Features Description: LT8614 42V, 4A Synchronous Step-Down Silent Switcher With 2.5 A Quiescent Current
Features Description: LT8614 42V, 4A Synchronous Step-Down Silent Switcher With 2.5 A Quiescent Current
Features Description: LT8614 42V, 4A Synchronous Step-Down Silent Switcher With 2.5 A Quiescent Current
42V, 4A Synchronous
Step-Down Silent Switcher
with 2.5µA Quiescent Current
FEATURES DESCRIPTION
nn Silent Switcher® Architecture The LT®8614 step-down regulator features Silent Switcher
nn Ultralow EMI Emissions architecture designed to minimize EMI emissions while
nn High Efficiency at High Frequency delivering high efficiency at frequencies up to 3MHz.
nn Up to 96% Efficiency at 1MHz, 12V to 5V Assembled in a 3mm × 4mm QFN, the monolithic con-
IN OUT
nn Up to 94% Efficiency at 2MHz, 12V to 5V struction with integrated power switches and inclusion of
IN OUT
nn Wide Input Voltage Range: 3.4V to 42V all necessary circuitry yields a solution with a minimal PCB
nn Ultralow Quiescent Current Burst Mode® Operation: footprint. An ultralow 2.5µA quiescent current—with the
nn 2.5μA I Regulating 12V to 3.3V output in full regulation— enables applications requiring
Q IN OUT
nn Output Ripple < 10mV highest efficiency at very small load currents. Transient
P-P
nn Fast Minimum Switch On-Time: 30ns response remains excellent and output voltage ripple is
nn Low Dropout Under All Conditions: 125mV at 1A below 10mVP-P at any load, from zero to full current.
nn Safely Tolerates Inductor Saturation in Overload
The LT8614 allows high VIN to low VOUT conversion at high
nn Adjustable and Synchronizable: 200kHz to 3MHz
frequency with a fast minimum top switch on-time of 30ns.
nn Peak Current Mode Operation
Operation is safe in overload even with a saturated inductor.
nn Accurate 1V Enable Pin Threshold
nn Internal Compensation Essential features are included and easy to use: An open-
nn Output Soft-Start and Tracking drain PG pin signals when the output is in regulation. The
nn Small 18-Lead 3mm × 4mm QFN SYNC pin allows clock synchronization and choice of Burst
Mode operation or pulse-skipping mode. Soft-start and
tracking functionality is accessed via the TR/SS pin. An
APPLICATIONS accurate enable threshold can be set using the EN/UV pin
nn Automotive and Industrial Supplies and a resistor at the RT pin programs switch frequency.
nn General Purpose Step-Down All registered trademarks and trademarks are the property of their respective owners. Protected
by U.S. patents, including 8823345.
nn GSM Power Supplies
1µF 1µF 85
GND1 GND2
80
LT8614
PG BST
0.1µF 4.7µH VOUT 75
10nF
SYNC/MODE SW 5V
TR/SS BIAS 4A 70
1µF 4.7pF 1M
65
INTVCC FB 47µF
41.2k
243k 60
RT GND 0 0.5 1.0 1.5 2.0 2.5 3.0 3.5 4.0
LOAD CURRENT (A) 8614 TA01b
fSW = 1MHz 8614 TA01a
Rev. E
SYNC/MODE
BIAS...........................................................................30V
BST Pin Above SW Pin................................................4V
GND
PG
FB
FB, TR/SS, RT, INTVCC ................................................4V 20 19 18 17
SYNC/MODE Voltage ..................................................6V
BIAS 1 16 TR/SS
Operating Junction Temperature Range (Note 2)
INTVCC 2 15 RT
LT8614E.............................................. –40°C to 125°C
BST 3 14 EN/UV
LT8614I............................................... –40°C to 125°C 22
VIN1 4 13 VIN2
LT8614H............................................. –40°C to 150°C SW
GND1
SW
SW
GND2
UDC PACKAGE
18-LEAD (3mm × 4mm) PLASTIC QFN
θJA = 40°C/W, θJC(PAD) = 12°C/W (Note 3)
EXPOSED PAD (PINS 21, 22) ARE SW, SHOULD BE SOLDERED TO PCB
NOTE: PINS 5, 12 ARE REMOVED. CONFIGURATION DOES NOT MATCH
JEDEC 20-PIN PACKAGE OUTLINE
ORDER INFORMATION
LEAD FREE FINISH TAPE AND REEL PART MARKING* PACKAGE DESCRIPTION TEMPERATURE RANGE
LT8614EUDC#PBF LT8614EUDC#TRPBF LGGQ 18-Lead (3mm × 4mm) Plastic QFN –40°C to 125°C
LT8614IUDC#PBF LT8614IUDC#TRPBF LGGQ 18-Lead (3mm × 4mm) Plastic QFN –40°C to 125°C
LT8614HUDC#PBF LT8614HUDC#TRPBF LGGQ 18-Lead (3mm × 4mm) Plastic QFN –40°C to 150°C
OBSOLETE
LT8614MPUDC#PBF LT8614MPUDC#TRPBF LGGQ 18-Lead (3mm × 4mm) Plastic QFN –55°C to 150°C
Contact the factory for parts specified with wider operating temperature ranges. *The temperature grade is identified by a label on the shipping container.
Tape and reel specifications. Some packages are available in 500 unit reels through designated sales channels with #TRMPBF suffix.
ELECTRICAL CHARACTERISTICS
The l denotes the specifications which apply over the full operating
temperature range, otherwise specifications are at TA = 25°C.
PARAMETER CONDITIONS MIN TYP MAX UNITS
Minimum Input Voltage l 2.9 3.4 V
VIN Quiescent Current VEN/UV = 0V 1.0 3 µA
l 1.0 8 µA
VEN/UV = 2V, Not Switching, VSYNC = 0V 1.7 4 µA
l 1.7 10 µA
VEN/UV = 2V, Not Switching, VSYNC = 2V 0.26 0.5 mA
VIN Current in Regulation VOUT = 0.97V, VIN = 6V, Output Load = 100µA l 21 50 µA
VOUT = 0.97V, VIN = 6V, Output Load = 1mA l 210 350 µA
Note 1: Stresses beyond those listed under Absolute Maximum Ratings High junction temperatures degrade operating lifetimes. Operating lifetime
may cause permanent damage to the device. Exposure to any Absolute is derated at junction temperatures greater than 125°C.
Maximum Rating condition for extended periods may affect device Note 3: θ values determined per JEDEC 51-7, 51-12. See the Applications
reliability and lifetime. Information section for information on improving the thermal resistance.
Note 2: The LT8614E is guaranteed to meet performance specifications Note 4: This IC includes overtemperature protection that is intended to
from 0°C to 125°C junction temperature. Specifications over the –40°C protect the device during overload conditions. Junction temperature will
to 125°C operating junction temperature range are assured by design, exceed 150°C when overtemperature protection is active. Continuous
characterization, and correlation with statistical process controls. The operation above the specified maximum operating junction temperature
LT8614I is guaranteed over the full –40°C to 125°C operating junction will reduce lifetime.
temperature range. The LT8614H is guaranteed to meet performance
specifications from –40°C to 150°C operating junction temperature range.
Rev. E
EFFICIENCY (%)
EFFICIENCY (%)
EFFICIENCY (%)
80 80 60
75 75 50
70 70 40
65 fSW = 1MHz 65 fSW = 1MHz 30 fSW = 1MHz
L = 4.7µH L = 2.2µH L = 4.7µH
60 VIN = 12V 60 VIN = 12V 20 VIN = 12V
55 VIN = 24V 55 VIN = 24V 10 VIN = 24V
VIN = 36V VIN = 36V VIN = 36V
50 50 0
0 0.5 1 1.5 2 2.5 3 3.5 4 0 0.5 1 1.5 2 2.5 3 3.5 4 0.01 0.1 1 10 100 1000
LOAD CURRENT (A) LOAD CURRENT (A) LOAD CURRENT (mA)
8614 G01 8614 G02 8614 G03
70 94 VIN = 12V
85
EFFICIENCY (%)
EFFICIENCY (%)
EFFICIENCY (%)
60 VIN = 24V
92
50 VIN = 24V 80
90
40
fSW = 1MHz 75
30 88
L = 4.7µH
20 VIN = 12V
86 70
10 VIN = 24V
VIN = 36V
0 84 65
0.01 0.1 1 10 100 1000 0.25 0.75 1.25 1.75 2.25 2.75 0 2 4 6 8 10
LOAD CURRENT (mA) SWITCHING FREQUENCY (MHz) INDUCTOR VALUE (µH)
8614 G04 8614 G05 8614 G06
0.973 0.05
1.00
0.971
0.99 0
0.969
0.98
0.967 –0.05
0.02 3.0 15
0 2.5
–0.02 2.0 10
–0.04 1.5
–0.06 1.0 5
–0.08 0.5
–0.10 0 0
5 10 15 20 25 30 35 40 45 0 5 10 15 20 25 30 35 40 45 –55 –25 5 35 65 95 125 155
INPUT VOLTAGE (V) INPUT VOLTAGE (V) TEMPERATURE (°C)
8614 G10 8614 G11 8614 G12
Top FET Current Limit vs Duty Cycle Top FET Current Limit Bottom FET Current Limit
9.0 9.5 7.5
8.5 6.5
8.0
5% DC
8.0 6.0
7.5
7.5 5.5
7.0
7.0 5.0
350 34
SWITCH DROP (mV)
125 300 32
TOP SWITCH TOP SWITCH
100 250 30
200 28
75
150 26
50
BOTTOM SWITCH 100 24
25 BOTTOM SWITCH
50 22
0 0 20
–50 –25 0 25 50 75 100 125 150 0 1 2 3 4 –50 –25 0 25 50 75 100 125
TEMPERATURE (°C) SWITCH CURRENT (A) TEMPERATURE (°C)
8614 G16 8614 G17 8614 G18
Rev. E
600 720
800
500 710
300 690
400
200 680
200
100 670
0 660 0
0 0.5 1 1.5 2 2.5 3 3.5 4 –50 –25 0 25 50 75 100 125 150 0 50 100 150 200
LOAD CURRENT (A) TEMPERATURE (°C) LOAD CURRENT (mA)
8614 G19 8614 G20 8614 G21
600 RT = 60.4k
LOAD CURRENT (mA)
0.8
FB VOLTAGE (V)
60 500
400 0.6
40 300
0.4
200
20
0.2
100
0 0 0
5 10 15 20 25 30 35 40 45 0 0.2 0.4 0.6 0.8 1 0 0.2 0.4 0.6 0.8 1.0 1.2 1.4
INPUT VOLTAGE (V) FB VOLTAGE (V) TR/SS VOLTAGE (V)
8614 G22 8614 G23 8614 G24
11.5
PG THRESHOLD OFFSET FROM VREF (%)
2.5
11.0 –8.0
2.4
SS PIN CURRENT (µA)
10.5 –8.5
FB RISING FB RISING
2.3 10.0 –9.0
175 5.0
10 IL IL
500mA/DIV 500mA/DIV
8
VOUT VOUT
5mV/DIV 10mV/DIV
6
0
0.2 0.6 1 1.4 1.8 2.2 2.6 3
SWITCHING FREQUENCY (MHz)
8614 G31
IL
500mA/DIV ILOAD ILOAD
1A/DIV 1A/DIV
Rev. E
VIN VIN
VIN VIN
2V/DIV 2V/DIV
VOUT VOUT
VOUT VOUT
2V/DIV 2V/DIV
40
AMPLITUDE (dBµV/m)
30
20
10
LT8614
CLASS 5 PEAK
0
0 100 200 300 400 500 600 700 800 900 1000
FREQUENCY (MHz)
50
HORIZONTIAL POLARIZATION
40
AMPLITUDE (dBµV/m)
30
20
10
LT8614
CLASS 5 PEAK
0
0 100 200 300 400 500 600 700 800 900 1000
FREQUENCY (MHz)
DC2019A DEMO BOARD (WITH EMI FILTER INSTALLED) 8614 G39
14VIN TO 5VOUT AT 4A, fSW = 2MHz
Rev. E
BLOCK DIAGRAM
VIN2
VIN1 13
VIN 4 CIN2
CIN3 CIN1 –
INTERNAL 0.97V REF
+ 3.4V BIAS
R3 1V + REG
1
OPT EN/UV
14 – SHDN
SLOPE COMP
R4 INTVCC
OPT 2
CVCC
OSCILLATOR
ERROR BST
PG 200kHz TO 3MHz 3
19 ±9% AMP
+ VC
BURST SWITCH M1
CBST
+ DETECT LOGIC L
VOUT – AND
SW
VOUT
ANTI- 8, 9, 21, 22
COUT
SHDN SHOOT
C1 R1 THROUGH M2
TSD
INTVCC UVLO
R2 FB VIN UVLO
20 GND1
CSS SHDN 6, 7
2.2µA TSD
OPT VIN UVLO
TR/SS GND2
16
10, 11
RT RT
15
SYNC/MODE
17
GND
18 8614 BD
Rev. E
GROUND PLANE
ON LAYER 2
R1 C1 RPG
CSS
R2 V
CVCC V V
1 16 V RT
20 17
22 V
21
6 11
CIN1 7 10 CIN2
CIN3
CBST
L COUT
9614 F01
GROUND VIA VIN VIA VOUT VIA V OTHER SIGNAL VIAS
60
pulses in Burst Mode operation such that the LT8614 can
stay in sleep mode longer between each pulse. This can be
achieved by using a larger value inductor (i.e., 4.7µH), and 40
Rev. E
Rev. E
floating.
The LT8614 will tolerate a shorted output. Several features High Temperature Considerations
are used for protection during output short-circuit and
For higher ambient temperatures, care should be taken in
brownout conditions. The first is the switching frequency
the layout of the PCB to ensure good heat sinking of the
will be folded back while the output is lower than the set
LT8614. The ground pins on the bottom of the package
point to maintain inductor current control. Second, the
should be soldered to a ground plane. This ground should
bottom switch current is monitored such that if inductor
be tied to large copper layers below with thermal vias;
current is beyond safe levels switching of the top switch
these layers will spread heat dissipated by the LT8614.
will be delayed until such time as the inductor current
Placing additional vias can reduce thermal resistance fur-
falls to safe levels.
ther. The maximum load current should be derated as the
Frequency foldback behavior depends on the state of ambient temperature approaches the maximum junction
the SYNC pin: If the SYNC pin is low the switching fre- rating. Power dissipation within the LT8614 can be esti-
quency will slow while the output voltage is lower than mated by calculating the total power loss from an efficiency
the programmed level. If the SYNC pin is connected to measurement and subtracting the inductor loss. The die
a clock source or tied high, the LT8614 will stay at the temperature is calculated by multiplying the LT8614 power
programmed frequency without foldback and only slow dissipation by the thermal resistance from junction to
switching if the inductor current exceeds safe levels. ambient. The LT8614 will stop switching and indicate a
fault condition if safe junction temperature is exceeded.
Rev. E
VIN
5.8V TO 42V
4.7µF EN/UV
VIN1 VIN2
1µF 1µF
0603 GND1 GND2 0603
LT8614
PG BST
0.1µF 4.7µH VOUT
10nF
SYNC/MODE SW 5V
TR/SS BIAS 4A
1µF 4.7pF 1M 47µF
INTVCC FB 1210
41.2k X5R/X7R
RT GND 243k
VIN
5.8V TO 42V
4.7µF EN/UV
VIN1 VIN2
1µF 1µF
0603 GND1 GND2 0603
LT8614
PG BST
0.1µF 2.2µH VOUT
10nF
SYNC/MODE SW 5V
TR/SS BIAS 4A
1µF 4.7pF 1M 47µF
INTVCC FB 1210
18.2k X5R/X7R
RT GND 243k
Rev. E
0.055 BSC
0.70 ±0.05
3.50 ±0.05
0.770
2.10 ±0.05 BSC
1.50 REF 0.220 ±0.05
0.356 ±0.05
0.400 ±0.05
PACKAGE OUTLINE
0.25 ±0.05
0.50 BSC
2.50 REF
3.10 ±0.05
4.50 ±0.05
RECOMMENDED SOLDER PAD PITCH AND DIMENSIONS
APPLY SOLDER MASK TO AREAS THAT ARE NOT SOLDERED
PIN 1 ID
0.75 ±0.05 0.12 × 45°
3.00 ±0.10 1.50 REF
0.40 ±0.10
PIN 1 1
2.127 ±0.10
TOP MARK 0.220 ±0.05 2
(NOTE 5)
NOTE:
1. DRAWING IS NOT A JEDEC PACKAGE OUTLINE
2. DRAWING NOT TO SCALE
3. ALL DIMENSIONS ARE IN MILLIMETERS
4. DIMENSIONS OF EXPOSED PAD ON BOTTOM OF PACKAGE DO NOT INCLUDE
MOLD FLASH. MOLD FLASH, IF PRESENT, SHALL NOT EXCEED 0.15mm ON ANY SIDE
5. SHADED AREA IS ONLY A REFERENCE FOR PIN 1 LOCATION
ON THE TOP AND BOTTOM OF PACKAGE
Rev. E
Information furnished by Analog Devices is believed to be accurate and reliable. However, no responsibility is assumed by Analog
Devices for its use, nor for any infringements of patents or other rights of third parties that may result from its use. Specifications
subject to change without notice. No license For more by
is granted information www.analog.com
implication or otherwise under any patent or patent rights of Analog Devices. 23
LT8614
TYPICAL APPLICATIONS
12V, 4A Step-Down Converter
VIN
12.8V TO 42V
4.7µF EN/UV
VIN1 VIN2
1µF 1µF
0603 GND1 GND2 0603
LT8614
PG BST
0.1µF 8.2µH VOUT
10nF
SYNC/MODE SW 12V
TR/SS BIAS 4A
1µF 4.7pF 1M
47µF
INTVCC FB 1210
41.2k
RT GND 88.7k X5R/X7R
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LT3991 55V, 1.2A, 2.2MHz High Efficiency Micropower Step-Down DC/DC VIN: 4.2V to 55V, VOUT(MIN) = 1.21V, IQ = 2.8µA,
Converter with IQ = 2.8µA ISD < 1µA, 3mm × 3mm DFN-10 and MSOP-10E Packages
LT3970 40V, 350mA, 2.2MHz High Efficiency Micropower Step-Down DC/DC VIN: 4.2V to 40V, VOUT(MIN) = 1.21V, IQ = 2.5µA,
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LT3990 62V, 350mA, 2.2MHz High Efficiency MicroPower Step-Down DC/DC VIN: 4.2V to 62V, VOUT(MIN) = 1.21V, IQ = 2.5µA,
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24
09/19
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