Emerging Trends in Electronics (22636)

UNIT 2
Recent Electronic Components
Teaching Hrs: 8 Marks 10
Course Outcome- Suggest the relevant components for the emerging application/s.
To attain above course outcome candidate must able to :
a. State features of given component.
b. Explain the advantages of given component.
c. Explain the concept of SMD and soldering method.
Unit focus on following major points:
2.1 Flexible PCB: Features and Applications
2.2 Battery [Li-ion, nuclear] :Concepts and Applications
2.3 Memristor, Organic LED: Concepts, Features and Applications
2.4 Surface Mount Device: Concepts, advantages, Applications and Reflow soldering
method.
Introduction
The electrical and physical characteristics of electronics components and technology govern
electronic circuit features and its applications. Due to advances in material science and new
device fabrication technology, various emerging appliances and circuit designs are possible
to design. Desirable features of electronics components suitable for emerging applications
are

 Miniature size
 Lower power consumption
 Leadless mounting
 Higher operating speed
 Multi-function operation
 Multi- level compatibility
 Higher noise immunity
 Higher operating temperature range
 Least Radiation
 Higher operating frequency
 Reliability
 Higher operating life
 For Display device : Brighter multi color , flexible nature and size
 For battery: Smaller size ,Higher rating , fast charging , maintenance free operation

Modern electronics consumer and industrial systems demand high component density and
multilayer electrical interconnectivity. Introduction of Flexible Printed Circuits (FPC) is
fulfilling the requirements. FPCs offer a number of clear system-level benefits over rigid
Printed Circuit Board (PCB) technology such as Lighter weight, Lower thickness,
Dynamically bendable, Accessible for 3D interconnection assembly, More space saving and
higher freedom on electronic design and mechanical design.
Exponential market growth in mobile electronics such as smart phones, Personal Data
Assistance (PDAs), notebooks and portable wearable gadgets is pushing rigid circuitry
beyond its current limits. Today Flexible printed circuits are found in variety of applications
from automobiles, VCR's, camcorders, portable phones and SLR cameras to sophisticated
military and avionics systems.

Maharashtra State Board of Technical Education 35

Emerging Trends in Electronics (22636)

This chapter will discuss the overview of new generation Flexible Printed Circuits and
Flexible PCB making technology , latest trends in battery , Optical LEDS, concept of the 4th
fundamental electric circuit component named as Memristor and the concept and advantages
of Surface Mount Devices and Reflow soldering method.
2.1 Flexible PCB
Flexible-printed circuit technology has a well-established history that goes back nearly one
hundred years. However, its commercial use is prominently observed within the last few
decades, the advance of electronic systems is evidence of a major digital technology
revolution. Today our homes with cordless phones and digital TVs, cars equipped with
hands-free communications and telematics, and business world with notebook computers and
mobile personal data assistants (PDAs) need to replace costly and increasingly complicated
wired assemblies. This has become possible due to the flexible circuits which offer a much
simpler and more cost-effective interconnection method. Flexible circuits provide enormous
design freedoms for electronic engineers and product designers. As the demands of modern
electronic systems call for increasing functionality, greater circuit density, higher
connectivity, better environmental performance, and all at lower cost, flexible circuitry can be
the ultimate answer for the twenty-first century electronics.
The heart of FPC is the flexible PCBs which comprise films and thin layers of conductive
circuit traces. Basic material elements that constitute a flexible PCB are a dielectric substrate
film (base material), adhesives to bond the various materials together, electrical conductors
(circuit traces), and a protective coatings (cover lay or cover coat). Together the above
materials form a basic flexible-circuit laminate suitable for use as a simple wiring assembly as
shown in Fig 2.1and 2.2

Cover lay

Conductor

Adhesive

Base Substrate

Fig 2.1 Flexible PCB Layer structure

Dielectric substrate film: Commonly used dielectric substrate materials in the form of very
thin films (12–120 microns) are polyester and polyimide. Polyester material is very cheap and
is used for low-cost flexible circuits used in calculators, touch panels, keypads, cameras and
automotive dashboards. Because of its highly flexible nature it is used for the connection
between a notebook PC keyboard and its screen, where thousands of flexing operations are
required. Polyimide material has excellent high temperature characteristics and low thermal
expansion. Therefore it is used for aerospace and defense sector applications where complex
multilayer circuits withstanding around 7000C are required. For very high temperature
applications PEEK (Polyether ether ketone), which is a colour less organic thermoplastic
polymer in the poly aryl ether ketone (PAEK) family is used. PEEK has excellent mechanical
and chemical resistance properties even at high temperatures.
Adhesive: Common adhesive that offers maximum compatibility with the chosen base
material are polyimide and polyester adhesives .Also ‘universal’ adhesives such as acrylics,
epoxies, and phenolics are used. In conjunction with the basic building blocks, appropriate
stiffening materials such as aluminum , steel and moulder polymers are used in the circuitry
to provide solutions to electrical interconnect problems.

Maharashtra State Board of Technical Education 36

Emerging Trends in Electronics (22636)

Conductors: Fine metallic copper foil material is used. Two main types commonly used are
Electrodeposited (ED) copper and rolled-annealed (RA) copper. ED copper foils offer the
industry low-cost circuitry, whereas RA copper foils offer high resistance to continuous
flexing required for circuits in dynamic applications. They are deposited onto the base
substrate, by spraying or sputtering. Other than copper, gold, aluminum, nickel or silver, can
also be used as a conductor.
Protective Coatings (Cover lay): Protective coatings of FPC protect it from moisture,
contamination and abrasion, and also reduce conductor stress during bending. The most
commonly used materials are polyester film coated with polyester adhesive, polyimide film
with acrylic adhesive, and polyimide film with epoxy adhesive. To reduce conductor damage
from frequent bending, the thickness of the cover lay should be the same as the thickness of
the dielectric layer.
2.1.1 Flexible-Circuit Construction
Many of the flexible circuits follow six basic designs.
(1) Single-Sided Flexible Circuits:
Single-sided flexible circuits are the most common types of flexible circuits available. They
consist of a single conductor layer on a flexible dielectric film with access from one side only.
They can be manufactured with or without cover lays and protective coatings, and they have
simple design and are cheap. The conductors used can be conventional metal foil or polymer
thick-film (PTF) ink. Many times a printable conductive ink, loaded with carbon or silver
particle is directly applied to the flexible substrate in the circuit pattern. Such circuits are
useful in applications such as computer printers and disk drives. Nearly all of the world’s
calculators consist of PTF flexible circuits on polyester film
(2) Double Access Flexible Circuits
Double access flexible circuits allow more number of component placing on both sides of the
flexible dielectric film. This often uses punching through-holes in the dielectric film prior to
its lamination with the conductor. Because of the more process steps required to produce
double access circuitry it is not widely used.
(3) Double-Sided Flex Circuits:
The double-sided flexible circuits are also very popular as they incorporate more than a single
conductive layer on the same base film. With double-sided circuits it is necessary to ensure
reliable connectivity paths between components mounted on the top and the bottom of the
board. For this conductive metal staples, pins and rivets techniques are used. The most
popular flexible circuit through-board interconnectivity technique is the plated through hole
(PTH), which is also the most popular approach in the rigid- Printed Circuit Board(PCB) .
These circuits are complex to construct and have high costs, but they meet demands of
designers, manufacturers and consumers for even greater circuit density. Flexible multilayer
circuits are popular within the defense and aerospace sectors where dynamic high-density
circuits are required. However, life span is not more than 25 years.
(4) Sculptured Flex:
In sculptured flex circuits a conductor layer of varying thickness is used. The conductive layer
is etched back to provide thin layers and thicker layers for joining and circuit interconnection.
Such circuits provide improved mechanical strength and rigidity.
(5) Multilayer Flex Circuits: These flexible circuits have three or more layers of conductors.
These circuits are complex to construct and have high costs but they meet demands of
designers, manufacturers and consumers with greater circuit density.
(6) Rigid-Flex Circuits: Rigid-flex circuits (Fig.2.3) are hybrid constructions consisting of
rigid and flexible substrates laminated together. Predominantly, the rigid circuits are used to
house the components, whereas the flexible circuitry provides the necessary interconnects
between them. Like double-sided and multilayer circuits they use PTH interconnects where

Maharashtra State Board of Technical Education 37

Emerging Trends in Electronics (22636)

required. These types of boards are used in the defense electronics circuits for high reliability,
strength and flexibility. They are also used in commercial microelectronics applications such
as laptop computers and notebooks and extensively in the construction of hearing aids.
Applications of Flexible PCB
 Thin and light LED products
 Smart phones and tablet PCs
 Automotive PCB
 Component embedded PCB
 RFID products
 CSP (chip-scale package) technology
 Space Electronics Circuits

Fig 2. 2 Flexible Printed Circuit Board

Fig 2.3 Rigid-Flex Circuit

2.2 Battery [Li-ion, Nuclear]

For the portable DC power many times rechargeable batteries are preferred to non chargeable
battery. Among rechargeable batteries Nickel-Cadmium (Ni-Cd), Nickel Metal Hydride
(NiMH /Ni-MH) and Lithium-ion (Li-ion/ LIB) are the most popular types used
commercially. Following table compares the characteristics of these three types.
(Note: Unlike electronic devices, for batteries, positive electrode is termed as cathode and
negative electrode is termed as anode.)
2.2.1 Li-ion Battery
A Lithium-ion battery is commonly called as Li-ion battery or abbreviated as LIB. It is a
rechargeable electrochemical battery converting chemical energy into electrical energy and
vice
versa.
Table 2.1 Comparative study of rechargeable batteries
Features Nickel-Cadmium(Ni- Nickel Metal Hydride Lithium-ion (Li-ion/
Cd) (NiMH /Ni-MH) LIB)
Cathode Nickel hydroxide Nickel hydroxide Lithium Metal Oxide
Material (Ni (OH) 2) (Ni (OH) 2)

Maharashtra State Board of Technical Education 38

Emerging Trends in Electronics (22636)

Hydrogen
Anode Cadmium hydroxide
absorbing alloy (Metal Graphite
Material (Cd (OH) 2)
Hydride)
Electrolyte Potassium hydroxide Potassium hydroxide Lithium salt, LiPF6 in an
Material (KOH) (KOH) organic solution
Battery
1.2 V 1.2 V 3.5 V
Voltage
Battery cycle
500 cycles 600 cycles 2000+ cycles
count
Memory Effect Good Reduced No
Self Discharge
High (15%-20%) High (20%-30%) Low (5%-10%)
/ month
Toxic Toxic Less Toxic Less Toxic
Cost Less expensive Moderate High Cost
Battery Images

It is getting popularity for portable electronics and electric vehicles, military

and aerospace applications. Li-ion battery is made up of an anode (Negative Electrode),
cathode (Positive Electrode), separator, and electrolyte as shown in Fig.2.4. Most lithium
batteries (Li-ion) used in computer, communication, consumer electronics products use
cathodes (Positive Electrodes) made of lithium compounds, such as lithium cobalt oxide
(LiCoO2), lithium manganese oxide (LiMn2O4) , and lithium nickel oxide (LiNiO2). The
anodes ( Negative Electrodes )are generally made of graphite .

Fig 2.4 Lithium-ion battery

All lithium-ion batteries work in broadly the same way. The anode and cathode store the
lithium. The electrolyte carries positively charged lithium ions from the anode to the
cathode and vice versa through the separator .As shown in Fig.2.5 when the battery is
charging up, the lithium-cobalt oxide, (positive electrode) releases some of its lithium
ions, which move through the electrolyte to the graphite (negative electrode) and remain

Maharashtra State Board of Technical Education 39

Emerging Trends in Electronics (22636)

there. The battery takes in and stores energy during this process. When the battery is
discharging, the lithium ions move back across the electrolyte to the positive electrode,
producing the energy that powers the load. In both charging and discharging cases,
electrons flow in the opposite direction to the ions around the outer circuit. Electrons do
not flow through the electrolyte which is effectively an insulating barrier, so far as
electrons are concerned. Unlike simpler batteries, lithium-ion ones have built
in electronic controllers that regulate how they charge and discharge. They prevent the
overcharging and overheating that can cause lithium-ion batteries to explode in some
circumstances.

Fig 2.5 Charging and Discharging of Li-ion battery

Lithium batteries operate in extremely cold climates or extremely hot climates, are light in
weight and require less maintenance. However, they require protection circuit to maintain
voltage and current within safe limits and are expensive to manufacture. It is about 40 percent
higher in cost than nickel-cadmium.
2.2.2 Nuclear Battery:
Small, compact and smart devices of next generation require new batteries with increased
functionality, reliability and long life. A nuclear battery also called as atomic
battery, tritium battery or radioisotope generator can be the solution for this need.(Fig.2.6)
Nuclear battery is a device which uses energy from the emission of a radioactive isotope to
generate electricity. As half life period of radioactive materials is in terms of decades, it is
capable to provide power for 10 to 20 years. For example, the radioactive isotope, Tritium
isotope, has half life of 12.32 years while Ni-63 isotope has half life of 100 years which shows
that nuclear batteries equipped with theses isotopes can provide electricity for a much longer
periods. This is a unique feature of nuclear battery. These batteries generate electricity
from nuclear energy, but they do not use a chain reaction (chain reaction is normally used in
nuclear reactor to generate electricity from nuclear energy).
Radioactive isotopic material required for the nuclear battery can be obtained from radioactive
waste of the nuclear fission reaction from the nuclear reactor. Thus nuclear batteries can be
also useful for the disposal of waste from the nuclear reactors. These batteries can be the
solution for the bulky chemical batteries which need to be replaced frequently. Nuclear
batteries can work in space as they are not dependent on solar energy; the significant features

Maharashtra State Board of Technical Education 40

 Emerging Trends in Electronics (22636)

of nuclear batteries are its compactness, reliable, light weight and long life. It can work in
space at extremely low and high temperature variation.

Fig.2.6 Nuclear-Diamond Battery developed in Bristol

However, high initial cost of production and observing the regional and country specific laws
regarding use and disposal of radioactive fuels can be a hurdle in its commercial use. These
batteries need to gain social acceptance for its application
Applications:
They are used in space applications due to its compact size and light weight and long lasting
reliable voltage supply independent of atmospheric conditions. Nuclear batteries can be used
in cardiac pacemaker to avoid frequent battery replacement problem for the patients. Nuclear
powered laptop battery can offer long life time with less need of frequent charging.

2.3 Memristor, Organic LED:

2.3.1 Memristor:
For nearly 180 years, circuit theory is studied with three fundamental circuit elements, which
are resistor, capacitor and inductor. They describe the relations between voltage, current,
charge and flux as shown in the Fig 2.7 Resistance relates voltage and current (dv=R*di),
capacitance relates charge and voltage (dq=C*dv) and inductance relates flux and current (dφ
=L*di), respectively and thus connect the three points of the quadrant of Fig.2.7. On the basis
of symmetry, in 1971,Prof. Leon .O. Chua theoretically predicted that there must be a missing
passive element, establishing a relationship between flux(φ) and electric charge (q) , which
completes the 4th point of a quadrant of Fig.2.7. This element was named as Memristor, that
is, resistor with memory (concatenation of Memory Resistor) described with equation dφ = M
* dq. It remembers the charge that has flowed through it or the voltage that was last applied
across it. Symbol of Memristor is as shown in Fig.2.8

Features of Memristor can be summarized as:

 Memristor is essentially a charge dependent resistor and is defined by relation dφ = M dq.
 Memristor is claimed as a fundamental circuit element because no combination of passive
devices can reproduce the properties of a Memristor.

Fig.2.7 Fundamental circuit elements

Maharashtra State Board of Technical Education 41

 Emerging Trends in Electronics (22636)

Fig.2.8 Memristor Symbol

 Prof. Chua proved that Memristor shows non linear relationship between voltage and
current which is exhibited by a hysteretic loop as shown in Fig.2.9.Memristor features
unique properties like memory effect (non volatile nature) and non linearity
 Memristor does not introduce a phase shift between current and voltage at zero crossing i.e.
i=0 only if v=0
.

Fig.2.9 Memristor I-V Characteristics

In 2008, that is after 37 years of the invention of Memristor by Prof. Chua, the first physical
Memristor device was demonstrated by Hewlett Packard (HP) Lab research team in the form
of a sandwich structure of Pt/TiO2/Ti02-x /Pt. HP team successfully correlated the resemblance
of Memristor characteristics with the characteristics of nano scale ReRAM device which they
fabricated (Fig.2.10). This Metal-Insulator-Metal (MIM) structure was termed as Resistive
switching Random Access Memory (ReRAM). Thereafter the terms 'Memristor' and 'ReRAM'
are very often used interchangeably though there is a fine line of demarcation between them.
ReRAM is considered as a subset of Memristor. These devices thereafter are used as switches
in crossbar architectures of Non Volatile Memory (NVM) as shown in Fig.2.11
Such ReRAM has a potential to replace the most popular flash memory which is having more
than 90% share in the semiconductor market, as on today. The ReRAM has highlighting
features such as simple construction, high packaging density, high operation speed, low
operational voltages, high scalability, and multibit storage potential. ReRAM is therefore
getting a considerable attention by industry as well as researchers as a NVM of next
generation.

Fig 2.10 HP ReRAM I-V characteristics resembling Memristor

Maharashtra State Board of Technical Education 42

Emerging Trends in Electronics (22636)

Fig.2.11. ReRAM used as switches in crossbar architecture of Nonvolatile Memory

Applications:
Memristor devices has widened the application and research novelty in almost all engineering
fields including computational and logic circuits, NVM, artificial intelligence and
neuromorphic systems as seen from Fig.2.12. Memristor have been used for different digital
logic applications like flip flop, logic gates and FPGA (Field Programmable Gate Array) with
a crossbar array of Memristors. This improves the performance of analog circuits with
reduced area and added functionality. Memristors have also been proposed in designing ultra
wideband receivers, adaptive filters, programmable threshold comparators, oscillators,
Schmitt triggers, difference amplifiers, in chaos circuits and also for biometric circuits.
Memristor can contribute significant advancements in the field of neuro morphic computing
because it is found that the dynamics of a Memristor closely resemble those of the synapse in
brain tissue. It is proposed to develop real-time data analysis in neural network and
neuromorphic applications.

Fig.2.12 Versatile Application Areas of Memristor

2.3.2 Organic LED:

Organic light-emitting diode (OLED) is an advanced display technology made from thin
films of light emitting organic materials. OLEDS are made by placing a series of thin films,
one emissive layer and one conducting layer between two electrodes (Metallic cathode and
Transparent anode), as shown in the Fig 2.13. When electrical current is applied (Fig.2.13 (a-
c), electrons in the cathode region are pushed towards emissive layer and holes in the anode
region towards the conductive layer. When the electrons and holes combine, a bright light is
emitted (Fig.2.13 (d)). This is the basic working principle of OLED.
Features and Applications:
Currently OLED displays are made by evaporating gases in a vacuum chamber but in future
they can be made by ink jet printing which is a very fast and cost effective method. OLED

Maharashtra State Board of Technical Education 43

Emerging Trends in Electronics (22636)

displays are simpler than LCD because they do not require backlight or filtering. They provide
better contrast, higher brightness, fast refresh rates (necessary for gaming and VR), lower
power consumption and simple design which enables ultra thin, flexible, foldable and
transparent displays . Currently all leading companies manufacturing smart phone, wearable
smart watches and gadget , VR/AR headsets, TV Displays, computer monitors, handheld
game consoles and PDAs are using OLEDS. The flexible OLED displays are opening the
possibility of roll able TV and stretchable displays. (Fig. 2.14 and 2.15)
A b

C d

Fig.2.13 ( a to d) Working Principle and operation of OLED

Fig. 2.14 Prototype OLED lighting Fig.2.15. Prototype flexible display (4.1")
panels

2.4 Surface Mount Device:

A surface-mount device (SMD) is an electronic device whose components are directly placed
or mounted onto the surface of the PCB. The technology or method for producing electronic
circuits using SMD is called Surface-mount technology (SMT). It has largely replaced
the through-hole technology (THT) especially in devices that need to be small or flat. With
SMT both sides of a PCB can be used when required. SMD components can be smaller than
THT components since they can have either smaller leads or no leads at all.(Fig. 2.16) This
makes it easier to shrink the components down.

Maharashtra State Board of Technical Education 44

Emerging Trends in Electronics (22636)

Fig.2.16 Surface Mount Technology

SMT process consists of 5 steps :

(1) Printing: PCB stencil is aligned on the surface of the boards and solder paste is applied to
ensure that the pads are coated with a uniform and controlled amount of solder paste. The
machine used is called screen printer or solder paste printer.
(2) Mounting : The surface mount components are accurately placed onto the pads with the
help of pick and place machines, as shown in Figure 2.17 . This machine is also called as chip
mounter or chip shooter machine. The wet solder paste applied during this process acts as a
temporary adhesive. However, it is important to ensure that the boards are moved gently to
prevent misalignment.
(3) Reflow Soldering : The boards are passed through a reflow oven, as shown in Figure
2.18. It is also called reflow soldering machine or smt reflow oven) which subjects the boards
to infrared radiation after which the solder paste melts and solder joints are formed.
(4) AOI (Automatic Optic Inspection) : AOI Machine runs a number of quality checks for
the boards visually, such as component alignment and checking for solder bridges. The boards
then proceed to further testing.
(5) Testing: PCBs are tested for the desired operation and performance

Fig.2.17 Assembly line with SMT placement equipment

Fig 2.18 Commercial reflow oven

Advantages of SMT over the older through-hole technique:

[1] Smaller components.
[2] Much higher component density Components can be placed on both sides of the circuit
board.

Maharashtra State Board of Technical Education 45

Emerging Trends in Electronics (22636)

[3] Higher density of connections because holes do not block routing space on inner
layers, nor on back-side layers if components are mounted on only one side of the
PCB.
[4] Accurate placing of components
[5] Better mechanical performance under shock and vibration conditions
[6] Fewer holes need to be drilled which is time-consuming and expensive.
[7] Lower initial cost and time of setting up for mass production, using automated
equipment.
[8] Simpler and faster automated assembly. Some placement machines are capable of
placing more than 136,000 components per hour.
[9] Many SMT parts cost less than equivalent through-hole parts.
Disadvantages of SMT
[1] As the device complexity increases, the heat generated by operation increases. If the
heat is not removed, the temperature of the device rises shortening the operational life.
[2] SMT is unsuitable for some parts such as transformers, heat-sinked power
semiconductors, physically large capacitors, fuses, connectors
[3] SMDs' solder connections may be damaged after going through thermal cycling.

Resources

1. https://www.youtube.com/watch?v=C-2ysGoCRoo
https://www.electronics-notes.com/articles/electronic_components/surface-mount-
2.
technology-smd-smt/what-is-smt-primer-tutorial.php
3. https://www.explainthatstuff.com/how-lithium-ion-batteries-work.html
4. https://en.wikipedia.org/wiki/Memristor
5. https://nanohub.org › resources › memristor

Sample Questions
Sr.
Question
No.
1. Statement 1: In Li-ion batteries, lithium ions move from the negative electrode
to the positive electrode during discharge. Statement 2: In Li-ion batteries
lithium ions move from the positive electrode to the negative electrode during
charging.
Select correct option for above statement
A. Statement 1 is true but statement 2 is false
B. Statement 2 is true but statement 1 is false
C. Both statements are true
D. Both statements are false
2. In Li-ion battery, the ____________ is/are lithium ion based
A. Positive electrode
B. Negative electrode
C. Positive and negative electrode
D. Electrolyte

Maharashtra State Board of Technical Education 46

Emerging Trends in Electronics (22636)

3. A nuclear battery is a device which uses energy from the ________ to generate
electricity.
A. Hydrocarbon
B. Hydrogen
C. Emission of radioactive isotopes
D. chain reaction of radioactive element
4. Compared to other batteries, nuclear batteries are very ______, but have an
extremely ____ and high energy density
A. Cheap, long life
B. Costly, long life
C. Cheap, short life
D. Costly, short life
5. Surface-mount technology (SMT) is a method for producing ____ in which the
components are mounted or placed directly onto the surface of ______
A. Electric circuit, electric board
B. Electronic circuit, printed circuit board
C. Pneumatic circuit, pneumatic bench
D. Instrumentation circuit, control panel
6. OLED stands for ______
A. Organic Light emitting display.
B. Optical Light emitting display.
C. Organic Light emitting diode.
D. Optical Light emitting diode.
7. In OLED, at least one of the electrode is _______
A. Reactive
B. Transparent
C. Passive
D. Idle
8. OLEDs are used to create digital display in devices such as _______
A. Only TV screens
B. Only smart phones
C. Only computer monitors
D. All of above
9. Statement 1: An OLED display works without a backlight
Statement 2: Because OLED emits visible light.
Select correct option for above statement
A. Statement 1 is true but statement 2 is false
B. Statement 2 is true but statement 1 is false
C. Both statements are true
D. Both statements are false
10. Memristor is defined by relation ______
A. dφ = M*dq.
B. dq=C*dv.
C. dφ =L*di.
D. dv=R*di.

Maharashtra State Board of Technical Education 47

Emerging Trends in Electronics (22636)

11. The surface mount components are accurately placed onto the pads with the
help of ____________
A. Pick and place machine.
B. Manually.
C. Reflow Machine.
D. Printing Machine.
12. Desirable feature of electronics components suitable for emerging
applications is __________
A. Higher power consumption.
B. Miniature size.
C. Lower operation speed.
D. Low operating frequency.
13. _______allow more number of components placing on both sides of the
flexible dielectric film
A. Single sided flexible circuits
B. Single mounted flexible circuits
C. Double access flexible circuits
D. Sculptured Flex circuits.
14. Memristor features unique properties like _______ and _______.
A. Nonvolatile nature, linearity.
B. Volatile nature, non-linearity.
C. Volatile nature, linearity.
D. Nonvolatile nature, non-linearity.
15. _______is considered as a subset of Memristor
A. ROM
B. ReRAM
C. Static RAM
D. DRAM
16. Hysteresis loop and ______ phase shift between current and voltage, at _____
are the significant features of Memristor.
A. 0-degree, zero crossing
B. 90-degree, zero crossing
C. 45 degree, non-zero crossing
D. 180 degree, non-zero crossing
17. Memristor shows ________ relationship between voltage and current.
A. Linear
B. Nonlinear
C. Exponential
D. logarithmic
18. Currently OLED displays are made by ____________.
A. Evaporating gases in a vacuum chamber.
B. Evaporating liquid in a vacuum chamber.
C. Evaporating solid in a vacuum chamber.
D. Anodization.
19. OLED displays are simpler than LCD because they do not require ________
or ________.
A. Power, filtering.
B. Power, diffusing.
C. Backlight, diffusing.
D. Backlight, filtering.

Maharashtra State Board of Technical Education 48

Emerging Trends in Electronics (22636)

20. In the cover lay of FPC, to reduce conductor damage from frequent bending,
the thickness of the cover lay should be ______
A. Same as the thickness of the dielectric layer.
B. more than the thickness of the dielectric layer
C. less than the thickness of the dielectric layer
D. Independent of the thickness of the dielectric layer

Maharashtra State Board of Technical Education 49