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Thermal Management in Electronics

The document is an assignment for a class on Thermal Management of Electronic Systems. It contains 10 questions covering various topics related to thermal management and microelectronic packaging. The questions address [1] the need for thermal management of electronics and its effect on component life, [2] Moore's Law and the history of microelectronics, and [3] the roles of different engineering disciplines in microelectronic packaging. Students are asked to write equations for power dissipation in electronic devices and explain terms related to heat transfer. They also must distinguish specific heats, explain conservation of mass and energy, and discuss how CFD software can help with electronic cooling. The final question requires identifying electronic components in photographs.

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135 views2 pages

Thermal Management in Electronics

The document is an assignment for a class on Thermal Management of Electronic Systems. It contains 10 questions covering various topics related to thermal management and microelectronic packaging. The questions address [1] the need for thermal management of electronics and its effect on component life, [2] Moore's Law and the history of microelectronics, and [3] the roles of different engineering disciplines in microelectronic packaging. Students are asked to write equations for power dissipation in electronic devices and explain terms related to heat transfer. They also must distinguish specific heats, explain conservation of mass and energy, and discuss how CFD software can help with electronic cooling. The final question requires identifying electronic components in photographs.

Uploaded by

PATEL PUNIT
Copyright
© © All Rights Reserved
We take content rights seriously. If you suspect this is your content, claim it here.
Available Formats
Download as PDF, TXT or read online on Scribd
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Assignment # 1

Sub: Thermal Management of Electronic Systems (2MEOE01)

Posting date: 25th Aug 2022 Submission date : 11th September, 2022
Max. Marks: 10

Q: 1. Explain the requirement of thermal management for electronic devices


and why it is relevant in modern technological world. How is the electronic
component life and reliability affected due to higher junction temperatures?

Q: 2. What do you understand by Moore’s Law? Trace the historical milestones


related to the development of electronic components/microelectronics.

Q: 3. What do you understand by the term “microelectronic packaging” and


three- level packaging hierarchy?
Justify the statement “Microelectronic packaging is perhaps the most cross-
disciplined of all technologies” highlighting the respective roles played by
Physics, Chemistry, Electrical Engineering, Computer Engineering, Mechanical
& Manufacturing Engineering, Materials Science, Chemical Engineering and
Environmental Engineering disciplines in context of microelectronic packaging.

Q: 4. Write the mathematical equations used in the estimation of theoretical


power dissipation through various active and passive electronic devices:
Active devices: CMOS, JFET, Power MOSFET
Passive devices: Interconnects, Resistors, Capacitors, Inductors and
Transformers.

Q: 5. Explain the terms: internal energy, enthalpy, specific heat, heat transfer
rate, heat flux. What are the units for each of the terms?

Q: 6. Distinguish between the specific heat at constant pressure(cp) and the


specific heat at constant volume(cv) for a compressible substance (such as air).
Which of two (cp or cv) is larger and why?

Q: 7. Using simple drawings, explain the principle of conservation of mass


applied to a control volume. Write the related equations for the same.

Q: 8. State the first law of thermodynamics. Using simple drawings, explain


the principle of conservation of energy for closed and open system respectively.
Write the related equations for the same.

Q: 9. Briefly explain how the computational fluid dynamics (CFD) can be helpful
in thermal management of electronic systems. Explore the various features
available in commercially available CFD software such as ANSYS
Fluent/ICEPAK for electronic cooling solutions.
Q: 10. The photographs of a PCB with various electronic components is shown
below (two views of same unit). From visual information available, identify and
name the type of electronic component in the photograph (such as resistor,
capacitor, transistor, etc.) marked as A to L.

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