIP 33K 5% 1/16W
C234 1-162-968-11 CERAMIC CHIP 0.0047uF 10% 50V R151 1-216-845-11 METAL CHIP 100K 5% 1/16W
R152 1-216-833-11 METAL CHIP 10K 5% 1/16W
C235 1-162-968-11 CERAMIC CHIP 0.0047uF 10% 50V R201 1-216-839-11 METAL CHIP 33K 5% 1/16W
C236 1-117-863-11 CERAMIC CHIP 0.47uF 10.00% 6.3V R202 1-216-833-11 METAL CHIP 10K 5% 1/16W
C237 1-115-412-11 CERAMIC CHIP 680PF 5.00% 25V
C238 1-115-412-11 CERAMIC CHIP 680PF 5.00% 25V R203 1-216-845-11 METAL CHIP 100K 5% 1/16W

80
 HCD-CP500MD
Ver. 1.3
CD CONTROL

Ref. No. Part No. Description Remarks Ref. No. Part No. Description Remarks
R204 1-216-827-11 METAL CHIP 3.3K 5% 1/16W C843 1-162-970-11 CERAMIC CHIP 0.01uF 10% 25V
R205 1-216-821-11 METAL CHIP 1K 5% 1/16W C844 1-162-970-11 CERAMIC CHIP 0.01uF 10% 25V
R206 1-216-833-11 METAL CHIP 10K 5% 1/16W
R207 1-216-857-11 METAL CHIP 1M 5% 1/16W < CONNECTOR >

R212 1-216-813-11 METAL CHIP 220 5% 1/16W CN801 1-794-470-11 CONNECTOR, FFC/FPC 25P
R213 1-216-864-11 METAL CHIP 0 5% 1/16W
R214 1-216-864-11 METAL CHIP 0 5% 1/16W < DIODE >
R215 1-216-864-11 METAL CHIP 0 5% 1/16W
R216 1-216-813-11 METAL CHIP 220 5% 1/16W D801 8-719-085-55 DIODE SY3318-V-L (BACK LIGHT)
D802 8-719-085-55 DIODE SY3318-V-L (BACK LIGHT)
R217 1-216-829-11 METAL CHIP 4.7K 5% 1/16W D803 8-719-085-55 DIODE SY3318-V-L (BACK LIGHT)
R218 1-216-821-11 METAL CHIP 1K 5% 1/16W D804 8-719-085-55 DIODE SY3318-V-L (BACK LIGHT)
R219 1-216-821-11 METAL CHIP 1K 5% 1/16W D810 8-719-084-70 DIODE SY3318-V-S1-T (BACK LIGHT)
R221 1-216-813-11 METAL CHIP 220 5% 1/16W
R226 1-216-809-11 METAL CHIP 100 5% 1/16W D821 8-719-074-42 DIODE SLR325VR-T31 (STAND BY)
D822 8-719-084-70 DIODE SY3318-V-S1-T (BACK LIGHT)
R227 1-216-845-11 METAL CHIP 100K 5% 1/16W D823 8-719-084-70 DIODE SY3318-V-S1-T (BACK LIGHT)
R228 1-216-853-11 METAL CHIP 470K 5% 1/16W D824 8-719-084-70 DIODE SY3318-V-S1-T (BACK LIGHT)
R229 1-216-825-11 METAL CHIP 2.2K 5% 1/16W D825 8-719-084-70 DIODE SY3318-V-S1-T (BACK LIGHT)
R230 1-216-789-11 METAL CHIP 2.2 5% 1/16W
R240 1-216-837-11 METAL CHIP 22K 5% 1/16W D826 8-719-084-70 DIODE SY3318-V-S1-T (BACK LIGHT)
D827 8-719-084-70 DIODE SY3318-V-S1-T (BACK LIGHT)
R241 1-216-837-11 METAL CHIP 22K 5% 1/16W D828 8-719-084-70 DIODE SY3318-V-S1-T (BACK LIGHT)
R242 1-216-837-11 METAL CHIP 22K 5% 1/16W
R243 1-216-837-11 METAL CHIP 22K 5% 1/16W < IC >
R244 1-218-344-11 RES-CHIP 7.5K 5% 1/16W
R245 1-218-344-11 RES-CHIP 7.5K 5% 1/16W IC801 8-759-827-68 IC NJL62H400A-1

R246 1-218-344-11 RES-CHIP 7.5K 5% 1/16W < CONDUCTOR >

R247 1-218-344-11 RES-CHIP 7.5K 5% 1/16W
R248 1-218-332-11 RES-CHIP 130K 5% 1/16W JR803 1-216-864-11 METAL CHIP 0 5% 1/16W
R249 1-216-845-11 METAL CHIP 100K 5% 1/16W JR804 1-216-864-11 METAL CHIP 0 5% 1/16W
R250 1-218-344-11 RES-CHIP 7.5K 5% 1/16W JR805 1-216-864-11 METAL CHIP 0 5% 1/16W
JR806 1-216-864-11 METAL CHIP 0 5% 1/16W
R251 1-216-847-11 METAL CHIP 150K 5% 1/16W JR807 1-216-864-11 METAL CHIP 0 5% 1/16W
R252 1-218-344-11 RES-CHIP 7.5K 5% 1/16W
R253 1-216-837-11 METAL CHIP 22K 5% 1/16W JR810 1-216-864-11 METAL CHIP 0 5% 1/16W
R254 1-216-837-11 METAL CHIP 22K 5% 1/16W
< LIQUID CRYSTAL DISPLAY >
< NETWORK >
LCD801 1-804-393-11 DISPLAY PANEL, LIQUID CRYSTAL
RN201 1-233-576-11 RES, CHIP NETWORK 100
RN202 1-233-576-11 RES, CHIP NETWORK 100 < TRANSISTOR >

< VARIABLE RESISTOR > Q801 8-729-900-53 TRANSISTOR DTC114EKA-T146

Q803 8-729-900-53 TRANSISTOR DTC114EKA-T146
RV101 1-223-227-21 RES, CARBON ADJ VAR 47K Q804 8-729-900-53 TRANSISTOR DTC114EKA-T146
Q805 8-729-900-53 TRANSISTOR DTC114EKA-T146
< SWITCH > Q806 8-729-900-53 TRANSISTOR DTC114EKA-T146

S101 1-771-853-11 SWITCH, DETECTION (LIMIT IN) Q807 8-729-900-53 TRANSISTOR DTC114EKA-T146
∗∗∗∗∗∗∗∗∗∗∗∗∗∗∗∗∗∗∗∗∗∗∗∗∗∗∗∗∗∗∗∗∗∗∗∗∗∗∗∗∗∗∗∗∗∗∗∗∗∗∗∗∗∗∗∗∗∗∗∗ Q808 8-729-900-53 TRANSISTOR DTC114EKA-T146
Q809 8-729-900-53 TRANSISTOR DTC114EKA-T146
A-2056-914-A CONTROL BOARD, COMPLETE
(lucluding CD-PRISM board, HEAD PHONE board, < RESISTOR >
MD-INDICATE board and OPTICAL bpard)
∗∗∗∗∗∗∗∗∗∗∗∗∗∗∗∗∗∗∗∗∗∗∗∗∗ R801 1-216-819-11 METAL CHIP 680 5% 1/16W
R802 1-216-820-11 METAL CHIP 820 5% 1/16W
4-217-319-21 PLATE, LCD LIGHT R803 1-216-822-11 METAL CHIP 1.2K 5% 1/16W
4-234-552-01 HOLDER (LCD) R804 1-216-824-11 METAL CHIP 1.8K 5% 1/16W
4-234-566-01 LCD SHEET R805 1-216-827-11 METAL CHIP 3.3K 5% 1/16W
4-235-892-01 SHEET (LCD.HOLDER)
4-235-893-01 SHEET, LCD (S) R808 1-216-819-11 METAL CHIP 680 5% 1/16W
R809 1-216-820-11 METAL CHIP 820 5% 1/16W
< CAPACITOR > R810 1-216-822-11 METAL CHIP 1.2K 5% 1/16W
R811 1-216-824-11 METAL CHIP 1.8K 5% 1/16W
C841 1-124-259-11 ELECT 4.7uF 20.00% 16V R812 1-216-827-11 METAL CHIP 3.3K 5% 1/16W
C842 1-107-826-11 CERAMIC CHIP 0.1uF 10.00% 16V

81
HCD-CP500MD
CONTROL CD-PRISM HEAD PHONE MD-INDICATE

Ref. No. Part No. Description Remarks Ref. No. Part No. Description Remarks
R813 1-216-831-11 METAL CHIP 6.8K 5% 1/16W S820 1-571-760-11 SWITCH, KEY BOARD (X (TAPE))
R815 1-216-819-11 METAL CHIP 680 5% 1/16W S821 1-571-760-11 SWITCH, KEY BOARD (x (TAPE))
R816 1-216-820-11 METAL CHIP 820 5% 1/16W S822 1-571-760-11 SWITCH, KEY BOARD (Y (TAPE))
R817 1-216-822-11 METAL CHIP 1.2K 5% 1/16W S823 1-571-760-11 SWITCH, KEY BOARD (z (TAPE))
R818 1-216-824-11 METAL CHIP 1.8K 5% 1/16W
S824 1-571-760-11 SWITCH, KEY BOARD (.)
R819 1-216-827-11 METAL CHIP 3.3K 5% 1/16W S825 1-571-760-11 SWITCH, KEY BOARD (?/1)
R820 1-216-831-11 METAL CHIP 6.8K 5% 1/16W
R821 1-216-836-11 METAL CHIP 18K 5% 1/16W
R822 1-216-833-11 METAL CHIP 10K 5% 1/16W CD-PRISM BOARD
R833 1-216-829-11 METAL CHIP 4.7K 5% 1/16W ∗∗∗∗∗∗∗∗∗∗∗∗∗∗∗

R834 1-216-829-11 METAL CHIP 4.7K 5% 1/16W < CONNECTOR >

R835 1-216-829-11 METAL CHIP 4.7K 5% 1/16W
R836 1-216-829-11 METAL CHIP 4.7K 5% 1/16W ∗ CN808 1-506-984-11 PIN, CONNECTOR (PC BOARD) 2P
R841 1-216-809-11 METAL CHIP 100 5% 1/16W
R842 1-216-845-11 METAL CHIP 100K 5% 1/16W < DIODE >

R843 1-216-845-11 METAL CHIP 100K 5% 1/16W D811 8-719-084-70 DIODE SY3318-V-S1-T (BACK LIGHT)
R845 1-216-817-11 METAL CHIP 470 5% 1/16W D812 8-719-084-70 DIODE SY3318-V-S1-T (BACK LIGHT)
R846 1-216-817-11 METAL CHIP 470 5% 1/16W
R847 1-216-819-11 METAL CHIP 680 5% 1/16W
R848 1-216-819-11 METAL CHIP 680 5% 1/16W HEAD PHONE BOARD
∗∗∗∗∗∗∗∗∗∗∗∗∗∗∗∗∗∗
R861 1-216-845-11 METAL CHIP 100K 5% 1/16W
R862 1-216-829-11 METAL CHIP 4.7K 5% 1/16W < CAPACITOR >
R863 1-216-819-11 METAL CHIP 680 5% 1/16W
R864 1-216-817-11 METAL CHIP 470 5% 1/16W C132 1-124-584-00 ELECT 100uF 20% 10V
R865 1-216-817-11 METAL CHIP 470 5% 1/16W C135 1-164-227-11 CERAMIC CHIP 0.022uF 10% 25V
C232 1-124-584-00 ELECT 100uF 20% 10V
R868 1-216-819-11 METAL CHIP 680 5% 1/16W C235 1-164-227-11 CERAMIC CHIP 0.022uF 10% 25V
R869 1-216-819-11 METAL CHIP 680 5% 1/16W
R880 1-216-845-11 METAL CHIP 100K 5% 1/16W < FERRITE BEAD >
R881 1-216-845-11 METAL CHIP 100K 5% 1/16W
R882 1-216-845-11 METAL CHIP 100K 5% 1/16W FB101 1-469-144-21 FERRITE 0uH
FB201 1-469-144-21 FERRITE 0uH
R883 1-216-845-11 METAL CHIP 100K 5% 1/16W FB301 1-469-144-21 FERRITE 0uH
R891 1-216-817-11 METAL CHIP 470 5% 1/16W
R892 1-216-817-11 METAL CHIP 470 5% 1/16W < JACK >
R893 1-216-817-11 METAL CHIP 470 5% 1/16W
R894 1-216-817-11 METAL CHIP 470 5% 1/16W J301 1-794-453-11 JACK (PHONES)

< VARIABLE RESISTOR > < COIL >

RV801 1-476-730-11 ENCODER, ROTARY (VOLUME) L101 1-412-006-31 INDUCTOR 10uH

RV802 1-418-859-11 ENCODER, ROTARY (TREBLE) L201 1-412-006-31 INDUCTOR 10uH
RV803 1-418-859-11 ENCODER, ROTARY (BASS)
< TRANSISTOR >
< SWITCH >
Q132 8-729-920-31 TRANSISTOR DTC343TK-T-146
S801 1-571-760-11 SWITCH, KEY BOARD (z (MD)) Q232 8-729-920-31 TRANSISTOR DTC343TK-T-146
S802 1-571-760-11 SWITCH, KEY BOARD (u (MD))
S803 1-571-760-11 SWITCH, KEY BOARD (Z (MD)) < RESISTOR >
S804 1-571-760-11 SWITCH, KEY BOARD (Z (CD))
S805 1-571-760-11 SWITCH, KEY BOARD (u (CD)) R128 1-216-801-11 METAL CHIP 22 5% 1/16W
R139 1-216-829-11 METAL CHIP 4.7K 5% 1/16W
S806 1-571-760-11 SWITCH, KEY BOARD (x (CD)) R228 1-216-801-11 METAL CHIP 22 5% 1/16W
S809 1-571-760-11 SWITCH, KEY BOARD (DSG) R239 1-216-829-11 METAL CHIP 4.7K 5% 1/16W
S810 1-571-760-11 SWITCH, KEY BOARD (ENTER/START)
S811 1-571-760-11 SWITCH, KEY BOARD (SYNCHRO)
S812 1-571-760-11 SWITCH, KEY BOARD (REC MODE) MD-INDICATE BOARD
∗∗∗∗∗∗∗∗∗∗∗∗∗∗∗∗∗∗
S813 1-571-760-11 SWITCH, KEY BOARD (REPEAT)
S814 1-571-760-11 SWITCH, KEY BOARD (PLAY MODE/DIRECTION) < CONNECTOR >
S815 1-571-760-11 SWITCH, KEY BOARD (FUNCTION)
S817 1-571-760-11 SWITCH, KEY BOARD (x (MD)) ∗ CN806 1-506-985-11 PIN, CONNECTOR (PC BOARD) 3P
S818 1-571-760-11 SWITCH, KEY BOARD (BAND)

S819 1-571-760-11 SWITCH, KEY BOARD (>)

82
 HCD-CP500MD
MD-INDICATE OPTICAL DIGITAL

Ref. No. Part No. Description Remarks Ref. No. Part No. Description Remarks
< DIODE > C1006 1-163-038-00 CERAMIC CHIP 0.1uF 25V
C1007 1-126-933-11 ELECT 100uF 20.00% 16V
D813 8-719-084-70 DIODE SY3318-V-S1-T (BACK LIGHT) C1008 1-163-038-00 CERAMIC CHIP 0.1uF 25V
D814 8-719-084-70 DIODE SY3318-V-S1-T (BACK LIGHT) C1009 1-164-156-11 CERAMIC CHIP 0.1uF 25V
C1010 1-126-933-11 ELECT 100uF 20.00% 16V
< TRANSISTOR >
C1011 1-163-038-00 CERAMIC CHIP 0.1uF 25V
Q802 8-729-900-53 TRANSISTOR DTC114EKA-T146 C1012 1-126-933-11 ELECT 100uF 20.00% 16V
C1013 1-126-933-11 ELECT 100uF 20.00% 16V
< RESISTOR > C1014 1-164-156-11 CERAMIC CHIP 0.1uF 25V
C1015 1-126-933-11 ELECT 100uF 20.00% 16V
R885 1-216-817-11 METAL CHIP 470 5% 1/16W
R886 1-216-817-11 METAL CHIP 470 5% 1/16W C1016 1-164-156-11 CERAMIC CHIP 0.1uF 25V
C1017 1-163-038-00 CERAMIC CHIP 0.1uF 25V
C1018 1-163-038-00 CERAMIC CHIP 0.1uF 25V
OPTICAL BOARD C1019 1-163-009-11 CERAMIC CHIP 0.001uF 10.00% 50V
∗∗∗∗∗∗∗∗∗∗∗∗∗∗ C1020 1-163-009-11 CERAMIC CHIP 0.001uF 10.00% 50V

< CAPACITOR > C1021 1-164-156-11 CERAMIC CHIP 0.1uF 25V

C1022 1-126-933-11 ELECT 100uF 20.00% 16V
C550 1-164-156-11 CERAMIC CHIP 0.1uF 25V C1023 1-163-038-00 CERAMIC CHIP 0.1uF 25V
C551 1-104-665-11 ELECT 100uF 20.00% 10V C1024 1-164-156-11 CERAMIC CHIP 0.1uF 25V
C553 1-104-665-11 ELECT 100uF 20.00% 10V C1025 1-164-156-11 CERAMIC CHIP 0.1uF 25V
C554 1-162-970-11 CERAMIC CHIP 0.01uF 10% 25V
C1026 1-126-933-11 ELECT 100uF 20.00% 16V
< CONNECTOR > C1027 1-163-031-11 CERAMIC CHIP 0.01uF 50V
C1034 1-163-031-11 CERAMIC CHIP 0.01uF 50V
∗ CN551 1-506-989-11 PIN, CONNECTOR (PC BOARD) 7P C1035 1-164-156-11 CERAMIC CHIP 0.1uF 25V
C1037 1-163-117-00 CERAMIC CHIP 100PF 5% 50V
< FERRITE BEAD >
C1038 1-163-117-00 CERAMIC CHIP 100PF 5% 50V
FB551 1-469-144-21 FERRITE 0uH C1039 1-162-927-11 CERAMIC CHIP 100PF 5% 50V
C1040 1-162-927-11 CERAMIC CHIP 100PF 5% 50V
< IC > C1041 1-162-927-11 CERAMIC CHIP 100PF 5% 50V
C1042 1-162-917-11 CERAMIC CHIP 15PF 5% 50V
IC551 8-749-019-61 IC JFJ4000-01SY (DIGITAL OPTICAL IN)
C1043 1-162-918-11 CERAMIC CHIP 18PF 5.00% 50V
< CONNECTOR > C1044 1-162-964-11 CERAMIC CHIP 0.001uF 10% 50V
C1045 1-126-933-11 ELECT 100uF 20.00% 16V
J302 1-774-136-11 CONNECTOR, ROUND TYPE 6P (PC LINK) C1046 1-136-153-00 FILM 0.01uF 5% 50V
C1047 1-136-153-00 FILM 0.01uF 5% 50V
< TRANSISTOR >
C1048 1-126-933-11 ELECT 100uF 20.00% 16V
Q301 8-729-048-96 TRANSISTOR 2SK1825 C1049 1-162-974-11 CERAMIC CHIP 0.01uF 50V
Q302 8-729-048-96 TRANSISTOR 2SK1825 C1050 1-162-974-11 CERAMIC CHIP 0.01uF 50V
C1051 1-162-974-11 CERAMIC CHIP 0.01uF 50V
< RESISTOR > C1052 1-162-964-11 CERAMIC CHIP 0.001uF 10% 50V

R304 1-216-797-11 METAL CHIP 10 5% 1/16W C1118 1-126-935-11 ELECT 470uF 20.00% 16V
R305 1-216-797-11 METAL CHIP 10 5% 1/16W C2003 1-162-964-11 CERAMIC CHIP 0.001uF 10% 50V
R306 1-216-845-11 METAL CHIP 100K 5% 1/16W C2004 1-162-964-11 CERAMIC CHIP 0.001uF 10% 50V
R310 1-216-835-11 METAL CHIP 15K 5% 1/16W C2005 1-162-964-11 CERAMIC CHIP 0.001uF 10% 50V
R312 1-216-833-11 METAL CHIP 10K 5% 1/16W
< CONNECTOR >
R336 1-216-864-11 METAL CHIP 0 5% 1/16W
R337 1-216-864-11 METAL CHIP 0 5% 1/16W CN1001 1-794-470-11 CONNECTOR, FFC/FPC 25P
∗∗∗∗∗∗∗∗∗∗∗∗∗∗∗∗∗∗∗∗∗∗∗∗∗∗∗∗∗∗∗∗∗∗∗∗∗∗∗∗∗∗∗∗∗∗∗∗∗∗∗∗∗∗∗∗∗∗∗∗ CN1003 1-779-295-11 CONNECTOR, FFC (LIF (NON-ZIF)) 27P
CN1004 1-779-285-11 CONNECTOR, FFC (LIF (NON-ZIF)) 17P
A-4725-834-A DIGITAL BOARD, COMPLETE
∗∗∗∗∗∗∗∗∗∗∗∗∗∗∗∗∗∗∗∗∗∗∗ < IC >

< CAPACITOR > IC1001 8-759-828-80 IC M30805MG-205GP

IC1004 8-759-988-58 IC BA6209N
C1001 1-126-934-11 ELECT 220uF 20.00% 10V IC1005 8-759-675-78 IC UDA1360TS/N1.118
C1002 1-163-038-00 CERAMIC CHIP 0.1uF 25V IC1006 8-759-675-77 IC UDA1350AH
C1003 1-126-933-11 ELECT 100uF 20.00% 16V
C1004 1-163-038-00 CERAMIC CHIP 0.1uF 25V < COIL >
C1005 1-126-933-11 ELECT 100uF 20.00% 16V
L1001 1-412-533-21 INDUCTOR 47uH

83
HCD-CP500MD
Ver. 1.3
DIGITAL MAIN

Ref. No. Part No. Description Remarks Ref. No. Part No. Description Remarks
< TRANSISTOR > < VIBRATOR >

Q1001 1-801-806-11 TRANSISTOR DTC144EK-T146 X1001 1-579-175-11 VIBRATOR, CERAMIC (10MHz)

Q1002 8-729-602-36 TRANSISTOR 2SA1602TP-1EF ∗∗∗∗∗∗∗∗∗∗∗∗∗∗∗∗∗∗∗∗∗∗∗∗∗∗∗∗∗∗∗∗∗∗∗∗∗∗∗∗∗∗∗∗∗∗∗∗∗∗∗∗∗∗∗∗∗∗∗∗
Q1003 8-729-602-36 TRANSISTOR 2SA1602TP-1EF
Q1004 8-729-403-35 TRANSISTOR UN5113-TX 1-676-599-11 LOADING BOARD
Q2001 8-729-602-36 TRANSISTOR 2SA1602TP-1EF ∗∗∗∗∗∗∗∗∗∗∗∗∗∗∗

Q2002 8-729-038-67 TRANSISTOR KRC102S < CONNECTOR >

< RESISTOR > ∗ CN1 1-568-943-11 PIN, CONNECTOR 5P

R1001 1-216-066-00 METAL CHIP 5.1K 5% 1/10W < SWITCH >

R1002 1-216-066-00 METAL CHIP 5.1K 5% 1/10W
R1005 1-216-025-11 RES-CHIP 100 5% 1/10W S1 1-771-799-11 SWITCH, LEVER (SLIDE)(DISC TRAY OPEN DET)
R1006 1-216-025-11 RES-CHIP 100 5% 1/10W ∗∗∗∗∗∗∗∗∗∗∗∗∗∗∗∗∗∗∗∗∗∗∗∗∗∗∗∗∗∗∗∗∗∗∗∗∗∗∗∗∗∗∗∗∗∗∗∗∗∗∗∗∗∗∗∗∗∗∗∗
R1007 1-216-025-11 RES-CHIP 100 5% 1/10W
A-4725-837-A MAIN BOARD, COMPLETE (AEP, UK)
R1010 1-216-025-11 RES-CHIP 100 5% 1/10W A-4725-849-A MAIN BOARD, COMPLETE (AUS)
R1011 1-216-833-11 METAL CHIP 10K 5% 1/16W A-4726-237-A MAIN BOARD, COMPLETE (CH)
R1012 1-216-833-11 METAL CHIP 10K 5% 1/16W A-4727-454-A MAIN BOARD, COMPLETE (HK)
R1013 1-216-833-11 METAL CHIP 10K 5% 1/16W A-4727-455-A MAIN BOARD, COMPLETE (E51)
R1014 1-216-833-11 METAL CHIP 10K 5% 1/16W ∗∗∗∗∗∗∗∗∗∗∗∗∗∗∗∗∗∗∗∗∗

R1015 1-216-833-11 METAL CHIP 10K 5% 1/16W 4-217-354-11 BUSHING, INSULATING

R1016 1-216-833-11 METAL CHIP 10K 5% 1/16W 7-685-546-14 SCREW +BTP 3X8 TYPE2 N-S
R1017 1-216-833-11 METAL CHIP 10K 5% 1/16W 7-685-647-79 SCREW +BVTP 3X10 TYPE2 N-S
R1018 1-216-833-11 METAL CHIP 10K 5% 1/16W 112 A-4303-624-A TUNER UNIT (AEP, UK, AUS, CH)
R1024 1-216-041-00 METAL CHIP 470 5% 1/10W 112 A-4303-626-A TUNER UNIT (E51, HK)

R1029 1-216-821-11 METAL CHIP 1K 5% 1/16W < CAPACITOR >

R1030 1-216-827-11 METAL CHIP 3.3K 5% 1/16W
R1033 1-216-824-11 METAL CHIP 1.8K 5% 1/16W C101 1-126-964-11 ELECT 10uF 20.00% 50V
R1034 1-216-825-11 METAL CHIP 2.2K 5% 1/16W (EXCEPT AEP, UK, E51, HK)
R1035 1-216-073-00 RES-CHIP 10K 5% 1/10W C101 1-126-963-11 ELECT 4.7uF 20.00% 50V
(AEP, UK, E51, HK)
R1036 1-216-295-00 SHORT 0 C102 1-126-964-11 ELECT 10uF 20.00% 50V
R1057 1-216-829-11 METAL CHIP 4.7K 5% 1/16W (EXCEPT AEP, UK, E51, HK)
R1058 1-216-025-11 RES-CHIP 100 5% 1/10W C102 1-126-963-11 ELECT 4.7uF 20.00% 50V
R1059 1-216-025-11 RES-CHIP 100 5% 1/10W (AEP, UK, E51, HK)
R1060 1-216-025-11 RES-CHIP 100 5% 1/10W C103 1-126-964-11 ELECT 10uF 20.00% 50V
(EXCEPT AEP, UK, E51, HK)
R1067 1-216-833-11 METAL CHIP 10K 5% 1/16W
R1068 1-216-833-11 METAL CHIP 10K 5% 1/16W C103 1-126-963-11 ELECT 4.7uF 20.00% 50V
R1073 1-216-073-00 RES-CHIP 10K 5% 1/10W (AEP, UK, E51, HK)
R1075 1-216-025-11 RES-CHIP 100 5% 1/10W C104 1-126-964-11 ELECT 10uF 20.00% 50V
R1076 1-216-833-11 METAL CHIP 10K 5% 1/16W (EXCEPT AEP, UK, E51, HK)
C104 1-126-963-11 ELECT 4.7uF 20.00% 50V
R1077 1-216-295-00 SHORT 0 (AEP, UK, E51, HK)
R1078 1-216-864-11 METAL CHIP 0 5% 1/16W C105 1-126-964-11 ELECT 10uF 20.00% 50V
R1080 1-216-864-11 METAL CHIP 0 5% 1/16W (EXCEPT AEP, UK, E51, HK)
R1081 1-216-833-11 METAL CHIP 10K 5% 1/16W C105 1-126-963-11 ELECT 4.7uF 20.00% 50V
R1082 1-216-833-11 METAL CHIP 10K 5% 1/16W (AEP, UK, E51, HK)

R1085 1-216-833-11 METAL CHIP 10K 5% 1/16W C106 1-126-964-11 ELECT 10uF 20.00% 50V
R1087 1-216-057-00 METAL CHIP 2.2K 5% 1/10W (EXCEPT AEP, UK, E51, HK)
R1088 1-216-069-00 METAL CHIP 6.8K 5% 1/10W C106 1-104-664-11 ELECT 47uF 20.00% 16V
R1090 1-216-817-11 METAL CHIP 470 5% 1/16W (AEP, UK)
R1091 1-216-813-11 METAL CHIP 220 5% 1/16W C106 1-126-963-11 ELECT 4.7uF 20.00% 50V
(E51, HK)
R1092 1-216-813-11 METAL CHIP 220 5% 1/16W C107 1-126-964-11 ELECT 10uF 20.00% 50V
R1093 1-216-033-00 METAL CHIP 220 5% 1/10W (EXCEPT AEP, UK, E51, HK)
R1094 1-216-813-11 METAL CHIP 220 5% 1/16W C107 1-109-982-11 CERAMIC CHIP 1uF 10.00% 10V
R1095 1-216-039-00 METAL CHIP 390 5% 1/10W (AEP, UK)
R2002 1-216-296-11 SHORT 0
C107 1-115-467-11 CERAMIC CHIP 0.22uF 10.00% 10V
R2005 1-216-864-11 METAL CHIP 0 5% 1/16W (E51, HK)
R2006 1-216-809-11 METAL CHIP 100 5% 1/16W C108 1-115-467-11 CERAMIC CHIP 0.22uF 10.00% 10V
R2007 1-216-845-11 METAL CHIP 100K 5% 1/16W C109 1-162-927-11 CERAMIC CHIP 100PF 5% 50V
R2008 1-216-809-11 METAL CHIP 100 5% 1/16W

84
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Ref. No. Part No. Description Remarks Ref. No. Part No. Description Remarks
C110 1-126-964-11 ELECT 10uF 20.00% 50V C206 1-104-664-11 ELECT 47uF 20.00% 16V
(EXCEPT AEP, UK, E51, HK) (AEP, UK)
C110 1-126-963-11 ELECT 4.7uF 20.00% 50V C206 1-126-963-11 ELECT 4.7uF 20.00% 50V
(AEP, UK, E51, HK) (E51, HK)
C207 1-126-964-11 ELECT 10uF 20.00% 50V
C111 1-164-245-11 CERAMIC CHIP 0.015uF 10.00% 25V (EXCEPT AEP, UK, E51, HK)
C112 1-164-245-11 CERAMIC CHIP 0.015uF 10.00% 25V C207 1-109-982-11 CERAMIC CHIP 1uF 10.00% 10V
C113 1-107-826-11 CERAMIC CHIP 0.1uF 10.00% 16V (AEP, UK)
(EXCEPT AEP, UK, E51, HK) C207 1-115-467-11 CERAMIC CHIP 0.22uF 10.00% 10V
C113 1-115-467-11 CERAMIC CHIP 0.22uF 10.00% 10V (E51, HK)
(AEP, UK, E51, HK)
C114 1-162-927-11 CERAMIC CHIP 100PF 5% 50V C208 1-115-467-11 CERAMIC CHIP 0.22uF 10.00% 10V
C209 1-162-927-11 CERAMIC CHIP 100PF 5% 50V
C115 1-162-968-11 CERAMIC CHIP 0.0047uF 10% 50V C210 1-126-964-11 ELECT 10uF 20.00% 50V
(EXCEPT AEP, UK, E51, HK) (EXCEPT AEP, UK, E51, HK)
C115 1-162-965-11 CERAMIC CHIP 0.0015uF 10% 50V C210 1-126-963-11 ELECT 4.7uF 20.00% 50V
(AEP, UK, E51, HK) (AEP, UK, E51, HK)
C116 1-162-962-11 CERAMIC CHIP 470PF 10% 50V C211 1-164-245-11 CERAMIC CHIP 0.015uF 10.00% 25V
C117 1-162-927-11 CERAMIC CHIP 100PF 5% 50V
C118 1-107-826-11 CERAMIC CHIP 0.1uF 10.00% 16V C212 1-164-245-11 CERAMIC CHIP 0.015uF 10.00% 25V
(EXCEPT AEP, UK, E51, HK) C213 1-162-962-11 CERAMIC CHIP 470PF 10% 50V
C214 1-162-927-11 CERAMIC CHIP 100PF 5% 50V
C118 1-115-467-11 CERAMIC CHIP 0.22uF 10.00% 10V C215 1-162-968-11 CERAMIC CHIP 0.0047uF 10% 50V
(AEP, UK, E51, HK) (EXCEPT AEP, UK, E51, HK)
C120 1-163-022-00 CERAMIC CHIP 0.012uF 10% 50V C215 1-162-965-11 CERAMIC CHIP 0.0015uF 10% 50V
(EXCEPT AEP, UK, E51, HK) (AEP, UK, E51, HK)
C120 1-164-245-11 CERAMIC CHIP 0.015uF 10.00% 25V
(AEP, UK, E51, HK) C216 1-107-826-11 CERAMIC CHIP 0.1uF 10.00% 16V
C121 1-162-962-11 CERAMIC CHIP 470PF 10% 50V (EXCEPT AEP, UK, E51, HK)
C123 1-126-964-11 ELECT 10uF 20.00% 50V C216 1-115-467-11 CERAMIC CHIP 0.22uF 10.00% 10V
(AEP, UK, E51, HK)
C124 1-162-970-11 CERAMIC CHIP 0.01uF 10% 25V C217 1-162-927-11 CERAMIC CHIP 100PF 5% 50V
(EXCEPT AEP, UK, E51, HK) C218 1-107-826-11 CERAMIC CHIP 0.1uF 10.00% 16V
C124 1-162-962-11 CERAMIC CHIP 470PF 10% 50V (EXCEPT AEP, UK, E51, HK)
(AEP, UK, E51, HK) C218 1-115-467-11 CERAMIC CHIP 0.22uF 10.00% 10V
C125 1-126-965-11 ELECT 22uF 20.00% 50V (AEP, UK, E51, HK)
C127 1-130-495-00 MYLAR 0.1uF 5% 50V
C128 1-130-495-00 MYLAR 0.1uF 5% 50V C220 1-163-022-00 CERAMIC CHIP 0.012uF 10% 50V
(EXCEPT AEP, UK, E51, HK)
C130 1-115-467-11 CERAMIC CHIP 0.22uF 10.00% 10V C220 1-164-245-11 CERAMIC CHIP 0.015uF 10.00% 25V
C133 1-115-467-11 CERAMIC CHIP 0.22uF 10.00% 10V (AEP, UK, E51, HK)
C140 1-162-962-11 CERAMIC CHIP 470PF 10% 50V C221 1-162-962-11 CERAMIC CHIP 470PF 10% 50V
C150 1-104-664-11 ELECT 47uF 20.00% 16V C223 1-126-964-11 ELECT 10uF 20.00% 50V
C201 1-126-964-11 ELECT 10uF 20.00% 50V C224 1-162-970-11 CERAMIC CHIP 0.01uF 10% 25V
(EXCEPT AEP, UK, E51, HK) (EXCEPT AEP, UK, E51, HK)

C201 1-126-963-11 ELECT 4.7uF 20.00% 50V C224 1-162-962-11 CERAMIC CHIP 470PF 10% 50V
(AEP, UK, E51, HK) (AEP, UK, E51, HK)
C202 1-126-964-11 ELECT 10uF 20.00% 50V C225 1-126-965-11 ELECT 22uF 20.00% 50V
(EXCEPT AEP, UK, E51, HK) C227 1-130-495-00 MYLAR 0.1uF 5% 50V
C202 1-126-963-11 ELECT 4.7uF 20.00% 50V C228 1-130-495-00 MYLAR 0.1uF 5% 50V
(AEP, UK, E51, HK) C230 1-115-467-11 CERAMIC CHIP 0.22uF 10.00% 10V
C203 1-126-964-11 ELECT 10uF 20.00% 50V
(EXCEPT AEP, UK, E51, HK) C233 1-115-467-11 CERAMIC CHIP 0.22uF 10.00% 10V
C203 1-126-963-11 ELECT 4.7uF 20.00% 50V C240 1-162-962-11 CERAMIC CHIP 470PF 10% 50V
(AEP, UK, E51, HK) C250 1-104-664-11 ELECT 47uF 20.00% 16V
C300 1-126-961-11 ELECT 2.2uF 20.00% 50V
C204 1-126-964-11 ELECT 10uF 20.00% 50V (EXCEPT AEP, UK)
(EXCEPT AEP, UK, E51, HK) C300 1-126-964-11 ELECT 10uF 20.00% 50V
C204 1-126-963-11 ELECT 4.7uF 20.00% 50V (AEP, UK)
(AEP, UK, E51, HK)
C205 1-126-964-11 ELECT 10uF 20.00% 50V C301 1-104-664-11 ELECT 47uF 20.00% 16V
(EXCEPT AEP, UK, E51, HK) (EXCEPT AEP, UK, E51, HK)
C205 1-126-963-11 ELECT 4.7uF 20.00% 50V C301 1-126-964-11 ELECT 10uF 20.00% 50V
(AEP, UK, E51, HK) (AEP, UK, E51, HK)
C206 1-126-964-11 ELECT 10uF 20.00% 50V C302 1-126-941-11 ELECT 470uF 20.00% 16V
(EXCEPT AEP, UK, E51, HK) C304 1-104-665-11 ELECT 100uF 20.00% 16V
C305 1-104-665-11 ELECT 100uF 20.00% 16V
(EXCEPT AEP, UK)

85
HCD-CP500MD
MAIN

Ref. No. Part No. Description Remarks Ref. No. Part No. Description Remarks
C305 1-104-664-11 ELECT 47uF 20.00% 16V C350 1-124-903-11 ELECT 1uF 20.00% 50V
(AEP, UK) C351 1-107-826-11 CERAMIC CHIP 0.1uF 10.00% 16V
C306 1-126-964-11 ELECT 10uF 20.00% 50V C352 1-107-826-11 CERAMIC CHIP 0.1uF 10.00% 16V
(EXCEPT AEP, UK, E51, HK)
C306 1-126-963-11 ELECT 4.7uF 20.00% 50V C353 1-104-664-11 ELECT 47uF 20.00% 16V
(AEP, UK, E51, HK) C354 1-107-826-11 CERAMIC CHIP 0.1uF 10.00% 16V
C307 1-104-665-11 ELECT 100uF 20.00% 16V C355 1-126-961-11 ELECT 2.2uF 20.00% 50V
(EXCEPT AEP, UK, E51, HK) (AEP, UK)
C307 1-126-935-11 ELECT 470uF 20.00% 10V C356 1-126-964-11 ELECT 10uF 20.00% 50V
(AEP, UK, E51, HK) (AEP, UK)
C357 1-107-826-11 CERAMIC CHIP 0.1uF 10.00% 16V
C308 1-126-961-11 ELECT 2.2uF 20.00% 50V
C310 1-104-665-11 ELECT 100uF 20.00% 16V C358 1-164-739-11 CERAMIC CHIP 560PF 5.00% 50V
C311 1-124-903-11 ELECT 1uF 20.00% 50V (AEP, UK)
(EXCEPT E51, HK) C360 1-162-970-11 CERAMIC CHIP 0.01uF 10% 25V
C311 1-104-665-11 ELECT 100uF 20.00% 16V (AEP, UK)
(E51, HK) C361 1-162-921-11 CERAMIC CHIP 33PF 5% 50V
C312 1-104-665-11 ELECT 100uF 20.00% 16V (AEP, UK)
C361 1-164-185-11 CERAMIC CHIP 13PF 5.00% 50V
C313 1-126-965-11 ELECT 22uF 20.00% 50V (AEP, UK)
C314 1-107-826-11 CERAMIC CHIP 0.1uF 10.00% 16V C362 1-162-921-11 CERAMIC CHIP 33PF 5% 50V
C316 1-126-955-11 ELECT 4700uF 20.00% 35V (AEP, UK)
C317 1-126-955-11 ELECT 4700uF 20.00% 35V
C318 1-107-826-11 CERAMIC CHIP 0.1uF 10.00% 16V C362 1-164-185-11 CERAMIC CHIP 13PF 5.00% 50V
(AEP, UK)
C319 1-107-826-11 CERAMIC CHIP 0.1uF 10.00% 16V C363 1-104-665-11 ELECT 100uF 20.00% 16V
C320 1-126-942-61 ELECT 1000uF 20.00% 25V C364 1-162-961-11 CERAMIC CHIP 330PF 10% 50V
C321 1-126-944-11 ELECT 3300uF 20.00% 25V (AEP, UK)
C322 1-107-826-11 CERAMIC CHIP 0.1uF 10.00% 16V C365 1-162-970-11 CERAMIC CHIP 0.01uF 10% 25V
C323 1-104-665-11 ELECT 100uF 20.00% 16V (AEP, UK)
C366 1-104-664-11 ELECT 47uF 20.00% 10V
C324 1-104-665-11 ELECT 100uF 20.00% 16V (AEP, UK)
C325 1-107-826-11 CERAMIC CHIP 0.1uF 10.00% 16V
C326 1-104-665-11 ELECT 100uF 20.00% 16V C367 1-107-826-11 CERAMIC CHIP 0.1uF 10.00% 16V
C327 1-126-964-11 ELECT 10uF 20.00% 50V (AEP, UK)
C328 1-126-941-11 ELECT 470uF 20.00% 16V C368 1-115-456-21 CAPACITOR 0.22F 5.5V
C369 1-115-456-21 CAPACITOR 0.22F 5.5V
C329 1-107-826-11 CERAMIC CHIP 0.1uF 10.00% 16V C373 1-104-665-11 ELECT 100uF 20.00% 25V
C330 1-107-826-11 CERAMIC CHIP 0.1uF 10.00% 16V C374 1-104-666-11 ELECT 220uF 20.00% 10V
C331 1-126-767-11 ELECT 1000uF 20.00% 10V
C332 1-107-826-11 CERAMIC CHIP 0.1uF 10.00% 16V C377 1-162-970-11 CERAMIC CHIP 0.01uF 10% 25V
C333 1-104-666-11 ELECT 220uF 20.00% 10V C378 1-164-315-11 CERAMIC CHIP 470PF 5.00% 50V
(EXCEPT AEP, UK) C379 1-162-964-11 CERAMIC CHIP 0.001uF 10% 50V
(AEP, UK)
C333 1-104-665-11 ELECT 100uF 20.00% 16V C379 1-164-315-11 CERAMIC CHIP 470PF 5.00% 50V
(AEP, UK) (EXCEPT AEP, UK)
C335 1-107-826-11 CERAMIC CHIP 0.1uF 10.00% 16V C380 1-162-970-11 CERAMIC CHIP 0.01uF 10% 25V
C336 1-104-665-11 ELECT 100uF 20.00% 16V (EXCEPT AEP, UK)
C337 1-126-964-11 ELECT 10uF 20.00% 50V
C338 1-126-935-11 ELECT 470uF 20.00% 10V C380 1-216-864-11 METAL CHIP 0 5% 1/16W
(AEP, UK)
C339 1-107-826-11 CERAMIC CHIP 0.1uF 10.00% 16V C381 1-162-970-11 CERAMIC CHIP 0.01uF 10% 25V
C340 1-162-967-11 CERAMIC CHIP 0.0033uF 10% 50V C383 1-162-302-11 CERAMIC 0.0022uF 30.00% 16V
C341 1-104-665-11 ELECT 100uF 20.00% 16V C390 1-162-970-11 CERAMIC CHIP 0.01uF 10% 25V
C342 1-124-903-11 ELECT 1uF 20.00% 50V C392 1-107-826-11 CERAMIC CHIP 0.1uF 10.00% 16V
C343 1-107-826-11 CERAMIC CHIP 0.1uF 10.00% 16V (EXCEPT AEP, UK, E51, HK)
(EXCEPT AEP, UK)
C392 1-162-970-11 CERAMIC CHIP 0.01uF 10% 25V
C343 1-162-964-11 CERAMIC CHIP 0.001uF 10% 50V (AEP, UK, E51, HK)
(AEP, UK) C393 1-165-176-11 CERAMIC CHIP 0.047uF 10.00% 16V
C344 1-162-970-11 CERAMIC CHIP 0.01uF 10% 25V C394 1-125-891-11 CERAMIC CHIP 0.47uF 10.00% 10V
(EXCEPT AEP, UK) C507 1-164-156-21 CETAMIC CHIP 0.1uF 25V
C344 1-162-966-11 CERAMIC CHIP 0.0022uF 10% 50V C509 1-104-665-11 ELECT 100uF 20.00% 16V
(AEP, UK) C801 1-164-160-11 CERAMIC CHIP 20PF 5.00% 50V
C345 1-126-767-11 ELECT 1000uF 20.00% 10V
C347 1-104-664-11 ELECT 47uF 20.00% 16V C802 1-162-919-11 CERAMIC CHIP 22PF 5% 50V
C803 1-107-826-11 CERAMIC CHIP 0.1uF 10.00% 16V
C348 1-107-826-11 CERAMIC CHIP 0.1uF 10.00% 16V C804 1-107-826-11 CERAMIC CHIP 0.1uF 10.00% 16V
C349 1-107-826-11 CERAMIC CHIP 0.1uF 10.00% 16V C805 1-104-665-11 ELECT 100uF 20.00% 16V

86
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Ref. No. Part No. Description Remarks Ref. No. Part No. Description Remarks
< CONNECTOR > FB320 1-216-864-11 METAL CHIP 0 5% 1/16W
FB321 1-216-864-11 METAL CHIP 0 5% 1/16W
CN301 1-794-470-11 CONNECTOR, FFC/FPC 25P
CN302 1-779-290-11 CONNECTOR, FFC (LIF (NON-ZIF)) 22P FB322 1-410-993-11 INDUCTOR CHIP 1uH
∗ CN303 1-569-366-11 SOCKET, CONNECTOR 18P FB323 1-216-864-11 METAL CHIP 0 5% 1/16W
∗ CN304 1-565-650-11 SOCKET, CONNECTOR 25P FB324 1-216-864-11 METAL CHIP 0 5% 1/16W
∗ CN306 1-568-954-11 PIN, CONNECTOR 5P FB325 1-216-864-11 METAL CHIP 0 5% 1/16W
FB326 1-216-864-11 METAL CHIP 0 5% 1/16W
∗ CN308 1-568-954-11 PIN, CONNECTOR 5P
FB327 1-216-864-11 METAL CHIP 0 5% 1/16W
< DIODE >
< IC >
D303 8-719-200-82 DIODE 11ES2-TA1B
D304 8-719-050-84 DIODE RB441QT-77 IC101 8-759-584-38 IC TDA7296
D305 8-719-200-82 DIODE 11ES2-TA1B IC201 8-759-584-38 IC TDA7296
D306 8-719-200-82 DIODE 11ES2-TA1B IC301 8-759-000-00 IC MC6800P (CH)
D307 8-719-200-82 DIODE 11ES2-TA1B IC301 6-700-261-01 IC BD3861FS (EXCEPT CH)
IC302 8-759-359-49 IC NJM3414AV (TE2)
D308 8-719-991-33 DIODE 1SS133T-77
D309 8-719-991-33 DIODE 1SS133T-77 IC303 8-759-646-54 IC KIA7808API
D310 8-719-921-75 DIODE MTZN-T-77-10B IC305 8-759-038-14 IC MC74HC4538N (CH)
D311 8-719-921-63 DIODE MTZJ-T-77-7.5B IC305 8-759-686-72 IC uPC29L04J-T (EXCEPT CH)
D312 8-719-109-89 DIODE MTZJ-T-77-5.6B IC306 6-800-349-01 IC M30622MGA-A64FP
IC307 8-759-584-65 IC KA3082
D313 8-719-921-80 DIODE MTZJ-T-77-11B
D314 8-719-200-82 DIODE 11ES2-TA1B IC308 8-759-481-02 IC M62016L
D315 8-719-200-82 DIODE 11ES2-TA1B IC309 8-759-560-51 IC BU1924F (AEP, UK)
D316 8-719-200-82 DIODE 11ES2-TA1B IC310 8-759-646-53 IC KIA7812API
D317 8-719-200-82 DIODE 11ES2-TA1B IC311 8-759-646-54 IC KIA7808API
IC313 8-759-646-54 IC KIA7808API
D318 8-719-200-82 DIODE 11ES2-TA1B
D319 8-719-991-33 DIODE 1SS133T-77 IC314 8-759-646-52 IC KIA7805API
D320 8-719-050-84 DIODE RB441QT-77 IC315 8-759-646-52 IC KIA7805API
D321 8-719-991-33 DIODE 1SS133T-77 IC316 8-759-637-58 IC PST592C-T
D322 8-719-991-33 DIODE 1SS133T-77 IC503 8-759-548-57 IC SN74LV00ANSR

D323 8-719-991-33 DIODE 1SS133T-77 < CONDUCTOR/RESISTOR >

D324 8-719-991-33 DIODE 1SS133T-77
D325 8-719-991-33 DIODE 1SS133T-77 JR101 1-216-864-11 METAL CHIP 0 5% 1/16W
D326 8-719-200-82 DIODE 11ES2-TA1B JR201 1-216-864-11 METAL CHIP 0 5% 1/16W
D330 8-719-921-40 DIODE MTZJ-T-77-4.7C JR301 1-216-864-11 METAL CHIP 0 5% 1/16W
JR302 1-216-864-11 METAL CHIP 0 5% 1/16W
D331 8-719-982-11 DIODE MTZJ-T-77-4.3B (AEP, UK) JR304 1-216-864-11 METAL CHIP 0 5% 1/16W
D332 8-719-991-33 DIODE 1SS133T-77 (AEP, UK)
D336 8-719-921-40 DIODE MTZJ-T-77-4.7C JR305 1-216-864-11 METAL CHIP 0 5% 1/16W
JR310 1-249-401-11 CARBON 47 5% 1/4W
< FERRITE BEAD/CONDUCTOR >
< COIL >
FB301 1-414-813-11 FERRITE 0uH
FB302 1-216-864-11 METAL CHIP 0 5% 1/16W L101 1-420-872-00 COIL, AIR-CORE
FB303 1-216-864-11 METAL CHIP 0 5% 1/16W L201 1-420-872-00 COIL, AIR-CORE
FB304 1-414-813-11 FERRITE 0uH
FB306 1-414-813-11 FERRITE 0uH < JACK >

FB307 1-414-813-11 FERRITE 0uH PJ301 1-815-636-11 JACK, PIN 2P (ANALOG IN)
FB308 1-414-813-11 FERRITE 0uH
FB309 1-414-813-11 FERRITE 0uH < TRANSISTOR >
FB310 1-414-813-11 FERRITE 0uH
FB311 1-414-813-11 FERRITE 0uH Q101 8-729-920-31 TRANSISTOR DTC343TK-T-146
Q201 8-729-920-31 TRANSISTOR DTC343TK-T-146
FB312 1-414-813-11 FERRITE 0uH Q303 8-729-056-23 TRANSISTOR STC352-OY
FB313 1-414-813-11 FERRITE 0uH Q304 8-729-056-23 TRANSISTOR STC352-OY
FB314 1-216-864-11 METAL CHIP 0 5% 1/16W Q305 8-729-055-91 TRANSISTOR SRA2202S
FB315 1-414-813-11 FERRITE 0uH
FB316 1-414-813-11 FERRITE 0uH Q306 8-729-055-94 TRANSISTOR SRC1202S
Q307 8-729-055-91 TRANSISTOR SRA2202S
FB317 1-414-813-11 FERRITE 0uH Q308 8-729-055-94 TRANSISTOR SRC1202S
FB318 1-216-864-11 METAL CHIP 0 5% 1/16W Q309 8-729-019-00 TRANSISTOR KTC2026
FB319 1-216-864-11 METAL CHIP 0 5% 1/16W Q310 8-729-055-91 TRANSISTOR SRA2202S

87
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Ref. No. Part No. Description Remarks Ref. No. Part No. Description Remarks
Q311 8-729-055-94 TRANSISTOR SRC1202S R130 1-216-845-11 METAL CHIP 100K 5% 1/16W
Q312 8-729-019-00 TRANSISTOR KTC2026 R131 1-249-389-11 CARBON 4.7 5% 1/4W F
Q315 8-729-055-91 TRANSISTOR SRA2202S R132 1-216-833-11 METAL CHIP 10K 5% 1/16W
Q316 8-729-055-94 TRANSISTOR SRC1202S R133 1-216-830-11 METAL CHIP 5.6K 5% 1/16W
Q318 8-729-055-91 TRANSISTOR SRA2202S (EXCEPT AEP, UK, E51, HK)

Q319 8-729-034-51 TRANSISTOR KTC3875 R133 1-216-833-11 METAL CHIP 10K 5% 1/16W
Q320 8-729-202-56 TRANSISTOR 2SA950-Y-TPE2 (AEP, UK, E51, HK)
Q321 8-729-055-94 TRANSISTOR SRC1202S R134 1-216-829-11 METAL CHIP 4.7K 5% 1/16W
Q322 8-729-202-56 TRANSISTOR 2SA950-Y-TPE2 (EXCEPT AEP, UK, E51, HK)
Q323 8-729-055-94 TRANSISTOR SRC1202S R134 1-216-833-11 METAL CHIP 10K 5% 1/16W
(AEP, UK)
Q329 8-729-120-28 TRANSISTOR 2SC2412K-T-146-QR R134 1-218-272-11 RES-CHIP 5.1K 5% 1/16W
(AEP, UK) (E51, HK)
Q330 8-729-055-91 TRANSISTOR SRA2202S R135 1-216-825-11 METAL CHIP 2.2K 5% 1/16W
Q331 8-729-055-94 TRANSISTOR SRC1202S
Q333 8-729-055-94 TRANSISTOR SRC1202S R136 1-216-833-11 METAL CHIP 10K 5% 1/16W
Q335 8-729-037-02 TRANSISTOR KTA1266Y-AT R143 1-216-833-11 METAL CHIP 10K 5% 1/16W
R201 1-216-827-11 METAL CHIP 3.3K 5% 1/16W
Q337 8-729-055-94 TRANSISTOR SRC1202S (EXCEPT AEP, UK, E51, HK)
Q339 8-729-055-94 TRANSISTOR SRC1202S R201 1-216-830-11 METAL CHIP 5.6K 5% 1/16W
(AEP, UK, E51, HK)
< RESISTOR > R202 1-216-825-11 METAL CHIP 2.2K 5% 1/16W
(EXCEPT AEP, UK, E51, HK)
R102 1-249-421-11 CARBON 2.2K 5% 1/4W F
(EXCEPT AEP, UK, E51, HK) R202 1-216-837-11 METAL CHIP 22K 5% 1/16W
R102 1-216-837-11 METAL CHIP 22K 5% 1/16W (AEP, UK, E51, HK)
(AEP, UK, E51, HK) R204 1-216-833-11 METAL CHIP 10K 5% 1/16W
R104 1-216-833-11 METAL CHIP 10K 5% 1/16W (EXCEPT AEP, UK, E51, HK)
(EXCEPT AEP, UK, E51, HK) R204 1-216-829-11 METAL CHIP 4.7K 5% 1/16W
R104 1-216-829-11 METAL CHIP 4.7K 5% 1/16W (AEP, UK, E51, HK)
(AEP, UK, E51, HK) R205 1-249-421-11 CARBON 2.2K 5% 1/4W F
R105 1-249-421-11 CARBON 2.2K 5% 1/4W F R206 1-216-833-11 METAL CHIP 10K 5% 1/16W
(EXCEPT AEP, UK, E51, HK)
R106 1-216-833-11 METAL CHIP 10K 5% 1/16W
(EXCEPT AEP, UK, E51, HK) R206 1-216-849-11 METAL CHIP 220K 5% 1/16W
R106 1-216-849-11 METAL CHIP 220K 5% 1/16W (AEP, UK, E51, HK)
(AEP, UK, E51, HK) R207 1-216-830-11 METAL CHIP 5.6K 5% 1/16W
R107 1-216-827-11 METAL CHIP 3.3K 5% 1/16W R208 1-216-821-11 METAL CHIP 1K 5% 1/16W
R108 1-216-827-11 METAL CHIP 3.3K 5% 1/16W (EXCEPT AEP, UK, E51, HK)
R109 1-249-421-11 CARBON 2.2K 5% 1/4W F R208 1-216-837-11 METAL CHIP 22K 5% 1/16W
(AEP, UK, E51, HK)
R110 1-216-821-11 METAL CHIP 1K 5% 1/16W R209 1-249-421-11 CARBON 2.2K 5% 1/4W F
(EXCEPT AEP, UK, E51, HK)
R110 1-216-837-11 METAL CHIP 22K 5% 1/16W R212 1-216-831-11 METAL CHIP 6.8K 5% 1/16W
(AEP, UK, E51, HK) (EXCEPT AEP, UK)
R112 1-216-831-11 METAL CHIP 6.8K 5% 1/16W R212 1-216-833-11 METAL CHIP 10K 5% 1/16W
(EXCEPT AEP, UK) (AEP, UK)
R112 1-216-833-11 METAL CHIP 10K 5% 1/16W R213 1-216-829-11 METAL CHIP 4.7K 5% 1/16W
(AEP, UK) R221 1-216-830-11 METAL CHIP 5.6K 5% 1/16W
R113 1-216-829-11 METAL CHIP 4.7K 5% 1/16W (EXCEPT AEP, UK, E51, HK)
R221 1-216-833-11 METAL CHIP 10K 5% 1/16W
R121 1-216-830-11 METAL CHIP 5.6K 5% 1/16W (AEP, UK)
(EXCEPT AEP, UK, E51, HK)
R121 1-216-833-11 METAL CHIP 10K 5% 1/16W R221 1-216-832-11 METAL CHIP 8.2K 5% 1/16W
(AEP, UK) (E51, HK)
R121 1-216-832-11 METAL CHIP 8.2K 5% 1/16W R222 1-216-829-11 METAL CHIP 4.7K 5% 1/16W
(E51, HK) R223 1-216-835-11 METAL CHIP 15K 5% 1/16W
R122 1-216-829-11 METAL CHIP 4.7K 5% 1/16W (EXCEPT AEP, UK, E51, HK)
R123 1-216-835-11 METAL CHIP 15K 5% 1/16W R223 1-216-829-11 METAL CHIP 4.7K 5% 1/16W
(AUS, CH) (AEP, UK, E51, HK)
R226 1-216-821-11 METAL CHIP 1K 5% 1/16W
R123 1-216-829-11 METAL CHIP 4.7K 5% 1/16W
(AEP, UK, E51, HK) R227 1-216-817-11 METAL CHIP 470 5% 1/16W
R126 1-249-417-11 CARBON 1K 5% 1/4W F R228 1-216-825-11 METAL CHIP 2.2K 5% 1/16W
R127 1-216-817-11 METAL CHIP 470 5% 1/16W R229 1-216-837-11 METAL CHIP 22K 5% 1/16W
R128 1-216-825-11 METAL CHIP 2.2K 5% 1/16W R230 1-216-845-11 METAL CHIP 100K 5% 1/16W
R129 1-216-837-11 METAL CHIP 22K 5% 1/16W R231 1-249-389-11 CARBON 4.7 5% 1/4W F

88
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Ref. No. Part No. Description Remarks Ref. No. Part No. Description Remarks
R232 1-216-833-11 METAL CHIP 10K 5% 1/16W R349 1-216-829-11 METAL CHIP 4.7K 5% 1/16W
R233 1-216-830-11 METAL CHIP 5.6K 5% 1/16W (AEP, UK)
(EXCEPT AEP, UK, E51, HK) R350 1-216-809-11 METAL CHIP 100 5% 1/16W
R233 1-216-833-11 METAL CHIP 10K 5% 1/16W (AEP, UK)
(AEP, UK, E51, HK) R351 1-216-811-11 METAL CHIP 150 5% 1/16W
R234 1-216-829-11 METAL CHIP 4.7K 5% 1/16W (AEP, UK)
(EXCEPT AEP, UK, E51, HK) R352 1-216-841-11 METAL CHIP 47K 5% 1/16W
R234 1-216-833-11 METAL CHIP 10K 5% 1/16W R353 1-216-841-11 METAL CHIP 47K 5% 1/16W
(AEP, UK)
R355 1-216-821-11 METAL CHIP 1K 5% 1/16W
R234 1-218-272-11 RES-CHIP 5.1K 5% 1/16W R356 1-216-821-11 METAL CHIP 1K 5% 1/16W
(E51, HK) R357 1-216-821-11 METAL CHIP 1K 5% 1/16W
R235 1-216-825-11 METAL CHIP 2.2K 5% 1/16W R358 1-216-821-11 METAL CHIP 1K 5% 1/16W
R236 1-216-833-11 METAL CHIP 10K 5% 1/16W R360 1-216-797-11 METAL CHIP 10 5% 1/16W
R243 1-216-833-11 METAL CHIP 10K 5% 1/16W (EXCEPT AEP, UK, E51, HK)
R300 1-216-813-11 METAL CHIP 220 5% 1/16W
R360 1-216-864-11 METAL CHIP 0 5% 1/16W
R301 1-216-809-11 METAL CHIP 100 5% 1/16W (AEP, UK, E51, HK)
R302 1-249-411-11 CARBON 330 5% 1/4W R361 1-216-833-11 METAL CHIP 10K 5% 1/16W
R303 1-249-413-11 CARBON 470 5% 1/4W F R362 1-216-845-11 METAL CHIP 100K 5% 1/16W
R304 1-216-864-11 METAL CHIP 0 5% 1/16W (EXCEPT E51, HK)
R305 1-216-833-11 METAL CHIP 10K % 1/16W R362 1-216-829-11 METAL CHIP 4.7K 5% 1/16W
(E51, HK)
R307 1-162-970-11 CERAMIC CHIP 0.01uF 10% 25V R363 1-216-825-11 METAL CHIP 2.2K 5% 1/16W
R313 1-216-823-11 METAL CHIP 1.5K 5% 1/16W
R314 1-216-815-11 METAL CHIP 330 5% 1/16W R364 1-249-413-11 CARBON 470 5% 1/4W F
R315 1-216-809-11 METAL CHIP 100 5% 1/16W R365 1-216-833-11 METAL CHIP 10K 5% 1/16W
(EXCEPT AEP, UK, E51, HK) R366 1-216-833-11 METAL CHIP 10K 5% 1/16W
R315 1-216-864-11 METAL CHIP 0 5% 1/16W R367 1-216-843-11 METAL CHIP 68K 5% 1/16W
(AEP, UK, E51, HK) R368 1-216-841-11 METAL CHIP 47K 5% 1/16W

R316 1-216-827-11 METAL CHIP 3.3K 5% 1/16W R370 1-216-841-11 METAL CHIP 47K 5% 1/16W
R317 1-216-849-11 METAL CHIP 220K 5% 1/16W R371 1-216-829-11 METAL CHIP 4.7K 5% 1/16W
R319 1-216-833-11 METAL CHIP 10K 5% 1/16W (EXCEPT AEP, UK, E51, HK)
R320 1-216-827-11 METAL CHIP 3.3K 5% 1/16W R371 1-216-821-11 METAL CHIP 1K 5% 1/16W
R321 1-216-833-11 METAL CHIP 10K 5% 1/16W (AEP, UK, E51, HK)
R372 1-216-829-11 METAL CHIP 4.7K 5% 1/16W
R322 1-216-809-11 METAL CHIP 100 5% 1/16W R373 1-216-829-11 METAL CHIP 4.7K 5% 1/16W
(EXCEPT AEP, UK, E51, HK)
R322 1-216-864-11 METAL CHIP 0 5% 1/16W R374 1-216-829-11 METAL CHIP 4.7K 5% 1/16W
(AEP, UK, E51, HK) R389 1-216-829-11 METAL CHIP 4.7K 5% 1/16W
R326 1-216-809-11 METAL CHIP 100 5% 1/16W R401 1-216-841-11 METAL CHIP 47K 5% 1/16W
R327 1-216-833-11 METAL CHIP 10K 5% 1/16W R402 1-216-821-11 METAL CHIP 1K 5% 1/16W
R328 1-216-833-11 METAL CHIP 10K 5% 1/16W R403 1-216-821-11 METAL CHIP 1K 5% 1/16W

R329 1-216-841-11 METAL CHIP 47K 5% 1/16W R404 1-216-821-11 METAL CHIP 1K 5% 1/16W
R330 1-216-841-11 METAL CHIP 47K 5% 1/16W R405 1-216-821-11 METAL CHIP 1K 5% 1/16W
R331 1-216-837-11 METAL CHIP 22K 5% 1/16W R406 1-216-821-11 METAL CHIP 1K 5% 1/16W
R333 1-216-829-11 METAL CHIP 4.7K 5% 1/16W R407 1-216-821-11 METAL CHIP 1K 5% 1/16W
R334 1-216-825-11 METAL CHIP 2.2K 5% 1/16W R409 1-216-829-11 METAL CHIP 4.7K 5% 1/16W

R336 1-216-809-11 METAL CHIP 100 5% 1/16W R419 1-216-821-11 METAL CHIP 1K 5% 1/16W
R340 1-216-833-11 METAL CHIP 10K 5% 1/16W R420 1-216-821-11 METAL CHIP 1K 5% 1/16W
R341 1-216-833-11 METAL CHIP 10K 5% 1/16W R421 1-216-821-11 METAL CHIP 1K 5% 1/16W
R342 1-216-809-11 METAL CHIP 100 5% 1/16W R422 1-216-821-11 METAL CHIP 1K 5% 1/16W
(AEP, UK) R423 1-216-821-11 METAL CHIP 1K 5% 1/16W
R343 1-216-857-11 METAL CHIP 1M 5% 1/16W
(AEP, UK) R424 1-216-821-11 METAL CHIP 1K 5% 1/16W
R425 1-216-821-11 METAL CHIP 1K 5% 1/16W
R344 1-216-821-11 METAL CHIP 1K 5% 1/16W R426 1-216-821-11 METAL CHIP 1K 5% 1/16W
(AEP, UK) R427 1-216-821-11 METAL CHIP 1K 5% 1/16W
R345 1-216-809-11 METAL CHIP 100 5% 1/16W R428 1-216-821-11 METAL CHIP 1K 5% 1/16W
(AEP, UK)
R346 1-216-845-11 METAL CHIP 100K 5% 1/16W R429 1-247-807-31 CARBON 100 5% 1/4W
(AEP, UK) R430 1-247-807-31 CARBON 100 5% 1/4W
R347 1-216-821-11 METAL CHIP 1K 5% 1/16W R432 1-216-821-11 METAL CHIP 1K 5% 1/16W
(AEP, UK) R433 1-216-821-11 METAL CHIP 1K 5% 1/16W
R348 1-216-853-11 METAL CHIP 470K 5% 1/16W R434 1-216-821-11 METAL CHIP 1K 5% 1/16W
(AEP, UK)

89
HCD-CP500MD
MAIN POWER

Ref. No. Part No. Description Remarks Ref. No. Part No. Description Remarks
R435 1-249-417-11 CARBON 1K 5% 1/4W F < TERMINAL BOARD >
R436 1-249-417-11 CARBON 1K 5% 1/4W F
R437 1-249-417-11 CARBON 1K 5% 1/4W F SJ301 1-694-820-11 TERMINAL BOARD (SPEAKER)
R438 1-249-417-11 CARBON 1K 5% 1/4W F
R439 1-216-821-11 METAL CHIP 1K 5% 1/16W < TERMINAL >

R440 1-216-821-11 METAL CHIP 1K 5% 1/16W TH1 1-537-770-11 TERMINAL BOARD, GROUND
R441 1-216-821-11 METAL CHIP 1K 5% 1/16W TH2 1-537-770-11 TERMINAL BOARD, GROUND
R442 1-249-417-11 CARBON 1K 5% 1/4W F
R443 1-216-821-11 METAL CHIP 1K 5% 1/16W < VIBRATOR >
R444 1-216-801-11 METAL CHIP 22 5% 1/16W
X301 1-579-242-41 VIBRATOR, CRYSTAL (4.332Hz)(AEP, UK)
R445 1-216-821-11 METAL CHIP 1K 5% 1/16W X801 1-567-098-41 VIBRATOR, CRYSTAL (32.768MHz)
R446 1-216-845-11 METAL CHIP 100K 5% 1/16W X802 1-781-107-21 VIBRATOR, SERAMIC (10MHz)
R448 1-216-821-11 METAL CHIP 1K 5% 1/16W ∗∗∗∗∗∗∗∗∗∗∗∗∗∗∗∗∗∗∗∗∗∗∗∗∗∗∗∗∗∗∗∗∗∗∗∗∗∗∗∗∗∗∗∗∗∗∗∗∗∗∗∗∗∗∗∗∗∗∗∗
R449 1-216-821-11 METAL CHIP 1K 5% 1/16W
R450 1-216-821-11 METAL CHIP 1K 5% 1/16W A-4725-836-A POWER BOARD, COMPLETE (AEP, UK, AUS, CH)
A-4725-850-A POWER BOARD, COMPLETE (E51, HK)
R452 1-216-821-11 METAL CHIP 1K 5% 1/16W ∗∗∗∗∗∗∗∗∗∗∗∗∗∗∗∗∗∗∗∗∗∗∗
R453 1-216-821-11 METAL CHIP 1K 5% 1/16W
R454 1-216-833-11 METAL CHIP 10K 5% 1/16W 1-533-233-11 HOLDER, FUSE
R455 1-216-821-11 METAL CHIP 1K 5% 1/16W
R456 1-216-821-11 METAL CHIP 1K 5% 1/16W < CAPACITOR >

R457 1-216-821-11 METAL CHIP 1K 5% 1/16W C902 1-101-005-00 CERAMIC 22000PF 50V
R458 1-216-821-11 METAL CHIP 1K 5% 1/16W C903 1-101-005-00 CERAMIC 22000PF 50V
R466 1-216-821-11 METAL CHIP 1K 5% 1/16W C904 1-101-005-00 CERAMIC 22000PF 50V
R467 1-216-821-11 METAL CHIP 1K 5% 1/16W C905 1-101-005-00 CERAMIC 22000PF 50V
R468 1-216-821-11 METAL CHIP 1K 5% 1/16W C906 1-161-494-00 CERAMIC 0.022uF 25V

R474 1-216-821-11 METAL CHIP 1K 5% 1/16W C907 1-161-494-00 CERAMIC 0.022uF 25V
R475 1-249-417-11 CARBON 1K 5% 1/4W F C908 1-161-494-00 CERAMIC 0.022uF 25V
R476 1-216-821-11 METAL CHIP 1K 5% 1/16W C909 1-161-494-00 CERAMIC 0.022uF 25V
R477 1-216-821-11 METAL CHIP 1K 5% 1/16W C910 1-161-494-00 CERAMIC 0.022uF 25V
R478 1-216-821-11 METAL CHIP 1K 5% 1/16W C911 1-104-664-11 ELECT 47uF 20.00% 25V
(EXCEPT E51, HK)
R479 1-216-821-11 METAL CHIP 1K 5% 1/16W
R480 1-216-821-11 METAL CHIP 1K 5% 1/16W C911 1-104-666-11 ELECT 220uF 20.00% 16V
R481 1-216-821-11 METAL CHIP 1K 5% 1/16W (E51, HK)
R482 1-216-821-11 METAL CHIP 1K 5% 1/16W C912 1-126-767-11 ELECT 100uF 20.00% 16V
R483 1-216-821-11 METAL CHIP 1K 5% 1/16W (EXCEPT E51, HK)
C912 1-126-941-11 ELECT 470uF 20.00% 16V
R484 1-216-821-11 METAL CHIP 1K 5% 1/16W (E51, HK)
R485 1-216-821-11 METAL CHIP 1K 5% 1/16W C913 1-161-494-00 CERAMIC 0.022uF 25V
R486 1-216-821-11 METAL CHIP 1K 5% 1/16W (E51, HK)
R487 1-216-821-11 METAL CHIP 1K 5% 1/16W C914 1-161-494-00 CERAMIC 0.022uF 25V
R488 1-216-821-11 METAL CHIP 1K 5% 1/16W (E51, HK)

R489 1-216-821-11 METAL CHIP 1K 5% 1/16W C915 1-161-494-00 CERAMIC 0.022uF 25V
R490 1-216-821-11 METAL CHIP 1K 5% 1/16W (E51, HK)
R491 1-216-821-11 METAL CHIP 1K 5% 1/16W C916 1-161-494-00 CERAMIC 0.022uF 25V
R492 1-216-821-11 METAL CHIP 1K 5% 1/16W (E51, HK)
R493 1-216-821-11 METAL CHIP 1K 5% 1/16W C917 1-104-665-11 ELECT 100uF 20.00% 16V
(E51, HK)
R494 1-216-821-11 METAL CHIP 1K 5% 1/16W C918 1-126-964-11 ELECT 10uF 20.00% 50V
R495 1-216-864-11 METAL CHIP 0 5% 1/16W
(EXCEPT E51, HK) < CONNECTOR >
R495 1-216-811-11 METAL CHIP 150 5% 1/16W
(E51, HK) CN901 1-564-321-00 PIN, CONNECTOR 2P
R497 1-216-864-11 METAL CHIP 0 5% 1/16W ∗ CN902 1-764-333-11 PLUG, CONNECTOR 10P (EXCEPT E51, HK)
(EXCEPT AEP, UK) CN902 1-766-283-11 PIN, CONNECTOR (PC BOARD) 10P (E51, HK)
R497 1-216-829-11 METAL CHIP 4.7K 5% 1/16W
(AEP, UK) < DIODE >

R509 1-216-821-11 METAL CHIP 1K 5% 1/16W D902 8-719-902-17 DIODE 1N5401

R513 1-216-831-11 METAL CHIP 6.8K 5% 1/16W D903 8-719-902-17 DIODE 1N5401
D904 8-719-902-17 DIODE 1N5401
D905 8-719-902-17 DIODE 1N5401
D906 8-719-046-07 DIODE 2A02M

90
 HCD-CP500MD
POWER TC

Ref. No. Part No. Description Remarks Ref. No. Part No. Description Remarks
D907 8-719-046-07 DIODE 2A02M A-4725-838-A TC BOARD, COMPLETE
D908 8-719-046-07 DIODE 2A02M ∗∗∗∗∗∗∗∗∗∗∗∗∗∗∗∗∗∗∗
D909 8-719-046-07 DIODE 2A02M
D910 8-719-991-33 DIODE 1SS133T-77 < CAPACITOR >
D911 8-719-991-33 DIODE 1SS133T-77
C402 1-162-962-11 CERAMIC CHIP 470PF 10% 50V
D912 8-719-991-33 DIODE 1SS133T-77 C403 1-104-509-11 CERAMIC CHIP 0.018uF 10.00% 16V
D913 8-719-991-33 DIODE 1SS133T-77 C404 1-162-962-11 CERAMIC CHIP 470PF 10% 50V
D915 8-719-109-97 DIODE MTZJ-T-77-6.8B C405 1-126-934-11 ELECT 220uF 20.00% 10V
D917 8-719-991-33 DIODE 1SS133T-77 C408 1-104-664-11 ELECT 47uF 20.00% 10V
D918 8-719-109-93 DIODE MTZJ-T-77-6.2B
C409 1-126-963-11 ELECT 4.7uF 20.00% 50V
D919 8-719-991-33 DIODE 1SS133T-77 C410 1-126-963-11 ELECT 4.7uF 20.00% 50V
D920 8-719-991-33 DIODE 1SS133T-77 C412 1-126-961-11 ELECT 2.2uF 20.00% 50V
C414 1-104-664-11 ELECT 47uF 20.00% 10V
< FUSE > C415 1-104-664-11 ELECT 47uF 20.00% 10V

0 F901 1-533-466-11 FUSE, GLASS TUBE (DIA. 5)(T1.25AL/250V) C416 1-126-963-11 ELECT 4.7uF 20.00% 50V
(E51, HK) C417 1-126-963-11 ELECT 4.7uF 20.00% 50V
0 F902 1-533-468-11 FUSE, GLASS TUBE (DIA. 5)(T2AL/250V) C420 1-126-965-11 ELECT 22uF 20.00% 50V
(E51, HK) C422 1-162-969-11 CERAMIC CHIP 0.0068uF 10% 25V
0 F903 1-533-468-11 FUSE, GLASS TUBE (DIA. 5)(T2AL/250V) C423 1-126-960-11 ELECT 1uF 20.00% 50V
0 F904 1-533-468-11 FUSE, GLASS TUBE (DIA. 5)(T2AL/250V)
0 F905 1-533-464-11 FUSE, GLASS TUBE (DIA. 5)(T0.8AL/250V) C424 1-126-960-11 ELECT 1uF 20.00% 50V
(AEP, UK, AUS, CH) C425 1-126-934-11 ELECT 220uF 20.00% 16V
C428 1-162-964-11 CERAMIC CHIP 0.001uF 10% 50V
< LINE FILTER > C429 1-164-730-11 CERAMIC CHIP 0.0012uF 10.00% 50V
C430 1-164-730-11 CERAMIC CHIP 0.0012uF 10.00% 50V
0 LF901 1-424-150-11 TRANSFORMER, LINE FILTER
C431 1-162-964-11 CERAMIC CHIP 0.001uF 10% 50V
< TRANSISTOR > C432 1-136-967-11 MYLAR 0.012uF 5.00% 50V
C433 1-162-968-11 CERAMIC CHIP 0.0047uF 10% 50V
Q901 8-729-056-23 TRANSISTOR STC352-OY (EXCEPT E51, HK) C434 1-104-664-11 ELECT 47uF 20.00% 10V
Q901 8-729-028-54 TRANSISTOR KTC3205-Y-AT(E51, HK) C435 1-162-970-11 CERAMIC CHIP 0.01uF 10% 25V
Q902 8-729-119-79 TRANSISTOR 2SC2785TP-FEK
Q903 8-729-056-23 TRANSISTOR STC352-OY (EXCEPT E51, HK) C436 1-104-509-11 CERAMIC CHIP 0.018uF 10.00% 16V
Q903 8-729-028-54 TRANSISTOR KTC3205-Y-AT (E51, HK) C437 1-126-934-11 ELECT 220uF 20.00% 10V
C438 1-162-965-11 CERAMIC CHIP 0.0015uF 10% 50V
< RESISTOR > C439 1-126-935-11 ELECT 470uF 20.00% 16V
C440 1-162-965-11 CERAMIC CHIP 0.0015uF 10% 50V
R902 1-249-417-11 CARBON 1K 5% 1/4W F
(EXCEPT E51, HK) C450 1-126-965-11 ELECT 22uF 20.00% 50V
R902 1-249-413-11 CARBON 470 5% 1/4W F
(E51, HK) < CONNECTOR >
R903 1-249-425-11 CARBON 4.7K 5% 1/4W F
R904 1-249-437-11 CARBON 47K 5% 1/4W ∗ CN301 1-569-366-11 SOCKET, CONNECTOR 18P
R905 1-247-807-31 CARBON 100 5% 1/4W CN302 1-569-927-11 SOCKET, CONNECTOR 9P

R906 1-247-807-31 CARBON 100 5% 1/4W < DIODE >

< RELAY > D401 8-719-975-40 DIODE RB411D-T146

0 RY901 1-755-332-11 RELAY < IC >

< SWITCH > IC401 8-759-242-58 IC TA8189N

IC402 8-759-508-69 IC BA3126N
0 S901 1-786-152-11 SWITCH, SLIDE (VOLTAGE SELECTOR)(E51, HK)
< TRANSISTOR >
< TRANSFORMER >
Q401 8-729-212-02 TRANSISTOR KTC3203Y-AT
0 T901 1-437-251-11 TRANSFORMER, POWER (AEP, UK, AUS, CH) Q402 8-729-037-02 TRANSISTOR KTA1266Y-AT
0 T901 1-437-253-11 TRANSFORMER, POWER (E51, HK) Q403 8-729-038-67 TRANSISTOR KRC102S
0 T902 1-437-248-21 TRANSFORMER, POWER Q406 8-729-920-31 TRANSISTOR DTC343TK-T-146
∗∗∗∗∗∗∗∗∗∗∗∗∗∗∗∗∗∗∗∗∗∗∗∗∗∗∗∗∗∗∗∗∗∗∗∗∗∗∗∗∗∗∗∗∗∗∗∗∗∗∗∗∗∗∗∗∗∗∗∗ Q407 8-729-920-31 TRANSISTOR DTC343TK-T-146

Q413 8-729-920-31 TRANSISTOR DTC343TK-T-146

The components identified by

mark 0 or dotted line with mark
0 are critical for safety.
Replace only with part number
specified.

91
HCD-CP500MD
Ver. 1.1
TC
Ref. No. Part No. Description Remarks Ref. No. Part No. Description Remarks
Q414 8-729-920-31 TRANSISTOR DTC343TK-T-146 65 1-757-946-11 WIRE (FLAT TYPE)(25 CORE)
0 104 1-696-169-11 CORD, POWER (AEP, UK, E51, HK)
< RESISTOR > 0 104 1-696-848-41 CORD, POWER (AUS)
0 104 1-782-464-21 CORD, POWER (CH)
R399 1-216-821-11 METAL CHIP 1K 5% 1/16W 108 1-757-943-11 WIRE (FLAT TYPE)(22CORE)
R400 1-216-833-11 METAL CHIP 10K 5% 1/16W
R403 1-216-805-11 METAL CHIP 47 5% 1/16W 209 1-678-514-11 FLEXIBLE BOARD
R405 1-216-809-11 METAL CHIP 100 5% 1/16W 0 210 A-4672-541-A OPTICAL PICK-UP KMS-260B
R406 1-216-831-11 METAL CHIP 6.8K 5% 1/16W 305 1-757-055-11 WIRE (FLAT TYPE)(16 CORE)
0 308 A-4735-357-A BASE ASSY, OP (KSM-213DHAP/Z-NP)
R407 1-216-848-11 METAL CHIP 180K 5% 1/16W HR901 1-500-670-11 HEAD, OVER WRITE
R408 1-216-831-11 METAL CHIP 6.8K 5% 1/16W
R409 1-216-809-11 METAL CHIP 100 5% 1/16W LCD801 1-804-393-11 DISPLAY PANEL, LIQUID CRYSTAL
R410 1-216-848-11 METAL CHIP 180K 5% 1/16W M101 A-4672-898-A MOTOR ASSY, SPINDLE
R411 1-216-845-11 METAL CHIP 100K 5% 1/16W M102 A-4735-076-A MOTOR ASSY, SLED
M103 A-4735-074-A MOTOR ASSY, LOADING (MD)
R412 1-216-824-11 METAL CHIP 1.8K 5% 1/16W M901 A-2004-893-A MOTOR (LD) ASSY (DISC TRAY OPEN/CLOSE)
R413 1-216-848-11 METAL CHIP 180K 5% 1/16W
R414 1-216-833-11 METAL CHIP 10K 5% 1/16W S102 1-771-957-11 SWITCH, PUSH (2KEY)(REFLECT/PROTECT)
R415 1-216-833-11 METAL CHIP 10K 5% 1/16W 0 T902 1-437-248-21 TRANSFORMER, POWER
R416 1-216-829-11 METAL CHIP 4.7K 5% 1/16W ∗∗∗∗∗∗∗∗∗∗∗∗∗∗∗∗∗∗∗∗∗∗∗∗∗∗∗∗∗∗∗∗∗∗∗∗∗∗∗∗∗∗∗∗∗∗∗∗∗∗∗∗∗∗∗∗∗∗∗∗

R417 1-216-805-11 METAL CHIP 47 5% 1/16W ∗∗∗∗∗∗∗∗∗∗∗∗∗∗

R418 1-216-845-11 METAL CHIP 100K 5% 1/16W HARDWARE LIST
R419 1-216-824-11 METAL CHIP 1.8K 5% 1/16W ∗∗∗∗∗∗∗∗∗∗∗∗∗∗
R420 1-216-848-11 METAL CHIP 180K 5% 1/16W
R421 1-216-857-11 METAL CHIP 1M 5% 1/16W #1 7-685-546-14 SCREW +BTP 3X8 TYPE2 N-S
#2 7-685-246-14 SCREW +KTP 3X8 TYPE2 NON-SLIT
R422 1-216-833-11 METAL CHIP 10K 5% 1/16W #3 7-685-861-01 SCREW +BVTT 2.6X5 (S)
R423 1-216-837-11 METAL CHIP 22K 5% 1/16W #4 7-685-659-14 SCREW +BVTP 4X8 TYPE2 N-S
R424 1-216-841-11 METAL CHIP 47K 5% 1/16W (EXCEPT CH, E51, HK)
R425 1-216-829-11 METAL CHIP 4.7K 5% 1/16W #4 7-685-659-71 SCREW +BVTP 4X8 TYPE2 IT-3 (CH, E51, HK)
R426 1-216-829-11 METAL CHIP 4.7K 5% 1/16W
#5 7-685-548-19 SCREW +BTP 3X12 TYPE2 N-S
R427 1-216-809-11 METAL CHIP 100 5% 1/16W #6 7-685-647-79 SCREW +BVTP 3X10 TYPE2 N-S
R428 1-216-835-11 METAL CHIP 15K 5% 1/16W #7 7-685-850-04 SCREW +BVTT 2X3 (S)
R429 1-216-835-11 METAL CHIP 15K 5% 1/16W #8 7-685-204-19 SCREW ++K 2X6 TYPE2 NON-SLIT
R430 1-216-829-11 METAL CHIP 4.7K 5% 1/16W #9 7-685-533-19 SCREW ++B 2.6X6 TYPE2 NON-SLIT
R431 1-216-829-11 METAL CHIP 4.7K 5% 1/16W

R432 1-216-827-11 METAL CHIP 3.3K 5% 1/16W

R433 1-216-825-11 METAL CHIP 2.2K 5% 1/16W
R434 1-216-803-11 METAL CHIP 33 5% 1/16W
R435 1-216-833-11 METAL CHIP 10K 5% 1/16W
R436 1-216-797-11 METAL CHIP 10 5% 1/16W

R437 1-216-829-11 METAL CHIP 4.7K 5% 1/16W

R438 1-216-841-11 METAL CHIP 47K 5% 1/16W
R439 1-216-833-11 METAL CHIP 10K 5% 1/16W
R440 1-218-446-11 METAL CHIP 1 5% 1/16W
R441 1-216-821-11 METAL CHIP 1K 5% 1/16W

R442 1-216-825-11 METAL CHIP 2.2K 5% 1/16W

< TRANSFORMER >

T401 1-433-372-11 TRANSFORMER, BIAS OSCILLATION

T402 1-419-080-11 COIL
T403 1-419-080-11 COIL
∗∗∗∗∗∗∗∗∗∗∗∗∗∗∗∗∗∗∗∗∗∗∗∗∗∗∗∗∗∗∗∗∗∗∗∗∗∗∗∗∗∗∗∗∗∗∗∗∗∗∗∗∗∗∗∗∗∗∗∗

MISCELLANEOUS
∗∗∗∗∗∗∗∗∗∗∗∗∗∗∗

2 1-757-943-11 WIRE (FLAT TYPE)(12CORE)

3 1-796-101-11 DECK, MECH
12 1-757-944-11 WIRE (FLAT TYPE)(17CORE)
13 1-757-942-11 WIRE (FLAT TYPE)(27CORE) The components identified by
14 1-792-767-11 WIRE (FLAT TYPE)(25 CORE) mark 0 or dotted line with mark
0 are critical for safety.
Replace only with part number
specified.

92
 HCD-CP500MD

MEMO

93