TYWE3S Module Datasheet

Hardware Product Development > Network Modules > Wi-Fi Module >

WE Series Module

Version: 20210315

Online Version
 Contents

Contents

1 Overview 2
1.1 Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2
1.2 Applications . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2

2 Change history 3

3 Module interfaces 3
3.1 Dimensions and footprint . . . . . . . . . . . . . . . . . . . . . . . . 3
3.2 Pin definition . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4
3.3 Definitions on test points . . . . . . . . . . . . . . . . . . . . . . . . 6

4 Electrical parameters 7
4.1 Absolute electrical parameters . . . . . . . . . . . . . . . . . . . . . 7
4.2 Working conditions . . . . . . . . . . . . . . . . . . . . . . . . . . . 7
4.3 RF power consumption . . . . . . . . . . . . . . . . . . . . . . . . . 8
4.4 Working power consumption . . . . . . . . . . . . . . . . . . . . . . . 8

5 RF parameters 10
5.1 Basic RF features . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10
5.2 TX performance . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10
5.3 RX performance . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11

6 Antenna 12
6.1 Antenna type . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12
6.2 Antenna interference reduction . . . . . . . . . . . . . . . . . . . . . 12
6.3 Antenna connector specifications . . . . . . . . . . . . . . . . . . . . 13

7 Packaging information and production instructions 15

7.1 Mechanical dimensions . . . . . . . . . . . . . . . . . . . . . . . . . 15
7.2 Recommended PCB layout . . . . . . . . . . . . . . . . . . . . . . . . 16
7.3 Production instructions . . . . . . . . . . . . . . . . . . . . . . . . . 17
7.4 Recommended oven temperature curve . . . . . . . . . . . . . . . . . 19
7.5 Storage conditions . . . . . . . . . . . . . . . . . . . . . . . . . . . . 21

8 Appendix: Statement 22

i
 Contents

TYWE3S is a low-power embedded Wi-Fi module that Tuya has developed. It consists
of a highly integrated wireless RF chip (ESP8266), a few peripherals, an embedded
Wi-Fi network protocol stack, and varied library functions.

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 1 OVERVIEW

1 Overview

TYWE3S has an embedded low-power 32-bit CPU, 2-MB flash memory, 50-KB static
random-access memory (SRAM), and rich peripherals.

TYWE3S is an RTOS platform that integrates all function libraries of the Wi-Fi MAC
and TCP/IP protocols. You can develop embedded Wi-Fi products as required.

1.1 Features

• Embedded low-power 32-bit CPU, which can also function as an application

processor (The clock rate supports 80 Mhz and 160 Mhz)
• Working voltage: 3.0 to 3.6 V
• Peripherals: 9 GPIOs, 1 universal asynchronous receiver/transmitter (UART),
and 1 analog-to-digital converter (ADC)
• Wi-Fi connectivity

– IEEE 802.11 b/g/n

– Channels 1 to 14@2.4 GHz (CH1 to 11 for US/CA and CH1 to 13 for EU/CN)
– Support WEP/WPA/WPA2/WPA2 PSK (AES) security mode
– Up to +20 dBm output power in 802.11b mode
– Support STA/AP/STA+AP working mode
– Support SmartConfig and AP network configuration manners for Android
and IOS devices
– Onboard PCB antenna with a gain of 3.0 dBi
– Working temperature: -20 to +85℃

1.2 Applications

• Intelligent building
• Smart household and home appliances
• Smart socket and light
• Industrial wireless control
• Baby monitor
• Network camera
• Intelligent bus

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 3 MODULE INTERFACES

2 Change history

Update Date Updated Content Version after Update

07/23/2019 This is the first release. V2.0.0

3 Module interfaces

3.1 Dimensions and footprint

TYWE3S has two rows of pins with a 2mm pin spacing. The TYWE3S dimensions are
16±0.35 mm (W)×24±0.35 mm (L) ×3.4±0.15 mm (H). The thickness of the PCB is
0.8 mm±0.1 mm.

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 3 MODULE INTERFACES

3.2 Pin definition

Pin Number Symbol I/O type Function

1 RST I/O Hardware reset

pin (active low, a
resistor has been
pulled up
internally)

2 ADC AI ADC interface (1),

a 10-bit-precision
SAR ADC

3 EN I Enabling pin,
which needs to be
connected to the
voltage of 3.3V in
normal cases

4 GPIO16 I/O GPIO_16 ( when

used, it needs to
be connected to a
pulled-up resistor
of 10K)

5 GPIO14 I/O GPIO_14, which

corresponds to
MTMS (Pin 9) of IC

6 GPIO12 I/O GPIO_12, which

corresponds to
MTDI (Pin 10) of
IC

7 GPIO13 I/O GPIO_13, which

corresponds to
MTCK (Pin 12) of
IC

8 VCC P Power supply pin

(3.3V)

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 3 MODULE INTERFACES

Pin Number Symbol I/O type Function

9 GND P Power supply

reference ground

10 GPIO15 O GPIO_15 (in the

module power-on
initialization
process, use with
caution)

11 GPIO2 O UART0_TXD (used

to display the
module internal
information)

12 GPIO0 I/O GPIO_0 (in the

module power-on
initialization
process, use with
caution)

13 GPIO4 I/O GPIO_04, which

corresponds to
GPIO 4 (Pin 16) of
IC

14 GPIO5 I/O GPIO_05, which

corresponds to
GPIO 5 (Pin 24) of
IC

15 RXD0 I/O UART0_RXD (2)

16 TXD0 O UART0_TXD (2)

Note:

P indicates power supply pins, I/O indicates input/output pins, and AI indicates
analog input pins.

RST is only a module reset pin and cannot be used for clearing information about

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 3 MODULE INTERFACES

Wi-Fi network configuration.

Pin 2 ADC can only be used as an ADC interface but cannot be used as a common
IO interface. Once not used, it needs to be pulled up. As an ADC input interface,
the input voltage range is 0 to 1.0 V.

UART0 is a user-side serial interface. When the module is enabled, there is

information output from the user-side serial interface, which can be neglected.

3.3 Definitions on test points

Pin number Symbol I/O type Function

- TEST I Be used for

production tests
of the module.

Note: Test pins are not recommended for use.

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 4 ELECTRICAL PARAMETERS

4 Electrical parameters

4.1 Absolute electrical parameters

Minimum Maximum
Parameter Description value value Unit

Ts Storage -40 125 ℃

temperature

VIN Power supply -0.3 3.6 V

voltage

Static TAMB-25℃ - 2 KV
electricity
discharge
voltage
(human body
model)

Static TAMB-25℃ - 0.5 KV

electricity
discharge
voltage
(machine
model)

4.2 Working conditions

Minimum Typical Maximum

Parameter Description value value value Unit

Ta Working -20 - 85 ℃
tempera-
ture

VCC Working 3.0 3.3 3.6 V

voltage

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 4 ELECTRICAL PARAMETERS

Minimum Typical Maximum

Parameter Description value value value Unit

VIL IO low level -0.3 - VCC*0.25 V

input

VIH IO high VCC*0.75 - VCC V

level input

VOL IO low level - - VCC*0.1 V

output

VOH IO high VCC*0.8 - VCC V

level
output

Imax IO drive - - 12 mA
current

4.3 RF power consumption

Transmit Typical
Symbol Mode Rate power value Unit

Transmit 11b 11 Mbps +17 dBm 220 mA

Transmit 11g 54 Mbps +15 dBm 110 mA

Transmit 11n MCS 7 +13 dBm 100 mA

Receive 11b 11 Mbps Constantly 76 mA

receive

Receive 11g 54 Mbps Constantly 76 mA

receive

Receive 11n MCS7 Constantly 76 mA

receive

4.4 Working power consumption

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 4 ELECTRICAL PARAMETERS

Working Peak value

Working status, Ta = Average (Typical
mode 25°CTa=25℃ value value) Unit

Quick The module is 80 415 mA

connection in the fast
network state network
connection
state and the
Wi-Fi indicator
always
flashes

Hotspot The module is 90 451 mA

network in the hotspot
configuration network
state configuration
state and the
Wi-Fi indicator
always
flashes slowly

Network The module is 58.5 411 mA

connection connected to
idle state the network
and the Wi-Fi
indicator is
always on

Network The module is 100 411 mA

connection connected to
operation the network
state and the Wi-Fi
indicator is
always on

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 5 RF PARAMETERS

Working Peak value

Working status, Ta = Average (Typical
mode 25°CTa=25℃ value value) Unit

Disconnected The module is 80 430 mA

state disconnected
and the Wi-Fi
indicator is
dark

5 RF parameters

5.1 Basic RF features

Parameter Description

Working frequency 2.412 to 2.484 GHz

Wi-Fi standard IEEE 802.11 b/g/n (channels 1 to 14)

Data transmission rate 11b: 1, 2, 5.5, 11 (Mbps)

11g: 6, 9, 12, 18, 24, 36, 48, 54 (Mbps)

11n: HT20 MCS 0 to 7

Antenna type PCB antenna with a gain of 3.0 dBi

5.2 TX performance

Minimum Maximum
Parameter value Typical value value Unit

Average RF - 20 - dBm
output power,
802.11b CCK
Mode 11M

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 5 RF PARAMETERS

Minimum Maximum
Parameter value Typical value value Unit

Average RF - 17 - dBm
output power,
802.11g
OFDM Mode
54M

Average RF - 14 - dBm
output power,
802.11n
OFDM Mode
MCS7

Frequency -20 - 20 ppm

error

EVM@802.11b - - 16 - dB
CCK 11 Mbps
Mode 17.5
dBm

EVM@802.11g - - 30 - dB
OFDM 54
Mbps Mode
15.0 dBm

EVM@802.11n - -31 - dB
OFDM MCS7
Mode 14.0
dBm

5.3 RX performance

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 6 ANTENNA

Minimum Typical Maximum

Parameter value value value Unit

PER<8%, 1M - -91 - dBm

RX
sensitivity,
802.11b
CCK Mode

PER<10%, 54 M - -73 - dBm

RX
sensitivity,
802.11g
OFDM
Mode

PER<10%, MCS 7 - -70 - dBm

RX
sensitivity,
802.11n
OFDM
Mode

6 Antenna

6.1 Antenna type

TYWE3S uses an onboard PCB antenna with a gain of 3.0 dBi.

6.2 Antenna interference reduction

To ensure optimal Wi-Fi performance when the Wi-Fi module uses an onboard PCB
antenna, it is recommended that the antenna be at least 15 mm away from other
metal parts.

To ensure antenna performance, the PCB should not be routed or clad with copper
in the antenna area. The main points of the layout: 1. Make sure that there is no
substrate medium directly below or above the printed antenna. 2. Make sure that

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 6 ANTENNA

the area around the printed antenna is far away from the metal copper skin, so as
to ensure the radiation effect of the antenna to the greatest extent.

6.3 Antenna connector specifications

There is no antenna connector for this module at the moment.

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 6 ANTENNA

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 7 PACKAGING INFORMATION AND PRODUCTION INSTRUCTIONS

7 Packaging information and production instructions

7.1 Mechanical dimensions

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 7 PACKAGING INFORMATION AND PRODUCTION INSTRUCTIONS

7.2 Recommended PCB layout

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 7 PACKAGING INFORMATION AND PRODUCTION INSTRUCTIONS

7.3 Production instructions

• The stamp-hole module must be mounted by the SMT machine. After being
unpacked, it must be soldered within 24 hours. Otherwise, it must be put into
the drying cupboard where the RH is not greater than 10%, or it needs to be
packaged under vacuum again and the exposure time needs to be recorded

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 7 PACKAGING INFORMATION AND PRODUCTION INSTRUCTIONS

(the total exposure time cannot exceed 168 hours).

– SMT equipment:
∗ Mounter
∗ SPI
∗ Reflow soldering machine
∗ Oven temperature tester
∗ Automated optical inspection (AOI) equipment
– Baking equipment:
∗ Cabinet oven
∗ Anti-static heat-resistant pallets
∗ Anti-static heat-resistant gloves

• Storage conditions for a delivered module are as follows:

– The moisture-proof bag must be placed in an environment where the tem-

perature is below 40°C and the relative humidity is lower than 90%.

– The shelf life of a dry-packaged product is 12 months from the date when
the product is packaged and sealed.

– The package contains a humidity indicator card (HIC).

• The module needs to be baked in the following cases:

– Vacuum packing bag was found to be damaged before being unpacked.

– There is no humidity indicator card (HIC) in the vacuum packing bag.
– After being unpacked, 10% and above circles on the HIC become pink.
– The total exposure time has been more than 168 hours since unpacking.
– More than 12 months have passed since the sealing date of the bag.

• Baking settings:

– Temperature: 60°C and ≤ 5%RH for reelizing and 125°C and ≤5%RH for
palletizing (please use heat-resistant pallet rather than plastic pallet)

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 7 PACKAGING INFORMATION AND PRODUCTION INSTRUCTIONS

– Time: 48 hours for reelizing and 12 hours for palletizing

– Alarm temperature: 65°C for reelizing and 135°C for palletizing
– Production ready temperature after natural cooling: < 36°C
– The number of drying times: 1
– Re-baking condition: If a module remains unused for 168 hours after being
unpacked, it must be baked again. > Important: If this batch of modules
is not baked within 168 hours, do not use the wave soldering to solder
them. Because these modules are 3-level moisture-sensitive components,
they are very likely to get damp when exposed outside. In this case, if they
are soldered at high temperatures, it may result in component failure or
poor soldering.

• In the whole production process, take electrostatic discharge (ESD) protective

measures.

• To guarantee the passing rate, it is recommended that you use the SPI and AOI
to monitor the quality of solder paste printing and mounting.

7.4 Recommended oven temperature curve

Perform mounting with the SMT based on the following reflow oven temperature
curve. The highest temperature is 245°C. The reflow temperature curve is as be-
low:

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 7 PACKAGING INFORMATION AND PRODUCTION INSTRUCTIONS

• A: Temperature axis

• B: Time axis

• C: Liquidus temperature: 217 to 220°C

• D: Ramp-up slope: 1 to 3°C/s

• E: Duration of constant temperature: 60 to 120s; the range of constant tem-

perature: 150 to 200°C

• F: Duration above the liquidus: 50 to 70s

• G: Peak temperature: 235 to 245°C

• H: Ramp-down slope: 1 to 4°C/s

Note: The above curve is just an example of the solder paste SAC305.
For more details about other solder pastes, please refer to Recommended
oven temperature curve in the solder paste specifications.

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 7 PACKAGING INFORMATION AND PRODUCTION INSTRUCTIONS

7.5 Storage conditions

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 8 APPENDIX: STATEMENT

8 Appendix: Statement

FCC Caution: Any changes or modifications not expressly approved by the party
responsible for compliance could void the user’s authority to operate this equip-
ment.

This device complies with Part 15 of the FCC Rules. Operation is subject to the
following two conditions: (1) This device may not cause harmful interference, and
(2) this device must accept any interference received, including interference that
may cause undesired operation.

Note: This equipment has been tested and found to comply with the limits for a
Class B digital device, pursuant to part 15 of the FCC Rules. These limits are de-
signed to provide reasonable protection against harmful interference in a residen-
tial installation. This equipment generates, uses, and can radiate radio frequency
energy and, if not installed and used in accordance with the instructions, may cause
harmful interference to radio communications. However, there is no guarantee that
interference will not occur in a particular installation. If this equipment does cause
harmful interference to radio or television reception, which can be determined by
turning the equipment off and on, the user is encouraged to try to correct the inter-
ference by one or more of the following measures:

• Reorient or relocate the receiving antenna.

• Increase the separation between the equipment and receiver.
• Connect the equipment into an outlet on a circuit different from that to which
the receiver is connected.
• Consult the dealer or an experienced radio/TV technician for help.

Radiation Exposure Statement

This equipment complies with FCC radiation exposure limits set forth for an uncon-
trolled rolled environment. This equipment should be installed and operated with a
minimum distance of 20 cm between the radiator and your body.

Important Note

This radio module must not be installed to co-locate and operating simultaneously
with other radios in the host system except in accordance with FCC multi-transmitter
product procedures. Additional testing and equipment authorization may be re-
quired to operate simultaneously with other radio.

The availability of some specific channels and/or operational frequency bands are

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 8 APPENDIX: STATEMENT

country dependent and are firmware programmed at the factory to match the in-
tended destination. The firmware setting is not accessible by the end-user.

The host product manufacturer is responsible for compliance with any other FCC
rules that apply to the host not covered by the modular transmitter grant of certi-
fication. The final host product still requires Part 15 Subpart B compliance testing
with the modular transmitter installed.

The end-user manual shall include all required regulatory information/warning as

shown in this manual, including: This product must be installed and operated with
a minimum distance of 20 cm between the radiator and user body.

This device has got an FCC ID: 2ANDL-TYWE3S. The final end product must be la-
beled in a visible area with the following: “Contains Transmitter Module FCC ID:
2ANDL-TYWE3S”.

This device is intended only for OEM integrators under the following conditions:

1) The antenna must be installed such that 20 cm is maintained between the an-
tenna and users, and 2) The transmitter module may not be co-located with any
other transmitter or antenna.

As long as the 2 conditions above are met, further transmitter tests will not be re-
quired. However, the OEM integrator is still responsible for testing their end-product
for any additional compliance requirements required with this module installed.

Declaration of Conformity European Notice

Hereby, Hangzhou Tuya Information Technology Co., Ltd declares that this module
product is in compliance with essential requirements and other relevant provisions
of Directive 2014/53/EU, 2011/65/EU. A copy of the Declaration of conformity can
be found at https://www.tuya.com.

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 8 APPENDIX: STATEMENT

This product must not be disposed of as normal household waste, in accordance with
the EU directive for waste electrical and electronic equipment (WEEE-2012/19/EU).
Instead, it should be disposed of by returning it to the point of sale, or to a municipal
recycling collection point.

The device could be used with a separation distance of 20 cm to the human body.

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