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Silicon NPN Transistors BDP947-953

These silicon NPN transistors are suitable for AF driver and output stages due to their high collector current, high current gain, and low collector-emitter saturation voltage. They come in complementary PNP types and are available in the SOT223 package. Key parameters include a DC current gain of 25-475, collector-emitter saturation voltage below 0.5V, and transition frequency above 100MHz.

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0% found this document useful (0 votes)
138 views8 pages

Silicon NPN Transistors BDP947-953

These silicon NPN transistors are suitable for AF driver and output stages due to their high collector current, high current gain, and low collector-emitter saturation voltage. They come in complementary PNP types and are available in the SOT223 package. Key parameters include a DC current gain of 25-475, collector-emitter saturation voltage below 0.5V, and transition frequency above 100MHz.

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rolandse
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© © All Rights Reserved
We take content rights seriously. If you suspect this is your content, claim it here.
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BDP947_BDP949_BDP953

Silicon NPN Transistors

• For AF driver and output stages


4 3
• High collector current 2
• High current gain 1

• Low collector-emitter saturation voltage


• Complementary types: BDP948, BDP950,
BDP954 (PNP)
• Pb-free (RoHS compliant) package
• Qualified according AEC Q101

Type Marking Pin Configuration Package


BDP947 BDP947 1=B 2=C 3=E 4=C - - SOT223
BDP949 BDP949 1=B 2=C 3=E 4=C - - SOT223
BDP953 BDP953 1=B 2=C 3=E 4=C - - SOT223

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BDP947_BDP949_BDP953

Maximum Ratings
Parameter Symbol Value Unit
Collector-emitter voltage VCEO V
BDP947 45
BDP949 60
BDP953 100
Collector-base voltage VCBO
BDP947 45
BDP949 60
BDP953 120
Emitter-base voltage VEBO 5
Collector current IC 3 A
Peak collector current, tp ≤ 10 ms ICM 5
Base current IB 200 mA
Peak base current, tp ≤ 10 ms IBM 500
Total power dissipation- Ptot 5 W
TS ≤ 100 °C
Junction temperature Tj 150 °C
Storage temperature Tstg -65 ... 150

Thermal Resistance
Parameter Symbol Value Unit
Junction - soldering point1) RthJS ≤ 10 K/W

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BDP947_BDP949_BDP953

Electrical Characteristics at TA = 25°C, unless otherwise specified


Parameter Symbol Values Unit
min. typ. max.
DC Characteristics
Collector-emitter breakdown voltage V(BR)CEO V
IC = 10 mA, IB = 0 , BDP947 45 - -
IC = 10 mA, IB = 0 , BDP949 60 - -
IC = 10 mA, IB = 0 , BDP953 100 - -
Collector-base breakdown voltage V(BR)CBO
IC = 100 µA, IE = 0 , BDP947 45 - -
IC = 100 µA, IE = 0 , BDP949 60 - -
IC = 0 , IE = 100 µA, BDP953 120 - -
Emitter-base breakdown voltage V(BR)EBO 5 - -
IE = 10 µA, IC = 0
Collector-base cutoff current ICBO µA
VCB = 45 V, IE = 0 - - 0.1
VCB = 45 V, IE = 0 , TA = 150 °C - - 20
Emitter-base cutoff current IEBO - - 100 nA
VEB = 4 V, IC = 0
DC current gain2) hFE -
IC = 10 mA, VCE = 5 V 25 - -
IC = 500 mA, VCE = 1 V 100 - 475
IC = 2 A, VCE = 2 V, BDP947, BDP949 50 - -
IC = 2 A, VCE = 2 V, BDP953 15 - -
Collector-emitter saturation voltage2) VCEsat - - 0.5 V
IC = 2 A, IB = 0.2 A
Base emitter saturation voltage2) VBEsat - - 1.3
IC = 2 A, IB = 0.2 A

AC Characteristics
Transition frequency fT - 100 - MHz
IC = 50 mA, VCE = 10 V, f = 100 MHz
Collector-base capacitance Ccb - 25 - pF
VCB = 10 V, f = 1 MHz
1For calculation of R
thJA please refer to Application Note AN077 (Thermal Resistance Calculation)
2Pulse test: t < 300µs; D < 2%

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BDP947_BDP949_BDP953

DC current gain hFE = ƒ(IC) Collector-emitter saturation voltage


VCE = 2 V IC = ƒ(VCEsat ), hFE = 10

10 3 10 4

mA
100°C
-

25°C 10 3
-55°C
10 2
hFE

IC
100°C
25°C
10 2 -50°C

10 1

10 1

10 0 0 1 2 3 4
10 0
10 10 10 10 mA 10 0 0.1 0.2 0.3 0.4 V 0.6
IC VCEsat

Base-emitter saturation voltage Collector current IC = ƒ(VBE)


IC = (VBEsat), hFE = 10 VCE = 2 V

10 4 10 4

mA mA

10 3 10 3

-50°C -50°C
25°C 25°C
IC

IC

100°C 100°C

10 2 10 2

10 1 10 1

10 0 10 0
0 0.2 0.4 0.6 0.8 1 V 1.3 0 0.2 0.4 0.6 0.8 1 V 1.3
VBEsat VBE

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BDP947_BDP949_BDP953

Collector cutoff current ICBO = ƒ(TA) Collector-base capacitance Ccb = ƒ(VCB)


VCB = 45 V Emitter-base capacitance Ceb = ƒ(VEB)

10 5 500
nA
pF

10 4
400

CCB(CEB )
350
10 3
ICB0

300
max

10 2 250
CEB
200
10 1
150
typ

100
10 0

50
CCB
10 -1 0
0 20 40 60 80 100 120 °C 150 0 4 8 12 16 V 22
TA VCB(VEB

Total power dissipation P tot = ƒ(TS) Permissible Pulse Load RthJS = ƒ(tp)

5.5 10 2

4.5

4
10 1
RthJS
Ptot

3.5

D = 0,5
2.5
0,2
0,1
2
10 0 0,05
0,02
1.5
0,01
0,005
1
0
0.5

0 10 -1 -6 -5 -4 -3 -2 0
0 15 30 45 60 75 90 105 120 °C 150 10 10 10 10 10 s 10
ts tp

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BDP947_BDP949_BDP953

Permissible Pulse Load


Ptotmax/PtotDC = ƒ(tp )

10 3

-
Ptotmax/PtotDC

D=0
10 2 0.005
0.01
0.02
0.05
0.1
0.2
0.5
10 1

10 0 -6 -5 -4 -3 -2 0
10 10 10 10 10 s 10
tp

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Package SOT223 BDP947_BDP949_BDP953

Package Outline 1.6±0.1


6.5 ±0.2
A
3 ±0.1 0.1 MAX.

4 B

15˚ MAX.

3.5 ±0.2
7 ±0.3
1 2 3

0.5 MIN.
0.7 ±0.1 2.3 0.28 ±0.04
4.6 0...10˚
0.25 M A
0.25 M B
Foot Print 3.5

1.4
4.8
1.4

1.2 1.1

Marking Layout (Example)

Manufacturer
2005, 24 CW
Date code (YYWW)

BCP52-16
Type code

Pin 1

Packing
Reel ø180 mm = 1.000 Pieces/Reel
Reel ø330 mm = 4.000 Pieces/Reel
8 0.3 MAX.
12
7.55

6.8 1.75
Pin 1

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BDP947_BDP949_BDP953

Edition 2009-11-16

Published by
Infineon Technologies AG
81726 Munich, Germany

 2009 Infineon Technologies AG


All Rights Reserved.

Legal Disclaimer

The information given in this document shall in no event be regarded as a guarantee


of conditions or characteristics. With respect to any examples or hints given herein,
any typical values stated herein and/or any information regarding the application of
the device, Infineon Technologies hereby disclaims any and all warranties and
liabilities of any kind, including without limitation, warranties of non-infringement of
intellectual property rights of any third party.

Information

For further information on technology, delivery terms and conditions and prices,
please contact the nearest Infineon Technologies Office (<www.infineon.com>).

Warnings

Due to technical requirements, components may contain dangerous substances.


For information on the types in question, please contact the nearest Infineon
Technologies Office.
Infineon Technologies components may be used in life-support devices or systems
only with the express written approval of Infineon Technologies, if a failure of such
components can reasonably be expected to cause the failure of that life-support
device or system or to affect the safety or effectiveness of that device or system.
Life support devices or systems are intended to be implanted in the human body or
to support and/or maintain and sustain and/or protect human life. If they fail, it is
reasonable to assume that the health of the user or other persons may be
endangered.

8 2011-10-05

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