BIOMEMS (17BM831)

Hemanth Kumar G , Assistant Professor, Department of BME, ACSCE.

MODULE -4 : Materials for MEMS and Microsystems

Materials for MEMS and Microsystems: Substrates and wafers, Active Substrate
materials, Silicon as a Substrate material – Ideal Substrate, Crystal Structure,
Mechanical Properties of Silicon, Silicon Compounds, Silicon Peizoresistors,
Gallium Arsenide, Quartz, Polymers, Packaging Materials.

This chapter will cover the materials used in “silicon-based” MEMS and
microsystems. As such, silicon will be the principal material to be studied.

Other materials to be dealt with are silicon compounds such as: SiO2,
SiC, Si3N4 and polysilicon.

Also will be covered are electrically conducting of silicon piezoresistors

and piezoelectric crystals for electromechanical actuations and signal
transductions.

An overview of polymers, which are the “rising stars” to be used as MEMS

and microsystems substrate materials, will be studied too.
 Silicon – an ideal substrate material for MEMS

● Silicon (Si) is the most abundant material on earth. It almost always exists in
compounds with other elements.

● Single crystal silicon is the most widely used substrate material for MEMS
and microsystems.

● The popularity of silicon for such application is primarily for the following
reasons:

(1) It is mechanically stable and it is feasible to be integrated into electronics

on the same substrate (b/c it is a semiconducting material).

(2) Electronics for signal transduction such as the p or n-type piezoresistive

can be readily integrated with the Si substrate-ideal for transistors.

(3) Silicon is almost an ideal structure material. It has about the same
Young’s modulus as steel ( 2x105 MPa), but is as light as aluminum
with a density of about 2.3 g/cm3.
 Silicon – an ideal substrate material for MEMS-Cont’d

(4) It has a melting point at 1400oC, which is about twice higher than that of
aluminum. This high melting point makes silicon dimensionally stable
even at elevated temperature.

(5) Its thermal expansion coefficient is about 8 times smaller than that of
steel, and is more than 10 times smaller than that of aluminum.

(6) Silicon shows virtually no mechanical hysteresis. It is thus an ideal

candidate material for sensors and actuators.

(7) Silicon wafers are extremely flat for coatings and additional thin film
layers for either being integral structural parts, or performing precise
electromechanical functions.

(8) There is a greater flexibility in design and manufacture with silicon than
with other substrate materials. Treatments and fabrication processes
for silicon substrates are well established and documented.
 Single-Crystal Silicon
● For silicon to be used as a substrate material in integrated circuits and
MEMS, it has to be in a pure single-crystal form.
● The most commonly used method of producing single-crystal silicon is the
Czochralski (CZ) method.

The Czochralski method for producing single-crystal silicon

Puller
Equipment: a crucible and a “puller”.
Quartz
crucible Graphite
Seed susceptor
Procedure:
crystal (1) Raw Si (quartzite) + coal, coke, woodchips)
Silicon
boule are melted in the crucible.
Heating element

(2) A “seed” crystal is brought to be in contact

Heating element

with molten Si to form larger crystal.

Silicon melt (3) The “puller” slowly pulls the molten Si up
to form pure Si “boule” after the
solidification.
(4) The diameters of the “bologna-like” boules
vary from 100 mm (4”) to 300 mm (12”) in
diameters.
Chemical reaction for the process: SiC + SiO2 → Si + CO + SiO
Pure silicon wafers

Pure silicon boules of 300 mm

diameter and 30 ft long, can
weigh up to 400 Kg.
A pure silicon boule

These boules are sliced into

300 mm
thin disks (wafers) using 200 mm
wafer
diamond saws. wafer

Standard sizes of wafers are:

100 mm (4”) diameter x 500 m thick.

150 mm (6”) diameter x 750 m thick.
200 mm (8”) diameter x 1 mm thick
300 mm (12”) diameter x 750 m thick (tentative).
Single Silicon Crystal Structure

● Single silicon crystals are basically of “face-cubic-center” (FCC)

structure.
● The crystal structure of a typical FCC crystal is shown below:
z
Atoms

Lattice

x
Note: Total number of atoms: 8 at corners and 6 at faces = 14 atoms
 Single Silicon Crystal Structure-Cont’d

● Single crystal silicon, however has 4 extra atoms in the interior.

● The situation is like to merge two FCC crystals together as shown below:

(a) Merger of two FCC (b) Merged crystal structure

● Total no. of atoms in a single silicon crystal = 18.

● The unsymmetrical distribution of atoms within the crystal make pure

silicon anisotropic in its mechanical properties.

● In general, however, we treat silicon as an isotropic material.

The Miller Indices
● Miller indices are commonly use to describe the faces of crystalline materials.
z
● A plane intersects x, y and z-coordinates at
P(x,y,z) a, b and c.
c y
b
● A point on the plane located at P(x,y,z)
a
● The equation defines the P(x,y,z) is:
x y z1
x  (7.1)
a b c
Express Eq. (7.1) in a different form:
hx  ky  mz  1 (7.2)
in which h = 1/a, k = 1/b and k = 1/c.

● Miller indices involve:

(hkm) = designation of a “face”, or a plane;

<hkm> = designation of a direction that is perpendicular to the (hkm) plane.

● NOTE: In a cubic crystal, such as silicon, a = b = c = 1

The 3 Distinct Planes of a Cubic Crystal
z

y
y y

x
x x
Figure A Figure B Figure C

Top face: Plane (001) Diagonal face: Plane (110) Incline face:
Plane (111)
Right face: Plane (010)

Front face: Plane (100)

The 3 Principal Planes of a Silicon Crystal
(y) <001>

001)

The (100) group (010)

(100)
y (x)<100>

x (z)<010>

The (110) group The (111) group

y
y

x
x
The 3 Principal Planes of a Silicon Crystal-Cont’d
0.543 nm 0.768 nm 0.768 nm

0.768 nm
(100) Plane (110) Plane (111) Plane
Diagonal Plane Inclined Plane
●Characteristics of silicon by principal planes:

(1) The (100) planes contain least number of atoms→ the weakest plane
→ easiest to work with.
(2) The (110) planes offers the cleanest surfaces in micro fabrications.
(3) The (111) contains shortest bonds between atoms → strongest plane
→ toughest to work with.
Miller Index for Orientation Young’s Modulus, E (GPa) Shear Modulus, G (GPa)

<100> 129.5 79.0

<110> 168.0 61.7

<111> 186.5 57.5

NOTE: The (100) plane makes an angle of 54.74o with the (111) plane.
 (Bulk) Mechanical and Thermophysical Properties of Silicon

Legend: y = yield strength; E = Young’s modulus;  = mass density; C = specific heat;

k = thermal conductivity;  = coefficient of thermal expansion, TM = melting point.

y E  C k  TM
(109 N/m2) (1011 N/m2) (g/cm3) (J/g-oC) (W/cm-oC) (10-6/oC) (oC)

Si 7.00 1.90 2.30 0.70 1.57 2.33 1400

SiC 21.00 7.00 3.20 0.67 3.50 3.30 2300
Si3N4 14.00 3.85 3.10 0.69 0.19 0.80 1930
SiO2 8.40 0.73 2.27 1.00 0.014 0.50 1700
Aluminum 0.17 0.70 2.70 0.942 2.36 25 660
Stainless Steel 2.10 2.00 7.90 0.47 0.329 17.30 1500
Copper 0.07 0.11 8.9 0.386 3.93 16.56 1080
GaAs 2.70 0.75 5.30 0.35 0.50 6.86 1238
Ge 1.03 5.32 0.31 0.60 5.80 937
Quartz 0.5-0.7 0.76-0.97 2.66 0.82-1.20 0.067-0.12 7.10 1710

* Principal source for semiconductor material properties: “Fundamentals of Microfabrication”, Marc

Madou, CRC Press, 1997
 Silicon Compounds
There are 3 principal silicon compounds used in MEMS and microsystems:
Silicon dioxide (SiO2), Silicon carbide (SiC) and silicon nitride (Si3N4) – each
Has distinct characteristic and unique applications.

Silicon dioxide (SiO2)

● It is least expensive material to offer good thermal and electrical insulation.

● Also used a low-cost material for “masks” in micro fabrication processes

such as etching, deposition and diffusion.

● Used as sacrificial material in “surface micromachining”.

● Above all, it is very easy to produce:

- by dry heating of silicon: Si + O2 → SiO2

- or by oxide silicon in wet steam: Si + 2H2O → SiO2 + 2H2

Silicon dioxide (SiO2) – cont’d

Properties Values
Density (g/cm3) 2.27
Resistivity (-cm) 1016
Dielectric constant 3.9
Melting point (oC) 1700
Specific heat (J/g/oC) 1.0
Thermal conductivity (W/cm/oC) 0.014
Coefficient of thermal expansion (ppm/oC) 0.5

Silicon carbide (SiC)

Its very high melting point and resistance to chemical reactions make it ideal
candidate material for being masks in micro fabrication processes.

It has superior dimensional stability.

 Silicon nitride (Si3N4)
● Produced by chemical reaction:
3SiCl2H2 + 4NH3 → Si3N4 + 6HCL + 6H2
● Used as excellent barrier to diffusion to water and ions.
● Its ultra strong resistance to oxidation and many etchants make it a
superioor material for masks in deep etching.
● Also usAed as high strength electric insulators.
● Selected properties Si3N4 films are as follows:

Properties LPCVD* PECVD**

Deposition temperature (oC) 700-800 250-350
Density (g/cm3) 2.9-3.2 2.4-2.8
Film quality Excellent Poor
Dielectric constant 6-7 6-9
Resistivity (-cm) 1016 106-1015
Refractive index 2.01 1.8-2.5
Atom % H 4-8 20-25
Etch rate in concentrated HF 200 A/min
Etch rate in boillng HF 5-10A/min
Poisson’s ratio 0.27
Young’s modulus (GPa) 385
Coefficient of thermal expansion, ppm/oC 1.6
* Low pressure chemical vapor deposition; ** Plasma enhanced chemical vapor deposition
 Polycrystalline silicon

● It is usually called “Polysilicon”.

● It is an aggregation of pure silicon crystals with randomly orientations

deposited on the top of silicon substrates:
Random small
polysilicon grains

A few microns
Oxide layer

Silicon substrate m

● These polysilicon usually are highly doped silicon.

● They are deposited to the substrate surfaces to produce localized

“resistors” and “gates for transistors”

● Being randomly oriented, polysilicon is even stronger than single silicon

crystals.
Polycrystalline silicon – cont’d

Comparison of Mechanical Properties of Polysilicon with Other Materials

Materials Young’s modulus Poisson’s ratio Coefficient of

(GPa) thermal expansion
(ppm/oC)
As substrates:
Silicon 190 0.23 2.6
Alumina 415 8.7
Silica 73 0.17 0.4

As thin films:
Polysilicon 160 0.23 2.8
Thermal SiO2 70 0.2 0.35
LPCVD SiO2 270 0.27 1.6
PACVD SiO2 2.3
Aluminum 70 0.35 25
Tungsten 410 0.28 4.3
Polymide 3.2 0.42 20-70
 Silicon Piezoresistors

Piezoresistance = a change in electrical resistance of solids when

subjected to stress fields. Doped silicon are
piezoresistors (p-type or n-type).
Relationship between change of resistance {∆R} and stresses {σ}:

{R} = [] {} (7-6)

where {R} = { Rxx Ryy Rzz Rxy Rxz Ryz}T represents the
change of resistances in an infinitesimally small cubic piezoresistive
crystal element with corresponding stress components:
{} = {xx yy zz xy xz yz}T and [π] = piezoresistive coefficient matrix.
Mechanical
load
A silicon piezoresistance
subjected to a stress field: p- or n-type yz
silicon zy xy 
xx
y zz zx xz x
x
z
z
 Silicon Piezoresistors – Cont’d
● Due to equilibrium condition, there are six independent stress components:
3 normal stress components and 3 shearing stress components.
● Consequently, the piezoresistive coefficient matrix has the components:
 11  12 12 0 0 0  
  

 12  11  12 0 0 0 
 12  12 11 0 0 0 
   

(7.7)
0 0 0  44 0 0 
0 0 0 0  44 0 
 

0 0 0 0 0  44 
● Expanding Eq. (7.6) result in the following:
 Rxx   11 xx   12  yy   zz   Rxy   44  xy

 Ryy  11 yy   12  xx   zz   Rxz   44  xz

 Rzz   11 11   12  xx   yy   Ryz   44  yz

● Note: Only 3 piezoresistive coefficients are required; π11 and π12 associated
with normal stresses and π44 with shearing stresses.
 Silicon Piezoresistors – Cont’d

Numerical values of piezoresistive coefficients

Silicon piezoresistors at room temperature
Materials Resistivity
(-cm)
11* 12* 44*

p-silicon 7.8 +6.6 -1.1 +138.1

n-silicon 11.7 -102.2 +53.4 -13.6

Silicon piezoresistors
Leads x
y T-direction
R 
  L L   T  T
R
p- or n-type Si
 Silicon Piezoresistors – Cont’d

Numerical values of piezoresistive coefficients

Leads x
R 
y T-direction
  L L   T  T
R

p- or n-type Si

Piezoresistive coefficients of p-type silicon piezorestors in various directions

Crystal Planes Orientation Orientation L T

<x> <y>
(100) <111> <111> +0.6644 -0.3344
(100) <110> <100> +0.544 0
(100) <110> <110> +0.544 -0.544
(100) <100> <100> +0.0244 +0.0244
Example 7.3 Estimate the change of resistance in silicon piezoresistors
attached to the diaphragm of a pressure sensor in Example 4.4.

From Example 4.4, the corresponding maximum stress

at the mid-span of each of the 4 edges is:
Piezoresistor, A σmax = 186.81 MPa with an applied pressure at 70 MPa.

(100 Plane) We may thus let: σL = σT = σmax = 186.8 MPa, or

B
C
L = max
= 186.8x106 Pa (N/m2)

T = max
Since the diaphragm is on (100) face, the
two piezoresistive coefficients are:
D
266 m
π L = πT = 0.02 π44
480 m
783 m

1085 m But π44 = 138.1 x 10-11 Pa-1 from the Table,

2500 m we thus have:


 
R 
R
    
L L
 T T
2 44 max
 2  0.02(138.110 11
)(186.810 6
)  0.01032 Ω/Ω
 Temperature sensitivity of silicon piezoresistors

A major deficiency of silicon piezoresistors is its sensitivity of temperature

as indicated in the table:

Doping p-Type TCR p-Type TCP n-Type TCR n-Type TCP

concentration (% per oC) (% per oC) (% per oC) (% per oC)
(1018/cm3)

5 0.0 -0.27 0.01 -0.28

10 0.01 -0.27 0.05 -0.27
30 0.06 -0.18 0.09 -0.18
100 0.17 -0.16 0.19 -0.12

TCR = temperature coefficient of resistance;

TCP = temperature coefficient of piezoresistivity.

Example: a p-type silicon piezoresistor with a doping of 1019 atoms/cm3,

The loss of piezoresistivity is 0.27%/oC. In an operating temperature of 120oC,
It would lose (120-20)x0.27% = 27% of the value of the piezoresistivity coefficient.
 Gallium Arsenide (GaAs)
● GaAs is a compound simiconductor with equal number of Ga and As atoms.

● Because it is a compound, it is more difficult to process.

● It is excellent material for monolithic integration of electronic and

photonic devices on a single substrate.

● The reason for being excellent material for photoelectronics is its high
electron mobility (7 times more mobile than silicon):

Materials Electron Mobility, m2/V-sec

Aluminum 0.00435
Copper 0.00136
Silicon 0.145
Gallium Arsenide, GaAs 0.850
Silicon oxide 0
Silicon nitride 0
Gallium Arsenide (GaAs)-Cont’d

● GaAs is also a good thermal insulator.

● Low yield strength (only 1/3 of that of silicon) – “bad”.

● A comparison of GaAs and silicon as substrate materials in

micromachining:

Properties GaAs Silicon

Opto-electronics Very good Not good
Piezoelectric effect Yes No
Piezoelectric coefficient (pN/oC) 2.6 Nil
Thermal conductivity Relatively low Relatively high
Cost High Low
Bonding to other substrates Difficult Relatively easy
Fracture Brittle, fragile Brittle, strong
Operating temperature High Low
Optimum operating temp. (oC) 460 300
Physical stability Fair Very good
Hardness (GPa) 7 10
Fracture strength (GPa) 2.7 6
Quartz Z-axis
Si
● Quartz is a compound of SiO2.
● The single-unit cell is in shape of tetrahedron:
● Quartz crystal is made of up to 6 rings with O2
O2
6 silicon atoms.
O2

Properties Value  Z Value  Z Temperature

Dependency
Thermal conductivity 29x10-3 16x10-3 with T
(Cal/cm/sec/oC)
Relative permittivity 4.6 4.5 with T
Density (Kg/m3) 2.66x103 2.66x103
Coefficient of thermal 7.1 13.2 with T
expansion (ppm/oC)
Electrical resistivity (/cm) 0.1x1015 20x1015 with T
Fracture strength (GPa) 1.7 1.7 with T
Hardness (GPa) 12 12
 Quartz-Cont’d

● Quartz is ideal material for sensors because of its extreme dimensional

stability.

● It is used as piezoelectric material in many devices.

● It is also excellent material for microfluics systems used in biomedical

applications.

● It offers excellent electric insulation in microsystems.

● A major disadvantage is its hard in machining. It is usually etched in

HF/NH4F into desired shapes.

● Quartz wafers up to 75 mm diameter by 100 µm thick are available

commercially.
 Piezoelectric Crystals
● Piezoelectric crystals are solid ceramic compounds that produce
piezoelectric effects:
Induced Mechanical
Mechanical Deformation
Forces

Applied Voltage, V
V

Mechanical force induced Electric voltage induced

electric voltage mechanical deformation

● Natural piezoelectric crystals are: quartz, tourmaline and sodium

potassium tartrate.

● Synthesized crystals are: Rochelle salt, barium titanate and lead

zirconate.
 Piezoelectric Crystals – Cont’d
Induced Mechanical
Mechanical Deformation
Forces

Applied Voltage, V
Mechanical force induced Electric voltage induced
electric voltage mechanical deformation

Mechanical strain by electric field: Electric field by stress:

ε=dV V=fσ
where ε = induced strain where V = generated voltage in
d = piezoelectric coefficient volts/m
V = applied voltage, V/m σ = applied stress in Pa

1
E
fd
 Piezoelectric Crystals – Cont’d
Piezoelectric coefficients:

Piezoelectric Crystals Coefficient, d Electromechanical

(10-12 m/volt) conversion factor, K**
Quartz (crystal SiO2) 2.3 0.1
Barium titnate (BaTiO3) 100-190 0.49
Lead zirconate titanate, PZT 480 0.72
(PbTi1-xZrxO3)
PbZrTiO6 250

PbNb2O6 80

Rochelle salt 350 0.78

(NaKC4H4O6-4H2O)
Polyvinylidene fluorid, PVDF 18

**K 2  Output of mechanical energy or K 2 

Output of electrical energy
Input of electrical energy Input of mechanical energy
Example 7.4

A thin piezoelectric crystal film, PZT is used to transduce the signal in a micro
accelerometer involving a cantilever beam made of silicon. The accelerometer
is design for maximum acceleration/deceleration of 10 g.

The PZT transducer is located at the support of the cantilever beam where the
maximum strain exists (near the support) during the bending of the beam
as illustrated below.

Determine the electrical voltage output from the PZT film at a maximum
acceleration/deceleration of 10 g.

PZT crystal Mass: 2 m

(see detail A) max
m = 10 mg
A 10 m

A 50 m
1000 m max

View A-A Detail A

Example 7.4 – Cont’d
Solution:
Use Newton’s 2nd law to find the equivalent dynamic force with an acceleration
of 10 g: Peq = ma = (10x10-6)x(10x9.81) =981x10-6 N
Peq

The maximum bending moment is:

Mmax = PeqL = (981x10-6)(1000x10-6) = 0.981x10-6 N-m and it occurs at the built-in end

The corresponding maximum stress is:

M max C (0.981x106 )(25x106 )
 max  I   235.36x106 Pa
(0.1042x1018 )
 max  235.36x10  123.87x105 6
and the maximum strain is:  max  m/m
E 1.9x1011

The voltage generated in the PZT piezoelectric crystal is:

 5
V     max  123.87x10  0.258x107 Volts/m
d d 480x1012

or v = Vl = (0.258x107)(4x10-6) = 10.32 volts

 Example 7.5

Piezoelectric
Determine the required electric Teflon Actuator
voltage for ejecting a droplet of ink Coating
2000 m 
from an inkjet printer head using PZT
piezoelectric crystal as a pumping V
mechanism.
10 m

The ejected ink will have a resolution of Inkwell

300 dpi (dots per inch). The ink droplet
is assumed to produce a dot with a film
thickness of 1 m on the paper.

Ejection nozzle
The geometry and dimension of the diameter, d
printer head is illustrated below. Ink droplet:
Sphere with diameter, d
Assume that the ink droplet takes a
shape of a sphere and the inkwell is 1 m Dot on paper
Paper
always re-filled after ejection.
 Example 7.5 – Cont’d
Piezoelectric
Teflon Actuator
Solution: Coating
2000 m 
● Determine the ejection nozzle diameter, d: 
V

The diameter of the dot film on the paper is: 10 m

Inkwell
D = 1/300 inch = 0.084666 mm = 84.67 µm

By equating the volumes of the dot sphere

the flat dot on the paper, we have: Ejection nozzle

 2
r   D t
4 
3  Ink droplet:
Sphere with diameter, d
diameter, d

3 4  1 m Dot on paper
 Paper
D
from which, we get the radius of the
dot, r = 11.04x10-6 m, with D = 84.7 µm and t = 1 µm
 Example 7.5 – Cont’d

● We assume that:
Piezoelectric
Teflon Actuator
Volume of an ink droplet Coating
leaving the ink well 2000 m 

V
= Volume created by vertical 10 m
expansion of the PZT cover
Inkwell

Let W = vertical expansion of the PZT cover

induced by the applied voltage, V Ejection nozzle
∆ = diameter of the PZT cover = 2000 µm diameter, d
Ink droplet:
Sphere with diameter, d

1 m Dot on paper
Paper
We will have:
D

4 V dot 4x5629.21x1018
W    1791.83x10 12 m
 2
3.1416(2000x106 )2
 Example 7.5 – Cont’d
Piezoelectric
● The corresponding strain in the PZT Teflon Actuator
Coating
piezoelectric cover is: 2000 m 

V
W 12
 
1791.83x10
 179.183x106 m/m 10 m
L 6
10x10

Inkwell

The piezoelectric coefficient of the PZT

crystal is d = 480x10-12 m/v, leading to
the required voltage to be:
Ejection nozzle

 6 diameter, d
V    179.183x10  0.3733x106 volts/m
Ink droplet:
Sphere with diameter, d
d 480x1012 1 m Dot on paper
Paper
or D

v  LV  10x106 0.3733x10   3.733

6 volts
 Polymers

What is polymer?
Polymers include: Plastics, adhesives, Plexiglass and Lucite.

Principal applications of polymers in MEMS:

● Currently in biomedical applications and adhesive bonding.
● New applications involve using polymers as substrates with
electric conductivity made possible by doping.

Molecular structure of polymers:

● It is made up of long chains of organic (hydrocarbon) molecules.
● The molecules can be as long as a few hundred nm.

Characteristics of polymers:
● Low melting point; Poor electric conductivity
● Thermoplastics and thermosets are common industrial products
● Thermoplastics are easier to form into shapes.
● Thermosets have higher mechanical strength even at temperature
up to 350oC.
Polymers as industrial materials

Polymers are popular materials used for many industrial products for the
following advantages:

● Light weight

● Ease in processing

● Low cost of raw materials and processes for producing polymers

● High corrosion resistance

● High electrical resistance

● High flexibility in structures

● High dimensional stability

 Polymers for MEMS and microsystems

(1) Photo-resist polymers are used to produce masks for creating desired
patterns on substrates by photolithography technique.
(2) The same photoresist polymers are used to produce the prime mold with
desirable geometry of the MEMS components in a LIGA process in micro
manufacturing.
(3) Conductive polymers are used as “organic” substrates for MEMS and
microsystems.
(4) The ferroelectric polymers that behave like piezoelectric crystals can be used
as the source of actuation in micro devices such as in micro pumping.
(5) The thin Langmuir-Blodgett (LB) films can be used to produce multilayer
microstructures.
(6) Polymers with unique characteristics are used as coating substance to
capillary tubes to facilitate effective electro-osmotic flow in microfluidics.
(7) Thin polymer films are used as electric insulators in micro devices,
and as dielectric substance in micro capacitors.
(8) They are widely used for electromagnetic interference (EMI) and radio
frequency interference (RFI) shielding in microsystems.
(9) Polymers are ideal materials for encapsulation of micro sensors and
the packaging of other microsystems.
Conductive Polymers

● Polymers are poor electric conducting materials by nature.

● A comparison of electric conductivity of selected materials are:

Materials Electric Conductivity, S/m*

Conductors:
Copper, Cu 106-108
Carbon 104

Semiconductors:
Germanium, Ge 100
Silicon 10-4-10-2

Insulators:
Glass 10-10-10-8
Nylon 10-14-10-12
SiO2 10-16-10-14
Polyethlene 10-16-10-14

* S/m = siemens per meter = Ω-1 = A2-s3/Kg-m2

Conductive Polymers – Cont’d
Some polymers can be made electrically conductive by the following
3 methods:

(1) Pyrolysis:
at 600oC
Pyropolymer-base Conductive polymer
Amine =
Phthalonitrile resin as high as 2.7x104 S/m

(2) Doping:
Introducing metal atoms into molecular matrices of polymers
→ Conductive polymers
Polymers groups Dopants
Polyacetylenes (PA) Br2, I2, AsF5, HClO4 and H2SO4 for p-type
Sodium naphthalide in tetrahydrofuran for n-type
Polyparaphenylenes (PPP) AsF5 for p-type; alkali metals for n-type
Polyphenylene sulfide (PPS) AsF5

(3) Insertion of conductive fibers:

Fibers made of Au, Ag, stainless steel, aluminum fibers and flakes.
 Langmuir-Blodgett (LB) films

● The process was first introduced by Langmuir in 1917 and was later
refined by Blodgett. That was why it is called Langmuir-Blodgett
process, or LB films.

● The process involves the spreading volatile solvent over the surface-active
substrate materials.

● The LB process can produce more than one single monolayer by depositing
films of various compositions onto a substrate to produce a multilayer
structure.

● LB films are good candidate materials for exhibiting ferro (iron)- , pyro (heat)-
and piezoelectric properties. LB films may also be produced with controlled
optical properties such as refractive index and anti reflections.

They are thus ideal materials for micro sensors and optoelectronic devices.
 Langmuir-Blodgett (LB) films – Cont’d

● Following are a few examples of LB film applications in microsystems:

(1) Ferroelectric (magnetic) polymer thin films:

● The one in particular is the Poly-vinylidene fluoride (PVDF).

● Applications of this type of films include:
- Sound transducers in air and water,
- Tactile sensors,
- Biomedical applications such as tissue compatibility,
cardio-pulmonary sensors and implantable transducers
and sensors for prosthetics and rehabilitation devices.
● As a piezoelectric source. The piezoelectric coefficient of PVDF is given
in Table 7-14.

(2) Coating materials with controllable optical properties:

● Broadband optical fibers that transmit light at various wavelengths.
Langmuir-Blodgett (LB) films – Cont’d

(3) Microsensors:

Many electrically conducting polymeric materials are sensitive to the

exposed gas and other environmental conditions. So they are suitable
materials for micro sensors.

Its ability of detecting specific substances relies on the reversible and

specific absorption of species of interest on the surface of the polymer
layer and the subsequent measurable change of conductivity of the polymer.
Gas Sample
Conductive
Dielectric Polymer
Plastic A gas sensor:
Encapsulant Electrical conductivity changes
V with absorption of the exposed
p-Silicon Substrate gas.
 SU-8 Photoresists

• It is a negative epoxy-based polymer sensitive to UV light (λ = 350-400 nm)

• It is used for thin-film production with thickness from 1 m to 2 mm
• Reasons for it being popular in MEMS:
• Can be built to thick films for 3-D MEMS structures (aspect ratio to 50)
• Much lower production costs than thick films by silicon
• It is commercially available in liquid form
• SU-8 films can be produced by a spin-process:
Dispenser
Resist Edge
Resist Photoresist
spray bead
puddle Wafer Catch cup
Wafer
Vacuum
Vacuum chuck chu ck
Spinner
motor
SU8-100 SU8-50
To drain &
Film thickness

exhaust
(micrometer)

To vacuum
pump

Spin speed (rpm)

 Mechanical Properties of SU-8 Polymer
Young’s modulus 4400 MPa

Poisson’s ratio 0.22

Viscosity 0.06 Pa-s (40% SU-8 – 60% solvent)

1.50 Pa-s (60% SU-8 – 40% solvent)
15.0 Pa-s (70% SU-8 – 30% solvent)

Coefficient of thermal expansion* 0.183 ppm /oC

Thermal conductivity 0.073 W/cm-oC

Glass transition temperature 200oC

Reflective index 1.8 at 100 GHz

1.7 at 1.6 THz
Absorption coefficient 2/cm at 100 GHZ
40/cm a 1.6 THz
Relative dielectric constant 3 at 10 MHz

Source: Guerin 2005. * in comparison to 2.33 ppm/oC for silicon

 Typical Process Flow for Constructing SU-8 Films

(1) (2) (3)

Substrate Spin-coating Soft
treatment SU-8 photoresist bake
(e.g. silicon wafer, washed inH2SO4
+H2O2, baked at 200oC for 5 min) (spin @ desired speed for 30 s)

(4) (5) (6)

Exposure to Post expose Develop
UV light bake SU-8 photoresist
by supplier) (following instruction by supplier)
(required time
(in chemical
solvent)
(8) (9)
(7) Rinse Hard SU-8 film
& dry bake removal

(in de-ionized water) (@150-200oC) (in special liquid bath, or laser

ablation, and pyrolosis, or as
instructed by the supplier)
 Packaging Materials

Unlike IC packaging in which plastic or ceramic are extensively used as

encapsulate materials for the delicate IC circuits, MEMS packaging
involve a great variety of materials-varying from plastic and polymers
to stainless steel, as can be seen in a specially packaged micro
pressure sensor:
Cylindrical metal casing

Metal wires Square silicon die

& pad
Adhesive die bond
Metal interconnect pins
SiO2 insulator
Pyrex glass
Constraint base
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