SP3222EB/3232EB

True +3.0V to +5.5V RS-232 Transceivers

FEATURES
■ Meets true EIA/TIA-232-F Standards C1+ 1 16 VCC
from a +3.0V to +5.5V power supply
V+ 2 15 GND
■ 250kbps Transmission Rate Under Load
■ 1µA Low-Power Shutdown with Receivers C1- 3 14 T1OUT
Active (SP3222EB) C2+ 4 SP3232EB 13 R1IN
■ Interoperable with RS-232 down to +2.7V
C2- 5 12 R1OUT
power source
■ Enhanced ESD Specifications: V- 6 11 T1IN
±15kV Human Body Model
T2OUT 7 10 T2IN
±15kV IEC1000-4-2 Air Discharge
±8kV IEC1000-4-2 Contact Discharge R2IN 8 9 R2OUT

Now Available in Lead Free Packaging

DESCRIPTION
The SP3222EB/3232EB series is an RS-232 transceiver solution intended for portable or
hand-held applications such as notebook or palmtop computers. The SP3222EB/3232EB
series has a high-efficiency, charge-pump power supply that requires only 0.1µF capacitors
in 3.3V operation. This charge pump allows the SP3222EB/3232EB series to deliver true RS-
232 performance from a single power supply ranging from +3.0V to +5.5V. The SP3222EB/
3232EB are 2-driver/2-receiver devices. This series is ideal for portable or hand-held
applications such as notebook or palmtop computers. The ESD tolerance of the SP3222EB/
3232EB devices are over ±15kV for both Human Body Model and IEC1000-4-2 Air discharge
test methods. The SP3222EB device has a low-power shutdown mode where the devices'
driver outputs and charge pumps are disabled. During shutdown, the supply current falls to
less than 1µA.
SELECTION TABLE

RS-232 RS-232 External TTL No. of

MODEL Power Supplies Shutdown
Drivers Receivers Components 3-State Pins

SP3222EB +3.0V to +5.5V 2 2 4 Yes Yes 18, 20

SP3232EB +3.0V to +5.5V 2 2 4 No No 16

Date: 02/27/05 SP3222EB/3232EB True +3.0 to +5.5V RS-232 Transceivers © Copyright 2005 Sipex Corporation

1
ABSOLUTE MAXIMUM RATINGS
These are stress ratings only and functional Output Voltages
operation of the device at these ratings or any other TxOUT ........................................................... ±13.2V
above those indicated in the operation sections of RxOUT ..................................... -0.3V to (VCC + 0.3V)
the specifications below is not implied. Exposure to
absolute maximum rating conditions for extended Short-Circuit Duration
periods of time may affect reliability and cause TxOUT .................................................... Continuous
permanent damage to the device. Storage Temperature ...................... -65°C to +150°C

VCC ...................................................... -0.3V to +6.0V Power Dissipation Per Package

20-pin SSOP (derate 9.25mW/oC above +70oC) ........ 750mW
V+ (NOTE 1) ...................................... -0.3V to +7.0V
18-pin PDIP (derate 15.2mW/oC above +70oC) ....... 1220mW
V- (NOTE 1) ....................................... +0.3V to -7.0V 18-pin SOIC (derate 15.7mW/oC above +70oC) ....... 1260mW
V+ + |V-| (NOTE 1) ........................................... +13V 20-pin TSSOP (derate 11.1mW/oC above +70oC) ...... 890mW
16-pin SSOP (derate 9.69mW/oC above +70oC) ........ 775mW
ICC (DC VCC or GND current) ......................... ±100mA 16-pin PDIP (derate 14.3mW/oC above +70oC) ....... 1150mW
16-pin Wide SOIC (derate 11.2mW/oC above +70oC) .... 900mW
Input Voltages 16-pin TSSOP (derate 10.5mW/oC above +70oC) ...... 850mW
16-pin nSOIC (derate 13.57mW/°C above +70°C) ...... 1086mW
TxIN, EN ............................................ -0.3V to +6.0V
RxIN .................................................................. ±25V

NOTE 1: V+ and V- can have maximum magnitudes of 7V, but their absolute difference cannot exceed 13V.
NOTE 2: Driver Input hysteresis is typically 250mV.
ELECTRICAL CHARACTERISTICS
Unless otherwise noted, the following specifications apply for VCC = +3.0V to +5.5V with TAMB = TMIN to TMAX, C1 to
C4=0.1µF

PARAMETER MIN. TYP. MAX. UNITS CONDITIONS

DC CHARACTERISTICS
Supply Current 0.3 1.0 mA no load, TAMB = +25°C, VCC = 3.3V,
TxIN = VCC or GND
Shutdown Supply Current 1.0 10 µA SHDN = GND, TAMB = +25°C,
VCC = +3.3V, TxIN = VCC or GND
LOGIC INPUTS AND RECEIVER OUTPUTS
Input Logic Threshold LOW GND 0.8 V TxIN, EN, SHDN, Note 2
Input Logic Threshold HIGH 2.0 VCC V VCC = 3.3V, Note 2
2.4 V VCC = 5.0V, Note 2
Input Leakage Current ±0.01 ±1.0 µA TxIN, EN, SHDN, TAMB = +25°C,
VIN = 0V to VCC
Output Leakage Current ±0.05 ±10 µA receivers disabled, VOUT = 0V to VCC
Output Voltage LOW 0.4 V IOUT = 1.6mA
Output Voltage HIGH VCC-0.6 VCC-0.1 V IOUT = -1.0mA
DRIVER OUTPUTS
Output Voltage Swing ±5.0 ±5.4 V 3kΩ load to ground at all driver
outputs, TAMB = +25°C
Output Resistance 300 Ω VCC = V+ = V- = 0V, TOUT = +2V
Output Short-Circuit Current ±35 ±60 mA VOUT = 0V
Output Leakage Current ±25 µA VOUT = ±12V,VCC= 0V,
or 3.0V to 5.5V, drivers disabled

Date:02/27/05 SP3222EB/3232EB True +3.0 to +5.5V RS-232 Transceivers © Copyright 2005 Sipex Corporation

2
 ELECTRICAL CHARACTERISTICS
Unless otherwise noted, the following specifications apply for VCC = +3.0V to +5.5V with TAMB = TMIN to TMAX , C1 to
C4=0.1µF. Typical Values apply at VCC = +3.3V or +5.5V and TAMB = 25oC.

PARAMETER MIN. TYP. MAX. UNITS CONDITIONS

RECEIVER INPUTS

Input Voltage Range -25 +25 V

Input Threshold LOW 0.6 1.2 V VCC=3.3V

0.8 1.5 VCC=5.0V

Input Threshold HIGH 1. 5 2.4 V VCC=3.3V

1.8 2.4 VCC=5.0V

Input Hysteresis 0. 3 V

Input Resistance 3 5 7 kΩ

TIMING CHARACTERISTICS

Maximum Data Rate 250 kbps RL=3kΩ, CL=1000pF, one driver switching

Receiver Propagation Delay 0.15 µs tPHL, RxIN to RxOUT, CL=150pF

0.15 tPLH, RxIN to RxOUT, CL=150pF

Receiver Output Enable Time 200 ns

Receiver Output Disable Time 200 ns

Driver Skew 100 ns | tPHL - tPLH |, TAMB = 25oC

Receiver Skew 50 ns | tPHL - tPLH |

Transition-Region Slew Rate 30 V/µs VCC = 3.3V, RL = 3KΩ, TAMB = 25oC,

measurements taken from -3.0V to +3.0V
or +3.0V to -3.0V

Date: 02/27/05 SP3222EB/3232EB True +3.0 to +5.5V RS-232 Transceivers © Copyright 2005 Sipex Corporation

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 TYPICAL PERFORMANCE CHARACTERISTICS
Unless otherwise noted, the following performance characteristics apply for VCC = +3.3V, 250kbps data rates, all drivers
loaded with 3kΩ, 0.1µF charge pump capacitors, and TAMB = +25°C.

6 30

4 25 - Slew
TxOUT +
+ Slew

Slew rate (V/µs)

2 20
Transmitter Output

T1 at 250Kbps
Voltage (V)

0 T2 at 15.6Kbps 15
All TX loaded 3K // CLoad
-2 10 T1 at 250Kbps
TxOUT - T2 at 15.6Kbps
-4 5 All TX loaded 3K // CLoad

-6 0
0 1000 2000 3000 4000 5000 0 500 1000 2000 3000 4000 5000
Load Capacitance (pF) Load Capacitance (pF)

Figure 1. Transmitter Output Voltage vs Load Figure 2. Slew Rate vs Load Capacitance.
Capacitance.

35 16
T1 at Full Data Rate
30 T2 at 1/16 Data Rate 250Kbps 14
Supply Current (mA)
Supply Current (mA)

All TX loaded 3K // CLoad

25 12

20 125Kbps 10
8
15 20Kbps
6 1 Transmitter at 250Kbps
10
4 1 Transmitter at 15.6Kbps
5 All transmitters loaded with 3K // 1000pf
2
0 0
0 1000 2000 3000 4000 5000 2.7 3 3.5 4 4.5 5
Load Capacitance (pF) Supply Voltage (V)

Figure 3. Supply Current vs Load Capacitance when Figure 4. Supply Current vs Supply Voltage.
Transmitting Data.

6
TxOUT +
4
Transmitter Output
Voltage (V)

2
T1 at 250Kbps
0 T2 at 15.6Kbps
All TX loaded 3K // 1000 pF
-2

-4 TxOUT -

-6
2.7 3 3.5 4 4.5 5
Supply Voltage (V)

Figure 5. Transmitter Output Voltage vs Supply

Voltage.

Date:02/27/05 SP3222EB/3232EB True +3.0 to +5.5V RS-232 Transceivers © Copyright 2005 Sipex Corporation

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 PIN DESCRIPTION

PIN NUMBER

NAME FUNCTION SP3222EB

SP3232EB
SSOP
DIP/SO
TSSOP

Receiver Enable. Apply logic LOW for normal operation.

EN 1 1 -
Apply logic HIGH to disable the receiver outputs (high-Z state).

C1+ Positive terminal of the voltage doubler charge-pump capacitor. 2 2 1

V+ +5.5V generated by the charge pump. 3 3 2

C1- Negative terminal of the voltage doubler charge-pump capacitor. 4 4 3

C2+ Positive terminal of the inverting charge-pump capacitor. 5 5 4

C2- Negative terminal of the inverting charge-pump capacitor. 6 6 5

V- -5.5V generated by the charge pump. 7 7 6

T1OUT RS-232 driver output. 15 17 14

T2OUT RS-232 driver output. 8 8 7

R1IN RS-232 receiver input. 14 16 13

R2IN RS-232 receiver input. 9 9 8

R1OUT TTL/CMOS reciever output. 13 15 12

R2OUT TTL/CMOS reciever output. 10 10 9

T1IN TTL/CMOS driver input. 12 13 11

T2IN TTL/CMOS driver input. 11 12 10

GND Ground. 16 18 15

VCC +3.0V to +5.5V supply voltage 17 19 16

Shutdown Control Input. Drive HIGH for normal device operation.

SHDN Drive LOW to shutdown the drivers (high-Z output) and the on- 18 20 -
board power supply.

N.C. No Connect. - 11, 14 -

Table 1. Device Pin Description

Date: 02/27/05 SP3222EB/3232EB True +3.0 to +5.5V RS-232 Transceivers © Copyright 2005 Sipex Corporation

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 EN 1 20 SHDN EN 1 18 SHDN
C1+ 2 19 VCC
C1+ 2 17 VCC
V+ 3 18 GND
V+ 3 16 GND
C1- 4 17 T1OUT
C1- 4 15 T1OUT
C2+ 5 SP3222EB 16 R1IN
C2+ 5 SP3222EB 14 R1IN
C2- 6 15 R1OUT
C2- 6 13 R1OUT
V- 7 14 N.C.
V- 7 12 T1IN
T2OUT 8 13 T1IN
T2OUT 8 11 T2IN
R2IN 9 12 T2IN
R2IN 9 10 R2OUT
R2OUT 10 11 N.C.

DIP/SO
SSOP/TSSOP
Figure 6. Pinout Configurations for the SP3222EB

C1+ 1 16 VCC
V+ 2 15 GND
C1- 3 14 T1OUT
C2+ 4 SP3232EB 13 R1IN

C2- 5 12 R1OUT
V- 6 11 T1IN

T2OUT 7 10 T2IN
R2IN 8 9 R2OUT

Figure 7. Pinout Configuration for the SP3232EB

Date:02/27/05 SP3222EB/3232EB True +3.0 to +5.5V RS-232 Transceivers © Copyright 2005 Sipex Corporation

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 VCC
VCC

+ 19
C5 0.1µF + 17
VCC C5 0.1µF
2 C1+ 3 VCC
+ V+ + 2 C1+ 3
+ V+ +
C1 0.1µF *C3 0.1µF
4 C1- C1 0.1µF *C3 0.1µF
4 C1-
5 C2+ SP3222EB V- 7
5 C2+ SP3222EB 7
+ V-
C2 0.1µF SSOP C4 0.1µF + DIP/SO
TSSOP + C2 0.1µF C4 0.1µF
6 C2- +
6 C2-

13 T1IN T1OUT 17
LOGIC 12 T1IN T1OUT 15
RS-232
INPUTS 12 T2IN T2OUT 8 OUTPUTS LOGIC RS-232
INPUTS 11 T2IN T2OUT 8 OUTPUTS

15 R1OUT R1IN 16
13 R1OUT R1IN 14
LOGIC 5kΩ RS-232
LOGIC 5kΩ RS-232
OUTPUTS INPUTS
10 R2OUT R2IN 9 OUTPUTS INPUTS
10 R2OUT R2IN 9
5kΩ
5kΩ
1 EN 20
SHDN 1 EN 18
SHDN
GND
GND
*can be returned to
18 either VCC or GND *can be returned to
16 either VCC or GND

Figure 8. SP3222EB Typical Operating Circuits

VCC

+ 16
C5 0.1µF
VCC
1 C1+ 2
+ V+ +
C1 0.1µF *C3 0.1µF
3 C1-
4 C2+ SP3232EB V-
6
+
C2 0.1µF C4 0.1µF
5 C2- +

11 T1IN T1OUT 14
LOGIC RS-232
INPUTS 10 T2IN T2OUT 7 OUTPUTS

12 R1OUT R1IN 13

LOGIC 5kΩ RS-232

OUTPUTS INPUTS
9 R2OUT R2IN 8
5kΩ

GND
*can be returned to
15 either VCC or GND

Figure 9. SP3232EB Typical Operating Circuit

Date: 02/27/05 SP3222EB/3232EB True +3.0 to +5.5V RS-232 Transceivers © Copyright 2005 Sipex Corporation

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DESCRIPTION
The drivers can guarantee a data rate of 250kbps
The SP3222EB/3232EB transceivers meet the fully loaded with 3KΩ in parallel with 1000pF,
EIA/TIA-232 and V.28/V.24 communication ensuring compatibility with PC-to-PC commu-
protocols and can be implemented in battery- nication software.
powered, portable, or hand-held applications
such as notebook or palmtop computers. The The slew rate of the driver output is internally
SP3222EB/3232EB devices all feature Sipex's limited to a maximum of 30V/µs in order to
proprietary on-board charge pump circuitry that meet the EIA standards (EIA RS-232D 2.1.7,
generates 2 x VCC for RS-232 voltage levels Paragraph 5). The transition of the loaded
from a single +3.0V to +5.5V power supply. output from HIGH to LOW also meets the
This series is ideal for +3.3V-only systems, monotonicity requirements of the standard.
mixed +3.3V to +5.5V systems, or +5.0V-only
systems that require true RS-232 performance. Figure 10 shows a loopback test circuit used to
The SP3222EB/3232EB series have drivers that the RS-232 drivers. Figure 11 shows the test
operate at a typical data rate of 250kbps fully results of the loopback circuit with all drivers
loaded. active at 120kbps with RS-232 loads in parallel
with 1000pF capacitors. Figure 12 shows the
The SP3222EB and SP3232EB are 2-driver/2- test results where one driver was active at
receiver devices ideal for portable or hand-held 250kbps and all drivers loaded with an RS-232
applications. The SP3222EB features a 1µA receiver in parallel with a 1000pF capacitor. A
shutdown mode that reduces power consump- solid RS-232 data transmission rate of 250kbps
tion and extends battery life in portable systems. provides compatibility with many designs in
Its receivers remain active in shutdown mode, personal computer peripherals and LAN appli-
allowing external devices such as modems to be cations.
monitored using only 1µA supply current.
The SP3222EB driver's output stages are turned
off (tri-state) when the device is in shutdown
THEORY OF OPERATION mode. When the power is off, the SP3222EB
device permits the outputs to be driven up to
The SP3222EB/3232EB series are made up of ±12V. The driver's inputs do not have pull-up
three basic circuit blocks: 1. Drivers, 2. resistors. Designers should connect unused in-
Receivers, and 3. the Sipex proprietary charge puts to VCC or GND.
pump.
In the shutdown mode, the supply current falls
Drivers to less than 1µA, where SHDN = LOW. When
The drivers are inverting level transmitters that the SP3222EB device is shut down, the device's
convert TTL or CMOS logic levels to ±5.0V driver outputs are disabled (tri-stated) and the
EIA/TIA-232 levels inverted relative to the in- charge pumps are turned off with V+ pulled
put logic levels. Typically, the RS-232 output down to VCC and V- pulled to GND. The time
voltage swing is ±5.5V with no load and at least required to exit shutdown is typically 100µs.
±5V minimum fully loaded. The driver outputs Connect SHDN to VCC if the shutdown mode is
are protected against infinite short-circuits to not used.
ground without degradation in reliability. Driver
outputs will meet EIA/TIA-562 levels of ±3.7V
with supply voltages as low as 2.7V.

Date:02/27/05 SP3222EB/3232EB True +3.0 to +5.5V RS-232 Transceivers © Copyright 2005 Sipex Corporation

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 VCC

+
C5 0.1µF
VCC

+ C1+ V+ +
C1 0.1µF C3 0.1µF
C1-
C2+ SP3222EB V-
+ SP3232EB
C2 0.1µF C4 0.1µF
+
C2-

LOGIC TxIN TxOUT

INPUTS

LOGIC RxOUT RxIN

OUTPUTS
5kΩ
EN*
*SHDN VCC

GND

1000pF

* SP3222EB only

Figure 10. SP3222EB/3232EB Driver Loopback Test Circuit

Figure 11. Driver Loopback Test Results at 120kbps Figure 12. Driver Loopback Test Results at 250 kbps

Date: 02/27/05 SP3222EB/3232EB True +3.0 to +5.5V RS-232 Transceivers © Copyright 2005 Sipex Corporation

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Receivers In applications that are sensitive to power-sup-
The receivers convert EIA/TIA-232 levels to ply noise, decouple VCC to ground with a capaci-
TTL or CMOS logic output levels. The tor of the same value as charge-pump capacitor
SP3222EB receivers have an inverting tri-state C1. Physically connect bypass capacitors as
output. These receiver outputs (RxOUT) are tri- close to the IC as possible.
stated when the enable control EN = HIGH. In
the shutdown mode, the receivers can be active The charge pumps operate in a discontinuous
or inactive. EN has no effect on TxOUT. The mode using an internal oscillator. If the output
truth table logic of the SP3222EB driver and voltages are less than a magnitude of 5.5V, the
receiver outputs can be found in Table 2. charge pumps are enabled. If the output voltage
exceed a magnitude of 5.5V, the charge pumps
Since receiver input is usually from a transmis- are disabled. This oscillator controls the four
sion line where long cable lengths and system phases of the voltage shifting. A description of
interference can degrade the signal, the inputs each phase follows.
have a typical hysteresis margin of 300mV. This
ensures that the receiver is virtually immune to Phase 1
noisy transmission lines. Should an input be left — VSS charge storage — During this phase of
unconnected, a 5kΩ pulldown resistor to ground the clock cycle, the positive side of capacitors
will commit the output of the receiver to a HIGH C1 and C2 are initially charged to VCC. Cl+ is
state. then switched to GND and the charge in C1– is
transferred to C2–. Since C2+ is connected to
Charge Pump VCC, the voltage potential across capacitor C2
is now 2 times VCC.
The charge pump is a Sipex–patented design
(5,306,954) and uses a unique approach com- Phase 2
pared to older less–efficient designs. The charge — VSS transfer — Phase two of the clock con-
pump still requires four external capacitors, but nects the negative terminal of C2 to the VSS
uses a four–phase voltage shifting technique to storage capacitor and the positive terminal of C2
attain symmetrical 5.5V power supplies. The to GND. This transfers a negative generated
internal power supply consists of a regulated voltage to C3. This generated voltage is regu-
dual charge pump that provides output voltages lated to a minimum voltage of -5.5V. Simulta-
5.5V regardless of the input voltage (VCC) over neous with the transfer of the voltage to C3, the
the +3.0V to +5.5V range. positive side of capacitor C1 is switched to VCC
and the negative side is connected to GND.
In most circumstances, decoupling the power
supply can be achieved adequately using a 0.1µF Phase 3
bypass capacitor at C5 (refer to Figures 8 and 9). — VDD charge storage — The third phase of the
clock is identical to the first phase — the charge
SHDN EN TxOUT RxOUT transferred in C1 produces –VCC in the negative
terminal of C1, which is applied to the negative
0 0 Tri-state Active side of capacitor C2. Since C2+ is at VCC, the
voltage potential across C2 is 2 times VCC.
0 1 Tri-state Tri-state
1 0 Active Active Phase 4
— VDD transfer — The fourth phase of the clock
1 1 Active Tri-state connects the negative terminal of C2 to GND,
Table 2. SP3222EB Truth Table Logic for Shutdown and transfers this positive generated voltage
and Enable Control across C2 to C4, the VDD storage capacitor.

Date:02/27/05 SP3222EB/3232EB True +3.0 to +5.5V RS-232 Transceivers © Copyright 2005 Sipex Corporation

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This voltage is regulated to +5.5V. At this The simulation is performed by using a test
voltage, the internal oscillator is disabled. Si- model as shown in Figure 18. This method
multaneous with the transfer of the voltage to will test the IC’s capability to withstand an
C4, the positive side of capacitor C1 is switched ESD transient during normal handling such as
to VCC and the negative side is connected to in manufacturing areas where the ICs tend to
GND, allowing the charge pump cycle to begin be handled frequently.
again. The charge pump cycle will continue as
long as the operational conditions for the inter- The IEC-1000-4-2, formerly IEC801-2, is
nal oscillator are present. generally used for testing ESD on equipment
and systems. For system manufacturers, they
Since both V+ and V– are separately generated must guarantee a certain amount of ESD
from VCC; in a no–load condition V+ and V– will protection since the system itself is exposed to
be symmetrical. Older charge pump approaches the outside environment and human presence.
that generate V– from V+ will show a decrease in The premise with IEC1000-4-2 is that the
the magnitude of V– compared to V+ due to the system is required to withstand an amount of
inherent inefficiencies in the design. static electricity when ESD is applied to points
and surfaces of the equipment that are
The clock rate for the charge pump typically accessible to personnel during normal usage.
operates at 250kHz. The external capacitors can The transceiver IC receives most of the ESD
be as low as 0.1µF with a 16V breakdown current when the ESD source is applied to the
voltage rating. connector pins. The test circuit for IEC1000-4-2
is shown on Figure 19. There are two methods
ESD Tolerance within IEC1000-4-2, the Air Discharge method
and the Contact Discharge method.
The SP3222EB/3232EB series incorporates
ruggedized ESD cells on all driver output and With the Air Discharge Method, an ESD
receiver input pins. The ESD structure is voltage is applied to the equipment under
improved over our previous family for more test (EUT) through air. This simulates an
rugged applications and environments sensitive electrically charged person ready to connect a
to electrostatic discharges and associated cable onto the rear of the system only to find
transients. The improved ESD tolerance is at an unpleasant zap just before the person
least ±15kV without damage nor latch-up. touches the back panel. The high energy
potential on the person discharges through
There are different methods of ESD testing an arcing path to the rear panel of the system
applied: before he or she even touches the system. This
a) MIL-STD-883, Method 3015.7 energy, whether discharged directly or through
b) IEC1000-4-2 Air-Discharge air, is predominantly a function of the discharge
c) IEC1000-4-2 Direct Contact current rather than the discharge voltage.
Variables with an air discharge such as
The Human Body Model has been the generally approach speed of the object carrying the ESD
accepted ESD testing method for semiconduc- potential to the system and humidity will tend to
tors. This method is also specified in MIL-STD- change the discharge current. For example, the
883, Method 3015.7 for ESD testing. The premise rise time of the discharge current varies with
of this ESD test is to simulate the human body’s the approach speed.
potential to store electrostatic energy and
discharge it to an integrated circuit.

Date: 02/27/05 SP3222EB/3232EB True +3.0 to +5.5V RS-232 Transceivers © Copyright 2005 Sipex Corporation

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 VCC = +5V

+5V C4
+ – VDD Storage Capacitor
+ +
C1 C2
– – – +
VSS Storage Capacitor
–5V –5V C3

Figure 13. Charge Pump — Phase 1

VCC = +5V

C4
+ – VDD Storage Capacitor
+ +
C1 C2
– – – +
VSS Storage Capacitor
–10V C3

Figure 14. Charge Pump — Phase 2

[ T ]

+6V

a) C2+

GND 1 T

GND 2

b) C2-

T
-6V
Ch1 2.00V Ch2 2.00V M 1.00µs Ch1 5.48V

Figure 15. Charge Pump Waveforms

VCC = +5V

+5V C4
+ – VDD Storage Capacitor
+ +
C1 C2
– – – +
VSS Storage Capacitor
–5V –5V C3

Figure 16. Charge Pump — Phase 3

VCC = +5V

+10V C4
+ – VDD Storage Capacitor
+ +
C1 C2
– – – +
VSS Storage Capacitor
C3

Figure 17. Charge Pump — Phase 4

Date:02/27/05 SP3222EB/3232EB True +3.0 to +5.5V RS-232 Transceivers © Copyright 2005 Sipex Corporation

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 R
RC R
RSS
C

SW1
SW1 SW2
SW2

Device
DC Power C
CSS Under
Source Test

Figure 18. ESD Test Circuit for Human Body Model

The Contact Discharge Method applies the ESD The circuit models in Figures 18 and 19
current directly to the EUT. This method was represent the typical ESD testing circuits used
devised to reduce the unpredictability of the for all three methods. The CS is initially charged
ESD arc. The discharge current rise time is with the DC power supply when the first
constant since the energy is directly transferred switch (SW1) is on. Now that the capacitor is
without the air-gap arc. In situations such as charged, the second switch (SW2) is on while
hand held systems, the ESD charge can be SW1 switches off. The voltage stored in the
directly discharged to the equipment from a capacitor is then applied through RS, the current
person already holding the equipment. The limiting resistor, onto the device under test
current is transferred on to the keypad or the (DUT). In ESD tests, the SW2 switch is pulsed
serial port of the equipment directly and then so that the device under test receives a duration
travels through the PCB and finally to the IC. of voltage.

Contact-Discharge Module

R
RC R
RSS RV
C

SW1
SW1 SW2
SW2

Device
DC Power C
CSS Under
Source Test

RS and RV add up to 330Ω for IEC1000-4-2.

Figure 19. ESD Test Circuit for IEC1000-4-2

Date: 02/27/05 SP3222EB/3232EB True +3.0 to +5.5V RS-232 Transceivers © Copyright 2005 Sipex Corporation

13
For the Human Body Model, the current

I➙
limiting resistor (RS) and the source capacitor
(CS) are 1.5kΩ an 100pF, respectively. For 30A
IEC-1000-4-2, the current limiting resistor (RS)
and the source capacitor (CS) are 330Ω an
150pF, respectively.
15A
The higher CS value and lower RS value in the
IEC1000-4-2 model are more stringent than the
Human Body Model. The larger storage capacitor
injects a higher voltage to the test point when SW2 0A
is switched on. The lower current limiting resistor
increases the current charge onto the test point. t=0ns t➙ t=30ns

Figure 20. ESD Test Waveform for IEC1000-4-2

Device Pin Human Body IEC1000-4-2

Tested Model Air Discharge Direct Contact Level

Driver Outputs ±15kV ±15kV ±8kV 4

Receiver Inputs ±15kV ±15kV ±8kV 4

Table 3. Transceiver ESD Tolerance Levels

Date:02/27/05 SP3222EB/3232EB True +3.0 to +5.5V RS-232 Transceivers © Copyright 2005 Sipex Corporation

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 PACKAGE: PLASTIC SHRINK
SMALL OUTLINE
(SSOP)

E H

A
Ø
A1 L
e B

DIMENSIONS (Inches)
Minimum/Maximum 16–PIN 20–PIN
(mm)
A 0.068/0.078 0.068/0.078
(1.73/1.99) (1.73/1.99)
A1 0.002/0.008 0.002/0.008
(0.05/0.21) (0.05/0.21)
B 0.010/0.015 0.010/0.015
(0.25/0.38) (0.25/0.38)
D 0.239/0.249 0.278/0.289
(6.07/6.33) (7.07/7.33)
E 0.205/0.212 0.205/0.212
(5.20/5.38) (5.20/5.38)
e 0.0256 BSC 0.0256 BSC
(0.65 BSC) (0.65 BSC)
H 0.301/0.311 0.301/0.311
(7.65/7.90) (7.65/7.90)
L 0.022/0.037 0.022/0.037
(0.55/0.95) (0.55/0.95)
Ø 0°/8° 0°/8°
(0°/8°) (0°/8°)

Date: 02/27/05 SP3222EB/3232EB True +3.0 to +5.5V RS-232 Transceivers © Copyright 2005 Sipex Corporation

15
 PACKAGE: PLASTIC
DUAL–IN–LINE
(NARROW)

E1 E

D1 = 0.005" min.
(0.127 min.)
A1 = 0.015" min.
D (0.381min.)

A = 0.210" max.
(5.334 max).
A2 C
L Ø
B1
e = 0.100 BSC B eA = 0.300 BSC
(2.540 BSC) (7.620 BSC)
ALTERNATE
END PINS
(BOTH ENDS)

DIMENSIONS (Inches)
Minimum/Maximum 16–PIN 18–PIN
(mm)
A2 0.115/0.195 0.115/0.195
(2.921/4.953) (2.921/4.953)

B 0.014/0.022 0.014/0.022
(0.356/0.559) (0.356/0.559)

B1 0.045/0.070 0.045/0.070
(1.143/1.778) (1.143/1.778)

C 0.008/0.014 0.008/0.014
(0.203/0.356) (0.203/0.356)

D 0.780/0.800 0.880/0.920
(19.812/20.320) (22.352/23.368)

E 0.300/0.325 0.300/0.325
(7.620/8.255) (7.620/8.255)

E1 0.240/0.280 0.240/0.280
(6.096/7.112) (6.096/7.112)

L 0.115/0.150 0.115/0.150
(2.921/3.810) (2.921/3.810)

Ø 0°/ 15° 0°/ 15°

(0°/15°) (0°/15°)

Date:02/27/05 SP3222EB/3232EB True +3.0 to +5.5V RS-232 Transceivers © Copyright 2005 Sipex Corporation

16
 PACKAGE: PLASTIC
SMALL OUTLINE (SOIC)
(WIDE)

E H

A
Ø
A1 L
e B

DIMENSIONS (Inches)
Minimum/Maximum 16–PIN 18–PIN
(mm)
A 0.090/0.104 0.090/0.104
(2.29/2.649) (2.29/2.649))

A1 0.004/0.012 0.004/0.012
(0.102/0.300) (0.102/0.300)

B 0.013/0.020 0.013/0.020
(0.330/0.508) (0.330/0.508)
D 0.398/0.413 0.447/0.463
(10.10/10.49) (11.35/11.74)
E 0.291/0.299 0.291/0.299
(7.402/7.600) (7.402/7.600)
e 0.050 BSC 0.050 BSC
(1.270 BSC) (1.270 BSC)

H 0.394/0.419 0.394/0.419
(10.00/10.64) (10.00/10.64)

L 0.016/0.050 0.016/0.050
(0.406/1.270) (0.406/1.270)

Ø 0°/8° 0°/8°
(0°/8°) (0°/8°)

Date: 02/27/05 SP3222EB/3232EB True +3.0 to +5.5V RS-232 Transceivers © Copyright 2005 Sipex Corporation

17
 D

Ø1

E/2

E1
E

Gauge Plane
E1/2 L2

Seating Plane Ø1 Ø
L

1 2 3 L1
INDEX AREA b
(D/2 X E1/2) VIEW C
e

TOP VIEW

16 Pin SOIC JEDEC MS-013 (AA) Variation

B SEE VIEW C
SYMBOL MIN NOM MAX
A 2.35 - 2.65
A1 0.1 - 0.3
A2 2.05 - 2.55
b 0.31 - 0.51
c 0.2 - 0.33
D 10.30 BSC A2
A
E 10.30 DSC
E1 7.50 BSC
e 1.27 BSC Seating Plane
L 0.4 - 1.27 A1 SIDE VIEW
L1 1.04 REF
L2 0.25 BSC
ø 0º - 8º
ø1 5º - 15º
b
Note: Dimensions in (mm) WITH PLATING

BASE METAL
SECTION B-B

Date:02/27/05 SP3222EB/3232EB True +3.0 to +5.5V RS-232 Transceivers © Copyright 2005 Sipex Corporation

18
 D

Ø2

E
E1

Seaing Plane Ø3 L
Ø1
L1

1 2 DETAIL A
INDEX AREA
D x E1
2 2

SEE DETAIL “A”

A2 A

Seating Plane
b A1

16 Pin TSSOP JEDEC MO-153 (AB)

Variation
SYMBOL MIN NOM MAX
A - - 1.2
A1 0.05 - 0.15
A2 0.8 1 1.05 b
b 0.19 - 0.3
c 0.09 - 0.2
D 4.9 5 5.1
E 6.40 BSC
E1 4.3 4.4 4.5 C
e 0.65 BSC
Ø1 0º 4º 8º
ø2 12º REF
ø3 12º REF Section B-B
L 0.45 0.6 0.75
L1 1.00 REF

Note: Dimensions in (mm)

Date: 02/27/05 SP3222EB/3232EB True +3.0 to +5.5V RS-232 Transceivers © Copyright 2005 Sipex Corporation

19
 ORDERING INFORMATION
Part Number Temperature Range Package Type
SP3222EBCA .......................................... 0˚C to +70˚C .......................................... 20-Pin SSOP
SP3222EBCA/TR ..................................... 0˚C to +70˚C .......................................... 20-Pin SSOP
SP3222EBCP .......................................... 0˚C to +70˚C ............................................ 18-Pin PDIP
SP3222EBCT ........................................... 0˚C to +70˚C ........................................ 18-Pin WSOIC
SP3222EBCT/TR ..................................... 0˚C to +70˚C ........................................ 18-Pin WSOIC
SP3222EBCY .......................................... 0˚C to +70˚C ........................................ 20-Pin TSSOP
SP3222EBCY/TR ..................................... 0˚C to +70˚C ........................................ 20-Pin TSSOP
SP3222EBEA .......................................... -40˚C to +85˚C ........................................ 20-Pin SSOP
SP3222EBEA/TR .................................... -40˚C to +85˚C ........................................ 20-Pin SSOP
SP3222EBEP .......................................... -40˚C to +85˚C .......................................... 18-Pin PDIP
SP3222EBET .......................................... -40˚C to +85˚C ...................................... 18-Pin WSOIC
SP3222EBET/TR .................................... -40˚C to +85˚C ...................................... 18-Pin WSOIC
SP3222EBEY .......................................... -40˚C to +85˚C ...................................... 20-Pin TSSOP
SP3222EBEY/TR .................................... -40˚C to +85˚C ...................................... 20-Pin TSSOP

SP3232EBCA .......................................... 0˚C to +70˚C .......................................... 16-Pin SSOP

SP3232EBCA/TR ..................................... 0˚C to +70˚C .......................................... 16-Pin SSOP
SP3232EBCP .......................................... 0˚C to +70˚C ............................................ 16-Pin PDIP
SP3232EBCT ........................................... 0˚C to +70˚C ........................................ 16-Pin WSOIC
SP3232EBCT/TR ..................................... 0˚C to +70˚C ........................................ 16-Pin WSOIC
SP3232EBCN .......................................... 0˚C to +70˚C ......................................... 16-Pin nSOIC
SP3232EBCN/TR .................................... 0˚C to +70˚C ......................................... 16-Pin nSOIC
SP3232EBCY .......................................... 0˚C to +70˚C ........................................ 16-Pin TSSOP
SP3232EBCY/TR ..................................... 0˚C to +70˚C ........................................ 16-Pin TSSOP
SP3232EBEA .......................................... -40˚C to +85˚C ........................................ 16-Pin SSOP
SP3232EBEA/TR .................................... -40˚C to +85˚C ........................................ 16-Pin SSOP
SP3232EBEP .......................................... -40˚C to +85˚C .......................................... 16-Pin PDIP
SP3232EBET .......................................... -40˚C to +85˚C ...................................... 16-Pin WSOIC
SP3232EBET .......................................... -40˚C to +85˚C ...................................... 16-Pin WSOIC
SP3232EBEN ......................................... -40˚C to +85˚C ....................................... 16-Pin nSOIC
SP3232EBEN/TR .................................... -40˚C to +85˚C ....................................... 16-Pin nSOIC
SP3232EBEY .......................................... -40˚C to +85˚C ...................................... 16-Pin TSSOP
SP3232EBEY/TR .................................... -40˚C to +85˚C ...................................... 16-Pin TSSOP
Available in lead free packaging. To order add "-L" suffix to part number.
Example: SP3232EBEN/TR = standard; SP3232EBEN-L/TR = lead free
/TR = Tape and Reel
Pack quantity is 1,500 for WSOIC, SSOP or 20 pin TSSOP and 2,500 for NSOIC or 16 pin TSSOP.

CLICK HERE TO ORDER SAMPLES

Corporation

ANALOG EXCELLENCE
Headquarters and
Sales Office
233 South Hillview Drive
Milpitas, CA 95035
TEL: (408) 934-7500
FAX: (408) 935-7600

Sipex Corporation reserves the right to make changes to any products described herein. Sipex does not assume any liability arising out of the
application or use of any product or circuit described herein; neither does it convey any license under its patent rights nor the rights of others.

Date:02/27/05 SP3222EB/3232EB True +3.0 to +5.5V RS-232 Transceivers © Copyright 2005 Sipex Corporation

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