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Fabrication Steps: CMOS Processing (Part 1)
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Fabrication Steps: CMOS Processing
10 Employee Awar
Chapter1 Chapter2 Chapter3 Chapter4 Workplace
Index Digital CMOS Employees function as
Semiconductor Background
Background Processing making sure that emplo
incredibly important ...
3.1 3.2 3.3 3.4 3.5 3.6
Fabrication Create Create Implant Implant Create
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Steps N-Well and Field Oxide Gate Oxide and Poly Layer N+ Impurities P+ Impurities Metal Contact
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Property of material plays a very important role on the performance of MOSFET devices. If you are not agreeing with this
statement, then maybe you have to refer device physic. But now just believe me. J
While we are fabricating the MOSFET, we have to take care about the different material used based on the performance of end
product (MOSFET) and so we can say that properties of the material (which material, doping, sizes …) come from the Fabrication of
the MOSFET. In this post, I am going to brief you about the different Fabrication steps of CMOS device and some important info
which will help you to understand different terminology + fundamental of lower technology node process. Videos
Just few basics:
Materials can be classified in to 3 main groups as per their electrical conducting property. VLSI Ex
1. Insulator
Used to isolate conducting or semiconducting material from each other.
MOS devices and Capacitance require insulator for their physical operation.
Which insulator is required – it depends on the functionality for which you want to use it.
Few of the known insulators are
Silicon Dioxide
Silicon Nitride
2. Conductor
Conductors are used in the IC world for electrical connectivity.
These are used as Local interconnects, Global Interconnects and in Contact/VIAs.
Few of the good conductors are:
Silver
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