KM3NET RAMS Analysis WRS SCB 20102017

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Analysis Process:
Sheets description:
This user manual

Process factor audit
Name of the document
CHanges history Tools available in order to define reliability
Reference documents models in the bill of material sheet:
-Define capacitor type
-Calculate component temperature
elevation
-Arrhenuis law tool: using manufacturer
given MTTF (to incorporate into FIT data
sheet) calculate FIT for product life profile
-Recommended derating table
-Evaluate mechanical parts FIT (weibull
table) and incorporate into FIT data shit
Note: FIT data are imported each time a new calculation is pro
-Import bill of ma
components or p
-Select belonging
-Display related f
-Select the reliab
-List products, hierarchy component part
definition between listed in FIT data)
products (upper level component or pr
Functions description: is automatically r
-Inputs/outputs Automatic graphical
function display data is the FIT co
-Constraints FIT,. Total FIT= Ind
(generated from
functionnal analysis) FIT*Component Q
-Define and chec
on each compone
check give a red fl
over-rated)
Process factor audit
Failure models and related individual failure rate data
(for the product life profile):
-Reliability data calculted with Fides expertool for
specific component part number and for generic
components with defined stress (data are copy/past
from fides analysis results)
-The life profile corresponding to the data is displayed
in this sheet
-Set the Pi Process related to the process audit result
(from 1 to 8)
-Or data from manufacturer, but failure rate re-
calculated with product life profile (using Arhenius or
Confi_manson law)
-Evaluated data
der to define reliability

material sheet:
pe
nt temperature
using manufacturer
rporate into FIT data
for product life profile
ating table
al parts FIT (weibull
ate into FIT data shit
time a new calculation is processed with Fides tool or each time new manufacturer data are recorded in the FIT data table
Failure rates results

-Import bill of material (list of Product Mean Time To Failure
components or products) calculation results display
-Select belonging Product
-Display related function
-Select the reliability model or
component part number (model are
listed in FIT data). Then for each
component or product line, the FIT
is automatically reported from FIT
data is the FIT column and in total
FIT,. Total FIT= Individual
FIT*Component Quantity)
-Define and check the stress applied
on each component (automatic
check give a red flag if component is
over-rated)
Allow to analyse copy/pa

data and sort from higher
Allow to analyse copy/pa
data and sort from higher
lower (using excel dedicat
function)
e FIT data table
Compact results (select

functional block in order to
display its failure rate)
Display the product hierarchy
Reliability Block Fault Tree Analysis
Diagram tool tool
Allow to analyse copy/paste

data and sort from higher to
Allow to analyse copy/paste
data and sort from higher to
lower (using excel dedicated
function)
Maintenance table:
-Define for each
component product
maintenance actions.
Needed ressources and Audit que
cost. Failure occurence and concernin
Failure Mode Effect and Criticity Analysis: failure mode analysis is an -Results a
-Identify failures modes for whole product, sub- input from FMECA and the scale
components and functions MTTF analysis in order to
-Define the sub-assembly / function related to the define maintenance policy
failure mode and spares policy
-Automatically import from functions failures
results the failure occurence
-Calculate the Reliability Priority Number: allow to
display most critical failures mode
-Define weakness pont
ee Analysis
le:
uct
ons.
es and Audit questions
rence and concerning reliability:
lysis is an -Results are display on
A and the scale from 1 to 4
order to
nce policy
KM3NET RAMS WRS SCB analysis
Chronium board analysis
Reference:
KM3NET_QA_
Ref document
Issue 2
Classification
Public
Name
Prepared by Colonges
Verified by
Approved by
Approved by
Authorized by
Applicable / reference documents
References
RD number Title Ref
reliability_Models_KM3NE
RD1 KM3NET reliability models
T_04052017_RESULTS
RD2 SCB schematic SCB_Schematics_V3_4-2
7S_IDC14-SCB-V3_4-PL-
RD3 SCB Bill Of Material
V3_41
RD5
Date Version Modification history

June 2017 Initial
10/2/2017 2 New template

Capacitor ratings and
reference changes
10/5/2017 3 (references)
SCB analysis and
ard analysis
T_QA_
ment
Revision 0
ation
Restricted X
Date Stamp
10/2/2017
Edition
1
3.4 (18/06/2014)
3.41 (22/09/2014)
Product name Project Author

David Calvo
Stephane
SCB+Chronium KM3NET Colonges
SCB KM3NET David

List of tools, generic parameters, standard data:
Condensator type definition
Integrated circuit elevation temperature calculation
Calculate failure probability for a given FIT
Calculate component FIT for application life profile using manufacturer data from a given temperature
Recommanded derating values
Generic potential failure modes list
Reliability Block Diagram Tool
Mechanical component calculation (weibull law)
Fault tree analysis
Condensator type definition

Non defined temperature coefficient capacitor type analysis:
Value (F) Voltage CV Type (result)

0.00000022 16 Ceramic capacitor with non-defined temperature coefficient (Type
0.000000001 100 Ceramic capacitor with non-defined temperature coefficient (Type
Temperature rise
Integrated circuits
Ctype Ctype value Conductivity

QFN 223 0.94
Discrete components
High conductivity DO15 (DO204C)
Faiilure probability calculation tool (only tool. Calcul are automatically performed in the table)
Time year Time (hour) FIT

100 876000 400
Life Profil
Calendar time
Phase name On / Off
(hours)
Operational / Ready mode ON 1800

Off winter OFF 60
Off summer OFF 60
Safe mode OFF 6840
Mean value 8760
1.5893171311E-227
Calculation from manufacturer data:
Arrhenius
Manufacturer FIT New FIT Manufacturer reference temperatur
1 4.03557399791686 25
Norris Lantzberg acceleration factor Delta T reference
1.00648126929884 10.27
Life Profil 4.03557399791686
Arrhenius * Norris Lantzberg AF 4.06172963977274
Failure probability to FIT calculation tool:

Failure probability Duration (hours) Calculated FIT
0.01 87600 114.729861341341
Derating standard values
Derating Table:
# Category Subcategory
Ceramic capacitor (type 1)

1
Ceramic capacitor (type 2)

2
Aluminuim, liquid electrolyte

capacitor
Capacitor
Aluminium, high capacity

(backup) capacitor
4
Tantale capacitor
6
Connector Signal (<=0,2A)
7
Connector
8
Connector Power (>0,2A)
10 Diode, low power, switching,

signal (<=1A)
11
12 Diode, low power, Schottky

(<=1A)
13
Diode, Zener
14
Diode, Transil (TVS)
15
16
Diode, power, switching (>1A)
17
Discrete
semiconductors
18
Diode, power, Schottky (>1A)
19
20
Transistor, power, MOS (>5W)
21
22 Transistor, low power, MOS

(<=5W)
23
24
Transistor, power, bipolar (>5W)
25
26 Transistor, low power, bipolar

(<=5W)
27
28 IGBT
29
Inductor, coil
30 30
Inductor, power
31 31
Transformer, low power (<=10W)

32 32
Transformer, power (>10W)
33 33
Power, linear IC
34
Low power, linear IC

35
Integrated circuit
Digital IC
36
Microprocessor IC
37
Thermal fuse
38
Fuse
39
Polyswitch fuse
40
41 Photocoupler Optocoupler
42
Quartz Oscillator
43 Quartz, oscillator
Oscillator (voltage)
43 Oscillator
Resistor Low power, chip (<=

44 0,25W)
45
Resistor
46 Resistor Power, wirewound (>

0,25W)
47
Resistor Thermistor
48
Resistor Shunt
49
50
LEDs LED
51
52
Reed relay (mercury, dry)

53
54
55
Electromechanical relay
(<=500W)
56 Relays
57
58
Electromechanical relay (>500W)

59
60
1.12174911010699 0.89146493720384
0.000001
0.000099
Reliability Block Diagram Tool
Goal: Calculate failure probability depending on the reliability dependanc

Fill fuction with "0" if Fill FIT with "0" if empty
RBD locations list Function name FIT
Q1L1 toto 9.83

Q1L2 titi 10
Q1L3 0 0
Q1L4 0 0
Q1L5 0 0
Q1L6 0 0
Q1L7 0 0
Q1L8 0 0
Q2L1 tatat 9.83
Q2L2 0 0
Q2L3 0 0
Q2L4 0 0
Q2L5 0 0
Q2L6 0 0
Q2L7 0 0
Q2L8 0 0
Q3L1 0 0
Q3L2 0 0
Q3L3 0 0
Q3L4 0 0
Q3L5 0 0
Q3L6 0 0
Q3L7 0 0
Q3L8 0 0
Q4L1 0 0
Q4L2 0 0
Q4L3 0 0
Q4L4 0 0
Q4L5 0 0
Q4L6 0 0
Q4L7 0 0
Q4L8 0 0
Mechanical component calculation (weibull law):
Description β η (Years)
Seal, static, gasket N 1.4 3
Seal, static, o-ring N 1.4 3
Seal, dynamic, shaft N 1.4 3
Spring, compression N 1.1 3
Spring, extension N 1.1 3
Spring, torsional N 1.1 3
Solenoid N 1.1 9
Contactor N 1.0 10
Valve, poppet N 1.0 11
Valve, slide N 1.0 17
Bearing, ball N 1.3 5
Bearing, roller N 1.3 6
Bearing, sleeve N 1.0 6
Bearing, linear motion N 1.2 8
Gear, spur N 2.0 9
Gear, helical N 2.0 9
Gear, bevel N 2.0 9
Gear, planetary N 2.0 9
Gear, spline N 2.0 9
Actuator, linear N 1.2 11
Actuator, rotary N 2.0 9
Pump, centrifugal, axial flow N 1.2 4
Pump, centrifugal N 1.2 4
Pump, displacement,
1.2 6
reciprocating N
Pump, displacement, rotary N 1.2 6
Filter, fluid, oil N 1.1 3
Brake, band N 1.4 11
Brake, drum N 1.4 11
Brake, disk N 1.4 11
Brake, magnetic N 1.4 11
Clutch, friction N 1.4 11
Clutch, plate N 1.4 11
Clutch, cone N 1.4 11
Clutch, rim N 1.4 11
Clutch, block N 1.4 11
Clutch, centrifugal N 1.4 11
Clutch, coil N 1.4 11
Clutch, magnetic N 1.0 17
Compressor, centrifugal N 1.9 7
Compressor, reciprocating N 1.9 7
Compressor, rotary N 1.9 7
Motor, DC N 1.2 6
Motor, AC N 1.2 11
Accumulator N 1.4 114
Fasteners, threaded, bolt N 3.0 34
Fasteners, threaded, screw N 3.0 34
Coupling, mechanical, rigid shaft,
2.0 9
clamp/compression N
2.0 9
flange N
2.0 9
sleeve/collar N
Coupling, mechanical, flexible
2.0 34
shaft, bellows N
2.0 34
shaft, flexible insert N
2.0 34
shaft, disk N
Slider crank mechanism N 1.2 6
Transducer N 1.0 2
Belt, drive N 1.2 3
Chain, drive N 1.2 6
Bushing N 3.0 34
Flywheel N 2.0 9
Hinge N 3.0 23
Rivet N 3.0 34
The table below shows a summary of "starting point estimates" for mechanical device fa
For my application, would I expect most devices to fail in "x years?" For this question,
Would I expect the device to wearout, or are failures expected to occur more randoml
Fault Tree Analysis

Years Hours
Period 10 87600
Intermediate fault name:

loss function
Probability:
0.00359433569980242
AND
Basic event name:

titi
FIT:
1000
Probability:
0.08387274565535
rom a given temperature
h non-defined temperature coefficient (Type II) with a medium CV product [ECCC_05]

h non-defined temperature coefficient (Type I) with a medium CV product [ECCC_05]
Dissipated power Air convection

1.00E+00 1.00
Dissipated power Pin Number (Np) RjA (calculated)

7.09E-01 32 28.08
2 42.00
performed in the table)
Quantity failure probability number of failure

20 0.295593729149643 5.91187458299286
Ambient temperature Dt
Cycle duration (hours)
(°C) (°C)
48 10 10
48 50 10
48 15 10
48 10 19
48 10.3082191780822 17.027397260274
Activation energy
0.5
Reference cycle number T max
318.16 30.03 Fides guide 2009, Page 37
9.32069945002727
Code Type of stress Standard stress level
Not Applicable 1
Capacitor, Ceramic Voltage stress
capacitor (type 1) Vapplied / Vrated 0.5
Capacitor, Ceramic Voltage stress
capacitor (type 2) Vapplied / Vrated 0.5
Capacitor, Aluminuim,
liquid electrolyte
capacitor
Voltage stress
Vapplied / Vrated 0.5
Capacitor, Aluminium,
high capacity (backup)
capacitor
Voltage stress
Capacitor, Tantale
capacitor
Voltage stress
Connector, Connector Current stress
Signal (<=0,2A) Iapplied / Irated 0.8
Connector, Connector Voltage stress
Signal (<=0,2A) Vapplied / Vrated 0.8
Connector, Connector Current stress
Power (>0,2A) Iapplied / Irated 0.5
Connector, Connector Voltage stress
Power (>0,2A) Vapplied / Vrated 0.5
Discrete
semiconductors, Diode,
low power, switching,
signal (<=1A) Junction temperature rise
DTj 5
Discrete
low power, switching,
signal (<=1A) Reverse voltage stress
Discrete
low power, Schottky Junction temperature rise
(<=1A) DTj 5
Discrete
low power, Schottky Reverse voltage stress
(<=1A) Vapplied / Vrated 0.5
Discrete
Zener Junction temperature rise
DTj 10
Discrete
Transil (TVS) Junction temperature rise
DTj 10
Discrete
Transil (TVS) Peak Power stress
Papplied / Prated 0.95
Discrete
power, switching (>1A) Junction temperature rise
DTj 10
Discrete
power, switching (>1A) Reverse voltage stress
Discrete
power, Schottky (>1A) Junction temperature rise
DTj 10
Discrete
power, Schottky (>1A) Reverse voltage stress
Discrete
semiconductors,
Transistor, power, MOS Voltage stress
(>5W) Vapplied / Vrated 0.4
Discrete
semiconductors,
Transistor, power, MOS Junction temperature rise
(>5W) DTj 20
Discrete
semiconductors,
Transistor, low power, Voltage stress
MOS (<=5W) Vapplied / Vrated 0.5
Discrete
semiconductors,
Transistor, low power, Junction temperature rise
MOS (<=5W) DTj 5
Discrete
semiconductors,
Transistor, power, Voltage stress
bipolar (>5W) Vapplied / Vrated 0.4
Discrete
semiconductors,
Transistor, power, Junction temperature rise
bipolar (>5W) DTj 20
Discrete
semiconductors,
Transistor, low power, Voltage stress
bipolar (<=5W) Vapplied / Vrated 0.5
Discrete
semiconductors,
Transistor, low power, Junction temperature rise
bipolar (<=5W) DTj 5
Discrete
semiconductors, IGBT Voltage stress
Discrete Junction temperature rise
semiconductors, IGBT DTj 20
Temperature rise
30, Inductor, coil
DT 5
30, Inductor, power Temperature rise

DT 20
30, Transformer, low Temperature rise
power (<=10W) DT 5
30, Transformer, power Temperature rise
(>10W) DT 20
Integrated circuit,
Power, linear IC Junction temperature rise
DTj 25
Integrated circuit, Low Junction temperature rise
power, linear IC DTj 5
Integrated circuit, Digital Junction temperature rise
IC DTj 5
Integrated circuit,
Microprocessor IC Junction temperature rise
DTj 20
Fuse, Thermal fuse Current stress

Iapplied / Irated 0.5
Fuse, Polyswitch fuse Current stress

Fuse, Polyswitch fuse Voltage stress

Photocoupler Junction temperature rise

DTj 10
Photocoupler Current stress

Iapplied / Imax 0.5
Quartz, oscillator Output current stress

Quartz, Oscillator Voltage stress
Vapplied / Vrated 1
Resistor, Resistor Low

power, chip (<= 0,25W)
Power stress
Pdissipated / Pmax 0.2
Resistor, Resistor Low

power, chip (<= 0,25W) Voltage stress
Resistor, Resistor
Power, wirewound (> Power stress
0,25W) Pdissipated / Pmax 0.5
Resistor, Resistor
Power, wirewound (> Voltage stress
0,25W) Vapplied / Vrated 0.8
Resistor, Resistor
Thermistor NA NA
Resistor, Resistor Shunt Current stress
Junction temperature rise
LEDs
DTj 5
LEDs Current stress

Iapplied / Imax 0.5
Relays, Reed relay Contact Voltage stress
(mercury, dry) Vapplied / Vrated 0.8
Relays, Reed relay Contact Current stress
(mercury, dry) Iapplied / Irated 0.8
Relays, Reed relay Coil voltage stress
(mercury, dry) Uapplied / Urated 0,8< ratio <1,2
Relays,
Electromechanical relay Contact Voltage stress
(<=500W) Vapplied / Vrated 0.8
Relays,
Electromechanical relay Contact Current stress
(<=500W) Iapplied / Irated 0.8
Relays,
Electromechanical relay Coil voltage stress
(<=500W) Uapplied / Urated 0,8< ratio <1,2
Relays,
Electromechanical relay Contact Voltage stress
(>500W) Vapplied / Vrated 0.8
Relays,
Electromechanical relay Contact Current stress
(>500W) Iapplied / Irated 0.8
Relays,
Electromechanical relay Coil voltage stress
(>500W) Uapplied / Urated 0,8< ratio <1,2
ability depending on the reliability dependancies (Parrallel or serial configuration)
Q1
Q2
Q3
Q4
2-Year Renewal 15-Year Renewal

8-Year Renewal Interval (FPMH)
Interval (FPMH) Interval (FPMH)
31 41 42
31 41 42
31 41 42
36 39 39
36 39 39
36 39 39
11 12 13
11 11 11
10 10 10
6.7 6.7 6.7
17 23 25
13 19 20
19 19 19
11 14 15
2.8 9.9 14
2.8 9.9 14
2.8 9.9 14
2.8 9.9 14
2.8 9.9 14
7.3 9.4 10
2.8 9.9 14
24 29 30
24 29 30
15 19 20
15 19 20
36 39 39
5.2 8.7 10
5.2 8.7 10
5.2 8.7 10
5.2 8.7 10
5.2 8.7 10
5.2 8.7 10
5.2 8.7 10
5.2 8.7 10
5.2 8.7 10
5.2 8.7 10
5.2 8.7 10
6.7 6.7 6.7
5.2 15 18
5.2 15 18
5.2 15 18
15 19 20
7.3 9.4 10
0.20 0.35 0.44
0.012 0.19 0.64
0.012 0.19 0.64
2.8 9.9 14
2.8 9.9 14
2.8 9.9 14
0.20 0.78 1.4
0.20 0.78 1.4
0.20 0.78 1.4

15 19 20
57 57 57
34 40 40
15 19 20
0.012 0.19 0.64
2.8 9.9 14
0.038 0.59 2.0
0.012 0.19 0.64
ing point estimates" for mechanical device failure rates, in failures per million hours (FPMH), for the device categories covered in the Ha
devices to fail in "x years?" For this question, "most devices" means 63 % of the population. If the answer is no, then a longer characteri
are failures expected to occur more randomly over time? Rapid wearout is modeled using larger values of β, whereas if the population o
Dreaded event name:
Probability:
0.00359433569980239
OR
Basic event name:

toto
FIT:
500
Probability:
0.0428546325951036
Temperature
elevation
19.92
29.80
Maximum temperature
Number of cycles Relative humidity
during cycling
(/phase) (%)
(°C)
180 30 40
6 30 40
6 40 40
360 30 40
318.164383561644 30.0684931506849 40
009, Page 37
Applicable
stress levels Max applicable
(Space industry: stress levels (UTE C
e.g. ECSS) 80-810)
for information for information Comments
Voltage stress
Voltage stress Vapplied / Vrated = 0,8
Vapplied / Vrated = 0,3 Voltage stress
Vapplied / Vrated = 0,8
Liquid electrolyte
aluminium
capacitors are life
limited devices
Temperature of
capacitor
(Ambient + Heat
generation) is a
key for calculating
Voltage stress expected life
- Vapplied / Vrated = 0,5
Liquid electrolyte
aluminium
capacitors are life
limited devices
Temperature of
capacitor
(Ambient + Heat
generation) is a
key for calculating
expected life
- -
Bad voltage peaks
tolerance
High sensibility on
soldering flow
Temperature of
capacitor
(Ambient + Heat
generation) is a
Voltage stress Voltage stress key for calculating
Vapplied / Vrated = 0,3 Vapplied / Vrated = 0,5 expected life
Junction -
temperature rise
DTj=+5°C
-
Voltage stress
-
Junction
temperature rise
DTj=+5°C
Only during
overvoltage event
(e.g. lightning)
-
-
"Drain - Source"
voltage stress
-
Junction
-
temperature rise
DTj=+20°C
"Drain - Source"
voltage stress
-
"Collector -
Emitter" voltage
stress
-
Voltage stress
-
Junction
temperature rise "Collector -
DTj=+20°C Emitter" voltage
stress
-
-
"Collector -
- Emitter" voltage
- stress
-
-
Temperature rise
DT=+5°C - Signal filtering
Temperature rise Power filtering,

DT=+20°C - DC/DC converters
Signal
- - transformers
- -
Linear power
supply, DC/DC
Junction - converters
temperature rise
DTj=+20°C - AOP, ADC, DAC
Gates, buffer,
- MUX, Memory
Junction
temperature rise Micro, FPGA,
DTj=+10°C - ASIC
- -
- -
- -
Junction
temperature rise
DTj=+20°C -
Transistor output
- - current
NA NA
SMD components
can stressed
Power stress surrounding
Papplied / Prated = 0,3 components
- -
Power stress Power stress

Papplied / Prated = 0,3 Papplied / Prated = 0,7
- -
NA NA No derating stress
- -
- -
- -
- -
- -
- - Refer to datasheet
- -
- -
- -
- -
- -
- -
Level 1 Level 2
toto titi
9.83 10
tatat 0
9.83 0
0 0
0 0
0 0
0 0
F(t1) 0.00086073735290282 0.00087562

F(t2) 0.00086073735290282 0
F(t3) 0 0
F(t4) 0 0
F(t) tot 7.40868790682151E-07 0.00087562

R(t) tot 0.999999259131209 0.99912438
Years Hours Total

Period 10 87600 Reliability %: 0.99912364
FR Total (%): 0.00087636
0.09277529434202
Picture
0.0099
14.7781121978613
Shape (B) 1.2
Life (n) 35040
Temps (interval de temps 127440 3.6369863
4.70858049
Weibull (R(t)) 0.00901756907327
Lambda (FIT pour le tem3.69474300479E-05

MTTF 27065.4819213131
H), for the device categories covered in the Handbook of Reliability Prediction Procedures for Mechanical Equipment NSWC-11 (ref. 4)
n. If the answer is no, then a longer characteristic life should be chosen.
g larger values of β, whereas if the population of devices is expected to fail randomly, or to contain a mixture of defective devices and "g
Intermediate fault name:
Probability:
0
OR
Basic event name: Basic event name:
FIT: FIT:
0
Probability: Probability:
0 0
CTYPE Value For case thermal resistance
-
CBGA 480
CDIP 320
CGFP 560
CGFP 410
JCLCC 470
PBGA 450
PDIP 360
PLCC 390
PPGA 380
PQFP 340
PQFP 570
QFN 223
SOIC 400
SOJ 400
Low conduct 41 1 2
Low conduct 378 134 2
Low conduct 73 45 2
Low conducti 195 150 3
Low conducti 65 4 3
Low conduct 97 4 4
SOP 410
SSOP 560
TQFP 480
TSOP 750
TSSOP 650
SOT23 285
RJA value
Discrets actif Rja Rjc Np
Low conduct 60 5 2
Low conduct 58 1 4
Low conduct 96 3 3
Low conducti 63 1 3
Low conduct 35 1 4
Low conducti 40 1 2
Low conductivity SIL_LC
Low conductivity SIP_LC
Low conduct 88 27 2
Low conduct 67 2 2

Low conduct 93 31 2
Low conduct 100 8 3
Low conduct 84 21 4

Low conduct 95 3 3
Low conduct 40 1 3
Low conduct 58 4 3
Low conduct 47 1 3
High_conductivity
High conduct 42 2
High conduct 30 2
High conduct 241 2

High conduct 50 2
High conducti 126 3
High conduct 45 3
High conduct 71 4
High conduct 40 4
High conduct 50 3
High conducti 44 3
High conduct 26 4
High conducti 29 2
High conductivity SIL
High conductivity SIP
High conduct 59 2
High conduct 46 2
High conduct 361 2
High conduct 73 2
High conduct 202 2
High conduct 216 2
High conduct 273 2
High conduct 62 2
High conduct 360 3

High conduct 136 5
High conduct 133 6
High conduct 67 3
High conduct 125 4
High conduct 318 6
High conduct 250 4
High conduct 57 4
High conduct 328 3
High conduct 139 4
High conduct 318 3
High conduct 229 5
High conduct 351 6

High conduct 302 3
High conduct 142 3
High conduct 117 3
High conduct 64 3
High conduct 9 3
High conduct 40 3
High conduct 34 3
Level 3 Level 4 Level 5
0 0 0
0 0 0
0 0 0
0 0 0
0 0 0
0 0 0
0 0 0
0 0 0
0 0 0
0 0 0
0 0 0
0 0 0
0 0 0
1 1 1
Equipment NSWC-11 (ref. 4). These estimates are shown for three device renewal intervals, two years, eight years and 15 years. The d
e of defective devices and "good" devices, a value closer to 1.0 may be more appropriate.
Level 6 Level 7
0 0
0 0
0 0
0 0
0 0
0 0
0 0
0 0
0 0
0 0
0 0
0 0
0 0
1 1
ht years and 15 years. The device is assumed to be "as good as new" after renewal. The assumed Weibull shape parameter and charac
Level 8
0
0
0
0
0
0
0
0
0
0
0
0
0
1
shape parameter and characteristic life is shown in columns two and three. These estimates are based primarily on Barranger "typical"
marily on Barranger "typical" estimates for similarly named device categories (ref. 1). Mechanical device failure rates are ultimately depen
re rates are ultimately dependent on a multitude of factors, including specific device characteristics, applied loads, duty cycle and failure
loads, duty cycle and failure definition. Click the N in the description field to go directly to the relevant NSWC-11 handbook section, wh
WC-11 handbook section, which provides further information on failure modes, mechanisms and application considerations. Reference 1
considerations. Reference 1 provides very broad ranges for Weibull characteristic life and shape parameter estimates, which can have
r estimates, which can have a very significant impact on the estimated failure rate. Larger estimates of beta indicate a more pronounced
indicate a more pronounced end of life wearout phase. Larger estimates of characteristic life (the point where 63.2 % of the population
ere 63.2 % of the population is expected to fail) indicates a more durable device, or lower applied loads. The user should adjust these e
e user should adjust these estimates based on the specific application and their own engineering judgment. Questions such as the follo
Questions such as the following may be helpful in making revised estimates:
Consignes
Pi Process result =
Or imposed Pi Process:
Requirements
Recommendation
Numéro
Financing is assigned to the project's reliability
manager. This is the subject of a separate item (at
accounting level) in project management.
1
Personnel and means necessary for carrying out
Reliability studies satisfactorily are made available
to the product reliability manager
The operating dependability (reliability) business
2 participates in the allocation of requirements to
subassemblies.
Describe the environment in which the product will

be stored, transported, used and maintained.
Describe average and maximum quantitative
values for the following characteristics:
Temperature,
Humidity
Shocks
26
Vibrations,
Pressure
Penetration/abrasion,
Ambient light,
Mounting position,
Weather (wind, rain, snow),
Operators' qualification level.
Define precisely what will be considered as a
28 product failure (possibilities of acceptable
degraded modes)
(e.g. > high limit at 60%), failures due to reliability.
For example, this can include classes C, E, F, V1
in the following classification of the origin of
technical events.
C: Random failure of a component / E: Incomplete
study (or defective design) / F: Manufacturing
outside standard (or production defect) / M:
Manipulation too severe (or failure to respect the
user and maintenance documentation) / O: Special
check (check correct operation) / P: Preventive
maintenance / R: Application of a retrofit / S:
Consequence of another failure (or
secondary failure) / V: Aging of equipment (1
Unexpected wear, 2 life limits exceeded) / X: Use
outside specifications / Y: Abnormal technical
events (or unconfirmed anomaly) / ?:
Undetermined origin or cause.
Measurement method: e.g. No. of hours of flight /
29 No. of failures with determined causes. In general,
conformity with a requirement can be verified by
one of the following four methods depending on its
nature:
· Inspection (I): Visual or dimensional verification of
product constituents. The verification is based on
human senses (view, touch) or uses simple
measurement and manipulation methods.
No stimulus is necessary. Passive means such as
a measuring tape, microscope, gauge etc. can be
used.
· Analysis (A) : Verification based on analytic
proofs obtained by calculation, without any
intervention on product constituents. The
techniques used are modelling, simulation and
prediction. E.g. predicted reliability calculation.
· Demonstration (D) : Verification of observable
characteristics on product constituents while
functioning, without the use of physical
Define the life profile for the product (breakdown
into operational scenarios for which reliability
performances are expected).
Give successive phases for use of the product
(environment/phase duration pair).
The description shall cover at least the following
phases:
31
Storage (non-functioning, protected environment,
small temperature variation, controlled humidity,
etc.),
Non-functioning (the product possibly being in its
operational environment),
Operational functioning (e.g. in flight, taxiing,
navigation, etc.).
The following essential elements must be taken
into account in formulating the requirement for a
reliability specification:
- Quantitative formulation of the reliability
requirement,
- Complete description of the environment in which
the system will be stored, transported, used and
maintained,
- Life profile of the product for which Reliability
40 performances are expected,
- Clear identification of the type of time
measurement (Hours of operation, Hours of flight,
cycles, etc),
- Clear definition of what forms a failure,
- Clear description of the method selected to
demonstrate that the system is confirming with the
specified reliability,
- Associate penalties with a failure to satisfy
reliability requirements.
Make use of feedback from operations obtained

from similar products used in similar environments
so as to achieve a good level of confidence in
maintenance of reliability performances.
Feedback from operations is also used to calibrate
or check predictive reliability methods.
These studies require a large amount of time to
collect operational data and precise recording of
anomalies encountered.
53 Input data comprise
- records of observed anomalies,
- conditions for use of the product (life profile,
operational environment, usage duration),
- analysis of the cause of the failure (that may or
may not be due to the manufacturer).
Output data comprise:
Operational reliability that may be extrapolated for
different environments and life profiles by models
output from the system engineering.
Use reliability engineering to optimise product

architecture, design choices. Give reliability
54
engineering authority if a reliability performance is
not reached
At least one of the following three types of
specifications (or an equivalent) must be used for
the specification of reliability performances (that
must be quantitative):
The MTBF or the failure rate is a definition adapted
to reparable systems with a long life and / or for
which the life of missions is short relative to their
MTBF. The validity of the assumed constant failure
rate in time sometimes needs to be proven.
The probability of survival for a defined time period.
For example, this specification is used when a high
57 reliability level is required throughout the mission
duration.
The probability of success independent of time for
single use devices. It can also be used for devices
with cyclic use.
These quantitative values shall be specified either
as average values (design objectives) or minimum
acceptable values below which the customer finds
that the system is completely unsatisfactory with
regard to his operational requirements. The
objective type (design objective or minimum
acceptable) shall be specified explicitly.
Formally identify requirements and critical factors

related to reliability. The risk management
62 procedure will use this information.
Mark and manage these risks.
Existence of an action plan.
Identify the type of time measurement for reliability

64 performances (Hours of operation, Hours of flight,
cycles, etc).
Customer requirements must be identified,

65 documented and traced with respect to input
documents.
Reliability requirements must be negotiated to take

account of the state-of-the-art of technology and to
optimise the cost-performance of the product
design and Reliability studies.
For an initial objective requested by the customer,
103 a study by the project manager will evaluate the
cost of achieving Reliability performances and
propose alternatives so as to optimise the cost of
achieving Reliability performances.
The results of the negotiations will be integrated
into the final offer submitted to the customer.
Organise a design review. Check that reliability
requirements are respected.
106 This review defines:
- reliability allocations
- conditions for use (life profile)
Organise a requirements review, check that all

reliability requirements are identified and that the
107 customer and the supplier understand each other.
It must be possible to validate, achieve and
verify these requirements (conformity means).
The maintenance policy requested by the customer

117 should be taken into account in this activity to
maintain product reliability in the long term.
A Reliability plan has been written, or there is a

122 Development Plan that fully describes reliability
aspects
Design
Recommendation
Numéro
Obtain technical data for subassemblies in order to
6
develop the production test.
Procedures related to corrective actions include:

- Effective processing of customer complaints and
product nonconformity reports,
- The search for the causes of nonconformity
related to the product, the process and the quality
7
system, and recording the results of this search,
- Determining corrective actions necessary to
eliminate the causes of nonconformity,
- Application of all means to measure the
effectiveness of the corrective action.
Procedures related to preventive actions include:
- The use of appropriate information sources such
a processes and operations affecting the product
quality, waivers, audit results, quality records,
maintenance reports and customer complaints, so
as to detect, analyse and eliminate the potential
causes of nonconformities,
8 - Determination of appropriate steps to deal with
any problem requiring preventive action,
- Triggering of preventive actions and the
application of control means to make sure that they
produce the expected effect,
- Assurance that relative information about actions
implemented is submitted to the management
review.
Make sure that a person responsible for logistics

support, industrialisation, purchasing,
development and RAMS is involved at every step.
16 Make sure that the baseline used allows
simultaneous engineering. The contractor's
organisation is based on permanent specialists of
the function.
Set up training courses so that the person is in full

control of the test means, standards and
34
interpretation of measurements: planned training
and monitoring of skills
Make sure that all data justifying the need are
available and are validated in a preliminary
36
reliability study document. A directive imposes that
this document is written.
Have a means of recording know how and

technical standards through business procedures
(information recording the designer's know how:
38 guidelines, checklist, process, operating
methods, etc.).
Manage and monitor these procedures as a
function of changes to techniques.
Make sure that the skills required for an activity are

assigned by name in a regularly reviewed skills
39
table and periodically verify that training is
appropriate for the activities.
Make sure that there is a list of business
recommendations on manipulation and storage
44 operations at the user, for use by Logistics
Support. This collection must be enriched by
feedback from operations.
Produce and maintain a preferred components list
48
taking account of reduced reliability characteristics.
Make sure that there is a methodology to:

gather technical events, update, operation.
Recording feedback from operations, with the
objective of improving the reliability of future
50
designs.
Make sure that feedback from operations is
actually used by designers; existence of a usage
methodology.
Make sure that there is centralised management of

reliability evaluation studies to reuse previous
calculations with stresses:
51
clearly identified basic assumptions,
data extractable and reusable by design
businesses
Make sure that the traceability and justification for

the design are done with the objective of
52 controlling definitions and changes.
Existence of a methodology to allow access to this
information within the design office.
Use reliability engineering to optimise product
architecture, design choices. Give reliability
54
engineering authority if a reliability performance is
not reached
List and implement protection means to avoid
61
reducing the reliability of the subassembly.
Formally identify requirements and critical factors

related to reliability. The risk management
62 procedure will use this information.
Mark and manage these risks.
Existence of an action plan.
Make sure that the test coverage is maximum and

83 is based on the specification. Justification of
the coverage in a document.
Implement design verifications: these procedures

must be based on proof reading, approval
86 circuit and reviews with the objective of making
sure that the orientation actions, and elements
chosen are correct.
Make sure that the maintenance concept is
formalised and validated by the customer.
Example of documents to be presented in
87
response to requirements of the concept:
integrated logistics support plan, logistics
supportability file.
Organise a design review. Check that reliability

requirements are respected.
106 This review defines:
- reliability allocations
- conditions for use (life profile)
Make sure that adjustments to the baseline are

specified in the management plan.
123 Make sure that skills are committed on the project
in the management plan and that there is a
planning.
Make sure that there is an acceptance procedure

and that it is relevant.
The acceptance procedure is written from a
124 definition file and a test oriented manufacturing file
describing adjacent cases, presenting a functional
description, inputs/outputs, and key
manufacturing points.
Make sure that there is a project documentation to

130
correctly evaluate the reliability.
Make sure that there is a design methodology
obliging designers to apply rules aimed at
131
improving reliability. Make sure that it is checked
that rules are applied.
Make sure that the developer includes test

operation stresses specified by the test manager in
132
the product definition.
There is a precise test methodology.
Make sure that there is a product / process

133 qualification procedure for manufacturing
processes.
Make sure that suppliers are qualified and follow

134 up the following aspects: sustainability, quality
monitoring.
Make sure that there is a qualification procedure so

as to evaluate risks related to the use of the
135
new technology component (for example by
extrapolation of use in a similar environment).
Make sure that the predicted reliability calculation

137 is made using a recognised tool associated
with the selected calculation methodology
Make a compromise between the complexity of
built-in tests and the reliability of components
147 used for the operational functions, in order to
achieve an effective test coverage ratio.
Request a justification document on the subject.
Use of validated and recognised modelling means

(particularly electrical, thermal, mechanical
150
models).
Demonstrate that tools are monitored and updated.
Manufacturing of board or sub-assemblies

Recommendation
Numéro
The product final test and particularly the coverage

level achieved by this test must be studied
and defined with respect to the product.
Specification and Design.
5 This test must check the product according to
procedures in the System Testability Manual:
- Appropriate treatment in case of a nonconformity,
- Recording and saving results for monitoring of
tests.

7
a processes and operations affecting the
product quality, waivers, audit results, quality
records, maintenance reports and customer
complaints, so as to detect, analyse and eliminate
the potential causes of nonconformities,
review.
The subassembly varnishing activity, that must

result in immunity to a number of stresses that can
reduce the reliability of the subassembly, must be
carried out with a permanent inspection particularly
dealing with monitoring of the main parameters
that are:
17
- The humidity rate,
- The temperature,
- The quality of varnish constituents,
- The thickness of the varnish deposit.
The varnish viscosity must also be checked at
least daily.
Maintenance procedures related to corrective

actions in production must include:
- Effective processing of complaints and
subassembly nonconformity reports,
- The search for causes of nonconformity related to
the process and recording of the results of
18
this search,
- Determination of corrective actions necessary to
eliminate causes of nonconformity,
- Application of control means to assure that the
corrective action is implemented and that it
produces the required effect.
Based on the defined preventive maintenance plan

and after its production, a correction is made
by:
19 redefining production means references,
replacement of consumables,
replacement of worn and therefore potentially
defective parts (probes and inspection tools).
This verification is less complicated than a planned
preventive maintenance action, and should be
done by the user of the means (it forms part of the
operator's training). Its purpose is to make sure
that the operation will be done correctly and that it
21
will provide the expected result (using the right
loaded software or a correct configuration).
The frequency of the verifications (to be defined)
may be systematic before each use or after a
defined number of uses of the means.
This filter assures that the final test that forms the
final verification milestone is carried out by a
competent person and particularly a person whose
skills are monitored to assure that the most
22
recent requirements are taken into consideration.
The audit assures that the operator reviews control
over procedures and critical points, to achieve
perfect confidence in execution of the final test.
It is important to perform the minimum number of

manipulations of subassemblies during the
production phase to limit risks of mechanical
shocks and other overstresses.
Furthermore, the automation of manipulations
23
between activities during the entire production
provides a means of eliminating a large number of
failures caused by human intervention.
This recommendation remains applicable to very
small series
It is essential to specifically monitor and maintain

(by updating) references coordinates, batch
25 numbers, etc.) loaded in production tools, for the
automation of tasks and for reliable execution of
activities.
Delegation of the general inspection assures

objectivity making it possible to better filter any
errors that could have occurred during processes
used for varnishing of subassemblies and critical
33
for reliability.
Filling in the follower sheet enables traceability of
all operations and actions that occurred during
this varnishing.
The particular subassembly drying task within the
varnishing activity requires know-how by the
operator, who therefore needs to be experienced if
it is required to avoid overstressing subassemblies.
37
Reduced reliability due to an excessively high
temperature, an excessively long application or
imperfect drying, can cause serious degradations
in the remainder of the process.
Operators must be provided with a workstation

datasheet or any other information means
41
describing actions to be carried out and different
instructions and protocols to be followed.
Take readings of temperature profiles for each

program used with the soldering means to
precisely determine levels that were applied
42
(amplitude and duration so as to verify that values
remain within the required range during execution
of the activity).
The description of actions to be carried out during

application of a production tool on a subassembly
must be sufficiently explicit to not allow
interpretation by the operator that would result in
43
accidental use of inappropriate means.
It must be assured that the reliability of
subassemblies will not be reduced by the use of an
unsuitable tool.
Recording on an Anomaly datasheet type

document facilitates monitoring of different
malfunctions.
This anomaly datasheet is one of the main
46 documents used to implement preventive and/or
corrective maintenance actions.
The assembly contributes to traceability for
management of nonconformities (products and
means).
The different subassemblies are made and

integrated starting from planned tasks that may
correspond to simultaneous activities. Priorities
have to be managed, so that only a minimum
60 number of subassemblies needs to be stored (any
time taken in routing production will require
storage and additional manipulations of
subassemblies), thus limiting ways in which the
reliability of elements might be reduced.
61
A clear statement of persons authorised to approve
process changes must be available.
These changes requiring acceptance by the
customer must be identified before they are
applied.
Any change affecting processes, production
77
equipment, tools and programs, must be
documented and must lead to a procedure to
control its application.
Make sure that results of process changes produce
the required effect and that the changes have
not reduce the product quality.
Measure the bath contamination by sampling

(frequency to be defined) so as not to exceed the
84 allowable pollutant content during this activity.
Excess content of pollutant will increase the risks
of reducing the reliability of the solder.
Set up self-checking to filter human errors that

88
could reduce the reliability of the subassembly
It must be impossible for reliability to be reduced

due to nonconformity of soldering (missing, excess
or offset) during electronic component transfer
activities.
89
Indicators (deposited quantity, appearance after
transfer, etc.) must be identified and they must be
monitored (operator check, etc) to detect all
causes of reduced reliability of subassemblies.
Setting up periodic store inventories prevents the

use of any elements that do not satisfy expiration
90 criteria; correct name or identification, correct
geographic location during storage).
Set up protections against ESD for subassemblies

91
during manipulations and storage.
A number of production means parameters are

provided by test tools (probes, sensors, detectors,
etc.).
These test tools need to be monitored periodically
(frequency to be defined) to assure that the
92
measurements made are reliable.
The delta between the stress actually applied by
the production means and the measurement
made of this stress must be minimal and perfectly
measurable.
Set up suitable protections if necessary to avoid
degrading subassemblies during this activity.
The purpose of these protections is to isolate part
93
of the subassembly, and it must be possible to
verify that they were effective after the activity is
complete (tests, measurements).
Set up a self-test of testers in order to detect any

anomalies.
It must be impossible to perform a test if the self-
test is not conclusive or unless there is a traced
94
waiver (authorisation to execute the test provided
that the follower sheet is marked and signed and
cannot be separated from the subassembly)
accompanying the subassembly thus tested.
This cross check filters nonconformities before the

subassembly is continued in the production
process.
95 The final inspection activity is the last level for
identification of errors that could reduce the
reliability of the subassembly caused by unreliable
varnishing.
A so-called conformity check must be identified

and must occur before every final entry of items
into storage.
96
Check on reception that there is no non-
conforming element that could potentially reduce
reliability during the remainder of the process.
Use of the statistical process control by making

SPC (Statistical Process Control) cards verifies
that some activities carried out at precise moments
97 in the production phase take place correctly.
The SPC is used for activities for which the risk
(statistical) of having a nonconformity that reduces
the reliability of the subassembly is highest.
The special feature of the varnishing activity

requires a precise description of the protocol and
98
parallel actions to be followed to assure that it is
done reliably.
Accidental use of out-of-date consumables can

have a negative influence on quality and
consequently reliability, a number of suitable
methods must be set up for preservation,
identification and withdrawal of the products
99
concerned if necessary.
Systematically reading labels before use to identify
each product used and to obtain all information
about expiration, reduces risks of using a product
that would reduce reliability.
This involves monitoring of test execution
indicators to take immediate action with:
- a definition of envelope curves, outside which it
can be deemed that there is no anomaly,
- an alarm as soon as an anomaly is detected,
100
- suspension of the current activity to avoid
stressing the subassembly,
- compulsory action and correction of the anomaly
before the activity can be resumed and
continued.
This maintenance by metrological monitoring of

production tool parameters must make it possible
to eliminate the risk of degrading the reliability of
an element by aggression of the subassembly
101
(overstress). The use of parameters that are not
precisely consistent with specified parameters
(temperature too low, etc.) would make it
impossible to assure that the operation is reliable.
The activity must be done under the permanent

control of a number of fundamental parameters
102 and it must be possible to determine if the
subassembly was overstressed or affected by a
malfunction during this activity.
Have high and low safety systems tied to

inspection and monitoring means (systematically
112
stop the cycle and have a technician carry out an
analysis before restarting)
Possess a plan for qualification of a method of

removing the masking varnishes used so as to
avoid reducing the reliability of the subassembly.
115
Risks of the penetration of humidity affecting the
reliability of the subassembly are strong if the
operator does not take some precautions.
Include an inspection step (even visual) to assure

120 that the masking varnish is placed correctly before
varnishing.
Provide preventive maintenance (by the use of a

plan describing a maintenance strategy) to detect
an anomaly, if there is one, before use on the
121 subassembly.
This maintenance must be described in a
maintenance plan describing intervals, parameters
to be verified, critical levels, margins, etc.
Wait for the time necessary to reach thermal
equilibrium between each transfer phase to avoid
125 overstressing the subassembly.
A procedure must specify this need and describe
the method.
All preventive and corrective maintenance

operations for keeping production means and tools
in condition, must be described in a plan revised
periodically so as to prevent the use of any tool for
126
which parameters have changed (drifts, etc.) and
that could thus cause damage (physical
deformations of component connections) during
placement operations.
Make sure that varnish preparation (dosing) is

127 controlled by a qualified procedure and
measurements used for checking before use.
Make sure that the operators are well informed

128 about final test activities and study how to update
their skills in real time.
Make sure that the final inspection of the

varnishing is effective by strict application of the
inspection procedure. This final inspection must
verify that the subassembly has passed each
129
elementary step and its associated inspection
(check the various validations of documents
attached to the subassembly), respecting a
formalised procedure.
Make sure that the person who will perform the

136 task knows the procedure for implementing the
means at a production workstation.
Make sure that the right software is loaded and

more particularly that it is the most recent version
138 to be used in the subassembly.
This identification information must also be traced
Make sure that maintenance is done on production

means and that this maintenance is followed,
139
particularly to take account of the most recent
nonconformities.
Make sure that the operator has received training

140
(qualification), appropriate for the activity.
All overstresses must be detectable and quantified
(instant of occurrence stress level relative to
required parameters).
It must be possible to display this detection in real
141
time and not only after the activity, so that action
can be taken during the application thus reducing
the overstress on the subassembly and therefore
limiting its degradation.
It is important that the person responsible for this

activity should be informed so as to reduce
anomalies caused by human error (in this case
144
visual inspection) not detected during the
inspection, so as to minimise the risk due to human
error or the failure to detect an anomaly.
Increase operators awareness about the

verification of the quality of soldering flux deposit.
Since this operation requires a special verification
after it has been done, placement of an electronic
145
barcode reading as verification phase must enable
good monitoring of this inspection and the
subassembly follower sheet must include a check
that it has been done.
Use measurements for verification of purchased

products such as:
153 examination of the required documentation,
inspection and audit at the purchase source,
examination of products on delivery.
Perform an inspection action (barcode reading,

154 reading the S/N) to verify that the right product is
available before starting the test.
Check that the test coverage during and after burn-

155
in is formalised correctly.
Equipement integration
Recommendation
Numéro
The product final test and particularly the coverage

level achieved by this test must be studied and
defined with respect to the product. Specification
and Design.
5 This test must check the product according to
procedures in the System Testability Manual:
- Appropriate treatment in case of a nonconformity,
- Recording and saving results for monitoring of
tests.
7

review.
When traceability is required, the system

implemented must make it possible of:
- maintaining the product identification throughout
the life cycle,
- knowing the history (definition file + changes) and
the final use (deliveries, scrap) of all products
manufactured from the same batch of raw material
or from the same manufacturing batch,
- finding the identity of elements making up an
9 assembly and the higher assembly,
- finding the sequential documentation on
production (manufacturing, assembly, inspection)
of a given product (e.g. configuration follower sheet
including recording of actual operations and
observed anomalies).
The traceability system must be capable of
determining the product configuration ready for
delivery, including variations between the real state
and the agreed state.
Wrapping, packaging and marking processes must
be controlled to assure conformity with specified
requirements.
Define a list of equipment for which packaging is
necessary.
10
Suggest a method of managing special packaging
by product (dates, modes, duration).
Periodically check the quality of packaging.
Use appropriate packaging specific to the
products.
Designated storage areas or premises must be

used to prevent damage or deterioration of the
product.
Appropriate measures are taken to allow reception
in these areas and shipment from them.
The state of the product in stock must be
11
evaluated at appropriate intervals to detect any
deterioration.
Manage and control atmospheres in storage.
Tailor positioning in storage.
Manage periodic actions to maintain product
characteristics in storage (powering on).
The supplier shall take measures to protect the

product quality after inspections and final tests.
When specified in the contract, this protection is
extended to include delivery for final use.
12
The supplier makes sure that the accompanying
documentation for the product as specified at the
order is present at the time of the delivery, and that
it is protected against loss and damage.
During the phase, the product must be inspected

and tests must be carried out in accordance with
the quality plan and/or written procedures.
13
The product must remain blocked until the required
inspections and tests are terminated, or until the
necessary reports have been received and verified.
Perform all final inspections and tests in
accordance with the quality plan and/or written
procedures.
The quality plan and/or procedures for final
inspections and tests must require that all specified
inspections and tests, including those defined for
product reception, are carried out and that the
14
results are conforming with requirements.
Before shipment, make sure that:
All activities specified in the quality plan and/or
written procedures have been satisfactory
accomplished,
The associated data and documentation are
available and accepted.
Make sure that the incoming product is not used or

implemented until it has been inspected or until its
conformity with specified requirements has been
verified in another way.
The check on conformity with specified
requirements must be made in accordance with the
quality plan and/or written procedures.
15 Inspections carried out in the premises of
subcontractors and proofs of conformity provided
must be taken into account to determine the
importance and nature of inspections to be carried
out on reception.
When the incoming product is released before it
has been verified for reasons of urgency, it must
be identified and this release shall be recorded.
Maintenance procedures related to corrective

actions in production must include:
- Effective processing of complaints and
subassembly nonconformity reports,
- The search for causes of nonconformity related to
the process and recording of the results ofthis
18
search,
- Determination of corrective actions necessary to
eliminate causes of nonconformity,
- Application of control means to assure that the
corrective action is implemented and that it
produces the required effect.
Based on the defined preventive maintenance plan

and after its production, a correction is made
by:
19 redefining production means references,
replacement of consumables,
replacement of worn and therefore potentially
defective parts (probes and inspection tools).
This verification is less complicated than a planned
preventive maintenance action, and should be
done by the user of the means (it forms part of the
operator's training). Its purpose is to make sure
that the operation will be done correctly and that it
21
will provide the expected result (using the right
loaded software or a correct configuration).
The frequency of the verifications (to be defined)
may be systematic before each use or after a
defined number of uses of the means.
This filter assures that the final test that forms the
final verification milestone is carried out by a
competent person and particularly a person whose
skills are monitored to assure that the most recent
22
requirements are taken into consideration.
The audit assures that the operator reviews control
over procedures and critical points, to achieve
perfect confidence in execution of the final test.
It is important to perform the minimum number of

manipulations of subassemblies during the
production phase to limit risks of mechanical
shocks and other overstresses.
Furthermore, the automation of manipulations
23
between activities during the entire production
provides a means of eliminating a large number of
failures caused by human intervention.
This recommendation remains applicable to very
small series
It is essential to specifically monitor and maintain

(by updating) references coordinates, batch
25 numbers, etc.) loaded in production tools, for the
automation of tasks and for reliable execution of
activities.
The description of the accepted nonconformity or

repairs made is recorded to indicate the real
condition of the product.
Written procedures are kept up to date defining at
least:
The process for classification of nonconformities
30 and control over the use of nonconforming
components in finished products,
The formal authorisation process and the
application field for personnel authorising the use
of replacement materials and/or nonconforming
products (waiver procedures),
The process for control of scrapped parts.
Product inspection and test procedures must
specify resources (men, means), methods to be
implemented, acceptance criteria and methods of
32
recording the results.
These procedures must also define the training
and if necessary require operators' qualification.
Purchasing documents must include the following

when applicable:
The type, category and any other precise
identification, the title or any other formal
identification and the applicable edition of
specifications, drawings, requirements for
processes, inspection instructions and other
relevant technical data, the title, identifier and
edition of the quality system standard to be
applied, purchasing document reviewed and
approved before distribution to assure that they are
capable of satisfying the requirements.
35
Documented procurement requirements must
include the following when applicable:
Tests, examinations, inspections and acceptance
conditions imposed by the customer, and any
relevant instructions or requirements, requirements
related to specimens (production method, number,
storage conditions) for inspections, investigations
or audits, requirements related to notification of
anomalies, changes to the definition and approval
of their processing.
Suppliers must be notified about customer
requirements.
Operators must be provided with a workstation

datasheet or any other information means
41
describing actions to be carried out and different
instructions and protocols to be followed.
The description of actions to be carried out during

application of a production tool on a subassembly
must be sufficiently explicit to not allow
interpretation by the operator that would result in
43
accidental use of inappropriate means.
It must be assured that the reliability of
subassemblies will not be reduced by the use of an
unsuitable tool.
Recording on an Anomaly datasheet type

document facilitates monitoring of different
malfunctions.
This anomaly datasheet is one of the main
46 documents used to implement preventive and/or
corrective maintenance actions.
The assembly contributes to traceability for
management of nonconformities (products and
means).
Produce written procedures to assure that the
purchased product is conforming with the specified
requirements.
47
Define the terms and conditions for procurement
and the responsibilities of all persons concerned.
Check that procedures are applied.
The responsibility for examination and the decision

to process the nonconforming product must be
defined.
Written procedures must describe processing of
nonconformities.
These procedures must predict that the
nonconforming product can be:
reworked to satisfy the specified requirements,
49 accepted by waiver with or without repair.
declassified for other applications,
rejected or scrapped.
If required by the contract, the proposal for use or
repair of the nonconforming product may be
submitted to the customer.
The repaired and/or reworked product is inspected
once again in accordance with the requirements in
The different subassemblies are made and

integrated starting from planned tasks that may
correspond to simultaneous activities. Priorities
have to be managed, so that only a minimum
60 number of subassemblies needs to be stored (any
time taken in routing production will require storage
and additional manipulations of subassemblies),
thus limiting ways in which the reliability of
elements might be reduced.
61
Requirements for qualification of process
66 operations including equipment and associated
personnel, must be specified.
Special processes must be done by qualified
operators and/or are continuously monitored, with
67
control over process parameters to assure
conformity with requirements.
Written inspection and test procedures have to be
produced and kept up to date, to verify that
70
specified requirements for the product are
respected.
Store and keep product and process
documentation available in the workshop.
Make a list of the documentation regularly.
Periodically update the documentation.
Train an entity among workshop personnel in the
management of technical documentation.
Have technical documentation for products.
Have a documentation specific to the inspection
and maintenance tests.
Associate this product technical documentation
71
with implementation processes.
When documents are provided, analyse the validity
of this product documentation.
Be in possession of process control
documentation.
Specify technical documentation for each process.
Provide this technical documentation and make it
useable.
and tests .
Inspection, measurement and test equipment is

used to assure that the measurement uncertainty
is known and is compatible with the required
measurement aptitude.
73
Test software or comparison references used as
inspection means are verified before they are put
into service to demonstrate that they are capable
of checking that the product is acceptable.
Handling, preservation and storage of inspection

and measurement equipment assures that
precision and usability are maintained.
74 Inspection, measurement and test equipment,
including the test benches and test software, are
protected against manipulations that would
invalidate calibration settings.
When the working environment is important for
product quality, appropriate limits must be
75
specified, controlled and verified (layout of the
workshop, ergonomy of the workstation, etc).

applied.
77
the required effect and that the changes have not
reduce the product quality.
Product handling methods and means are provided
to prevent damage or deterioration to the product
78 and include:
- transport procedures,
- handling methods specific to each product.
Make sure that written procedures describe the
following activities, for all production means, tools
79 and programs:
validation before use, maintenance, periodic
inspection according to written procedures.
A procedure is necessary to take account of

specific requirements for the following at the
different production steps, if applicable in
accordance with the manufacturer's
recommendations and/or applicable regulations:
- cleaning,
- prevention, detection and removal of foreign
bodies,
- handling adapted to sensitive products,
- marking and labelling, including safety marking,
80
- control of shelf life and stock rotation,
- dangerous equipment
Produce special management procedures for
perishables.
Eliminate all products that have passed their useful
life and unidentified products.
Suggest criteria for evaluating and analysing the
quality of storage conditions.
List and analyse failures related to lack of quality in
storage.
Further description
When special processes are used (processes for
which results cannot be fully verified a posteriori by
an inspection or test of the product, and for which
the consequences of deficiencies in application will
not appear until this product is used, for example
gluing, soldering:
The special processes to be implemented must be
identified.
The supplier verifies that all parameters of special
processes (for example materials, personnel,
procedures and software) produce satisfactory
results.
The supplier identifies and documents significant
81
operations and process parameters to be
controlled.
Any modification to these operations and
parameters must be described in a proposal
justifying this modification and guaranteeing that it
does not introduce any harmful effect on the result
of the process.
The supplier must verify special processes by
making one or several typical parts under the
conditions defined for the phase.
Special processes or subcontracted processes
must be qualified before use.
The supplier must keep qualified special processes
up to date.
Further description
When they have an influence on the quality and
reliability of the product, services and supplies
82 such as water, compressed air, electricity and
chemicals used must be controlled and verified
regularly to make sure that their effect on the
process is constant.

88

91
A number of production means parameters are

provided by test tools (probes, sensors, detectors,
etc.).
These test tools need to be monitored periodically
(frequency to be defined) to assure that the
92
measurements made are reliable.
The delta between the stress actually applied by
the production means and the measurement made
of this stress must be minimal and perfectly
measurable.
Set up a self-test of testers in order to detect any
anomalies.
It must be impossible to perform a test if the self-
test is not conclusive or unless there is a traced
94
waiver (authorisation to execute the test provided
that the follower sheet is marked and signed and
cannot be separated from the subassembly)
accompanying the subassembly thus tested.

99
each product used and to obtain all
information about expiration, reduces risks of using
a product that would reduce reliability.
This involves monitoring of test execution

indicators to take immediate action with:
- a definition of envelope curves, outside which it
can be deemed that there is no anomaly,
- an alarm as soon as an anomaly is detected,
100
- suspension of the current activity to avoid
stressing the subassembly,
- compulsory action and correction of the anomaly
before the activity can be resumed and
continued.
Records must be produced and kept to provide

proof that the product has been subjected to
inspections and/or tests in accordance with defined
criteria.
Records must be sufficient to identify the person
who performed the inspections and released the
113
product.
Test records must indicate measured values when
they are required by the specification or the
acceptance plan.
If specified, the supplier must demonstrate the
qualification of the product.
The inspection file must contain:

criteria for acceptance and refusal, a sequential list
of inspection and test operations to be done,
inspection result record documents, a list of
114
specific and non-specific inspection instruments,
the documents associated with specific inspection
instruments for their design, production, validation,
management, use and maintenance .
Nonconformity documents must specify:
the product identification, the description of the
nonconformity,
the cause of the nonconformity, actions taken to
116 prevent recurrence of the nonconformity, reworking
or repairs if necessary,
check of characteristics affected by the reworking
or repairs,
the final decision.
Provide preventive maintenance (by the use of a

plan describing a maintenance strategy) to detect
an anomaly, if there is one, before use on the
121 subassembly.
This maintenance must be described in a
maintenance plan describing intervals, parameters
to be verified, critical levels, margins, etc.


Make sure that maintenance is done on production

means and that this maintenance is followed,
139
particularly to take account of the most recent
nonconformities.
Make sure that the operator has received training

140
(qualification), appropriate for the activity.

products such as:
System integration
Recommendation
Numéro
7

review.

the life cycle,
requirements.
necessary.
10
products.

product.
11
deterioration.
The supplier shall take measures to protect the

product quality after inspections and final tests.
When specified in the contract, this protection is
extended to include delivery for final use.
12
The supplier makes sure that the accompanying
documentation for the product as specified at the
order is present at the time of the delivery, and that
it is protected against loss and damage.

13
procedures.
14
accomplished,
Make sure that the incoming product is not used or

implemented until it has been inspected or until its
conformity with specified requirements has been
verified in another way.
The check on conformity with specified
requirements must be made in accordance with the
quality plan and/or written procedures.
15 Inspections carried out in the premises of
subcontractors and proofs of conformity provided
must be taken into account to determine the
importance and nature of inspections to be carried
out on reception.
When the incoming product is released before it
has been verified for reasons of urgency, it must
be identified and this release shall be recorded.

least:

32
when applicable:
processes, inspection
instructions and other relevant technical data, the
title, identifier and edition of the quality system
standard to be applied, purchasing document
reviewed and approved before distribution to
assure that they are capable of satisfying the
35 requirements.
requirements.

requirements.
47
The responsibility for examination and the decision

to process the nonconforming product must be
defined.
Written procedures must describe processing of
nonconformities.
These procedures must predict that the
nonconforming product can be:
reworked to satisfy the specified requirements,
49 accepted by waiver with or without repair.
declassified for other applications,
rejected or scrapped.
If required by the contract, the proposal for use or
repair of the nonconforming product may be
submitted to the customer.
The repaired and/or reworked product is inspected
once again in accordance with the requirements in

67
Written inspection and test procedures have to be
produced and kept up to date, to verify that
70
specified requirements for the product are
respected.

71
documentation.
useable.
and tests .

73
inspection means are verified before they are
put into service to demonstrate that they are
capable of checking that the product is acceptable.

75
applied.
77

78 and include:
79 and programs:

- cleaning,
bodies,
80
perishables.
storage.
Further description
gluing, soldering:
identified.
results.
81
controlled.
of the process.
up to date.
Further description

88

91

99
each product used and to obtain all
information about expiration, reduces risks of using
a product that would reduce reliability.
Records must be produced and kept to provide
proof that the product has been subjected to
inspections and/or tests in accordance with defined
criteria.
Records must be sufficient to identify the person
who performed the inspections and released the
113
product.
Test records must indicate measured values when
they are required by the specification or the
acceptance plan.
If specified, the supplier must demonstrate the
qualification of the product.

114

nonconformity,
or repairs,
the final decision.



products such as:
Operation and maintenance

Recommendation
Numéro
7

review.

the life cycle,
requirements.
necessary.
10
products.

product.
11
deterioration.

13

procedures.
14
accomplished,
A policy is applied aimed at identifying, evaluating

and managing potential risks associated with
nonconformities, non only on products but also on
20 all design, planning, manufacturing, assembly,
inspection processes, etc.
This policy must take account of potential risks
associated with human factors.
least:

32

when applicable:
processes, inspection
instructions and other relevant technical data, the
title, identifier and edition of the quality system
standard to be applied, purchasing document
reviewed and approved before distribution to
assure that they are capable of satisfying the
35 requirements.
requirements.

requirements.
47
Records concerning processes, products and

63
personnel are kept up to date.
67

71
documentation.
useable.
and tests .
Control the capability of products to detect failures,

72 control failure detection means, facilitate
maintenance.

73
inspection means are verified before they are
put into service to demonstrate that they are
capable of checking that the product is acceptable.

75
applied.
77

78 and include:
79 and programs:

- cleaning,
bodies,
80
perishables.
storage.
Further description
gluing, soldering:
identified.
results.
81
controlled.
of the process.
up to date.
Further description

91

114
nonconformity,
or repairs,
the final decision.
Support activities
Recommendation
Numéro
Allocate the infrastructures necessary for

production and integration operations to obtain the
reliability level predicted by reliability studies during
the product design (no degradation of
reliability during these phases).
Perform the Process FMECA.
Examples: supply appropriate power networks,
clean rooms, ergonomic buildings, application of
3
5S methods.
The improvement in the environment may consist
of: Increasing the surface areas (easier
manipulations), Improving lighting, Reducing
operator fatigue, Imposing storage and cleanliness
standards,
Improving the quality of tools,
Making personnel aware about reliability.
Set up Reliability engineering indicators.

Fix objectives to improve the company's Reliability
engineering; Audit the company's Reliability
4
engineering (get the reliability specialists to attend
further training, make presentations in
reliability conferences).
Collect information about product reliability in its

operational environment from customers and users
24
of the product, and carry out associated action
plans.
Fix objectives for improving the company's
27
reliability engineering annually.
Certify the company quality system according to
45
ISO 9001 V2000
The Operating Dependability (Reliability) business

participates in all phases of the project, from
phases before the development and until series
55
production. The Functional Dependability
business is also involved in production and
operational monitoring
Train personnel concerned with reliability, with
training varying from awareness to expert refresher
courses for reliability managers, depending on the
56 criticality of reliability performances expected for
the product.
Make production personnel aware about non-
degradation of products.
Allocate the necessary resources (hardware
58 means, access to technical data, and time
necessary to perform reliability studies).
Control of documentation related to reliability

59 studies: recording, saving, archiving, validation,
management of documents in configuration.
Before signing the contract (with the subcontractor)

68 identify risks associated with the reliability of
the subcontracted product.
Integrate the Reliability theme in the company

69 quality policy and breakdown this policy at levels
concerned by reliability engineering.
Control monitoring and measurement devices, the
metrology of measurement instruments and
industrial means. Control the verification,
76 calibration and rating of measurement instruments
and
test and trial benches used by the company. APMs
are tied to national standards.
Make operational reliability measurements of

products in operation (monitoring of technical
events, analysis of causes of failure, allocation of
85 the origin of failures, recording the real product
usage profile, reliability evaluation, analysis of
these measurements and take account of the
result for studies on new products).
Appoint a person responsible for reliability for each

project, who will guarantee that product
104 reliability objectives are achieved. This person
shall report on progress with studies and
problems encountered.
Organise periodic meetings with the subcontractor,
105 in which the reliability of subcontracted
products will be systematically discussed.
Include information about system engineering

108
tasks in the various project plannings.
Include mechanisms for "communication on
reliability aspects" with the subcontractor in the
project management plan, and mentioning the
109
frequency and nature of meetings, permanent
agenda, content of minutes, reliability aspects of
communications.
Plan activities related to reliability improvement in
the reliability plan. Describe fundamental activities
110 related to reliability improvement in plans and
perform them completely, with records of these
actions.
Plan reliability studies to guarantee that product

111 reliability objectives are achieved and to
synchronise reliability studies and product design.
Maintain the product reliability in production:

Analyse potential degradations that could occur
118 during production and integration operations during
the design phase (example Process
FMECA).
Consult customers regularly on operational
119 reliability aspects and take their comments into
account for the design of new products.
Select the components used, analyse the market,

142
evaluate component reliability.
Select component suppliers, analyse the market.

143 Evaluate how component reliability is taken into
account.
Monitor and control (plan, record) corrective

actions done by the subcontractor related to
146
product
reliability.
Deal with the theme of reliability in the agenda of
management reviews (progress objective,
148 action plan, measurement of the extent to which
objectives are achieved, and reliability
assessment of products at customers).
Set up an anomaly processing system that can

cover the entire FIDES life cycle.
This system is intended to:
- record the circumstances of the anomaly,
- record references of the defective product,
- propose remedial action,
- analyse the causes of the anomaly,
149 - propose corrective/preventive actions,
- check the efficiency of the corrective/preventive
actions.
Processing in this system is suitable for:
- quickly finding identical anomalies observed
previously,
- producing statistics,
- use as feedback from operations.
Use statistical methods adapted to the use of

151
feedback from operations.
Validate that the subcontractor has actually taken

contract reliability requirements into account
152
and that his project baseline takes them into
account.
Ruggedizing
Recommendation
Numéro
Check that environmental specifications are
156 complete.
Provide training and manage operation and

157 maintenance for implementation and maintenance
of the product
Check that procedures specific to the product and
158 rules specific to businesses are respected by an
appropriate monitoring system
159 Design dependable electrical protection devices
Study and handle risks of the product under test
160 being deteriorated by failures of its test or
maintenance means.
Identify and use appropriate prevention means of
161 preventing reasonably predictable aggressions
(related to the weather)
Use appropriate prevention means to identify and
162 handle reasonably predictable abnormal uses
weather
Include production, storage and maintenance
163 environments in the product environment
specifications
Justify that environment specifications are
164
respected
Carry out a product improvement process (for
example highly accelerated stress tests) so as to
165 limit the product sensitivity to environmental
constraints (disturbances, environments,
overstress)
Perform an analysis of failure cases that could
166
result in failure propagation.
Carry out a process analysis of implementation
167
and maintenance operations
Carry out a review of maintenance operations done
168 by the final user and deal with his
recommendations
Write complete procedures for all product
169
implementation and maintenance operations
Respect a standard dealing with conducted and
radiated electromagnetic disturbances. This is
170
equally applicable to the product and the system
into which it is integrated
Respect a standard dealing with power supplies
(standard that defines possible disturbances and
171 possible EN2282 type variations). The standard
must be respected both for electricity generation
and for electricity consumption
ATTENTION LIGNES 300 à 1700 m

NA
N1
N2
N3
N4
1 N1
1 N2
1 N3
1 N4
1 NA
2 N1
2 N2
2 N3
2 N4
2 NA
3 N1
3 N2
3 N3
3 N4
3 NA
4 N1
4 N2
4 N3
4 N4
4 NA
5 N1
5 N2
5 N3
5 N4
5 NA
6 N1
6 N2
6 N3
6 N4
6 NA
7 N1
7 N2
7 N3
7 N4
7 NA
8 N1
8 N2
8 N3
8 N4
8 NA
9 N1
9 N2
9 N3
9 N4
9 NA
10 N1
10 N2
10 N3
10 N4
10 NA
11 N1
11 N2
11 N3
11 N4
11 NA
12 N1
12 N2
12 N3
12 N4
12 NA
13 N1
13 N2
13 N3
13 N4
13 NA
14 N1
14 N2
14 N3
14 N4
14 NA
15 N1
15 N2
15 N3
15 N4
15 NA
16 N1
16 N2
16 N3
16 N4
16 NA
17 N1
17 N2
17 N3
17 N4
17 NA
18 N1
18 N2
18 N3
18 N4
18 NA
19
19
19
19
19
20 N1
20 N2
20 N3
20 N4
20 NA
21 N1
21 N2
21 N3
21 N4
21 NA
22 N1
22 N2
22 N3
22 N4
22 NA
23 N1
23 N2
23 N3
23 N4
23 NA
24 N1
24 N2
24 N3
24 N4
24 NA
25 N1
25 N2
25 N3
25 N4
25 NA
26 N1
26 N2
26 N3
26 N4
26 NA
27 N1
27 N2
27 N3
27 N4
27 NA
28 N1
28 N2
28 N3
28 N4
28 NA
29 N1
29 N2
29 N3
29 N4
29 NA
30 N1
30 N2
30 N3
30 N4
30 NA
31 N1
31 N2
31 N3
31 N4
31 NA
32 N1
32 N2
32 N3
32 N4
32 NA
33 N1
33 N2
33 N3
33 N4
33 NA
34 N1
34 N2
34 N3
34 N4
34 NA
35 N1
35 N2
35 N3
35 N4
35 NA
36 N1
36 N2
36 N3
36 N4
36 NA
37 N1
37 N2
37 N3
37 N4
37 NA
38 N1
38 N2
38 N3
38 N4
38 NA
39 N1
39 N2
39 N3
39 N4
39 NA
40 N1
40 N2
40 N3
40 N4
40 NA
41 N1
41 N2
41 N3
41 N4
41 NA
42 N1
42 N2
42 N3
42 N4
42 NA
43 N1
43 N2
43 N3
43 N4
43 NA
44 N1
44 N2
44 N3
44 N4
44 NA
45 N1
45 N2
45 N3
45 N4
45 NA
46 N1
46 N2
46 N3
46 N4
46 NA
47 N1
47 N2
47 N3
47 N4
47 NA
48 N1
48 N2
48 N3
48 N4
48 NA
49 N1
49 N2
49 N3
49 N4
49 NA
50 N1
50 N2
50 N3
50 N4
50 NA
51
51
51
51
51
52 N1
52 N2
52 N3
52 N4
52 NA
53 N1
53 N2
53 N3
53 N4
53 NA
54 N1
54 N2
54 N3
54 N4
54 NA
55 N1
55 N2
55 N3
55 N4
55 NA
56 N1
56 N2
56 N3
56 N4
56 NA
57 N1
57 N2
57 N3
57 N4
57 NA
58 N1
58 N2
58 N3
58 N4
58 NA
59 N1
59 N2
59 N3
59 N4
59 NA
60 N1
60 N2
60 N3
60 N4
60 NA
61 N1
61 N2
61 N3
61 N4
61 NA
62 N1
62 N2
62 N3
62 N4
62 NA
63 N1
63 N2
63 N3
63 N4
63 NA
64 N1
64 N2
64 N3
64 N4
64 NA
65 N1
65 N2
65 N3
65 N4
65 NA
66 N1
66 N2
66 N3
66 N4
66 NA
67 N1
67 N2
67 N3
67 N4
67 NA
68 N1
68 N2
68 N3
68 N4
68 NA
69 N1
69 N2
69 N3
69 N4
69 NA
70 N1
70 N2
70 N3
70 N4
70 NA
71 N1
71 N2
71 N3
71 N4
71 NA
72 N1
72 N2
72 N3
72 N4
72 NA
73 N1
73 N2
73 N3
73 N4
73 NA
74 N1
74 N2
74 N3
74 N4
74 NA
75 N1
75 N2
75 N3
75 N4
75 NA
76 N1
76 N2
76 N3
76 N4
76 NA
77 N1
77 N2
77 N3
77 N4
77 NA
78 N1
78 N2
78 N3
78 N4
78 NA
79 N1
79 N2
79 N3
79 N4
79 NA
80 N1
80 N2
80 N3
80 N4
80 NA
81 N1
81 N2
81 N3
81 N4
81 NA
82 N1
82 N2
82 N3
82 N4
82 NA
83 N1
83 N2
83 N3
83 N4
83 NA
84 N1
84 N2
84 N3
84 N4
84 NA
85 N1
85 N2
85 N3
85 N4
85 NA
86 N1
86 N2
86 N3
86 N4
86 NA
87 N1
87 N2
87 N3
87 N4
87 NA
88 N1
88 N2
88 N3
88 N4
88 NA
89 N1
89 N2
89 N3
89 N4
89 NA
90 N1
90 N2
90 N3
90 N4
90 NA
91 N1
91 N2
91 N3
91 N4
91 NA
92 N1
92 N2
92 N3
92 N4
92 NA
93 N1
93 N2
93 N3
93 N4
93 NA
94 N1
94 N2
94 N3
94 N4
94 NA
95 N1
95 N2
95 N3
95 N4
95 NA
96 N1
96 N2
96 N3
96 N4
96 NA
97 N1
97 N2
97 N3
97 N4
97 NA
98 N1
98 N2
98 N3
98 N4
98 NA
99 N1
99 N2
99 N3
99 N4
99 NA
100 N1
100 N2
100 N3
100 N4
100 NA
101 N1
101 N2
101 N3
101 N4
101 NA
102 N1
102 N2
102 N3
102 N4
102 NA
103 N1
103 N2
103 N3
103 N4
103 NA
104 N1
104 N2
104 N3
104 N4
104 NA
105 N1
105 N2
105 N3
105 N4
105 NA
106
106
106
106
106
107 N1
107 N2
107 N3
107 N4
107 NA
108 N1
108 N2
108 N3
108 N4
108 NA
109 N1
109 N2
109 N3
109 N4
109 NA
110 N1
110 N2
110 N3
110 N4
110 NA
111 N1
111 N2
111 N3
111 N4
111 NA
112 N1
112 N2
112 N3
112 N4
112 NA
113 N1
113 N2
113 N3
113 N4
113 NA
114 N1
114 N2
114 N3
114 N4
114 NA
115 N1
115 N2
115 N3
115 N4
115 NA
116 N1
116 N2
116 N3
116 N4
116 NA
117 N1
117 N2
117 N3
117 N4
117 NA
118 N1
118 N2
118 N3
118 N4
118 NA
119 N1
119 N2
119 N3
119 N4
119 NA
120 N1
120 N2
120 N3
120 N4
120 NA
121 N1
121 N2
121 N3
121 N4
121 NA
122 N1
122 N2
122 N3
122 N4
122 NA
123 N1
123 N2
123 N3
123 N4
123 NA
124 N1
124 N2
124 N3
124 N4
124 NA
125 N1
125 N2
125 N3
125 N4
125 NA
126 N1
126 N2
126 N3
126 N4
126 NA
127 N1
127 N2
127 N3
127 N4
127 NA
128 N1
128 N2
128 N3
128 N4
128 NA
129 N1
129
N2
129 N3
129 N4
129 NA
130 N1
130 N2
130 N3
130 N4
130 NA
131 N1
131 N2
131 N3
131 N4
131 NA
132 N1
132 N2
132 N3
132 N4
132 NA
133 N1
133 N2
133 N3
133 N4
133 NA
134 N1
134 N2
134 N3
134 N4
134 NA
135 N1
135 N2
135 N3
135 N4
135 NA
136 N1
136 N2
136 N3
136 N4
136 NA
137 N1
137 N2
137 N3
137 N4
137 NA
138 N1
138 N2
138 N3
138 N4
138 NA
139 N1
139 N2
139 N3
139 N4
139 NA
140 N1
140 N2
140 N3
140 N4
140 NA
141 N1
141 N2
141 N3
141 N4
141 NA
142 N1
142 N2
142 N3
142 N4
142 NA
143 N1
143 N2
143 N3
143 N4
143 NA
144 N1
144 N2
144 N3
144 N4
144 NA
145 N1
145 N2
145 N3
145 N4
145 NA
146 N1
146 N2
146 N3
146 N4
146 NA
147 N1
147 N2
147 N3
147 N4
147 NA
148 N1
148 N2
148 N3
148 N4
148 NA
149 N1
149 N2
149 N3
149 N4
149 NA
150 N1
150 N2
150 N3
150 N4
150 NA
151 N1
151 N2
151 N3
151 N4
151 NA
152 N1
152 N2
152 N3
152 N4
152 NA
153 N1
153 N2
153 N3
153 N4
153 NA
154 N1
154 N2
154 N3
154 N4
154 NA
155 N1
155 N2
155 N3
155 N4
155 NA
156 N1
156 N2
156 N3
156 N4
156 NA
157 N1
157 N2
157 N3
157 N4
157 NA
158 N1
158 N2
158 N3
158 N4
158 NA
159 N1
159 N2
159 N3
159 N4
159 NA
160 N1
160 N2
160 N3
160 N4
160 NA
161
161
161
161
161
162 N1
162 N2
162 N3
162 N4
162 NA
163 N1
163 N2
163 N3
163 N4
163 NA
164 N1
164 N2
164 N3
164 N4
164 NA
165 N1
165 N2
165 N3
165 N4
165 NA
166 N1
166 N2
166 N3
166 N4
166 NA
167 N1
167 N2
167 N3
167 N4
167 NA
168 N1
168 N2
168 N3
168 N4
168 NA
169 N1
169 N2
169 N3
169 N4
169 NA
170 N1
170 N2
170 N3
170 N4
170 NA
171 N1
171 N2
171 N3
171 N4
171 NA
172 N1
172 N2
172 N3
172 N4
172 NA
173 N1
173 N2
173 N3
173 N4
173 NA
174 N1
174
N2
174 N3
174 N4
174 NA
175 N1
175 N2
175 N3
175 N4
175 NA
176 N1
176 N2
176 N3
176 N4
176 NA
177 N1
177 N2
177 N3
177 N4
177 NA
178 N1
178 N2
178 N3
178 N4
178 NA
179 N1
179 N2
179 N3
179 N4
179 NA
180 N1
180 N2
180 N3
180 N4
180 NA
181 N1
181 N2
181 N3
181 N4
181 NA
182 N1
182 N2
182 N3
182 N4
182 NA
183 N1
183 N2
183 N3
183 N4
183 NA
184 N1
184 N2
184 N3
184 N4
184 NA
185 N1
185 N2
185 N3
185 N4
185 NA
186 N1
186 N2
186 N3
186 N4
186 NA
187 N1
187 N2
187 N3
187 N4
187 NA
188 N1
188 N2
188 N3
188 N4
188 NA
189 N1
189 N2
189 N3
189 N4
189 NA
190 N1
190 N2
190 N3
190 N4
190 NA
191 N1
191 N2
191 N3
191 N4
191 NA
192 N1
192 N2
192 N3
192 N4
192 NA
193 N1
193 N2
193 N3
193 N4
193 NA
194 N1
194 N2
194 N3
194 N4
194 NA
195 N1
195 N2
195 N3
195 N4
195 NA
196 N1
196 N2
196 N3
196 N4
196 NA
197 N1
197 N2
197 N3
197 N4
197 NA
198
198
198
198
198
199 N1
199 N2
199 N3
199 N4
199 NA
200 N1
200 N2
200 N3
200 N4
200 NA
201 N1
201 N2
201 N3
201 N4
201 NA
202 N1
202 N2
202 N3
202 N4
202 NA
203 N1
203 N2
203 N3
203 N4
203 NA
204 N1
204 N2
204 N3
204 N4
204 NA
205 N1
205 N2
205 N3
205 N4
205 NA
206 N1
206 N2
206 N3
206 N4
206 NA
207 N1
207 N2
207 N3
207 N4
207 NA
208 N1
208 N2
208 N3
208 N4
208 NA
209 N1
209 N2
209 N3
209 N4
209 NA
210 N1
210
N2
210 N3
210 N4
210 NA
211 N1
211 N2
211 N3
211 N4
211 NA
212 N1
212 N2
212 N3
212 N4
212 NA
213 N1
213 N2
213 N3
213 N4
213 NA
214 N1
214 N2
214 N3
214 N4
214 NA
215 N1
215 N2
215 N3
215 N4
215 NA
216 N1
216 N2
216 N3
216 N4
216 NA
217 N1
217 N2
217 N3
217 N4
217 NA
218 N1
218 N2
218 N3
218 N4
218 NA
219 N1
219 N2
219 N3
219 N4
219 NA
220 N1
220 N2
220 N3
220 N4
220 NA
221 N1
221 N2
221 N3
221 N4
221 NA
222 N1
222 N2
222 N3
222 N4
222 NA
223 N1
223 N2
223 N3
223 N4
223 NA
224 N1
224 N2
224 N3
224 N4
224 NA
225 N1
225 N2
225 N3
225 N4
225 NA
226 N1
226 N2
226 N3
226 N4
226 NA
227 N1
227 N2
227 N3
227 N4
227 NA
228
228
228
228
228
229 N1
229 N2
229 N3
229 N4
229 NA
230 N1
230 N2
230 N3
230 N4
230 NA
231 N1
231 N2
231 N3
231 N4
231 NA
232 N1
232 N2
232 N3
232 N4
232 NA
233 N1
233 N2
233 N3
233 N4
233 NA
234 N1
234 N2
234 N3
234 N4
234 NA
235 N1
235 N2
235 N3
235 N4
235 NA
236 N1
236 N2
236 N3
236 N4
236 NA
237 N1
237 N2
237 N3
237 N4
237 NA
238 N1
238 N2
238 N3
238 N4
238 NA
239 N1
239 N2
239 N3
239 N4
239 NA
240 N1
240 N2
240 N3
240 N4
240 NA
241 N1
241 N2
241 N3
241 N4
241 NA
242 N1
242 N2
242 N3
242 N4
242 NA
243 N1
243 N2
243 N3
243 N4
243 NA
244 N1
244 N2
244 N3
244 N4
244 NA
245 N1
245 N2
245 N3
245 N4
245 NA
246 N1
246 N2
246 N3
246 N4
246 NA
247 N1
247 N2
247 N3
247 N4
247 NA
248 N1
248 N2
248 N3
248 N4
248 NA
249 N1
249 N2
249 N3
249 N4
249 NA
250 N1
250 N2
250 N3
250 N4
250 NA
251 N1
251 N2
251 N3
251 N4
251 NA
252 N1
252 N2
252 N3
252 N4
252 NA
253 N1
253 N2
253 N3
253 N4
253 NA
254 N1
254 N2
254 N3
254 N4
254 NA
255 N1
255 N2
255 N3
255 N4
255 NA
256 N1
256 N2
256 N3
256 N4
256 NA
257
257
257
257
257
258 N1
258 N2
258 N3
258 N4
258 NA
259 N1
259 N2
259 N3
259 N4
259 NA
260 N1
260 N2
260 N3
260 N4
260 NA
261 N1
261 N2
261 N3
261 N4
261 NA
262 N1
262 N2
262 N3
262 N4
262 NA
263 N1
263 N2
263 N3
263 N4
263 NA
264 N1
264 N2
264 N3
264 N4
264 NA
265 N1
265 N2
265 N3
265 N4
265 NA
266 N1
266 N2
266 N3
266 N4
266 NA
267 N1
267 N2
267 N3
267 N4
267 NA
268 N1
268 N2
268 N3
268 N4
268 NA
269 N1
269 N2
269 N3
269 N4
269 NA
270 N1
270 N2
270 N3
270 N4
270 NA
271 N1
271 N2
271 N3
271 N4
271 NA
272 N1
272 N2
272 N3
272 N4
272 NA
273 N1
273 N2
273 N3
273 N4
273 NA
Pas de modification autre que le choix des Answers (colonne en vert) au sein du cadre
Possibilité de compresser des parties de la feuille avec les + et - situés dans les marges
1.48406993886709
2.00
Requirements
Question Weight Answers
Is there a financing item for reliability studies? Have the necessary

10.7 N4
means and personnel been identified?
Are global reliability requirements allocated to subassemblies? What

10.4 N2
allocation method was used?
12.4 N4
Is there a description and characterisation of the environment in
10.3 N4
which the product will be stored, transported, used and maintained?
How is it planned to demonstrate the product reliability? 9.8 N4
Is the usage profile of the product for which reliability performances

9.9 N4
are expected defined?
What is the context associated with product reliability requirements? 8.1 N4
Is feedback from operations used to maintain a good level of

confidence in achieving reliability 8.5 N4
performances?
Are the reliability criteria taken into account in the architecture of the
12.6 N4
products, and design, industrialisation and support choices?
Is the reliability requirement expressed quantitatively? 8.2 N4
Have technical risks affecting the reliability been identified? 12.4 N4
Has a type of time measurement (Hours of operation, Hours of flight,

6.6 N4
number of cycles, etc.) been identified for reliability performances?
Have customer requirements been identified, documented and

7.3 N4
traced?
s the state-of-the-art of technology taken into account, and is the

cost-performance of the product design optimised during negotiations 10.7 N4
of reliability requirements with the customer?
Has a design review been organised in which Reliability aspects are
10.3 N4
dealt with?
Has a requirements review been organised dealing with reliability

10.3 N4
aspects?
How is the product maintenance policy (requested by the customer)

5.8 N4
taken into account?
Has a Reliability Plan been written for the product? 7.6 N4
Design
Are technical data for subassemblies available for development of the
7.8 N4
production test?
What process is used to collect technical events, to produce anomaly

reports and measure increases in reliability? How are equipment 6.7 N4
changes managed?
Do procedures related to preventive actions include:
- The use of appropriate information sources?
- Determination of appropriate steps? 6.8 N4
- Triggering of preventive actions and application of control means?
- A management review of corrective actions?
Is the point of view of the different disciplines involved in engineering

16.7 N4
taken into account?
What measures have been taken so that the person concerned is

5.8 N4
qualified for the test means, measurements and relevant standards?
Is there a list of justification elements? 8 N4
Is there any management of business procedures? 13.8 N4
Is there any management of skills? 24.5 N4
Is there a collection of business recommendations for manipulation

7.7 N4
and storage operations at the customer?
Is there a preferred components list? 8 N4
Has feedback from operations been used to improve future designs? 24.2 N4
Is there a database recording reliability evaluation studies? 10.6 N4
Is there a database on the history and definition justifications? 7.8 N4
Are the reliability criteria taken into account in the architecture of the
12.6 N4
products, and design, industrialisation and support choices?
Have means of protecting subassemblies during some production

7.3 N4
activities been identified and implemented?
Have technical risks affecting the reliability been identified? 21 N4
Is there assurance that the test coverage is maximum, and that it is

based on the specification? 6 N4
Is there a justification document?
Are there any design verification procedures? 27.1 N4

Is there a maintenance concept? 5.4 N4
Has a design review been organised in which Reliability aspects are

12.1 N4
dealt with?
Is there a reliability management plan in which key skills (specialists)

17.7 N4
are identified?
Is there an acceptance procedure for production tests? 7.8 N4
Is there any analysis documentation for evaluating the reliability? 7.5 N4
Are there any design rules to adapt the choice of a component for a
12.7 N4
given reliability?
Are test points defined and are recommendations for production tests
6 N4
applied?
Is there a qualification procedure for products and manufacturing

7.2 N4
process?
Is there a product/supplier qualification procedure? 7.6 N4
Are new components qualified before they are used? 7.2 N4
Is there a tool for formally calculating the reliability? Is there a formal

choice of the reliability compilation (FIDES, adjusted MIL-HDBK-217, 7.7 N4
proprietary feedback from operations or other method)?
Are choices related to test coverage documented? 10.2 N4
Are validated and recognised modelling means used? 13.8 N4
ufacturing of board or sub-assemblies

Is there a final product test? Are nonconforming test results treated:

at the product, at the 6.6 N4
process? Are test results recorded?

changes managed?
Are inspection parameters monitored during the varnishing activity? 9.9 N4
Does corrective maintenance take place as soon as an anomaly

6.9 N4
appears on production means or produced subassemblies?
Is preventive maintenance planned to correct drifts to production

4 N4
means parameters?
Is there a periodic verification of programming means so that the
4.1 N4
software loading operation is done correctly?
Are the skills of final test operators systematically audited? 4.1 N4
Are production and manipulation of subassemblies automated? 6.5 N4
Are data loaded in programmable production means managed? 2.8 N4
Is the subassembly varnishing inspection done by someone other

4.4 N4
than the varnishing operator?
Is the subassembly drying activity after varnishing carried out by
5.6 N4
experienced personnel?
Are the instructions (protocol and particular instructions to be

7.4 N4
respected) given to operators?
Are there any records of temperature profiles for each program used
6.9 N4
for the soldering means?
How is it assured that production means are adapted to elements to

7.2 N4
be produced?
How are technical events or anomaly reports recorded? 7.6 N4
How are priorities managed as a function of end of file dates? 3.1 N4

7.3 N4
How are changes to manufacturing processes controlled? 13.9 N4
Is contamination of solder baths measured by sampling (so as not to

5.8 N4
exceed the pollutant content during this activity)?
Is a self checking system applied to filter human errors (that could

5.3 N4
reduce reliability of the subassembly)?
Are there any indicators to verify that a good solder is obtained when
6 N4
components are transferred?
Are checks made to assure that stock inventories are defined and
5.5 N4
respected
Have you set up specific protections against ESD for subassemblies

26 N4
during manipulations and storage?
Are there any periodic verifications used to monitor tools used for
4.9 N4
inspection of production means?
Are there any appropriate protections to avoid degrading
6 N4
subassemblies while cleaning?
Are there any self-tests of test tools in order to detect any anomalies
5.1 N4
before use on the subassembly ?
Is there a cross-check to optimise the final inspection of varnishing of

5.6 N4
subassemblies?
Is there a conformity check when putting into stock in stores with the
6 N4
exclusion of non-conforming items?
is there an SPC (Statistical Process Control) for the production

4.5 N4
process?
Is there a detailed description of the varnishing protocol? 5.8 N4
Is there a label for identification and withdrawal of out-of-date

6.4 N4
consumables?
Is there a real time processing of test monitoring indicators so as to
4.7 N4
not to degrade the subassembly as soon as an anomaly appears?
is there a preventive maintenance by metrological monitoring? 5.9 N4
Is a method used for checking drifts and malfunctions (by probes and
other monitoring systems), 6.1 N4
and to validate or allow the operation of drying ovens?
Are high and low safety systems provided tied to inspection and
monitoring means (systematically stop the cycle and analysis by a 5.7 N4
technician before restarting)?
Is there a qualification plan of the method of removing masking

6.5 N4
varnishes used so as not to reduce reliability of the subassembly?
Is there an inspection step (even visual) to assure that the masking

6.5 N4
varnish placement activity takes place correctly before varnishing?
Is there a preventive maintenance to detect an anomaly, if there is

4.7 N4
one, before a production means is used on a subassembly?
Is a rest time between each silk screen printing operation respected
to avoid overstressing the 6.4 N4
subassembly?
Have plans for maintenance of production means been revised and

made more robust to eliminate any possibility of degradation to 6.7 N4
component connections?
Is the preparation (dosing) of varnish controlled by a qualified

5.9 N4
procedure and test measurements?
Is there a procedure for assuring that operators are well informed and
4.4 N4
are studies done to determine how to update their skills in real time?
Is it assured that the inspection on the final varnishing quality is

5.2 N4
effective, by strictly applying the inspection procedure
Is it checked that the procedure for implementing the means is

5.1 N4
known?
Is it checked that the right software is loaded, and that its version is
6.7 N4
identified?
Is a check carried out to assure that means are maintained and that
this maintenance is 5.9 N4
followed?
Is it checked that the operator has received training (qualification),

8.5 N4
appropriate for the activity?
Are means secured (drying oven T°) through direct monitoring by
6.6 N4
probes and recordings, to prevent overstresses?
Are personnel made aware about a visual verification of

5.9 N4
subassemblies after placement and before remelting?
Are operators made aware of the need to verify the quality of

soldering flux deposit (implementation of a verification action that 5.9 N4
must appear in the subassembly follower sheet)?
Is the conformity of purchased products checked? 8.6 N4
Is an inspection action (barcode reading, reading the S/N) performed

6.1 N4
to verify that the right product is available before starting the test?
Is it checked that the test coverage for burn-in is formalised correctly? 5.2 N4
Equipement integration
Is there a final product test? Are nonconforming test results treated:

6.6 N3
at the product, at the process? Are test results recorded?
changes managed?

How is product traceability achieved? 16.5 N3

Does the supplier control wrapping, packaging and marking
processes to assure conformity with the specified requirements? Is 12.3 N3
there a list of equipment requiring packaging?
Are there any designated storage areas or premises? Are they used
to prevent damage or deterioration of the product? Are appropriate 10.8 N3
measures taken to enable reception and shipping in these areas?
Does the supplier take steps to maintain the product quality after the
inspections and final tests?
17.5 N3
When specified in the contract, are these steps extended to include
delivery for final use?
Is there any risk that a product that has not satisfied inspections and
tests specified during one phase will go on to the next phase without 7.2 N3
corrective action?
Have all final inspections and tests been carried out in accordance
with the quality plan and/or 7.9 N3
written procedures?
Are appropriate inspections and tests carried out on incoming

6.7 N3
products before use?
Does corrective maintenance take place as soon as an anomaly

appears on production means or 6.9 N3
produced subassemblies?
Is preventive maintenance planned to correct drifts to production

4 N3
means parameters?
Is there a periodic verification of programming means so that the
4.1 N3
software loading operation is done correctly?
Are the skills of final test operators systematically audited? 4.1 N3
Are production and manipulation of subassemblies automated? 6.5 N3
Are data loaded in programmable production means managed? 2.8 N3
Is the description of the accepted nonconformity or of the repairs

10.3 N3
performed recorded to indicate the product's real condition?
Are means necessary for inspections and tests of the product
11.6 N3
defined?
Are there any documents for performing incoming inspection on

8.8 N3
supplies?
Are the instructions (protocol and particular instructions to be

7.4 N3
respected) given to operators?
How is it assured that production means are adapted to elements to

7.2 N3
be produced?
How are technical events or anomaly reports recorded? 7.6 N3

Are there any written procedures for assuring that products are
10.6 N3
conforming with specified requirements?
Has the responsibility for the examination and the decision to process
13.6 N3
the nonconforming product been defined?
How are priorities managed as a function of end of file dates? 3.1 N3

7.3 N3
Are means concerning special processes identified? 13.1 N3
Are human resources concerning special processes managed? 11.7 N3
How is the product inspection and test documentation controlled?

9.3 N3
Is documentation well controlled? Does it take account of all
12.2 N3
equipment changes?
What steps are taken to control how inspection, measurement and

test equipment is compatible 9.6 N3
with needs?
How is the environment of inspection, measurement and test

7.9 N3
equipment controlled?
How is the working environment controlled? 9.6 N3

Are handling and transport methods defined? 8.8 N3
How are production equipment, tools and programs for numerical

10.5 N3
control machine controlled?
How are handling, storage, packaging, preservation, and delivery

6.5 N3
controlled?
How are special processes controlled? 14.4 N3
How are services and fluids in the working environment controlled? 10.1 N3

reduce reliability of the 5.3 N3
subassembly)?
during manipulations and 26 N3
storage?
Are there any periodic verifications used to monitor tools used for
inspection of production 4.9 N3
means?
Are there any self-tests of test tools in order to detect any anomalies
5.1 N3
before use on the subassembly ?

6.4 N3
consumables?
Is there a real time processing of test monitoring indicators so as to

not to degrade the 4.7 N3
subassembly as soon as an anomaly appears?
Are records produced and kept to prove that the product has been
inspected and/or tested in accordance with defined criteria? Are the 5.3 N3
records sufficient to identify the person who made the checks?
Is there an inspection file containing acceptance criteria, the

sequential list of inspection and test operations, inspection result
5.7 N3
record documents, list of specific and non-specific inspection
instruments?
Is there any documentation specific to the nonconformity? 11.1 N3
Is there a preventive maintenance to detect an anomaly, if there is

4.7 N3
one, before a production means is used on a subassembly?

5.1 N3
known?
6.7 N3
identified?
Is a check carried out to assure that means are maintained and that
this maintenance is 5.9 N3
followed?
Is it checked that the operator has received training (qualification),

8.5 N3
appropriate for the activity?
System integration
changes managed?


Does the supplier take steps to maintain the product quality after the
inspections and final tests?
17.5 N3
When specified in the contract, are these steps extended to include
delivery for final use?
corrective action?
written procedures?
Are appropriate inspections and tests carried out on incoming

6.7 N3
products before use?

10.3 N3

11.6 N3
defined?
8.8 N3
supplies?
10.6 N3
Has the responsibility for the examination and the decision to process
13.6 N3
the nonconforming product been defined?

How is the product inspection and test documentation controlled?

9.3 N3

12.2 N3
equipment changes?

with needs?

7.9 N3


10.5 N3

6.5 N3
controlled?

reduce reliability of the 5.3 N3
subassembly)?
during manipulations and 18.4 N3
storage?

6.4 N3
consumables?
Are records produced and kept to prove that the product has been
inspected and/or tested in accordance with defined criteria? Are the 5.3 N3
records sufficient to identify the person who made the checks?

5.7 N3
instruments?

5.1 N3
known?
6.7 N3
identified?
Operation and maintenance

changes managed?


corrective action?
written procedures?
Is a policy applied aimed at identifying, evaluating and managing

potential risks associated with
nonconformities, on products and also on all design, planning, 16.3 N3
manufacturing, assembly and
inspection processes, etc?
12.8 N3

14.3 N3
defined?

9.9 N3
supplies?
6.8 N3
Is there any documentation for special processes? Is this

12.2 N3
documentation kept up to date?

5.6 N3
equipment changes?
How are product testability and maintainability controlled? 17.6 N3

with needs?

11.7 N3


11.3 N3

11.3 N3
controlled?

during manipulations and 17.4 N3
storage?

5.7 N3
instruments?
Support activities
Have the conclusions of reliability studies in terms of necessary

infrastructures for production and integration been taken into 7.4 N3
account?
Are there any objectives to improve reliability engineering in the

company? Are there any indicators about the current position relative 6.6 N3
to these objectives?
Are customer comments about product reliability collected during

7.9 N3
operational functioning?
Are there any objectives to improve the process to construct product

6.3 N3
reliability?
The company has one or several quality certifications, for example
6.5 N3
ISO 9001 Version 2000
Does the Operating Dependability business participate in all phases

8.8 N3
of the project?
Is training of persons working on reliability appropriate for the
7.5 N3
criticality of reliability performances expected for the product?
Are technical data necessary for reliability studies accessible?

Are the necessary tools available? Have the necessary time and 8.3 N3
financing been allowed for?
Are reliability study documents managed? 5.4 N3
Have risks related to reliability of products at subcontractors been

7.2 N3
identified?
Is the reliability theme present in the company quality policy? 7.4 N3
What procedure is there to control monitoring and measurement

devices, the metrology of measurement instruments and industrial 7.8 N3
means?
Are product reliability measurements actually made in operation? 8 N3
Has a person responsible for reliability studies been appointed? 8.5 N3

Are periodic reliability meetings organised with the subcontractor? 5.7 N3
Are tasks related to reliability taken into account in project plannings? 6.3 N3
Are tasks related to reliability taken into account in project plannings? 4.1 N3
Are reliability activities including reliability improvement organised? 9.1 N3
Are reliability studies planned? 7.3 N3
Are measures taken to maintain the product reliability in production? 8.1 N3
Are there periodic consultations planned with customers related to

7.3 N3
reliability aspects?
Are reliability criteria considered when selecting the components

12.9 N3
used?
Select component suppliers, analyse the market. Evaluate how

component reliability is taken into 10.8 N3
account.
Are corrective actions done by the subcontractor related to reliability

7.2 N3
monitored
Is the reliability aspect dealt with in management reviews? 5.6 N3
What process is set up to collect technical events, produce anomaly

reports and measure improved reliability? How are hardware 8.3 N3
upgrades managed?
Are statistical methods adapted to the use of feedback from

6 N3
operations?
Has the reliability management baseline of the subcontractor been

7.7 N3
validated?
Ruggedizing
4 N3
7 N3
7 N3
4 N3
4 N3
4 N3
4 N3
4 N3
4 N3
7 N3
4 N3
4 N3
4 N3
7 N3
4 N3
3 N3
ATTENTION LIGNES 300 à 1700 masquées pour protéger les données qu'elles co
0
0
1
2
3
No specific resources are allocated to the reliability studies: integrated with other studies or a non formalised specific alloca
Resources allocated to reliability studies are identified at project management level and are formalised in a document.
Resources allocated to reliability studies are identified at project management level and are formalised in a validated plan.
Resources allocated to reliability studies are identified at project management level and are formalised in a validated plan.
Non Applicable
There is not or will not be any allocation of reliability requirements to subassemblies.
Persons responsible for reliability engineering have defined (or have participated in defining) the allocation of reliability req
Non Applicable
The product environment is partially
not known (or is(applicable
known hardly known), the manufacturer
parameters has recommendation
defined in the not defined any formal assumption.
are partially known) but
complementary assumptions.
The product environment is partially known (applicable parameters defined in the recommendation are partially known), the
The product environment is known perfectly (applicable parameters defined in the recommendation are known). A docume
Non
The Applicable
customer has not defined any degraded mode.
The manufacturer has not defined these elements for its study.
The manufacturer has produced the description of the product failure and (or) the list of feared events, and (or) product de
The manufacturer has produced the description of the product failure and (or) the list of feared events, and (or) product de
The list of feared events has been provided in the call for bids (or contract).
Degraded modes are also described in the call for bids (or contract).
Non Applicable
The product environment is not known (or hardly known), the manufacturer has not produced any formal assumption.
The call for bids (or the contract) includes a request to demonstrate reliability but does not contain any details about the me
The call for bids (or the contract) includes a request for demonstration, but the description of the method to be used only p
The method of demonstrating the product reliability is defined perfectly in the call for bids or the contract (in accordance wi
Non Applicable
The life profile is not defined.
The life profile provided
is not provided
in the in the specification,
specification but and
(contract) it wasthatdefined completely
partially or partially
satisfies the by the manufacturer
recommendation or that waswith no val
partially d
validated by the customer.
The life profile provided in the specification (contract) satisfies the recommendation or was defined completely by the manu
Non Applicable
The customer did not take account of the recommendation and the necessary information (according to the recommendatio
Partial identification of customer reliability requirements as requested in the recommendation.
Complete identification of customer reliability requirements as requested in the recommendation.
Complete identification of customer reliability requirements as requested in the recommendation at the time of the call for b
Non Applicable
No feedback from operations is available (measurement of the operational reliability on previous projects).
There is feedback
This feedback fromfrom operations,
operations doesbutnotitprecisely
is not used, nor formalised
correspond in one or more
to the technologies documents.
currently used.
There is a validation
differences (document). or adjustment of predicted reliability methods.
Predicted reliability methods are validated or adjusted, and regularly updated.
Non Applicable
Reliability engineering does not make any contribution to product design.
Participation in reliability engineering during the product design is sporadic and/or partial. The only contribution of reliability
Reliability engineering contributes to the design as certified in documents, but the company's baseline does not describe th
Reliability engineering contributes to the design and has the authority to make decisions if a reliability objective is not achie
Non Applicable
No quantitative reliability requirement
No quantitative
The specification reliability
containsrequirement, but atypes
one of the three quantitative evaluation
of performance of reliability(as
specification is required
defined in the recommendation).
Some elements about the quantification are covered in non formalised assumptions.
One of the three types of performance specification (as defined in the recommendation) is defined in the specification.
All quantification assumptions are formally specified
Non Applicable
No risk management is made regarding reliability performances.
An initial
This analysis ofbut
is formalised, risks
riskrelated to obtaining
management is notreliability
maintained performances has been made, but risk management is not formalis
in the long term:
cooperation isis set
Cooperation set up
up between
between thethe equipment
equipment manufacturer
manufacturer and and the
the system
system engineer
engineer to to evaluate
evaluate risks
risks related
related to
to the
the produc
produ
A risk sheet is written and is kept up to date for each risk, in particular this sheet presents quantitative approaches towards
Non Applicable
The type of time measurement is not fully defined in the call for bids (or or the
thecontract
contract), andbutthe
themanufacturer
manufacturerhas hasnot complete
completed
these assumptions have not been validated by the customer.
The type of time measurement is not fully defined in the call for bids (or the contract), but the manufacturer has completed
The type of time measurement is fully defined in the call for bids (or the contract).
Non Applicable
Customer requirements related to reliability are identified not identified.
and listed in a document with no revision index, there is no tracea
justification or record in a document).
Customer requirements related to reliability are identified and listed in a document and (e.g.kept
reliability
up to plan) with revisionversion
date (successive index,
traceability of changes to these requirements (justification and record in a document).
Non Applicable
No Negotiation, fixed requirements.
Informal negotiations, or negotiations after the contract has been signed.
Negotiations with the customer leading to optimisation of costs / performances in achieving Reliability performances, performances. there
negotiation.
Non Applicable
No design review.
Organisation of a design review in which reliability aspects are dealt with incompletely or are handled by persons who are n
Organisation of a design review in which reliability aspects are dealt with completely by persons who are reliability specialis
Non Applicable
No requirements review.
An informal requirements review has been set up (or is planned depending on progress with the project). There are no ava
An informal requirements review has been set up (or is planned depending on progress with the project). Persons respons
An informal requirements review has been set up (or is planned depending on progress with the project). Persons respons
Non Applicable
The product maintenance policy is not defined.
The maintenance policy is defined without taking account of reliability aspects.
maintenance
The product policy is policy
maintenance defined taking
that account
maintains theofproduct
reliability aspectsin(identification
reliability the long termand monitoring
is perfectly of critical
defined and iselements).
described i
Reliability managers participate in the definition of the maintenance policy (identification and monitoring of critical elements
Non Applicable
No reliability plan has been written.
The reliability plan has been written but has not been formalised.
The reliability plan has been written and validated by the project. This document that was written at an early stage is not up
The reliability plan has been written and validated by the project. This document is updated throughout the project as a fun
Non Applicable
No technical data for subassemblies related to the test.

Existence of non validated partially useable data.
Existence of validated partially useable data for all subassemblies.
Existing data are complete, validated and useable for all subassemblies
Not Applicable
There are no procedures related to corrective actions
Corrective actions
Determination are implemented
of corrective following atocustomer
actions necessary eliminatecomplaint
the causes or of
a nonconformity report, but they are not formalised.
the nonconformity,
These
Determination of corrective actions necessary to eliminate the causes of the nonconformity, action is implemented and th
procedures do not define the application of control means to assure that the corrective
Application of control means to assure that the corrective action is implemented and that it produces the expected effect.
Not Applicable
No procedure for preventive actions is implemented
Procedures for preventive actions do exist but they are incomplete
Procedures for preventive actions do exist and are almost complete with regard to the mentioned criteria (there are possibl
Procedures for preventive actions do exist, they are formalised and are complete with regard to the mentioned criteria
Not Applicable
The baseline does not impose any simultaneous engineering.
There is a procedure
global instruction thatsimultaneous
imposing does not specify the methods.
engineering Nonot
but it is formal organisation.
adapted to the company organisation; positions respo
businesses
There is a procedure imposing simultaneous engineering. The organisation of the company is based on permanent specia
Not Applicable
No training or monitoring of skills on these points
There are training courses but not followed, no individualisation of training courses
individually.with update.
Training followed individually
Skills are monitored for all personnel concerned
Not Applicable
No justification document.
There is an informal justification document.
There is a formalised and identified document in the justification file, which assures that all requirements are satisfied.
There is a formalised and identified document in the justification file, which assures that all requirements are satisfied. A di
Not Applicable
No business procedures.
Existence of incomplete procedures that are not managed.
Existence of managed and validated procedures.
Existence of managed and validated procedures covering all businesses, particularly reliability.
Not Applicable
No monitoring of suitability for training.
There is a skills table but this table is not monitored in training.
Training tables are regularly updated, but there is no periodic verification that training is suitable for the activities.
There is a skills table and training is periodically monitored and updated. There are regular evaluations of the suitability of t
Not Applicable
No collection
There of recommendations
is non formalised and nocollection
and unmanaged procedures for processing of feedback from operations.
of recommendations.
Feedback
There is a from operations
formalised is dealt
collection but not systematically.
of recommendations but it is not necessarily applicable to the project (not referenced to the
Feedback from
Formalised operations
collection formalised in a base
of recommendations, that isand
validated not referenced
managed and is not
to the much used in design.
project.
Formalised and validated feedback from operations, referenced to the project, useable and acting as design input data to i
Not Applicable
No preferred components list.
There is non formalised preferred components list, that has not been validated, and only contains technical characteristics.
There is a managed and formalised preferred components list with standardisation objectives. It is validated by purchasing
There is a managed and formalised preferred components list with standardisation objectives. It is validated by purchasing
Not Applicable
No recording methodology.
Methodology initialised without update.
Methodology updated but is unusable/not used (for example due to lack of information).
Methodology updated, useable and used.
Not Applicable
No database.
There is a database but it is not centralised.
There is a centralised database with no formal enrichment process.
There is a centralised database with a formal and updated enrichment process.
Not Applicable
No database, nor personal expert knowledge.
There is no explicit database but personal knowledge and experience of experts.
Formal definition of knowledge and the history of the justification of definitions in a database, but with no procedures for up
There are procedures for updating and management of the database.
Not Applicable
Reliability engineering
Participation does
in reliability not makeduring
engineering any contribution
the producttodesign
product is design.
sporadic and/or
partial. The only contribution of reliability engineering is to evaluate reliability.
Reliability engineering contributes to the design as certified in documents, but the company's baseline does not describe th
Reliability engineering contributes to the design and has the authority to make decisions if a reliability objective is not achie
Not Applicable
No particular protection means is identified.
Protection means are identified but are partially applied in different activities.
Protection means are identified and their application is verified.
Protection means are identified following a periodic analysis of observed anomalies and their application is verified.
Not Applicable
No risk management is made regarding reliability performances.
An initial
This analysis ofbut
is formalised, risks
riskrelated to obtaining
management is notreliability
maintained performances has been made, but risk management is not formalis
in the long term:
cooperation
Cooperation is set up between the equipment manufacturer and the system engineer
is set up between the equipment manufacturer and the system engineer to
to evaluate
evaluate risks
risks related
related to
to the
the produc
produ
A risk sheet is written and is kept up to date for each risk, in particular this sheet presents quantitative approaches towards
Not Applicable
No justification of the test coverage.
The test coverage is evaluated and some compared simply
actions are with
donethe specification.
to maximise performance.
The performance justification is formalised.
test coverage is evaluated and actions are applied to maximise performance.
The performance justification will assure that the coverage rate is maximum.
Not Applicable
No design verification procedures.
There are no formalised verification procedures.
There are formal verification procedures.
There are formal verification procedures that are periodically revised, including peer reviews.
Notsupport
No Applicable
requirements planned. The customer's organisation is not taken into
account.
There are support requirements but they are only partially formalised; They are isolated or even inconsistent and not broke
logistics support organisation at the manufacturer.
Support requirements are formalised. Response
taken into account to
at requirements formalised
the design stage, butbroken
they are not validated andsubassemblies,
down into considered as justified
secondary.andPav
Elements in the support system (documents, training, spare parts batches, tools and test means, etc.) are available and ar
Not Applicable
No design review.
Organisation of a design review in which reliability aspects are dealt with incompletely or are handled by persons who are n
Not Applicable
No management plan, and no planning describing tasks to be accomplished. No organisation set up.
There is an incomplete management plan that does not specify any adjustments to the baseline. The planning describing t
There is an incomplete
a complete management
management planplan that does
specifying not
any specify anytoadjustments
adjustments the baseline.to the baseline. There is planning describ
There is planning describing tasks to be accomplished and the precise and validated organisation set up; there is a good m
Not Applicable
No acceptance procedure.
There is an acceptance procedure but it is done in production independently of development teams.
There is an acceptance procedure done during the development including configuration monitoring, but it has not been val
The acceptance procedure is adapted to the product (proof of traceability of its application to the product and its configurat
Not Applicable
The data used are not traced.
The definition file (DD) contains studies, but they are not up to date (consistent with the rest of the file) and have not been
The definition file contains up-to-date studies, but they have not been validated.
The definition file contains up-to-date and validated studies.
Not Applicable
No reliability oriented design rules.
There are rules but they are not formalised (nor updated nor validated) nor copied nor validated.
There are formalised, updated rules, but they have not been validated.
There are formalised, updated and validated rules.
Not Applicable
Production does not have any information about the method for applying the test on the product.
The
Thereproduction manager
is a validated is aware
compilation ofof the manner in which
recommendations test operations
specifically willthe
describing be manner
carried out and participated
in which in carried
the tests are producingout,th
application.
Production managers participate in the definition of the production test.
There is a validated compilation of recommendations specifically describing the manner in which the tests are carried out,
Not Applicable
No product / process qualification procedure.
Manufacturing processes are informally designed for the product. This is neither traced nor validated.
Manufacturing processes are formally designed for the product, but have not been validated.
The company reference documentation imposes a product / process qualification procedure.
Not Applicable
Suppliers are not qualified.
Suppliers have been partially qualified informally.
The company baseline requires that suppliers should be qualified based on the reliability (and / or the manufacturing qualit
audits, ISO certification).
Not Applicable
No procedure.
There are informal rules.
There is a procedure.
There is a managed procedure that monitors technological change and validated by competent technical services.
Not Applicable
Predicted reliability calculation methodology not controlled.
Tool not recognised
Predicted or validated
reliability calculation methodology identified but not recognised (controversial relevance to the state-of-the-art) an
Tool not recognised or validated
Predicted reliability calculation methodology identified and recognised and not validated
Tool recognised but not validated
Selection and validation of methods and tools used for predicted reliability calculations
Not Applicable
The reliability calculations carried out do not establish the contribution of each function (including built-in test devices) to re
The
Thereinfluence of built-in
is a specified test devices
objective limitingon
thereliability
impact of orbuilt-in
complexity is takenon
test devices into account informally
reliability.
There is an a posteriori verification that this objective is achieved.
This objective is taken into account in the product design so as to optimise the design of built-in tests, and this procedure is
The verification of the objective is substantiated.
Not Applicable
Modelling means are neither validated nor recognised.
recognised and
Modelling means are recognised, validated
validated andbut not monitored.
monitored but no one is assigned to
management of tools.
Modelling means are recognised, validated and monitored. Managed monitoring.
Not Applicable
No changes are made to the predefined test coverage rate.

A summary
Final productoftests
product
are tests can reviewed,
regularly be made witheventhe purpose
after of revising
specification andand improving
design. the predefined
The purpose coverage
is to increase rate. Howevte
the predefined
procedure
Final to be
product adopted.
tests are regularly reviewed, even after specification and design. The purpose is to increase the predefined te
procedure to be adopted. These were validated by an authority independent from the operating entity.
Not Applicable
Corrective actions
the causes or of
a nonconformity report, but they are not formalised.
the nonconformity,
These procedures
Determination do not define
of corrective thenecessary
actions applicationtoofeliminate
control means to assure
the causes of thethat the corrective action is implemented and th
nonconformity,
Not Applicable
Procedures for preventive actions do exist and but they are incomplete
are almost complete with regard to the mentioned criteria (there are possibl
satisfaction of criteria)
Not Applicable
No
Theinspection
varnishingparameters are monitored
activity is monitored during theof
by supervision varnishing
a numberactivity.
of mentioned parameters at the stipulated frequency, but th
and no study indicating their criticality for reliability of the subassembly.
The varnishing activity is monitored by supervision of a number of mentioned parameters at the stipulated frequency. Thes
from a critical analysis of the varnishing activity regarding the reliability of the subassembly. This criticality plan was genera
Not Applicable
There is no corrective maintenance after an anomaly appears on a production means or a subassembly.
Corrective actions are made directly where the anomaly was observed, although a corrective maintenance plan was not se
Real maintenance procedures related to corrective actions are implemented, a formal corrective maintenance procedure is
Not Applicable
There is no preventive maintenance to correct any drifts of production means.
Preventive actions are carried out directly where the anomaly might be detected, although there no formal preventive main
Real maintenance procedures are implemented for preventive actions, there is a formal preventive maintenance plan for th
Not Applicable
There is noofperiodic
A number verification
verifications of theout
are carried programming meansmeans.
on the production used toThese
load software.
verifications are brief and do not necessarily take
There is no clear formal definition of the procedure or the limits of these verification
Planning of verifications has been studied, this planning is respected and a written document has been produced verifying
Strict planning of verifications has been studied, this planning is respected and a written document has been produced ver
This document was produced taking account of the entire software loading process and was validated by an authority inde
Not Applicable
No audit is done to monitor operator skills.
The equivalent of an audit is done to monitor the skills of operators performing the final product test, but it is not formally de
An audit is done to monitor the skills of operators performing the final product test and this audit follows an identified forma
Not Applicable
No manipulation of subassemblies is automated.
A number
The ofautomation
level of manipulations wasofstudied
subassemblies has been
in a feasibility automated.
and result study.
wholeofprocedure
The level automation is formalised,
was studiedalthough the study
in a feasibility and has
resultnotstudy.
been validated by an authority independent from the operat
The whole procedure is formalised, and has been validated by an authority independent from the operating entity.
Not Applicable
There
A check is and/or
no check on maintenance
maintenance of programming
of parameters dataprogrammable
loaded into in programmable production
production means.
means is/are done, but there is no forma
guarantee this maintenance.
A check and maintenance of data programmed in production means are done, in accordance with an identified formal defin
update procedure). All documents have been validated by an authority independent from the operating entity.
Not Applicable
No general inspection is carried out at the end of varnishing.
A person other than the varnishing operator makes a general inspection of this operation, but this inspection is not based o
A person other than the varnishing operator makes a general inspection of this operation. This inspection is done accordin
A person other than the varnishing operator makes a general inspection of this operation. This inspection is done accordin
Not Applicable
The subassembly
Operators is not
drying the dried by experienced
subassembly personnel.
are experienced. Their experience is based on activities very similar to drying subassem
to them.
Operators drying the subassembly are experienced. Their experience is based provenonin formal
similar documents but not
drying activities. validated
This by a
experience
an independent authority.
Not Applicable
There are no instructions for operators.
A number ofrelated
Instructions instructions
to theare provided
activity to beatperformed
the workstation,
do existbut they
and areare not necessarily
formalised given to
in documents the operator.
(workstation sheets, protocols
responsible
Instructions related to the activity to be performed do exist and are formalised in documents (workstation sheets,from
for carrying out an activity. These documents have not been validated by an authority independent the op
protocols
responsible for carrying out an activity. These documents have been validated by an authority independent from the opera
Not Applicable
No readings are taken during execution of the program.
A number of readings are taken during execution of the activity and may be used to find levels applied on the subassembly
Readings are used to precisely know levels applied on subassemblies. They are done according to a predefined formal de
Readings are used to precisely know levels applied on subassemblies. They are done according to a predefined formal de
Not Applicable
There is no explicit description assuring that there will be no mismatch between production means and the subassembly.
A number
Each of criteria
production needisto
means be verified tobyassure
accompanied that the of
a description means
a set are suitable fortothe
of parameters besubassembly, but they are not formall
verified
Each before use
production on a subassembly.
means is accompanied These are formallyofidentified
by a description a set of in a document
parameters thatverified
to be has notbefore
been use
validated by an autho
on a subassembly
This description is sufficiently explicit so that the identified means match the subassembly. All parameters to be verified are
Not Applicable
No records are kept and there is no traceability of problems encountered during production.
Critical points are identified and can be transmitted to initiate corrective actions, but no formal definition is made.
Every production problem, regardless of its nature, is identified and recorded in a document provided for this purpose that
Every production problem, regardless of its nature, is identified and recorded in a document provided for this purpose and
Not Applicable
No hierarchisation of priorities is done in production.
According
A genuine to production
priority planning,
management is some
set uppriority is givenoftoend
as a function subassemblies
of file dates. to minimise
This planning manipulations and storage.
is based on formal Thesetha
documents p
independent from the operating entity.
A genuine priority management is set up as a function of end of file dates. This planning is based on formal documents tha
Not Applicable
Not Applicable
Process changes are recorded
made without being recorded,
and submitted these modifications are not submitted for authorisation.
for authorisation.
These
Any changes
change are not
affecting documented,
processes, and there
production is no procedure
equipment, tools andto programs
control their application.
is described in a document and a procedure m
However,
Any change there is no systematic
affecting processes,check that the
production results oftools
equipment, changes to processes
and programs produce the
is described in arequired
document effect
andand that thesem
a procedure
Systematic checks are carried out to assure that the results of changes to processes produce the required effect and that t
Not Applicable
The pollution content in the solder bath is not measured.
The content of contaminating pollutant in the solder bath is measured. These measurements are sporadic and are not form
The content of contaminating pollutant in the solder bath is measured. These measurements are made following an identif
The content of contaminating pollutant in the solder bath is measured. These measurements are made following an identif
Not Applicable
No self-checking is done on the task
Self-checking is done at the end of the activity. However, it is not described in any formal document .
Self-checking is done at the end of the activity. This is done in accordance with a protocol predefinedthatprotocol formalised
was validated in a
by an docum
authorit
This protocol is formalised in a document .
Not Applicable
There is no indicator to verify that good solder is obtained during the transfer.
There are indicators to assure that a good solder has been achieved. However, these do not depend on a formal study or d
There are indicators to assure that a good solder has been achieved. These are based on a document giving their informa
Furthermore, these documents have been validated by an authority independent from the operating entity .
Not Applicable
No periodic inventory is made and there is no automatic inventory reminder.
Several
Periodic inventories
inventories are
are made.
made. However,
If the datethere
of anisinventory
no formalisplan for the frequency
not respected, of these
a reminder inventories. issued until a new i
is systematically
define actions to be done and the different monitoring forms to be updated.
Periodic inventories are made. If the date of an inventory is not respected, a reminder is systematically issued until a new i
Not Applicable
There is no protection against ESD.
Protection against ESD is subject to non formalised rules and practices.
There are validated procedures for protection against ESD defining practices recognised as protecting the subassemblies.
Protection against ESD is described in validated procedures and follow-up checks are made on these procedures.
Not Applicable
There is no periodic verification for monitoring production means test tools.
Tools and instruments used for inspection of production means are checked occasionally but without following a formal ver
Tools and instruments used for inspection of production means are periodically checked. These verifications (frequency an
Tools and instruments used for inspection of production means are periodically checked. These verifications (frequency an
Not Applicable
No specific protection is used when cleaning subassemblies.
A number of protections are set up during the subassembly cleaning activity. These protections may be specific to some su
Protections and appropriate procedures to be followed are formalised in one or several documents as a function of types o
been validated by an authority independent from the operating entity.
Not Applicable
No self-test is done on the testers.
A self-test is carried out on the testers. This self test is carried out without any formal document or study to determine the e
A self-test is carried out on the testers. This self test is described in documents used to determine the degree of effectivene
Not Applicable
There is no cross-check at the final inspection of varnishing.
A cross-check is done during the final inspection of the subassembly varnishing activity. However, this inspection method i
The
A effectiveness
cross-check of this
is done method
during the has
finalbeen measured
inspection of theand the procedure
subassembly and theactivity.
varnishing scope of the inspection are formally desc
The effectiveness of this method has been measured and the procedure and the scope of the inspection are formally desc
Not Applicable
There is no conformity check before putting into stock in the stores.
Some parameters are monitored when putting into stock in stores, but there is no formal definition of them.
A real check on conformity of items is made before putting in stock in stores. This conformity check is formally described (p
A real check on conformity of items is made before putting in stock in stores. This conformity check is formally described (p
Not Applicable
There is no inspection of the production process using SPC cards.
There is a means of inspecting the production process by SPC card or a similar method, but it is not formally described in a
There is a means of inspecting the production process by SPC card. This statistical check is formalised and its efficiency fo
There is a means of inspecting the production process by SPC card. This statistical check is formalised and its efficiency fo
Not Applicable
There is no description of the varnishing procedure available to the operator.
The different actions to be carried out and to varnish the subassembly
the operations are known
to be followed and are
to varnish theavailable through
subassembly arevarious documents
described in a doc
respected.
The However,
different this
actions to bedocument
carried out has
and notthebeen validated
operations to by
bean authority
followed independent
to varnish from the operating
the subassembly entity. in a doc
are described
respected. This document has also been validated by an authority independent from the operating entity.
Not Applicable
No labels or signs provide any information about expiration dates of consumables.
No labels or signs
Consumables provide any
are correctly information
identified about expiration dates of consumables.
by labelling.
All information are
Consumables necessary
correctlyforidentified
this identification
by labelling. is formally described in documents, but these documents have not been val
All information necessary for this identification is formally described in documents, and these documents have been validat
Not Applicable
There are no test monitoring indicators.
There are a formally
Documents number describe
of indicatorsthe used
way intowhich
identify any indicators
these anomaly that are occurred
processed.during the test. These indicators are not subje
However, these data have not been validated by an authority independent from the operating entity.
There is real time processing of test monitoring indicators. Documents formally describe the way in which these indicators
Not Applicable
No preventive maintenance measure by metrological monitoring has been set up.
A number
Real of metrology
metrological actions
monitoring is are done related
recorded to preventive
in the preventive maintenance.
maintenance plan that is applied.
One or
Real several documents
metrological monitoring formally defineinthese
is recorded actions even
the preventive if they have
maintenance notthat
plan been validated by an organisation independe
is applied.
One or several documents formally define these actions, and this preventive maintenance plan has been validated by an o
Not Applicable
No particular verification governs operation of the drying ovens.
There are several
The operator makesmalfunction
a real check indicators
on driftsforandthemalfunction
drying ovens. These can
indicators . provide information for the operator who would lik
Documents
The operatorare usedaasreal
makes a reference
check on to authorise
drifts the operation
and malfunction of drying
indicators . ovens, even if they have not been validated by an
Documents are used as a reference to authorise the operation of drying ovens. These documents have been validated by
Not Applicable
There is no value of inspection parameters causing a systematic stop of the activity when this value is reached.
Inspection and monitoring means can stop the activity. However, there is no document indicating values beyond which a sy
There are high and low safety systems on inspection and monitoring means. They are formally identified in a document an
There are high and low safety systems on inspection and monitoring means. They are formally identified in a document sp
Not Applicable
There is no plan specific to the method of removing masking varnishes.
Masking varnishes are removed using a particular method but no formal document describes this method.
Operators apply a qualification plan for the method of removing masking varnishes after varnishing of subassemblies. This
Operators apply a qualification plan for the method of removing masking varnishes after varnishing of subassemblies. This
Not Applicable
No particular visual inspection is done during the placement of masking varnish before varnishing.
An inspection specific to the placement of masking varnish for varnishing is done, however no document describes the pro
An inspection step specific to the placement of masking varnish is done. This particular inspection is described in a correct
An inspection step specific to the placement of masking varnish is done. This particular inspection is described in a correct
Not Applicable
There is no preventive maintenance plan in production.
A number ofmaintenance
Preventive parameters does
need exist
to beonverified withinmeans.
production the framework of preventive
This maintenance maintenance.
is broken down inThese points aremaintenance
a documented not exhaus
Not all of this plan has been validated.
Preventive maintenance does exist on production means. This maintenance is broken down in a documented maintenance
Not Applicable
No particular timeout is respected between the different transfer phases on a subassembly.
A number of measures are applied during the component transfer to respect the necessary waiting time between two trans
A document explicitly describes times and actions to be respected for the transfer of components. However, this document
A document explicitly describes times and actions to be respected for the transfer of components. Furthermore, this docum
Not Applicable
There is no revision and record of the plan for maintenance of production means specifically applicable to manipulation of c
Plans for maintenance
Documentation of production
describes points to bemeans
revised are revised
and to be but
madethere is no
more document
robust that the
regarding formally describes
maintenance ofthe frequency
production of t
mean
entity.
Documentation describes points to be revised and to be made more robust regarding the maintenance of production mean
Not Applicable
There
The is no qualified
preparation procedure
of the varnish isorcontrolled
inspection bytomaking
guarantee the on
checks quality of the of
a number prepared
points. varnish.
However,
The no document
preparation formallyisdescribes
of the varnish controlledthis verification.
by making checks on a number of points.
These
The points andofthe
preparation theprocedure
varnish is to be followed
controlled are formalised
by making checks onin aadocument.
number of points.
These points and the procedure to be followed are formalised in a document that has been validated by an independent au
Not Applicable
No plan has been set up to inform operators and update their knowledge.
Operators
These are informed
actions aboutinparticular
are described documents activities and their
describing skills
details are updated
of actions to be occasionally.
followed. However, these actions have no
But these documents
Operators are informed have
aboutnotparticular
been validated.
activities and their skills are updated occasionally according to needs.
These actions are described in documents describing details of actions to be followed and these documents have been va
Not Applicable
No procedure describes this final inspection.
The final inspection of varnishing activities is made by reviewing a number of points considered to be critical, although no f
The final inspection of varnishing activities is made by reviewing a number of points considered to be critical. The different
The final inspection of varnishing activities is made by reviewing a number of points considered to be critical. The different
Not Applicable
There is no procedure or the operator cannot access it from the workstation.
There is a procedure explicitly describing implementation of production means at the workstation. However, the operator ca
workstation. This is formalised in a manner that obliges the operator to be familiar with it before implementing the means (v
There is a procedure explicitly describing implementation of production means at the workstation. This is formalised in a m
Not Applicable
No identification
After software has of been
the loaded
loadedsoftware is made.
in a hardware subassembly, an identifier of the loaded software is provided, assuring that t
However, no document precisely describes the format or logging of this identifier.
Every time that software is loaded, the operator is informed of the software version to be used. An identifier of the version t
A cross verification is formalised.
Not Applicable
There is no monitoring
Maintenance is providedof for
maintenance
production done
means onandproduction means is followed.
this maintenance
However, there is no formal documented maintenance plan indicating the frequency and compulsory application points for
Real maintenance of the production means has been set up. It is monitored based on a plan describing all compulsory app
Not Applicable
There is no check that an operator has received appropriate training for the workstation to which he is posted.
There is a verification to assure that the operator required to perform the task has actually previously received appropriate
There is a verification to assure that the operator required to perform the identified task has actually previously received ap
Not Applicable
There is no particular safety system.
There are monitoring systems or other indicators to determine that parameters to be applied by means on subassemblies a
Documents formally define
There are monitoring theor
systems coverage level andtosetting
other indicators up ofthat
determine these direct monitoring
parameters systems.
to be applied by means on subassemblies a
Documents formally define the coverage level and setting up of these direct monitoring systems. The monitoring plan thus
Not Applicable
No particular verification is done after components have been placed and before remelting.
The operator may make a verification that the placement activity before remelting took place correctly. However, this verific
The operator does make a verification that the placement activity before remelting took place correctly. This verification is d
The operator does make a verification that the placement activity before remelting took place correctly. This verification is d
Not Applicable
No particular verification is made to check that the soldering flux deposit took place correctly.
The operator checks that the activity for the soldering flux deposit (quantity, appearance, etc.) took place correctly. Howeve
The operator checks that the activity for the soldering flux deposit (quantity, appearance, etc.) took place correctly. This ve
Furthermore, these verification means and their placement have been validated by an authority independent from the oper
Not Applicable
There is no verification on the conformity of purchased products.
Conformity of purchased products is only verified by examination of the required documentation.
Conformity of purchased products is verified by examination of products on delivery and by examination of the required do
Conformity of purchased products is verified by examination of products on delivery, by examination of the required docum
Not Applicable
No verification is made to assure that the right product is available for the test to be done.
A verification of the product type for the test to be done might be made This verification is not formally described.
The identification of the product to be tested is systematically verified. This is based on a documented procedure indicating
This verification method has been validated by an authority independent from the operating entity.
Not Applicable
No verification of the test coverage rate during burn-in is done.
The test coverage rate during burn-in was verified when it was set up. No additional verifications have been done with rega
The test coverage rate during burn-in is verified. A document describes changes requiring a verification and the procedure
The test coverage rate during burn-in is verified. A document describes changes requiring a verification and the procedure
Not Applicable
No changes are made to the predefined test coverage rate.

A summary of product tests can be made with the purpose of revising and improving the predefined coverage rate. Howev
Final product tests are regularly reviewed, even after specification and design. The purpose is to increase the predefined te
Final product tests are regularly reviewed, even after specification and design. The purpose is to increase the predefined te
Not Applicable
Corrective actions
the causes or of
a nonconformity
the nonconformity, report, but they are not formalised.
These procedures
nonconformity,
Not Applicable
Not Applicable
No product traceability during its life cycle, the product is distinguished only by its marking.
Traceability is used to identify and the product
know the butproduct
not to determine its originfile
history (Definition and its history.
+ changes),
However
It it is not
is sufficient sufficient
to find to know the documentation
the documentation associated withassociated
its life cyclewith
(e.its
g. life cycle (e.g.follower
configuration no configuration follower records
sheet containing sheet con
o
Exhaustive application of the recommendation.
Not Applicable
Product packaging is not defined, the materials used for this packaging are used depending on their availability.
Information about packaging
the packagingdates, management methods inspections to be carried out is not defined.
is given.
No specific inspection of the packaging.
Special
A product
specific regularpackaging
inspectionisofprovided, and documentation
the packaging is made is associated with it No specific inspection of the packaging.
A procedure regularly checks that periodic inspections are applied.
Not Applicable
Product storage areas are not specific, the storage environment is not considered.
Product
Storage storage
positionsareas are not specific,
are individually the storage environment is controlled and adapted to the stored products.
defined.
Periodic actions are carried out to maintain product characteristics.
The condition of products in stock is regularly inspected, the stock is verified andstorage conditions are regularly optimised
Not Applicable
Normal protections for products during delivery are not used
Product quality protections are used during delivery to the customer. The supplier does not check that accompanying docu
Product
The quality
supplier protections
takes measures aretoused during
protect delivery quality
the product to the customer. The supplier
during delivery does
for its final check that accompanying documen
use.
He assures that the accompanying documentation for the product is present as specified at the time of the order, and that
Not Applicable
No inspection or test during the phase.
Inspections are carried out during the phase, but they are not formalised in the form of written procedures or quality plan.
Inspections are carried out during the phase and are formalised in the form of written procedures or a quality plan. These in
Not Applicable
No final inspection or test.
Final inspections and tests are carried out, but they are not described in strict procedures or in a quality plan.
Final inspections
All activities and tests
specified in theare carried
quality planout, Theyinare
and/or described
written in strict
procedures procedures
have or in a quality
been satisfactorily plan. Application of these
accomplished
Data and the associated documentation are available (follower sheet type document that records the configuration, operati
Not Applicable
No inspection or test on reception
Inspections and tests are carried out on reception, but no procedure specific to these actions is described.
Conformity
Inspections with specified
carried out in requirements
subcontractor ispremises
verified in
andaccordance with a quality
proofs of conformity plan and/or
supplied written
are taken intoprocedures. There is no
account to determine the
When the entering product is released before it has been verified for reasons of urgency, it is identified and this release is r
Not Applicable
There is no corrective maintenance after an anomaly appears on a production means or a subassembly.
Corrective actions are made directly where the anomaly was observed, although a corrective maintenance plan was not se
Not Applicable
There is noactions
Preventive preventive maintenance
are carried to correct
out directly where anythedrifts of production
anomaly might bemeans.
detected,
although
Real there no formal
maintenance preventive
procedures maintenanceforplan
are implemented is set up.
preventive actions, there is a formal preventive maintenance plan for th
authority independent from the operating entity.
Not Applicable
There
A is noofperiodic
number verification
verifications of theout
are carried programming meansmeans.
on the production used toThese
load software.
verifications are brief and do not necessarily take
There is no clear formal definition of the procedure or the limits of these verification
Planning
Strict of verifications
planning has been
of verifications studied,
has been this planning
studied, is respected
this planning and aand
is respected written document
a written has been
document produced
has been verifying
produced ver
This document was produced taking account of the entire software loading process and was validated by an authority inde
Not Applicable
No audit is done to monitor operator skills.
The equivalent of an audit is done to monitor the skills of operators performing the final product test, but it is not formally de
Not Applicable
No manipulation of subassemblies is automated.
A number
The level ofofautomation
manipulations wasofstudied
subassemblies has been
in a feasibility automated.
and result study.
wholeofprocedure
The level automation is formalised,
was studiedalthough the study
in a feasibility and has notstudy.
result been validated by an authority independent from the operat
The whole procedure is formalised, and has been validated by an authority independent from the operating entity.
Not Applicable
There is no check on maintenance of programming data in programmable production means.
A check and/or maintenance of parameters loaded into programmable production means is/are done, but there is no forma
Not Applicable
There is no information about the degree of nonconformity of the product.
The indication of the degree of nonconformity of the products is only used for information, its purpose is not to make a dec
Written procedures define the process for classification of nonconformities and control over the use of nonconforming com
processprocess
The formal for authorisation of personnel
for authorisation and theto application
use replacement
field formaterials
personneland/or nonconforming
authorising products
the use of is not materials
replacement formalised.
an
The process for control over scrapped parts.
Not Applicable
No product inspection
Acceptance methods andor test procedure
criteria has been specified, there is no description of methods and acceptance criteria.
are described.
The results
Results are are
not not kept. and used for feedback from operations.
recorded
Procedures also
Acceptance describe
methods and training anddescribed.
criteria are qualification of operators.
Results are recorded and used for feedback from operations. Procedures also describe training and qualification of operat
Not Applicable
No documentation specific to the incoming inspection on supplies.
Product identification documents are the only documents used for the incoming inspection on supplies.
Purchasing
approval documents
of their include a precise identification, the applicable edition of specifications, drawings, requirements in te
processing
The customer's requirements are forwarded to suppliers.
Not Applicable
There are of
A number noinstructions
instructionsare
for provided
operators.at the workstation, but they are not necessarily
given to the operator.
Instructions related to the activity to be performed do exist and are formalised in documents (workstation sheets, protocols
Instructions related to the activity to be performed do exist and are formalised in documents (workstation sheets, protocols
Not Applicable
There is no explicit description assuring that there will be no mismatch between production means and the subassembly.
A number of criteria need to be verified to assure that the means are suitable for the subassembly, but they are not formall
Each production means is accompanied by a description of a set of parameters to be verified before use on a subassembly subassembl
This description is sufficiently explicit so that the identified means match the subassembly. All parameters to be verified are
Not Applicable
No records are kept and there is no traceability of problems encountered during production.
Critical points are identified and can be transmitted to initiate corrective actions, but no formal definition is made.
Every production problem, regardless of its nature, is identified and recorded in a document provided for this purpose that
Every production problem, regardless of its nature, is identified and recorded in a document provided for this purpose and
Not Applicable
No procedures to assure that products are conforming with specified requirements. Nothing formal.
Generic procedures (all products) are defined to assure conformity of
the purchased product.
There is a formal
Procedures proof:
specific e.g.product
to the Ratingare defined in a validated plan to assure conformity of the purchased product.
Procurementspecific
Procedures conditions and
to the the responsibilities
product are defined inofa persons
validateddoing
plan the work are
to assure not described.
conformity of the purchased product.
Procurement conditions and the responsibilities of persons doing the work are described. Proofs that these procedures hav
Not Applicable
The nonconforming product is not examined.
The nonconforming product is examined and described but these actions are carried out with no written procedures.
The nonconforming
Rejected or scrapped.product is examined and described according to written procedures, but they do not allow for product m
If required by the contract, the proposal for use or repair of the non-conforming product is submitted to the customer. The r
Not Applicable
No hierarchisation of priorities is done in production.
According to production planning, some priority is given to subassemblies to minimise manipulations and storage. These p
Not Applicable
Not Applicable
Means concerning special processes are not formally identified.
Documents identify technical means dedicated to special processes. Equipment and personnel associated with these proc
Process operation qualification requirements, including associated equipment and personnel, are specified.
Process operation qualification requirements, including associated equipment and personnel, are specified. Documents ide
Not Applicable
Special processes are not associated with qualified human resources.
Special processes are done by trained operators, but there is no regular check on their skills.
Special processes are done by qualified operators, or they are continuously monitored.
Special processes are done by qualified operators and they are continuously monitored.
Not Applicable
No documentation about product inspections and tests.
The documentation for product inspections and tests is limited to the test program; it contains the reference to specification
The documentation includes a program and a test report containing information about the test itself, and also all results wit
The documentation includes the test program, the test report, specifications for test means, and the definition of test mean
Not Applicable
No documentation specific to the products or processes, there are no plans to provide special documentation.
Documentation specific to products and processes does exist, however it is not always effectively updated, there is no ana
Documentation specific to products and processes does exist, it is updated periodically in a planned manner, the validity of
Precise procedures are applied for storage and preservation of the documentation.
Not Applicable
There is no procedure that defines how to check that inspection, measurement and test equipment is compatible with need
Procedures define how to check that inspection, measurement and test equipment is compatible with needs. There is no c
Inspection, measurement
Test software or comparison andreferences
test equipment
used is
asused in suchmeans
inspection a manner that thebefore
are verified measurement
they are uncertainty
put into serviceis known and is
to demonst
Systematic verification before use is industrially impossible but the use of a metrological procedure (Validation period and d
Not Applicable
The environment of inspection, measurement and test equipment is not taken into account.
Inspection, measurement and test equipment is protected against aggression that could damage it, it. it is also protected aga
Handling, preservation
Inspection, measurement andandstorage of inspection
test equipment equipment
is protected are not
against defined bythat
aggression strict procedures.
could damage it, it is also protected aga
Handling, preservation and storage of inspection equipment are defined by strict procedures.
Not Applicable
The layout of are
Workstations workshops
specificistonot designed as a function of the processed product.
equipment.
The working environment
Workstations are specific to is equipment.
controlled.
The working environment is controlled and verified.
Workshop layouts are designed to optimise maintenance.
Not Applicable
made without
Process changes are recorded being recorded,
for authorisation.
These
Any changes
change are not
affecting documented,
processes, and there
production is no procedure
equipment, to programs
tools and control their application.
is described in a document and a procedure m
However,
Any changethere is no systematic
affecting processes,check that the
production results oftools
equipment, changes to processes
and programs produce the
is described in arequired
document effect
andand that thesem
a procedure
Systematic checks are carried out to assure that the results of changes to processes produce the required effect and that t
Not Applicable
Handling methods are not defined. There are no specific means to prevent deterioration during manipulation.
Handling methods are defined, but they are not specific to a product.
Handling methods specific to the product are written down, specific means are provided to prevent any deterioration during
Product manipulation procedures are specifically defined, and associated means prevent any deterioration to the product d
Not Applicable
Means and tools are not submitted for inspection and validation before use.
Means and tools are submitted for inspection before use, but these inspections are not all formalised.
The periodic inspection of means and tools is submitted for validation, formal procedures identify actions periodicand inspections
periodic to be
insp
Formal procedures describe maintenance of tools.
Not Applicable
Handling, storage, packaging, preservation and delivery conditions are coded, not coded,
thereandareexecution
procedures of these
that canoperations is not
be adapted to
Execution of these operations is not specific to a product.
Handling, storage, packaging, preservation and delivery conditions are coded, there are procedures specific to each produ
Considerations such as expiration dates, sensitivity of products to stress, dangerousness of products are also coded and a
Not Applicable
Special processes are not identified.
Special processes
Any modification toare identified.
these Theand
operations parameters
parameters for these
will beprocesses
described(materials,
in a proposalpersonnel,
justifyingprocedures and software)
this modification and guaranare
Special processes have not been verified by making one or several typical parts under defined conditions.
Special processes are verified by making one or several typical parts under defined conditions.
Special processes (subcontracted or not) are qualified before they are used and they are kept up to date.
Not Applicable
Services and supplies such as water, compressed air, electricity and chemicals are not verified.
Services and supplies such as water, compressed air, electricity and chemicals are verified occasionally following a proven
Services and supplies such as water, compressed air, electricity and chemicals are controlled and verified periodically to m
Services and supplies such as water, compressed air, electricity and chemicals are controlled and verified continuously to
Not Applicable
No self-checking is done on the task
Self-checking is done at the end of the activity. However, it is not described in any formal document .
Self-checking is done at the end of the activity. This is done in accordance with a protocol predefined
thatprotocol formalised
was validated in a
by an docum
authorit
Not Applicable
Protection against ESD is subject to non formalised rules and practices.
There are validated procedures for protection against ESD defining practices recognised as protecting the subassemblies.
Protection against ESD is described in validated procedures and follow-up checks are made on these procedures.
Not Applicable
There is no periodic verification for monitoring production means test tools.
Tools and instruments used for inspection of production means are checked occasionally but without following a formal ver
Tools and instruments
documents and they have used for inspection
been validated byof an
production
authoritymeans are periodically
independent from the checked. These verifications (frequency an
operating entity.
Not Applicable
No self-test is done on the testers.
A self-test is carried out on the testers. This self test is carried out without any formal document or study to determine the e
Not Applicable
No labels or signs
Consumables provide any
are correctly information
identified about expiration dates of consumables.
by labelling.
All information necessary for this identification
Consumables are correctly identified by labelling. is formally described in documents, but these documents have not been val
All information necessary for this identification is formally described in documents, and these documents have been validat
Not Applicable
There are no test monitoring indicators.
There are a formally
Documents number describe
of indicators
the used
way intowhich
identify any indicators
these anomaly that
are occurred
processed. during the test. These indicators are not subje
However, these data have not been validated by an authority independent from the operating entity.
There is real time processing of test monitoring indicators. Documents formally describe the way in which these indicators
Not Applicable
Records of inspections and tests are produced but are not kept.
Records of inspections and tests are produced and are kept but cannot be used to identify the source of the inspection (pe
Records
The of inspections
records are sufficientand
totests arethe
identify produced
person and
whoare kept out
carried andthe
caninspections
be used toandidentify the source
authorised of the
release of inspection
the product. (perso
Test records indicate measured values when they are required by the specification or the acceptance plan.
Not Applicable
No inspection file
The inspection file is limited to the definition of acceptance or refusal criteria.
Thesequential
the inspectionlist
fileof
defines acceptance
inspection and testoroperations
refusal criteria, and theout,
to be carried list of operations to be done. It proposes inspection resul
inspection result record documents, the list of specific and non-specific inspection instruments, documents associated with
Not Applicable
There is no documentation specific to the nonconformity.
Documentationdocuments
Nonconformity specific to the nonconformity
specify the productplays a unique the
identification, roledescription
to identify the nonconforming
of the nonconformity product
and the cause of the nonc
However, theredocuments
Nonconformity is no formalspecify
definition
the of actionsidentification,
product to prevent recurrence of theofnonconformity,
the description reworking
the nonconformity or cause
and the repairsofif the
necessa
nonc
Actions are formalised to prevent recurrence of the nonconformity, reworking or repairs if necessary and checking of chara
Not Applicable
There is no preventive maintenance plan in production.
A number of parameters need to be verified within the framework of preventive maintenance. These points are not exhaus
Not Applicable
There is no procedure or the operator cannot access it from the workstation.
There is a procedure explicitly describing implementation of production means at the workstation. However, the operator ca
Not Applicable
No identification
After software has of been
the loaded
loadedsoftware is made.
in a hardware subassembly, an identifier of the loaded software is provided, assuring that t
However, no document precisely describes the format or logging of this identifier.
Every
be time
used. Anthat software
identifier is loaded,
of the versionthe operator
to be used isisprovided
informedafter
of the software
the version to be used. An identifier of the version t
operation
Not Applicable
There is no monitoring
Maintenance is providedof for
maintenance
production done
means onand
production means is followed.
this maintenance
However, there is no formal documented maintenance plan indicating the frequency and compulsory application points for
Not Applicable
There is no check that an operator has received appropriate training for the workstation to which he is posted.
There is a verification to assure that the operator required to perform the task has actually previously received appropriate
Not Applicable
There is no verification on the conformity of purchased products.
Conformity of purchased products is only verified by examination of the required documentation.
Conformity of purchased products is verified by examination of products on delivery and by examination of the required do
Conformity of purchased products is verified by examination of products on delivery by examination of the required docume
Not Applicable

Corrective actions
the causes or of
a nonconformity
These
Determination of corrective actions necessary to eliminate the causes of the nonconformity, action is implemented and th
procedures do not define the application of control means to assure that the corrective
Not Applicable
Not Applicable
know the butproduct
+ changes),
However
It it is not
its life cyclewith
(e.its
o
Not Applicable
Information about the packaging dates,
packaging management methods inspections to be carried out is not defined.
is given.
No specific
Special inspection
product of theispackaging.
packaging provided, and documentation is associated with it
Nospecific
A specificregular
inspection of the of
inspection packaging.
the packaging is made
Not Applicable
Product storage
Storage positionsareas are not specific,
are individually defined.the storage environment is controlled and adapted to the stored products.
Not Applicable
Normal protections for products during delivery are not used
Product quality protections are used during delivery to the customer. The supplier does not check that accompanying docu
Product
The quality
supplier protections
takes measures aretoused during
protect delivery quality
the product to the customer. The supplier
during delivery does
for its final check that accompanying documen
use.
He assures that the accompanying documentation for the product is present as specified at the time of the order, and that
Not Applicable
Not Applicable
Final
All inspections
activities and tests
and/or described
written in strict
accomplished
Not Applicable
No inspection or test on reception
Inspections and tests are carried out on reception, but no procedure specific to these actions is described.
Conformity with
Inspections specified
carried out in requirements
subcontractor ispremises
verified in accordance
and with a quality
proofs of conformity plan and/or
supplied written
are taken intoprocedures. There is no
account to determine the
When the entering product is released before it has been verified for reasons of urgency, it is identified and this release is r
Not Applicable
The indication
Written of thedefine
procedures degree theofprocess
nonconformity of the products
for classification is only used for
of nonconformities andinformation,
control overitsthe
purpose
use of is not to make a com
nonconforming dec
processprocess
The formal for authorisation of personnel
for authorisation and the to application
use replacement
field formaterials
personnel and/or nonconforming
authorising the use ofproducts is not materials
an
Notproduct
No Applicable
inspection or test procedure has been specified, there is no description of
methods and acceptance
Acceptance methods and criteria.
criteria are described.
The results are not kept.
Results are not recorded and used for feedback from operations.
Procedures
Results also describe
are recorded training
and used forand qualification
feedback of operators.
from operations. Procedures also describe training and qualification of operat
Not Applicable
Purchasing documents
approval of their include a precise identification, the applicable edition of specifications, drawings, requirements in te
processing
Notprocedures
No Applicable to assure that products are conforming with specified requirements.
Nothing formal.
There is a formal
Procedures proof:
Procurementspecific
Procedures conditions and
to the the responsibilities
validateddoing
plan the work are
Not Applicable
The nonconforming product is not examined.
The nonconforming product is examined and described but these actions are carried out with no written procedures.
The nonconforming
Rejected or scrapped.product is examined and described according to written procedures, but they do not allow for product m
If required by the contract, the proposal for use or repair of the non-conforming product is submitted to the customer. The r
Not Applicable
Not Applicable
operators,and
Special processes are done by qualified operators or they
theyare
arecontinuously
continuouslymonitored.
monitored.
Not Applicable
No documentation about product inspections and tests.
The documentation for product inspections and tests is limited to the test program; it contains the reference to specification
The documentation includes a program and a test report containing information about the test itself, and also all results wit
The documentation includes the test program, the test report, specifications for test means, and the definition of test mean
Notdocumentation
No Applicable specific to the products or processes, there are no plans to provide
special documentation.
Documentation specific to products and processes does exist, however it is not
always effectively
Documentation updated,
specific there is no
to products andanalysis
processes about
doestheexist,
validity
it isofupdated
documents.
periodically in a planned manner, the validity of the documents used is not analysed.
analysed.
Not Applicable
Inspection,
Test software measurement
or comparison andreferences
test equipment
used isasused in suchmeans
they are uncertainty is known
put into service and is
to demonst
Not Applicable
Handling, preservation and storage of inspection equipment are not defined by strict procedures.
Inspection, measurement and test equipment is protected against aggression that could damage it, it is also protected aga
Not Applicable
The layout of are
equipment.
Workstations are specific tois equipment.
controlled.
Not Applicable
made without
Process changes are recorded being recorded,
for authorisation.
These changes
However, are
there is nonot documented,
systematic checkandthatthere is no procedure
the results of changes to to
control their application.
processes produce the required effect and that these
quality.
produce the required effect and that these changes have not modified the product
quality.
Not Applicable
Not Applicable
The periodic inspection of means and tools is submitted for validation, formal procedures identify actions periodicand inspections
periodic to be
insp
Not Applicable
Handling, storage, packaging, preservation and delivery conditions are coded, not coded,
thereandareexecution of these
procedures that canoperations is not
be adapted to
Not Applicable
Special processes are identified. The parameters for these processes (materials, personnel, procedures and software) are
Any modification to these operations and parameters will be described in a proposal justifying this modification and guaran
Special processes are haveverified
not been verified one
by making by making one typical
or several or several
partstypical
underparts under
defined defined conditions.
conditions.
Not Applicable
Not Applicable
No self-checking
Self-checking is done
is done on the
at the endtask
of the activity. However, it is not described in any
formal document
Self-checking .
is done at the end of the activity. This is done in accordance with a
predefined
protocol thatprotocol formalised
was validated by anin aauthority
document. independent from the operating entity.
Not Applicable
Protection against ESD
There are validated is subject
procedures fortoprotection
non formalised
againstrules
ESDand practices.
defining practices
recognisedagainst
Protection as protecting
ESD isthe subassemblies.
described in validated procedures and follow-up checks are
made on these procedures.
Not Applicable
No labels
these or signshave
documents providenot any
been information
validated by about expirationindependent
an authority dates of consumables.
from the
operating
these entity. have been validated by an authority independent from the operating
documents
entity.
Not Applicable
Records of inspections and tests are produced but are not kept.
Records of inspections and tests are produced and are kept but cannot be used to identify the source of the inspection (pe
Records
The records of inspections
are sufficient and totests arethe
identify produced
person andwhoare kept out
carried andthe
caninspections
be used toandidentify the source
authorised of the
the product. (perso
Test records indicate measured values when they are required by the specification or the acceptance plan.
Not Applicable
No inspection file
The inspectionlist
the sequential fileofdefines acceptance
Not Applicable
of the nonconformityproduct
However, there is no formal definition of actions to prevent recurrence of
Nonconformity documents specify the product identification, the description of the nonconformity and thethe nonconformity, reworking or cause
repairsofif the
necessa
nonc
Not Applicable
There is no procedure
workstation. However, or thethe operator
operator cancannot access
implement theit means
from the workstation.
with no assurance that
he isitfamiliar
with before with it The proposed
implementing the meansformat is such
(visual that the
warning whenoperator
startingwillupnot
thesystemat
means,
etc).
means, etc). This formal definition has also been validated by an authority
Not Applicable
No identification
software of theassuring
is provided, loaded software is made.is conforming with the subassembly.
that the software
However,
Every timeno document
that softwareprecisely
is loaded, describes
the operatorthe format or logging
is informed of theofsoftware
this identifier.
version to
be used. An identifier of the version to be used is provided after the operation operation.
Not Applicable
There is no of
Conformity verification
purchased onproducts
the conformity
is only of purchased
verified products. of the required
by examination
documentation.
Conformity of purchased products is verified by examination of products on delivery
andexamination
by by examination of theofrequired
the required documentation.
documentation and by inspection and audit of the
purchase source.
Not Applicable
Corrective actions
the causes or of
a nonconformity
These procedures
nonconformity,
Not Applicable
Not Applicable
know the butproduct
+ changes),
However
It it is not
its life cyclewith
(e.its
o
Not Applicable
Information about packaging
the packaging dates, management methods inspections to be carried out is not defined.
is given.
No specific
Special inspection
product packaging of theispackaging.
provided, and documentation is associated with it
Nospecific
A specificregular
inspection of the of
inspection packaging.
the packaging is made
Not Applicable
Product
Storage storage
positionsareas are not specific,
are individually defined. the storage environment is controlled and adapted to the stored products.
Not Applicable
Not Applicable
Final inspections
All activities and tests
and/or described
written in strict
accomplished
Not Applicable
No policy iswith
associated applied to evaluate risks
nonconformities only of onnonconformity.
products. But not on all design, planning,
manufacturing, assembly, inspection
associated with nonconformities, not only on productsprocesses, etc. but also on all design, planning, manufacturing, assembly, inspectio
This policy does not take account of
manufacturing, assembly, inspection processes, etc. potential risks associated with human factors.
This policy takes account of potential risks associated with human factors.
Not Applicable
The indication
Written proceduresof thedefine
degree theofprocess
nonconformity of the products
for classification is only used for
of nonconformities andinformation,
control overitsthe
purpose
use of is not to make a com
nonconforming dec
The process for authorisation of personnel to use replacement materials and/or nonconforming
formal process for authorisation and the application field for personnel authorising the use of replacement materials an products is not formalised.
Notproduct
No Applicableinspection or test procedure has been specified, there is no description of
methods andmethods
Acceptance acceptance and criteria.
criteria are described.
The results
Results are are
not not kept. and used for feedback from operations.
recorded
Procedures also describe
Results are recorded training
and used forand qualification
feedback of operators.
from operations. Procedures also describe training and qualification of operat
Not Applicable
Purchasing documents
approval of their include a precise identification, the applicable edition of specifications, drawings, requirements in te
processing
Notprocedures
No Applicable to assure that products are conforming with specified requirements.
Nothing formal.
There is a formal
Procedures proof:
Procurementspecific
Procedures conditionsto theand the responsibilities
validateddoing
plan the work are
Not Applicable
No documentation concerning special processes.
The associated documentation only deals with processes, the associated products or human resources are not taken into
Records are provided for processes, products and personnel associated with special processes, but these procedures are
Records for processes, products and personnel are updated;
Not Applicable
Not Applicable
Special processes are done by qualified operators operators,and or they
theyare
arecontinuously
continuouslymonitored.
monitored.
Notdocumentation
No Applicable specific to the products or processes, there are no plans to provide
special documentation.
Documentation specific to products and processes does exist, however it is not
always effectively
Documentation updated,
specific there is no
to products andanalysis
processesabout
doestheexist,
validity
it isofupdated
documents.
analysed.
Not Applicable
No built-in tests, maintenance is done when a failure appears
There is a minimum
Application of PBIT, surveillance by lights
CBIT, IBIT (Power upor alarms.
Built In Test, Continuous Built In Test,
Initiated Built
Application ofinbuilt-in
test) type
teststests.
(PBIT, CBIT, IBIT) and testability complements by one (or
several) external test means.
Not Applicable
Inspection,
Test measurement
software or comparison andreferences
test equipment
used is
asused in suchmeans
put into service and is
to demonst
Not Applicable
Handling, preservation
Inspection, measurement andandstorage of inspection
test equipment equipment
is protected are not
against defined bythat
aggression strict procedures.
could damage it, it is also protected aga
Not Applicable
The layout of are
equipment.
Workstations are specific to is equipment.
controlled.
Not Applicable
Process changes are recordedmade without being recorded,
for authorisation.
These changes are not documented, and there is no procedure to control their application.
However, there is no systematic check that the results of changes to processes produce the required effect and that these
quality.
quality.
Not Applicable
Not Applicable
The periodic inspection of means and tools is submitted for validation, formal procedures identify actions periodicandinspections
periodic to be
insp
Not Applicable
Handling, storage, packaging, preservation and delivery conditions are coded, not coded, and
there areexecution
proceduresof these operations
that can be adapted is not
to
Not Applicable
Special processes
Any modification toare identified.
these Theand
operations parameters for these
parameters will beprocesses
described(materials,
in a proposalpersonnel,
justifyingprocedures and software)
this modification and guaran are
Special processes are haveverified
not been verified one
by making by making one typical
or several or several
partstypical
underparts under
defined defined conditions.
conditions.
Not Applicable
Not Applicable
Protection against ESD
There are validated is subject
procedures fortoprotection
non formalised
againstrules
ESDand practices.
defining practices
recognised as protecting the subassemblies.
Protection against ESD is described in validated procedures and follow-up checks are
Not Applicable
No inspection file
The inspectionlist
the sequential fileof
defines acceptance
Not Applicable
of the nonconformity product
However, there is no formal definition of actions to prevent recurrence of the nonconformity,
Nonconformity documents specify the product identification, the description of the nonconformity and the reworking or cause
repairsofif the
necessa
nonc
Not Applicable
No evaluation has been made of the impact, no specific systems to protect products.
A few product protection systems have been set up (storage room), partial awareness of personnel.
Workshops are provided with structures to provide protection against risks of damage to equipment caused by unsuitable i
Formal studies have been carried out, to preserve the product in production (e.g. Process FMECA).
Not Applicable
No indicator on Reliability engineering has been set up. No Reliability business actions are performed.
No indicator
Some on Reliability
indicators have been engineering has been set
set up (maintenance up, the company's
of performances, baseline includes
performances documents
of prediction related
methods), the to Reliabilityba
company's e
Directives engineering
Reliability are regularlyhaveupdated.
been fixed; the company's Reliability engineering is audited regularly (further training of person
conferences).
Not Applicable
No information about the product reliability perceived by the customer is available.
There is some available information about product reliability perceived by the customer.
Customer satisfaction inquiries have been carried out dealing with the reliability aspect, aspect. action plans aimed to improve the
customer has seen the results.
Not Applicable
There is no process for construction of reliability in the company.
The reliability construction process is described.
The reliability objectives
improvement constructionareprocess is described,
fixed, action plans are progress
definedactions are defined
and a summary informally.
of results
obtained is made.
Not Applicable
The manufacturer has set not up
setaup a quality
quality system.
system but there is no standard quality
certification for it, or the certification is more than a year old.
The manufacturer has set up a quality system and has obtained a certification. For example ISO 9000 V2000.
He regularly audits his reliability activity internally (at least once every two years) to define progress actions.
Not Applicable
No-one responsible for reliability engineering participates in the project.
Persons responsible for reliability engineering participate partially (incomplete service according to the meaning in the reco
Persons responsible
according to the meaningfor reliability engineering participate
in the recommendation) fully (complete
in the project, and thisservice according to the meaning in the recomme
participation
is formally defined in documents.
Not Applicable
The reliability specialist has not received any specific training (initial or further training).
No awareness
Awareness actions
actions have have been undertaken
been carried out for companyin thepersonnel
company, but persons
concerned responsible
by reliability (e.g.for reliability personnel
production studies have be
inform
Persons responsible
Personnel for reliability
are experienced, studies have
and business received
activities training and
are organised are company.
in the experienced.
The personnel participate in reliability conferences and present documents
Not Applicable
No allocation
Means of means
are allocated is clearly activities,
to reliability attributed but
to reliability activities.
insufficiently (competent personnel,
adapted tools, time to perform under-sized studies).
Means (human and equipment) are satisfactorily allocated to reliability activities.
Means (human and equipment) are satisfactorily allocated to reliability activities, these means are described in a job mana
Not Applicable
Reliability documents are not managed in configuration.
Some documents
(Recording, saving, are managed
archiving, in configuration.
validation, management of documents in configuration
not done systematically.
Predicted reliability study documents are accessible for more than 5 years after they
are produced (for comparative studies between predictions/operations).
Notreliability
No Applicable risk analysis is made with the subcontractor before the contract is signed
(no reliability
No specific provision)
risk analysis is made with the subcontractor before the contract is signed,
but a risk identification
The reliability risk analysiswaswasmade during
made the job.
before These risks
the contract wasare not managed.
signed and is described
in a formal document. These risks are not managed.
The reliability risk analysis was made before the contract was signed and is described in a formal document. Identified risk
Not Applicable
The quality policy does not take reliability into account.
Reliability is mentioned indirectly in quality policy objectives.
Reliability is mentioned in the company's quality policy.
Reliability is one of the major objectives of the quality policy.
Not Applicable
There is no verification, calibration and rating procedure for measurement instruments
and test
There is and trial benches
a verification, in the company.
calibration and rating procedure for measurement instruments
and test
There is and trial benches
a verification, in the company,
calibration and ratingbut it is not respected.
procedure for measurement instruments
and test and trial benches in the company, and it is applied.
Verification, calibration and rating of measurement instruments and test and trial benches used by the company is controlle
Not Applicable
No reliability evaluation by analysis of feedback from operations.
Observation and collection of information dealing with product failure rates, the only feedback from operations relates to a
Feedback from operations for evaluation of reliability data, analysis of causes of failure, allocation of the cause of failures,
Feedback from operations for evaluation of reliability data, analysis of causes of failure, allocation of the cause of failures,
Not Applicable
No person responsible for reliability studies has been identified.
There is a person responsible for reliability studies in practice, but no record of his appointment is available.
A reliability study manager has been formally named, he has been trained and has experience in the reliability field.
A reliability study manager has been named and integrated into the project, he is trained and has the required experience
Not Applicable
There are no planned periodic meetings with the subcontractor in which reliability aspects of the subcontracted product are
Although they have not been planned, meetings with the subcontractor have taken place in which reliability aspects were d
Periodic meetings with the customer are defined in project plans, in which reliability aspects are dealt with. These are held
Periodic meetings with the customer are defined in project plans, in which reliability aspects are dealt with, these take plac
Not Applicable
Reliability tasks are not planned.
Reliability tasks to be done are identified but are not described in a plan.
Reliability tasks are described and there is a planning for them.
Reliability tasks are described and there is a planning for them tied to other company plannings
Not Applicable
There is no communication with the subcontractor dealing with reliability.
There is a communication
Requirements with the subcontractor
for the communication dealing withdealing
with the subcontractor reliability
withaspects.
reliability
aspects are described
Requirements in a project management
for the communication plan, but only
with the subcontractor partialwith
dealing application
reliabilityof these requirements has been demonstr
aspects are described in a project management plan, and are applied (proofs of this application).
Not Applicable
No activity has been planned or done related to product reliability improvement.
There are activities
Fundamental related
activities to reliability
related improvement
to reliability but are
improvement theydescribed
do not appear in specific
in plans and plans.
are done partially.
Fundamental activities related to reliability improvement are described in plans and are done completely and records of the
Not Applicable
No planning has been made for reliability studies.
Although there is a calendar for reliability studies, they do not appear on a planning.
Reliability studies appear on the project planning.
Reliability studies appear on the project planning. There is a formal definition of synchronisation between execution of the
Not Applicable
No analysis is made of potential degradations that could occur during production operations.
Some isolated analyses of degradations that occurred during production operations are carried out so as to remedy observ
A Process FMECA was done at least once to evaluate and reduce risks of a reduction in the product reliability.
A Process FMECA is done systematically to evaluate and reduce risks of degrading the reliability of new products or produ
Not Applicable
There is no available feedback from customers about the perception of product reliability.
There is some available feedback from customers concerning reliability, and but not
it ismuch
used of it is used.
to improve the product design, development and production.
The company regularly consults its customers about the reliability of its products (formal interviews or investigations by que
Not Applicable
No components are selected
Components are selected informally based on the reliability (or manufacturing quality) criteria.
The company baseline requires that components should be selected based on the reliability (and/or manufacturing quality)
The company baseline requires that components should be selected based on the reliability (and/or manufacturing quality)
Not Applicable
Component suppliers are not selected.
A partial selection of component suppliers is made informally.
The company baseline requires that component suppliers should be selected based on the reliability (and or manufacturing
The company baseline requires that component suppliers should be selected based on the reliability (and or manufacturing
Notsystem
No Applicable
has been set up for monitoring corrective actions that the subcontractor
was asked to take.
Corrective actions that the subcontractor was asked to take are monitored partially during meetings with the subcontractor.
A system has been set up for periodic monitoring of corrective actions that the subcontractor has been asked to take, but i
A system has been set up for periodic monitoring of corrective actions that the subcontractor has been asked to take and t
Not Applicable
The Reliability of products is not discussed in the Management reviews.
The reliability of products is discussed irregularly during Management Reviews.
The reliability of products is systematically dealt with during Management Reviews.
The reliability of products is systematically dealt with during Management Reviews, progress objectives are defined, and an
Not Applicable
There is no system for processing anomalies.
The manufacturer has set up a system for processing anomalies, that partially satisfies the requirements of the recommend
The manufacturer
- They are regularlyhas set up a system
interpreted for processing
to produce conclusions, anomalies, that partially satisfies the requirements of the recommend
- Benefits of the system set up are measured.
Not Applicable
neither observed
Feedback from operations is recorded, but it is nor
not recorded.
used at all, or it is used with
unsuitable from
Feedback statistical methods
operations not formalised.
is recorded, it is used with suitable methods but they are
not formalised
Feedback from(no generalised
operations methods).
is recorded, it is processed using relevant statistical
methods and it is distributed to users.
Not Applicable
Contractual requirements about reliability are applicable but are not transmitted to the subcontractor.
The manufacturer sends contractual requirements or internal requirements related to reliability to the subcontractor, but the
The subcontractor has produced a reliability management reference document (management plan or reliability plan), that r
The subcontractor has produced a reliability management reference document (management plan or reliability plan), that r
Not Applicable
Recommendation not applied

Recommendation partly applied
Recommendation almost fully applied
Recommendation fully applied
Not Applicable
Not Applicable
Not Applicable
Not Applicable
Not Applicable
Not Applicable
Not Applicable
Not Applicable
Not Applicable
Not Applicable
Not Applicable
Not Applicable
Not Applicable
Not Applicable
Not Applicable
Not Applicable
en vert) au sein du cadre bleu
et - situés dans les marges
Global rating 5484

Process Grade 0.8101
Description Rating
Resources allocated to reliability studies are identified at project management level and
are formalised in a validated plan. Proof of the real availability of resources is established 32.1
.
Persons responsible for reliability engineering have defined (or have participated in
defining) the allocation of reliability requirements to subassemblies. No validated 10.4
document certifies this allocation.
The product environment is known perfectly (applicable parameters defined in the

37.2
recommendation are known). A document lists all these parameters.
Product failures are perfectly identified in the call for bids (or the contract).
The list of feared events has been provided in the call for bids (or contract). 30.9
Degraded modes are also described in the call for bids (or contract).
The method of demonstrating the product reliability is defined perfectly in the call for bids
29.4
or the contract (in accordance with the content of the recommendation).
The life profile provided in the specification (contract) satisfies the recommendation or
29.7
was defined completely by the manufacturer and formally validated by the customer.
Complete identification of customer reliability requirements as requested in the
24.3
recommendation at the time of the call for bids
The manufacturer's feedback from operations is used and formalised in a document.

This feedback from operations corresponds to technologies currently used in which
formal similarity studies are carried out and formally defined to evaluate the 25.5
differences (document).
Predicted reliability methods are validated or adjusted, and regularly updated.
Reliability engineering contributes to the design and has the authority to make decisions
if a reliability objective is not achieved. This is certified in documents. The company's
37.8
baseline describes this participation. A reliability engineering guide like the FIDES Guide
is applied
One of the three types of performance specification (as defined in the recommendation)
is defined in the specification. 24.6
All quantification assumptions are formally specified
Risks related to obtaining reliability performances are perfectly identified.

There is a procedure for management of these risks at the manufacturer and it is
followed.
Cooperation is set up between the equipment manufacturer and the system engineer to
37.2
evaluate risks related to the product environment.
A risk sheet is written and is kept up to date for each risk, in particular this sheet presents
quantitative approaches towards risk probability, severity (cost, planning, performance),
proposed solutions to reduce the risk and cost of solutions.
The type of time measurement is fully defined in the call for bids (or the contract). 19.8
Customer requirements related to reliability are identified and listed in a document and
kept up to date (successive versions if justified) with their revision index, there is 21.9
traceability of changes to these requirements (justification and record in a document).
Negotiations with the customer leading to optimisation of costs / performances in

achieving Reliability performances, there is an official document describing this 32.1
negotiation.
Organisation of a design review in which reliability aspects are dealt with completely by
30.9
persons who are reliability specialists. A procedure or plan imposes this review.
An informal requirements review has been set up (or is planned depending on progress
with the project). Persons responsible for reliability engineering were called upon to
30.9
participate in the document review or validation, and records of this participation are
available. A procedure or plan imposes this review
The product maintenance policy that maintains the product reliability in the long term is
perfectly defined and is described in a document.
17.4
Reliability managers participate in the definition of the maintenance policy (identification
and monitoring of critical elements).
The reliability plan has been written and validated by the project. This document is
22.8
updated throughout the project as a function of events that might make it change.
Description Rating
Existing data are complete, validated and useable for all subassemblies 23.4

Effective processing of customer complaints and nonconformity reports on the product,
The search for causes of nonconformity related to the product, the process and the
quality system and recording the results of this search,
20.1
Determination of corrective actions necessary to eliminate the causes of the
nonconformity,
Application of control means to assure that the corrective action is implemented and that
it produces the expected effect.
Procedures for preventive actions do exist, they are formalised and are complete with
20.4
regard to the mentioned criteria
50.1
Training followed individually with update.

17.4
Skills are monitored for all personnel concerned
There is a formalised and identified document in the justification file, which assures that
24
all requirements are satisfied. A directive imposes that this document is written.
Existence of managed and validated procedures covering all businesses, particularly

41.4
reliability.
There is a skills table and training is periodically monitored and updated. There are
73.5
regular evaluations of the suitability of training to satisfy the company's objectives.
Formalised collection of recommendations, validated and referenced to the project.

Formalised and validated feedback from operations, referenced to the project, useable 23.1
and acting as design input data to improve reliability.
There is a managed and formalised preferred components list with standardisation
objectives. It is validated by purchasing, methods and technical services and contains not
24
only technical characteristics but also information about the reliability and failure methods
of components.
Methodology updated, useable and used. 72.6
There is a centralised database with a formal and updated enrichment process. 31.8
There are procedures for updating and management of the database. 23.4
Reliability engineering contributes to the design and has the authority to make decisions
if a reliability objective is not achieved. This is certified in documents. The company's
37.8
baseline describes this participation. A reliability engineering guide like the FIDES Guide
is applied
Protection means are identified following a periodic analysis of observed anomalies and
21.9
their application is verified.
Risks related to obtaining reliability performances are perfectly identified.
There is a procedure for management of these risks at the manufacturer and it is
followed.
Cooperation is set up between the equipment manufacturer and the system engineer to
63
evaluate risks related to the product environment.
A risk sheet is written and is kept up to date for each risk, in particular this sheet presents
quantitative approaches towards risk probability, severity (cost, planning, performance),
proposed solutions to reduce the risk and cost of solutions.
The test coverage is evaluated and actions are applied to maximise performance.
18
The performance justification will assure that the coverage rate is maximum.
There are formal verification procedures that are periodically revised, including peer
81.3
reviews.
Support requirements formalised: maintenance concept .
There is a project organisation at the manufacturer to satisfy customer requirements in
the form of a logistics support plan .
Support requirements are taken into account at the design stage, they are broken down 16.2
into subassemblies, justified and validated in a supportability file.
Elements in the support system (documents, training, spare parts batches, tools and test
means, etc.) are available and are consistent and validated .
Organisation of a design review in which reliability aspects are dealt with completely by
36.3
persons who are reliability specialists. A procedure or plan imposes this review.
There is a complete management plan specifying any adjustments to the baseline.

There is planning describing tasks to be accomplished and the precise and validated 53.1
organisation set up; there is a good match with the company workload plan.
The acceptance procedure is adapted to the product (proof of traceability of its

23.4
application to the product and its configuration) and is validated.
The definition file contains up-to-date and validated studies. 22.5
There are formalised, updated and validated rules. 38.1
Production managers participate in the definition of the production test.

There is a validated compilation of recommendations specifically describing the manner
18
in which the tests are carried out, and there is proof that the recommendations are
applied.
The company reference documentation imposes a product / process qualification

21.6
procedure.
The company baseline requires that suppliers should be qualified based on the reliability
(and / or the manufacturing quality) criterion, this qualification is effective and is based on
22.8
formal activities (interview with suppliers, analysis of previous services,
audits, ISO certification).
There is a managed procedure that monitors technological change and validated by

21.6
competent technical services.
Selection and validation of methods and tools used for predicted reliability calculations 23.1
There is a specified objective limiting the impact of built-in test devices on reliability.
This objective is taken into account in the product design so as to optimise the design of
30.6
built-in tests, and this procedure is traced.
The verification of the objective is substantiated.
Modelling means are recognised, validated and monitored. Managed monitoring. 41.4
Description Rating
Final product tests are regularly reviewed, even after specification and design. The
purpose is to increase the predefined test coverage. Documents describe the
19.8
procedure to be adopted. These were validated by an authority independent from the
operating entity.

46.2
nonconformity,
Application of control means to assure that the corrective action is implemented and that
it produces the expected effect.
46.8
The varnishing activity is monitored by supervision of a number of mentioned parameters

at the stipulated frequency. These parameters are monitored and derived
from a critical analysis of the varnishing activity regarding the reliability of the 29.7
subassembly. This criticality plan was generated and then validated (parameters
monitored and implemented) by an independent authority.
Real maintenance procedures related to corrective actions are implemented, a formal

corrective maintenance procedure is applied for them and has been validated by an 20.7
Real maintenance procedures are implemented for preventive actions, there is a formal
preventive maintenance plan for them and it has been validated by an authority 12
Strict planning of verifications has been studied, this planning is respected and a written
document has been produced verifying all points (and way this was done).
12.3
This document was produced taking account of the entire software loading process and
was validated by an authority independent from the operating entity.
An audit is done to monitor the skills of operators performing the final product test and
this audit follows an identified formal definition, This audit has been validated by an 12.3
Manipulations of subassemblies are automated.

The level of automation was studied in a feasibility and result study.
19.5
The whole procedure is formalised, and has been validated by an authority independent
from the operating entity.
A check and maintenance of data programmed in production means are done, in

accordance with an identified formal definition (document, inspection procedure,
8.4
update procedure). All documents have been validated by an authority independent from
the operating entity.
A person other than the varnishing operator makes a general inspection of this operation.
This inspection is done according to a formalised procedure described in a document 13.2
that has been validated by an authority independent from the operating entity.
Operators drying the subassembly are experienced. Their experience is based on similar
drying activities. This experience is proven in formal documents validated by 16.8
an independent authority.
Instructions related to the activity to be performed do exist and are formalised in

documents (workstation sheets, protocols, etc.). They are given to each operator
22.2
responsible for carrying out an activity. These documents have been validated by an
Readings are used to precisely know levels applied on subassemblies. They are done
according to a predefined formal definition (document indicating the protocol, frequency,
20.7
etc.), and these documents have been validated by an authority independent from the
operating entity.
Each production means is accompanied by a description of a set of parameters to be

verified before use on a subassembly.
This description is sufficiently explicit so that the identified means match the 21.6
subassembly. All parameters to be verified are formalised in a document that has been
validated by an authority independent from the operating entity.
Every production problem, regardless of its nature, is identified and recorded in a

document provided for this purpose and following a predefined formal format. The
complete system and more particularly the way in which information is recorded for reuse 22.8
during preventive and corrective maintenance, has been validated by an authority
A genuine priority management is set up as a function of end of file dates. This planning
is based on formal documents that have been validated by an authority independent from 9.3
the operating entity.
Protection means are identified following a periodic analysis of observed anomalies and
21.9
their application is verified.
Process changes are recorded, persons authorised to approve changes to production
processes are clearly named.
Changes requiring acceptance by the customer are identified before application.
Any change affecting processes, production equipment, tools and programs is described
41.7
in a document and a procedure must be produced to control its application.
Systematic checks are carried out to assure that the results of changes to processes
quality.
The content of contaminating pollutant in the solder bath is measured. These

measurements are made following an identified protocol and frequency. All these points
17.4
to be respected are described in a document that has been validated by an authority
Self-checking is done at the end of the activity. This is done in accordance with a
protocol that was validated by an authority independent from the operating entity. 15.9
There are indicators to assure that a good solder has been achieved. These are based
on a document giving their information level and the protocol to be followed.
18
Furthermore, these documents have been validated by an authority independent from the
operating entity .
Periodic inventories are made. If the date of an inventory is not respected, a reminder is
systematically issued until a new inventory has been validated. Documents formally
16.5
define actions to be done and the different monitoring forms to be updated. It was
Protection against ESD is described in validated procedures and follow-up checks are
78
Tools and instruments used for inspection of production means are periodically checked.
These verifications (frequency and procedures) are formalised in documents and they 14.7
have been validated by an authority independent from the operating entity.
A number of protections are set up during the subassembly cleaning activity.
Protections and appropriate procedures to be followed are formalised in one or several
18
documents as a function of types of subassembly, and these documents have
A self-test is carried out on the testers. This self test is described in documents used to
determine the degree of effectiveness and the procedure. These documents have been 15.3
A cross-check is done during the final inspection of the subassembly varnishing activity.
The effectiveness of this method has been measured and the procedure and the scope 16.8
of the inspection are formally described in validated documents.
A real check on conformity of items is made before putting in stock in stores. This
conformity check is formally described (parameters, special points, etc.) through a set of
documents. The relevance of the information in these documents and the manner in 18
which they are broken down has been validated by an authority independent from the
operating entity.
There is a means of inspecting the production process by SPC card. This statistical
check is formalised and its efficiency for the process to be checked is known. The
13.5
complete system has been validated by an authority independent from the operating
entity.
The different actions to be carried out and the operations to be followed to varnish the
subassembly are described in a document formally setting down the protocol to be
17.4
respected. This document has also been validated by an authority independent from the
operating entity.
Consumables are correctly identified by labelling.

All information necessary for this identification is formally described in documents, and
19.2
these documents have been validated by an authority independent from the operating
entity.
There is real time processing of test monitoring indicators. Documents formally describe
the way in which these indicators are processed. These documents have been validated 14.1
by an authority independent from the operating entity.
Real metrological monitoring is recorded in the preventive maintenance plan that is

applied.
One or several documents formally define these actions, and this preventive 17.7
maintenance plan has been validated by an organisation independent from the operating
entity.
The operator makes a real check on drifts and malfunction indicators .

Documents are used as a reference to authorise the operation of drying ovens. These 18.3
documents have been validated by an authority independent from the operating entity.
There are high and low safety systems on inspection and monitoring means. They are
formally identified in a document specific to each means. Furthermore, these documents
17.1
and stop procedures have been validated by an authority independent from the operating
entity.
Operators apply a qualification plan for the method of removing masking varnishes after
varnishing of subassemblies. This plan is formally defined through specific documents 19.5
that have been validated by an authority independent from the operating entity.
An inspection step specific to the placement of masking varnish is done. This particular
inspection is described in a correctly formalised procedure. These documents have been 19.5
validated by an independent authority.
Preventive maintenance does exist on production means. This maintenance is broken

down in a documented maintenance plan that has been validated by an authority 14.1
A document explicitly describes times and actions to be respected for the transfer of
components. Furthermore, this document has been validated by an authority 19.2
Documentation describes points to be revised and to be made more robust regarding the
maintenance of production means. The frequency of these revisions and all actions
20.1
aimed at reducing possibilities of degradation due to parameter drifts have been
The preparation of the varnish is controlled by making checks on a number of points.

These points and the procedure to be followed are formalised in a document that has 17.7
been validated by an independent authority.
Operators are informed about particular activities and their skills are updated
occasionally according to needs.
These actions are described in documents describing details of actions to be followed 13.2
and these documents have been validated by an authority independent from the
operating entity.
The final inspection of varnishing activities is made by reviewing a number of points

considered to be critical. The different actions to be carried out are described in a
15.6
documented procedure. This document has also been validated by an authority
There is a procedure explicitly describing implementation of production means at the

workstation. This is formalised in a manner that obliges the operator to become familiar
with it before implementing the means (visual warning when starting up the means, etc). 15.3
This formal definition has also been validated by an authority independent from the
operating entity.
Every time that software is loaded, the operator is informed of the software version to be
used. An identifier of the version to be used is provided after the operation 20.1
Real maintenance of the production means has been set up. It is monitored based on a
plan describing all compulsory application points and the frequency of the different
17.7
actions. Furthermore, these documents have been validated by an authority independent
There is a verification to assure that the operator required to perform the identified task
has actually previously received appropriate training. This verification follows a formal
25.5
procedure for a complete review of the different points. The procedure has been
There are monitoring systems or other indicators to determine that parameters to be
applied by means on subassemblies are respected.
Documents formally define the coverage level and setting up of these direct monitoring 19.8
systems. The monitoring plan thus produced has been validated by an authority
The operator does make a verification that the placement activity before remelting took
place correctly. This verification is done in accordance with a procedure (from mentioning
a simple visual inspection to the description of points to be systematically verified). 17.7
Furthermore, this procedure has been validated by an authority independent from the
operating entity.
The operator checks that the activity for the soldering flux deposit (quantity, appearance,
etc.) took place correctly. This verification is done in accordance with a procedure
enabling traceability (for example barcode reading of the manufacturing follower sheet). 17.7
Furthermore, these verification means and their placement have been validated by an
Conformity of purchased products is verified by examination of products on delivery, by

examination of the required documentation and by inspection and audit of the purchase 25.8
source.
The identification of the product to be tested is systematically verified. This is based on a

documented procedure indicating the procedure to be followed (barcode reading of an
identifier, etc.). 18.3
This verification method has been validated by an authority independent from the
operating entity.
The test coverage rate during burn-in is verified. A document describes changes
requiring a verification and the procedure to be implemented. This entire document has 15.6
Description Rating
Final product tests are regularly reviewed, even after specification and design. The
purpose is to increase the predefined test coverage. Documents describe the procedure 13.2
to be adopted.
Procedures related to corrective actions include at least:
30.8
nonconformity,
These procedures do not define the application of control means to assure that the
corrective action is implemented and that it produces the expected effect.
Procedures for preventive actions do exist and are almost complete with regard to the
mentioned criteria (there are possible minor nonconformities in the application or 31.2
Traceability is used to identify and know the product history (Definition file + changes),
However it is not sufficient to know the documentation associated with its life cycle (e.g.
33
no configuration follower sheet containing records of operations carried out and
anomalies observed).
Special product packaging is provided, and documentation is associated with it No
24.6
specific inspection of the packaging.
Product storage areas are specific.

The storage environment is controlled and adapted to the stored products.
21.6
Storage positions are individually defined.
Product quality protections are used during delivery to the customer. The supplier does
check that accompanying documents are present, but does not protect them against loss 35
and deterioration.
Inspections are carried out during the phase and are formalised in the form of written
14.4
procedures or a quality plan. These inspections and test are not always complete.
Final inspections and tests are carried out, They are described in strict procedures or in a
15.8
quality plan. Application of these inspections and tests is not verified and validated.
Conformity with specified requirements is verified in accordance with a quality plan

and/or written procedures. There is no monitoring of products allowed to enter without 13.4
inspections in case of urgency.
Real maintenance procedures related to corrective actions are implemented, a formal

corrective maintenance procedure is applied for them but it has not been validated by an 13.8
Real maintenance procedures are implemented for preventive actions, there is a formal
preventive maintenance plan for them but it has not been validated by an 8
Planning of verifications has been studied, this planning is respected and a written
8.2
document has been produced verifying all points (and way this was done).
An audit is done to monitor the skills of operators performing the final product test and
this audit follows an identified formal definition, although it has not been validated by an 8.2
Manipulations of subassemblies are automated.

The level of automation was studied in a feasibility and result study.
13
The whole procedure is formalised, although the study has not been validated by an
A check and maintenance of data programmed in production means are done, in

accordance with an identified formal definition (document, inspection procedure, update 5.6
procedure).
The description of the accepted nonconformity or the repairs made is recorded to

indicate the real condition of the product.
Written procedures define the process for classification of nonconformities and control
20.6
over the use of nonconforming components in finished products.
The process for authorisation of personnel to use replacement materials and/or
nonconforming products is not formalised.
Product inspection or test procedures are specified. Acceptance methods and criteria are
described.
23.2
Procedures also describe training and qualification of operators.
Purchasing documents include a precise identification, the applicable edition of

specifications, drawings, requirements in terms of process, inspection instructions and
other relevant technical data, the title, identifier and edition of the quality system standard 17.6
to be applied, purchasing documents reviewed and approved before distribution, to
assure that they satisfy the requirements.
Instructions related to the activity to be performed do exist and are formalised in

documents (workstation sheets, protocols, etc.). They are given to each operator
14.8
responsible for carrying out an activity. These documents have not been validated by an
Each production means is accompanied by a description of a set of parameters to be

verified before use on a subassembly. These are formally identified in a document that 14.4
has not been validated by an authority independent from the operating entity.
Every production problem, regardless of its nature, is identified and recorded in a

document provided for this purpose that can then be used for preventive and corrective 15.2
maintenance. Nevertheless, this form of information recording has not been validated.
Procedures specific to the product are defined in a validated plan to assure conformity of
21.2
Procurement conditions and the responsibilities of persons doing the work are not
described.
The nonconforming product is examined and described according to written procedures,

27.2
but they do not allow for product modifications or acceptance without modification.
A genuine priority management is set up as a function of end of file dates. This planning
is based on formal documents that have not been validated by an authority independent 6.2
Protection means are identified and their application is verified. 14.6
Process operation qualification requirements, including associated equipment and

26.2
personnel, are specified.
Special processes are done by qualified operators, or they are continuously monitored. 23.4
The documentation includes a program and a test report containing information about the
18.6
test itself, and also all results with a list of anomalies remaining at the end of the test.
Documentation specific to products and processes does exist, it is updated periodically in
24.4
a planned manner, the validity of the documents used is not analysed.
Inspection, measurement and test equipment is used in such a manner that the
measurement uncertainty is known and is compatible with the required measurement 19.2
aptitude. There is no verification of inspection equipment before it is put into service.

15.8
Workstations are specific to equipment.

19.2

Any change affecting processes, production equipment, tools and programs is described 27.8
However, there is no systematic check that the results of changes to processes produce
the required effect and that these changes have not modified the product quality.
Handling methods specific to the product are written down, specific means are provided
to prevent any deterioration during manipulations. There is no verification about their 17.6
application.
The periodic inspection of means and tools is submitted for validation, formal procedures
21
identify periodic inspections to be carried out.
Handling, storage, packaging, preservation and delivery conditions are coded, there are
13
procedures specific to each product.
Special processes are identified.
The parameters for these processes (materials, personnel, procedures and software) are
evaluated.
Significant operations and parameters of the process to be controlled in production have
been identified and documented.
28.8
Any modification to these operations and parameters will be described in a proposal
justifying this modification and guaranteeing that it does not introduce any harmful effect
on the result of the process.
Special processes have not been verified by making one or several typical parts under
defined conditions.
Services and supplies such as water, compressed air, electricity and chemicals are
controlled and verified periodically to make sure that their effect on the process is 20.2
constant.
10.6
predefined protocol formalised in a document.
There are validated procedures for protection against ESD defining practices recognised
52
as protecting the subassemblies.
Tools and instruments used for inspection of production means are periodically checked.
These verifications (frequency and procedures) are formalised in documents, but there is 9.8
no validation of these documents by an authority independent from the operating entity.
A self-test is carried out on the testers. This self test is described in documents used to
determine the degree of effectiveness and the procedure. But these documents have not 10.2

All information necessary for this identification is formally described in documents, but
12.8
these documents have not been validated by an authority independent from the
operating entity.
There is real time processing of test monitoring indicators.

Documents formally describe the way in which these indicators are processed.
9.4
However, these data have not been validated by an authority independent from the
operating entity.
Records of inspections and tests are produced and are kept and can be used to identify
10.6
the source of the inspection (persons, machine).
The inspection file defines acceptance or refusal criteria, and the list of operations to be
11.4
done. It proposes inspection result record documents.
Nonconformity documents specify the product identification, the description of the
nonconformity and the cause of the nonconformity.
However, there is no formal definition of actions to prevent recurrence of the 22.2
nonconformity, reworking or repairs if necessary and checking of characteristics affected
by the reworking or repairs.
Preventive maintenance does exist on production means. This maintenance is broken

down in a documented maintenance plan. 9.4

workstation. This is formalised in a manner that obliges the operator to be familiar with it 10.2
before implementing the means (visual warning when starting up the means, etc).
Every time that software is loaded, the operator is informed of the software version to be
13.4
used. An identifier of the version to be used is provided after the operation.
Real maintenance of the production means has been set up. It is monitored based on a
plan describing all compulsory application points and the frequency of the different 11.8
actions.
There is a verification to assure that the operator required to perform the identified task
has actually previously received appropriate training. This verification follows a formal 17
procedure for a complete review of the different points.
Conformity of purchased products is verified by examination of products on delivery and

17.2
by examination of the required documentation.
Description Rating
30.8
nonconformity,
33
Special product packaging is provided, and documentation is associated with it
24.6

21.6
Product quality protections are used during delivery to the customer. The supplier does
check that accompanying documents are present, but does not protect them against loss 35
and deterioration.
14.4
15.8
Conformity with specified requirements is verified in accordance with a quality plan

and/or written procedures. There is no monitoring of products allowed to enter without 13.4
inspections in case of urgency.

20.6
described.
23.2
21.2
described.
The nonconforming product is examined and described according to written procedures,

27.2
but they do not allow for product modifications or acceptance without modification.

26.2
The documentation includes a program and a test report containing information about the
18.6
test itself, and also all results with a list of anomalies remaining at the end of the test.
Documentation specific to products and processes does exist, it is updated

24.4
Inspection, measurement and test equipment is protected against aggression that could
damage it, it is also protected against manipulations that would invalidate calibration
settings. 15.8
Handling, preservation and storage of inspection equipment are not defined by strict
procedures.

19.2
27.8
the required effect and that these changes have not modified the product
quality.
application.
21
13
evaluated.
28.8
defined conditions.
constant.
10.6
predefined protocol formalised in a document.
There are validated procedures for protection against ESD defining practices
36.8

All information necessary for this identification is formally described in documents, but
12.8
these documents have not been validated by an authority independent from the
operating entity.
Records of inspections and tests are produced and are kept and can be used to identify
10.6
the source of the inspection (persons, machine).
11.4


workstation. This is formalised in a manner that obliges the operator to be familiar
10.2
with it before implementing the means (visual warning when starting up the means,
etc).
Every time that software is loaded, the operator is informed of the software version to
13.4
be used. An identifier of the version to be used is provided after the operation.
Conformity of purchased products is verified by examination of products on delivery

17.2
and by examination of the required documentation.
Description Rating
35
nonconformity,
18.4
Special product packaging is provided, and documentation is associated with it
27.6

31.2
22.4
20.8
There is a policy aimed at identifying, evaluating and managing potential risks

associated with nonconformities, not only on products but also on all design, planning,
32.6
manufacturing, assembly, inspection processes, etc.
This policy does not take account of potential risks associated with human factors.
25.6
described.
28.6

13.6
described.
Records are provided for processes, products and personnel associated with special
24.4
processes, but these procedures are not updated.
26.2
Documentation specific to products and processes does exist, it is updated

11.2
Application of PBIT, CBIT, IBIT (Power up Built In Test, Continuous Built In Test,
35.2
Initiated Built in test) type tests.
Inspection, measurement and test equipment is protected against aggression that could
damage it, it is also protected against manipulations that would invalidate calibration
settings. 23.4
Handling, preservation and storage of inspection equipment are not defined by strict
procedures.

21.6
27.8
the required effect and that these changes have not modified the product
quality.
application.
22.6
22.6
evaluated.
30.4
defined conditions.
constant.
There are validated procedures for protection against ESD defining practices
34.8
11.4
Description Rating
Workshops are provided with structures to provide protection against risks of damage to
equipment caused by unsuitable infrastructures (for example electrostatic discharges), 14.8
personnel have been trained in their use.
Some indicators have been set up (maintenance of performances, performances of

prediction methods), the company's baseline includes documents related to Reliability
13.2
engineering.
Directives are regularly updated.
Customer satisfaction inquiries have been carried out dealing with the reliability aspect. 15.8
The reliability construction process is described, progress actions are defined informally. 12.6
The manufacturer has set up a quality system and has obtained a certification. For
13
example ISO 9000 V2000.
Persons responsible for reliability engineering participate fully (complete service

according to the meaning in the recommendation) in the project, but this participation is 17.6
not formalised in a plan or procedure.
Awareness actions have been carried out for company personnel concerned by reliability
(e.g. production personnel informed about non-degradation of products). 15
Persons responsible for reliability studies have received training and are experienced.
Means (human and equipment) are satisfactorily allocated to reliability activities. 16.6
Assumptions related to predicted calculations are specified in documents.

Documentation related to reliability studies is controlled but not systematically:
10.8
(Recording, saving, archiving, validation, management of documents in configuration
not done systematically.
The reliability risk analysis was made before the contract was signed and is described
14.4
in a formal document. These risks are not managed.
Reliability is mentioned in the company's quality policy. 14.8
There is a verification, calibration and rating procedure for measurement instruments

15.6
and test and trial benches in the company, and it is applied.
Feedback from operations for evaluation of reliability data, analysis of causes of failure,
allocation of the cause of failures, record of the real product usage profile. Role to 16
observe feedback from operations, not used to quantify the reliability of new projects.
A reliability study manager has been formally named, he has been trained and has
17
experience in the reliability field.
Periodic meetings with the customer are defined in project plans, in which reliability
11.4
aspects are dealt with. These are held sporadically.
Reliability tasks are described and there is a planning for them. 12.6
Requirements for the communication with the subcontractor dealing with reliability
aspects are described in a project management plan, but only partial application of these 8.2
requirements has been demonstrated.
Fundamental activities related to reliability improvement are described in plans and

18.2
are done partially.
Reliability studies appear on the project planning. 14.6
A Process FMECA was done at least once to evaluate and reduce risks of a reduction in
16.2
the product reliability.
There is some available feedback from customers concerning reliability, and it is used
14.6
to improve the product design, development and production.
The company baseline requires that components should be selected based on the
reliability (and/or manufacturing quality) criterion without further clarification. This is 25.8
effective but is based only on manufacturer data.
The company baseline requires that component suppliers should be selected based on
the reliability (and or manufacturing quality) criterion. This is effective and is based on an 21.6
analysis of data provided by suppliers.
A system has been set up for periodic monitoring of corrective actions that the
14.4
subcontractor has been asked to take, but it is not completely or satisfactorily controlled.
The reliability of products is systematically dealt with during Management Reviews. 11.2
The manufacturer has set up a system for processing anomalies, that partially satisfies
16.6
the requirements of the recommendation. It is fully applied to the project.
Feedback from operations is recorded, it is used with suitable methods but they are
12
not formalised (no generalised methods).
The subcontractor has produced a reliability management reference document

(management plan or reliability plan), that repeats the original requirements of the prime 15.4
contractor. The manufacturer does not verify that this baseline is applied.
Description Rating
Recommendation almost fully applied 8

ger les données qu'elles contiennent
es or a non formalised specific allocation. 1

d are formalised in a document. 2
d are formalised in a validated plan. 3
d are formalised in a validated plan. Proof of the real availability of resources is established . 4
5
6
ining) the allocation of reliability requirements to subassemblies. No validated document certifies this al 7
ining) the allocation of reliability requirements to subassemblies. Validated documents certify this partic 8
ining) the allocation of reliability requirements to subassemblies. Validated documents certify this part 9
10
defined any formal
mmendation assumption.
are partially known) but no document lists these parameters and 11
12
mmendation are partially known), the manufacturer has made complementary assumptions and formali 13
mmendation are known). A document lists all these parameters. 14
15
16
f feared events, and (or) product degraded modes without formal validation by the customer 17
f feared events, and (or) product degraded modes with formal validation by the customer 18
19
20
oduced any formal assumption. 21
not contain any details about the measurement method. 22
ion of the method to be used only partially satisfies the recommendation. 23
ds or the contract (in accordance with the content of the recommendation). 24
25
26
ially by the manufacturer with no validation by the customer.
ommendation or that was partially defined by the manufacturer and formally 27
28
was defined completely by the manufacturer and formally validated by the customer. 29
30
ion (according to the recommendation) was not provided. 31
32
33
mendation at the time of the call for bids 34
35
n previous projects). 36
37
38
39
40
41
al. The only contribution of reliability engineering is to evaluate reliability. 42
pany's baseline does not describe this participation. 43
ns if a reliability objective is not achieved. This is certified in documents. The company's baseline describ 44
45
46
ned in the recommendation). 47
n) is defined in the specification. 48
49
50
51
but risk management is not formalised or is incomplete. 52
oo evaluate
evaluate risks
risks related
related to
to the
the product
product environment.
environment. 53
nts quantitative approaches towards risk probability, severity (cost, planning, performance), proposed solutions to54 reduce the risk and co
55
d the
but themanufacturer
manufacturerhas hasnot completed
completed it. data by making assumptions, although
these 56
57
but the manufacturer has completed these data by making assumptions validated by the customer. 58
59
60
no revision index, there is no traceability of changes to these requirements (no 61
62
.kept
reliability
up to plan) with revisionversions
date (successive index, there is no traceability
if justified) of changes
with their revision to these
index, requirements (no justif
there is 63
64
65
66
67
performances. there is an official document describing this
ving Reliability performances, 68
69
70
71
or are handled by persons who are not reliability specialists. 72
y persons who are reliability specialists. 73
y persons who are reliability specialists. A procedure or plan imposes this review. 74
75
76
s with the project). There are no available records that persons responsible for reliability engineering part 77
s with the project). Persons responsible for reliability engineering were called upon to participate in the d 78
s with the project). Persons responsible for reliability engineering were called upon to participate in the 79
80
81
82
ndperfectly
monitoring of critical
defined and iselements).
described in a document. 83
n and monitoring of critical elements). 84
85
86
87
as written at an early stage is not updated. 88
ated throughout the project as a function of events that might make it change. 89
90
91
92
93
94
95
96
97
98
99
100
101
report,
mity, but they are not formalised. 102
rective
mity, action is implemented and that it produces the expected effect. 103
at it produces the expected effect. 104
105
106
107
mentioned criteria (there are possible minor nonconformities in the application or satisfaction of criteria) 108
regard to the mentioned criteria 109
110
111
112 are allocated ind
ompany organisation; positions responsible for logistics support, industrialisation, purchasing, development and RAMS
113
pany is based on permanent specialists of the function. 114
115
116
117
118
119
120
121
122
t all requirements are satisfied. 123
t all requirements are satisfied. A directive imposes that this document is written. 124
125
126
127
128
129
130
131
132
s suitable for the activities. 133
ular evaluations of the suitability of training to satisfy the company's objectives. 134
135
136
to the project (not referenced to the project) and is not validated. 137
sed in design. 138
and acting as design input data to improve reliability. 139
140
141
ly contains technical characteristics. 142
ectives. It is validated by purchasing, methods and technical services and contains only technical charac 143
ectives. It is validated by purchasing, methods and technical services and contains not only technical cha 144
145
146
147
148
149
150
151
152
153
154
155
156
157
abase, but with no procedures for updating and management of configuration monitoring. 158
159
160
161
162
pany's baseline does not describe this participation. 163
ns if a reliability objective is not achieved. This is certified in documents. The company's baseline describ 164
165
166
167
168
d their application is verified. 169
170
171
but risk management is not formalised or is incomplete. 172
oo evaluate risks related to the product environment.
evaluate risks related to the product environment. 173
nts quantitative approaches towards risk probability, severity (cost, planning, performance), proposed solutions to
174
reduce the risk and co
175
176
177
178
179
180
181
182
183
184
185
d or even inconsistent and not broken down into subassemblies: No integrated 186
187
ed and considered as secondary. Partially justified requirements
n into subassemblies, justified and validated in a supportability file. or requirements not satisfied. 188
est means, etc.) are available and are consistent and validated . 189
190
191
or are handled by persons who are not reliability specialists. 192
y persons who are reliability specialists. 193
y persons who are reliability specialists. A procedure or plan imposes this review. 194
195
isation set up. 196
baseline. The planning describing tasks to be accomplished and the organisation set up is imprecise: i 197
baseline. There is planning describing tasks to be accomplished and the organisation set up but it has 198
rganisation set up; there is a good match with the company workload plan. 199
200
201
pment teams. 202
n monitoring, but it has not been validated and it is not traced. 203
tion to the product and its configuration) and is validated. 204
205
206
e rest of the file) and have not been validated. 207
208
209
210
211
212
213
214
215
216
d out and participated in producing the test recommendations.
er in which the tests are carried out, but with no guarantee about their 217
218
er in which the tests are carried out, and there is proof that the recommendations are applied. 219
220
221
d nor validated. 222
223
224
225
226
227
ty (and / or the manufacturing quality) criterion, this qualification is effective and is based on formal
an analysi 228
activities (interview with suppliers, a
229
230
231
232
233
ompetent technical services. 234
235
l relevance to the state-of-the-art) and not validated 236
237
238
239
240
(including built-in test devices) to reliability. 241
242
of built-in tests, and this procedure is traced. 243
244
245
246
247
248
249
250
251
252
253
254
255
256
he predefined
pose coverage
is to increase rate. However,
the predefined test no document
coverage. formally describes
Documents related actions.
describe the 257
pose is to increase the predefined test coverage. Documents describe the 258
operating entity. 259
260
261
report, but they are not formalised.
mity, 262
rective
265
266
mentioned criteria (there are possible minor nonconformities in the application or 267
268
270
ers at the stipulated frequency, but there is no formal documented monitoring 271
272
ers at the stipulated frequency. These parameters are monitored and derived from a critical analysis of the 273
274
mbly. This criticality plan was generated and then validated (parameters monitored and implemented) by an independent authority.
275
or a subassembly. 276
rective maintenance plan was not set up. 277
corrective maintenance procedure is applied for them but it has not been validated by an authority indep 278
corrective maintenance procedure is applied for them and has been validated by an authority independen 279
280
281
ugh there no formal preventive maintenance plan is set up. 282
al preventive maintenance plan for them but it has not been validated by an authority independent from t 283
al preventive maintenance plan for them and it has been validated by an authority independent from the 284
285
are brief and do not necessarily take account of all software loading rules. 286
287
ument has been produced verifying all points (and way this was done). 288
n document has been produced verifying all points (and way this was done).
d was validated by an authority independent from the operating entity. 289
290
291
l product test, but it is not formally defined. 292
this audit follows an identified formal definition, although it has not been validated by an authority inde 293
this audit follows an identified formal definition, This audit has been validated by an authority independ 294
295
296
297
uthority independent from the operating entity. 298
nt from the operating entity. 299
300
ns is/are done, but there is no formal definition of actions to be carried out to 301
302
rdance with an identified formal definition (document, inspection procedure, update procedure). 303
om the operating entity. 304
305
306
on, but this inspection is not based on any formal document describing the procedure. 307
on. This inspection is done according to a formalised procedure but this document has not been valida 308
on. This inspection is done according to a formalised procedure described in a document that has been 309
310
vities very similar to drying subassemblies but no specific training has been given 311
312
mal documents but not validated by an independent authority.
lar drying activities. This experience is proven in formal documents validated by 313
314
315
316
given to
ments the operator.
(workstation sheets, protocols, etc.). They are given to each operator 317
an authority independent from the operating entity.
ments (workstation sheets, protocols, etc.). They are given to each operator 318
320
321
d levels applied on the subassembly. These readings are carried out sporadically and there is no precise 322
according to a predefined formal definition (document indicating the protocol, frequency, etc.), but they 323
according to a predefined formal definition (document indicating the protocol, frequency, etc.), and th 324
325
ction means and the subassembly. 326
ubassembly, but they are not formally identified in a document. 327
has notbefore
erified been use
on a subassembly. 328
bly. All parameters to be verified are formalised in a document that has been validated by an authority independent
329 from the operating e
330
331
formal definition is made. 332
ment provided for this purpose that can then be used for preventive and corrective maintenance. Nevert 333
ment provided for this purpose and following a predefined formal format. The complete system and mor 334
335
336
manipulations and storage.
g is based on formal Thesethat
documents priorities
have notarebeen
not described
validated in
byformal documents.
an authority 337
338
g is based on formal documents that have been validated by an authority independent from the operatin 339
340
341
342
343
345
ted for authorisation. 346
ed in a document and a procedure must be produced to control its application. 347
ce
ed the
in arequired
documenteffect
andand that thesemust
a procedure changes have nottomodified
be produced theapplication.
control its product quality. 348
roduce the required effect and that these changes have not modified the product quality. 349
350
351
ments are sporadic and are not formalised in any way. 352
ments are made following an identified protocol and frequency. All these points to be respected are des 353
ments are made following an identified protocol and frequency. All these points to be respected are des 354
355
356
mal document . 357
efined
col thatprotocol formalised
was validated in aauthority
by an document.independent from the operating entity. 358
359
360
361
do not depend on a formal study or do not satisfy any formally expressed criteria. 362
level,and
d on a document giving their information level however, no independent
the protocol authority has validated this do
to be followed. 363
the operating entity . 364
365
366
ese inventories. issued until a new inventory has been validated. Documents formally
s systematically 367
368
s systematically issued until a new inventory has been validated. Documents formally define actions to 369
370
371
372
ed as protecting the subassemblies. 373
made on these procedures. 374
375
376
ally but without following a formal verification plan. 377
d. These verifications (frequency and procedures) are formalised in documents, but there is no validati 378
d. These verifications (frequency and procedures) are formalised in documents and they have been vali 379
380
381
otections may be specific to some subassemblies, but there are no formal documents for them. 382
documents as a function of types of subassembly.
subassembly, and these documents have 383
384
385
386
ocument or study to determine the effectiveness and the limits. 387
o determine the degree of effectiveness and the procedure. But these documents have not been validat 388
o determine the degree of effectiveness and the procedure. These documents have been validated by a 389
390
391
y. However, this inspection method is not described in a formal document. 392
e
y. of the inspection are formally described in documents 393
e of the inspection are formally described in validated documents. 394
395
396
al definition of them. 397
ormity check is formally described (parameters, special points, etc.) through a set of documents. How 398
ormity check is formally described (parameters, special points, etc.) through a set of documents. Th 399
400
401
d, but it is not formally described in a document. 402
eck is formalised and its efficiency for the process to be checked is known. 403
eck is formalised and its efficiency for the process to be checked is known. The complete system has b 404
405
406
available through
subassembly arevarious documents.
described However,
in a document these
formally documents
setting areprotocol
down the too dispersed
to be for the operator to b 407
ntsubassembly
from the operating entity. in a document formally setting down the protocol to be
are described 408
he operating entity. 409
410
411
412
these documents have not been validated by an authority independent from the operating entity. 413
these documents have been validated by an authority independent from the operating entity. 414
415
416
e test. These indicators are not subject to a formal plan and their processing is done later 417
erating entity. 418
e the way in which these indicators are processed. These documents have been validated by an authori 419
420
421
plied. 422
idated by an organisation independent from the operating entity.
plied. 423
nce plan has been validated by an organisation independent from the operating entity. 424
425
426
mation for the operator who would like to oven dry a subassembly. Nevertheless, no formal document i 427
they have not been validated by an authority independent from the operating entity. 428
documents have been validated by an authority independent from the operating entity. 429
430
en this value is reached. 431
indicating values beyond which a systematic stop is necessary. 432
formally identified in a document and stop procedures specific to each means. 433
formally identified in a document specific to each means. Furthermore, these documents and stop proce 434
435
436
scribes this method. 437
er varnishing of subassemblies. This plan is formally defined through specific documents. 438
er varnishing of subassemblies. This plan is formally defined through specific documents that have been 439
440
441
ever no document describes the procedure to be followed for this inspection. 442
r inspection is described in a correctly formalised procedure. However, these documents have not been 443
r inspection is described in a correctly formalised procedure. These documents have been validated by 444
445
446
nance.
down inThese points aremaintenance
a documented not exhaustive and there is no formal document for them.
plan. 447
448
down in a documented maintenance plan that has been validated by an authority independent from the o 449
450
451
sary waiting time between two transfer phases to avoid reducing reliability of the subassembly. However 452
omponents. However, this document has not been validated by an authority independent from the operat 453
omponents. Furthermore, this document has been validated by an authority independent from the operat 454
455
fically applicable to manipulation of components. 456
formally describes
he maintenance ofthe frequency
production of these
means. Therevisions,
frequency nor
of particular points and
these revisions that all
might change.
actions 457 of degradation du
aimed at reducing possibilities
458
he maintenance of production means. The frequency of these revisions and all actions aimed at reducing 459
460
461
462
463
been validated by an independent authority. 464
465
466
ally. However, these actions have not been formalised in any document. 467
ally according to needs. 468
and these documents have been validated by an authority independent from the operating entity. 469
470
471
nsidered to be critical, although no formal document is followed in carrying out these actions. 472
nsidered to be critical. The different actions to be carried out are described in a documented procedure 473
nsidered to be critical. The different actions to be carried out are described in a documented procedu 474
475
476
orkstation. However, the operator can implement the means with no assurance that he is familiar with it 477
it before implementing the means (visual warning when starting up the means, etc). 478
orkstation. This is formalised in a manner that obliges the operator to become familiar with it before i 479
480
software is provided, assuring that the software is conforming with the subassembly. 481
482
operation.
be used. An identifier of the version to be used is provided after the operation 483
484
485
486
nd compulsory application points for this maintenance. 487
a plan describing all compulsory application points and the frequency of the different actions. 488
a plan describing all compulsory application points and the frequency of the different actions. Furtherm 489
490
n to which he is posted. 491
ally previously received appropriate training. 492
k has actually previously received appropriate training. This verification follows a formal procedure for a 493
k has actually previously received appropriate training. This verification follows a formal procedure fo 494
495
496
pplied by means on subassemblies are respected. However, there is no study or formal document dealing 497
systems.
pplied by means on subassemblies are respected. 498
systems. The monitoring plan thus produced has been validated by an authority independent from the operating 499entity.
500
501
place correctly. However, this verification is not formally described. 502
place correctly. This verification is done in accordance with a procedure (from mentioning a simple visual 503
place correctly. This verification is done in accordance with a procedure (from mentioning a simple visu 504
505
506
e, etc.) took place correctly. However this verification is not formally described. 507
e, etc.) took place correctly. This verification is done in accordance with a procedure enabling traceability
traceabi (for example
508 barcode reading
authority independent from the operating entity. 509
510
511
512
d by examination of the required documentation. 513
y examination of the required documentation and by inspection and audit of the purchase source. 514
515
516
n is not formally described. 517
a documented procedure indicating the procedure to be followed (barcode reading of an identifier, etc.).
etc. 518
ating entity. 519
520
521
rifications have been done with regard to possible changes (new technologies, etc.) 522
ing a verification and the procedure to be implemented. 523
ing a verification and the procedure to be implemented. This entire document has been validated by an 524
525
526
527
528
529
530
531
he predefined coverage rate. However, no document formally describes related actions. 532
pose is to increase the predefined test coverage. Documents describe the procedure to be adopted. 533
pose is to increase the predefined test coverage. Documents describe the procedure to be adopted. Th 534
535
536
mity, 537
rective
540
541
542
545
546
547
g. no configuration
n follower follower records
sheet containing sheet containing records
of operations of operations
carried carried out
out and anomalies and anomalies observed).
observed). 548
549
nding on their availability. 550
ut is not defined. 551
552
cific inspection of the packaging. 553
554
555
556
ted to the stored products. 557
558
ge conditions are regularly optimised 559
560
561
s not check that accompanying documents are present. 562
sse.
check that accompanying documents are present, but does not protect them against loss and deterior 563
ed at the time of the order, and that the documentation is protected against loss and deterioration. 564
565
566
written procedures or quality plan. 567
rocedures or a quality plan. These inspections and test are not always complete. 568
rocedures or a quality plan. These inspections and tests are complete. 569
570
571
es or in a quality plan. 572
nctorily
a quality plan. Application of these inspections and tests is not verified and validated.
accomplished 573
hat records the configuration, operations carried out and observed anomalies) and accepted. 574
575
576
actions is described. 577
d/or written
e taken intoprocedures. There is no
account to determine monitoring
the of and
importance products allowed
nature to enter to
of inspections without inspections
be carried out on in case
reception. 578
cy, it is identified and this release is recorded. 579
580
or a subassembly. 581
rective maintenance plan was not set up. 582
corrective maintenance procedure is applied for them but it has not been validated by an authority indep 583
corrective maintenance procedure is applied for them and has been validated by an authority independen 584
585
586
al preventive maintenance plan for them but it has not been validated by an 587
588
al preventive maintenance plan for them and it has been validated by an authority independent from the 589
590
are brief and do not necessarily take account of all software loading rules. 591
592
ument
n has been
document produced
has been verifying
produced all points
verifying (and way
all points (andthis
waywas
thisdone).
was done). 593
d was validated by an authority independent from the operating entity. 594
595
596
l product test, but it is not formally defined. 597
this audit follows an identified formal definition, although it has not been validated by an authority inde 598
this audit follows an identified formal definition, This audit has been validated by an authority independ 599
600
601
602
nt from the operating entity. 604
605
606
ns is/are done, but there is no formal definition of actions to be carried out to guarantee this maintenan 607
rdance with an identified formal definition (document, inspection procedure, update procedure). 608
rdance with an identified formal definition (document, inspection procedure, update procedure). All docu 609
610
611
on, its purpose is not to make a decision about whether or not to use the nonconforming equipment. 612
nforming products
the use of is not materials
and/or nonconforming products. 613
614
615
methods and acceptance criteria. 616
617
618
e training and qualification of operators. 619
620
621
tion on supplies. 622
cations, drawings, requirements in terms of process, inspection instructions and other relevant technical 623
624
625
626
627
ments (workstation sheets, protocols, etc.). They are given to each operator responsible for carrying o 628
ments (workstation sheets, protocols, etc.). They are given to each operator responsible for carrying o 629
630
ction means and the subassembly. 631
ubassembly, but they are not formally identified in a document. 632
verified
erified before use on a subassembly. These are formally identified in a document that has not been vali 633
634 from the operating e
bly. All parameters to be verified are formalised in a document that has been validated by an authority independent
635
636
formal definition is made. 637
ment provided for this purpose that can then be used for preventive and corrective maintenance. Nevert 638
ment provided for this purpose and following a predefined formal format. The complete system and mor 639
640
thing formal. 641
of the purchased product. 642

cribed.
ed. Proofs that these procedures have been evaluated exist. 644
645
646
ut with no written procedures. 647
s, but they do not allow for product modifications or acceptance without modification. 648
t is submitted to the customer. The repaired and/or reworked product is once again inspected in accordance with649
the requirements in th
650
651
manipulations and storage. These priorities are not described in formal documents. 652
g is based on formal documents that have not been validated by an authority independent from the oper 653
g is based on formal documents that have been validated by an authority independent from the operatin 654
655
656
657
658
660
661
ersonnel associated with these processes are not defined 662
sonnel, are specified. 663
sonnel, are specified. Documents identifying these requirements are regularly updated. 664
665
666
667
668
669
670
671
ontains the reference to specifications of equipment to be tested, references of equipment to be tested, t 672
the test itself, and also all results with a list of anomalies remaining at the end of the test. 673
eans, and the definition of test means. 674
675
special documentation. 676
effectively updated, there is no analysis about the validity of documents. 677
y in a planned manner, the validity of the documents used is analysed. not analysed. 678
679
680
st equipment is compatible with needs. 681
ompatible with needs. There is no check to assure that they are used. 682
urement uncertainty is known and is compatible with the required measurement aptitude. There
they are put into service to demonstrate that they are capable of checking if the product is acceptable. is no verific 683
al procedure (Validation period and definition of the class of equipment in the test procedure), the class is defined in advance.
684
685
686
d damage it,it. it is also protected against manipulations that would invalidate calibration settings. 687
ocedures.
d damage it, it is also protected against manipulations that would invalidate calibration settings. 688
dures. 689
690
691
692
693
694
695
ed in a document and a procedure must be produced to control its application. 697
ce
ed the
in arequired
document effect
andand that thesemust
a procedure changes have nottomodified
be produced theapplication.
control its product quality. 698
roduce the required effect and that these changes have not modified the product quality. 699
700
n during manipulation. 701
702
d to prevent any deterioration during manipulations. There is no verification about their application. 703
ent any deterioration to the product during manipulations. It is verified that these methods are applied. 704
705
706
all formalised. 707
periodicand
es identify actions inspections
periodic to be carriedtoout.
inspections be carried out. 708
709
710
execution of these operations is not perfectly
e procedures that can be adapted to all products. controlled. 711
712
e procedures specific to each product. 713
ss of products are also coded and applied. 714
715
716
onnel, procedures and software) are evaluated. These processes are not documented, or not defined by
stifying this modification and guaranteeing that it does not introduce any harmful effect on the result of the process. 717
defined conditions. 718
nditions.
are kept up to date. 719
720
721
rified occasionally following a proven failure (see ISO 14000). 722
ntrolled and verified periodically to make sure that their effect on the process is constant. 723
ntrolled and verified continuously to make sure that their effect on the process is constant. 724
725
726
mal document . 727
efined
col thatprotocol formalised
was validated in aauthority
by an document.
independent from the operating entity. 728
729
730
731
732
ed as protecting the subassemblies. 733
made on these procedures. 734
735
736
ally but without following a formal verification plan. 737
d. These verifications (frequency and procedures) are formalised in documents, but there is no validati 738
739
740
741
ocument or study to determine the effectiveness and the limits. 742
o determine the degree of effectiveness and the procedure. But these documents have not been validat 743
o determine the degree of effectiveness and the procedure. These documents have been validated by a 744
745
746
747
these documents have not been validated by an authority independent from the operating entity. 748
these documents have been validated by an authority independent from the operating entity. 749
750
751
e test. These indicators are not subject to a formal plan and their processing is done later 752
erating entity. 753
e the way in which these indicators are processed. These documents have been validated by an authori 754
755
756
ntify the source of the inspection (persons, machine). 757
ythorised
the source of the
the product. (persons, machine). 758
he acceptance plan. 759
760
761
762
e done. It proposes inspection result record documents. 763
uments, documents associated with specific inspection instruments for their design, production, validation, management,
764 use and main
765
766
forming product
conformity and the cause of the nonconformity. 767
rmity, reworking
conformity or cause
and the repairsofif the
necessary and checking of characteristics affected by the reworking or repairs.
nonconformity. 768
s if necessary and checking of characteristics affected by the reworking or repairs. 769
770
771
nance. These points are not exhaustive and there is no formal document for them. 772
down in a documented maintenance plan.
773
down in a documented maintenance plan that has been validated by an authority independent from the o 774
775
776
orkstation. However, the operator can implement the means with no assurance that he is familiar with it 777
orkstation. This is formalised in a manner that obliges the operator to be familiar with it before imple 778
orkstation. This is formalised in a manner that obliges the operator to become familiar with it before i 779
780
software is provided, assuring that the software is conforming with the subassembly. 781
782
be used. An identifier of the version to be used is provided after the operation. 783
784
785
786
nd compulsory application points for this maintenance. 787
a plan describing all compulsory application points and the frequency of the different actions. 788
a plan describing all compulsory application points and the frequency of the different actions. Furtherm 789
790
n to which he is posted. 791
ally previously received appropriate training. 792
k has actually previously received appropriate training. This verification follows a formal procedure for a 793
k has actually previously received appropriate training. This verification follows a formal procedure fo 794
795
796
797
d by examination of the required documentation. 798
examination of the required documentation and by inspection and audit of the purchase source. 799
800
801
802
803
804
805
806
mity, 807
rective
810
811
812
815
816
817
g. no configuration
carried carried out
observed). 818
819
822
823
824
825
826
828
830
831
s not check that accompanying documents are present. 832
sse.
check that accompanying documents are present, but does not protect them against loss and deterior 833
ed at the time of the order, and that the documentation is protected against loss and deterioration. 834
835
836
840
841
nctorily
accomplished 843
845
846
actions is described. 847
d/or written
e taken intoprocedures. There is no
account to determine monitoring
the of and
importance products allowed
nature to enter to
of inspections without inspections
be carried out on in case
reception. 848
cy, it is identified and this release is recorded. 849
850
851
on,
overitsthe
purpose
use of is not to make a components
nonconforming decision about whetherproducts.
in finished or not to use the nonconforming equipment. 852
nforming
the use ofproducts is not materials
and/or nonconforming products. 853
854
855
856
857
859
860
861
864
865
866

cribed.
870
871
ut with no written procedures. 872
s, but they do not allow for product modifications or acceptance without modification. 873
t is submitted to the customer. The repaired and/or reworked product is once again inspected in accordance with874
the requirements in th
875
876
880
881
882
883
884
885
886
ontains the reference to specifications of equipment to be tested, references of equipment to be tested, t 887
the test itself, and also all results with a list of anomalies remaining at the end of the test. 888
eans, and the definition of test means. 889
890
891
892
893
894
895
urement uncertainty is known and is compatible with the required measurement aptitude. There
they are put into service to demonstrate that they are capable of checking if the product is acceptable.is no verific 898
al procedure (Validation period and definition of the class of equipment in the test procedure), the class is defined 899
in advance.
900
901
d damage it,it. it is also protected against manipulations that would invalidate calibration settings. 902
ocedures.
dures. 904
905
906
907
908
909
910
ce the required effect and that these changes have not modified the product 912
913
914
915
917
920
921
all formalised. 922
periodicand
924
925
927
930
931
onnel, procedures and software) are evaluated. These processes are not documented, or not defined by 932
stifying this modification and guaranteeing that it does not introduce any harmful effect on the result of the process.
defined conditions.
nditions. 933
935
936
940
941
942
943
944
945
946
947
948
949
950
951
952
953
954
955
956
ntify the source of the inspection (persons, machine). 957
ythorised
the source of the inspection
release of the product. (persons, machine). 958
he acceptance plan. 959
960
961
962
964
uments, documents associated with specific inspection instruments for their design, production, validation, management, use and main
965
966
forming product
rmity, reworking or repairs if necessary and
conformity and the cause of the nonconformity. checking of characteristics affected by the reworking or repairs. 968
970
971
972
973
974
975
976
977
978
979
980
981
982
983
984
985
986
987
988
989
990
991
mity, 992
rective
995
996
997
1000
1001
1002
g. no configuration
carried carried out
observed). 1003
1004
1007
1008
1009
1010
1011
1013
1015
1016
1020
1021
nctorily
accomplished 1023
1025
1026
manufacturing, assembly, inspection processes, etc. 1027
1028
1029
1030
1031
on,
overitsthe
purpose
use of is not to make a components
nonconforming decision about whetherproducts.
in finished or not to use the nonconforming equipment. 1032
nforming products is not formalised.
the use of replacement materials and/or nonconforming products. 1033
1034
1035
1036
1037
1039
1040
1041
1044
1045
1046

cribed.
1050
1051
human resources are not taken into account. 1052
rocesses, but these procedures are not updated. 1053
1054
1055
1056
1060
1061
1062
1063
1064
1065
1066
1067
1068
1069
1070
1071
1072
1073
1074
1075
urement
put into service and is compatible
to demonstrate with
that they arethe required
capable measurement
of checking if the aptitude.
product isThere is no verific
acceptable. 1078
al procedure (Validation period and definition of the class of equipment in the test procedure), the class is defined 1079
in advance.
1080
1081
it. it is also protected against manipulations that would invalidate calibration settings.
d damage it, 1082
ocedures.
dures. 1084
1085
1086
1087
1088
1089
1090
1092
ce the required effect and that these changes have not modified the product
1093
1094
1095
1097
1100
1101
all formalised. 1102
periodicand
1104
1105
1107
1110
1111
onnel, procedures and software) are evaluated. These processes are not documented, or not defined by
stifying this modification and guaranteeing that it does not introduce any harmful effect on the result of the process.1112
defined conditions.
nditions. 1113
1115
1116
1120
1121
1122
1123
1124
1125
1126
1127
uments, documents associated with specific inspection instruments for their design, production, validation, management,1129 use and main
1130
1131
forming product
rmity, reworking or repairs if necessary and
conformity and the cause of the nonconformity. checking of characteristics affected by the reworking or repairs. 1133
1135
1136
1137
1138
1139
1140
1141
of personnel. 1142
o equipment caused by unsuitable infrastructures (for example electrostatic discharges), personnel have been1143 trained in their use.
ess FMECA). 1144
1145
s are performed. 1146
es documents
ediction related
methods), the to Reliabilitybaseline
company's engineering.
includes documents related to Reliability engineering. 1147
d regularly (further training of personnel, presentations in reliability 1148
1149
1150
1151
1152
, action plans aimed to improve the reliability have been set up, and the 1153
1154
1155
1156
1157
1158
1159
1160
1161
1162
ample
mple ISO 9000 V2000. 1163
fine progress actions. 1164
1165
1166
according to the meaning in the recommendation) in the project, no document certifies this participation 1167
ding to the meaning in the recommendation) in the project, but this participation is not formalised in a p 1168
1169
1170
1171
onsible
ity (e.g.for reliability personnel
production studies have been trained.
informed about non-degradation of products). 1172
1173
1174
1175
1176
1177
1178
means are described in a job management plan. 1179
1180
1181
1182
1183
1184
1185
1186
1187
1188
in a formal document. Identified risks are described in risk sheets that are regularly updated. 1189
1190
1191
1192
1193
1194
1195
1196
1197
1198
hes used by the company is controlled (accreditation, certification, etc.); APMs are tied to national stan 1199
1200
1201
edback from operations relates to a reliability evaluation. 1202
, allocation of the cause of failures, record of the real product usage profile. Role to observe feedback f 1203
, allocation of the cause of failures, record of the real product usage profile. These measurements are 1204
1205
1206
ointment is available. 1207
perience in the reliability field. 1208
ed and has the required experience in the field. He makes regular reports on progress with studies in me 1209
1210
cts of the subcontracted product are systematically discussed, and no meetings have taken place. 1211
ce in which reliability aspects were dealt with. 1212
pects are dealt with. These are held sporadically. 1213
pects are dealt with, these take place in accordance with the plan / their planning. 1214
1215
1216
1217
1218
1219
1220
1221
1222
se requirements has been demonstrated. 1223
1224
1225
1226
1227
1228
e done completely and records of these actions are produced 1229
1230
1231
1232
1233
onisation between execution of the project and reliability studies (milestones, stop points, etc.). 1234
1235
1236
e carried out so as to remedy observed defects. 1237
in the product reliability. 1238
e reliability of new products or product ranges. 1239
1240
1241
1242
1243
al interviews or investigations by questionnaires). These feedbacks are used and are the subject of act 1244
1245
1246
1247
ability (and/or manufacturing quality) criterion without further clarification. This is effective but is based 1248
ability (and/or manufacturing quality) criterion. This is effective and is based on detailed analyses (use 1249
1250
1251
1252
n the reliability (and or manufacturing quality) criterion. This is effective and is based on an analysis of d 1253
n the reliability (and or manufacturing quality) criterion. This is effective and is based on formal activities: ( 1254
1255
1256
ing meetings with the subcontractor. 1257
ractor has been asked to take, but it is not completely or satisfactorily controlled. 1258
ractor has been asked to take and there is proof demonstrating that this monitoring is effective. 1259
1260
1261
1262
1263
ogress objectives are defined, and an evaluation about whether or not these objectives are achieved is 1264
1265
1266
the requirements of the recommendation. It is not fully applied to the project. 1267
the requirements of the recommendation. It is fully applied to the project. 1268
1269
1270
1271
1272
1273
1274
1275
subcontractor. 1276
eliability to the subcontractor, but the subcontractor has not written any document guaranteeing that th 1277
gement plan or reliability plan), that repeats the original requirements of the prime contractor. The manufac 1278
gement plan or reliability plan), that repeats the original requirements of the prime contractor. The manufact 1279
1280
1281
1282
1283
1284
1285
1286
1287
1288
1289
1290
1291
1292
1293
1294
1295
1296
1297
1298
1299
1300
1301
1302
1303
1304
1305
1306
1307
1308
1309
1310
1311
1312
1313
1314
1315
1316
1317
1318
1319
1320
1321
1322
1323
1324
1325
1326
1327
1328
1329
1330
1331
1332
1333
1334
1335
1336
1337
1338
1339
1340
1341
1342
1343
1344
1345
1346
1347
1348
1349
1350
1351
1352
1353
1354
1355
1356
1357
1358
1359
1360
1361
1362
1363
1364
1365
Pi Process 0.80829072
8% Max
494.9 515.7 Comments
1
1
1
1
1
1
1
1
1
16% Max
1035.9 1035.9 Commentaire
1
1
1
1
1
1
1
1
20% Max
1096.2 1096.2 Commentaire
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
10% Max
968 1452 Commentaire
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
10% Max
750 1125 Commentaire
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
18% Max
719 1078.5 Commentaire
1
1
1
1
1
1
1
1
1
1
1
1
1
18% Max
420 630 Commentaire
1
1
1
1
1
1
Max
150 225 Commentaire
1
1
1
1
1
Justification
Justificatif
Justificatif
Justificatif
Justificatif
Justificatif
Justificatif
Justificatif
Specific Process
factor (leave
blank if not) Component Type
COTS Board
COTS Board
COTS Board
COTS Board
COTS Board
COTS Board
COTS Board
COTS Board
COTS Board
COTS Board
COTS Board
COTS Board
COTS Board
COTS Board
COTS Board
COTS Board
COTS Board
COTS Board
COTS Board
ALUMINIUM CAPACITOR [
ASIC [ECAS]
ASIC [ECAS]
ASIC [ECAS]
ASIC [ECAS]
ASIC [ECAS]
ASIC [ECAS]
ASIC [ECAS]
ASIC [ECAS]
ASIC [ECAS]
Ceramic capacitors [ECCC]













Connectors [ECCO]
Connectors [ECCO]
Connectors [ECCO]
Connectors [ECCO]
Connectors [ECCO]
Connectors [ECCO]
Connectors [ECCO]
Connectors [ECCO]
Connectors [ECCO]
Connectors [ECCO]
Connectors [ECCO]
Connectors [ECCO]
Connectors [ECCO]
Connectors [ECCO]
Connectors [ECCO]
Connectors [ECCO]
Connectors [ECCO]
Connectors [ECCO]
Connectors [ECCO]
Connectors [ECCO]
Connectors [ECCO]
Connectors [ECCO]
Connectors [ECCO]
Connectors [ECCO]
Connectors [ECCO]
Connectors [ECCO]
Connectors [ECCO]
Connectors [ECCO]
Connectors [ECCO]
Connectors [ECCO]
Connectors [ECCO]
Connectors [ECCO]
Connectors [ECCO]
Connectors [ECCO]
Connectors [ECCO]
Connectors [ECCO]
Connectors [ECCO]
Connectors [ECCO]
Connectors [ECCO]
Connectors [ECCO]
Connectors [ECCO]
Connectors [ECCO]
Connectors [ECCO]
Connectors [ECCO]
Connectors [ECCO]
Connectors [ECCO]
Connectors [ECCO]
Connectors [ECCO]
Connectors [ECCO]
Connectors [ECCO]
Connectors [ECCO]
Connectors [ECCO]
Connectors [ECCO]
Connectors [ECCO]
Connectors [ECCO]
Connectors [ECCO]
Connectors [ECCO]
Connectors [ECCO]
Connectors [ECCO]
Connectors [ECCO]
Connectors [ECCO]
Connectors [ECCO]
Connectors [ECCO]
Connectors [ECCO]
Connectors [ECCO]
Connectors [ECCO]
Connectors [ECCO]
Connectors [ECCO]
Connectors [ECCO]
Connectors [ECCO]
Connectors [ECCO]
Connectors [ECCO]
Connectors [ECCO]
Connectors [ECCO]
Connectors [ECCO]
Connectors [ECCO]
Connectors [ECCO]
Connectors [ECCO]
Connectors [ECCO]
Connectors [ECCO]
Connectors [ECCO]
Connectors [ECCO]
Connectors [ECCO]
Connectors [ECCO]
Connectors [ECCO]
Connectors [ECCO]
Connectors [ECCO]
Connectors [ECCO]
Connectors [ECCO]
Connectors [ECCO]
Connectors [ECCO]
Connectors [ECCO]
Connectors [ECCO]
Connectors [ECCO]
Connectors [ECCO]
Connectors [ECCO]
Connectors [ECCO]
Connectors [ECCO]
Connectors [ECCO]
Connectors [ECCO]
Connectors [ECCO]
Connectors [ECCO]
Connectors [ECCO]
Connectors [ECCO]
Connectors [ECCO]
Connectors [ECCO]
Connectors [ECCO]
Connectors [ECCO]
Connectors [ECCO]
Connectors [ECCO]
Connectors [ECCO]
Connectors [ECCO]
Connectors [ECCO]
Connectors [ECCO]
Connectors [ECCO]
Connectors [ECCO]
Connectors [ECCO]
Connectors [ECCO]
Connectors [ECCO]
Connectors [ECCO]
Connectors [ECCO]
Connectors [ECCO]
Connectors [ECCO]
Connectors [ECCO]
Connectors [ECCO]
Connectors [ECCO]
Connectors [ECCO]
Connectors [ECCO]
Connectors [ECCO]
Connectors [ECCO]
Connectors [ECCO]
Connectors [ECCO]
Connectors [ECCO]
Connectors [ECCO]
Connectors [ECCO]
Connectors [ECCO]
Connectors [ECCO]
Connectors [ECCO]
Connectors [ECCO]
Connectors [ECCO]
Connectors [ECCO]
Connectors [ECCO]
Connectors [ECCO]
Connectors [ECCO]
Connectors [ECCO]
Connectors [ECCO]
Connectors [ECCO]
Connectors [ECCO]
Connectors [ECCO]
Connectors [ECCO]
Connectors [ECCO]
Connectors [ECCO]
Connectors [ECCO]
Connectors [ECCO]
Connectors [ECCO]
Discrete semiconductors [ECDS]


Electromechanical relays monostable [ECRL]







Fuses [ECFU]
Fuses [ECFU]
Fuses [ECFU]
Fuses [ECFU]
Fuses [ECFU]
Fuses [ECFU]
Fuses [ECFU]
Integrated Circuits [ECIC]









Light Emitting Diode (LED) [ECLE]

Magnetic Components: Inductors and Transformers [ECIN]




Optocouplers [ECOP]
Optocouplers [ECOP]
Optocouplers [ECOP]
Optocouplers [ECOP]
Piezoelectric components: Oscillators and Quartz [ECPZ]

Printed circuit board (PCB)



Resistors [ECRE]
Resistors [ECRE]
Resistors [ECRE]
Resistors [ECRE]
Resistors [ECRE]
Resistors [ECRE]
Resistors [ECRE]
Resistors [ECRE]
Resistors [ECRE]
Resistors [ECRE]
Resistors [ECRE]
Resistors [ECRE]
Resistors [ECRE]
Resistors [ECRE]
Resistors [ECRE]
Resistors [ECRE]
Resistors [ECRE]
Resistors [ECRE]
Resistors [ECRE]
Resistors [ECRE]
Resistors [ECRE]
Resistors [ECRE]
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Resistors [ECRE]
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Resistors [ECRE]
Resistors [ECRE]
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Resistors [ECRE]
Resistors [ECRE]
Resistors [ECRE]
Resistors [ECRE]
Resistors [ECRE]
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Resistors [ECRE]
Resistors [ECRE]
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Resistors [ECRE]
Resistors [ECRE]
Resistors [ECRE]
Resistors [ECRE]
Resistors [ECRE]
Resistors [ECRE]
Resistors [ECRE]
Resistors [ECRE]
Resistors [ECRE]
Resistors [ECRE]
Resistors [ECRE]
Resistors [ECRE]
Resistors [ECRE]
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Resistors [ECRE]
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Resistors [ECRE]
Resistors [ECRE]
Resistors [ECRE]
Resistors [ECRE]
Resistors [ECRE]
Resistors [ECRE]
Resistors [ECRE]
Resistors [ECRE]
Resistors [ECRE]
Resistors [ECRE]
Resistors [ECRE]
Resistors [ECRE]
Resistors [ECRE]
Resistors [ECRE]
Resistors [ECRE]
Resistors [ECRE]
Resistors [ECRE]
Resistors [ECRE]
Resistors [ECRE]
Resistors [ECRE]
Resistors [ECRE]
Resistors [ECRE]
Resistors [ECRE]
Resistors [ECRE]
Resistors [ECRE]
Resistors [ECRE]
Resistors [ECRE]
Resistors [ECRE]
Resistors [ECRE]
Resistors [ECRE]
Resistors [ECRE]
Resistors [ECRE]
Resistors [ECRE]
Resistors [ECRE]
Resistors [ECRE]
Resistors [ECRE]
Resistors [ECRE]
Resistors [ECRE]
Resistors [ECRE]
Resistors [ECRE]
Resistors [ECRE]
Resistors [ECRE]
Resistors [ECRE]
Resistors [ECRE]
Resistors [ECRE]
Resistors [ECRE]
Resistors [ECRE]
Resistors [ECRE]
Resistors [ECRE]
Resistors [ECRE]
Resistors [ECRE]
Resistors [ECRE]
Resistors [ECRE]
Resistors [ECRE]
Resistors [ECRE]
Resistors [ECRE]
Resistors [ECRE]
Resistors [ECRE]
Resistors [ECRE]
Resistors [ECRE]
Resistors [ECRE]
Resistors [ECRE]
Resistors [ECRE]
Resistors [ECRE]
Resistors [ECRE]
Resistors [ECRE]
Resistors [ECRE]
Resistors [ECRE]
Resistors [ECRE]
Resistors [ECRE]
Resistors [ECRE]
Resistors [ECRE]
Resistors [ECRE]
Resistors [ECRE]
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Resistors [ECRE]
Resistors [ECRE]
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Resistors [ECRE]
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Resistors [ECRE]
Resistors [ECRE]
Resistors [ECRE]
Resistors [ECRE]
Resistors [ECRE]
Resistors [ECRE]
Resistors [ECRE]
Resistors [ECRE]
Resistors [ECRE]
Resistors [ECRE]
Resistors [ECRE]
Resistors [ECRE]
Resistors [ECRE]
Resistors [ECRE]
Resistors [ECRE]
Resistors [ECRE]
Resistors [ECRE]
Resistors [ECRE]
Resistors [ECRE]
Resistors [ECRE]
Resistors [ECRE]
Resistors [ECRE]
Resistors [ECRE]
Resistors [ECRE]
Resistors [ECRE]
Resistors [ECRE]
Resistors [ECRE]
Resistors [ECRE]
Resistors [ECRE]
Resistors [ECRE]
Resistors [ECRE]
Resistors [ECRE]
Resistors [ECRE]
Resistors [ECRE]
Resistors [ECRE]
Resistors [ECRE]
Resistors [ECRE]
Resistors [ECRE]
Resistors [ECRE]
Resistors [ECRE]
Resistors [ECRE]
Resistors [ECRE]
Resistors [ECRE]
Resistors [ECRE]
Resistors [ECRE]
Resistors [ECRE]
Resistors [ECRE]
Resistors [ECRE]
Resistors [ECRE]
Resistors [ECRE]
Resistors [ECRE]
Resistors [ECRE]
Resistors [ECRE]
Resistors [ECRE]
Resistors [ECRE]
Resistors [ECRE]
Resistors [ECRE]
Resistors [ECRE]
Resistors [ECRE]
Resistors [ECRE]
Resistors [ECRE]
Switches [ECSW]
Switches [ECSW]
Switches [ECSW]
Switches [ECSW]
Switches [ECSW]
Switches [ECSW]
Switches [ECSW]
Switches [ECSW]
Switches [ECSW]
Switches [ECSW]
Switches [ECSW]
Switches [ECSW]
Switches [ECSW]
Switches [ECSW]
Switches [ECSW]
Switches [ECSW]
Switches [ECSW]
Switches [ECSW]
Switches [ECSW]
Switches [ECSW]
Switches [ECSW]
Switches [ECSW]
Switches [ECSW]
Switches [ECSW]
Switches [ECSW]
Switches [ECSW]
Switches [ECSW]
Switches [ECSW]
Switches [ECSW]
Switches [ECSW]
Switches [ECSW]
Switches [ECSW]
Switches [ECSW]
Switches [ECSW]
Switches [ECSW]
Switches [ECSW]
Switches [ECSW]
Switches [ECSW]
Switches [ECSW]
Switches [ECSW]
Switches [ECSW]
Switches [ECSW]
Switches [ECSW]
Switches [ECSW]
Switches [ECSW]
Switches [ECSW]
Switches [ECSW]
Switches [ECSW]
Switches [ECSW]
Switches [ECSW]
Switches [ECSW]
Tantalum capacitors [ECTC]
AC/DC and DC/DC voltage conv
Aluminium capacitor [FCAC
CRT screens [FCCR]
Ceramic capacitor [FCCC]
Connectors [FCCO]
Connectors [FCCO]
Connectors [FCCO]
Connectors [FCCO]
Connectors [FCCO]
Connectors [FCCO]
Discrete semiconductors [
Electromechanical relays monostable [FCRL]
Hard disk [FCHD]
Integrated Circuit & ASIC [
LCD screens [FCLC]
LCD screens [FCLC]
Magnetic Components: Inductors and Transformers [FCIN]
Magnetic Components: Inductors and Transformers [FCIN]
Optocouplers [FCOP]
Optocouplers [FCOP]
Optocouplers [FCOP]
Optocouplers [FCOP]
Optocouplers [FCOP]
Optocouplers [FCOP]
Piezoelectric components: Oscillators and Quartz [FCPZ]
Piezoelectric components: Oscillators and Quartz [FCPZ]
Resistors [FCRE]
Resistors [FCRE]
Resistors [FCRE]
Switches [FCSW]
Switches [FCSW]
Switches [FCSW]
Tantalum capacitor [FCTC]
AsGa Discrete Semiconductor
AsGa Integrated Circuit[HFAS]
Capacitor HFRF[HFHC]
Other [HFHO]
Other [HFHO]
Other [HFHO]
Other [HFHO]
RF HF Inductors [HFHI]
RF HF Resistors[HFHR]
Si Discrete Semiconductor[HF
Si, SiGe integrated circuit[HFSI
ASIC [HMAS]
ASIC [HMAS]
ASIC [HMAS]
ASIC [HMAS]
ASIC [HMAS]
ASIC [HMAS]
Bare chips
Bare chips
Bare chips
Bare chips
Bare chips
Bare chips
Bare chips
Bare chips
Case and substrate
Case and substrate
Case and substrate
Case and substrate
Case and substrate
Case and substrate
Case and substrate
Case and substrate
Case and substrate
Case and substrate
Case and substrate
Case and substrate
Case and substrate
Case and substrate
Case and substrate
Case and substrate
Case and substrate
Case and substrate
Case and substrate
Case and substrate
Ceramic capacitors
Ceramic capacitors
Ceramic capacitors
Ceramic capacitors
Ceramic capacitors
Ceramic capacitors
Ceramic capacitors
Ceramic capacitors
Ceramic capacitors
Connectors [HMCO]
Connectors [HMCO]
Connectors [HMCO]
Connectors [HMCO]
Connectors [HMCO]
Connectors [HMCO]
Connectors [HMCO]
Connectors [HMCO]
Connectors [HMCO]
Connectors [HMCO]
Connectors [HMCO]
Connectors [HMCO]
Connectors [HMCO]
Connectors [HMCO]
Connectors [HMCO]
Connectors [HMCO]
Connectors [HMCO]
Connectors [HMCO]
Connectors [HMCO]
Connectors [HMCO]
Deposited capacitor
Deposited capacitor
Deposited resistors
Deposited resistors
Deposited resistors
Deposited resistors
Deposited resistors
Deposited resistors
External Connection
External Connection
External Connection
External Connection
External Connection
External Connection
External Connection
External Connection
External Connection
External Connection
External Connection
External Connection
External Connection
External Connection
External Connection
External Connection
External Connection
External Connection
External Connection
External Connection
External Connection
External Connection
External Connection
External Connection
External Connection
External Connection
External Connection
External Connection
External Connection
External Connection
External Connection
External Connection
External Connection
External Connection
External Connection
External Connection
External Connection
External Connection
External Connection
External Connection
External Connection
External Connection
External Connection
External Connection
External Connection
External Connection
External Connection
External Connection
External Connection
External Connection
External Connection
External Connection
External Connection
External Connection
External Connection
External Connection
External Connection
External Connection
External Connection
External Connection
External Connection
External Connection
External Connection
External Connection
External Connection
External Connection
External Connection
External Connection
External Connection
External Connection
External Connection
External Connection
External Connection
External Connection
External Connection
External Connection
External Connection
External Connection
External Connection
External Connection
External Connection
External Connection
External Connection
External Connection
External Connection
External Connection
External Connection
External Connection
External Connection
External Connection
External Connection
External Connection
External Connection
External Connection
External Connection
External Connection
External Connection
External Connection
External Connection
External Connection
External Connection
External Connection
External Connection
External Connection
External Connection
External Connection
External Connection
External Connection
Fuses [HMFU]
Fuses [HMFU]
Light Emitting Diode (LED) [HMLE]
Light Emitting Diode (LED) [HMLE]
Lithium and nickel batteries
Magnetic components: Inductor

Monostable electromechanical r
1.0 Monostable electromechanical r
Multilayer inductors
Multilayer inductors
Optocouplers [HMOP]
Optocouplers [HMOP]
Other RF HF passive compone
Piezoelectric components: Osci
Piezoelectric components: Os
RF HF DS AsGa discrete semico
RF HF DS Si and SiGe discrete
RF HF IC AsGa integrated circu
RF HF IC Si, SiGe integrated cir
RF HF Inductors [HMHI]
RF HF Inductors [HMHI]
RF HF Resistors [HMHR]
RF HF Resistors [HMHR]
RF HF capacitors [HMHC]
Resistive chips (SMD)
Resistive chips (SMD)
Resistive networks
Resistive networks
Solid tantalum capacitor (SMD
Solid tantalum capacitor (SMD
Switches [HMSW]
Switches [HMSW]
Switches [HMSW]
Switches [HMSW]
Switches [HMSW]
Switches [HMSW]
Switches [HMSW]
Switches [HMSW]
Switches [HMSW]
Switches [HMSW]
Switches [HMSW]
Switches [HMSW]
Switches [HMSW]
Switches [HMSW]
Switches [HMSW]
Switches [HMSW]
Switches [HMSW]
Switches [HMSW]
Switches [HMSW]
Switches [HMSW]
Switches [HMSW]
Switches [HMSW]
Switches [HMSW]
Switches [HMSW]
Switches [HMSW]
Switches [HMSW]
Switches [HMSW]
Switches [HMSW]
Switches [HMSW]
Switches [HMSW]
Switches [HMSW]
Switches [HMSW]
Switches [HMSW]
Switches [HMSW]
Switches [HMSW]
Switches [HMSW]
Switches [HMSW]
Switches [HMSW]
Switches [HMSW]
Switches [HMSW]
Switches [HMSW]
Switches [HMSW]
Switches [HMSW]
Switches [HMSW]
Switches [HMSW]
Switches [HMSW]
Switches [HMSW]
Switches [HMSW]
Wiring
Wiring
Wiring
Wiring
Wiring
Wiring
Wiring
Wiring
Wiring
Wiring
micro-cases
micro-cases
micro-cases
micro-cases
micro-cases
Aluminium capacitor [PCAC
CRT screens [PCCR]
CRT screens [PCCR]
Ceramic capacitor [PCCC]
Ceramic capacitor [PCCC]
Connectors [PCCO]
Connectors [PCCO]
Connectors [PCCO]
Connectors [PCCO]
Connectors [PCCO]
Connectors [PCCO]
Connectors [PCCO]
Connectors [PCCO]
Connectors [PCCO]
Connectors [PCCO]
Connectors [PCCO]
Connectors [PCCO]
Electromechanical relays monostable [PCRL]
Hard disk [PCHD]
Hard disk [PCHD]
LCD screens [PCLC]
LCD screens [PCLC]
LCD screens [PCLC]
LCD screens [PCLC]
Magnetic Components: Inductors and Transformers [PCIN]
Optocouplers [PCOP]
Optocouplers [PCOP]
Optocouplers [PCOP]
Optocouplers [PCOP]
Optocouplers [PCOP]
Optocouplers [PCOP]
Optocouplers [PCOP]
Optocouplers [PCOP]
Optocouplers [PCOP]
Optocouplers [PCOP]
Optocouplers [PCOP]
Optocouplers [PCOP]
Piezoelectric components: Oscillators and Quartz [PCPZ]
Resistors [PCRE]
Resistors [PCRE]
Resistors [PCRE]
Resistors [PCRE]
Resistors [PCRE]
Switches [PCSW]
Switches [PCSW]
Switches [PCSW]
Switches [PCSW]
Switches [PCSW]
Switches [PCSW]
Tantalum capacitor [PCTC]
Tantalum capacitor [PCTC]
CRT screens [VSCR]
CRT screens [VSCR]
Fans [VSFA]
Hard disks [VSHD]
Hard disks [VSHD]
Hard disks [VSHD]
Hard disks [VSHD]
Hard disks [VSHD]
Hard disks [VSHD]
Hard disks [VSHD]
Hard disks [VSHD]
Hard disks [VSHD]
Hard disks [VSHD]
Hard disks [VSHD]
Hard disks [VSHD]
Hard disks [VSHD]
Hard disks [VSHD]
Hard disks [VSHD]
Hard disks [VSHD]
Hard disks [VSHD]
Hard disks [VSHD]
Keyboard boards [VSKO]
Keyboards [VSKB]
Keyboards [VSKB]
Keyboards [VSKB]
Keyboards [VSKB]
Keyboards [VSKB]
LCD screens [VSLC]
LCD screens [VSLC]
LCD screens [VSLC]
LCD screens [VSLC]
LCD screens [VSLC]
LCD screens [VSLC]
LCD screens [VSLC]
LCD screens [VSLC]
TantalumÊcapacitors [ECT
Varistor
FMC firmware
Reliability models Individual FIT
Zero FIT (KM3NET_DS) 0.0

Not used (KM3NET_DS) 0.0
Central digital functions/CPU function:CPU1 (KM3NET_DS) 20.7
Central digital functions/Chipset function (Northbridge, South 11.3
Central digital functions/DRAM memoy function (DDR-SDRA 43.2
Central digital functions/FLASH memory Boot function (NOR): 63.9
Central digital functions/FLASH memory Storage function (NA 71.4
Central digital functions/L2, L3 cache or SRAM function:SRA 29.2
Central digital functions/SCSI controller function:SCSI1 (KM3N 30.0
Common functions all boards/Common functions:Commun (KM 63.4
Input output lines/Analog or discrete line:Analogue (KM3NET_D 12.3
Input output lines/Input / output isolation or switching by the 16.9

Input output lines/Input output isolation by optocoupling:Opto 4.6
Input output lines/Parallel bus digital line:Parallel (KM3NET_DS) 6.5
Input output lines/Serial bus line:SerialBus (KM3NET_DS) 27.6
Input output lines/Serial peripheral line:SerialPerip (KM3NET_DS 18.4
Peripheral digital functions/Analogue/digital or digital/analogu 23.9
Peripheral digital functions/Ethernet control function (LAN) 28.7
Peripheral digital functions/Fieldbus control function (CAN, AR 28.7
Peripheral digital functions/Graphic control function (VGA) 57.4
Peripheral digital functions/Wireless control function (Bluetooth 26.3
BPS: BFC233920225 2.2UF (C20,C21) (KM3NET_DS) 1.1
BPS: BFC233920334 330nF (C22,C23) (KM3NET_DS) 1.1
Capa alu1 (KM3NET_DS) 0.3
Capa alu2 (KM3NET_DS) 0.4
ASIC1 (KM3NET_DS) 0.5
Base : Coco_V2 (KM3NET_DS) 1.9
Base : PMT (KM3NET_DS) 1.8
Base : PROMIS_V2 (KM3NET_DS) 1.9
BPS: 08051C103K4Z2A 10nF (C66, C71, C76) (KM3NET_DS) 0.0
BPS: 08052U180GAT2A 18pF (C9,C10) (KM3NET_DS) 0.0
BPS: 08055C474KAZ2A 470nF (C67,C68,C72,C73,C77,C78) 0.2
BPS: 0805ZD475KAT2A 4.7UF (C17,C30,C39,C48) (KM3NET_ 0.2
BPS: 12066D226KAT2A 22UF (C27, C36, C40, C49) (KM3NET 0.7
BPS: 1210ZD226KAT2A 22UF (C25, C34, C44, C53) (KM3NET 21.3
BPS: C0805C473J3GACTU 47nF (C14,C29,C38,C46) (KM3NE 0.0
BPS: C1210C107M9PACTU 100UF (C18,C31,C41,C51) (KM3N 0.7
BPS: C1608C0G1H101J080AA 100pF (C26) (KM3NET_DS) 0.0
BPS: C1608C0G1H181J 180pF (C47) (KM3NET_DS) 0.0
BPS: C1608C0G1H221J 220pF (C35, C45) (KM3NET_DS) 0.0
BPS: C2012X7S2A224K085AE 220nF (C16) (KM3NET_DS) 3.1
BPS: DEBB33A472KA3B 4,7nF (CA1,CA2,CA3,CA4) (KM3NET 1.8
BPS: DEBB33F102KA3B 1nF (C28, C57, C60) (KM3NET_DS) 0.1
BPS: DEBB33F102KA3B 1nF (C59) (KM3NET_DS) 0.0
BPS: DEBE33A103ZA3B 10nF (C58) (KM3NET_DS)
2,C37,C42,C50,C56,C62,C63,C64,C65, 6.0
C69,C70,C75) (KM3NET_DS) 0.0
BPS: H222K33X7RL63J5R 2.2nF (C15) (KM3NET_DS) 0.0
BPS: RDED72W474K5B1C13B 470nF (C12) (KM3NET_DS) 0.0
Base : 0402 NP0 10pF(C41 CAPC1005X55N) (KM3NET_DS) 0.0
Base : 0402 X5R 100nF(C36,C43 CAPC1005X55N) (KM3NET_ 2.7
Base : 0603 NP0 220pF(C38 CAPC1608X87N) (KM3NET_DS) 0.0
Base : 0603 X5R 10uF(C29,C30,C33,C39 CAPC1608X90N) ( 20.0
Base : 0603 X5R 1uF(C34 CAPC1608X90N) (KM3NET_DS) 0.9
Base : 0603 X7R 100nF(C14,C32,C37 CAPC1608X87N) (KM3 0.0
Base : 0805 X7R 22nF 200V(C1,C2,C3,C4,C5,C6,C7,C8 CAPC 4.3
Base : 0805 X7R 47nF 200V(C10,C12,C16,C28 CAPC2012X145 32.4
Base : 1206 X7R 100nF 200V(C20,C21,C22,C23,C24,C25,C26 32.4
CAPA_CER_HCV_0,1_Typ2_IP (KM3NET_DS) 0.2
CAPA_CER_HCV_0,1_Typ2_NID (KM3NET_DS) 0.1
CAPA_CER_HCV_0,1_Typ2_NIP (KM3NET_DS) 0.1

CAPA_CER_HCV_1_Typ2_IP (KM3NET_DS) 170.7
CAPA_CER_HCV_1_Typ2_NIP (KM3NET_DS) 113.2
CAPA_CER_LCV_0,1_Typ2_ID (KM3NET_DS) 0.0
CAPA_CER_LCV_0,1_Typ2_ILV (KM3NET_DS) 0.0
CAPA_CER_LCV_0,1_Typ2_IP (KM3NET_DS) 0.0
CAPA_CER_LCV_0,1_Typ2_NID (KM3NET_DS) 0.0
CAPA_CER_LCV_0,1_Typ2_NILV (KM3NET_DS) 0.0
CAPA_CER_LCV_0,1_Typ2_NIP (KM3NET_DS) 0.0

CAPA_CER_LCV_1_Typ2_ID (KM3NET_DS) 12.0
CAPA_CER_LCV_1_Typ2_ILV (KM3NET_DS) 14.7
CAPA_CER_LCV_1_Typ2_IP (KM3NET_DS) 18.1
CAPA_CER_LCV_1_Typ2_NID (KM3NET_DS) 7.8
CAPA_CER_LCV_1_Typ2_NILV (KM3NET_DS) 9.9
CAPA_CER_LCV_1_Typ2_NIP (KM3NET_DS) 12.0
CAPA_CER_MCV_0,1_Typ2_ID (KM3NET_DS) 0.0
CAPA_CER_MCV_0,1_Typ2_ILV (KM3NET_DS) 0.0
CAPA_CER_MCV_0,1_Typ2_IP (KM3NET_DS) 0.0
CAPA_CER_MCV_0,1_Typ2_NID (KM3NET_DS) 0.0
CAPA_CER_MCV_0,1_Typ2_NILV (KM3NET_DS) 0.0

CAPA_CER_MCV_0,1_Typ2_NIP (KM3NET_DS) 0.0



CAPA_CER_MCV_1_Typ2_ID (KM3NET_DS) 22.5
CAPA_CER_MCV_1_Typ2_ILV (KM3NET_DS) 27.6
CAPA_CER_MCV_1_Typ2_IP (KM3NET_DS) 33.9
CAPA_CER_MCV_1_Typ2_NID (KM3NET_DS) 18.6
CAPA_CER_MCV_1_Typ2_NILV (KM3NET_DS) 18.6
CAPA_CER_MCV_1_Typ2_NIP (KM3NET_DS) 22.5
CLBV2: 100 nf Murata GRM188R61E105KA12D - 0603 - 50 Vo 0.0
CLBV2: 22 µF Murata GRM31CR61E226KE15L - 1206 - 35 Vo 4.6
CLBV2: 22nf GCM188R71H223KA37D - 0603 - 50Volts (KM3N 0.0
CLBV2: 100 pf C0603C101J5GACTU - 0603 - 50 Volts (KM3NE 0.0
CLBV2: 100nf ref GCC0603KRX7R9BB104 - 50V - Tageo/Phy 0.1
CLBV2: 10nf CX0603MRX7R9BB103 / U0603R103KCT/ C0603X1 0.0
CLBV2: 10µF CL10A106MP8NNNC - 0603 - 10 Volts (KM3NET 4.1
CLBV2: 1µF MCCA000531 / C0603C105K3PAC7867 -0603 - 25 0.1
CLBV2: 1µF MURATA GRM188R61E105KA12D -0603 - 25Volt 0.9
CLBV2: 4,7µF TDK C1005X5R0J475M - 0402 - 10 Volts (KM3N 0.7
CLBV2: GRM31CR61A476ME15L MURATA 47µF (VCCAUX) - 12 1.0
Capa cera1 (KM3NET_DS) 0.2
FMC: MC0603N101J500CT(C1,C2) (KM3NET_DS) 0.0
FMC: MC1206B106K160CT(C4)
C25,C26,C27,C28,C29,C30, (KM3NET_DS) 16.3
C31,C32,C33,C34,C35,C36,C37) REFDES TO BE UPDATED (KM3NET_DS)
0.0
OCTOPUS LARGE: MLCC 0402 NP0 100pF (C16,C17,C18,C43 0.0
OCTOPUS LARGE: MLCC 0402 X7R 100nF (C1_0,C1_1,C1_2,C1 0.2
OCTOPUS LARGE: MLCC 0402 X7R 1nF (C26,C27,C30,C31,C3 0.0
OCTOPUS LARGE: MLCC 0402 X7R 1nF (C28,C33) (KM3NET 0.0
OCTOPUS LARGE: MLCC 0402 X7R 22nF (C1-C10,C19-C25,C 0.2

OCTOPUS LARGE: MLCC 0402 X7R 22nF (C11-C13) (KM3NE 0.0
OCTOPUS LARGE: MLCC 1210 X5R 47uF 10V (C14) (KM3NET 1.6
OCTOPUS LARGE: MLCC 1210 X5R 47uF 10V (C15) (KM3NET 0.3
OCTOPUS SMALL: MLCC 0402 NP0 100pF (C16,C17,C18,C43 0.0
OCTOPUS SMALL: MLCC 0402 X7R 100nF (C1_0,C1_1,C1_2,C1 0.2
OCTOPUS SMALL: MLCC 0402 X7R 1nF (C26,C27,C30,C31,C3 0.0
OCTOPUS SMALL: MLCC 0402 X7R 1nF (C28,C33) (KM3NET_ 0.0
OCTOPUS SMALL: MLCC 0402 X7R 22nF (C1-C10,C19-C25,C 0.2
OCTOPUS SMALL: MLCC 0402 X7R 22nF (C11-C13) (KM3NET 0.0
OCTOPUS SMALL: MLCC 1210 X5R 47uF 10V (C14) (KM3NET 1.6
OCTOPUS SMALL: MLCC 1210 X5R 47uF 10V (C15) (KM3NET 0.3
OM12V_NIKHEF : 06035C473KAT2A C7,C11 (KM3NET_DS) 0.3
OM12V_NIKHEF : 0603ZD105KAT2A MLCC 0603 X7R 1uF C28 2.8
OM12V_NIKHEF : 1812AC153KAT1A CAP1812_15n_1000V C9 10.9
OM12V_NIKHEF : 2220AC124KAZ1A C smd 2220 X7R 120n 1k 10.9
OM12V_NIKHEF : 2222_867_15221 MLCC 0603 NP0 220pF C 0.1

OM12V_NIKHEF : CC0603KRX7R9BB104 MLCC 0603 X7R 100n 0.6
OM12V_NIKHEF : CC1812JKNPOCBN152 CAP1812_1n5_1000 2.2
OM12V_NIKHEF : CGA3E1X5R1A335K080AC MLCC 0603 X5R 1.8
OM12V_NIKHEF : TMK316BJ106KL-T C smd 1206 X5R 10uF 25 18.9
PB: NP0 50V 0805 1nF 5%, TC 30ppm, -55/+125°C (C66) (KM 0.0
PB: X5R 25V 0805 10uF 10%, -55/+85°C (C02) (KM3NET_DS) 12.5
PB: X5R 50V 1206 10uF 10%, TC 15%, -55/+85°C (C75) (KM3 36.9
PB: X5R 6.3V 0805 10uF 20%, TC 15%, -55/+85°C (C12) (KM 16.3
PB: X5R 6.3V 0805 10uF 20%, TC 15%, -55/+85°C (C91) (KM 16.3
PB: X5R 6.3V 0805 10uF 20%, TC 15%, -55/+85°C (C93) (KM 10.6
PB: X5R 6.3V 0805 10uF 20%, TC 15%, -55/+85°C (C96) (KM 13.4
PB: X5R 6.3V 0805 10uF 20%, TC 15%, -55/+85°C (C98) (KM 10.6
PB: X5R 6.3V 0805 22uF 20%, TC 15%, -55/+85°C (C08) (KM 0.5
PB: X5R 6.3V 0805 22uF 20%, TC 15%, -55/+85°C (C09) (KM 0.5
PB: X5R 6.3V 0805 22uF 20%, TC 15%, -55/+85°C (C15) (KM 0.7
PB: X5R 6.3V 0805 22uF 20%, TC 15%, -55/+85°C (C16) (KM 0.7
PB: X5R 6.3V 0805 22uF 20%, TC 15%, -55/+85°C (C18) (KM 0.7
PB: X5R 6.3V 0805 22uF 20%, TC 15%, -55/+85°C (C19) (KM 0.7
PB: X5R 6.3V 0805 22uF 20%, TC 15%, -55/+85°C (C21) (KM 2.6
PB: X5R 6.3V 0805 22uF 20%, TC 15%, -55/+85°C (C22) (KM 2.6
PB: X5R 6.3V 0805 22uF 20%, TC 15%, -55/+85°C (C23) (KM 4.0
PB: X5R 6.3V 0805 22uF 20%, TC 15%, -55/+85°C (C31) (KM 7.1
PB: X5R 6.3V 0805 22uF 20%, TC 15%, -55/+85°C (C32) (KM 7.1
PB: X5R 6.3V 0805 22uF 20%, TC 15%, -55/+85°C (C33) (KM 10.7
PB: X5R 6.3V 0805 22uF 20%, TC 15%, -55/+85°C (C41) (KM 16.3
PB: X5R 6.3V 0805 22uF 20%, TC 15%, -55/+85°C (C42) (KM 16.3
PB: X5R 6.3V 0805 22uF 20%, TC 15%, -55/+85°C (C43) (KM 24.5
PB: X5R 6.3V 0805 22uF 20%, TC 15%, -55/+85°C (C46) (KM 24.5
PB: X5R 6.3V 0805 22uF 20%, TC 15%, -55/+85°C (C67) (KM 16.3
PB: X5R 6.3V 0805 22uF 20%, TC 15%, -55/+85°C (C68) (KM 24.5
PB: X7R 50V 0805 0.1uF 10%, -55/+125°C (C06) (KM3NET_DS 0.0
PB: X7R 50V 0805 0.22uF 10%, TC 15%, -55/+125°C (C72) ( 24.5
PB: X7R 50V 0805 0.47uF 10%, TC 15%, -55/+125°C (C73) ( 24.5
PS12_Itsolution: 12065C224JAT2A(C7)-220nF (KM3NET_DS) 0.0
PS12_Itsolution: 12067C222KAT2A(C6)-2,2nF (KM3NET_DS) 0.0

PS12_Itsolution: GR355DD72W474KW01L(C3) -470nF (KM3NE 0.0
PS12_Itsolution: GRM21BR71H104KA01L(C2) - 100nF (KM3N 0.5
PS12_Itsolution: VJ3640Y684KXEA(C4,C5)-680nF (KM3NET_D 47.8
BPS: 1-0726388-2 1 (TP5) (KM3NET_DS) 0.2
BPS: 1-826629-0 10 (J2) (KM3NET_DS) 0.8
BPS: 2-1761606-3 10 (J3) (KM3NET_DS) 0.8
BPS: 350789-1 3 (J8, J9) (KM3NET_DS) 0.4

BPS: 43045-0413 4 (J5, J6) (KM3NET_DS) 0.5
BPS: 43045-1413 14 (J7) (KM3NET_DS) 0.9
BPS: M22-2015005 2 (JP1, JP2, JP3, J1) (KM3NET_DS) 0.3
BPS: PM 5.08/2/90 3.5 2 (J4) (KM3NET_DS) 0.3
Base : CON smd ver F 2x5p 0.8mm(J1 SEM-105-02-03.0-H-D- 1.3

CABLE_FLAT_50 (KM3NET_DS) 0.9
CLBV2: JTAG connector 87831-1420 MOLEX (KM3NET_DS) 0.9
CLBV2: LEMO-V DP 101 A004 FISHER (KM3NET_DS) 0.3
CLBV2: Molex 75331-0444 (KM3NET_DS) 0.6
CLBV2: Samtec ASP-134486-01 (KM3NET_DS) 8.1
CLBV2: Tyco 281274-1 (KM3NET_DS) 1.1
CLBV2: BEL COMPONENTS SI-46012-f (KM3NET_DS) 0.8

CLBV2: Jumper Samtec TSH-102-1-L (KM3NET_DS) 0.3
CLBV2: Molex 22-27-2031 (KM3NET_DS) 0.4
CLBV2: Molex Micro USB105133-0001 (KM3NET_DS) 0.9
CLBV2: PHOENIX 1755736 MSTBVA25_2G508 (KM3NET_DS) 0.3
CLBV2: SAMTEC MPT_08_630_03_L_V (KM3NET_DS) 0.7
CON_BAT_Holder (KM3NET_DS) 0.9
CON_CIRC_THOLE_2 (KM3NET_DS) 0.3
CON_CIRC_TH_2 (KM3NET_DS) 0.3
CON_CI_SMD_0P10P (KM3NET_DS) 2.0

CON_CI_TH_0P10P (KM3NET_DS) 1.2
CON_COAX_SMD_0P2P (KM3NET_DS) 0.6
CON_COAX_SMD_2P5P (KM3NET_DS) 1.0
CON_COAX_TH_0P2P (KM3NET_DS) 0.4
CON_COAX_TH_2P5P (KM3NET_DS) 0.6

CON_PCB_SMD_196 (KM3NET_DS) 9.1
CON_PCB_SMD_32 (KM3NET_DS) 2.2

CON_PCB_TH_10 (KM3NET_DS) 1.2
CON_RECT_CI_60P (KM3NET_DS) 6.4
CON_RECT_HARNESS_10 (KM3NET_DS) 0.2
CON_RECT_HARNESS_25 (KM3NET_DS) 0.3
CON_RECT_PRESSFIT_40 (KM3NET_DS) 0.2
CON_RECT_PressFIT_0P10P (KM3NET_DS) 0.1

CON_RECT_SMD_0P10P (KM3NET_DS) 1.0
CON_RECT_SMD_1 (KM3NET_DS) 0.2


CON_RECT_THOLE_128P (KM3NET_DS) 2.2
CON_RECT_THOLE_6 (KM3NET_DS) 0.5
CON_RECT_THOLE_8 (KM3NET_DS) 0.6

CON_RECT_TH_0P10P (KM3NET_DS) 0.6
CON_RECT_TH_1 (KM3NET_DS) 0.2
CON_RECT_TH_128P (KM3NET_DS) 2.2
CON_RECT_TH_16P (KM3NET_DS) 0.8


CON_RECT_WRAPPING_0P10P (KM3NET_DS) 0.2
CON_SUP_SMD_0P10P (KM3NET_DS) 1.4
CON_SUP_TH_0P10P (KM3NET_DS) 0.8
ConnCircu1 (KM3NET_DS) 0.1

ConnCoax1 (KM3NET_DS) 0.2
ConnPrint1 (KM3NET_DS) 0.3
ConnSupp1 (KM3NET_DS) 0.3
FMC: 0826-1X1T-80-F (J4) (KM3NET_DS) 1.0
FMC: 09185066904 (J8) (KM3NET_DS) 0.6
FMC: 09185106904 (J7) (KM3NET_DS) 1.1

FMC: 20020107-G031A01LF (J2 TBC) (KM3NET_DS) 0.4
FMC: ASP-134488-01 (J1) (KM3NET_DS) 8.1
FMC: Bypass jumper (J3, J5) (KM3NET_DS) 0.3
FMC: SI-46012-F (J6 - TBC) (KM3NET_DS) 1.0
FMC: TMM-107-01-G-D-SM (J_JTAG) (KM3NET_DS) 1.5
OCTOPUS LARGE: 75876-0040 (J99) (KM3NET_DS) 3.8
OCTOPUS LARGE: J2_19 Male 2x5p 2.00mm TMM-105-01-G- 1.3

OCTOPUS LARGE: J3_19 Male 1x5p 2.00mm TMM-105-01-G- 1.3
OCTOPUS LARGE: Male 2x5p 0.8mm (J1_0,J1_1,J1_2,J1_3,J1_ 1.3
OCTOPUS SMALL: 75876-0040 (J99) (KM3NET_DS) 3.8
OCTOPUS SMALL: J2_19 Male 2x5p 2.00mm TMM-105-01-G- 1.3
OCTOPUS SMALL: J3_19 Male 1x5p 2.00mm TMM-105-01-G- 1.3
OCTOPUS SMALL: Male 2x5p 0.8mm (J1_0,J1_1,J1_2,J1_3,J1_ 1.3
PB: HDR 2.54A 5 TE Connectivity (J4) (KM3NET_DS) 0.5
PB: MPS-08-7.70-01-L-V (J2) (KM3NET_DS) 1.1
PB: MPS-08-7.70-01-L-V (J3) (KM3NET_DS) 1.1
PB: MPSC-01-24-01-7.70-01-L-V (J1) (KM3NET_DS) 4.0
BPS: 1.5KE440CA ZENER DIODE (D7, D9) (KM3NET_DS) 0.0
BPS: 1N5347BG ZENER DIODE (D10, D11) (KM3NET_DS) 0.4
BPS: 1N5388BG ZENER DIODE (D8) (KM3NET_DS) 0.6
BPS: BSS123LT1G (SOT23)(Q2) (KM3NET_DS) 0.0
BPS: FMMT459TA (SOT23)(Q4) (KM3NET_DS) 0.0
BPS: IXTX32P60P (TO264)(Q3) (KM3NET_DS) 0.1
BPS: P600M-E3 SWITCHING DIODE (D6) (KM3NET_DS) 0.7
BPS: SiHG73N60E (TO247AC)(Q1, Q5) (KM3NET_DS) 0.1
Base : CMLD4448 PIN2,5 REMOVED(D1,D2,D3,D4,D5,D6,D7,D 0.0
Base : PMF370XN(T1 SOT65P210X110-3N) (KM3NET_DS) 0.1
CLBV2: Fairchild NDS351N/SOT (FIT manufacturer: 5,8 but t° 0.1
CLBV2: Fairchild NDS352P/SOT (TO BE CONFIRMED POWER! 0.2
CLBV2: Littelfuse SP0503BAHTG (KM3NET_DS) 0.0
DIS_SMD_MOSinf5W_ID (KM3NET_DS) 0.1
DIS_SMD_RECTDIODES_NIP (KM3NET_DS) 0.1
DIS_SMD_SIGDIODES_NIP (KM3NET_DS) 0.0
DIS_SOD323_schotky_NIP (KM3NET_DS) 0.1
DIS_SOT323_SIGDIODES_ID (KM3NET_DS) 0.0
DIS_SOT523_MOS<5W_ID (KM3NET_DS) 0.1
DIS_SOT_ESD_ID (KM3NET_DS) 0.1
DIS_SOT_SIGDIODES_ID (KM3NET_DS) 0.1

DS1 (KM3NET_DS) 0.0
DS2 (KM3NET_DS) 0.0
DS3 (KM3NET_DS) 1.9
DS4 (KM3NET_DS) 0.3
DS5 (KM3NET_DS) 0.4
DS6 (KM3NET_DS) 0.4
DS7 (KM3NET_DS) 0.4
DS_SO_SIGDIODES_NILV (KM3NET_DS) 0.0
FMC: NDS351AN (Q2) (KM3NET_DS) 0.2
FMC: NDS352AP (Q1) (KM3NET_DS) 0.2
OM12V_NIKHEF : ADR5044ARTZ (U3 ) (KM3NET_DS) 0.0
OM12V_NIKHEF : BSS138 (T1, T3, T4, T5, T6) (KM3NET_DS) 0.1
OM12V_NIKHEF : BSS84 (T8) (KM3NET_DS) 0.1
OM12V_NIKHEF : CRS08 SWITCHING DIODE (D11,D12) (KM 0.0
OM12V_NIKHEF : DB3S308F0L SWITCHING DIODE (D9,D10) 0.0
OM12V_NIKHEF : DMN4034SSS-13 (T11, T12) (KM3NET_DS) 0.1
OM12V_NIKHEF : DZ2J062MOL ZENER DIODE (D13,D14) (K 0.0

OM12V_NIKHEF : DZ2S150M0L ZENER DIODE (D2) (KM3NET 0.0
OM12V_NIKHEF : DZ2S240M0L ZENER DIODE (D3) (KM3NET 0.0
OM12V_NIKHEF : ES1J (super fast recovery diode 600 V 1 0.0
OM12V_NIKHEF : IPD60R1K4C6 (T2, T9, T10) (KM3NET_DS) 0.1
OM12V_NIKHEF : MBS10(Single Phase 0.8 AMPS. Glass Passiv 0.2
OM12V_NIKHEF : PMEG3002EJ SWITCHING DIODE (D5,D6,D 0.0
PB: BSS138PW N-MOSFET 60V, 0.32A, SOT323, Rds 0.9ohm, 1.8
PB: BSS138PW N-MOSFET 60V, 0.32A, SOT323, Rds 0.9ohm, 1.8
PINDIODE_TH3_ID (KM3NET_DS) 0.0
PS12_Itsolution: STD13NM60N(Q1) (KM3NET_DS) 0.1
PS12_Itsolution: STTH3L06U(D1) (KM3NET_DS) 0.1
RLGold<1 (KM3NET_DS) 18.5

RLGold>1 (KM3NET_DS) 14.1

RLSilver<1 (KM3NET_DS) 18.5


RLSilver>1 (KM3NET_DS) 14.1



BPS: 0477010.MXEP -10A (F1) (KM3NET_DS) 0.0
FUS_NIP (KM3NET_DS) 0.5
FUS_RESET_IP (KM3NET_DS) 0.8
Fuse (KM3NET_DS) 0.1
OM12V_NIKHEF : 0485.500DR (F1) (KM3NET_DS) 0.0
PS12_Itsolution: 0461.500ER (F1, F2)-check current ratio (KM 0.8
PS12_Itsolution: SF-1206S080-2(F3) (KM3NET_DS) 0.8
BPS: AMC1200SDUB(U18,U20,U22) (KM3NET_DS) 1.0
BPS: AQY214EHA(U15) (KM3NET_DS) 0.1
BPS: AQY216EHA(U16) (KM3NET_DS) 0.1
BPS: HV7802MG-G(U3, U14) (KM3NET_DS) 0.9
BPS: INA214AIDCKT(U6, U13) (KM3NET_DS) 0.5
BPS: LM3880MF-1AB(U9) (KM3NET_DS) 0.1
BPS: LMC7101AIM5(U19,U21,U23) (KM3NET_DS) 0.5
BPS: LMZ10503TZE-ADJ/NOPB(U10) (KM3NET_DS) 1.1
BPS: LTC4366CTS8-2TRMPBF(U4) (KM3NET_DS) 1.3
BPS: MAX3232IPW(U2) (KM3NET_DS) 0.6
BPS: PIC18F26K22-I/SO(U1) (KM3NET_DS) 0.3
CLBV2: Micrel SY100EPT23LZG (KM3NET_DS) 0.2
CLBV2: Sensirion SHT21 (KM3NET_DS) 0.6
CLBV2: Silicon Labs CP2103GM (KM3NET_DS) 0.1
CLBV2: AHRS (KM3NET_DS) 0.9
CLBV2: Analog Devices AD5662BRMZ-1 (KM3NET_DS) 0.2
CLBV2: Maxim DS18B20U (KM3NET_DS) 0.1
CLBV2: Maxim MAX700CSA (KM3NET_DS) 0.5
CLBV2: Maxim MAX8517EUB (FIT manufacturer: 11,57 @25°C) 0.9
CLBV2: Microchip 24AA64-I/SM (KM3NET_DS) 0.2
CLBV2: Numonyx - Micron N25Q00AA13GSF40 (KM3NET_DS) 0.3
CLBV2: Philips SN74LV541D (KM3NET_DS) 0.2

CLBV2: Philips SN74LVC08AD (KM3NET_DS) 0.1
CLBV2: Philips SN74LVT125D (KM3NET_DS) 0.2
CLBV2: Texas Instrument CDCM61004 (KM3NET_DS) 0.6
CLBV2: Texas Instrument LP5951MF-3.0 (KM3NET_DS) 0.4
CLBV2: Texas Instruments LM336bd-2-5 (KM3NET_DS) 0.8
CLBV2: Texas Instruments MAX3227EI (KM3NET_DS) 0.1

CLBV2: Texas Instruments SN74LVC1G32 (KM3NET_DS) 0.2
CLBV2: Texas Instruments SN75HVD10 (KM3NET_DS) 0.2
CLBV2: Texas Instruments TS3A4741DCNR (KM3NET_DS) 0.7
CLBV2: Xilinx XC7K160T-2FBG676C (specify the consumption 1.2
FMC: MAX3227 (U14, U15, U16) (KM3NET_DS) 0.2

FMC: SN65LVDS1(U1,U5,U6,U9) (KM3NET_DS) 0.5
FMC: SN65LVDT2(U2,U3,U4,U7,U8,U10,U11) (KM3NET_DS) 0.2
FMC: SN75HVD10(U12,U13,U17,U18) (KM3NET_DS) 1.4
IC1 (KM3NET_DS) 2.0
IC2 (KM3NET_DS) 1.4
IC3 (KM3NET_DS) 0.9
IC4 (KM3NET_DS) 0.7
IC5 (KM3NET_DS) 0.6
IC6 (KM3NET_DS) 0.6
IC7 (KM3NET_DS) 0.2
IC8 (KM3NET_DS) 0.2
IC_BGA324_Dig_ID (KM3NET_DS) 4.7
IC_BGA324_Dig_ID_35° (KM3NET_DS) 15.6
IC_BGA484_FPGA_ID (KM3NET_DS) 4.7
IC_BGA484_FPGA_ID_35° (KM3NET_DS) 15.6
IC_BGA676_FPGA_ID (KM3NET_DS) 4.7
IC_XC6VLX240T (KM3NET_DS) 12.0
IC_BGA676_FPGA_ID_35° (KM3NET_DS) 15.6
IC_DDPACKDO263_Analog-Hybrid_IP (KM3NET_DS) 8.0
IC_LCC28_Analog_ID (KM3NET_DS) 0.9

IC_LGA71_Analg_IP (KM3NET_DS) 1.4
IC_LSM303D_LGA16_Hybrid_ILV (KM3NET_DS) 1.1
IC_PQFP128_Digital (KM3NET_DS) 0.2
IC_PQFP48_DIG_ID (KM3NET_DS) 0.2
IC_QFN24_DIG_ID (KM3NET_DS) 0.2
IC_QFN40_Analog-Hybrid_IP (KM3NET_DS) 8.0

IC_QFN8_ANALOG_ID (KM3NET_DS) 0.9
IC_QFN8_ANALOG_ID_15° (KM3NET_DS) 2.3
IC_SC70_5_AnalogHybrid_NIA (KM3NET_DS) 0.8
IC_SC70_6_AnalogHybrid_NIA (KM3NET_DS) 0.8
IC_SC70_6_AnalogHybrid_NIP (KM3NET_DS) 0.9
IC_SC70_AnalogHybrid_NIA (KM3NET_DS) 0.8
IC_SMDPower8_Anlog-Hybrid_IP (KM3NET_DS) 8.0
IC_SMD_5_DIG_NID (KM3NET_DS) 0.1
IC_SO16_DIG_ID (KM3NET_DS) 0.2
IC_SO6_Analog-Hybrid_ILV (KM3NET_DS) 1.1
IC_SO6_EEPROM_NID (KM3NET_DS) 0.3
IC_SO8_Analog-Hybrid_ILV (KM3NET_DS) 1.1
IC_SO8_DIG_ID (KM3NET_DS) 0.2
IC_SO8_DIG_NID (KM3NET_DS) 0.1
IC_SO8_EEPROM_NID (KM3NET_DS) 0.3
IC_SO8_MICROP_NID (KM3NET_DS) 0.4
IC_SOIC16_Analog-Hybrid_ID (KM3NET_DS) 0.9
IC_SOIC20_AnalogHybrid_ID (KM3NET_DS) 0.2
IC_SOIC20_DIG_ID (KM3NET_DS) 0.2
IC_SOIC24_Analog-Hybrid_ID (KM3NET_DS) 0.2
IC_SOP10_Hyb_ID (KM3NET_DS) 0.9
IC_SOP10_Hyb_IP (KM3NET_DS) 1.4
IC_SOT223-5_Analog-Hibrid_NIP (KM3NET_DS) 5.2
IC_SOT23-5_Dig_NID (KM3NET_DS) 0.1
IC_SOT23-6_Dig_NID (KM3NET_DS) 0.1
IC_SOT23_Analog_NIA (KM3NET_DS) 0.8
IC_SOT23_Analog_NIP (KM3NET_DS) 0.9
IC_TSSOP16_AnalogHbrid_IP (KM3NET_DS) 1.4
IC_TSSOP20_Flash_NID (KM3NET_DS) 0.3
IC_TSSOP20_Hybrid_NID (KM3NET_DS) 0.6
IC_TSSOP24_Analog-Hybrid_ID (KM3NET_DS) 0.9
IC_TSSOP24_Analog-Hybrid_NID (KM3NET_DS) 0.6

IC_TSSOP8_DIG_ID (KM3NET_DS) 0.2
IC_TSSOP8_EEPROM_NID (KM3NET_DS) 0.3
OCTOPUS LARGE: FPF2002 (U1_0,U1_1,U1_2,U1_3,U1_4,U1_ 1.5
OCTOPUS LARGE: PCA9548 (U2,U3,U4) (KM3NET_DS) 4.2
OCTOPUS LARGE: XC2C128 (U5) (KM3NET_DS) 1.2
OCTOPUS LARGE: mic8114 (U6) (KM3NET_DS) 0.1
OCTOPUS SMALL: FPF2002 (U1_0,U1_1,U1_2,U1_3,U1_4,U1_ 1.5

OCTOPUS SMALL: PCA9548 (U2,U3,U4) (KM3NET_DS) 4.2
OCTOPUS SMALL: XC2C128 (U5) (KM3NET_DS) 1.2
OCTOPUS SMALL: mic8114 (U6) (KM3NET_DS) 0.1
OM12V_NIKHEF : BCV62C (U7 ) (KM3NET_DS) 0.7
OM12V_NIKHEF : BVC61C (U8 ) (KM3NET_DS) 0.7
OM12V_NIKHEF : FAN7621BSJX (U6 ) (KM3NET_DS) 0.6
OM12V_NIKHEF : LMC7211AIM5 (U2,U4,U15 ) (KM3NET_DS) 0.6
OM12V_NIKHEF : LMV431AIMF (U9 ) (KM3NET_DS) 0.6
OM12V_NIKHEF : TEA1795T/N1 (U1 ) (KM3NET_DS) 0.6
OM12V_NIKHEF : TEA1795T/N1 (U10 ) (KM3NET_DS) 0.6
PB: 74LVC1G00SE-7 2-inp NAND, 1.65 to 5.5V, SOT-353 (U1 0.1
PB: 74LVC1G14SE-7 Inverter, Schmitt trig, 1.65 to 5.5V, SOT 0.1
PB: INA214AIDCK Current sense amp, 100V/V ±1%, 2.7-26V, 0 0.7
PB: INA286AID Current Sense Amplifier (U3) (KM3NET_DS) 0.9
PB: LP2981AIM5-3.3 Vreg, LDO, +3.3V, tol 1%, acc 0.75%, - 0.5
PB: LP2981AIM5-5.0 Vreg, LDO, +5.0V, tol 1%, acc 0.75%, - 0.5
PB: LTC2499CUHF#PBF 24bit ADC, Delta Sigma, HS, 7.5SPS, 0.7
PB: LTC2631CTS8-LZ10 IC, 10BIT DAC, I2C, SOT23-8 (DAC1 0.6

PB: MCP3425A0T-E/CH ADC, 16-bit, delta-sigma, 15sps (ADC 0.9
PB: MCP6542-E/MS Comparator, dual, sub-uA, 1.6V to 5.5V, 0.5
PB: PCA9515ADGKR Dual bidirectional I2C bus repeater (U5) 0.1
PB: TPS71501DCKR Vreg adj, LDO 415mV 50mA, acc 4%, -40 0.6
PB: TPS74401RGW Vreg adj, LDO 115mV 3A 1%, -40/+125°C 1.4
PS12_Itsolution: LTC4366-2(U3) (KM3NET_DS) 0.9

REG_LM20242_NIP (KM3NET_DS) 5.2
BPS: KP-2012SEC(D1, D5) (KM3NET_DS) 0.0
BPS: KP-2012SURC(D2, D3, D4) (KM3NET_DS) 0.0
CLBV2: LG R971 LED GREEN OSRAM LG R971 (KM3NET_DS 0.0
LED1 (KM3NET_DS) 0.1

LED_SMD2_COLOR_ID (KM3NET_DS) 0.1
LED_SMD2_WHITE_ID (KM3NET_DS) 0.3
LED_TH2_WHITE_ID (KM3NET_DS) 0.3
BPS: B82145A1474J000 470UH (L1, L3) (KM3NET_DS) 0.0

BPS: FBMJ4516HS720NT (L2,L4,L5,L6) (KM3NET_DS) 0.1
Base : L smd 1210 22uH(L1,L4 INDC3225X135N) (KM3NET_DS 0.1
Base : L8 CSHS-EP7-1S-6P-Z (KM3NET_DS) 0.0
Base : MMZ1608B601C(L3,L5,L6,L9 INDC1608X95N) (KM3NE 0.1
CLBV2: BLM21PG221SN1 (KM3NET_DS) 0.2
CLBV2: 4,7µH Vishay IHLP2020BZER4R7M11 (KM3NET_DS) 0.2

FMC: 20020107-G031A01LF (J2-transformers) (KM3NET_DS) 0.0
FMC: SI-46012-F (J6 - TBC) (KM3NET_DS) 0.0
IND_HC_IP_20° (KM3NET_DS) 0.1
IND_HC_NIP_20° (KM3NET_DS) 0.0
IND_HP_NIP (KM3NET_DS) 0.0
IND_ML_NIP (KM3NET_DS) 0.3
Magn1 (KM3NET_DS) 0.0
OM12V_NIKHEF : Bead / LQM18NNR47K00 / 470 nH (L1, L4) 0.0
OM12V_NIKHEF : Inductor/ 7443340470 / 4.7µH (L2) (KM3NET 0.0
OM12V_NIKHEF : Transformer / EP20-ET45300.06.05_V4 (L3 0.0
PB: FILT BNX022-01 (F1) (KM3NET_DS) 0.2
PB: IND MCSD43-470KU 4.5X4.0 (L8) (KM3NET_DS) 0.0
PB: MLB-321611-0120PW (FB10) (KM3NET_DS) 0.2


PB: WUERTH 74279252 (FB11) (KM3NET_DS) 0.2
PB: WUERTH 74279252 (FB12) (KM3NET_DS) 0.2
PS12_Itsolution: 46105C(L1, L2) (KM3NET_DS) 0.0
TRANSFO_LPT_4transfos_ID (KM3NET_DS) 0.0
TRANSFO_LPT_RF_ID (KM3NET_DS) 0.0
CLBV2: FTLF1318 (KM3NET_DS) 0.3
Opto1 (KM3NET_DS) 0.6
BPS: AS-3.6864-18-SMD (Y1) (KM3NET_DS) 2.1

CLBV2: 20MHz IQD Frequency Products CFPV-45 (Farnell 16 10.6
CLBV2: 25 MHz Mercury Electronics VM53S3-25.000-2.5/-30+ 10.6
CLBV2: Euroquartz 10.000MHZ XO53050UITA (MAX Output curr 17.5
OSC_QUARTZSMD_NID (KM3NET_DS) 0.5
Piezo1 (KM3NET_DS) 2.4
Quartz_10M_NID (KM3NET_DS) 0.5
BPS: PCB (KM3NET_DS) 0.1
Base : pcb (KM3NET_DS) 0.0
CLBV2: CLB PCB (KM3NET_DS) 0.1
FMC: PCB (KM3NET_DS) 0.1
OCTOPUS LARGE: PCB (KM3NET_DS) 0.0
OCTOPUS SMALL: PCB (KM3NET_DS) 0.0
OM12V_NIKHEF : PCB (KM3NET_DS) 0.0

PB: PCB (KM3NET_DS) 0.0
SCB: PCB (KM3NET_DS) 0.1
PCBBlind2 (KM3NET_DS) 0.0

PCBMicro1 (KM3NET_DS) 0.0
PCBPad1 (KM3NET_DS) 0.0
PCBThr1 (KM3NET_DS) 0.0
PCB_ANALOGBACKPLANE (KM3NET_DS) 0.1
PCB_CTDB (KM3NET_DS) 0.3
PCB_CompassV1 (KM3NET_DS) 0.0

PCB_DTB (KM3NET_DS) 0.3
PCB_L2BP (KM3NET_DS) 0.0
PCB_L2CB (KM3NET_DS) 0.4
PCB_TIB (KM3NET_DS) 0.5
PS12_Itsolution: PCB (KM3NET_DS) 0.0
BPS: CCF601M00FKE36- 1000000 Ohms (R46) (KM3NET_DS) 0.0
BPS: CFR100J470K- 470000 Ohms (R45) (KM3NET_DS) 0.0
BPS: CR0805-FX-1501ELF- 1500 Ohms (R1, R2) (KM3NET_DS 0.0
BPS: CR0805-FX-2202ELF- 22000 Ohms (R3) (KM3NET_DS) 0.0
BPS: CRCW0805100KFKEA- 100000 Ohms (R56, R44) (KM3N 0.0
BPS: CRCW080510K0FKEA- 10000 Ohms (R14,R21,R25,R26, 0.0
BPS: CRCW0805187KFKEA- 187000 Ohms (R76, R79) (KM3N 0.0
BPS: CRCW08051K00FKEA- 1000 Ohms (R43) (KM3NET_DS) 0.0
BPS: CRCW08051K00FKEA- 1000 Ohms (R5,R16,R23,R29,R7 0.0
BPS: CRCW08051K10FKEA- 1100 Ohms (R33) (KM3NET_DS) 0.0
BPS: CRCW0805205KFKEA- 205000 Ohms (R68,R71) (KM3N 0.0
BPS: CRCW080523K7FKEA- 23500 Ohms (R36) (KM3NET_DS 0.0
BPS: CRCW080575K0FKEA- 75000 Ohms (R15,R22,R28,R32, 0.0
BPS: CRCW0805820RFKEA- 820 Ohms (R34) (KM3NET_DS) 0.0
BPS: CRF2512-FX-R010ELF- 0,01 Ohms (R10) (KM3NET_DS) 0.0
BPS: CRGH0805F150K- 150000 Ohms (R59, R62) (KM3NET_ 0.0
BPS: CRGH0805F820R- 820 Ohms (R47,R54) (KM3NET_DS) 0.0
BPS: ERA6AEB304V- 300000 Ohms (R17) (KM3NET_DS) 0.0
BPS: ERJ1TRQF1R0U- 1 Ohms (R4) (KM3NET_DS) 0.0

Generic resistor ERJ (KM3NET_DS) 0.0
BPS: ERJ6GEYJ222V- 2200 Ohms (R61,R70,R78) (KM3NET_ 0.0
BPS: ERJ6GEYJ471V- 470 Ohms (R56,R60,R65,R69,R73,R77 0.0
BPS: ERJP06F1501V- 1500 Ohms (R35,R57,R66) (KM3NET_D 0.0
BPS: HHV-25JT-52-10M- 10000000 Ohms (R7) (KM3NET_DS) 0.0
BPS: HV732BTTD3304F- 33000000 Ohms (R64) (KM3NET_DS 0.0
BPS: HVR2500001004FR500- 1000000 Ohms (R49) (KM3NET 0.0
BPS: HVR2500008203FR500- 820000 Ohms (R50) (KM3NET_ 0.0
BPS: HVR3700001003JR500- 100000 Ohms (R51) (KM3NET_ 0.0

BPS: HVR3700001005JR500- 10000000 Ohms (R20) (KM3NE 0.0
BPS: HVR3700001005JR500- 10000000 Ohms (R41, R55) (K 0.0
BPS: HVR3700004124FR500- 412000000 Ohms (R19) (KM3N 0.0

BPS: LR2512-R05FW- 0,05 Ohms (R42) (KM3NET_DS) 0.0

BPS: MCTC0525B3482T5E- 34800 Ohms (R30) (KM3NET_DS) 0.0
BPS: MF1/4LCT52R100J- 10 Ohms (R8) (KM3NET_DS) 0.0
BPS: ROX2SJ33R- 33 Ohms (R12, R13) (KM3NET_DS) 0.0
BPS: WSL2010R1000FEA18- 0,1 Ohms (R38) (KM3NET_DS) 0.0
BPS: YR1B12K4CC- 12400 Ohms (R9) (KM3NET_DS) 0.0
Base : Rsmd 0603 0R(R5 RESC1608X55N) (KM3NET_DS) 0.0
Base : Rsmd 0603 10M0(R12 RESC1608X50L_special) (KM3N 0.0
Base : Rsmd 0603 1K(R2,R11 RESC1608X55N) (KM3NET_DS) 0.0

Base : Rsmd 0603 1M47(R13,R14 RESC1608X50L_special) ( 0.0
Base : Rsmd 0603 1R5(R1 RESC1608X55N) (KM3NET_DS) 0.0
Base : Rsmd 0603 22K(R3,R7,R8,R10 ,,,) (KM3NET_DS) 0.0
Base : Rsmd 0603 56R(R4,R9 ,) (KM3NET_DS) 0.0
Base : Rsmd 2512 3G 2%(R15 RESC6332X70N) (KM3NET_DS) 0.1
CLBV2: 1,2K CR0603-FX-1201ELF - 0,1W (KM3NET_DS) 0.0
CLBV2: 10k CR0603-FX-1002ELF / RC0603FR-0710KL (KM3 0.0
CLBV2: 15 Ohms MCHP03W8F150JT5E (KM3NET_DS) 0.0
CLBV2: 180K CRG0603F180K (KM3NET_DS) 0.0
CLBV2: 1K CR0603-JW-102GLF, CRCW0603102KFKEA / RC0 0.0
CLBV2: 2K2 RC0603FR-0722KL / CRG0603F22K (KM3NET_D 0.0

CLBV2: 33 Ohms RC0603FR-0733RL (KM3NET_DS) 0.0
CLBV2: 39 Ohms 0402 (KM3NET_DS) 0.0
CLBV2: ,22k (1%) CRCW06034K22FKEA - 0,1W (KM3NET_DS) 0.0
CLBV2: 0 Ohms CRCW06030000Z0EA / RC0603JR-070RL (K 0.0
CLBV2: 100 Ohms MR-CRG0603F100R / RC0603FR-07100RL 0,1 0.0
CLBV2: 150 Ohms CRCW060350R0FKEA (KM3NET_DS) 0.0
CLBV2: 22K RC0603FR-0722KL / CRG0603F22K (KM3NET_DS 0.0
CLBV2: 243 Ohms CRCW0603243RFKEA (KM3NET_DS) 0.0

CLBV2: 27,4 Ohms CRCW060327R4FKEA (KM3NET_DS) 0.0
CLBV2: 3,1K (1%) CRCW06033K01FKEA Vishay Draloric - 0, 0.0
CLBV2: 4,7K RC0603FR-074K7L - 0,1 W (KM3NET_DS) 0.0
CLBV2: C1,R2,R32,R33,R88,R89,C98 DNP (KM3NET_DS) 0.0
FMC: - 4700 Ohms (R3) (KM3NET_DS) 0.0
FMC: CPF0603F200RC1- 200 Ohms (R6,R16,R19) (KM3NET_ 0.0
FMC: CR16-000-ZL- 0,000001 Ohms (R4) (KM3NET_DS) 0.0
FMC: CRGH0603F10K- 10000 Ohms (R14) (KM3NET_DS) 0.0
FMC: CRGH0603F22K- 22000 Ohms (R11) (KM3NET_DS) 0.0
FMC: CRGH0603F4K7- 4700 Ohms (R7,R9) (KM3NET_DS) 0.0
FMC: CRGH0603F560R- 560 Ohms (R12) (KM3NET_DS) 0.0
FMC: CRGH0603F56R- 56 Ohms (R13) (KM3NET_DS) 0.0
FMC: MC0063W06031100R- 100 Ohms (R5,R8,R10,R15,R17, 0.0
OCTOPUS LARGE: Rsmd 0402 100K (R13) (KM3NET_DS) 0.0
OCTOPUS LARGE: Rsmd 0402 1K (R11,R12_0,R12_1,R12_2,R 0.0

OCTOPUS LARGE: Rsmd 0402 2K2 (R1_0,R1_7,R1_5,R1_1,R1_ 0.0
OCTOPUS LARGE: Rsmd 0402 33R (R3,R4,R5) (KM3NET_DS) 0.0
OCTOPUS LARGE: Rsmd 0402 47K (R6,R7,R8) (KM3NET_DS) 0.0
OCTOPUS LARGE: Rsmd 0603 0R (R9) (KM3NET_DS) 0.0
OCTOPUS LARGE: Rsmd 0603 1M (R10) (KM3NET_DS) 0.0
OCTOPUS SMALL: Rsmd 0402 100K (R13) (KM3NET_DS) 0.0
OCTOPUS SMALL: Rsmd 0402 1K R11,R12_0,R12_1,R12_2,R1 0.0
OCTOPUS SMALL: Rsmd 0402 2K2 R1_0,R1_1,R1_2,R1_3,R1_ 0.0
OCTOPUS SMALL: Rsmd 0402 33R (R3,R4,R5) (KM3NET_DS) 0.0
OCTOPUS SMALL: Rsmd 0402 47K (R6,R7,R8) (KM3NET_DS) 0.0
OCTOPUS SMALL: Rsmd 0603 0R (R9) (KM3NET_DS) 0.0
OCTOPUS SMALL: Rsmd 0603 1M (R10) (KM3NET_DS) 0.0
OM12V_NIKHEF : R=10000000Ohms RES1206_10M_1% (R20, 0.0
OM12V_NIKHEF : R=100000Ohms MC_0.063W_0603_1%_100K 0.0
OM12V_NIKHEF : R=1000Ohms MC_0.063W_0603_1%_1K (R4 0.0
OM12V_NIKHEF : R=11000Ohms MC_0.063W_0603_1%_11K ( 0.0
OM12V_NIKHEF : R=12Ohms MC_0.063W_0603_1%_12R (R24 0.0
OM12V_NIKHEF : R=1Ohms MC_0.1W_0805_1%_10R (R42) ( 0.0
OM12V_NIKHEF : R=2700Ohms MC_0.063W_0603_1%_2K7 (R 0.0
OM12V_NIKHEF : R=3900Ohms MC_0.063W_0603_1%_3K9 (R 0.0
OM12V_NIKHEF : R=4,7Ohms MC_0.063W_0603_1%_4R7 (R3, 0.0
OM12V_NIKHEF : R=47Ohms MC_0.1W_0805_2%_47R (R46) 0.0
OM12V_NIKHEF : R=61900Ohms MC_0.063W_0603_1%_61K9 0.0
OM12V_NIKHEF : R=68000Ohms PCW2512-68KF (R1,R2) (K 0.0
OM12V_NIKHEF : R=8,2Ohms RN73C2A8R2BTDF (R12,R48) 0.0
PB: 1.2kR 1% 0.125W 0805 150V, -55/+155°C (R65) (KM3NET 0.0
PB: 1.3kR 1% 0.125W 0805 150V, -55/+155°C (R11) (KM3NET 0.0
PB: 100kR 1% 0.125W 0805 150V, -55/+155°C (R03) (KM3NET 0.0
PB: 100kR 1% 0.125W 0805 150V, -55/+155°C (R06) (KM3NET 0.0
PB: 100kR 1% 0.125W 0805 150V, -55/+155°C (R26) (KM3NET 0.0
PB: 100kR 1% 0.125W 0805 150V, -55/+155°C (R28) (KM3NET 0.0
PB: 100kR 1% 0.125W 0805 150V, -55/+155°C (R36) (KM3NET 0.0
PB: 100kR 1% 0.125W 0805 150V, -55/+155°C (R38) (KM3NET 0.0
PB: 100kR 1% 0.125W 0805 150V, -55/+155°C (R76) (KM3NET 0.0
PB: 100kR 1% 0.125W 0805 150V, -55/+155°C (R88) (KM3NET 0.0
PB: 10R 0.1% 0.400W 1206 200V (RS7) (KM3NET_DS) 0.1
PB: 120kR 1% 0.125W 0805 150V, -55/+155°C (R01) (KM3NET 0.0
PB: 120kR 1% 0.125W 0805 150V, -55/+155°C (R37) (KM3NET 0.0
PB: 13kR 1% 0.125W 0805 150V, -55/+155°C (R10) (KM3NET_ 0.0
PB: 150kR 1% 0.125W 0805 150V, -55/+155°C (R25) (KM3NET 0.0
PB: 150kR 1% 0.125W 0805 150V, -55/+155°C (R57) (KM3NET 0.0
PB: 180R 1% 0.125W 0805 150V, -55/+155°C (R09) (KM3NET_ 0.0
PB: 180R 1% 0.125W 0805 150V, -55/+155°C (R13) (KM3NET_ 0.0
PB: 180R 1% 0.125W 0805 150V, -55/+155°C (R17) (KM3NET_ 0.0
PB: 180R 1% 0.125W 0805 150V, -55/+155°C (R23) (KM3NET_ 0.0
PB: 180R 1% 0.125W 0805 150V, -55/+155°C (R33) (KM3NET_ 0.0
PB: 180R 1% 0.125W 0805 150V, -55/+155°C (R41) (KM3NET_ 0.0
PB: 180R 1% 0.125W 0805 150V, -55/+155°C (R43) (KM3NET_ 0.0
PB: 180R 1% 0.125W 0805 150V, -55/+155°C (R44) (KM3NET_ 0.0
PB: 180R 1% 0.125W 0805 150V, -55/+155°C (R51) (KM3NET_ 0.0
PB: 180R 1% 0.125W 0805 150V, -55/+155°C (R53) (KM3NET_ 0.0
PB: 180R 1% 0.125W 0805 150V, -55/+155°C (R54) (KM3NET_ 0.0
PB: 180R 1% 0.125W 0805 150V, -55/+155°C (R68) (KM3NET_ 0.0
PB: 180R 1% 0.125W 0805 150V, -55/+155°C (R69) (KM3NET_ 0.0
PB: 180R 1% 0.125W 0805 150V, -55/+155°C (R77) (KM3NET_ 0.0
PB: 180R 1% 0.125W 0805 150V, -55/+155°C (R78) (KM3NET_ 0.0
PB: 1MR 1% 0.125W 0805 150V, -55/+155°C (R63) (KM3NET_ 0.0
PB: 1MR 1% 0.125W 0805 150V, -55/+155°C (R71) (KM3NET_ 0.0
PB: 200kR 1% 0.125W 0805 150V, -55/+155°C (R02) (KM3NET 0.0
PB: 200kR 1% 0.125W 0805 150V, -55/+155°C (R70) (KM3NET 0.0
PB: 20kR 1% 0.125W 0805 150V, -55/+155°C (R15) (KM3NET_ 0.0
PB: 20kR 1% 0.125W 0805 150V, -55/+155°C (R45) (KM3NET_ 0.0
PB: 20kR 1% 0.125W 0805 150V, -55/+155°C (R90) (KM3NET_ 0.0
PB: 20mR 0.5% Kelvin 0.5W 50ppm/°C 1206, -40/+125°C (RS0 0.1
PB: 220kR 1% 0.125W 0805 150V, -55/+155°C (R27) (KM3NET 0.0
PB: 2kR 1% 0.125W 0805 150V, -55/+155°C (R40) (KM3NET_D 0.0
PB: 2kR 1% 0.125W 0805 150V, -55/+155°C (R50) (KM3NET_D 0.0
PB: 2kR 1% 0.125W 0805 150V, -55/+155°C (R96) (KM3NET_D 0.0
PB: 2kR 1% 0.125W 0805 150V, -55/+155°C (R97) (KM3NET_D 0.0
PB: 3.6MR 1% 0.125W 0805 150V, -55/+155°C (R62) (KM3NET 0.0
PB: 3.9kR 1% 0.125W 0805 150V, -55/+155°C (R64) (KM3NET 0.0
PB: 300kR 1% 0.125W 0805 150V, -55/+155°C (R07) (KM3NET 0.0
PB: 300kR 1% 0.125W 0805 150V, -55/+155°C (R08) (KM3NET 0.0
PB: 300kR 1% 0.125W 0805 150V, -55/+155°C (R46) (KM3NET 0.0
PB: 300kR 1% 0.125W 0805 150V, -55/+155°C (R47) (KM3NET 0.0
PB: 300kR 1% 0.125W 0805 150V, -55/+155°C (R56) (KM3NET 0.0
PB: 300kR 1% 0.125W 0805 150V, -55/+155°C (R58) (KM3NET 0.0
PB: 300kR 1% 0.125W 0805 150V, -55/+155°C (R84) (KM3NET 0.0
PB: 300kR 1% 0.125W 0805 150V, -55/+155°C (R85) (KM3NET 0.0
PB: 300kR 1% 0.125W 0805 150V, -55/+155°C (R86) (KM3NET 0.0
PB: 300kR 1% 0.125W 0805 150V, -55/+155°C (R87) (KM3NET 0.0
PB: 300kR 1% 0.125W 0805 150V, -55/+155°C (R89) (KM3NET 0.0
PB: 300kR 1% 0.125W 0805 150V, -55/+155°C (R93) (KM3NET 0.0
PB: 30kR 1% 0.125W 0805 150V, -55/+155°C (R95) (KM3NET_ 0.0
PB: 330R 1% 0.125W 0805 150V, -55/+155°C (R05) (KM3NET_ 0.0
PB: 33kR 1% 0.125W 0805 150V, -55/+155°C (R04) (KM3NET_ 0.0
PB: 3kR 1% 0.125W 0805 150V, -55/+155°C (R60) (KM3NET_D 0.0
PB: 470R 1% 0.125W 0805 150V, -55/+155°C (R31) (KM3NET_ 0.0
PB: 47R 1% 0.125W 0805 150V, -55/+155°C (R66) (KM3NET_D 0.0
PB: 47kR 1% 0.125W 0805 150V, -55/+155°C (R73) (KM3NET_ 0.0
PB: 5.1kR 1% 0.125W 0805 150V, -55/+155°C (R30) (KM3NET 0.0
PB: 510kR 1% 0.125W 0805 150V, -55/+155°C (R94) (KM3NET 0.0
PB: 62kR 1% 0.125W 0805 150V, -55/+155°C (R55) (KM3NET_ 0.0
PB: 680kR 1% 0.125W 0805 150V, -55/+155°C (R00) (KM3NET 0.0
PB: 750R 1% 0.125W 0805 150V, -55/+155°C (R21) (KM3NET_ 0.0
PB: 75R 1% 0.125W 0805 150V, -55/+155°C (R61) (KM3NET_D 0.0
PB: 75R 1% 0.125W 0805 150V, -55/+155°C (R80) (KM3NET_D 0.0
PB: 82kR 1% 0.125W 0805 150V, -55/+155°C (R35) (KM3NET_ 0.0
PB: 82kR 1% 0.125W 0805 150V, -55/+155°C (R72) (KM3NET_ 0.0
PB: 9.1kR 1% 0.125W 0805 150V, -55/+155°C (R20) (KM3NET 0.0
PB: 910kR 1% 0.125W 0805 150V, -55/+155°C (R75) (KM3NET 0.0
PB: Resistor, Thick Film, 0R, 0805, 1%, 125mW, 150V (S0) ( 0.0
PS12_Itsolution: CRCW120610R0JNEAIF- 10 Ohms (R3) (KM 0.0
PS12_Itsolution: CRHV1206AF10M0FKFT- 10000000 Ohms ( 0.0
PS12_Itsolution: ERA6AEB1182V- 11800 Ohms (R2) (KM3NET 0.0
PS12_Itsolution: HV732BTTD105J- 1000000 Ohms (R6) (KM3 0.0
PS12_Itsolution: HV732BTTD8203F- 820000 Ohms (R4) (KM3 0.0
PS12_Itsolution: HV732HTTE3904F- 39000000 Ohms (R5) ( 0.0
PS12_Itsolution: SMW2180RJT- 180 Ohms (R7, R8) (KM3NET 0.0
RES_ARRAY_ID_0,2 (KM3NET_DS) 0.0
RES_CHIP_ID_0,2 (KM3NET_DS) 0.0
RES_CHIP_IP_0,2 (KM3NET_DS) 0.0
RES_CHIP_IP_1 (KM3NET_DS) 0.0
RES_CHIP_NID_0,2 (KM3NET_DS) 0.0
RES_CHIP_NILV_0,2 (KM3NET_DS) 0.0
RES_CHIP_NIP_0,2 (KM3NET_DS) 0.0
RES_CHIP_NIP_1 (KM3NET_DS) 0.0
RES_HSFILM_NIP_0,2 (KM3NET_DS) 0.0
RES_LPFILM_NILV_0,2 (KM3NET_DS) 0.0
RES_LPFILM_NIP_0,2 (KM3NET_DS) 0.0
RES_LPFILM_NIP_1 (KM3NET_DS) 0.1
Res1 (KM3NET_DS) 0.0
CLBV2: Eswitch TL3301EF100QG (KM3NET_DS) 0.8
CLBV2: Tyco 1-1571983-0 (KM3NET_DS) 0.8
SWGold<1 (KM3NET_DS) 12.0
SWGold>1 (KM3NET_DS) 10.0
SWSilver<1 (KM3NET_DS) 12.0
SWSilver>1 (KM3NET_DS) 10.0
SW_SILV<2A_resistloadSealed_NID (KM3NET_DS) 0.7
BPS: T520D227M010ATE018 220UF (C24,C33,C43,C52) (KM3 8.4
BPS: TPSB106K016R0500 10UF (C54, C61) (KM3NET_DS) 2.0
BPS: TR3D476K025C0150 45UF (C55) (KM3NET_DS) 7.4
BPS: TR3E477K010C0100 470UF (C11) (KM3NET_DS) 8.4
CAPA_tantal_IP (KM3NET_DS) 0.5
CLBV2: 100µF JMK316BJ107ML-T Taiyo Yuden - 1206 -10 V 1.5
CLBV2: 330 µFref B45197A2337K409 kimet-10Volts-Case D -o 0.0
Capa tant1 (KM3NET_DS) 0.8
FMC: TR3D107K016C0125 (C3) (KM3NET_DS) 0.4
PS12_Itsolution: TR3W107K025C0100(C1)-100µF (KM3NET_D 7.4
AC/DC voltage converter (KM3NET_DS) 670.7
DC/DC voltage converter (KM3NET_DS) 201.2
Aluminium capacitor (KM3NET_DS) 1.7
CRT screen (KM3NET_DS) 7613.5
Ceramic capacitor (KM3NET_DS) 0.6
Connecteur wrapping ou insertion More than200 contacts (K 3.4
Connecteur wrapping ou insertion from 20 up to200 contacts 1.6
Connecteur wrapping ou insertion up to 20 contacts (KM3NET 0.5
wrapping or insertion connector More than200 contacts (KM3 13.8
wrapping or insertion connector from 20 up to200 contacts ( 6.1
wrapping or insertion connector up to 20 contacts (KM3NET_D 1.9
Diode Hermetic (KM3NET_DS) 4.4
Diode Non Hermetic low power (KM3NET_DS) 0.1
Diode Non Hermetic power (KM3NET_DS) 28.4
Transistor Hermetic (KM3NET_DS) 1.3
Transistor Non Hermetic low power (KM3NET_DS) 0.2
Transistor Non Hermetic power (KM3NET_DS) 6.4
Relay Non resistive load < 3 actuations/h (KM3NET_DS) 67.1
Relay Non resistive load ³ 3 actuations/h (KM3NET_DS) 671.1
Relay Resistive load < 3 actuations/h (KM3NET_DS) 57.1
Relay Resistive load ³ 3 actuations/h (KM3NET_DS) 571.3
Hard disk (KM3NET_DS) 1335.0
Digital and memory integrated circuit > 84 p Hermetic (KM3NE 0.8
Digital and memory integrated circuit ≤ 84 p Hermetic (KM3NE 0.4
Digital and memory integrated circuit ≤ 84 p Non Hermetic (K 0.4
Digital and memory integrated circuit ≤ 84 p Non Hermetic (K 0.8
Other integrated circuit > 84 p Hermetic (KM3NET_DS) 7.4
Other integrated circuit ≤ 84 p Hermetic (KM3NET_DS) 2.3
Other integrated circuit ≤ 84 p Non Hermetic (KM3NET_DS) 2.3
Other integrated circuit ≤ 84 p Non Hermetic (KM3NET_DS) 7.4
LCD screen (class III) STN (KM3NET_DS) 4748.5
LCD screen (class III) TFT (KM3NET_DS) 3580.4
Inductor (KM3NET_DS) 0.1
Transformer (KM3NET_DS) 0.2
Optocoupler with Photodiode Hermetic (KM3NET_DS) 1.3
Optocoupler with Photodiode Non Hermetic low power (KM3NE 0.5
Optocoupler with Photodiode Non Hermetic power (KM3NET_D 3.2
Optocoupler with Phototransistor Hermetic (KM3NET_DS) 2.9
Optocoupler with Phototransistor Non Hermetic low power (K 1.1
Optocoupler with Phototransistor Non Hermetic power (KM3NE 7.1
Quartz oscillator (KM3NET_DS) 15.0
Quartz resonator (KM3NET_DS) 1.1
Printed circuit PTH > 2000 connections (KM3NET_DS) 0.3
Printed circuit PTH up to 2000 connections (KM3NET_DS) 0.1
Printed circuit SMD > 2000 connections (KM3NET_DS) 3.5
Printed circuit SMD up to 2000 connections (KM3NET_DS) 0.9
Potentiometer (KM3NET_DS) 1.0
Resistive network, Resistive chip (KM3NET_DS) 0.0
Resistor (KM3NET_DS) 0.1
DIP, Encoder wheel (from 4 to 10 pins) (KM3NET_DS) 11.8
Push button, Switch, Inver. ( < 4 pins ) (KM3NET_DS) 6.0
Switch ( > 10 pins) (KM3NET_DS) 25.5
Tantalum capacitor (KM3NET_DS) 3.3
AsGaDS1 (KM3NET_DS) 0.1
AsGaIC1 (KM3NET_DS) 6.4
RFHFCapa1 (KM3NET_DS) 0.3
Other1 (KM3NET_DS) 0.0
RFHFInd1 (KM3NET_DS) 0.1
RFHFRes1 (KM3NET_DS) 0.0
SiDS1 (KM3NET_DS) 0.0
SiIC1 (KM3NET_DS) 4.7
OTAD1 (KM3NET_DS) 324.1
OTAS1 (KM3NET_DS) 1.2
BC1 (KM3NET_DS) 19.5
BC5 (KM3NET_DS) 8.8
BC6 (KM3NET_DS) 2.5
BC8 (KM3NET_DS) 2.4
CSUB1 (KM3NET_DS) 0.0
CC1 (KM3NET_DS) 0.5
CC2 (KM3NET_DS) 0.8
CC3 (KM3NET_DS) 6.2
CC4 (KM3NET_DS) 1.3
CC5 (KM3NET_DS) 2.4
CC6 (KM3NET_DS) 11.9
CC7 (KM3NET_DS) 1.3
CC8 (KM3NET_DS) 2.4
CC9 (KM3NET_DS) 2.4
OTCOCircu1 (KM3NET_DS) 0.3
OTCOCoax1 (KM3NET_DS) 0.4
OTCOPrint1 (KM3NET_DS) 0.6
OTCOSupp1 (KM3NET_DS) 0.6
MCDC1 (KM3NET_DS) 10.6
MCDC2 (KM3NET_DS) 10.6
DR1 (KM3NET_DS) 0.0
DR2 (KM3NET_DS) 0.0
DR3 (KM3NET_DS) 0.0
DR4 (KM3NET_DS) 0.0
DR5 (KM3NET_DS) 0.0
DR6 (KM3NET_DS) 0.0
EC1 (KM3NET_DS) 0.0
EC10 (KM3NET_DS) 0.0
EC2 (KM3NET_DS) 0.0
EC3 (KM3NET_DS) 0.0
EC4 (KM3NET_DS) 0.0
EC5 (KM3NET_DS) 0.0
EC6 (KM3NET_DS) 0.0
EC7 (KM3NET_DS) 0.0
EC8 (KM3NET_DS) 0.0
EC9 (KM3NET_DS) 0.0
OTFU1 (KM3NET_DS) 0.1
OTFU2 (KM3NET_DS) 0.1
OTLE1 (KM3NET_DS) 0.6
OTLE2 (KM3NET_DS) 3.2
OTLI1 (KM3NET_DS) 3515.3
OTIN1 (KM3NET_DS) 0.0

OTRLGold<1 (KM3NET_DS) 25.4
OTRLGold>1 (KM3NET_DS) 18.9
OTRLSilver<1 (KM3NET_DS) 25.4
OTRLSilver>1 (KM3NET_DS) 18.9
MI1 (KM3NET_DS) 0.4
MI2 (KM3NET_DS) 0.4
OTOP1 (KM3NET_DS) 3.2
OTOP2 (KM3NET_DS) 6.9
OTHO1 (KM3NET_DS) 0.1
OTPZ1 (KM3NET_DS) 5.0
OTDA1 (KM3NET_DS) 2.5
OTDI1 (KM3NET_DS) 2.5
OTAG1 (KM3NET_DS) 143.7
OTSI1 (KM3NET_DS) 108.8
OTHI1 (KM3NET_DS) 0.7
OTHI2 (KM3NET_DS) 0.7
OTHR1 (KM3NET_DS) 0.0
OTHR2 (KM3NET_DS) 0.0
OTHC1 (KM3NET_DS) 1.3
RC1 (KM3NET_DS) 0.0
RC2 (KM3NET_DS) 0.0
DR7 (KM3NET_DS) 0.0
DR8 (KM3NET_DS) 0.0
MCSC1 (KM3NET_DS) 29.3
MCSC2 (KM3NET_DS) 29.3
OTSWGold<1 (KM3NET_DS) 33.2
OTSWGold>1 (KM3NET_DS) 27.4
OTSWSilver<1 (KM3NET_DS) 33.2
OTSWSilver>1 (KM3NET_DS) 27.4
WI1 (KM3NET_DS) 0.0
WI10 (KM3NET_DS) 0.0
WI2 (KM3NET_DS) 0.0
WI3 (KM3NET_DS) 0.0
WI4 (KM3NET_DS) 0.0
WI5 (KM3NET_DS) 0.0
WI6 (KM3NET_DS) 0.0
WI7 (KM3NET_DS) 0.0
WI8 (KM3NET_DS) 0.0
WI9 (KM3NET_DS) 0.0
MC1 (KM3NET_DS) 19.5
MC2 (KM3NET_DS) 8.8
MC3 (KM3NET_DS) 2.5
MC4 (KM3NET_DS) 23.2
MC5 (KM3NET_DS) 2.4
AC/DC voltage converter more than 500W (KM3NET_DS) 707.1
AC/DC voltage converter up to 500W (KM3NET_DS) 383.6
DC/DC voltage converter more than 50W (KM3NET_DS) 234.1
DC/DC voltage converter up to 50W (KM3NET_DS) 94.7
Aluminium capacitor (KM3NET_DS) 1.4
CRT screen jusquto 20" (KM3NET_DS) 7483.2
CRT screen larger than 20" (KM3NET_DS) 7673.4
Ceramic capacitor high CV product (KM3NET_DS) 0.7
Ceramic
and capacitor moderate CV product (KM3NET_DS)
printed 0.3
circuit
and supports soldered (PTH or SMD) <= 20 contacts (KM3NET_DS) 2.1
printed
circuit
and supports soldered (PTH or SMD) > 20 ; <= 200 (KM3NET_DS) 6.7
printed
circuit supports soldered (PTH or SMD) > 200 contacts (KM3NET_DS) 15.0
and printed
circuit supports wrapping or insertion <= 20 contacts (KM3NET_DS)
and printed 0.5
circuit
and supports wrapping or insertion > 20 ; <= 200 (KM3NET_DS)
printed 1.7
circuit supports wrapping or insertion > 200 contacts (KM3NET_DS) 3.8
Other connector soldered (PTH or SMD) <= 20 contacts (KM3 1.3
Other connector soldered (PTH or SMD) > 20 ; <= 200 (KM3N 4.1
Other connector soldered (PTH or SMD) > 200 contacts (KM3 8.8
Other connector wrapping or insertion <= 20 contacts (KM3NE 0.3
Other connector wrapping or insertion > 20 ; <= 200 (KM3NET 1.0
Other connector wrapping or insertion > 200 contacts (KM3NE 2.2
Diode Hermetic SMD (KM3NET_DS) 3.6
Diode Hermetic TH (KM3NET_DS) 3.6
Diode Non Hermetic SMD low power (KM3NET_DS) 0.1
Diode Non Hermetic SMD power (KM3NET_DS) 23.5
Diode Non Hermetic TH low power (KM3NET_DS) 0.1
Diode Non Hermetic TH power (KM3NET_DS) 23.5
Transistor Hermetic SMD (KM3NET_DS) 1.1
Transistor Hermetic TH (KM3NET_DS) 1.1
Transistor Non Hermetic SMD low power (KM3NET_DS) 0.2
Transistor Non Hermetic SMD power (KM3NET_DS) 5.3
Transistor Non Hermetic TH low power (KM3NET_DS) 0.2
Transistor
Relay < 10 Non Hermetic TH power (KM3NET_DS) 5.3
contacts Resistive load < 3 actuations/h (KM3NET_DS) 26.9
Non-resistive
Relay < 10 load ³ 3 actuations/h (KM3NET_DS) 327.1
contacts
Relay < 10Non-resistive load < 3 actuations/h (KM3NET_DS) 32.7
contacts
Relay > 10Resistive load ³ 3 actuations/h (KM3NET_DS) 268.8
contacts
Relay > 10 Non-resistive load < 3 actuations/h (KM3NET_DS) 78.0
contacts
Relay > 10 Non-resistive load ³ 3 actuations/h (KM3NET_DS) 779.5
contacts
Relay > 10Resistive load < 3 actuations/h (KM3NET_DS) 64.1
contacts Resistive load ³ 3 actuations/h (KM3NET_DS) 640.7
Hard disk EIDE (KM3NET_DS) 1341.8
Hard disk SCSI (KM3NET_DS) 1318.7
Analogue, Mixed FPGA, CPLD, complex ASIC integrated circui 24.1
Analogue, Mixed FPGA, CPLD, complex ASIC integrated circuit 8.9
Digital integrated Circuit Hermetic > 288 (KM3NET_DS) 0.4
Digital integrated Circuit Hermetic from 144 to 288 (KM3NET_ 0.2
Digital integrated Circuit Hermetic from 24 to 48 (KM3NET_DS) 0.2
Digital integrated Circuit Hermetic from 48 to 144 (KM3NET_DS 0.2
Digital integrated Circuit Hermetic ≤ 24 p (KM3NET_DS) 0.1
Digital integrated Circuit Non Hermetic > 288 (KM3NET_DS) 0.4
Digital integrated Circuit Non Hermetic from 144 to 288 (KM3 0.2
Digital integrated Circuit Non Hermetic from 24 to 48 (KM3NE 0.2
Digital integrated Circuit Non Hermetic from 48 to 144 (KM3N 0.2
Digital integrated Circuit Non Hermetic ≤ 24 p (KM3NET_DS) 0.1
Memory integrated circuit Hermetic > 288 (KM3NET_DS) 2.1
Memory integrated circuit Hermetic from 144 to 288 (KM3NET 1.2
Memory integrated circuit Hermetic from 24 to 48 (KM3NET_DS 0.5
Memory integrated circuit Hermetic from 48 to 144 (KM3NET_ 0.8
Memory integrated circuit Hermetic ≤ 24 p (KM3NET_DS) 0.4
Memory integrated circuit Non Hermetic > 288 (KM3NET_DS) 2.1
Memory integrated circuit Non Hermetic from 144 to 288 (KM 1.2
Memory integrated circuit Non Hermetic from 24 to 48 (KM3N 0.5
Memory integrated circuit Non Hermetic from 48 to 144 (KM3 0.8
Memory integrated circuit Non Hermetic ≤ 24 p (KM3NET_DS) 0.4
Micro*, DSP, simple ASIC integrated circuit Hermetic > 288 ( 6.1
Micro*, DSP, simple ASIC integrated circuit Hermetic from 14 2.7
Micro*, DSP, simple ASIC integrated circuit Hermetic ≤ 24 p 0.7
Micro*, DSP, simple ASIC integrated circuit Non Hermetic > 6.1
Micro*, DSP, simple ASIC integrated circuit Non Hermetic fro 2.7
Micro*, DSP, simple ASIC integrated circuit Non Hermetic ≤ 2 0.7
LCD screen (Class III) from 14" to 20" (KM3NET_DS) 5009.0
LCD screen (Class III) larger than 20" (KM3NET_DS) 3776.2
LCD screen (Class III) STN up to 14" (KM3NET_DS) 4259.7
LCD screen (Class III) TFT from 14" to 20" (KM3NET_DS) 3418.0
Inductor (KM3NET_DS) 0.1
Transformer hight power (KM3NET_DS) 0.4
Transformer low power (KM3NET_DS) 0.0
Optocoupler with Photodiode Hermetic SMD (KM3NET_DS) 0.6
Optocoupler with Photodiode Hermetic TH (KM3NET_DS) 0.6
Optocoupler with Photodiode Non Hermetic SMD power (KM3 1.0
Optocoupler with Photodiode Non Hermetic TH low power (K 0.3
Optocoupler with Photodiode Non Hermetic TH power (KM3NE 1.0
Optocoupler with Phototransistor Hermetic SMD (KM3NET_DS 1.3
Optocoupler with Phototransistor Hermetic TH (KM3NET_DS) 1.3
Optocoupler with Phototransistor Non Hermetic SMD low pow 0.8
Optocoupler with Phototransistor Non Hermetic SMD power ( 2.2
Optocoupler with Phototransistor Non Hermetic TH low power 0.8
Optocoupler with Phototransistor Non Hermetic TH power (K 2.2
Optocoupler with Photodiode Non Hermetic SMD low power ( 0.3
Quartz oscillator SMD (KM3NET_DS) 11.4
Quartz oscillator throught hole (KM3NET_DS) 11.4
Quartz resonator SMD (KM3NET_DS) 0.7
Quartz resonator throught hole (KM3NET_DS) 1.2
Printed circuit PTH <= 2000 reports (KM3NET_DS) 0.1
Printed circuit PTH > 2000 reports (KM3NET_DS) 0.2
Printed circuit SMD <= 2000 reports (KM3NET_DS) 0.9
Printed circuit SMD > 2000 reports (KM3NET_DS) 3.4
High stability bulk metal foil accuracy resistor (KM3NET_DS) 0.2
Potentiometer (KM3NET_DS) 0.9
Resistive network, Resistive chipresistif (KM3NET_DS) 0.0
Resistor high dissipation (KM3NET_DS) 0.1
Resistor low dissipation (KM3NET_DS) 0.0
DIP, Encoder wheel (from 4 to 10 pins) (KM3NET_DS) 8.3
DIP, Encoder
Push wheel (from
button, Switch, Inver.4( to
<410pins)
pins) Non
(KM3NET_DS)
resistive 11.2
load (KM3NET_DS)
Push button, Switch, Inver. ( < 4 pins) Resistive 5.7
load (KM3NET_DS) 4.3
Tantalum capacitor gel (KM3NET_DS) 2.0
Tantalum capacitor solid (KM3NET_DS) 3.3
BPS: CC6-0512SF-E(U12) (KM3NET_DS) 34.0
BPS: MTU1S0505MC(U17) (KM3NET_DS) 35.7
BPS: V375C5E50BF3(U5) (KM3NET_DS) 33.8
Conv1 (KM3NET_DS) 127.4
PB :LT3464ETS8 DC/DC CONV, 85mA, Boost, TSOT23-8 (DC7 41.2
PB :OKL-T/1-W12N-C DC/DC POL Converter 12Vin 0.591-5.5Vo 52.5
PB :OKL-T/1-W12N-C DC/DC POL Converter 12Vin 0.591-5.5Vo 52.5
PB :OKL-T/1-W12N-C DC/DC POL Converter 12Vin 0.9-5.5Vout 42.6
PS12_Itsolution: VI-J61-EZ-S(U4) (KM3NET_DS) 59.9
CRT1 (KM3NET_DS) 348.0
CRT2 (KM3NET_DS) 348.0
Fan (KM3NET_DS) 2284.7
HD1 (KM3NET_DS) 281.7
Key6 (KM3NET_DS) 1.8
LCD1 (KM3NET_DS) 1319.6
Batt1 (KM3NET_DS) 2287.1
CAPA_tantal_0,1_IP (KM3NET_DS) 0.1
DIS_THole_ESD_ID (KM3NET_DS) 0.1
Varistor (KM3NET_DS) 40.0
LTM2882CV-3 (KM3NET_DS) 1.5
Toto (KM3NET_DS) 1000.0
FIT*Pi process Remark
0.0 Version date
0.0 Pi process
0.0 File:
0.0
0.0
41.3
22.5
86.4
127.7
142.7
58.4
60.1
126.8
24.7
33.8
9.2
13.0
55.2
36.8
47.9
57.4
57.4
114.9
52.7
2.2
2.2
0.6
0.9
1.0
3.5
5.8
1.0
5.8
5.8
3.8
3.5
3.8
0.0
0.0
0.3
0.3
1.4
42.7
0.0
1.4
0.0
0.0
0.0
6.1
3.6
0.1
0.1
11.9
0.0
0.0
0.0
0.0
5.3
0.0
40.0
1.8
0.0
8.6
64.9
64.9
0.3
0.1
0.2
0.6
2.7
1.8
9.2
6.1
21.8
14.5
42.7
18.4
28.3
73.7
48.9
117.1
77.7
174.8
115.9
248.8
165.1
341.3
226.4
0.0
0.0
0.0
0.0
0.0
0.0
0.2
0.2
0.3
0.1
0.2
0.2
0.6
0.8
1.0
0.4
0.5
0.6
1.5
1.9
2.3
1.0
1.3
1.5
3.0
3.7
4.5
1.9
2.5
3.0
5.2
6.4
7.8
3.4
4.3
5.2
24.0
29.5
36.2
15.6
19.8
24.0
0.0
0.1
0.1
0.0
Ceramic capacitor HCV rating 20% typ2
0.0 Interface power
0.0
0.4
0.4
0.5
0.3
0.3
0.4
1.2
1.5
1.8
1.0
1.0
1.2
2.9
3.5
4.3
2.4
2.4
2.9
5.6
6.9
8.5
4.6
4.6
5.6
15.4
19.0
23.3
12.8
12.8
15.4
45.0
55.3
67.9
37.2
37.2
45.0
0.0
9.1
0.0
0.0
0.1
0.0
8.1
0.1
1.8
1.3
2.0
0.4
0.6
4.9
1.0
1.9
9.4
1.0
1.9
0.0
32.5
0.0
0.0
0.4
0.0
0.0
0.4
0.1
3.2
0.6
0.0
0.4
0.0
0.0
0.4
0.1
3.2
0.6
0.6
5.6
21.8
21.8
0.3
1.2
4.3
3.5
37.8
0.0
25.0
25.0
2.7
25.0
25.0
25.0
25.0
25.0
25.0
1.8
1.8
2.7
25.0
0.8
0.8
25.0
2.4
1.8
48.9
0.2
73.7
32.5
32.5
21.1
26.9
21.1
0.9
0.9
1.4
1.4
1.4
1.4
5.3
5.3
8.0
14.2
14.2
21.3
32.5
32.5
49.1
49.1
32.5
49.1
0.0
0.0
0.0
0.0
0.0
0.0
0.0
0.0
0.0
0.0
0.0
0.0
0.0
0.0
0.0
0.0
0.0
0.0
0.0
14.7
0.0
0.0
0.0
0.0
0.0
0.0
0.1
0.0
0.0
48.9
48.9
0.1
0.0
0.0
0.9
95.5
0.5
1.5
1.5
0.8
1.0
1.8
0.7
0.7
2.7
1.8
1.8
0.7
1.2
3.8
16.2
2.2
1.5
0.7
0.8
4.4
1.8
0.7
1.4
1.8
0.6
0.6
4.1
18.3
5.8
29.0
9.2
13.0
2.5
11.0
3.5
17.4
5.5
7.8
1.3
2.0
0.8
1.2
18.1
4.4
2.5
12.7
0.4
0.6
0.4
0.2
0.9
0.3
1.4
0.5
0.6
2.0
0.4
9.2
2.9
2.4
14.5
4.6
9.2
6.5
1.8
4.4
1.3
1.5
1.6
1.7
1.9
0.6
1.0
3.0
1.1
1.2
0.4
5.5
1.7
4.4
4.4
1.5
1.5
1.6
1.6
0.6
1.7
8.7
2.8
0.7
0.8
2.5
0.9
3.9
1.0
1.1
1.2
0.4
1.8
0.6
2.9
0.9
1.3
2.7
12.3
3.9
19.4
6.1
8.7
1.6
7.4
2.3
11.6
3.7
5.2
0.3
1.6
2.7
0.8
0.5
0.4
2.2
3.7
1.1
0.7
0.5
3.2
5.3
1.6
1.1
0.5
3.2
5.3
1.6
1.1
2.1
1.2
2.2
0.8
16.2
0.7
2.1
3.0
7.7
2.6
2.6
2.6
7.7
2.6
2.6
2.6
1.1
2.3
2.3
8.0
0.1
0.8
1.2
0.1
0.1
0.3
1.3
0.2
0.0
0.2
0.2
0.4
0.1
0.2
0.2
0.0
0.1
0.0
0.2
0.1
0.1
0.0
0.0
3.7
0.6
0.8
0.8
0.8
0.0
0.5
0.5
0.1
0.1
0.1
0.0
0.0
0.3
0.1
0.1
0.1
0.1
0.2
0.4
0.0
3.6
3.6
0.0
0.3
0.1
37.0
10.9
10.9
10.9
37.0
37.0
11.1
11.1
11.1
18.2
18.2
18.2
28.2
7.3
7.3
7.3
28.2
28.2
7.5
7.5
7.5
13.1
13.1
13.1
37.0
10.9
10.9
10.9
37.0
37.0
11.1
11.1
11.1
18.2
18.2
18.2
28.2
7.3
7.3
7.3
28.2
28.2
7.4
7.4
7.4
13.1
13.1
13.1
0.0
1.0
1.5
0.2
0.1
1.5
1.5
2.1
0.3
0.3
1.7
0.9
0.1
1.0
2.2
2.2
2.2
2.2
2.7
1.2
0.7
0.3
1.2
0.2
1.8
0.3
0.1
0.9
1.8
0.4
0.6
0.3
0.2
0.3
1.2
0.8
1.6
0.2
0.3
0.3
1.4
2.5
0.3
0.9
0.4
2.7
3.9
2.9
1.8
1.4
1.3
1.1
0.5
0.5
9.3
31.3
9.3
31.3
9.3
24.0
31.3
16.0
1.8
2.8
2.3
0.3
0.3
0.3
0.3
16.0
0.3
1.8
4.5
1.5
1.5
1.8
1.5
16.0
0.2
0.3
2.3
0.6
2.3
0.3
0.2
0.6
0.7
1.8
0.3
0.3
0.3
1.8
2.8
10.5
0.2
0.2
1.5
1.8
2.8
0.6
1.2
1.8
1.2
0.3
0.6
3.0
8.4
2.5
0.1
3.0
8.4
2.5
0.1
1.4
1.4
1.2
1.2
1.1
1.1
1.1
0.1
0.1
0.1
0.1
0.1
0.1
1.4
1.8
0.9
0.9
1.4
1.1
1.7
0.9
0.9
0.9
0.9
0.2
1.1
2.9
1.7
10.5
0.1
0.1
0.1
0.2
1.2
0.2
0.1
0.6
0.6
0.0
0.1
0.3
0.0
0.3
0.5
0.5
0.0
0.0
0.1
0.1
0.1
0.5
0.0
0.0
0.3
0.0
0.4
0.0
0.0
0.0
0.5
0.1
0.3
0.3
0.3
0.5
0.3
0.3
0.5
0.3
0.3
0.3
0.3
0.3
0.3
0.3
0.5
0.1
0.1
0.0
0.6
1.2
2.7
2.7
4.2
21.2
21.2
35.0
0.9
4.8
4.6
21.5
21.2
0.9
0.1
0.0
0.2
0.2
0.1
0.1
0.0
0.1
0.2
0.0
0.0
0.0
0.0
0.0
0.0
0.0
0.0
0.0
0.0
0.0
0.0
0.0
0.0
0.0
0.0
0.0
0.0
0.0
0.0
0.0
0.0
0.0
0.0
0.0
0.0
0.0
0.3
0.7
0.0
0.6
0.0
0.7
1.0
0.0
0.0
0.1
0.0
0.0
0.0
0.0
0.0
0.0
0.0
0.0
0.0
0.0
0.0
0.0
0.0
0.0
0.0
0.0
0.0
0.1
0.0
0.0
0.0
0.0
0.0
0.0
0.1
0.0
0.0
0.0
0.1
0.0
0.0
0.0
0.0
0.0
0.0
0.0
0.0
0.0
0.0
0.1
0.0
0.0
0.0
0.0
0.0
0.0
0.0
0.0
0.0
0.1
0.0
0.0
0.0
0.0
0.0
0.0
0.0
0.0
0.0
0.0
0.0
0.0
0.0
0.0
0.0
0.0
0.0
0.0
0.0
0.0
0.0
0.0
0.0
0.0
0.0
0.0
0.0
0.0
0.0
0.0
0.0
0.0
0.0
0.0
0.0
0.0
0.0
0.0
0.0
0.0
0.0
0.0
0.0
0.0
0.0
0.0
0.0
0.0
0.0
0.0
0.0
0.0
0.0
0.0
0.0
0.0
0.0
0.0
0.0
0.0
0.0
0.0
0.0
0.0
0.0
0.0
0.0
0.0
0.0
0.0
0.0
0.0
0.0
0.0
0.0
0.1
0.0
0.0
0.0
0.0
0.0
0.0
0.0
0.0
0.0
0.0
0.0
0.0
0.0
0.0
0.0
0.0
0.0
0.0
0.0
0.0
0.0
0.0
0.0
0.0
0.0
0.0
0.0
0.1
0.1
0.1
0.0
0.0
0.0
0.0
0.0
0.0
0.0
0.0
0.0
0.0
0.0
0.0
0.0
0.0
0.0
0.0
0.0
0.0
0.0
0.0
0.0
0.0
0.0
0.0
0.0
0.0
0.0
0.2
0.2
0.2
0.2
0.0
0.0
0.0
0.0
0.0
0.0
0.0
0.0
0.0
0.0
0.0
0.0
0.0
0.0
0.0
0.0
0.0
0.0
0.0
0.0
0.0
0.0
0.0
0.0
0.0
0.0
0.0
0.0
0.0
0.0
0.0
0.0
0.0
0.0
0.0
0.0
0.0
0.0
0.0
0.0
0.1
0.0
0.1
0.1
0.1
0.1
0.0
0.2
0.0
0.0
1.1
0.0
0.0
0.3
1.6
1.7
24.0
3.9
3.9
3.9
24.0
24.0
4.1
4.1
4.1
9.5
9.5
9.5
19.9
3.8
3.8
3.8
19.9
19.9
4.0
4.0
4.0
8.3
8.3
8.3
24.0
3.9
3.9
3.9
24.0
24.0
4.0
4.0
4.0
9.5
9.5
9.5
19.9
3.8
3.8
3.8
19.9
19.9
3.9
3.9
3.9
8.3
8.3
8.3
1.5
16.7
4.1
14.8
16.7
1.1
3.1
0.1
1.5
0.6
0.1
7.1
3.5
1.8
1.8
0.8
14.8
1341.4
402.5
3.4
15227.0
1.2
6.9
3.1
1.0
27.6
12.2
3.8
8.7
0.2
56.8
2.7
0.4
12.9
134.3
1342.3
114.3
1142.6
2670.0
1.6
0.8
0.8
1.6
14.8
4.5
4.5
14.8
9497.1
7160.8
0.2
0.4
2.6
1.0
6.5
5.7
2.2
14.3
29.9
2.3
0.5
0.1
7.0
1.7
2.0
0.0
0.3
23.7
12.1
51.0
6.5
0.2
0.3
0.3
0.9
0.9
0.4
1.7
12.8
3.5
3.5
0.5
0.9
7.2
0.0
0.1
0.1
0.3
0.2
0.0
0.0
0.2
0.2
0.9
0.8
0.4
1.6
0.1
9.4
3.4
0.7
0.7
648.1
648.1
490.4
490.4
307.6
307.6
232.7
232.7
2.5
8.8
14.4
2.5
14.4
14.4
38.9
38.9
38.9
38.9
17.6
4.9
46.4
4.7
0.0
0.0
0.0
0.0
0.0
0.0
0.0
0.0
0.0
0.0
0.0
0.0
0.0
0.0
0.0
0.0
0.0
0.0
0.0
0.0
0.9
1.6
12.4
2.5
4.7
23.8
2.5
4.7
4.7
0.6
3.6
6.0
1.8
1.2
0.8
5.0
8.4
2.5
1.7
1.2
7.2
12.0
3.6
2.4
1.2
7.2
12.0
3.6
2.4
21.2
21.2
0.0
0.0
0.0
0.0
0.0
0.0
0.0
0.0
0.0
0.0
0.0
0.0
0.0
0.0
0.0
0.0
0.0
0.0
0.0
0.0
0.0
0.0
0.0
0.0
0.0
0.0
0.0
0.0
0.0
0.0
0.0
0.0
0.0
0.0
0.0
0.0
0.0
0.0
0.0
0.0
0.0
0.0
0.0
0.0
0.0
0.0
0.0
0.0
0.0
0.0
0.0
0.0
0.0
0.0
0.0
0.0
0.0
0.0
0.0
0.0
0.0
0.0
0.0
0.0
0.0
0.0
0.0
0.0
0.0
0.0
0.0
0.0
0.0
0.0
0.0
0.0
0.0
0.0
0.0
0.0
0.0
0.0
0.0
0.0
0.0
0.0
0.0
0.0
0.0
0.0
0.0
0.0
0.0
0.0
0.0
0.0
0.0
0.0
0.0
0.0
0.0
0.0
0.0
0.0
0.0
0.0
0.0
0.0
0.0
0.0
0.0
0.0
0.0
0.0
0.2
0.2
1.3
6.3
7030.6
7030.6
7030.6
7030.6
7035.0
7035.0
7041.1
7041.1
0.0
New value given by manufacturer 1400000
0.0 (FIT 734)hours au lieu de 37,7
0.2
0.2
0.0
0.0
1.3
1.3
50.8
22.2
22.2
22.2
50.8
50.8
22.7
22.7
31.5
41.5
41.5
41.5
37.8
14.9
14.9
14.9
37.8
37.8
15.3
15.3
22.3
30.3
30.3
30.3
50.8
22.2
22.2
22.2
50.8
50.8
22.7
22.7
31.5
41.5 Firmware and data retention
41.5
20.7
37.8
14.9
14.9
14.9
37.8
37.8
15.3
15.3
22.3
30.3
30.3
30.3
0.8
0.8
6.3
13.9
0.3
0.3
0.5
0.5
0.5
0.5
1.9
1.9
10.1
10.1
9.7
9.7
39.2
39.2
38.7
38.7
4.9
4.9
5.7
5.7
20.0
19.6
8.3
38.1
4.9
4.9
5.7
5.7
20.0
19.6
8.3
38.1
287.4
78.0
78.0
217.6
78.0
16.4
16.4
1.3
1.3
0.0
0.0
2.5
2.5
4.2
4.2
32.9
32.9
0.0
0.0
0.0
0.0
58.5
58.5
66.4
10.0
10.0
10.0
66.4
66.4
11.0
11.0
11.0
48.0
48.0
48.0
54.7
9.6
9.6
9.6
54.7
54.7
10.4
10.4
10.4
40.1
40.1
40.1
66.3
10.0
10.0
10.0
66.3
66.3
11.0
11.0
11.0
48.0
48.0
48.0
54.7
9.6
9.6
9.6
54.7
54.7
10.4
10.4
10.4
40.0
40.0
40.0
0.0
0.0
0.0
0.0
0.0
0.0
0.0
0.0
0.0
0.0
38.9
17.6
4.9
46.4
4.7
1414.2
767.1
468.2
189.3
2.7
14966.5
15346.8
1.4
0.6
4.2
13.5
30.1
1.1
3.3
7.5
2.6
8.1
17.6
0.6
2.0
4.5
7.2
7.2
0.2
47.0
0.2
47.0
2.2
2.2
0.3
10.7
0.3
10.7
53.8
654.2
65.4
537.5
155.9
1558.9
128.2
1281.4
2683.6
2637.5
48.1
17.9
5.1
9.3
3.3
48.1
17.9
5.1
9.3
3.3
0.7
0.5
0.3
0.4
0.3
0.7
0.5
0.3
0.4
0.3
4.2
2.4
1.1
1.5
0.9
4.2
2.4
1.1
1.5
0.9
12.1
5.4
1.9
3.3
1.5
12.1
5.4
1.9
3.3
1.5
10017.9
7552.4
8519.4
6836.1
0.2
0.8
0.0
1.2
1.2
2.0
0.7
2.0
2.7
2.7
1.5
4.5
1.5
4.5
0.7
22.9
22.9
1.4
2.4
0.1
0.5
1.7
6.8
0.4
1.8
0.0
0.3
0.0
16.6
22.5
11.4
8.5
36.0
48.6
4.0
6.6
68.1
71.5
67.7
254.7
192.7
112.7
85.3
82.4
104.9
104.9
85.1
85.1
85.1
85.1
119.8
696.1
696.1
4569.4
563.5
539.9
595.9
544.8
586.4
540.2
596.4
545.0
606.0
549.6
529.2
574.7
534.6
585.3
539.7
575.3
534.8
585.8
3.6
4572.4
4576.0
4580.4
4582.4
4585.4
2639.2
1361.0
894.6
739.2
3635.7
1762.8
1079.5
851.7
4574.2
4574.2
4575.7
4577.7
0.2
1.1
3.7
16.8
97.4
129.6
0.2
80.0
3.0
2000.0
0.0
0.0
0.0
0.0
0.0
0.0
0.0
0.0
0.0
0.0
0.0
0.0
0.0
0.0
0.0
0.0
0.0
0.0
0.0
0.0
0.0
0.0
0.0
0.0
0.0
0.0
0.0
0.0
0.0
0.0
0.0
0.0
0.0
0.0
0.0
0.0
0.0
0.0
0.0
0.0
0.0
0.0
0.0
0.0
0.0
0.0
0.0
0.0
0.0
0.0
0.0
0.0
0.0
0.0
0.0
0.0
0.0
0.0
0.0
0.0
0.0
0.0
0.0
0.0
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0.0
0.0
0.0
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0.0
0.0
0.0
0.0
0.0
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0.0
0.0
0.0
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0.0
0.0
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0.0
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0.0
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0.0
0.0
0.0
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0.0
0.0
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0.0
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May 2th, 2017
2
Reliability_models_KM3NET_02052017
Life profil
FIT Data reported in the table are only valid for the defined life profile defined bellow (for other life profile, run new
Profil name: Profile abbreviation:

KM3NET Deap Sea KM3NET_DS
Calendar Ambient
Dt
Phase name On / Off time temperatur
(°C)
(hours) e (°C)
ON ON 8759 17 1
OFF OFF 1 13 45
llow (for other life profile, run new reliability models calculation with Fides expert tool
Maximum
Cycle Number of temperatur Relative
duration cycles e during humidity
(hours) (/phase) cycling (%)
(°C)
8759 1 30 25
1 1 25 25
Mission duration
Years Hours
15 131400
Set here the mission duration
PBS Product Product quantity Upper level
ORCA/ARCA Phase
2 KM3NET
1
Building Block 1 ORCA/ARCA Phase 1
DU 115 Building Block
SCB 1 WRS
SCB_decoupling 1 SCB
SCB_Connectors 1 SCB
SCB common
1 SCB
functions
SCB_clock 1 SCB
SCB_Process 1 SCB
SCB_Communicate 1 SCB
SCB_Power 1 SCB
SCB_JTAG 1 SCB
SCB_display 1 SCB
SCB_monitoring 1 SCB
SCB_drivers 1 SCB
CHR_WR_LINK 1 CHROMIUN
CHR_GTX 1 CHROMIUN
CHR_SFP 1 CHROMIUN
CHR_GPIO 1 CHROMIUN
CHR_POWER 1 CHROMIUN
CHR_USB 1 CHROMIUN
CHR_Common 1 CHROMIUN
CHROMIUN 1 WRS
WRS 2 DU base
DU base 1 DU
DOM 18 DU
System requirements
Function Replaceable?
impact (%)
Detect Neutrinos crossing a

300 detector line in deep N 100
sea
Collect group of DU data N 100
Detect Neutrinos crossing

N 100
arround a radius ofxxx
DU White rabbit switch N 100
SCB power filtering N 100

Provide scb interface N 100
Provide common functions
N 100
for SCB
SCB generate clock N 100
SCB Process data N 100
SCB provide ethernet
N 100
communication interface
Provide DC DC convertion
N 100
for SCB
Provide SCB programming
N 100
interface
Diodes display N 100
SCB monitoring N 100
Provide SCB electrical
N 100
interface
CHR provide I2C
N 100
communication with SCB
Optic SFP connection to
N 100
FPGA
CHR provide SFP interface
N 100
(optical)
CHR provide GPIO
N 100
interface
CHR convert power N 100
CHR provide USB interface N 100
CHR common functions lke

N 100
PCB
Provide optic to electrical
interface and communicate N 100
with SCB for test purpose
White rabbit switch N 100
Collect 18 line DOM data N 100

DOM Collect photons N 100
Function detail Input1
Common functions like PCB… Signals

Temperature monitoring
For test purpose? Connector I2C GPIO

GTX= Giga bit tranceiver. Connector: distribute
SFP electrical data
SFP signals to SCB
Optic signal
Conversion RS232 / I2C RS232 only for test

12V (NN W?)
Provide connection with SCB FPGA for
programming and test purpose only (not usefull USB data
in the deep sea)
Collect 18 optical data and interface ON shore

via Optical Cable. Electrical/Optical interface DOM Optic fibers
with SCB (white rabbit core switch)
Input2 Input3
Electric signals
Electric signals
I2C
I2C
Optical cable from ON Shore Data from SCB

Input4 Input5
Input6 Output1
24V filtered
Signals
I2C GPIO to SCB clock
Electric signals
Electric signals
I2C
5V
I2C data
Optical data to 18 DOM

Output2 Output3
I2C GPIO to SFP
Optic signal
RS232
3V3
Usb
Optical data to ON shore Electrical data to SCB

Output4 Output 5
Output 6 Energy Configuration
3V3
Numero de SFP / Light level

3V3
setting
3V3 and 2V5
3V3
5V, 3V3 SFP configuration

Setting Operating Environmental Comments
USB bus (TBC)
#N/A
#N/A
#N/A
#N/A
#N/A
Provide clock - PPS and trigger collec
#N/A
#N/A
#N/A
#N/A
#N/A
#N/A
#N/A
#N/A
#N/A
vide clock - PPS and trigger collection and controls
#N/A
#N/A
#N/A
Designation Refdes Quantity
SCB_V3_4 SCB_PCB
C1, C247, C292, C297, C300, C301, C311, C429, C430, C431,
C2012X5R0J226M
C432
11
C2, C3, C4, C75, C76, C85, C86, C263, C268, C269, C270,
C2012X5R0J226M
C271, C294, C295, C296, C302
16
C2012X5R0J226M C266, C283
2
C10, C68, C267, C275, C284, C287, C238, C255, C273, C274,
C276, C277, C303, C304, C322, C74, C84, C264, C318, C23,
C1608X5R1A475K
C71, C72, C91, C92, C93, C94, C95, C96, C218, C246, C256,
C312, C323 33
C104, C105, C106, C107, C108, C109, C110, C111, C112,
C113, C114, C115, C116, C117, C118, C119, C120, C121,
C1005X7R1C224K
C123, C124, C126, C127, C128, C129, C130, C131, C132,
C133, C134, C135, C136, C137
32
C1005X7R1E102K
0
C1608C0G1H330J 1
CC0603KRX7R9BB104 0
C1005C0G1H100C C166, C202, C204, C205, C314 5
CC0603KRX7R6BB224 C165, C168 2
C1608C0G1H680J C170
1
C1005C0G1H150J C19, C20 2
C1005X7R1H471K 0
C1005C0G1H270J C21, C22 2
B32529C1104K000 C214 1
C2012X5R1C226K C239, C248, C254, C257, C278, C279, C305, C306 8
ECJ-0EB1H272K C163, C206, C245, C262, C265, C282, C310 7
T520D227M010ATE018 C249, C258, C280, C307 4
T520D227M006ATE009 C259, C260, C288, C289,C290, C291, C427, C428 4
C1005X7R1E223K C5, C6, C7, C8, C9, C11, C12, C13, C14, C15, C16, C17, C18, 0
C24,C36,
C35, C25,C42,
C26,C46,
C29,C47,
C30,C55,
C31,C140,
C33, C34,
C144,C37, C38,
C151, C40,C156,
C155, C41,
C1608X5R0J106M 16
C44, C45, C52, C161,
C56, C57, C59,
C167, C60,C203,
C175, C100,C211
C141, C142, C143,
C1005X7R1E473K C146, C148, C159, C160,
C53,C162, C169, C171, C172, C173,
C54, C328
C174, C176, C177, C178, C180, C181, C183, C184, C186,
3
C1005X7R1C104K C187, C191, C192, C193, C194, C201, C207, C208, C209, 111
C43, C58,C212,
C210, C88, C89,
C213,C90, C99,
C215, C101,
C216, C102,
C217, C103,
C219, C122,
C220, C125,
C221,
C1005X7R1E103K C138, C139, C149, C150, C152, C153, C154, C157, C158,
C222, C223, C224, C225, C226, C227, C228, C229, C230, 28
C185,
C231, C189,
C232, C190,
C233, C195,
C234, C196,
C240, C197,
C241, C199,
C242, C327
C243, C244,
C1005X5R1C105K C61, C235,
C253, C236,
C261, C237,
C285, C250,
C286, C251,
C293, C252,
C298, C272,
C299, C281,
C309, C315
C316, 10
C317, C319, C320, C321, C324, C325, C326, C422
o.c. 0
C1005X5R1C474K C69, C70, C73, C83, C87 5
T520D337M006ATE025 C77, C78, C79, C80, C81, C82, C97, C98 8
1888250-1 CN1 1
KX15-20K4DE 0
BM02B-SRSS-TB(LF)(SN) CN3
UTCA_MCH_TONGUE3
0
1734035-1 0
TS4148 RZ D1, D2, D3, D4 4
LG L29K-G2J1-24-Z D11, D12, D13, D14 4
S2M-TP D16 1
BAT54A-G D5, D6, D9, D10 4
BAV99 D8, D15 2
SN74LVT125D IC1 1
AD8541AKSZ
ADCMP600BRJZ-R2 IC11
1
MC100LVEP14DTG IC12 1
CDCM61002RHBT IC13 1
AD9516-4BCPZ IC16
1
TMP100NA/250 IC17, IC18, IC19, IC20 4
DS1374U-33+ 0
DS90LV011ATMF IC21 1
FNETHE025 IC22, IC40 2
AT45DB642D-CNU IC25 1
SN74LVC1G32DBVR IC26 1
LM385M3-2.5/NOPB IC28 1
DS1374U-18+ 0
MT29F4G16ABBDAHC:D TR IC30 1
MAX3232CDBR IC31 1
AP7173-SPG-13 IC32, IC34, IC35, IC39, IC48 5
XC6VLX240T-1FFG1156C IC33 1
PC28F256P30BFA 0
MCP1802T-3002I/OT IC38, IC44 2
VM53S3-25.000-2.5/-30+75 IC4 1
LAN8720A-CP IC41 1
CY7C1314KV18-250BZXC 0
TPS51200DRCR 0
TPS53126RGET IC46, IC47 2
AD5662BRJZ IC5, IC8 2
MT47H32M16HR-25E IT:G TR IC50 1
AT91SAM9G45-CU IC6 1
FRETHE025 IC7 1
ICS83023AMILF IC9
1
QSS-048-01-L-D-DP QSS-075-01-L-D-A J1, J2 2
QSS-016-01-L-D-DP 0
DC10A 0
742792093 L1, L16, L17, L18
4
IHLP2525CZER1R5M01 L11, L13, L14, L15 4
BLM18KG221SN1D L2, L3, L4, L5, L6, L7, L8, L9, L12, L19, L20 11
P1, P3, P4, P7, P8

152123 5
P2
M22-5320305 1
0878321421 P5 1
SBH11-PBPC-D10-ST-BK P6 1
BG055-03A-1-0450-0530-0350-L-G 0
NDS331N Q1, Q2, Q3 3
CRCW0805100RFKEAHP R31, R32, R257, R258 4
ERJ-2RKF2201X R36, R38 2
ERJ-2RKF3002X R107, R175 2
RC0402FR-0722KL R116, R176, R206
R45, R47, R48, R49, R55, R100, R102, R110, R111, R117, R120,
3
ERJ-2RKF4701X R126, R132, R185, R189, R200, R202, R203, R208, R209, R232, 29
R237, R239, R240, R243, R248, R249, R252, R256
ERJ-2RKF33R0X R30, R63, R70, R78, R142, R143, R144, R146, R147, R151 10
ERJ-2RKF1501X R159, R186, R195, R196, R236 5
ERJ-2RKF4871X R178 1
o.c.
0
ERJ-2RKF4700X R20, R22, R33, R145 4
RC0603JR-070RL R177 1
ERJ-2RKF2490X 0
ERJ-2RKF9311X R228, R234 2
R42, R68, R71, R72, R73, R81, R82, R84, R85, R87, R88, R89,
ERJ-2RKF2000X 18
R91, R92, R93, R141, R246, R247
R29, R39, R59, R90, R171, R193, R218, R220, R223, R224,
ERJ-2RKF1000X 13
R225, R245, R250
R4, R5, R6, R11, R35, R37, R106, R128, R129, R138, R165,
ERJ-2RKF1002X R166, R167, R168, R169, R170, R181, R188, R190, R191, R198,
R199, R207, R211, R229, R231, R238, R242
28
CRCW060333R0FKEAHP R34, R41, R172, R173, R182, R183 6
R101, R103, R104, R105, R112, R113, R114, R115, R121, R124,
ERJ-2RKF1001X 13
R133, R136, R205
CRCW060349R9FKEAHP R40, R154, R155, R156, R157 5
R1, R46, R160, R161, R162, R163, R184, R217, R219, R221,
ERJ-2RKF3300X 12
R222, R226
ERJ-2GE0R00X R28, R152, R153, R187, R192, R210, R233, R251 8
ERJ-2RKF1003X R7, R8, R9, R10, R158 5
ERJ-2RKF49R9X R23, R24, R25, R26, R27, R75, R77, R174 8
ERJ-3EKF8200V R79 1
ERJ-3EKF3900V R80 1
ERJ-2RKF4121X R83, R98, R99, R108, R109, R118, R130, R148, R204 9
ERJ-2RKF5101X R86 1
EXB-E10C470J 0
MNR18E0APJ270 RP15, RP16, RP17, RP18, RP19, RP20 6
FSM6JSMA S1, S2 2
219-4MST 0
IRF9910Pbf T2, T3, T4, T5 4
H1260NL Tr1 1
1812WBT2_4LB 0
ABS09-32.768KHZ-T X1 1
7M-12.000MAAJ-T X2 1
GRPB032VWVN-RC P10 1
ABS09-32.768KHZ-7-T 0
IVT3200C 0
WBC1-1LB Tr3 1
ERJ-3EKF75R0V 0
ERJ-2RKF75R0X R69, R76, R94, R95, R140, R253, R254, R255 8
MC100EP52DTG U1 1
CRCW060320R0FKEAHP R21 1
Chromium_V1 N/A 1
HDRV14W65P254_2X7_1791X508X839P J9 1
CAPC1608X90N,CAPC1608X90N,CA
C1,C2,C3,C4,C5,C6,C7,C8,C9,C10,C11,C12,C1 67
CAPC1608X90N,CAPC1608X90N,C C66,C67,C68,C69 4
CAPC2012X94N C85 1
RESC1608X55N,RESC1608X55N,RE
R210,R212,R214,R216,R218,R220,R222,R224,R 47
RESC1608X55N R298 1
RESC1608X55N R118 1
RESC1608X55N,RESC1608X55N,R R119,R120,R121 3
RESC1608X55N,RESC1608X55N R116,R117 2
RESC1608X55N R123 1
RESC1608X55N R122 1
R4,R5,R6,R7,R8,R187,R188,R209,R211,R213,R 49
MOLEX_54819-5,MOLEX_54819-5 J3,J4 2
R189,R190,R191,R192,R193,R194,R195,R196, 20
R124,R125,R126,R127,R128,R129,R130,R131,R 63
R9,R10,R11,R12,R13,R14,R15,R16,R17,R18,R1 111
CAPC3225X279N C74,C75,C76,C77,C78,C79,C80,C81 8
RESC3216X65N,RESC3216X65N,R R1,R2,R3 3
CAPC3216X180N,CAPC3216X180N,C133,C134,C135,C136,C137,C138,C139,C140,C 40
CAPC1608X87N,CAPC1608X87N C91,C92 2
SWITCH_TYCO_FSMJSMA,SWITC S2,S3 2
CAPC1608X90N C86 1
INDC2012X130N,INDC2012X130N,I LB1,LB2,LB3,LB4,LB5,LB6,LB7,LB8,LB9,LB10, 44
,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,, L3,L4,L5,L6,L7,L8,L9,L10,L11,L12,L13,L14,L15, 40
CAPMP7360X380N,CAPMP7360X38C70,C71,C72,C73 4
CAPMP6032X280N,CAPMP6032X28C93,C94,C95,C96,C97,C98,C99,C100,C101,C10 40
TDK_ACM1513_ET L1 1
TEST_C150H80-1_ET,TEST_C150H8
TP1,TP2,TP3,TP4,TP5,TP6,TP7 7
SOP65P490X110-8N,SOP65P490X1U3,U4 2
SODFL3517X110N_ET D7 1
CTS_218-4LPST_ET S1 1
CAPC3216X160N_ET,CAPC3216X1C82,C83,C84 3
SOP65P640X110-24N,SOP65P640XU17,U18,U19 3
PSON50P100X145X50-6N_ET,PSON
D1,D2 2
BOURNS_SRP1265A_SERIES_ET L2 1
PHOENIX_1888687_ET J6 1
MOLEX_76047-5001,MOLEX_76047-J1_10,J11_20 2
KINGBRIGHT_APHB1608_SERIES, D_L1a,D_L1b,D_L2a,D_L2b,D_L3a,D_L3b,D_L4 40
KINGBRIGHT_APHB1608_SERIES, D5,D6 2
SAMTEC_QTS-048-02-L-D-DP-A,SAJ1,J2 2
LGA144S127P12X12_1500X1500X4U2 1
,SOP65P640X110-16N,SOP65P640XU6,U7,U8,U9,U10,U11,U12,U13,U14,U15,U16,U 12
QFN50P400X400X80-25N_ET1 U1 1
SOT95P285X140-3N,SOT95P285X14
T1,T2,T3 3
SOT95P280X145-6N_ET U5 1
MOLEX_70246-1004 J5 1
HDRV2W64P254_1x2_Molex_22-29-J7,J8,J10 3
SOT95P285X140-3N,SOT95P285X1T4,T5 2
SOT95P240X120-3N D3 1
CAPC3225X270N_ET,CAPC3225X2C87,C88,C89,C90 4
TO-277P650x115-3N_ET D4 1
Chronium PCB CHR_PCB 1
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Version/Value PART_NUMBER Other information / MANUFACTURDatasheet/RAMS A
SCB_V3_4 N/A N/A
12 Layers PCB
C2012X5R0J226M CC2012-0805 Digikey
22uF ±20% 6,3V X5R Capa
22uF ±20% 6,3V X5R Capa
22uF ±20% 6,3V X5R Capa
C1608X5R1A475K CC1608-0603 Digikey
4,7uF ±10% 10V X5R Capa
C1005X7R1C224K CC1005-0402 Digikey
220nF ±10% 16V X7R Capa

C1005X7R1E102K CC1005-0402 Digikey
1nF ±10% 25V X7R Capaci
33pF ±5% 50V COG Capac C1608C0G1H330J CC1608-0603 Digikey
CC0603KRX7R9BB104
100nF ±10% 50V X7R Capa CC1608-0603 Digikey
10pF ±5% 50V NP0 Capaci C1005C0G1H100C CC1005-0402 Digikey
CC0603KRX7R6BB224
220nF ±10% 10V X7R Capa CC1608-0603 DigiKey
68pF ±5% 50V COG Capac C1608C0G1H680J CC1608-0603 Digikey
15pF ±5% 50V NP0 Capaci C1005C0G1H150J CC1005-0402 Digikey
470pF ±10% 50V X7R CapaC1005X7R1H471K CC1005-0402 Digikey
27pF ±5% 50V NP0 Capaci C1005C0G1H270J CC1005-0402 Digikey
100nF ±10% 100V PolyesteB32529C1104K000 Farnell
22uF ±10% 16V X5R CapacC2012X5R1C226K CC2012-0805 Digikey

2,7nF ±10% 50V X7R Capa ECJ-0EB1H272K CC1005-0402 Digikey
T520D227M010ATE01
220uF ±20% 10V 18mOhm D Digikey
8
220uF ±20% 6,3V 9mOhmT530D227M010AHE00 D Digikey
6
22nF ±10% 25V X7R CapacC1005X7R1E223K CC1005-0402 Digikey
10uF ±20% 6,3V X5R Capa C1608X5R0J106M CC1608-0603 Digikey
47nF ±10% 25V X7R Capac

C1005X7R1E473K CC1005-0402 Digikey
100nF ±10% 16V X7R Capa

10nF ±10% 50V X7R Capac

C1005X7R1E103KCC1005-0402 Digikey
CC1005-0402 Digikey
1uF ±10% 16V X5R Capaci
C1005X5R1C105K
Capacitor o.c. CC1608-0603 Digikey
470nF ±10% 16V X5R Capa

330uF ±20% 6,3V 25mOhm

T520D337M006ATE025 D Digikey
TYCO_ETHERNET_188825
Low Profile uTCA Ethernet 1888250-1 Digikey
0-1
Multipin B2B Connector (pl KX15-20K4DE JAE_KX15_20P Digikey
BM02B-SRSS-TB(LF)
SH_CRIMP_1MM_2 Farnell
(SN)
Disconnectable Crimp Styl
UTCA_MCH_TONGUE2_3
UTCA_MCH_TONGUE3 N/A
_4
microTCA MTCA.0 standar
Mini USB Receptacle Type 1734035-1 USBB-G Farnell
High Speed Switching Dio TS4148 RZ CC1608-0603 Farnell
LED SMARTLED GREEN LG L29K-G2J1-24-Z CD1608-0603 DigiKey
Standard Diode 2A, 1KV, S2M-TP Digikey
Schottky Barrier Double BAT54A-G SOT23 Digikey
Silicon Switching Diode Ar BAV99 SOT-23 Farnell
Quad Buffer with 3-State SN74LVT125D PW014 Farnell
SOT65P210X110-5N Digikey
General-Purpose CMOS Ampl

AD8541AKSZ
ADCMP600BRJZ-R2 SOT23-5AL Digikey
Rail-to-Rail, Very Fast,

Low-Voltage 1:5 Differen MC100LVEP14DTG 948E-02_N DigiKey
Low Jitter Clock GeneratoCDCM61002RHBT QFN32_POWERPAD Farnell
QFN50P900X900X100-
Digikey
64M
Clock Generator 2.5GHz AD9516-4BCPZ
I2C Temperature Sensor TMP100NA/250 SOT23A-6L DigiKey
I2C, 32 BIT BINARY C DS1374U-33+ UMAX10 Digikey
Single High Speed DifferenDS90LV011ATMF MF05A_N Digikey
SMD oscillator 3.3V (Elfa) FNETHE025 SPXO DigiKey
64-megabit 2.7V, Dual-IntAT45DB642D-CNU 8CN3 DigiKey
Single 2-Input Positive-OSN74LVC1G32DBVR SOT23-5AL DigiKey
Micropower Voltage Refer

LM385M3-2.5/NOPB MF03A_N DigiKey
I2C, 32 BIT BINARY C DS1374U-18+ UMAX10 Digikey
NAND Flash 256Mx16,

MT29F4G16ABBDAHC:D
1. TR VFBGA63 Digikey
3-V to 5.5V Multichannel MAX3232CDBR SSOP16 DigiKey
1.5A Low Dropout Linera RAP7173-SPG-13 SOIC127P600-8AL Digikey
Virtex-6 LXT Platform XC6VLX240T-1FFG1156C

FP FF1156 CERN
BGA64C100P8X8_1300X1
NOR Flash Memory, 256Mb
PC28F256P30BFA Digikey
000X120
300 mA, High PSRR, Low
MCP1802T-3002I/OT
Q SOT-23-OT5_N DigiKey
VM53S3-25.000-2.5/-30+75VCTCXO_VM53S
VCTCXO 25MHz Oscillato RS
QFN50P400X400-
RMII Ethernet Transceiver LAN8720A-CP Digikey
24W4M
BGA165C100P11X15_130
18-Mbit (512Kx36) QDRII
CY7C1314KV18-250BZXC 0X1500X140 Digikey
SON50P300X300X100-
Sink/Source DDR TerminatTPS51200DRCR Digikey
11N-R175X250
QFN50P400X400X100-
Dual Synchronous Step-DoTPS53126RGET DigiKey
25N-S255
NanoDAC 16 Bits, SPI, 2.7 AD5662BRJZ SOT23-8 DigiKey
DDR2 SDRAM 8Mx16x4

MT47H32M16HR-25E
B IT:G TR BGA-84 DigiKey
ARM9 MCU 400 MHZ, RAM

AT91SAM9G45-CU TFBGA324 DigiKey
VCXO 25MHz Oscillator FRETHE025 vs-705 Digikey
TSOP65P490-8AN Digikey
350MHz Differential-to-LV ICS83023AMILF
High Speed Ground
QSS-048-01-L-D-DP
Plane So QSS-048-01-X-D-DP-A
QSS-075-01-L-D-A Samtec
QSS-016-01-X-D-DP-A Samtec
High Speed Ground Plane
QSS-016-01-L-D-DP
So
dc-10 Farnell
Power Jack 5A @ 12V DC10A
742792093 DigiKey
FERRITE BEAD 2200 OHM 742792093

Low Profile, High Curren
IHLP2525CZER1R5M01 IHLP2525 Digikey
220R@100MHz 2,2A 50mO
BLM18KG221SN1D 0603 Digikey
SMB_V-RJ45 Digikey
SMC Straight Connector 152123
HDR2X3 Digikey
Header, 6-Pin, Dual row, M22-5320305
CONN_HDR_SMD_2mm_
SMD Header, 7-Pin, Dual 0878321421 Digikey
2x7
Header, 10-Pin, Dual row,
SBH11-PBPC-D10-ST-BK HDR2X10 DigiKey
HDR1x3_BG055
BG055-03A-1-0450-0530-0350-L-G Farnell
N-Channel Logic Level Enh NDS331N SOT23-3 Digikey
100R ±1% 0.33W ±100ppm/

CRCW0805100RFKEAHP 0805 Digikey
2K2 ±1% 0.1W ±100ppm/°C

ERJ-2RKF2201X 0402 DigiKey
30K ±1% 0.1W ±100ppm/°C

0402 DigiKey
22K ±1% 0.063W ±100ppm/
RC0402FR-0722KL
4K7 ±1% 0.1W ±100ppm/°C
33R ±1% 0.1W ±100ppm/°C

ERJ-2RKF33R0X 0402 DigiKey
1K5 ±1% 0.1W ±100ppm/°C

4K87 ±1% 0.1W ±100ppm/°

2K43 ±1% 0.1W ±100ppm/°

6K81 ±1% 0.1W ±100ppm/°

12K1 ±1% 0.1W ±100ppm/°

0402 DigiKey, N/A
SMD Resistor o.c.

470R ±1% 0.1W ±100ppm/°
0R0 Ohm 1/10W 0603 Resi

RC0603JR-070RL 0603 DigiKey
249R ±1% 0.1W ±100ppm/°

9K31 ±1% 0.1W ±100ppm/°

200R ±1% 0.1W ±100ppm/°

2K8 ±1% 0.1W ±100ppm/°C

13K ±1% 0.1W ±100ppm/°C

100R ±1% 0.1W ±100ppm/°

0402 DigiKey
10K ±1% 0.1W ±100ppm/°C

ERJ-2RKF1002X
33R ±1% 0.25W ±100ppm/°
CRCW060333R0FKEAHP 0603 DigiKey
1K ±1% 0.1W ±100ppm/°CERJ-2RKF1001X 0402 DigiKey

49R9 ±1% 0.25W ±100ppm/
CRCW060349R9FKEAHP 0603 DigiKey
330R ±1% 0.1W ±100ppm/°

0R0 Ohm 1/10W 0402 ResiERJ-2GE0R00X 0402 DigiKey
100K ±1% 0.1W ±100ppm/°

49R9 ±1% 0.1W ±100ppm/°

820R ±1% 0.1W ±100ppm/°

ERJ-3EKF8200V 0603 DigiKey
390R ±1% 0.1W ±100ppm/°

ERJ-3EKF3900V 0603 DigiKey
4K12 ±1% 0.1W ±100ppm/°

5K1 ±1% 0.1W ±100ppm/°C

47R, 62.5mW Chip Resist EXB-E10C470J EXBE DigiKey

RESCAXS50P160X380X6
27R, 62.5mW Chip ResistoMNR18E0APJ270 DigiKey
0-16N
Push button FSM6JSMA SWITCH Farnell
4 Positions DIP SWITCH 219-4MST NHDS-8 Digikey
Dual N-Channel 20V 10A IRF9910Pbf SOIC127P600X175-8N DigiKey
Ethernet Trafo (TME) H1260NL H1260NL Digikey
SMT Mini WideBand Trans1812WBT2_4LB 1812WBT2_4LB Coilcraft
Crystal Oscillator 32768 H

ABS09-32.768KHZ-T XTAL_32k Newark
SMD Crystal 7M Series 1 7M-12.000MAAJ-T OSC_IQD_CFPS-39 DigiKey
THT Header, 3-Pin, Dual GRPB032VWVN-RC

r MHDR2X3_1.27mm DigiKey
Crystal 32.768 Hz 7,0pFABS09-32.768KHZ-7-T ABS09 Farnell
SMD Temperature CompensaIVT3200C OSC_RAKON_IVT3200C
SMT Mini WideBand Trans WBC1-1LB SMT-6P150P Coilcraft
75R ±1% 0.1W ±100ppm/°C

ERJ-3EKF75R0V 0603 DigiKey
75R ±1% 0.1W ±100ppm/°C

Differential Data and Cloc MC100EP52DTG Digikey
20R ±1% 0.25W ±100ppm/°

CRCW060320R0FKEAHP Digikey
12 Layers PCB Chromium_V1 N/A N/A
Header 2x7P, HDRV14W65P254_2X7_1791X508X839P

THT, pitch THT Connector Molex
90N,CAPC1608X90N,CAPC1608X90N,CAPC1608X90N,CAPC1608X90N,CAPC1608X90N,CAPC1608X90N,CAPC1608X90N,CAPC1
General purpose multilay 603 AVX
General
CAPC1608X90N,CAPC1608X90N,CAPC1608X90N,CAPC1608X90N
purpose multilay 603 AVX
General purpose multilay CAPC2012X94N 805 AVX
55N,RESC1608X55N,RESC1608X55N,RESC1608X55N,RESC1608X55N,RESC1608X55N,RESC1608X55N,RESC1608X55N,RESC1
General purpose Rsmd 06 603 Multicomp
General purpose Rsmd 06 RESC1608X55N 603 Multicomp
General purpose
RESC1608X55N,RESC1608X55N,RESC1608X55N603
Rsmd 06 Multicomp
General purpose Rsmd
RESC1608X55N,RESC1608X55N
06 603 Multicomp
USB, 1x5 pins, 0.8mm
MOLEX_54819-5,MOLEX_54819-5
pitch SMT Connector Molex
C1608X55N,RESC1608X55N,RESC1608X55N,RESC1608X55N,RESC1608X55N,RESC1608X55N,RESC1608X55N,RESC1608X55N
225X279N,CAPC3225X279N,CAPC3225X279N,CAPC3225X279N,CAPC3225X279N,CAPC3225X279N,CAPC3225X279N
General purpose MLCC 1 1210 AVX
General purpose
RESC3216X65N,RESC3216X65N,RESC3216X65N
Rsmd 12 1206 Multicomp
216X180N,CAPC3216X180N,CAPC3216X180N,CAPC3216X180N,CAPC3216X180N,CAPC3216X180N,CAPC3216X180N,CAPC3216
Capacitor 4u7F 50V X5R 1206 Kemet
General purpose MLCC
CAPC1608X87N,CAPC1608X87N
06 603 Yageo
TactileSWITCH_TYCO_FSMJSMA,SWITCH_TYCO_FSMJSMA
Switch, 6x6mm, S TYCO ELECTRONICS
CAPACITOR, 0603, 4.7uF,CAPC1608X90N 603 TDK
2012X130N,INDC2012X130N,INDC2012X130N,INDC2012X130N,INDC2012X130N,INDC2012X130N,INDC2012X130N,INDC2012X13
Ferrite Bead 0805 220 Oh 805 Murata
SMD inductor power 1uH
,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,, 805 Taiyo Yuden
CAPMP7360X380N,CAPMP7360X380N,CAPMP7360X380N,CAPMP7360X380N
Elco, Tant., 100uF/25V. TA Case V AVX
X280N,CAPMP6032X280N,CAPMP6032X280N,CAPMP6032X280N,CAPMP6032X280N,CAPMP6032X280N,CAPMP6032X280N,CAP
Elco, Tant., 10uF/25V, Ca Case C AVX
Common Mode Line FilterTDK_ACM1513_ETSMT TDK
50H80-1_ET,TEST_C150H80-1_ET,TEST_C150H80-1_ET,TEST_C150H80-1_ET,TEST_C150H80-1_ET,TEST_C150H80-1_ET
Testpoint, Plated, 0.80mm
Level translating
SOP65P490X110-8N,SOP65P490X110-8N
I2C-bus MSOP-8 NXP
400W Transient VoltageSODFL3517X110N_ET
S SODFL NXP
Half Pitch, SMD DIP SwitCTS_218-4LPST_ETSOIC-8 CTS
Middle
CAPC3216X160N_ET,CAPC3216X160N_ET,CAPC3216X160N_ET
voltage CGA serie 1206 TDK
SOP65P640X110-24N,SOP65P640X110-24N,SOP65P640X110-24N
UltraPSON50P100X145X50-6N_ET,PSON50P100X145X50-6N_ET
low capacitance doubl SON-6 NXP
Inductor, 10uH, 20%,
BOURNS_SRP1265A_SERIES_ET
shie SMT Bourns
PCB Terminal Block, 16A/
PHOENIX_1888687_ET
THT Connector Phoenix
2-by-5 Multiport
MOLEX_76047-5001,MOLEX_76047-5001
Connecto THT Molex
8_SERIES,KINGBRIGHT_APHB1608_SERIES,KINGBRIGHT_APHB1608_SERIES,KINGBRIGHT_APHB1608_SERIES,KINGBRIGHT
Led dual, smt, Green Supe 603 Kingbright
KINGBRIGHT_APHB1608_SERIES,KINGBRIGHT_APHB1608_SERIES
Led dual, smt, Green Hyp 603 Kingbright
Differential
SAMTEC_QTS-048-02-L-D-DP-A,SAMTEC_QTS-048-02-L-D-DP-A
Pairs HS Termi SMT Connector Samtec
?Module, dual 13A
LGA144S127P12X12_1500X1500X451
or sin LGA-144 Linear Technology
40X110-16N,SOP65P640X110-16N,SOP65P640X110-16N,SOP65P640X110-16N,SOP65P640X110-16N,SOP65P640X110-16N,SOP
I/O port, I2C-bus and SMBus TSSOP-16 NXP
USB-to-Dual-UARTQFN50P400X400X80-25N_ET1
Bridge QFN-24_05 Silicon Labs
N-Channel
SOT95P285X140-3N,SOT95P285X140-3N,SOT95P285X140-3N
Enhancement SOT23 Diodes
Temperature Sensor With
SOT95P280X145-6N_ET
SOT23-6 Texas Instruments
10p shrouded header strai
MOLEX_70246-1004THT Molex
4_1x2_Molex_22-29-2021,HDRV2W64P254_1x2_Molex_22-29-2021,HDRV2W64P254_1x2_Molex_22-29-2021
2p straight THT Locking h THT Molex
P-Channel Mosfet
SOT95P285X140-3N,SOT95P285X140-3N
SC-59 Diodes
Zener 5V1 TO236 SOT95P240X120-3NSOT95 Fairchild
CAPC3225X270N_ET,CAPC3225X270N_ET,CAPC3225X270N_ET,CAPC3225X270N_ET
Ceramic Cap 100uF 6V3 SMD-1210 Murata
Skottky Diode 10A 60VTO-277P650x115-3N_ET
L TO-277-3 MCC
Mission duration:
Product Function Function detail

12 layers, 4866 pads,
SCB common functions Provide common functions for SCB 3110 via
FPGA power supply (1V,
SCB_decoupling SCB power filtering 1V2 and 1V5)

FPGA power supply (1V8
SCB_decoupling SCB power filtering and 2V5)

FPGA power supply (3V3)
SCB_decoupling SCB power filtering

FPGA power supply (5V)

SCB_clock SCB generate clock External loop filter for PLL
in AD9516
SCB provide ethernet communication
SCB_Communicate interface bypass capacitor and USB
bias voltage (C314)
SCB_clock SCB generate clock External loop filter for PLL
in AD9516
External loop filter for PLL
SCB_clock SCB generate clock in AD9516
SCB_clock SCB generate clock ARM Clocking
SCB_clock SCB generate clock ARM clocking

SCB_Communicate interface Ethernet communication
SCB_decoupling SCB power filtering power regulators


SCB_decoupling SCB power filtering signal adaptation
SCB_clock SCB generate clock

SCB_decoupling SCB power filtering signal adaptation
signal adaptation

SCB_decoupling SCB power filtering 1V0 decoupling
SCB_Connectors Provide scb interface
SCB_Power Provide DC DC convertion for SCB

SCB_Communicate interface
SCB_Power Provide DC DC convertion for SCB LDO regulator 3V3 input
SCB_Process SCB Process data



SCB_monitoring SCB monitoring


SCB_JTAG Provide SCB programming interface


SCB_clock SCB generate clock DAC for clock frequency
setting
SCB_JTAG Provide SCB programming interface USB port



SCB_drivers Provide SCB electrical interface

SCB common functions Provide common functions for SCB





SCB_JTAG Provide SCB programming interface


CHR_Common CHR common functions lke PCB
CHR provide I2C communication with
CHR_WR_LINK SCB
CHR_USB CHR provide USB interface
CHR_POWER CHR convert power
CHR_SFP CHR provide SFP interface (optical)
CHR_GPIO CHR provide GPIO interface
CHR_WR_LINK SCB
CHR_SFP CHR provide SFP interface (optical) Reliability model to be
confirmed
CHR_GPIO CHR provide GPIO interface No FIT : Test point
CHR_WR_LINK SCB
CHR_GTX Optic SFP connection to FPGA
1011.2687595
Years Hours
15 131400
Menu > données > validation>autoris
Failure Failure
quantity quantity for
/product for the project
Reliability model FIT Total FIT 15 years for 15 years Rating/rating max
SCB: PCB 0 0 0 0
CAPA_CER_HCV_0,1_Typ 0.22845947 2.51305422 0.0003302153 0.151899049 0.04285714285714
CAPA_CER_HCV_0,1_Typ 0.22845947 3.65535159 0.0004803132 0.2209440713 0.05714285714286
CAPA_CER_HCV_0,1_Typ 0.22845947 0.45691895 6.003915E-05 0.0276180089 0.08571428571429
CAPA_CER_HCV_0,1_Typ 0.22845947 7.53916265 0.000990646 0.455697147 0.14285714285714
CAPA_CER_MCV_0,1_Typ0.04512753 1.44408091 0.0001897522 0.0872860265 0.075
0 0 0 0
CAPA_CER_HCV_0,1_Typ 0.22845947 0.22845947 3.001957E-05 0.0138090045 0.066
CAPA_CER_HCV_0,1_Typ 0.22845947 0 0 0
CAPA_CER_LCV_0,1_Typ 0.02406802 0.12034008 1.581269E-05 0.0072738355 0.066
CAPA_CER_MCV_0,1_Typ0.04512753 0.09025506 1.185951E-05 0.0054553767 0.33
CAPA_CER_LCV_0,1_Typ 0.02406802 0.02406802 3.162537E-06 0.0014547671 0.0066

CAPA_CER_LCV_0,1_Typ 0.02406802 0.04813603 6.325074E-06 0.0029095342
CAPA_CER_HCV_0,1_Typ 0.22845947 0 0 0
CAPA_CER_LCV_0,1_Typ 0.02406802 0.04813603 6.325074E-06 0.0029095342
CAPA_CER_HCV_0,1_Typ 0.22845947 0.22845947 3.001957E-05 0.0138090045 0.033
CAPA_CER_HCV_0,1_Typ 0.22845947 1.82767579 0.0002401566 0.1104720356 0.14285714285714
CAPA_CER_HCV_0,1_Typ 0.22845947 1.59921632 0.000210137 0.0966630312 0.066
CAPA_tantal_0,3_IP (KM 3.68 14.72 0.001934208 0.88973568 0.3125
CAPA_tantal_0,1_IP (KM 0.175316 0.701264 9.214609E-05 0.0423872012 0.15625
(KM3NET_DS) 0 0 0 0
CAPA_CER_HCV_0,1_Typ 0.22845947 3.65535159 0.0004803132 0.2209440713 0.09428571428571
CAPA_CER_LCV_0,1_Typ 0.02406802 0.07220405 9.487612E-06 0.0043643013 0.1
CAPA_CER_MCV_0,1_Typ0.04512753 5.00915566 0.0006582031 0.3027734045 0.066
CAPA_CER_MCV_0,1_Typ0.04512753 1.2635708 0.0001660332 0.0763752732 0.066
CAPA_CER_HCV_0,1_Typ 0.22845947 2.28459474 0.0003001957 0.1380900445 0.1

RES_CHIP_ID_0,2 (KM3NET_DS) 0.00133581 0 0 0
CAPA_CER_HCV_0,1_Typ 0.22845947 1.14229737 0.0001500979 0.0690450223 0.1
CAPA_CER_HCV_0,1_Typ2_NIP
(KM3NET_DS) 0.22845947 1.82767579 0.0002401566 0.1104720356 0.1
CON_RECT_THOLE_8
(KM3NET_DS) 1.10002343 1.10002343 0.0001445431 0.0664898162
CON_RECT_TH_20 (KM3NET_DS) 1.73928976 0 0 0
CON_RECT_SMD_1 (KM3 0.38891701 0.38891701 5.11037E-05 0.0235077
Zero FIT (KM3NET_DS) 0 0 0 0

zero fit (KM3NET_DS) 0 0 0 0
FMC: SN65LVDS1(U1,U5, 0.92216256 3.68865024 0.0004846886 0.222956775
FMC: SN65LVDT2(U2,U3,U0.42116176 1.68464705 0.0002213626 0.1018268062
DIS_SMD_SIGDIODES_NI 0.01129263 0.01129263 1.483852E-06 0.0006825718
DIS_SOD323_schotky_NI 0.1354638 0.54185518 7.119977E-05 0.0327518945
CLBV2: Philips SN74LVT 0.31163207 0.31163207 4.094845E-05 0.0188362888
0 0 0 0
IC_SOT23-5_Dig_NID (K 0.20029164 0.20029164 2.631832E-05 0.0121064281

IC_TSSOP20_Flash_NID 0.57226107 0.57226107 7.51951E-05 0.0345897479
CLBV2: Texas Instrumen 1.17313494 1.17313494 0.0001541499 0.0709089683
(KM3NET_DS) 0 0 0 0
IC_SOT23-6_Dig_NID (K 0.20029172 0.80116686 0.0001052733 0.0484257299
0 0 0 0
(KM3NET_DS) 0 0 0 0
CLBV2: 25 MHz Mercury E 21.1905579 42.3811158 0.0055688786 2.5616841647
Central digital functions 127.709421 127.709421 0.0167810179 7.7192682191
CLBV2: Texas Instrumen 0.31163319 0.31163319 4.09486E-05 0.0188363565
IC_SO8_DIG_NID (KM3NE 0.20029134 0.20029134 2.631828E-05 0.0121064098
(KM3NET_DS) 0 0 0 0
Central digital functions 142.734058 142.734058 0.0187552553 8.6274174214
BPS: MAX3232IPW(U2) ( 1.18297762 1.18297762 0.0001554433 0.0715038995
PB: LP2981AIM5-3.3 Vreg, 0.93397892 4.66989458 0.0006136241 0.2822671077
IC_XC6VLX240T (KM3NE 24 24 0.0031536 1.450656
(KM3NET_DS) 0 0 0 0
PB: LP2981AIM5-3.3 Vreg, 0.93397892 1.86795783 0.0002454497 0.1129068431
Peripheral digital function 57.4398072 57.4398072 0.0075475907 3.4718917039
(KM3NET_DS) 0 0 0 0
(KM3NET_DS) 0 0 0 0
PB: TPS71501DCKR Vreg a1.13540559 2.27081117 0.0002983846 0.1372569105
Central digital functio 86.3916669 172.783334 0.0227037301 10.443715826
CLBV2: Analog Devices 0.33378186 0.33378186 4.385894E-05 0.0201751107
(KM3NET_DS) 0 0 0 0
IC_SO8_DIG_NID (KM3NE 0.20029134 0.20029134 2.631828E-05 0.0121064098

Connecteur wrapping ou in 3.11666101 6.23332202 0.0008190585 0.3767669163
(KM3NET_DS) 0 0 0 0
(KM3NET_DS) 0 0 0 0
CLBV2: 4,7µH Vishay I 0.48514748 1.94058992 0.0002549935 0.1172970169

CLBV2: 4,7µH Vishay I 0.48514748 1.94058992 0.0002549935 0.1172970169
CLBV2: BLM21PG221SN1 0.48514748 5.33662227 0.0007012322 0.3225667965

Connecteur wrapping ou in 0.97050055 0 0 0
Transistor Non Hermetic 0.30004057 0.90012172 0.000118276 0.0544069572
RES_CHIP_ID_0,2 (KM3N 0.00133581 0.00534326 7.021038E-07 0.0003229678 0.0009
BPS: ERJ6GEYJ222V- 220 0.03708082 0.07416163 9.744839E-06 0.0044826258
Generic resistor ERJ (KM 0.03708082 0.07416163 9.744839E-06 0.0044826258
CLBV2: 10k CR0603-FX- 0.00070845 0.00212534 2.7927E-07 0.0001284642

Generic resistor ERJ (KM 0.03708082 1.07534368 0.0001413002 0.0649980736
(KM3NET_DS) 0 0 0 0
CLBV2: 10k CR0603-FX- 0.00070845 0.00070845 9.309002E-08 4.282141E-05
Generic resistor ERJ (KM 0.03708082 0 0 0

CLBV2: 1K CR0603-JW- 0.00081297 0.0048778 6.40943E-07 0.0002948338
CLBV2: 1K CR0603-JW- 0.00081297 0.00406483 5.341192E-07 0.0002456948
(KM3NET_DS) 0 0 0 0
RES_ARRAY_ID_0,2 (KM 0.00358338 0.02150027 2.825135E-06 0.0012995621
Push button, Switch, Inver 12.0995367 24.1990735 0.0031797583 1.4626887985
(KM3NET_DS) 0 0 0 0
IC_SO8_Analog-Hybrid_I 2.25150373 9.00601492 0.0011833904 0.544359566
IC_SOIC16_Analog-Hybri 1.82527068 1.82527068 0.0002398406 0.1103266611
(KM3NET_DS) 0 0 0 0
wrapping or insertion conn 3.8269225 3.8269225 0.0005028576 0.2313145036
(KM3NET_DS) 0 0 0 0
(KM3NET_DS) 0 0 0 0
Transformer (KM3NET_ 0.4228341 0.4228341 5.55604E-05 0.0255577845
(KM3NET_DS) 0 0 0 0
IC_TSSOP8_DIG_ID (KM 0.31163126 0.31163126 4.094835E-05 0.0188362398
CLBV2: 1K CR0603-JW- 0.00081297 0.00081297 1.068238E-07 4.913897E-05
SCB: PCB (KM3NET_DS) 0.17398107 0.17398107 2.286111E-05 0.0105161116
PB: HDR 2.54A 5 TE Conne1.08701203 1.08701203 0.0001428334 0.0657033551

CAPA_CER_MCV_0,1_Typ0.04512753 3.0235444 0.0003972937 0.182755118
CAPA_CER_MCV_0,3_Typ1.21578191 4.86312764 0.000639015 0.2939468871
CAPA_CER_LCV_0,1_Typ 0.02406802 0.02406802 3.162537E-06 0.0014547671
CAPA_CER_HCV_0,3_Typ 6.11517865 48.9214292 0.0064282758 2.9570068667 0.34285714285714
CAPA_CER_HCV_0,1_Typ 0.22845947 9.13837897 0.001200783 0.5523601782
CAPA_CER_LCV_0,1_Typ 0.02406802 0.04813603 6.325074E-06 0.0029095342
Push button, Switch, Inver 12.0995367 24.1990735 0.0031797583 1.4626887985
CAPA_CER_HCV_0,3_Typ 6.11517865 6.11517865 0.0008035345 0.3696258583
CLBV2: BLM21PG221SN1 0.48514748 21.3464891 0.0028049287 1.290267186
CLBV2: BLM21PG221SN1 0.48514748 19.4058992 0.0025499352 1.1729701691
CAPA_tantal_0,5_IP (KM 16.8 67.2 0.00883008 4.0618368
CAPA_tantal_0,1_IP (KM 0.175316 7.01264 0.0009214609 0.4238720122 0.09428571428571
PB: FILT BNX022-01 (F1) 0.48514748 0.48514748 6.374838E-05 0.0293242542
Zero FIT (KM3NET_DS) 0 0 0 0
PB: PCA9515ADGKR Dual bi
0.19384926 0.38769853 5.094359E-05 0.0234340498
PTVS12VS1UR (KM3NET_ 0 0 0 0
CLBV2: Tyco 1-1571983- 1.66047479 1.66047479 0.0002181864 0.1003657383
CAPA_CER_HCV_0,1_Typ 0.22845947 0.68537842 9.005872E-05 0.0414270134
PB: PCA9515ADGKR Dual bi
0.19384926 0.58154779 7.641538E-05 0.0351510747
CLBV2: Littelfuse SP05 0.06740137 0.13480274 1.771308E-05 0.008148017
CLBV2: BLM21PG221SN1 0.48514748 0.48514748 6.374838E-05 0.0293242542
CON_CI_TH_0P10P (KM3 2.45972717 2.45972717 0.0003232081 0.1486757488
CON_CI_TH_20P50P (KM 5.50011715 11.0002343 0.0014454308 0.6648981618
CLBV2: LG R971 LED GR 0.09231873 3.69274934 0.0004852273 0.2232045412
CLBV2: LG R971 LED GR 0.09231873 0.18463747 2.426136E-05 0.0111602271
CON_CI_SMD_10P20P (K 5.79763253 11.5952651 0.0015236178 0.7008642012
IC_BGA484_FPGA_ID_35° 31.2877305 31.2877305 0.0041112078 1.8911555829
OCTOPUS LARGE: PCA9548.3800433 100.56052 0.0132136523 6.0782800474
CLBV2: Silicon Labs C 0.24512358 0.24512358 3.220924E-05 0.0148162496
PB: BSS138PW N-MOSFET3.59236611 10.7770983 0.0014161107 0.6514109314
CLBV2: Maxim DS18B20U 0.13377732 0.13377732 1.757834E-05 0.0080860362
PB: BSS138PW N-MOSFET3.59236611 7.18473222 0.0009440738 0.4342739543
OM12V_NIKHEF : DZ2J06 0.06740249 0.06740249 8.856687E-06 0.0040740758
CAPA_CER_HCV_0,3_Typ 6.11517865 24.4607146 0.0032141379 1.4785034333 0.33
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0 0 0 0
0 0 0 0
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0 0 0 0
0 0 0 0
0 0 0 0
0 0 0 0
0 0 0 0
0 0 0 0
0 0 0 0
0 0 0 0
0 0 0 0
0 0 0 0
0 0 0 0
0 0 0 0
0 0 0 0
0 0 0 0
0 0 0 0
0 0 0 0
0 0 0 0
0 0 0 0
0 0 0 0
0 0 0 0
0 0 0 0
0 0 0 0
0 0 0 0
0 0 0 0
0 0 0 0
0 0 0 0
0 0 0 0
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0 0 0 0
0 0 0 0
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0 0 0 0
0 0 0 0
0 0 0 0
0 0 0 0
0 0 0 0
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0 0 0 0
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0 #REF! #REF!
0 #REF! #REF!
0 #REF! #REF!
0 #REF! #REF!
0 #REF! #REF!
0 #REF! #REF!
0 #REF! #REF!
0 #REF! #REF!
0 #REF! #REF!
0 #REF! #REF!
0 #REF! #REF!
0 #REF! #REF!
données > validation>autoriser pour créer une liste de choix
Component
Component
type sub-category(for
Standard
rating) rating Rating check
#N/A #N/A #N/A
Ceramic capacitors
[ECCC] Capacitor, Ceramic 0.5 OK
Ceramic capacitors
Ceramic capacitors
Ceramic capacitors
Ceramic capacitors
#N/A #N/A #N/A

Ceramic capacitors
Ceramic capacitors
[ECCC] #N/A #N/A
Ceramic capacitors
Ceramic capacitors
Ceramic capacitors
Ceramic capacitors
Ceramic capacitors
[ECCC] #N/A #N/A
Ceramic capacitors
Ceramic capacitors
Ceramic capacitors
Ceramic capacitors
TantalumÊcapacito
rs [ECTC] Capacitor, Tantale 0.5 OK
TantalumÊcapacito
rs [ECTC] Capacitor, Tantale 0.5 OK
#N/A #N/A #N/A
Ceramic capacitors
Ceramic capacitors
Ceramic capacitors
Ceramic capacitors
Ceramic capacitors
Resistors
[ECRE] #N/A #N/A
Ceramic capacitors
Ceramic capacitors
[ECCC] Capacitor, Tantale 0.5 OK
Connectors
[ECCO] #N/A #N/A
Connectors
[ECCO] #N/A #N/A
Connectors
[ECCO] #N/A #N/A
0 #N/A #N/A
0 #N/A #N/A
Integrated Circuits
[ECIC] #N/A #N/A
Integrated Circuits
[ECIC] #N/A #N/A
Discrete semicondu
ctors [ECDS] #N/A #N/A
Discrete semicondu
Discrete semicondu
Integrated Circuits
[ECIC] #N/A #N/A
#N/A #N/A #N/A
Integrated Circuits
[ECIC] #N/A #N/A
Integrated Circuits
[ECIC] #N/A #N/A
Integrated Circuits
[ECIC] #N/A #N/A
#N/A #N/A #N/A

Integrated Circuits
[ECIC] #N/A #N/A
Piezoelectric #N/A #N/A #N/A

components: Oscill
#N/A #N/A #N/A
ators and Quartz
[ECPZ] #N/A #N/A
COTS Board #N/A #N/A
Integrated Circuits
[ECIC] #N/A #N/A
Integrated Circuits
[ECIC] #N/A #N/A
#N/A #N/A #N/A
Integrated Circuits
[ECIC] #N/A #N/A
Integrated Circuits
[ECIC] #N/A #N/A
Integrated Circuits
[ECIC] #N/A #N/A
Piezoelectric #N/A #N/A #N/A

Integrated Circuits
components:
[ECIC] Oscill #N/A #N/A
ators and Quartz
[ECPZ] #N/A #N/A
#N/A #N/A #N/A
#N/A #N/A #N/A
Integrated Circuits
[ECIC] #N/A #N/A
Integrated Circuits
[ECIC]
Piezoelectric #N/A #N/A
components: Oscill
#N/A #N/A #N/A
ators and Quartz
[ECPZ] #N/A #N/A
Integrated Circuits
[ECIC] #N/A #N/A
Connectors
[FCCO] #N/A #N/A
#N/A #N/A #N/A
#N/A #N/A #N/A
Magnetic
Components: Induc
Magnetic
tors and Transform
Components:
ers [ECIN] Induc #N/A #N/A
tors and Transform
ers [ECIN] #N/A #N/A
Magnetic
Components: Induc
tors and Transform
ers [ECIN] #N/A #N/A
Connectors
[FCCO] #N/A #N/A
Connectors
[FCCO] #N/A #N/A
Connectors
[FCCO] #N/A #N/A
Connectors
[FCCO] #N/A #N/A
Connectors
Discrete
[FCCO] #N/A #N/A
semiconductors
[PCDS] #N/A #N/A
Resistors
[ECRE] #N/A #N/A
Resistors
[ECRE] #N/A #N/A
Resistors
[ECRE] #N/A #N/A
Resistors
[ECRE] #N/A #N/A
Resistors
[ECRE] Not Applicable 1 OK
Resistors
Resistors
Resistors
Resistors
Resistors
Resistors
#N/A Not Applicable 1 OK

Resistors
Resistors
Resistors
Resistors
Resistors
Resistors
Resistors
Resistors
Resistors
Resistors
Resistors
Resistors
Resistors
Resistors
Resistors
Resistors
Resistors
Resistors
Resistors
Resistors
Resistors
Switches
[FCSW] Not Applicable 1 OK
Integrated Circuits
[ECIC] Not Applicable 1 OK
Integrated Circuits
[ECIC]
Piezoelectric Not Applicable 1 OK
components: Oscill
Piezoelectric
ators and Quartz
components:
[ECPZ] Oscill Not Applicable 1 OK
ators and Quartz
[ECPZ] Not Applicable 1 OK
Connectors
[FCCO] Not Applicable 1 OK
Magnetic #N/A Not Applicable 1 OK

Components: Induc
tors and Transform
ers [FCIN] Not Applicable 1 OK
Resistors
Integrated Circuits
Resistors
Printed
[ECRE] circuit Not Applicable 1 OK
board (PCB)
[ECPC] Connector Power #N/A #N/A
Connectors
[ECCO] Not Applicable 1 OK
Ceramic capacitors
[ECCC] Not Applicable 1 OK
Ceramic capacitors
Ceramic capacitors
Resistors
Resistors
Resistors
Resistors
Resistors
Resistors
Resistors
Resistors
Resistors
Resistors
Resistors
Resistors
Ceramic capacitors
Resistors
Ceramic capacitors
Ceramic capacitors
Switches
[FCSW]
Magnetic Not Applicable 1 OK
Ceramic capacitors
Components:
[ECCC] Induc Not Applicable 1 OK
Magnetic
tors and Transform
Components:
ers [ECIN] Induc Not Applicable 1 OK
tors and Transform
ers [ECIN] Not Applicable 1 OK
TantalumÊcapacito
rs [ECTC]
TantalumÊcapacito
Components:
rs [ECTC] Induc Capacitor, Tantale 0.5 OK
tors and Transform
0 Not Applicable 1 OK
Integrated Circuits
Switches
[ECSW] Not Applicable 1 OK
Ceramic capacitors
Integrated Circuits
[ECIC]
Discrete semicondu
Components:
ctors [ECDS]Induc Not Applicable 1 OK
tors and Transform
Connectors
Connectors
Light
[ECCO]Emitting Not Applicable 1 OK
Diode (LED)
Light
[ECLE]Emitting Not Applicable 1 OK
Diode (LED)
[ECLE] Not Applicable 1 OK
Connectors
Integrated Circuits
Integrated Circuits
Integrated Circuits
Discrete semicondu
ctors [ECDS] Not Applicable 1 OK
Integrated Circuits
Connectors
Connectors
Discrete semicondu
Discrete semicondu
Ceramic capacitors
Discrete semicondu
Remark
Proposed C2012X5R1V226M125AC (22uF ±20% 35V Ceramic Capacitor)
Proposed GRM188R6YA475KE15D (4.7uF ±20% 35V Ceramic Capacitor)

Proposed T59EE227M016C0025 (220uF ±20% 16V 25mOhm Tantalum Capacitor)
Proposed T59EE227M016C0025 (220uF ±20% 16V 25mOhm Tantalum Capacitor)
Proposed GRM188R6YA106MA73D (10uF ±20% 35V Ceramic Capacitor)
Proposed C1005X7R1H104M050BB (0.1uF ±20% 50V Ceramic Capacitor)
Proposed UMK105CBJ105MV-F (1uF ±20% 50V Ceramic Capacitor)
Proposed C1005X5R1E474K050BB (0.47 uF ±10% 25V Ceramic Capacitor)

Proposed 10TPE330M (330uF ±20% 10V 25mOhm Tantalum Capacitor)
ProposedGMK325BJ226MM-P. 22uF +20%, 100V Ceramic Capacitor
Proposed T491C106M035AT 10uF 35 V 20% 1.6mOhm Tantalum Capacitor

Proposed C4532X5R1A107M. 100uF +20% 10V Ceramic Capacitor
Years
Mission
15
duration:
Set the mission duration inside fun

sheet
System loss
Replaceability? Product
failures %
1 100 N ORCA/ARCA Phase 1

2 100 N Building Block
3 100 N DU
4 100 N SCB
5 100 N SCB_decoupling
6 100 N SCB_Connectors
7 100 N SCB common functions
8 100 N SCB_clock
9 100 N SCB_Process
10 100 N SCB_Communicate
11 100 N SCB_Power
12 100 N SCB_JTAG
13 100 N SCB_display
14 100 N SCB_monitoring
15 100 N SCB_drivers
16 100 N CHR_WR_LINK
17 100 N CHR_GTX
18 100 N CHR_SFP
19 100 N CHR_GPIO
20 100 N CHR_POWER
21 100 N CHR_USB
22 100 N CHR_Common
23 100 N CHROMIUN
24 100 N WRS
25 100 N DU base
26 100 N DOM
27
28
29
30
31
32
33
34
35
36
37
38
39
40
41
42
43
44
45
46
47
48
49
50
51
52
53
54
55
56
57
58
59
60
61
62
63
64
65
66
67
68
69
70
71
72
73
74
75
76
Hours
131400
Set the mission duration inside functional analysis

sheet
Product integrated
Quantity in the upper level Unit FIT
inside (next upper level
assembly (intermediate calcul)
name)
2 KM3NET
1 ORCA/ARCA Phase 1
115 Building Block
1 WRS
1 SCB 49.6
1 SCB 16.4
1 SCB 6.9
1 SCB 303.5
1 SCB 168.1
1 SCB 189.0
1 SCB 33.8
1 SCB 25.4
1 SCB
1 SCB 0.8
1 SCB 0.9
1 CHROMIUN 25.7
1 CHROMIUN 11.6
1 CHROMIUN 74.6
1 CHROMIUN 109.2
1 CHROMIUN 203.4
1 CHROMIUN 11.1
1 CHROMIUN 0.2
1 WRS
2 DU base
1 DU
18 DU
NA
NA
NA
NA
NA
NA
NA
NA
NA
NA
NA
NA
NA
NA
NA
NA
NA
NA
NA
NA
NA
NA
NA
NA
NA
NA
NA
NA
NA
NA
NA
NA
NA
NA
NA
NA
NA
NA
NA
NA
NA
NA
NA
NA
NA
NA
NA
NA
NA
NA
Total FIT Total quantity (for
Unit FIT MTTF(hours) MTTF(Years)
(intermediate calcul) project)
565912.5 282956.3 3534.1 9.7 2.0

282956.3 282956.3 3534.1 9.7 2.0
282956.3 2460.5 406423.2 1113.5 230.0
794.4 794.4 1258732.7 3448.6 460.0
49.6 49.6 20145299.8 55192.6 460.0
16.4 16.4 60969335.4 167039.3 460.0
6.9 6.9 144940475.8 397097.2 460.0
303.5 303.5 3295410.7 9028.5 460.0
168.1 168.1 5948075.0 16296.1 460.0
189.0 189.0 5290782.9 14495.3 460.0
33.8 33.8 29547145.8 80951.1 460.0
25.4 25.4 39397919.2 107939.5 460.0
0.0 0.0 460.0
0.8 0.8 1248179430.8 3419669.7 460.0
0.9 0.9 1110960860.2 3043728.4 460.0
25.7 25.7 38950238.0 106713.0 460.0
11.6 11.6 86242099.3 236279.7 460.0
74.6 74.6 13402082.6 36718.0 460.0
109.2 109.2 9158609.7 25092.1 460.0
203.4 203.4 4915905.3 13468.2 460.0
11.1 11.1 89861626.5 246196.2 460.0
0.2 0.2 5747751833.8 15747265.3 460.0
435.8 435.8 2294658.3 6286.7 460.0
2460.5 1230.2 812846.5 2227.0 460.0
2460.5 2460.5 406423.2 1113.5 230.0
0.0 0.0 4140.0
Failure
Total FIT (for probability per
Total MTTF (Hours) Total MTTF (years)
project) unit) for 15
years
565912.5 1767.1 0.2 1.0

565912.5 1767.1 0.2 1.0
565912.5 1767.1 0.2 0.3
365446.9 2736.4 0.3 0.1
22834.1 43794.1 5.0 0.0
7544.8 132542.0 15.1 0.0
3173.7 315088.0 36.0 0.0
139588.1 7163.9 0.8 0.0
77335.9 12930.6 1.5 0.0
86943.7 11501.7 1.3 0.0
15568.3 64232.9 7.3 0.0
11675.7 85647.7 9.8 0.0
0.0
368.5 2713433.5 309.8
414.1 2415132.3 275.7
11809.9 84674.4 9.7
5333.8 187482.8 21.4
34323.0 29135.0 3.3
50226.0 19910.0 2.3
93573.8 10686.8 1.2
5119.0 195351.4 22.3
80.0 12495112.7 1426.4
200465.6 4988.4 0.6
565912.5 1767.1 0.2
565912.5 1767.1 0.2
0.0
Failure quantity for 15
years
74.4
74.4
74.4
48.0
3.0
1.0
0.4
18.3
10.2
11.4
2.0
1.5
0.0
0.0
0.1
1.6
0.7
4.5
6.6
12.3
0.7
0.0
26.3
74.4
74.4
0.0
Paste in this sheet data copied from other sheet for sort and
analysis (for example paste data from "Bill Of Material
analysis" and sort the result from higher to lower
component FIT or analyse by component category using a
dynamic table.
Don't forget to copy paste a new time your data when
values have changed.
Designation Refdes Quantity Version/Value PART_NUMBER Other informMANUFACTU

CAPMP6032X C93,C94,C95 40 Elco, Tant., CAPMP6032X Case C AVX
CAPC3225X2C74,C75,C76 8 General pur CAPC3225X2 1210 AVX
CAPC3225X2C87,C88,C89 4 Ceramic CapCAPC3225X2SMD-1210 Murata
,SOP65P640U6,U7,U8,U9 12 I/O port, I2C- ,SOP65P640TSSOP-16 NXP
CAPMP7360X C70,C71,C72 4 Elco, Tant., CAPMP7360X Case V AVX
LGA144S127U2 1 ?Module, duaLGA144S127LGA-144 Linear Technology
SWITCH_TY S2,S3 2 Tactile Swit SWITCH_TYCO_FSMJSMTYCO ELECTRONICS
INDC2012X1LB1,LB2,LB3 44 Ferrite Bead INDC2012X1 805 Murata
,,,,,,,,,,,,,,,,,,,,,L3,L4,L5,L6, 40 SMD inductor,,,,,,,,,,,,,,,,,,,,, 805 Taiyo Yuden
SAMTEC_QTS- J1,J2 2 Differential P SAMTEC_QTS- SMT ConnectSamtec
MOLEX_7604J1_10,J11_2 2 2-by-5 Multip MOLEX_7604THT Molex
SOT95P285XT1,T2,T3 3 N-Channel E SOT95P285XSOT23 Diodes
CAPC3216X1C133,C134,C 40 Capacitor 4u CAPC3216X1 1206 Kemet
SOT95P285XT4,T5 2 P-Channel MoSOT95P285XSC-59 Diodes
CAPC1608X9C86 1 CAPACITOR,CAPC1608X9
0 603 TDK
CAPC1608X9C66,C67,C68 4 General purpCAPC1608X9 603 AVX
RESC1608X5R9,R10,R11, 111 General purpRESC1608X5 603 Multicomp
KINGBRIGHTD_L1a,D_L1b 40 Led dual, smtKINGBRIGHT 603 Kingbright
CAPC1608X9C1,C2,C3,C4 67 General purpCAPC1608X9 603 AVX
HDRV2W64P25 J7,J8,J10 3 2p straight T HDRV2W64P25 THT Molex
PHOENIX_18J6 1 PCB TerminalPHOENIX_18THT ConnectPhoenix
RESC1608X5R124,R125,R 63 General purpRESC1608X5 603 Multicomp
RESC1608X5R4,R5,R6,R7 49 General purpRESC1608X5 603 Multicomp
CTS_218-4L S1 1 Half Pitch, CTS_218-4L SOIC-8 CTS
HDRV14W65P J9 1 Header 2x7P,HDRV14W65P THT ConnectMolex
MOLEX_7024J5 1 10p shroudedMOLEX_7024THT Molex
CAPC3216X1C82,C83,C84 3 Middle volta CAPC3216X1 1206 TDK
SOP65P640XU17,U18,U19 3 SOP65P640X110-24N,SOP65P640X110-24N,SOP65
TDK_ACM151 L1 1 Common Mode TDK_ACM151 SMT TDK
BOURNS_SRP L2 1 Inductor, 10uBOURNS_SRP SMT Bourns
SOP65P490XU3,U4 2 Level transla SOP65P490XMSOP-8 NXP
QFN50P400XU1 1 USB-to-Dual-QFN50P400XQFN-24_05 Silicon Labs
KINGBRIGHTD5,D6 2 Led dual, sm KINGBRIGHT 603 Kingbright
Chromium_VN/A 1 12 Layers PCChromium_VN/A N/A
PSON50P100D1,D2 2 Ultra low capaPSON50P100SON-6 NXP
SOT95P280XU5 1 Temperature SOT95P280XSOT23-6 Texas Instruments
RESC3216X6R1,R2,R3 3 General purpRESC3216X6 1206 Multicomp
RESC1608X5R116,R117 2 General purpRESC1608X5 603 Multicomp
MOLEX_5481J3,J4 2 USB, 1x5 pinsMOLEX_5481SMT ConnectMolex
SOT95P240XD3 1 Zener 5V1 T SOT95P240XSOT95 Fairchild
CAPC1608X8C91,C92 2 General purpCAPC1608X8 603 Yageo
RESC1608X5R298 1 General purpRESC1608X5 603 Multicomp
CAPC2012X9C85 1 General purpCAPC2012X9 805 AVX
TO-277P650xD4 1 Skottky Diod TO-277P650xTO-277-3 MCC
TEST_C150HTP1,TP2,TP3 7 Testpoint, Pl TEST_C150H80-1_ET,TEST_C150H80-1_ET,TEST_
SODFL3517XD7 1 400W TransieSODFL3517XSODFL NXP
Function
Datasheet/R
Product Function detail Reliability model FIT Total FIT
CHR_SFP CHR provide SFP interfaceCAPA_tantal_0,5_IP (KM3NET_ 16.8 672
CHR_POWE CHR convert power CAPA_CER_HCV_0,5_Typ2_NIP28.3035817 226.428654
CHR_GPIO CHR provide GPIO interfa OCTOPUS LARGE: PCA9548 (U2 8.3800433 100.56052
CHR_POWE CHR convert power CAPA_tantal_0,5_IP (KM3NET_ 16.8 67.2
Linear Technology CHR_POWE CHR convert power IC_BGA484_FPGA_ID_35° (KM 31.2877305 31.2877305
TYCO ELECTRONICS CHR_WR_LI CHR provide I2C communic Push button, Switch, Inver. ( < 12.0995367 24.1990735
CHR_SFP CHR provide SFP interfaceCLBV2: BLM21PG221SN1 (KM 0.48514748 21.3464891
CHR_SFP CHR provide R Seliability moCLBV2: BLM21PG221SN1 (KM 0.48514748 19.4058992
CHR_GTX Optic SFP connection to CON_CI_SMD_10P20P (KM3NE 5.79763253 11.5952651
CHR_SFP CHR provide SFP interfaceCON_CI_TH_20P50P (KM3NET_5.50011715 11.0002343
CHR_POWE CHR convert power PB: BSS138PW N-MOSFET 60V,3.59236611
0 10.7770983
CHR_SFP CHR provide SFP interfaceCAPA_CER_HCV_0,1_Typ2_NIP0.22845947 9.13837897
CHR_POWE CHR convert power PB: BSS138PW N-MOSFET 60V,3.59236611
0 7.18473222
CHR_USB CHR provide USB interfac CAPA_CER_MCV_0,3_Typ2_NIP1.21578191 4.86312764
CHR_SFP CHR provide SFP interfaceGeneric resistor ERJ (KM3NET_ 0.03708082 4.11597065
CHR_GPIO CHR provide GPIO interfa CLBV2: LG R971 LED GREEN 0.09231873 3.69274934
CHR_USB CHR provide USB interfac CAPA_CER_MCV_0,1_Typ2_NIP0.04512753 3.0235444
CHR_POWE CHR convert power Connecteur wrapping ou insertio 0.97050055 2.91150166
CHR_POWE CHR convert power CON_CI_TH_0P10P (KM3NET_ 2.45972717 2.45972717
CHR_GPIO CHR provide GPIO interfa Generic resistor ERJ (KM3NET_ 0.03708082 2.33609145
CHR_USB CHR provide USB interfac Generic resistor ERJ (KM3NET_ 0.03708082 1.81696002
CHR_GPIO CHR provide GPIO interfa CLBV2: Tyco 1-1571983-0 (KM 1.66047479 1.66047479
CHR_WR_LI CHR provide I2C communic PB: HDR 2.54A 5 TE Connectivi 1.08701203 1.08701203
CHR_USB CHR provide USB interfac Connecteur wrapping ou insertio 0.97050055 0.97050055
P65P640X110-24N,SOP65CHR_GPIO CHR provide GPIO interfa PB: PCA9515ADGKR Dual bidirec0.19384926 0.58154779
CHR_POWE CHR convert power PB: FILT BNX022-01 (F1) (KM3 0.48514748 0.48514748
CHR_POWE CHR convert power CLBV2: BLM21PG221SN1 (KM 0.48514748 0.48514748
CHR_WR_LI CHR provide I2C communic PB: PCA9515ADGKR Dual bidirec0.19384926 0.38769853
CHR_USB CHR provide USB interfac CLBV2: Silicon Labs CP2103 0.24512358 0.24512358
CHR_GPIO CHR provide GPIO interfa CLBV2: LG R971 LED GREEN 0.09231873 0.18463747
CHR_CommoCHR common functions lk SCB: PCB (KM3NET_DS) 0.17398107 0.17398107
CHR_USB CHR provide USB interfac CLBV2: Littelfuse SP0503BAH 0.06740137 0.13480274
Texas Instruments CHR_GPIO CHR provide GPIO interfa CLBV2: Maxim DS18B20U (KM3 0.13377732 0.13377732
CHR_POWE CHR convert power Generic resistor ERJ (KM3NET_ 0.03708082 0.11124245
CHR_USB CHR provide USB interfac Generic resistor ERJ (KM3NET_ 0.03708082 0.07416163
CHR_POWE CHR convert power OM12V_NIKHEF : DZ2J062MOL 0.06740249 0.06740249
CHR_POWE CHR convert power CAPA_CER_LCV_0,1_Typ2_NIP 0.02406802 0.04813603
CHR_GPIO CHR provide GPIO interfa Generic resistor ERJ (KM3NET_ 0.03708082 0.03708082
CHR_POWE CHR convert power CAPA_CER_LCV_0,1_Typ2_NIP 0.02406802 0.02406802
CHR_POWE CHR convert power DIS_SMD_SIGDIODES_NIP (KM0.01129263 0.01129263
ST_C150H80-1_ET,TEST_CHR_GPIO CHR provide No FIT : Test Zero FIT (KM3NET_DS) 0 0
CHR_POWE CHR convert power PTVS12VS1UR (KM3NET_DS) 0 0
Failure Failure
quantity quantity for
/product for the project
15 years for 15 years
0.0883008 40.618368
0.02975273 13.6862535
0.01487636 6.84312677
0.01321365 6.07828005
0.00883008 4.0618368
0.00411121 1.89115558
0.00317976 1.4626888
0.00280493 1.29026719
0.00254994 1.17297017
0.00152362 0.7008642
0.00144543 0.66489816
0.00141611 0.65141093
0.00120078 0.55236018
0.00094407 0.43427395
0.00080353 0.36962586
0.00063901 0.29394689
0.00054084 0.24878573
0.00048523 0.22320454
0.00039729 0.18275512
0.00038257 0.17598281
0.00032321 0.14867575
0.00030696 0.14120271
0.00023875 0.10982433
0.000229 0.10534171
0.00021819 0.10036574
0.00014283 0.06570336
0.00012752 0.05866094
9.7448E-05 0.04482626
9.0059E-05 0.04142701
7.6415E-05 0.03515107
6.3748E-05 0.02932425
6.3748E-05 0.02932425
5.0944E-05 0.02343405
3.2209E-05 0.01481625
2.4261E-05 0.01116023
2.2861E-05 0.01051611
1.7713E-05 0.00814802
1.7578E-05 0.00808604
1.4617E-05 0.00672394
1.4617E-05 0.00672394
9.7448E-06 0.00448263
9.7448E-06 0.00448263
8.8567E-06 0.00407408
6.3251E-06 0.00290953
4.8724E-06 0.00224131
4.8724E-06 0.00224131
4.8724E-06 0.00224131
4.8724E-06 0.00224131
3.1625E-06 0.00145477
1.4839E-06 0.00068257
0 0
0 0
CHROMIUN
Function FIT: 435.79
MTTF (hours) 2294658.31
MTTF (years) 261.95

Total quantity 460
Total FIT 200465.575837031
Mission (year) Duration (hours) Failure risk (%)

1 8760 0.38
2 17520 0.76
5 43800 1.89
10 87600 3.75
15 131400 5.57
20 175200 7.35
Max quantity allowed to

% Loss allowed
failed before loosing
before repaired
more than 5% system
action:
loss
5 23
Product
CHROMIUN
Integrated inside WRS
Integrated inside DU base
Integrated inside DU
Integrated inside Building Block
Integrated inside ORCA/ARCA Phase 1
Integrated inside KM3NET
Total lower level quantity
inside upper level
assembly:
Quantity in
redondance:
0
% failure risk is 0
Quantity of failure if redondant product are
Failures quantity directly repaired implemented
1.75 1.76 0.83
3.50 3.51 0.97
8.70 8.78 1.00
17.23 17.56 1.00
25.60 26.34 1.00
33.81 35.12 1.00
Duration in hours Duration in years before

before reaching 5% of reaching 5% of product
product loss loss
114732.915633844 13.097364798384
Product quantity
integrated inside the
upper level assembly
Lower level
1 assembly
2
1
115
1
2
Upper level
assembly
460
Name of
System/Subsystem Failure Mode,
analysed
Failure Mode Identification Failure Mode Effects
Compone Next Overall

Potential
nt Local Higher System
Ref# (ID) Function Failure
Severity
(LRU/LLR Effect Level Escalatio
Mode
(SEV)
U) Effect n
Provide optic
to electrical
interface and
0 CHROMIUN communicat Short circuit tata all is dead holidays 4
e with SCB
for test
purpose
lure Mode, Effects and Criticity Analysis
Causes Identification Failure Management
Diagnostic/
Detection
(SEV*OCC)
Occurence
Potential
Detection
Criticality
Comment
Root Mitigation
Local Central s
(OCC)
Causes
(DET)
7 28 2
1
Prepared By: S.Colonges
Reviewed By:
Reliability Prediction Failure Classification
Item
Effective (Ss) (Sr)
Actual RPN
Failure Item Modal

Modal Data Severity Severity
Rate failure Apportion
Failure Source impact on impact on
(Automati (manual) ment
Rate Safety Reliability
c)
56 200465.5758 80 160372.4607
0 0
0 0
0 0
0 0
0 0
0 0
0 0
0 0
0 0
0 0
0 0
0 0
0 0
0 0
0 0
0 0
0 0
0 0
0 0
0 0
0 0
0 0
0 0
0 0
0 0
0 0
0 0
0 0
0 0
0 0
0 0
0 0
0 0
0 0
0 0
0 0
0 0
0 0
0 0
0 0
0 0
0 0
0 0
0 0
0 0
0 0
0 0
0 0
0 0
0 0
0 0
0 0
0 0
0 0
0 0
0 0
0 0
0 0
0 0
0 0
0 0
0 0
0 0
0 0
0 0
0 0
0 0
0 0
0 0
0 0
0 0
0 0
0 0
0 0
0 0
0 0
0 0
0 0
0 0
0 0
0 0
0 0
0 0
0 0
0 0
0 0
0 0
0 0
0 0
0 0
0 0
0 0
0 0
0 0
0 0
0 0
0 0
0 0
0 0
0 0
0 0
0 0
0 0
0 0
0 0
0 0
0 0
0 0
0 0
0 0
0 0
0 0
0 0
0 0
0 0
0 0
0 0
0 0
0 0
0 0
0 0
0 0
0 0
0 0
0 0
0 0
0 0
0 0
0 0
0 0
0 0
0 0
0 0
0 0
0 0
0 0
0 0
0 0
0 0
0 0
0 0
0 0
0 0
0 0
0 0
0 0
0 0
0 0
0 0
0 0
0 0
0 0
0 0
0 0
Date:
Date:
(SPF)
e Classification RPN Management
Single
New Severity
Point of
Occurence
Failure or Action
Detection
Responsi Action
New RPN
more Recomm
bility Taken
(OCC)
than 5% ended
(SEV)
(DET)
New
New
of the
detector
loss
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
5
MST - NectarCAM Maintenance Estimate
General activities at Basecamp
Management Workpackage
Analyse maintenance needs and corrective actions
Plan Maintenance activities to be carried out (planing)
Maintenance briefing
Fill in logs after completed maintenance
Maintenance and activities report
Update spares components database
Staff training
Spare parts inventory fallow up
Setup / GSE Facility

Test benches
Tools maintenance
Facilities maintenance
Maintenance and failure tracking database development and maintenance
Inspection of other maintenance facilities
Inspection of safety equipment
Other activities
System Design docs
Operation Manual
Maintenance Manual
Operation plan (update)
Maintenance plan (update)
Safety plan (update)
PBS based Activities Product

Preventive maintenance
WRS
Corrective maintenance
WRS
Total per year
Action details
Calibration system XY system inspection

Camera body visual inspection
Camera body visual inspection, incl. windows, electrical and data connectio
Camera displacement monitoring input windows
Camera enclosure visual inspection & maintenance
Camera entrance window visual inspection
Camera fan replacement, connector inspection/replacement, paint touch-up
Camera fixation maintenance
Camera shutter visual inspection and maintenance
Camera star imaging screen visual inspection and maintenance
Check cable ducts
Check database with condition monitoring information
Check general status of aux. elements
Check general status of camera mount elements
Check general status of foundation
Check general status of OSS elements
Check lightning protection devices
Check of internal UPS unit
Check of safety functions
Check screws and fixings
Cleaning of dust filters cooling system
Cleaning of dust filters of dry air system
Cleaning of other maintenance facilities
Cleaning of safety equipment
connectors of cooling system
Control of water level of cooling system
Coordination of maintenance activities
Dust removal from window
Greasing of locks, hinges rear door
Inspect external interfaces
Inspect internal interfaces
Inspection of air conditioning unit
Inspection of all tubes and cable along telescope
Inspection of other maintenance facilities
Inspection of safety equipment
Other maintenance facilities
Plan Maintenance activities to be carried out
Power system inspection, grounding check
Safety inspection of mirror access platforms
Safety Plan (update)
Spares database
Stockroom
Stockroom cleaning
Stockroom inspection
Tracking system for the maintenance activities
Update hardware and software logbooks (tracking system)
Update Maintenance manual
Upgrade of high level procedures
Verify function of safety systems
Visual check of electrical cabinets
Visual inspection
Visual inspection and cleaning of cal. system window
Visual inspection from inside
Visual inspection from outside
Action detail Single Activities
Number of
Action Action type Frequency Duration
Items
(per year) [hours]
1
1
1
1
1
1
1
1
460
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
Automatic
460 4.957393654
0 0
0 0
0 0
0 0
0 0
0 0
0 0
0 0
0 0
0 0
0 0
0 0
0 0
0 0
0 0
0 0
0 0
0 0
0 0
0 0
0 0
0 0
0 0
0 0
0 0
0 0
0 0
0 0
0 0
0 0
0 0
0 0
0 0
0 0
0 0
0 0
0 0
0 0
0 0
0 0
0 0
0 0
0 0
Action List Competence Action type
Test Mechanical Preventive

Replace Electrical Corrective
Clean Electronical Monitoring
Grease Optics Tracking
Paint IT specialist Planning
Inspect Calibration / Scientist
Manage External ressource
None
gle Activities Total Human
Tools & Failure
Person Resource Spare Part
Persons Equipment quantity for Assumptions
Hours per Competenc Costs
needed needed life site
Year e Level
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
Automatic Automatic
0 74.360904815
0 0
0 0
0 0
0 0
0 0
0 0
0 0
0 0
0 0
0 0
0 0
0 0
0 0
0 0
0 0
0 0
0 0
0 0
0 0
0 0
0 0
0 0
0 0
0 0
0 0
0 0
0 0
0 0
0 0
0 0
0 0
0 0
0 0
0 0
0 0
0 0
0 0
0 0
0 0
0 0
0 0
0 0
0 0
0
Years Hours
Mission duration: 20 175200
________
___________
Line 1: WRS
FIT: 2460.5
I_____
Line 2:
FIT:
Line 3:
FIT:
Line 4:
FIT:
Global system reliability(%): 57.0120

Global failure rate(%): 0.4299
System FIT (failure / 109 hours): 3207.24
FIT sum line 1: 2460.4892070

FIT sum line 2:
FIT sum line 3:
FIT sum line 4:
Failures rate branch 1 0.35019158719492

Failures rate branch 2 1
Parallel branch failure rate 0.3501916
Parallel branch reliability 0.6498084
FIT 2460.4892070
________
___________
WRS
2460.5
______I
WRS
2460.5
2460.5
2460.5
0.3501915871949 1 1 1
0.3501915871949 1 1 1
1 1 1 1
1 1 1 1
0.1226341 1.0000000 1.0000000 1.0000000
0.8773659 1.0000000 1.0000000 1.0000000
746.7534832 0.0000000 0.0000000 0.0000000
2460.4892070237
0.3501915871949
1 1 1
1 1 1
1 1 1
1 1 1
1.0000000 1.0000000 1.0000000
1.0000000 1.0000000 1.0000000
0.0000000 0.0000000 0.0000000
Recalcul
0.4298803
0.5701197
3207.2426902
3207.2426902
Dreaded event name:
Shutter failure
Probability:
0.000373767091509558
AND
Basic event name:

Door keep permanently closed
FIT:
100
Probability:
0.00872174299196449
Dreaded event name:
Shutter failure
Probability:
0.00359433569980242
AND
Basic event name:

FIT:
1000
Probability:
0.0838727456553459
Years Hours
Period 10 87600
Dreaded event name:
Probability:
0.000373767091509603
OR
Basic event name:

Door still open
FIT:
500
Probability:
0.0428546325951036
Dreaded event name:
Probability:
0.00359433569980239
OR
Basic event name:

Door still open
FIT:
500
Probability:
0.0428546325951036
Dreaded event name:
Probability:
0
OR

titi titi
FIT: FIT:
0
0 0
Dreaded event name:
Probability:
0
OR

titi titi
FIT: FIT:
0
0 0
Dreaded event name:
Probability:
0.0039667593469116
OR
Basic event name:

FIT:
1000
Probability:
0.0838727456553459
Dreaded event name:
Probability:
0.00717575215048194
OR
Basic event name:

FIT:
1000
Probability:
0.0838727456553459
Dreaded event name:
Probability:
0.00359433569980239
OR
Dreaded event name:
Probability:
0.00359433569980242
AND
Basic event name:

anently closed Door still open
FIT:
500
Probability:
0.0428546325951036
Dreaded event name:
Probability:
0.00359433569980239
OR
Dreaded event name:
Probability:
0.00359433569980242
AND
Basic event name:

anently closed Door still open
FIT:
500
Probability:
0.0428546325951036
Dreaded event name:
Probability:
0
OR
Basic event name:

titi
FIT:
0
Probability:
0
Dreaded event name:
Probability:
0
OR
Basic event name:

titi
FIT:
0
Probability:
0
Basic event name:
titi
FIT:
Probability:
0
Basic event name:
titi
FIT:
Probability:
0
Factor Recommendation
Design reliability Recommendation
Protection against
overcurrent /
overvoltage/ESD and EMC
Electrical protection are implemented
Avoid critical components in

Critical components terms of reliability (high FIT)
Derating Derating rules are applied
Take care about mechanical

constraints location for
Components placement components placement
Perform a thermal analysis.

Ensure a good temperature
Thermal analysis and dissipation dissipation
Chemical environment is
Environment protection taken into account
Reliability improvement
margin available or past
Improvement margin recommendations applied
Manufacturing reliability Recommendation
Identify assembly process

Assembly process and related risk
PCB technology PCB quality
Mechanical constraints taken

into account: connector
Cabling locking. Cables hold. Marking
Board inspection. No residual
Cleanness flux
Respect IPC class rules /
Pads are conform to
Industrial layout / IPC class soldering constraints
A stress screening is defined
in order to remove youth
HASS failure
Manufacturing test coverage

Manufacturing tests is defined
Maximum number of
repairing actions defined.
Repairing action Rejecting criterion defined
Quality factors Recommendation
Design changes / related

files, documents and version
Configuration management management
Documents are delivered

with the product. Technical
report including functional
analysis, test and validation
Documentation: Technical report / test reports… reports, user manual…
Provide schematics,
software/firmware, layout,
simulation, gerbers, Bill of
Design files material, datasheets
Failure modes Recommendation
Failure rate Failure rate number analysis
Critical failure or single points

Critical risks failure identification
In the FMECA analysis,

RPN number analyze RPN level
Recovery mechanisms are

identified. Possibility to select
Recovery / flexibility degraded mode
Monitoring parameters and

displays are available in
order to detect and analyze
Detectability failures
N1: 2 3
Partially applied / standard practically applied /

Not applied/Not reliable reliability Good reliability

Overcurrent and
overvoltage
protection. ESD
protected
components. ESD
recommendations not
Not protected Only an overcurrent protection fully applied
More than 5 critical 1 or 2 critical

components more than 2 components components
More than 2 components not
meet derating Derating
recommendations or Some components not meet recommendation
maximum rating applied the derating recommendations applied
High risk: big ceramic

capacitors placed in
longitudinal direction.
Biggest case placed on the
diagonal of the board (high
flexion constraint). Critical
components closed to
connectors or constraints
zone during integration. Medium risk: some component Low risk of
Components closed to are close to mechanical mechanical
mechanical fixing zones constraints zones constraints
No thermal analysis
performed. Thermal Thermal analysis
dissipation constraints not performed. Thermal
taken into account. Thermal No thermal analysis performed. dissipation
dissipation not conform to Thermal dissipation constraints constraints practically
components datasheet partially taken into account taken into account
Practically protected
Not applied/Not reliable. No protection. Moderate or low chemical
High chemical constraints chemical constraints constraints
Small margin or Recommendation
No margin or recommendations partially practically applied or
recommendation not applied applied moderate margin
All components have

Not applied/Not reliable. the same assembly
CMS and through hole Major part of CMS technology (through
technologies mixed on the components. Few through hole hole or CMS) on one
both side of the board components or both sides
High risk. Power quality.
Class violation. To low FR2 FR3. Test
insulation resistance. No Class violation or warnings. reports and coupons
sample tests coupons Some defects or repairing available. No
available action allowed. No test reports violation

Not applied/Not reliable reliability high reliability
Not applied/Not reliable reliability high reliability
Conform to IPC class

Not applied/Not reliable Conform to IPC class 1 2
Partially applied: only a burnin Board are powered.
is defined without powering A burnin + ESS is
Not applied/Not reliable boards performed
Visual inspection + In
situ test + functional
No visual inspection - No test defined (but all
continuity test (Takaya or in Visual inspection + functional the functions are not
situ) - No functional test test tested)
Not conform board are

delivered to the customer More than 3 repairing actions One repairing action

Practically applied:
Version date is recorded. But version +
version management is not modification date
clear and reference/applicable available. Changes
document list is not available. history available +
No version and design Design changes management references/applicable
change management is not clear. documents are listed
Partially applied: some The product is
documents are delivered. But correctly documented
Not reliable: No document the set of document should be for each project
delivered completed phase
Partially applied: only design most of the required
Not applied: no documents files and bill of material documents are
available available provided

Good reliability: no
Moderate reliable: some critical contributors
Not reliable: high failure rate function show high failure rate identified
Good reliability :
some single point
Not reliable: a lot of single Standard reliability: more than failure, put with fast
points failure or critical one single point failure recovery procedure
failure identified identified identified
Not reliable: A lot of high Good reliability:
RPN identified (more than Moderate: some high RPN Higher RPN less than
40) identified > 30 20
almost all the failure
Not reliable: no recovery Partially applied: some mode identified allow
mechanism identified recovery modes are identified recovery modes
All failure modes

could practically
monitored (remote
and locally :
housekeeping data,
No monitoring available Partial monitoring led displays…)
4
Fully applied / High reliability Result
Protection over current and overvoltage

implemented. ESD protected components. EMC
recommendations applied
no critical component 4
Derating recommendations applied with a high

margin
No risk of mechanical constraints
Totally protected or no chemical constraints
High margin and recommendation fully applied

Mean value for design 4.0
Only CMS components on a single side
FR4 or polymide. No violations. Tests coupons

and PCB tests available
Fully applied / High reliability
Fully applied / High reliability
Conform to IPC class 3
With light functional test during temperature

cycling
Board fully inspected and tested in the

manufacturing facility. Automatic test tools
developed. All test data are recorded
No repairing action allowed. All failed board are

rejected
Mean value for industrialization #DIV/0!
Totally applied: design changes history fully

available+version management. A CIDL with the
list of applicable documents and files is available
Totally applied: the product is fully documented

Totally applied: all the documents are provided
Mean value for quality #DIV/0!
High reliability: really low failure rate estimates
High reliability: no single point failure identified
High reliability: higher RPN lower than 10
Totally applied: all the failure mode have related

recovery procedures
All failures modes are monitored

Mean value for failure mode #DIV/0!
Comment
Analysis
Remark
Design 4.0
data not
Analysis Industrialisa #DIV/0! available
#DIV/0!
#DIV/0!
#DIV/0!
Analysis
Analysis
Design
4.0
2.0
Column M
0.0
Design
4.0
2.0
Column M
0.0
Industrialisation

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This user manual

der to define reliability

Failure rates results

Allow to analyse copy/pa

Compact results (select

Allow to analyse copy/paste

Applicable / reference documents

Date Version Modification history

10/2/2017 2 New template

Product name Project Author

SCB KM3NET David

Condensator type definition

Value (F) Voltage CV Type (result)

Ctype Ctype value Conductivity

Time year Time (hour) FIT

Operational / Ready mode ON 1800

Life Profil 4.03557399791686

Arrhenius * Norris Lantzberg AF 4.06172963977274

Failure probability to FIT calculation tool:

Derating standard values

Ceramic capacitor (type 1)

Ceramic capacitor (type 2)

Aluminuim, liquid electrolyte

Aluminium, high capacity

10 Diode, low power, switching,

12 Diode, low power, Schottky

Diode, Transil (TVS)

22 Transistor, low power, MOS

26 Transistor, low power, bipolar

Transformer, low power (<=10W)

Low power, linear IC

Resistor Low power, chip (<=

46 Resistor Power, wirewound (>

Reed relay (mercury, dry)

Electromechanical relay (>500W)

Goal: Calculate failure probability depending on the reliability dependanc

RBD locations list Function name FIT

Q1L1 toto 9.83

Mechanical component calculation (weibull law):

Fault Tree Analysis

Intermediate fault name:

Basic event name:

h non-defined temperature coefficient (Type II) with a medium CV product [ECCC_05]

Dissipated power Air convection

Dissipated power Pin Number (Np) RjA (calculated)

Quantity failure probability number of failure

30, Inductor, power Temperature rise

Fuse, Thermal fuse Current stress

Fuse, Polyswitch fuse Current stress

Fuse, Polyswitch fuse Voltage stress

Photocoupler Junction temperature rise

Photocoupler Current stress

Quartz, oscillator Output current stress

Resistor, Resistor Low

Resistor, Resistor Low

LEDs Current stress

2-Year Renewal 15-Year Renewal