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Summary of Rtl-To-Gdsii Tool Flow Using Synopsys DC and Cadence Soc Encounter

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Utkarsh Agrawal

This document summarizes the steps in the RTL-to-GDSII tool flow using Synopsys DC and Cadence SoC Encounter, including: 1) Synthesis to convert RTL to structural netlist 2) Placement and routing to implement the logical netlist physically in multiple steps: floorplanning, power planning, placement, clock tree synthesis, routing, and filler insertion 3) Simulation and VCD generation using the final netlist to write node activity 4) Power calculation based on the VCD file and Encounter database to generate final power numbers.

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Summary of Rtl-To-Gdsii Tool Flow Using Synopsys DC and Cadence Soc Encounter

Uploaded by

Utkarsh Agrawal
654 views3 pages
This document summarizes the steps in the RTL-to-GDSII tool flow using Synopsys DC and Cadence SoC Encounter, including: 1) Synthesis to convert RTL to structural netlist 2) Placement and routing to implement the logical netlist physically in multiple steps: floorplanning, power planning, placement, clock tree synthesis, routing, and filler insertion 3) Simulation and VCD generation using the final netlist to write node activity 4) Power calculation based on the VCD file and Encounter database to generate final power numbers.

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Back-End_DesignFlow.pdf

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This document summarizes the steps in the RTL-to-GDSII tool flow using Synopsys DC and Cadence SoC Encounter, including: 1) Synthesis to convert RTL to structural netlist 2) Placement and routing to implement the logical netlist physically in multiple steps: floorplanning, power planning, placement, clock tree synthesis, routing, and filler insertion 3) Simulation and VCD generation using the final netlist to write node activity 4) Power calculation based on the VCD file and Encounter database to generate final power numbers.

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© All Rights Reserved
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Download as pdf or txt
654 views3 pages

Summary of Rtl-To-Gdsii Tool Flow Using Synopsys DC and Cadence Soc Encounter

Uploaded by

Utkarsh Agrawal
This document summarizes the steps in the RTL-to-GDSII tool flow using Synopsys DC and Cadence SoC Encounter, including: 1) Synthesis to convert RTL to structural netlist 2) Placement and routing to implement the logical netlist physically in multiple steps: floorplanning, power planning, placement, clock tree synthesis, routing, and filler insertion 3) Simulation and VCD generation using the final netlist to write node activity 4) Power calculation based on the VCD file and Encounter database to generate final power numbers.

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Summary of RTL-to-GDSII tool flow using

Synopsys DC and Cadence SoC Encounter


Arun C.
December 16, 2010

1 Overview
The reader is assumed to be familiar with the IC design methodology and
steps. If not please go through the same provided in the wiki.
In order to use this flow, the following tools must be installed:

• Synopsys design compiler (2006-06).

• CADENCE SoC encounter (8.1).

• Mentor-Graphics Modelsim RTL simulator (SE-64 6.2). ModelSim may


be replaced by any simulator which produces a VCD file.

A standard-cell library is also needed in order to run the flow. The current
flow uses the OSU standard-cell library (for the 180nm TSMC process).
This flow will work correctly only for designs with a single clock.
The toplevel directory structure is organised as follows.

1. rtl: Contains the rtl code.

2. LIB: All the libraries are copied/linked here.

3. synthesis: Contains the synthesis flow.

4. pnr: Contains the PnR flow.

In each individual directory, a corresponding readMe is available.


The steps in the back-end design flow from RTL to GDSII are as follows:

1
• Synthesis: RTL ( bahavioural code ) is converted to structural netlist.
Inputs for this stage are rtl, design constraints and synthesis libraries.

• Placement and Routing (PnR): The netlist is the logical description of


the circuit. Physical implementation of the logical netlist is carried out
in PnR stage. Following steps are done as part of this stage.

1. Floorplan: Overall chip dimensions are designed in this stage.


IOPins/IOCells/PADS are placed, memories and other macros if
available are placed.
2. Powerplan: Designs how power is provided to the chip. Metal
stripes/meshes are drawn on the metal layers, which supply power
to the bottom base-layer devices through power VIAs. The power-
plan should be done based on maximum IR drop ( voltage supply
drop that can be tolerated), Electromigration limits of the metal,
Routability of the signal nets ( Power stripes block the signal
routes ) and to an extent target power consumption of the chip.
3. Placement: In this stage the design is placed, and the stage per-
forms optimizations based on timing, transition and capacitances
( typical DRV, design rule viol, parameters ), power and signal
routablility. In this stage, the clock insertion delay is assumed to
be ideal. It is based on the values ”we” input to the tool or 0,
not on actual ”achieved” values. Trial routing is done after every
stage to ensure the routability of the design and to get a more
accurate idea of parasitics. Similarly timing, area, routability and
design-rule-violation analysis (DRV) are analysed in each stage.
4. Clock-tree synthesis (CTS): Clock insertion delay is balanced across
all the sequential elements in the design. An ideal clock tree has
0 insertion delay and 0 skew. But the implemented one will have
differences in the clock latency and skew among the flops. Op-
timizations and analyses are done similar to the placement stage
based on these clock non ideal timing and ensure that all these are
within limits. Other signals similar to clock such as synchronous
RESET, SCANMODE etc also need to be synthesised in similar
way, if required.
5. Routing: The design is actually routed in this stage. All those sig-
nals which cannot be routed will be reported as geometry/connectivity

2
violations. If the routing does not conform to antenna rules, these
also are reported as violations. One more round of optimizations
and analysis similar to placement and CTS is done with the actual
extracted route parasitics. ( RC values ).
6. Filler insertion and final database generation: During the VLSI
manufacturing process, it is important that the surface of the
wafer is as planar as possible after each processing step. Hence
the gaps in between the standard cells are filled with ”filler cells”
that do not have any functionality. These cells just extend the
bulk region of the silicon and improve the silicon planarity.
The design is RC extracted ( the format used is DSPF). Design is
saved in GDSII form ( contains metal level mask information, only
polygons and texts ), DEF ( contains the physical data, such as
the co-ordinates of a particular signal connection (layer,thickness))
and the verilog/vhdl netlist corresponding to the final layout. Fi-
nal reports are generated and analysed. Also the design is checked
for geometry/connectivity/antennna violations which may occur
depending on the way the design is routed. If present these are
corrected and and fixed again.

• Simulation and VCD Generation: The user must write a Testbench


which provides a set of inputs for the rtl and monitors the output.
The final netlist from the PnR stage is used and the node activity is
written out in the VCD (value change dump) format. This step is
called gate-level-simulation (GLS)

• Power calculation based on VCD (done using Encounter): The VCD-


file generated in the simulation step along with the final Encounter
database is used to generate the final power numbers. Inputs to this
stage are the VCD file and the Encounter database (contains the netlist,
placement, routing, parasitics information etc.). If the parasitics in-
formation is not present in the database, we need to re-extract the
database.

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