RT9025

2A, Ultra Low Dropout LDO

General Description Features
The RT9025 is a high performance positive voltage regulator z Ultra Low Dropout Voltage 230mV at 2A
designed for use in applications requiring very low Input z Output Current up to 2A
voltage and extremely low dropout voltage at up to z High Accuracy Output Voltage 2%
2A(Peak). It operates with a VIN as low as 1V and VDD z Power Good Output
voltage 3V with programmable output voltage as low as z Output Voltage Pull Low Resistor when Disable
0.8V. The RT9025 features ultra low dropout that is ideal z Over Current Protection
for applications where VOUT is very close to VIN. z Thermal Shutdown Protection
Additionally, it has an enable pin to further reduce power z RoHS Compliant and 100% Lead (Pb)-Free
dissipation while shutdown and provides excellent
regulation over variations in line, load and temperature. Applications
The RT9025 provides a power good signal to indicate if z Note Book PC Applications
the voltage level of Vo reaches 90% of its rating value. z Motherboard Applications
The RT9025 is available in the SOP-8 and SOP-8 (Exposed
Pad) package with 1.05V, 1.2V, 1.5V, 1.8V and 2.5V
Pin Configurations
internally preset outputs that are also adjustable by using
external resistors. (TOP VIEW)

PGOOD 8 GND
Ordering Information EN 2 7 ADJ
RT9025- VIN 3 6 VOUT
VDD 4 5 NC
Package Type
S : SOP-8
SOP-8
SP : SOP-8 (Exposed Pad-Option 1)
Operating Temperature Range
PGOOD 8 GND
P : Pb Free with Commercial Standard
EN 2 7 ADJ
G : Green (Halogen Free with Commer- GND
cial Standard) VIN 3 9 6 VOUT
Z : ECO (Ecological Element) VDD 4 5 NC

Output Voltage SOP-8 (Exposed Pad)

1K : 1.05V/Adj
12 : 1.2V/Adj
15 : 1.5V/Adj
18 : 1.8V/Adj
25 : 2.5V/Adj
Note :
Richtek Pb-free and Green products are :
` RoHS compliant and compatible with the current require-
ments of IPC/JEDEC J-STD-020.
` Suitable for use in SnPb or Pb-free soldering processes.

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 RT9025
Typical Application Circuit
VOUT = 0.8 × R1 + R2
R2
VIN VIN VOUT VOUT VIN VIN VOUT VOUT
CIN CIN CF
10µF COUT R1 COUT
RT9025 10µF RT9025 10µF
10µF
Chip Enable ADJ Chip Enable ADJ
EN EN
PGOOD PGOOD R2
VDD VDD VDD VDD
GND 100k GND 100k
1µF 1µF
VOUT VOUT

Figure 1. Fixed Voltage Regulator Figure 2. Adjustable Voltage Regulator

Functional Pin Description

Pin No. Pin Name Pin Function
1 PGOOD Power Good Open Drain Output.
2 EN Chip Enable (Active High).
3 VIN Supply Input Voltage.
4 VDD Supply Voltage of Control Circuit.
5 NC No Internal Connection.
6 VOUT Output Voltage.
Set the output voltage by the internal feedback resistors when ADJ is grounded.
7 ADJ
If external feedback resistors is used, VOUT = 0.8V x (R2 + R1) / R2.

8, Ground. The exposed pad must be soldered to a large PCB and connected to
GND
9 (Exposed Pad) GND for maximum power dissipation.

Function Block Diagram

VIN VOUT

SD
OCP

Error
EN OTP Amplifier
+
-

VDD POR 0.8V Mode ADJ

PGOOD
-
0.72V +
GND

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 RT9025
Absolute Maximum Ratings (Note 1)
z Supply Input Voltage, VIN -------------------------------------------------------------------------------------------- 6V
z Control Voltage --------------------------------------------------------------------------------------------------------- 6V
z Output Voltage --------------------------------------------------------------------------------------------------------- 6V
z Power Dissipation, PD @ TA = 25°C
SOP-8 -------------------------------------------------------------------------------------------------------------------- 0.833W
SOP-8 (Exposed Pad) ----------------------------------------------------------------------------------------------- 1.333W
z Package Thermal Resistance (Note 2)
SOP-8, θJA -------------------------------------------------------------------------------------------------------------- 120°C/W
SOP-8, θJC -------------------------------------------------------------------------------------------------------------- 60°C/W
SOP-8 (Exposed Pad), θJA ------------------------------------------------------------------------------------------ 75°C/W
SOP-8 (Exposed Pad), θJC ----------------------------------------------------------------------------------------- 15°C/W
z Lead Temperature (Soldering, 10 sec.) --------------------------------------------------------------------------- 260°C
z Junction Temperature ------------------------------------------------------------------------------------------------- 150°C
z Storage Temperature Range ---------------------------------------------------------------------------------------- −65°C to 150°C
z ESD Susceptibility (Note 3)
HBM (Human Body Mode) ------------------------------------------------------------------------------------------ 2kV
MM (Machine Mode) -------------------------------------------------------------------------------------------------- 200V

Recommended Operating Conditions (Note 4)

z Supply Input Voltage, VIN -------------------------------------------------------------------------------------------- 1.4V to 5V
z Control Voltage, VDD -------------------------------------------------------------------------------------------------- 4.5V to 5.5V
z Junction Temperature Range ---------------------------------------------------------------------------------------- −40°C to 125°C
z Ambient Temperature Range ---------------------------------------------------------------------------------------- −40°C to 85°C

Electrical Characteristics
(VIN = VOUT + 500mV, VEN = VDD = 5V, CIN = COUT = 10μF, TA = 25°C, unless otherwise specified)
Parameter Symbol Test Conditions Min Typ Max Unit
VIN
Input Voltage Range VIN 1.4 -- 5 V
Quiescent Current (GND Current)
IQ VDD = 5V -- 0.6 1.2 mA
(Note 5)
VDD
VDD Operation Range VDD VDD Input Range 4.5 -- 5.5 V
VOUT
Fixed Output Voltage VDD = 5V −2 0 2 %
VDD = 5V, IOUT = 2A,
V OUT Load Regulation (Note 6) ΔVLOAD -- 0.2 1 %
VIN = VOUT + 1V

VDD = 5V, V IN = VOUT + 1V to 5V

V OUT Line Regulation (VIN) ΔVLINE_IN -- 0.2 0.6 %
IOUT = 1mA

VDD = 5V, IOUT = 2A -- 230 300

Dropout Voltage (Note 7) VDROP mV
VDD = 5V, IOUT = 1A -- 115 150
To be Continued
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RT9025
Parameter Symbol Test Conditions Min Typ Max Unit
Current Limit ILIM VDD = 5V, V IN = 3.6V -- 3.5 -- A
Short Circuit Current VDD = 5V , VOUT < 0.2V -- 1.8 -- A
VDD = 5V, COUT = 10μF, Enable
In-rush Current -- 0.5 -- A
Start-up, ILOAD = 2A
V OUT Pull Low Resistance VEN = 0V -- 150 -- Ω
V OUT Rising Time 10% to 90%, VOUT = 1.8V -- 200 600 μs
ADJ
Reference Voltage VREF VDD = 5V, V OUT = 2.5V 0.788 0.8 0.812 V
ADJ Pin Threshold -- 0.2 -- V
Power-On Reset
POR Threshold 2.4 2.7 3.0 V
POR Falling Hysteresis 0.15 0.2 -- V
Power Good

Power Good Rising Threshold VDD = 5V -- 90 -- %

Power Good Hysteresis VDD = 5V -- 10 -- %
Power Good Sink Capability VDD = 5V, IOUT = 10mA -- 0.2 0.4 V
Chip Enable

EN Threshold Logic-High VEN_H VDD = 5V 1.2 -- -- V

Voltage Logic-Low VEN_L VDD = 5V -- -- 0.6 V
EN Pin Bias Current IEN VEN = 5V -- 12 -- μA
V DD Shutdown Current ISHDN VDD = 5V, V EN = 0V -- -- 1 μA
Over Temperature Protection
Thermal Shutdown Temperature TSD -- 160 -- °C
Thermal Shutdown Returned
-- 90 -- °C
Temperature

Note 1. Stresses listed as the above “Absolute Maximum Ratings” may cause permanent damage to the device. These are for
stress ratings. Functional operation of the device at these or any other conditions beyond those indicated in the
operational sections of the specifications is not implied. Exposure to absolute maximum rating conditions for extended
periods may remain possibility to affect device reliability.
Note 2. θJA is measured in the natural convection at TA = 25°C on a 4-layers high effective thermal conductivity test board of
JEDEC 51-7 thermal measurement standard. The case point of θJC is on the expose pad for SOP-8 (Exposed Pad)
package.
Note 3. Devices are ESD sensitive. Handling precaution is recommended.
Note 4. The device is not guaranteed to function outside its operating conditions.
Note 5. Quiescent, or ground current, is the difference between input and output currents. It is defined by IQ = IIN - IOUT under
no load condition (IOUT = 0mA).
Note 6. Regulation is measured at constant junction temperature by using a 2ms current pulse. Devices are tested for load
regulation in the load range from 1mA to 2A.
Note 7. The dropout voltage is defined as VIN -VOUT, which is measured when VOUT is VOUT(NORMAL) − 100mV.

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 RT9025
Typical Operating Characteristics
Load Transient Response Load Transient Response

VOUT VOUT
(20mV/Div) (20mV/Div)

IOUT IOUT
(1A/Div) (1A/Div)
VDD = 5V, VIN = 1.8V, VOUT = 1.2V ADJ VDD = 5V, VIN = 3.3V, VOUT = 2.5V FIX

Time (2.5ms/Div) Time (2.5ms/Div)

VIN Line Transient Response VIN Line Transient Response

4
VIN
(1V/Div)
3 3
VIN
(1V/Div)
2

VOUT VOUT
(50mV/Div) (50mV/Div)

VDD = 5V, VOUT = 1.2V ADJ, IOUT = 0A VDD = 5V, VOUT = 2.5V FIX, IOUT = 0A

Time (250μs/Div) Time (250μs/Div)

VDD Line Transient Response VDD Line Transient Response

5 5
VDD VDD
(1V/Div) 4 (1V/Div) 4

VOUT VOUT
(20mV/Div) (20mV/Div)

VIN = 1.8V, VOUT = 1.2V ADJ, IOUT = 0A VIN = 3.3V, VOUT = 2.5V FIX, IOUT = 0A

Time (250μs/Div) Time (250μs/Div)

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RT9025

Dropout Voltage vs. Load Current Start Up from Enable and PGOOD Delay
350

300 125°C
VEN
(5V/Div)
Dropout Voltage (mV)

250 25°C
VOUT
200
(1V/Div)

150 PGOOD
-40°C (1V/Div)
100

50 I IN
(1A/Div) VDD = VEN = 5V, VIN = 1.8V,
VOUT = 1.2V ADJ, IOUT = 2A
0
0 0.2 0.4 0.6 0.8 1 1.2 1.4 1.6 1.8 2 Time (1ms/Div)
Load Current (A)

Start Up from VDD Start Up from VIN

VDD VIN
(5V/Div) (1V/Div)

VOUT VOUT
(1V/Div) (1V/Div)

I IN I IN
(1A/Div) VDD = 5V, VIN = VEN = 1.8V, (1A/Div) VDD = 5V, VIN = VEN = 1.8V,
VOUT = 1.2V ADJ, IOUT = 2A VOUT = 1.2V ADJ, IOUT = 2A

Time (1ms/Div) Time (1ms/Div)

Short Circuit Protection Short Circuit Current vs. Temperature

2.6
2.4
Short Circuit Current (A) 1

2.2
VOUT 2.0
(1V/Div)
1.8
1.6
1.4
1.2
1.0
0.8
0.6
IOUT 0.4
(1A/Div)
0.2
0.0
Time (500μs/Div) -50 -25 0 25 50 75 100
Temperature (°C)

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 RT9025

Enable Threshold Voltage vs. Temperature Quiescent Current vs. Temperature

1.20 1200
1.15 1100
Enable Threshold Voltage (V)1

1.10 1000

Quiescent Current (µA) 1

1.05 900 VIN = 3.3V, VOUT = 2.5V, IOUT = 0A
Rising
1.00 800
0.95 700
0.90 Falling 600 VIN = 1.8V, VOUT = 1.2V, IOUT = 0A
0.85 500
0.80 400
0.75 300
0.70 200
0.65 100
0.60 0
-50 -25 0 25 50 75 100 -50 -25 0 25 50 75 100 125
Temperature (°C) Temperature (°C)

Fixed Output Voltage Range vs. Temperature Reference Voltage vs. Temperature
2.60 0.84
VIN = 3.3V, VADJ = 0V, VOUT = 2.5V, IOUT = 0A
2.58 0.83
Fixed Output Voltage (V)

Reference Voltage (V) 1

2.56
0.82
2.54
2.52 0.81

2.50 0.80
2.48 0.79
2.46
0.78
2.44
2.42 0.77

2.40 0.76
-50 -25 0 25 50 75 100 125 -50 -25 0 25 50 75 100 125
Temperature (°C) Temperature (°C)

VDD POR Threshold Voltage vs. Temperature ADJ Threshold Voltage Range vs. Temperature
3.00 0.30
2.95 0.28
ADJ Threshold Voltage (V)

2.90
0.26
2.85 Rising
POR Voltage (V) 1

0.24
2.80
2.75 0.22
2.70 0.20
2.65 Falling
0.18
2.60
0.16
2.55
0.14
2.50
2.45 0.12

2.40 0.10
-50 -25 0 25 50 75 100 -50 -25 0 25 50 75 100
Temperature (°C) Temperature (°C)

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RT9025
Application information
Adjustable Mode Operation Region of Stable COUT ESR vs. Output Current
The output voltage of RT9025 is adjustable from 0.8V to 10

(Ω)
ESR (Ω)
VIN by external voltage divider resisters as shown in Typical
Unstable Region
Application Circuit (Figure 2). The value of resisters R1

OUT ESR
1
and R2 should be more than 10kΩ to reduce the power

StableCCOUT
loss.The output voltage can be calculated by the following
equation : 0.1 Stable Region

RegionofofStable
⎛ R1 ⎞
VOUT = VREF × ⎜ 1 + ⎟
⎝ R2 ⎠
0.01 Unstable Region (Simulation Verity)
where VREF is the reference voltage (0.8V typical).

Region
VDD = 5V, VIN = 1.8V, VOUT = 1.2V
Enable R1 = R2 = 100kΩ, CIN = COUT = 10μF/X5R
0.001
The RT9025 goes into shutdown mode when the EN pin 0 0.5 1 1.5 2 2.5 3
is in the logic low condition. During this condition, the Output Current (A)
pass transistor, error amplifier, and band gap are turned
Figure 3. Region of Stable COUT ESR vs. Output Current
off, reducing the supply current to 10μA typical. The
RT9025 goes into operation mode when the EN pin is in
the logic high condition. If the EN pin is floating, please Current Limit
notice the RT9025 internal initial logic level. For RT9025, The RT9025 contains an independent current limit and
the EN pin function pulls low level internally. So the the short circuit current protection to prevent unexpected
regulator will be turn off when EN pin is floating. applications. The current limit monitors and controls the
pass transistor's gate voltage, limiting the output current
Input Capacitor
to higher than 3.5A typical. When the output voltage is
Good bypassing is recommended from input to ground to less than 0.2V, the short circuit current protection starts
improve AC performance. A 10μF input capacitor or greater the current fold back function and maintains the loading
located as close as possible to the IC is recommended. current 1.8A. The output can be shorted to ground
indefinitely without damaging the part.
Output Capacitor
The output capacitor must meet both requirements for Power Good
minimum amount of capacitance and ESR in all LDOs The power good function is an open-drain output. Connects
application. The RT9025 is designed specifically to work 100kΩ pull up resistor to VOUT to obtain an output voltage.
with low ESR ceramic output capacitor in space-saving The PGOOD pin will output high immediately after the
and performance consideration. Using a ceramic capacitor output voltage arrives 90% of normal output voltage.
which value is at least 10μF with ESR is > 15mΩ on the
RT9025 output ensures stability. The RT9025 still works Thermal-Shutdown Protection
well with output capacitor of other types due to the wide Thermal protection limits power dissipation to prevent IC
stable ESR range. Figure 3 shows the curves of allowable over temperature in RT9025. When the operation junction
ESR range as a function of load current for various output temperature exceeds 160°C, the over temperature
capacitor values. Output capacitor of larger capacitance protection circuit starts the thermal shutdown function
can reduce noise and improve load transient response, and turns the pass transistor off. The pass transistor turns
stability, and PSRR. The output capacitor should be located on again after the junction temperature cools by 30°C.
not more than 0.5 inch from the VOUT pin of the RT9025 RT9025 lowers its OTP trip level from 160°C to 90°C
and returned to a clean analog ground. when output short circuit occurs (VOUT < 0.2V). It limits

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 RT9025
IC case temperature under 100°C and provides maximum
safety to customer while output short circuit occurring.

Power Dissipation
For continuous operation, do not exceed absolute
maximum operation junction temperature 125°C. The
power dissipation definition in device is: (a) Copper Area = (2.3 x 2.3) mm2, θJA = 75°C/W
PD = (VIN − VOUT) x IOUT + VIN x IQ
The maximum power dissipation depends on the thermal
resistance of IC package, PCB layout, the rate of
surroundings airflow and temperature difference between
junctions to ambient. The maximum power dissipation can
be calculated by following formula :
PD(MAX) = (TJ(MAX) − TA) / θJA (b) Copper Area = 10mm2, θJA = 64°C/W
Where T J(MAX) is the maximum operation junction
temperature, TA is the ambient temperature and the θJA is
the junction to ambient thermal resistance.
For recommended operating conditions specification of
RT9025,the maximum junction temperature is 125°C. The
junction to ambient thermal resistance for SOP-8 (Exposed
Pad) package is 75°C/W on the standard JEDEC 51-7 (4
(c) Copper Area = 30mm2, θJA = 54°C/W
layers, 2S2P) thermal test board. The copper thickness
is 2oz. The maximum power dissipation at TA = 25°C can
be calculated by following formula :
PD(MAX) = (125°C − 25°C) / (75°C/W) = 1.33W (SOP-8
Exposed Pad on the minimum layout)

Layout Considerations
The thermal resistance θJA of SOP-8 (Exposed Pad) is
determined by the package design and the PCB design. (d) Copper Area = 50mm2, θJA = 51°C/W
However, the package design had been designed. If
possible, it's useful to increase thermal performance by
the PCB design. The thermal resistance θJA can be
decreased by adding a copper under the exposed pad of
SOP-8 (Exposed Pad) package.
As shown in Figure 4, the amount of copper area to which
the SOP-8 (Exposed Pad) is mounted affects thermal
(e) Copper Area = 70mm2, θJA = 49°C/W
performance. When mounted to the standard SOP-8
(Exposed Pad) pad (Figure 4.a), θJA is 75°C/W. Adding Figure 4. Thermal Resistance vs. Copper Area Layout
copper area of pad under the SOP-8 (Exposed Pad) (Figure Thermal Design
4.b) reduces the θJA to 64°C/W. Even further, increasing
the copper area of pad to 70mm2 (Figure 4.e) reduces the
θJA to 49°C/W.

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RT9025
The maximum power dissipation depends on operating
ambient temperature for fixed T J(MAX) and thermal
resistance θJA. For RT9025 packages, the Figure 5 of de-
rating curves allows the designer to see the effect of rising
ambient temperature on the maximum power allowed.
2.2
2.0 Copper Area
1.8 70mm2
50mm2
Power Dissipation (W)

1.6
30mm2
1.4 10mm2
1.2 Min. layout
1.0
0.8
0.6
0.4
0.2
JEDEC 4-Layers PCB
0.0
0 20 40 60 80 100 120 140
Ambient Temperature (°C)

Figure 5. Derating Curve for Package

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 RT9025
Outline Dimension

H
A

J B

C
I
D

Dimensions In Millimeters Dimensions In Inches

Symbol
Min Max Min Max
A 4.801 5.004 0.189 0.197
B 3.810 3.988 0.150 0.157
C 1.346 1.753 0.053 0.069
D 0.330 0.508 0.013 0.020
F 1.194 1.346 0.047 0.053
H 0.170 0.254 0.007 0.010
I 0.050 0.254 0.002 0.010
J 5.791 6.200 0.228 0.244
M 0.400 1.270 0.016 0.050

8-Lead SOP Plastic Package

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RT9025
H
A

EXPOSED THERMAL PAD Y

(Bottom of Package)
J X B

C
I
D

Dimensions In Millimeters Dimensions In Inches

Symbol
Min Max Min Max
A 4.801 5.004 0.189 0.197
B 3.810 4.000 0.150 0.157
C 1.346 1.753 0.053 0.069
D 0.330 0.510 0.013 0.020
F 1.194 1.346 0.047 0.053
H 0.170 0.254 0.007 0.010
I 0.000 0.152 0.000 0.006
J 5.791 6.200 0.228 0.244
M 0.406 1.270 0.016 0.050
X 2.000 2.300 0.079 0.091
Option 1
Y 2.000 2.300 0.079 0.091
X 2.100 2.500 0.083 0.098
Option 2
Y 3.000 3.500 0.118 0.138

8-Lead SOP (Exposed Pad) Plastic Package

Richtek Technology Corporation Richtek Technology Corporation

Headquarter Taipei Office (Marketing)
5F, No. 20, Taiyuen Street, Chupei City 8F, No. 137, Lane 235, Paochiao Road, Hsintien City
Hsinchu, Taiwan, R.O.C. Taipei County, Taiwan, R.O.C.
Tel: (8863)5526789 Fax: (8863)5526611 Tel: (8862)89191466 Fax: (8862)89191465
Email: marketing@richtek.com

Information that is provided by Richtek Technology Corporation is believed to be accurate and reliable. Richtek reserves the right to make any change in circuit
design, specification or other related things if necessary without notice at any time. No third party intellectual property infringement of the applications should be
guaranteed by users when integrating Richtek products into any application. No legal responsibility for any said applications is assumed by Richtek.

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