Low temperature co-fired ceramic processing

The very rapid evolution of semiconductor IC technology has put immense pressure on the packaging
technologies. The new packages must have increasingly smaller footprints, simultaneously offering
improved performance in handling high frequency clocks, very large number of pin-outs and
capability to handle and dissipate large heat densities. In other realms there is a need for multilayer
solution for miniaturizing the HF circuits in GHz range, while the Micro Electro Mechanical System
(MEMS) devices need an one technology solution for packaging sensors / actuators requiring
electrical, optical, fluidic and mechanical ‘interconnects’. The Low Temperature Co-fired Ceramic (LTCC)
Technology offers and ‘integrated’ solutions to these problems.
Low temperature co-fired ceramic processing

LTCC (Low Temperature Co-fired Ceramics) is a multi-layer glass ceramic substrate which is Co-fired with low resistance
metal conductors at low firing temperature (less than 1000℃). It is sometimes referred to as "Glass Ceramics" because its
composition consists of glass and alumina.
LTCC Fabrication Process
• The process starts with via punching of each layer as per individual layer design.
• If the layer requires any open or buried cavity, it is prepared using the same machine.
• The alignment holes are also punched using via puncher.
• Via filling is done subsequently, using stencil printing.
• This is followed by screen printing of conductor pattern using usual screen printing process.
• Once individual layers are ready, those layers are stacked in sequence, and aligned mechanically.
• The stacks are then sealed in a plastic bag are and laminated under prescribed temperature-pressure cycle
using isostatic laminator.
• The individual circuits are then singulated using cutter and fired using a special programmable batch furnace.
• All the fabrication processes described above, are carried out in Class 10000 Clean Room.
• For preparing packages, there are two main post firing processes that remain at this stage. One, processes for
preparing BGA, and second, processes for sealing. We have chosen two possible options for sealing
processes, viz. Solder sealing and Seam sealing and three BGA formation processes, viz. sphere
attachment, stencil printing and electroplating. Following is the brief description of sealing and BGA
formation processes.
Solder sealing
Solder sealing is done using solder performs. This needs conducting and solderable surfaces on either side.
Further, interconnection from lid to base would also require similar pads. As per present plan, these conducting
surfaces would be made using a co-fired Ag-Pd paste. Finally, solder sealing is done by reflow after
components are placed.

Seam Sealing
Seam sealing requires brazing of metallic parts to the ceramic substrate. Brazing is a three step process that
requires post-fire adhesion layer, post fire barrier layer, brazing layer, each being individually printed and fired.
The brazing layer is a low temperature alloy, and is required to be fired with the metallic part. The BGA could
then be formed by one of the processes described below. It may be noted here that final sealing process by
seam sealing can be done only after components are placed inside the base.

BGA Formation Processes

The three process options selected here have their own advantages and disadvantages. Sphere attachment is done
using pre-formed solder spheres which could be attached using another solder paste or through reflow of the same
BGA spheres. This process is simple, and cheap, but has limitations in terms of minimum BGA size. The stencil
printing process is also cheap, slightly more process dependent but can make BGAs with sizes up to even 100µm
but with relaxed pitch. The electroplating process is having more process steps making it costlier, but is capable of
even sub-100µm BGA with equal pitch. Through the present project we are attempting an exploration of each one of
this process. The materials selection for each process has to be done very carefully so as to ensure subsequently
lower temperature steps.
Sphere Attachment
BGA by solder sphere attachment is done by directly placing micro-spheres of high-Pb solder on conducting pads
with high alignment accuracy. The solder pads are dispensed with a viscous flux or attachment solder paste prior to
this placement. Reflow of these solder spheres or attachment solder paste would produce BGAs.

Stencil printing
For good adhesion, one requires Under Bump Metallurgy (UBM) or adhesion / barrier layers before solder
deposition. High lead Sn-Pb Solder is deposited by printing solder paste onto the Under Bump Metallurgy (UBM)
by stencil printing process and reflowing the solder paste to form a spherical solder bump.

Electroplating
In this case the UBM consists typically of an evaporated adhesion layer that provides conducting path for
electroplating, followed by photolithography to open areas of BGA pads. The BGA pads are then electroplated with
adhesion enhancing and solder-barrier layers. Plating of the high lead Sn-Pb solder alloy is then done over the UBM
followed by removal of resist and underlying evaporated seed layer. The final step is of reflow that forms the solder
bump.
LTCC Advantages
•Multilayer capability- means interconnect density limited only by the installed process capabilities

•Compatibility with flip chip process

means capability to handle and redistribute large number of I/Os

•Capability to integrate passives

means appropriation of additional components within the package which otherwise are accommodated
out of the package

•HF capability up to millimeter wave…

means integration of front-end modules in communication devices

•Integration of Si and other technology devices simultaneously

Flexibility to choose integration scheme

•but the system designer has to work in tandem with chip manufacturers
Ceramic process brings high reliability
•Capability of handling electrical, optical, fluidic and mechanical interconnects in and out of the
package
Amenable to automated wafer assembly; useful tool for fast prototyping
•TCE matching with semiconductor device materials
Application examples
- Nozzles that require conductors.
• Nozzle for atmospheric pressure plasma cleaning equipment.
It is possible to appropriately design the internal conductor pattern shape and the distance between conductors depending
on the type of gas used. The shape for rectification at the nozzle tip is also available.

- Substrate utilizing the hollow as a flow path.

• Sensor unit that analyzes gas and liquid components.
• Substrate that resists high temperatures by the flow of cooling gas and liquid through it.

- Substrate with special characteristics, created by filling the hollow part with a different material.
• Substrate with excellent high frequency characteristics.
• Substrate filled with high shielding material to reduce signal interference.
• High heat dissipation substrate filled with high heat dissipation material.

- Built-in integrated component substrate for miniaturization and space saving.

(Note: The mounting part requires an opening)
• Component mounting, or built-in cavity substrate.

- Substrate that requires partial thermal insulation due to product configuration.

• Substrate where the effective temperature range differs between the upper and lower substrates, or the temperature on one
side is to be kept high (or low).