Internal Use Only

Service Manual
LG-A290

Date: January, 2012 / Issue 1.0

 Table Of Contents
1. INTRODUCTION................................................................ 3 4.12 SIM1 Card Interface Trouble.................................................... 90
1.1 Purpose.................................................................................................3 4.13 SIM2 Card Interface Trouble................................................... 92
1.2 Regulatory Information..................................................................3 4.14 SIM3 Card Interface Trouble................................................... 94
1.3 Abbreviations.....................................................................................5 4.15 KEY backlight Trouble................................................................ 96
4.16 Torch Trouble................................................................................. 98
2. SYSTEM SPECIFICATION.................................................. 7
4.17 Micro SD Trouble ......................................................................100
2.1 H/W Features.......................................................................................7
4.18 Bluetooth Trouble ....................................................................102
2.2 Technical Specification....................................................................9
4.19 FM Radio Trouble . ...................................................................104
3. TECHNICAL BRIEF...........................................................14
5. DOWNLOAD..................................................................106
3.1 Digital Main Processor.................................................................. 14
3.2 Power Management..................................................................... 19 6. BLOCK DIAGRAM..........................................................119
3.3 FEM with integrated Power Amplifier Module
7. Circuit Diagram............................................................120
(SKY77550, U400)........................................................................... 24
3.4 Clocks.................................................................................................. 26 8 BGA PIN MAP.................................................................124
3.5 RFSYS of MT6253 (U101)............................................................. 28
9. PCB LAYOUT..................................................................126
3.6 MEMORY(PF38F5060M0Y3DK, U100 )................................... 30
3.7 BT & FM Module(MT6626, U401)............................................ 34 10. ENGINEERING MODE.................................................128
3.8 SIM Card Interface.......................................................................... 38
11 RF CALIBRATION.........................................................129
3.9 Micro-SD Card Interface.............................................................. 41
11.1 Configuration of Tachyon . ....................................................129
3.10 LCD Interface................................................................................. 44
11.2 How to use Tachyon..................................................................131
3.11 Battery Charger Interface / MUIC.......................................... 46
3.12 Keypad Interface.......................................................................... 48 12 EXPLODED VIEW & REPLACEMENT PART LIST.........133
3.13 Audio Front-End........................................................................... 51 12.1 EXPLODED VIEW.........................................................................133
3.14 Camera Interface.......................................................................... 55 12.2 ReplacementParts.....................................................................134
3.15 KEY BACLKLIGHT LED Interface............................................. 57 12.3 Accessory......................................................................................151
3.16 Vibrator Interface......................................................................... 58
3.17 Torch LED Interface..................................................................... 59

4. TROUBLE SHOOTING.....................................................60
4.1 RF Component............................................................................... 60
4.2 RX Trouble........................................................................................ 61
4.3 TX Trouble......................................................................................... 65
4.4 Power On Trouble........................................................................... 69
4.6 Vibrator Trouble.............................................................................. 74
4.7 LCD Trouble...................................................................................... 76
4.8 Camera Trouble............................................................................... 79
4.9 Speaker/ Receiver Trouble.......................................................... 83
4.10 3.5φ Headset Trouble................................................................. 85
4.11 Microphone Trouble................................................................... 88

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 1. INTRODUCTION

1. INTRODUCTION

1.1 Purpose
This manual provides the information necessary to repair, calibration, description and download the features of this
model.

1.2 Regulatory Information

A. Security
Toll fraud, the unauthorized use of telecommunications system by an unauthorized part (for example, persons other
than your company’s employees, agents, subcontractors, or person working on your company’s behalf) can result in
substantial additional charges for your telecommunications services. System users are responsible for the security of
own system. There are may be risks of toll fraud associated with your telecommunications system. System users are
responsible for programming and configuring the equipment to prevent unauthorized use. The manufacturer does
not warrant that this product is immune from the above case but will prevent unauthorized use of common-carrier
telecommunication service of facilities accessed through or connected to it.
The manufacturer will not be responsible for any charges that result from such unauthorized use.

B. Incidence of Harm
If a telephone company determines that the equipment provided to customer is faulty and possibly causing harm or
interruption in service to the telephone network, it should disconnect telephone service until repair can be done. A
telephone company may temporarily disconnect service as long as repair is not done.

C. Changes in Service
A local telephone company may make changes in its communications facilities or procedure. If these changes could
reasonably be expected to affect the use of the this phone or compatibility with the network, the telephone company is
required to give advanced written notice to the user, allowing the user to take appropriate steps to maintain telephone
service.

D. Maintenance Limitations
Maintenance limitations on this model must be performed only by the manufacturer or its authorized agent. The user
may not make any changes and/or repairs expect as specifically noted in this manual. Therefore, note that unauthorized
alternations or repair may affect the regulatory status of the system and may void any remaining warranty.

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 1. INTRODUCTION

E. Notice of Radiated Emissions

This model complies with rules regarding radiation and radio frequency emission as defined by local regulatory agencies.
In accordance with these agencies, you may be required to provide information such as the following to the end user.

F. Pictures
The pictures in this manual are for illustrative purposes only; your actual hardware may look slightly different.

G. Interference and Attenuation

Phone may interfere with sensitive laboratory equipment, medical equipment, etc.Interference from unsuppressed
engines or electric motors may cause problems.

H. Electrostatic Sensitive Devices

ATTENTION
Boards, which contain Electrostatic Sensitive Device (ESD), are indicated by the sign.
Following information is ESD handling:

• Service personnel should ground themselves by using a wrist strap when exchange system boards.

• When repairs are made to a system board, they should spread the floor with anti-static mat which is also grounded.

• Use a suitable, grounded soldering iron.

• Keep sensitive parts in these protective packages until these are used.

• When returning system boards or parts like EEPROM to the factory, use the protective package as described.

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 1. INTRODUCTION

1.3 Abbreviations
For the purposes of this manual, following abbreviations apply:

APC Automatic Power Control

BB Baseband

BER Bit Error Ratio

CC-CV Constant Current – Constant Voltage

DAC Digital to Analog Converter

DCS Digital Communication System

dBm dB relative to 1 milli watt

DSP Digital Signal Processing

EEPROM Electrical Erasable Programmable Read-Only Memory

ESD Electrostatic Discharge

FPCB Flexible Printed Circuit Board

GMSK Gaussian Minimum Shift Keying

GPIB General Purpose Interface Bus

GSM Global System for Mobile Communications

IPUI International Portable User Identity

IF Intermediate Frequency

LCD Liquid Crystal Display

LDO Low Drop Output

LED Light Emitting Diode

OPLL Offset Phase Locked Loop

PAM Power Amplifier Module

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 1. INTRODUCTION

PCB Printed Circuit Board

PGA Programmable Gain Amplifier

PLL Phase Locked Loop

PSTN Public Switched Telephone Network

RF Radio Frequency

RLR Receiving Loudness Rating

RMS Root Mean Square

RTC Real Time Clock

SAW Surface Acoustic Wave

SIM Subscriber Identity Module

SLR Sending Loudness Rating

SRAM Static Random Access Memory

PSRAM Pseudo SRAM

STMR Side Tone Masking Rating

TA Travel Adapter

TDD Time Division Duplex

TDMA Time Division Multiple Access

UART Universal Asynchronous Receiver/Transmitter

VCO Voltage Controlled Oscillator

VCTCXO Voltage Control Temperature Compensated Crystal Oscillator

WAP Wireless Application Protocol

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 2. PERFORMANCE

2. SYSTEM SPECIFICATION

2.1 H/W Features

Item Feature Comment

Standard Battery Lithium Ion, 3.7V 1500mAh

Stand by TIME >450 hr., Min.@PP9

Stand by time >500 hr., Min.@PP5

>6.0hr., Min.@GSM900, PL=5

>14.0 hr., Min.@GSM900, PL=13
Talk time
>8 hr., Min.@DCS, PL=0
>14 hr., Min.@DCS, PL=9

Charging time Approx. 3 hours 30 min.

RX Sensitivity GSM, EGSM: -109dBm, DCS: -109dBm

GSM, EGSM: 32.3dBm(Level 5),

TX output power
DCS , PCS: 29.5dBm(Level 0)

GPRS compatibility Class 10

SIM card type 3V Small

Display MAIN : TFT 176 × 220(QCIF) pixel 262K Color

KEY TOTAL 22EA

Hard icons. Key Pad
Status Indicator Numeric(12EA : 0 ~ 9, #, *) Navigation Key OK Key(5EA)
Menu Key, Clear Key, Send Key, End Key,
SIM Switch Key(5EA)

ANT Internal

EAR Phone Jack Yes(3.5Ø)

PC Synchronization Yes

Speech coding EFR/FR/HR

Data and Fax Yes

Vibrator Yes

Loud Speaker Yes

Voice Recoding Yes

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 2. PERFORMANCE

Item Feature Comment

Microphone Yes

Speaker/Receiver 18 x 12 Speaker/Receiver

Travel Adapter Yes

MIDI SW MIDI (Mono SPK)

Camera 1.3M

Bluetooth / FM Radio Bluetooth version 2.1 / 76~108MHz supported

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 2. PERFORMANCE

2.2 Technical Specification

Item Description Specification

GSM850 EGSM
TX: 824 ~ 849 MHz TX: 880 ~ 915MHz
RX: 869 ~ 894 MHz RX: 925 ~ 960 MHz
DCS
1 Frequency Band TX: 1710 ~ 1785 MHz
RX: 1805 ~ 1880 MHz
PCS
TX: 1850 ~ 1910 MHz
RX: 1930 ~ 1990 MHz

RMS < 5 degrees

2 Phase Error
Peak < 20 degrees
3 Frequency Error < 0.1ppm
GSM850 / EGSM
Level Power Toler. Level Power Toler.
5 33 dBm ±2dB 13 17 dBm ±3dB
6 31 dBm ±3dB 14 15 dBm ±3dB
7 29 dBm ±3dB 15 13 dBm ±3dB
8 27 dBm ±3dB 16 11 dBm ±5dB
9 25 dBm ±3dB 17 9 dBm ±5dB
10 23 dBm ±3dB 18 7 dBm ±5dB
11 21 dBm ±3dB 19 5 dBm ±5dB
12 19 dBm ±3dB
4 Power Level
DCS / PCS
Level Power Toler. Level Power Toler.
0 30 dBm ±2dB 8 14 dBm ±3dB
1 28 dBm ±3dB 9 12 dBm ±4dB
2 26 dBm ±3dB 10 10 dBm ±4dB
3 24 dBm ±3dB 11 8 dBm ±4dB
4 22 dBm ±3dB 12 6 dBm ±4dB
5 20 dBm ±3dB 13 4 dBm ±4dB
6 18 dBm ±3dB 14 2 dBm ±5dB
7 16 dBm ±3dB 15 0 dBm ±5dB

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 2. PERFORMANCE

Item Description Specification

GSM850 / EGSM

Offset from Carrier (kHz). Max. dBc

100 +0.5

200 -30

250 -33

400 -60

600 ~ <1,200 -60

1,200 ~ <1,800 -60

1,800 ~ <3,000 -63

3,000 ~ <6,000 -65

Output RF Spectrum 6,000 -71

5
(due to modulation DCS/ PCS

Offset from Carrier (kHz). Max. dBc

100 +0.5

200 -30

250 -33

400 -60

600 ~ <1,200 -60

1,200 ~ <1,800 -60

1,800 ~ <3,000 -65

3,000 ~ <6,000 -65

6,000 -73

GSM850 / EGSM

Offset from Carrier (kHz). Max. dBm

Output RF Spectrum 400 -19

6
(due to switching transient) 600 -21

1,200 -21

1,800 -24

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 2. PERFORMANCE

Item Description Specification

DCS/ PCS

Offset from Carrier (kHz). Max. dBm

Output RF Spectrum 400 -22

6
(due to switching transient) 600 -24

1,200 -24

1,800 -27

7 Spurious Emissions Conduction, Emission Status

GSM850, EGSM
BER (Class II) < 2.439% @-102 dBm
8 Bit Error Ratio
DCS,PCS
BER (Class II) < 2.439% @-102 dBm

9 RX Level Report Accuracy ± 3 dB

10 SLR 15±3 dB

Frequency (Hz) Max.(dB) Min.(dB)

100 -12 -

200 0 -

300 0 -12

11 Sending Response 1,000 0 -6

2,000 4 -6

3,000 4 -6

3,400 4 -9

4,000 0 -

12 RLR(Norminal) 4± 3 dB

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 2. PERFORMANCE

Item Description Specification

Frequency (Hz) Max.(dB) Min.(dB)

100 -6 -

200 2 -

300 2 -9

500 * *
13 Receiving Response 1,000 2 -7

3,000 2 *

3,400 2 -12

4,000 2

* Mean that Adopt a straight line in between 300 Hz and 1,000 Hz to

be Max. level in the range.

14 STMR(Vol. Nominal) >17dB

15 Echo Loss >58dB

16 Idle Noise Sending < -64dBm0p

17 Idle Noise Receiving < -54dBm0P(Volume Max)

System frequency
18 ≤ 2.5 ppm
(13 MHz) tolerance

19 32.768KHz tolerance ≤ 30 ppm

At least 58 dB spl under below conditions:

20 Ringer Volume 1. Ringer set as ringer.
2. Test distance set as 100 cm

Fast Charge : Typ. 600 mA

21 Charge Current Slow Charge : Typ. 500mA
Total Charging Time : < Approx. 3 hours 30min.

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 3. TECHNICAL BRIEF

Item Description Specification

Bar Number Power

4 over -91dBm±2dBm

4 -> 3 -91dBm±2dBm
22 Antenna Display
3 -> 2 -99dBm±2dBm

2 -> 1 -103dBm±2dBm

1 -> 0 -105dBm±2dBm

Battery Bar Number Voltage

3 ≥ 3.75± 0.05 V

23 Battery Indicator 3 -> 2 3.75 ± 0.05 V

2 -> 1 3.65 ± 0.05 V

1 -> 0 3.5 ± 0.05 V

Low Voltage Warning ≤ 3.5 ± 0.05V (Call), every 1 minute

24
( Blinking Bar) ≤ 3.5 ± 0.05V (Standby), every 3 minute.

Forced shut down

25 3.35 ± 0.05V
Voltage

Sustain RTC
26 Over 1 min(Super Cap : Polyacene Capacitor 10uAh)
without battery

Li-Ion Battery
Standard Voltage = 3.7 V
27 Battery Type
Battery full charge voltage = 4.2 V
Capacity: 1500mAh

Switching-mode charger
28 Travel Charger Input: 90 ~ 264 V, 47/63 Hz
Output: 5.1 V, 700 mA

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 3. TECHNICAL BRIEF

3. TECHNICAL BRIEF

3.1 Digital Main Processor

Figure. 3.1.1 MT6253 Hardware Block Diagram

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 3. TECHNICAL BRIEF

3.1.1 General
• Integrated voice-band, audio-band and base-band analog front ends.
• Package:
– aQFN, 11.5x11.5x0.85 mm.
– 0.47 mm pitch.
– 260balls, 0.47mm pitch package.

3.1.2 MCU Subsystem

• ARM7EJ-S 32-bit RISC processor.
• High performance multi-layer AMBA bus.
• Operating frequency 52/104MHz.
• Dedicated DMA bus, 7DMA channels.
• 144KB 0n-chip SRAM.
• On-chip boot ROM for Factory Flash Programming.
• Watchdog timer for system crash recovery.
• 3 sets of General Purpose Timer.
• Circuit Switch Data coprocessor.
• Division coprocessor.

3.1.3 External Memory Interface

• Supports up to 3 external devices.
• Supports 16-bit memory components with maximum size of up to 64M Bytes for each bank.
• Supports Flash and SRAM/PSRAM with Burst Mode.
• Support legacy industry standard parallel LCD Interface.
• Suppport multi-media companion chips with 8/16 bits data width.
• Configurable driving strength for memory interface.

3.1.4 User Interface

• 6-row x 7-column keypad control with hardware scanner.
• Support multi key press for gaming.
• SIM/USIM Controller with hardware T=0/T=1 protocol control.
• Real Time Clock(RTC) operating with a separate power supply.
• General Purpose I/Os (GPIOs).
• 1 set of Pulse Width Modulation(PWM) Output.
• Alerter Output with Enhanced PWM or PDM.
• Maximum 7 external interrupt lines.

3.1.5 Security
• Support security key and 128bit chip unique ID.

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 3. TECHNICAL BRIEF

3.1.6 Connectivity
• 3 sets of UART with hardware flow control and speed up to 921600 bps.
• IrDA modulator/demodulator with hardware framer supports SIR mode of operation.
• HS/FS/LS USB 2.0 Device controller.
• Multi Media Card/Secure Digital Memory Card/Memory Stick/Memory Stick Prto/SDIO host controller.
• Supports SDIO interface for SDIO peripherals as well as WIFI connectivity.
• DAI/PCM and !2S interface for Audio application.

3.1.7 Low Power Schemes

• Power Down Mode for analog and digital circuits.
• Processor Sleep Mode.
• Pause Mode of 32KHs clocking at Standby State.
• 3-channel Auxiliary 10-bit A/D Converter for application usage other than battery monitoring.

3.1.8 Power and Supply Management

• 2.8V to 4.7V Input Range.
• Charger Input up to 8V.
• 11 sets of LDO Optimized Specific GSM Sub-systems.
• One LDO for RF transceiver.
• High Operation Efficiency and Low Stand-by Current.
• Dual SIM Card Interface.
• One boost regulator and Four Open-Drain Output Current Regulators to Supply/Control the LED.
• LDO type Vibrator.
• One NMOS switch to control R(GB) LED.
• Thermal Overload Protection.
• Under Voltage Lock-out Protection.
• Over Voltage Protection.

3.1.9 Integrated RF Receiver

• Direct conversion architecture.
• Quad band differential input LNAs.
• Quadrature RF mixers.
• Fully integrated channel filter with f3dB=150kHs.
• 95dB gain with 60dB gain control range.
• No IIP2 calibration.

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 3. TECHNICAL BRIEF

3.1.10 Integrated RF Transmitter

• Offset phase lock loop.
• IQ modulator DC offset calibration by BB ADC/DAC.
• Precise quadrature by IF divide-by-4.
• Integrated loop filter.

3.1.11 Integrated RF Frequency Synthesizer

• Programmable fractional-N synthesizer.
• Integrated wide range RFVCO.
• Integrated loop filter.
• Fast setting time suitable for multi-slot SPRS applications.

3.1.12 Integrated RF Digitally-Controlled Crystal Oscillator(DCXO)

• One-pin 26MHz crystal oscillator.
• On-chip programmable capacitor array for cross tune.

3.1.13 Radio Interface and Baseband Front End

• GMSK modulator with analog I and Q channel outputs.
• 10-bit D/A Converter for uplink baseband I and Q signals.
• 14-bit high resolution A/D Converter for downlink baseband I and Q signals.
• Calibration mechanism of offset and gain mismatch for baseband A/D Converter and D/A
Converter.
• 10-bit D/A Converter for Automatic Power Control.
• Programmable Radio RX filter with adaptive bandwidth control.
• Dedicated Rx filter for FB acquisition.
• 6-Pin Baseband Parallel Interface(BRI) with programmable driving strength.
• Multi-band support.

3.1.14 Voice and Modem CODEC

• Digital tone generation.
• Voice Memo.
• Noise Reduction.
• Echo Suppression.
• Advanced Sidetone Oscillation Reduction.
• Digital sidetone generator with programmable gain.
• Two programmable acoustic compensation filters.
• GSM/GPRS quad vocoders for adaptive multirate(AMR), enhanced full rate(EFR), full.
rate(FR), and half rate(HR).
• GSM channel coding, equalization and A5/1, A5/2 and A5/3 ciphering.
• GPRS GEA1, GEA2 and GEA3 ciphering.

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3.1.15 Voice Interface and Voice Front End

• Two microphone inputs sharing one low noise amplifier with programmable gain and automatic gain control(AGC)
mechanism.
• Voice power amplifier with programmable gain.
• 2nd order Sigma-delta A/D Converter for voice uplink path.
• D/A Converter for voice downlink path.
• Supporter for voice downlink path.
• Supports half-duplex hands-free operation.
• Compliant with GSM 03.05

3.1.16 LCD Interface

• Dedicated Parallel Interface supports 2 external 8/9 bit Parallel Interface, and Serial interface for LCM.

3.1.17 LCD Controller

• Supports LCM format: RGB332, RGB444, RGB565, RGB666, RGB888.
• Supports LCD module with maximum resolution up to 240x320 at 16bpp.
• Capable of combining display memories with up to 4 blending layers.
• Accelerated Gamma correction with programmable gamma table.
• Supports hardware display rotation for each layer.

3.1.18 Audio CODEC

• Wavetable synthesis with up to 64 tones.
• Advanced wavetable synthesizer capable of generating and 47 sets of percussions.
• PCM Playback and Record.
• Digital Audio Playback.

3.1.19 Audio Interface and Audio Front End

• Supports I2S interface.
• High resolution D/A Converters for Stereo Audio playback.
• Stereo analog input for stereo audio source.
• Analog multiplexer for Stereo Audio.
• FM Radio Recording.
• Stereo to Mono Conversion.
• HE-AAC decode support.

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3.2 Power Management

Power management unit, so called PMU, is integrated into analog part. To facilitate software control and interface design,
PMU control share the CCI interface along with other analog parts, such as BBTX, BBRX, VBI and ABI during FT.

MT6253 PMU System

Charger
LDOS
System

KPLED
Buck
Driver

SIM IO 1 Boost

Vibrator
SIM IO 2
Driver

Power-on Backlight
Driver
Sequence /
Protection
Speaker
Logic Driver

Figure. 3.2.1 PMU system block diagram

3.2.1 Low Dropout Regulators(LDOs), Buck converterand Reference

The PMU Integrates 12 LDOs that are optimized for their given functions by balancing quiescent current, dropout
voltage, line/load regulation, and output noise.

 RF LDO (Vrf)
The RF LDO is a linear regulator that could source 180mA (max) with 2.8V output voltage. It supplies the RF circuitry of
the handset. The LDO is optimized for high performance and adequate quiescent current.

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 Digital Core Buck Converter (Vcore)

The digital core regulator is a DC-DC step-down (Buck converter) that could source 200mA(max) with 1.2V to 0.9V
programmable output voltage based on software register setting. It supplies the power for baseband circuitry of the SoC.
The buck converter is optimized for high efficiency and low quiescent current.

 Digital IO LDO (Vio)

The digital IO LDO is a linear regulator that could source 100mA (max) with 2.8V output voltage. It supplies the the
power for baseband circuitry of the SoC. The LDO is optimized for very low quiescent current and turns on automatically
together with Vm/Va LDOs.

 Analog LDO (Va)

The analog LDO is a linear regulator that could source 100mA (max) with 2.8V output voltage.
It supplies the analog sections of the SoC. The LDO is optimized for low frequency ripple rejection in order to reject the
ripple coming from the burst at 217Hz of RF power amplifier.

 TCXO LDO (Vtcxo)

The TCXO LDO is a linear regulator that could source 20mA (max) with 2.8V output voltage.
It supplies the temperature compensated crystal oscillator, which needs ultra low noise supply
with very good ripple rejection.

 Single-Step RTC LDO (Vrtc)

The single-step RTC LDO is a linear regulator that can charge up a capacitor-type backup coin cell to 2.8V, which also
supplies the RTC module even at the absence of the main battery. The single-step LDO features the reverse current
protection and is optimized for ultra low quiescent current while sustaining the RTC function as long as possible.

 Memory LDO (Vm)

The memory LDO is a linear regulator that could source 200mA (max) with 1.8V or 2.8V output voltage selection based on
the supply specification of memory chips. It supplies the memory circuitry in the handset. The LDO is optimized for very
low quiescent current with wide output loading range.

 SIM LDO (Vsim)

The SIM LDO is a linear regulator that could source 80mA (max) with 1.8V or 3.0V output voltage selection based on
the supply specs of subscriber identity modules (SIM) card. It supplies the SIM card and SIM level shifter circuitry in the
handset. The Vsim LDO is controlled independently by the register named VSIM_EN.

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 SIM2 LDO (Vsim2)

The SIM2 LDO is a linear regulator that could source 20mA (max) with 1.8V or 3.0V output voltage selection based on the
supply specs of the 2nd subscriber identity modules (SIM) card.
It supplies the 2nd SIM card and SIM level shifter circuitry in the handset. The Vsim2 LDO is controlled independently by
the register named VSIM2_EN.

 USB LDO (Vusb)

The USB LDO is a linear regulator that could source 75mA (max) with 3.3V output dedicated for USB circuitry. It is
controlled independently by the register named RG_VUSB_EN.

 Memory Card / Bluetooth LDO (Vbt)

The VBT LDO is a linear regulator that could source 150mA (max) with 1.5V, 1.8V, 2.5V or 2.8V output for memory card or
Bluetooth module. It is controlled independently by the register named RG_VBT_EN.

 Camera Analog LDO (Vcama)

The Vcama LDO is a linear regulator that could source 150mA (max) with 1.5V, 1.8V, 2.5V or 2.8V output which is selected
by the register named VCAMA_SEL[1:0]. It supplies the analog power of the camera module. Vcama is controlled
independently by the register named RG_VCAMA_EN.

 Camera Digital LDO (Vcamd)

The Vcamd LDO is a linear regulator that could source 75mA (max) with 1.3V, 1.5V, 1.8V or 2.8V output which is selected
by the register named VCAMD_SEL[1:0]. It supplies the digital power of the camera module. Vcamd is controlled
independently by the register named RG_VCAMD_EN.

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 3. TECHNICAL BRIEF

VCORE 1V2 / 1V0 200 mA PMU (BB)

PULL UP(I2C1, I2C2, BT_PCMSYNC, BAT CONNECTOR)

VIO 2V8 100 mA
SIM Selection, Jack DET, Hook DET, LCD, FM Radio

VRF 2V8 200 mA PAM

VA 2V8 125 mA BB(PLL, RFE, MBUF, AFE, RFD)

VM 1V8 / 2V8 200 mA EMI (BB), MEMORY

VTCXO 2V8 20 mA DCXO (BB)

VSIM 1V8 / 3V0 80 mA SIM1

VSIM2 1V8 / 3V0 20 mA SIM2, SIM3

VUSB 3V3 100 mA USB Power (BB)

VBT(VMMC) 1V8 / 2V84 / 3V0 150 mA MSDC (BB), T-FLASH

VCAM_A 1V5 / 1V8 / 2V5 / 2V8 150 mA CAMERA (ANALOG, IO)

VCAM_D 1V5 / 1V8 / 2V5 / 2V8 75 mA CAMERA (DIGITAL)

VRTC 2V8 1 mA

Table3.2.1. Power Supply Domains (Without RF)

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 3. TECHNICAL BRIEF

3.2.1 Power On
Together with Power Management IC (PMIC), MT6253 offers both fine and coarse resolutions of power control through
software programming. With this efficient method, the developer can turn on selective resources accordingly in order to
achieve optimized power consumption. The operating modes of MT6253 as well as main power states provided by the
PMIC are shown in Figure.3.2.1.

Active Software Sleep

Power On
Mode Program Mode

Core
Processors Software Pause
Program Mode

Power Software Active

Power On Core
Down Mode Program Mode

Core
Processors

Active State Standby State

Phone Power State

Core Operating Mode

Figure 3.2.1. Major Phone Power States and Operating Modes for MT6253 based terminal

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 3. TECHNICAL BRIEF

3.3 FEM with integrated Power Amplifier Module (SKY77550, U400)

3.3.1 Internal Block Diagram

SKY77550
TX_HB_IN(10) Match

(21) RX2

VBATT (3)
VBATT (4) HBT POWER AMPLIFIER

VRAMP (16) CURRENT SENSE

(26) ANT
POWER AMPLIFIER CONTROL
TxEN (18)
LOGIC DECODER
BS (12)
VSW_EN (11)
(19) RX1

Tx_LB_IN (9) Match

201287_001

Figure. 3.3.1 SKY77550 FUNCTIONAL BLOCK DIAGRAM

3.3.2 General Description

SKY77550 is a transmit and receive Front-End Module (FEM) with Integrated Power Amplifier Control(iPAC™) for Dual-
band cellular handsets comprising GSM850/900 and DCS1800/PCS1900 operation. Designed in a low profile, compact
form factor, the SKY77550 offers a complete Transmit VCO-to-Antenna and Antenna-to-Receive SAW filter solution. The
FEM also supports Class 12 General Packet Radio Service (GPRS) multi-slot operation.

The module consists of a GSM850/900 PA block and a DCS1800/PCS1900 PA block, impedance matching circuitry for
50 ohm input and output impedances, Tx harmonics filtering, high linearity / low insertion loss RF switch, and a Power
Amplifier Control (PAC) block with internal current sense resistor. The two Hetero-junction Bipolar Transistor (HBT) PA
blocks, a Bi-FET PAC and switch control circuit are fabricated onto a single Gallium Arsenide (GaAs) die. One PA block
supports the GSM850/900 bands and the other PA block supports the DCS1800/PCS1900 bands.

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 3. TECHNICAL BRIEF

Both PA blocks share common power supply pads to distribute current. The output of each PA block and the outputs
to the two receive pads are connected to the antenna pad through an RF switch. The GaAs die, Switch die and passive
components are mounted on a multi-layer laminate substrate. The assembly is encapsulated with plastic over mold.

Input Contrpol Bits

Mode
VSW_EN Tx_EN BS

STANDBY 0 0 0

Rx11 1 0 0

Rx21 1 0 1

Tx_LB 1 1 0

Tx_HB 1 1 1
1
Rx1 and Rx2 are broadband receive ports and each supports the GSM850, GSM900, DCS, and PCS nands.

Table 3.3.1 SKY77550 Mode Control Logic

VLOGIC
C400

DNI

R402 C401 33p

HB_TX
51
RF_ANT_SW1
C403 33p
C402
LB_TX
ANT400
14
13

12

11

10

DNI
RSVD2
RSVD1

BS

VSW_EN

Tx_HB_IN

Tx_LB_IN

GND8
15
R407 10K
RF_TX_RAMP VRAMP GND6
16 8
GND5 VBAT
7
PA_EN TxEN GND4
17 6
U400 GND3
R409 C407 5
C406 RSVD
18
24K 220p VBATT2
4
DNI Rx1 VBATT1
19 3

RSVD3 GND2 C410 C408 C409

20 2
GND1 1u
1 10u 56p
C405 Rx2
21
100p
GND13
GND12
GND11

GND10
GND9
PGND

GND7
ANT

22
(10V,2125) (50V,C,NPO) (50V,C,NP0)
SW400
23
24
25

26

27
28
29

C411 C412 L400

2
ANT COMMON
1
100p 2.4n
G3 G4 100p
C413 3 4
L411
DNI 27n C415
0.5p
C416
DNI
Figure 3.3.2 TX-module CIRCUIT DIAGRAM

C417 18p
GSM850_RxP

L401
FL400 B9512 22n
1 IN O1_1 9
C418 18p
GSM850_RxN
O1_2 8 C419 18p
EGSM_RxP
O2_1 7
L402
9.1n 4 GND O2_2 6 L403
C_G1
C_G2
C_G3
C_G4

22n
2 3 5 10
C420 18p
EGSM_RxN
C421 5.6p
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2012 LG Electronics. Inc. All right reserved.
1 IN
FL401 B9513 L404 Only for training and service purposes
O1_1 9 4.7n

O1_2 8
C422 5.6p
DCS_RxP
O2_1 7
C423 6.8p
PCS_RxN
G1 O2_2
 3. TECHNICAL BRIEF

3.4 Clocks
There are two major time bases in the MT6253. For the faster one is the 26 MHz clock originated from the digital control
oscillator(DCXO) of RF block. This is then converted to the square-wave signal through CLKSQ.
The other time base is the 32768 Hz clock generated by an on-chip oscillator connected to an external crystal.

26MHz
DCXO EN
MPLL_SEL CG 104MHz EMI_clock
(0x8300_0204[1:0])
104MHz AHB_clock
CLKSQ_DIV2_MCU_SEL
(0x8300_0100[0]) 52MHz AHB_clock
0
2 FMCU_CK 52MHz APB_clock
CLKSQ CLKSQ_26M_CK 1/2 1 3 MCU_DCM
0
CLKSQ_DIV2_MCU_SEL
(0x8300_0100[1])
DPLL_SEL
1/2 CLKSQ_CON (0x8300_0100) (0x8300_0204[3:2])
EN
CG 104MHz GDSP1_CK
1 104MHz GDSP2_CK
0 0
2 FDSP_CK
MPLL MPLI_113M_CK
3 DSP_DCM

CLKSQ_DIV2_GSM_SEL
(0x8300_0100[2])
PLL_CON0(0x8300_0200)
PLL_CON1(0x8300_0204)
GPLL_SEL
(0x8300_0204[4])
MPLL_CON0(0x8300_0210) EN
MPLL_CON1(0x8300_0214)
1 CG 52MHz GGSM_CK
52MHz BFE_clock
0 1
UPLL UPLL_CON0(0x8300_0208) 0 FGSM_CK
UPLL_CON1(0x8300_020C)
GSM_DCM

UPLL_104M_CK
CLKSQ_DIV2_USB_SEL
(0x8300_0100[3]) UPLL_SEL
(0x8300_0204[5])

EN
1 CG GUSB_CK

0 1 FUSB_CK
0
USB_DCM

UPLL_48M_USB_CK USB PHY USB_PHY_CLK MSDC_DCM

EN
CG MSDC clock
IrDA clock
UPLL_48M_IRDA_CK F48M_CK

32KHz EN
XOSC_ANA
CG
XOSCOUT F32K_CK SLOW_CK

XOSC_CON(0x8300_0000) SLOW_DCM

Figure. 3.4.1 Clock distributions inside the MT6253.

J31
RFVCO_MT
M32
BT_CLK_26M FREF
C109 4.7u H6
AU_VCM
Y6
PWM
TSX-3225 26MHZ_7_4PF
26MHz K34
2 1 XTAL1
L33
3 4 XTAL2_GND
X100
V4
AVDD_RTC
T4

Figure. 3.4.2 Crystal Oscillator External Connection

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 3. TECHNICAL BRIEF

3.4.1 32.768KHz Time Base

The 32768 Hz clock is always running. It’s mainly used as the time base of the Real Time Clock(RTC) module, which
maintains time and date with counters. Therefore, both the 32768Hz oscillator and the RTC module is powered by
separate voltage supplies that shall not be powered down when the other supplies do.
In low power mode, the 13Mhz time base is turned off, so the 32768Hz clock shall be employed to update the critical
TDMA timer and Watchdog Timer. This time base is also used to clocks the keypad scanner logic

3.4.2 26MHz Time Base

Since PLL are based on 13MHz reference clock. There is an ½-dividers for PLL existing to allow using 26MHz DCXO.
There are 2 phase-locked loops(PLL) in MT6253. The UPLL generates 624Mhz clock output, then a frequency divider
further divide 6, and 13 to generate fixed 103Mhz, and 48Mhz for GSM_CLOCK and USB_CLOCK and DSP_CLOCK. These
four primary clocks then feed into GSM, USB, MCU and DSP Clock Domain, respectively.
These 2 PLLs require no off-chip components for operations and can be turn off in order to save power. After power-on,
the PLLs are off by default and the source clock signal is selected through multiplexers. The software shall take cares of
the PLL lock time while changing the clock selections. The PLL and usages are listed below.
- PLL supply four clock source : MCU_CLOCK(104~113Mhz), DSP_CLOCK(104~113Mhz),
GSM_CLOCK(104Mhz) and USB_CLOCK(48Mhz)
- For DSP/MCU system clock, MCU_CLOCK and DSP_CLOCK. The outputted 104~113Mhz clock is controlled by MCU for
500Khz per step and settled time is under 100uS. The clock is also connected to DSP/MCU DCM (dynamic clock manager)
for dynamically adjusting clock rate by digital clock divider.
MCU_CLOCK paces the operations of the MCU cores, MCU memory system, and MCU peripherals as well
Modem system clock, GSM_CLOCK, which paces the operations of the GSM/GPRS hardware, coprocessors as well. The
outputted 104Mhz clock is connecter to GSM_DCM for dynamically adjusting clock rate by digital clock divider. Typically
the GSM_DCM output clock no more than 52Mhz.

Note that PLL need some time to become stable after being powered up. The software shall take cares of the PLL lock
time before switching them to the proper frequency. Usually, a software loop longer than the PLL lock time is employed
to deal with the problem.
For power management, the MCU software program may stop MCU Clock by setting the Sleep Control Register. Any
interrupt requests to MCU can pause the sleep mode, and thus MCU return to the running mode.
AHB also can be stop by setting the Sleep Control Register. However the behavior of AHB in sleep mode is a little different
from that of MCU. After entering Sleep Mode, it can be temporarily waken up by any “hreq”(bus request), and then goes
back to sloop automatically after all “hreqs” de-assert. Any transactions can take place as usual in sleep mode, and it can
save power while there is no transaction on it. However the penalty is losing a little system efficiency for switching on
and off bus clock, but the impact is small

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 3. TECHNICAL BRIEF

3.5 RFSYS of MT6253 (U101)

Figure. 3.5.1 Block DIAGRAM of RFSYS

3.5.1 GENERAL DESCRIPTION

RFSYS built in MT6253 SOC is a highly integrated RF transceiver for multi-band GMS and GPRS cellular systems. The
features are listed as following.
 Receiver
- Direct conversion architecture
- Quad band differential input LNAs
- Quadrature RF mixers
- Fully integrated channel filter with f3dB=150kHz
- 95 dB gain with 60 dB gain control range

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 3. TECHNICAL BRIEF

 Transmitter
- Offset phase lock loop.
- IQ modulator.
- Integrated TX VCO.
- Integrated loop filter.

 Frequency Synthesizer
- Programmable fractional-N synthesizer.
- Integrated wide range RFVCO.
- Integrated loop filter.
- Fast settling time suitable for multi-slot GPRS/EDGE applications.

 Digitally-Controlled Crystal Oscillator (DCXO)

- One-pin 26 MHz crystal oscillator.
- On-chip programmable capacitor array for coarse tune.
- On-chip programmable capacitor array for fine tune.

 RFSYS in a-QFN package

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 3. TECHNICAL BRIEF

3.6 MEMORY(PF38F5060M0Y3DK, U100 )

3.6.1 Functional Description

The Numonyx™ StrataFlash® Cellular Memory (M18) device provides high read and write performance at low voltage on a
16-bit data bus.
The flash memory device has a multi-partition architecture with read-while-program and read-while-erase capability.
The device supports synchronous burst reads up to 108 MHz using ADV# and CLK address-latching (legacy-latching)
on some litho/density combinations and up to 133 MHz using CLK address-latching only on some litho/density
combinations. It is listed below in the following table.

Sync PSRAM AD-Mux I/O Block Diagram.

M18 AD Mux Family with Synchronous PSRAM

F1-CE# F-VPP
F1-OE# F1-VCC
CLK F-RST#

WAIT Flash Die

(Address/Data Multiplex I/O)
ADV#
A/DQ[15:0]
F-WP#
VCCQ
F-WE# A[MAX:16]

VSS

A[MAX:0]

DQ[15:0]
PSRAM Die
P-CS# (Non-Multiplex I/O)
R-OE# P-VCC
P-CRE R-UB#
R-WE# R-LB#

Notes:
1. F2-OE# must be treated as an RFU, Howerver, to ensure future compatibility, F2-OE# can be tied to F1-OE# or left
floated.
2. F2-VCC must be treated as an RFU, Howerver, to ensure future compatibility, F2-VCC can be tied to F1-VCC or left
floated.
3. For full AD-Mux (NOR/PSRAM), PSRAM Address[15:0] are shared with NOR ADQ[15:0]; See Figure, “ “ on apge 27.
4. For full AD-Mux (NOR/PSRAM) all address/data are shared with NOR ADQ[15:0], Upper addresses [Max:16] should be
connected to VSS.
Figure. 3.6.1 MEMORY BLOCK DIAGRAM

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 3. TECHNICAL BRIEF

Supports frequency up to
Litho (nm) Density (Mbit) Sync read address-latching
(MHz)

256 133 CLK-latching

90
512 108 ADV# - and CLK-latching

128 133 CLK-latching

256 133 CLK-latching

65 512 133 CLK-latching

1024 108 ADV# - and CLK-latching

1024 133 CLK-latching

Table 3_6_1 M18 Frequency combinations

In continuous-burst mode, a data Read can traverse partition boundaries.

Upon initial power-up or return from reset, the device defaults to asynchronous arrayread mode. Synchronous burst-
mode reads are enabled by programming the Read Configuration Register. In synchronous burst mode, output data is
synchronized with a user-supplied clock signal. A WAIT signal provides easy CPU-to-flash memory synchronization.
Designed for low-voltage applications, the device supports read operations with VCC at1.8 V, and erase and program
operations with VPP at 1.8 V or 9.0 V. VCC and VPP can be tied together for a simple, ultra-low power design. In addition to
voltage flexibility, a dedicated VPP connection provides complete data protection when VPP is less than VPPLK.
A Status Register provides status and error conditions of erase and program operations
One-Time-Programmable (OTP) registers allow unique flash device identification that can be used to increase flash
content security. Also, the individual block-lock feature provides zero-latency block locking and unlocking to protect
against unwanted program or erase of the array.

The flash memory device offers three power savings features:

• Automatic Power Savings (APS) mode: The device automatically enters APS following a read-cycle completion.
• Standby mode: Standby is initiated when the system deselects the device by deasserting CE#.
• Deep Power-Down (DPD) mode: DPD provides the lowest power consumption and is enabled by programming in the
Enhanced Configuration Register. DPD is initiated by asserting the DPD pin.

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 3. TECHNICAL BRIEF

3.6.2 Features

 Device Architecture
- Flash Die Density: 128, 256, 512 Mbit, or 1Gbit.
- PSRAM Die Density: 32Mbit to 512Mbit.
- x16 Non-Mux, AD-Mux, or AAD-Mux I/O Interface Option.
- Virtual Address Option.

 Device Voltage
- Core: VCC = 1.8 V
- I/O: VCCQ = 1.8 V

 Device Packaging
- Ballout: x16C with 107 Active Balls, QUAD+ with 88 Active Balls, or LPCP 56-ball NOR/PSRAM AD-Mux.
- Area: 6.2x7.7 mm to 11x13 mm.
- Height: 1.0 mm to 1.4 mm.

 PSRAM Performance
- 70 ns Initial Read Access.
- 20 ns Asynchronous Page-Mode Read 133, 104, and 80Mhz with 5.5, 7, and 9ns Clock-to-Output Synchronous Burst-
Mode Reads.
- Configurable 4-, 8-, 16- and Continuous-Word Burst-Length Reads and Writes- Partial-Array and Temperature-
Compensated Self Refresh- Programmable Output Impedance.

 Quality and Reliability

- Extended Temperature –25 °C to +85 °C
- Minimum 100K Flash Block Erase Cycles.
- ETOX™ IX (Flash) and ETOX™ X (Flash)Technology on 128 Mbit, 256 Mbit, and 512Mbit M18 die; ETOX™ X (Flash) on 1
Gbit M18 die.

 Flash Performance
- 96 ns Initial Read Access; 15 ns Asynchronous Page-Mode Read.
- Up to 133 MHz with 5.5 ns Clock-to-Data Output Synchronous Burst-Mode Read.
- Buffered Enhanced Factory and 1.8 V Low-Power Buffer Programming Modes:2 μs/Byte (Typ).
- Deep Power-Down Mode: 2 μA (Typ).
- Configurable Output Driver.

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 3. TECHNICAL BRIEF

 Flash Architecture
- Multi-Level Cell Technology.
- Hardware Read-While-Program/Erase.
- Symmetrically Blocked Array.
- Eight Partitions.
- Configurable 8-, 16-, or Continuous-Words Burst Length Reads.
- 2-Kbit One-Time Programmable User Protection Register Bits.
- Zero-Latency Block Locking.
- Automated Blank Check Mode.

 Flash Software
- Numonyx™ FDI and Numonyx™ PSM.
- Common Flash Interface.
- Basic and Extended Flash Command Set.

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 3. TECHNICAL BRIEF

3.7 BT & FM Module(MT6626, U401)

The connections between internal modules, as well as, external interfaces can be found in Figure 3.7.1
The Bluetooth transceiver section of MT6626 incorporates the complete receiving and transmitting Paths, including PLL,
VCO, LNA, PA, modulator, and demodulator. The Bluetooth baseband signal processor incorporates hardware engines to
perform frequency hopping, error correcting, whitening, encrypting, data packet assembling. The FM receiver section
incorporates the complete receiving path with wide tuning range. The FM baseband signal processor incorporates the
digital demodulator and audio processing function which provides superior audio quality as well as RDS/RBDS data
service.

CLOCK
ENABLE VCC28_RF VDD28 PTA PCM VCC28OUT VBAT

XTAL

CLOCK SLEEP RF DIG PCM

GEN. CON LDO LDO CODEC BAT LDO
INTERFACE DMA
SYSRAM
CONTROL

APB
BRIDGE
BLUETOOTH
BLUETOOTH TRANSCEIVER
BASEBAND SIGNAL
PROCESSOR
32-BIT
MICROPROCESS
OR
INTERRUPT
CONTROLLER
JTAG JTAG

FM BASEBAND
SIGNAL PROCESSOR
FM RECEIVER
I2S
AUDIO (WLCSP I2C GPIO UART
DAC ONLY)

32K CLOCK RDS ANALOG I2S I2C GPIO/EINT UART

INTERRUPT OUTPUT

Figure 3.7.1. BT BLOCK DIAGRAM

3.7.1 General Description

MT6626 is a monolithic single chip that integrates Bluetooth v2.1+EDR and FM receiver. It can be incorporated in varieties
of mobile platforms to provide Bluetooth connectivity and FM radio. MT6626 is available in QFN40 and WLCSP package.
With a very small package size and require few external BOM components, a compact footprint can be designed for
today’s slim mobile device. Unparalleled performance of sensitivity and interference rejection featured, MT6626 also
provides uncompromising low power performance. It also supports 10dBm transmit power with efficient power control,
which provide the user with excellent link quality.

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 3. TECHNICAL BRIEF

3.7.2 Feature

 BT Radio features
- Fully compliant with Bluetooth specification 2.1 + EDR.
- Low out-of-band spurious emissions supports simultaneous operation with GPS, GSM/GPRS worldwide radio systems
- Integrated balun.
- Supports low power scan mode support.
- Fully integrated power amplifier provides 10dBm (class 1) output power.
- -95dBm sensitivity with excellent interference rejection performance.
- AGC dynamically adjusts receiver performance in changing environments.

 BT Baseband features
- Support SCO and eSCO link with re-transmission.
- Scatternet support: Up to 4 piconets simultaneously with background inquiry/page scan Sniff mode support.
- AFH and PTA collaborative support for WLAN/BT coexistence.
- PCM interface and built-in transcoders for A-law, μ-law and linear voice with re-transmission support.
- Built-in hardware modem engine for access code correlation, header error correction, forward error correction, CRC,
whitening, and encryption.
- Channel quality driven data rate adaptation.
- Channel assessment for AFH.

 Platform features
- 32-bit RISC microprocessor.
- Integrated LDO enables direct connection to battery.
- Wide range of frequency of crystal and external reference clock support.
- High speed UART supports up to 4Mbps baud rate.
- Built-in RAM and ROM with patch system.
- External LPO clock support for sleep mode and FM function. Supports standard HCI interface.
- Idle mode and sleep mode design enables ultra low power performance.

 FM features
-76-108 MHz worldwide FM bands with 50KHz tuning step.
-RDS / RBDS radio data system support.
-Long/short antenna support.
-30ms seek time per channel, and 6sec search time for all channels.
-Superior stereo noise reduction.
-Supports 32.768KHz clock as reference clock.
-Soft mute volume control.
-Supports automatic short antenna calibration for different FM channels.
-60dB mono SINAD with 22.5KHz FM deviation.
-2dBuVemf sensitivity with superior interference rejection.
-20dBuVemf RDS sensitivity (dev: 2KHz).
-Support I2S digital interface (available in WLCSP package).

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 3. TECHNICAL BRIEF

3.7.3 Functional Description

 Power Subsystem
MT6626 contains several LV (low voltage, 2.8V to 1.5V) linear regulators to provide power supply for every power domain,
including RF circuitry and digital core circuitry. Furthermore, it has built-in BAT linear regulator which allows the chip to
connect directly to Li-Ion battery power supply. The supported battery voltage ranges from 3.2V to 4.3V.
The input pin LDO28EN is used by the host controller to turn on and off the BAT regulator. The host can control this pin
to enable the whole MT6626 system. The enable voltage (VIH) of pin LDO28EN is 1.5V. Please be sure that the control
signal meets this requirement in order for the system to operate correctly. The built-in LV linear regulators for RF circuitry
are cap-less regulators. It provides high PSRR for achieving excellent RF performance. The power controls for these RF
LDOs are maintained internally by digital controller for optimized power consumption.
The DIG (digital) LV regulator requires an external capacitor. When the 1.2V power is supplied from the regulator on
VDD12 pins, an internal POR (Power-On Reset) will be generated to start the system. An external system reset to start the
system is optional according to the application requirement.

 Clock generation
There are two clock domains inside MT6626. One is the SYSTEM reference clock which is used for the Bluetooth and MCU
system operations. The second is the LPO clock, which is a low-power 32.768KHz reference clock used for FM system and
also maintaining Bluetooth link during sleep mode operations. The use of the LPO clock for FM system allows the entire
MT6626 to be operating in the lowest possible power consumption mode when the rest of the system is under sleep
state.
MT6626 has two options for the SYSTEM clock source input. It can either be a one-pin crystal input, or it can come from
external clock source. MT6626 supports most widely used clock frequencies in the mobile handset platform. They include
13, 16, 19.2, 26, and 32MHz.
To save system BOM cost, the SYSTEM clock can be shared with the clocks available on the mobile handset platform.
For example, the reference clock used for mobile base-band chipset can also be used as the MT6626 source clock. In
this configuration, an output pin SRCLKENA from MT6626 is used as the enable signal for the external clock source. The
generation of the signal is coupled to the internal sleep mode control function. The input frequencies can be selected by
GPIO trapping or detected automatically based on the availability of externally supplied 32.768KHz clock.
The LPO clock can come from the host chip in both QFN40 and WLCSP package, or an external oscillator for WLCSP only.

 Chip power management

MT6626 is designed such that Bluetooth and FM functions can be operated concurrently and independently without
interference. With sophisticated built-in state control and advanced power management, the operating mode can be
changed seamlessly while achieving minimum power consumption.
MT6626’s operating modes can be categorized into 6 major modes
- Chip power off mode.
- Power-on Init mode.
- Bluetooth standalone operation mode.
- FM standalone operation mode.
- Bluetooth + FM concurrent operations mode.
- System deep sleep mode.

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 3. TECHNICAL BRIEF

 MCU Subsystem
The MCU (Micro-Controller Unit) subsystem contains the 32-bit RISC microprocessor, internal memory and the ROM
patch function. It also contains the UART interface controller and the power/clock management function.

 Bluetooth Subsystem
The Bluetooth subsystem contains the Bluetooth baseband subsystem and the Bluetooth RF subsystem.
The Bluetooth baseband subsystem contains a baseband processor which supports timing control, bit-stream
processing, encryption, frequency hopping, and modulation/demodulation. It also contains the audio codec, Wi-Fi
coexistence interface controller, and a sleep mode controller.
The Bluetooth RF subsystem contains a fully integrated transceiver. For TX path, the baseband transmit data is digitally
modulated in the baseband processor, then up-converted to 2.4GHz RF channels through DA converter, filter, IQ up-
converter, and the power amplifier. The power amplifier is capable of transmitting 10dBm power for class-1.5 operation.
For RX path, MT6626 is a low IF receiver architecture. An image-reject mixer down-converts the RF signal to the IF with
the LO from the synthesizer, which could support different clock frequencies as the reference clock as described in
section 4.2. The mixer output is then converted to digital signal, down-converted to baseband for demodulation. A fast
AGC enables the effective discovery of device within the dynamic range of the receiver.
MT6626 features self calibration schemes to compensate the process and temperature variation to maintain high
performance. Those calibrations are performed automatically right after system boot-up.

 FM Subsystem
MT6626’s FM radio subsystem provides a completely integrated FM RX receiver supporting 76-108 MHz FM bands with
50KHz tuning step. It also performs fast channel seek/scan algorithm to validate 200 carrier frequencies in 6 seconds. In
addition to receive FM audio broadcasting, the digital RDS/RBDS data system is supported as well. The integrated FM
transceiver utilizes state-of-the-art digital demodulation/modulation techniques to achieve excellent performance.
In order to achieve high SINAD, good sensitivity and excellent noise suppression, the FM receiver adopts adaptive
demodulation scheme to optimize RX system performance in all range of signal quality by reference of a very
sophisticated channel quality indicator (CQI). When the received signal quality is poor, the design not only enhances the
ACI rejection capability but also uses a very ingenious skill to soft mute annoying noise so as to provide good perception
quality.
The FM subsystem requires only the availability of the 32.768KHz clock input, and can be operated completed
independently from the Bluetooth subsystem. Therefore, allowing for full simultaneous operation and coexistence with
the Bluetooth subsystem while maintaining the most power-efficient consumption under different operating states.
The FM subsystem supports high performance stereo analog line out. In WLCSP package, it also supports digital audio
out.

LGE Internal Use Only - 37 - Copyright © 2012 LG Electronics. Inc. All right reserved.
Only for training and service purposes
 3. TECHNICAL BRIEF

3.8 SIM Card Interface

VIO VIO
Dual SIM Controller
VBAT

47K R221
VSIM_1

MMC_DET
T_FLASH_SIM_COMBO C239
C237
2.2u
C238
1u VSIM_2
2.2u

C265
1u
SYS_RESET
C257

23

19
1u C258

4
19

VMMC

SYSRSTB

VIO

VBAT
18
ST2 1u
G1

17
ST1
VSIM1
5
SCLK1/GPIO1 SIM_CLK_1
TP200 SIMCLK1/GPI13 SRST1/GPIO2
6
1 SIM1_CLK 15 7
SIM_RST_1
S4
2 SIO1/GPIO3 SIM_DATA_1
MMC_DATA2 T1 TP201 SIMRST1/GPI14
8
3 SIM1_RST 14
MMC_DATA3 T2
4 VSIM2
MMC_CMD T3 TP202 3
S200

5 SIM1_DATA SIMIO1/GPI15 SCLK2/GPIO4 SIM_CLK_2

T4 13 2
6 SRST2/GPIO5 SIM_RST_2
T5 1
MMC_CLK 7 SIO2/GPIO6 SIM_DATA_2
T6 28
8 SIMCLK2/GPI16

U202
T7 16
MMC_DATA0 9 VSIM3
T8 27
MMC_DATA1 10 VSIM2 SIMRST2/GPI17 SCLK3/GPIO7 VSIM1
S8 17 24
SRST3/GPIO8
G3

G2

25
S7
S3
S6
S2
S5
S1

SIMIO2/GPI18 SIO3/GPIO9
18 26
C270C235 R241
21

11
12
13
14
15
16

20

VA209 VA210VA211 VA212 VA213 VA214

1u 1u CE0 VSIM4
20 9
SCLK4/GPIO10 0
10
I2C_SCL2 SCL SRST4/GPIO11
21 11 C259
SIO4/GPIO12
VSIM2 12
I2C_SDA2 SDA 1u

GND
22
C234
1u

29
SIM2_RST
R246
DNI
SIM2_CLK
SIM2_DATA

VA223 VA222 C261 VA221

DNI

VSIM_1

SIM_CONNECTOR
VSIM_1

J201
R225
DNI 4 1
C5 C1
5 2
C6 C2 SIM_RST_1
6 3
SIM_DATA_1 C7 C3 SIM_CLK_1
10 7
GND4 GND1
9 8
GND3 GND2
VA215 C247 VA216 VA217 C249
1u DNI

VSIM_2 VSIM_2
SIM_CONNECTOR
J202
R231
DNI 4 1
C5 C1
5 2
C6 C2 SIM_RST_2
6 3
SIM_DATA_2 C7 C3 SIM_CLK_2
10 7
GND4 GND1
9 8
VA218 GND3 GND2
VA219 VA220
C254 C256
1u DNI

Figure 3.8.1 SIM Connector Circuit Diagram

LGE Internal Use Only - 38 - Copyright © 2012 LG Electronics. Inc. All right reserved.
Only for training and service purposes
 3. TECHNICAL BRIEF

The Main Base Band Processor(MT6253) contains two dedicated smart card interfaces to allow the MCU to access the
two SIM cards. Each interface can operator via 5 terminals. As shown is the Figure 3.8.2, SIMVCC, SIMSEL, SIMRST, SIMCLK
and SIMDATA are for one SIM interface, while SIM2VEE, SIM2SEL, SIM2RST, SIM2CLK and SIM2DATA are for the other one.
The functions of the two SIM interfaces are identical; therefore, only first SIM interface will be described in this document.
The VSIM is used to control the external voltage supply to the SIM card and SIM SEL determines the regulated smart card
supply voltage. SIMRST is used as the SIM card reset signal. Besides, SIMDATA and SIMCLK are used for data exchange
purpose.

A290 is using U202 as SIM controller to be able to use triple SIM.

Figure 3.8.2 SIM Interface block diagram

LGE Internal Use Only - 39 - Copyright © 2012 LG Electronics. Inc. All right reserved.
Only for training and service purposes
 3. TECHNICAL BRIEF

3.8.1 Dual SIM controller(MT6306, U202)

 General Description
The MT6306 is a SIM card / GPIO control chip optimized for GSM handsets, especially those based on the MediaTek
MT62xx system solution. It supports up to four SIM interfaces or 12 GPIOs plus six GPIs. Each SIM interface can be
individually programmed as GPIOs. The SIM interface supports both 1.8V and 3V SIM cards. An I2C interface is used to
control SIM channel individually.
The MT6306 is available in 28-pin 4mm x 4mm QFN package. The operating temperature range is from -25°C to +85°C.

 Features
Control and communication through an I2C interface with baseband processor.Independent 1.8V/3V VCC control for
each SIM cardPower management and control for quad SIM cardsIndependent clock stop mode (at high or low level)
for each SIM cardProgrammable SIM interface pins (can be SIM interface pins or GPIO pins)Compatible with MediaTek
baseband processor chips, MT6252, MT6253, MT6235, MT6236, etc.28-Pin 4mm x 4mm QFN Package.

VSIM1
SIMCLK1
SCLK1
SIMRST1 SIM CARD A
SRST1
SIMRO1
SIO1
Signal
SIMCLK2 Processing
Blocks VSIM2
SIMRST2
Baseband SCLK2
SIMRO2
Processor SRST2 SIM CARD B
SIO2
SDA
Analog
SCL Blocks VSIM1
I2C
AD0 SCLK1
SRST1 SIM CARD C
SIO1

VSIM2
SCLK2
SRST2 SIM CARD D
SYSRSTB
SIO2
MT6306

Figure 3.8.3 SIM Controller block diagram

LGE Internal Use Only - 40 - Copyright © 2012 LG Electronics. Inc. All right reserved.
Only for training and service purposes
 3. TECHNICAL BRIEF

3.9 Micro-SD Card Interface

VIO

47K R221

MMC_DET
T_FLASH_SIM_COMBO
C265
1u

19
VMMC 18
ST2

G1
17
ST1

1
S4
2
MMC_DATA2 T1
3
MMC_DATA3 T2
4
MMC_CMD T3
S200

5
T4
6
MMC_CLK T5
7
T6
8
MMC_DATA0 T7
9
MMC_DATA1 T8
10 VSIM2
S8
G3

G2
S7
S3
S6
S2
S5
S1

C270C235
21

11
12
13
14
15
16

20

VA209 VA210VA211 VA212 VA213 VA214

1u 1u

VSIM2
C234
1u
SIM2_RST
R246
DNI
SIM2_CLK
SIM2_DATA

VA223 VA222 C261 VA221

DNI

Figure 3.9.1 Micro-SD Card Interface

The controller fully supports the Memory Stick bus protocol as defined in Format Specification version 2.0 of Memory
Stick Standard (Memory Stick PRO) and the SD Memory Card bus protocol as defined in SD Memory Card Specification
Part 1 Physical Layer Specification version 2.0 as well as the Multi Media Card(MMC) bus protocol as defined in MMC
system specification version 4.1. Since SD memory Card bus protocol is backward compatible to MMC bus protocol,
the controller is capable of working well as the host on MMC bus under control of proper firmware. Furthermore, the
controller also support SDIO card specification version 1.0 partially. However, the controller can only be configured as
either the host controller.

LGE Internal Use Only - 41 - Copyright © 2012 LG Electronics. Inc. All right reserved.
Only for training and service purposes
 3. TECHNICAL BRIEF

3.9.1 Pin Assignment

Since the controller can only be configured as either the host of Memory Stick or the host of SD/MMC Memory Card at
one time, pins for Memory Stick and SD/MMC Memory Card are shared in order to save pin counts. The following lists
pins required for Memory Stick and SD/MMD Memory Card. Figure 3.9.2 shows how they are shared. In Table 3.9.1, all
I/O pads have embedded both pull up and pull down resistor because they are shared by both the Memory Stick and SD/
MMC Memory Card. Pins 2,4,5,8 are only useful for SD/MMC Memory Card. Pull down resistor for these pins can be used
for power saving. All embedded pull-up and pull-down resistors can be disabled by programming the corresponding
control registers if optimal pull-up or pull-down resistor are required on the system board. The pin VDDPD is used for
power saving. Power for Memory Stick or SD/MMC Memory Card can be shut down by programming the corresponding
control register. The pin WP(Write Protection) is only valid when the controller is configured for SD/MMC Memory Card. It
is used to detect the status of Write Protection Switch on SD/MMC Memory Card.

NO. Name Type MMC SD MS MSPRO Description

1 SD_CLK 0 CLK CLK SCLK SCLK Clock
2 SD_DAT3 I/0/PP CD/DAT3 DAT3 Data Line [Bit 3]
3 SD_DAT0 I/0/PP DAT0 DAT0 SDI0 DAT0 Data Line [Bit 0]
4 SD_DAT1 I/0/PP DAT1 DAT1 Data Line [Bit 1]
5 SD_DAT2 I/0/PP DAT2 DAT2 Data Line [Bit 2]
6 SD_CMD I/0/PP CMD CMD BS BS Command Or Bus State
7 SD_PWRON 0 VDD ON/OFF
8 SD_WP I Write Protection Switch in SD
9 SD_INS I VSS2 VSS2 INS INS Card Detection

Table 3.9.1 Sharing of pins for Memory Stick and SD/MMC Memory Card controller

[ microSD CARD PIN_MAP ] microSD CARD

PIN NUMBER DESCRIPTION
T1 DAT2
T2 CD/DAT32 T1 T3 T5 T7
T3 CMD T2 T4 T6 T8
T4 VDD
T5 CLK
T6 Vss2
T7 DAT0
T8 DAT1

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Only for training and service purposes
 3. TECHNICAL BRIEF

3.9.2 Card Detection

For SD/MMC Memory Card, detection of card insertion/removal by hardware is also supported. Because a pull down
resistor with about 470 KΩ resistance which is impractical to embed in an I/O pad is needed on the signal CD/DAT3, and
it has to be capable of being connected or disconnected dynamically onto the signal CD during initialization period, an
additional I/O pad is needed to switch on/off the pull down resistor on the system board. The scenario of card detection
for SD/MMC Memory Card is shown in Figure 3.9.2. Before SD/MMD Memory Card is inserted or powered on, SW1 and
SW2 shall be opened for card detection of the host side. Meanwhile, pull down resistor RCD on system board shall
attach onto the signal CD/DAT3 by the output signal RCDEN. In addition, SW3 on the card is default to be closed. Upon
insertion of SD/MMC Memory Card the signal CD/DAT3 will have a transition from low to high. If SD/MMC Memory Card
is removed then the signal CD/DAT3 will return to logic low. After the card identification process, pull down resistor RCD
on system board shall disconnect with the signal CD/DAT3 and SW3 on the card shall be opened for normal operation.
Since the scheme above needs a mechanical switch such as a relay on system board, it is not ideal enough. Thus, a
dedicated pin “INS” is used to perform card insertion and removal for SD/MMC. The pin “INS” will connect to the pin “VSS2”
of a SD/MMC connector.

HOST CARD

RPU 10-90 K
output enable

SW1 SW3

DATA3 OUT PAD PAD

RPD 470 Kohm

CD/DAT3 IN

SW2 RCDEN
output enable

Figure 3.9.2 Card Detection for SD/MMC Memory Card

LGE Internal Use Only - 43 - Copyright © 2012 LG Electronics. Inc. All right reserved.
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 3. TECHNICAL BRIEF

3.10 LCD Interface

LCD INTERFACE CONNECTOR

VIO

VBAT

R307 R308
DNI 100K

35
LCD_LED_CA1
34
FL300 LCD_LED_CA2 C305
33
1 9 LCD_LED_CA3 2.2u
LCD_WR INOUT_A1 INOUT_B1 32
2 8
LCD_RS INOUT_A2 INOUT_B2 31
3 7
LCD_CS INOUT_A3 INOUT_B3 30
4 6
INOUT_A4 INOUT_B4 29 R310
28 100K
LCD_VSYNC
G1
G2

27
LCD_RD
5
10

26
7.5pF
25

24
LCD_RESET
23

22

FL301 21
C322
20
1 9 1u
LCD_DATA07 INOUT_A1 INOUT_B1 19
2 8
LCD_DATA05 INOUT_A2 INOUT_B2 18
3 7
LCD_DATA03 INOUT_A3 INOUT_B3 17
4 6
LCD_DATA01 INOUT_A4 INOUT_B4 16
G1
G2

15

14
5
10

13
7.5pF
12

11
FL302 10

1 9 9
LCD_DATA06 INOUT_A1 INOUT_B1
2 8 8
VIO VIO
LCD_DATA04 INOUT_A2 INOUT_B2
3 7 7
LCD_DATA02 INOUT_A3 INOUT_B3
4 6 6
LCD_DATA00 INOUT_A4 INOUT_B4 R311 5
LCD_ID
G1
G2

100K 4
5
10

7.5pF 2

1 C308 C309
CN301
1u 1u

GP : LOW
LGIT : HIGH

Figure 3.10.1 LCD Interface

ILI9225 is a 262,144-color one-chip SoC driver for a-TFT liquid crystal display with resolution of 176RGBx220 dots,
comprising a 528-channel source driver, a 220-channel gate driver, 87120 bytes RAM for graphic data of 176RGBx220
dots, and power supply circuit.
ILI9225 can operate with low I/O interface power supply up to 1.65V, with an incorporated voltage follower circuit to
generate voltage levels for driving an LCD.
The ILI9225 also supports a function to display in 8 colors and a standby mode, allowing for precise power control by
software. These features make the ILI9225 an ideal LCD driver for medium or small size portable products such as digital
cellular phones or small PDA, where long battery life is a major concern.

LGE Internal Use Only - 44 - Copyright © 2012 LG Electronics. Inc. All right reserved.
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 3. TECHNICAL BRIEF

MINI_ABB For AGR Without Audio

No CCDS
VCAMD TORCH_3V3 VIB_3V3 VHP_MIC_2V0

LCD_LED_CA1
LCD_LED_CA2
LCD_LED_CA3
VUSB_LDO_4V9 VBAT
C240 C241 C242 C243
1u 1u 1u 1u

C244 C245
VUSB_CHG_IN
1u
1u
VIO
10
7
8
9

1
2
4
5
LED1
LED2
LED3
LED4

OUT1
OUT2
OUT3
OUT4

3 C250
VIN
25 23 1u
VBAT1 VBUS1
26 24
VBAT2 VBUS2
R226 47K
27 22
EXPDET D- MUIC_IO_M
21
U203 D+ MUIC_IO_P
R247 0 11 20 FB209 120
USB_DM USB1DM ID MUIC_ACC_ID
R248 0 12 19 R227
USB_DP USB1DP R2_2K
13 18 2.2K
UART_RX USB2DM CLDO
14
UART_TX USB2DP
15
AUDL
16
AUDR
R250 17
HOOK_DET MIC
PGND
GND1
GND2
INTB
SDA

32
SCL

470
DSS

C252
29
30
31

6
28
33

VUSB_LDO_4V9
R232 47K 10n

VIO

DSS : High--> Default UART

R233
2.2K

I2C_SDA1
I2C_SCL1
MUIC_INT

Figure 3.10.2 MINI ABB for LCD Backlight Source

The SNB1058A0RSMR is an integrated solution for backlighting(current sink type).

Address : 0x0D LED Conreol (LED _SET)

Data (7:0) Entity Access Function
1001 1111 Default setting
000x xxxx LED_ISET[2:0] R/W 000 : 2.5mA
~ 001 : 5mA
111x xxxx 010 : 10mA
011 : 15mA
100 : 20mA
101 : 25mA
110 : 30mA
111 : 30mA

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 3. TECHNICAL BRIEF

3.11 Battery Charger Interface / MUIC

MINI_ABB For AGR Without Audio

No CCDS
VCAMD TORCH_3V3 VIB_3V3 VHP_MIC_2V0

LCD_LED_CA1
LCD_LED_CA2
LCD_LED_CA3
VUSB_LDO_4V9 VBAT
C240 C241 C242 C243
1u 1u 1u 1u

C244 C245
VUSB_CHG_IN From External Source
1u
1u
(Wall Adaptor or Computer)
VIO
10
7
8
9

1
2
4
5
LED1
LED2
LED3
LED4

OUT1
OUT2
OUT3
OUT4

3 C250
VIN
25 23 1u
VBAT1 VBUS1
26 24
VBAT2 VBUS2
R226 47K
27 22
EXPDET D- MUIC_IO_M
21
U203 D+ MUIC_IO_P
R247 0 11 20 FB209 120
USB_DM USB1DM ID MUIC_ACC_ID
R248 0 12 19 R227
USB_DP USB1DP R2_2K
13 18 2.2K
UART_RX USB2DM CLDO
14
UART_TX USB2DP
15
AUDL
16
AUDR
R250 17
HOOK_DET MIC
PGND
GND1
GND2
INTB
SDA

32
SCL

470
DSS

C252
29
30
31

6
28
33

VUSB_LDO_4V9
R232 47K 10n

VIO

DSS : High--> Default UART

R233
2.2K

I2C_SDA1
I2C_SCL1
MUIC_INT

Figure 3.11.1 BATTERY CHARGER BLOCK

The McKinney is designed to interface the cell phone USB, and audio chips with external peripherals via a micro-USB
connector. The switch features impedance detection for identification of various accessories that are attached through
DP and DM of the micro-USB port. When an accessory is plugged into the micro-USB port, the switch uses a detection
mechanism to identify the accessory (see the State Machine for details). It will then switch to the appropriate channel—
data, audio, or USB.
The McKinney has an I2C interface for communication with the cell phone baseband or applicationsprocessor. An
interrupt is generated when anything plugged into the micro-USB is detected. Another interrupt is generated when the
device is unplugged.
The McKinney also provides a linear charger up to 1.1A charging current, 4 channel LED current drive(max 150mA) and 4
linear regulators.
If VBUS is higher than 4.0V and lower than 7.5V (programmable 6.0V ~ 7.5V through I2C) and 250mV higher than VBAT
then charger starts charging automatically. If VBAT is below 2.5V, McKinney starts pre-charge mode with 80mA charging
current until VBAT reaches 2.5V and switch to fast charge mode with soft start. When battery voltage approaches
programmed regulation voltage(4.2V default), CV charging mode starts with programmed regulation voltage. At CV
mode, if charging current reaches programmed full charge current, the device generates interrupt to notice charging full
condition and start charge off timer. If charger off timer is disabled, charger stays at CV mode until stopped by system
control.

LGE Internal Use Only - 46 - Copyright © 2012 LG Electronics. Inc. All right reserved.
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 3. TECHNICAL BRIEF

EXPDET USB LDO VBUS

Current Current
Sense Control

ISET
VICHG
Charging Full 2C Charge Full
IFULL current control VBAT
Control
GND VDD_SYS= Supply
GND (VBUS or VBAT)
Select

USB1DM 3.5V
USB2DM D-
AUDL 75µA Charger
USB1DP detection
USB2DP D+
AUDR
MIC 0.6V
ID

200kΩ 680Ω
SDA R2.2K
SCL
CONTROL ADC
INTB
DSS LDO CLDO
500kΩ
VIN
LED1
OUT1 LDO1 I control
LED2
OUT2 LDO2 I control
LED3
OUT3 LDO3 I control
LED4
LDO4 I control
OUT4

Figure 3.11.2 MINI ABB BLOCK DIAGRAM

LGE Internal Use Only - 47 - Copyright © 2012 LG Electronics. Inc. All right reserved.
Only for training and service purposes
 3. TECHNICAL BRIEF

3.12 Keypad Interface

KEYPAD INTERFACE

SW1 SW2
KB300 KB301

R301
KEY_ROW0
680
VA301
NUM 1 NUM 2 NUM 3 UP DOWN
KB302 KB303 KB304 KB305 KB306

R302
KEY_ROW2
680
VA302

NUM 4 NUM 5 NUM 6 LEFT RIGHT

KB308 KB309 KB310 KB311 KB312

R303
KEY_ROW3
680
VA304
NUM 7 NUM 8 NUM 9 OK
KB313 KB314 KB315 KB316

R316
KEY_ROW4
680
VA305

STAR NUM 0 SHARP SEND

KB317 KB318 KB319 KB320

R304
KEY_ROW1
680
VA306

VA307 VA309 VA310 VA308

VA311
R309

680
R305

R306

R317
680

680

680
R318

680
KEY_COL0

KEY_COL1

KEY_COL2

KEY_COL3

KEY_COL4

KEY_ROW4
END
VA314 SW300 1
KB307
3
4
END_KEY 5
VA303 HOT_KEY 6
7

KEY_COL4

VA315

Figure 3.12.1 MAIN KEY STRUCTURE

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Only for training and service purposes
 3. TECHNICAL BRIEF

The keypad can be divided into two parts: one is the keypad interface including 7 columns and 6 rows(A290 is using
5columns and 5rows) with one dedicated power-key, as shown in Figure 3.12.2; the other is the key detection block
which provides key pressed, key released and de-bounce mechanisms. Each time the key is pressed or released, i.e.
something different in the 6 x 7 matrix or power-key, the key detection block senses the change and recognizes if a
key has been pressed or released. Whenever the key status changes and is stable, a KEYPAD IRQ is issued. The MCU can
then read the key(s) pressed directly in KP_MEM1, KP_MEM2, KP_MEM3, and KP_MEM4 registers. To ensure that the key
pressed information is not missed, the status register in keypad is not read-cleared by APB read command. The status
register can only be changed by the key-pressed detection FSM.

(6x7 + one power-key) key matrix Dedicated for Power-key

COL0 COL1 COL2 COL3 COL4 COL5 COL6 PWR_KEY

ROW5
1 1 1 1 1 1 1 1

ROW4
1 1 1 1 1 1 1 1

ROW3
1 1 1 1 1 1 1 1

ROW2
1 1 1 1 1 1 1 1

ROW1
1 1 1 1 1 1 1 1

ROW0
1 1 1 1 1 1 1 1

Baseband
PMIC

PMIC integrated BB chip

Figure 3.12.2 6x7 matrix with one power-key

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 3. TECHNICAL BRIEF

This keypad can detect one or two key-pressed simultaneously with any combination. Figure 3.12.3 shows one key
pressed condition. Figure 3.12.4(a) and Figure 3.12.4(b) illustrate two keys pressed cases. Since the key press detection
depends on the HIGH or LOW level of the external keypad interface, if keys are pressed at the same time and there exists
a key that is on the same column and the same row with the other keys, the pressed key cannot be correctly decoded.
For example, if there are three key presses: key1 = (x1, y1), key2 = (x2, y2), and key3 = (x1, y2), then both key3 and key4
= (x2, y1) are detected, and therefore they cannot be distinguished correctly. Hence, the keypad can detect only one or
two keys pressed simultaneously at any combination. More than two keys pressed simultaneously in a specific pattern
retrieve the wrong information.

Figure 3.12.3 One key pressed with de-bounce mechanism denoted

Figure 3.12.4 Two keys pressed, case 1 (b) Two keys pressed, case 2

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 3. TECHNICAL BRIEF

3.13 Audio Front-End

3.13.1 General Description

The audio front-end essentially consists of voice and audio data paths. Figure 3.13.1 shows the block diagram of the
audio front-end. All voice band data paths comply with the GSM 03.50 specification. Mono hands-free audio or external
FM radio playback paths are also provided. The audio stereo path facilitates CD-quality playback, external FM radio, and
voice playback through a headset.

Figure 3.13.1 Block diagram of audio front end

Figure 3.13.2 shows the digital circuits block diagram of the audio front-end. The APB register block is an APB peripheral
that stores settings from the MCU. The DSP audio port (DAP) block interfaces with the DSP for control and data
communications. The digital filter block performs filter operations for voice band and audio band signal processing.
The Digital Audio Interface (DAI) block communicates with the System Simulator for FTA or external Bluetooth modules.

LGE Internal Use Only - 51 - Copyright © 2012 LG Electronics. Inc. All right reserved.
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 3. TECHNICAL BRIEF

Figure 3.13.2 Block diagram of digital circuit of audio front end

To communicate with the external Bluetooth module, the master-mode PCM interface and master-mode I2S/EIAJ
interface are supported. The clock of PCM interface is 256 kHz while the frame sync is 8 kHz. Both long sync and short
sync interfaces are supported. The PCM interface can transmit 16-bit stereo or 32-bit mono 8 kHz sampling rate voice
signal. Figure 3.13.3 shows the timing diagram of the PCM interface. Note that the serial data changes when the clock is
rising and is latched when the clock is falling.

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 3. TECHNICAL BRIEF

Figure 3.13.3 Timing diagram of Bluetooth application

I2S/EIAJ interface is designed to transmit high quality audio data. Figure 3.13.4 and Figure 3.13.5 illustrate the timing
diagram of the two types of interfaces. I2S/EIAJ can support 32 kHz, 44.1 kHz, and 48 kHz sampling rate audio signals. The
clock frequency of I2S/EIAJ can be 32×(sampling frequency), or 64×(sampling frequency). For example, to transmit a 44.1
kHz CD-quality music, the clock frequency should be 32 × 44.1 kHz = 1.4112 MHz or 64 × 44.1 kHz = 2.8224 MHz.

I2S/EIAJ interface is not only used for Bluetooth module, but also for external DAC components. Audio data can easily
be sent to the external DAC through the I2S/EIAJ interface. In this document, the I2S/EIAJ interface is referred to as EDI
(External DAC Interface).

Figure 3.13.4 Block diagram of digital circuit of audio front end

Figure 3.13.5 Block diagram of digital circuit of audio front end

LGE Internal Use Only - 53 - Copyright © 2012 LG Electronics. Inc. All right reserved.
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 3. TECHNICAL BRIEF

MIC Signal
Audio Signal
Speech Signal
Audio + Speech Signal
TI MINI
ABB
(I2C IF)
HOOK DETECT EAN62227701

MAIN_MIC_P/N
AU_IN1_P/N
(Differential Input)
HS_MIC_P/N
AU_IN0_P/N
(Differential Input)

JACK DETECT
MT6253 3.5Ø
HS SOUND R/L
AU_MOUTR/L SOUND R/L HS MP3/MID R/L Conn
DSP (Single ended Output) Audio Sub HS FM Radio

AU_OUT0_P/N System HS SPEECH P/N

(Differential Output)
HS SPEECH P/N (I2C IF)
SPEECH P/N
FM Recording(AMR type)
SPK PHONE P/N TPA2055P3

AU_FMINR/L
SPK1_P/N NA

SOUND R/L
BT SPEECH FM Radio R/L
BT SOUND PLAY SPEECH P/N
SPK PHONE P/N

SPEECH N/P
MT6626 This path is changeable. It will be fixed after REV.B RCV/SPK
BT + FM Radio
(PCM, UART +I2C IF)

Figure 3.13.6 A290 Audio Block Diagram

LGE Internal Use Only - 54 - Copyright © 2012 LG Electronics. Inc. All right reserved.
Only for training and service purposes
 3. TECHNICAL BRIEF

3.14 Camera Interface

EMI FILTER
CAM CONN
7.5pF
10
5

VCAMD
G2
G1

VCAMA
CAM_DATA00 6
INOUT_B4 INOUT_A4
4
CAM_F_DATA[0]
CAM_DATA01 7
INOUT_B3 INOUT_A3
3
CAM_F_DATA[1]
CAM_DATA02 8
INOUT_B2 INOUT_A2
2
CAM_F_DATA[2]
CAM_DATA03 9
INOUT_B1 INOUT_A1
1
CAM_F_DATA[3]
FL303

FB300
7.5pF CN302
1 24 75
10
5
G2
G1

2 23

CAM_DATA04 6
INOUT_B4 INOUT_A4
4
CAM_F_DATA[4] CAM_F_DATA[7] I2C_SCL1
CAM_DATA05 7
INOUT_B3 INOUT_A3
3
CAM_F_DATA[5] 3 22

CAM_DATA06 8
INOUT_B2 INOUT_A2
2
CAM_F_DATA[6] CAM_F_DATA[6] I2C_SDA1
CAM_DATA07 9
INOUT_B1 INOUT_A1
1
CAM_F_DATA[7] 4 21
CAM_F_DATA[5]
FL304
5 20
CAM_F_DATA[4] CAM_VSYNC
6 19
R314
CAM_MCLK CAM_F_MCLK CAM_F_DATA[3] CAM_HSYNC
10
7 18

C311 C312
CAM_F_DATA[2] CAM_F_MCLK
8 17
DNI 7.5p
CAM_F_DATA[1]
9 16
CAM_F_DATA[0]
10 15

R315 CAM_F_PCLK
CAM_PCLK CAM_F_PCLK 11 14
10
CAM_RESET
C313 C314 12 13

7.5p DNI CAM_PD C315 C316 C317

(DIF_D8) VA312 VA313 1u 1u 1u
ENBY0034201
DNI DNI GB042-24S-H10-E3000

YACC6A1S is a high quality 1.3mega-pixel single chip CMOS image sensor for mobile phone camera applications and
digital still camera products.
YACC6A1S incorporates a 1324 x 1084 pixel array, on chip 10-bit ADC, and an image signal processor. Unique sensor
technology enhances image quality by reducing FPN (Fixed Pattern Noise), horizontal/vertical line noise, and random
noise.

VSYNC, HSYNC, D[7:0], PCLM, STRDBE

RESETB SD
CHP_ Image Signal
ENABLE Processor SC
ROW Decoder

Pixel Array
ADC /AGC

(1324 X 1084)

MCLK
PLL Column Decoder

Figure 3.14.1 Camera Sensor Block Diagram

LGE Internal Use Only - 55 - Copyright © 2012 LG Electronics. Inc. All right reserved.
Only for training and service purposes
 3. TECHNICAL BRIEF

3.14.1 FEATURES
• Pixel Size: 1.75um X 1.75um • Sub-Sample : 1/2, 1/4 (VGA, QVGA)
• Active Image Size : 2.296mm (H) X 1.848mm (V) • Image Scaling : 1x ~ 1/64x
• Resolution : 1,280 H X 1,024 V • Image Flip : X/Y Flip
• Color Filter : RGB Bayer • Auto Exposure
• Optical Format : 1/6 inch • Auto White Balance
• Anti-Flicker(50Hz / 60Hz) : Auto/Manual
• Frame Rate : 20fps@SXGA, 30fps@720P, 40fps@VGA
• Noise Reduction
• Power Supply : 2.8V / 1.8V
• Black Level Calibration
• Power Consumption : TBD @ 15fps, SXGA
• Stobe Control : Support Xenon / LED Type
• ADC : 10bit
• On-Chip Dead Pixel Correction
• PLL : On Chip
• Edge Enhancement
• Operation Temperature : -20 ~ 60 ºC • Brightness
• Master Clock : 48MHZ(Max) • Color Saturation
• Host Interface : two-wire serial bus interface • Gamma Correction
• Windowing : Programmable • Color Correction
• Output Format : YUV4:2:2, RGB5:6:5, ITU656-like • Lens Shading Correction
• Image Effect : M
 ono, Sepia, Solarization, Negative,
Sketch, Embossing

Figure 3.14.2 Camera Sensor features

[Table 1. DC Characteristics]
Item Symbol Min Typ Max Unit Note
Digital Core Circuit Power Supply Voltage VDD:D 1.7 1.8 1.9 V
Analog Circuit Power Supply Voltagey VDD:A 2.7 2.8 3.0 V
Analog Pixel Circuit Power Supply Voltagey VDD:P 2.7 2.8 3.0 V
Digital I/O Circuit Power Supply Voltagey VDD:I 1.7 1.8/2.8 3.0 V
H level Input Voltage VIH 0.7*VDD:I V
L level Input Voltage VIL 0.3*VDD:I V
Output High Current (VDD:I=2.8V, VOH=2.4V) IOH 4.2 mA 1
Output High Current (VDD:I=1.8V, VOH=1.4V) IOH 3.0 mA 1
Output Low Current (VDD:I=2.8V, VOH=0.4V) IOL 4.8 mA 1
Output Low Current (VDD:I=1.8V, VOH=0.4V) IOL 3.8 mA 1
Note1) User can control the amount of current by controlling bit[7:3] of PWRCTL[0x01:P0].
Above valuse are ouput current when bit[7:3] of PWRCTL[0x01:P0] is 5’b01010.
Figure 3.14.3 Camera Sensor DC charicteristics

LGE Internal Use Only - 56 - Copyright © 2012 LG Electronics. Inc. All right reserved.
Only for training and service purposes
 3. TECHNICAL BRIEF

3.15 KEY BACLKLIGHT LED Interface

Key Backlight LED is controlled by KEYPAD_LED signal of MT6253.
The built-in open drain output switch drives the Keypad LED in the handset. This switch is controlled by baseband with
the enable register. The keypad LED can sink 150mA and will become high impedance as disabled.

KEY BACKLIGHT

VBAT

C300
C301
1u
1u

LD300 LD301 LD302 LD303 LD304 LD305

19-217_BHC-ZM1N2QY_3T
EDLH0015101
BLUE LED

KEYPAD_LED
C319
1u

Figure 3.15.1 Key Backlight Block

LGE Internal Use Only - 57 - Copyright © 2012 LG Electronics. Inc. All right reserved.
Only for training and service purposes
 3. TECHNICAL BRIEF

3.16 Vibrator Interface

Vibrator is driven by MINI ABB LDO source.
VIB_3V3 is connected with + terminal of vibrator and – terminal is connected with GND. It is controlled by source of MINI
ABB(only ON/OFF function).
MINI ABB is controlled by I2C IF of MT6253.

VIBRATOR
VIB_3V3

R312 0 VB300
1

C306 C307
VA300
33p 1u

DNI

Figure 3.16.1 Vibrator Driver Block

LGE Internal Use Only - 58 - Copyright © 2012 LG Electronics. Inc. All right reserved.
Only for training and service purposes
 3. TECHNICAL BRIEF

3.17 Torch LED Interface

Torch LED is driven by MINI ABB LDO source.
TORCH_3V3 is connected p-channel of LED.It is controlled by source of MINI ABB(only ON/OFF function).
MINI ABB is controlled by I2C IF of MT6253.

TORCH
TORCH_3V3
R313

15

C310
4
3
2

1u
LD306
1

Figure 3.17.1 Torch Driver Block

LGE Internal Use Only - 59 - Copyright © 2012 LG Electronics. Inc. All right reserved.
Only for training and service purposes
 4. TROUBLE SHOOTING

4. TROUBLE SHOOTING

4.1 RF Component

U100

U202
U401

U101
X100

U400

Memory(256NOR/648pSDRAM)
U100
PF38F4050M0Y3DF
U101 Main Chip (MT6253)
U401 BT/FM combo chip (MT6626)
U400 TX Module (SKY77550)
X100 Crystal, 26MHz Clock
U202 SIM Switch(MT6306)

LGE Internal Use Only - 60 - Copyright © 2012 LG Electronics. Inc. All right reserved.
Only for training and service purposes
 4. TROUBLE SHOOTING

4.2 RX Trouble

START

HP8960 : Test mode

62 CH, 7 level setting (TCH)
62 CH, -60 dBm setting (BCCH)
Spectrum analyzer setting
Oscilloscope setting

Check
Crystal Circuit

Check
Mobile SW , TX
module
And Rx Circuit

Re-download SW and
Do calibration again

LGE Internal Use Only - 61 - Copyright © 2012 LG Electronics. Inc. All right reserved.
Only for training and service purposes
 4. TROUBLE SHOOTING

(1) Checking Crystal Circuit

No
26 MHz O.K? Replace TP1

TP1(X100) Yes
X100 1 pin : 26MHz
Crystal is OK.
See next page to check PLL Circuit

Figure 4.2.1

J31
RFVCO_MT
M32
BT_CLK_26M FREF
C109 4.7u H6
AU_VCM
Y6
PWM
TSX-3225 26MHZ_7_4PF
26MHz K34
2 1 XTAL1
L33
3 4 XTAL2_GND
X100
V4
AVDD_RTC
T4

TP1

LGE Internal Use Only - 62 - Copyright © 2012 LG Electronics. Inc. All right reserved.
Only for training and service purposes
 4. TROUBLE SHOOTING

(2) Checking Mobile SW &Tx module

TP2
FL400
FL401

TP5

TP4
U400
TP6
SW400
TP3

TP1

Figure 4.2.2

TP4
VLOGIC
C400

DNI
TP6
R402 C401 33p
HB_TX
51
RF_ANT_SW1

TP5
C403 33p
C402
LB_TX
GND400 ANT400
14
13

12

11

10

TP3
9

DNI
RSVD2
RSVD1

BS

VSW_EN

Tx_HB_IN

Tx_LB_IN

GND8
15
R407 10K
RF_TX_RAMP VRAMP GND6
16 8
GND5 VBAT
7
PA_EN TxEN GND4
17 6
U400 GND3
R409 C407 5
C406 RSVD
18
24K 220p VBATT2
4
DNI Rx1 VBATT1
19 3

TP4 TP2
RSVD3 GND2 C410 C408 C409
20 2
GND1 1u
1 10u 56p
C405 Rx2
21
100p
GND13
GND12
GND11

GND10
GND9
PGND

GND7
ANT

22
(10V,2125) (50V,C,NPO) (50V,C,NP0)
SW400
23
24
25

26

27
28
29

C411 C412 L400

2
ANT COMMON
1
100p 2.4n
G3 G4 100p
C413 3 4
L411
27n C415 C416
DNI
0.5p DNI

C417 18p
GSM850_RxP

L401
FL400 B9512 22n
1 IN O1_1 9
C418 18p
GSM850_RxN
O1_2 8 C419 18p
EGSM_RxP
O2_1 7
L402
9.1n 4 GND O2_2 6 L403
C_G1
C_G2
C_G3
C_G4

22n
2 3 5 10
C420 18p
EGSM_RxN
C421 5.6p
DCS_RxN

FL401 B9513 L404

1 IN O1_1 9 4.7n

O1_2 8
C422 5.6p
DCS_RxP
O2_1 7
C423 6.8p
PCS_RxN
L405 4 G1 O2_2 6

4.3n L406
G2
G3
G4
G5

2 3 5 10
5.6n

C424 6.8p
PCS_RxP

LGE Internal Use Only - 63 - Copyright © 2012 LG Electronics. Inc. All right reserved.
Only for training and service purposes
 4. TROUBLE SHOOTING

START

TP1 & No Replace Mobile SW

TP2 is Short ? (SW100)

Yes

Check No
TP3(Vbat) of U400 Replace U400
?

Yes

Check No
Check Main Chip (MT6253)
TP4~TP6 ?

Yes

Check No
FL400 & FL401? Replace FL400 or FL401

Yes

Re-download SW and
Do calibration again

TP4 TP5 TP6

MODE RF_VLOGIC RF_TX_EN RF_BS
Stanby LOW LOW LOW
RX1 HIGH LOW LOW
RX2 HIGH LOW HIGH
TX_LB HIGH HIGH LOW
TX_HB HIGH HIGH HIGH

LGE Internal Use Only - 64 - Copyright © 2012 LG Electronics. Inc. All right reserved.
Only for training and service purposes
 4. TROUBLE SHOOTING

4.3 TX Trouble

START

HP8960 : Test mode

62 CH, 7 level setting (TCH)
62CH, -60dBm setting (BCCH)
Spectrum analyzer setting
Oscilloscope setting

(1)Check
Crystal Circuit

(2)
Check
Mobile SW &Tx
module

(3)
Check PLL Control

Redownload SW or
Do calibration again

LGE Internal Use Only - 65 - Copyright © 2012 LG Electronics. Inc. All right reserved.
Only for training and service purposes
 4. TROUBLE SHOOTING

(1) Checking Crystal Circuit

26 MHz No Replace TP1

O.K?

TP1(X100) Yes
X100 1 pin : 26MHz
Crystal is OK.
See next page to check PLL Circuit

Figure 4.2.1

J31
RFVCO_MT
M32
BT_CLK_26M FREF
C109 4.7u H6
AU_VCM
Y6
PWM
TSX-3225 26MHZ_7_4PF
26MHz K34
2 1 XTAL1
L33
3 4 XTAL2_GND
X100
V4
AVDD_RTC
T4

TP1

LGE Internal Use Only - 66 - Copyright © 2012 LG Electronics. Inc. All right reserved.
Only for training and service purposes
 4. TROUBLE SHOOTING

(2) Checking Mobile SW &Tx module

TP2

TP5
TP7

TP4
U400
TP6

TP3
SW400

TP1

Figure 4.2.2

TP4
VLOGIC
C400

DNI
TP6
R402 C401 33p
HB_TX
51
RF_ANT_SW1

TP7
C403 33p
C402
LB_TX
GND400 ANT400
14
13

12

11

10

DNI

TP3
RSVD2
RSVD1

BS

VSW_EN

Tx_HB_IN

Tx_LB_IN

GND8
15
R407 10K
RF_TX_RAMP VRAMP GND6
16 8
GND5 VBAT
7
PA_EN TxEN GND4

TP5
17 6
U400 GND3
R409 C407 5
C406 RSVD
18
24K 220p VBATT2
4
DNI Rx1 VBATT1
19 3

TP4 TP2
RSVD3 GND2 C410 C408 C409
20 2
GND1 1u
1 10u 56p
C405 Rx2
21

VLO
100p
GND13
GND12
GND11

GND10
GND9
PGND

GND7
ANT

22
(10V,2125) (50V,C,NPO) (50V,C,NP0)

GIC
SW400
23
24
25

26

27
28
29

C411 C412 L400

2
ANT COMMON
1
100p 2.4n

TX_E
G3 G4 100p
C413 3 4
L411

N
27n C415 C416
DNI
0.5p DNI

FL400 B9512
C417 18p

L401
GSM850_RxP
BS
Vram
22n
1 IN O1_1 9
C418 18p

p
GSM850_RxN
O1_2 8 C419 18p
EGSM_RxP
O2_1 7
L402
9.1n 4 GND O2_2 6 L403
C_G1
C_G2
C_G3
C_G4

22n
2 3 5 10
C420 18p
EGSM_RxN
C421 5.6p
DCS_RxN

FL401 B9513 L404

1 IN O1_1 9 4.7n

O1_2 8
C422 5.6p
DCS_RxP
O2_1 7
C423 6.8p
PCS_RxN
L405 4 G1 O2_2 6

4.3n L406
G2
G3
G4
G5

2 3 5 10
5.6n

C424 6.8p
PCS_RxP

LGE Internal Use Only - 67 - Copyright © 2012 LG Electronics. Inc. All right reserved.
Only for training and service purposes
 4. TROUBLE SHOOTING

START

TP1 & No Replace Mobile SW

TP2 is Short ? (SW100)

Yes

Check No
TP3(Vbat) of U400 Replace U400
?

Yes

Check No
TP4~TP6 ? Check Main Chip (MT6253)

Yes

Check No Check Main Chip (MT6253)

TP7 ? & circuit

Yes

Re-download SW and
Do calibration again

TP4 TP5 TP6

MODE RF_VLOGIC RF_TX_EN RF_BS
Stanby LOW LOW LOW
RX1 HIGH LOW LOW
RX2 HIGH LOW HIGH
TX_LB HIGH HIGH LOW
TX_HB HIGH HIGH HIGH

LGE Internal Use Only - 68 - Copyright © 2012 LG Electronics. Inc. All right reserved.
Only for training and service purposes
 4. TROUBLE SHOOTING

4.4 Power On Trouble

VCORE_PMU (TP2)
VA(TP5)
VM(TP6)
U101
VIO(TP7)
VRF(TP4) VSIM1(TP11)
VHP_1V8 VSIM2(TP12)
(TP9)
VTCXO VUSB(TP10)
(TP3) VCAMA(TP8)

Figure 4.4.1

VSIM/VSIM2 U101
VBL_OUT
PWRKEY
RESETB
BAT_ON

ISINK1
SCLK1

SRST2
SCLK2
SIO2

VBT
LED
B10
D12
C11

P4
P2
C9

J1
K2
L3
L5
R116

1K
SIM1_CLK
SIM2_DATA
SIM2_RST
SIM2_CLK

KEYPAD_LED

TP1
SYS_RESET
END_KEY

BAT_TEMP

Figure 4.4.3 Remote power on

LGE Internal Use Only - 69 - Copyright © 2012 LG Electronics. Inc. All right reserved.
Only for training and service purposes
 4. TROUBLE SHOOTING

AK8
JTMS
AM6
JTDI
AJ9 VHP_1V8
JTCK
AL7
JTRST_B
AP6 VCORE_PMU VTCXO VRF VA VM VIO VCAMA VUSB VSIM1 VSIM2
JRTCK
AL5
JTDO
L100 2.2u TP2
N1
VCORE1
R5
VCORE1_FB
D22 TP3
VTCXO
B22
TP4
VRF
A21
TP5
VA
B20 TP6
VM
C19
VIBRATOR
B18 TP7
VIO
C21
TP8
VCAMA
C17 TP9
VCAMD
D16
TP10
VUSB
A17
TP11
VSIM
B16 TP12
VSIM2
B14
VREF
A13
BAT_BACKUP
C123
C124 C125 C126 C127 C128 C129 C130 C131 C132 C133 C134
1u
C135 10u 1u 1u 4.7u 1u 1u 1u 1u 1u 1u 1u
0.1u

Figure 4.4.4 Power Block of LG-A290

LGE Internal Use Only - 70 - Copyright © 2012 LG Electronics. Inc. All right reserved.
Only for training and service purposes
 4. TROUBLE SHOOTING

START

Check No
Battery Voltage Charge or Change Battery
> 3.35V

Yes

Push
power-on key No Check the contact of power key
And check the level change Or dome-switch
into high of POWERKEY

Yes

Check
the voltage of No
Replace U101 (MT6253)
The LDO outputs at U101

VCORE_PMU = 1.2V, VTCXO = 2.8V. VRF = 2.8V, VA =

2.8V, VM = 1.8V, VIO = 2.8V, VCAMA = 2.8V, VUSB =
Yes 3.3V, VSIM1 = 3.0V, VSIM2 = 3.0V, VHP_1V8=1.8V

Logic
No
level at RPWRON of R116
= HIGH(above 1.2V)? Re-download software

Yes

Is No
Replace U101 and
the phone power on?
Re-download software

Yes
Does it
work properly?

No
The phone will
Properly operating. Replace the main board

LGE Internal Use Only - 71 - Copyright © 2012 LG Electronics. Inc. All right reserved.
Only for training and service purposes
 4. TROUBLE SHOOTING

CN201
VUSB_CHG_IN (TP3)

VBAT(TP2)
VUSB_LDO_4V9 (TP1)
VIO(TP4)

U203

Figure 4.5.1

MINI_ABB For AGR Without Audio

No CCDS
VCAMD TORCH_3V3 VIB_3V3 VHP_MIC_2V0
LCD_LED_CA1
LCD_LED_CA2
LCD_LED_CA3

VUSB_LDO_4V9 VBAT
C240 C241 C242 C243
1u 1u 1u 1u

TP1 TP2
C244 C245
VUSB_CHG_IN
1u
1u
VIO
TP3
10
7
8
9

1
2
4
5
LED1
LED2
LED3
LED4

OUT1
OUT2
OUT3
OUT4

3 C250
VIN
25 23 1u
VBAT1 VBUS1
26 24
VBAT2 VBUS2
R226 47K
27 22
EXPDET D- MUIC_IO_M
21
U203 D+ MUIC_IO_P
R247 0 11 20 FB209 120
USB_DM USB1DM ID MUIC_ACC_ID
R248 0 12 19 R227
USB_DP USB1DP R2_2K
13 18 2.2K
UART_RX USB2DM CLDO
14
UART_TX USB2DP
15
AUDL
16
AUDR
R250 17
HOOK_DET MIC
PGND
GND1
GND2
INTB
SDA

32
SCL

470
DSS

C252
29
30
31

6
28
33

VUSB_LDO_4V9
R232 47K 10n

VIO

DSS : High--> Default UART

R233
2.2K

TP4I2C_SDA1
I2C_SCL1
MUIC_INT

Figure 4.5.2

LGE Internal Use Only - 72 - Copyright © 2012 LG Electronics. Inc. All right reserved.
Only for training and service purposes
 4. TROUBLE SHOOTING

START

Change the battery

No

Yes
Battery is charged? Charging is properly operating

Yes

Is I/O Connector(CN201) No Resolder the CN201

well-soldered ? (Pin 1 : VUSB_CHG_IN)

Yes

Check the voltage at No The TA is out of order

TP3 = 3.5V~6.7V ? Change the TA

Yes

Is the voltage No
at TP4 = 2.8V Replace the U101

Yes

Is the voltage No Replace the

at TP1= 4.9V U203

Yes

Is the voltage No Replace the

at TP2= 4.2V U203

Yes

No
Battery is charged? Replace the main board

Yes

Charging is properly operating

LGE Internal Use Only - 73 - Copyright © 2012 LG Electronics. Inc. All right reserved.
Only for training and service purposes
 4. TROUBLE SHOOTING

4.6 Vibrator Trouble

U203

VIB_3V3(TP1)
VIB_3V3(TP1)

Figure 4.6.1

For AGR Without Audio

o CCDS
VCAMD TORCH_3V3 VIB_3V3 VHP_MIC_2V0
VIBRATOR
TP1
VIB_3V3
LCD_LED_CA1
LCD_LED_CA2
LCD_LED_CA3

C240 C241 C242 C243

1u 1u 1u 1u

C245 R312 0 VB300

VUSB_CHG_IN
1u 1
10
7
8
9

1
2
4
5

2
LED1
LED2
LED3
LED4

OUT1
OUT2
OUT3
OUT4

3
VIN
U203 C250
C306 C307
25 23 1u VA300
26
VBAT1 VBUS1
24 33p 1u
VBAT2 VBUS2

27 22
MUIC_IO_M
DNI
EXPDET D-
21
U203 D+ MUIC_IO_P
11 20 FB209 120
USB1DM ID MUIC_ACC_ID
12 19 R227
13
USB1DP R2_2K
Figure
18 4.6.2 2.2K Figure 4.6.3
USB2DM CLDO
14
USB2DP
15
AUDL
16
AUDR
250 17
MIC
PGND
GND1
GND2
INTB

LGE Internal Use Only - 74 - Copyright © 2012 LG Electronics. Inc. All right reserved.
SDA

32
SCL

70
DSS
Only for training and service purposes
C252
29
30
31

6
28
33

232 47K 10n

 4. TROUBLE SHOOTING

SETTING : Enter the engineering mode, and set vibrator on at vibration of BB test menu

START

Check the soldering No Resolder the Pad

of vibrator(VB300) ? (VB300).

Yes

Is the voltage at TP1 No

Replace the U203
3.3V?

Yes

Replace vibrator

Yes

Vibrator
Working well !

LGE Internal Use Only - 75 - Copyright © 2012 LG Electronics. Inc. All right reserved.
Only for training and service purposes
 4. TROUBLE SHOOTING

4.7 LCD Trouble

CN301

VBAT(TP1)

VBAT(TP1) FL302

FL300
FL301
LCD_WR(TP2)

LCD_RS(TP3)
LCD_CS(TP4)

Figure 4.7.1

LCD INTERFACE CONNECTOR

VIO

TP1
VBAT

R307
DNI
R308
100K
CN301
FL300
FL300 LCD_LED_CA1
LCD_LED_CA2 34
35

33
C305
1 9 LCD_LED_CA3 2.2u
LCD_WR INOUT_A1 INOUT_B1 32
2 8
LCD_RS INOUT_A2 INOUT_B2 31
3 7
LCD_CS INOUT_A3 INOUT_B3 30
4 6
INOUT_A4 INOUT_B4 29 R310
28 100K
LCD_VSYNC
G1
G2

27
LCD_RD
5
10

26
7.5pF
25

24
LCD_RESET

FL301
23

22

FL301 21
C322
20
1 9 1u
LCD_DATA07 INOUT_A1 INOUT_B1 19
2 8
LCD_DATA05 INOUT_A2 INOUT_B2 18
3 7
LCD_DATA03 INOUT_A3 INOUT_B3 17
4 6
LCD_DATA01 INOUT_A4 INOUT_B4 16
G1
G2

15

14
5
10

13
7.5pF

FL302
12

11
FL302 10

1 9 9
LCD_DATA06 INOUT_A1 INOUT_B1
2 8 8
VIO VIO
LCD_DATA04 INOUT_A2 INOUT_B2
3 7 7
LCD_DATA02 INOUT_A3 INOUT_B3
4 6 6
LCD_DATA00 INOUT_A4 INOUT_B4 R311 5
LCD_ID
G1
G2

100K 4
5
10

7.5pF 2

1 C308 C309
CN301
1u 1u

GP : LOW
LGIT : HIGH

Figure 4.7.2

LGE Internal Use Only - 76 - Copyright © 2012 LG Electronics. Inc. All right reserved.
Only for training and service purposes
 4. TROUBLE SHOOTING

LGE Internal Use Only - 77 - Copyright © 2012 LG Electronics. Inc. All right reserved.
Only for training and service purposes
 4. TROUBLE SHOOTING

START

Is the connection of No
Reassemble LCD connector
CN301 with LCD connector ok ?

Yes

Check the Voltage Level of No

TP1 is about Battery voltage ? Resoldering or Replace U203
(SWIF signal is high Level)

Yes

Check the Waveform of No Resoldering EMI filter.

EMI filter ? FL300(TP2,TP3,TP4), FL301, FL302

Yes

Does LCD work No

properly ? Replace LCD module

Yes

LCD working
well !

LGE Internal Use Only - 78 - Copyright © 2012 LG Electronics. Inc. All right reserved.
Only for training and service purposes
 4. TROUBLE SHOOTING

4.8 Camera Trouble

CN302 VCAMA(TP1)
VCAMD(TP2)

FL303 FL304

Figure 4.8.1

I2C_SDA1(TP5)

I2C_SCL1(TP6)
U101

Figure 4.8.2

LGE Internal Use Only - 79 - Copyright © 2012 LG Electronics. Inc. All right reserved.
Only for training and service purposes
 4. TROUBLE SHOOTING

EMI FILTER
CAM CONN
7.5pF TP3
10
5

VCAMD
G2
G1

VCAMA
CAM_DATA00 6
INOUT_B4 INOUT_A4
4
CAM_F_DATA[0]
CAM_DATA01 7
INOUT_B3 INOUT_A3
3
CAM_F_DATA[1]
CAM_DATA02 INOUT_B2 INOUT_A2 CAM_F_DATA[2]
TP1
8 2
CAM_DATA03 9
INOUT_B1 INOUT_A1
1
CAM_F_DATA[3]
FL303

CN302
7.5pF TP4 1
CN302
24
FB300
75
10
5
G2
G1

2 23

CAM_DATA04 6
INOUT_B4 INOUT_A4
4
CAM_F_DATA[4] CAM_F_DATA[7] I2C_SCL1
CAM_DATA05 7
INOUT_B3 INOUT_A3
3
CAM_F_DATA[5] 3 22

CAM_DATA06 8
INOUT_B2 INOUT_A2
2
CAM_F_DATA[6] CAM_F_DATA[6] I2C_SDA1
CAM_DATA07 9
INOUT_B1 INOUT_A1
1
CAM_F_DATA[7] 4 21
CAM_F_DATA[5]
FL304
5 20
CAM_F_DATA[4] CAM_VSYNC
6 19
R314
CAM_MCLK CAM_F_MCLK CAM_F_DATA[3] CAM_HSYNC
10
7 18

C311 C312
CAM_F_DATA[2] CAM_F_MCLK
8 17
DNI 7.5p
CAM_F_DATA[1]
9 16
CAM_F_DATA[0]
10 15

R315 CAM_F_PCLK
CAM_PCLK
10
CAM_F_PCLK
CAM_RESET
11 14
TP2
C313 C314 12 13

7.5p DNI CAM_PD C315 C316 C317

(DIF_D8) VA312 VA313 1u 1u 1u
ENBY0034201
DNI DNI GB042-24S-H10-E3000

U101

AB2
KROW4_GPIO9 KEY_ROW4 VIO
AC3
KROW3_GPIO10 KEY_ROW3
AD6
KROW2_GPIO11 KEY_ROW2
AD2
KROW1_GPIO12 KEY_ROW1
AE3
KROW0_GPIO13 KEY_ROW0 R106 R107
AM4 TP5
UTXD1 UART_TX 2.2K 2.2K
AJ7 TP6
URXD1 UART_RX
T32
URTS1_B_GPIO25 I2C_SDA1
V30
UCTS1_B_GPIO24 I2C_SCL1
AN3

LGE Internal Use Only - 80 - Copyright © 2012 LG Electronics. Inc. All right reserved.
Only for training and service purposes
 4. TROUBLE SHOOTING

CAM_MCLK

CAM_RESET

I2C_DATA CAM_MCLK
26MHz

Graph 4.8.1. I2C Data Waveform Graph 4.8.2. MCLK Waveform

CAM_HSYNC
CAM_VSYNC

CAM_HSYNC
CAM_PCLK
26MHz

Graph 4.8.3.CAM_VSYNC vs. Graph 4.8.4.CAM_HSYNC vs.

CAM_HSYNC Waveform CAM_PCLK Waveform

LGE Internal Use Only - 81 - Copyright © 2012 LG Electronics. Inc. All right reserved.
Only for training and service purposes
 4. TROUBLE SHOOTING

START

Is the connection of CN302 No Reassemble camera connector

with Camera ok ? with camera.

Yes

Check
the each voltage Level of No Resoldering or
TP1(2.8V), TP2(1.8V), Replace U101(If TP1 is not 2.8V),
is right ? U203(If TP2 is not 1.8v)

Yes

Check the Waveform of No

I2C_CLK1, I2C_DATA1 ? Resoldering TP5, TP6

Yes

Check the Waveform of No

Change the board
CAM_MCLK(13MHz) ?

Yes

Check the Waveform of No

Replace Camera Module.
Data pins on CN302 ?

Yes

Check the Waveform of No Resoldering EMI filter.

EMI filter ? (TP3, TP4)

Yes

Does Camera work No Replace U101 or

properly ? Change the board

Yes

Camera working well !

LGE Internal Use Only - 82 - Copyright © 2012 LG Electronics. Inc. All right reserved.
Only for training and service purposes
 4. TROUBLE SHOOTING

4.9 Speaker/ Receiver Trouble

TP4

TP1
U200 U101
TP3
TP2

SPEAKER PAD
(CN200)

Figure 4.9.1

AUDIO SUBSYSTEM VBAT

5-1-2-6_TPA2055D3/R_MTK&IFX_Dual_Ver0.1
VHP_1V8
C200 C201
2.2u 0.1u

Place 0.1uF close to AMP

TP2 2.2u C203

TP1 CN200
TP3
D2

D4

DNI C264
CN200
HPVDD

SPVDD

1
R206 12 C4 E3 FB201
SPEECH_N C3
IN3- OUT+
E4
R207 12
SPEECH_P IN3+ OUT-
FB202
2

SOUND_L
SOUND_R
C204
C205
1u
1u
A3
B3

A4
IN1+
IN1- U200 U200
HPL

HPR
B1

A1
HS_OUT_L

HS_OUT_R
C206 0.1u IN2+
C211 0.1u B4 D1
IN2- CP C266
39pF

39pF

C214 C267
B2 E1 1n
I2C_SDA1 C2
SDA CN 2.2u 1n VA203 VA204

I2C_SCL1
C215

C216

SCL
CPVDD

CPVSS
BIAS

GND
A2

E2

C1

D3

C217 C218 C219

2.2u 2.2u 2.2u

AB2
KROW4_GPIO9 KEY_ROW4 VIO
AC3
KROW3_GPIO10 KEY_ROW3
AD6
KROW2_GPIO11 KEY_ROW2
AD2
KROW1_GPIO12 KEY_ROW1
AE3
KROW0_GPIO13 KEY_ROW0 R106 R107

U101UTXD1 AM4
UART_TX
TP4
AJ7 2.2K 2.2K
URXD1 UART_RX
T32
URTS1_B_GPIO25 I2C_SDA1
V30
UCTS1_B_GPIO24 I2C_SCL1
AN3

LGE Internal Use Only - 83 - Copyright © 2012 LG Electronics. Inc. All right reserved.
Only for training and service purposes
 4. TROUBLE SHOOTING

START START
< Cal l > < Mp3>

Check the state of Check the state of

No No
sordering sordering
Camera working well !
of speaker of speaker
PAD(CN200) PAD(CN200)

Yes Yes

Check the Audio No No Check the Audio

signal Change the U200 signal
TP1 TP1

Yes Yes

Check the Audio No No Check the Audio

Replace/
signal signal
Change the U101
TP2, TP4 TP3, TP4

Yes Yes

Speaker Speaker
Working well!! Working well!!

LGE Internal Use Only - 84 - Copyright © 2012 LG Electronics. Inc. All right reserved.
Only for training and service purposes
 4. TROUBLE SHOOTING

4.10 3.5φ Headset Trouble

TP2
TP3

TP4

TP1 Q200

Figure 4.10.1

LGE Internal Use Only - 85 - Copyright © 2012 LG Electronics. Inc. All right reserved.
Only for training and service purposes
 4. TROUBLE SHOOTING

VIO
Q200
R200

1M
S

G R251 C271 1n
FM_ANT
Q200 1K

C202 VA224
L200
TP1 D
R201
270n
8p

100K
R204 1800

10
FB200

JACK_DETECT

close to 3.5pi conn

FB204 M6-GND
R208 0 FB210 1800 6
HS_OUT_R M1-R
R209 5.6 0 FB211 1800 1
HS_OUT_L M4-DETECT
5.6 FB206 4D

VA200 VA201 VA202 M4-L

C212 C213 4
TP4 56p 56p 5
M5-MIC

DNI J200

FB207
FB207

1800

R256
TP3
1

VA205

VHP_MIC_2V0

BB side place VA225

R217
1.5Kohms
TP2
C223 R254
HP_MIC_N
2.2Kohms

0.1u 820
C224
R219

39p
C225
R255
HP_MIC_P HOOK_DET
0.1u 820
VA226 C226
2.2u

Figure 4.10.1

LGE Internal Use Only - 86 - Copyright © 2012 LG Electronics. Inc. All right reserved.
Only for training and service purposes
 4. TROUBLE SHOOTING

START
< Cal l >

Resolder TP1

Check the
TP1(JACK No
Resolder Q200
DETECT) is
HIGH?

Yes

Yes Can you hear Hook detect

3.5 φ Headset
the sound from Trouble?
MIC Trouble?
the earphone?

No No YES YES

Check the
Audio signal No Resolder or Replace
HS_OUT_L/R U101
(TP4)?

Yes
Check the
Audio signal No Resolder or Replace
3.5 φ Headset
Speaker working well HS_OUT_L/R U203
(TP4)?

Yes

3.5 φ Headset Check the Low detect

Speaker working well Yes at VA205?
No

Resolder or Replace
FB207

3.5 φ Headset
Hook working well

LGE Internal Use Only - 87 - Copyright © 2012 LG Electronics. Inc. All right reserved.
Only for training and service purposes
 4. TROUBLE SHOOTING

4.11 Microphone Trouble

TP1 TP3TP2
TP4

TP6 TP5

Figure 4.12.1

MICBIAS

TP1
R216

1K

MAIN MICROPHONE
R218 C222
10u
2.2K
MIC200

C228 R220
MIC200
MAIN_MIC_P
0.1u 820 1
C229 C263
2
47p 9p
C230 R222
MAIN_MIC_N
0.1u 820

VA206 VA207
C231 C232
R223
TP2 TP5 2.2K
DNI DNI

TP4
TP3 TP6

LGE Internal Use Only - 88 - Copyright © 2012 LG Electronics. Inc. All right reserved.
Only for training and service purposes
 4. TROUBLE SHOOTING

SETTING : After initialize Agilent 8960, Test EGSM900, DCS mode ( or GSM850, PCS mode )

START

Check microphone
sound hole

Make a phone call,

then check TP1 mic No 1. Check mic Bias signal line
bias signal 2. Change the U101
comes from U101?

Yes

Check the No
soldering of Change the microphone
MIC200

Yes

Check the soldering of No

Resolder component
TP2,TP3,TP4,TP5,TP6

Yes

Microphone will work

properly.

LGE Internal Use Only - 89 - Copyright © 2012 LG Electronics. Inc. All right reserved.
Only for training and service purposes
 4. TROUBLE SHOOTING

4.12 SIM1 Card Interface Trouble

TP1

S200

Figure 4.13.1
VIO

47K R221

MMC_DET
T_FLASH_SIM_COMBO
C265
1u

S200
19

VMMC 18
ST2
G1

17
ST1

1
S4
2
MMC_DATA2 T1
3
MMC_DATA3 T2
4
MMC_CMD T3
S200

5
T4
6
MMC_CLK T5
7
T6
8
MMC_DATA0 T7
9
MMC_DATA1 T8
10 VSIM2
S8

TP1
G3

G2
S7
S3
S6
S2
S5
S1

C270C235
21

11
12
13
14
15
16

20

VA209 VA210VA211 VA212 VA213 VA214

1u 1u

VSIM2
C234
1u
SIM2_RST
R246
DNI
SIM2_CLK
SIM2_DATA

VA223 VA222 C261 VA221

DNI

Figure 4.13.1

LGE Internal Use Only - 90 - Copyright © 2012 LG Electronics. Inc. All right reserved.
Only for training and service purposes
 4. TROUBLE SHOOTING

START

Does the SIM

card No Change the SIM Card.
Support 1.8 or This phone supports 1.8V or 3.0V SIM card.
3.0V ?

Yes

Is Voltage at No Voltage output No

the TP1 of VSIM LDO Change the U101
1.8V or 3V? Is 1.8V or 3V?

YES

Resolder S200
Yes

Change
redownload
the SIM Card No No Change the main
SW.
and try again. board
Does it work
Does it work
Properly?
Properly?

Yes
Yes

SIM card is SIM card is

properly working properly working.

LGE Internal Use Only - 91 - Copyright © 2012 LG Electronics. Inc. All right reserved.
Only for training and service purposes
 4. TROUBLE SHOOTING

4.13 SIM2 Card Interface Trouble

U202

J201

Figure 4.13.1

VSIM_1

SIM_CONNECTOR
VSIM_1

VIO
R225
J201 J201
TP1
VIO
Dual SIM Controller
TP1
DNI 4 1
5
C5 C1
2 VBAT
C6 C2 SIM_RST_1
6 3
SIM_DATA_1 C7 C3 SIM_CLK_1

47K R221
VA215
10
9
GND4 GND1
GND3 GND2
7
8
C247 VA216 VSIM_1
TP2
T_FLASH_SIM_COMBO
VA217 C249
1u DNI
C237 C238
MMC_DET C239 2.2u 1u VSIM_2
2.2u

C265
1u
SYS_RESET
C257
23

19

1u C258
4
19

SYSRSTB

VIO

VBAT

18
ST2 1u
G1

17
ST1

SIM_CONNECTOR
VSIM1
5
VSIM_2 VSIM_2
SCLK1/GPIO1 SIM_CLK_1
TP200 SIMCLK1/GPI13 SRST1/GPIO2
6
1 SIM1_CLK 15 7
SIM_RST_1
S4
2 SIO1/GPIO3 SIM_DATA_1
T1 TP201 SIMRST1/GPI14
8
3 J202 SIM1_RST 14
T2 R231
4 DNI 4 1 VSIM2
T3 C5 C1 TP202 3
S200

5 5
C6 C2
2 SIM1_DATA SIM_RST_2
SIMIO1/GPI15 SCLK2/GPIO4 SIM_CLK_2
T4 13 2
6 3 SRST2/GPIO5
6 SIM_DATA_2 C7 C3 SIM_CLK_2 1
SIM_RST_2
T5 10 7
7 GND4 GND1 SIO2/GPIO6 SIM_DATA_2
T6 9 8 28
GND3 GND2 SIMCLK2/GPI16
8
TP3VSIM1
VA218
U202

VA219
T7 C254 VA220 C256 16
9 1u VSIM3
T8 DNI 27
10 VSIM2 SIMRST2/GPI17 SCLK3/GPIO7
S8 17 24
SRST3/GPIO8
G3

G2

25
S7
S3
S6
S2
S5
S1

SIMIO2/GPI18 SIO3/GPIO9
18 26
R241
21

11
12
13
14
15
16

20

20
CE0 U202 VSIM4
SCLK4/GPIO10
9
0
10
I2C_SCL2 SCL SRST4/GPIO11
21 11 C259
SIO4/GPIO12
VSIM2 12
I2C_SDA2 SDA 1u
GND

22
C234
1u
29

SIM2_RST
R246
DNI
SIM2_CLK
SIM2_DATA

VA223 VA222 C261 VA221

DNI

LGE Internal Use Only - 92 - Copyright © 2012 LG Electronics. Inc. All right reserved.
Only for training and service purposes
 4. TROUBLE SHOOTING

START

Does the SIM card No Change the SIM Card.

Support 1.8V or 3V ? This phone supports 1.8V or 3V SIM card.

Yes

No Is Voltage at the TP2 Is Voltage at the TP3

Is Voltage at the TP1
1.8V or 3V? 1.8V or 3V? 1.8V or 3V?

NO No

Resolder U202 Change the U101

Yes If NOT

Change
the SIM Card and try No Redownload SW. No
again. Does it work Change the main board
Does it work Properly?
Properly?

Yes
Yes

SIM card is SIM card is

properly working properly working.

LGE Internal Use Only - 93 - Copyright © 2012 LG Electronics. Inc. All right reserved.
Only for training and service purposes
 4. TROUBLE SHOOTING

4.14 SIM3 Card Interface Trouble

U202

J202

Figure 4.13.1

VSIM_1

SIM_CONNECTOR
VSIM_1

VIO
R225
J201 J201
TP1
VIO
Dual SIM Controller
TP1
DNI 4 1
5
C5 C1
2 VBAT
C6 C2 SIM_RST_1
6 3
SIM_DATA_1 C7 C3 SIM_CLK_1

47K R221
VA215
10
9
GND4 GND1
GND3 GND2
7
8
C247 VA216 VSIM_1
TP2
T_FLASH_SIM_COMBO
VA217 C249
1u DNI
C237 C238
MMC_DET C239 2.2u 1u VSIM_2
2.2u

C265
1u
SYS_RESET
C257
23

19

1u C258
4
19

SYSRSTB

VIO

VBAT

18
ST2 1u
G1

17
ST1

SIM_CONNECTOR
VSIM1
5
VSIM_2 VSIM_2
SCLK1/GPIO1 SIM_CLK_1
TP200 SIMCLK1/GPI13 SRST1/GPIO2
6
1 SIM1_CLK 15 7
SIM_RST_1
S4
2 SIO1/GPIO3 SIM_DATA_1
T1 TP201 SIMRST1/GPI14
8
3 J202 SIM1_RST 14
T2 R231
4 DNI 4 1 VSIM2
T3 C5 C1 TP202 3
S200

5 5
C6 C2
2 SIM1_DATA SIM_RST_2
SIMIO1/GPI15 SCLK2/GPIO4 SIM_CLK_2
T4 13 2
6 3 SRST2/GPIO5
6 SIM_DATA_2 C7 C3 SIM_CLK_2 1
SIM_RST_2
T5 10 7
7 GND4 GND1 SIO2/GPIO6 SIM_DATA_2
T6 9 8 28
GND3 GND2 SIMCLK2/GPI16
8
TP3VSIM1
VA218
U202

VA219
T7 C254 VA220 C256 16
9 1u VSIM3
T8 DNI 27
10 VSIM2 SIMRST2/GPI17 SCLK3/GPIO7
S8 17 24
SRST3/GPIO8
G3

G2

25
S7
S3
S6
S2
S5
S1

SIMIO2/GPI18 SIO3/GPIO9
18 26
R241
21

11
12
13
14
15
16

20

20
CE0 U202 VSIM4
SCLK4/GPIO10
9
0
10
I2C_SCL2 SCL SRST4/GPIO11
21 11 C259
SIO4/GPIO12
VSIM2 12
I2C_SDA2 SDA 1u
GND

22
C234
1u
29

SIM2_RST
R246
DNI
SIM2_CLK
SIM2_DATA

VA223 VA222 C261 VA221

DNI

LGE Internal Use Only - 94 - Copyright © 2012 LG Electronics. Inc. All right reserved.
Only for training and service purposes
 4. TROUBLE SHOOTING

START

Does the SIM card No Change the SIM Card.

Support 1.8V or 3V ? This phone supports 1.8V or 3V SIM card.

Yes

No Is Voltage at the TP2 Is Voltage at the TP3

Is Voltage at the TP1
1.8V or 3V? 1.8V or 3V? 1.8V or 3V?

NO No

Resolder U202 Change the U101

Yes If NOT

Change the
SIM Card and try No Redownload SW. No
again. Does it work Change the main board
Does it work Properly?
Properly?

Yes
Yes

SIM card is SIM card is

properly working properly working.

LGE Internal Use Only - 95 - Copyright © 2012 LG Electronics. Inc. All right reserved.
Only for training and service purposes
 4. TROUBLE SHOOTING

4.15 KEY backlight Trouble

LD305 LD302

LD300 LD303

LD301 LD304

Figure 4.14.1

LGE Internal Use Only - 96 - Copyright © 2012 LG Electronics. Inc. All right reserved.
Only for training and service purposes
 4. TROUBLE SHOOTING

KEY BACKLIGHT

VBAT

C300
C301
1u
1u

LD300 LD301 LD302 LD303 LD304 LD305

19-217_BHC-ZM1N2QY_3T
EDLH0015101
BLUE LED

KEYPAD_LED
C319
1u

START

No
VBAT = high ? Check U101

Yes

No
KEYPAD_LED = Low ? Check U101

Yes

Replace or resolder No Backlight will

LED work properly.

LGE Internal Use Only - 97 - Copyright © 2012 LG Electronics. Inc. All right reserved.
Only for training and service purposes
 4. TROUBLE SHOOTING

4.16 Torch Trouble

LD306

TP1

TORCH
TORCH_3V3

TP1
R313

15

C310
4
3
2

1u
LD306
1

Figure 4.14.1

LGE Internal Use Only - 98 - Copyright © 2012 LG Electronics. Inc. All right reserved.
Only for training and service purposes
 4. TROUBLE SHOOTING

START

No
TORCH_3V3 = 3.3V? Check U203

Yes

Replace or resolder No
Check U203
LED(LD306)

Torch will
work properly.

LGE Internal Use Only - 99 - Copyright © 2012 LG Electronics. Inc. All right reserved.
Only for training and service purposes
 4. TROUBLE SHOOTING

4.17 Micro SD Trouble

TP2

TP1

S200

VIO

TP2
47K R221

MMC_DET
T_FLASH_SIM_COMBO
C265
1u
19

VMMC 18
ST2
G1

17
ST1

TP11
S4
S200
2
MMC_DATA2 T1
3
MMC_DATA3 T2
4
MMC_CMD T3
S200

5
T4
6
MMC_CLK T5
7
T6
8
MMC_DATA0 T7
9
MMC_DATA1 T8
10 VSIM2
S8
G3

G2
S7
S3
S6
S2
S5
S1

C270C235
21

11
12
13
14
15
16

20

VA209 VA210VA211 VA212 VA213 VA214

1u 1u

VSIM2
C234
1u
SIM2_RST
R246
DNI
SIM2_CLK
SIM2_DATA

VA223 VA222 C261 VA221

DNI

LGE Internal Use Only - 100 - Copyright © 2012 LG Electronics. Inc. All right reserved.
Only for training and service purposes
 4. TROUBLE SHOOTING

START

Micro SD Detect No Check the No

OK? VMMC(TP1)=2.8V?

Yes Yes Change U101

No
MMC_DET(TP2)
Is High?

YES Re-attach or
Replace S200

Check out No
MMC_CLK & Data Re-download SW
Timing OK?

Yes

Replace Micro SD Card

Yes

Micro SD Card will

work properly

LGE Internal Use Only - 101 - Copyright © 2012 LG Electronics. Inc. All right reserved.
Only for training and service purposes
 4. TROUBLE SHOOTING

4.18 Bluetooth Trouble

BT Ant.

U401

TP1
TP4

U401
TP2
TP3

Figure 4.15.1
I2C_SCL3

I2C_SDA3
FM_ANT

CON ANT FEED VBAT

R410

SFCY0000901 R415
0

TP400 47
GND2 GND1 C436
C428 100p
OUT IN

FL402
TP1
18p
C432 C430 C431
C438 C437
DNI DNI 1.5p DNI
DNI C433
1u

TP2
A1
A2
A3
B4
D5
A4
D6
A5
A6
B6
AVSS_BALUN
RF2G_N
AVDD28_TRX
I2C_CK
GPIO2
FM_RDS
GPIO4
I2C_DAT
RXLNA_INP_LA
RXLNA_INP_SA

R413 100K
C6 E1
AVDD28_FM VBAT
C426 1u B7 E2
FM_AUDIO_R AUROUT LDO28EN BT_POWER_EN
C425 1u C7 D1 C434 1n
FM_AUDIO_L AULOUT OSC_IN
B5 C1 BT_CLK_26M
AVSS28_FM2 AVDD28_SX
F2 U401 B2
TP401 VDD28 AVSS28_RF1
D7 D2 C435 1u
BT_HOST_WAKEUP GPIO0 VCC28OUT_FM
TP402 E7 C3
BT_CLK_REQUEST SRCLKENA T1P

TP4
D4 B3
TESTMODE AVSS28_RF3
AVSS28_FM1

LDODVOUT12

TP403 E5 C2
BT_32K EXT32K AVSS28_RF2
SYSRST_B

VCC28OUT

F7 B1
PCMSYNC

BT_UART_RX UTXD1 REXT

PCMCLK

PCMOUT
URXD1

PCMIN

DVSS

R412
15K
E6
E4
F6
F5
C5
E3
F3
C4
D3
F1

TP404 C427 C429

1u 1u

TP3
BT_UART_TX
BT_RESET

BT_PCMOUT
BT_PCM_SYNC
BT_PCM_CLK

BT_PCMIN

LGE Internal Use Only - 102 - Copyright © 2012 LG Electronics. Inc. All right reserved.
Only for training and service purposes
 4. TROUBLE SHOOTING

START

Check condition of No Repair

matching components Matching components

Check TP2(VBAT) No
Check U101 circuit
&TP1(BT_POWER_EN)

Yes

Check TP3 No
Check U101 circuit
(VDD28)

Yes

Check TP4 No
Check U101 circuit
(BT_CLK_26M)

Yes

Replace U100

 U101 (MT6253) : Main Chip

LGE Internal Use Only - 103 - Copyright © 2012 LG Electronics. Inc. All right reserved.
Only for training and service purposes
 4. TROUBLE SHOOTING

4.19 FM Radio Trouble

J200

U401
Filter
Circuit
CN201

Figure 4.17.1

VIO

R200

1M
Filter Circuit
S

G R251 C271 1n
FM_ANT
Q200 1K

C202 VA224
L200
D 8p
270n
R201
100K
R204 1800

10
FB200

JACK_DETECT

close to 3.5pi conn

FB204 M6-GND
R208 0 FB210 1800 6
HS_OUT_R M1-R
R209 5.6 0 FB211 1800 1
HS_OUT_L M4-DETECT
5.6 FB206 4D

VA200 VA201 VA202 M4-L

J200
C212 C213 4
M5-MIC
56p 56p 5
DNI J200
FB207

1800

R256

VA205

VHP_MIC_2V0
LGE Internal Use Only - 104 - Copyright © 2012 LG Electronics. Inc. All right reserved.
Only for training and service purposes
BB side place VA225
R217
1.5Kohms
 4. TROUBLE SHOOTING

START

Check of
Ear jack condition

No Check Trouble Shooting

Is the condition good?
4.11 Ear mic

Yes

Check condition of
Filter Circuit
(L200, C202)

No Give the additory

Is the condition good? solder in
L200, C202

Yes

Check U101 Circuit

(VBAT_AMP2)

LGE Internal Use Only - 105 - Copyright © 2012 LG Electronics. Inc. All right reserved.
Only for training and service purposes
 5. DOWNLOAD

5. DOWNLOAD
k–ž•“–ˆ‹G›––“GaG㜼 Onzt|s{pGŒ™GZUWP

XUj–œ•›™ G–™G‰œ Œ™GGaG㜼 iyhpsGO{tnP
YUGzV~G⮹㾡 aG㜼 OGw}⮹㾡⓸ ㇵḴ㛺㢀UGP

LG-A290

LG-A290

LGE Internal Use Only - 106 - Copyright © 2012 LG Electronics. Inc. All right reserved.
Only for training and service purposes
 5. DOWNLOAD

kss ⮹㾡 aG㜼
kssG⮹㾡 a 㜼 On|Y_W†UkssP
On|Y_W  kssP

LG-A290

LG-A290

LG-A290

LGE Internal Use Only - 107 - Copyright © 2012 LG Electronics. Inc. All right reserved.
Only for training and service purposes
 5. DOWNLOAD

LG-A290

LG-A290

LG-A290

LGE Internal Use Only - 108 - Copyright © 2012 LG Electronics. Inc. All right reserved.
Only for training and service purposes
 5. DOWNLOAD

zŒ›G|—†|zi†w–™›Gtˆ——•ŽGŒ™GGaGG㜼 OW[P

LG-A290

LGE Internal Use Only - 109 - Copyright © 2012 LG Electronics. Inc. All right reserved.
Only for training and service purposes
 5. DOWNLOAD

|ziGk™Œ™G⮹㾡 aG㜼 Osn |zi t–‹Œ” k™Œ™ Œ™G[U`U[P

LGE Internal Use Only - 110 - Copyright © 2012 LG Electronics. Inc. All right reserved.
Only for training and service purposes
 5. DOWNLOAD

LGE Internal Use Only - 111 - Copyright © 2012 LG Electronics. Inc. All right reserved.
Only for training and service purposes
 5. DOWNLOAD

|ziGtˆ—G㉔䈑 aG㜼OGpumpulvuGhŽ–“‹GzŒ™ŒšP

‘LG-A290’

LGE Internal Use Only - 112 - Copyright © 2012 LG Electronics. Inc. All right reserved.
Only for training and service purposes
 5. DOWNLOAD

LGE Internal Use Only - 113 - Copyright © 2012 LG Electronics. Inc. All right reserved.
Only for training and service purposes
 5. DOWNLOAD

㐘䚽 䑀㢰 ⶸ㤸 aG㜼Otœ“›nzt†}ZWP
O P

LGE Internal Use Only - 114 - Copyright © 2012 LG Electronics. Inc. All right reserved.
Only for training and service purposes
 5. DOWNLOAD

LG-A290

LG-A290 ‘LG-A290’

LG-A290

LG-A290 LG-A290

LG-A290
‘LG-A290’

LG-A290

LGE Internal Use Only - 115 - Copyright © 2012 LG Electronics. Inc. All right reserved.
Only for training and service purposes
 5. DOWNLOAD

LG-A290 LG-A290

LG-A290 LG-A290

LG-A290 LG-A290

LGE Internal Use Only - 116 - Copyright © 2012 LG Electronics. Inc. All right reserved.
Only for training and service purposes
 5. DOWNLOAD

LG-A290 LG-A290

LGE Internal Use Only - 117 - Copyright © 2012 LG Electronics. Inc. All right reserved.
Only for training and service purposes
 5. DOWNLOAD

LG-A290 LG-A290

LGE Internal Use Only - 118 - Copyright © 2012 LG Electronics. Inc. All right reserved.
Only for training and service purposes
 6. BLOCK DIAGRAM

6. BLOCK DIAGRAM
AUDIO/SPEECH BLOCK DIAGRAM 1"$5

$8',263((&+%/2&.',$*5$0
SIM1 / T-Flash(combo) Vibrator
HOT_KEY Back-up BAT SIM2
SIM SW Dual
I2C 2
I2C_2
SIM
Controller SIM3 Torch
7)7/&'
LCD CTRL
KEY PAD Ě
LCD IF
4&,) 1.3M CAM
8bit I2C
8bit, I2C_1
1

0(025< '63 AU_IN1_P/N

MAIN_MIC_P/N

125 (Differential Input)

125,) HS_MIC_P/N
0ELW AU_IN0_P/N
FM Recording (Differential Input)
S65$0
65$0 (AMR type)
t )
JACK DETECT
0ELW S65$0,) HS SOUND R/L ‘
07 AU_MOUTR/L
SOUND R/L
HS MP3/MIDI R/L &RQQ
RF-VLOGIC HS FM Radio R/L
(Single ended
Output) FM Radio R/L $XGLR6XE HS FM Radio R/L
RF-BS
AU_OUT0_P/N 6\VWHP HS SPEECH P/N
(Differential HS SPEECH P/N ,& ,)
,&,)
VRAMP SPEECH P/N
Output)
GSM TX-EN
SPK PHONE P/N 73$3
Tx Module {yhuzjlp}ly HOOK DETECT
TX-HB-IN
(SKY77550)
TX-LB-IN 7,0,1, MUIC

RQQ
I2C_1
LCD LED
LCD_LED
$%%

SLQ&R
GSM RX-LB
GSM850/EGSM
Rx SAW ID
DCS/PCS RX-HB
SOUND R/L ,&,)
GSM
($1
Rx SAW FM Radio R/L

26MHz AU_FMINR/L
PMU SPEECH P/N
SPK PHONE P/N

32KHz

RCV/SPK
86%
07 8$577$
(1500mAh Li-ion)
(1500mAh,
%7 )0 5 GL
%7)05DGLR &KDUJLQJ,&B
3&08$57,&B,)

LGE Internal Use Only - 119 - Copyright © 2012 LG Electronics. Inc. All right reserved.
Only for training and service purposes
 7. CIRCUIT DIAGRAM

7. Circuit Diagram
VIO

R109 R110

2.2K 2.2K

I2C_SDA3
I2C_SCL3

MEMORY (512 NOR / 128 pSRAM : AD MUX type)

LCD_DATA00
LCD_DATA01
LCD_DATA02
LCD_DATA03
LCD_DATA04
LCD_DATA05
LCD_DATA06
LCD_DATA07

LCD_RESET
NROM_CS
NRAM_CS

MEM_CLK

LCD_ID

LCD_WR
LCD_RS
LCD_RD

LCD_CS
VM VM

NWAIT
NADV

AD00
AD01
AD02
AD03
AD04
AD05
AD06
AD07
AD08
AD09
AD10
AD11
AD12
AD13
AD14
AD15
AD16
AD17
AD18
AD19
AD20
AD21
AD22
AD23
AD24
U100

NRD
NWR
NLB
NUB
A1
DU1
H8 A14
P_CRE DU2
C3
DU3
D3 C12
NWAIT WAIT DU4
H3
DU5
AM12
AL13
AJ15

AK14
AK20
AM20
AJ21
AJ13
AN11
AM22

AK28
AJ25
AN31
AL27
AP30
AN29
AL29
AK26
AM30
AM26
AK30
AP32
AM28
AJ29
AN27
AJ27
AN25
AM18
AL19
AN17
AK22
AN23
AM24
AL23
AP26

AL31
AL33
AK34
AJ33
AH32
AG33

AE31
AG31
AK32
AE29
AH30
AF32
AG29
AJ31
AF30

AF34
AD30
AE33
AC29
AD32
AC31
C7 H12

F14
C23
E23
E25
F26
E27
F28
E29
G29
F30
G31
F32
K30
H32
L31
NLB P_LB_ DU6

J5
C8 K1
NUB P_UB_ DU7
H7 K14
ECS0_B
ECS1_B
ECS2_B_GPIO14

ERD_B
EWR_B
ELB_B
EUB_B
ECLK
EADV_B
EWAIT

ED0
ED1
ED2
ED3
ED4
ED5
ED6
ED7
ED8
ED9
ED10
ED11
ED12
ED13
ED14
ED15
EA16
EA17
EA18
EA19
EA20
EA21
EA22
EA23
EA24

NWEB_GPIO28
NALE_GPIO29
NCLE_GPIO30
NCEB_GPIO26
NREB_GPIO27
NRNB_GPIO31

NLD0_GPIO32
NLD1_GPIO33
NLD2_GPIO34
NLD3_GPIO35
NLD4_GPIO36
NLD5_GPIO37
NLD6_GPIO38
NLD7_GPIO39
NLD8_GPIO40

LWRB_GPIO41
LPA0_GPIO42
LRDB_GPIO43
LRSTB_GPIO44
LPCE1B_GPIO46
LPCE0B_GPIO45

AGND28_AFE
AGND
GND_RF1
GND_RF2
GND_RF3
GND_RF4
GND_RF5
GND_RF6
GND_RF7
GND_RF8
GND_RF9
GND_RF10
GND_RF11
GND_RFVCO
GND_RXISO
GND_SX
NRAM_CS P_CE1_ DU8
MICBIAS
D6 G12
P100 MEM_CLK CLK ADQ0 AD00
PGND G11
AM34 ADQ1 AD01
E_GND D8 F9
VDD33_EMI / 1.8V NWR WE_ ADQ2 AD02
F12 F8
E9 K6 NRD OE_ ADQ3 AD03
RF_TX_RAMP APC AU_MICBIAS G7
F20 B2 ADQ4 AD04
IP AU_IN1_P HP_MIC_P E6 G6
D20 C1 NADV ADV_ ADQ5 AD05
IN AU_IN1_N HP_MIC_N F5
E19 D2 ADQ6 AD06
QP AU_IN0_N MAIN_MIC_N E11 F4
F18 E3 NROM_CS F_CE_ ADQ7 AD07
QN AU_IN0_P MAIN_MIC_P C4 F11
F4 F-CE2#_A25 ADQ8 AD08
AU_FMINR FM_AUDIO_R F10

U101
E31 G5 ADQ9 AD09
GSM850_RxP GSM850P AU_FMINL FM_AUDIO_L E8 G9
D32 F6 MEM_RESET F_RST_ ADQ10 AD10
GSM850_RxN GSM850N AU_OUT0_N SPEECH_N E9 G8
D30 E5 F_WP_P_CE2_ ADQ11 AD11
EGSM_RxN GSM900N AU_OUT0_P SPEECH_P R100 R101 100K H11 F7
C31 F8 0 F_DPD ADQ12 AD12
EGSM_RxP GSM900P AU_MOUTL SOUND_L F6

MT6253
D28 C3 ADQ13 AD13
DCS_RxP DCS1800P AU_MOUTR SOUND_R D7 G4
C29 J3 VCC ADQ14 AD14
DCS_RxN DCS1800N SPK1_P G3
C27 K4 VA103VA104VA101VA102 C105 C103 ADQ15 AD15
PCS_RxN PCS1900N SPK1_N 1% E3
D26 VCCQ1
PCS_RxP PCS1900P 47p 47p G10 E4
C25 R3 R102 5.1K VCCQ2 A16 AD16
LB_TX TXO_LB PAD_VRT H4 D11
D24 U5 VCCQ3 A17 AD17
HB_TX TXO_HB DP USB_DP E10
V6 A18 AD18
DM USB_DM D5 D10
P34 R103 VSS1 A19 AD19
BPI_BUS5_GPIO82 100K E12 E5
U29 AA5 VIO VSS2 A20 AD20
PA_EN BPI_BUS4_GPIO81 KCOL6_GPIO1 F3 D4
P32 AB6 VSS3 A21 AD21
BPI_BUS3 KCOL5_GPIO2 G5 D12
T30 Y2 VSS4 A22 AD22
BPI_BUS2 KCOL4_GPIO3 KEY_COL4 E7
N33
VLOGIC BPI_BUS1 VCORE 1V2 / 1V0 200mA PMU(BB) KCOL3_GPIO4
AB4
KEY_COL3 D9
A23
C11
AD23
R31 AA3 R104 R105 F-VPP A24 AD24
RF_ANT_SW1 BPI_BUS0 KCOL2_GPIO5 KEY_COL2
VIO PULL UP(I2C1,I2C2,BT_PCMSYNC,BAT CONNECTOR) KCOL1_GPIO6
AC5
KEY_COL1 2.2K 2.2K
J31
RFVCO_MT
2V8 100mA SIM Selection, Jack DET, Hook DET, LCD, FM Radio KCOL0_GPIO7
AA1
KEY_COL0
I2C_SDA2
M32 AD4
VUSB BT_CLK_26M FREF KROW5_GPIO8 I2C_SCL2
H6 C106 C107 C108 C139
C109 4.7u AU_VCM VRF 2V8 200mA PAM KROW4_GPIO9
AB2
KEY_ROW4 VIO 1u 1u 0.1u
Y6 AC3 DNI
PWM KROW3_GPIO10 KEY_ROW3
TSX-3225 26MHZ_7_4PF AD6
KROW2_GPIO11 KEY_ROW2
26MHz K34
XTAL1
VA 2V8 125mA BB(PLL, RFE, MBUF, AFE, RFD) KROW1_GPIO12
AD2
KEY_ROW1
2 1
FB100 L33 AE3
VA VCORE_PMU 3 4 XTAL2_GND KROW0_GPIO13 KEY_ROW0
1800 R106 R107
X100
V4
VM 1V8 / 2V8 200mA EMI(BB), MEMORY AM4
AVDD_RTC UTXD1 UART_TX 2.2K 2.2K
T4 AJ7
AVDD33 URXD1 UART_RX
D8
AVDD28_PLL
VTCXO 2V8 20mA DCXO(BB) URTS1_B_GPIO25
T32
I2C_SDA1
C110 FB101 VCORE_PMU C7 V30
1800 AVDD28_RFE UCTS1_B_GPIO24 I2C_SCL1
1u D6 AN3
D4
AVDD28_MBUF VSIM 1V8 / 3V0 80mA SIM1 UTXD2_GPIO23
AL3
AVDD28_AFE URXD2_GPIO22 LCD_VSYNC
T6 AM2
AVDD12 UTXD3_GPIO21 BT_UART_TX
W3
VDDK1
VSIM2 1V8 / 3V0 20mA SIM2, SIM3 URXD3_GPIO20
AJ5
BT_UART_RX
C111 C112 AK12
100n 1u C113 VA VIO VMMC VDDK2
VTCXO Y30 C15
100n VM
AK4
VDDK3 VUSB 3V3 100mA USB Power(BB) VM_SEL
AL21
FB105 VDD33_1 WATCHDOG MEM_RESET
R29 AE5
VDD33_2 SECURITY_EN
1800 AM8
VDD33_MSDC
VBT(VMMC) 1V8/2V84/3V0 150mA MSDC(BB), T-FLASH SRCLKENAI_GPIO77
AF2
BT_CLK_REQUEST
R108 51 AJ19 U3
VDD33_EMI TEST_MODE
P30 Y4
M30
VDD28_RFD VCAM_A 1V5/1V8/2V5/2V8 150mA CAMERA(ANALOG,IO) SYSRST_B SYS_RESET
VDD28_DCXO
K32 AK8
VDD28_SX JTMS
C115 C116 C140 C117 C141 J33 VCAM_D 1V5/1V8/2V5/2V8 75mA
C114 VDD28_RFVCO CAMERA(DIGITAL) JTDI
AM6
100n 100n 100n 100n H30 AJ9 VHP_1V8
1u 100n VDD28_RXFE JTCK
F24 AL7
F22
VDD28_TRXIF VRTC 2V8 1mA JTRST_B
AP6 VCORE_PMU VTCXO VRF VA VM VIO VCAMA VUSB VSIM1 VSIM2
VDD28_TXVCO JRTCK
E21 AL5
VRF_1 VDD28_OPLL JTDO
N31
VDD28_OPLL VDD15_RFD L100 2.2u
VBAT N1
VCORE1
C118 1u D18 R5
VBAT_RF VCORE1_FB
E17 D22
VBAT_A VTCXO
VRF E15 B22
VBAT_D1 VRF
F16 A21
VBAT_D2 VA
N3 B20
VBAT_SWREG VM
VDD28_OPLL F2 C19
VRF_1 FB102 600 VBAT_AMP1 VIBRATOR
G3 B18
R113 VBAT_AMP2 VIO
C21
VCAMA
0 C119 C120 E13 C17
FB104 GATEDRV VCAMD
75 1u F12 D16
10u VUSB_LDO_4V9 CHRIN VUSB
A9 VDD33_MSDC A17
VBAT BATSNS VSIM
DAIPCMOUT_GPIO16

A7 B16
BT_POWEN_GPIO72

DAIPCMIN_GPIO17

IRDA_PDN_GPIO76
SD_PWREN_GPIO73

Close to VDD28_OPLL ISENSE VSIM2

DAISYNC_GPIO19

B14
CMDAT0_GPIO47
CMDAT1_GPIO48
CMDAT2_GPIO49
CMDAT3_GPIO50
CMDAT4_GPIO51
CMDAT5_GPIO52
CMDAT6_GPIO53
CMDAT7_GPIO54
CMHREF_GPIO55
CMMCLK_GPIO58
CMVREF_GPIO56

CMPCLK_GPIO59

BT_32K_GPIO74
DAICLK_GPIO15

DAIRST_GPIO18

FM_32K_GPIO75

C121 VSIM/VSIM2 VREF

CMRST_GPIO60
CMPDN_GPIO57

MCDA0_GPIO71
MCDA1_GPIO70
MCDA2_GPIO69
MCDA3_GPIO68
MCINS_GPIO65

EINT3_GPIO61
EINT2_GPIO62
EINT1_GPIO63
EINT0_GPIO64

C122 A13
MCWP_GPIO66
MCCK_GPIO67

5.6p 1u BAT_BACKUP
VBOOST1_SW

C123
C124 C125 C126 C127 C128 C129 C130 C131 C132 C133 C134
1u
VBL_OUT

AUX_IN0
AUX_IN1
AUX_IN2

VBOOST1

C135
PWRKEY
RESETB
BAT_ON

ISINK1
ISINK2
ISINK3
ISINK4

10u 1u 1u 4.7u 1u 1u 1u 1u 1u 1u 1u
MCCM0

SRST1
SCLK1

SRST2
SCLK2

0.1u
SIO1

SIO2

XOUT
VBT
LED

XIN

XP
XM
YP
YM

Close to VDD28_RFVCO
AC33
AB32
AB34
V32
AA33
Y32
AB30
W33
AA31
AA29
V34
U33
W31
W29

AG5
AJ3
AG3
AF4
AH2
AF6
AJ1

AP10
AJ11
AN9
AK10
AN7
AL9
AM10
AL11

D14
B12
C13
B10
D12
C11

P4
P2
C9

J1
K2
L3
L5
G1
M6
H2

U1
V2

E11
D10
F10

AK6
AN5
R33
U31

AE1
AH4
AK2
M2
M4

B8
A5
B4
C5

VMMC
TP112
TP113
TP114
TP115
TP116

R114
5.6K
R116

1K

MUIC_INT
BAT_TEMP
SIM1_DATA
SIM1_RST
SIM1_CLK
SIM2_DATA
SIM2_RST
SIM2_CLK

JACK_DETECT
BT_32K

BT_HOST_WAKEUP

BAT100
CAM_DATA00
CAM_DATA01
CAM_DATA02
CAM_DATA03
CAM_DATA04
CAM_DATA05
CAM_DATA06
CAM_DATA07

CAM_VSYNC
CAM_RESET
CAM_PD
CAM_PCLK

BT_PCMIN
BT_RESET

MMC_DATA0
MMC_DATA1
MMC_DATA2
MMC_DATA3
MMC_DET
CAM_HSYNC
CAM_MCLK

BT_PCM_CLK
BT_PCMOUT

MMC_CLK
MMC_CMD

VA100
BT_POWER_EN

C136
1u
KEYPAD_LED
SYS_RESET
END_KEY

BAT_TEMP

VIO
Back-up Battery
R117
100K X101
FC-135
1 2

C137 32.768KHz C138

LOW : DEMUX
27p 22p
BT_PCM_SYNC

HIGH : MUX

OJ100 OJ101 OJ102OJ103 OJ104

LGE Internal Use Only - 120 - Copyright © 2012 LG Electronics. Inc. All right reserved.
Only for training and service purposes
 7. CIRCUIT DIAGRAM

3.5phi HEADSET
AUDIO SUBSYSTEM VBAT

VIO

5-1-2-6_TPA2055D3/R_MTK&IFX_Dual_Ver0.1
R200

VHP_1V8 1M
C200 C201 S
2.2u 0.1u
G R251 C271 1n
FM_ANT
Place 0.1uF close to AMP Q200 1K

C202 VA224
L200
D 8p
270n
R201

2.2u C203 100K

R204 1800

D2

D4
DNI C264 10
CN200 FB200

HPVDD

SPVDD
1 JACK_DETECT
R206 12 C4 E3 FB201
SPEECH_N C3
IN3- OUT+
E4
R207 12
SPEECH_P IN3+ OUT-
FB202
2

C204 1u A3 B1
close to 3.5pi conn
SOUND_L C205 1u B3
IN1+ HPL HS_OUT_L
R208
FB204
6
M6-GND
0 FB210 1800
SOUND_R IN1- U200
A1
HS_OUT_R R209 5.6 1
M1-R
0 FB211 1800
A4
HPR HS_OUT_R HS_OUT_L
4D
M4-DETECT
C206 0.1u IN2+
5.6 FB206
C211 0.1u B4 D1
IN2- CP C266 VA200 VA201 VA202 M4-L

39pF

39pF
C214 C212 C213 4
C267 M5-MIC
B2 E1 1n 56p 56p 5
I2C_SDA1 C2
SDA CN 2.2u 1n VA203 VA204
DNI J200
I2C_SCL1

C215

C216
SCL
CPVDD

CPVSS
BIAS

GND

FB207

1800
A2

E2

C1

D3

C217 C218 C219

2.2u 2.2u 2.2u R256

VIO MICBIAS VA205

VHP_MIC_2V0

BB side place
47K R221

R216

1K
T_FLASH_SIM_COMBO
R217

MAIN MICROPHONE
VA225
1.5Kohms
MMC_DET
C223 R254
R218 C222 HP_MIC_N

2.2Kohms
C265 0.1u 820
10u C224

R219
1u 2.2K
39p
C225
R255
HP_MIC_P HOOK_DET
19

0.1u 820
VMMC 18 C228 R220 VA226 C226
ST2
G1

17 MIC200
ST1
MAIN_MIC_P 2.2u
0.1u 820 1
C229 C263
2
47p 9p
1 C230
S4 R222
2 MAIN_MIC_N
MMC_DATA2 T1 820
3 0.1u
MMC_DATA3 T2
4 VA206 VA207
MMC_CMD T3 C231 C232
S200

5 R223
T4 2.2K
6 DNI DNI
MMC_CLK T5
7
T6
8
MMC_DATA0 T7
9
T8
VUSB_CHG_IN
MMC_DATA1 10 VSIM2
S8
Line Width: 2mm
G3

G2
S7
S3
S6
S2
S5
S1

CN201
C270C235 GND
21

11
12
13
14
15
16

20

VA209 VA210VA211 VA212 VA213 VA214

6
1u 1u C269 C268 C233 8

1n 22p 10
560p
12
14
VSIM2
1
C234 2
MUIC_IO_M
1u 3
MUIC_IO_P
SIM2_RST 4
R246 MUIC_ACC_ID 5
DNI
SIM2_CLK 7

VA222 VA221
SIM2_DATA VIO
Dual SIM Controller MINI_ABB For AGR Without Audio C236
9
11
13
VA223 C261
DNI VBAT
No CCDS 22pF 15

VSIM_1 VCAMD TORCH_3V3 VIB_3V3 VHP_MIC_2V0

C237 C238
C239 2.2u 1u VSIM_2
VSIM_1 2.2u

SIM_CONNECTOR
VSIM_1

LCD_LED_CA1
LCD_LED_CA2
LCD_LED_CA3
SYS_RESET
C257 VUSB_LDO_4V9 VBAT
C240 C241 C242 C243
J201 1u 1u 1u 1u
23

19

R225 1u C258
4

DNI 4 1
C5 C1
SYSRSTB

VIO

VBAT

5 2 1u
C6 C2 SIM_RST_1
6 3
SIM_DATA_1 C7 C3 SIM_CLK_1 VSIM1
10 7 5
GND4 GND1 SCLK1/GPIO1 SIM_CLK_1
9 8 TP200 6
GND3 GND2 SIM1_CLK SIMCLK1/GPI13 SRST1/GPIO2 SIM_RST_1 C244 C245
VA215 C247 VA216 VA217 15 7 VUSB_CHG_IN
C249 SIO1/GPIO3 SIM_DATA_1 1u
1u DNI TP201 SIMRST1/GPI14
8 1u
SIM1_RST 14
VSIM2 VIO

10
TP202 3

7
8
9

1
2
4
5
SIM1_DATA SIMIO1/GPI15 SCLK2/GPIO4 SIM_CLK_2
13 2

LED1
LED2
LED3
LED4

OUT1
OUT2
OUT3
OUT4
SRST2/GPIO5 SIM_RST_2 3 C250
1 VIN
SIO2/GPIO6 SIM_DATA_2 25 23
28 VBAT1 VBUS1
1u
SIMCLK2/GPI16
U202

16 26 24
VBAT2 VBUS2
VSIM3
27 R226 47K
SIMRST2/GPI17 SCLK3/GPIO7 VSIM1
17 24 27 22
EXPDET D- MUIC_IO_M
SRST3/GPIO8 21
25 U203 D+ MUIC_IO_P
SIMIO2/GPI18 SIO3/GPIO9 11 20
18 26 R247 0 FB209 120
R241 USB_DM USB1DM ID MUIC_ACC_ID
R248 0 12 19 R227
CE0 VSIM4 USB_DP USB1DP R2_2K
20 9 13 18 2.2K
UART_RX

SIM_CONNECTOR
USB2DM CLDO
SCLK4/GPIO10 0
14
10 UART_TX USB2DP
I2C_SCL2 SCL SRST4/GPIO11 15
VSIM_2 21 11 C259 AUDL
VSIM_2 SIO4/GPIO12 16
12 AUDR
I2C_SDA2 SDA 1u
GND

R250 17
22
HOOK_DET MIC

PGND
GND1
GND2
INTB
SDA
32

SCL
470
DSS
29

J202
R231 C252

29
30
31

6
28
33
4 1 VUSB_LDO_4V9
DNI C5 C1 R232 47K 10n
5 2
C6 C2 SIM_RST_2
6 3
SIM_DATA_2 C7 C3 SIM_CLK_2 VIO
10 7
GND4 GND1
9 8
VA218 GND3 GND2
VA219 VA220
DSS : High--> Default UART
C254 C256
1u DNI

R233
2.2K
I2C_SDA1
I2C_SCL1
MUIC_INT

LGE Internal Use Only - 121 - Copyright © 2012 LG Electronics. Inc. All right reserved.
Only for training and service purposes
 7. CIRCUIT DIAGRAM

KEY BACKLIGHT
BATTERY CONNECTOR
LCD INTERFACE CONNECTOR
VBAT VIO
VIO VBAT

R300 VBAT
240K D2
R307 R308
3 C300
R320 C301 DNI 100K
BAT_TEMP 2 1u
1K
1
1u
VA317 ZD300
C318 D1
C302 C321 35
1u C303 C304 C320 LCD_LED_CA1
39p 100u 5.6n CN300 34
39p 1u FL300 LCD_LED_CA2 C305
DNI 33
LD300 LD301 LD302 LD303 LD304 LD305 1 9 LCD_LED_CA3 2.2u
LCD_WR INOUT_A1 INOUT_B1 32
2 8
19-217_BHC-ZM1N2QY_3T LCD_RS INOUT_A2 INOUT_B2 31
3 7
EDLH0015101 LCD_CS INOUT_A3 INOUT_B3 30
EMD2,5.1V,150mW,R/TP BLUE LED 4
INOUT_A4 INOUT_B4
6
29 R310
28 100K
LCD_VSYNC

G1
G2
27
LCD_RD

5
10
26
7.5pF
25

24
LCD_RESET
23

KEYPAD_LED 22

C319 FL301 21
C322
1u 1 9 20
1u
LCD_DATA07 INOUT_A1 INOUT_B1 19
2 8
LCD_DATA05 INOUT_A2 INOUT_B2 18
3 7

VIBRATOR
LCD_DATA03 INOUT_A3 INOUT_B3 17
4 6
LCD_DATA01 INOUT_A4 INOUT_B4 16

G1
G2
15

14

5
10
VIB_3V3 7.5pF 13

12

11
FL302 10

1 9 9
LCD_DATA06 INOUT_A1 INOUT_B1
2 8 8
VIO VIO
LCD_DATA04 INOUT_A2 INOUT_B2
3 7 7
LCD_DATA02 INOUT_A3 INOUT_B3
R312 0 VB300 4 6 6
LCD_DATA00 INOUT_A4 INOUT_B4 R311 5
1 LCD_ID

G1
G2
100K 4

5
10
3
2
7.5pF 2
C306 C307 1
VA300 C308 C309
33p 1u CN301
1u 1u
DNI
TORCH
TORCH_3V3 GP : LOW
LGIT : HIGH

R313

15
C310

4
3
2
1u
LD306

1
KEYPAD INTERFACE

SW1 SW2 EMI FILTER

KB300 KB301 CAM CONN
R301
KEY_ROW0 7.5pF
680

10
5
VA301
NUM 1 NUM 2 NUM 3 UP DOWN

VCAMD
G2
G1

VCAMA
KB302 KB303 KB304 KB305 KB306 CAM_DATA00 6
INOUT_B4 INOUT_A4
4
CAM_F_DATA[0]
CAM_DATA01 7
INOUT_B3 INOUT_A3
3
CAM_F_DATA[1]
R302
END CAM_DATA02 8
INOUT_B2 INOUT_A2
2
CAM_F_DATA[2]
KEY_ROW2 CAM_DATA03 9
INOUT_B1 INOUT_A1
1
CAM_F_DATA[3]
680 KB307
VA302 FL303

NUM 4 NUM 5 NUM 6 LEFT RIGHT END_KEY

KB308 KB309 KB310 KB311 VA303 FB300
KB312 7.5pF CN302
1 24 75

10
5
R303

G2
G1
KEY_ROW3 2 23
680
CAM_DATA04 6
INOUT_B4 INOUT_A4
4
CAM_F_DATA[4] CAM_F_DATA[7] I2C_SCL1
VA304
CAM_DATA05 INOUT_B3 INOUT_A3 CAM_F_DATA[5] 3 22
NUM 7 NUM 8 NUM 9 OK CAM_DATA06
7
8
INOUT_B2 INOUT_A2
3
2
CAM_F_DATA[6] CAM_F_DATA[6] I2C_SDA1
KB313 KB314 KB315 KB316 CAM_DATA07 9
INOUT_B1 INOUT_A1
1
CAM_F_DATA[7] 4 21
CAM_F_DATA[5]
FL304
5 20
R316
KEY_ROW4 CAM_F_DATA[4] CAM_VSYNC
680
VA305 6 19
R314
CAM_MCLK CAM_F_MCLK CAM_F_DATA[3] CAM_HSYNC
STAR NUM 0 SHARP SEND 10
7 18
KB317 KB318 KB319 KB320
C311 C312
CAM_F_DATA[2] CAM_F_MCLK
KEY_ROW4 8 17
DNI 7.5p
R304
CAM_F_DATA[1]
VA314 SW300
KEY_ROW1 1 9 16
680 3
VA306 CAM_F_DATA[0]
4 10 15
5
R315 CAM_F_PCLK
VA307 VA309 VA310 VA308 HOT_KEY 6 CAM_PCLK CAM_F_PCLK 11 14
VA311 7
10
CAM_RESET
2 C313 C314 12 13

CAM_PD
R309

680
R305

R306

R317

7.5p DNI C315 C316 C317

680

680

680
R318

680

KEY_COL4 (DIF_D8) VA312 VA313 1u 1u 1u

ENBY0034201
DNI DNI GB042-24S-H10-E3000
VA315
KEY_COL0

KEY_COL1

KEY_COL2

KEY_COL3

KEY_COL4

LGE Internal Use Only - 122 - Copyright © 2012 LG Electronics. Inc. All right reserved.
Only for training and service purposes
 7. CIRCUIT DIAGRAM

RF Part VLOGIC
C400

DNI

R402 C401 33p

HB_TX
51
RF_ANT_SW1
C403 33p
C402
LB_TX
GND400 ANT400

14
13

12

11

10

9
DNI

RSVD2
RSVD1

BS

VSW_EN

Tx_HB_IN

Tx_LB_IN
GND8
15
R407 10K
RF_TX_RAMP VRAMP GND6
16 8
GND5 VBAT
7
PA_EN TxEN GND4
17 6
U400 GND3
R409 C407 5
C406 RSVD
18
24K 220p VBATT2
4
DNI Rx1 VBATT1
19 3

RSVD3 GND2 C410 C408 C409

20 2
GND1 1u
1 10u 56p
C405 Rx2
21
100p

GND13
GND12
GND11

GND10
GND9
PGND
GND7

ANT
22
(10V,2125) (50V,C,NPO) (50V,C,NP0)
SW400

23
24
25

26

27
28
29
C411 C412 L400
2
ANT COMMON
1
100p 2.4n
G3 G4 100p
C413 3 4
L411
27n C415 C416
DNI
0.5p DNI

C417 18p
GSM850_RxP

L401
FL400 B9512 22n
1 IN O1_1 9
C418 18p
GSM850_RxN
O1_2 8 C419 18p
EGSM_RxP
O2_1 7
L402
9.1n 4 GND O2_2 6 L403

C_G1
C_G2
C_G3
C_G4
22n
2 3 5 10
C420 18p
EGSM_RxN
C421 5.6p
DCS_RxN

FL401 B9513 L404

1 IN O1_1 9 4.7n

O1_2 8
C422 5.6p
DCS_RxP
O2_1 7
C423 6.8p
PCS_RxN
L405 4 G1 O2_2 6

4.3n L406

G2
G3
G4
G5
2 3 5 10
5.6n

C424 6.8p
PCS_RxP

BT & FM

I2C_SCL3

I2C_SDA3
FM_ANT
CON ANT FEED VBAT

R410

SFCY0000901 R415

0
TP400 GND2 GND1
47
C428 100p C436
OUT IN

FL402

18p
C432 C430 C431
C438 C437
DNI DNI 1.5p DNI
DNI C433
1u

A1
A2
A3
B4
D5
A4
D6
A5
A6
B6
AVSS_BALUN
RF2G_N
AVDD28_TRX
I2C_CK
GPIO2
FM_RDS
GPIO4
I2C_DAT
RXLNA_INP_LA
RXLNA_INP_SA
R413 100K
C6 E1
AVDD28_FM VBAT
C426 1u B7 E2
FM_AUDIO_R AUROUT LDO28EN BT_POWER_EN
C425 1u C7 D1 C434 1n
FM_AUDIO_L AULOUT OSC_IN
B5 C1 BT_CLK_26M
AVSS28_FM2 AVDD28_SX
F2 U401 B2
TP401 VDD28 AVSS28_RF1
D7 D2 C435 1u
BT_HOST_WAKEUP GPIO0 VCC28OUT_FM
TP402 E7 C3
BT_CLK_REQUEST SRCLKENA T1P
D4 B3
TESTMODE AVSS28_RF3

AVSS28_FM1

LDODVOUT12
TP403 E5 C2
BT_32K EXT32K SYSRST_B AVSS28_RF2

VCC28OUT
F7 B1
UTXD1 PCMSYNC REXT
BT_UART_RX
PCMCLK

PCMOUT
URXD1

PCMIN

DVSS
R412
15K
E6
E4
F6
F5
C5
E3
F3
C4
D3
F1

TP404 C427 C429

1u 1u
BT_UART_TX
BT_RESET

BT_PCMOUT
BT_PCM_SYNC
BT_PCM_CLK

BT_PCMIN

LGE Internal Use Only - 123 - Copyright © 2012 LG Electronics. Inc. All right reserved.
Only for training and service purposes
 8. BGA PIN MAP

8.BGA PIN MAP

BGA IC pin check (U101)

c
c

: not in use

LGE Internal Use Only - 124 - Copyright © 2012 LG Electronics. Inc. All right reserved.
Only for training and service purposes
 8. BGA PIN MAP

BGA IC pin check (U100)

 Ball Diagram (Top View), PF38F5060M0Y3DK

: not in use

LGE Internal Use Only - 125 - Copyright © 2012 LG Electronics. Inc. All right reserved.
Only for training and service purposes
 9. PCB LAYOUT

9. PCB LAYOUT

snThY`W†thpu†lh][[\YWWX†XUXOGGGP

KB305

01
KB3

KB3
00
VA310

VA301
LD305

LD302
KB311

KB312
C300

C301
KB316
KB3

KB3
20

07
KB306

KB302 KB304
KB303
LD305 & LD302
LD300 & LD303
VA307
LD300

LD303
VA304
LD301 & LD304
C319

KB308 KB310

KB309 - No Key Backlight

KB313 KB315

KB314
LD301

LD304

KB317 KB319

KB318

LG-A290_MAIN_EAX64452001_1.1_TOP
LGE Internal Use Only - 126 - Copyright © 2012 LG Electronics. Inc. All right reserved.
Only for training and service purposes
 9. PCB LAYOUT

J200(3.5φ Headset) LD306

LD306(Torch LED)
- No 3.5φ Headset - No Torch
J200

FB210

C
N
20
0
C212
R217

C226
CN200(Speaker PAD)

FB207
- No Speaker
R219 R256

R254 VA205

CN302(Camera connector)

VB
30
- No Camera

0
VA224

VA201
FB200

FB211
C202

C213
L200
TP400

C310

C268

C269
R313

FB206 R209 C266 VB300(Vibrator PAD)

C219

C214

C218

C203
C233
CN201

VA225
VA226
24
- No Vibrator
FB204 R208 C267

VA200
R255

C
D
A
B

E
C217

CN302
C224 C215

1
C236

U200
C204 FB201 VA203

C264

VA300
C216
C223

C225

R312
C205 FB202 VA204

4
VA312

C206

C211

R207

R206
C307

FB300
VA313

C315
12

13

C200

C201
R320 C302

C318
C306

R226
R300 VA317
C316

C317

U200(Audio sub system)

R250
FL303 FL304

C314 VA218 VA219

CN300
- The Audio working bad

C105

C103
R315 C432

R204

R201
R231 VA220

VA202
Q200

R200

R251
C313 C254 C256 C430
C320
FB209

C250

C428
U203(miniABB)

R227

C252

C303
C431

ZD300
C304
C321
VA215
VA216

VA217
- No Charging

C247

R225

C249
J202(SIM3 socket)
C245

C244

- No USB
U203

R248
R233
- No SIM3 operation

R247
R232

- No LCD Backlight

C308

C309

C240

C241

C242

C243

J202

J201
J201(SIM2 socket)
CN301(LCD connector) - No SIM2 operation

CN301
- No LCD Display

U202(Dual SIM controller)

U100(Memory) - No SIM2, SIM3 operation

R310
C305
FL302

R308
C322

- No booting FL301

R307
FL300

SW300
R311

SW300(SIM switch)
C312

C107
R101
R314
K

C311
J

C108
- No SIM change operation
R100 H
G
U100
BAT100(Backup Battery)
F

C139
C237

C106

C257

C258
BAT100
E R221
D C238

R241
C R301 VA305
R103

- No service
B
VA306

C427

C434

R412

C435
R316

C433
C259

FL402
A

C117
R415
R109

R304 VA314

TP201

TP202
C115

C135
U202

VA315

VA308
R303 C429

R317
14 1

C437
D
C
E

A
F
R114
R110

1
R305

TP116
R413 C436

C438
U401
U401(BT/FM)

TP115TP114
AP R117

VA309 VA311
R306
AN
AM

R104

R105
AL TP200

VA100

R318
C239
TP112
AK
R106

R107

7
AJ

- The FM Radio working bad (in use

R309

TP113
AH
R410
C113

AG

C425

C426
AF

TP403 TP404
C234 R246 C261
AE C271
C116

R108

TP402

C138
U101(DBB)
TP401
AD

FB100
VA221 VA223 VA222

C110
X101
AC

intenna)
C114
C118

AB
AA
FB105 C140 Y

C137
W C112

- No Power on
V
U101
- The Bluetooth working bad
U
T

FB101
R
R102
X100

P
N

- No service
M
L
K L100

C124
J
H
G
F
E
C121 D
C
FB102

B C136

C235
C141
34 33 32 31 30 29 28 27 26 25 24 23 22 21 20 19 18 17 16 15 14 13 12 11 10 9 8 7 6 5 4 3 2 1
L401 L403 L404 L406
VA103
VA104
VA101 VA302
VA102

VA303
R116
C123

C111

C120

U400(RF module)
C126
C417

C418

C419

C420

C421

C422

C423

C424

C127

C128

C129

R113 C131 C132 R302 C109

S200
C122
VA214

- RF sensitivity
C133

C134

VA211
VA213

FL400 FL401
FB104

L405 C125 C130 VA212 S200(T-flash/SIM1 combo)

C406

C407

R409
L402

- Tx Power
C119

VA210
VA209

- No SIM1 operation
R407

- No service C402

- No u-SD Memory
C415

C416

U400

L400
C400
C412

C401

R216

C230

C228

R402
C222
SW400

C229
C403

R223 R218
R222

R220

C408 C232 C231

C410
SW400(mobile switch) C409 VA207 C263 VA206
C265 C270

- Can’t make a call

- Tx Low power
C411 C405
C413
L411

- Not good BER

- No Service MIC200
GND400
ANT400

- No MIC operation
MIC200

LG-A290_MAIN_EAX64452001_1.1_BOT
LGE Internal Use Only - 127 - Copyright © 2012 LG Electronics. Inc. All right reserved.
Only for training and service purposes
 10. ENGINEERING MODE

10. ENGINEERING MODE

Engineering mode is designed to allow a service man/engineer to view and test the basic functions provided by a
handset. The key sequence for switching the engineering mode on is “3845#*290# “Select. Pressing END will switch back
to non-engineering mode operation. Use Up and Down key to select a menu and press ‘select’ key to progress the test.
Pressing ‘back key will switch back to the original test menu.

[1] Device Test [3] SW sanity test [8] Engineer Mode

[1-1] All Auto Test [3-1] FPRI Test [8-1] Network Setting
[1-2] All Auto Test Result [3-2] E serial NO [8-1-1] Network Info
[1-3] Auto Detect [3-3] UA string [8-1-2] Band Selection
[1-4] Key Press Test [3-4] UA profile [8-1-3] PLMN list preference
[1-5] Camera Test [3-5] Unlock SIM [8-2] Device
[1-6] Display Test [3-6] DB Check [8-2-1] LCD
[1-7] Sound Test [3-6-1] Copy to user disk [8-2-2] GPIO
[1-8] Vibrator Test [3-6-2] Copy to Ext disk [8-2-3] PWM
[1-9] Acoustic loopback [3-6-3] CRC [8-2-4] EINT
[1-10] FM Radio [8-2-5] ADC
[1-11] Torch Test [8-2-6] Set Default Level
[1-12] LCD Backlight [4] Factory Reset [8-2-7] Set UART
[1-13] Keypad Backlight [8-2-8] Sleep Mode
[1-14] Vibrator Duration [8-2-9] DCM Mode
[1-15] LCD [5] Call Timer [8-2-10] Memory Info
[8-2-11] FM Radio
[8-2-12] PMU register settings
[2] ELT mode [6] Version [8-3] GPRS Act
[2-1] Automatic [8-3-1] Attach
[2-1-1] 1 Time [8-3-2] 1st PDP
[2-1-2] 2 Times [7] Resource BIN [8-3-3] 2nd PDP
[2-1-3] 3 Times [1-1] LANGPACK [8-4] Packet Data Connect
[2-1-4] 4 Times [1-2] CUSTPACK [8-4-1] SIM Slot1 Empty
[2-1-5] 5 Times [8-4-2] SIM Slot2 Empty
[2-1-6] 25 Times [8-4-3] SIM Slot3 Empty
[2-1-7] 100 Times [8-5] Debug Info
[2-1-8] Infinite Times [8-5-1] last Exception
[2-2] Manual [8-6] Bluetooth
[2-2-1] LCD backlight [8-6-1] General Test
[2-2-2] Ringtone [8-6-2] Bluetooth RF Test
[2-2-3] Vibrator [8-6-3] Bluetooth UPF Test
[2-2-4] Camera [8-6-4] A2 BT Test
[2-2-5] Audio loopback [8-7] Enable Fake Lang
[8-8] Heap freesize

LGE Internal Use Only - 128 - Copyright © 2012 LG Electronics. Inc. All right reserved.
Only for training and service purposes
 11. RF CALIBRATION

11RF CALIBRATION 11. RF CALIBRATION

11.1 Configuration of Tachyon

11 1 1 C
11.1.1 Configuration
fi ti off di
directory
t

LGA290
LGA290
LGA290
LGA290
LGA290

ͽ͸Ͷ͑ͺΟΥΖΣΟΒΝ͑ΆΤΖ͑΀ΟΝΪ ʹΠΡΪΣΚΘΙΥ͑ι͑ͣͨ͑͡͡ͽ͸͑ͶΝΖΔΥΣΠΟΚΔΤ͑͟ͺΟΔ͑͑͟ͲΝΝ͑ΣΚΘΙΥ͑ΣΖΤΖΣΧΖΕ͑͟
2/6 ΀ΟΝΪ͑ΗΠΣ͑ΥΣΒΚΟΚΟΘ͑ΒΟΕ͑ΤΖΣΧΚΔΖ͑ΡΦΣΡΠΤΖΤ

LGE Internal Use Only - 129 - Copyright © 2012 LG Electronics. Inc. All right reserved.
Only for training and service purposes
 11. RF CALIBRATION

11. RF CALIBRATION

11.1.2 Description of basic folders

Folder Description

Tachyon Exe file and MFC dll, UI dll is present.

Common dll files.

Common
(XML Data I/O , Auto Test Logic, Tachyon Logic Control, Communication)

Envirement files.
files
Config
(Port configuration, Loss adjust)

Instrument Tester control dll.

Model files is present.

Model (Model -> Solution (Qualcomm, EMP, ADI, INFINEON) -> MODEL
NAME(LGGM630, LGSH470, ..) -> BUYER NAME(SKT, TEL, VIVO, …)

OCX Conponent files.

files

PhoneCmd Phone communication file

Report Files is present.

Report
(Cal data, test data)

11.1.3 Description of configuration files

File Description

There are imformations to calibrate.

‘MODEL NAME’_Calibration.XML
It consist of calibration items.

‘MODEL NAME’_CallSetup.XML There are imformations to call.

It consists of default values

values.
‘MODEL NAME’_NV.INI
It is written when ‘cal&auto’ is begun.

‘MODEL NAME’_Sequence.XML It is described a testing procedures.

ͽ͸Ͷ͑ͺΟΥΖΣΟΒΝ͑ΆΤΖ͑΀ΟΝΪ ʹΠΡΪΣΚΘΙΥ͑ι͑ͣͨ͑͡͡ͽ͸͑ͶΝΖΔΥΣΠΟΚΔΤ͑͟ͺΟΔ͑͑͟ͲΝΝ͑ΣΚΘΙΥ͑ΣΖΤΖΣΧΖΕ͑͟
3/6 ΀ΟΝΪ͑ΗΠΣ͑ΥΣΒΚΟΚΟΘ͑ΒΟΕ͑ΤΖΣΧΚΔΖ͑ΡΦΣΡΠΤΖΤ

LGE Internal Use Only - 130 - Copyright © 2012 LG Electronics. Inc. All right reserved.
Only for training and service purposes
 11. RF CALIBRATION

11. RF CALIBRATION

11.2 How to use Tachyon

11 2 1 Model selection
11.2.1
Follow the procedure before start calibration & auto test

a. Click the icon, in tool bar.

Then, You can make a choice of LG-A165

LG-A290 for loading cfg files before run.

b. Select model name and then do double-click the buyer name.

You will see configuration files loaded in the right window with PASS information above

LG-A290

LG-A290
LG-A290
LG-A290
LG-A290
LG-A290
LG-A290
LG-A290 LG-A290

< Example of selection of model name>

ͽ͸Ͷ͑ͺΟΥΖΣΟΒΝ͑ΆΤΖ͑΀ΟΝΪ ʹΠΡΪΣΚΘΙΥ͑ι͑ͣͨ͑͡͡ͽ͸͑ͶΝΖΔΥΣΠΟΚΔΤ͑͟ͺΟΔ͑͑͟ͲΝΝ͑ΣΚΘΙΥ͑ΣΖΤΖΣΧΖΕ͑͟
4/6 ΀ΟΝΪ͑ΗΠΣ͑ΥΣΒΚΟΚΟΘ͑ΒΟΕ͑ΤΖΣΧΚΔΖ͑ΡΦΣΡΠΤΖΤ

LGE Internal Use Only - 131 - Copyright © 2012 LG Electronics. Inc. All right reserved.
Only for training and service purposes
 11. RF CALIBRATION

11. RF CALIBRATION

11.2.2 Start cal & auto

a. Click calibration & autotest button, in Tool bar

b. Calibration & autotest will be executed in order.

1) Precede Action.
- NV write
- Test command send.
2) RF Calibration
3) RF A
Auto
t ttestt
4) After action
- Phone reset
- Change UE to AMSS

ͽ͸Ͷ͑ͺΟΥΖΣΟΒΝ͑ΆΤΖ͑΀ΟΝΪ ʹΠΡΪΣΚΘΙΥ͑ι͑ͣͨ͑͡͡ͽ͸͑ͶΝΖΔΥΣΠΟΚΔΤ͑͟ͺΟΔ͑͑͟ͲΝΝ͑ΣΚΘΙΥ͑ΣΖΤΖΣΧΖΕ͑͟
6/6 ΀ΟΝΪ͑ΗΠΣ͑ΥΣΒΚΟΚΟΘ͑ΒΟΕ͑ΤΖΣΧΚΔΖ͑ΡΦΣΡΠΤΖΤ

LGE Internal Use Only - 132 - Copyright © 2012 LG Electronics. Inc. All right reserved.
Only for training and service purposes
 12. EXPLODED VIEW & REPLACEMENT PART LIST

13. EXPLODED VIEW & REPLACEMENT PART LIST

13.1 EXPLODED VIEW(SBOM)
ACQ00

EAB00
MBL01
Cover Assembly,Rear

ABA00
Bracket Assembly
SJMY00

EBP00 MCK00

PCB Assembly,Main
EBR00

EAJ00

AEX00 GGZZ00

MKC00

MJN00
EAC00

MBG00

EAA00

Can Assembly,Shield

ABM01
ADB00
MBL00
Dome Assembly,Metal
EAB01
Keypad Assembly,Main

Location Description
EBR00 PCB Assembly,Main
ACQ01 SJMY00 Motor,DC
ABA00 Bracket Assembly
ABM01 Can Assembly,Shield
ADB00 Dome Assembly,Metal
EAB00 Speaker,Dual Mode
EAJ00 LCD Module
EBP00 Camera Module
EAB01 Microphone,Condenser
GGZZ00 Screw,Tapping
ACQ00 Cover Assembly,Rear
MBG00 Button,Side
MBL00 Cap
MBL01 Cap,Receptacle
EAA00 PIFA Antenna,Multiple
ACQ01 Cover Assembly,Front
MJN00 Tape,Window
MKC00 Window,LCD
AEX00 Keypad Assembly,Main
MCK00 Cover,Battery
EAC00 Rechargeable Battery,Lithium Ion

LGE Internal Use Only - 133 - Copyright © 2012 LG Electronics. Inc. All right reserved.
Only for training and service purposes
 12. EXPLODED VIEW & REPLACEMENT PART LIST

12.2 ReplacementParts Note: This Chapterisused for reference,Part order is ordered

<Mechanic component> by SBOM standard on GCSC

Level LocationNo. Description PartNumber Spec Remark

1 AGQ000000 Phone Assembly AGQ86713301 LGA290.ABRASV SV:SILVER SILVER -

Cover
2 ACQ100400 ACQ85944501 LGA290.ABRASV SV:SILVER SILVER -
Assembly,EMS

5 ABA00 Bracket Assembly ABA74130801 LGA290.ABRAZY BK:Black -

6 MAZ000000 Bracket MAZ63334801 MOLD PC LGA290.ABRAZY BK:Black -

6 MJN000000 Tape MJN68004101 COMPLEX LGA290.ABRAZY BK:Black -

6 MJN009400 Tape,Camera MJN68003901 COMPLEX LGA290.ABRAZY BK:BLACK BLACK -

6 MCQ074200 Damper,Speaker MCQ66906201 COMPLEX LGA290.ABRAZY BK:Black -

5 MJN000002 Tape MJN68132901 COMPLEX LGA290.ABRAZY ZZ:Without Color -

5 MJN000001 Tape MJN68093701 COMPLEX LGA290.ABRAZY ZZ:Without Color -

Can
5 ABM01 ABM73677101 LGA290.ABRAZY BK:Black -
Assembly,Shield

Dome
5 ADB00 ADB73778401 LGA290.ABRAZY BK:Black -
Assembly,Metal

5 MEV000000 Insulator MEV63977601 COMPLEX LGA290.ABRAZY BK:Black -

5 MJN000000 Tape MJN67977501 COMPLEX LGA290.ABRAZY BK:Black -

COMPLEX LG-VX6000 ZZ:Without Color PID Label

5 MEZ000000 Label MLAZ0038301
4 Array PRINTING,

GGZZ0004901 BH + - 1.6mM 4mM SWCH FZB

3 GGZZ00 Screw,Tapping GGZZ0004901
SERVEONE CO., LTD.

Cover
3 ACQ00 ACQ85749801 LGA290.ABRAZY BK:Black -
Assembly,Rear

MOLD PC LUPOY SC-1004A LGA290.ABRAZY

4 MBG00 Button,Side MBG64406301
BK:Black -

LGE Internal Use Only - 134 - Copyright © 2012 LG Electronics. Inc. All right reserved.
Only for training and service purposes
 12. EXPLODED VIEW & REPLACEMENT PART LIST

Level LocationNo. Description PartNumber Spec Remark

4 MBL00 Cap MBL65136901 COMPLEX LGA290.ABRAZY BK:Black -

4 MBL01 Cap,Receptacle MBL65137001 MOLD RUBBER LGA290.ABRAZY BK:Black -

MOLD PC LUPOY SC-1004A LGA290.ABRAZY

4 MCK063300 Cover,Rear MCK66962301
BK:Black -

4 MCQ009400 Damper,Camera MCQ66816701 COMPLEX LGA290.ABRAZY BK:Black -

Damper
4 MCQ015700 MCQ66816801 COMPLEX LGA290.ABRAZY BK:Black -
Connector

COMPLEX C2000 CGRSV WA:White C2000

4 MEZ002100 Label,After Service MLAB0001102
USASV DIA 4.0 PRINTING,

4 MJN061100 Damper,Motor MCQ66837601 COMPLEX LGA290.ABRAZY BK:Black -

4 MKC009400 Window,Camera MKC64201401 CUTTING PMMA LGA290.ABRAZY BK:Black -

4 MKC041800 Window,IRDA MKC64180701 CUTTING PC LGA290.ABRAZY TR:Transparent -

4 MJN089300 Tape,Window MJN68004001 COMPLEX LGA290.ABRAZY BK:Black -

4 MDJ000000 Filter MDJ63324201 COMPLEX LGA290.ABRAZY BK:Black -

4 MCQ000000 Damper MCQ66837701 COMPLEX LGA290.ABRAZY BK:Black -

Cover
3 ACQ01 ACQ85744801 LGA290.ABRAZY BK:Black -
Assembly,Front

4 MJN00 Tape,Window MJN68003801 COMPLEX LGA290.ABRAZY BK:Black -

4 MDJ000000 Filter MDJ63286501 COMPLEX LGA290.ABRAZY BK:Black -

4 MCQ043300 Damper,LCD MCQ66816501 COMPLEX LGA290.ABRAZY BK:Black -

MOLD PC LUPOY SC-1004A LGA290.ABRAZY

4 MCK032700 Cover,Front MCK66981901
BK:Black -

4 MCR000000 Decor MCR64734501 COMPLEX LGA290.ABRASV ZZ:Without Color -

4 MKC00 Window,LCD MKC64180501 CUTTING PMMA LGA290.ABRAZY BK:Black -

Keypad
3 AEX00 AEX73878201 LGA290.ABRAZY BK:Black -
Assembly,Main

2 MEZ002100 Label,Approval MEZ64403301 COMPLEX LGA290.ABRASV ZZ:Without Color -

LGE Internal Use Only - 135 - Copyright © 2012 LG Electronics. Inc. All right reserved.
Only for training and service purposes
 12. EXPLODED VIEW & REPLACEMENT PART LIST

Level LocationNo. Description PartNumber Spec Remark

LGA290.ABRASV ZZ:Without Color LGA290

1 AGF000000 Package Assembly AGF76407301
BRA(Brazil Package)

1 AAD000000 Addition Assembly AAD85994601 LGA290.ABRASV ZY:Color Unfixed -

LGE Internal Use Only - 136 - Copyright © 2012 LG Electronics. Inc. All right reserved.
Only for training and service purposes
 12. EXPLODED VIEW & REPLACEMENT PART LIST

12.2 ReplacementParts Note: This Chapterisused for reference, Part order is ordered

<Main component> by SBOM standard on GCSC

Level LocationNo. Description PartNumber Spec Remark

PCB
3 EBR00 EBR74262801 LGA290.ABRAZY 1.0 Main
Assembly,Main

PCB Assembly
4 EBR071500 EBR74606301 LGA290.ABRAZY 1.0 Main
Main,Insert

5 SJMY00 Motor,DC SJMY0007104 3V 80mA 0A 12KRPM 0RPM 0SEC 0GF.CM 0OHM

5 RAA050100 Resin,PC BRAH0001301 UF2040 or 3075BHF . . NONE

1812-8T-04W2P Nd-Fe-B 700mW 8OHM 91DB

Speaker,Dual
5 EAB00 EAB62308201 720HZ 1812*3.0T wire 15mm DCCA coil WIRE
Mode
KIRYN TELECOM CO., LTD

GPM1233A1 QCIF 2.2INCH 176X220 350CD

COLOR 50% 4/3 400:1 120Hz Inverter N - -
5 EAJ00 LCD Module EAJ62010101
39.85x52.95x1.9t, ILI9225G-S (ILITEK)
GIANTPLUS TECHNOLOGY CO., LTD.

CW1334-ABDBS CW1334-ABDBS 1.3M hynix 1/6

5 EBP00 Camera Module EBP61322001
COWELL ELECTRONICS CO.,LTD

PCB Assembly
4 EBR071800 EBR74262901 LGA290.ABRAZY 1.0 Main
Main,SMT

5 SAD010000 Software,Mobile SAD33240401 Base V10b - BRAZIL MTK -

PCB Assembly
5 EBR071600 EBR74263001 LGA290.ABRAZY 1.2 Main
Main,SMT Bottom

KTJ6131E P-CHANNEL MOSFET -30V +-20 -0.05A

6 Q200 FET EQFP0007601 20OHM 100mW ESM R/TP 3P KEC
CORPORAITION

MCR01MZP5F1502 15KOHM 1% 1/16W 1005

6 R412 Resistor,Chip ERHZ0000221
R/TP - ROHM.

GRM155R71H561K 560pF 10% 50V X7R -

Capacitor
6 C268 ECZH0003118 55TO+125C 1005 R/TP - MURATA
Ceramic,Chip
MANUFACTURING CO.,LTD.

LGE Internal Use Only - 137 - Copyright © 2012 LG Electronics. Inc. All right reserved.
Only for training and service purposes
 12. EXPLODED VIEW & REPLACEMENT PART LIST

Level LocationNo. Description PartNumber Spec Remark

251M1002107MR12A168 100uF 20% 10V 50UA -

Capacitor,TA
6 C303 EAE62287901 55TO+125C 0.6OHM 3.2X1.6X1.1MM NONE SMD
Conformal
R/TP 1.2T max. MATSUO ELECTRIC CO.,LTD

VA206 ULCE0505C015FR 5V 0% 0.5F 1.0*0.5*0.55 NONE

6 Varistor SEVY0007301
VA207 SMD R/TP INNOCHIPS TECHNOLOGY

LQG15HS2N4S02D 2.4NH 0.3NH - 300mA

Inductor
6 L400 ELCH0003828 0.15OHM 6GHZ 8 SHIELD NONE 1.0X0.5X0.5MM
Multilayer,Chip
R/TP MURATA MANUFACTURING CO.,LTD.

KDZ5.1EV-RTK/P 5.2V 4.98TO5.2V 70OHM

6 ZD300 Diode,Zener EAH61793901
150mW ESC R/TP 2P 1 KEC CORPORAITION

MCR01MZP5J1R0 1OHM 5% 1/16W 1005 R/TP -

6 R256 Resistor,Chip ERHZ0000434
ROHM.

MCH155A040C 4pF 0.25PF 50V NP0 -55TO+125C

Capacitor
6 C408 ECCH0000105 1005 R/TP - ROHM Semiconductor KOREA
Ceramic,Chip
CORPORATION

FB204 MCR01MZSJ000 0OHM 5% 1/16W 1005 R/TP -

6 Resistor,Chip ERHZ0000401
FB206 ROHM.

LGE Internal Use Only - 138 - Copyright © 2012 LG Electronics. Inc. All right reserved.
Only for training and service purposes
 12. EXPLODED VIEW & REPLACEMENT PART LIST

Level LocationNo. Description PartNumber Spec Remark

C118
C120
C121
C123
C125
C126
C128
C129
C130
C131
C132
C133
C134
C136
C204
C205
C235 C1005X5R1A105KT000F 1uF 10% 10V X5R -
Capacitor
6 C238 ECZH0001215 55TO+85C 1005 R/TP - TDK KOREA
Ceramic,Chip
C240 COOPERATION
C241
C242
C243
C244
C245
C247
C254
C257
C258
C259
C265
C270
C308
C309
C310

C318
C320
C322
C425 C1005X5R1A105KT000F 1uF 10% 10V X5R -
Capacitor
6 C426 ECZH0001215 55TO+85C 1005 R/TP - TDK KOREA
Ceramic,Chip
C427 COOPERATION
C429
C433
C435

C108
C135
C201
C206 GRM36X7R104K10PT 100nF 10% 10V X7R -
Capacitor
6 C211 ECZH0003103 55TO+125C 1005 R/TP - MURATA
Ceramic,Chip
C223 MANUFACTURING CO.,LTD.
C225
C228
C230

LGE Internal Use Only - 139 - Copyright © 2012 LG Electronics. Inc. All right reserved.
Only for training and service purposes
 12. EXPLODED VIEW & REPLACEMENT PART LIST

Level LocationNo. Description PartNumber Spec Remark

MCR01MZP5J470 47OHM 5% 1/16W 1005 R/TP -

6 R410 Resistor,Chip ERHZ0000483
ROHM.

MCR01MZP5J471 470OHM 5% 1/16W 1005 R/TP -

6 R250 Resistor,Chip ERHZ0000484
ROHM.

C266
C267 MCH155CN102KK 1nF 10% 50V X7R -55TO+125C
Capacitor
6 C269 ECCH0000143 1005 R/TP - ROHM Semiconductor KOREA
Ceramic,Chip
C271 CORPORATION
C434

FL300
FL301
ICVE10184E070R101FR ESD/EMI 0HZ 7.5pF 0H
6 FL302 Filter,EMI/Power SFEY0011401
SMD R/TP INNOCHIPS TECHNOLOGY
FL303
FL304

C417
C418 MCH155A180J 18pF 5% 50V NP0 -55TO+125C
Capacitor
6 C419 ECCH0000113 1005 R/TP - ROHM Semiconductor KOREA
Ceramic,Chip
C420 CORPORATION
C436

R101
R103
R117
MCR01MZP5J104 100KOHM 5% 1/16W 1005 R/TP
6 R201 Resistor,Chip ERHZ0000406
- ROHM.
R308
R310
R311

VA101
VA102
VA103
VA104
VA200
VA201
VA203
VA204
VA224
VA225, ICVS0505500FR 5.6V 0% 50F 1.0*0.5*0.55 - SMD
6 Varistor SEVY0005402
VA226 R/TP INNOCHIPS TECHNOLOGY
VA302
VA303
VA305
VA306
VA308
VA309
VA311
VA314
VA315

LGE Internal Use Only - 140 - Copyright © 2012 LG Electronics. Inc. All right reserved.
Only for training and service purposes
 12. EXPLODED VIEW & REPLACEMENT PART LIST

Level LocationNo. Description PartNumber Spec Remark

PF38F5060M0Y3DK NOR/512 PSRAM/128

1.7VTO2V,1.7VTO1.95V 8.0*8.0*1.0 TR 56P
6 U100 IC,MCP,NOR EAN62212601 NOR+PSRAM BGA 512Mbit(MICRON 65nm,AAD
MUX)+128Mbit(WINBOND 65nm,AD MUX)
MICRON SEMICONDUCTOR ASIA PTE LTD.

R100
R113
R241 PCB
6 R247 ASSY,MAIN,PAD SAFP0000401 LG-LU3000 LGTBK,MAIN,A,
R248 SHORT
R312
R415

R104
R105
R106
R107
R109
MCR01MZP5J222 2.2KOHM 5% 1/16W 1005 R/TP
6 R110 Resistor,Chip ERHZ0000443
- ROHM.
R218
R219
R223
R227
R233

CL05A475MQ5NRNC 4.7uF 20% 6.3V X5R -

C109 Capacitor
6 ECCH0017601 55TO+85C 1005 R/TP 0.5MM SAMSUNG
C127 Ceramic,Chip
ELECTRO-MECHANICS CO., LTD.

BLM15BB750SN1D 75 ohm 1.0X0.5X0.5 25% 0.4

FB104
6 Filter,Bead SFBH0007103 ohm 0.3A SMD R/TP 2P 0 MURATA
FB300
MANUFACTURING CO.,LTD.

C1005C0G1H560JT000F 56pF 5% 50V NP0 -

C212 Capacitor
6 ECZH0000841 55TO+125C 1005 R/TP - TDK KOREA
C213 Ceramic,Chip
COOPERATION

C203
C214
CL05A225MQ5NSNC 2.2uF 20% 6.3V X5R -
C217 Capacitor
6 ECCH0000198 55TO+85C 1005 R/TP . SAMSUNG ELECTRO-
C218 Ceramic,Chip
MECHANICS CO., LTD.
C219
C226

LGE Internal Use Only - 141 - Copyright © 2012 LG Electronics. Inc. All right reserved.
Only for training and service purposes
 12. EXPLODED VIEW & REPLACEMENT PART LIST

Level LocationNo. Description PartNumber Spec Remark

C106
C107
C110
C112
GRM155R60J105K 1uF 10% 6.3V X5R -55TO+85C
C140 Capacitor
6 ECCH0004904 1005 R/TP - MURATA MANUFACTURING
C234 Ceramic,Chip
CO.,LTD.
C307
C315
C316
C317

R116
R216 MCR01MZP5J102 1KOHM 5% 1/16W 1005 R/TP -
6 Resistor,Chip ERHZ0000404
R251 ROHM.
R320

GRM1555C1H7R5D 7.5pF 0.5PF 50V C0G -

C312 Capacitor
6 ECCH0010501 55TO+125C 1005 R/TP - MURATA
C313 Ceramic,Chip
MANUFACTURING CO.,LTD.

R301
R302
R303
R304
R305 MCR01MZP5J681 680OHM 5% 1/16W 1005 R/TP -
6 Resistor,Chip ERHZ0000505
R306 ROHM.
R309
R316
R317
R318

R221
MCR01MZP5J473 47KOHM 5% 1/16W 1005 R/TP
6 R226 Resistor,Chip ERHZ0000486
- ROHM.
R232

MCR01MZP5J100 10OHM 5% 1/16W 1005 R/TP -

6 R204 Resistor,Chip ERHZ0000402
ROHM.

C215
C216 MCH155A390J 39pF 5% 50V NP0 -55TO+125C
Capacitor
6 C224 ECCH0000120 1005 R/TP - ROHM Semiconductor KOREA
Ceramic,Chip
C302 CORPORATION
C304

1005GC2T27NJLF 27NH 5% - 200mA 0.9OHM

Inductor
6 L411 ELCH0004715 1.4GHZ 8 SHIELD NONE 1.0X0.5X0.5MM R/TP
Multilayer,Chip
PILKOR ELECTRONICS LTD.

C122 GRM1555C1H5R6C 5.6pF 0.25PF 50V NP0 -

Capacitor
6 C421 ECCH0000185 55TO+125C 1005 R/TP - MURATA
Ceramic,Chip
C422 MANUFACTURING CO.,LTD.

LGE Internal Use Only - 142 - Copyright © 2012 LG Electronics. Inc. All right reserved.
Only for training and service purposes
 12. EXPLODED VIEW & REPLACEMENT PART LIST

Level LocationNo. Description PartNumber Spec Remark

GRM188R60J106M 10000000
C124 Capacitor
6 ECCH0005604 pF,6.3V,M,X5R,TC,1608,R/TP,0.8 mm MURATA
C222 Ceramic,Chip
MANUFACTURING CO.,LTD.

C103 MCH155A470JK 47pF 5% 50V NP0 -55TO+125C

Capacitor
6 C105 ECCH0000122 1005 R/TP - ROHM Semiconductor KOREA
Ceramic,Chip
C229 CORPORATION

BLM15PD600SN1D 60 ohm 1.0x0.5x0.5 25% 0.06

FB201
6 Filter,Bead EAM62072101 ohm 1.1A SMD R/TP 2P 0 MURATA
FB202
MANUFACTURING CO.,LTD.

49448-1611 Micro-SD 8P STRAIGHT SMD R/TP

6 S200 Socket,Card ENSY0018601
Combo MOLEX JAPAN CO.,LTD.

MCR01MZP5J152 1.5KOHM 5% 1/16W 1005 R/TP

6 R217 Resistor,Chip ERHZ0000529
- ROHM.

C405
C1005C0G1H101JT 100pF 5% 50V NP0 -
C411 Capacitor
6 ECZH0000813 55TO+125C 1005 R/TP - TDK KOREA
C412 Ceramic,Chip
COOPERATION
C428

IC,Digital
MT6253 0 0 0 NONE NONE 263P - BGA R/TP
6 U101 Baseband EUSY0409701
263P MEDIATEK SINGAPORE PTE.LTD.
Processor,GSM

C111
C113
C114 CL05F104ZO5NNNC 0.1uF -20TO+80% 16V Y5V -
Capacitor
6 C115 ECZH0004402 30TO+85C 1005 R/TP - SAMSUNG ELECTRO-
Ceramic,Chip
C116 MECHANICS CO., LTD.
C117
C141

R314 MCR01MZP5F10R0 10OHM 1% 1/16W 1005 R/TP

6 Resistor,Chip ERHZ0000206
R315 - ROHM.

C1005X7R1E562KT000F 5.6nF 10% 25V X7R -

Capacitor
6 C321 ECZH0001107 55TO+125C 1005 R/TP - TDK KOREA
Ceramic,Chip
COOPERATION

MCR01MZP5J562 5.6KOHM 5% 1/16W 1005 R/TP

6 R114 Resistor,Chip ERHZ0000499
- ROHM.

IC,Audio Sub TPA2055D3 1.6~5.5V 0W WLCSP R/TP 20P -

6 U200 EUSY0420001
System TEXAS INSTRUMENTS INCO.

LGE Internal Use Only - 143 - Copyright © 2012 LG Electronics. Inc. All right reserved.
Only for training and service purposes
 12. EXPLODED VIEW & REPLACEMENT PART LIST

Level LocationNo. Description PartNumber Spec Remark

VA209
VA210
VA211
VA212
VA213
VA214
VA215
ICVL0518100Y500FR 18V 0% 10F 1.0*0.5*0.55
6 VA216 Varistor SEVY0004301
NONE SMD R/TP INNOCHIPS TECHNOLOGY
VA217
VA218
VA219
VA220
VA221
VA222
VA223

FB100
FB101
FB105 BLM15BD182SN1D 1800 ohm 1.0X0.5X0.5 25%
6 FB200 Filter,Bead SFBH0008105 1.4 ohm 0.1A SMD R/TP 2P 0 MURATA
FB207 MANUFACTURING CO.,LTD.
FB210
FB211

MCR01MZP5F5101 5.1KOHM 1% 1/16W 1005

6 R102 Resistor,Chip ERHZ0000294
R/TP - ROHM.

C1005C0G1H090DT000F 9pF 0.5PF 50V NP0 -

Capacitor
6 C263 ECZH0000810 55TO+125C 1005 R/TP - TDK KOREA
Ceramic,Chip
COOPERATION

LQG15HS22NJ02D 22NH 5% - 300mA 0.42OHM

L401 Inductor
6 ELCH0003839 1.9GHZ 8 SHIELD NONE 1.0X0.5X0.5MM R/TP
L403 Multilayer,Chip
MURATA MANUFACTURING CO.,LTD.

RC1005F150CS 15OHM 1% 1/16W 1005 R/TP -

6 R313 Resistor,Chip ERHY0000181
SAMSUNG ELECTRO-MECHANICS CO., LTD.

B9512 881.5MHz, 942.5MHz 1.8*1.4*0.68 SMD

6 FL400 Filter,Saw,Dual SFSB0002305
R/TP 10P EPCOS PTE LTD.

MCR01MZP5F1003 100KOHM 1% 1/16W 1005

6 R413 Resistor,Chip ERHZ0000204
R/TP - ROHM.

B9513 1805M~1880M, 1930M~1990M 1.8*1.4*0.68

6 FL401 Filter,Saw,Dual SFSB0002306
SMD R/TP 10P EPCOS PTE LTD.

GB042-24S-H10-E3000 24P 0.40MM STRAIGHT

6 CN302 Connector,BtoB ENBY0034201
SOCKET SMD R/TP 1M - LS Mtron Ltd.

LGE Internal Use Only - 144 - Copyright © 2012 LG Electronics. Inc. All right reserved.
Only for training and service purposes
 12. EXPLODED VIEW & REPLACEMENT PART LIST

Level LocationNo. Description PartNumber Spec Remark

LFB212G45SG8A166 BPF 2.45KHZ 100Hz SMD

6 FL402 Filter,Ceramic SFCY0000901
R/TP 4P MURATA MANUFACTURING CO.,LTD.

R208 MCR01MZSJ5R6 5.6OHM 5% 1/16W 1005 R/TP -

6 Resistor,Chip ERHZ0000545
R209 ROHM.

R206 MCR01MZP5F12R0 12OHM 1% 1/16W 1005 R/TP

6 Resistor,Chip ERHZ0000348
R207 - ROHM.

CL10A106MP8NNNC 10uF 20% 10V X5R -

C119 Capacitor
6 ECCH0007803 55TO+85C 1608 R/TP 0.8MM SAMSUNG
C410 Ceramic,Chip
ELECTRO-MECHANICS CO., LTD.

MCR01MZP5F2403 240KOHM 1% 1/16W 1005

6 R300 Resistor,Chip ERHZ0000252
R/TP - ROHM.

C200
CL05A225MP5NSNC 2.2uF 20% 10V X5R -
C237 Capacitor
6 ECCH0007804 55TO+85C 1005 R/TP 0.5MM SAMSUNG
C239 Ceramic,Chip
ELECTRO-MECHANICS CO., LTD.
C305

MT6306 3.2~4.3V 999 ANALOG

6 U202 IC,Multiplexer EAN62228101 SWITCH/MULTIPLEXER QFN R/TP 28P SIM
Controller MEDIATEK INC.

C1005C0G1H330JT000F 33pF 5% 50V NP0 -

C306 Capacitor
6 ECZH0000830 55TO+125C 1005 R/TP - TDK KOREA
C401 Ceramic,Chip
COOPERATION

04-6293-635-005-829+ 35P 0.30MM FPC ANGLE

Connector,FFC/FP
6 CN301 ENQY0013901 BOTH SMD R/TP LOCKING FLIP TYPE
C/PIC
KYOCERA ELCO KOREA SALES CO.,LTD.

R220
R222 MCR01MZP5J821 820OHM 5% 1/16W 1005 R/TP -
6 Resistor,Chip ERHZ0000513
R254 ROHM.
R255

SNB1058A0RSMR Mini ABB : MUIC, Charger IC,

Current Sink, LDOs QFN R/TP 32P TEXAS
6 U203 IC,Mini ABB EAN62227701
INSTRUMENTS KOREA LTD, HONGKONG
BRANCH.

C138 MCH155A220JK 22pF 5% 50V NP0 -55TO+125C

Capacitor
6 C233 ECCH0000115 1005 R/TP - ROHM Semiconductor KOREA
Ceramic,Chip
C236 CORPORATION

CL05C270JB5NNNC 27pF 5% 50V NP0 -

Capacitor
6 C137 ECCH0000117 55TO+125C 1005 R/TP 0.5 SAMSUNG ELECTRO-
Ceramic,Chip
MECHANICS CO., LTD.

MCR01MZP5J105 1MOHM 5% 1/16W 1005 R/TP -

6 R200 Resistor,Chip ERHZ0000407
ROHM.

LGE Internal Use Only - 145 - Copyright © 2012 LG Electronics. Inc. All right reserved.
Only for training and service purposes
 12. EXPLODED VIEW & REPLACEMENT PART LIST

Level LocationNo. Description PartNumber Spec Remark

LQG15HS9N1J02D 9.1NH 5% - 300mA 0.26OHM

Inductor
6 L402 ELCH0003818 3.4GHZ 8 SHIELD NONE 1.0X0.5X0.5MM R/TP
Multilayer,Chip
MURATA MANUFACTURING CO.,LTD.

C1005CH1H0R5BT000F 0.5pF 0.1PF 50V NP0 -

Capacitor
6 C415 ECZH0001002 55TO+125C 1005 R/TP - TDK KOREA
Ceramic,Chip
COOPERATION

C1005C0G1H6R8CT000F 6.8pF 0.25PF 50V NP0 -

C423 Capacitor
6 ECCH0001001 55TO+125C 1005 R/TP - TDK KOREA
C424 Ceramic,Chip
COOPERATION

GU073-5P-SD-E1500 GU073-5P-SD-
6 CN201 Connector,I/O ENRY0008801
E1500,5,mm,ANGLE LS Mtron Ltd.

FC-135(12.5PF, +-20PPM) 32.768KHZ 20PPM

6 X101 Crystal EXXY0018701
12.5PF 32*15 SMD R/TP SEIKO EPSON CORP

MS-156C NONE STRAIGHT SOCKET SMD

6 SW400 Connector,RF ENWY0008701 T/REEL AU 50OHM 400mDB HIROSE KOREA
CO.,LTD

C403
MCR01MZP5F51R0 51OHM 1% 1/16W 1005 R/TP
6 R108 Resistor,Chip ERHY0000105
- ROHM.
R402

X1E000021043400 26MHZ 10PPM 0F NONE SMD

6 X100 Crystal EXXY0027401
R/TP EPSON TOYOCOM CORP

C1005NP0159CGTQ 1.5pF 0.25PF 50V C0G -

Capacitor
6 C431 EAE62563601 55TO+125C 1005 R/TP 0.55T max. DARFON
Ceramic,Chip
ELECTRONICS CORP.

MCR01MZP5J243 24KOHM 5% 1/16W 1005 R/TP

6 R409 Resistor,Chip ERHZ0000449
- ROHM.

5000-6P-1.8SLB SIM 6P STRAIGHT SMD R/TP -

6 J201,J202 Card Socket EAG63032701
HYUPJIN I&C CO.,LTD.

LQG15HS4N3S02D 4.3NH 0.3NH - 300mA

Inductor
6 L405 ELCH0003834 0.18OHM 6GHZ 8 SHIELD NONE 1.0X0.5X0.5MM
Multilayer,Chip
R/TP MURATA MANUFACTURING CO.,LTD.

PAS311HR-VG1 3.8 Backup Capacitor

Capacitor
6 BAT100 SMZY0023501 0.03F,Module Assembly, KOREA TAIYO
Assembly
YUDEN.CO., LTD.

Connector,Terminal KQ03LV1-3R 3P 2.50MM ANGLE SMD T/REEL

6 CN300 EAG62810901
Block NEMO HIROSE ELECTRIC CO., LTD.

LGE Internal Use Only - 146 - Copyright © 2012 LG Electronics. Inc. All right reserved.
Only for training and service purposes
 12. EXPLODED VIEW & REPLACEMENT PART LIST

Level LocationNo. Description PartNumber Spec Remark

CIG21L2R2MNE 2.2UH 20% - 500mA 0.5 0.95

Inductor,Wire
6 L100 ELCP0008017 0.16OHM - - SHIELD 2X1.25X1MM NONE R/TP
Wound,Chip
SAMSUNG ELECTRO-MECHANICS CO., LTD.

MT6626P/A-L BT2.1 EDR, FM Radio(RDS),

6 U401 IC,Bluetooth EAN62212501 3.06x2.56x0.53, 110nm, 0.4pitch WLCSP R/TP 40P
MEDIATEK INC.

SKY77550 33DBM,33DBM,31DBM,31DBM
30DB,30DB,28DB,28DB 39%,39%,37%,37% 50UA
6 U400 Module,Tx Module SMRH0007101
1.46A,970mA -33DB,-33DB -45DBM -1.3DBM 28P
6.0x6.0x1.0MM - SKYWORKS SOLUTIONS INC.

C1005X7R1H221KT000F 0.22nF 10% 50V X7R -

Capacitor
6 C407 ECCH0000133 55TO+125C 1005 R/TP - TDK KOREA
Ceramic,Chip
COOPERATION

Microphone SOB410S44VRC 44DB 2.2KOHM OMNI 1.5TO4V

6 EAB01 EAB62291401
Condenser 4pi 1.2t SMD BSE CO., LTD.

LS12K2-T NONE 12VDC 0.02A HORIZONTAL 0GF

6 SW300 Switch,Tact ESCY0004401
T/REEL - CITIZEN ELECTRONICS CO.,LTD.

EVLC5S02100 5.5V 0% 100F 1.0*0.5*0.6 UL SMD

6 VA205 Varistor SEVY0005202
R/TP AMOTECH CO., LTD.

MCH153CN103KK 10nF 10% 16V X7R -

Capacitor
6 C252 ECCH0000155 55TO+125C 1005 R/TP - ROHM Semiconductor
Ceramic,Chip
KOREA CORPORATION

99-216UTC/TR8-1 WHITE 2.95~3.3 30mA

6 LD306 LED,Chip EDLH0015202 1440~1720mcd x, y 110mW - R/TP 2P -
EVERLIGHT ELECTRONICS CO., LTD.

1005GC2T5N6SLF 5.6NH 0.3NH - 300mA

Inductor 0.27OHM 3.2GHZ 8 SHIELD NONE
6 L406 ELCH0001054
Multilayer,Chip 1.0X0.5X0.5MM R/TP PILKOR ELECTRONICS
LTD.

CL10A105KB8NNNC 1uF 10% 50V X5R -

Capacitor
6 C250 EAE62505701 55TO+85C 1608 R/TP 0.9T max. SAMSUNG
Ceramic,Chip
ELECTRO-MECHANICS CO., LTD.

BLM15AG601SN1D 600 ohm 1.0X0.5X0.5 25% 0.6

6 FB102 Filter,Bead SFBH0008101 ohm 0.3A SMD R/TP 2P 0 MURATA
MANUFACTURING CO.,LTD.

ICVL0505101V150FR 5.6V 0% 60F 1.0*0.5*0.55

6 VA100 Varistor SEVY0003601
NONE SMD R/TP INNOCHIPS TECHNOLOGY

KJA-PH-0-0183 4P 4P ANGLE R/TP 3.5M BLACK

6 J200 Jack,Phone EAG63010701
5P Reverse shape KSD CO., LTD

LGE Internal Use Only - 147 - Copyright © 2012 LG Electronics. Inc. All right reserved.
Only for training and service purposes
 12. EXPLODED VIEW & REPLACEMENT PART LIST

Level LocationNo. Description PartNumber Spec Remark

LQG15HS4N7S02D 4.7NH 0.3NH - 300mA

Inductor
6 L404 ELCH0003835 0.18OHM 6GHZ 8 SHIELD NONE 1.0X0.5X0.5MM
Multilayer,Chip
R/TP MURATA MANUFACTURING CO.,LTD.

MCH155A080DK 8pF 0.5PF 50V NP0 -55TO+125C

Capacitor
6 C202 ECCH0000109 1005 R/TP - ROHM Semiconductor KOREA
Ceramic,Chip
CORPORATION

MCR01MZP5J103 10KOHM 5% 1/16W 1005 R/TP

6 R407 Resistor,Chip ERHZ0000405
- ROHM.

LK1005 R27K-T 270NH 10% - 25mA - - 1.2OHM

Inductor
6 L200 ELCH0010402 120MHZ 10 SHIELD NONE 1.0X0.5X0.5MM R/TP
Multilayer,Chip
TAIYO YUDEN CO.,LTD

BLM15AG121SN1D 120 ohm 1.0X0.5X0.5 25%

6 FB209 Filter,Bead SFBH0007101 0.25 ohm 0.5A SMD R/TP 2P 0 MURATA
MANUFACTURING CO.,LTD.

PCB
5 EBR071700 Assembly,Main EBR74263101 LGA290.ABRAZY 1.0 Main
SMT Top

6 EAX010000 PCB,Main EAX64452001 LGA290.ABRAZY 1.1 FR-4 SBL 6 0.8 Main

LGE Internal Use Only - 148 - Copyright © 2012 LG Electronics. Inc. All right reserved.
Only for training and service purposes
 12. EXPLODED VIEW & REPLACEMENT PART LIST

Level LocationNo. Description PartNumber Spec Remark

C118
C120
C121
C123
C125
C126
C128
C129
C130
C131
C132
C133
C134
C136
C204
C205
C235 C1005X5R1A105KT000F 1uF 10% 10V X5R -
Capacitor
6 C238 ECZH0001215 55TO+85C 1005 R/TP - TDK KOREA
Ceramic,Chip
C240 COOPERATION
C241
C242
C243
C244
C245
C247
C254
C257
C258
C259
C265
C270
C308
C309
C310

C318
C320
C322
C425 C1005X5R1A105KT000F 1uF 10% 10V X5R -
Capacitor
6 C426 ECZH0001215 55TO+85C 1005 R/TP - TDK KOREA
Ceramic,Chip
C427 COOPERATION
C429
C433
C435

LD300
LD301
19-217/BHC-ZM1N2QY/3T BLUE 2.7~3.2 25mA
LD302
6 LED,Chip EDLH0015101 18~45mcd 465~475nm 95mW 1608 R/TP 2P -
LD303
EVERLIGHT ELECTRONICS CO., LTD.
LD304
LD305

LGE Internal Use Only - 149 - Copyright © 2012 LG Electronics. Inc. All right reserved.
Only for training and service purposes
 12. EXPLODED VIEW & REPLACEMENT PART LIST

Level LocationNo. Description PartNumber Spec Remark

VA101
VA102
VA103
VA104
VA200
VA201
VA203
VA204
VA224
VA225 ICVS0505500FR 5.6V 0% 50F 1.0*0.5*0.55 - SMD
6 Varistor SEVY0005402
VA226 R/TP INNOCHIPS TECHNOLOGY
VA302
VA303
VA305
VA306
VA308
VA309
VA311
VA314
VA315

PIFA KI-M08720 QUAD -2DB 5 Metal Stamping Type -

4 EAA00 EAA62764501
Antenna,Multiple KOMATECH CO.,LTD

LGE Internal Use Only - 150 - Copyright © 2012 LG Electronics. Inc. All right reserved.
Only for training and service purposes
 12. EXPLODED VIEW & REPLACEMENT PART LIST

12.3 Accessory Note: This Chapterisused for reference,Part order is ordered

by SBOM standard onGCSC

Level LocationNo. Description PartNumber Spec Remark

Accessory,Data LG0038 ,1.2M,BLACK, ningbo broad

2 EBX000000 SGDY0017902
Cable telecommunication co.,ltd

EMB-LGE001STKE ,BLACK,4 POLE PLUG,3.5

2 EAB010200 Earphone,Stereo SGEY0003219
4,Earphone,Stereo CRESYN CO.,LTD

STA-U34BS 90Vac~264Vac 5.1V 700mA 5060 CE

2 EAY060000 Adapters SSAD0036504
NONE NONE - SALCOMP OY

SD-C02G2CYB(LQBKP) 2GBYTE 2.7VTO3.6V

IC,Memory MICRO SD CARD 15.0x11.0x1.0MM TR 8P 2GB
2 EAN011400 EAN62171601
Card,MICRO SD MicroSD Card (32nm TLC) TOSHIBA
ELECTRONICS KOREA CORPORATION

2 MCK00 Cover,Battery MCK67064501 MOLD PC LGA290.ABRAZY SF:SILVER BLACK -

BL-44JN-WWU-LGC PRISMATIC 3.7V 1.5AH

Rechargeable
300mAH 61x44x4.4 65x44x4.8 BLACK Bar type,
2 EAC00 Battery EAC61679601
Top cap Screw joint 444461, 1500mAh, Bar Type
Lithium Ion
(Top cap screw joint), WW, Up LG Chem,LTD.

COMPLEX LGA290.ABRASV ZZ:Without Color Full

2 MFL053800 Manual,Operation MFL67450001
manual for LG290 ABRA

LGE Internal Use Only - 151 - Copyright © 2012 LG Electronics. Inc. All right reserved.
Only for training and service purposes