PD09

Defect Analysis and Process Troubleshooting - Part 2

S.Manian Ramkumar
Rochester Institute of Technology

Sunday, February 12
2:00 pm - 5:00 pm
Room: 2

www.IPCAPEXEXPO.org
SMT and THT Defect Analysis
and Process Troubleshooting
Part 2 - Analytical Problem Solving Approach
Dr. S. Manian Ramkumar Ph.D.
Professor and Dean
Rochester Institute of Technology
Phone: 585-475-6081
smrmet@rit.edu; http://smt.rit.edu

Disclaimer
 Dr. Ramkumar and the Center for
Electronics Manufacturing and Assembly at
the Rochester Institute of Technology
◦ Makes no warranties to the general scientific
validity of the information and viewpoints
contained in this material, for any particular
application by potential users.
◦ Takes no responsibility for any use or misuse of
the information contained in this material and
cautions readers that an independent evaluation
of the viewpoints expressed is entirely the
responsibility of the reader.

2
 ANALYTICAL PROBLEM
SOLVING METHODOLOGY

Strengths of the Methodology

 Systematic
◦ Step-by-Step approach to solving the problem
 Maintains Focus
◦ Keeps the user on track and on the issue
 Consistent and Repeatable
 Strengthens Questioning
 Improves Listening
 Enforces Documentation

4
Essential Attributes for User Minimizes the Following

 Common Sense  Non-cooperation

 Judgment  Arrogance and Agenda
 Attitude based Decision Making
 Expertise  Speculation
 Experience  Guesswork
 Knowledge
 Superstition
 Information
 Unsatisfactory Solutions
 Data
 Repetitive Occurrence
 Questioning, Listening and
Documenting Skills  Costly Fixes

Important Attributes and Effect

5

Problem Solving Process

Gather Solve the

Sort Organize Analyze Confirm
Data Problem

Make you Thinking Visible

Document the thought process
6
 PROBLEM DEFINITION &
SPECIFICATION – CASE
STUDIES

Types of Problems
Periodic Sporadic

Onetime Only Continuous

Ideal Performance

Process
Deviation

Actual Performance

Time
8
 Confirming Ideal and Actual
 Criteria  Measurement System
 Specifications ◦ Capability
 Assumptions ◦ Repeatability
◦ Reproducibility
 Conditions
◦ Reliability
 Personnel
 Method Caution
1. Never lower the Ideal Performance level
 Timing without good reason
 Applicability 2. Compare Ideal and Actual using same
system of measurement, criteria, etc.

Case Studies
 Case 1
◦ Solder balling under BGA256
 Case 2
◦ Bottom side SMT components missing after
wave
 Case 3
◦ Tombstoning of 0402 LEDs on a assembly
 Case 4
◦ Insufficient Hole fill on multiple components
10
Case 1 – Solder Balling under BGA256
 BGA 256
Defects Identified in this
 FR4 PCB, 8 layers, 62 mil region of the BGA
thick
 PCB Assembly A1006
 Manufactured in US,
Canada and South Asia BGA 256
 Parts sourced from
various suppliers
 Random Occurrence
 Requires reworking the
BGAs
11

Solder Balling – Possible Root

Causes
 Excessive heating rate/flux  Dirty stencils
evaporation  Dirty supports
 Solder particle oxidation  Small particles
 Solder paste viscosity too  Excess pressure pushing
low/slumping onto mask paste onto mask
 Paste print on the solder  Air kiss blowing particles
mask (misalignment) onto the mask
 Preheat ramp up rate high  Solder splattering due to
 Preheat temperature high entrapped volatiles
 Paste contamination or  Outgassing from
oxidized particles neighboring components
 Misprint
 Poor board cleaning
 Excess flux content

12
Collecting more details?
 Questioning to the void ……. 1. Listen
2. Acknowledge
◦ Re-ask the same question or 3. Confirm
4. Document
◦ What else ……? questions
• To get more
Open information
• What? When? Where?
Questions How? Who? Why?

Crack Void
• To clarify something
Closed • Do, Have, Will, Can, Is
...
Questions

13

Details Pertain To ……
 The assemblies (part #) that see the same
defect and not
 The components that have the same
defect and not
 The operators and shifts that seem to be
producing the defect and not
 The date and time you started seeing it
for the first time and since then
 The geographic location of the factory
where you are seeing the defect and not
14
Details Pertain To ……
 The location on the assembly where you
are seeing the defect and not
 The timing in the process flow when you
are you finding the defect and when not
 Any trends in the defect and location of
the defect
Make your thought process visible by writing
down the details as you ask the questions

15

Case 1 – Collecting More Details

 What other assemblies use the same BGA?
 What other assemblies have the same
defect?
 What other assemblies could have the
defect but do not?
 What other BGAs show the same defect?
 What other defects do you see?
 What other defects could you see but do
not?

16
Case 1 – Collecting More Details
 Where geographically is the BGA assembly
when the defect is seen?
 Where else is the assembly being assembled
where you do not see the defect?
 Where on the defective assembly is the
BGA located?
 Where within the BGA location is the
defect located?
 Where else on the defective assembly is the
same defect located or not?

17

Case 1 – Collecting More Details

 When did this defect happen first?
 When has the defect happened since
then?
 When during the assembly life cycle of
the product was the defect noticed?
 When could the defect have been seen
prior to now, but not?

18
 Q# IS IS NOT

WHAT?
Assembly
Defect

Geography
WHERE?

Location
on
Assembly
Date &
Time First
Occurred
WHEN?

When
since?

When in
the life
cycle?
19

What IS ….. What IS NOT?

 What BGA Assembly or group of assemblies is
having the solder balling defect?

 What is wrong with the assembly?

 What BGA Assembly or group of assemblies

could be having the solder balling defect but is
not?

 What could be wrong with the assembly but is

not?
20
 Q# IS IS NOT

WHAT?
Assembly Assembly “A1006” “A1005”, “A1007”, “A1009”
Defect Solder Balling Bridging, Cold Solder, Open Joint

Geography
WHERE?

Location
on
Assembly
Date &
Time First
Occurred
WHEN?

When
since?

When in
the life
cycle?
21

Where IS …..Where IS NOT?

 Where geographically is the assembly when the
solder balling defect is noticed?

 Where is the solder balling defect located on the

assembly?

 Where geographically could the assembly be when

the solder balling defect is noticed but is not?

 Where could the solder balling defect be located

on the assembly but is not?

22
 Q# IS IS NOT

WHAT?
Assembly Assembly “A1006” “A1005”, “A1007”, “A1009”
Defect Solder Balling Bridging, Cold Solder, Open Joint

Assembly plants in the US and

Geography Assembly plants in South Asia
Canada
WHERE?

Location Entire area of U15 or location

on Top right hand corner of U15 U13 and U14 on the same
Assembly assembly
Date &
Time First
Occured
WHEN?

When
since?

When in
the life
cycle?
23

When IS …..When IS NOT?

 When was the solder balling defect first
noticed?

 When has the solder balling defect been

noticed since then? Any pattern?

 When in the history or life cycle of the

assembly was the solder balling defect first
noticed?

24
When IS …..When IS NOT?
 When could the solder balling defect have been
first noticed, but was not?

 When could the solder balling defect have been

noticed since then, but was not?

 When in the history or life cycle of the

assembly could the solder balling defect have
been first noticed, but was not?

25

Assembly’s History or Life Cycle

26
 Q# IS IS NOT

WHAT?
Assembly Assembly “A1006” “A1005”, “A1007”, “A1009”
Defect Solder Balling Bridging, Cold Solder, Open Joint

Assembly plants in the US and

Geography Assembly plants in South Asia
Canada
WHERE?

Location Entire area of U15 or location

on Top right hand corner of U15 U13 and U14 on the same
Assembly assembly
Date &
Prior to January 15, 2011, First
Time First January 15, 2011, First Shift
Shift
Occurred
WHEN?

When
March 15, 2011, Random May 15, 2011
since?

When in
X-Ray Inspection stage after SMT
the life Prior to X-Ray or after X-Ray
Assembly
cycle?
27

Extent IS…..Extent IS NOT?

 How many units of the assembly have the
solder balling defect?

 What is the size of a single solder balling defect?

 How many solder balling defects are on one

unit?

 What is the trend in the assembly and in the

solder balling defect?

28
 Extent IS…..Extent IS NOT?
 How many units of the assembly could have the
solder balling defect but is not?

 What other size could the solder balling defect

be but is not?

 How many solder balling defect could be on

one unit, but is not?

 What could be the trend in the assembly and in

the solder balling defect but is not?
29

Q# IS IS NOT

# of Units 30% 0%, <30%, or >30%

Size of Single
EXTENT?

Defect
# of Defects Entire area of the BGA, or all
One area in one location
on One Unit locations the BGA is used
Assembly Assembly quantity is constant
and Defect (every 2 months) Neither Increasing or Decreasing
Trend The defect trend is random

30
 ANALYSIS

31

Identifying Possible Root Causes

 Narrow down the possibilities based
upon …..
◦ Differences Comes from the data that was
collected and summarized
◦ Changes
◦ Causes and Effect
◦ Knowledge
◦ Experience
◦ Similar Problems

32
 Identifying the Differences &
Changes

 What is different, odd, unusual, or

distinctive about each IS compared to
each IS NOT?

 What has changed in, on, around, or about

each Differences identified?

33

Q# IS IS NOT
WHAT?

Assembly Assembly “A1006” “A1005”, “A1007”, “A1009”

Defect Solder Balling Bridging, Cold Solder, Open Joint

Assembly plants in the US and

Geography Assembly plant in South Asia
Canada
WHERE?

Location Entire area of U15 or location

on Top right hand corner of U15 U13 and U14 on the same
Assembly assembly
Date &
Time First January 15, 2011 Prior to January 15, 2011
Occurred
WHEN?

When
March 15, 2011, Random May 15, 2011
since?

When in
X-Ray Inspection stage after SMT
the life Prior to X-Ray or after X-Ray
Assembly
cycle?
34
 Q# Differences Changes
“A1005”BGA256, 6 Layer PCB Layer count
WHAT? Assembly “A1007”BGA256, 8 Layer PCB US and Canada build
“A1009” BGA169, 8 Layer PCB BGA Size

Component supply chain

Geography New component supplier added
Stencil Supplier
WHERE?

Location Two tantalum capacitors on the

Thermal Mass
on corner of the BGA (Fig. next
Potential for Outgassing
Assembly slide)
Date & New component supplier added
Time First to the supply chain in South Asia
Occurred in January 2011
The assembly was rerun with the
WHEN?

When
new supplier after 2 months and
since?
suspended when defect persisted
When in
the life
cycle?
35

Case 1 – Solder Balling under BGA256

 BGA 256
Tantalum Capacitors
 FR4 PCB, 8 layers, 62 mil
thick
 PCB Assembly A1006
 Manufactured in US,
Canada and South Asia BGA 256
 Parts sourced from
various suppliers
 Random Occurrence
 Requires reworking the
BGAs
36
 Solder Balling – Possible Root
Causes
 Excessive heating rate/flux  Dirty stencils
evaporation  Dirty supports
 Solder particle oxidation  Small particles
 Solder paste viscosity too  Excess pressure pushing
low/slumping onto mask paste onto mask
 Paste print on the solder  Air kiss blowing particles
mask (misalignment) onto the mask
 Preheat ramp up rate high  Solder splattering due to
 Preheat temperature high entrapped volatiles
 Paste contamination or  Outgassing from
oxidized particles neighboring components
 Misprint
 Poor board cleaning
 Excess flux content

37

# Possible Root Causes

1 Worn out stencil aperture

2 High preheat ramp rate and temperature

3 Outgassing of tantalum capacitors

4 Improper stencil cleaning on the bottom side

5 Paste viscosity low causing slumping

6 Component Supplier

7 Process Difference between Geographies

10

38
 IDENTIFYING AND PROVING
THE TRUE ROOT CAUSE

39

Possible Root
# Does Not Explain Explains only if ….
Cause
Reason for Elimination Assumption

Worn out stencil

aperture
1 If worn out stencil is the cause
of solder balling defect, how
does it explain both the IS
and IS NOT?

High preheat ramp rate

and temperature
If preheat is the cause of
2
solder balling defect, how
does it explain both the
IS and IS NOT?
Outgassing of tantalum
capacitors
If outgassing is the cause
3
of solder balling defect,
how does it explain both
the IS and IS NOT? 40
 Possible Root
# Does Not Explain Explains only if ….
Cause
Reason for Elimination Assumption
Improper stencil
cleaning on the bottom
side
If stencil cleaning is the
4
cause of solder balling
defect, how does it
explain both the IS and
IS NOT?
Paste viscosity low
causing slumping
If low paste viscosity is
5 the cause of solder
balling defect, how does it
explain both the IS and
IS NOT?

41
6

Proving the Root Cause

 Check the assumptions using facts

 Observing the cause

 Test the causes with experiments

 Try the fix to see if it works

Caution
1. Have a damage control plan ready
42
 Case Study Finding
 Case 1
◦ Solder balling under BGA256

Identified Root Cause

43

CASE STUDY 2

44
 Case Studies
 Case 1
◦ Solder balling under BGA256
 Case 2
◦ Bottom side SMT components missing after
wave
 Case 3
◦ Tombstoning of 0402 LEDs on a assembly
 Case 4
◦ Insufficient Hole fill on multiple components
45

Collecting more details?

 Questioning to the void ……. 1. Listen
2. Acknowledge
◦ Re-ask the same question or 3. Confirm
4. Document
◦ What else ……? questions
• To get more
Open information
• What? When? Where?
Questions How? Who? Why?

Crack Void
• To clarify something
Closed • Do, Have, Will, Can, Is
...
Questions

46
Details Pertain To ……
 The assemblies (part #) that see the same
defect and not
 The components that have the same
defect and not
 The operators and shifts that seem to be
producing the defect and not
 The date and time you started seeing it
for the first time and since then
 The geographic location of the factory
where you are seeing the defect and not
47

Details Pertain To ……
 The location on the assembly where you
are seeing the defect and not
 The timing in the process flow when you
are you finding the defect and when not
 Any trends in the defect and location of
the defect
Make your thought process visible by writing
down the details as you ask the questions

48
 Q# IS IS NOT

WHAT?
Assembly
Defect

Geography
WHERE?

Location
on
Assembly
Date &
Time First
Occurred
WHEN?

When
since?

When in
the life
cycle?
49

What IS ….. What IS NOT?

 What assemblies or group of assemblies is
having the bottom components missing defect?

 What is wrong with the assemblies?

 What assemblies or group of assemblies could

be having the bottom components missing
defect but is not?

 What could be wrong with the assemblies but

is not?
50
 Q# IS IS NOT

WHAT?
Assembly
Defect

Geography
WHERE?

Location
on
Assembly
Date &
Time First
Occurred
WHEN?

When
since?

When in
the life
cycle?
51

Where IS …..Where IS NOT?

 Where geographically are the assemblies when the
bottom components missing defect is noticed?

 Where is the bottom components missing defect

located on the assemblies?

 Where geographically could the assemblies be

when the bottom components missing defect is
noticed but is not?

 Where could the bottom components missing

defect be located on the assemblies but is not?

52
 Q# IS IS NOT

WHAT?
Assembly
Defect

Geography
WHERE?

Location
on
Assembly
Date &
Time First
Occured
WHEN?

When
since?

When in
the life
cycle?
53

When IS …..When IS NOT?

 When was the bottom components missing
defect first noticed?

 When has the bottom components missing

defect been noticed since then? Any pattern?

 When in the history or life cycle of the

assemblies was the bottom components missing
defect first noticed?

54
When IS …..When IS NOT?
 When could the bottom components missing
defect have been first noticed, but was not?

 When could the bottom components missing

defect have been noticed since then, but was
not?

 When in the history or life cycle of the

assemblies could the bottom components
missing defect have been first noticed, but was
not?

55

Assembly’s History or Life Cycle

56
 Q# IS IS NOT

WHAT?
Assembly
Defect

Geography
WHERE?

Location
on
Assembly
Date &
Time First
Occurred
WHEN?

When
since?

When in
the life
cycle?
57

Extent IS…..Extent IS NOT?

 How many units of the assemblies have the
bottom components missing defect ?

 What is the size of a single bottom components

missing defect ?

 How many bottom components missing defect

are on one unit?

 What is the trend in the assemblies and in the

bottom components missing defect ?
58
 Extent IS…..Extent IS NOT?
 How many units of the assemblies could have the
bottom components missing defect but is not?

 What other size could the bottom components

missing defect be but is not?

 How many bottom components missing defect

could be on one unit, but is not?

 What could be the trend in the assemblies and in

the bottom components missing defect but is not?

59

Q# IS IS NOT

# of Units

Size of Single
EXTENT?

Defect
# of Defects
on One Unit
Assembly
and Defect
Trend

60
 ANALYSIS

61

Identifying Possible Root Causes

 Narrow down the possibilities based
upon …..
◦ Differences Comes from the data that was
collected and summarized
◦ Changes
◦ Causes and Effect
◦ Knowledge
◦ Experience
◦ Similar Problems

62
 Identifying the Differences &
Changes

 What is different, odd, unusual, or

distinctive about each IS compared to
each IS NOT?

 What has changed in, on, around, or about

each Differences identified?

63

Q# IS IS NOT
WHAT?

Assembly
Defect

Geography
WHERE?

Location
on
Assembly
Date &
Time First
Occurred
WHEN?

When
since?

When in
the life
cycle?
64
 Q# Differences Changes

WHAT? Assembly

Geography
WHERE?

Location
on
Assembly
Date &
Time First
Occurred
WHEN?

When
since?

When in
the life
cycle?
65

# Possible Root Causes

10

66
 IDENTIFYING AND PROVING
THE TRUE ROOT CAUSE

67

Possible Root
# Does Not Explain Explains only if ….
Cause

Reason for Elimination Assumption

If is the cause
1 of bottom components
missing defect , how does it
explain both the IS and IS
NOT?

If is the cause
of bottom components
2
missing defect, how does
it explain both the IS and
IS NOT?
If is the
cause of bottom
components missing
3
defect, how does it
explain both the IS and
68
IS NOT?
 Possible Root
# Does Not Explain Explains only if ….
Cause

Reason for Elimination Assumption

If is the cause
4 of bottom components
missing defect , how does it
explain both the IS and IS
NOT?

If is the cause
of bottom components
5
missing defect, how does
it explain both the IS and
IS NOT?
If is the
cause of bottom
components missing
6
defect, how does it
explain both the IS and
IS NOT? 69

Proving the Root Cause

 Check the assumptions using facts

 Observing the cause

 Test the causes with experiments

 Try the fix to see if it works

Caution
1. Have a damage control plan ready
70
 Case Study Finding
 Case 2
◦ Bottom side SMT components missing after
wave
Identified Root Cause

71

EVALUATING ALTERNATIVES
AND SELECTING A FIX

72
Alternatives
 Brainstorm possible alternatives that will
provide a solution to the problem ……
Pick the top 3 in your opinion

73

Develop a list of Objectives to

Evaluate Alternatives
 Objectives are the  Resources to be
set of criteria for used or saved
evaluating ◦ People
alternatives ◦ Equipment
 Expected Results ◦ Money
◦ Correct …… ◦ Time
◦ Minimize …… ◦ Space
◦ Reduce …….  Any regulations or
◦ Prevent …… restrictions
◦ Improve ……

74
Key Objectives …….
 List Key Objectives that you have
identified ………

75

Classifying Objectives
 MUST Objectives & WANT Objectives

Mandatory YES

Measurable YES

Realistic YES

76
# Objectives MUST WANT

Rank/Weight

77

Objectives Alt. 1 Alt. 2 Alt. 3

78
 AVOIDING FUTURE
PROBLEMS

79

Primary and Secondary Effects of

the Decision – Potential Problems
Secondary Effects

Primary Effects

Decision

80
Addressing Potential Problems

81

Methodology References
 Kepner-Tregoe Process
“The New Rational Manager – An Updated Edition for a
New World”
Princeton Research Press, 2006
ISBN 978-0-9715627-1-4

 Universal Troubleshooting Process (UTP)

www.troubleshooters.com

82
 SMT Process

POSSIBLE ROOT CAUSES

FOR DEFECTS

83

Bridging
 Misaligned component/placement
 Excess solder deposition
 Component/board contamination
 Preheat ramp up rate high
 Solder paste viscosity too low or slumping of paste
 No solder mask separation between leads
 Bad/Misaligned print
 Flux separation
 Excess solder paste
 Excess placement pressure
 Hot slumping

84
Tombstoning
 Excessive heating rate
 Pad size mismatch
 Coplanarity error
 Component placement offset
 Paste volume mismatch between pads
 Improper thermal distribution
 Variations in component termination quality
(oxidation levels)
 Paste type (pasty region)
 Insufficient flux activity (variations between
pads)
85

Skewing
 Board Warpage
 Pad size mismatch
 Differential contamination on pads or
terminations
 Improper pad design and layout
 Paste volume variations on pads
 Improper placement

86
Open Joints
 Stencil aperture clogged (insufficient or
no paste)
 Misaligned component
 Component coplanarity error
 Localized board warpage or delamination
 Excessive paste wicking onto the leads
 Contaminated parts/improper wetting
 Contaminated pads

87

Non-wetting
 Solder paste oxidation
 Preheat temperature and time not sufficient
 Soak temperature high (flux drying out
soon)
 Contaminated surfaces of PCB and
component (oxidized)
 Improper or long term storage of PCB and
components
 Insufficient flux quantity and activation
 Reflow temperature too low

88
Dewetting
 Excessive reflow temperature
 Excessive heating rate
 Board contamination

89

Solder Wicking
 Leads hotter than PCB pad
 Coplanarity error
 High peak temperatures
 Contaminated Pads

90
Cold Solder Joints
 Rapid cooling
 Insufficient peak temperature
 Insufficient TAL
 PCB disturbed during cooling
 Excessive heat sinking due to thick
copper plane
 Improper oven temperatures
 Conveyor too fast

91

Component Cracking
 Thermal shock
 Preheat ramp rate too high
 Bad components
 Placement pressure too high
 Improper board supports
 Bad feeders/shutter jam

92
Solder Joint Cracking
 Rapid cooling
 Poor handling
 Thermal Shock
 Localized warpage
 Excessive intermetallic formation (high
TAL and high peak temperature)
 CTE mismatch

93

Voiding
 Solder powder oxidation
 Contamination of PCB and component
surfaces
 Excessive preheat rate
 Excessive fluxing action
 Excess volatile content in flux
 Excessive solder paste quantity
 Insufficient soak time and temperature
 Outgassing of volatiles

94
Blow Holes / Pin holes
 Excessive reflow temperature
 Preheat ramp up rate high
 Excess volatile content in the flux
 Excess contamination

95

Popcorn Delamination
 Preheat ramp up rate high
 Component storage (moisture
absorption)
 Thermal shock
 Excessive reflow temperature

96
Large Grain Size/Grainy Solder
 Board contamination
 Component contamination
 Cooling Rate Low
 Reflow temperature too low

97

Through Hole Technology Process

POSSIBLE ROOT CAUSES

FOR DEFECTS

98
Dewetting and Nonwetting
 Board Rerun
 Conveyor speed high
 Uneven fluxing
 Inactive flux
 Flux Specific Gravity low
 Preheat Temperature – Low
 Solder Contamination
 Solder Wave Height – Low
 Solder Temperature – Low
 Component Lead Contamination
 Board Contamination

99

Solder Voids
 Conveyor Speed High
 Flux Blow-off Insufficient
 Flux Specific Gravity High
 Preheat Temperature Low
 Component Lead Contamination
 Board Contamination
 Moisture in Laminate

100
Outgassing (Voiding, Blow holes and
Pin holes)
 Conveyor Speed High
 Flux Blow-off Insufficient
 Flux Specific Gravity High
 Preheat Temperature Low
 Component Lead Contamination
 Board Contamination
 Moisture in Laminate

101

Skipped or Omitted Solder

 Board Not Seated Right
 Conveyor Speed – High
 Uneven Fluxing
 Inactive Flux
 Uneven Soldering
 Solder Wave Height – Low
 Board Contamination
 Component Lead Contamination
 Board Warped
 Improper Pallet Design

102
Excessive Solder
 Board Rerun
 Conveyor Angle Low
 Conveyor Speed Low
 Uneven Fluxing
 Solder Contamination
 Uneven Soldering
 Solder Wave Height High
 Large Plane on Solder Side

103

Icicles
 Short Cycle Time
 Conveyor Angle Low
 Conveyor Vibration
 Conveyor Speed High
 Uneven Fluxing
 Inactive Flux
 Flux Specific Gravity Low
 Solder Contamination
 Solder Wave Height Low
 Solder Temperature Low
 Component Leads Too Long
 Uneven Soldering

104
Bridging
 Board Rerun
 Conveyor Angle Low
 Excessive and uneven Fluxing
 Flux Specific Gravity Low
 Solder Contamination
 Uneven Soldering
 Component Lead Contamination
 Board Contamination

105

Webbing
 Board Rerun
 Excessive Solder Dross
 Solder contamination

106
Solder Balls and Splatter
 Conveyor Speed High
 Flux Blow-off Insufficient
 Flux Specific Gravity High
 Preheat Ramp Rate High
 Uneven Soldering
 Solder Temperature High
 Board/Component Contamination

107

Cold Solder Joint

 Short Cycle Time
 Conveyor Vibration
 Preheat Temperature Low
 Solder Contamination
 Solder Temperature Low
 Component Lead Contamination
 Board Contamination

108
Flux Entrapment
 Conveyor Speed High
 Flux Blow-off Insufficient
 Inactive Flux
 Flux Specific Gravity High
 Preheat Temperature Low

109

Flooding
 Board Not Seated Right
 Uneven Solder Level
 Solder Wave Height High
 Board Warped
 Improper Weight/Copper Distribution
 Improper Pallet Design

110
Insufficient Barrel Fill
 Board Not Seated Right
 Conveyor Angle High
 Conveyor Speed High
 Uneven Fluxing
 Inactive Flux
 Preheat Temperature Low
 Solder Contamination
 Uneven Soldering
 Solder Wave Height Low
 Component Lead Contamination
 Board Contamination

111

THANK YOU

11
2
 Course Evaluations

Thank you for registering for an IPC APEX EXPO Professional

Development Course(s).

If you attended PD09: Defect Analysis and Process

Troubleshooting - Part 2, please take a few minutes to let us know
what you thought about the instructor and course. Your opinion will
be valued and used to shape future Professional Development
Course(s).

To access the course evaluation from, login to the Agenda Planner

and click on the attended course to find the correct evaluation form.
An email will also be sent with the evaluation form link after the
completion of the course.
*****************************************************
This handbook contains slides that your Instructor authorized for
distribution at IPC APEX EXPO 2017.

Content may differ slightly from the material presented in class.

If your Instructor provides the classroom presentation in electronic
format, you will be sent a copy within 30 days of the event.
******************************************************

PROFESSIONAL DEVELOPMENT WORKSHOP

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