LM 7800
LM 7800
LM 7800
LM340, LM340A and LM7805 Family Wide VIN 1.5-A Fixed Voltage Regulators
1 Features 3 Description
•
1 Output Current up to 1.5 A The LM340 and LM7805 Family monolithic 3-terminal
positive voltage regulators employ internal current-
• Available in Fixed 5-V, 12-V, and 15-V Options limiting, thermal shutdown and safe-area
• Output Voltage Tolerances of ±2% at TJ = 25°C compensation, making them essentially indestructible.
(LM340A) If adequate heat sinking is provided, they can deliver
• Line Regulation of 0.01% / V of at 1-A Load over 1.5-A output current. They are intended as fixed
(LM340A) voltage regulators in a wide range of applications
including local (on-card) regulation for elimination of
• Load Regulation of 0.3% / A (LM340A) noise and distribution problems associated with
• Internal Thermal Overload, Short-Circuit and SOA single-point regulation. In addition to use as fixed
Protection voltage regulators, these devices can be used with
• Available in Space-Saving SOT-223 Package external components to obtain adjustable output
voltages and currents.
• Output Capacitance Not Required for Stability
Considerable effort was expended to make the entire
2 Applications series of regulators easy to use and minimize the
number of external components. It is not necessary to
• Industrial Power Supplies bypass the output, although this does improve
• SMPS Post Regulation transient response. Input bypassing is needed only if
• HVAC Systems the regulator is located far from the filter capacitor of
the power supply.
• AC Inventors
• Test and Measurement Equipment LM7805 is also available in a higher accuracy and
better performance version (LM340A). Refer to
• Brushed and Brushless DC Motor Drivers LM340A specifications in the LM340A Electrical
• Solar Energy String Invertors Characterisitcs table.
SPACE
Device Information(1)
Available Packages PART NUMBER PACKAGE BODY SIZE (NOM)
Pin 1. Input DDPAK/TO-263 (3) 10.18 mm × 8.41 mm
2. Ground
LM340x SOT-223 (4) 6.50 mm × 3.50 mm
3. Output 2
1 LM7805 Family
Tab/Case is Ground or Output TO-220 (3) 14.986 mm × 10.16 mm
TO-3 (2) 38.94 mm x 25.40 mm
TO-3 TO-220
(1) For all available packages, see the orderable addendum at
1 the end of the data sheet.
2
3
TO-263 SOT-223
1 2 1
2 3
3
An IMPORTANT NOTICE at the end of this data sheet addresses availability, warranty, changes, use in safety-critical applications,
intellectual property matters and other important disclaimers. PRODUCTION DATA.
LM340, LM340A, LM7805, LM7812, LM7815
SNOSBT0L – FEBRUARY 2000 – REVISED SEPTEMBER 2016 www.ti.com
Table of Contents
1 Features .................................................................. 1 7.3 Feature Description................................................. 12
2 Applications ........................................................... 1 7.4 Device Functional Modes........................................ 12
3 Description ............................................................. 1 8 Application and Implementation ........................ 13
4 Revision History..................................................... 2 8.1 Application Information............................................ 13
8.2 Typical Applications ................................................ 14
5 Pin Configuration and Functions ......................... 3
8.3 System Examples ................................................... 15
6 Specifications......................................................... 4
6.1 Absolute Maximum Ratings ...................................... 4 9 Power Supply Recommendations...................... 17
6.2 ESD Ratings.............................................................. 4 10 Layout................................................................... 17
6.3 Recommended Operating Conditions....................... 4 10.1 Layout Guidelines ................................................. 17
6.4 Thermal Information .................................................. 4 10.2 Layout Example ................................................... 17
6.5 LM340A Electrical Characteristics, 10.3 Heat Sinking DDPAK/TO-263 and SOT-223
Package Parts.......................................................... 18
VO = 5 V, VI = 10 V............................................................ 5
6.6 LM340 / LM7805 Electrical Characteristics, 11 Device and Documentation Support ................. 20
VO = 5 V, VI = 10 V............................................................ 6 11.1 Documentation Support ........................................ 20
6.7 LM340 / LM7812 Electrical Characteristics, 11.2 Related Links ........................................................ 20
VO = 12 V, VI = 19 V.......................................................... 7 11.3 Receiving Notification of Documentation Updates 20
6.8 LM340 / LM7815 Electrical Characteristics, 11.4 Community Resources.......................................... 20
VO = 15 V, VI = 23 V.......................................................... 8 11.5 Trademarks ........................................................... 20
6.9 Typical Characteristics .............................................. 9 11.6 Electrostatic Discharge Caution ............................ 20
7 Detailed Description ............................................ 12 11.7 Glossary ................................................................ 20
7.1 Overview ................................................................. 12 12 Mechanical, Packaging, and Orderable
7.2 Functional Block Diagram ....................................... 12 Information ........................................................... 21
4 Revision History
NOTE: Page numbers for previous revisions may differ from page numbers in the current version.
• Changed pinout number order for the TO-220 and SOT-223 packages from: 2, 3, 1 to: 1, 2, 3 .......................................... 1
• Added ESD Ratings table, Thermal Information table, Feature Description section, Device Functional Modes,
Application and Implementation section, Power Supply Recommendations section, Layout section, Device and
Documentation Support section, and Mechanical, Packaging, and Orderable Information section....................................... 1
• Deleted obsolete LM140 and LM7808C devices from the data sheet ................................................................................... 1
• Changed Figure 13 caption from Line Regulation 140AK-5.0 to Line Regulation LM340, .................................................. 11
• Changed Figure 14 caption from Line Regulation 140AK-5.0 to Line Regulation LM340, .................................................. 11
Pin Functions
PIN
I/O DESCRIPTION
NAME NO.
INPUT 1 I Input voltage pin
GND 2 I/O Ground pin
OUTPUT 3 O Output voltage pin
6 Specifications
6.1 Absolute Maximum Ratings
over operating free-air temperature range (unless otherwise noted) (1) (2)
MIN MAX UNIT
DC input voltage 35 V
(3)
Internal power dissipation Internally Limited
Maximum junction temperature 150 °C
TO-3 package (NDS) 300 °C
Lead temperature (soldering, 10 sec.)
Lead temperature 1,6 mm (1/16 in) from case for 10 s 230 °C
Storage temperature −65 150 °C
(1) Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings
only, which do not imply functional operation of the device at these or any other conditions beyond those indicated under Recommended
Operating Conditions. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
(2) If Military/Aerospace specified devices are required, please contact the Texas Instruments Sales Office/Distributors for availability and
specifications.
(3) The maximum allowable power dissipation at any ambient temperature is a function of the maximum junction temperature for operation
(TJMAX = 125°C or 150°C), the junction-to-ambient thermal resistance (θJA), and the ambient temperature (TA). PDMAX = (TJMAX −
TA)/θJA. If this dissipation is exceeded, the die temperature rises above TJMAX and the electrical specifications do not apply. If the die
temperature rises above 150°C, the device goes into thermal shutdown. For the TO-3 package (NDS), the junction-to-ambient thermal
resistance (θJA) is 39°C/W. When using a heat sink, θJA is the sum of the 4°C/W junction-to-case thermal resistance (θJC) of the TO-3
package and the case-to-ambient thermal resistance of the heat sink. For the TO-220 package (NDE), θJA is 54°C/W and θJC is 4°C/W.
If SOT-223 is used, the junction-to-ambient thermal resistance is 174°C/W and can be reduced by a heat sink (see Applications Hints on
heat sinking).If the DDPAK\TO-263 package is used, the thermal resistance can be reduced by increasing the PCB copper area
thermally connected to the package: Using 0.5 square inches of copper area, θJA is 50°C/W; with 1 square inch of copper area, θJA is
37°C/W; and with 1.6 or more inches of copper area, θJA is 32°C/W.
(1) ESD rating is based on the human-body model, 100 pF discharged through 1.5 kΩ.
(1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application
report.
(1) All characteristics are measured with a 0.22-μF capacitor from input to ground and a 0.1-μF capacitor from output to ground. All
characteristics except noise voltage and ripple rejection ratio are measured using pulse techniques (tw ≤ 10 ms, duty cycle ≤ 5%).
Output voltage changes due to changes in internal temperature must be taken into account separately.
(1) All characteristics are measured with a 0.22-μF capacitor from input to ground and a 0.1-μF capacitor from output to ground. All
characteristics except noise voltage and ripple rejection ratio are measured using pulse techniques (tw ≤ 10 ms, duty cycle ≤ 5%).
Output voltage changes due to changes in internal temperature must be taken into account separately.
(1) All characteristics are measured with a 0.22-μF capacitor from input to ground and a 0.1-μF capacitor from output to ground. All
characteristics except noise voltage and ripple rejection ratio are measured using pulse techniques (tw ≤ 10 ms, duty cycle ≤ 5%).
Output voltage changes due to changes in internal temperature must be taken into account separately.
(1) All characteristics are measured with a 0.22-μF capacitor from input to ground and a 0.1-μF capacitor from output to ground. All
characteristics except noise voltage and ripple rejection ratio are measured using pulse techniques (tw ≤ 10 ms, duty cycle ≤ 5%).
Output voltage changes due to changes in internal temperature must be taken into account separately.
Figure 1. Maximum Average Power Dissipation Figure 2. Maximum Average Power Dissipation
7 Detailed Description
7.1 Overview
The LM340 and LM7805 devices are a family of fixed output positive voltage regulators with outputs ranging from
3 V to 15 V. They accept up to 35 V of input voltage and with proper heat dissipation can provide over 1.5 A of
current. With a combination of current limiting, thermal shutdown, and safe area protection, these regulators
eliminate any concern of damage. These features paired with excellent line and load regulation make the LM340
and LM7805 Family versatile solutions to a wide range of power management designs. Although the LM340 and
LM7805 Family were designed primarily as fixed-voltage regulators, these devices can be used with external
component for adjustable voltage and current.
NOTE
Information in the following applications sections is not part of the TI component
specification, and TI does not warrant its accuracy or completeness. TI’s customers are
responsible for determining suitability of components for their purposes. Customers should
validate and test their design implementation to confirm system functionality.
When a value for θ(H–A) is found, a heat sink must be selected that has a value that is less than or equal to this
number.
θ(H–A) is specified numerically by the heat sink manufacturer in this catalog or shown in a curve that plots
temperature rise vs power dissipation for the heat sink.
*Required if the regulator is located far from the power supply filter.
**Although no output capacitor is needed for stability, it does help transient response. (If needed, use 0.1-μF, ceramic
disc).
0.22 PF 0.1 PF
GND GND
0.22 PF 0.1 PF
Figure 22. High Input Voltage Circuit With Series Figure 23. High Input Voltage Circuit
Resistor implementation With Transistor
RSC Q1
Q1 IQ1 2N6132
2N6133 IN
VI
Q2
R1 2N6124
3.0: IREG IO MAX
OUTPUT
VO INPUT
INPUT OUT
OUTPUT
0.22 PF 0.1 PF R1
GND
3.0: 0.22 PF 0.1 PF
GND
INPUT OUTPUT
LM79xx
+ +
GND 0.1 PF
- OUT
10 Layout
Figure 29. θ(J–A) vs Copper (1 Ounce) Area for the DDPAK/TO-263 Package
Figure 30. Maximum Power Dissipation vs TAMB for the DDPAK/TO-263 Package
Figure 31 and Figure 32 show the information for the SOT-223 package. Figure 31 assumes a θ(J–A) of 74°C/W
for 1-oz. copper and 51°C/W for 2-oz. copper and a maximum junction temperature of 125°C.
Figure 31. θ(J–A) vs Copper (2 Ounce) Area Figure 32. Maximum Power Dissipation vs
for the SOT-223 Package TAMB for the SOT-223 Package
See AN-1028 LMX2370 PLLatinum Dual Freq Synth for RF Pers Comm LMX2370 2.5GHz/1.2GHz (SNVA036)
for power enhancement techniques to be used with the SOT-223 package.
11.5 Trademarks
E2E is a trademark of Texas Instruments.
All other trademarks are the property of their respective owners.
11.6 Electrostatic Discharge Caution
These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam
during storage or handling to prevent electrostatic damage to the MOS gates.
11.7 Glossary
SLYZ022 — TI Glossary.
This glossary lists and explains terms, acronyms, and definitions.
www.ti.com 21-Sep-2023
PACKAGING INFORMATION
Orderable Device Status Package Type Package Pins Package Eco Plan Lead finish/ MSL Peak Temp Op Temp (°C) Device Marking Samples
(1) Drawing Qty (2) Ball material (3) (4/5)
(6)
LM340MPX-5.0/NOPB ACTIVE SOT-223 DCY 4 2000 RoHS & Green SN Level-1-260C-UNLIM 0 to 125 N00A Samples
Addendum-Page 1
PACKAGE OPTION ADDENDUM
www.ti.com 21-Sep-2023
Orderable Device Status Package Type Package Pins Package Eco Plan Lead finish/ MSL Peak Temp Op Temp (°C) Device Marking Samples
(1) Drawing Qty (2) Ball material (3) (4/5)
(6)
LM7805MPX/NOPB ACTIVE SOT-223 DCY 4 2000 RoHS & Green SN Level-1-260C-UNLIM 0 to 125 N00A Samples
(1)
The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2)
RoHS: TI defines "RoHS" to mean semiconductor products that are compliant with the current EU RoHS requirements for all 10 RoHS substances, including the requirement that RoHS substance
do not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, "RoHS" products are suitable for use in specified lead-free processes. TI may
reference these types of products as "Pb-Free".
Addendum-Page 2
PACKAGE OPTION ADDENDUM
www.ti.com 21-Sep-2023
RoHS Exempt: TI defines "RoHS Exempt" to mean products that contain lead but are compliant with EU RoHS pursuant to a specific EU RoHS exemption.
Green: TI defines "Green" to mean the content of Chlorine (Cl) and Bromine (Br) based flame retardants meet JS709B low halogen requirements of <=1000ppm threshold. Antimony trioxide based
flame retardants must also meet the <=1000ppm threshold requirement.
(3)
MSL, Peak Temp. - The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.
(4)
There may be additional marking, which relates to the logo, the lot trace code information, or the environmental category on the device.
(5)
Multiple Device Markings will be inside parentheses. Only one Device Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a continuation
of the previous line and the two combined represent the entire Device Marking for that device.
(6)
Lead finish/Ball material - Orderable Devices may have multiple material finish options. Finish options are separated by a vertical ruled line. Lead finish/Ball material values may wrap to two
lines if the finish value exceeds the maximum column width.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information
provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and
continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals.
TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.
Addendum-Page 3
PACKAGE MATERIALS INFORMATION
www.ti.com 23-Jun-2023
B0 W
Reel
Diameter
Cavity A0
A0 Dimension designed to accommodate the component width
B0 Dimension designed to accommodate the component length
K0 Dimension designed to accommodate the component thickness
W Overall width of the carrier tape
P1 Pitch between successive cavity centers
Sprocket Holes
Q1 Q2 Q1 Q2
Pocket Quadrants
Pack Materials-Page 1
PACKAGE MATERIALS INFORMATION
www.ti.com 23-Jun-2023
Width (mm)
H
W
Pack Materials-Page 2
PACKAGE MATERIALS INFORMATION
www.ti.com 23-Jun-2023
TUBE
T - Tube
height L - Tube length
W - Tube
width
Pack Materials-Page 3
PACKAGE MATERIALS INFORMATION
www.ti.com 23-Jun-2023
TRAY
W-
Outer
tray
width
Text
Pack Materials-Page 4
MECHANICAL DATA
NDE0003B
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MECHANICAL DATA
NDS0002A
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MECHANICAL DATA
6,70 (0.264)
6,30 (0.248)
3,10 (0.122)
2,90 (0.114)
4
0,10 (0.004) M
Gauge Plane
1 2 3
0,25 (0.010)
0,84 (0.033) 0°–10°
2,30 (0.091)
0,66 (0.026)
0,10 (0.004) M
4,60 (0.181) 0,75 (0.030) MIN
1,70 (0.067)
1,80 (0.071) MAX 1,50 (0.059)
0,35 (0.014)
0,23 (0.009)
Seating Plane
4202506/B 06/2002
.640 MAX
[16.26]
.110 .010
.340 .010 [2.8 0.25]
PIN 1 ID [8.64 0.25]
.100 .010
[2.54 0.25] +.015
2 .400
-.005
.200 .010
[5.08 0.25] [ 10.16
+0.38
-0.12 ]
3
3X .048-.055 3X .032 .005
[1.22-1.39] [0.81 0.12]
.151 .002
[3.84 0.05]
7.0
7
.035 .010
.250 .010
[0.89 0.25]
[6.35 0.25]
+.010
R.025
-.005
[
0.64
+0.25
-0.12 ] .180 .005
[4.57 0.12]
.187 .006
[4.76 0.15]
(.479 )
[12.16]
4219861/A 01/2022
NOTES:
1. All controlling linear dimensions are in inches. Dimensions in brackets are in millimeters. Any dimension in brackets or parenthesis are for
reference only. Dimensioning and tolerancing per ASME Y14.5M.
2. This drawing is subject to change without notice.
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EXAMPLE BOARD LAYOUT
NDG0003F TO-220 - 4.69 mm max height
TRANSISTOR OUTLINE
(.479 )
[12.16]
(.177) 4X (.047)
[4.5] [1.2]
(.229 )
3X (.110) [5.81] ( .008) TYP VIA
[2.8] [0.2]
PKG
3X (.039)
[1]
1
(.328 )
2X (.100 ) [8.32]
[2.54] PKG
2 SYMM
(.400 )
[10.16]
3 6X (.050 ) 8X (.046 )
[1.27] [1.18]
(R.002 ) TYP
[0.05]
(.059 ) 2X
[1.49] (.054 )
(.305 ) [1.37]
[7.74]
(.002 )
[0.05]
EXPOSED EXPOSED
METAL METAL
4219861/A 01/2022
NOTES: (continued)
3. This package is designed to be soldered to a thermal pad on the board. For more information, see Texas Instruments literature numbers
SLMA002(www.ti.com/lit/slm002) and SLMA004 (www.ti.com/lit/slma004).
4. Vias are optional depending on application, refer to device data sheet. It is recommended that vias under paste be filled, plugged or tented.
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EXAMPLE STENCIL DESIGN
NDG0003F TO-220 - 4.69 mm max height
TRANSISTOR OUTLINE
24X (.046 )
[1.17]
3X (.110) 40X (.039)
[2.8] PKG [1] 40X (.039 )
3X (.039) [0.98]
24X (.042 )
[1]
[1.07]
1
(.025 ) (.023 )
2X (.100 ) [0.64] [0.59]
[2.54] PKG
2 SYMM
3 5X
(.050 ) 7X (.046 )
[1.27] [1.18]
(R.002 ) TYP
[0.05]
(.025 )
[0.64]
3X (.054 )
[1.37]
(.305 ) (.201) 4X (.047)
[7.74] [5.1] [1.2]
EXPOSED PAD
61% PRINTED SOLDER COVERAGE BY AREA UNDER PACKAGE
SCALE: 5X
4219861/A 01/2022
NOTES: (continued)
5. Laser cutting apertures with trapezoidal walls and rounded corners may offer better paste release. IPC-7525 may have alternate
design recommendations.
6. Board assembly site may have different recommendations for stencil design.
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