DATA SHEET

(Tentative)
Part No. AN37010A
Package Code No. HSOP042-P-0400D

Publication date: March 2011 Ver. EB 1

AN37010A

Contents
„ Overview …………………………………………………….……………………………………………………… 3
„ Features ………………………………………………….………………………………………………………… 3
„ Applications ………………………………………………….……………………………………………………… 3
„ Package ………………………………………………….…………………………………………………………. 3
„ Type ……………………………………………………….…………………………………………………………. 3
„ Application Circuit Example (Block Diagram) …………………………………………………………………… 4
„ Pin Descriptions ………………………………………….………………………………………………………… 5
„ Absolute Maximum Ratings ……………………………….……………………………………………………… 6
„ Operating Supply Voltage Range …………………….…………………………………………………………… 6
„ Recommended Use Conditions……………………….…………………………………………………………… 6
„ Allowable Current and Voltage Range …………………………………………………………………………… 7
„ Electrical Characteristics …………….…………………………………………………………………………… 8
„ Electrical Characteristics (Reference values for design) …………….…………………………………………. 10
„Technical Data ……………….………………………….………………………………………………………… 11
y Various protection function composition…………………………………………………………………………. 11
y I/O block circuit diagrams and pin function descriptions………………………………………………………. 12
„ Usage Notes ………………………………………….……………………………………………………………. 15
y Special attention and precaution in using ………………………………………………………………………. 15
y Notes of Power LSI ………………………………………………………………………………………………. 16

Ver. EB 2
AN37010A

AN37010A (Tentative)
4-channel LED driver, including a built-in DC/DC converter, for LCD TV
backlight

„ Overview
AN37010A is a 4-channel LED driver IC, which has a built-in step-up DC/DC converter, for LCD TV backlight. It is possible to
drive series-connected LEDs by the voltage of less than 185 V applied to each channel. It is possible to input PWM duty pulses to each
channel from outside. Moreover, since the maximum LED current value of each 4-channel can be adjusted by external applied voltage,
either normal mode or backlight scan mode can be used by selecting the maximum LED current value.

„ Features
y LED driver IC with 4-channel constant current output
y Integrated 185 V, 2 Ω (typ.) MOSFETs for LED Driver Stages
y LED drive current range of each channel : 10 mA to 200 mA
y Individual dimming control can be set by PWM input
y The maximum current value of each channel can be set by an external resistor and external applied voltage.
y Built-in various protection functions
x Thermal shutdown protection
x Over-voltage protection
x Over-current protection
x LED abnormal detection etc.
y Built-in 5 V regulator for internal circuits of IC
y The switching frequency of DC/DC converter is synchronized with an external signal

„ Applications
y LED backlight for LCD TV, LCD monitor

„ Package
y 28 pin Plastic Small Outline Package With Heat Sink (SOP Type)

„ Type
y Silicon Monolithic Bipolar IC

Ver. EB 3
AN37010A

„ Application Circuit Example (Block Diagram)

VIN
to 180 V
ILED

5V

17 19 25 23
RS GATE OVP FLAG

＋ VGATE
－ R
0.5 V
S
＋
COMP －
CT
13 TIMER COMP
EOTA
VCNT TMR_O
2V 15
＋
－ ＋ VREG2
－
OVP_O
VFB[1:4]
COMP
EO POR_O PRE
16 DRIVER
TSD_O
RT
14
fSW[kHz] SYNC RAMP
12 SDET_O
=110 000 TSD
/RT [kΩ] TMR_O
UVLO
OVP_O
22 VREF LED TSD_O
SHORT
DET
24 V LINEAR
24 VDD BG POR
REGULATOR VFB[1:4]

21 VREG1
FB1 5
20 VREG2
LED short-circuit FB2 6
27 SDET
detection
H : Enable
1V FB3 9
L : Disable
VREF 26 VSET FB4 10

28 PWM1
1 PWM2 11
CS4
2 PWM3
CS3 8
3 PWM4
7
CS2
4
CS1
GND GND
18 FIN

Notes) y This application circuit is an example. The operation of mass production set is not guaranteed. Perform enough evaluation and verification on
the design of mass production set.
y This block diagram is for explaining functions. Part of the block diagram may be omitted, or it may be simplified.

Ver. EB 4
AN37010A

„ Pin Descriptions

Pin No. Pin name Type Description

1 PWM2 Input Dimming pulse input 2 (LED current , High : Enable, Low : Disable)
2 PWM3 Input Dimming pulse input 3 (LED current , High : Enable, Low : Disable)
3 PWM4 Input Dimming pulse input 4 (LED current , High : Enable, Low : Disable)
4 CS1 Input External resistor connection 1 for LED current peak value setup
5 FB1 Output LED cathode drive output 1
6 FB2 Output LED cathode drive output 2
7 CS2 Input External resistor connection 2 for LED current peak value setup
8 CS3 Input External resistor connection 3 for LED current peak value setup
9 FB3 Output LED cathode drive output 3
10 FB4 Output LED cathode drive output 4
11 CS4 Input External resistor connection 4 for LED current peak value setup
Switching frequency synchronization pulse input
12 SYNC Input
(The operation of internal oscillator is synchronized with the rising edge)
13 CT — Timer capacitor connection for startup and protection operation
14 RT — Resistor connection for the switching frequency setup
15 VCNT Input Reference voltage input for DCDC control
16 EO — DCDC control error amplifier output
17 RS Input Switching NMOSFET current detection resistor connection
18 GND Ground Ground for pre-driver operating external switching NMOSFET
19 GATE Output Output pin to drive the gate of external switching NMOSFET
Power supply input for pre-driver driving external switching NMOSFET
20 VREG2 Input
(Connect with VREG1 pin externally.)
21 VREG1 Output Internal 5 V supply voltage output
22 VREF Output Reference voltage output
23 FLAG Output Abnormal state output
24 VDD Power supply Power supply for control circuit
25 OVP Input Over-voltage detection
26 VSET Input LED current peak value setup
27 SDET Input LED short detection enable (High : Enable, Low : Disable)
28 PWM1 Input Dimming pulse input 1 (LED current , High : Enable, Low : Disable)
FIN FIN Ground Main ground and die pad ground

Ver. EB 5
AN37010A

„ Absolute Maximum Ratings

Note) Absolute maximum ratings are limit values which do not result in damages to this IC, and IC operation is not guaranteed at these limit values.

A No. Parameter Symbol Rating Unit Notes

1 Supply voltage VDD 60 V *1
2 Supply current IDD — A —
3 Power dissipation PD 582 mW *2
4 Operating ambient temperature Topr –20 to +85 °C *3
5 Storage temperature Tstg –55 to +150 °C *3
6 FB pin current IFB1ABS to IFB4ABS 300 mA *3
7 Junctions temperature Tj +150 °C －

Notes) *1 : The values under the condition not exceeding the above absolute maximum ratings and the power dissipation.
*2 : The power dissipation shown is the value at Ta = 85°C for the independent (unmounted) IC package without a heat sink.
When using this IC, refer to the PD-Ta diagram of the package standard and design the heat radiation with sufficient margin so that the
allowable value might not be exceeded based on the conditions of power supply voltage, load, and ambient temperature.
*3 : Except for the power dissipation, operating ambient temperature, and storage temperature, all ratings are for Ta = 25°C.
*4 : Refer to „ Allowable Current and Voltage Range in page 7 for the allowable voltage and current of each pin.

■ Operating Supply Voltage Range

Parameter Symbol Range Unit Notes
Supply voltage range VDD 10.8 to 55 V *1

Note) *1 : The values under the condition not exceeding the above absolute maximum ratings and the power dissipation.

■ Recommended Use Conditions

Parameter Symbol Range Unit Notes

PWM dimming pulse frequency fPWM1 to fPWM4 0 to 1000 Hz *2
Step-up DCDC switching frequency fSW 300 to 800 kHz *2
SYNC pin input frequency fSYNC 300 to 800 kHz *2
Note) *2 : Use this IC under the condition not exceeding the above ratings, referring to the reference values for an application manual.
Especially pay attention to the power dissipation in case of step-up operation.

Ver. EB 6
AN37010A

„ Allowable Current and Voltage Range

Notes) y Allowable current and voltage ranges are limit ranges which do not result in damages to this IC, and IC operation is not guaranteed within
these limit ranges.
y Voltage values, unless otherwise specified, are with respect to GND.
y Do not apply external currents or voltages to any pin not specifically mentioned.
y For the circuit currents, "+" denotes current flowing into the IC, and "−" denotes current flowing out of the IC.

Pin No. Pin name Rating Unit Notes Pin No. Pin name Rating Unit Notes
5 FB1 −0.3 to 185 V — 5 FB1 0 to 300 mA —

6 FB2 −0.3 to 185 V — 6 FB2 0 to 300 mA —

9 FB3 −0.3 to 185 V — 9 FB3 0 to 300 mA —

10 FB4 −0.3 to 185 V — 10 FB4 0 to 300 mA —

28 PWM1 −0.3 to VREG V *1 4 CS1 −300 to 0 mA —

1 PWM2 −0.3 to VREG V *1 7 CS2 −300 to 0 mA —

2 PWM3 −0.3 to VREG V *1 8 CS3 −300 to 0 mA —

3 PWM4 −0.3 to VREG V *1 11 CS4 −300 to 0 mA —

4 CS1 −0.3 to VREG V *1

7 CS2 −0.3 to VREG V *1
8 CS3 −0.3 to VREG V *1
11 CS4 −0.3 to VREG V *1
12 SYNC −0.3 to VREG V *1
13 CT −0.3 to VREG V *1
14 RT −0.3 to VREG V *1
15 VCNT −0.3 to VREG V *1
17 RS −0.3 to VREG V *1
25 OVP −0.3 to VREG V *1
26 VSET −0.3 to VREG V *1
27 SDET −0.3 to VREG V *1
23 FLAG −0.3 to VDD V *2

Notes) *1 : VREG must not exceed 6 V.

*2 : Do not apply external voltages. This pin voltage must not exceed the rated value transiently.

Ver. EB 7
AN37010A

„ Electrical Characteristics at VDD = 24 V

Note) Ta = 25°C±2°C unless otherwise specified.

Limits
B No. Parameter Symbol Conditions Unit Notes
Min Typ Max
Regulator block
VDD pin current at LED PWM1 to 4 = High
1 IDDOP 1.8 2.6 3.4 mA —
operation fsw = 500 kHz
PWM1 to 4 = Low
2 VDD pin current at LED stop IDDHT 1.5 2.3 3.1 mA —
fsw = 500 kHz
VDD under-voltage protection
3 VDDUL VDD rising 8.6 9.5 10.4 V —
cancel voltage
VDD under-voltage protection
4 VDDULHY VDD falling 0.25 0.45 0.65 V —
hysteresis
C = 0.1 μF, VDD = 24 V, PWM1
5 VREF voltage VREF 2.328 2.4 2.427 V —
to 4 = Low, IREF = 0
C = 0.1 μF, VDD = 24 V, PWM1
6 VREF load regulation ΔVREFL to 4 = Low, 0 — 20 mV —
IREF = 100 μA
C = 1 μF, VDD = 24 V,
7 VREG voltage VREG 4.75 5.0 5.25 V —
PWM1 to 4 = Low, IREG = 0
C = 1 μF, VDD = 10.8 V to 55 V,
8 VREG line regulation ΔVREGV 0 — 20 mV —
PWM1 to 4 = Low, IREG = 0
C = 1 μF, VDD = 24 V,
9 VREG load regulation ΔVREGL PWM1 to 4 = Low, 0 — 20 mV —
IREG = 4 mA
LED drive
10 FB pin current range IFB PWM1 to 4 = High 10 — 200 mA —
11 FB pin ON resistance RFBON IFB1 to 4 = 0.2 A 1 2 3 Ω —
12 FB pin leak current RFBLK VFB = 45 V to 180 V — — 1 μA —
13 CS pin output offset voltage VCSOS VSET = 0.5 V –10 — 10 mV —
14 CS pin output maximum voltage VCSUL VSET = 1.5 V 0.97 1.00 1.03 V —
15 PWM pin input High voltage VPWMIH — 1.8 — VREG V —
16 PWM pin input Low voltage VPWMIL — 0 — 0.3 V —
17 PWM pin pull-down resistance RPWM VPWM = 5 V 60 100 140 kΩ —

Ver. EB 8
AN37010A

„ Electrical Characteristics (continued) at VDD = 24 V

Note) Ta = 25°C±2°C unless otherwise specified.

Limits
B No. Parameter Symbol Conditions Unit Notes
Min Typ Max
Step-up DCDC
18 RT pin voltage VRT RT = 110 kΩ 2.32 2.4 2.48 V —
19 DC/DC switching frequency fSW RT = 110 kΩ 442 520 598 kHz —
20 Maximum duty ratio DMAX RT = 110 kΩ 80 90 99 % —
21 GATE pin source resistance RGTSRC IGATE = –50 mA — 3 6 Ω —
22 GATE pin sink resistance RGTSNK IGATE = 50 mA — 2.5 5 Ω —
23 VCNT voltage range VCNT VCNT > VSET + 3×IFB + 0.2 1 — 2 V —
24 Error amp. trans conductance gm VCNT = 1.5 V 260 400 540 μA/V —
VEO = 1.75 V, VCNT = 1.5 V,
25 EO source current IEOSRC –90 –65 –40 μA —
VFB = 1 V
VEO = 1.75 V, VCNT = 1.5 V,
26 EO sink current IEOSNK 40 65 90 μA —
VFB = 2 V
27 SYNC pin High-level threshold VSYNCIH — 1.8 — VREG V —
28 SYNC pin Low-level threshold VSYNCIL — 0 — 0.3 V —
29 SYNC pin pull-down resistance RSYNC VSYNC = 5 V 60 100 140 kΩ —
FLAG pin
30 FLAG pin output High voltage VFLAGH Pull-up to 5 V via 100 kΩ 4.9 — 5.1 V —
31 FLAG pin output Low voltage VFLAGL Pull-up to 5 V via 100 kΩ — 50 100 mV —
32 FLAG pin Off leak current IFLAGLK Pull-up to 45 V via 100 kΩ — — 1 μA —
Over-voltage protection (Step-up DCDC output)
OVP pin over-voltage protection
33 VOVP — 2.32 2.4 2.48 V —
operation threshold
Timer (Overload)
34 CT pin current ICT CT = 0 V –4.1 –3.1 –2.1 μA —
CT pun protection operation
35 VCTSHDN — 2.3 2.4 2.5 V —
threshold voltage
Over-current protection (Step-up DCDC switching transistor current)
36 RS pin limit threshold VRS — 0.45 0.50 0.55 V —
LED short detection
37 LED short detection threshold VLEDSC VFB – VSET, VSET = 0.5 V 6.0 6.4 6.8 V —
VSET = 0.5 V, VFB1 = 7.5 V,
38 SDET timer tSDET 10 23 40 μs —
FLAG = High → Low
VREG –
39 SDET pin High-level threshold VSDETIH — — VREG V —
0.7
40 SDET pin Low-level threshold VSDETIL — 0 — 0.7 V —

Ver. EB 9
AN37010A

„ Electrical Characteristics (Reference values for design) at VDD = 24 V

Notes) Ta = 25°C±2°C unless otherwise specified.
The characteristics listed below are reference values derived from the design of the IC and are not guaranteed by inspection.
If a problem does occur related to these characteristics, we will respond in good faith to user concerns.

Reference values
B No. Parameter Symbol Conditions Unit Notes
Min Typ Max
Over-voltage protection (Step-up DCDC output)
VOVP = 5 V,
41 OVP timer tOVP 10 23 40 μs —
FLAG = High → Low
LED drive
42 FB current rising delay time IFBRD VSET = 0.5 V, RCS = 5 Ω — — 2.0 μs —
43 FB current falling delay time IFBFD VSET = 0.5 V, RCS = 5 Ω — — 1.0 μs —
Thermal shutdown protection
Thermal shutdown protection At the time the temperature of
44 TTSD 150 160 170 °C —
operation temperature chip rises
Thermal shutdown protection
45 TTRCV Temp falling 110 120 130 °C —
cancel temperature
VSET-voltage
46 VSET voltage range VSET — 0.1 — VREF V —

Ver. EB 10
AN37010A

„ Technical Data
y Various protection function composition
Note) The characteristics listed below are reference values derived from the design of the IC and are not guaranteed.

Setting Protection method

Protection function Detection Threshold Timer DC/DC converter LED current source FLAG pin
pin (Hysteresis width) time switching operation operation detection
The IC operation stops The IC operation stops
> 160°C Low
Chip temperature — — only at the time TSD only at the time TSD
(40°C) (not hold)
operates operates
OFF OFF
VDD pin under- < 9.5 V (The IC operation recovers (The IC operation recovers
VDD — —
voltage (0.45 V) at the time when VDD is at the time when VDD is
applied again) applied again)
OFF
0.5 V
RS pin over-current RS — (Pulse-by-pulse over — —
(—)
current limit)
OFF OFF
LED open > 2.64 V 0.8 × (The IC operation recovers (The IC operation recovers Low
EO
/ Over-load (—) CT[pF] μs at the time when VDD is at the time when VDD is (hold)
applied again) applied again)
FB1, FB2, > VSET + 6.4 V Low
LED short 23 μs — —
FB3, FB4 (—) (hold)
OFF OFF
Step-up DCDC > 2.4 V (The IC operation recovers (The IC operation recovers Low
OVP 23 μs
over-voltage (—) at the time when VDD is at the time when VDD is (hold)
applied again) applied again)

Ver. EB 11
AN37010A

„ Technical Data (continued)

y I/O block circuit diagrams and pin function descriptions
Note) The characteristics listed below are reference values derived from the design of the IC and are not guaranteed.

Pin Waveform
Internal circuit Impedance Description
No. and voltage
VREG1(5V)
Pin 1,2
3,12
Z : 100 kΩ
1, 28 (High voltage Pin 1, 2, 3, 28：Dimming pulse input
2, 4.8k input) Pin 12：Switching frequency
3, AC or DC syncronizing pulse input
12, 13.6k Z : 18.4 kΩ
28 (Low voltage (Input range : 0 V to VREG (5 V typ))
81.6k input)

4, DC Pin 5,6
9,10 External resister connection pin for setting
7, (Same voltage as
Z:－ LED current
8, Pin 26)
(Current setting range : 10 mA to 200 mA)
11 ※1 V max Pin 4,7
8,11

5, VREG(5V)
6, DC LED cathode drive output
(Same voltage as Z:－
9, (Allowable voltage range : 180 V max)
Pin 15)
10

VREG1(5V)
AC
External capacitor connection pin for start
13 (Depends on 13 Z : 2.27 kΩ
up and protection function
other pin
condition)

VREG1(5V)

DC External resister connection pin for setting

14 Z:－
2.4 V DC/DC switching frequency
14

VREG1(5V)

Reference voltage input for DC/DC

control
15 (Allowable voltage range :
15 DC Z:－
VCNT > VSET + 3×IFB + 0.2
and 1 V < VCNT < 2 V)

Ver. EB 12
AN37010A

„ Technical Data (continued)

y I/O block circuit diagrams and pin function descriptions (continued)
Note) The characteristics listed below are reference values derived from the design of the IC and are not guaranteed.

Pin Waveform
Internal circuit Impedance Description
No. and voltage
VREG1(5V)

DC External component connection pin for

16 16 Z:－
(0 to 2.64 V) DC/DC phase compensation

VREG1(5V)

AC 17 Current detection pin for external

17 Z:－
(0.5 V peak_Max) NMOSFET

DC GND pin of pre-driver circuit for external

18 － Z : Low
(GND : 0 V) NMOSFET

VREG2(5V)
19 AC Z:－ External NMOSFET gate control
19

DC Power supply input of pre-driver circuit for

20 Z:－
5V external NMOSFET

DC External capacitor connection pin for

21 － Z : Low
5V internal stabilized power supply (5 V)

5V

DC 22
22 Z : Low B/G voltage output (2.4 V)
2.4 V

23
500
23 AC or DC Z:－ Abnormal condition detection output

Power supply input

24 DC － Z:－
(Allowable voltage range : 10.8 V to 55 V)

Ver. EB 13
AN37010A

„ Technical Data (continued)

y I/O block circuit diagrams and pin function descriptions (continued)
Note) The characteristics listed below are reference values derived from the design of the IC and are not guaranteed.

Pin Waveform
Internal circuit Impedance Description
No. and voltage

270
25
DC
25 Z : High Over voltage protection input
(0 to VREF)

VREG1(5V)

26
Reference voltage input for setting LED
26 DC Z:－ current
(Allowable voltage range : 1 V max)

VREG1(5V)
Enable pin for LED short detection
DC
27 Z:－ ※High(VREG1) : Available
(0 V or VREG1)
Low(GND) : Unavailable
27
270

DC
Fin － Z : Low Main GND
0V

Ver. EB 14
AN37010A

„ Usage Notes
y Special attention and precaution in using
1. This IC is intended to be used for general electronic equipment [Backlight LED driver for LCD TV].
Consult our sales staff in advance for information on the following applications:
x Special applications in which exceptional quality and reliability are required, or if the failure or malfunction of this IC may
directly jeopardize life or harm the human body.
x Any applications other than the standard applications intended.
(1) Space appliance (such as artificial satellite, and rocket)
(2) Traffic control equipment (such as for automobile, airplane, train, and ship)
(3) Medical equipment for life support
(4) Submarine transponder
(5) Control equipment for power plant
(6) Disaster prevention and security device
(7) Weapon
(8) Others : Applications of which reliability equivalent to (1) to (7) is required
It is to be understood that our company shall not be held responsible for any damage incurred as a result of or in connection with
your using the IC described in this book for any special application, unless our company agrees to your using the IC in this book
for any special application.
2. Pay attention to the direction of LSI. When mounting it in the wrong direction onto the PCB (printed-circuit-board), it might
smoke or ignite.
3. Pay attention in the PCB (printed-circuit-board) pattern layout in order to prevent damage due to short circuit between pins. In
addition, refer to the Pin Description for the pin configuration.
4. Perform a visual inspection on the PCB before applying power, otherwise damage might happen due to problems such as a solder-
bridge between the pins of the semiconductor device. Also, perform a full technical verification on the assembly quality, because
the same damage possibly can happen due to conductive substances, such as solder ball, that adhere to the LSI during
transportation.
5. Take notice in the use of this product that it might break or occasionally smoke when an abnormal state occurs such as output pin-
VDD or VIN short (Power supply fault), output pin-GND short (Ground fault), or output-to-output-pin short (load short) .
And, safety measures such as an installation of fuses are recommended because the extent of the above-mentioned damage and
smoke emission will depend on the current capability of the power supply.
6. When designing your equipment, comply with the range of absolute maximum rating and the guaranteed operating conditions
(operating power supply voltage and operating environment etc.). Especially, please be careful not to exceed the range of absolute
maximum rating on the transient state, such as power-on, power-off and mode-switching. Otherwise, we will not be liable for any
defect which may arise later in your equipment.
Even when the products are used within the guaranteed values, take into the consideration of incidence of break down and failure
mode, possible to occur to semiconductor products. Measures on the systems such as redundant design, arresting the spread of fire
or preventing glitch are recommended in order to prevent physical injury, fire, social damages, for example, by using the products.
7. When using the LSI for new models, verify the safety including the long-term reliability for each product.
8. When the application system is designed by using this LSI, be sure to confirm notes in this book.
Be sure to read the notes to descriptions and the usage notes in the book.
9. Connect the metallic plate (fin) on the side of the IC with the GND potential. The thermal resistance and the electrical
characteristics are guaranteed only when the metallic plate (fin) is connected with the GND potential.
10. Power-on sequence : Apply VDD after the voltage is applied to VIN.
Power-off sequence : Lower VIN after VDD power-off.
11. Use the external components of DC/DC converter block corresponding to input voltage, output voltage and output current. Use
this IC under the condition that over-voltage and over-current don't occur on the actual use condition, taking enough margin
against the absolute maximum ratings. Please refer to the recommended constant and the method of calculation in an application
manual.
12. Raise VIN voltage in 3 ms or more.
Then, confirm carefully that the over-current more than specified value doesn't flow into external components and this IC.
13. Input a signal to PWM pin and SYNC pin on the conditions that VS pin, VIN voltage and VDD pin have been raised.
14. The PWM1-4 pin signals of all channels should be Low-level in order to change the input signal to VSET pin.
Ver. EB 15
AN37010A

„ Usage Notes (continued)

y Notes of Power LSI

1. The protection circuit is for maintaining safety against abnormal operation. Therefore, the protection circuit should not work
during normal operation.
Especially for the thermal protection circuit, if the area of safe operation or the absolute maximum rating is momentarily exceeded
due to output pin to VDD or VIN short (Power supply fault), or output pin to GND short (Ground fault), the LSI might be damaged
before the thermal protection circuit could operate.

2. Unless specified in the product specifications, make sure that negative voltage or excessive voltage are not applied to the pins
because the device might be damaged, which could happen due to negative voltage or excessive voltage generated during the ON
and OFF timing when the inductive load of a motor coil or actuator coils of optical pick-up is being driven.

3. The product which has specified ASO (Area of Safe Operation) should be operated in ASO.

4. Verify the risks which might be caused by the malfunctions of external components.

Ver. EB 16
 Request for your special attention and precautions in using the technical information and
semiconductors described in this book
(1) If any of the products or technical information described in this book is to be exported or provided to non-residents, the laws and
regulations of the exporting country, especially, those with regard to security export control, must be observed.

(2) The technical information described in this book is intended only to show the main characteristics and application circuit examples
of the products. No license is granted in and to any intellectual property right or other right owned by Panasonic Corporation or any
other company. Therefore, no responsibility is assumed by our company as to the infringement upon any such right owned by any
other company which may arise as a result of the use of technical information described in this book.

(3) The products described in this book are intended to be used for general applications (such as office equipment, communications
equipment, measuring instruments and household appliances), or for specific applications as expressly stated in this book.
Consult our sales staff in advance for information on the following applications:
– Special applications (such as for airplanes, aerospace, automotive equipment, traffic signaling equipment, combustion equipment,
life support systems and safety devices) in which exceptional quality and reliability are required, or if the failure or malfunction of
the products may directly jeopardize life or harm the human body.
It is to be understood that our company shall not be held responsible for any damage incurred as a result of or in connection with
your using the products described in this book for any special application, unless our company agrees to your using the products in
this book for any special application.

(4) The products and product specifications described in this book are subject to change without notice for modification and/or im-
provement. At the final stage of your design, purchasing, or use of the products, therefore, ask for the most up-to-date Product
Standards in advance to make sure that the latest specifications satisfy your requirements.

(5) When designing your equipment, comply with the range of absolute maximum rating and the guaranteed operating conditions
(operating power supply voltage and operating environment etc.). Especially, please be careful not to exceed the range of absolute
maximum rating on the transient state, such as power-on, power-off and mode-switching. Otherwise, we will not be liable for any
defect which may arise later in your equipment.
Even when the products are used within the guaranteed values, take into the consideration of incidence of break down and failure
mode, possible to occur to semiconductor products. Measures on the systems such as redundant design, arresting the spread of fire
or preventing glitch are recommended in order to prevent physical injury, fire, social damages, for example, by using the products.

(6) Comply with the instructions for use in order to prevent breakdown and characteristics change due to external factors (ESD, EOS,
thermal stress and mechanical stress) at the time of handling, mounting or at customer's process. When using products for which
damp-proof packing is required, satisfy the conditions, such as shelf life and the elapsed time since first opening the packages.

(7) This book may be not reprinted or reproduced whether wholly or partially, without the prior written permission of our company.

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