Qs x360830G6

QuickSpecs HP EliteBook x360 830 G6 Notebook PC
Overview
HP EliteBook x360 830 G6 Notebook PC
Left
1. HD and IR Camera (Optional) 7. Glass Clickpad

2. IR camera LEDs (Optional) 8. Smartcard reader (Optional)
3. Internal microphones 9. Volume Up/Down
4. Camera Shutter 10. Vents
5. HD Camera LED 11. Power Button
6. Ambient light sensor (Optional) 12. USB 3.2 Gen 1 charging port
Not all configuration components are available in all regions/countries.

Page 1
c06277916 — DA 16441 — Worldwide — Version 8 — May 27, 2020
Overview
Right
1. Power connector 6. Audio Combo Jack

2. USB 3.2 Gen 1 7. Nano Security Lock Slot (Lock sold separately)
3. HDMI port (Cable not included) 8. SIM card tray1
4. USB Type-C™ with Thunderbolt™ 9. Touch fingerprint sensor (Optional)
5. USB Type-C™ with Thunderbolt™
1. All units have a SIM card stray but units that do not support WWAN are shipped with a non-removable SIM slot plug

Page 2
Overview
At a Glance
• Eye catching, Aluminum x360 design with four usage modes that is 0.66 inches (1.69 cm) thin and with a starting
weight of 2.97 lbs. (1.35 Kg)
• Choice of 8th Generation Intel® Core™ i3, i5, i7 Processors
• Optional ultrabright, ant-glare touch displays with ambient light sensor
• Choice of displays:
- 33.8 cm (13.3") diagonal FHD IPS LED-backlit BrightView touch with Corning® Gorilla® Glass 5, 250 nits, 45% NTSC
- 33.8 cm (13.3") diagonal FHD IPS LED-backlit Anti-Glare glass touch with Corning® Gorilla® Glass 5, 400 nits, 72%
NTSC
with HP Sure View*
- 33.8 cm (13.3") diagonal FHD IPS LED-backlit Anti-Glare glass touch with Corning® Gorilla® Glass 5, 1000 nits, 72%
NTSC with HP Sure View*
• Enterprise grade security with HP Sure Sense, HP SureStart Gen5, HP Privacy Camera, HP Sure View Gen31, HP Sure
Run Gen2, HP Sure Recover Gen22, HP Sure Click, SmartCard Reader2 and Touch Fingerprint reader2
• New optional HP Rechargeable Active Pen2
• Ultimate connectivity with optional Wi-Fi 62, CAT16 4G/LTE WWAN, and Thunderbolt™ Docking (Dock sold
separately)
• Preinstalled with Windows 10 versions or FreeDOS 3.0
• Choice of solid state drives up to 2 TB and DDR4 memory up to 32 GB
• Supports fast charging (50% in 30 minutes) with no impact on battery recharge cycles 3
• Featuring HP Collaboration Keyboard with Clickpad to manage most commonly used conferencing functions with a
single keystroke
• Innovative world-facing third mic improves inbound ambient noise cancellation
• Battery life up to 21 hours5
• Passed MIL-STD 810G testing, plus an additional 120,000 hours of reliability testing through HP's Total Test Process 4
• Instant on/instant off with Modern Connected Standby
1. HP Sure View G3 integrated privacy screen is an optional feature that must be configured at purchase and is designed to
function in landscape orientation.
2. Sold separately or as an optional feature
3. Recharges your battery up to 50% within 30 minutes when the system is off or in standby mode. Power adapter with a
minimum capacity of 65 watts is required. After charging has reached 50% capacity, charging will return to normal. Charging
time may vary +/-10% due to System tolerance.
4. MIL STD 810G testing is not intended to demonstrate fitness for U.S. Department of Defense contract requirements or for
military use. Test results are not a guarantee of future performance under these test conditions. Accidental damage requires
an optional HP Accidental Damage Protection Care Pack.
5. Windows 10 MM14 battery life will vary depending on various factors including product model, configuration, loaded
applications, features, use, wireless functionality, and power management settings. The maximum capacity of the battery
will
naturally decrease with time and usage. See http://www.bapco.com for additional details.
*Touch-enabled display and Sure View privacy panel will lower actual brightness.
NOTE: See important legal disclosures for all listed specs in their respective features sections.

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QuickSpecs
Technical Specifications
PRODUCT NAME
OPERATING SYSTEMS
Preinstalled Windows 10 Pro 641
Windows 10 Pro 64 (National Academic Only)2
Windows 10 Home 641
Windows 10 Home Single Language 641
FreeDOS 3.0
1. Not all features are available in all editions or versions of Windows. Systems may require upgraded and/or separately
purchased hardware, drivers, software or BIOS update to take full advantage of Windows functionality. Windows 10 is
automatically updated, which is always enabled. ISP fees may apply and additional requirements may apply over time for
updates. See http://www.windows.com/
2. Some devices for academic use will automatically be updated to Windows 10 Pro Education with the Windows 10
Anniversary Update. Features vary; see https://aka.ms/ProEducation for Windows 10 Pro Education feature information.
PROCESSORS
Intel® Core™ i3-8145U with Intel® UHD Graphics 620 (2.1 GHz base frequency, up to 3.9 GHz with Intel® Turbo Boost
Technology, 4 MB L3 cache, 2 cores)3,4,5,6
Intel® Core™ i5-8365U vPro™ processor with Intel® UHD Graphics 620 (1.6 GHz base frequency, up to 4.1 GHz with Intel®
Turbo Boost Technology, 6 MB L3 cache, 4 cores) 3,4,5,6
Intel® Core™ i7-8665U vPro™ processor with Intel® UHD Graphics 620 (1.9 GHz base frequency, up to 4.8 GHz with Intel®
Turbo Boost Technology, 8 MB L3 cache, 4 cores) 3,4,5,6
Processor Family
8th Generation Intel® Core™ i7 processor (i3-8145U)6
8th Generation Intel® Core™ i7 processor (i7-8665U and i7-8565U)6
8th Generation Intel® Core™ i5 processor (i5-8365U and i5-8265U)6
3. Multicore is designed to improve performance of certain software products. Not all customers or software applications
will necessarily benefit from use of this technology. Performance and clock frequency will vary depending on application
workload and your hardware and software configurations. Intel’s numbering, branding and/or naming is not a measurement
of higher performance.
4. Processor speed denotes maximum performance mode; processors will run at lower speeds in battery optimization mode.
5. Intel® Turbo Boost performance varies depending on hardware, software and overall system configuration. See
http://www.intel.com/technology/turboboost for more information.
6. In accordance with Microsoft’s support policy, HP does not support the Windows 8 or Windows 7 operating system on
products configured with Intel and AMD 7th generation and forward processors or provide any Windows 8 or Windows 7
drivers on http://www.support.hp.com.

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QuickSpecs
CHIPSET
Chipset is integrated with processor
GRAPHICS
Integrated
Intel® UHD Graphics 6207
Supports
Support HD decode, DX12, HDMI 1.4b8, HDCP 2.2
7. HD content required to view HD images.

8. HDMI cable sold separately.
DISPLAY
Touch
33.8 cm (13.3") diagonal FHD IPS BrightView LED-backlit touch screen with Corning® Gorilla® Glass 5, 250 nits, 45% NTSC
with HD camera (1920 x 1080)7,9,10
with HD camera for WWAN (1920 x 1080)7,9,10
with Ambient Light Sensor and HD IR camera (1920 x 1080) 7,9,10
with Ambient Light Sensor and HD IR camera for WWAN (1920 x 1080)7,9,10
33.8 cm (13.3") diagonal FHD IPS Anti-Glare LED-backlit touch screen with Corning® Gorilla® Glass 5, 400 nits, 72% NTSC
with Ambient Light Sensor and HD IR camera for WWAN (1920 x 1080) 7,9,10
HP Sure View Integrated Privacy Screen 33.8 cm (13.3") diagonal FHD IPS BrightView LED-backlit touch screen with
Corning® Gorilla® Glass 5, 1000 nits, 72% NTSC with Ambient Light Sensor and HD IR webcam (1920 x 1080) 7,9,10,11*
HP Sure View Integrated Privacy Screen 33.8 cm (13.3") diagonal FHD IPS BrightView LED-backlit touch screen with
Corning® Gorilla® Glass 5, 1000 nits, 72% NTSC with Ambient Light Sensor and HD IR webcam for WWAN (1920 x
1080)7,9,10,11*
HP Sure View Integrated Privacy Screen 33.8 cm (13.3") diagonal FHD IPS Anti-Glare LED-backlit touch screen with
Corning® Gorilla® Glass 5, 1000 nits, 72% NTSC with Ambient Light Sensor and HD IR webcam for WWAN (1920 x
1080)7,9,10,11*
HDMI 1.4b
Supports resolution up to 4k @ 30Hz

9. Resolutions are dependent upon monitor capability, and resolution and color depth settings.
10. Sold separately or as an optional feature.
11. HP Sure View G3 integrated privacy screen is an optional feature that must be configured at purchase and
is designed to function in landscape orientation.

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QuickSpecs
Docking station Total number Max. Dock Technical limitations
model of supported resolutions Connectors
displays supported
(Including the
notebook)
display)
Dual 4k (4096 x 2160) only with:
• 1 DP + TB port or
2xDP, 1xVGA, 1xTB,
HP Thunderbolt Dock • USB-C alt mode + TB port
Dual 4K @ 60Hz 1xUSB-C alt-mode
G2 3
Dual 4K (3840 x 2160) with any of the DP,
TB or USB-C alt mode video ports
Dual 2K @
60Hz
HP Elite USB-C Dock G4 3 Single 4K @ 1xHDMI, 2xDP
60Hz (3840 x
1440)
Dual 4K @ 60Hz
HP USB-C Universal Single 5K @
Dock 3 60Hz 2xDP
HP USB-C Travel Single 2K @ 60Hz Single external display

2 1xHDMI, 1xVGA Only HDMI or VGA at the time
Dock
Single 4K @ 30Hz Single external display

HP USB-C Mini Dock 2 1xHDMI, 1xVGA
Only HDMI or VGA at the time
STORAGE AND DRIVES

Primary M.2 Storage
128 GB SATA-3 SS TLC12
256 GB PCIe® NVMe™ SS Value12
256 GB PCIe® Gen3x4 NVMe™ SS TLC12
256 GB SATA-3 SED SS TLC12
256 GB Intel® PCIe® NVMe™ QLC M.2 SSD with 16 GB Intel® Optane™ memory H10 12,13,14
512 GB PCIe® NVMe™ SS Value12
512 GB PCIe® Gen3x4 NVMe™ SS TLC12
512 GB PCIe® Gen3x4 NVMe™ SED SS TLC12
512 GB SATA-3 SS TLC (FIPS 140-2)12
512 GB Intel® PCIe® NVMe™ QLC M.2 SSD with 32 GB Intel® Optane™ memory H10(Planned to be available Q2 2019)12,13,14
1 TB PCIe® Gen3x4 NVMe™ SS TLC12
2 TB PCIe® Gen3x4 NVMe™ SS TLC12
12. For storage drives, GB = 1 billion bytes. TB = 1 trillion bytes. Actual formatted capacity is less. Up to 30 GB (for Windows
10) is reserved for system recovery software.
13. Intel® Optane™ memory system acceleration does not replace or increase the DRAM in your system. Requires 8th Gen or
higher Intel® Core™ processor, BIOS version with Intel® Optane™ supported, Windows 10 64-bit, and an Intel® Rapid
Storage Technology (Intel® RST) driver.
14. Intel® Optane™ memory H10 only for Intel® PCIe® NVMe™ QLC M.2 SSD.

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QuickSpecs
MEMORY
Maximum Memory
32 GB DDR4-2400 SDRAM15
Memory
32 GB DDR4-2400 SDRAM (2 x 16 GB)15
16 GB DDR4-2400 SDRAM (1 x 16 GB) 15
16 GB DDR4-2400 SDRAM (2 x 8 GB) 15
8 GB DDR4-2400 SDRAM (1 x 8 GB) 15
8 GB DDR4-2400 SDRAM (2 x 4 GB) 15
4 GB DDR4-2400 SDRAM (1 x 4 GB) 15
Memory Slots
2 SODIMM
Both slots are upgradeable
System runs at 2400 for Intel® 8th Generation processors
Supports Dual Channel Memory
15. Due to the non-industry standard nature of some third-party memory modules, we recommend HP branded memory to
ensure compatibility. If you mix memory speeds, the system will perform at the lower memory speed.
NETWORKING/COMMUNICATIONS
WLAN
Intel® Wireless-AC 9560 802.11a/b/g/n/ac (2x2) Wi-Fi® and Bluetooth® 5 Combo, vPro™10,16
Intel® Wireless-AC 9560 802.11a/b/g/n/ac (2x2) Wi-Fi® and Bluetooth® 5 Combo, non-vPro™ 10,16
Intel® Wi-Fi 6 AX200 802.11a/b/g/n/ac/ax (2x2) and Bluetooth® 5 Combo, vPro™ 10,20
Intel® Wi-Fi 6 AX200 802.11a/b/g/n/ac/ax (2x2) Bluetooth® 5 Combo, non-vPro™10,20
WWAN
Intel® XMM™ 7262 LTE-Advanced Cat 617
Intel® XMM™ 7360 LTE-Advanced Cat 917
Intel® XMM™ 7560 LTE-Advanced Pro Cat 1619
NFC
NXP NPC300 Near Field Communication Module10
Miracast
Native Miracast Support18

16. Wireless access point and Internet service required and sold separately. Availability of public wireless access points
limited.
17. WWAN module is an optional feature, requires factory configuration and requires separately purchased service contract.
Check with service provider for coverage and availability in your area. Connection speeds will vary due to location,
environment, network conditions, and other factors. 4G LTE not available on all products, in all regions.
18. Miracast is a wireless technology your PC can use to project your screen to TVs, projectors, and streaming.
19. Gigabit class Category 16 4G LTE module is optional and must be configured at the factory. Module designed for up to 1
Gbps download speeds as carriers deploy 5 carrier aggregation and 100Mhz channel bandwidth, requires activation and
separately purchased service contract. Backwards compatible to HSPA 3G technologies. Check with service provider for

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QuickSpecs
coverage and availability in your area. Connection, upload and download speeds will vary due to network, location,
environment, network conditions, and other factors. 4G LTE not available on all products, in all regions.
20. Wireless access point and internet service required and sold separately. Availability of public wireless access points
limited. Wi-Fi 6 is backwards compatible with prior 802.11 specs. The specifications for Wi-Fi 6 (802.11ax) are draft and are
not final. If the final specifications differ from the draft specifications, it may affect the ability of the notebook to
communicate with other 802.11ax devices.
AUDIO/MULTIMEDIA
Audio
Audio by Bang & Olufsen
Integrated 3 Multi Array Microphone
2 Integrated Stereo Speakers (74 Db)
Camera
HD camera7
HD IR camera7
KEYBOARDS/POINTING DEVICES/BUTTONS & FUNCTION KEYS

Keyboard
HP Premium Collaboration Keyboard, backlit and spill resistant with drain
Pointing Device
Clickpad with multi-touch gestures enabled, taps enabled as default
Microsoft Precision Touchpad Default Gestures Support
Function Keys
F1 - Display Switching
F2 - Blank or Privacy
F3 - Brightness Down
F4 - Brightness Up
F5 - Audio Mute
F6 - Volume Down
F7 - Volume Up
F8 - Mic Mute
F9 - Backlit Toggle
F10 - numlk
F11 - Wireless
F12 - Calendar
Share/Present
Call Answer
Call End
Hidden Function Keys

Fn+R - Break
Fn+S - Sys Rq

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QuickSpecs
Fn+C - Scroll Lock
Fn+E - Insert
Fn+W - Pause
SOFTWARE AND SECURITY

Preinstalled Software
BIOS
HP BIOSphere Gen521
HP Drive Lock & Automatic Drive Lock22
BIOS Update via Network
Master Boot Record Security
Power On Authentication
Secure Erase23
Absolute Persistence Module24
Pre-boot Authentication
Software
HP Native Miracast Support25
HP Connection Optimizer
HP Image Assistant
HP Hotkey Support
HP JumpStart
HP Support Assistant26
HP Noise Cancellation Software
Buy Office (Sold separately)
Manageability Features
HP Driver Packs27
HP System Software Manager (SSM)
HP BIOS Config Utility (BCU)
HP Client Catalog
HP Manageability Integration Kit Gen328
HP Cloud Recovery29
Client Security Software

HP Client Security Manager Gen530
HP Fingerprint Sensor31
HP Power On Authentication
Windows Defender32
Security Management
Pre-boot Authentication
TPM 2.0 Embedded Security Chip shipped with Windows 10 (Common Criteria EAL4+ Certified)
SATA 0,1 port disablement (via BIOS)
Serial, USB enable/disable (via BIOS)
Power-on password (via BIOS)
Setup password (via BIOS)
Support for chassis padlocks and cable lock devices
HP Sure Click33
HP Sure Start Gen534
HP Sure Run Gen235
HP Sure Recover Gen236
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QuickSpecs
HP Sure Sense37
TPM
Model: Infineon SLB9670
Version: 7.85
Revision: TPM 2.0
FIPS 140-2 Compliant: Yes
Smartcard Reader
Model number: Alcor AU9560
FIPS 201 Compliant: Yes
IPv6 Compliance
Yes
MD5 Hash: Please follow the instructions below to access MD5 Hash.
Log-on to http://hp.com/support, enter your product name, select software and drivers, select OS,
select driver. After selecting the driver, click on “Associated files” and then click on “Download”. When
opening the file, under “Purpose” you should see the appropriate “SOFTPAQ MD5:” Field
Is the BIOS on this notebook ISO/IEC 19678:2015 (formerly NIST 800-147) compliant?:
Yes
UEFI version: 2.6
21. HP BIOSphere Gen5 is available on select HP Pro and Elite PCs. See product specifications for details. Features may vary
depending on the platform and configurations.
22 HP Automatic Drive Lock is not supported on NVMe drives
23. HP Secure Erase for the methods outlined in the National Institute of Standards and Technology Special Publication 800-
88 "Clear" sanitation method. HP Secure Erase does not support platforms with Intel® Optane™.
24. Absolute agent is shipped turned off, and will be activated when customers activate a purchased subscription.
Subscriptions can be purchased for terms ranging multiple years. Service is limited, check with Absolute for availability
outside the U.S. The Absolute Recovery Guarantee is a limited warranty. Certain conditions apply. For full details visit:
http://www.absolute.com/company/legal/agreements/ computrace-agreement. Data Delete is an optional service provided
by Absolute Software. If utilized, the Recovery Guarantee is null and void. In order to use the Data Delete service, customers
must first sign a Pre-Authorization Agreement and either obtain a PIN or purchase one or more RSA SecurID tokens from
Absolute Software.
25. Miracast is a wireless technology your PC can use to project your screen to TVs, projectors, and streaming.
26. HP Support Assistant requires Windows and Internet access.
27. HP Driver Packs not preinstalled, however available for download at http://www.hp.com/go/clientmanagement.
28. HP Manageability Integration Kit can be downloaded from http://www.hp.com/go/clientmanagement.
29. HP Cloud Recovery is available for HP Elite and Pro desktops and laptops PCs with Intel® or AMD processors and requires
an open, wired network connection. Note: You must back up important files, data, photos, videos, etc. before use to avoid
loss of data. Detail please refer to: https://support.hp.com/us-en/document/c05115630
30. HP Client Security Manager Gen5 requires Windows and is available on the select HP Pro and Elite PCs. See product
specifications for details.
31. HP Fingerprint Sensor sold separately or as an optional feature.
32. Windows Defender Opt in and internet connection required for updates.

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QuickSpecs
33. HP Sure Click is available on select HP platforms and supports Microsoft Internet Explorer, Google Chrome™, and
Chromium™. Supported attachments include Microsoft Office (Word, Excel, PowerPoint) and PDF files in read only mode,
when Microsoft Office or Adobe Acrobat are installed.
34. HP Sure Start Gen5 is available on select HP PCs with Intel processors. See product specifications for availability.
35. HP Sure Run Gen2: See product specifications for availability.
36. HP Sure Recover Gen2: See product specifications for availability. Requires an open, wired network connection. Not
available on platforms with multiple internal storage drives. You must back up important files, data, photos, videos, etc.
before using HP Sure Recover to avoid loss of data. HP Sure Recover (Gen1) does not support platforms with Intel® Optane™.
37. HP Sure Sense requires Windows 10. See product specifications for availability.
POWER
Power Supply
HP Smart 45 W External AC power adapter38
HP Smart 45 W External AC power adapter, 2-prong (Japan only)38
HP Smart 65 W External AC power adapter38
HP Smart 65 W EM External AC power adapter38
HP 45 W USB Type-C™ adapter38
HP 65 W USB Type-C™ adapter38
Primary Battery
HP Long Life 4-cell, 53 Wh Li-ion39
Battery Life
Up to 21 hours (Intel® 8th Generation CPU and 4-cell 53 WHr battery)40
Power Cord
2-wire plug - 1m3
3-wire plug - 1m
3-wire plug - 1.8m
Duckhead power cord - 1 m
Duckhead power cord - 1.8 m
38. Availability may vary by country.

39. Battery is internal and not replaceable by customer. Serviceable by warranty.
40. Windows 10 MM14 battery life will vary depending on various factors including product model, configuration, loaded
applications, features, use, wireless functionality, and power management settings. The maximum capacity of the battery
will naturally decrease with time and usage. See http://www.bapco.com for additional details.
WEIGHTS & DIMENSIONS

Product Weight
Starting weight
2.97 lbs35 1.35 kgs41
NOTE: Starting weight configuration includes FHD 400 nits BrightView Touch, 53 Wh battery, 4 GB, 128 GB SSD, HD + IR
camera, No FPS, with WWAN Antenna, No NFC, and No Pen

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QuickSpecs
Mainstream weight
3.13 lbs351.42 kgs41
NOTE: Mainstream weight configuration includes FHD 250 nits BrightView Touch, 53 Wh battery, 4 GB, 128 GB SSD, HD
Camera, No FPS, with WWAN Antenna, No NFC and No Pen
Product Dimensions (w x d x h)
12.07 x 8.47 x 0.66 in
30.66 x 21.52 x 1.69 cm
41. Weight will vary by configuration.
PORTS/SLOTS
2 USB 3.1 Type-C™ with Thunderbolt™ support
2 USB 3.2 Gen 1 (1 Charging)
1 HDMI 1.4b8
1 External Nano SIM tray (Optional)10
1 Headphone/microphone combo
1 Smartcard reader (Optional)10
1 AC power
Nano Security Lock Slot (Lock sold separately)
Sensors
Accelerometer
Magnetometer
Gyro
ALS (ambient light sensor)
Hall Sensor
8. HDMI cable sold separately

SERVICE AND SUPPORT

HP offers 3-year and 1-year limited warranties and 90 day software limited warranty options depending on country.
Batteries have a default one year limited warranty except for Long Life batteries which will have same 1-year or 3-year
limited warranty as the platform. Refer to http://www.hp.com/support/batterywarranty/ for additional battery
information. On-site service and extended coverage is also available. HP Care Pack Services are optional extended
service contracts that go beyond the standard limited warranties. To choose the right level of service for your HP
product, use the HP Care Pack Services Lookup Tool at: http://www.hp.com/go/cpc. 42
42. HP Care Packs are sold separately. Service levels and response times for HP Care Packs may vary depending on your
geographic location. Service starts on date of hardware purchase. Restrictions and limitations apply. For details, visit
http://www.hp.com/go/cpc. HP services are governed by the applicable HP terms and conditions of service provided or
indicated to Customer at the time of purchase. Customer may have additional statutory rights according to applicable local
laws, and such rights are not in any way affected by the HP terms and conditions of service or the HP Limited Warranty
provided with your HP Product.

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QuickSpecs

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QuickSpecs
SYSTEM UNIT
Stand-Alone Power Nominal Operating AC 19V
Requirements (AC Power) Voltage
Average Operating Power Win10
Integrated Graphics Yes
Max Operating Power UMA < 65W
Temperature Operating 32° to 95° F (0° to 35° C)
Non-operating -4° to 140° F (-20° to 60° C)
Relative Humidity Operating 10% to 90%, non-condensing
Non-operating 5% to 95%, 101.6° F (38.7° C) maximum wet bulb temperature
Shock Operating 40 G, 2 ms, half-sine
Non-operating 200 G, 2 ms, half-sine
Random Vibration Operating 0.75 grms
Non-operating 1.50 grms
Altitude (unpressurized) Operating -50 to 10,000 ft (-15.24 to 3,048 m)
Non-operating -50 to 40,000 ft (-15.24 to 12,192 m)
Planned Industry Standard UL Yes
Certifications CSA Yes
FCC Compliance Yes
ENERGY STAR® Yes43
EPEAT® 2019 Yes, Silver in U.S.44
ICES Yes
Australia Yes
NZ A-Tick Compliance Yes
CCC Yes
Japan VCCI Compliance Yes
KC Yes
BSMI Yes
CE Marking Compliance Yes
BNCI or BELUS Yes
CIT Yes
GOST Yes
Saudi Arabian Compliance Yes
(ICCP)
SABS Yes
43. Configurations of the HP EliteBook x360 830 G6 that are ENERGY STAR® certified are identified as HP EliteBook x360 830
G6 ENERGY STAR® on HP websites and on http://www.energystar.gov.
44. Based on US EPEAT® registration according to IEEE 1680.1-2018 EPEAT®. Status varies by country. Visit
http://www.epeat.net for more information.

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QuickSpecs
ENVIRONMENTAL & INDUSTRY
Environmental Eco-Label Certifications This product has received or is in the process of being certified to the
Data & declarations following approvals and may be labeled with one or more of these marks:
• IT ECO declaration
• US ENERGY STAR®
• US Federal Energy Management Program (FEMP)
• EPEAT® 2019 Silver registered in the United States. Based on EPEAT®
registration according to IEEE 1680.1-2018 EPEAT®. Status varies by
country. See http://www.epeat.net for registration status in your
country.
• TCO Certified Edge
• China Energy Conservation Program (CECP)
• China State Environmental Protection Administration (SEPA)
• Taiwan Green Mark
• Korea Eco-label
• Japan PC Green label*
System Configuration The configuration used for the Energy Consumption and Declared Noise
Emissions data for the Notebook model is based on a “Typically Configured
Notebook”.
Energy Consumption
(in accordance with US
ENERGY STAR® test
method) 115VAC, 60Hz 230VAC, 50Hz 100VAC, 50Hz
Normal Operation 4.26 4.42 4.3
(Sort idle)
Normal Operation 2.66 2.77 2.69
(Long idle)
Sleep 0.88 0.92 0.9
Off 0.36 0.37 0.36
Note:
Energy efficiency data listed is for an ENERGY STAR® compliant product if
offered within the model family. HP computers marked with the ENERGY
STAR® Logo are compliant with the applicable U.S. Environmental Protection
Agency (EPA) ENERGY STAR® specifications for computers. If a model family
does not offer ENERGY STAR® compliant configurations, then energy
efficiency data listed is for a typically configured PC featuring a hard disk
drive, a high efficiency power supply, and a Microsoft Windows® operating
system.
Heat Dissipation* 115VAC, 60Hz 230VAC, 50Hz 100VAC, 60Hz

Normal Operation 14 15 15
(Short idle)
Normal Operation 9 9 9
(Long idle)
Sleep 3 3 3
Off 1 1 1
*NOTE: Heat dissipation is calculated based on the measured watts, assuming

the service level is attained for one hour.

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QuickSpecs
Declared Noise Sound Power Sound Pressure

Emissions (LWAd, bels) (LpAm, decibels)
(in accordance with
ISO 7779 and ISO 9296)
Typically Configured – 2.5 15
Idle
Fixed Disk – Random 2.6 15
writes
Longevity and Upgrading This product can be upgraded, possibly extending its useful life by several
years. Upgradeable features and/or components contained in the product may
include:
• 3 USB ports
• 1 PC card slot (type I/II)
• 1 ExpressCard/54 slot
• 1 IEEE 1394 Port
• 2 SODIMM memory slots
• Optional expansion base docking station
• 1 multi-bay II storage port
• Interchangeable HDD
Spare parts are available throughout the warranty period and or for up to “5”
years after the end of production.
Batteries This battery(s) in this product comply with EU Directive 2006/66/EC
Batteries used in the product do not contain:

Mercury greater the1ppm by weight
Cadmium greater than 20ppm by weight
Battery size: CR2032 (coin cell)

Battery type: Lithium
Additional Information • This product is in compliance with the Restrictions of Hazardous
Substances (RoHS) directive - 2011/65/EC.
• This HP product is designed to comply with the Waste Electrical and
Electronic Equipment (WEEE) Directive – 2002/96/EC.
• This product is in compliance with California Proposition 65 (State of
California; Safe Drinking Water and Toxic Enforcement Act of 1986).
• This product is in compliance with the IEEE 1680.1 (EPEAT) standard at
the Silver level, see http://www.epeat.net
• Plastics parts weighing over 25 grams used in the product are marked
per ISO11469 and ISO1043.
• This product contains 5.69% post-consumer recycled plastic (by wt.)
• This product is 96.4% recycle-able when properly disposed of at end of
life.
Packaging Materials External: PAPER/Corrugated 264

Internal: PLASTIC/EPE (Expanded Polyethylene) 47

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QuickSpecs
PLASTIC/Polypropylene - PP 3
PLASTIC/Polyethylene low density - LDPE 14
Material Usage This product does not contain any of the following substances in excess of
regulatory limits (refer to the HP General Specification for the Environment at
http://www.hp.com/hpinfo/globalcitizenship/environment/supplychain/gen_
specifications.html):
• Asbestos
• Certain Azo Colorants
• Certain Brominated Flame Retardants – may not be used as flame
retardants in plastics
• Cadmium
• Chlorinated Hydrocarbons
• Chlorinated Paraffins
• Bis(2-Ethylhexyl) phthalate (DEHP)
• Benzyl butyl phthalate (BBP)
• Dibutyl phthalate (DBP)
• Diisobutyl phthalate (DIBP)
• Formaldehyde
• Halogenated Diphenyl Methanes
• Lead carbonates and sulfates
• Lead and Lead compounds
• Mercuric Oxide Batteries
• Nickel – finishes must not be used on the external surface designed to
be frequently handled or carried by the user.
• Ozone Depleting Substances
• Polybrominated Biphenyls (PBBs)
• Polybrominated Biphenyl Ethers (PBBEs)
• Polybrominated Biphenyl Oxides (PBBOs)
• Polychlorinated Biphenyl (PCB)
• Polychlorinated Terphenyls (PCT)
• Polyvinyl Chloride (PVC) – except for wires and cables, and certain
retail packaging has been voluntarily removed from most
applications.
• Radioactive Substances
• Tributyl Tin (TBT), Triphenyl Tin (TPT), Tributyl Tin Oxide (TBTO)
Packaging Usage HP follows these guidelines to decrease the environmental impact of product
packaging:
• Eliminate the use of heavy metals such as lead, chromium, mercury
and cadmium in packaging materials.
• Eliminate the use of ozone-depleting substances (ODS) in packaging
materials.
• Design packaging materials for ease of disassembly.
• Maximize the use of post-consumer recycled content materials in
packaging materials.
• Use readily recyclable packaging materials such as paper and
corrugated materials.
• Reduce size and weight of packages to improve transportation fuel
efficiency.
• Plastic packaging materials are marked according to ISO 11469 and
DIN 6120 standards.

Page 17
QuickSpecs
End-of-life Management Hewlett-Packard offers end-of-life HP product return and recycling programs
and Recycling in many geographic areas. To recycle your product, please go to:
http://www.hp.com/go/reuse-recycle or contact your nearest HP sales office.
Products returned to HP will be recycled, recovered or disposed of in a
responsible manner.
The EU WEEE directive (2002/95/EC) requires manufacturers to provide

treatment information for each product type for use by treatment facilities.
This information (product disassembly instructions) is posted on the Hewlett
Packard web site at: http://www.hp.com/go/recyclers. These instructions may
be used by recyclers and other WEEE treatment facilities as well as HP OEM
customers who integrate and re-sell HP equipment.
HP, Inc. Corporate For more information about HP’s commitment to the environment:
Environmental
Information Global Citizenship Report
http://www.hp.com/hpinfo/globalcitizenship/gcreport/index.html
Eco-label certifications
http://www8.hp.com/us/en/hp-
information/environment/ecolabels.html
ISO 14001 certificates:
http://h20195.www2.hp.com/V2/GetDocument.aspx?docname=c047
55842
and
http://www.hp.com/hpinfo/globalcitizenship/environment/pdf/cert.
pdf
DISPLAYS
Note: All specifications represent the typical specifications provided by HP's component manufacturers; actual performance
may vary either higher or lower.
Panel LCD 13.3 inch Outline Dimensions (W x H x D) 299.06 x 185.54 (max.)

diagonal FHD WLED Active Area 293.76 x 165.24
BrightView UWVA 72
Weight 170 g max. (panel only)
percent cg 400 nits eDP
1.4+PSR2 ultraslim Diagonal Size 13.3"
Thickness 2.0 mm
Interface eDP 1.4 w/ PSR2 (2 lane)

Page 18
QuickSpecs
Surface Treatment BrightView Glass
Touch Enabled Yes
Contrast Ratio 1500:1 (typical)
Refresh Rate 60 Hz
Brightness 400 nits typ.
Pixel Resolution 1920 x 1080 (FHD)
Format of LCD Pixel Arrangement RGB
Backlight WLED
Color Gamut Coverage 72% of NTSC
Color Depth 8 bit
Viewing Angle UWVA 85/85/85/85
Panel LCD 13.3 inch Outline Dimensions (W x H x D) 299.06 x 185.54 (max.)

diagonal FHD WLED Active Area 293.76 x 165.24
Anti-glare UWVA 72
Weight 170 g max. (panel only)
1.4+PSR2 ultraslim Diagonal Size 13.3"
Thickness 2.0 mm
Interface eDP 1.4 w/ PSR2 (2 lane)
Surface Treatment Anti-glare Glass
Touch Enabled Yes
Contrast Ratio 1500:1 (typical)
Refresh Rate 60 Hz
Brightness 400 nits typ.
Backlight WLED
Color Depth 8 bit
Panel LCD 13.3 inch Outline Dimensions (W x H x D) 300.56 x 187.77 max. (w/ PCB & w/o bracket)
diagonal FHD WLED Active Area 293.76 x 165.24 typ.
BrightView UWVA 45
Weight <260 max. (panel only)
slim Diagonal Size 13.3"
Thickness 3.0 mm max.
Interface eDP 1.2 (2 lane)
Touch Enabled Yes
Contrast Ratio 600:1 (typ)
Refresh Rate 60 Hz
Brightness 250 nit typ
Page 19
QuickSpecs
Backlight WLED
Color Depth 6 bit
Panel LCD 13.3 inch Outline Dimensions (W x H x D) 298.76 x 186.04 mm (typ.)

diagonal FHD WLED Active Area 293.76 x 165.24 mm (typ.)
BrightView UWVA
Weight 255 g (max)
72 percent cg 1000 nits
eDP 1.4+PSR2 flat Privacy Diagonal Size 13.3 inch
Thickness 3.0 mm (max)
Interface eDP 1.4
Touch Enabled YES
Contrast Ratio 2000:1(typ.)
Refresh Rate 60 Hz
Brightness* 1000 nits
Pixel Resolution 1920 x 1080(FHD)
Backlight LED
Color Depth 8 bit
Panel LCD 13.3 inch Outline Dimensions (W x H x D) 298.76 x 186.04 mm (typ.)

diagonal FHD WLED Anti- Active Area 293.76 x 165.24 mm (typ.)
Glare UWVA 72 percent cg
Weight 255 g (max)
1000 nits eDP 1.4+PSR2
flat Privacy Diagonal Size 13.3 inch
Thickness 3.0 mm (max)
Interface eDP 1.4
Surface Treatment Anti-glare Glass
Touch Enabled YES
Contrast Ratio 2000:1 (typ.)
Refresh Rate 60 Hz
Brightness 1000 nits
Pixel Resolution 1920 x 1080(FHD)

Page 20
QuickSpecs
Backlight LED
Color Depth 8 bit
STORAGE AND DRIVES

Note: For storage drives, GB = 1 billion bytes. TB = 1 trillion bytes. Actual formatted capacity is less. Up to 30 GB (for Windows
10) is reserved for system recovery software.
SSD 128 GB 2280 Form Factor M.2 2280

M2 SATA-3 TLC Capacity 128 GB
NAND Type TLC
Height 0.09 in (2.3 mm)
Width 0.87 in (22 mm)
Weight 0.02 lb (10 g)
Interface ATA-8, SATA 3.0
Maximum Sequential Read Up To 520 MB/s
Maximum Sequential Write Up To 450 MB/s
Logical Blocks 250,069,680
Operating Temperature 32° to 158°F (0° to 70°C) [ambient temp]
Features DIPM; TRIM; DEVSLP

M2 PCIe-3x4 SS NVMe TLC Capacity 256 GB
NAND Type TLC
Interface PCIe NVMe Gen3X4
Features ATA Security; TRIM; L1.2

Page 21
QuickSpecs
M2 SATA-3 Self Encrypted Capacity 256 GB
OPAL2 TLC
NAND Type TLC
Interface ATA-8, SATA 3.0
256 GB 2280 PCIe NVMe Form Factor M.2 2280

Value Solid State Drive Capacity 256 GB
NAND Type TLC
Features TRIM; L1.2
SSD 512 GB 2280 M2 PCIe- Form Factor M.2 2280

3x4 SS NVMe TLC Capacity 512 GB
NAND Type MLC
Logical Blocks 1,000,215,216
Features TRIM; L1.2
SSD 512 GB 2280 M2 SATA- Form Factor M.2 2280

3 TLC FIPS Capacity 512 GB
NAND Type TLC

Page 22
QuickSpecs
Interface ACS-3, SATA 3.2
SSD 512 GB 2280 PCIe-3x4 Form Factor M.2 2280

NVMe Self Encrypted OPAL2 Capacity 512 GB
TLC
NAND Type TLC
Features TRIM; L1.2
SSD 1 TB 2280 PCIe-3x4 Form Factor M.2 2280

NVMe TLC SS Capacity 1 TB
NAND Type TLC
Maximum Sequential Read Up to 3480 MB/s
Maximum Sequential Write Up to 2800 MB/s
Features TRIM; L1.2
SSD 2 TB 2280 PCIe-3x4 Form Factor M.2 2280

NVMe TLC SS Capacity 2 TB
NAND Type TLC

Page 23
QuickSpecs
Features TRIM; L1.2
SSD 512 GB 2280 PCIe Form Factor M.2 2280

NVMe Value Capacity 512 GB
NAND Type TLC
Features TRIM; L1.2
SSD 512 GB PCIe Form Factor M.2 2280

NVMe + 32 GB Optane Capacity 512 GB
NAND Type TLC
Features TRIM; L1.2

Page 24
QuickSpecs
NETWORKING/COMMUNICATIONS
Intel® Wireless-AC 9560 Wireless LAN Standards IEEE 802.11a
802.11a/b/g/n/ac (2 x 2) IEEE 802.11b
Wi-Fi® and Bluetooth® 5.0 IEEE 802.11g
Combo 1, vPro™ 10,14 IEEE 802.11n
IEEE 802.11ac
Interoperability Wi-Fi® certified
Frequency Band • 802.11b/g/n
2.402 – 2.482 GHz
• 802.11a/n
4.9 – 4.95 GHz (Japan)
5.15 – 5.25 GHz
5.25 – 5.35 GHz
5.47 – 5.725 GHz
5.825 – 5.850 GHz
Data Rates • 802.11b: 1, 2, 5.5, 11 Mbps
• 802.11g: 6, 9, 12, 18, 24, 36, 48, 54 Mbps
• 802.11a: 6, 9, 12, 18, 24, 36, 48, 54 Mbps
• 802.11n: MCS 0 ~ MCS 15, (20MHz, and 40MHz)
• 802.11ac: MCS0 ~ MCS9, (1SS, and 2SS) (20MHz, 40MHz, ,80MHz &
160MHz)
Modulation Direct Sequence Spread Spectrum
BPSK, QPSK, CCK, 16-QAM, 64-QAM, 256-QAM
Security 3 •IEEE and WiFi compliant 64 / 128 bit WEP encryption for a/b/g mode
only
•AES-CCMP: 128 bit in hardware
•802.1x authentication
•WPA, WPA2: 802.1x. WPA-PSK, WPA2-PSK, TKIP, and AES.
•WPA2 certification
•IEEE 802.11i
•Cisco Certified Extensions, all versions through CCX4 and CCX Lite
•WAPI
Network Architecture Ad-hoc (Peer to Peer)
Models Infrastructure (Access Point Required)
Roaming IEEE 802.11 compliant roaming between access points
Output Power 2 • 802.11b: +18.5dBm minimum
• 802.11g: +17.5dBm minimum
• 802.11a: +18.5dBm minimum
• 802.11n HT20(2.4GHz): +15.5dBm minimum
• 802.11n HT20(5GHz): +15.5dBm minimum
• 802.11ac VHT80(5GHz): +11.5dBm minimum
Power Consumption •Transmit mode 2.0 W
•Receive mode 1.6 W
•Idle mode (PSP) 180 mW (WLAN Associated)
•Idle mode 50 mW (WLAN unassociated)

Page 25
QuickSpecs
•Connected Standby 10mW
•Radio disabled 8 mW
Power Management ACPI and PCI Express compliant power management
802.11 compliant power saving mode
Receiver Sensitivity 3 802.11b, 1Mbps: -93.5dBm maximum
802.11b, 11Mbps: -84dBm maximum
802.11a/g, 6Mbps: -86dBm maximum
802.11n, MCS07: -67dBm maximum
802.11ac, MCS0: -84dBm maximum
Antenna type High efficiency antenna with spatial diversity, mounted in the display
enclosure
Two embedded dual band 2.4/5 GHz antennas are provided to the card
to support WLAN MIMO communications and Bluetooth communications
Form Factor PCI-Express M.2 MiniCard
Dimensions Type 2230: 2.3 x 22.0 x 30.0 mm
Weight Type 2230: 2.8g
Operating Voltage 3.3v +/- 9%
Temperature Operating 14° to 158° F (–10° to 70° C)
Non-operating –40° to 176° F (–40° to 80° C)
Humidity Operating 10% to 90% (non-condensing)
Non-operating 5% to 95% (non-condensing)
Altitude Operating 0 to 10,000 ft (3,048 m)
Non-operating 0 to 50,000 ft (15,240 m)
LED Activity LED Amber – Radio OFF; LED White – Radio ON
1. Check latest software/driver release for updates on supported security features.

2. Maximum output power may vary by country according to local regulations.
3. Receiver sensitivity is measured at a packet error rate of 8% for 802.11b (CKK
modulation) and a packet error rate of 10% for 802.11a/g (OFDM modulation).
HP Integrated Module with Bluetooth 4.0/4.1/4.2 Wireless Technology

Bluetooth Specification 4.0/4.1/4.2 Compliant
Frequency Band 2402 to 2480 MHz
Number of Available Legacy: 0~79 (1 MHz/CH)
Channels BLE: 0~39 (2 MHz/CH)
Signaling Data Rate Legacy: 3 Mbps signaling data rate1 2.17 Mbps
BLE: 1 Mbps signaling data rate1 0.2 Mbps
1. Actual throughput may vary.
Legacy: Synchronous Connection Oriented links up to 3, 64 kbps, voice

channels
Legacy: Asynchronous Connection Less links 2178.1 kbps/177.1 kbps

asymmetric (3-DH5) or 864 kbps symmetric (3-EV5)
Transmit Power The Bluetooth component shall operate as a Class II Bluetooth device
with a maximum transmit power of + 4 dBm for BR and EDR.

Page 26
QuickSpecs
Power Consumption Peak (Tx) 330 mW

Peak (Rx) 230 mW
Selective Suspend 17 mW
Electrical Interface USB 2.0 compliant
Bluetooth Software Microsoft Windows Bluetooth Software
Supported
Link Topology
Power Management Microsoft Windows ACPI, and USB Bus Support
Certifications FCC (47 CFR) Part 15C, Section 15.247 & 15.249
Power Management ETS 300 328, ETS 300 826
Certifications Low Voltage Directive IEC950
UL, CSA, and CE Mark
Bluetooth Profiles BT4.1-ESR 5/6/7 Compliance
Supported LE Link Layer Ping
LE Dual Mode
LE Link Layer
LE Low Duty Cycle Directed Advertising
LE L2CAP Connection Oriented Channels
Train Nudging & Interlaced Scan
BT4.2 ESR08 Compliance
LE Secure Connection- Basic/Full
LE Privacy 1.2 –Link Layer Privacy
LE Privacy 1.2 –Extended Scanner Filter Policies
LE Data Packet Length Extension
FAX Profile (FAX)
Basic Imaging Profile (BIP)2
Headset Profile (HSP)
Hands Free Profile (HFP)
Advanced Audio Distribution Profile (A2DP)
Security & Manageability Intel® vPro™ support with appropriate Intel® chipset components

14. Wireless access point and Internet service required and sold separately. Availability of public
wireless access points limited.
Intel® Wireless-AC 9560 Wireless LAN Standards IEEE 802.11a

802.11a/b/g/n/ac (2 x 2) IEEE 802.11b
Wi-Fi® and Bluetooth® 5.0 IEEE 802.11g
Combo 1, non-vPro™ 10,14 IEEE 802.11n
IEEE 802.11ac
Frequency Band • 802.11b/g/n
2.402 – 2.482 GHz
• 802.11a/n
4.9 – 4.95 GHz (Japan)
5.15 – 5.25 GHz
5.25 – 5.35 GHz
5.47 – 5.725 GHz

Page 27
QuickSpecs
5.825 – 5.850 GHz
Data Rates •802.11b: 1, 2, 5.5, 11 Mbps
•802.11g: 6, 9, 12, 18, 24, 36, 48, 54 Mbps
•802.11a: 6, 9, 12, 18, 24, 36, 48, 54 Mbps
•802.11n: MCS 0 ~ MCS 15, (20MHz, and 40MHz)
•802.11ac: MCS0 ~ MCS9, (1SS, and 2SS) (20MHz, 40MHz, 80MHz &
160MHz)
BPSK, QPSK, CCK, 16-QAM, 64-QAM, 256-QAM
Security 3 • IEEE and WiFi compliant 64 / 128 bit WEP encryption for a/b/g mode
only
• AES-CCMP: 128 bit in hardware
• 802.1x authentication
• WPA, WPA2: 802.1x. WPA-PSK, WPA2-PSK, TKIP, and AES.
• WPA2 certification
• IEEE 802.11i
• Cisco Certified Extensions, all versions through CCX4 and CCX Lite
• WAPI
Power Consumption • Transmit mode 2.0 W
• Receive mode 1.6 W
• Idle mode (PSP) 180 mW (WLAN Associated)
• Idle mode 50 mW (WLAN unassociated)
• Connected Standby 10mW
• Radio disabled 8 mW
Receiver Sensitivity 3 802.11b, 1Mbps: -93.5dBm maximum
802.11b, 11Mbps: -84dBm maximum
enclosure

Page 28
QuickSpecs
Dimensions Type 2230: 2.3 x 22.0 x 30.0 mm
Weight Type 2230: 2.8g
Temperature Operating 14° to 158° F (–10° to 70° C)
Non-operating –40° to 176° F (–40° to 80° C)
Humidity Operating 10% to 90% (non-condensing)
Non-operating 5% to 95% (non-condensing)
Altitude Operating 0 to 10,000 ft (3,048 m)
Non-operating 0 to 50,000 ft (15,240 m)
LED Activity LED Amber – Radio OFF; LED White – Radio ON

HP Integrated Module with Bluetooth 4.0/4.1/4.2/5.0 Wireless Technology

Bluetooth Specification 4.0/4.1/4.2/5.0 Compliant

channels

with a maximum transmit power of + 4 dBm for BR and EDR.
Power Consumption Peak (Tx) 330 mW
Peak (Rx) 230 mW
Selective Suspend 17 mW
Supported Link Topology
LE Dual Mode
LE Link Layer

Page 29
QuickSpecs
FAX Profile (FAX)

14. Wireless access point and Internet service required and sold separately. Availability of public
wireless access points limited.
Intel® Wi-Fi 6 AX200 Wireless LAN Standards IEEE 802.11a

802.11a/b/g/n/ac/ax IEEE 802.11b
(2 x 2) and Bluetooth® 5.0 IEEE 802.11g
Combo 1, vPro™ 10,18 IEEE 802.11n
IEEE 802.11ac
IEEE 802.11ax
IEEE 802.11d
IEEE 802.11e
IEEE 802.11h
IEEE 802.11i
IEEE 802.11k
IEEE 802.11r
IEEE 802.11v
Frequency Band • 802.11b/g/n/ax
2.402 – 2.482 GHz
• 802.11a/n/ac/ax
4.9 – 4.95 GHz (Japan)
5.15 – 5.25 GHz
5.25 – 5.35 GHz
5.47 – 5.725 GHz
5.825 – 5.850 GHz
Data Rates • 802.11b: 1, 2, 5.5, 11 Mbps
• 802.11g: 6, 9, 12, 18, 24, 36, 48, 54 Mbps
• 802.11a: 6, 9, 12, 18, 24, 36, 48, 54 Mbps
160MHz)
• 802.11ax: MCS0 ~ MCS11, (1SS and 2SS) (20MHz, 40MHz, ,80MHz &
160MHz)
OFDM, BPSK, QPSK, CCK, 16-QAM, 64-QAM, 256-QAM, 1024QAM
Security 3 • IEEE and WiFi compliant 64 / 128 bit WEP encryption for a/b/g mode
only

Page 30
QuickSpecs
• IEEE 802.11i
• WAPI
Models
• 802.11ax HT40(2.4GHz): +10dBm minimum
• 802.11ax VHT160(5GHz): +10dBm minimum
• Idle mode (PSP) 180 mW (WLAN Associated)
• Idle mode 50 mW (WLAN unassociated)
Receiver Sensitivity 3 • 802.11b, 1Mbps: -93.5dBm maximum
• 802.11b, 11Mbps: -84dBm maximum
• 802.11a/g, 6Mbps: -86dBm maximum
• 802.11n, MCS07: -67dBm maximum
• 802.11ac, MCS0: -84dBm maximum
• 802.11ax, MCS11(HT40): -59dBm maximum
• 802.11ax, MCS11(VHT160): -58.5dBm maximum
enclosure
Dimensions 1. Type 2230: 2.3 x 22.0 x 30.0 mm
2. Type 1216: 1.67 x 12.0 x 16.0 mm
Weight 1. Type 2230: 2.8g
2. Type 126: 1.3g
Operating voltage 3.3v +/- 9%
Temperature Operating: 14° to 158° F (–10° to 70° C)
Non-operating: –40° to 176° F (–40° to 80° C)

Page 31
QuickSpecs
Humidity Operating: 10% to 90% (non-condensing)
Non-operating: 5% to 95% (non-condensing)
Altitude Operating: 0 to 10,000 ft (3,048 m)
Non-operating: 0 to 50,000 ft (15,240 m)
HP Integrated Module with Bluetooth 4.0/4.1/4.2/5.0/5.1 Wireless Technology
Bluetooth Specification 4.0/4.1/4.2/5.0/5.1 Compliant


channels

with a maximum transmit power of + 9.5 dBm for BR and EDR.
Power Consumption Peak (Tx): 330 mW
Peak (Rx): 230 mW
Selective Suspend: 17 mW
Supported Link Topology
LE Dual Mode
LE Link Layer
FAX Profile (FAX)

Page 32
QuickSpecs
Security & Manageability Intel® vPro™ support with appropriate Intel® chipset components

18. Wireless access point and internet service required and sold separately. Availability of public
wireless access points limited. Wi-Fi 6 is backwards compatible with prior 802.11 specs. The
specifications for Wi-Fi 6 (802.11ax) are draft and are not final. If the final specifications differ
from the draft specifications, it may affect the ability of the notebook to communicate with other
802.11ax devices.
Intel® Wi-Fi 6 AX200 Wireless LAN Standards IEEE 802.11a
802.11a/b/g/n/ac/ax IEEE 802.11b
(2 x 2) Bluetooth® 5 IEEE 802.11g
Combo 1, non-vPro™ 10,18 IEEE 802.11n
IEEE 802.11ac
IEEE 802.11ax
IEEE 802.11d
IEEE 802.11e
IEEE 802.11h
IEEE 802.11i
IEEE 802.11k
IEEE 802.11r
IEEE 802.11v
Interoperability Wi-Fi certified
Frequency Band • 802.11b/g/n/ax
2.402 – 2.482 GHz
• 802.11a/n/ac/ax
4.9 – 4.95 GHz (Japan)
5.15 – 5.25 GHz
5.25 – 5.35 GHz
5.47 – 5.725 GHz
5.825 – 5.850 GHz
Data Rates • 802.11b: 1, 2, 5.5, 11 Mbps
• 802.11g: 6, 9, 12, 18, 24, 36, 48, 54 Mbps
• 802.11a: 6, 9, 12, 18, 24, 36, 48, 54 Mbps
160MHz)
• 802.11ax: MCS0 ~ MCS11, (1SS and 2SS) (20MHz, 40MHz, ,80MHz &
160MHz)
OFDM, BPSK, QPSK, CCK, 16-QAM, 64-QAM, 256-QAM, 1024QAM
3
Security • IEEE and WiFi compliant 64 / 128 bit WEP encryption for a/b/g mode
only
• IEEE 802.11i
• WAPI

Page 33
QuickSpecs
• 802.11ax HT40(2.4GHz): +10dBm minimum
• 802.11ax VHT160(5GHz): +10dBm minimum
• Idle mode (PSP) 180 mW WLAN Associated)
• Idle mode 50 mW WLAN unassociated)
Receiver Sensitivity 3 •802.11b, 1Mbps: -93.5dBm maximum

•802.11b, 11Mbps: -84dBm maximum
•802.11ax, MCS11(HT40): -59dBm maximum
•802.11ax, MCS11(VHT160): -58.5dBm maximum
enclosure
Dimensions 1. Type 2230: 2.3 x 22.0 x 30.0 mm
2. Type 1216: 1.67 x 12.0 x 16.0 mm
Weight 1. Type 2230: 2.8g
2. Type 126: 1.3g
Temperature Operating: 14° to 158° F (–10° to 70° C)
Non-operating: –40° to 176° F (–40° to 80° C)
Humidity Operating: 10% to 90% (non-condensing)
Non-operating: 5% to 95% (non-condensing)
Altitude Operating: 0 to 10,000 ft (3,048 m)
Non-operating: 0 to 50,000 ft (15,240 m)
HP Integrated Module with Bluetooth 4.0/4.1/4.2/5.0/5.1 Wireless Technology
Bluetooth Specification 4.0/4.1/4.2/5.0/5.1 Compliant

Page 34
QuickSpecs

channels

with a maximum transmit power of + 9.5 dBm for BR and EDR.
Power Consumption Peak (Tx): 330 mW

Peak (Rx): 230 mW
Selective Suspend: 17 mW

Supported
Link Topology

LE Dual Mode
LE Link Layer
FAX Profile (FAX)

18. Wireless access point and internet service required and sold separately. Availability of public
wireless access points limited. Wi-Fi 6 is backwards compatible with prior 802.11 specs. The
specifications for Wi-Fi 6 (802.11ax) are draft and are not final. If the final specifications differ
from the draft specifications, it may affect the ability of the notebook to communicate with other

Page 35
QuickSpecs
802.11ax devices.
Intel® XMM™ 7360 LTE- Technology/Operating FDD LTE: 2100 (Band 1), 1900 (Band 2), 1800 (Band 3),
Advanced Cat 915 bands 1700/2100 (Band 4), 850 (Band 5), 2600 (Band 7), 900 (Band 8), 1400
(Band 11), 700 (Band 12 lower), 700 (Band 13 upper), 700 (Band 17
lower), 850 (Band 18 lower), 850 (Band 19 upper), 800 (Band 20), 1400
(Band 21), 850 (Band 26), 700 (Band 28), 700 (Band 29 RX only), 2300
(Band 30), 1700/2100 (Band 66).
TDD LTE: 2600 (Band 38), 1900 (Band 39), 2400 (Band 40), 2500 (Band
41).
HSPA+: 2100 (Band 1), 1900 (Band 2), 1700/2100 (Band 4),
850 (Band 5), 900 (Band 8) MHz
Wireless protocol 3GPP Release 11 LTE Specification CAT.9, DL 60MHz BW throughput up
standards to 450Mbps; UL 20MHz throughput up to 50Mbps
WCDMA R99, 3GPP Release 5, 6, 7 and 8 UMTS Specification
GPS Standalone, A-GPS (MS-A, MS-B)
GPS bands 1575.42 MHz ± 1.023 MHz, GLONASS 1596-1607MHz, Beidou 1561.098
MHz
Maximum data rates LTE: 450 Mbps (Download), 50 Mbps (Upload)
DC-HSPA+: 42 Mbps (Download), 5.76 Mbps (Upload)
HSPA+: 21Mbps (Download), 5.76 Mbps (Upload)
Maximum output power LTE: 23 dBm
HSPA+: 23.5 dBm
Maximum power LTE: 1,200 mA (peak); 900 mA (average)
consumption HSPA+: 1,100 mA (peak); 800 mA (average)
Form Factor M.2, 3042-S3 Key B
Weight 5.8 g
Dimensions 42 x 30 x 2.3 mm
(Length x Width x
Thickness)
15. WWAN module is an optional feature, requires factory configuration and requires
separately purchased service contract. Check with service provider for coverage and
availability in your area. Connection speeds will vary due to location, environment,
network conditions, and other factors. 4G LTE not available on all products, in all regions.
Intel® XMM™ 7262 LTE- Technology/Operating FDD LTE: 2100 (Band 1), 1800 (Band 3), 850 (Band 5), 2600 (Band 7), 900
Advanced Cat 615 bands (Band 8), 800 (Band 20), 700 (Band 28),
HSPA+: 2100 (Band 1), 850 (Band 5), 900 (Band 8)
Wireless protocol 3GPP Release 11 LTE Specification CAT.6, DL 40MHz BW throughput up
standards to 300Mbps; UL 20MHz throughput up to 50Mbps
GPS Standalone, A-GPS (MS-A, MS-B and XTRA)
GPS bands 1575.42 MHz ± 1.023 MHz, GLONASS 1596-1607MHz
UMT: 384 kbps (Download), 384 kbps (Upload)
Maximum output power LTE: 23 dBm

Page 36
QuickSpecs
HSPA+: 23.5 dBm
Weight 6g
(Length x Width x
Thickness)
15. WWAN module is an optional feature, requires factory configuration and requires
separately purchased service contract. Check with service provider for coverage and
availability in your area. Connection speeds will vary due to location, environment,
network conditions, and other factors. 4G LTE not available on all products, in all
regions.
Intel® XMM™ 7560 LTE- Technology/Operating FDD LTE: 2100 (Band 1), 1900 (Band 2), 1800 (Band 3),
Advanced Pro Cat 1617 bands 1700/2100 (Band 4), 850 (Band 5), 2600 (Band 7), 900 (Band 8), 700
(Band 12 lower),
700 (Band 13 upper), 700 (Band 14 upper), 700 (Band 17 lower), 850
(Band 18 lower),
850 (Band 19 upper), 800 (Band 20), 1900 (Band 25), 850 (Band 26), 700
(Band 28),
700 (Band 29 RX only), 2300 (Band 30), 1700/2100 (Band 66).
TDD LTE: 2600 (Band 38), 1900 (Band 39), 2400 (Band 40), 2500 (Band
41), 3500 (Band 42),
5200 (Band 46 RX only)
HSPA+: 2100 (Band 1), 1900 (Band 2), 1700/2100 (Band 4),
850 (Band 5), 900 (Band 8) MH
Wireless protocol 3GPP Release 12 LTE Specification DL-CAT.16, DL 100MHz BW
standards throughput up to 978Mbps; UL-CAT.13 40MHz throughput up to
150Mbps
GPS Standalone, A-GPS (MS-B and LTO)
GPS Bands GPS 1575.42 MHz ± 1.023 MHz, GLONASS 1596-1607MHz, Beidou
1561.098 ± 2.046 MHz
HSPA+: 21Mbps (Download), 5.76 Mbps (Upload)
Maximum output power LTE: 23 dBm in all bands except B41
LTE B41 HPUE: 26dBm
HSPA+: 23.5 dBm
Weight 6g
(Length x Width x
Thickness)

Page 37
QuickSpecs
17. Gigabit class Category 16 4G LTE module is optional and must be configured at the factory.
Module designed for up to 1 Gbps download speeds as carriers deploy 5 carrier
aggregation and 100Mhz channel bandwidth, requires activation and separately
purchased service contract. Backwards compatible to HSPA 3G technologies. Check with
service provider for coverage and availability in your area. Connection, upload and
download speeds will vary due to network, location, environment, network conditions,
and other factors. 4G LTE not available on all products, in all regions.
NXP NPC300 Near Field Dimensions (L x W x H) Module 17 mm by 10 mm by 2.0 mm

Communication Module
Chipset NPC300
System interface I2C
NFC RF standards ISO/IEC 14443 A
ISO/IEC 14443 B
ISO/IEC 15693
ISO/IEC 18092
ECMA-340 NFCIP-1 Target and Initiator
ECMA-320 NFCIP-2
NFC Forum Support Tag Type 1, Type 2, Type3 and Type 4, NFCIP-1 and NFCIP-2
Reader (PCD-VCD) Mode 1 ISO/IEC 14443 A
ISO/IEC 14443 B
ISO/IEC 15693
MIFARE 1K
MIFARE 4K
MIFARE DESFire
FeliCa
Jewel and Topaz cards
Card Emulation (PICC- ISO/IEC 14443 A
VICC) Mode 1 ISO/IEC 14443 B and B’
MIFARE
FeliCa
Frequency 13.56 MHz
NFC Modes Supported Reader/Writer, Peer-to-Peer
Raw RF Data Rates 106, 212, 424, 848 kbps
Operating temperature -25 C to 80°C
Storage temperature -20°C to 125°C
Humidity 10-90% operating
5-95% non-operating
Supply Operating voltage 2.7 to 5.5 Volts
I/O Voltage 1.8V or 3.3V
Power Consumption Polling 710.93 mW

(Booster enable, VBAT= Detected Test Tag Type 1 152.09 mW
3.3V, VCC_BOOST = 5V)
Detected Test Tag Type 2 341.26 mW

Page 38
QuickSpecs
Antenna Antenna connector, 0.3mm pitch, 7 connector FPC. Antenna matching
is external to module.
POWER
HP 65W Dimensions (H x W x D) 107.0 x 47.0 x 30.0mm
Smart AC adapter
Weight 250g +/- 10g
Input Input Efficiency 88.0 % at 115 Vac and 89.0 % at 230Vac
Input frequency range 47 ~ 63 Hz
Input AC current Max. 1.7 A at 90 Vac
Output Output power 65W
DC output 19.5V
Hold-up time 5ms at 115 Vac input
Output current limit <11.0A
Connector 4.5mm Barrel Type
Environmental Design Operating 32°F to 95°F (0° to 35°C)
temperature
Non-operating (storage) -4°F to 185°F (-20° to 85°C)

temperature
Altitude 0 to 16,400 ft (0 to 5000m)
Humidity 20% to 95%
Storage Humidity 10% to 95%
EMI and Safety CE Mark - full compliance with LVD and EMC directives
Certifications Worldwide safety standards - IEC60950, EN60950, UL60950, Class1,
SELV; Agency approvals - C-UL-US, NORDICS, DENAN, EN55022 Class B,
FCC Class B, CISPR22 Class B, CCC, NOM-1 NYCE.
MTBF - over 200,000 hours at 25°C ambient condition.
HP 45W Dimensions (H x W x D) 3.74 x 1.57 x 1.04 in (9.5 x 4.0 x 2.65 cm)

Smart AC adapter
Weight 0.386 lb (175g) max
Input 90 to 265 VAC
Input Efficiency 87.74% at 115Vac and 88.4% at 230Vac
Input frequency range 47 to 63 Hz
Input AC current 1.4 A at 90 VAC
Output Output power 45W
DC output 19.5V
Hold-up time 5 msec at 115 VAC input

Page 39
QuickSpecs
Connector 4.5mm Barrel Type, 3 pin/grounded, mates with interchangeable
cords
Environmental Design Operating 32° to 95°F (0° to 35°C)
temperature
Non-operating (storage) -4° to 185°F (-20° to 85°C)

temperature
Humidity 20% to 95%
HP 65W EM Dimensions (H x W x D) 102 x 55 x 30mm

Smart AC adapter
Weight 270g +/- 10g
Input Input Efficiency 87% min at 115V/230V
Input frequency range 47 to 63 Hz
Input AC current 1.7 A at 90 VAC and maximum load
Output DC output 65W(19.5V/3.33A)
Hold-up time 5 msec at 115 VAC input
Output current limit <11A, Over voltage protection- 29V max
automatic shutdown
Connector 4.5mm Barrel Type, 3 pin/grounded, mates with interchangeable
cords
Environmental Design Operating 0° to 35° C
temperature
Non-operating (storage) -20° to 85° C

temperature
Altitude 0 to 5,000 m
Humidity 0% to 95%
EMI and Safety CE Mark - EMC directives; Worldwide safety standards
Certifications -IEC60950, EN60950, UL60950, Class1, SELV; Agency approvals - C-UL-
US, NORDICS, DENAN, EN55022 Class B, FCC Class B, CISPR22 Class B,
CCC, NOM-1 NYCE; Reliability - failure rate of less than 0.1% annually
within the first three years of operation.

Page 40
QuickSpecs
AC Adapter Dimensions (H x W x D) 62.0 x 62.0 x 28.5 mm

45 Watt nPFC USB
Weight unit: 220g +/- 10g
type C™
Input Input Efficiency Average Efficiency of 25%, 50%, 75%, 100%
load condition with 115Vac/230Vac Spec:5V
: 81.5%9V : 86.7%10V : 87.5%12V :
87.8%15V : 87.8%20V : 87.8%
Input frequency range 47 ~ 63Hz
Input AC current Max. 1.4 A at 90 Vac
Output Output Power 5V/15W
9V/27W
10V/37.5W
12V/45W
15V/45W
20V/45W
DC output 5V / 9V / 10V /12V / 15V / 20V
Connector USB Type-C™
temperature

temperature
AC Adapter Dimensions (H x W x D) 74 x 74 x 28.5 mm

65 Watt nPFC USB
Weight unit: 245g +/- 10g
type C ™
Input Input Efficiency 81.5% min at 115 Vac/ 230Vac @ 5V/3A
86.7% min at 115 Vac/ 230Vac @ 9V/3A
88% min at 115 Vac/ 230Vac @ 10V/5A
88% min at 115 Vac/ 230Vac @ 12V/5A
89% min at 115 Vac/ 230Vac @ 15V/4.33A
89% min at 115 Vac/ 230Vac @ 20V/3.25A
Input frequency range 47 ~ 63 Hz
Input AC current 1.7 A at 90 VAC and maximum load
Output Output Power 65W
DC output 5V/9V/10V/12V/15V/20V

Page 41
QuickSpecs
Connector Duck head / duck head power cord, without Smart ID DC connector
temperature

temperature
Humidity 5% to 95%
HP 4 Cell WHr Dimensions (H x W x D) 5.58 mm * 80.62 mm * 269.2 mm

53 Long Life -PL Fast
Weight 243g
Charge
Cells/Type 3-cell; Polymer
Energy Voltage 7.7V
Amp-hour capacity 6.9Ah
Watt-hour capacity 53.2Wh
Temperature Operating (Charging) 0°C ~ 45°C
Operating (Discharging) 14° to 122°F (-10° to 60°C)
Optional Travel Battery No
Available
Country of Origin
China

Page 42
Options and Accessories (Sold separately and availability may vary by country)
Type Description Part Number
Cases HP Essential Top Load Case H2W17AA
HP Basic Backpack H1D24AA
HP Slim Top Load F3W15AA
Docking HP Thunderbolt Dock 120W G2 2UK37AA

HP Thunderbolt Dock 120W G2 TAA 2UK37AA
HP Elite 90W Thunderbolt 3 Dock 1DT93AA
HP USB-C Dock G4 3FF69AA
HP USB-C Mini Dock 1PM64AA
HP USB-C Travel Dock T0K29AA
HP USB Travel Dock T0K30AA
HP USB-C Universal Dock 1MK33AA
HP Adjustable Dual Display Stand AW664AA
Input/Output HP Slim Wireless Keyboard and Mouse T6L04AA

HP Slim USB Keyboard and Mouse T6T83AA
HP Wireless (Link-5) Keyboard T6U20AA
HP USB Essential Keyboard and Mouse H6L29AA
HP Conferencing Keyboard K8P74AA
HP USB Collaboration Keyboard Z9N38AA
HP Wireless Collaboration Keyboard Z9N39AA
HP Comfort Grip Wireless Mouse H2L63AA
HP X4000b Bluetooth Mouse H3T50AA
HP 3-Button USB Laser Mouse H4B81AA
HP USB Travel Mouse G1K28AA
HP Ultra Mobile Wireless Mouse H6F25AA
HP Slim Bluetooth Mouse to AMO F3J92AA
HP Wireless Premium Mouse 1JR31AA
HP USB Premium Mouse 1JR32AA
HP Essential USB Mouse 2TX37AA
HP Elite Presenter Mouse 2CE30AA
HP USB-C to USB 3.0 Adapter N2Z63AAA
HP USB-C to USB-A Hub Z6A00AA
HP USB-C to HDMI 2.0 1WC36AA
HP USB-C to VGA N9K76AA
HP HDMI to DVI F5A28AA
HP USB-C to RJ45 V7W66AA
HP USB to RJ45 N7P47AA
HP HDMI to VGA H4F02AA
Power HP 65W Slim AC Adapter H6Y82AA

HP 90W Slim AC Adapter H6Y83AA

Page 43
Options and Accessories (Sold separately and availability may vary by country)
HP 90W Slim Combo AC Adapter w/ USB H6Y84AA
HP 45W Smart AC Adapter H6Y88AA
HP 45W 2-prong 4.5 mm DC jack AC Adapter L6F60AA
HP 45W USB-C Power Adapter 1HE07AA
HP 65W USB-C Power Adapter 1HE08AA
65W USB-C Slim Power Adapter 3PN48AA
HP Notebook Power Bank N9F71AA
HP USB-C Notebook Power Bank 1TZ86AA
UCC HP Stereo 3.5mm Headset T1A66AA

HP Stereo USB Headset T1A67AA
HP UC Wireless Mono Headset W3K08AA
HP UC Wireless Duo Headset W3K09AA
Storage HP USB External DVDRW Drive F2B56AA

HP 256GB M2 PCIe NVME SSD TLC (2280) 1FU87AA
HP 512GB M2 PCIe NVME SSD TLC 2280) 1FU88AA
Security HP Nano Keyed Cable Lock 1AJ39AA

HP Nano Dual-Head Keyed Cable Lock 1AJ41AA
Other HP TB Dock Audio Module 3AQ21AA

HP Thunderbolt 120W 1m cable 3AQ23AA
HP Thunderbolt 1m combo cable 3A25AA
HP Rechargeable Active Pen 4KL69AA
Displays HP EliteDisplay E243d 23.8-inch Docking Monitor 1TJ76AA

HP EliteDisplay E243 23.8-inch Monitor 1FH47AA
HP EliteDisplay E273q 27-inch Monitor 1FH52AA

Page 44
Change Log
Date of change: Version History: Description of change:
June 10, 2019 From V1 to V2 Added HP Cloud Recovery
June 20, 2019 From V2 to V3 Added Environmental tab
July 2, 2019 From V3 to V4 Updated Color Gamut
September 9, 2019 From V4 to V5 Updated Intel® Optane™ and disclaimer for 1000 nit Sure View panel
November 6, 2019 From V5 to V6 Updated Processors section
January 21, 2020 From V6 to V7 Added Modern Connected Standby
May 27, 2020 From V7 to V8 Updated Ports section
Copyright © 2020 HP Development Company, L.P. The only warranties for HP products are set forth in the express limited
warranty statements accompanying such products. Nothing herein should be construed as constituting an additional
warranty. HP shall not be liable for technical or editorial errors or omissions contained herein.
Intel, Core, Thunderbolt and Intel vPro are trademarks or registered trademarks of Intel Corporation or its subsidiaries in the
United States and other countries. USB Type-C™ and USB-C™ are trademarks of USB Implementers Forum. ENERGY STAR is a
registered trademark of the U.S. Environmental Protection Agency.

Page 45

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QuickSpecs HP EliteBook x360 830 G6 Notebook PC

1. HD and IR Camera (Optional) 7. Glass Clickpad

Not all configuration components are available in all regions/countries.

1. Power connector 6. Audio Combo Jack

Not all configuration components are available in all regions/countries.

Not all configuration components are available in all regions/countries.

Not all configuration components are available in all regions/countries.

7. HD content required to view HD images.

7. HD content required to view HD images.

Not all configuration components are available in all regions/countries.

HP USB-C Travel Single 2K @ 60Hz Single external display

Single 4K @ 30Hz Single external display

STORAGE AND DRIVES

Not all configuration components are available in all regions/countries.

10. Sold separately or as an optional feature.

Not all configuration components are available in all regions/countries.

KEYBOARDS/POINTING DEVICES/BUTTONS & FUNCTION KEYS

Hidden Function Keys

Not all configuration components are available in all regions/countries.

SOFTWARE AND SECURITY

Client Security Software

Not all configuration components are available in all regions/countries.

38. Availability may vary by country.

WEIGHTS & DIMENSIONS

Not all configuration components are available in all regions/countries.

41. Weight will vary by configuration.

8. HDMI cable sold separately

SERVICE AND SUPPORT

Not all configuration components are available in all regions/countries.

Not all configuration components are available in all regions/countries.

Not all configuration components are available in all regions/countries.

Heat Dissipation* 115VAC, 60Hz 230VAC, 50Hz 100VAC, 60Hz

*NOTE: Heat dissipation is calculated based on the measured watts, assuming

Not all configuration components are available in all regions/countries.

Declared Noise Sound Power Sound Pressure

Batteries used in the product do not contain:

Battery size: CR2032 (coin cell)

Packaging Materials External: PAPER/Corrugated 264

Not all configuration components are available in all regions/countries.

Not all configuration components are available in all regions/countries.

The EU WEEE directive (2002/95/EC) requires manufacturers to provide

Panel LCD 13.3 inch Outline Dimensions (W x H x D) 299.06 x 185.54 (max.)

Not all configuration components are available in all regions/countries.

Panel LCD 13.3 inch Outline Dimensions (W x H x D) 299.06 x 185.54 (max.)

Panel LCD 13.3 inch Outline Dimensions (W x H x D) 298.76 x 186.04 mm (typ.)

Panel LCD 13.3 inch Outline Dimensions (W x H x D) 298.76 x 186.04 mm (typ.)

Not all configuration components are available in all regions/countries.

STORAGE AND DRIVES

SSD 128 GB 2280 Form Factor M.2 2280

SSD 256 GB 2280 Form Factor M.2 2280

Not all configuration components are available in all regions/countries.

256 GB 2280 PCIe NVMe Form Factor M.2 2280

SSD 512 GB 2280 M2 PCIe- Form Factor M.2 2280

SSD 512 GB 2280 M2 SATA- Form Factor M.2 2280

Not all configuration components are available in all regions/countries.

SSD 512 GB 2280 PCIe-3x4 Form Factor M.2 2280

SSD 1 TB 2280 PCIe-3x4 Form Factor M.2 2280