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Publication date: October 2008

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Part No.
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Package Code No.

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SDB00167BEB
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AN17820B

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DATA SHEET

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1
AN17820B

Contents
„ Overview ………………………………………………….…………………………………………………………. 3
„ Features ………………………………………………….…………………………………………………………. 3
„ Applications ……….………………………………………………………………………………………………… 3
„ Package ……………………………………………………………………………………………………………. 3
„ Type …………………………………...……………………………………………………………………………. 3

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„ Application Circuit Example ……………………………………………………………………………………… 4
„ Block Diagram …………………………………….……………………………………………………………… 4

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„ Pin Descriptions …………………..………………………………………………………………………………. 5

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„ Absolute Maximum Ratings ……………………..……………..…………………………………………………. 6

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„ Operating Supply Voltage Range …………..……………………………………………………………………. 6
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„ Electrical Characteristics ………………….………………….………………….………………………………. 7

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„ Electrical Characteristics (Reference values for design) ………………….………………….………………. 7

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„ Technical Data …………………………………….………………….……………………………………………. 8

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• I/O block circuit diagrams and pin function descriptions …………........……………………………………. 8
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• Application information …........................………………..………….…………………………………………. 10

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• PD ⎯ Ta diagram …………........………….………………….…………………………………………………. 13
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„ Usage Notes ……….…..…………………….………………….…………………………………………………. 14
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SDB00167BEB 2
AN17820B

AN17820B
Dual channel BTL 7.5 W audio power amplifier with volume and standby
control

„ Overview
AN17820B is a monolithic integrated circuit designed for 7.5 W × 2-ch (8 Ω) output audio power amplifier. It is a dual channel
BTL IC suitable for stereo operation in TV application.

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„ Features
y Built-in stand-by circuit

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y Built-in volume circuit

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„ Applications
y ICs for low frequency amplifier

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„ Package
y 12 pin plastic single inline package with heat sink (SIP type)

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„ Type
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y Silicon monolithic bipolar IC
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SDB00167BEB 3
AN17820B

„ Application Circuit Example

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1 2 3 4 5 6 7 8 9 10 11 12

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1.0 μF 1.0 μF

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R2

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C1 C3
470 μF C2 10 μF 270 kΩ
R3

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100 nF R4
SP 8 Ω
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10 kΩ 10 kΩ SP 8 Ω

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68 kΩ

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VCC

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Standby Vin1 Vin2 Volume

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5V 1.25 V
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0V 0V
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Standby pin IC

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0V Off
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Note) This application circuit is shown as an example but does not guarantee the design for mass production set.
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„ Block Diagram
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_ _ _ _
+ + + +

1 2 3 4 5 6 7 8 9 10 11 12
Output Input Output
VCC
GND GND GND

Note) This block diagram is for explaining functions. The part of the block diagram may be omitted, or it may be simplified.

SDB00167BEB 4
AN17820B

„ Pin Descriptions
Pin No. Pin name Type Description
1 VCC Power supply VCC
2 OUT1(+) Output Channel 1 positive phase output
3 GND(OUT1) Ground GND for channel 1 output
4 OUT1(–) Output Channel 1 negative phase output

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5 Standby Input Standby
6 IN1 Input Channel 1 input
7 GND (Input) Ground Input GND

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8 IN2 Input Channel 2 input

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9 Volume Input Volume

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10 OUT2(–) Output Channel 2 negative phase output

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11 GND(OUT2) Ground GND for channel 2 output

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12 OUT2(+) Output Channel 2 positive phase output

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SDB00167BEB 5
AN17820B

„ Absolute Maximum Ratings

A No. Parameter Symbol Rating Unit Note
1 Supply voltage VCC 24.0 V *1, *2
2 Supply current ICC 4.0 A —
3 Power dissipation PD 1 904 mW *3
4 Operating ambient temperature Topr –25 to +70 °C *4
5 Storage temperature Tstg –55 to +150 °C *4

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Note) *1: The range under absolute maximum ratings, power dissipation.
*2: No signal input.

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*3: Power dissipation shows the value of only package at Ta = 70°C.

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When using this IC, refer to the • PD – Ta diagram in the „ Technical Data and use under the condition not exceeding the allowable value.

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*4: Expect for the storage temperature and operating ambient temperature, all ratings are for Ta = 25°C.

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„ Operating Supply Voltage Range

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Parameter Symbol Range Unit Note

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Supply voltage range VCC 5.0 to 18.0 V —

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Note) The values under the condition not exceeding the above absolute maximum ratings and the power dissipation.
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SDB00167BEB 6
AN17820B

„ Electrical Characteristics at VCC = 12.0 V

Note) Unless otherwise specified, Ta = 25°C±2°C, Frequency = 1 kHz, RL = 8 Ω.

B Limits No
Parameter Symbol Conditions Unit
No. Min Typ Max te

1 Quiescent circuit current ICQ Vin = 0 V, Vol = 0 V — 45 100 mA —

2 Standby current ISTB Vin = 0 V, Vol = 0 V — 1 10 μA —
3 Output noise voltage VNO Vol = 0 V, Rg = 10 kΩ — 0.25 0.6 mV[rms] *

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4 Voltage gain GV PO = 1.0 W, Vol = 1.25 V 38 40 42 dB —
5 Total harmonic distortion THD PO = 1.0 W, Vol = 1.25 V — 0.15 0.5 % —

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6 Maximum power output 1 PO1 THD = 10%, Vol = 1.25 V 6.0 7.5 — W —

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VCC = 15 V,
7 Maximum power output 2 PO2 10.0 12.5 — W —
THD = 10%, Vol = 1.25 V

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Rg = 10 kΩ, Vol = 0 V,
8 Ripple rejection ratio RR 30 50 — dB *

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Vr = 1 V[rms], fr = 120 Hz

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9 Output offset voltage VOFF Vol = 0 V, Rg = 10 kΩ –350 0 350 mV —

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10 Volume attenuation ratio Att PO = 1.0 W, Vol = 0 V 70 80 — dB *

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11 Channel balance 1 CB1 PO = 1.0 W, Vol = 1.25 V –1 0 1 dB —

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12 Channel balance 2 CB2 PO = 1.0 W, Vol = 0.6 V –2 0 2 dB —

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13 Middle voltage gain Gvm PO = 1.0 W, Vol = 0.6 V 26.5 29.5 32.5 dB —
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14 Channel crosstalk CT PO = 1.0 W, Vol = 1.25 V 40 55 — dB —
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Note) *: For this measurement, use the BPF = 15 Hz to 30 kHz (12 dB/OCT).
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„ Electrical Characteristics (Reference values for design) at VCC = 12.0 V

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Note) Unless otherwise specified, Ta = 25°C±2°C, Frequency = 1 kHz, RL = 8 Ω.

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The characteristics listed below are reference values for design of the IC and are not guaranteed by inspection.
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If a problem does occur related to these characteristics, Panasonic will respond in good faith to user concerns.
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B No
Parameter Symbol Conditions Unit
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No. Min Typ Max te

15 Standby pin current ISTB2 Vin = 0 V, VSTB = 3.0 V — — 25 μA —

16 Volume pin current IVOL Vin = 0 V, Vol = 0 V –12 — — μA —
17 Input impedance Zi Vin = ±0.3 VDC 24 30 36 kΩ —

SDB00167BEB 7
AN17820B

„ Technical Data
• I/O block circuit diagrams and pin function descriptions
Note) The characteristics listed below are reference values based on the IC design and are not guaranteed.

Pin
DC bias Internal circuit Description
No.
1 12 V typ. — Power supply pin.
1

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Driver Cct 2
Pre Amp
2

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VCC / 2 Channel 1 positive output pin

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3 0V — Ground for channel 1 output

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Driver Cct 4

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4 VCC / 2 Channel 1 negative output pin

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VCC / 2
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1k
5
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Standby control pin

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5 5 V typ. Standby "ON" = 0 V

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2k 30k Standby "OFF" = 5 V

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15k
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VREF

28.65k
6 1.45 V Channel 1 input pin.
1k
6

SDB00167BEB 8
AN17820B

„ Technical Data (continued)

• I/O block circuit diagrams and pin function descriptions (continued)
Note) The characteristics listed below are reference values based on the IC design and are not guaranteed.

Pin
DC bias Internal circuit Description
No.
7 0V — Input ground
VREF

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28.65k
8

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1.45 V Channel 2 input pin

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Volume control pin

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9 — 9 Volume "OFF" = 0V
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Max. Volume = 1.25 V

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Driver Cct 10
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10 VCC / 2 Channel 2 negative output pin

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11 0V — Ground for channel 2 output

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Driver Cct 12
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12 VCC / 2 Channel 2 positive output pin

500 11
29k
VCC / 2

SDB00167BEB 9
AN17820B

„ Technical Data (continued)

y Application information
1. Supply decoupling
To ensure a stable supply and achieve better ripple rejection, decoupling capacitors need to be connected to VCC (Pin 1).
Decoupling capacitors should have small equivalent series resistance (ESR). This is to prevent resistive losses and
introduction of undesirable phase shift to internal circuit.
A ceramic capacitor of 100 nF in parallel with a non-ceramic (tantalum or aluminum electrolytic) capacitor of 470 μF are
suggested. This combination has a small ESR over a wide frequency range.
Although small in size and ESR, large valued ceramic capacitor is not advisable to use. Current surges during power On/Off

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might store energy in the inductances of the power leads, and a large voltage spike could be created when the stored energy is
transferred from the inductances to the ceramic capacitor. The amplitude of the spike could exceed twice the supply voltage.

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Fig. 1. Practical capacitor
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Standby pin should be connected with carefully selected components in order to avoid "pop noise" during Standby On/Off

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transient.

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standby is switching on together with supply, this delay would be very useful to ensure no "pop noise".
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If the standby voltage is provided by a microcontroller, the suppression of "Pop" could even be better.
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The microcontroller can set a delay of 100 ms to 200 ms between the supply and Standby On/Off.
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The 68 kΩ and 270 kΩ resistor also from a voltage divider, which determines the Standby threshold.

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VCC

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270 kΩ 10 μF Output
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Fig. 2. Standby circuit Fig. 3. Standby On/Off logic

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3. Input DC decoupling
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Before the input signal reaches differential amplifier stage, its DC component should be remove.
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The capacitor of 1 μF pass only AC signal and the 10 kΩ resistor forms a DC path to ground.
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The 1 nF capacitor in parallel to the 10 kΩ resistor is optional and it serves to filter out high frequency noise at the input.
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10 kΩ 1 nF
Fig. 4. Input DC decoupling

SDB00167BEB 10
AN17820B

„ Technical Data (continued)

y Application information (continued)
4. Output zobel network
It should be noted that this device is designed such that the zobel network (RC pair) at the output pins is not necessary for
stable operation.
In practical application, the zobel network may be applied optionally for two reasons:
a) Ensuring stability for different PCB layout and speaker types.
b) Ability to withstand to high ESD

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Fig. 5. Output zobel network

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5. Good PCB layout can improve chip's performances.

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To reduce stray capacitances at the inputs and outputs, external components are to be placed as close to the pins as possible.
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PCB traces conducting huge current, such as those connected to supply or outputs, should be kept short and wide. This will
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keep inductances low and resistive loss to a minimum.
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The layout of test board is as shown below.

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SDB00167BEB 11
 M AN17820B

Output power per channel (W)

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„ Technical Data (continued)

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6. Output power (W) ⎯ Supply voltage (V)

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Conditions: Frequency = 1 kHz, RL = 8 Ω

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Supply voltage (V)

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 M AN17820B

• PD ⎯ Ta diagram
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„ Technical Data (continued)

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AN17820B

„ Usage Notes
1. This IC is intended to be used for general electronic equipment.
Consult our sales staff in advance for information on the following applications:
x Special applications in which exceptional quality and reliability are required, or if the failure or malfunction of this IC may
directly jeopardize life or harm the human body.
x Any applications other than the standard applications intended.
(1) Space appliance (such as artificial satellite, and rocket)
(2) Traffic control equipment (such as for automobile, airplane, train, and ship)
(3) Medical equipment for life support

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(4) Submarine transponder
(5) Control equipment for power plant
(6) Disaster prevention and security device
(7) Weapon

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(8) Others: Applications of which reliability equivalent to (1) to (7) is required

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2. Pay attention to the direction of LSI. When mounting it in the wrong direction onto the PCB (printed-circuit-board), it might
smoke or ignite.

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3. Pay attention in the PCB (printed-circuit-board) pattern layout in order to prevent damage due to short circuit between pins. In

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addition, refer to the „ Pin Description for the pin configuration.

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4. Perform a visual inspection on the PCB before applying power, otherwise damage might happen due to problems such as a solder-
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bridge between the pins of the semiconductor device. Also, perform a full technical verification on the assembly quality, because
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the same damage possibly can happen due to conductive substances, such as solder ball, that adhere to the LSI during
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transportation.

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5. Take notice in the use of this product that it might break or occasionally smoke when an abnormal state occurs such as output pin
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– VCC short (power supply fault), output pin – GND short (ground fault), output-to-output-pin short (load short), or pin shift and,
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safety measures such as an installation of fuses are recommended because the extent of the above-mentioned damage and smoke
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emission will depend on the current capability of the power supply.
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6. When designing your equipment, comply with the range of absolute maximum rating and the guaranteed operating conditions
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(operating power supply voltage and operating environment etc.). Especially, please be careful not to exceed the range of absolute
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maximum rating on the transient state, such as power-on, power-off and mode-switching. Otherwise, we will not be liable for any
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defect which may arise later in your equipment.

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Even when the products are used within the guaranteed values, take into the consideration of incidence of break down and failure
mode, possible to occur to semiconductor products. Measures on the systems such as redundant design, arresting the spread of fire
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or preventing glitch are recommended in order to prevent physical injury, fire, social damages, for example, by using the products.
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7. When using the LSI for new models, verify the safety including the long-term reliability for each product.
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8. When the application system is designed by using this LSI, be sure to confirm notes in this book.
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Be sure to read the notes to descriptions and the usage notes in the book.
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9. Ground the radiation fin so that there will be no difference in electric potential between the radiation fin and ground.

10. The thermal protection circuit operates at a Tj of approximately 150°C. The thermal protection circuit is reset automatically when
the temperature drops.

11. Make sure that the heat radiation design is effective enough if the VCC is comparatively high or the IC operates at high output
power.

12. Connect only ground pin for signal sources to the signal GND pin of the amplifier on the previous stage.

13. For installation to heat-sink, grease for heat-sink should be applied to reduce the contact heat resistance and increase the radiating
effect. Ensure that there is no foreign objects between IC and heat-sink which may cause cracks and additional stress to the IC.

SDB00167BEB 14
AN17820B

„ Usage Notes (continued)

14. The IC should be mounted onto a flat-surfaced heat-sink first, in a manner where little stress is applied, then solder the leads on
the IC to the board.

15. If the tightening torque of the heat-sink is too low, the heat resistance will become large. If it is too high, the physical device will
be distorted which might result in a failure. The tightening torque recommended is 78.5N.cm.

16. Fasten the heat-sink firmly on the chassis or board. Do not create a structure where the heat-sink is supported by the IC.

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17. The protection circuit is for maintaining safety against an abnormal operation. Therefore, design the protection circuit such that it
should not operate during normal operation. Especially for the over-temperature protection circuit, if the area of safe operation or
the absolute maximum rating is momentarily exceeded by output pin to VCC short, or output pin to GND short (ground fault), the

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LSI might be damaged before the over-temperature protection circuit starts working.

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18. Unless specified in the product specifications, make sure that negative voltage or excessive voltage are not applied to the pins

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because the device might be damaged, which could happen due to negative voltage or excessive voltage generated during the ON

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and OFF timing when the inductive load of a motor coil or actuator coils of optical pick-up is being driven.
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19. Check the risk that is caused by the failure of external components.

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20. In the event of abnormal operation condition whereby the output terminals swing towards supply / ground, the destruction of the
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speaker may result. As such, please ensure that the rating of the speaker is appropriate and made of non-flammable material.
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21. In the event of abnormal condition whereby the output terminals are short-circuit to ground or VCC terminal, very high heat

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dissipation may occur resulting in heat transfer directly or indirectly to peripheral components. Please consider non-flammable
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materials for the peripheral components or setup including the PCB.

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SDB00167BEB 15
 Request for your special attention and precautions in using the technical information and
semiconductors described in this book
(1) If any of the products or technical information described in this book is to be exported or provided to non-residents, the laws and
regulations of the exporting country, especially, those with regard to security export control, must be observed.

(2) The technical information described in this book is intended only to show the main characteristics and application circuit examples
of the products. No license is granted in and to any intellectual property right or other right owned by Panasonic Corporation or any
other company. Therefore, no responsibility is assumed by our company as to the infringement upon any such right owned by any
other company which may arise as a result of the use of technical information described in this book.

(3) The products described in this book are intended to be used for standard applications or general electronic equipment (such as office
equipment, communications equipment, measuring instruments and household appliances).
Consult our sales staff in advance for information on the following applications:
– Special applications (such as for airplanes, aerospace, automobiles, traffic control equipment, combustion equipment, life support
systems and safety devices) in which exceptional quality and reliability are required, or if the failure or malfunction of the prod-

ue e/
ucts may directly jeopardize life or harm the human body.
– Any applications other than the standard applications intended.

(4) The products and product specifications described in this book are subject to change without notice for modification and/or im-

tin nc
provement. At the final stage of your design, purchasing, or use of the products, therefore, ask for the most up-to-date Product
Standards in advance to make sure that the latest specifications satisfy your requirements.

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(5) When designing your equipment, comply with the range of absolute maximum rating and the guaranteed operating conditions
(operating power supply voltage and operating environment etc.). Especially, please be careful not to exceed the range of absolute

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maximum rating on the transient state, such as power-on, power-off and mode-switching. Otherwise, we will not be liable for any

cy
defect which may arise later in your equipment.

life
Even when the products are used within the guaranteed values, take into the consideration of incidence of break down and failure
mode, possible to occur to semiconductor products. Measures on the systems such as redundant design, arresting the spread of fire

ct
du
or preventing glitch are recommended in order to prevent physical injury, fire, social damages, for example, by using the products.

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(6) Comply with the instructions for use in order to prevent breakdown and characteristics change due to external factors (ESD, EOS,
.se ng ntin tin ty e ty ur
thermal stress and mechanical stress) at the time of handling, mounting or at customer's process. When using products for which
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damp-proof packing is required, satisfy the conditions, such as shelf life and the elapsed time since first opening the packages.

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(7) This book may be not reprinted or reproduced whether wholly or partially, without the prior written permission of our company.

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