ECSS-E-HB-31-01 Part 11A

5 December 2011

Space engineering
Thermal design handbook - Part 11:
Electrical Heating

ECSS Secretariat
ESA-ESTEC
Requirements & Standards Division
Noordwijk, The Netherlands
 ECSS‐E‐HB‐31‐01 Part 11A
5 December 2011

Foreword
This Handbook is one document of the series of ECSS Documents intended to be used as supporting
material for ECSS Standards in space projects and applications. ECSS is a cooperative effort of the
European Space Agency, national space agencies and European industry associations for the purpose
of developing and maintaining common standards.
The material in this Handbook is a collection of data gathered from many projects and technical
journals which provides the reader with description and recommendation on subjects to be
considered when performing the work of Thermal design.
The material for the subjects has been collated from research spanning many years, therefore a subject
may have been revisited or updated by science and industry.
The material is provided as good background on the subjects of thermal design, the reader is
recommended to research whether a subject has been updated further, since the publication of the
material contained herein.

This handbook has been prepared by TEC‐MT/QR division, reviewed by the ECSS Executive
Secretariat and approved by the ECSS Technical Authority.

Disclaimer
ECSS does not provide any warranty whatsoever, whether expressed, implied, or statutory, including,
but not limited to, any warranty of merchantability or fitness for a particular purpose or any warranty
that the contents of the item are error‐free. In no respect shall ECSS incur any liability for any
damages, including, but not limited to, direct, indirect, special, or consequential damages arising out
of, resulting from, or in any way connected to the use of this document, whether or not based upon
warranty, business agreement, tort, or otherwise; whether or not injury was sustained by persons or
property or otherwise; and whether or not loss was sustained from, or arose out of, the results of, the
item, or any services that may be provided by ECSS.

Published by: ESA Requirements and Standards Division

ESTEC, P.O. Box 299,
2200 AG Noordwijk
The Netherlands
Copyright: 2011 © by the European Space Agency for the members of ECSS

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Table of contents

1 Scope.......................................................................................................................6

2 References ..............................................................................................................7

3 Terms, definitions and symbols............................................................................8

3.1 Terms and definitions ................................................................................................. 8
3.2 Symbols...................................................................................................................... 8

4 Electrical heating..................................................................................................10
4.1 General..................................................................................................................... 10
4.1.1 Conductive element.................................................................................... 10
4.1.2 Electrical terminations ................................................................................ 10
4.1.3 Electrical insulation..................................................................................... 11
4.1.4 Outgassing ................................................................................................. 12
4.2 Space applications ................................................................................................... 13
4.2.1 Viking spacecraft ........................................................................................ 13
4.2.2 Fltsatcom spacecraft .................................................................................. 13
4.2.3 OTS ............................................................................................................ 13
4.2.4 SPOT.......................................................................................................... 14
4.2.5 Miscellaneous utilization............................................................................. 14
4.3 Power requirement estimation.................................................................................. 14
4.3.1 Simplification assumptions ......................................................................... 15
4.3.2 Conduction losses ...................................................................................... 15
4.3.3 Radiation losses ......................................................................................... 15
4.3.4 Process heat requirements......................................................................... 15
4.3.5 Operating heat requirements...................................................................... 15
4.3.6 Warm-up heat requirements....................................................................... 16
4.4 Regulation of electrical heaters ................................................................................ 16
4.4.1 Temperature sensor ................................................................................... 17
4.4.2 Temperature controller ............................................................................... 17
4.5 Existing systems....................................................................................................... 18
4.5.1 Minco Products Inc. .................................................................................... 18

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4.5.2 Isopad Limited ............................................................................................ 27

5 Electrical cooling..................................................................................................34
5.1 General..................................................................................................................... 34
5.1.1 Description.................................................................................................. 34
5.1.2 Advantages of use...................................................................................... 34
5.1.3 Physical phenomena .................................................................................. 34
5.1.4 Multi-stage thermoelectric devices ............................................................. 35
5.1.5 Heat dissipation .......................................................................................... 36
5.1.6 Performance characteristics ....................................................................... 37
5.2 Theory ...................................................................................................................... 38
5.2.1 Seebeck effect............................................................................................ 38
5.2.2 Peltier effect................................................................................................ 39
5.2.3 Thomson effect........................................................................................... 39
5.2.4 Joule effect ................................................................................................. 39
5.2.5 Fourier effect .............................................................................................. 39
5.3 Space applications ................................................................................................... 39
5.3.1 Electro-optics applications.......................................................................... 40
5.3.2 Fluid refrigeration........................................................................................ 40
5.3.3 Cooling of electronic equipment ................................................................. 41
5.4 Existing systems....................................................................................................... 41
5.4.2 Marlow Industries, Inc................................................................................. 41
5.4.3 Melcor......................................................................................................... 44

Bibliography.............................................................................................................48

Figures
Figure 4-1: Temperature range of thermofoil heaters depending on insulation. From
MINCO (1989a) [6]. a) Kapton/FEP, b) Kapton/FEP Al backing, c) Nomex,
d) Silicone Rubber, e) Mica, f) Kapton/WA, g) Polyimide Glass, h)
Polyester, i) Scrim................................................................................................ 12
Figure 4-2: Outgassing in a vacuum environment. Weight loss versus time.
Temperature 473 K, pressure 4 x 104 Pa, preconditioning 50 % RH. From
MINCO (1973) [5]. : Cross-linked polyalkane; : Silicone
rubber, MIL-W-16878/7; : MIL-W-81044/1; : Kapton, Type HF. ..... 13
Figure 4-3: On/Off control. Temperature versus Time. From MINCO (1989a) [6].................. 17
Figure 4-4: Simple proportional control. Temperature versus Time. From MINCO
(1989a) [6]. .......................................................................................................... 18
Figure 4-5: Pattem of MINCO Standard. Thermofoil heaters. From MINCO (1989a) [6]. ...... 21
Figure 4-6: Pattem of MINCO Mica. Thermofoil heaters. Dimensions in mm. From
MINCO (1989a) [6] .............................................................................................. 21

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Figure 4-7: Pattem of MINCO. Heater Kit HK913. From MINCO (1989a) [6] ......................... 21
Figure 4-8: Clamping attachment of a MINCO Mica. Thermofoil heater. From MINCO
(1989a) [6]. .......................................................................................................... 23
Figure 4-9: Standard ISOPAD products. (a) ISOTAPE, (b) ISOTRACE and (c)
UNITRACE. From ISOPAD (1990) [2]. ................................................................ 32
Figure 5-1: Schematic of a thermoelectric cooling element. From Scott (1974) [10]. ............ 35
Figure 5-2: Schematic of a typical thermoelectric module assembly. Elements
electrically in series and thermally in parallel. From Scott (1974) [10]................. 35
Figure 5-3: Maximum temperature difference versus number of stages in a module.
From MARLOW (1988) [3]................................................................................... 36
Figure 5-4: Temperature distribution through a thermoelectric cooling unit. From Scott
(1974) [10]. .......................................................................................................... 37
Figure 5-5: Temperature difference across a typical thermoelectric cooling unit versus
heat pumped. From Scott (1974) [10].................................................................. 38
Figure 5-6: Spacecraft thermal control using thermoelectric devices (TEDs). From
Chapter & Johnsen (1973) [1].............................................................................. 40
Figure 5-7: MELCOR Thermoelectric Heat Pump Module configurations. From
MELCOR (1987) [4] ............................................................................................. 46

Tables
Table 4-1: Characteristics of MINCO Thermofoil Heaters. From MINCO (1989a) [6] ............ 19
Table 4-2: MINCO Standard Thermofoil Heaters. Kapton, silicone rubber and Nomex
insulations. From MINCO (1989a) [6] .................................................................. 20
Table 4-3: MINCO Standard Thermofoil Heaters. Mica Insulation. From MINCO
(1989a) [6] ........................................................................................................... 20
Table 4-4: Area and Electrical Resistance of the Heaters Contained in Minco Heater Kit
HK913. From MINCO (1989a) [6] ........................................................................ 22
Table 4-5: Characteristics of Adhesives Recommended by MINCO. From MINCO
(1989c) [8]............................................................................................................ 24
Table 4-6: Specifications of MINCO Thermofoil Heaters. From MINCO (1989a) [6].............. 26
Table 4-7: Characteristics of MINCO Lead wires Mounted in Kapton, Nomex and
Silicone Rubber Heaters. From MINCO (1989a) [6] ............................................ 27
Table 4-8: Characteristics of MINCO Lead wires mounted in Mica Heaters. From
MINCO (1989a) [6] .............................................................................................. 27
Table 4-9: Specifications of ISOPAD electrical heaters. From ISOPAD (1990)..................... 29
Table 5-1: Performance characteristics and dimensions of MARLOW Standard
Thermoelectric Coolers. From MARLOW (1988) [3]............................................ 43
Table 5-2: MELCOR Thermoelectric Heat Pump Module Specifications. FC Series.
From MELCOR (1987) [4].................................................................................... 45
Table 5-3: MELCOR Thermoelectric Heat Pump Module Specifications. CP Series.
From MELCOR (1987) [4].................................................................................... 46
Table 5-4: MELCOR Wire Standards. From MELCOR (1987) [4].......................................... 47

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1
Scope

In this Part 11, the use of electrical heaters and electrical coolers in spacecraft systems are described.
Electrical thermal control is an efficient and reliable method for attaining and maintaining
temperatures. Solid state systems provide for flexibility in control of thermal regulation, they are
resistant to shock and vibration and can operate in extreme physical conditions such as high and zero
gravity levels. They are also easy to integrate into spacecraft subsystems.

The Thermal design handbook is published in 16 Parts

ECSS‐E‐HB‐31‐01 Part 1 Thermal design handbook – Part 1: View factors
ECSS‐E‐HB‐31‐01 Part 2 Thermal design handbook – Part 2: Holes, Grooves and Cavities
ECSS‐E‐HB‐31‐01 Part 3 Thermal design handbook – Part 3: Spacecraft Surface Temperature
ECSS‐E‐HB‐31‐01 Part 4 Thermal design handbook – Part 4: Conductive Heat Transfer
ECSS‐E‐HB‐31‐01 Part 5 Thermal design handbook – Part 5: Structural Materials: Metallic and
Composite
ECSS‐E‐HB‐31‐01 Part 6 Thermal design handbook – Part 6: Thermal Control Surfaces
ECSS‐E‐HB‐31‐01 Part 7 Thermal design handbook – Part 7: Insulations
ECSS‐E‐HB‐31‐01 Part 8 Thermal design handbook – Part 8: Heat Pipes
ECSS‐E‐HB‐31‐01 Part 9 Thermal design handbook – Part 9: Radiators
ECSS‐E‐HB‐31‐01 Part 10 Thermal design handbook – Part 10: Phase – Change Capacitors
ECSS‐E‐HB‐31‐01 Part 11 Thermal design handbook – Part 11: Electrical Heating
ECSS‐E‐HB‐31‐01 Part 12 Thermal design handbook – Part 12: Louvers
ECSS‐E‐HB‐31‐01 Part 13 Thermal design handbook – Part 13: Fluid Loops
ECSS‐E‐HB‐31‐01 Part 14 Thermal design handbook – Part 14: Cryogenic Cooling
ECSS‐E‐HB‐31‐01 Part 15 Thermal design handbook – Part 15: Existing Satellites
ECSS‐E‐HB‐31‐01 Part 16 Thermal design handbook – Part 16: Thermal Protection System

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2
References

ECSS‐S‐ST‐00‐01 ECSS System ‐ Glossary of terms

ECSS‐E‐HB‐30‐09 Part 15 Thermal design handbook – Part 15: Existing Satellites

All other references made to publications in this Part are listed, alphabetically, in the Bibliography.

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3
Terms, definitions and symbols

3.1 Terms and definitions

For the purpose of this Standard, the terms and definitions given in ECSS‐S‐ST‐00‐01 apply.

3.2 Symbols
A cross sectional area, [m2]

I electric current, [A]

L length of conductive path, [m]

Q heat transfer rate, [W]

QF fourier effect heat flow, [W]

QJ joule heat flow, [W]

QP peltier effect heat flow, [W]

Qcd conduction loss, [W]

Qo operating heat, [W]

Qp process heat transfer rate, [W]

Qr radiation loss, [W]

Qsl steady state loss, [W]

Qw warm‐up power, [W]

R electrical resistance, []

Ta ambient temperature, [K]

Tf final temperature, [K]

Ti initial temperature, [K]

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Ts heat sink temperature, [K]

V voltage, [V]

W power, [W]

a neat seebeck coefficient for two dissimilar materials,

[W.K1.A1]

cp specific heat, [J.kg1.K1]

h latent heat of fusion or vaporization, [J.kg1]

k thermal conductivity, [W.m1.K1]

m mass of material in each process load, [kg]

qT thomson effect heat flow per unit of conductor length,

[W.m1]

t cycle time for each load, [s]

tw desired warm‐up time, [s]

T difference of temperature between two junctions

formed by dissimilar materials, [K]

VS seebeck effect open circuit potential difference, [V]

 emissivity of heat sink material

 Stefan‐Boltzmann constant = 5,6697 x 108 W.m2.K4

 Thomson coefficient, [W.K1.A1]

Subscripts
c cool

h hot

max maximum

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4
Electrical heating

4.1 General
Reliable long‐term performance of most spacecraft components takes place at a specified temperature
range. The attainment of some temperature range requires, in many instances, the generation of heat
within the spacecraft. This involves simply turning up an electrical, chemical or nuclear heater.
When a local uniform heat source or a profiled heating area is needed, electrical heaters can provide it
efficiently due to their versatility. Some applications are reported later in this clause.
Electrical heaters are based on Ohmʹs and Jouleʹs laws.
Ohmʹs law states that the steady electric current, I, flowing through an electrical conductor is
proportional to the constant voltage, V, and to the reciprocal of the electrical resistance of the
conductor, R:
I = V/R
According to Jouleʹs law, the heat released per unit time, Q, by an electrical current, I, is equal to the
square of the electrical current, multiplied by the electrical resistance, R:
Q = I2R
Three parts can be distinguished in an electrical heater:

4.1.1 Conductive element

Made up by a metal alloy with specific properties depending on the use:
 High‐strength alloys to carry mechanical stress.
 Non‐magnetic materials.
 High temperature‐coefficient alloys for self‐regulated heaters.

4.1.2 Electrical terminations

Depending on the objectives and operating conditions of the heater, the most widely used options are:
Welded leadwire
Crimped leadwire
High‐temperature wire
UL‐approved wire
Solder pads

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Pins and connectors
Plated through‐holes
Integral flex‐circuits
Flat foil leads

4.1.3 Electrical insulation

4.1.3.1 Kapton/FEP insulation

For temperature requirements less than 473 K, heaters constructed of Kapton film and FEP Teflon
have been qualified (NASA S‐311‐79) and flight tested for space. The Kapton film used generally is
0,05 x 103 m thick, with a thermal conductivity of 163 W.m1. It is used either onboard spacecraft or
for simulation purposes in ground experiments. It has good flexibility and light weight; it is chemical
and radiation resistant (to 10 rads) and present low outgassing. See Taylor (1984) [11].
Two types of Kapton laminated heater elements are manufactured:
 Coiled wire is used for resistances up to 620 x 10/m. It withstands severe flexing with
repeated installations and removals, because flexing does not bend the wire as it does to a
printed circuit.
 Printed circuit Kapton/FEP heater is an etched nickel alloy foil with a clear amber
pollyimide insulation. It can be quite complex, with cutouts, void areas, and unusual
shapes. Varied watt densities within the same element can be obtained by controlling the
pattern.
It is the right choice for flat surfaces because heat is more efficiently transferred and, also, the foil
heater can be reproduced with great precision by photographic techniques. This kind of heaters has
been widely used in space applications.
Higher watt densities and greater reliability can be obtained with an aluminium foil backing: it
spreads heat and eliminates hot spots due to voids in mounting adhesives.

4.1.3.2 Other insulations

Electrical heaters working in hard conditions, like temperatures over 473 K, are sheathed in metal.
Alumina insulation is used to encase a spiral‐wound or a straight wire resistance element within the
sheath. Moisture is removed and the enclosure is helium leak tested. Electrical connections are made
through a glass‐to‐metal seal header.
There are other kinds of foil heaters, with different insulations, but their usefulness in space
applications is limited. Nevertheless, they are mentioned here:
 Nomex heaters are used as a low cost alternative to Kapton. It is radiation resistant to 106
rads, but it is not suitable for vacuum.
 Silicone rubber is a fiberglass reinforced elastomer, it may be vulcanized to heat sinks
and it is resistant to many chemicals but it is not suitable for vacuum or radiation. It is
used for commercial and industrial applications because of its low cost and high
temperature rating compared to Kapton.
 Mica heaters are rigid, so they should be factory formed and are clamped to heat sinks
with rigid backing plates, or else their layers will separate during warm‐up. They can be

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used in vacuum after burn in. They can withstand temperatures up to 866 K, and high
watt densities, up to 1705 x 10 W.m1.
 Kapton/WA is a clear amber polyimide film with acrylic adhesive. It is chemical and
radiation resistant, with low outgassing, low cost and high resistance densities. The only
problem is its narrow temperature range that limits applications over 423 K.
 Polyimide glass (Fiberglass reinforced polyimide) heaters have reduced flexibility but
they have a temperature range up to 513 K and a potential for high watt densities.
 Optical grade polyester heaters have an 82 % light transmission and could be mounted in
windows, lenses or between LCD and backlight, in cockpit displays and handheld
terminals, in order to prevent condensation and permit cold weather operation.
 Polyester is a low cost solution for economic fabrication of large heaters.
 Scrim is an open weave fiberglass cloth for lamination inside composite structures.
Temperature range for some insulations, compared to Kapton/FEP, are represented in Figure 4‐1.

Figure 4‐1: Temperature range of thermofoil heaters depending on insulation.

From MINCO (1989a) [6]. a) Kapton/FEP, b) Kapton/FEP Al backing, c) Nomex, d)
Silicone Rubber, e) Mica, f) Kapton/WA, g) Polyimide Glass, h) Polyester, i) Scrim.

4.1.4 Outgassing
Outgassing in a vacuum environment, in terms of weight loss versus time is an important property in
space applications, see Figure 4‐2. Essentially the outgassing products are water, carbon monoxide
and carbon dioxide. Loss weight in Kapton/FEP is very low, about 1 %, and it occurs during the first
few hours of test.

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Figure 4‐2: Outgassing in a vacuum environment. Weight loss versus time.

Temperature 473 K, pressure 4 x 104 Pa, preconditioning 50 % RH. From MINCO
(1973) [5]. : Cross‐linked polyalkane; : Silicone rubber, MIL‐W‐16878/7;
: MIL‐W‐81044/1; : Kapton, Type HF.

4.2 Space applications

Electrical heaters have had a widespread gamut of uses. Some of them are mentioned in this clause.

4.2.1 Viking spacecraft

Thermostatically controlled electric heaters were used in the lander body to:
‐ Maintain the propulsion systems over hydrazine freezing point (275 K) and, at the same time,
maintain the cavity around the lander body at a relatively low temperature to prevent overheating of
the lander internal equipment during the pre‐separation checkout operation.
 Accurate temperature control in critical parts of the biology and gas chromatograph/mass
spectrometer experiments.
 Pyrolyze Martian soil samples.
 Heat external meteorology instruments and semi‐external but insulated cameras.
From Tracey, Morey and Gorman (1978) [12].

4.2.2 Fltsatcom spacecraft

This satellite is essentially a constant power dissipation spacecraft, therefore this dissipation is
produced by the electronic units within the spacecraft and sufficient heaters are provided to substitute
for each component which might be turned off and maintain temperatures above established
minimum levels.
From Reeves (1979) [9].

4.2.3 OTS
Electrical heaters are used as battery heaters, in the Traveling Wave Tube Amplifier as compensation
heaters, and in the hydrazine tank, lines and valves, in order to prevent hydrazine from freezing.
See ECSS‐E‐HB‐31‐01 Part 15, clause 5.

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4.2.4 SPOT
Electrical heaters are used in the thermal control of the satellite platform, propulsion system, batteries
compartment, high‐resolution visible range instruments, and payload telemetry system.
See ECSS‐E‐HB‐31‐01 Part 15, clause 8.

4.2.5 Miscellaneous utilization

 To warm overboard dump valves for liquids (Space Shuttle).
 To keep constant structural temperature on the Space Telescope in order to prevent
optical misalignment.
 To maintain the temperature of sensitive gyroscopes and accelerometer guidance
platforms.
 To control the temperature of pressure transducers, other electronics components, and
infrared reference sources.
 Metal sheathed heaters are used on catalyst beds of hydrazine thruster engines for
spacecraft attitude control.
 To prevent condensation on satellites viewing windows.
 To keep solar panels warm at night.
 As shunt resistors, mounted on the skin of a satellite, to dump excess power of
overcharged batteries which would otherwise overheat delicate instruments.
From Taylor (1984) [11].

4.3 Power requirement estimation

The design of electrical heaters for space presents one important characteristic: limited power makes
calculation of correct wattage become critical.
Calculation and theory cannot substitute for experimentation when accuracy is very important,
because they cannot account for all the variables acting upon the system; nevertheless the value
obtained with the quick estimation procedure that will be described here (MINCO (1989b) [7]), can be
used to obtain a first approximation.
To confirm wattage calculations, a sample heater is placed with the required configuration against an
actual or simulated component with thermocouples mounted. The expected environment is
reproduced and the voltage varied in order to find either heat‐up time or the exact power required for
temperature stabilization.
Finite element analysis can handle many problems which resist theoretical or experimental solutions.
It is able to simulate extremely fast warm‐ups, map thermal gradients across complex shapes, and
determine watt density zones for profiled heaters.
When the warm‐up heat is much greater than the steady state loss (a common situation) a dual
element heater may be a good solution: one high‐power element for warm‐up and a smaller element
for maintenance temperature.

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4.3.1 Simplification assumptions

Heat sink, heater and processed material are at a uniform temperature. This is not strictly true, but it is
sufficient in a first step.
Convection losses are not considered since satellite applications of electrical heaters happen in
vacuum.
For radiant heat transfer, the surrounding environment is a black body at ambient temperature. This is
usually a good assumption in large open areas; however, it may not be so good in a small enclosure.
Approximations are chosen to give values higher than the real one, ensuring that heaters will have
more than sufficient power for the application. Also, a security factor is recommended.

4.3.2 Conduction losses

In electrical heaters, conductive loss generally refers to leakage through insulation layers or heat sink
mounting hardware. Conduction is a function of the temperature difference between the heater and its
surroundings,the distance between hot and cool areas, L, and the cross sectional area, A, and
conductivity, k, of conductive paths. The conduction loss is given by

kATs  Ta 
Qcd  [4‐1]
L

4.3.3 Radiation losses

Radiant leakage varies with the temperature difference between the heater and its surroundings, the
heater surface area, A, and the emissivity of the surfaces radiating and absorbing the heat, . Highly
reflective foils on the heater surface reduce heat leakage. The radiation loss is given by
Qr = A(Ts4Ta4)
where  is the Stefan‐Boltzmann constant.

4.3.4 Process heat requirements

Process heat represents work done by the heater to thermally process (warm, melt or vaporize) some
material, other than the heat sink, for example heating hydrazine lines. The process heat is given by
Qp = (m/t)[cp(TfTi) + h]
where m is the mass processed and t the cycle time for each load.
If the heater merely maintains temperature, the process heat is equal to zero. For continuous processes
m/t can be substituted by the mass flow.

4.3.5 Operating heat requirements

It is equal to the sum of steady state losses and process heat. The steady state loss is given by
Qsl = Qcd + Qr
and, thus, the operating heat is
Qo = Qsl + Qp = Qcd + Qr + Qp .

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4.3.6 Warm-up heat requirements

It is used to bring the heat sink to the final temperature in the desired time, plus extra heat to
compensate for conductive and radiant losses during warm‐up. The warm‐up power is given by

H w T f  Ti 
Qw   H w Ti  Ta  [4‐2]
1  e 

where
Qsl
Hw  [4‐3]
T f  Ta

is the warm‐up coefficient (see MINCO (1989b) [7]), and  is a dimensionless coefficient defined by

H wt w
 [4‐4]
mc p

where tw is the desired warm‐up time.

4.4 Regulation of electrical heaters

Nearly all heated systems have some type of temperature controller. Unregulated heaters can exhibit
large temperature fluctuations when heat demands or ambient temperatures vary.
Often, when the temperature is high, less heating is needed, and when the temperature is low, more is
desirable. Heating power can be made to adjust automatically without complicated controls by
choosing the temperature coefficient of the heating element material. Alloys used in heaters can have
a temperature coefficient of resistance ranging from almost flat to as high as 0,0045 ohms change per
ohm resistance per degree Kelvin (see Taylor (1984) [11]).
Nevertheless the performance of a thermal system is improved by the use of sensors and controllers.
Some of the most significant improvements are the accuracy of the system to maintain the
temperature near the setpoint, the heater life and the power rating.
The thermal switch design, used in the Viking lander body (see clause 4.2.1), could be a good example
of a regulation system. The switch consist of a sensor/actuator and a contactor. As the temperature
inside the lander decreases, the vapor pressure of the Freon in the actuator drops, the piston moves to
one side and the linkage closes the contacts. When the lander temperature increases, the Freon vapor
pressure rises, the piston moves to the other side and the linkage opens the contacts. The actuator has
a double bellows seal to prevent leakage. The contactor has a soft seat to minimize sensitivity to
particulate contamination, and a copper flex foil to provide a high‐conductivity flexible heat transfer
path for the movable contact.

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4.4.1 Temperature sensor

Heater, sensor and heat sink are not at the same temperature. Thermal gradients across the various
components cause delays in response time, and, therefore, there could appear overshoots on warm‐up
and sluggish response to heat demands. In order to minimize these effects, the sensor should be
placed near the heater in static systems and near the heat sink in dynamic systems.
Several positioning options for sensors are commercially offered by manufacturers:
 Wirewound resistance thermometers placed in a window into the foil heating element. Both the
heater and the sensor are more tightly coupled to the heat sink than to each other, however the
sensor is near enough to the heater to prevent overshoot. Resistance thermometers have the
advantage of averaging temperatures over an area.
 Some manufacturers can laminate thermistors or thermocouples inside heater bodies to
measure temperature at a single point.
 Thermal‐Ribbon thermometers can be mounted alongside the foil heater or directly over
the element.

4.4.2 Temperature controller

4.4.2.1 On/off control

This controller cycles the heater about the setpoint by turning power completely on and off (Figure
4‐3). This system is used in thermostats and simple electronic controllers and it has two drawbacks:
 Overshoot on warm‐up or on load changes.
 Temperature never settles to the setpoint.

Figure 4‐3: On/Off control. Temperature versus Time. From MINCO (1989a) [6].

4.4.2.2 Simple proportional control

The heater is supplied at full power until it enters a zone, called the proportional band, where the
controller gradually reduces power until the heater stabilizes at a constant temperature. Unless the
heater is perfectly balanced for a ʺ50% on/50% offʺ duty cycle, its final temperature differs from the
setpoint. This is the system ʺdroopʺ that lies within the proportional band, see Figure 4‐4.

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Figure 4‐4: Simple proportional control. Temperature versus Time. From MINCO
(1989a) [6].

4.4.2.3 PID control

Proportional‐Integral‐Derivative control improves accuracy in two ways (see MINCO (1989a) [6]):
widening the proportional band in relation to the rate of temperature rise to prevent overshoot, and
automatically compensating for droop.

4.5 Existing systems

Data on commercially‐available thermoelectric devices are presented in this clause. Data are arranged
as follows:
1. Manufacturer
2. Commercial Name
3. Standard Insulations
4. General Specifications
5. Shape, Dimensions and Electrical Resistance
6. Attachment
7. Watt densities
8. Leads and/or Wires

4.5.1 Minco Products Inc.

4.5.1.1 Manufacturer
MINCO PRODUCTS, INC.
7300 Commerce Lane
Minneapolis, Minnesota 55432‐3177
U.S.A.
TEL: 612 571‐3121
FAX: 612 571‐0927

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4.5.1.2 Commercial name
Thermofoil Heaters.

4.5.1.3 Standard insulations

Kapton/FEP, silicone rubber, Nomex/Epoxy and mica.

4.5.1.4 General specifications

Table 4‐1 contains thickness, flexibility, dielectric strength and temperature range of Thermofoil
Heaters for the standard insulations.

Table 4‐1: Characteristics of MINCO Thermofoil Heaters. From MINCO (1989a) [6]
Kapton/FEP Silicone Rubber Nomex/Epoxy Mica

Insulation Thickness 2,5/5,1 20,3 2,5/12,7 25,4/50,8

x 105 [m]

Maximum heater 2,54 5,08 4,32 6,35/11,43

thickness over element
x 104 [m]

Heater flexib. Min. bend 7,62 31,75 15,24 RIGID

radius x 104 [m]

Dielectric strength 1000 1000 1000 1000/2000

[V RMS]

Temperature Range [K] 73 to 473 211 to 508 193 to 423 123 to 873

4.5.1.5 Shape, dimensions and electrical resistance

4.5.1.5.1 Standard heaters

MINCO has a great variety of standard electrical heaters that are summarized in Table 4‐2 for Kapton,
silicone rubber and Nomex insulations, and in Table 4‐3 for mica insulation. The standard Thermofoil
heaters have a single uniform element patternedto minimize induction. Only limit values are
presented in those tables, to give an idea about the variety of models.
MINCO standard planform shapes are represented in Figure 4‐5 for Kapton, silicone rubber and
Nomex insulations, and in Figure 4‐6 for mica insulation.

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Table 4‐2: MINCO Standard Thermofoil Heaters. Kapton, silicone rubber and
Nomex insulations. From MINCO (1989a) [6]
Type a Nb Available resistance Effective area
[] x 104 [m2]
min max min max
1 1004 3,3 2341 2,26 948/1120 d
2 117 4,3 630 5,10 379
3 122 4,2 713/1317 c 7,48 664
4 0 ‐‐ ‐‐ ‐‐ ‐‐
5 27 3,6 199/262 c 10,0 17,9/55,5 c
6 192 3,4 1016/1648 d 2,45 735/1006 d
7 72 3,7 168/440 c 9,35 114/1000 d
8 229 4,7 2890 5,61 609/903 d
9 30 7,9 243/280 c 7,87/3,61 c 19
10 53 3,8 200/530 c 7,68/0,97 c 24
11 84 4,2 670 4,19/3,81 c 482
a Types correspond to those sketched in Figure 4‐5.
b Number of heaters quoted in MINCO (1989a) [6].
c Only available with Kapton and Nomex insulations.
d Only available with silicone rubber insulation.

Table 4‐3: MINCO Standard Thermofoil Heaters. Mica Insulation. From MINCO
(1989a) [6]
Type a Nb Available resistance Effective area
[] x 104 [m2]
min max min max
1 14 4,5 106,0 20,6 422,6
2 2 2,0 3,9 7,7 7,7
3 6 11,1 83,4 34,8 377,4
a Types corresponds to those sketched in Figure 4‐6.
b Number of heaters quoted in MINCO (1989a) [6].

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Figure 4‐5: Pattem of MINCO Standard. Thermofoil heaters. From MINCO (1989a)
[6].

Figure 4‐6: Pattem of MINCO Mica. Thermofoil heaters. Dimensions in mm. From
MINCO (1989a) [6]

4.5.1.5.2 Heater kit

The HK913 heater kit (Figure 4‐7 and Table 4‐4) contains 14 heating elements that can be arranged in
over 1000 combinations. #10 PSA (see clause 4.5.1.6) is included for attachment. It have solder pads
instead of lead wires. Insulation is Kapton/FEP and resistance tolerance is ±15%. The complete kit or
individual heaters can be ordered.

Figure 4‐7: Pattem of MINCO. Heater Kit HK913. From MINCO (1989a) [6]

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Table 4‐4: Area and Electrical Resistance of the Heaters Contained in Minco Heater
Kit HK913. From MINCO (1989a) [6]
HEATER a AREA RESISTANCE HEATER a AREA RESISTANCE
x104 [m2] [] x104 [m2] []

A 3,7 40 H 1,3 15
B 7,7 80 J 29,0 275
C 12,0 120 K 36,1 360
D 15,8 160 L 24,2 240
E 23,7 240 M 18,5 180
F 6,7 75 N 12,1 120
G 0,3 5,5 P 6,1 60
a Shapes correspond to those sketched in Figure 4‐7.

4.5.1.5.3 Custom options for thermofoil heaters

 Intricate geometries with different sizes and shapes can be manufactured by MINCO.
 Profiled elements level out temperature gradients by providing extra heat in the zones
where heat loss is greatest.
 Dual layer heaters can be used in order to double resistance densities or effectively cancel
induction with mirror elements.
 Dual voltage heaters, with twin elements, are designed to produce the same heat output
connected in parallel to 115 V or in series to 230 V.
With dual layer elements, resistances up to 465 x 104 .m2 are possible. In single layer elements
resistance are within the following limits (MINCO (1989a) [6]):

Heater type Maximum resistance x 104

[.m2]

Kapton/FEP 69,75

Nomex 69,75

Kapton/WA 232,50

Silicone rubber 31,00

Mica 1,78

Thermal‐Clear (wire) 186,00

4.5.1.6 Attachment
Mounting methods suggested by MINCO are:

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 Clamping: Mica heaters are clamped to heat sinks with rigid backing plates because
unsupported ones can separate during warm‐up. See Figure 4‐8. Other heaters, except silicone
rubber, may also be clamped for higher watt density ratings.

Figure 4‐8: Clamping attachment of a MINCO Mica. Thermofoil heater. From

MINCO (1989a) [6].

Heater assemblies with bolted, welded and crimped backing plates are provided by MINCO.
 Vulcanization: It is used to bond silicone rubber heaters to mating parts without
adhesive. Therefore heat transfer is facilitated, yielding better performance and
reliability.
 Films: This category includes #10 and #12 pressure‐sensitive adhesives (PSAs), factory
applied by MINCO. They present uniform thickness and lack of bubbles. PSAs are easy
to apply, nevertheless they have limited temperature ranges. #14 PSA is an adhesive film
approved for space/vacuum environments, however it requires a relatively high level of
heat and pressure to cure. Ablefilm 550K has a good combination of performance and
ease of application, but it carries a high price.
 Liquid Adhesives: RTVs and epoxies work better than PSAs for curved surfaces and
higher watt ratings; however they can include air bubbles unless given special handling.
Bubbles under the heater cause localized overheating and possible heater burnout.
Special techniques such as drawing a vacuum on the adhesive after mixing, or
perforating heaters between strands, are recommended for critical aerospace
applications. Aluminium backing helps spread heat away from remaining bubbles, and it
is therefore recommended if heaters operate near the upper limit of their watt density
ratings.
 Shrink Bands and Stretch Tape: Shrink bands and stretch tape secure heaters to cylinders.
The adhesive layer between heater and heat sink is eliminated and therefore higher watt
densities are allowed. Shrink bands are pre‐stretched plastic strips with PSA adhesive on
the ends. The band is wrapped around the heater and cylinder and its end is shrunk on
place.
A data summary is included below in Table 4‐5.

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Table 4‐5: Characteristics of Adhesives Recommended by MINCO. From MINCO (1989c) [8]

Insulation
Temperature Thermal Cond. Material a
Name Type Kapton Silicone Nomex Comments
Range [K] [W.m1.K1] Approvals
Rubber

MINCO #10PSA 5,1x105 m Uniform

NASA‐RP‐1061
Film thickness
200 to 373 Yes No Yes 0,23 Low outgassing
Easy to apply
UL recognized
Flat surfaces only

MINCO #12PSA 5,1x105 m Uniform

Film thickness
89 to 477 Yes Yes No 0,13 Easy to apply
Slightly curved
surfaces

MINCO #14PSA 2,54x105 m Uniform

NASA‐RP‐1061
Acrylic Film Film 73 to 422 Yes No Yes 0,13 thickness
Low outgassing
Difficult to apply

ABLEFILM 7,6x105‐ Uniform

550K 20,3x105 m NASA‐RP‐1061 thickness
219 to 423 Yes No 0,79
Film Low outgassing Easy to apply
Expensive

MINCO #6RTV 1 Part NASA‐RP‐1061 High temp.

211 to 508 No Yes No 0,21 capability
Cement Paste UL recognized

GE 566 RTV 2 Part NASA‐RP‐1061 Proper mixing is

Paste 158 to 508 Yes Yes 0,21 Low outgassing essential
MIL‐A‐00509 High temp.

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Insulation
Temperature Thermal Cond. Material a
Name Type Kapton Silicone Nomex Comments
Range [K] [W.m1.K1] Approvals
Rubber

(salt spray) capability

MIL‐A‐8623

MINCO #15 2 Part Easy to use

Epoxy Epoxy NASA‐RP‐1061 disperser
203 to 398 Yes No Yes 0,88
Low outgassing High thermal
conductivity

Crest Resin 3135 2 Part NASA‐RP‐1061 Slightly flexible

78 to 366 Yes No 0,14 Cryogenic rating
Epoxy Low outgassing

Type 3 Mylar Easy to apply

NASA‐RP‐1061
Shrink Band Shrink Removable
200 to 422 Yes Yes Yes N.A. Low outgassing
Band Smooth cylinders
UL recognized
only

Type 4 Kapton Easy to apply

NASA‐RP‐1061
Shrink Band Shrink Removable
200 to 450 Yes Yes Yes N.A. Low outgassing
Band Smooth cylinders
UL recognized
only

MINCO #20 Silicone Easy to apply

Stretch Tape Rubber Removable
222 to 473 Yes Yes Yes N.A.
Tape Smooth cylinders
only
a UL: Underwriters Laboratories.

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4.5.1.7 Watt densities

See Table 4‐6, where the maximum recommended heat output per square meter for different heater
types and attachment methods are presented.

Table 4‐6: Specifications of MINCO Thermofoil Heaters. From MINCO (1989a) [6]
Heater type and Mounting Method Temperature Maximum Watt Density
Range x 103 [W.m2]
[K]
Mica 2,54 x 104 m 123‐873 186,0
5,08 x 104 m 123‐873 139,5
Silicone Vulcanized 211‐508 108,5
Rubber #20 Stretch Tape 211‐473 108,5
#6 RTV Cement 225‐508 65,1
#12 PSA 211‐453 72,8
Kapton #20 Stretch Tape 225‐473 93,0
#3 Shrink Band 211‐423 93,0
#14 Film 73‐423 93,0
#15 Epoxy 203‐398 93,0
#10 PSA Al backing 218‐423 77,5
#10 PSA 213‐373 46,5
Nomex #20 Stretch Tape 228‐423 52,7
#14 Film 193‐423 51,1
#15 Epoxy 208‐398 52,7
#10 PSA 203‐373 40,3

4.5.1.8 Leads and/or wires

Red Teflon insulated lead wires, per MIL‐W‐16878, stranded, are used in Kapton, Nomex and silicone
rubber heaters. See the different types in Table 4‐7.
Mica/glass insulated, stranded nickel‐clad copper, potted at termination with high temperature
cement. See Table 4‐8.

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Table 4‐7: Characteristics of MINCO Lead wires Mounted in Kapton, Nomex and
Silicone Rubber Heaters. From MINCO (1989a) [6]
AWG 30 AWG 26 AWG 24 AWG 20
Current Capacity [A] 3,0 5,0 7,5 13,5
Maximum Heater Kapton/FEP 1,27 1,52 1,65 2,16
Thickness over leads
Silicone Ruber with 1,78 2,03 2,29 3,05
x 103 [m]
PSA

2,16 2,41 2,67 3,43

Nomex/Epoxy 1,65 1,90 2,41 2,92

Table 4‐8: Characteristics of MINCO Lead wires mounted in Mica Heaters. From
MINCO (1989a) [6]
AWG 22 AWG 20 AWG 18
Current Capacity [A] 8,0 9,0 11,0
Maximum Heater Thickness over 2,5 x 104 m Mica 3,81 5,08 5,08
leads
5,1 x 104 m Mica 4,32 5,59 5,59
x 10 [m]

4.5.2 Isopad Limited

4.5.2.1 Manufacturer
ISOPAD LIMITED
Isopad House, Shenley Rd.
Borehamwood, Hertfordshire WD/ 1TE.
England
TEL: 01‐953 6242
FAX: 01‐207 5530

4.5.2.2 Commercial name

Isotape: Factory terminated tracer.
Isotrace: Self limiting tracer.
Unitrace: Cut‐to‐length tracer.

4.5.2.3 Standard insulations

 ISOTAPE: PTFE insulation of thickness 0,4x103 m for use up to 300 V (0,5x103 m for use up to
600 V) plus glass fiber braiding silicone varnished.
 ISOTRACE: Thermoplastic elastomer.
 UNITRACE: Silicone rubber.

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4.5.2.4 General specifications
Trace heaters are primarily to be used in earth facilities, because of supply voltage (110 V or 240 V),
insulation, dimensions and weight. They are thought to be used in industrial pipelines and hazardous
areas.
No data in flexibility and dielectric strength are available. Temperature limits and thickness appear in
Table 4‐9.

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Table 4‐9: Specifications of ISOPAD electrical heaters. From ISOPAD (1990)

Type Reference V W/l R/l Tmin Tmax Thickness Width lmax
Name [V] [W/m] [/m] [K] [K] x103 [m] x103[m] x103 [m]

ISOTAPE FTW/SS 240 16 3600 203 493 2,0 6,0 348,0

33 1745
44 1309
48 1200
55 1047
ITW/SS 240 16 3600 203 483 3,0 8,0 108,5
33 1745 443
44 1309 413
55 1047 383
ISOTRACE FSL‐1/13 110 13 931 75
FSL‐1/26 26 465 64
FSL‐2/13 240 13 4431 228 338 5,0 13,0 150
FSL‐2/26 26 2215 128
ISL‐1/10 110 10 1210 233 338 3,5 7,35 100
ISL‐1/20 20 605 7,35 85
ISL‐1/30 30 403 9,5 64
ISL‐2/10 240 10 5760 233 338 3,5 7,35 150
ISL‐2/20 20 2880 7,35 165
ISL‐2/30 30 1920 9,5 130

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Type Reference V W/l R/l Tmin Tmax Thickness Width lmax

Name [V] [W/m] [/m] [K] [K] x103 [m] x103[m] x103 [m]

UNITRACE IVR‐10 240 10 5760 223 423 6,5 11,0 150

IVR‐20 20 2880 403 100
IVR‐30 30 1920 373 70
FZR‐10 240 10 5760 223 453 5,0 15,0 150
FZR‐15 15 3840 432 104
FZR‐30 30 1920 377 72
FZR‐45 45 1280 341 68
FZR‐10 240 10 5760 223 423 5,0 15,0 150
FZR‐15 15 3840 413 104
FZR‐30 30 1920 393 72
FZR‐45 45 1280 353 68
FZR‐60 60 960 313 60

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Materials employed for the different trace heaters are:

 ISOTAPE:
Heating element: Nickel chrome or copper nickel alloys.
Outer covering: Robust 18/8 stainless steel braid type 316.
 ISOTRACE:
Heating element: Self‐limiting conductive core material.
Bus wire: Nickel plated copper wire.
Overbraid: SS ‐ Stainless steel sheath
TC ‐ Tinned copper sheath
NC ‐ Nickel plated copper sheath
Oversheath (optional): Fluoropolymer.
 UNITRACE:
Heating element: Nickel chrome.
Conductors: Copper.
Conductor/element connection: Metallic bond.
Overbraid (optional):SS, TC, NC.

4.5.2.5 Shape, dimensions and electrical resistance

The particular geometry of a trace heater is defined by their width and maximum usable length.
Dimensions and the resistance per unit length appear in Table 4‐9.
Figure 4‐9 represents sections of the different heaters.

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Figure 4‐9: Standard ISOPAD products. (a) ISOTAPE, (b) ISOTRACE and (c)
UNITRACE. From ISOPAD (1990) [2].

Explanation

ISOPAD ISOTRACE UNITRACE

a Glass braid Bus wires Conductors

b PTFE insulation Self limiting heating element Inner sheath

c Element Primary insulation Heating element

d Element spacer Secondary insulation Circuit connection

e Stainless steel braid Outer braid Outer sheath

f Optional over sheath Overbraid

4.5.2.6 Attachment
 ISOTAPE: Fixing tape FT/2 (glass fiber) or FT/3 (aluminium foil).
 ISOTRACE: FT/1 Fixing tape.
 UNITRACE: FT/2 or FT/3 self‐adhesive tape.

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4.5.2.7 Watt densities
See Table 4‐9.

4.5.2.8 Leads and/or wires

See Figure 4‐9 for some examples of standard leads.

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5
Electrical cooling

5.1 General

5.1.1 Description
Thermoelectric coolers (TECs) are solid state devices that work as small heat pumps, obeying the laws
of thermodynamics as do conventional mechanical heat pumps (refrigerators), absorption
refrigerators, and other devices involving the transfer of heat.

5.1.2 Advantages of use

Some of the advantages of using thermoelectric cooling in space applications are:
 Flexible and easy to control thermal regulation system: localized cooling; temperature
control above or below ambient; heating or cooling, depending on current direction; and
precision temperature control to less than 0,05 K.
 Resistant, reliable and easy operation system: maintenance free; solid state reliability;
high resistance to shock and vibration; operation in high‐g levels; no moving parts;
operation in zero gravity; and in any orientation.
 Easy integration with another spacecraftʹs subsystems: DC powered; no gases or
refrigerant required; small, lightweight package; no acoustical noise (vibrations); and no
electrical noise.

5.1.3 Physical phenomena

A thermoelectric cooler consists of a type N and a type P semiconductor of bismuth telluride as shown
in Fig. 5‐1 (Scott (1974) [10]). A junction between these dissimilar semiconductors is formed at the
surface to be cooled and a DC voltage is applied across the other junction at the hot surface where heat
is transferred to the surroundings. The extra electrons in the N type material and the holes left in the P
type material are the carriers that transfer the heat from the cold to the hot junction. The heat is
pumped by virtue of the Peltier effect (see clause 5.2).

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Figure 5‐1: Schematic of a thermoelectric cooling element. From Scott (1974) [10].

Thermoelectric elements are usually connected thermally in parallel and electrically in series to obtain
the required power handling capacity. A drawing of a typical module assembly is shown in Figure
5‐2.

Figure 5‐2: Schematic of a typical thermoelectric module assembly. Elements

electrically in series and thermally in parallel. From Scott (1974) [10].

5.1.4 Multi-stage thermoelectric devices

A multi‐stage cascade is essentially two or more single thermoelectric modules, stacked in series. Each
successive higher temperature stage pumps not only the cold side heat but also the heat dissipated by
the lower temperature modules. Therefore each stage needs more thermoelectric couples than the
colder ones and this is the reason of the pyramid type appearance of the cascade module.
The applied heat load generally determines the maximum temperature difference that can be achieved
by the thermoelectric cooler. However, even with zero heat load, regardless of the amount of power
applied, every module has a theoretical maximum temperature difference. It depends on the number
of stages and the properties of the thermoelectric material, as can be seen in Figure 5‐3.
Using several thermoelectric coolers thermally in parallel it is possible to achieve large cooling
capacities.

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Figure 5‐3: Maximum temperature difference versus number of stages in a module.

From MARLOW (1988) [3].

5.1.5 Heat dissipation

It is necessary to transfer the heat dissipated at the hot side of the TEC to the environment using a heat
sink. The amount of heat dissipated at the hot side consists of the heat pumped from the cold side plus
the input power to the thermoelectric cooler.
The temperature distribution through a TEC is shown in Figure 5‐4. The heat generated by the
electronic component are first conducted through an alumina ceramic insulator and then through a
metal contact which makes the electrical connection between the N and P type semiconductor
materials. In order to conduct this heat, from the component to the cold junction, the component must
be hotter than the junction. The cold junction itself is the coldest point in the thermoelectric cooling
system. Once the heat is pumped to the hot junction, it is conducted through another metal contact,
through another ceramic insulator, and then be transferred to the surroundings by radiation.

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Figure 5‐4: Temperature distribution through a thermoelectric cooling unit. From

Scott (1974) [10].

5.1.6 Performance characteristics

Thermoelectric devices are typically rated by their characteristics at Imax with a hot side temperature
fixed at 300 K. Four performance parameters are used:

Imax: Current which yields the greatest net cooling.

Tmax: Temperature difference across the cooler at Imax with

no applied heat load.

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Qmax: The amount of applied heat load necessary to

suppress the temperature difference across the device
to zero at Imax.

Vmax: Thermoelectric cooler voltage at Imax without heat

load.

The thermoelectric cooler efficiency and the heat pumped increase as the temperature difference
across it decreases, see Figure 5‐5, where the coefficient of performance is defined as the ratio of the
heat pumped from the cold to the hot junction to the power that is supplied to operate the module.

Figure 5‐5: Temperature difference across a typical thermoelectric cooling unit

versus heat pumped. From Scott (1974) [10].

5.2 Theory
The thermoelectric phenomenon is the result of five distinct effects (Seebeck, Peltier, Thomson, Joule
and Fourier) that act concurrently.
The Seebeck, Peltier and Thomson effects are reversible thermodynamic phenomena, whereas the
Joule and Fourier effects are irreversible. See Chapter & Johnson (1973) [1].

5.2.1 Seebeck effect

Thermoelectric power generation is the result of the Seebeck effect. When the two junctions formed by
the dissimilar materials are maintained at different temperatures a voltage is created resulting in the
flow of current. The open circuit potential difference is expressed as:
VS = aT
where a is the Seebeck coefficient.

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5.2.2 Peltier effect

Thermoelectric heat pumping makes use of the phenomenon known as the Peltier effect. Heat
absorbed at the cold junction is pumped to the hot junction at a rate proportional to the carrier current
passing through the circuit:
QP = aTI
where T is the absolute temperature at the junction and I is the electrical current.

5.2.3 Thomson effect

The Thomson effect results in a heating or cooling in a homogeneous conductor when an electrical
current flows in the direction of the temperature gradient. The Thomson effect per unit of conductor
length can be expressed as
qT = IdT/dx
where  is the Thomson coefficient.

5.2.4 Joule effect

The Joule effect represents the heat generated within a conductor when an electrical current flows
along it:
QJ = I2R .

5.2.5 Fourier effect

The conductive heat transfer, as result of the Fourier effect, is given by:
QF = kAdT/dx
where k is the thermal conductivity of the material.

5.3 Space applications

Active thermal control systems for long duration missions of spacecrafts such as satellites, planetary
probes and space stations require an inherently reliable design that can be provided by thermoelectric
heaters, and Peltier effect coolers. One attractive design feature of the thermoelectric modules is their
capability to provide variable heat pumping between a surface and a spacecraft radiator/absorber (see
Figure 5‐6).

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Figure 5‐6: Spacecraft thermal control using thermoelectric devices (TEDs). From
Chapter & Johnsen (1973) [1].

5.3.1 Electro-optics applications

Electro‐optics applications in space include:
 Space Telescope Cameras.
 Laser Gyros for Navigation.
 Thermal Viewers.
 High Resolution CCD Cameras.
 Black Body References.

5.3.2 Fluid refrigeration

Thermoelectric coolers are used in cooling small volumes of air or liquid in space environment:
 Small Forced‐Air Cooling Systems.
 NASA Life Science Environmental Chambers.

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 Inertial Guidance Systems.
 Electronic Enclosures.

5.3.3 Cooling of electronic equipment

Various electronic components can be refrigerated:
 High Speed Integrated Circuits.
 Parametric Amplifiers.
 Avalanche Photo Diodes.
 Vidicon Tubes.

5.4 Existing systems

Data on commercially‐available thermoelectric devices are presented in this clause. Data are arranged
as follows:
1. Manufacturer
2. Commercial Name
3. General Description
4. Standard Models and Specifications
5. Attachment
6. Leads and/or Wires

5.4.2 Marlow Industries, Inc.

5.4.2.1 Manufacturer
Marlow Industries, Inc. Marlow Industries UK

10451 Vista Park Road. P.O. Box 41, Tadworth

Dallas, Texas 75238‐1645 Surrey KT20 6JL

U.S.A. England

TEL: 214 340‐4900 TEL: 0737 833079

FAX: 214 341‐5212 FAX: 0737 833140

5.4.2.2 Commercial name

Thermoelectric Coolers (TECs).

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5.4.2.3 General description
In addition to the Standard Product line, custom design services to meet special requirements are
available.
Special TECs can be optimized with high performance thermoelectric materials for specific operating
temperatures, increased reliability for space applications, and added strength for High‐G
environments. A special telecom grade screening process is also available which includes burn‐in and
rigorous cleaning to minimize contamination in a hermetic package for extended life.
Standard Thermoelectric Coolers may have special options:

Standard Options
Ceramic Material:
A: Aluminium oxide ceramic
B: Beryllium oxide ceramic (Not available on all models.)
Metallization: This digit indicates whether or not full face metallization is desired for solder mounting.
Metallization is not available on all modules, and it no required for mounting with epoxy or the
clamping method.
0 = No metallization
1 = Base only metallized
2 = Both sides metallized

Special Options
00 = Standard, no options.
01 = Pretinned hot side ceramic with 390 K solder.
02 = Pretinned hot and cold side ceramics with 390 K solder.
03 = Pretinned hot side ceramic with 369 K solder.
04 = Pretinned hot and cold side ceramics with 369 K solder.
05 = Thermistor (P/N 2228‐07) mounted on edge of cold ceramic.

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06 = Thermistor (P/N 2228‐07) calibrated and mounted on edge of cold ceramic.
07 = Lapped to ±0,025 x 103 m (Not available on all models.)
08 = Telecom grade, pre‐screening for extended life.

5.4.2.4 Standard models and specifications

In Table 5‐1 the performance characteristics and dimensions for the Standard Thermoelectric Coolers
are presented.

Table 5‐1: Performance characteristics and dimensions of MARLOW Standard

Thermoelectric Coolers. From MARLOW (1988) [3].
Imax Tmax Qmax Vmax Dimensions a x 103 [m]
[A] [K] [W] [V]
A B C D E
0,6 110 0,43 7,0 13,2 17,2 4,1 8,0 8,8
0,7 90‐122 0,31‐0,47 1,9‐5,8 6,6‐11,0 6,6‐17,2 2,2‐4,0 3,3‐4,0 4,3‐11,2
0,9 67 0,8‐4,0 1,3‐6,5 4,1‐6,0 7,1‐29,6 4,1‐6,0 6,1‐27,9 2,2‐3,2
1,0 67‐114 0,3‐4,8 0,4‐8,5 4,0‐13,2 4,0‐17,2 2,0‐13,2 4,0‐13,2 2,4‐8,8
1,2 67‐117 1,0‐2,4 1,3‐5,4 6,6‐11,0 6,9‐9,9 2,5‐8,8 2,5‐6,6 2,2‐7,9
1,3 109‐110 0,33‐0,62 1,9‐3,4 6,6‐8,8 6,6‐8,8 2,5‐4,1 2,5‐4,4 5,4‐5,9
1,4 89‐91 0,39‐1,9 0,8‐4,4 3,9‐24,4 3,9‐6,6 3,2‐24,6 3,2‐4,8 3,8‐4,2
1,5 67 1,3‐2,0 1,3‐2,0 4,1‐6,0 7,1‐7,2 4,1‐6,0 6,0‐6,1 2,2
1,8 65‐122 0,28‐9,2 0,8‐8,0 4,0‐21,7 4,0‐28,3 4,0‐13,2 4,0‐22,2 2,1‐21,4
1,9 84 3,1 3,9 4,8 22,0 5,3 13,2 4,4
3,6 133 0,58 6,3 21,7 28,3 5,2 5,2 20,5
4,0 120 2,7 6,8 21,7 28,2 6,4 10,8 14,3
4,2 67 38,0 14,4 29,7 33,5 29,7 29,7 3,2
4,5 105‐109 5,6 7,3 21,7 28,3 8,1‐8,6 13,0‐31,8 10,9‐14,5
5,0 91 14,0 8,4 29,6 29,6 19,6 19,6 7,4
5,3 67 2,6‐48,0 0,8‐14,4 9,7‐38,1 9,7‐41,9 9,7‐38,1 9,7‐38,1 3,6
5,5 96 1,1 0,8 9,7 9,7 5,2 5,2 7,5
5,6 99 9,6 8,2 29,6 29,6 13,0 13,0 7,4
9,0 67 20,0 3,5 29,5 29,5 29,5 29,5 5,4
11,6 67 25,0 3,5 29,6 29,6 29,6 29,6 4,9
14,0 67 31,0 3,4 29,7 29,7 29,7 29,7 4,5
a A: Base Ceramic Width; B: Base Ceramic Length; C: Top Ceramic Width; D: Top Ceramic Length; E: Cooler
Thickness.

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5.4.2.5 Attachment
Mounting methods include:
 CLAMPING: It has been described in clause 4.5.1.6 for thermoelectric heaters.
 SOLDERING: Using 390 K solder or 369 K solder. Full face metallizationis needed for
solder mounting.
 EPOXY: Hardening epoxy is used for permanent thermal interfaces.
 COMPRESSION: Non‐hardening thermal grease is used for compression thermal
interfaces.

5.4.2.6 Leads and/or wires

Four different headers are available:
 TO‐3: 8 pins, gold plated.
 TO‐37: 6 pins, gold plated.
 Round Plate: 41 x 103 m dia., 6 x 103 m thick, with 4, 6 or 8 insulated terminals, nickel
plated.
 Flat Plate: 54 x 103 m x 35 x 103 m x 3 x 103 m with 2 mounting holes, nickel plated.

5.4.3 Melcor

5.4.3.1 Manufacturer
Materials Electronic Product Corp.
994 Spruce St.
Trenton, NJ 08648
U.S.A.
TEL: 609 393‐4178
FAX: 609 393‐9461

5.4.3.2 Commercial name

FRIGICHIP Thermoelectric Heat Pumps.

5.4.3.3 General description

Thermocouples are constructed of N & P elements of high grade bismuth telluride in form of oriented
polycrystalline ingots. Ingot ends are soldered to copper bus bars interfaced with ceramic plates,
affording good mechanical integrity, high dielectric strength and thermal conductivity. Solid state
construction.
Temperature range: 123 K to 353 K.
Three types of standard options are available:
 Type L: Both hot and cold faces lapped flat.
 Type TT: Both faces metallized and tinned.

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 Type TL: Hybrid, hot face tinned, cold face lapped.
Special heat pump assemblies designed to particular specifications can be supplied, with features such
as integral heat exchangers or multi‐stage cascaded thermoelectric modules with ceramic construction
with solder interfacing between stages.

5.4.3.4 Standard models and specifications

There are two standard series of thermoelectric heat pumps:
 FC series: Miniature modules for use where space and electrical power are limited. Their
performance characteristics and dimensions are presented in Table 5‐2.
 CP series: Larger modules with cooling capacities to 125 W at 60 A, and temperature
differentials up to 70 K. Their performance characteristics and dimensions are given in
Table 5‐3.

Table 5‐2: MELCOR Thermoelectric Heat Pump Module Specifications. FC Series.

From MELCOR (1987) [4]
Imax Tmax Qmax Vmax Na Dimensions b x 103 [m]
[A] [K] [W] [V]
A B C D

0,8 67 0,22‐3,56 0,48‐7,98 4‐66 1,8‐9,9 3,4‐9,1 3,4‐11,5 2,4

1,2 67 0,32‐5,34 0,48‐7,98 4‐66 2,2‐12,3 4,2‐11,3 4,2‐14,4 2,7

1,5 67 0,40‐6,67 0,48‐7,98 4‐66 2,2‐12,3 4,2‐11,3 4,2‐14,4 2,4

2,0 67 0,54‐4,31 0,48‐3,87 4‐32 2,4‐9,3 4,7‐9,3 4,7‐11,6 2,4

a Number of thermocouples in the module.
b See Figure 5‐7 for dimensions definition.

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Table 5‐3: MELCOR Thermoelectric Heat Pump Module Specifications. CP Series.

From MELCOR (1987) [4]
Imax Tmax Qmax Vmax Na Dimensions b x 103 [m]
[A] [K] [W] [V]
A B C D

3,0 67 1,4‐25,7 0,85‐15,4 7‐127 8‐30 8‐30 3,6

3,9 67 1,8‐33,4 0,85‐15,4 7‐127 8‐30 8‐30 3,2

3,9 70 33,4 15,4 127 40 40 4,7

6,0 67 1,2‐51,4 0,36‐15,4 3‐127 5‐40 10‐40 3,8

8,5 65 1,6‐68,8 0,36‐15,4 3‐127 5‐40 10‐40 3,3

9,0 70 43,1 8,60 71 44 44 5,6

14,0 67 2,8‐67,0 0,36‐8,60 3‐71 8‐44 15‐44 4,6

24,0 67 51,8 3,87 32 40 40 5,0

39,0 70 81,5 3,75 31 55 55 5,8

60,0 67 125 3,75 31 55 55 4,9

a Number of thermocouples in the module.
b See Figure 5‐7 for dimensions definition.

Figure 5‐7: MELCOR Thermoelectric Heat Pump Module configurations. From

MELCOR (1987) [4]

5.4.3.5 Attachment
No data available.

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5.4.3.6 Leads and/or wires
Wire standards appear in Table 5‐4.

Table 5‐4: MELCOR Wire Standards. From MELCOR (1987) [4]

Module Type Wire Gauge (AWG) Length x 103 [m] Insulation

FC 0,45‐ALL 32 (SOLID) 50 None

FC 0,6‐ALL 30 (SOLID) 50 None

FC 0,7‐ALL 30 (SOLID) 50 None

CP 1,0‐ALL 24 (STRANDED) 114 PVC

CP 1,4‐ALL 22 (STRANDED) 114 PVC

CP 2‐ALL 18 (STRANDED) 114 PVC

CP 2,8‐ALL 16 (STRANDED) 114 PVC

CP 5‐XX‐10 14 (STRANDED) 114 PVC

CP 5‐XX‐06 12 (STRANDED) 114 PVC

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[3] MARLOW, ʺThermoelectric Productsʺ, Marlow Industries, Inc., Dallas, 1988.
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[8] MINCO, ʺThermofoil Heatersʺ, Bulletin HS‐201, Minneapolis, 1989.
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[11] Taylor, C.H., ʺPrecise Touches of Warmth in Cold Spaceʺ, Aerospace America, Vol. 22,
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[12] Tracey, T.R., Morey, T.F., Gorman, D.N., ʺThermal Design of the Viking Lander Capsuleʺ,
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48