KS4500 User Manual

Dicing Systems
Kulicke & Soffa Ltd.

Your Resource for Advanced Dicing Solutions
K&S 4500 Series

Digital Series Manual
Wire Bonders
Operations and Maintenance Manual
P/N 94500-000D-000-01 March 2002

Customer Support
Kulicke & Soffa Industries, Incorporated
2101 Blair Mill Road
Willow Grove, PA 19090 USA
Telephone: (215) 784-6788
Fax: (215) 784-6181
Confidential
The information presented in this volume is the property of
Kulicke & Soffa Industries, Inc.
Any reproduction, publication or distribution to a third party is strictly forbidden

unless written permission is given by an authorized agent of Kulicke & Soffa.
Kulicke & Soffa Industries Inc

K&S 4500 Digital Series Manual Wire Bonders Operations and Maintenance Manual
Record of Changes
RECORD OF CHANGES
Item New Part New Page Revision Date Comments
Number Number(s)
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Record of Changes
RECORD OF CHANGES
Item New Part New Page Revision Date Comments
Number Number(s)

iv
Safety First
SAFETY FIRST
Kulicke & Soffa believes that the safety of personnel working with and
around the Model 4500 Digital Series is the most important consideration.
Please read the following information before attempting to operate the
system or perform any maintenance function.
Important Safety Features

The Model 4500 Digital Series is equipped with a number of features
which are meant to help ensure your safety as well as the safety of the
system. Get to know each of them.
Protection Circuitry
The Model 4500 Digital Series is equipped with two fuses, one for the
general machine and one for workholders, which blows when overcurrent
is detected.
Safety Precautions
When working with or near the Model 4500 Digital Series, the following
safety precautions are strongly recommended.
1 The Model 4500 Digital Series must be connected to the Main Power
source through a Earth Leakage Circuit Breaker.
2 Always keep your hands out of the Working Area while the Bonding
Head is in operation.
3 Never touch the Heated Workholders with your hands or any material
having a low melting point.
The maximum temperature of the Heated Workholders is limited to
250!C. Wait 30 minutes before replacing the Heated Workholders,
illumination lamps or any other hot machine part to allow the parts to
cool down.
4 Beware of touching tools, as they may have sharp edges.
5 All maintenance tasks should be performed by trained, authorized

personnel. When indicated by the instructions in the Maintenance
Manual, contact K&S Customer Support before making the attempt.
6 Never perform any maintenance function while the Model 4500 Digital
Series is in operation. Always, power down the system first. Remove
the AC plug from the wall outlet as well.
Caution: If available at the site, perform the Lockout Procedure to eliminate

any chance of the AC plug being returned to the wall outlet before the end
of the maintenance procedure.
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Safety First
7 Read carefully all warnings given in the Maintenance Manual before

beginning any maintenance task.
8 No matter what the procedure, read carefully all instructions and study
the schematics and drawings provided before beginning to work.
9 Personnel who handle or remove printed circuit boards (PCBs) must be

grounded to avoid electrostatic discharge (ESD) damage. Banana
Grounding Sockets are located directly below the Base cover.
10 Obey all standard precautions for working with mechanical and

electrical equipment.
11 Left and Right Head doors may be opened for adjustment only while
the machine is in the RESET position.
12 The Back Cover should be opened only after powering down the
machine and removing the power cord from the wall outlet.
Specific Precautions for Models 4524D and

4524AD with N.E.F.O.
Do not touch the electrode or wire during bonding or when manually firing
the Negative Electric Flame Off (N.E.F.O.). The system produces a spark
between the N.E.F.O. electrode and the wire, which can cause an electric
shock if contacted during N.E.F.O. firing. The potential shock hazard is
not usually considered life threatening (IEC publication no. 479).
However, K&S recommends that those persons with abnormal heart
conditions or artificial heart stimulation devices (e.g. pacemakers) should
not be permitted to operate or service this equipment.
The N.E.F.O. produces high voltage within the N.E.F.O. box, in the
electrode and on the high voltage cable.
1 Do not open the N.E.F.O. box. If it becomes necessary to handle the

high-voltage cable or remove the N.E.F.O. box, unplug the machine
power cable and wait at least five minutes.
2 Use high voltage techniques at all times when handling the N.E.F.O.
box.
3 K&S recommends that during bonding operators use insulated gloves

and insulated tweezers.
Electrical Safety Labels

vi
About this Manual
About this Manual

This manual describes installation, operation and maintenance of the
K&S 4500 Digital Series Manual Wire Bonders. It is assumed that you are
knowledgeable about the wire bonding process. All procedures described in
this manual should be performed by qualified personnel only.
Note: Unless noted otherwise, the photographs in this manual show

views/items that are common for all models of the 4500 Digital Series.
Manual Contents
Chapter 1 Introduction
A general description of the K&S 4500 Digital

Series Manual Wire Bonders.
Chapter 2 Installation
Instructions and guidelines for installing your

K&S 4500 Digital Series Manual Wire Bonder.
Chapter 3 Physical Description
Description of the principal parts of the K&S

4500 Digital Series Manual Wire Bonder.
Chapter 4 Controls and Indicators
Description of the K&S 4500 Digital Series

Manual Wire Bonders switches, dials and
displays.
Chapter 5 Setup and Adjustments
Procedures and instructions for setting up and

adjusting the K&S 4500 Digital Series Manual
Wire Bonders for operation.
Chapter 6 Operation
Descriptions of bonding parameters and

procedures for setting bonding modes and
performing bonds.
Chapter 7 Maintenance Overview
General guidelines and adjustments checklist

for maintaining the K&S 4500 Digital Series
Manual Wire Bonders.
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About this Manual
Chapter 8 Electrical Subassemblies
Information for maintaining and adjusting the

K&S 4500 Digital Series Manual Wire Bonder
electrical subassemblies.
Chapter 9 Mechanical Subassemblies
Details about maintaining the main

mechanical subassemblies of the K&S 4500
Digital Series Manual Wire Bonders, including
procedures for adjusting and replacing
mechanical parts of the machine.
Chapter 10 Timing Diagrams
Diagrams of each machine’s bonding cycle time

and motion.
Chapter 11 Diagnostics
Description of the K&S 4500 Digital Series

Manual Wire Bonders’ diagnostics functions,
such as fault detection in the machine’s parts
or in the bonding cycle.
Chapter 12 Preventive Maintenance
Preventive maintenance procedures for various

subassemblies of the K&S 4500 Digital Series
Chapter 13 Troubleshooting
Procedures for troubleshooting the K&S 4500

Digital Series Manual Wire Bonders.
Chapter 14 Options and Accessories
Part numbers of optional items that are

available for the K&S 4500 Digital Series
Chapter 15 Parts List
Part numbers of all components and

assemblies of the K&S 4500 Digital Series

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Table of Contents
TABLE OF CONTENTS
1. INTRODUCTION__________________________________ 1-1
1.1 Product Description_______________________________________ 1-1
1.1.1 Model 4523D Wedge Bonder ______________________________ 1-1
1.1.2 Model 4523AD Auto-Stepback Wedge Bonder ______________ 1-1
1.1.3 Model 4524D Multi-Process Ball Bonder ____________________ 1-2
1.1.4 Model 4524AD Multi Process Auto-Stepback Ball Bonder ____ 1-2
1.2 Features _________________________________________________ 1-3

1.2.1 Common Standard Features _______________________________ 1-3
1.2.2 Optional Features_________________________________________ 1-4
1.3 Specifications ____________________________________________ 1-5

1.3.1 4523D __________________________________________________ 1-5
1.3.2 4523AD _________________________________________________ 1-7
1.3.3 4524D __________________________________________________ 1-9
1.3.4 4524AD ________________________________________________ 1-11
2. INSTALLATION __________________________________ 2-1

2.1 Pre-installation Requirements ______________________________ 2-1
2.2 Unpacking and Installation ________________________________ 2-2
2.3 Microscope Installation ___________________________________ 2-9

2.3.1 Leica S6/MZ-6 Microscope Installation _____________________ 2-9
3. PHYSICAL DESCRIPTION _________________________ 3-1

3.1 The Main Head ___________________________________________ 3-2
3.1.1 The Wire Feed System ____________________________________ 3-3
3.1.1.1 2" Spool for Vertical Wire Feed (4524D, 4524AD, 4523D, 4523AD) ________ 3-3
3.1.1.2 2" Spool for 30°/45° Wire Feed (4523D, 4523AD) _____________________ 3-3
3.1.1.3 0.5" Spool for 30°/45° Wire Feed (4523D, 4526AD)____________________ 3-3
3.1.1.4 Spool for Vertical Wire Feed (4523D, 4523AD)__________________________ 3-4
3.1.2 Microscope ______________________________________________ 3-5
3.1.3 The Area Light ___________________________________________ 3-5
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3.1.4 The Bonding Head ________________________________________ 3-5

3.1.5 The Tool Lifter ___________________________________________ 3-5
3.1.6 The Clamp Lifter (4523D, 4523AD)________________________ 3-6
3.1.7 The Negative Electronic Flame Off System (N.E.F.O.) (4524D,
4524AD) _________________________________________________________ 3-6
3.1.8 The Spotlight (Optional)___________________________________ 3-6
3.2 The Base ________________________________________________ 3-6

3.2.1 The Manipulator and Multi Mouse__________________________ 3-7
3.2.2 The Motorized Y Table (4523AD, 4524AD)_________________ 3-7
3.2.3 The Left and Right Control Panels__________________________ 3-7
3.2.4 The Keypad ______________________________________________ 3-8
3.2.5 The Workholders Connectors Panel ________________________ 3-8
4. CONTROLS AND INDICATORS ____________________ 4-1

4.1 The Multi Mouse _________________________________________ 4-2
4.2 The Right Panel __________________________________________ 4-3

4.2.1 Right Panel Controls (Models 4523D, 4523AD) _____________ 4-3
4.2.2 Right Panel Controls (Models 4524D, 4524AD) _____________ 4-4
4.2.3 Temperature Controls (all models) _________________________ 4-5
4.3 The Left Panel ___________________________________________ 4-6

4.3.1 Power Switch ____________________________________________ 4-6
4.3.2 Display __________________________________________________ 4-6
4.3.2.1 Bond Schedule ________________________________________________________ 4-7
4.3.2.2 Bond Parameters ______________________________________________________ 4-8
4.3.2.2.1 Search Parameter______________________________________________________ 4-8
4.3.2.2.2 Power Parameter ______________________________________________________ 4-8
4.3.2.2.3 Time Parameter _______________________________________________________ 4-8
4.3.2.2.4 Force Parameter _______________________________________________________ 4-9
4.3.2.2.5 Tail Parameter_________________________________________________________ 4-9
4.3.2.2.6 Tear Parameter (Models 4523D, 4523AD) _____________________________ 4-10
4.3.2.2.7 Ball Parameter (Models 4524D, 4524AD) ______________________________ 4-10
4.3.2.3 Loop Parameters _____________________________________________________ 4-10
4.3.2.3.1 Loop Parameter (All models)___________________________________________ 4-10
4.3.2.3.2 Step Parameter (Models 4523AD, 4524AD) ____________________________ 4-10
4.3.2.3.3 Kink Parameter (Models 4523AD, 4524AD) ____________________________ 4-10

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4.3.2.3.4 Reverse Parameter (Models 4523AD, 4524AD)_________________________ 4-11

4.3.2.3.5 Y Speed Parameter (Models 4523AD, 4524AD) ________________________ 4-11
4.3.2.4 Operation Modes _____________________________________________________ 4-11
4.3.2.4.1 Mode ________________________________________________________________ 4-11
4.3.2.4.2 Time_________________________________________________________________ 4-12
4.3.2.4.3 Tail __________________________________________________________________ 4-12
4.3.2.4.4 Auto_________________________________________________________________ 4-12
4.3.3 4523D Screens _________________________________________ 4-12

4.3.4 4523AD Screens ________________________________________ 4-13
4.3.5 4524D Screens (Standard Mode) _________________________ 4-13
4.3.6 4524D Screens (Ball Bumping Mode)______________________ 4-14
4.3.7 4524D Screens (S. Point Tab) ____________________________ 4-14
4.3.8 4524AD Screens (Standard Mode) ________________________ 4-15
4.3.9 4524AD Screens (Ball Bumping Mode) ____________________ 4-15
4.3.10 4524AD Screens (S. Point Tab Mode)_____________________ 4-16
4.3.11 The Keypad _____________________________________________ 4-17
4.3.12 Keypad Control Keys ____________________________________ 4-18
4.3.13 Dedicated Parameters Keys ______________________________ 4-19
4.4 Programming____________________________________________ 4-19

4.4.1 Changing Parameter Values ______________________________ 4-19
4.4.2 Changing Modes and Settings ____________________________ 4-20
4.4.3 Creating Bonding Schedules ______________________________ 4-21
4.5 Password Protection _____________________________________ 4-22

4.5.1 Entering an Authorization Level ___________________________ 4-23
4.5.2 Entering a Password _____________________________________ 4-23
4.5.3 Changing the Password __________________________________ 4-24
5. SETUP AND ADJUSTMENTS______________________ 5-1

5.1 Tool Installation __________________________________________ 5-1
5.1.1 Wedge Installation (4523D, 4523AD) ______________________ 5-1
5.1.2 Capillary Installation (4524D, 4524AD) ____________________ 5-4
5.2 Microscope Adjustment ___________________________________ 5-7
5.3 Bonding Force Adjustments and Setup _____________________ 5-7
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5.4 Workholder Installation and Adjustment ____________________ 5-9

5.4.1 Workholder Installation____________________________________ 5-9
5.4.2 Workholder Height Adjustment ____________________________ 5-9
5.4.3 Search Height Adjustment _______________________________ 5-10
5.4.4 Setting Workholder Temperature__________________________ 5-10
5.5 Wire Loading____________________________________________ 5-11

5.5.1 Useful Tips _____________________________________________ 5-12
5.5.2 Wire Loading of 2" Spool - Vertical Wire Feed (4524D,
4524AD) ________________________________________________________ 5-12
5.5.3 Wire Loading of 0.5" Spool - 30°/45° Wire Feed (4523D,
4523AD) ________________________________________________________ 5-14
5.5.4 Wire Loading of 2" Spool - 30°/45° Wire Feed (Optional for
4523D, 4523AD) ________________________________________________ 5-15
5.5.5 Wire Loading of 0.5" Spool - Vertical Wire Feed (Optional for
4523D, 4523AD) ________________________________________________ 5-17
5.5.6 Wire Loading of 2" Spool - Vertical Wire Feed (Optional for
4523D, 4523AD) ________________________________________________ 5-18
5.6 Spotlight Adjustment ____________________________________ 5-20
6. OPERATION _____________________________________ 6-1

6.1 Operating Model 4523D __________________________________ 6-1
6.1.1 Standard Mode Wedge Bonding ___________________________ 6-1
6.1.2 Off-Line Operations 4523D________________________________ 6-5
6.1.2.1 Initial Parameters and Machine Setting __________________________________ 6-5
6.1.2.2 Bond Strength Optimization ____________________________________________ 6-8
6.2 Operation - Model 4523AD________________________________ 6-9

6.2.1 Standard Mode Wedge Bonding ___________________________ 6-9
6.2.2 Lange Coupler Mode Wedge Bonding______________________ 6-13
6.2.3 Table Tear Mode Wedge Bonding _________________________ 6-13
6.2.4 Off-Line Operations 4523AD _____________________________ 6-16
6.2.4.1 Initial Parameters and Machine Setting __________________________________ 6-16
6.2.4.2 Bond Strength Optimization ____________________________________________ 6-19
6.3 Operating Model 4524D _________________________________ 6-20

6.3.1 Creating a Ball (manually) ________________________________ 6-20

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6.3.2 Standard Mode Ball Bonding______________________________ 6-21

6.3.3 Ball Bumping Mode Ball Bonding __________________________ 6-23
6.3.4 Single Point TAB Mode Ball Bonding ______________________ 6-25
6.3.5 Off-Line Operations 4524D_______________________________ 6-27
6.3.5.1 Initial Parameters and Machine Setting _________________________________ 6-27
6.3.6 Missing Ball Detector ____________________________________ 6-28
6.3.7 Capillaries and Wires ____________________________________ 6-29
6.3.8 Factors Influencing Loop Height (Standard Cycle) __________ 6-29
6.3.9 Bond Strength Optimization ______________________________ 6-30
6.4 Operating Model 4524AD ________________________________ 6-31

6.4.1 Creating a Ball (manually) ________________________________ 6-31
6.4.2 Standard Mode Ball Bonding______________________________ 6-32
6.4.3 Ball Bumping Mode Ball Bonding __________________________ 6-35
6.4.4 Single Point TAB Mode __________________________________ 6-38
6.4.5 Off-Line Operations 4524AD _____________________________ 6-40
6.4.5.1 Initial Parameters and Machine Setting _________________________________ 6-40
6.4.6 Missing Ball Detector ____________________________________ 6-42
6.4.7 Capillaries and Wires ____________________________________ 6-43
6.4.8 Factors Influencing Loop Height (Standard Cycle) __________ 6-43
6.4.9 Bond Strength Optimization ______________________________ 6-44
7. MAINTENANCE OVERVIEW _______________________ 7-1

7.1 General Guidelines________________________________________ 7-1
7.2 Machine Adjustments Checklist____________________________ 7-1

7.2.1 4524D, 4524AD _________________________________________ 7-2
7.2.2 4523D, 4523AD _________________________________________ 7-2
8. ELECTRICAL SUBASSEMBLIES ____________________ 8-1

8.1 Description of Electrical System ___________________________ 8-1
8.1.1 The Power Supply ________________________________________ 8-1
8.1.2 The Motherboard _________________________________________ 8-6
8.1.2.1 Connectors J1 - J5 and Fuses __________________________________________ 8-6
8.1.2.1.1 Connector J1 _________________________________________________________ 8-6
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8.1.2.1.2 Connector J2 _________________________________________________________ 8-6

8.1.2.1.3 Connector J3 _________________________________________________________ 8-7
8.1.2.1.4 Connector J4 _________________________________________________________ 8-7
8.1.2.1.5 Connector J5 _________________________________________________________ 8-7
8.1.2.1.6 Fuses _________________________________________________________________ 8-7
8.1.3 The Logic Board __________________________________________ 8-8

8.1.3.1 The Logic Board Power Supply ________________________________________ 8-10
8.1.3.2 Fuse F1______________________________________________________________ 8-10
8.1.3.3 The Logic Unit _______________________________________________________ 8-10
8.1.3.4 Sinewave Generator __________________________________________________ 8-10
8.1.3.5 Z Motor Circuit _______________________________________________________ 8-10
8.1.3.6 The Ultrasonic Generator Circuit _______________________________________ 8-10
8.1.3.7 The Force Driver Circuit _______________________________________________ 8-11
8.1.3.8 Connectors __________________________________________________________ 8-12
8.1.3.9 Diagnostic LEDs ______________________________________________________ 8-14
8.1.3.10 Adjustment Controls __________________________________________________ 8-14
8.1.3.11 Logic Board Test Points _______________________________________________ 8-15
8.1.3.12 Jumper Configuration _________________________________________________ 8-15
8.1.4 The Z Motor Relay Board (4523D, 4523AD) _______________ 8-16
8.1.5 The Stepper Drivers Board (4523D, 4523AD, 4524AD) ____ 8-16
8.2 The N.E.F.O. (4524D, 4524AD) __________________________ 8-18

8.2.1 N.E.F.O. Power Supply __________________________________ 8-18
8.2.2 Ball/Wedge Interface Board_______________________________ 8-18
8.2.2.1 Connectors __________________________________________________________ 8-19
8.2.3 Controller Assembly _____________________________________ 8-24
8.2.3.1 Jumper Configuration _________________________________________________ 8-24
8.3 Electrical Assemblies Replacement and Adjustment_________ 8-25

8.3.1 Logic Board Replacement ________________________________ 8-25
8.3.2 Ultrasonic Generator Adjustment _________________________ 8-26
8.3.2.1 Free Running Frequency Adjustment ___________________________________ 8-26
8.3.2.2 Ultrasonic Power Adjustment__________________________________________ 8-27
8.3.3 Z Motor Speed Adjustment_______________________________ 8-28
8.3.3.1 Adjusting the Z Motor Speed for Models 4523D/4523AD _______________ 8-28
8.3.3.2 Adjustments for Model 4524D Only ___________________________________ 8-28
8.3.3.3 Adjustments for Model 4524AD Only __________________________________ 8-29
8.3.4 Display Contrast Adjustment _____________________________ 8-30

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Table of Contents
9. MECHANICAL SUBASSEMBLIES __________________ 9-1

9.1 The Main Head Assembly _________________________________ 9-1
9.1.1 Left Side View (Internal) __________________________________ 9-1
9.1.1.1 The DC Motor _________________________________________________________ 9-1
9.1.1.2 The Stepper Drivers Board _____________________________________________ 9-1
9.1.1.3 The Air Dashpot _______________________________________________________ 9-3
9.1.1.4 The Tool Lifter ________________________________________________________ 9-3
9.1.1.5 The Clamp Lifter (4523D, 4523AD) ____________________________________ 9-4
9.1.1.6 The Bonding Head Mechanism__________________________________________ 9-4
9.1.1.7 The Force Actuator ____________________________________________________ 9-4
9.1.2 Right Side View (Internal) _________________________________ 9-5
9.1.2.1 The Height Control Cam _______________________________________________ 9-5
9.1.2.2 The Height Control Link and Contact Mechanism ________________________ 9-5
9.1.2.2.1 The Contact Pin _______________________________________________________ 9-5
9.1.2.2.2 LVDT (Linear Variable Differential Transformer) __________________________ 9-6
9.2 Bonding Head Maintenance _______________________________ 9-6

9.2.1 Bonding Head Free Motion ________________________________ 9-6
9.2.2 Bonding Head Bearings Adjustment ________________________ 9-7
9.2.3 Static Bonding Force and Dashpot Adjustment ______________ 9-7
9.2.4 Dashpot Replacement_____________________________________ 9-8
9.3 Force Actuator Assembly _________________________________ 9-8

9.3.1 Force Actuator Test ______________________________________ 9-9
9.3.2 Force Actuator Disassembly _______________________________ 9-9
9.3.3 Force Actuator Replacement _____________________________ 9-10
9.3.4 Adjusting the Force Actuator _____________________________ 9-10
9.4 Main LVDT Reset Position________________________________ 9-11
9.5 Transducer Replacement and Levelling ____________________ 9-12
9.6 Clamp Solenoid/Wire Clamp Replacement and Adjustment __ 9-15

9.6.1 Clamp Solenoid Replacement _____________________________ 9-15
9.6.1.1 Clamp Solenoid Replacement (4524D, 4524AD) ________________________ 9-15
9.6.1.2 Clamp Solenoid Replacement (4523D, 4523AD Standard Access) _______ 9-16
9.6.1.3 Clamp Solenoid Replacement (4523D, 4523AD Deep Access) ___________ 9-17
9.6.2 Clamp Solenoid Gap Adjustment __________________________ 9-18
9.6.3 Clamp Lateral Position Adjustment (4523D, 4523AD) ______ 9-19
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9.7 Wire Tension Adjustment - 0.5" Spool Holder (4523D, 4523AD)9-20
9.8 Drag Clamp and Drag Solenoid Adjustment and Replacement 9-20
9.8.1 Drag Clamp Gap Adjustment (4524, 4524AD) _____________ 9-20
9.8.2 Drag Clamp Force Adjustment (4524D, 4524AD) __________ 9-20
9.8.3 Drag Solenoid Replacement (4524D, 4524AD)_____________ 9-21
9.9 Wand Adjustments and Replacement (4524D, 4524AD) ____ 9-21

9.9.1 Wand Gap Adjustment ___________________________________ 9-22
9.9.2 Wand Reset Position Adjustment _________________________ 9-22
9.9.3 Wand Overtravel Adjustment _____________________________ 9-23
9.9.4 Wand Replacement ______________________________________ 9-23
9.9.5 Solenoid Replacement ___________________________________ 9-23
9.10 Spool 90º Wire Feed System _____________________________ 9-24

9.10.1 Wire Spool Holder _______________________________________ 9-24
9.10.2 Fixed Tensioner _________________________________________ 9-24
9.10.3 Kicker __________________________________________________ 9-24
9.10.4 Kicker Stroke Adjustment ________________________________ 9-25
9.11 Base Assembly __________________________________________ 9-25

9.11.1 The Manipulator Assembly _______________________________ 9-25
9.11.2 The Motorized Y Table (4523AD, 4524AD)________________ 9-26
9.11.3 The Multi Mouse ________________________________________ 9-26
9.11.4 Multi Mouse Assembly Removal __________________________ 9-26
9.11.5 Multi Mouse Disassembly ________________________________ 9-27
9.12 Manipulator and Motorized Y Table Maintenance ___________ 9-27

9.12.1 Manipulator Maintenance ________________________________ 9-27
9.12.2 Disassembling the Y Drive Subassembly (4523AD, 4524AD) 9-28
9.12.3 Preload Adjustment of the Motorized Y Table (4523AD,
4524AD) ________________________________________________________ 9-28
10. TIMING DIAGRAMS _____________________________ 10-1

10.1 Models 4523D Semi/Auto Bonding Cycle __________________ 10-2
10.2 Models 4523D Manual Bonding Cycle _____________________ 10-3

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10.3 Model 4523AD Semi/Auto Bonding Cycle _________________ 10-4
10.4 Model 4523AD Manual Bonding Cycle ____________________ 10-5
10.5 Model 4523AD Table Tear Bonding Cycle _________________ 10-6
10.6 Model 4523AD Lange Coupler Bonding Cycle ______________ 10-7
10.7 Model 4524D Semi/Auto Bonding Cycle ___________________ 10-8
10.8 Model 4524D Manual Bonding Cycle ______________________ 10-9
10.9 Model 4524D Ball Bumping Cycle________________________ 10-10
10.10 Model 4524D Single Point TAB Cycle ____________________ 10-11
10.11 Model 4524AD Semi/Auto Bonding Cycle ________________ 10-12
10.12 Model 4524AD Manual Bonding Cycle ___________________ 10-13
11. DIAGNOSTICS __________________________________ 11-1

11.1 Diagnostic LEDs _________________________________________ 11-1
11.2 Diagnostic Codes________________________________________ 11-2
11.3 Corrective Action________________________________________ 11-3
11.4 Auto Cycle Operation ____________________________________ 11-4

11.4.1 For Models 4523D/4523AD ______________________________ 11-4
11.4.2 For Models 4524/4524AD _______________________________ 11-4
12. PREVENTIVE MAINTENANCE ____________________ 12-1

12.1 Preventive Maintenance Schedule_________________________ 12-1
12.2 Clean the Bonding Head Contact Pin and Screw____________ 12-2
12.3 Clean the Wire Clamp and the Drag Clamp ________________ 12-2
12.4 Clean the Spool Holder and Kicker ________________________ 12-2
12.5 Clean the N.E.F.O. Wand (4524D, 4524AD) _______________ 12-3
12.6 Check the Force Actuator Coil Motion_____________________ 12-3
12.7 Check the Z Motor Drive Belt Tension _____________________ 12-4
12.8 Check the Bonding Head Movement and Dashpot __________ 12-4
12.9 Clean the Manipulator, Base and Motorized Y Table ________ 12-4
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12.10 Check the Cam Follower Bearing__________________________ 12-5
12.11 Check the Height Control Link Motion _____________________ 12-6
12.12 Adjust 18 Vp-p__________________________________________ 12-6
12.13 Adjust Ultrasonic Generator ______________________________ 12-6
12.14 Adjust Temperature Controller Zero Offset_________________ 12-7
12.15 Clean Solenoids _________________________________________ 12-7
13. TROUBLESHOOTING ____________________________ 13-1

13.1 General Operational Troubleshooting ______________________ 13-2
13.2 Bonding Process_________________________________________ 13-6
14. OPTIONS AND ACCESSORIES ___________________ 14-1

14.1 Optical Accessories______________________________________ 14-1
14.2 Stationary Heated Workholders ___________________________ 14-1
14.3 Rotary Heated Workholders ______________________________ 14-3
14.4 Cold Workholders _______________________________________ 14-3
14.5 Manual Index Workholders _______________________________ 14-4
14.6 Motorized Index Workholders_____________________________ 14-5
14.7 Motorized Heated Workholders ___________________________ 14-5
14.8 Workholders Harness Adapters ___________________________ 14-6
14.9 General Accessories _____________________________________ 14-7
14.10 Clamps _________________________________________________ 14-8
15. PARTS LISTS ___________________________________ 15-1

15.1 Front Panel Assembly____________________________________ 15-2
15.1.1 The Left Panel __________________________________________ 15-2
15.1.2 Wedge Right Panel (Models 4523D, 4523AD) _____________ 15-3
15.1.3 Ball Right Panel (Models 4524D, 4524AD) ________________ 15-3
15.2 Main Head ______________________________________________ 15-4
15.3 Bonding Head - Models 4524D and 4524AD_______________ 15-7

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15.4 Bonding Head - Models 4523D and 4523AD_______________ 15-8
15.5 Manipulator and Motorized Y Table ______________________ 15-10
15.6 Base Assembly _________________________________________ 15-12
15.7 Drag and Electrode Assembly____________________________ 15-13
15.8 2" Spool Assembly _____________________________________ 15-16
15.9 Multi Mouse Assembly__________________________________ 15-19
15.10 Clamp Assembly for 90° Wire Feed______________________ 15-20
15.11 N.E.F.O. System _______________________________________ 15-21
15.12 Ball/Wedge Interface Board______________________________ 15-22
16. INDEX__________________________________________ 16-1
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Table of Contents

xx
Introduction
1. INTRODUCTION
1.1 Product Description

The K&S 4500 Digital Series Manual Wire Bonders offer complete
solutions to the various wire bonding applications and process
requirements.
The 4500 Digital Series comprises the following bonding machine models:
4523D, 4523AD, 4524D and 4524AD.
1.1.1 Model 4523D Wedge Bonder

The Model 4523D Wedge Bonder is used with aluminum wire, gold wire
and ribbon. It is versatile enough to bond simple discrete devices up to
complex hybrid, microwave and deep cavity devices.
The 4523D offers control of individual bond parameters, loop height and
force, along with the capability of using a wide range of wire diameters.
The new digital option enables programming of unique bonding schedules.

Up to 200 different bonding programs may be stored in the memory.
The new bonding head, with the deep access option and tail adjust system,
makes it ideal for deep cavity microwave applications where tight control
over the tail length is required.
1.1.2 Model 4523AD Auto-Stepback Wedge Bonder

The Model 4523AD Auto-Stepback Wedge Bonder is used with aluminum
wire, gold wire and ribbon. It is especially appropriate for your high
quality applications requiring tight control of wire length and loop
formation.
The 4523AD offers control of individual bond parameters and

programmable loop formation along with the capability of using a wide
variety of wires.

The new bonding head, with the deep access option and tail adjust system,
makes it ideal for deep cavity microwave applications where tight control
over the tail length is required.
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1-1
Introduction
Product Description
1.1.3 Model 4524D Multi-Process Ball Bonder

The Model 4524D Multi-Process Ball Bonder for gold wire is ideal for
Research & Development and small production lots where unique
processes are used.
Single point TAB, ball bumping, and coining, together with standard ball
bonding, offer process flexibility and versatile capabilities.
Semi-auto and manual operation modes, individual bond parameter

control and a wide range of wire diameters make it ideal for a variety of
applications.

The built-in programmable Negative Electronic Flame-Off (N.E.F.O.)

system provides consistency and fine control of ball size.
1.1.4 Model 4524AD Multi Process Auto-Stepback Ball Bonder

The Model 4524AD Multi-Process Auto Stepback Ball Bonder for gold wire
is ideal for Research & Development and small production lots where
unique processes are used.
Single point TAB, ball bumping, and coining, together with standard ball
bonding, offer process flexibility and versatile capabilities.
Semi-auto manual and automatic operation modes, individual bond

parameter control and a wide range of wire diameters make it ideal for a
variety of applications.

The built-in programmable Negative Electronic Flame-Off (N.E.F.O.)

system provides consistency and fine control of ball size.

1-2
Introduction
1.2 Features
1.2.1 Common Standard Features

The following standard features are found on all K&S 4500 Digital Series
models:
!" DC Servo/LVDT Closed Loop Control enables the bonding head to

move at maximum speed and high precision between set heights, with
gradual starts and stops, and minimum jarring or vibration. All
sequence and timing functions are controlled electronically.
!" Ultrasonic System results in maximum efficiency, minimum power
requirement and close control of the bonding process.
!" High-Q Transducer is sensitive to changes of load during
bonding.
!" Phase-Locked-Loop (PLL) Ultrasonic Generator enables the
bonder to apply power to the bond at the instantaneous frequency
of the system.
!" Control Pad and Digital LCD Display enable easy configuration of
bond schedules and bonding parameters such as force, ultrasonic
power, search and loop heights, and bonding duration. Up to 200
different bonding programs may be stored in memory.
!" Air-Damped Bonding Head provides smooth travel without
vibration and ensures soft-touch without impact.
!" Bonding Area - 134 mm x 134 mm (5.3" x 5.3") for wedge bonding.
152 mm x 152 mm (6.0" x 6.0") for ball bonding.
!" Multi Mouse Single Hand Integrated Control, an ergonomic
“all-in-one” control system, provides:
!" Bonding position control
!" Semi/Auto mode operation - semi-automatic bonding
!" Manual Z mode operation - manual movement of the bonding
head
!" Stitch mode operation - programming of stitch cycle.
!" Temperature Controller controls the temperature of the heated

workholders.
!" Diagnostic LEDs allow fast isolation of faults that may occur during
machine operation. Any faults detected during the machine’s self-test
cause a combination of the LEDs to turn on. This helps the technician
determine the cause of the fault.
!" Overhead Microscope provides up to 85° view of the work area,
depending on the bonder’s microscope and spotlight (optional)
adjustments.
!" Motorized Y Table with programmable steps provides tight control
of wire looping and wire length (4523AD, 4524AD).
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1-3
Introduction
Features
!" Manual Z Mode allows manual control of all bonding operations.

This mode is very useful when bonding hybrid packages, or for
bonding very fine wire.
!" Lange Coupler Mode enables semi-automatic bonding of Lange
coupler applications. This mode provides exact repetitive table motion
and produces consistent low loops (4523AD).
!" Table Tear Mode enables wedge bonding with table tear method of
wire termination.
!" Tail Control System provides very fine control of the tail length,
resulting in tail length consistency throughout the bonding process.
The system is driven by a high resolution linear stepper motor. A real-
time tail control algorithm allows you to manually control and adjust
the tail length during the bonding process (4523D, 4523AD).
!" Negative Electronic Flame-Off (N.E.F.O.) system forms a ball by
generating a spark between the N.E.F.O. wand and the wire (4524D,
4524AD).
1.2.2 Optional Features

The following optional features are available for the K&S 4500 Digital
Series models:
!" Clamp 90## Wire Feed Kit allows up to 12.7 mm (500 mil) access for
bonding in deep packages and for rework of microwave and hybrid
packages.
!" Height Adjustable Rotary Table provides simple and accurate
control over the required wire angle and the bond level height. This
table is useful for applications with bond level variation and different
wire directions.
!" Spotlight eases targeting by projecting a bull’s-eye pattern onto the
bonding pad. The cross hair pattern provides even greater accuracy
with narrower gauge wire.
!" Workholders - various types of stationary or motorized, heated or
unheated workholders are available.
!" Fiber Optic Illumination Kit provides better illumination than the
standard lamp and contains a spotlight target.
!" Deep Access Kit for Models 4524D, 4524AD allows 12.7 mm
(500 mil) deep access capability.
For all optional equipment and accessories, see Chapter 14.

1-4
Introduction
1.3 Specifications
1.3.1 4523D
The K&S 4523D Wedge Bonder has the following specifications.
Wire
Diameter Range
Gold 12.7 - 76 µm (0.5 - 3.0 mil)
Aluminum 20 - 76 µm (0.7 - 3 mil)
Gold Ribbon (Option) Up to 25 x 250 µm (1x10 mil)
Spool 12.7 mm (0.5")
Option 50.8 mm (2")
Machine Specifications
Display LCD (20 x 4 characters)
Program Memory 6 channels; up to 200 programs
Bonding Area 134 mm x 134 mm (5.3" x 5.3")
Throat Depth 143 mm (5.6")
Gross Table Motion 140 mm (5.5")
Fine Table Motion 14 mm (0.55")
Multi Mouse Ratio 6:1
Z Motion System DC servo/LVDT control
Z Travel
Low Reset 6.6 mm (260 mil)
High Reset 12.7 mm (500 mil)
Ultrasonic System High Q 60 kHz transducer

PLL ultrasonic generator
Low Ultrasonic Power 1.3 W
High Ultrasonic Power 2.5 W
Bond Time 10 - 100 ms/10 - 1000 ms
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1-5
Introduction
Specifications
Bond Force Force coil 10 - 160 gr
Wire Termination Clamp tear
Wire Feed Angle 30/45º
Option 90º (Vertical)
Modes of Operation Semi-Auto, Manual Z, Stitch
Temperature Controller up to 250º ± 0.5ºC
Options
!" Microscopes and eyepieces !" Fiber optic illumination and

spotlight target
!" 90º wire feed angle kit for !" Manually height-adjustable,
deep access heated workholders
!" Spotlight target !" Motorized index workholders
!" Height-adjustable rotary !" ESD kit
table !" Left-hand operation
Electrical Requirements
Voltage 100 - 120/220 - 240 V $ 10%,

50/60 Hz, 250 VA max.
Physical Dimensions
Height 530 mm (21")
Width 680 mm (27")
Depth 700 mm (27.5")
Weight (basic machine)
Shipping 55 kg (122 lb)
Net 31 kg (69 lb)
Note: These specifications are subject to change without prior notice.

1-6
Introduction
1.3.2 4523AD
The K&S 4526 Auto Stepback Wedge Bonder has the following
specifications.
Wire
Diameter Range
Gold 12.7 - 76 µm (0.5 - 3.0 mil)
Aluminum 20 - 76 µm (0.7 - 3 mil)
Gold Ribbon (Option) Up to 25 x 250 µm (1x10 mil)
Spool 12.7mm (0.5")
Option 50.8 mm (2")
Bonding Area 134 mm x 134 mm (5.3" x 5.3")
Motorized Y
Stepback Up to 4 mm (160 mil)
Reverse Up to 0.25 mm (10 mil)
Kink Height Up to 0.5 mm (20 mil)
Z Travel
Low Reset 6.6 mm (260 mil)
High Reset 12.7 mm (500 mil)

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1-7
Introduction
Specifications
Bond Time 10 - 100 ms/10 - 1000 ms
Wire Feed Angle 30/45º
Option 90º (Vertical)
Modes of Operation Semi-Auto, Manual Z, Stitch,

Lange Coupler, Table Tear, Automatic
Bonding
Options

spotlight target
!" Ribbon clamp !" 90º wire feed angle kit for deep
access
!" Manually height-adjustable, !" Spotlight target
heated workholders
!" Motorized index !" 3rd channel kit
workholders
!" Mini-heater kit !" Height-adjustable rotary table
!" ESD kit
!" Left-hand operation
Voltage 100 - 120/220 - 240 V $ 10%,

50/60 Hz, 250 VA max.
Physical Dimensions
Height 530 mm (21")
Width 680 mm (27")
Depth 700 mm (27.5")

1-8
Introduction
Net 31 kg (69 lb)
1.3.3 4524D
The K&S 4524D Multi-Process Ball Bonder has the following
specifications.
Wire
Gold 18 - 76 µm (0.7 - 3.0 mil)
Spool 50.8 mm (2")
Bonding Area 152 mm x 152 mm (6" x 6")
Z Travel 9.1 mm (360 mil)

Bond Time
Ball Bonding/Bumping 20 - 200 ms
Single Point TAB 20 - 1000 ms
P/N 94500-000D-000-01 ver03/02

1-9
Introduction
Specifications
Modes of Operation Semi-Auto, Manual Z, Ball Bonding,

Ball Bumping, Single Point TAB,
Coining
Ball Formation System Negative EFO (N.E.F.O.)
Missing Ball Detector Indication and auto-stop
Options

spotlight target
!" Deep access kit for 12.5 mm !" Manually height-adjustable,
(500 mil) Z travel heated workholders
!" ESD kit and shielded wand
Voltage 100 - 120/220 - 240 V $ 10%,

50/60 Hz, 250 VA max.
Physical Dimensions
Height 530 mm (21")
Width 680 mm (27")
Depth 700 mm (27.5")
Net 31 kg (69 lb)

1-10
Introduction
1.3.4 4524AD
The K&S 4524AD Multi-Process Auto Stepback Ball Bonder has the
following specifications.
Wire
Gold 18 - 76 µm (0.7 - 3.0 mil)
Spool 50.8 mm (2")
Bonding Area 152 mm x 152 mm (6" x 6")
Motorized Y
Stepback Up to 4 mm (160 mil)
Reverse Up to 0.25 mm (10 mil)
Kink Height Up to 0.5 mm (20 mil)
Z Travel 9.1 mm (360 mil)

Bond Time 10 - 100 ms/10 - 1000 ms
Ball Bonding/Bumping 20 - 200 ms
Single Point TAB 20 - 1000 ms
P/N 94500-000D-000-01 ver03/02

1-11
Introduction
Specifications
Modes of Operation Semi-Auto, Manual Z, Ball Bonding,

Ball Bumping, Single Point TAB,
Coining, Automatic Bonding
Ball Formation System Negative EFO (N.E.F.O.)
Missing Ball Detector Indication and auto-stop
Options
spotlight target
!" Deep access kit for 12.5 mm !" Manually height-adjustable,
(500 mil) Z travel heated workholders
!" ESD kit and shielded wand
Voltage 100 - 120/220 - 240 V $ 10%,

50/60 Hz, 250 VA max.
Physical Dimensions
Height 530 mm (21")
Width 680 mm (27")
Depth 700 mm (27.5")
Net 31 kg (69 lb)

1-12
Installation
2. INSTALLATION
This chapter contains instructions and guidelines for installing your
K&S 4500 Digital Series Manual Wire Bonder.
2.1 Pre-installation Requirements

Before installing the K&S 4500 Digital Series Manual Wire Bonder,
ensure that the designated work area includes:
!" One or two properly grounded AC wall outlets, supplying

100-120/220-240 V ± 10% at 50/60 Hz (250 VA max).
!" Stable work table, as shown in Figure 2-1.
!" Vacuum for the workholder (if required).
Figure 2-1: Stable Work Table for K&S 4500 Digital
P/N 94500-000D-000-01 ver03/02

2-1
Installation
Unpacking and Installation
2.2 Unpacking and Installation

Your K&S 4500 Digital Series Manual Wire Bonder model was packed in a
reinforced container that provides complete protection against damage
during shipment.
To remove the bonder from its container:
1 Remove the packing list from the pocket located on the outside of the
shipping crate.
2 Cut the plastic bands that bind the wood.
3 Open the wood clamps on the top cover with a long screwdriver and
remove the top cover (see Figure 2-2).
4 Lift the accessories boxes out of their “cages” on the sides of the
bonder. From these boxes, remove the box(es) containing the bonder
fixtures and accessories (see Figure 2-3).
5 Remove the remaining walls of the shipping crate.
6 Remove the four (4) screws that secure the shipping board to the base
of the crate using a hex wrench (see Figure 2-4).
1 Box Accessories
1
Figure 2-2: K&S Digital 4500 Wire Bonder Packaging

2-2
Installation
1 Box Holder
Figure 2-3: Removing the K&S Digital 4500 Digital Box Holder
1 Screws attached
to base (x4)
2 Square Block
Figure 2-4: Loosening the K&S 4500 Digital Square Blocks
7 Loosen the four (4) nuts holding the four (4) square blocks that tighten
the shipping board to the base of the crate (see Figure 2-4). Turn the
square blocks to release the shipping board.
8 Lift the bonder with its attached shipping board out of the crate and
place it on a cart. This step requires two people (see Figure 2-5).
Caution: Grasp the bonder lower casting. Do not grasp the covers
(see Figure 2-5).
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2-3
Installation
9 Remove the protective bubble sheet from the bonder base

(see Figure 2-6).
10 Using a flat 9/16” wrench, remove the shipping screws, spacers and
shipping board from the base of the bonder (see Figure 2-7).
11 Place the bonder at its designated installation site. Ensure that it

rests on a stable platform in a draft-free location. It is not necessary to
bolt the bonder to the platform.
12 Remove the protective covering of the area light by cutting the twine
at the ends of the woven sponge sleeve and slipping the sleeve off (see
Figure 2-6).
13 Remove the masking tape attaching the Multi Mouse.
Figure 2-5: Taking the K&S 4500 Digital Wire Bonder Out of the Shipping Carton
14 Open the box(es) containing the bonder fixtures and accessories and
verify that the contents are as written in the packing slip.
Note: If any part is missing or damaged, notify your K&S representative

and shipper without delay.
15 From the interior right side of the main head, remove the rubber band
holding the Height Control Link to the main LVDT holder
(see Figure 2-8).
16 Remove the sponge packing located between the cam pulley and the
height control link (see Figure 2-8).

2-4
Installation
17 Remove the protective packaging from the force coil top

(see Figure 2-8).
18 Remove the small plastic pads located between the jaws of the wire
clamp and the drag clamp (see Figure 2-9).
Figure 2-6: K&S 4500 Digital Wire Bonder on Shipping Board
Figure 2-7: Removing the Shipping Screws
P/N 94500-000D-000-01 ver03/02

2-5
Installation
19 Remove the sponge padding located between the bonding head and the
wand bracket (4524D, 4524AD).
20 Remove the bands holding the bonding head (see Figure 2-8 and
Figure 2-9).
Note: The following step requires two people.
Caution: Improper support of the bonder when performing the following

step will cause the manipulator to become disassembled and damage the
bonder.
21 Free the manipulator assembly as follows (see Figure 2-10):

a. Pull the bonder forward so that it projects beyond the table,
supporting the chessman and table with one hand. Tilt the bonder
backwards to access the bottom of the bonder with the other
hand. Take care not to tip the bonder over.
b. Using an Allen wrench, remove the two screws securing the

manipulator assembly locking bar. Remove the bar. Retain the
bar in case you will have to move the bonder to another location.
c. Slide the bonder back into place on the table.
22 Uncoil the power cord. See the bonder nameplate for the operating
voltage requirement. Check that your AC wall outlet supplys the
correct voltage. If it does not, contact your K&S representative.
Note: If the cord does not have a plug, install a 3-prong plug which fits
your AC wall outlet socket. In particular, note the ground connection and
remove the GROUND label.

2-6
Installation
1 LVDT band
2 Bonding Head
Band
3 Cam Band
4 Coil Band
1
2
Figure 2-8: Main Head Packaging - Inner Right Side
1 Bonding Head
Band
2 Clamp Pad
Figure 2-9: Main Head Packaging - Front Side
P/N 94500-000D-000-01 ver03/02

2-7
Installation
Figure 2-10: Support the chessman and manipulator and lift
Figure 2-11: Removing the Manipulator Locking Rod

2-8
Installation
2.3 Microscope Installation

This section describes the installation of the microscope.
2.3.1 Leica S6/MZ-6 Microscope Installation
1 Take the microscope holder out of the accessories box. Unwrap and
install it on the microscope support.
2 Using a millimetric Allen wrench, adjust the pivot locking screw.
3 To install the microscope, mount it on the pivot from the left side and
secure it in place by tightening the pivot locking screw.
4 Install the eye pieces in the oculars.
Note: To adjust the view angle, release the rod locking screw and slide
the rod to the required position.
1 Rod Locking
Screw
2 Pivot Locking
Screw
1 2 3 Focus Knob
4 Zoom Knob
Figure 2-12: Leica S6 Microscope Installation
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2-9
Installation
Microscope Installation
1 Rod Locking
Screw
2 Pivot Locking
Screw
3 Focus Knob
4 Zoom Knob
1
2
3
Figure 2-13: Leica MZ6 Microscope Installation

2-10
Physical Description
3. PHYSICAL DESCRIPTION
This chapter provides a description of the principal parts of the K&S 4500
Series Manual Wire Bonder.
Figure 3-1 shows a general view of the 4500 Manual Wire Bonder.
1 Main Head
1
2 Spotlight
3 Microscope
2 4 Digital
Display
3
5 Area Light
6 Right Panel
7 Keypad
8 Work Table
9 Workholder
10 Base
11 Multi Mouse
5
4
6
9
7
8
10 11
Figure 3-1: Model 4500 Digital Series Manual Wire Bonder - Main Parts
P/N 94500-000D-000-01 ver03/02

3-1
The Main Head
3.1 The Main Head

Figure 3-2 shows the main head assembly of Models 4523D and 4523AD.
1 Tool Lifter
2 0.5" Spool for
30!/40! Wire
Feed
3 Clamp Lifter
4 Bonding Head
1
2
3 4
Figure 3-2: The Main Head Assembly - 4523D, 4523AD
Figure 3-3 shows the main head assembly of Models 4524D and 4524AD.
1 1 2" Spool for

Vertical Wire
Feed
2 Electrode and
Drag Assembly
3 Bonding Head
Figure 3-3: The Main Head Assembly - 4524D, 4524AD

3-2
3.1.1 The Wire Feed System
3.1.1.1 2" Spool for Vertical Wire Feed (4524D, 4524AD, 4523D, 4523AD)
The 2" Spool for Vertical Wire Feed System is mounted on the spotlight
support. At the top of the system, a 2" spool stores the wire and is held in
place by a spool holder. A glass tube for feeding the wire is attached to the
spool cap. Below the glass tube, a fixed tensioner provides wire tension,
preventing slack.
The 2" spool includes a kicker, which hangs from the top front of the main
head. After the first bond is performed, the kicker releases a sufficient
amount of wire for the bonder to complete the loop and the second bond
(4524D, 4524AD).
A drag clamp retains tension on the wire at certain stages in the bonding
cycle. The force is adjusted by rotating an adjustment nut on the side of
the clamp. A wire guide leads the wire across the jaws of the clamp
(4524D, 4524AD).
For more details, see sections 5.5.2 and 5.5.6.
3.1.1.2 2" Spool for 30°/45° Wire Feed (4523D, 4523AD)
The 2" spool for 30°/45° Wire Feed System is mounted by a bracket on the
front cover. The spool is located directly above the 0.5" spool axis, which
preserves wire tension. Wire is fed through a hole in the transducer to the
wire clamp either over the axis (45!) or under the axis (30!).
For more details, see section 5.5.4.
3.1.1.3 0.5" Spool for 30°/45° Wire Feed (4523D, 4526AD)
The 0.5" spool is located on the bonding head. The wire is pulled from the
spool through the feed holes of the ultrasonic transducer at 30! or 45!
angles, depending on the application. The wire is then fed into the wedge.
The spool rotates when the wire is pulled. Wire tension is controlled by
turning a nut on the side of the spool.
P/N 94500-000D-000-01 ver03/02

3-3
The Main Head
1 Spool Cup
1 2 Glass Tube
3 Spool Holder
2 4 Wire Spool
3
5 Fixed
4 Tensioner
6 Glass Plate
7 Kicker
Figure 3-4: The 2" Spool
3.1.1.4 Spool for Vertical Wire Feed (4523D, 4523AD)
The 2" spool for ribbon bonding is located on the bonding head
(Figure 5-12).
The 0.5" spool is located on the bonding head directly above the wire
clamp.
The spool rotates as the wire is pulled. Wire tension is controlled by

turning a nut on the side of the spool.

3-4
3.1.2 Microscope
The bonder may be equipped with either a Leica MZ6/S6 or stereo zoom
microscope. The microscope has a common focus for both oculars. In
addition, the microscope has an adjustable magnification zoom capability.
3.1.3 The Area Light

The area light illuminates the work area so that it may be viewed through
the microscope.
The area light is fastened to the front of the main head frame by a flexible
gooseneck. The LIGHT on/off control button is located on the right control
panel.
3.1.4 The Bonding Head

The bonding head is a horizontal lever with its pivot fixed in the main
head frame. The bonding head is driven by a dc servo motor.
The up/down motion of the bonding head is controlled electrically by

signals from the logic board and mechanically by the cam pulley and
height control link. The air dashpot at the rear of the bonding head
assures smooth, vibration-free motion.
Bonding head position feedback to the logic circuits is affected by the main
linear variable differential transformer (LVDT). This synchronizes the
bonding head motion with the bonding cycle and modulates the bonding
head speed.
The front of the bonding head holds the ultrasonic transducer, within
which the wedge/capillary is clamped. The wedge/capillary holds the wire
above the bonding pad and activates the ultrasonic vibration required to
perform the bond.
The bonding head also contains the wire clamp, which performs the tear
and tail operations.
3.1.5 The Tool Lifter

The tool lifter enables manual lifting of the front end of the bonding head.
This is useful for replacing the wedge/capillary, or for protecting the
wedge/capillary when it's not in use. Raising the tool lifter causes its lever
to lower the rear part of the bonding head, which raises the bonding head
front and the wedge/capillary.
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3-5
The Base
3.1.6 The Clamp Lifter (4523D, 4523AD)

The clamp lifter helps you feed the wire into the wedge wire feed hole.
Raising the clamp lifter moves the wire clamp away from the rear of the
wedge.
The clamp lifter handle is linked to an arm that raises the rear end of the
tear & feed arm, which in turn, pivots the wire clamp to the rear position.
3.1.7 The Negative Electronic Flame Off System (N.E.F.O.)

(4524D, 4524AD)
The Negative Electronic Flame Off System (N.E.F.O.) is a standard
feature of Models 4524D and 4524AD. The N.E.F.O. has two assemblies:
"# A generator box mounted inside the rear of the main head.
"# A wand located above the bonding head.
The generator box supplies negative voltage to the wand, producing a

spark between the wire and the wand. This spark creates the ball on the
wire.
3.1.8 The Spotlight (Optional)

The spotlight emits a bull’s-eye pattern on the bonding pad under the tip
of the wedge/capillary. This shows you the exact location of the bonding.
Using the centering screws in the spotlight housing, you can center the
beam on the bonding target area.
3.2 The Base

The base houses the bonder's electronic and mechanical controls. The
following subassemblies are found on the base:
"# The Manipulator and Multi Mouse (right or left-hand operation)

"# Right and Left Control Panels
"# Motorized Y Table (4523AD, 4524AD)
"# Workholder Connector Panel
"# The Keypad

3-6
3.2.1 The Manipulator and Multi Mouse

The manipulator supports the workholder table. It glides on three
ball-bearing raceways mounted within the base. The manipulator moves
in the horizontal plane, without backlash, and is secured against rotation.
The manipulator helps you maneuver a device, so that the bonding pads
rest directly under the wedge/capillary. You can also maneuver the device
over a larger motion by moving the workholder on the workholder table.
The Multi Mouse, located on either the right or left side of the base, is
used primarily to make fine adjustments in the position of the workholder.
Through a mechanical linkage system, the motion of the Multi Mouse is
translated, at a 6:1 ratio, to the manipulator.
The Multi Mouse includes buttons for controlling the bonding cycle and
programming the stitch cycle. For more details, see section 4.1.
3.2.2 The Motorized Y Table (4523AD, 4524AD)

The motorized Y table is mounted on the manipulator of Models 4523AD
and 4524AD. This enables programmable motion along the Y-axis which
controls loop formation. The table assembly contains the following:
"# Stepper motor

"# Lead screw
"# Anti-backlash nut
"# Linear slides
3.2.3 The Left and Right Control Panels

The left and right control panels are located on the upper face of the base
(see Figure 3-1).
The left control panel contains the power on/off switch and a Digital
Control Display. The left control panel is common for all 4500 Digital
Series Bonders.
The right control panel contains controls and indicators for the bonder's
electrical operations, such as the temperature controller, light and clamp
transducer testing, and N.E.F.O. system (4524D, 4524AD). The right
control panel is specific for each model.
The controls and their functions are described in Chapter 4.
P/N 94500-000D-000-01 ver03/02

3-7
The Base
3.2.4 The Keypad

The keypad is located on the base to either the left or right of the
workholder table. The keys on the keypad are used to set and control the
bonder parameters and also to perform loading and saving of bonding
programs. For more details, see section 4.4.
3.2.5 The Workholders Connectors Panel

The workholders connectors panel is located at the center of the bonder
directly behind the workholder table. It contains the following connectors:
Connects to the workholder thermocouple,

T.C.
which indicates the workholder
temperature.
Connects to the workholder heating power

HEATER
supply.
Connects two 19 V ac lines to the motorized

MOTOR
index workholder power supply.

3-8
Controls and Indicators
4. CONTROLS AND INDICATORS

The K&S 4500 Digital Series Manual Wire Bonders include the following
controls and indicators as shown in Figure 4-1.
1 Keypad
2 Main Power
Switch
3 Display
4 Temperature
Controller
5 Right Panel
Control
Buttons
6 Multi Mouse
3 4
2 5
Figure 4-1: Model 4500 Digital Series Manual Wire Bonder - Main Parts
P/N 94500-000D-000-01 ver03/02

4-1
The Multi Mouse
4.1 The Multi Mouse

The Multi Mouse is located on the base either to the right or the left of the
workholder table. The Multi Mouse has the following three functions:
!" Controlling the bonding cycle.

!" Fine positioning of the bonding pad under the wedge/capillary.
!" Programming the stitch cycle.
The Multi Mouse has the following two pushbuttons and a side button
(see Figure 4-2):
SEMI/AUTO Left pushbutton on the top side of the Multi Mouse.

Used to operate the Semi-Automatic Bonding Cycle.
MANUAL Z The Manual Z activator side button located on the left

side of the Multi Mouse. Used in manual operations to
control the bonding head movement.
STITCH Right pushbutton on the top side of the Multi Mouse.

Used to program the Stitch Cycle (see programming
section 4.4).
1 Manual Z
Sidebutton
2 Semi Auto
Pushbutton
3 Stitch
2 3 Pushbutton
Figure 4-2: The Multi Mouse

4-2
4.2 The Right Panel

The right control panel is located on the base to the right of the
workholder table. There are two types, one for models 4523D and 4523AD
(see Figure 4-3) and another for models 4524D and 4524AD
(see Figure 4-4).
4.2.1 Right Panel Controls (Models 4523D, 4523AD)
1 Temperature
Controls
2 Control
Buttons
Figure 4-3: Right Control Panel (Models 4523D, 4523AD)
The following right panel controls are relevant to models 4523D and
4523AD:
Applies the bond force to the bonding head.

Used while setting up the bonder.
When LED is ON, bond force is applied.
Tests the ultrasonic generator.

When LED is ON, the ultrasonic transducer is active.
This also signals that the ultrasonic circuit is properly
tuned.
Resets the bonder.
Turns the area light on and off.
P/N 94500-000D-000-01 ver03/02

4-3
The Right Panel
Opens the wire clamp for wire loading.

When LED is ON, the clamp is opened.
Selects the height of the RESET postion.

When LED is ON, the RESET position is HIGH.
When LED is OFF, the RESET position is LOW.
4.2.2 Right Panel Controls (Models 4524D, 4524AD)
1 Temperature
Controls
2 Open & Short
LEDs
1 3 Control
Buttons
Figure 4-4: Right Control Panel (Models 4524D, 4524AD)
The following right panel controls are relevant to models 4524D and
4524AD:
Applies the bond force to the bonding head.

Used while setting up the bonder.
When LED is ON, bond force is applied.
Tests the ultrasonic generator.

When LED is ON, the ultrasonic transducer is active.
This also signals that the ultrasonic circuit is properly
tuned.
Resets the bonder.
Turns the area light on and off.

4-4
Opens the wire clamp for wire loading.

When LED is ON, clamp is opened.
Disables the N.E.F.O. operation.

The LED, when lit indicates disabled N.E.F.O.
Produces a momentary spark between the wand and the

wire. Used for manual ball formation.
OPEN LED indicator that lights when the N.E.F.O. did not
produce a spark because of a remaining open circuit
between the wire and the wand.
SHORT LED indicator that lights when the N.E.F.O. did not
produce a spark because of a short circuit between the
wire and the wand.
4.2.3 Temperature Controls (all models)

The temperature controls are located in the right panel control area. They
are common to all 4500 Digital Series Bonders and have the following
parameters:
SET This parameter sets the workholder temperature.
UP This parameter increases the set point 1 value during

temperature setting.
DOWN This parameter decreases the set point 1 value during

temperature setting.
LED I Status light which blinks when set point 1 is displayed or

changed.
LED II Status light which is not used by the bonder.
TC Display This parameter shows the temperature (°C) of the

workholder.
For more details, see the supplied EWPC 907/T Series manual.
P/N 94500-000D-000-01 ver03/02

4-5
The Left Panel
4.3 The Left Panel

The Left Panel contains the Main Power Switch and the Display.
1 Main Power
1 Switch
2 Display Open
&
Short
LED
s
Figure 4-5: Left Panel
4.3.1 Power Switch
ON/OFF Switch for powering on the bonder. When the switch is in

the up position (1), power from the AC wall outlet is
applied to the bonder. (The switch is illuminated.)
4.3.2 Display
All machine parameters can be viewed on a 4 x 20 character LCD used to
display:
!" Bond schedule

!" Bond parameters
!" Loop parameters
!" Operation modes

4-6
Bond Schedule
Bond Parameters Search 1.44 1 2 (Active Bond Highlighted)
Cursor
Power 1.52
Time 3.3
Force 1.8
Figure 4-6: 1st Bond Screen (4523AD)
Bond Parameters Bond Schedule

Step 3.7 1 2
Cursor
Kink 1.2
Reverse 2.0
Y speed 5.0 Loop 3.1
Figure 4-7: Loop Screen (4523AD)
Cursor Mode: Standard
Time: Short
Tail: Long
Auto: Off
Figure 4-8: Modes Screen (4523AD)
4.3.2.1 Bond Schedule
The bond schedule describes the programmed machine bonding cycle.

For example:
12 Describes a simple wire using first bond channel and

second bond channel.
12_34 Describes two separate wires using four bond channels.
123 Describes a stitch bond program using three bond

(Models 4523D channels.
& 4523AD)
123 Describes a multiple ball bumping/S.P.T bond schedule

(Models 4524D using three channels.
& 4523AD)
P/N 94500-000D-000-01 ver03/02

4-7
The Left Panel
4.3.2.2 Bond Parameters
The bond parameters are per specific model:
4.3.2.2.1 Search Parameter
This parameter controls the Search height of the bonding head. This is the
position at which the bonding head stops above the bond site. At the
Search height, you can perform fine positioning (by the Multi Mouse) of
the device before bonding the wire. The Search height is set to 75 - 100 µm
(3 - 4 mil) above the bond site.
4.3.2.2.2 Power Parameter
Bonding power is the amount of ultrasonic (U/S) energy applied to the

bond. High Power parameter settings result in high ultrasonic vibration
amplitude and lower settings result in low vibration amplitude. The Power
parameter has two scales - LOW and HIGH. The current scale depends on
whether the ultrasonic generator has been set to LOW or HIGH. The LOW
scale is used for wire thickness of up to 50 µm (2 mil). The HIGH scale is
used for wire thickness ranging from 50 to 75 µm (2 - 3 mil). The position
of the HIGH/LOW switch on the logic board sets this scale.
Caution: The U/S power level is preset in the factory. The HIGH/LOW
switch should be set by authorized service personnel only.
4.3.2.2.3 Time Parameter
This parameter controls duration of the ultrasonic energy and bonding

force. Bonding time is the amount of time that the ultrasonic power and
force are applied. The TIME parameter scale changes if the bonding time
set by the TIME parameter in the MODES screen is set to Short or Long.
The K&S 4500 Digital Series wire bonders are factory-set to a maximum
standard bonding time of 120 ms, which is suitable for most applications.
The Time setting in the MODES screen can be set to Long or Short. The
TIME parameter of each bond channel can be set to provide a maximum
long bonding time of 1000 ms. Longer bonding times may be needed for
high temperature bonding, for applications where low ultrasonic energy is
required, or for bonding wires other than gold.

4-8
To change the Time setting to short or long bonding time:

1 On the Display, move to the MODES screen and select Time.
2 Use the or key to change the TIME setting to SHORT or LONG.
Models 4524D, 4524AD are factory-set to the following maximum bonding

times:
!" 200 ms for Standard Ball Bonding

!" 200 ms for Ball Bumping
!" 1000 ms for Single Point TAB
4.3.2.2.4 Force Parameter
This parameter controls the downward force exerted by the bonding head
during bonding. Bonding force is applied to the wire while the ultrasonic
energy is being applied. This force consists of the following:
!" Static force, which is set by the position of the counterweights on the
bonding head cover.
!" Amount of force applied by the electromagnetic coil (set by the FORCE
parameter).
4.3.2.2.5 Tail Parameter
This parameter sets the tail length. The tail is the length of wire
protruding from the tool after performance of the second bond. A tool with
a longer bonding foot requires a higher TAIL parameter setting, and a tool
with a shorter foot requires a lower TAIL parameter setting. The setting
must always ensure that sufficient tail length exists to enable the
N.E.F.O. wand to create the spark for ball bonding (4524D, 4524AD), or to
enable a complete first bond for wedge bonding (4523D, 4523AD).
To change the Tail setting to short or long (models 4523D, 4523AD only):
1 On the Display, move to the MODES screen and select TAIL.
2 Use the or key to change the TAIL setting to SHORT or LONG.
P/N 94500-000D-000-01 ver03/02

4-9
The Left Panel
4.3.2.2.6 Tear Parameter (Models 4523D, 4523AD)
This parameter sets the length of the tear movement after performance of
the second bond.
4.3.2.2.7 Ball Parameter (Models 4524D, 4524AD)
The BALL parameter is used for setting the ball size. This parameter
should be set at 2 - 3 times larger than the diameter of the wire. If the ball
is too small, it can block up the capillary. If the ball is too large, it can
cause a short-circuit between the N.E.F.O. wand and the wire.
You can view the ball size in the Reset position (before starting the
bonding cycle) by adjusting the microscope magnification.
4.3.2.3 Loop Parameters
The LOOP parameter is common to all models. The other loop parameters:
STEP, KINK, REVERSE and Y SPEED are relevant to models 4523AD and
4524AD only.
4.3.2.3.1 Loop Parameter (All models)
This parameter sets the height to which the bonding head rises after
performing the first bond. This height is determined by the wire diameter
and the specific application.
4.3.2.3.2 Step Parameter (Models 4523AD, 4524AD)
This parameter sets the motorized Y table's Stepback (backward motion).

The Stepback is the distance of the motorized Y table motion between the
first and the second bond pads. This distance is set by the STEP parameter
on the Display using the dedicated STEP + and - keys.
The Stepback travel saves manipulation time. It is useful for applications

requiring a series of parallel wires having equal distances between the
first and second bonds.
!" In the Semi Automatic Bonding Cycle mode, the maximum Stepback
setting is 4mm (160 mil).
!" In the Lange Coupler mode, the recommended Stepback setting is
0.5mm (20 mil).
4.3.2.3.3 Kink Parameter (Models 4523AD, 4524AD)
This parameter sets the height to which the bonding head rises after
performing the first bond. This setting affects loop formation. The Kink
height is the length of wire protruding from the wedge after the bonding
head rises following performance of the first bond.

4-10
4.3.2.3.4 Reverse Parameter (Models 4523AD, 4524AD)
This parameter sets the motorized Y table's forward motion. This setting
affects loop formation. In standard bonding modes, the Reverse parameter
is the amount of reverse motion of the motorized Y table following the first
bond (which influences looping). This value is set before bonding by the
Reverse parameter on the Display.
After the bonding head rises to the Kink height, the Y table moves
backwards the distance set by the Reverse setting. The bonding head then
rises to the Loop height.
In Lange Coupler mode, the Reverse motion is used to create low loops.
After making the first bond, the bonding head rises to the Loop height and
the motorized Y table returns. At the second Search height, the motorized
Y table performs the reverse motion. This reverse motion presses the wire
backward, creating a low loop.
4.3.2.3.5 Y Speed Parameter (Models 4523AD, 4524AD)
This parameter sets the motorized Y table speed. This value is used in
very fine bonding applications.
4.3.2.4 Operation Modes
4.3.2.4.1 Mode
Used to select the bonding cycle to be performed.
Table 4-1: Available Operation Modes
Model Modes
4523D Standard
4523AD Standard
Lange Coupler
Table tear
4524D Standard
4524AD Ball Bumping
S.P.T
P/N 94500-000D-000-01 ver03/02

4-11
The Left Panel
4.3.2.4.2 Time
You can choose between Short and Long Bonding Time.
4.3.2.4.3 Tail
You can choose between Short and Long Tail.
4.3.2.4.4 Auto
You can choose between On and Off. On indicates automatic complete wire
performance and Off indicates standard semi-automatic/manual wire
performance.
4.3.3 4523D Screens
Search 1.84 1 2
Power 1.76
Time 5.2
Force 1.8
Figure 4-9: 1st Bond Screen (4523D)
Search 2.02 1 2
Power 1.84 Loop 2.9
Time 3.8 Tail 3.0
Force 2.3 Tear 7.0
Figure 4-10: 2nd Bond Screen (4523D)
Mode: Standard
Time: Long
Tail: Short
Figure 4-11: Modes Screen (4523D)

4-12
4.3.4 4523AD Screens
Search 1.84 1 2
Power 1.76
Time 5.2
Force 1.8
Figure 4-12: 1st Bond Screen (4523AD)
Step 3.7 1 2
Kink 1.2
Reverse 2.0
Figure 4-13: Loop Screen (4523AD)
Search 2.02 1 2
Power 1.84
Time 3.8 Tail 3.0
Force 2.3 Tear 7.0
Figure 4-14: 2nd Bond Screen (4523AD)
Mode: Standard
Time: Short
Tail: Long
Auto: Off
Figure 4-15: Modes Screen (4523AD)
4.3.5 4524D Screens (Standard Mode)
Search 1.84 1 2
Power 1.76
Time 5.2
Force 1.8
Figure 4-16: 1st Bond Screen (4524D Standard Mode)
Search 2.02 1 2
Power 1.84 Loop 2.6
Time 3.8 Tail 4.4
Force 2.3 Ball 4.8
Figure 4-17: 2nd Bond Screen (4524D Standard Mode)
P/N 94500-000D-000-01 ver03/02

4-13
The Left Panel
Mode: Standard
Time: Long
Figure 4-18: Modes Screen (4524D Standard Mode)
4.3.6 4524D Screens (Ball Bumping Mode)
Search 2.40 1 2
Power 1.88
Time 5.2 Tail 4.4
Force 2.8 Ball 4.7
Figure 4-19: 1st and Additional Screens (4524AD Ball Bumping Mode)
Mode: Ball Bumping

Time: Long
Figure 4-20: Modes Screen (4524D Ball Bumping Mode)
4.3.7 4524D Screens (S. Point Tab)
Search 2.40 1 2
Power 1.88
Time 5.2
Force 2.8 Loop 2.5
Figure 4-21: 1st and Additional Screens (4524D S. Point Tab Mode)
Mode: S. Point Tab

Time: Long
Figure 4-22: Modes Screen (4524D S. Point Tab)

4-14
4.3.8 4524AD Screens (Standard Mode)
Search 1.84 1 2
Power 1.76
Time 5.2
Force 1.8
Figure 4-23:1st Bond Screen (4524AD Standard Mode)
Step 3.0 1 2
Kink 1.6
Reverse 2.4
Figure 4-24: Loop Screen (4524AD Standard Mode)
Search 2.00 1 2
Power 1.76
Time 3.2 Tail 4.8
Force 2.8 Ball 4.7
Figure 4-25: 2nd Bond Screen (4524AD Standard Mode)
Mode: Standard
Time: Long
Auto: On
Figure 4-26: Modes Screen (4524AD Standard Mode)
4.3.9 4524AD Screens (Ball Bumping Mode)
Search 2.40 1 2
Power 1.88
Time 5.2 Tail 4.4
Force 2.8 Ball 4.7
Figure 4-27: 1st Screen (4524AD Ball Bumping Mode)
P/N 94500-000D-000-01 ver03/02

4-15
The Left Panel
Search 2.86 1 2
Power 1.72 Step 3.2
Time 5.8 Tail 4.0
Force 2.4 Ball 4.2
Figure 4-28: 2nd and Additional Screens (4524AD Ball Bumping Mode)
Mode: Ball Bumping

Time: Long
Auto: On
Figure 4-29: Modes Screen (4524AD Ball Bumping Mode)
4.3.10 4524AD Screens (S. Point Tab Mode)
Search 2.80 1 2
Power 1.76
Time 3.2
Force 3.8
Figure 4-30: 1st Screen (4524AD S. Point Tab Mode)
Search 2.86 1 2
Power 1.72
Time 5.8 Step 3.2
Force 2.4 Loop 3.6
Figure 4-31: 2nd and Additional Screens (4524AD S. Point Tab Mode)
Mode: S.Point Tab

Time: Short
Tail: Short
Figure 4-32: Modes Screen (4524AD S. Point Tab Mode)

4-16
4.3.11 The Keypad

The keypad is located on the base to the left of the workholder table.
The STEP keys are relevant to models 4523AD and 4524AD only. All other
keys are common to all 4500 Digital Series Manual Bonders.
Figure 4-33: Keypad
P/N 94500-000D-000-01 ver03/02

4-17
The Left Panel
4.3.12 Keypad Control Keys

The following keys are used to set and control the bonder parameters and
also to perform loading and saving of bonding programs.
Deletes bond channels.

Escapes load, save and mode change operations.
Adds simple wires.

Adds bond channels in multiple ball bumping and S. Point
Tab.
Saves bonding program to memory.
Loads bonding program from memory.
Confirms key action when requested.
Switches between manual and semi auto operation:

When LED is ON, Manual Z operation is selected.
When LED is OFF, Semi-auto operation is selected.
UP/DOWN Moves cursor up or down one

configurable parameter.
Moves cursor up or down one screen.
Note: Cursor skips over

dedicated parameters.
LEFT/RIGHT Moves cursor to left or right parameter
(if available).
PLUS/MINUS Increases or decreases value of

parameter marked by cursor.

4-18
4.3.13 Dedicated Parameters Keys

These keys enable increasing and decreasing search, loop, and tail
parameter values. They are active also during the bonding cycle.
Raises and lowers the bonding head in search position.
Increases and decreases the loop height.
Increases and decreases the tail length.
Increases or decreases Stepback distance

(Models 4523AD, 4524AD only).
4.4 Programming
The following sections describe the steps of the programming:
!" Changing parameter values

!" Changing modes
!" Loading and saving bonding schedules
!" Creating new bonding schedules
4.4.1 Changing Parameter Values

Common parameter values, such as POWER, TIME and FORCE can be
changed using the central + or - keys. Dedicated values (SEARCH, LOOP,
TAIL and STEP) can be changed using the blue dedicated parameter keys.
To change common parameter values:

1 From the first digital display screen, use the arrow keys to move the
cursor to the required parameter.
2 Increase (+) or decrease (-) the value of the parameter using the
central + or - key.
P/N 94500-000D-000-01 ver03/02

4-19
Programming
To change dedicated parameter values:

1 Move to the relevant bond channel screen containing the required
parameter.
2 Press the + and - keys above and below the blue dedicated keys to
increase or decrease the value of the parameter.
Note: Dedicated keys are also used during bonding operations.
4.4.2 Changing Modes and Settings

Use the following procedure for changing modes (Standard, Ball Bumping,
Table tear etc. and settings (Time, Auto, Tail etc.).
To change a mode or a setting:

1 Move to the MODES screen.
2 Move to the required parameter.
3 Using the central + or - key, select the mode or setting required.
Changing MODE operation status will be followed by a confirmation

request and machine initialization.
To load a bonding program:

1 On the Keypad, press the LOAD key. A Load Program screen appears.
2 Select the required program using the + and - keys.
3 Press the ENTER key to confirm the selected program. The program is
loaded.

4-20
To save a bonding program:

1 On the Keyboard, press the SAVE key. A Save Program screen appears.
2 Choose the program number using the + and - keys.
3 Press the ENTER key to confirm the program number. The program is
saved.
4.4.3 Creating Bonding Schedules

Various bonding schedules may be defined. Depending on the bonder
model and the selected mode you may create:
!" Stitch bond schedules (models 4523D, 4523AD)

!" Two-wire bond schedules (all models)
!" Multiple ball bumping/S. Point Tab schedules (models 4524D,
4524AD)
To create a stitch bond schedule:

1 Use the arrow keys to move to the screen displaying the last bond
channel.
2 Press the Stitch Pushbutton on the Multi Mouse. A confirmation

message appears.
Press ENTER to confirm. An additional bond channel is added to the

bond schedule with identical parameters to the previous bond. You
may repeat this operation as needed – up to 4 stitches per cycle.
3 Return to the first bond channel screen to start working.
Note: To delete existing stitch bond channels, move the cursor to the last
bond channel and press ESC/DEL.
P/N 94500-000D-000-01 ver03/02

4-21
Password Protection
To create a two-wire bond schedule:

schedule.
2 Press the ADD key. An additional wire with two bond channels is
added to the bond schedule with identical parameters to the previous
bond.
Note: To delete existing wires, move the cursor to one of the bond
channels of the wire and press ESC/DEL.
To create multiple ball bumping/S.P.T schedules:

schedule.
2 Press the ADD key. An additional bond channel is added to the bond
schedule with identical parameters to the previous bond. You may
repeat this operation as needed.
Note: To delete existing wires, move the cursor to one of the bond
channels of the wire and press ESC/DEL.
4.5 Password Protection

The K&S 4500 Digital Series Manual Wire Bonders include a Password
Protection feature that protects system parameters from unauthorized
personnel. When enabled, the Password Protection feature has two
authorization levels, Engineer and Operator. An Engineer can change any
parameter in the system, while the Operator has authorization to change
the following parameters only:
!" Search parameter

!" Loop parameter
!" Tail parameter
!" Step parameter
Furthermore, an Operator can load a program using the LOAD button. The
loading sequence remains unchanged.
When Password Protection is enabled, only Users who hold the password
can log onto the model 4500 with the Authorization Level of an Engineer.
Engineers have the ability to change the password, as described in
section 4.5.3.

4-22
Systems equipped with the Password Protection feature are supplied with
a master password from K&S. Engineers, however, can create a new
password, as described in section 4.5.3.
Note: The master password is 4500.
4.5.1 Entering an Authorization Level

The Authorization Screen is the opening screen displayed when the
Password Protection feature is enabled in the Model 4500. The User must
enter his or her authorization level before continuing.
To Enter the Authorization Level:
1 Turn on the System. The Authorization screen is displayed, as

follows:
Authorization:
1. Engineer
2. Operator
2 Use the UP and DOWN ARROW keys to select either Engineer, which
leads to the Password screen or Operator, which leads to the Main
Program.
3 Press ENTER.
Note: The System should be turned off in order to switch between an

Engineer and an Operator.
4.5.2 Entering a Password

The Password screen, which is available only in Engineer Mode, enables
the User to enter the password necessary to access the System as an
Engineer.
To Enter the Authorization Level:
1 From the Authorization screen (section 4.5.1), select Engineer. The

Password screen is displayed, as follows:
Enter Password:
0000
2 Enter the password, using the PLUS and MINUS keys to change the
digits, and the LEFT and RIGHT ARROW keys to move between digits.
P/N 94500-000D-000-01 ver03/02

4-23
Password Protection
3 Press ENTER. The Change Password screen is displayed, as follows:
Change Password:
1. Yes
2. No
4 Use the UP and DOWN ARROW keys to select No.
5 Press ENTER. The Main Program is displayed.
4.5.3 Changing the Password

The Change Password screen, which is available only in Engineer Mode,
enables the Engineer to change the password, as required.
To Change the Password:
1 From the Authorization screen (section 4.5.1), select Engineer. The

Password screen is displayed, as follows:
Enter Password:
0000
2 Enter the current password, using the PLUS and MINUS keys to change
the digits, and the LEFT and RIGHT ARROW keys to move between
digits.
3 Press ENTER. The Change Password screen is displayed, as follows:
Change Password:
1. Yes
2. No
4 Use the UP and DOWN ARROW keys to select Yes.
5 Press ENTER. The New Password screen is displayed as follows.
Enter Password:
0000
6 Enter the new password, using the PLUS and MINUS keys to change
the digits and the LEFT and RIGHT ARROW keys to move between digits.
7 Press ENTER. The Main Program is displayed.

4-24
Setup and Adjustments
5. SETUP AND ADJUSTMENTS

This chapter contains the procedures and instructions for setting up and
adjusting the K&S 4500 Digital Series Manual Wire Bonders for
operation. Unless otherwise specified in your order, your machine was
adjusted and tested at the K&S factory according to K&S standard
procedure.
!" Models 4523D/4523AD are factory-set for bonding with 25 µm (1 mil)

aluminum wire.
!" Models 4524D/4524AD are factory-set for bonding with 25 µm (1 mil)
gold wire.
Unpack and install the machine according to the instructions in

Chapter 2. Before setting up the machine, familiarize yourself with its
control panels (see Chapter 4). Then perform the procedures in this
chapter in the order in which they appear (depending on your machine
model).
5.1 Tool Installation
5.1.1 Wedge Installation (4523D, 4523AD)
Note: Two setup gauges are supplied with the bonder: one for the
0.750" drop and one for the 0.828" drop. It is recommended to use the
0.750" wedge with either of these gauges. If you use the 0.828" wedge,
readjust the wire clamp position.
To install the wedge:
1 Take the plastic tube containing the wedge, Allen wrench and setup
gauges out of the machine accessories box.
2 Use the Allen wrench to loosen the wedge set screw located at the
front of the transducer. Insert the wedge so that the same amount
protrudes out the top of the transducer tip as from the bottom.
Tighten the set screw slightly so that the wedge is securely in place.
3 Position the setup gauge under the wedge (see Figures 5-1 and 5-2).
4 Loosen the set screw and gently push the wedge down until its tip
just rests on the setup gauge (see Figures 5-1 and 5-2). Tighten the
wedge set screw.
P/N 94500-000D-000-01 ver03/02

5-1
Tool Installation
Figure 5-1: Wedge Installation Using the Setup Gauge -4523D, 4523AD with 30°/45°
Wire Feed, 0.75" Drop
Figure 5-2: Wedge Installation Using the Setup Gauge - 4523D, 4523AD with Vertical
Wire Feed, 0.828" Drop
Caution: Do not tighten the set screw all the way since this may damage
the screw socket.
Caution: When the wedge tip rests on the setup gauge, do not move the
gauge, since this can rub the wedge, damaging the tip.

5-2
5 Power on the machine. Wait until initialization is completed.
6 Press the TEST control button and check that the green LED turns
On. Release the TEST control button and check that the LED turns
Off.
7 Wait at least 30 minutes until the machine warms up.
8 To retest for a tuned condition of the ultrasonic circuit, press the TEST
control button and check that the green LED turns On. Release the
TEST control button and check that the LED turns Off.
Table 5-1: Recommended Wedges
Model Description K&S Part Number Manufacturer Serial

Number
4523D 1.0 mil, Gold 27795-1003-010 Deweyl

/4523AD wire, vertical TKSVD-1/16-750-45-CG-
Deep feed 2025-M-A8D
Access Micro-Swiss
4WDE4-1825-TG5-M21
0.7 mil, Gold 27795-1003-007 Deweyl

wire, vertical TKSVD-1/16-750-45-F-1510-
feed M-A8D
Micro-Swiss
4WDE4-1315-T5F-M21
2.0 mil, Gold 27795-1003-020 Deweyl

wire, vertical TKSVD-1/16-750-45-CG-
feed 3035-M-A8D
Micro-Swiss
4WDF4-3030-T5G-M21
1x5 mil, 27795-1004-050 Deweyl

Gold TKSVD-1/16-750-45-CG-
Ribbon, 1X5-3-M
vertical feed Micro-Swiss
4WRF4-D230-T5G-M21
1x10 mil, 27795-1004-100 Deweyl

Gold TKSVD-1/16-750-45-CG-
Ribbon, 1X10-3-M
vertical feed Micro-Swiss
4WRF4-J240-T5G-M21
1.0 mil, 27795-1005-010 Deweyl

Aluminum CKSVD-1/16-750-45-C-2025-
wire, vertical M-A8D
feed
4523D 1 mil, 40427-0007-152 Micro-Swiss

/4523AD Aluminum 4WNL0-2025-W5C-M00
Standard wire, 30° feed
Access
P/N 94500-000D-000-01 ver03/02

5-3
Tool Installation
Table 5-1: Recommended Wedges
Model Description K&S Part Number Manufacturer Serial

Number
1 mil, Gold 40428-0002-251 Micro-Swiss

wire, 30° feed 4WNL0-2025-T5G-M00
0.7 mil, Gold 40430-1310-251 Micro-Swiss

wire, 30° feed 4WAV0-1315-T5F-M00
1x5 mil, 44293-0009-251 Micro-Swiss

Gold ribbon, 4WRL0-D230-T5G-M00
30° feed
1x10 mil, 44293-0015-251 Micro-Swiss

Gold ribbon, 4WRL0-J230-T5G-M00
30° feed
5.1.2 Capillary Installation (4524D, 4524AD)
To install the capillary:
1 Take the plastic tube containing the capillary, Allen wrench and
setup gauges out of the machine accessories box.
2 Use the Allen wrench to loosen the capillary set screw located at the
front of the transducer. Insert the capillary so that the same amount
protrudes out the top of the transducer tip as from the bottom.
Tighten the set screw slightly so that the capillary is securely in
place.
3 Position the setup gauge under the capillary (see Figure 5-3).
4 Loosen the set screw and gently push the capillary down until its tip
just rests on the setup gauge (see Figure 5-3). Tighten the capillary
set screw.

5-4
Figure 5-3: Capillary Insertion Using Setup Gauge - 4524D, 4524AD
Caution: Do not tighten the set screw all the way since this may damage
the screw socket
Caution: When the capillary tip rests on the setup gauge, do not move the
gauge, since this can rub the capillary, damaging the tip.
5 Power on the machine. Wait until initialization is completed.
6 Press the TEST control button and check that the green LED turns
On. Release the TEST control button and check that the LED turns
Off.
7 Wait about 30 minutes until the machine warms up.
8 To retest for a tuned condition of the ultrasonic circuit, press the TEST
control button and check that the green LED turns On. Release the
TEST control button and check that the LED turns Off.
P/N 94500-000D-000-01 ver03/02

5-5
Tool Installation
Table 5-2: Recommended Capillaries
Model Description K&S Part Manufacturer Serial

Number Number
4524D/ 1.0 mil, Gold 40472-0010-324 Micro-Swiss

4524AD wire
Standard
Access

wire
4524D/ 1.0 mil, Gold 40472-0010-624 Micro-Swiss

4524AD wire
RC
4524D/4524 1.0 mil, Gold 40472-0012-344 Micro-Swiss

AD wire
Deep
Access
4524D 1.0 mil, Gold 41494-0024-335 Micro-Swiss

Ball wire
Bumping

wire
4524D For coining 41482-0075-330 Micro-Swiss

Coining ball up to
5 mi

5-6
5.2 Microscope Adjustment

To adjust the microscope:
1 Turn the ZOOM knob to minimum magnification and turn the area
light on.
2 Set the LOOP dial to 0. Press and release the Semi Auto Pushbutton.
The bonding head passes through the first bond cycle, leaving the
wedge/capillary at the Loop height.
3 Release the pivot locking screw and swivel the microscope to the left or
right. Pivot it up or down so that you see the wedge/capillary in the
center of the field of view of the right eyepiece. Turn the focus knob
until the wedge/capillary is in sharp focus.
4 Turn the ZOOM knob to maximum magnification. Repeat step 3 until

the wedge/capillary tip is sharply focused in the field of view.
5 Tighten the microscope locking screw.
6 Adjust the distance between the eyepieces by pulling or pushing the

oculars sideways.
7 To compensate for differences in right and left eye focus requirements,

focus the left eyepiece independently using the left ocular focus ring.
5.3 Bonding Force Adjustments and Setup

Before starting bonding operation, you must verify the bonding forces of
your machine and set them to the factory values. For different
applications, see the recommended values for your specific model. (The
recommended values for each specific wire type are included in Chapter 6
in the Recommended Machine Adjustments tables, and are listed
separately for each model).
To set the bonding force:
1 Ensure that the bonding head is in the Reset position.
2 Remove the workholder from the workholder table.
3 Press the SETUP key. The green LED lights.
4 On the Display, set all Search parameters to 0.00.
5 Press and hold the Semi Auto Pushbutton.
6 Using a gram gauge (see Figure 5-4), lift the bonding head until the
gauge reading starts to rise.
P/N 94500-000D-000-01 ver03/02

5-7
Bonding Force Adjustments and Setup
7 Read the gram gauge. This is the first bond force. To adjust this force
to the factory recommended setting, or any other setting you require,
set the FORCE parameter accordingly (the recommended values for each
specific wire type are included in Chapter 6 in the Recommended
Machine Adjustments tables, and are listed separately for each model).
8 Release the Semi Auto Pushbutton.
9 Press and hold the Semi Auto Pushbutton. The bonding head moves
to the second Search height. The second bond channel number is
highlighted in the Display.
10 Repeat steps 6-9 until all the force parameters are set.
11 Press the SETUP key. The LED turns off.
Note: If the required bonding force appears to be lower than the minimum
force (FORCE = 0.0) or higher than the maximum force (FORCE = 9.9),
readjust the static force (see section 9.2.3).
Figure 5-4: Force Adjustment Using a Gram Gauge

5-8
5.4 Workholder Installation and Adjustment

Note: This procedure refers to manually height adjustable workholders of
type 483, 4142 or 4135. For motorized workholders, see the
instructions that are supplied with the workholder.
5.4.1 Workholder Installation
To install the workholder:
1 Take the workholder out of the machine accessories box.
2 Hold the top of the workholder and turn the workholder base
counterclockwise until it stops. The workholder is now at its minimum
height.
3 Place the workholder on the work station.
4 If using a heated workholder, connect the workholder harness to the

HEATER and T.C. connectors on the workholder connectors panel.
5.4.2 Workholder Height Adjustment
To adjust the workholder height (see Figure 5-5):
1 Load a device in the workholder. Adjust the workholder clamps to

secure the device in place
2 Set the LOOP parameter to 1. Press and release the Semi Auto
Pushbutton. The bonding head drops to its lowest position and
remains there. Ensure that the display shows the second bond channel
screen.
3 Hold the top of the workholder and turn the base of the workholder
clockwise to raise the workholder until the wedge/capillary just
touches the lowest bonding level.
4 Set the LOOP parameter to 5. Press the Semi Auto Pushbutton to

return the bonding head to the Reset position.
At this position, a device placed on the workholder should just touch
the wedge/capillary tip. The machine can now work within the
maximum range of bonding heights and the required overtravel.
P/N 94500-000D-000-01 ver03/02

5-9
Workholder Installation and Adjustment
5.4.3 Search Height Adjustment
To set the Search height:
1 Power on the bonder.
2 Move the workholder with the device to the bond site. Set the first
Search parameter to a high value, so that the wedge/capillary does not
hit the device’s surface. Press and hold the Semi Auto Pushbutton.
The bonding head descends to the first Search height.
3 Using the dedicated SEARCH key, set the Search parameter to the
required Search height, 75-100 µm (3 - 4 mil). Use a feeler gauge to
determine the Search height setting.
4 Release the Semi Auto Pushbutton.
5 Verify that the bonding head rises. On the Display, the next bond
channel number is highlighted.
6 Repeat steps 2-4 until all the Search parameters are set.
5.4.4 Setting Workholder Temperature
Note: If “EEE” appears in the temperature controller display, check that

the workholder is plugged into the workholder connectors panel properly.
To set the temperature of the workholder:
1 Press the Set Pushbutton on the temperature controller. The

temperature controller display shows the temperature setting (set
point 1) for 3 seconds. LED I blinks.
Note: If the Set Pushbutton is pressed again within 3 seconds, set point 2
appears in the display. This value has no function for the 4500 Digital
Series.
2 Press the Up and/or Down Pushbutton until the required

temperature setting appears in the display.

5-10
Figure 5-5: Adjusting Workholder Height
3 Release the pushbuttons. Within 3 seconds, set point 1 is stored in the

temperature controller memory. The temperature controller display
shows the actual workholder temperature. Ensure that LED I is on
(indicating that the workholder heater is turned on).
Note: The temperature controller is factory-set to the optimum setup. If

the actual workholder temperature deviates from set point 1, recalibrate
the temperature controller (see section 12.14). If it is necessary to change
parameters other than the set temperature, see the supplied EWPC 907/T
Series manual.
5.5 Wire Loading

Caution: When loading a wire, always wear protective gloves. Never
touch the wedge/capillary, wire or spool holder with your bare fingers.
This leaves oil traces that affect normal operation.
Caution: When handling the wedge/capillary, use a good pair of tweezers

such as MicroSwiss’ Tool Tweezers, model 43003-0010-001. Poor
quality tweezers make wire feeding difficult. This may affect the bonding
operation of your machine.
P/N 94500-000D-000-01 ver03/02

5-11
Wire Loading
5.5.1 Useful Tips

The following tips should help you during wire loading:
!" For best results, use the recommended wedges/capillaries (see sections
5.1.1 and 5.1.2).
!" When feeding the wire through the wedge/capillary:
!" Hold the wire about 12 mm (1/2") from the end (4524D, 4524AD).
!" Hold the wire about 2-3 mm (1/8") from the end (4523D, 4523AD -
30°/45° wire feed).
!" For the first feed, hold the wire about 25 mm (1") from the end.
For the second feed, hold the wire about 2-3 mm (1/8") from the
end (4523D, 4523AD - vertical wire feed).
!" Do not squeeze the wire too tightly with the tweezers. Gold is
extremely malleable and squeezing can cause the wire to get stuck
inside the wedge/capillary.
!" When feeding a new wire into the wedge/capillary, tear off a small
piece of the wire lead to create a sharp point at the end of the wire.
This makes it much easier to insert the wire into the wedge/capillary
hole.
!" If the wire does not go through the wedge/capillary hole, press and
release the TEST control button, while feeding the wire. This applies
ultrasonic vibrations to the wedge/capillary, easing the wire feeding.
5.5.2 Wire Loading of 2" Spool - Vertical Wire Feed (4524D,

4524AD)
To load the wire:
1 Power on the bonder. Ensure that the bonding head is in the Reset
position (The first bond channel number appears highlighted in the
Display).
2 If the 2" spool is not installed, install the spool holder assembly on
the spool holder bracket (see Figure 3-4).
3 Remove the plastic dust cover, spool cap and glass feed tube from the
spool holder. Place the gold wire spool in the spool holder
(see Figure 3-4).
4 While holding the glass feed tube in your hand, slip one of the rubber
O-rings over the tube’s pointed end. Slide it up to a location
15-18 mm (5/8-3/4") from the tube’s flared end. Insert the pointed end
of the tube through the spool cap, from the top.
5 Slip the second O-ring over the tube from below, and slide it up so
that the spool cap is held securely between the two O-rings. Place the
spool cap with the tube (flared end upward) on the spool holder (see
Figure 3-4).

5-12
6 Place the spool of wire on the spool holder with the free end of the
wire facing upwards. Place the spool cap together with the glass tube
over the wire spool.
7 Pull the free end of the wire, with the end pointed upward, over the
polished circumference of the spool cap and insert the wire into the
flared end of the tube. Feed the wire through the tube so that it
protrudes from the lower end.
8 Place the dust cover over the spool holder without pinching the wire.
9 Press the CLAMP control button. The LED turns On and the wire and
drag clamps open.
10 Using tweezers, grasp the small glass plate of the fixed tensioner (see
Figure 3-4) and gently remove it from its seat. If necessary, lift the
white plastic screw slightly over the tensioner to clear the way.
11 Pull the wire tip along the tensioner route and feed it through the
wire guide.
12 Ensure that the small glass plate is free of dust, grease or

fingerprints, and place it on top of the wire on the fixed tensioner
bracket. Ensure that the polished, rounded side of the glass plate
faces downward on the wire.
13 Pull the wire further through the wire guides and open jaws of the
drag clamp and wire clamp. Using tweezers, feed the wire through
the capillary so that it protrudes about 12.5 mm (1/2") from the
capillary tip.
14 Press CLAMP control button again. The LED turns Off and the clamp
closes.
P/N 94500-000D-000-01 ver03/02

5-13
Wire Loading
Figure 5-6: Wire Loading of 2" Spool - Vertical Wire Feed
Note: The wire should form a straight line from the kicker down to the
capillary. Otherwise, friction may cause looping problems and damage to
the wire. If the wire is not straight, reposition the spool holder.
5.5.3 Wire Loading of 0.5" Spool - 30°/45° Wire Feed (4523D,

4523AD)
To load the wire:
position. (The first bond channel number appears highlighted in the
Display.)
2 Place the spool of wire on the spool holder on the right side of the
bonding head.
!" If using a 30# wedge, feed the wire through the 30# wire feed hole
of the transducer.
of the transducer.
3 Press the CLAMP control button. The LED turns On and the wire clamp
opens. Lift the clamp lifter handle up, and feed the wire through the
wire clamp above the wire guide and through the wire feed hole in the
wedge.

5-14
4 Press the CLAMP control button again. The LED turns Off and the wire
clamp closes and pushes the clamp lifter handle down.
Figure 5-7: Wire Loading of 0.5" Spool - 30°/45° Wire Feed
5.5.4 Wire Loading of 2" Spool - 30°/45° Wire Feed (Optional for
4523D, 4523AD)
To load the wire:
position (The first bond channel number appears highlighted in the
Display).
2 If the 2" spool is not installed, install the spool holder assembly on the
spool holder bracket.
spool holder. Place the wire spool on the spool holder.
O-rings over the tube’s pointed end. Slide it up to a location 15-18 mm
(5/8-3/4") from the tube’s flared end. Insert the pointed end of the tube
through the spool cap, from the top.
5 Slip the second O-ring over the tube from below, and slide it up until
the spool cap is held securely between the two O-rings. Place the spool
cap with the tube (flared end upward) on the spool holder.
7 Place the dust cover back on the spool holder without pinching the
wire.
P/N 94500-000D-000-01 ver03/02

5-15
Wire Loading
bonding head.
of the transducer.
of the transducer.
opens. Lift the clamp lifter handle up, and feed the wire through the
wire clamp above the wire guide and through the wire feed hole in the
wedge.
clamp closes and pushes the clamp lifter handle down.
Note: The wire should form a straight line from the transducer to the
wedge. Otherwise, friction may cause looping problems and damage to
the wire. If the wire is not straight, see section 9.6 for Wire Clamp
Adjustment procedures.
Figure 5-8: Wire Loading of 2" Spool - 30°/45° Wire Feed

5-16
5.5.5 Wire Loading of 0.5" Spool - Vertical Wire Feed (Optional for
4523D, 4523AD)
To load the wire:
Display).
2 Assemble the spool support bracket (supplied with the vertical wire
clamp kit).
bonding head.
4 Open the clamp manually by pulling the clamp plunger towards you.
Then, rotate the clamp plunger slightly to lock it in the open position.
5 Feed the wire into the vertical hole of the wedge until it protrudes from
the hole at the bottom.
6 Ensure that the wire is loaded from the front side of the spool, through
the wire guide and the clamp, to the wedge.
7 Release the clamp plunger and close the clamp manually.
opens. Pull a small length of wire to ensure that the wire is fed
properly, without friction.
clamp closes.
Figure 5-9: Wire Loading of 0.5" Spool - Vertical Wire Feed
P/N 94500-000D-000-01 ver03/02

5-17
Wire Loading
5.5.6 Wire Loading of 2" Spool - Vertical Wire Feed (Optional for
4523D, 4523AD)
To load the wire:
Display.)
2 If the 2" spool is not installed, install the spool holder assembly on the
spool holder bracket (see Figure 3-4).
spool holder. Place the gold wire spool in the spool holder
(see Figure 3-4).
O-rings over the tube’s pointed end. Slide it up to a location 15-18 mm
(5/8-3/4") from the tube’s flared end. Insert the pointed end of the tube
through the spool cap, from the top.
5 Slip the second O-ring over the tube from below, and slide it up so that
the spool cap is held securely between the two O-rings. Place the spool
cap with the tube (flared end upward) on the spool holder
(see Figure 3-4).
6 Place the spool of wire on the spool holder with the free end of the wire
facing upwards. Place the spool cap together with the glass tube over
the wire spool.
8 Place the dust cover over the spool holder without pinching the wire.
9 Open the clamp manually by pulling the clamp plunger towards you.
Then, rotate the clamp plunger slightly to lock it in the open position.
10 Using tweezers, grasp the small glass plate of the fixed tensioner (see
Figure 3-4) and gently remove it from its seat. If necessary, lift the
white plastic screw slightly over the tensioner to clear the way.
11 Pull the wire tip along the tensioner route and feed it through the wire
guide.
12 Ensure that the small glass plate is free of dust, grease and
fingerprints, and place it on top of the wire on the fixed tensioner
bracket. Ensure that the polished, rounded side of the glass plate faces
downward on the wire.
13 Feed the wire into the vertical hole of the wedge until it protrudes from
the hole at the bottom.

5-18
14 Ensure that the wire is fed from the front side of the spool, through the
wire guide and the clamp, to the wedge.
15 Release the clamp plunger and close the clamp manually.
opens.
17 Pull a small length of wire to ensure that the wire is fed properly,
without friction.
clamp closes.
Figure 5-10: Wire Loading of 2" Spool - Vertical Wire Feed
P/N 94500-000D-000-01 ver03/02

5-19
Spotlight Adjustment
5.6 Spotlight Adjustment

If your bonder is equipped with the optional spotlight, spotlight
adjustment is necessary. Spotlight adjustment includes the following
tasks:
!" Preparing a reference bond to aid spotlight adjustment

!" Positioning the spotlight
!" Focusing
To prepare a reference bond:
1 Set the LOOP parameter to 10.

Set the REVERSE and STEP parameters to 0 (4523AD, 4524AD).
2 Maneuver the reference device directly under the bonding head.
3 Move the Multi Mouse to position the device precisely under the
wedge/capillary.
4 Perform the reference bond. Do not move the Multi Mouse after the
bond is performed. The bonding head is now at the Loop height and the
second bond channel number is highlighted on the Display.
To adjust the spotlight:
1 Loosen the clamping screw on the spotlight housing.
2 Move the spotlight housing so that you see the target spot near the
reference bond.
3 Turn the focusing ring at the top of the spotlight so that the target spot
appears as a sharp ring.
4 Turn the knurled screws near the bottom of the spotlight housing to
make fine adjustments in the target spot position.

5-20
1 Focus Ring
2 Spotlight
Clamping Screw
3 Knurled Screws
Figure 5-11: Spotlight Adjustment
Figure 5-12: 2" Spool for Ribbon Wire Feed
P/N 94500-000D-000-01 ver03/02

5-21
Spotlight Adjustment
Figure 5-13: Close-up of 2" Spool for Ribbon Wire Vertical Feed

5-22
Operation
6. OPERATION
This chapter explains how to operate your K&S 4500 Digital Series Wire
Bonder. The 4500 Digital Series Wire Bonders have common operation
principles and bonding methods. However, each model also has specific
process parameters and operation procedures. The process parameters are
explained in Chapter 4. The sections that follow describe the operating
procedures for each of the different models that comprise the 4500 Digital
Series:
!" Model 4523D Wedge Bonder

!" Model 4523AD Auto Stepback Wedge Bonder
!" Model 4524D Multi-Process Ball Bonder
!" Model 4534AD Multi-Process Auto Stepback Ball Bonder
Note: When you power on the bonder, the display will show the
parameters of the last program used. If this bonding program is not
suitable to your needs, change it to the required bond schedule. For more
information, see section 4.4.
6.1 Operating Model 4523D

This section describes the bond cycle operation modes and operating
procedures for the K&S Model 4523D Wedge Bonder.
The 4523D can operate in the following bonding modes:
!" Standard Mode
6.1.1 Standard Mode Wedge Bonding

The 4523D performs standard mode wedge bonding using Semi Auto or
Manual Z operation.
Note: Graphic representations of the cycle appear in Figure 6-1 and

Figure 6-2.
To perform Standard Mode Semi Auto Wedge Bonding:
1 Ensure that the bonding head is in the Reset position.
2 Position the workholder so that the bonding pad is under the wedge.
Ensure that the wire clamp is closed.
3 Press and hold the Semi Auto Pushbutton of the Multi Mouse. The
bonding head descends to the first Search height (set by the SEARCH
parameter) and stops.
P/N 94500-000D-000-01 ver03/02

6-1
Operation
Operating Model 4523D
4 While still holding the Semi Auto Pushbutton, move the Multi
Mouse to position the first bonding pad precisely under the wedge.
5 Release the Semi Auto Pushbutton. The bonding head descends to

the first bonding pad. The bonding force and ultrasonic energy (set by
the FORCE and POWER parameters respectively) are applied for the time
set by the TIME parameter. The first bond is performed and the wire
clamp opens.
The bonding head rises automatically to the Loop height (set by the
LOOP parameter). Before the bonding head reaches the Loop height,
the linear motor moves to the feed position, set by the TAIL parameter.
Note: Perform wedge bonding in the direction of the wire. If necessary,

rotate the device so that the first bond and the second bond pads are
aligned with the wire feed line.
6 Move the Multi Mouse to position the second bonding pad directly
under the wedge.
7 Press and hold the Semi Auto Pushbutton. The bonding head
drops to the second Search (set by the second Search Parameter)
height and stops. As the bonding head starts its descent, the wire
clamp closes momentarily to prevent the wire from feeding back into
the wedge feed hole (helping to create a stable loop).
8 While still pressing the Semi Auto Pushbutton, move the Multi
Mouse to position the second bonding pad precisely under the wedge.
Note: If you are using a stitch bond schedule repeat steps 5-7 to perform
the number of stitches required by the program.

the last bond pad. The last bonding force and ultrasonic energy (set
by the second FORCE and POWER parameters) are applied for the time
set in the second TIME parameter. After the bond is performed, the
wire clamp closes and rises (as set by the TEAR parameter), tearing
the wire.
The bonding head rises to the Reset position. The wire clamp drops
from the Tear position, feeding a wire tail through the wedge feed
hole to prepare for the next bond schedule.

6-2
Operation
Figure 6-1: Wedge Bonding Cycle in Semi Automatic Mode - 30°/45° Wire Feed
Figure 6-2: Wedge Bonding Cycle in Semi Automatic Mode - 90° Wire Feed
P/N 94500-000D-000-01 ver03/02

6-3
Operation
To perform Standard Mode Manual Z wedge bonding:
1 Press the MANUAL control button. The Green LED lights.
2 Press and hold the Manual Z Control Button of the Multi Mouse.
Lower the bonding head as close as you want to the bonding pad.
Move the Multi Mouse to maneuver the first bonding pad precisely
under the wedge.
3 Continue pressing the Manual Z Control Button to drop the

bonding head to the bonding pad and perform the bond as in the Semi
Auto mode.
4 Release the Manual Z Control Button slowly to raise the bonding

head to the Loop height.
under the capillary.
6 To perform the second bond, press and hold the Manual Z Control
Button of the Multi Mouse. Lower the bonding head as close as you
want to the bonding pad. Move the Multi Mouse to maneuver the
second bonding pad precisely under the wedge.

bonding head to the bonding pad and perform the bond.
8 Release the Manual Z Control Button to raise the bonding head to

the Reset position.

6-4
Operation
6.1.2 Off-Line Operations 4523D
6.1.2.1 Initial Parameters and Machine Setting
The following adjustments and parameters are recommended for selected

wires. Final bonding parameters should be optimized using microscopic
analysis and destructive tests.
Table 6-1: Recommended Machine Adjustments - 30°/45° Wire Feed
Parameter Setting
18 µm 25 µm 25 µm 25 x 125
Gold Gold Alum µm
Ribbon
Static bond force (gm) 7 - 10 15 15 15
Wire clamp gap (µm) 70 100 100 100
Wire clamp force (gm) 80 - 100 80 - 100 80 - 100 100 - 120
Workholder temperature 150 150 150
(#C)
Initial Bond Parameter
Settings
First POWER 0-1 1-2 1-2 2-4
First TIME 3* 5* 4 5*
First FORCE 0-1 1-2 1-2 4-5
First FORCE (gm) 12 - 14 25 - 30 25 - 30 60 - 80
LOOP 3 4 4 4
Second POWER 1-2 1.5 - 2.5 1.5 - 2.5 2.5 - 4.5
Second TIME 3* 5* 5 5*
Second FORCE 0-1 1-2 1-2 5
Second FORCE (gm) 14 - 16 25 - 30 25 - 30 60 - 80
TAIL 3 5 5 7
TEAR 4 5 5 5
P/N 94500-000D-000-01 ver03/02

6-5
Operation
Parameter Setting
Wires
Gold The smaller the wire diameter, the harder the wire
should be. The recommended elongation is:
0.5 - 2% for18 µm wire
6 - 8% for 76 µm wire.
Aluminum 1% Silicon wire with elongation of 1 - 3%.
* Operate the bonder in Long time mode.
Table 6-2: Recommended Machine Adjustments - 90° Wire Feed Deep Access
Parameter Setting
18 µm 25 µm 25 µm 25 x 125
Gold Gold Alum µm
Ribbon
(#C)
Settings
First POWER 0-1 1-2 1-2 2-4
First FORCE 0-1 1-2 1-2 4-5
First FORCE (gm) 15 - 20 25 - 30 25 - 30 60 - 80
LOOP 3 4 4 5
Second POWER 0-1 1-2 1-2 2-4
Second FORCE 0-1 1-2 1-2 4-5
Second FORCE (gm) 15 - 20 25 - 30 25 - 30 60 - 80

6-6
Operation
Parameter Setting
TAIL 3 5 5 3**
TEAR 4 5 5 6
Wires

** Operate the bonder in Long Tail Length mode.
P/N 94500-000D-000-01 ver03/02

6-7
Operation
6.1.2.2 Bond Strength Optimization
Bond strength depends on the following main parameters:
!" Metalization - the bondability and the adhesion of the die and the
substrate metals
!" Wire type, tensile strength and elongation
!" Wedge type
!" Bonding parameter settings
!" Workholder temperature (for gold wire)
Using a bond shear tester, perform a series of tests such as wire loop pull
testing and microscopic analysis of the squashed wire dimensions. Be
aware that loop height and the distance from the first bond to the second
bond affect the results of pull test measurements.
Figure 6-3 shows typical bonds and loops performed by Model 4523D.
Figure 6-3: Typical Bonds Performed by Model 4523

6-8
Operation
6.2 Operation - Model 4523AD

procedures for the K&S Model 4523AD Auto Stepback Wedge Bonder.
The 4523AD can operate in the following bonding modes:
!" Standard Mode

!" Table Tear Mode
!" Lange Coupler Mode
6.2.1 Standard Mode Wedge Bonding

The 4523AD performs standard mode wedge bonding using Semi Auto,
Manual Z operation, or automatic bonding.
To perform Standard Mode Semi Auto wedge bonding:
1 Ensure that the bonding head is in the Reset position and that the
MODE is set to STANDARD.
Ensure that the wire clamp are closed.
bonding head descends to the first Search height (set by the Search

the first bonding pad. The first bonding force and ultrasonic energy
(set by the FORCE and POWER parameters respectively) are applied for
the time set by the TIME parameter. The first bond is performed and
the wire clamp opens.
The bonding head rises automatically to the Kink height position,
and travels in a reverse motion to form the Loop shape. The bonding
head then automatically performs loop height and Stepback to the
second bond position.
Note: Perform wedge bonding in the direction of the wire. If necessary,

rotate the device so that the first bond and the second bond pads are
aligned with the wire feed line.
6 Press and hold the Semi Auto Pushbutton. The bonding head drops
to the second Search height and stops. As the bonding head starts its
descent, the wire clamp closes momentarily to prevent the wire from
feeding back into the wedge feed hole (helping to create a stable loop).
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6-9
Operation
Operation - Model 4523AD
Mouse to position the second bonding pad precisely under the wedge
bonding head to the bonding pad and perform the bond.

the second bond site. The second bonding force and ultrasonic energy
(set by the FORCE and POWER parameters of the second bond schedule)
are applied for the time set in the second TIME parameter. After the
bond is performed, the wire clamp closes and rises (as set by the TEAR
parameter), tearing the wire.
The bonding head rises to the Reset position. The wire clamp drops
from the Tear position, feeding a wire tail through the wedge feed
hole to prepare for the next bond schedule.
The table moves backwards returning the bonding head to the first
bond position.

6-10
Operation
Figure 6-4: Wedge Bonding Cycle in Semi Automatic Mode - 30°/45° Wire Feed
Figure 6-5: Wedge Bonding Cycle in Semi Automatic Mode - 90° Wire Feed
P/N 94500-000D-000-01 ver03/02

6-11
Operation
To perform Standard Mode Manual Z wedge bonding:
1 Press the MANUAL key on the Keypad. The green LED lights.
2 Press and hold the Manual Z Control Button of the Multi Mouse.
Lower the bonding head as close as you want to the bonding pad.
Move the Multi Mouse to maneuver the first bonding pad precisely
under the wedge.

Auto mode. The bonding head rises automatically to the Kink height,
and then travels in a reverse motion to the Loop height.

under the wedge.
6 To perform the second bond, repeat steps 2-3.
7 Release the Manual Z Control Button to raise the bonding head to

the Reset position.
To perform Standard Mode Automatic Wedge Bonding:
1 Ensure that the bonding head is in the Reset position, that the green
LED next to the MANUAL control button is Off and that the AUTO
setting in the Modes Screen is set to On.
Ensure that the wire clamp is closed.
bonding head descends to the first Search height (set by the SEARCH
5 Release the Semi Auto Pushbutton on the Multi Mouse. The bonding
head performs the first bond, the loop and the second bond, then rises
to the Reset height and returns to the position of the first bond.
Note: If any additional two-wire bonds are defined, instead of returning

to the first bond schedule, the cursor will move to the first bond of the
next wire. To perform a stitch bond schedule, repeat steps 2-5.

6-12
Operation
6.2.2 Lange Coupler Mode Wedge Bonding

(Graphic representations of the cycle appear in Figure 6-6 and Figure 6-7).
Lange couplers may be present in some high frequency microwave

amplifiers. A typical Lange coupler requires a series of extremely short
and low wire loops connecting thin film leads. Regular wedge bonding
cannot achieve loop heights that are low enough. Therefore, the 4523AD
has a special Lange coupler bonding capability. In Lange Coupler mode,
bonding may be performed semi-automatically as in regular wedge
bonding.
Operating procedures are similar to the Standard mode. In Lange Coupler

mode, after performing the first bond, the bonding head rises to Loop
height and performs the Stepback (without performing the Kink).
After performing the second bond, the table moves automatically

backwards to perform the required wire bending, creating a very low loop.
Note: To achieve higher resolution in Lange Coupler mode, the maximum

travel range of the Stepback is reduced from 4.0mm (0.16") to 0.5mm
(0.02").
6.2.3 Table Tear Mode Wedge Bonding

(A graphic representation of the cycle appears in Figure 6-8).
In the Table Tear mode, wire termination is achieved by motorized table

motion. The Table Tear mode is available for all the operation methods
(Manual Z, Semi Auto, and Automatic).
Operation steps are similar to standard wedge bonding (see section 6.2.1).
After the second bond, the bonding head automatically rises to Second Z
height (set by RV3) and the table moves forward to create the tail. Then,
the table moves automatically forward to perform the Tear operation and
returns to the Reset position.
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6-13
Operation
Figure 6-6: Wedge Bonding Cycle in Lange Coupler Mode - 30#/45# Wire Feed
Figure 6-7: Wedge Bonding Cycle in Lange Coupler Mode - 90# Wire Feed

6-14
Operation
Figure 6-8: Wedge Bonding Cycle in Table Tear Mode - 30#/45# Wire Feed
P/N 94500-000D-000-01 ver03/02

6-15
Operation
6.2.4 Off-Line Operations 4523AD

Parameter Setting
18 µm 25 µm 25 µm 25 x 125
Gold Gold Alum µm
Ribbon
(#C)
Settings
First POWER 0-1 1-2 1-2 2-4
First FORCE 0-1 1-2 1-2 4-5
First FORCE (gm) 12 - 14 25 - 30 25 - 30 60 - 80
LOOP 3 4 4 4
Second POWER 1-2 1.5 - 2.5 1.5 - 2.5 2.5 - 4.5
Second FORCE 0-1 1-2 1-2 5
Second FORCE (gm) 14 - 16 25 - 30 25 - 30 60 - 80
TAIL 3 5 5 7
TEAR 4 5 5 5
STEP BACK 1-2 2-3 2-3 4-6
REVERSE 2-3 3 3 3

6-16
Operation
Parameter Setting
KINK HEIGHT 2 2 2 3
Y SPEED 2 2 2 2
Wires
Parameter Setting
18 µm 25 µm 25 µm 25 x 125
Gold Gold Alum µm
Ribbon
(#C)
Settings
First POWER 0-1 1-2 1-2 2-4
First FORCE 0-1 1-2 1-2 4-5
First FORCE (gm) 15 - 20 25 - 30 25 - 30 60 - 80
LOOP 3 4 4 5
Second POWER 0-1 1-2 1-2 2-4
Second FORCE 0-1 1-2 1-2 4-5
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6-17
Operation
Parameter Setting
Second FORCE (gm) 15 - 20 25 - 30 25 - 30 60 - 80
TAIL 3 5 5 3**
TEAR 4 5 5 6
STEP BACK 1-2 1.5 - 2.5 1.5 - 2.5 2-3
REVERSE 2-3 2-3 2-3 3-4
KINK HEIGHT 2 2 2 2-3
Y SPEED 0 2 2 3
Wires

** Operate the bonder in Long Tail Length mode.

6-18
Operation
6.2.4.2 Bond Strength Optimization
substrate metals
!" Wedge type
!" Workholder temperature (for gold wire)
Using a pull tester, perform a series of tests such as wire loop pull testing
and microscopic analysis of the squashed wire dimensions. Be aware that
loop height and the distance from the first bond to the second bond affect
the results of pull test measurements.
Figure 6-9 shows typical bonds and loops performed by Model 4523AD.
Figure 6-9: Typical Bonds Performed by Model 4523AD
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6-19
Operation
6.3 Operating Model 4524D

procedures for the K&S Model 4524D Multi-Process Ball Bonder.
6.3.1 Creating a Ball (manually)

After loading the wire and setting the bonding parameters, but before
performing first bond, you must create a ball.
To create a ball:
1 Confirm that the N.E.F.O. unit is On and set the BALL parameter to
the recommended setting (see Table 6-5).
2 Press the CLAMP control button to open the wire clamp. The green
LED lights.
3 Pull some wire from the capillary tip and bend the wire upwards.
4 Press the CLAMP control button again to close the wire clamp. The
LED turns off.
5 Push and hold the N.E.F.O. solenoid, moving the wand to a position
under the wire.
6 Press the MANUAL SPARK control button.
7 Verify that a spark was generated and a ball created (in case a ball
was not created, repeat steps 1-6).
The 4524D can operate in the following bonding modes:
!" Standard mode ball bonding

!" Ball bumping mode
!" Single Point TAB mode

6-20
Operation
6.3.2 Standard Mode Ball Bonding

The 4524D performs standard mode ball bonding using Semi Auto or
Manual Z operation.
Note: A graphic representation of the cycle appears in Figure 6-10.
To perform Standard Mode Semi Auto bonding:
Mode is set to STANDARD.
2 Position the workholder so that the bonding pad is under the

capillary. Ensure that the ball is ready and that the drag and wire
clamps are closed.
3 Press and hold the Semi Auto Pushbutton. The wire clamp opens
and the kicker pulls out wire slack from the wire spool. The bonding
head descends to the first Search height and stops. The drag clamp
pulls the wire so that the ball is seated against the capillary tip.
Mouse to position the first bonding pad precisely under the capillary.

(set by the FORCE and POWER parameters) are applied for the time set
by the TIME parameter. The first bond is performed, the drag clamp
opens and the kicker is released.
After completing the first bond, the bonding head automatically rises
to the Loop height (set by the LOOP parameter) and stops.
to the second Search height and stops.
Mouse to position the second bonding pad precisely under the
capillary.
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6-21
Operation

the second bond pad. The second bond force and ultrasonic energy
(set by the second bond schedule FORCE and POWER parameters
respectively) are applied for the time set by the second bond schedule
Time parameter.
The bonding head rises automatically to the Reset position. The wire
clamp closes, after which the wire is snapped, creating a tail for a
new ball.
The bonding head remains in the Reset position. The N.E.F.O. wand
approaches the tail and fires. A new ball is created for the next
bonding cycle.
Note: You can create a multi-wire bond schedule by pressing the ADD
key. This procedure is fully described in the Programming section of
Chapter 4.
Figure 6-10: Ball Bonding Cycle in Semi Automatic Setting (Model 4524D)

6-22
Operation
To perform Standard Mode Manual Z bonding:
2 Use the Manual Z Control Button of the Multi Mouse to lower the
bonding head as close as you want to the bonding pad. Move the
Multi Mouse to position the first bonding pad precisely under the
capillary.

Auto mode.

6 To perform the second bond, repeat steps 2 and 3.
7 The bonding head rises to the Reset position automatically. The

N.E.F.O. then fires to create a ball for the next bonding cycle. Release
the Manual Z Control Button to start the next cycle.
6.3.3 Ball Bumping Mode Ball Bonding

The 4524D performs ball bumping mode ball bonding using Semi Auto or
Manual Z operation.
To perform Ball Bumping Mode Semi Auto ball bonding:
Mode is set to BALL BUMPING.
lowers to the first Search height.
Mouse to position the bonding pad precisely under the capillary.
4 Release the Semi Auto Pushbutton. The bonding head drops to the
bonding pad to perform the bond.
5 The bonding head rises from the bonding pad, forming a tail. The
wire clamp closes to tear the wire. The bonding head then rises to the
Reset position. The N.E.F.O. fires to create a ball for the next bonding
cycle.
On the Display the bond schedule moves to the next bond number (if
defined).
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6-23
Operation
Note: You can create a multiple ball bumping schedule by pressing the
ADD key. This procedure is fully described in the Programming section of
Chapter 4.
To perform Ball Bumping Mode manual Z bonding:
capillary.

Auto mode.

N.E.F.O. then fires to create a ball for the next cycle. Release the
Manual Z Control Button to start the next cycle.
Figure 6-11: Ball Bonding Cycle in Semi Automatic Operation (Model 4524D)

6-24
Operation
6.3.4 Single Point TAB Mode Ball Bonding

The Single Point TAB bond cycle is used to bond single points. The 4524D
performs Single Point TAB mode ball bonding using Semi Auto or
Manual Z operation.
To perform Single Point TAB Mode Semi Auto bonding:
Mode is set to S. POINT TAB.
bonding head lowers to the Search height.
Mouse to position the lead precisely under the tab tool.
bonding pad to perform the bond. The bonding head rises from the
bonding pad to the Reset position. On the Display, the bond schedule
moves to the next number (if defined). If there is more than one bond
to be made, the bonding head rises to the Loop height.
5 Repeat steps 2 - 4 until reaching the last bond. After making the last
bond, the bonding head rises to the Reset position.
to the first Search height.
7 Press and release the Stitch Pushbutton to return to the Reset

position.
Note: You can create a multiple S.P.T schedule by pressing the ADD key.
This procedure is fully described in the Programming section of
Chapter 4.
P/N 94500-000D-000-01 ver03/02

6-25
Operation
Figure 6-12 Single Point TAB Cycle in Semi-Automatic Mode
To perform Single Point TAB Mode Manual Z bonding:

capillary.

Auto mode.
4 The bonding head rises to the Reset position automatically. Release

Note: If any additional bonds are defined, the bonding head will not
return to the Reset position after performing the bond. In this case, use
the Manual Z Control Button to raise the bonding head to a position as
close as required to the bonding pad, then move the Multi Mouse to
position the next bonding pad and repeat steps 3-4 above.

6-26
Operation
6.3.5 Off-Line Operations 4524D

Table 6-5: Recommended Machine Adjustments
Parameter Setting
25 µm 30 µm 50 µm
Gold Gold Gold
Wire clamp gap (µm) 80 100 120
Wire clamp force (gm) 100 100 120
Drag clamp gap (µm) 250 350 500
Drag clamp force (gm) 6 10 10
N.E.F.O. Wand distance from
capillary at Reset (µm) 500 570 625
N.E.F.O. ball size 1.5 - 2.5 2.5 - 4.5 5-7
Tail length 4-5 5-6 6-7
Initial Bond Parameter Settings
1st POWER 1-2 1.5 - 2.5 2-3
1st TIME 5 4 - 10 5*
1st FORCE 1-2 2-3 4-5
1st FORCE (gm) 40 60 80
LOOP 4 5 7
Second POWER 2-3 3-4 6–8
Second TIME 5-7 10 3 - 5*
Second FORCE 4-6 7 8 - 10
2nd FORCE (gm) 80 100 120
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6-27
Operation
Parameter Setting
Wires Loop control is better if the elongation is

higher.
Ball Bonding Recommended wire is 99.99% gold with

2 - 6% elongation.
Ball Bumping Recommended wire is 98% gold,

2% palladium with 2 - 4% elongation.
Each bonder is factory-set for bonding 25 µm (0.001") gold wire,

2-4% elongation.
For wire diameter 38 µm or larger, use clamps with ceramic jaws.
6.3.6 Missing Ball Detector

The missing ball detector is integrated within the N.E.F.O. system. If the
N.E.F.O. system fails to create a ball, the missing ball detector stops
bonder operation.
!" The SHORT indicator turns on if a small gap exists between the tail
and the wand.
!" The OPEN indicator turns on if a large gap exists between the tail and
the wand.
To correct a missing ball condition
1 Readjust the tail length or the wand gap.
2 Press the CLAMP control button. The LED turns on and the clamp
opens.
3 Pull more wire through the capillary and bend the wire below the
capillary tip.
4 Press the CLAMP control button again. The LED turns off and the
clamp closes. The bonding head moves to the second Search height
and is ready to perform the next bond.

6-28
Operation
5 Perform the next bond. The bonder will then create a ball for the next
cycle.
Note: If you prefer not to use the automatic missing ball detector
mechanism, you can create a ball manually by:
1 Turning off the N.E.F.O control button
2 Resetting the bonder
3 Turning on the N.E.F.O
4 Creating a manual spark, see section 6.3.1.
6.3.7 Capillaries and Wires

For best results, use MicroSwiss capillaries. For a list of recommended
capillaries, see section 5.1.2.
Always use the setup gauge when installing the capillary. After installing
a new capillary, reset the bonder.
Be aware that the hole of the capillary applies some friction on the wire
during loop creation. If the hole diameter is too small, wire friction results
in loop height variations which are difficult to control. A soft wire
produces higher loops than a hard wire, which is important when making
long loops.
6.3.8 Factors Influencing Loop Height (Standard Cycle)

The factors influencing the loop height of a wire bonded on the 4524D at a
specific distance with a specific height difference are:
LOOP For longer distances between the wire bonds, a higher

Parameter parameter setting is required.
Setting
Wire The higher the tension on the wire as it is pulled out of

Tension the spool, the lower the loop will be. Wire tension is
controlled by the fixed tensioner glass plate.
Kicker The kicker may be used to form loops in long wires by

Stroke pulling a greater length of wire from the spool and
neutralizing the fixed tensioner during wire
manipulation.
Wire A wire with a low elongation coefficient (hard wire)

Elongation produces lower loops than a wire with a high elongation
Coefficient coefficient (soft wire). Typically, wires with elongation
coefficients of 2 - 4% are used for ball bonding.
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6-29
Operation
6.3.9 Bond Strength Optimization

substrate metals
!" Capillary type
!" Ball size
!" Workholder temperature
Figure 6-13 shows typical bonds and loops performed by Model 4524D.
Figure 6-13: Typical Bonds Performed by Model 4524D

6-30
Operation
6.4 Operating Model 4524AD

procedures of the K&S Model 4524AD Multi Process Auto Stepback Ball
Bonder.
6.4.1 Creating a Ball (manually)

After loading the wire and setting the bonding parameters, but before
performing bonding, you must create a ball.
To create a ball:
1 Power on the N.E.F.O. unit and set the BALL parameter to the
recommended setting (see Table 6-6).
2 Press the CLAMP control button to open the wire clamp. The green
LED lights.
3 Pull some wire from the capillary tip and bend the wire upwards.
4 Press the CLAMP control button again to close the wire clamp. The
LED turns off.
5 Push and hold the N.E.F.O. solenoid, moving the wand to a position
under the wire.
6 Press the MANUAL SPARK control button.
7 Verify that a spark was generated and a ball created (in case a ball
was not created, repeat steps 1-6).
The 4524AD can operate in the following bonding modes:
!" Standard Mode

!" Ball bumping Mode
!" Single Point TAB Mode
P/N 94500-000D-000-01 ver03/02

6-31
Operation
Operating Model 4524AD
6.4.2 Standard Mode Ball Bonding

The 4524AD performs standard mode ball bonding using Manual Z , Semi
Auto or automatic operation.
To perform Standard Mode Semi Auto ball bonding:
Mode is set to STANDARD.

capillary. Ensure that the ball is ready and that the drag and wire
clamps are closed.

(set by the FORCE and POWER parameters) are applied for the time set
by the TIME parameter. The first bond is performed, the drag clamp
opens and the kicker is released.
The bonding head rises automatically to the Kink height position and
travels in a reverse motion to form the Loop shape. The bonding head
then automatically performs Loop height and the table steps forward
to the second bond position.
Mouse to position the second bonding pad precisely under the
capillary.

6-32
Operation

the second bond pad. The second bond force and ultrasonic energy
(set by the second bond schedule FORCE and POWER parameters
respectively) are applied for the time set by the second bond schedule
TIME parameter.
The bonding head rises automatically to the Reset position. The wire
clamp closes, after which the wire is snapped, creating a tail for a
new ball.
The bonding head remains in the Reset position. The N.E.F.O. wand
approaches the tail and fires. A new ball is created for the next
bonding cycle.
Note: You can create a two-wire bond schedule by pressing the ADD
key. This procedure is fully described in the Programming section of
Chapter 4.
Figure 6-14 Ball Bonding Cycle in Semi Automatic Setting (Model 4524AD)
P/N 94500-000D-000-01 ver03/02

6-33
Operation
To perform Standard Mode Manual Z ball bonding:
Multi Mouse to maneuver the first bonding pad precisely under the
capillary.

Auto mode.

6 To perform the second bond, repeat steps 2 and 3.

N.E.F.O. then fires to create a ball for the next bonding cycle. Release
To perform Standard Mode Automatic Ball Bonding:
LED next to the MANUAL control button is Off and that the Auto

capillary.
5 Release the Semi Auto Pushbutton on the Multi Mouse. The

bonding head performs the first bond, the loop and the second bond,
then rises to the Reset height and returns to the position of the first
bond.
Note: If any additional two-wire bonds are defined, instead of returning

to the first bond position, the bonding head goes to the Reset height.
From there it must be moved manually using the Multi Mouse to the next
bond position.

6-34
Operation
6.4.3 Ball Bumping Mode Ball Bonding

The 4524AD performs standard mode ball bumping using Manual Z, Semi
Auto or Automatic operation.
To perform Ball Bumping Mode Semi Auto ball bonding:
MODE is set to BALL BUMPING.
The bonding head rises from the bonding pad, forming a tail. The
Reset position. The N.E.F.O. fires to create a ball for the next
bonding cycle. The table moves forward to the next bond position (if
defined this is set by the Step parameter). On the Display the bond
schedule moves to the next bond number (if defined).
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6-35
Operation
Figure 6-15 Ball Bumping Cycle in Semi Automatic Setting (Model 4524D, 4524AD)
To perform Ball Bumping Mode Manual Z ball bumping:
capillary.

Auto mode.

N.E.F.O. then fires to create a ball for the next bonding cycle. The
table moves forward to the next bond position (if defined this is set by
the STEP parameter). On the Display, the bond schedule moves to the
next number (if defined).
5 Release the Manual Z Control Button to start the next cycle.
Note: If there is more than one bond schedule defined, repeat steps 1-4.

6-36
Operation
To perform Ball Bumping Mode Automatic Ball Bonding:
LED next to the MANUAL control button is Off and that the Auto

capillary.
The bonding head rises from the bonding pad, forming a tail. The
Reset position. the N.E.F.O. fires to create a ball for the next bonding
cycle. The table moves forward to the next bond position (if defined
this is set by the Step parameter). On the Display the bond schedule
moves to the next bond number (if defined). The bonding head then
drops to the bonding pad again and performs the next bond in the
same way.
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6-37
Operation
6.4.4 Single Point TAB Mode

The Single Point TABS cycle is used to perform tape automated bonding.
The 4524AD performs S.P.T mode ball bumping using Manual Z, Semi
Auto or Automatic operation.
To perform Single Point TAB Mode Semi Auto bonding:
Mode is set to S. POINT TAB.
bonding head lowers to the Search height.
Mouse to position the lead precisely under the tab tool.
bonding pad to perform the first bond. The bonding head rises from
the bonding pad to the Reset position. On the Display, the bond
schedule moves to the next number (if defined). If there is more than
one bond to be made, the bonding head rises to the Loop height. The
table moves forward to a position set by the Step parameter.
5 Repeat steps 2 - 4 until reaching the last bond. After making the last
bond, the bonding head rises to the Reset position.

6-38
Operation
Figure 6-16 Single Point TAB Cycle in Semi-Automatic Mode
To perform Single Point TAB Mode Manual Z ball bumping:
capillary.

Auto mode.

N.E.F.O. then fires to create a ball for the next bonding cycle. The
table moves forward to the next bond position (if defined this is set by
the STEP parameter). On the Display, the bond schedule moves to the
next number (if defined).
After performing the last bond, the bonding head rises to the Reset
position.
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6-39
Operation
To perform Automatic S.P.T Bonding:
1 Ensure that the bonding head is in the Reset position, that the LED
next to the MANUAL control button is off and that the AUTO setting in
the Modes screen is On.
2 Position the workholder so that the bonding pad is under the tab tool.
3 Press the Semi Auto Pushbutton on the Multi Mouse. The bonding
head performs the first bond, then rises to the Reset height and
returns to the position of the first bond. If more than one bond is
defined, the bonding head rises to Loop height and the table steps
forward (as defined by the STEP parameter). The bonding head drops
to the next bond position and performs the bond. After the last bond
is completed the bonding head returns to the Reset height.
6.4.5 Off-Line Operations 4524AD

Parameter Setting
25 µm 30 µm 50 µm
Gold Gold Gold
Wire clamp gap (µm) 80 100 120
Wire clamp force (gm) 100 100 120
Drag clamp gap (µm) 250 350 500
Drag clamp force (gm) 6 10 10
N.E.F.O. Wand distance from
capillary at Reset (µm) 500 570 623
N.E.F.O. ball size 1.5 - 2.5 2.5 - 4.5 5-7
Tail length 4-5 5-6 6-7
Initial Bond Parameter Settings
1st POWER 1-2 1.5 - 2.5 2-3
1st TIME 5 4 - 10 5*
1st FORCE 1-2 2-3 4-5
1st FORCE (gm) 40 60 80
LOOP 4 5 7

6-40
Operation
Parameter Setting
Second POWER 2-3 3-4 6–8
Second TIME 5-7 10 3 - 5*
Second FORCE 4-6 7 8 - 10
2nd FORCE (gm) 80 100 120
STEP 2-3 2-3 4-6
REVERSE 3 3 3
KINK 2 2 3
Y SPEED 2 2 2
Wires Loop control is better if the elongation is

higher.
Ball Bonding Recommended wire is 99.99% gold with

2 - 6% elongation.
Ball Bumping Recommended wire is 98% gold,

2% palladium with 2 - 4% elongation.
Your bonder was factory-set for bonding 25 µm (0.001") gold wire,

2-4% elongation.
For wire diameter 38 µm or larger, use clamps with ceramic jaws.
P/N 94500-000D-000-01 ver03/02

6-41
Operation
6.4.6 Missing Ball Detector

The missing ball detector is integrated within the N.E.F.O. system. If the
N.E.F.O. system fails to create a ball, the missing ball detector stops
bonder operation.
!" The SHORT indicator turns on if a small gap exists between the tail
and the wand.
!" The OPEN indicator turns on if a large gap exists between the tail and
the wand.
To correct a missing ball condition:
1 Readjust the tail length or the wand gap.
2 Press the CLAMP control button. The LED turns on and the clamp
opens.
3 Pull more wire through the capillary and bend the wire below the
capillary tip.
4 Press the CLAMP control button again. The LED turns off and the
clamp closes. The bonding head moves to the second Search height
and is ready to perform the next bond.
5 Perform the next bond. The bonder will then create a ball for the next
cycle.
Note: If you prefer not to use the automatic missing ball detector
mechanism, you can create a ball manually by turning off the N.E.F.O
control button, resetting the bonder, turning on the N.E.F.O, and then
creating a manual spark (see section 6.3.1).

6-42
Operation
6.4.7 Capillaries and Wires

For best results, use MicroSwiss capillaries. For a list of recommended
capillaries, see section 5.1.2.
Always use the setup gauge when installing the capillary. After installing
a new capillary, reset the bonder.
Be aware that the hole of the capillary applies some friction on the wire
during loop creation. If the hole diameter is too small, wire friction results
in loop height variations which are difficult to control. A soft wire
produces higher loops than a hard wire, which is important when making
long loops.
6.4.8 Factors Influencing Loop Height (Standard Cycle)

The factors influencing the loop height of a wire bonded on the 4524AD at
a specific distance with a specific height difference are:
LOOP For longer distances between the wire bonds, a higher

Parameter parameter setting is required.
Setting
Wire The higher the tension on the wire as it is pulled out of

Tension the spool, the lower the loop will be. Wire tension is
controlled by the fixed tensioner glass plate.
Kicker The kicker may be used to form loops in long wires by

Stroke pulling a greater length of wire from the spool and
neutralizing the fixed tensioner during wire
manipulation.
Wire A wire with a low elongation coefficient (hard wire)

Elongation produces lower loops than a wire with a high elongation
Coefficient coefficient (soft wire). Typically, wires with elongation
coefficients of 2 - 4% are used for ball bonding.
P/N 94500-000D-000-01 ver03/02

6-43
Operation
6.4.9 Bond Strength Optimization

substrate metals
!" Capillary type
!" Ball size
!" Workholder temperature
Figure 6-17 shows typical bonds and loops performed by Model 4524AD.
Figure 6-17: Typical Bonds Performed by Model 4524D

6-44
Maintenance Overview
7. MAINTENANCE OVERVIEW
The K&S 4500 Digital Series Manual Wire Bonder is a rugged, durable
machine, designed to operate trouble-free for many years. However, like
any machine, the bonder requires servicing, adjustments, and occasional
repairs. Chapters 8-15 provide necessary information to the technician for
making repairs and adjustments.
It is assumed that the technician knows how to operate the K&S 4500
Digital Series Manual Wire Bonder.
7.1 General Guidelines

When performing maintenance on the K&S 4500 Digital Series Manual
Wire Bonder, adhere to the following general guidelines:
1 Always use the proper tools and equipment, as instructed in the

procedures.
2 Never use other than K&S approved spare parts (a complete parts list
appears in Chapter 15).
3 If a problem persists after you perform a procedure provided by this

manual, refer the problem to your K&S representative. Do not
attempt repairs beyond the scope of this manual.
4 Unless otherwise instructed, do not apply oil on any of the parts of the
bonder. Oil attracts dust that can interfere with the proper
functioning of the parts.
5 Except for adjustments that require bonder operation, perform all

maintenance work with the bonder's power off.
7.2 Machine Adjustments Checklist

Because of the interdependence of the electrical and mechanical
assemblies for proper bonder operation, the following adjustments appear
in the order of their priority. If you perform a specific adjustment, then
you must perform the adjustments that follow it in the list. For example, if
you perform 18 Vp-p adjustment, then you must also perform Reset
Height Adjustment, Verticality Adjustment, and so on down the list.
P/N 94500-000D-000-01 ver03/02

7-1
Maintenance Overview
Machine Adjustments Checklist
7.2.1 4524D, 4524AD
1 Reset Height (LVDT) Adjustment (section 9.4)
2 Verticality (Transducer) Adjustment (section 9.5)
3 Force Actuator Adjustment (section 9.3.4)
4 Static Bonding Force Adjustment (section 9.2.3)
5 Wire Path from Kicker to Capillary Alignment (section 5.4)
6 Ultrasonic Free Running Frequency Adjustment (section 8.3.2.1)
7 Ultrasonic Power Adjustment (section 8.3.2.2)
8 Clamp Solenoid Adjustments (section 9.6.2)
9 Drag Clamp Adjustments (sections 9.8.1 and 9.8.2)
10 Kicker Stroke Adjustment (section 9.10.4)
11 N.E.F.O. Wand and Ball Size Adjustment (section 8.2)
12 Bonding Parameters Setup (sections 6.3.5.1 and 6.4.5.1)
7.2.2 4523D, 4523AD
1 Reset Height (LVDT) Adjustment (section 9.4)
2 Transducer Insertion Depth - should be performed according to the

wedge type and together with the Clamp Position Adjustment
(section 9.5)
3 Verticality (Transducer) Adjustment (section 9.5)
4 Force Actuator Adjustment (section 9.3.4)
5 Static Bonding Force Adjustment (section 9.2.3)
6 Clamp Gap and Force Adjustment (section 9.6.2)
7 Clamp Lateral Position Adjustment (section 9.6.3)
8 Ultrasonic Free Running Frequency Adjustment (section 8.3.2.1)
9 Ultrasonic Power Adjustment (section 8.3.2.2)
10 Bonding Parameters Setup (sections 6.1.2.1 and 6.2.4.1)

7-2
Index
16. INDEX
Base, 3-6
1 Cleaning, 12-4
Base assembly, 9-25
18 Vp-p
Manipulator assembly, 9-25
Adjustment, 12-6
Multi Mouse, 9-26
Parts list, 15-12
9 Bond Parameters, 4-8
90° Wire Feed Bond Schedule, 4-7
Clamp assembly, 15-20 Bond strength
Bonding operation, 6-8, 6-19, 6-30, 6-44
A Bonding Area, 1-3
Bonding force adjustments and setup, 5-7
Accessories Bonding head, 3-5
General, 14-7 Bearings adjustment, 9-7
Optical, 14-1 Free motion, 9-6
Adjustment Left side view, 9-4
18 Vp-p, 12-6 Maintenance, 9-6
Bonding head bearings, 9-7 Model 4523AD, 15-8
Clamp lateral position, 9-19 Model 4523D, 15-8
Clamp solenoid gap, 9-18 Model 4524AD, 15-7
Dashpot, 9-7 Model 4524D, 15-7
Force actuator, 9-10 Movement check, 12-4
Kicker stroke, 9-25 Parts list, 15-7, 15-8
Logic board controls, 8-14 Bonding operation
LVDT, 9-11 Ball missing, 6-28
Spotlight, 5-20 Bond strength, 6-8, 6-19, 6-30, 6-44
Static bonding force, 9-7 Capillaries and wires, 6-29, 6-43
Temperature controller zero offset, 12-7 Loop height, 6-29, 6-43
Ultrasonic generator, 12-6 Parameters, 6-5, 6-16, 6-27, 6-40
Ultrasonic power, 8-26 Settings, 6-5, 6-16, 6-27, 6-40
Wand gap, 9-22 Troubleshooting, 13-6
Wand overtravel, 9-23
Wand reset position, 9-22 C
Wire tension, 9-20
Z motor speed, 8-28 Cam following bearing
Air dashpot Checking, 12-5
Left side view, 9-3 Capillaries and wires
Air-Damped Bonding, 1-3 Bonding operation, 6-29, 6-43
Area Light, 3-5 Capillary installation
Auto cycle operation Model 4524AD, 5-4
Model 4523AD, 11-4 Model 4524D, 5-4
Model 4523D, 11-4 Changing Modes and Settings, 4-20
Model 4524AD, 11-4 Changing Parameter Values, 4-19
Model 4524D, 11-4 Clamp 90! Wire Feed Kit, 1-4
Clamp assembly
B 90° Wire Feed, 15-20
Parts list, 15-20
Ball bumping cycle Clamp lateral position
Model 4524D, 10-10 Adjustment, 9-19
Ball bumping mode ball bonding, 6-23, 6-35 Model 4523AD, 9-19
Model 4523D, 9-19
P/N 94500-000D-000-01 ver03/02

16-1
Index
Clamp lifter
Left side view, 9-4 D
Model 4523AD, 3-6, 9-4
Dashpot
Model 4523D, 3-6, 9-4
Adjustment, 9-7
Clamp solenoid, 9-15
Check, 12-4
Gap adjustment, 9-18
Replacement, 9-8
Replacement, 9-15
DC Motor
Clamp solenoid replacement
Left side view, 9-1
Model 4523AD Deep Access, 9-17
DC Servo/LVDT Closed Loop Control, 1-3
Model 4523D Deep Access, 9-17
Dedicated Parameters Keys, 4-19
Model 4523D Standard Access, 9-16
Deep access
Model 4524AD, 9-15
Clamp solenoid replacement, 9-17
Model 4524AD Standard Access, 9-16
Deep Access Kit, 1-4
Model 4524D, 9-15
Diagnostic codes, 11-2
Standard access, 9-16, 9-20
Diagnostic LEDs, 1-3, 11-1
Clamps, 14-8
Logic board, 8-14
Cleaning
Disassembly
Base, 12-4
Force actuator, 9-9
Contact pin, 12-2
Multi Mouse, 9-27
Drag clamp, 12-2
Y drive subassembly, 9-28
Kicker, 12-2
Display, 4-6
Manipulator, 12-4
Display contrast adjustment, 8-30
Motorized Y table, 12-4
Down
N.E.F.O. wand, 12-3
Right panel controls, 4-5
Screw, 12-2
Drag and electrode assembly
Solenoids, 12-7
Parts list, 15-13
Spool holder, 12-2
Drag clamp
Wire clamp, 12-2
Cleaning, 12-2
Cold workholders, 14-3
Drag clamp force adjustment
Connectors
Model 4524, 9-20
Electrical system, 8-6
Model 4524AD, 9-20
J1, 8-6
Drag clamp gap adjustment
J2, 8-6
Model 4524, 9-20
J3, 8-7
Model 4524AD, 9-20
J4, 8-7
Drag solenoid replacement
J5, 8-7
Model 4524AD, 9-21
Logic board, 8-12
Model 4524D, 9-21
Contact mechanism
Right side view, 9-5
Contact pin E
Cleaning, 12-2 Electrical requirements
Height control link, 9-5 Model 4523AD, 1-8
Control Pad and Digital LCD, 1-3 Model 4523D, 1-6
Control panels, 3-7 Model 4524AD, 1-12
Controller assembly, 8-24 Model 4524D, 1-10
Controller board Electrical system, 8-1
Jumper configuration, 8-24 Connectors, 8-6
Corrective action, 11-3 Fuse F1, 8-10
Creating Bond Schedules, 4-21 Fuses, 8-6, 8-7
Logic board, 8-8
Motherboard, 8-6
Power supply, 8-1

16-2
Index
Elongation coefficient J
Loop height, 6-29, 6-43
Entering a Password, 4-23 Jumper configuration
Entering an Authorization Level, 4-23 Controller board, 8-24
Logic board, 8-15
F
K
Features
Common, 1-3 Keypad, 3-8, 4-17
Optional, 1-4 Keypad Control Keys, 4-18
Fiber Optic Illumination, 1-4 Kicker
Fixed tensioner Cleaning, 12-2
Wire feed system, 9-24 Wire feed system, 9-24
Force actuator Kicker stroke
Adjustment, 9-10 Adjustment, 9-25
Assembly, 9-8 Loop height, 6-29, 6-43
Coil motion check, 12-3
Disassembly, 9-9 L
Left side view, 9-4 Lange coupler bonding cycle
Replacement, 9-10 Model 4523AD, 10-7
Test, 9-9 Lange Coupler Mode, 1-4
Force driver circuit Lange coupler mode wedge bonding, 6-13
Logic board, 8-11 LED I
Free motion Right panel controls, 4-5
Bonding head, 9-6 LED II
Free running frequency Right panel controls, 4-5
Adjustment, 8-26 Left control panel, 4-6
Front panel assembly On/Off, 4-6
Parts list, 15-2, 15-4 Left side view
Fuses Air dashpot, 9-3
Electrical system, 8-6, 8-7 Bonding head mechanism, 9-4
Clamp lifter, 9-4
G DC Motor, 9-1
General accessories, 14-7 Force actuator, 9-4
Main head assembly, 9-1
Stepper driver board, 9-1
H
Tool lifter, 9-3
Heater Levelling
Workholders connectors panel, 3-8 Transducer, 9-12, 9-13
Height Adjustable Rotary, 1-4 Linear Variable Differential Transformer. See
Height control cam LVDT
Right side view, 9-5 Logic board
Height control link Adjustment controls, 8-14
Contact pin, 9-5 Connectors, 8-12
LVDT, 9-6 Diagnostic LEDs, 8-14
Right side view, 9-5 Electrical system, 8-8
Height control link motion Force driver circuit, 8-11
Checking, 12-6 Fuse F1, 8-10
High-Q Transducer, 1-3 Jumper configuration, 8-15
Logic unit, 8-10
I Power supply, 8-10
Replacement, 8-25
Installation, 2-2
Sinewave generator, 8-10
Microscopes, 2-9
P/N 94500-000D-000-01 ver03/02

16-3
Index
Test points, 8-15 Model 4524AD, 10-13

Z motor circuit, 8-10 Model 4524D, 10-9
Logic unit Manual index workholders, 14-4
Logic board, 8-10 Manual Z Mode, 1-4
Loop height Microscope, 3-5
Bonding operation, 6-29, 6-43 Adjustment, 5-7
Dial setting, 6-29 Installation, 2-9
Elongation coefficient, 6-29, 6-43 Missing ball condition
Kicker stroke, 6-29, 6-43 Correcting, 6-28
Parameter setting, 6-43 Missing ball detector, 6-28, 6-42
Wire tension, 6-29, 6-43 Model 4523AD
Loop Parameters, 4-10 Auto cycle operation, 11-4
LVDT Bonding head, 15-8
Adjustment, 9-11 Clamp lateral position, 9-19
Height control link, 9-6 Clamp lifter, 3-6, 9-4
Main, 9-11 Clamp solenoid replacement, 9-17
Reset position, 9-11 Electrical requirements, 1-8
Lange coupler bonding cycle, 10-7
M Machine specifications, 1-7
Main head, 3-2
Machine adjustments
Maintenance, 7-2
Checklist, 7-1
Operation, 6-9
Machine specifications
Options, 1-8
Model 4523AD, 1-7
Physical dimensions, 1-8
Model 4523D, 1-5
Model 4524AD, 1-11
Screens, 4-13
Model 4524D, 1-9
Specifications, 1-7
Main head
Speed adjustment, 8-28
Model 4523AD, 3-2
Spool for Vertical Wire Feed, 3-3
Model 4523D, 3-2
Steppers drivers board, 8-16
Model 4524AD, 3-2
Table tear bonding cycle, 10-6
Model 4524D, 3-2
Wedge installation, 5-1
Parts list, 15-4
Weight, 1-9
Main head assembly
Wire, 1-7
Left side view, 9-1
Wire loading, 5-14, 5-18
Right side view, 9-5
Wire tension adjustment, 9-20
Maintenance
Z motor relay board, 8-16
Bonding head, 9-6
Model 4523D
Guidelines, 7-1
Auto cycle operation, 11-4
Manipulator, 9-27
Bonding head, 15-8
Model 4523AD, 7-2
Clamp lateral position, 9-19
Model 4523D, 7-2
Clamp lifter, 3-6, 9-4
Model 4524AD, 7-2
Clamp solenoid replacement, 9-16, 9-17
Model 4524D, 7-2
Description, 1-1
Motorized Y table, 9-27
Electrical requirements, 1-6
Preventive, 12-1
Machine specifications, 1-5
Manipulator, 3-7
Main head, 3-2
Base assembly, 9-25
Maintenance, 7-2
Cleaning, 12-4
Manual bonding cycle, 10-3
Maintenance, 9-27
Manual bonding cycle, 10-5
Parts list, 15-10
N.E.F.O., 1-4
Manual bonding cycle
Options, 1-6
Model 4523AD, 10-5
Physical dimensions, 1-6
Model 4523D, 10-3

16-4
Index
Right panel controls, 4-3 Model 4524D

Screens, 4-12 Auto cycle operation, 11-4
Semi/auto bonding cycle, 10-4 Ball bumping cycle, 10-10
Semi/auto bonding cycle, 10-2 Bonding head, 15-7
Specifications, 1-5 Capillary installation, 5-4
Speed adjustment, 8-28 Clamp solenoid replacement, 9-15
Spool for Vertical Wire Feed, 3-3 Deep Access Kit, 1-4
Steppers drivers board, 8-16 Drag clamp adjustment, 9-20
Wedge installation, 5-1 Drag clamp force adjustment, 9-20
Weight, 1-6 Drag clamp gap adjustment, 9-20
Wire, 1-5 Drag clamp replacement, 9-20
Wire loading, 5-14, 5-18 Drag solenoid adjustment, 9-20
Wire tension adjustment, 9-20 Drag solenoid replacement, 9-21
Z motor relay board, 8-16 Electrical requirements, 1-10
Model 4524AD Machine specifications, 1-9
Auto cycle operation, 11-4 Main head, 3-2
Bonding head, 15-7 Maintenance, 7-2
Capillary installation, 5-4 Manual bonding cycle, 10-9
Clamp solenoid replacement, 9-15, 9-16 N.E.F.O., 1-4, 3-6, 8-18
Deep Access Kit, 1-4 N.E.F.O. wand, 12-3
Drag clamp force adjustment, 9-20 Options, 1-10
Drag clamp gap adjustment, 9-20 Physical dimensions, 1-10
Drag clamp replacement, 9-20 Right panel controls, 4-4
Drag solenoid adjustment, 9-20 Screens (Ball Bumping Mode), 4-14
Drag solenoid replacement, 9-20, 9-21 Screens (S. Point Tab), 4-14
Electrical requirements, 1-12 Screens (Standard Mode), 4-13
Machine specifications, 1-11 Semi/auto bonding cycle, 10-8
Main head, 3-2 Single point TAB cycle, 10-11
Maintenance, 7-2 Specifications, 1-9
Manual bonding cycle, 10-13 Speed adjustment, 8-28
Motorized Y table, 3-7, 9-26, 9-28 Spool for Vertical Wire Feed, 3-3
N.E.F.O., 3-6, 8-18 Wand adjustment, 9-21
N.E.F.O. wand, 12-3 Wand replacement, 9-21
Operation, 6-31 Weight, 1-10
Operation, 6-20 Wire, 1-9
Options, 1-12 Wire loading, 5-12
Physical dimensions, 1-12 Model 4524D Description, 1-2
Right panel controls, 4-4 Motor
Screens (Ball Bumping Mode), 4-15 Workholders connectors panel, 3-8
Screens (S. Point Tab Mode), 4-16 Motorized heated workholders, 14-5
Screens (Standard Mode), 4-15 Motorized index workholders, 14-5
Semi/auto bonding cycle, 10-12 Motorized Y table
Specifications, 1-11 Cleaning, 12-4
Speed adjustment, 8-28 Maintenance, 9-27
Spool for Vertical Wire Feed, 3-3 Model 4523AD, 3-7, 9-26, 9-28
Wand adjustment, 9-21 Parts list, 15-10
Wand replacement, 9-21 Preload adjustment, 9-28
Weight, 1-12 Motorized Y Table, 1-3
Wire, 1-11 Multi Mouse, 1-3, 3-7, 4-2
Wire loading, 5-12 Base assembly, 9-26
Y drive subassembly, 9-28 Disassembly, 9-27
Manual Z, 4-2
Parts list, 15-19
P/N 94500-000D-000-01 ver03/02

16-5
Index
Removal, 9-26 Parts lists, 15-1

Semi/auto, 4-2 Password Protection, 4-22
Stitch, 4-2 Phase-Locked-Loop (PLL) Ultrasonic
Generator, 1-3
N Physical dimensions
Model 4523AD, 1-8
N.E.F.O.
Model 4523D, 1-6
Clean wand, 12-3
Model 4524AD, 1-12
Model 4523AD, 1-4
Model 4524D, 1-10
Model 4524AD, 1-4, 3-6, 8-18, 12-3
Power supply
Model 4524D, 3-6, 8-18, 12-3
Parts list, 15-21, 15-22
Logic board, 8-10
Power supply, 8-18
Motherboard, 8-6
N.E.F.O., 8-18
O Power Switch, 4-6
Off-line Pre-installation requirements, 2-1
Operations 4523AD, 6-16 Preload adjustment
Operations 4523D, 6-5 Motorized Y table, 9-28
Operations 4524AD, 6-40 Preventive maintenance
Operations 4524D, 6-27 Schedule, 12-1
Operation Preventive maintenance checks
Auto cycle, 11-4 Bonding head movement, 12-4
Model 4523AD, 6-9 Cam following bearing, 12-5
Model 4523D, 6-1 Dashpot, 12-4
Model 4524AD, 6-31 Force actuator coil motion, 12-3
Model 4524D, 6-20 Height control link motion, 12-6
Operation Modes, 4-11 Z motion drive belt tension, 12-4
Optical accessories, 14-1 Product description, 1-1
Options Programming, 4-19
Model 4523AD, 1-8
Model 4523D, 1-6 R
Model 4524AD, 1-12
Removal
Model 4524D, 1-10
Multi Mouse assembly, 9-26
Overhead Microscope, 1-3
Replacement
Clamp solenoid, 9-15
P Dashpot, 9-8
Parameter setting Force actuator, 9-10
Loop height, 6-29, 6-43 Logic board, 8-25
Parameters Solenoids, 9-23
Bonding operation, 6-5, 6-16, 6-27, 6-40 Transducer, 9-12
Parts list Wand, 9-23
Base assembly, 15-12 Right panel controls
Bonding head, 15-7, 15-8 Down, 4-5
Clamp assembly, 15-20 LED I, 4-5
Drag and electrode assembly, 15-13 LED II, 4-5
Front panel assembly, 15-2, 15-4 Model 4523AD, 4-3
Main head, 15-4 Model 4523D, 4-3
Manipulator, 15-10 Model 4524AD, 4-4
Motorized Y table, 15-10 Model 4524D, 4-4
Multi Mouse, 15-19 Open, 4-5
N.E.F.O. system, 15-21, 15-22 Short, 4-5
Spool assembly, 15-16 TC Display, 4-5
Up, 4-5

16-6
Index
Right side view Standard access

Contact mechanism, 9-5 Clamp solenoid replacement, 9-16, 9-20
Height control cam, 9-5 Standard mode ball bonding, 6-21, 6-32
Height control link, 9-5 Standard mode wedge bonding, 6-9
Main head assembly, 9-5 Standard mode wedge bonding, 6-1
Rotary heated workholders, 14-3 Static bonding force
Adjustment, 9-7
S Stationary heated workholders, 14-1
Stepper driver board
Screw
Left side view, 9-1
Cleaning, 12-2
Steppers drivers board
Search
Model 4523AD, 8-16
Height adjustment, 5-10
Model 4523D, 8-16
Search Height Adjustment, 5-10
Semi/auto bonding cycle
Model 4524AD, 10-12
T
Semi/auto bonding cycle T.C.
Model 4523ADD, 10-4 Workholders connectors panel, 3-8
Model 4523D, 10-2 Table tear bonding cycle
Model 4524D, 10-8 Model 4523AD, 10-6
Settings Table Tear Mode, 1-4
Bonding operation, 6-5, 6-16, 6-27, 6-40 Table tear mode wedge bonding, 6-13
Short Tail Control System, 1-4
Right panel controls, 4-5 TC Display
Sinewave generator Right panel controls, 4-5
Logic board, 8-10 Temperature controller
Single point TAB cycle Zero offset adjustment, 12-7
Model 4524D, 10-11 Temperature Controller, 1-3
Single point TAB mode, 6-38 Test points
Single point TAB mode ball bonding, 6-25 Logic board, 8-15
Solenoids Tool installation, 5-1
Cleaning, 12-7 Tool lifter, 3-5
Replacement, 9-23 Left side view, 9-3
Specifications, 1-5 Transducer
Model 4523AD, 1-7 Levelling, 9-12, 9-13
Model 4523D, 1-5 Replacement, 9-12
Model 4524AD, 1-11 Troubleshooting
Model 4524D, 1-9 Bonding process, 13-6
Speed adjustment, 8-28 General, 13-2
Spool 90°
Wire feed system, 9-24 U
Spool assembly
Ultrasonic generator
Parts list, 15-16
Adjustment, 12-6
Spool for Vertical Wire Feed
Ultrasonic generator circuit
Model 4523AD, 3-3
Model 4523D, 3-3
Logic board, 8-10
Model 4524AD, 3-3
Ultrasonic power
Model 4524D, 3-3
Adjustment, 8-26
Spool holder
Ultrasonic System, 1-3
Cleaning, 12-2
Unpacking, 2-2
Wire feed system, 9-24
Up
Spotlight, 1-4, 3-6
Adjustment, 5-20
P/N 94500-000D-000-01 ver03/02

16-7
Index
W WireFeed System
0.5 inch Spool for 30°/45° Wire Feed
Wand adjustment & replacement (4523D, 4526AD), 3-3
Model 4524AD, 9-21 2 inch Spool for 30°/45° Wire Feed
Model 4524D, 9-21 (4523D, 4523AD), 3-3
Wand gap Spool for Vertical Wire Feed (4523D,
Adjustment, 9-22 4523AD), 3-3
Wand overtravel Spool for Vertical Wire Feed (4524D,
Adjustment, 9-23 4524AD, 4523D, 4523AD), 3-3
Wand reset position Workholders, 1-4
Adjustment, 9-22 Adjustment, 5-9
Wedge installation Cold, 14-3
Model 4523AD, 5-1 Connectors panel, 3-8
Model 4523D, 5-1 Harness adapters, 14-6
Weight Height adjustment, 5-9
Model 4523AD, 1-9 Installation, 5-9
Model 4523D, 1-6 Manual index, 14-4
Model 4524AD, 1-12 Motorized heated, 14-5
Model 4524D, 1-10 Motorized index, 14-5
Wire Rotary heated, 14-3
Model 4523AD, 1-7 Stationary heated, 14-1
Model 4523D, 1-5 Temperature control, 5-10
Model 4524AD, 1-11
Model 4524D, 1-9
Y
Wire clamp, 9-15
Cleaning, 12-2 Y drive subassembly
Wire feed system Disassembly, 9-28
Fixed tensioner, 9-24 Model 4523AD, 9-28
Kicker, 9-24
Kicker stroke adjustment, 9-25 Z
Spool 90°, 9-24
Z motion drive belt tension
Spool holder, 9-24
Checking, 12-4
Wire loading, 5-11
Z motor
Model 4523AD, 5-14, 5-18
Logic board, 8-10
Model 4523D, 5-14, 5-18
Model 4523AD, 8-16
Model 4524AD, 5-12
Model 4523D, 8-16
Model 4524D, 5-12
Speed adjustment, 8-28
Tips, 5-12
Wire tension
Adjustment, 9-20
Loop height, 6-29, 6-43

16-8

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Dicing Systems

Kulicke & Soffa Ltd.

K&S 4500 Series

Operations and Maintenance Manual

P/N 94500-000D-000-01 March 2002

Kulicke & Soffa Industries, Incorporated

2101 Blair Mill Road

Willow Grove, PA 19090 USA

Telephone: (215) 784-6788

Fax: (215) 784-6181

Any reproduction, publication or distribution to a third party is strictly forbidden

Kulicke & Soffa Industries Inc

P/N 94500-000D-000-01 ver03/02

Kulicke & Soffa Industries Inc

Important Safety Features

4 Beware of touching tools, as they may have sharp edges.

5 All maintenance tasks should be performed by trained, authorized

Caution: If available at the site, perform the Lockout Procedure to eliminate

P/N 94500-000D-000-01 ver03/02

7 Read carefully all warnings given in the Maintenance Manual before

9 Personnel who handle or remove printed circuit boards (PCBs) must be

10 Obey all standard precautions for working with mechanical and

Specific Precautions for Models 4524D and

1 Do not open the N.E.F.O. box. If it becomes necessary to handle the

3 K&S recommends that during bonding operators use insulated gloves

Electrical Safety Labels

Kulicke & Soffa Industries Inc

About this Manual

Note: Unless noted otherwise, the photographs in this manual show

A general description of the K&S 4500 Digital

Instructions and guidelines for installing your

Chapter 3 Physical Description

Description of the principal parts of the K&S

Chapter 4 Controls and Indicators

Description of the K&S 4500 Digital Series

Chapter 5 Setup and Adjustments

Procedures and instructions for setting up and

Descriptions of bonding parameters and

Chapter 7 Maintenance Overview

General guidelines and adjustments checklist

P/N 94500-000D-000-01 ver03/02

Chapter 8 Electrical Subassemblies

Information for maintaining and adjusting the

Chapter 9 Mechanical Subassemblies

Details about maintaining the main

Chapter 10 Timing Diagrams

Diagrams of each machine’s bonding cycle time

Description of the K&S 4500 Digital Series

Chapter 12 Preventive Maintenance

Preventive maintenance procedures for various

Procedures for troubleshooting the K&S 4500

Chapter 14 Options and Accessories

Part numbers of optional items that are

Chapter 15 Parts List

Part numbers of all components and

Kulicke & Soffa Industries Inc

1.2 Features _________________________________________________ 1-3

1.3 Specifications ____________________________________________ 1-5