Laminated busbars lower manufacturing costs by decreasing assembly time and reducing parts count. They improve reliability by reducing wiring errors and reworks. Increased capacitance from keeping dielectrics thin helps suppress noise. Busbars eliminate wiring errors and have virtually no failures. Their thin parallel conductors minimize inductance and impedance to reduce noise. Busbars provide denser packaging and improved thermal characteristics while offering flexible interconnection methods.
Laminated busbars lower manufacturing costs by decreasing assembly time and reducing parts count. They improve reliability by reducing wiring errors and reworks. Increased capacitance from keeping dielectrics thin helps suppress noise. Busbars eliminate wiring errors and have virtually no failures. Their thin parallel conductors minimize inductance and impedance to reduce noise. Busbars provide denser packaging and improved thermal characteristics while offering flexible interconnection methods.
Laminated busbars lower manufacturing costs by decreasing assembly time and reducing parts count. They improve reliability by reducing wiring errors and reworks. Increased capacitance from keeping dielectrics thin helps suppress noise. Busbars eliminate wiring errors and have virtually no failures. Their thin parallel conductors minimize inductance and impedance to reduce noise. Busbars provide denser packaging and improved thermal characteristics while offering flexible interconnection methods.
Laminated busbars lower manufacturing costs by decreasing assembly time and reducing parts count. They improve reliability by reducing wiring errors and reworks. Increased capacitance from keeping dielectrics thin helps suppress noise. Busbars eliminate wiring errors and have virtually no failures. Their thin parallel conductors minimize inductance and impedance to reduce noise. Busbars provide denser packaging and improved thermal characteristics while offering flexible interconnection methods.
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Busbars Reduce System Costs
A laminated busbar will lower manufacturing costs by decreasing assembly time as well as internal material handling costs. Various conductors are terminated at customer specified locations to eliminate the guesswork usually associated with assembly operating procedures. A reduced parts count will reduce ordering, material handling and inventory costs. Bus bars Improve Reliability Laminated bus bars can help your organization build quality into processes. The reduction of wiring errors results in fewer reworks, lower service costs and lower quality costs. Bus bars Increase Capacitance Increased capacitance results in decreasing characteristic impedance. This will ultimately lead to greater effective signal suppression and noise elimination. Keeping the dielectrics thin and using dielectrics with a high relative K factor will increase capacitance. Eliminate Wiring Errors By replacing a standard cable harnesses with bus bars, the possibility for miss-wirings is eliminated. Wiring harnesses have high failure rates relative to bus bars, which have virtually none. These problems are very costly to repair. Adding bus bars to your systems is effective insurance. Bus bars Lower Inductance Any conductor carrying current will develop an electromagnetic field. The use of thin parallel conductors with a thin dielectric laminated together minimizes the effect of inductance on electrical circuits. Magnetic flux cancellation is maximized when opposing potentials are laminated together. Laminated bus bars have been designed to reduce the proximity effect in many semiconductor applications as well as applications that involve high electromagnetic interference (EMI). Bus bars Lower Impedance Increasing the capacitance and reducing the inductance is a determining factor in eliminating noise. Keeping the dielectric thickness to a minimum will accomplish the highly desired low impedance. Bus bars Provide Denser Packaging The use of wide, thin conductors laminated together led to decreased space requirements. Laminated bus bars have helped decrease total system size and cost. Bus bars Provide Wider Variety of Interconnection Methods The flexibility of bus bars has allowed an unlimited number of interconnection styles to choose from. Bushings, embossments, and fasten tabs are most commonly used. Bus bars Improve Thermal Characteristics The wide, thin conductors are favourable to allowing better airflow in systems. As package sizes decrease, the cost of removing heat from systems has greatly increased. A bus bar cannot only reduce the overall size required, but it can also improve airflow with its sleek design. Material: The copper will be of ETP grade as per DIN 13601-2002 and with oxygen free copper. Chemical composition: Purity of copper will be as per DIN EN 13601:2002. Copper + Silver 99.90% min. Typical example Rating Current: 3200Amp. System:415Vac, TPN, 50Hz. Fault Level: 50KA. For 1 Sec. Operation Temp:40° C rise over 45 ° C ambient.
CONSIDERATION Enclosure size: 1400 mm. wide X 400mm. height Bus bar Size: 2:200x10 per Ph., 1:200x10 for Neutral. Bus bar material: Electrolytic gr. Al. (IS 63401/AA6101)
Short Circuit Rating
-upto 400A rated current: 25KA for 1 sec. -600 to 1000A rated current: 50KA for 1 sec. -1250 to 2000A rated current: 65-100KA for 1 sec. -2500 to 5000A rated current: 100-225KA for 1 sec.
The minimum cross section needed in sqmm for busbar in various common cases can be listed as below-
1) Aluminium busbar for 2000A, 35 kA for 1 sec withstand – From the table the minimum cross-section needed would be 443 mm2. Thus we can select a 100mm x 5mm busbar as the minimum cross-section. Considering a current density of 1A/ mm2 by considering temperature as well as skin effect, we shall require 4 x 100mm x 5mm busbars for this case.
2) Copper busbar for 2000A, 35 kA for 1 sec withstand – From the table the minimum cross- section needed would be 285 mm2. Thus we can select a 60mm x 5mm busbar as the minimum cross-section. Considering a current density of 1.6A/ mm2 by considering temperature as well as skin effect, we shall require 4 x 60mm x 5mm busbars for this case.
Thus, by using the above formula and table, we can easily select busbars for our switchboards. Size in Area Weight/ current carrying capacity in amp ( copper ) at 35 deg.C mm sqmm km AC ( no. of bus) DC ( no. of bus) I II III II II I II III II II 12X2 24 0.209 110 200 115 205 15X2 30 0.262 140 200 145 245 15X3 75 0.396 170 300 175 305 20X2 40 0.351 185 315 190 325 20X3 60 0.529 220 380 225 390 20X5 100 0.882 295 500 300 510 25X3 75 0.663 270 460 275 470 25X5 125 1.11 350 600 355 610 30X3 90 0.796 315 540 320 560 30X5 150 1.33 400 700 410 720 40X3 120 1.06 420 710 430 740 40X5 200 1.77 520 900 530 930 40X10 400 3.55 760 1350 1850 2500 770 1400 2000 50X5 250 2.22 630 1100 1650 2100 650 1150 1750 50X10 500 4.44 920 1600 2250 3000 960 1700 2500 60X5 300 2.66 760 1250 1760 2400 780 1300 1900 2500 60X10 600 5.33 1060 1900 2600 3500 1100 2000 2800 3600 80X5 400 3.55 970 1700 2300 3000 1000 1800 2500 3200 80X10 800 7.11 1380 2300 3100 4200 1450 2600 3700 4800 100X5 500 4.44 1200 2050 2850 3500 1250 2250 3150 4050 100X10 1000 8.89 1700 2800 3650 5000 1800 3200 4500 5800 120X10 1200 10.7 2000 3100 4100 5700 2150 3700 5200 6700 160X10 1600 14.2 2500 3900 5300 7300 2800 4800 6900 9000 200X10 2000 17.8 3000 4750 6350 8800 3400 6000 8500 10000
Temperature rise
During the short circuiting, the bus bar should be able to withstand the thermal as well as mechanical stress. When a sort circuiting takes place, the temperature rise is directly proportional to the squire of the rms value of the fault current. The duration of short circuiting is very small i.e. one second till the breakers opens and clears the fault. The heat dissipation through convection and radiation during this short duration is negligible and all the heat is observed by the busbar itself. The temperature rise due to the fault can be calculated by applying the formulae.
T = K (I/A) 2 (1+αθ) 10-2
T=temperature rise per second A= conductor cross section area α = temperature coefficient of resistivity at 20 deg.C/deg.C = 0 .00393 for copper = 0 .00386 for aluminium K = constant =0.52 for copper =1.166 for aluminium θ = temperature of the conductor at the instant at which the temperature rise is being calculated.
Typical calculation
Rated current = 1000A
Fault current = 50KA for 1 sec Permissible temperature rise= 40 deg.C Busbar material =aluminium ally E91E De-rating factor due to material =1 De-rating factor due to temperature rise =0.86 De-rating factor due to enclosure =0.75 Total de-rating factor = 1x0.75x0.86=0.66 Minimum cross section area required to withstand short circuit for 1 sec. = (Ifc x√t )/0.08 Where, Ifc = fault level current in KA t= 1 second Area A = (50x√1 )/0.08 = 625 sqmm Considering all de-rating factor, A = 625/0.66 =946.97 Say, cross sectional area per phase = 1000 sqmm For neutral, cross sectional area per phase = 500 sqmm
