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CLL251 Tutorial 3

The document presents a tutorial with multiple problems related to heat transfer in rods, circuit boards, and fins. It includes calculations for temperature distributions, heat losses, and the design of finned surfaces to prevent overheating. Additionally, it seeks to derive relations for fin efficiency based on various geometries and conditions.

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Maan Soni
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0% found this document useful (0 votes)
73 views1 page

CLL251 Tutorial 3

The document presents a tutorial with multiple problems related to heat transfer in rods, circuit boards, and fins. It includes calculations for temperature distributions, heat losses, and the design of finned surfaces to prevent overheating. Additionally, it seeks to derive relations for fin efficiency based on various geometries and conditions.

Uploaded by

Maan Soni
Copyright
© © All Rights Reserved
We take content rights seriously. If you suspect this is your content, claim it here.
Available Formats
Download as PDF, TXT or read online on Scribd
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CLL251 Tutorial 3

1. A very long rod 5 mm in diameter has one end maintained at 100 °C. The surface of the rod is
exposed to ambient air at 25°C with a convection heat transfer coefficient of 100 W/m2K.
a) Determine the temperature distributions along rods constructed from pure copper, 2024
aluminum alloy, and type AISI 316 stainless steels. What are the corresponding heat losses
from the rods?
b) Estimate how long the rods must be for the assumption of infinite length to yield an accurate
estimate of the heat loss.
Given: Copper: k = 398W/m∙K, 2024 aluminum : k = 180W/m∙K, 316 stainless steels: k =
14W/m∙K. (Bergman p162)
2. A 1520 cm2 integrated circuit board is to be cooled by attaching 4-cm long aluminum (k = 237
W/m∙K) fins on one side of it (Fig. 2). Each fin has a 2-mm2-mm square cross-section. The
surrounding ambient temperature is 25°C and the convection heat transfer coefficient on each fin
surface is 20 W/m2∙K. To prevent the circuit board from overheating, the upper surface of the
circuit board needs to be at 85°C or cooler. Design a finned surface having the appropriate
number of fins, with an overall effectiveness of 3 that can keep the circuit board surface from
overheating.
3. Steam in a heating system flows through tubes whose outer diameter is D1 = 3 cm and whose
walls are maintained at a temperature of 120°C. Circular aluminum fins (k = 180 W/m · °C) of
outer diameter D2 = 6 cm and constant thickness t = 2 mm are attached to the tube, as shown in
Fig. 3. The space between the fins is 3 mm, and thus there are 200 fins per meter length of the
tube. Heat is transferred to the surrounding air at T = 25°C, with a combined heat transfer
coefficient of h = 60 W/m2 · °C. Determine the increase in heat transfer from the tube per meter
of its length as a result of adding fins.
4. Obtain a relation for the fin efficiency for a fin of constant cross-sectional area Ac, perimeter p,
length L, and thermal conductivity k exposed to convection to a medium at T with a heat transfer
coefficient h. Assume the fins are sufficiently long so that the temperature of the fin at the tip is
nearly T. Take the temperature of the fin at the base to be Tb and neglect heat transfer from the
fin tips. Simplify the relation for (a) a circular fin of diameter D and (b) rectangular fins of
thickness t.

Fig 1 Fig 2 Fig 3

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