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100V N-Channel Mosfets: General Description

This document describes a 100V N-Channel MOSFET with the following key specifications: 1. It uses trench DMOS technology to minimize resistance and maximize switching performance while withstanding high energy pulses. 2. It has a breakdown voltage of 100V, on-resistance of 3.5mΩ at 10V gate voltage, and continuous drain current of 160A. 3. Intended for applications requiring high efficiency fast switching such as networking equipment, LED lighting, and quick chargers.

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0% found this document useful (0 votes)
129 views5 pages

100V N-Channel Mosfets: General Description

This document describes a 100V N-Channel MOSFET with the following key specifications: 1. It uses trench DMOS technology to minimize resistance and maximize switching performance while withstanding high energy pulses. 2. It has a breakdown voltage of 100V, on-resistance of 3.5mΩ at 10V gate voltage, and continuous drain current of 160A. 3. Intended for applications requiring high efficiency fast switching such as networking equipment, LED lighting, and quick chargers.

Uploaded by

Marius
Copyright
© © All Rights Reserved
We take content rights seriously. If you suspect this is your content, claim it here.
Available Formats
Download as PDF, TXT or read online on Scribd
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100V N-Channel MOSFETs PDP0970

General Description
BVDSS RDSON ID
These N-Channel enhancement mode power field effect
transistors are using trench DMOS technology. This 100V 3.5m 160A
advanced technology has been especially tailored to
minimize on-state resistance, provide superior switching Features
performance, and withstand high energy pulse in the  100V,160A, RDS(ON) =3.5mΩ@VGS = 10V
avalanche and commutation mode. These devices are  Improved dv/dt capability
well suited for high efficiency fast switching applications.  Fast switching
 100% EAS Guaranteed
 Green Device Available
TO220 Pin Configuration D Applications
 Networking
 Load Switch
 LED applications
G
 Quick Charger

S S
D
G

Absolute Maximum Ratings Tc=25℃ unless otherwise noted

Symbol Parameter Rating Units


VDS Drain-Source Voltage 100 V
VGS Gate-Source Voltage ±20 V
Drain Current – Continuous (TC=25℃) (Chip Limitation) 160 A
ID
Drain Current – Continuous (TC=100℃) (Chip Limitation) 100 A
1
IDM Drain Current – Pulsed 640 A
2
EAS Single Pulse Avalanche Energy 280 mJ
2
IAS Single Pulse Avalanche Current 75 A
Power Dissipation (TC=25℃) 208 W
PD
Power Dissipation – Derate above 25℃ 1.66 W/℃
TSTG Storage Temperature Range -50 to 150 ℃
TJ Operating Junction Temperature Range -50 to 150 ℃

Thermal Characteristics

Symbol Parameter Typ. Max. Unit


RθJA Thermal Resistance Junction to ambient --- 62 ℃/W
RθJC Thermal Resistance Junction to Case --- 0.6 ℃/W

Potens semiconductor corp. Ver.1.0.0 Preliminary

1
100V N-Channel MOSFETs PDP0970
Electrical Characteristics (TJ=25 ℃, unless otherwise noted)

Off Characteristics
Symbol Parameter Conditions Min. Typ. Max. Unit
BVDSS Drain-Source Breakdown Voltage VGS=0V , ID=250uA 100 --- --- V
△BVDSS/△TJ BVDSS Temperature Coefficient Reference to 25℃ , ID=1mA --- 0.05 --- V/℃
VDS=100V , VGS=0V , TJ=25℃ --- --- 1 uA
IDSS Drain-Source Leakage Current
VDS=80V , VGS=0V , TJ=125℃ --- --- 10 uA
IGSS Gate-Source Leakage Current VGS=±20V , VDS=0V --- --- ±100 nA

On Characteristics
RDS(ON) Static Drain-Source On-Resistance VGS=10V , ID=20A --- 2.8 3.5 m
VGS(th) Gate Threshold Voltage 1.5 2.5 3.5 V
VGS=VDS , ID =250uA
△VGS(th) VGS(th) Temperature Coefficient --- -5 --- mV/℃
gfs Forward Transconductance VDS=10V , ID=3A --- 15 --- S

Dynamic and switching Characteristics


Qg Total Gate Charge3 , 4 --- 295 450
3,4
Qgs Gate-Source Charge VDS=80V , VGS=10V , ID=10A --- 70 140 nC
3,4
Qgd Gate-Drain Charge --- 75 150
3,4
Td(on) Turn-On Delay Time --- 66.2 120
3,4
Tr Rise Time VDD=50V , VGS=10V , RG=6 --- 79.6 160
ns
Td(off) Turn-Off Delay Time3 , 4 ID=1A --- 242 480
Tf Fall Time3 , 4 --- 103 200
Ciss Input Capacitance --- 17800 26000
Coss Output Capacitance VDS=25V , VGS=0V , F=1MHz --- 980 1900 pF
Crss Reverse Transfer Capacitance --- 78 150
Rg Gate resistance VGS=0V, VDS=0V, F=1MHz --- 1.8 3.6 

Drain-Source Diode Characteristics and Maximum Ratings


Symbol Parameter Conditions Min. Typ. Max. Unit
IS Continuous Source Current --- --- 160 A
VG=VD=0V , Force Current
ISM Pulsed Source Current --- --- 320 A
VSD Diode Forward Voltage VGS=0V , IS=1A , TJ=25℃ --- --- 1 V
trr Reverse Recovery Time VGS=0V,IS=10A , --- 64 --- ns
Qrr Reverse Recovery Charge dI/dt=100A/µs , TJ=25℃ --- 150 --- nC

Note :
1. Repetitive Rating : Pulsed width limited by maximum junction temperature.
2. VDD=50V,VGS=10V,L=0.1mH,IAS=75A.,RG=25,Starting TJ=25℃.
3. The data tested by pulsed , pulse width ≦ 300us , duty cycle ≦ 2%.
4. Essentially independent of operating temperature.

Potens semiconductor corp. Ver.1.0.0 Preliminary

2
100V N-Channel MOSFETs PDP0970

Normalized On Resistance (m)


ID , Continuous Drain Current (A)

TC , Case Temperature (℃) TJ , Junction Temperature (℃)


Fig.1 Continuous Drain Current vs. TC Fig.2 Normalized RDSON vs. TJ
Normalized Gate Threshold Voltage (V)

VGS , Gate to Source Voltage (V)

TJ , Junction Temperature (℃) Qg , Gate Charge (nC)


Fig.3 Normalized Vth vs. TJ Fig.4 Gate Charge Characteristics
Normalized Thermal Response (RθJC)

ID , Drain Current (A)

Square Wave Pulse Duration (s) VDS , Drain to Source Voltage (V)
Fig.5 Normalized Transient Impedance Fig.6 Maximum Safe Operation Area

Potens semiconductor corp. Ver.1.0.0 Preliminary

3
100V N-Channel MOSFETs PDP0970

Fig.7 Switching Time Waveform Fig.8 Gate Charge Waveform

Potens semiconductor corp. Ver.1.0.0 Preliminary

4
100V N-Channel MOSFETs PDP0970
TO220 PACKAGE INFORMATION

Dimensions In Millimeters Dimensions In Inches


Symbol
MAX MIN MAX MIN
A 10.300 9.700 0.406 0.382
A1 8.840 8.440 0.348 0.332
A2 1.250 1.050 0.049 0.041
A3 5.300 5.100 0.209 0.201
B 16.200 15.400 0.638 0.606
C 4.680 4.280 0.184 0.169
C1 1.500 1.100 0.059 0.043
D 1.000 0.600 0.039 0.024
E 3.800 3.400 0.150 0.134
G 9.300 8.700 0.366 0.343
H 0.600 0.400 0.024 0.016
K 2.700 2.100 0.106 0.083
L 13.600 12.800 0.535 0.504
M 1.500 1.100 0.059 0.043
N 2.590 2.490 0.102 0.098
T W0.35 W0.014
DIA Φ1.5 TYP. deep0.2 TYP. Φ0.059 TYP. deep0.008 TYP.

Potens semiconductor corp. Ver.1.0.0 Preliminary

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