Photovoltaic MOSFET Driver

Photovoltaic MOSFET drivers of wide variation

FEATURES
High-speed switching
8.8 6.4 High insulation
3.9 DIP type: 5,000 Vrms, SOP type: 2,500 Vrms,
4.3 4.4 2.65 4.45
SSOP type: 1,500 Vrms
8.8 6.4 2 1.8 Extensive product lineup
3.6
Products include SSOP, SOP4-pin and DIP6-pin.

+ + TYPICAL APPLICATIONS
1 6 1 4
Power supply (Vcc) for electronic circuits
Control circuit

Control circuit

2 Driving MOSFET
ｰ ｰ Note: Please contact our sales representative for automotive applications of PhotoMOS.
3 4 2 3

(Unit: mm)

TYPES

Output rating Part No. Packing quantity

Through hole
Drop-out Short circuit Package Surface mount terminal
terminal
voltage current Tube Tape and reel
(Typ.) (Typ.) Tube packing Tube packing Tape and reel Tape and reel
style style packing style X, Y*1 packing style Z, W*2
1-tube: 50 pcs. 1-reel: 1,000 pcs.
8.7 V 14 μA DIP6-pin APV1122 APV1122A APV1122AX APV1122AZ
Outer carton: 500 pcs. Outer carton: 1,000 pcs.
8.7 V 14 μA - APV1121S APV1121SX APV1121SZ 1-tube: 100 pcs. 1-reel: 1,000 pcs.
SOP4-pin*3
8.2 V 8 μA - APV2121S APV2121SX APV2121SZ Outer carton: 2,000 pcs. Outer carton: 1,000 pcs.
1-reel: 3,500 pcs.
8.2 V 8 μA SSOP*4 - - APV2111VY APV2111VW -
Outer carton: 3,500 pcs.
*1. SOP type is picked from 1/2-pin side, SSOP type is picked from 1/4-pin side.
*2. SOP type is picked from 3/4-pin side, SSOP type is picked from 2/3-pin side.
*3. For space reasons, the two initial letters of the part number “AP”, package (SOP) indicator “S” and the packing style indicator “X” or “Z” are not marked on the device.
(Ex. the label for product number APV1121SX is V1121.)
*4. Tape and reel package is the standard packing style. Packing quantity of 1,000 pieces is possible. Please contact our sales office.
For space reasons, the two initial letters of the part number “AP”, package (SSOP) indicator “V” and the packing style are not marked on the device.
(Ex. the label for product number APV2111VY is V2111.)

RATING

Absolute maximum ratings (Ambient temperature: 25°C)

Item Symbol APV1122 (A) APV1121S APV2121S APV2111V Remarks
LED forward current IF 50 mA
LED reverse voltage VR 5V
Input

f = 100 Hz,
Peak forward current IFP 1A
Duty Ratio = 0.1%
Power dissipation Pin 75 mW
I/O isolation voltage Viso 5,000 Vrms 2,500 Vrms 2,500 Vrms 1,500 Vrms
(Avoid icing and
Ambient temperature (Operating) Topr –40 to +85°C
condensation)
Ambient temperature (Storage) Tstg –40 to +100°C

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Photovoltaic MOSFET Driver
Electrical characteristics (Ambient temperature: 25°C)
Item Symbol APV1122 (A) APV1121S APV2121S APV2111V Condition
LED operate Typical 0.6 mA 0.85 mA
IFon VOC = 5 V
current Maximum 3 mA
LED turn off Minimum 0.2 mA
Input

IFoff VOC = 1 V
current Typical 0.5 mA 0.75 mA
LED dropout Typical 1.15 V
VF IF = 10 mA
voltage Maximum 1.5 V
Minimum 6V 5V
Drop-out voltage*1 VOC IF = 10 mA
Output

Typical 8.7 V 8.2 V

Short circuit Minimum 5 μA 3 μA
ISC IF = 10 mA
current*2 Typical 14 μA 8 μA
IF = 10 mA
Transfer characteristics

Turn on time*3 Typical Ton 0.4 ms 0.8 ms

CL = 1,000 pF
IF = 10 mA
Turn off time*3 Typical Toff 0.1 ms
CL = 1,000 pF
Typical 0.8 pF f = 1 MHz
I/O capacitance Ciso
Maximum 1.5 pF VB = 0 V
Initial I/O isolation
Minimum Riso 1,000 MΩ 500 V DC
resistance
*1.Drop-out voltage measurement circuit
APV1122(A) APV1121S, APV2121S, APV2111V
IF=10mA 1 IF=10mA
6 1 4

2
V RV=10MΩ V RV=10MΩ
3 4 2 3

*2.Short circuit current measurement circuit

APV1122(A) APV1121S, APV2121S, APV2111V
IF=10mA IF=10mA
1 6 1 4

2
I RI=100Ω I RI=100Ω
3 4 2 3

*3.Turn on/Turn off time measurement circuit

APV1122(A) APV1121S, APV2121S, APV2111V
IF=10mA 1 IF=10mA 1
VOUT VOUT
2 CL CL

3 4 2 3

CL=1000pF CL=1000pF

*3.Turn off time

Input

5V

1V
Output
Ton Toff

Recommended operating conditions (Ambient temperature: 25°C)

Please use under recommended operating conditions to obtain expected characteristics.
Item Symbol Min. Max. Unit
LED current IF 10 30 mA

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 Photovoltaic MOSFET Driver

REFERENCE DATA

1.Drop-out voltage vs. ambient temperature 2.Short circuit current vs. ambient 3.LED operate current vs. ambient
characteristics temperature characteristics temperature characteristics
Input current: 10 mA Input current: 10 mA Drop-out voltage: 5 V
14 25 3.0

2.5
12 20

LED operate current (mA)

Short circuit current (μA)
Drop-out voltage (V)

2.0 APV2121S
10 15 APV2111V
APV1122
APV1121S
1.5
APV1122
8 APV1121S 10
1.0

APV1122
6 5 APV2121S
APV2121S 0.5 APV1121S
APV2111V APV2111V

4 0 0
-40 -20 0 20 40 60 8085 -40 -20 0 20 40 60 8085 -40 -20 0 20 40 60 80 85
Ambient temperature (°C) Ambient temperature (°C) Ambient temperature (°C)

4.LED turn off current vs. ambient 5.LED dropout voltage vs. ambient 6.Turn on time vs. ambient temperature
temperature characteristics temperature characteristics characteristics
Drop-out voltage: 1 V LED forward current: 10 to 50 mA LED forward current: 10 mA
Load capacity: 1,000 pF; output voltage: 5 V
2.0 1.5 2.0

1.4
LED turn off current (mA)

LED dropout voltage (V)

1.5 1.5

Turn on time (ms)

APV2121S
APV2111V APV2121S
1.3 APV2111V

1.0 50 ｍA 1.0
1.2 30 ｍA APV1122
20 ｍA APV1121S
APV1122
0.5 0.5
APV1121S 1.1 10 ｍA

0 1.0 0
-40 -20 0 20 40 60 80 85 -40 -20 0 20 40 60 80 100 -40 -20 0 20 40 60 8085
Ambient temperature (°C) Ambient temperature (°C) Ambient temperature (°C)

7.Turn off time vs. ambient temperature 8.Turn on time vs. LED forward current 9.Turn off time vs. LED forward current
characteristics characteristics characteristics
LED forward current: 10 mA Load capacity: 1,000 pF; output voltage: 5 V Load capacity: 1,000 pF; output voltage: 1 V
Load capacity: 1,000 pF; output voltage: 1 V
0.5 2.0 0.30

0.25
0.4
1.5
Turn off time (ms)
Turn off time (ms)

Turn on time (ms)

APV2121S 0.20
0.3 APV2111V
1.0 0.15
APV2121S
0.2 APV2111V
0.10 APV2121S
APV2111V
0.5
0.1
APV1122 0.05
APV1121S APV1122 APV1122
APV1121S APV1121S
0 0 0
-40 -20 0 20 40 60 80 85 0 10 20 30 40 50 60 0 10 20 30 40 50 60
Ambient temperature (°C) LED forward current (mA) LED forward current (mA)

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Photovoltaic MOSFET Driver
10.Drop-out voltage vs. LED forward current 11.Short circuit current vs. LED forward
characteristics current characteristics
10 APV1122 100
APV1121S APV1122
APV1121S
8

Short circuit current (μA)

APV2121S
Drop-out voltage (V)

APV2111V
APV2121S
6 APV2111V

10
4

0 1
0 10 20 30 40 50 1 10 100
LED forward current (mA) LED forward current (mA)

DIMENSIONS CAD The CAD data of the products with a “CAD” mark can be downloaded from our Website. Unit: mm

DIP6pin
CAD Through hole terminal type CAD Surface mount terminal type PC board pattern
External dimensions External dimensions (BOTTOM VIEW)
Max.10° 5.08
5-0.8 dia.
2.54
° 0
Max.1

2.54
7.62
7.62±0.05

6.4
6.4±0.05
6.4±0.05

7.6

1
Tolerance: ±0.1
°
10

±0.05 3.4 8.8±0.05 3.4

8.8
x.

Recommended mounting pad

Ma

(TOP VIEW)
3.4
3.9 ±0.2

0.47
0.2+0.2

0.47 0.47
3

1.25
8.3

0.47 1.25 1.25

0.47
1.9
0.47
1.25 1.25 2.54 2.54
1.25
Terminal thickness: t = 0.25 Terminal thickness: t = 0.25
General tolerance: ±0.1 1.5
2.54 2.54 General tolerance: ±0.1
2.54 2.54

Tolerance: ±0.1

SOP4pin
CAD External dimensions Recommended mounting pad
(TOP VIEW)
0.5
4.4±0.2

6.8 ±0.4

6
1.2

4.3±0.2
0.5

0.8

2.54
2±0.2

Tolerance: ±0.1
0.4
0.1

0.4

2.54
Terminal thickness: t = 0.15
General tolerance: ±0.1

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 Photovoltaic MOSFET Driver
SSOP
CAD External dimensions Recommended mounting pad
4.45 (TOP VIEW)

2.65

0.7
0.9

1.27

1.8
4.35
0.2 0.2 0.4 0.4
Tolerance: ±0.1
（4.85） 1.27

Terminal thickness: t = 0.15

General tolerance: ±0.1

SCHEMATIC AND WIRING DIAGRAMS

Output Load
Schematic Connection Wiring diagram
configuration type

＋
1 6 IF 1 6 Load 6 Load ＋
Control circuit

External External
2 E1 2 MOSFET MOSFET VL (DC)
VL (AC, DC)
－ 3 4 4
3 4 －

*
1 Form A - -

＋
1 4 IF 1 4 Load
4 Load ＋
External
Control circuit

E1 External
MOSFET MOSFET VL (DC)
VL (AC, DC)
－ 2 3 3
2 3 －

*Terminal 3 cannot be used, since it is in the internal circuit of the device.

SAFETY STANDARDS

UL (Recognized) CSA (Certified)

Part No. File No. File No. Remarks
Contact rating Contact rating
(Standard No.) (Standard No.)
APV2111V
-
(SSOP)
APV2121S
-
Photovoltaic (SOP) E191218
(Certified by C-UL)
MOSFET driver APV1121S (UL1577) VDE approved
-
(SOP) (Nr. 40036199)
APV1122
-
(DIP6)
Note: For the latest information on compliance with safety standards, please refer to our website.

Please refer to "the latest product specifications"

when designing your product.
•Requests to customers:
https://industrial.panasonic.com/ac/e/salespolicies/

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 PhotoMOS® Cautions for Use

SAFETY WARNINGS
 o not use the product under conditions that exceed the range
D  heck the wiring diagrams in the catalog and be sure to
C
of its specifications. It may cause overheating, smoke, or fire. connect the terminals correctly. If the device is energized
Do not touch the recharging unit while the power is on. There with short circuit or any wrong connection, it may cause
is a danger of electrical shock. Be sure to turn off the power unexpected malfunction, abnormal heat or fire.
when performing mounting, maintenance, or repair operations
on the device (including connecting parts such as the terminal
board and socket).

PhotoMOS® Cautions for Use

Derating design
Derating is a significant factor for reliable design and product life. 5) When packing printed circuit boards and equipment, avoid using
Even if the conditions of use (temperature, current, voltage, etc.) of high-polymer materials such as foam styrene, plastic, and other
the product are within the absolute maximum ratings, reliability may materials which carry an electrostatic charge.
be lowered remarkably when continuously used in high load 6) When storing or transporting PhotoMOS®, the environment should
conditions (high temperature, high humidity, high current, high not be conducive to generating static electricity (for instance, the
voltage, etc.) Therefore, please derate sufficiently below the humidity should be between 45% and 60%), and PhotoMOS®
absolute maximum ratings and evaluate the device in the actual should be protected using conductive packing materials.
condition.
Moreover, regardless of the application, if malfunctioning can be Unused terminals
expected to pose high risk to human life or to property, or if products The No. 3 terminal is used with the circuit inside the device.
are used in equipment otherwise requiring high operational safety, in Therefore, do not connect it to the external circuitry with either
addition to designing double circuits, that is, incorporating features connection method A, B or C. (1 Form A 6-pin type)
such as a protection circuit or a redundant circuit, safety testing
should also be carried out. Short across terminals
Do not short circuit between terminals when device is energized,
 pplying stress that exceeds the absolute maximum
A since there is possibility of breaking of the internal IC.
rating
If the voltage or current value for any of the terminals exceeds the Surge voltages at the input
absolute maximum rating, internal elements will deteriorate because If reverse surge voltages are present at the input terminals, connect
of the overvoltage or overcurrent. In extreme cases, wiring may a diode in reverse parallel across the input terminals and keep the
melt, or silicon P/N junctions may be destroyed. reverse voltages below the reverse breakdown voltage.
Therefore, the circuit should be designed in such a way that the load Typical circuits are below shown.
never exceed the absolute maximum ratings, even momentarily. 1) 6-pin

Input voltage (for Voltage-sensitive type)

1 6
For rising and dropping ratio of input voltage(dv/dt), maintain Min.
100mV/ms. 2 5
3 4
Oscillation circuit and control circuit (for TSON)
The oscillation circuit and control circuit of product may be destroyed
by external noise, surge, static electricity and so on.
For noise effect to peripheral circuits when oscillation circuit 2) Power type
operates, please implement safety measures on the system before
use by verifying operation under the actual design.

 eterioration and destruction caused by discharge of

D
static electricity (for TSON/RF C×R3/RF C×R5/RF
C×R10)
This phenomenon is generally called static electricity destruction, 3 4
and occurs when static electricity generated by various factors is
discharged while the PhotoMOS® terminals are in contact, producing
internal destruction of the element.
1 2
To prevent problems from static electricity, the following precautions
and measures should be taken when using your device.
1) Employees handling PhotoMOS® should wear anti-static clothing
and should be grounded through protective resistance of 500kΩ
to 1MΩ.
2) A conductive metal sheet should be placed over the worktable.
Measuring instruments and jigs should be grounded.
3) When using soldering irons, either use irons with low leakage
current, or ground the tip of the soldering iron. (Use of low-voltage
soldering irons is also recommended.)
4) Devices and equipment used in assembly should also be
grounded.

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PhotoMOS® Cautions for Use
 ecommended LED forward current or recommended
R Output spike voltages
input voltage 1) If an inductive load generates spike voltages which exceed the
Design in accordance with the recommended operating conditions absolute maximum rating, the spike voltage shall be limited.
for each product. Representative circuit examples of AC/DC dual use type are
Since these conditions are affected by the operating environment, shown below. There are the same with DC only type.
ensure conformance with all relevant specifications. (1) 6-pin
1 6
 ED forward current vs. Ambient temperature
L
characteristics 2 5
Please keep the LED forward current to within the range given Load
3 4
below.

Clamp diode is
100
connected in parallel
with the load.

80 1 6
LED forward current (mA)

2 5
60
Load
3 4
40
CR snubber is
connected in parallel
20
with the load.

0 (2) Power type

-40 -20 0 20 40 60 8085 100
Ambient temperature (°C)

Ripple in the input power supply 1 2 3 4

If ripple is present in the input power supply, observe the following: Load
Clamp diode is
1) For LED forward current at Emin, please maintain the value connected in parallel
mentioned at “■Recommended LED forward current.” with the load.

2) Please make sure the LED forward current for Emax. is no higher
than 50 mA. 1 2 3 4
Load
CR snubber is
3) Please maintain the input voltage at least 4V for Emin. (GU, RF
connected in parallel
and Power voltage-sensitive type). with the load.

4) Please make sure the input voltage for Emax. is no higher than 6V
(GU and RF voltage-sensitive type). 4
1 2 3
Load A varistor is
5) Please make sure the input voltage for Emax. is no higher than 30V connected in parallel
(Power voltage-sensitive type). with PhotoMOS®

(3) TSON
1 4

Load
2 3
Emin. Emax.

Clamp diode is
connected in parallel
6) Please maintain the input voltage at least 3V for Emin. (for TSON)
with the load.
1 4
7) Please make sure the input voltage for Emax. is no higher than 5.5V.
(for TSON) Load
2 3

8) Please keep amplitude voltage of ripple within ±0.5V. (for TSON) CR snubber is
connected in parallel
with the load.
within ±0.5 V

Set voltage
2) When Clamp diode or CR Snubber is used in the circuit, the spike
voltages from the load are limited. But the longer wire may
within ±0.5 V become the inductance and cause the spike voltage. Keep the
wire as short as possible.

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 PhotoMOS® Cautions for Use
Reverse voltages at the input (for TSON) Input wiring pattern
If reverse voltages are present at the input terminals, for example, 1) With AQY* or AQW* series avoid installing the input (LED side)
connect a schottky barrier diode in reverse parallel across the input wiring pattern to the bottom side of the package if you require the
terminals and keep the reverse voltages below the reverse specified I/O isolation voltage (Viso) after mounting the PC board.
breakdown voltage. Typical circuit is shown below. Since part of the frame on the output side is exposed, it may
cause fluctuations in the I/O isolation voltage.
1 4
Portion of output side frame
2 3 (Output terminal side)

Continual DC bias (AQV259 and AQV258)

If a continual DC bias will be applied between the input and output, Input wiring
pattern (Input terminal side)
the breakdown voltage of the switching element MOSFET on the
output side may degrade. Therefore, be sure to test the product
under actual conditions. Example of circuits that will cause May not allow the prescribed I/O withstand
voltage (Viso) to be achieved
degradation of breakdown voltage of MOSFET is given below.
* Excluding reinforced insulation products and SSOP, SON, and TSON packages
1 6
E IF 2 5 2) Exposed terminals are electrically connected to internal elements.
IL
Be aware that contact with external circuits may cause
3 4
deterioration of insulation between input and output, leading to
Load destruction of internal elements.
3) If installed in proximity to other device, take care to avoid short
Cleaning solvents compatibility circuits between device, which may occur if exposed frames of
Cleaning the solder flux should use the immersion washing with an adjacent device come too close.
organic solvent. If you have to use ultrasonic cleaning, please adopt
the following conditions and check that there are no problems in the
actual usage.
• Frequency: 27 to 29kHz
• Ultrasonic output: No greater than 0.25W/cm2*
• Cleaning time: 30s or less
• Cleanser used: Asahiklin AK-225
• Others: Float PCB and the device in the cleaning solvent to
prevent from contacting the ultrasonic vibrator
* Applies to unit area ultrasonic output for ultrasonic baths

Notes for mounting

1) When different kinds of packages are mounted on PC boad,
temperature rise at soldering lead is highly dependent on
package size. Therefore, please set the lower temperature
soldering condition than the conditions of item “■Soldering”, and
confirm the temperature condition of actual usage before
soldering.
2) When soldering condition exceeds our recommendation, the
PhotoMOS® characteristics may be adversely affected. It may
occur package crack or bonding wire breaking because of
thermal expansion unconformity and resin strength reduction.
Please contact our sales office about the propriety of the
condition.
3) Please confirm the heat stress by using actual board because it
may be changed by board condition or manufacturing process
condition.
4) Solder creepage, wettability, or soldering strength will be affected
by the soldering condition or used soldering type. Please check
them under the actual production condition in detail.
5) Please apply coating when the device returns to a room
temperature.

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PhotoMOS® Cautions for Use
Soldering  bout the exposed terminals on the sides of the
A
1) Example of surface-mount terminal recommended conditions package (for VSSOP)
(1) IR (Infrared reflow) soldering method For VSSOP type, as shown in the following figure, part of the input
In case of automatic soldering, following conditions should be and output frames are exposed on the sides of the package. Due to
observed. (recommended condition reflow: Max. 2 times, this, please be keep in mind the cautions listed below.
measurement point: soldering lead) 1) Take care to avoid short circuits between exposed terminals,
t3 which may cause insulation deterioration between input and
T1 = 150 to 180°C output, leading to destruction of internal elements.
T3
T2 = 230°C 2) Since the exposed terminals are connected electrically to the
T2 T3 = 240 to 250°C* internal element, please refer to the item “■Deterioration and
t1 = 60 to 120 s destruction caused by discharge of static electricity”, and
T1
t2 = Within 30 s
t3 = Within 10 s implement sufficient measures to control static electricity.
*240 to 245°C for SON, VSSOP 3) When installing the devices in the vicinity, please keep in mind
and TSON package that if the exposed frames of adjacent devices get too close, a
t1 t2
short between devices may occur.

Part of frame on output side

(2) Other soldering methods
Other soldering methods (VPS, hot-air, hot plate, laser
heating, pulse heater, etc.) affect the PhotoMOS®
characteristics differently, please evaluate the device under
the actual usage.
(3) Manual soldering method Part of frame on input side
Temperature: 350 to 400°C, within 3s, electrical power 30 to
60W Adjacent mounting
When several PhotoMOS® are mounted closely each other or
2) Example of through hole terminal recommended conditions heat-generating components are mounted close to the PhotoMOS®,
(1) DWS soldering method the abnormal heating may occur. This abnormal heat may be
In case of automatic soldering, following conditions should be caused by the internal element when energized or thermal
observed. (recommended condition number of times: Max. 1 interference between the devices. The degree of temperature rise
time, measurement point: soldering lead *1) depends on the mounting layout of the devices and usage condition,
therefore please be sure to use PhotoMOS® with reduced load
T2 T1 = 120°C current after testing under the worst condition of the actual usage.
T2 = Max. 260°C
t1 = within 60 s
T1 Transportation and storage
t2+t3 = within 5 s
1) Extreme vibration during transport may deform the lead or
damage the PhotoMOS® characteristics. Please handle the outer
t1 t2 t3 and inner boxes with care.
2) Inadequate storage condition may degrade soldering,
*1 Solder temperature: Max. 260°C appearance, and characteristics. The following storage conditions
(2) Other soldering method (recommended condition: 1 time) are recommended:
Preheating: Max. 120°C, within 120s, measurement point: • Temperature: 0 to 45°C
soldering lead • Humidity: Max. 70%RH
Soldering: Max. 260°C, within 10s, measurement area: • Atmosphere: No harmful gasses such as sulfurous acid gas,
soldering temperature minimal dust.
(3) Manual soldering method 3) Storage before TSON, VSSOP, SON, SSOP, or SOP processing
Temperature: 350 to 400°C, within 3s, electrical power 30 to In case the heat stress of soldering is applied to the PhotoMOS®
60W which absorbs moisture inside of its package, the evaporation of
the moisture increases the pressure inside the package and it
may cause the package blister or crack. This device is sensitive
to moisture and it is packed in the sealed moisture-proof package.
Please make sure the following condition after unsealing.
* Please use the device immediately after unsealing.
(Within 30 days at 0 to 30°C and Max. 70%RH)
* If the device will be kept for a long time after unsealing, please
store in the another moisture-proof package containing silica gel.
(Please use within 90 days.)

Water condensation
Water condensation occurs when the ambient temperature changes
suddenly from a high temperature to low temperature at high
humidity, or the device is suddenly transferred from a low ambient
temperature to a high temperature and humidity. Condensation
causes the failures such as insulation deterioration. Panasonic
Corporation does not guarantee the failures caused by water
condensation. The heat conduction by the equipment the
PhotoMOS® is mounted may accelerate the water condensation.
Please confirm that there is no condensation in the worst condition
of the actual usage. (Special attention should be paid when high
temperature heating parts are close to the PhotoMOS®.)

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 PhotoMOS® Cautions for Use
Packing format
1) Tape and reel
Tape dimensions Dimensions of tape reel

Direction of picking 21±0.8

1.75±0.1
Tractor feed holes 1.5 +0.5
-0 dia.
0.2 ±0.05 2.2±0.2 4±0.1 2±0.5

2.4±0.2

180±3dia.
60 ±3dia.
TSON

±0.3
4-pin

12
Device mounted
on tape
±0.3 1.05±0.1dia.

5.5±0.1
1.2 2±0.1
4±0.1
13±0.5 dia.
(1) When picked from 1/2-pin side: Part No. AQY2C1R*PX (Shown above) 13±1.5 1.2±0.5
*Quality of material: Polystyrene (PS)
(2) When picked from 3/4-pin side: Part No. AQY2C1R*PZ

Direction of picking

Tractor feed holes 1.5 +0.5

ｰ0 dia.

1.75±0.1
0.4 ±0.05 4.0 ±0.1
2.4±0.2
2.5±0.2

±0.3
VSSOP

12.0
4-pin Device mounted
on tape
3.3±0.3 1±0.1dia. 8±0.1 2±0.1
5.5±0.1

(1) When picked from 1 and 4-pin side: Part No. AQY*TY (Shown above)
(2) When picked from 2 and 3-pin side: Part No. AQY*TW

Direction of picking
1.75±0.1

Tractor feed holes 1.5 +0.5

ｰ0 dia.

0.3±0.05 2.8±0.2 4±0.1

3.6±0.2

SON
±0.3

21±0.8
12

4-pin Device mounted 80 ±1dia.

on tape
1.5±0.1dia. 4±0.1 2±0.1
5.5±0.1

2±0.3
2±0.5

(1) When picked from 1 and 4-pin side: Part No. AQY*MY (Shown above)

250 ±2dia.
80 ±1 dia.
(2) When picked from 2 and 3-pin side: Part No. AQY*MW

Direction of picking
1.75±0.1

Tractor feed holes 1.50 +0.5

ｰ 0 dia.
0.3±0.05 3.0 ±0.1 4.0±0.1
5.1±0.2

13 ±0.5dia. 14±1.5 2 ±0.5

12.0±0.3

*Quality of material: Paper

SSOP
4-pin Device mounted
5.5±0.1

on tape
2.7±0.3 4.0±0.1
1.5+0.1
ｰ 0 dia.

(1) When picked from 1 and 4-pin side: Part No. AQY*VY, APV2111VY (Shown above)
(2) When picked from 2 and 3-pin side: Part No. AQY*VW, APV2111VW

Direction of picking
1.75±0.1

Tractor feed holes

0.3±0.05 1.55±0.05dia. 7.2±0.1
5.5±0.1
±0.3
4.7±0.1

SOP
12

4-pin Device mounted on tape

2.8±0.3 4±0.1 1.55±0.1dia.
12±0.1 2±0.1

(1) When picked from 1/2-pin side: Part No. AQY*SX, APV**21SX (Shown above)
(2) When picked from 3/4-pin side: Part No. AQY*SZ, APV**21SZ
Note: “ * ” indicates characters of number or alphabet.

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PhotoMOS® Cautions for Use

Tape dimensions Dimensions of tape reel

21±0.8
80 ±1dia.
Direction of picking

1.75±0.1
Tractor feed holes ±0.1
0.3±0.05 1.55±0.05dia. 4 7.2±0.1
2±0.5

5.5±0.1
±0.3

250 ±2dia.
80 ±1 dia.
6.9 ±0.1
SOP

12
6-pin Device mounted on tape
12±0.1 2±0.1 1.55±0.1dia.
2.8±0.3

(1) When picked from 1/2/3-pin side: Part No. AQV*SX (Shown above) *Quality of material: Paper 13 ±0.5dia. 14±1.5 2 ±0.5
(2) When picked from 4/5/6-pin side: Part No. AQV*SZ

Direction of picking

1.75±0.1
Tractor feed holes
0.3±0.05 1.55±0.05dia. 7.5±0.1

7.5±0.1
10.15±0.1

16±0.3
SOP
8-pin Device mounted 21±0.8
on tape
80 ±1dia.
4±0.1 1.55±0.1dia.
2.8±0.3
12±0.1 2±0.1

2±0.5
(1) When picked from 1/2/3/4-pin side: Part No. AQW*SX (Shown above)
(2) When picked from 5/6/7/8-pin side: Part No. AQW*SZ

250 ±2 dia.
80 ±1dia.
Direction of picking
1.75±0.1

Tractor feed holes

0.3±0.05 1.55±0.05dia. 7.5±0.1
7.5±0.1
11.15±0.1

16±0.3

SOP Device mounted *Quality of material: Paper 13 ±0.5dia. 17.5±1.5 2±1

16-pin on tape

4±0.1 1.55±0.1dia.
2.8±0.3 12±0.1 2±0.1

(1) When picked from 1/2/3/4/5/6/7/8-pin side: Part No. AQS*SX (Shown above)
(2) When picked from 9/10/11/12/13/14/15/16-pin side: Part No. AQS*SZ

21±0.8
80 ±1dia.

Direction of picking
1.75±0.1

Tractor feed holes ±0.1

4 2±0.5
0.3±0.05 1.5+0.1
ｰ0 dia. 10.2±0.1

DIP 4-pin 300 ±2 dia.

80 ±1dia.
5.5±0.1

12±0.3
5.25±0.1

Surface mount
terminal Device mounted on tape
12±0.1 2±0.1 1.55±0.1dia.
4.2±0.3

(1) When picked from 1/2-pin side: Part No. AQY*HAX, AQY210HLAX (Shown above) *Quality of material: Paper 13±0.5dia. 13.5±2.0 2±0.5
(2) When picked from 3/4-pin side: Part No. AQY*HAZ, AQY210HLAZ

21±0.8
80 ±1dia.
Direction of picking
1.75±0.1

Tractor feed holes

0.3±0.05 1.5+0.1
ｰ0 dia. 10.1±0.1 2±0.5
7.5±0.1

300±2dia.

DIP 6-pin
80±1dia.
±0.3
9.2±0.1

Surface mount
16

terminal Device mounted on tape

12±0.1 4±0.1 1.6±0.1dia.
4.5±0.3 2±0.1

(1) When picked from 1/2/3-pin side: Part No. AQV*AX (Shown above) *Quality of material: Paper 13 ±0.5dia. 17.5±2 2±0.5
(2) When picked from 4/5/6-pin side: Part No. AQV*AZ
Note: “ * ” indicates characters of number or alphabet.

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 PhotoMOS® Cautions for Use

Tape dimensions Dimensions of tape reel

Direction of picking

1.75±0.1
Tractor feed holes ±0.1
0.3 ±0.05
1.5+0.1
ｰ0 dia.
4 10.1±0.1

DIP 8-pin

7.5±0.1
Surface mount

10.2±0.1

±0.3
terminal

16
21±0.8
(Basic insulation Device mounted on tape
80 ±1dia.
type) 12±0.1 2±0.1 1.55±0.1dia.
4.5±0.3
2±0.5
(1) When picked from 1/2/3/4-pin side: Part No. AQW*AX (Shown above)
(2) When picked from 5/6/7/8-pin side: Part No. AQW*AZ

300±2dia.
80±1dia.
Direction of picking

1.75±0.1
Tractor feed holes
0.3±0.05 1.5 +0.1
ｰ0 dia.
4±0.1 10.2±0.1

DIP 8-pin

7.5±0.1
Surface mount

10.3±0.1

16±0.3
terminal *Quality of material: Paper 13 ±0.5dia. 17.5±2 2±0.5
(Reinforced Device mounted on tape
insulation type 12±0.1 2±0.1 1.55±0.1dia.
4.2±0.3

(1) When picked from 1/2/3/4-pin side: Part No. AQW*EHAX,

AQW210HLAX (Shown above)
(2) When picked from 5/6/7/8-pin side: Part No. AQW*EHAZ, AQW210HLAZ

21±0.8
100±1dia.
Direction of picking
±0.1

Tractor feed holes

1.75

0.3±0.05 1.55+0.05
ｰ 0.05 dia.
4.0±0.1 12.6±0.1
2±0.5
11.5 ±0.1

330±2 dia.
Power-DIP

100±1dia.
24.0 ±0.3

4-pin
9.7±0.1

SMD Device mounted

on tape

16.0±0.1 2.0±0.1 1.55±0.1 dia.

4.5±0.3

(1) When picked from 1/2-pin side: Part No. AQY*AX (Shown above) *Quality of material: Paper 13 ±0.5dia. 25.5±2 1.7±0.8
(2) When picked from 3/4-pin side: Part No. AQY*AZ

21±0.8
80 ±1dia.
Direction of picking
1.75±0.1

Tractor feed holes

0.3±0.05 1.5+0.1
ｰ0 dia. 10.1±0.1
2±0.5
7.5±0.1

DIP 6-pin
±0.3
9.2±0.1

300±2dia.
Surface mount 80±1dia.
16

terminal
Device mounted on tape
(Photovoltaic
MOSFET driver) 12±0.1 4±0.1 1.6±0.1dia.
±0.3
4.5
2±0.1

(1) When picked from 1/2/3-pin side: Part No. APV1122AX (Shown above) *Quality of material: Paper 13 ±0.5dia. 17.5±2 2±0.5
(2) When picked from 4/6-pin side: Part No. APV1122AZ
Note: “ * ” indicates characters of number or alphabet.

2) Tube
Devices are packaged in a tube so that 1-pin is on the stopper B
side. Observe correct orientation when mounting them on PC
boards.
(PD type) (SOP type)
Stopper B Stopper A

Stopper B (green) Stopper A (gray)

(DIP type) (Power type)

Stopper B Stopper A Green Gray
Stopper B Stopper A

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PhotoMOS® Cautions for Use
Current limit function (output current control) Adjacent mounting (for Power type)
1) Current limit function aims to increase resistance to surges when 1) When devices are mounted close together with the heat-
the switch is turned on. Before using this function, connect the generated devices, ambient temperature may rise abnormally.
varistor to the output as shown in the figure below. Mounting layout and ventilation should be considered.

1 4 2) When many devices are mounted close together, load current

Varistor Surge: 10×160μs 1.6kV should be reduced. (Refer to the data of “Load current in adjacent
2 3
mounting vs. Ambient temperature characteristics.”)
* Set the varistor voltage to 150 V or less.
Recommended load voltage
2) The current limit function capability can be lost if used longer than As a guide in selecting PhotoMOS®, please refer to the following
the specified time. Be sure to set the output loss to the Max. rate. table.
1) Power photoMOS® (1 Form A)
Short circuit protection circuit
Absolute maximum rating Recommended
The short circuit protection circuit is designed to protect circuits from
Load voltage Load current load voltage
excess current. Therefore, surge current may be detected as current
overload in which case the output current will be cut and the off AQZ102 60 V DC 4.0 A DC 5, 12, 24 V DC
state maintained. For this reason, please include the inrush current DC AQZ105 100 V DC 2.6 A DC 48 V DC
in the load current and keep it below the maximum load current. type AQZ107 200 V DC 1.3 A DC 100 V DC
Also, in order to maintain stability of internal IC operation, maintain AQZ104 400 V DC 0.7 A DC 200 V DC
an input current of at least 5 mA (Latch type), 10 mA (Non Latch 12 V AC
type). AQZ202 Peak AC, DC 60 V Peak AC, DC 3.0 A
5, 12, 24 V DC
24 V AC
AC/ AQZ205 Peak AC, DC 100 V Peak AC, DC 2.0 A
Photovoltaic MOSFET driver cautions for use DC
48 V DC
When two external MOSFETs are connected with a common source type 48 V AC
AQZ207 Peak AC, DC 200 V Peak AC, DC 1.0 A
terminal, oscillation may occur when operation is restored. 100 V DC
Therefore, please insert a 100 to 1,000 Ω resistor between the gate 120 V AC
AQZ204 Peak AC, DC 400 V Peak AC, DC 0.5 A
terminal of the first MOSFET and the gate terminal of the second 200 V DC
MOSFET.
2) Power photoMOS® (1 Form B)
A typical example of this is given in the circuit below.
Absolute maximum rating Recommended
1 6
Load voltage Load current load voltage
2 AC/
100 V AC
3 4 DC AQZ404 Peak AC, DC 400 V Peak AC, DC 0.5 A
200 V DC
type

3) Power photoMOS® Voltage-sensitive type (1 Form A)

Input LED current (for Standard type)
Absolute maximum rating Recommended
For rising and dropping ratio of input LED current (di/dt), maintain
Load voltage Load current load voltage
Min. 100 μA/s.
AQZ102D 60 V DC 3.6 A DC 5, 12, 24 V DC
Input voltage (for Power voltage-sensitive type) DC AQZ105D 100 V DC 2.3 A DC 48 V DC
For rising and dropping ratio of input voltage (dv/dt), maintain Min. type AQZ107D 200 V DC 1.1 A DC 100 V DC
100 mV/s. AQZ104D 400 V DC 0.6 A DC 200 V DC
12 V AC
AQZ202D Peak AC, DC 60 V Peak AC, DC 2.7 A
5, 12, 24 V DC
24 V AC
AC/ AQZ205D Peak AC, DC 100 V Peak AC, DC 1.8 A 48 V DC
DC
type AQZ207D Peak AC, DC 200 V Peak AC, DC 0.9 A 48 V AC
100 V DC
120 V AC
AQZ204D Peak AC, DC 400 V Peak AC, DC 0.45 A
200 V DC

4) Power photoMOS® High Capacity type (1 Form A)

Absolute maximum rating Recommended
Load voltage Load current load voltage

DC AQZ192 60 V DC 10 A DC 5, 12, 24 V DC
type AQZ197 200 V DC 5 A DC 100 V DC
12 V AC
AQZ202G Peak AC, DC 60 V Peak AC, DC 6 A
5, 12, 24 V DC
24 V AC
AC/ AQZ205G Peak AC, DC 100 V Peak AC, DC 4 A 48 V DC
DC
type AQZ207G Peak AC, DC 200 V Peak AC, DC 2 A 48 V AC
100 V DC
120, 240 V AC
AQZ206G2 Peak AC, DC 600 V Peak AC, DC 1 A
200, 400 V DC

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Please contact ..........

Electromechanical Control Business Division

1006, Oaza Kadoma, Kadoma-shi, Osaka 571-8506, Japan
industral.panasonic.com/ac/e/

©Panasonic Corporation 2021

ASCTB124E 202103 Specifications are subject to change without notice.