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Semiconductor Device: Lecturers: DR - Eng. Arief Udhiarto, S.T.,M.T Source: U.C. Berkeley, Trinity College Dublin, Etc

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This document provides an overview of semiconductor devices and integrated circuits (ICs). It discusses how ICs are composed of interconnected electronic components on a single semiconductor chip. It traces the evolution of ICs from early prototypes in the 1950s to modern billion-component chips. The document also outlines how steady miniaturization of the transistor has enabled improvements in IC performance and cost through increased integration and device speeds. Today's most advanced transistors are measured in nanometers.

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Semiconductor Device: Lecturers: DR - Eng. Arief Udhiarto, S.T.,M.T Source: U.C. Berkeley, Trinity College Dublin, Etc

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51 views18 pages
This document provides an overview of semiconductor devices and integrated circuits (ICs). It discusses how ICs are composed of interconnected electronic components on a single semiconductor chip. It traces the evolution of ICs from early prototypes in the 1950s to modern billion-component chips. The document also outlines how steady miniaturization of the transistor has enabled improvements in IC performance and cost through increased integration and device speeds. Today's most advanced transistors are measured in nanometers.

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Lecture 1

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This document provides an overview of semiconductor devices and integrated circuits (ICs). It discusses how ICs are composed of interconnected electronic components on a single semiconductor chip. It traces the evolution of ICs from early prototypes in the 1950s to modern billion-component chips. The document also outlines how steady miniaturization of the transistor has enabled improvements in IC performance and cost through increased integration and device speeds. Today's most advanced transistors are measured in nanometers.

Copyright:

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Download as PDF, TXT or read online from Scribd
Download as pdf or txt
51 views18 pages

Semiconductor Device: Lecturers: DR - Eng. Arief Udhiarto, S.T.,M.T Source: U.C. Berkeley, Trinity College Dublin, Etc

Uploaded by

Mess Yeah
This document provides an overview of semiconductor devices and integrated circuits (ICs). It discusses how ICs are composed of interconnected electronic components on a single semiconductor chip. It traces the evolution of ICs from early prototypes in the 1950s to modern billion-component chips. The document also outlines how steady miniaturization of the transistor has enabled improvements in IC performance and cost through increased integration and device speeds. Today's most advanced transistors are measured in nanometers.

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You are on page 1/ 18

SEMICONDUCTOR DEVICE

Lecturers : Dr.Eng. Arief Udhiarto, S.T.,M.T


Source : U.C. Berkeley, Trinity College Dublin, etc
Room & Schedule
 Room: GK.304 Th. 08:00-09.40 AM

Electrical Engineering Department


Faculty of Engineering 2
Universitas Indonesia
Relation to Other Courses
 Prerequisite:
 Familiarity with the Bohr atomic model

 Relation to other courses:


 Electronics Circuit (ENEE614020)
 Semiconductor Device Fab & Laboratory
(ENEE606203)
 Introduction of Nanoelectronics (ENEE616034)

Electrical Engineering Department


Faculty of Engineering 3
Universitas Indonesia
Reading Material
 Primary Text :
Semiconductor Device Fundamentals : R. F. Pierret
(Addison Wesley, 1996)
 References Text:
 Solid State Electronic Devices 4th Edition: B. G.
Stretman, S. Banerjee (Prentice Hall, 2000)
 Device Electronics for Integrated Circuits 3rd
Edition: R. Muller, T. Kamins (Wiley & Sons, 2003)

Electrical Engineering Department


Faculty of Engineering 4
Universitas Indonesia
SAP
1. Course : Semiconductor Devices
2. Course Code : ENEE612006 Credit: 2 Semester: 2
3. Lecturers : Dr.Eng. Arief Udhiarto (AU)
4. Class System : Parallel
5. Course’s Objective : Students are able to explain basic concept
of semiconductor material for electronics
application, basic operation of metal-
semiconductor junction, p-n junction, bipolar
transistor, Metal-Oxide-Semiconductor Field-
Effect Transistor, current state of electronic
devices
6. Grading System (%) : Homework (15), Middle Test (30),
Seminar (20), Final Test (30),
attendance (5)

Electrical Engineering Department


Faculty of Engineering 5
Universitas Indonesia
Miscellany
 Academic (dis)honesty
 Faculty policy will be strictly followed
 Collaboration (not cheating!) is encouraged
 Classroom etiquette:
 Get to class on time!
 Turn off mobile phones, gadgets, etc.
 No distracting conversations
 Ask as many questions as possible

Electrical Engineering Department


Faculty of Engineering 6
Universitas Indonesia
Pre Test
1. What do you know about the following
semiconductor devices terminology
1. electron
2. hole
3. Generation and recombination
4. Forward bias
2. What makes semiconductor materials
important for electronic devices?
10 Minutes only

Electrical Engineering Department


Faculty of Engineering 7
Universitas Indonesia
Course Outline

Semiconductor Fundamentals; PN-Junction Diode


Metal-Semiconductor Contact

Bipolar Junction Transistor


IC Processing MOSFET
(other subject)

Electrical Engineering Department


Faculty of Engineering 8
Universitas Indonesia
Overview of IC Devices and
Semiconductor Fundamentals
Reading Assignment : Pierret Chap 1, Chap 2

Electrical Engineering Department


Faculty of Engineering 9
Universitas Indonesia
 An IC consists of interconnected electronic
components in a single piece ( chip ) of
semiconductor material

In 1959, Robert Noyce (Fairchild


In 1958, Jack S. Kilby (Texas Semiconductor) demonstrated an IC
Instruments) showed that it was made in silicon using SiO2 as the
possible to fabricate a simple IC in insulator and Al for the metallic
germanium. interconnects.

Electrical Engineering Department


Faculty of Engineering 10
Universitas Indonesia
Evolution of Bipolar Junction Transistors

Point Contact BJT


1947 https://theglobalscientist.com/2014/04/07/the-next-big-
step-in-computers-what-can-physics-offer-us/

Electrical Engineering Department


Faculty of Engineering 11
Universitas Indonesia
From a Few, to Billions
 By connecting a large number of components, each
performing simple operations, an IC that performs very
complex tasks can be built.
 The degree of integration has increased at an
exponential pace over the past ~40 years.
 The number of devices on a chip doubles every ~18 months, for
the same price.

http://electronicsbyexamples.blogspot.com/2013/03/milestones-in-
digital-electronics.html 12
Electrical Engineering Department
Faculty of Engineering 13
Universitas Indonesia
IC Technology Advancement
 Improvements in IC performance and cost have
been enabled by the steady miniaturization of
the transistor

Electrical Engineering Department


Faculty of Engineering 14
Universitas Indonesia
Advantages of Technology Scaling
• More dies per wafer, lower cost
• Higher-speed devices and circuits

Electrical Engineering Department


Faculty of Engineering 15
Universitas Indonesia
Today and Tomorrow

http://semimd.com/applied/tag/applied-materials/
Electrical Engineering Department
Faculty of Engineering 16
Universitas Indonesia
The Nanometer Size Scale

Electrical Engineering Department


Faculty of Engineering 17
Universitas Indonesia
State-of-the-art Transistor Size

 1µm = 10-6m = 10-4 cm = 1000 nm


 1 nm =10 Å

Electrical Engineering Department


Faculty of Engineering 18
Universitas Indonesia

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