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LM35
www.ti.com SNIS159C – AUGUST 1999 – REVISED JULY 2013

LM35 Precision Centigrade Temperature Sensors

1FEATURES DESCRIPTION
•
2 Calibrated Directly in ° Celsius (Centigrade) The LM35 series are precision integrated-circuit
temperature sensors, with an output voltage linearly
• Linear + 10 mV/°C Scale Factor proportional to the Centigrade temperature. Thus the
• 0.5°C Ensured Accuracy (at +25°C) LM35 has an advantage over linear temperature
• Rated for Full −55°C to +150°C Range sensors calibrated in ° Kelvin, as the user is not
required to subtract a large constant voltage from the
• Suitable for Remote Applications
output to obtain convenient Centigrade scaling. The
• Low Cost Due to Wafer-Level Trimming LM35 does not require any external calibration or
• Operates from 4 to 30 V trimming to provide typical accuracies of ±¼°C at
• Less than 60-μA Current Drain room temperature and ±¾°C over a full −55°C to
+150°C temperature range. Low cost is assured by
• Low Self-Heating, 0.08°C in Still Air trimming and calibration at the wafer level. The low
• Nonlinearity Only ±¼°C Typical output impedance, linear output, and precise inherent
• Low Impedance Output, 0.1 W for 1 mA Load calibration of the LM35 make interfacing to readout or
control circuitry especially easy. The device is used
with single power supplies, or with plus and minus
supplies. As the LM35 draws only 60 μA from the
supply, it has very low self-heating of less than 0.1°C
in still air. The LM35 is rated to operate over a −55°C
to +150°C temperature range, while the LM35C is
rated for a −40°C to +110°C range (−10° with
improved accuracy). The LM35 series is available
packaged in hermetic TO transistor packages, while
the LM35C, LM35CA, and LM35D are also available
in the plastic TO-92 transistor package. The LM35D
is also available in an 8-lead surface-mount small-
outline package and a plastic TO-220 package.

+VS +VS
(4 V to 20 V)

LM35 VOUT
LM35 OUTPUT
0 mV + 10.0 mV/°C
R1

Figure 1. Basic Centigrade Temperature Sensor tVS

(+2°C to +150°C) Choose R1 = –VS / 50 µA
VOUT = 1500 mV at 150°C
VOUT = 250 mV at 25°C
VOUT = –550 mV at –55°C

Figure 2. Full-Range Centigrade Temperature

Sensor

Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of
Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
2 All trademarks are the property of their respective owners.
PRODUCTION DATA information is current as of publication date. Copyright © 1999–2013, Texas Instruments Incorporated
Products conform to specifications per the terms of the Texas
Instruments standard warranty. Production processing does not
necessarily include testing of all parameters.
LM35
SNIS159C – AUGUST 1999 – REVISED JULY 2013 www.ti.com

These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam
during storage or handling to prevent electrostatic damage to the MOS gates.

CONNECTION DIAGRAMS

METAL CAN PACKAGE SMALL-OUTLINE MOLDED PACKAGE

TO (NDV) SOIC-8 (D)
TOP VIEW

+VS VOUT
VOUT 1 8 +VS
t
GND N.C. 2 7 N.C.
Case is connected to negative pin (GND) N.C. 3 6 N.C.
GND 4 5 N.C.
N.C. = No connection

PLASTIC PACKAGE PLASTIC PACKAGE

TO-92 (LP) TO-220 (NEB)
BOTTOM VIEW

+VS VOUT GND

LM
35DT

+VS VOUT
GND
Tab is connected to the negative pin
(GND).
NOTE: The LM35DT pinout is different than
the discontinued LM35DP

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ABSOLUTE MAXIMUM RATINGS (1) (2)

MIN MAX UNIT
Supply voltage –0.2 35 V
Output voltage –1 6 V
Output current 10 mA
Electrostatic discharge (ESD) susceptibility (3) 2500 V
Storage temperature TO Package –60 180
TO-92 Package –60 150
°C
TO-220 Package –65 150
SOIC-8 Package –65 150
Lead temperature TO Package (soldering, 10 seconds) 300
TO-92 and TO-220 Package (soldering, 10 seconds) 260
°C
SOIC Package Infrared (15 seconds) 220
Vapor phase (60 seconds) 215
Specified operating temperature LM35, LM35A –55 150
range: TMIN to TMAX (4)
LM35C, LM35CA –40 110 °C
LM35D 0 100

(1) If Military/Aerospace specified devices are required, please contact the Texas Instruments Sales Office/ Distributors for availability and
specifications.
(2) Absolute Maximum Ratings indicate limits beyond which damage to the device may occur. DC and AC electrical specifications do not
apply when operating the device beyond its rated operating conditions. See Note 1.
(3) Human body model, 100 pF discharged through a 1.5-kW resistor.
(4) Thermal resistance of the TO-46 package is 400°C/W, junction to ambient, and 24°C/W junction to case. Thermal resistance of the TO-
92 package is 180°C/W junction to ambient. Thermal resistance of the small outline molded package is 220°C/W junction to ambient.
Thermal resistance of the TO-220 package is 90°C/W junction to ambient. For additional thermal resistance information see table in the
APPLICATIONS section.

ELECTRICAL CHARACTERISTICS (1) (2)

LM35A LM35CA
UNITS
PARAMETER TEST CONDITIONS TYP TESTED DESIGN TYP TESTED DESIGN (MAX.)
LIMIT (3) LIMIT (4) LIMIT (3) LIMIT (4)
TA = 25°C ±0.2 ±0.5 ±0.2 ±0.5
TA = –10°C ±0.3 ±0.3 ±1
Accuracy (5) °C
TA = TMAX ±0.4 ±1 ±0.4 ±1
TA = TMIN ±0.4 ±1 ±0.4 ±1.5
Nonlinearity (6) TMIN ≤ TA ≤ TMAX ±0.18 ±0.35 ±0.15 ±0.3 °C
Sensor gain TMIN ≤ TA ≤ TMAX +10 +9.9, +10 +9.9,
mV/°C
(average slope) +10.1 +10.1
Load regulation (7) TA = 25°C ±0.4 ±1 ±0.4 ±1
mV/mA
0 ≤ IL ≤ 1 mA TMIN ≤ TA ≤ TMAX ±0.5 ±3 ±0.5 ±3
TA = 25°C ±0.01 ±0.05 ±0.01 ±0.05
Line regulation (7) mV/V
4 V ≤ VS ≤ 30 V ±0.02 ±0.1 ±0.02 ±0.1

(1) Unless otherwise noted, these specifications apply: −55°C ≤ TJ ≤ 150°C for the LM35 and LM35A; −40°C ≤ TJ ≤ 110°C for the LM35C
and LM35CA; and 0°C ≤ TJ ≤ 100°C for the LM35D. VS = 5 Vdc and ILOAD = 50 μA, in the circuit of Figure 2. These specifications also
apply from +2°C to TMAX in the circuit of Figure 1. Specifications in boldface apply over the full rated temperature range.
(2) Specifications in boldface apply over the full rated temperature range.
(3) Tested Limits are ensured and 100% tested in production.
(4) Design Limits are ensured (but not 100% production tested) over the indicated temperature and supply voltage ranges. These limits are
not used to calculate outgoing quality levels.
(5) Accuracy is defined as the error between the output voltage and 10 mv/°C times the case temperature of the device, at specified
conditions of voltage, current, and temperature (expressed in °C).
(6) Nonlinearity is defined as the deviation of the output-voltage-versus-temperature curve from the best-fit straight line, over the rated
temperature range of the device.
(7) Regulation is measured at constant junction temperature, using pulse testing with a low duty cycle. Changes in output due to heating
effects can be computed by multiplying the internal dissipation by the thermal resistance.
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ELECTRICAL CHARACTERISTICS(1)(2) (continued)

LM35A LM35CA
UNITS
PARAMETER TEST CONDITIONS TYP TESTED DESIGN TYP TESTED DESIGN (MAX.)
LIMIT (3) LIMIT (4) LIMIT (3) LIMIT (4)
VS = 5 V, 25°C 56 67 56 67
VS = 5 V 105 131 91 114
Quiescent current (8) µA
VS = 30 V, 25°C 56.2 68 56.2 68
VS = 30 V 105.5 133 91.5 116
Change of quiescent 4 V ≤ VS ≤ 30 V, 25°C 0.2 1 0.2 1
µA
current (7) 4 V ≤ VS ≤ 30 V 0.5 2 0.5 2
Temperature +0.39 +0.5 +0.39 +0.5
coefficient of µA/°C
quiescent current
Minimum temperature In circuit of Figure 1, IL = 0 +1.5 +2 +1.5 +2
°C
for rate accuracy
Long term stability TJ = TMAX, for 1000 hours ±0.08 ±0.08 °C

(8) Quiescent current is defined in the circuit of Figure 1.

ELECTRICAL CHARACTERISTICS (1) (2)

LM35 LM35C, LM35D
UNITS
PARAMETER TEST CONDITIONS TYP TESTED DESIGN TYP TESTED DESIGN (MAX.)
LIMIT (3) LIMIT (4) LIMIT (3) LIMIT (4)
TA = 25°C ±0.4 ±1 ±0.4 ±1
Accuracy, LM35, TA = –10°C ±0.5 ±0.5 ±1.5
°C
LM35C (5) TA = TMAX ±0.8 ±1.5 ±0.8 ±1.5
TA = TMIN ±0.8 ±1.5 ±0.8 ±2
TA = 25°C ±0.6 ±1.5
Accuracy, LM35D (5) TA = TMAX ±0.9 ±2 °C
TA = TMIN ±0.9 ±2
Nonlinearity (6) TMIN ≤ TA ≤ TMAX ±0.3 ±0.5 ±0.2 ±0.5 °C
Sensor gain TMIN ≤ TA ≤ TMAX +10 +9.8, +10 +9.8,
mV/°C
(average slope) +10.2 +10.2
Load regulation (7) TA = 25°C ±0.4 ±2 ±0.4 ±2
mV/mA
0 ≤ IL ≤ 1 mA TMIN ≤ TA ≤ TMAX ±0.5 ±5 ±0.5 ±5
TA = 25°C ±0.01 ±0.1 ±0.01 ±0.1
Line regulation (7) mV/V
4 V ≤ VS ≤ 30 V ±0.02 ±0.2 ±0.02 ±0.2

(1) Unless otherwise noted, these specifications apply: −55°C ≤ TJ ≤ 150°C for the LM35 and LM35A; −40°C ≤ TJ ≤ 110°C for the LM35C
and LM35CA; and 0°C ≤ TJ ≤ 100°C for the LM35D. VS = 5 Vdc and ILOAD = 50 μA, in the circuit of Figure 2. These specifications also
apply from +2°C to TMAX in the circuit of Figure 1. Specifications in boldface apply over the full rated temperature range.
(2) Specifications in boldface apply over the full rated temperature range.
(3) Tested Limits are ensured and 100% tested in production.
(4) Design Limits are ensured (but not 100% production tested) over the indicated temperature and supply voltage ranges. These limits are
not used to calculate outgoing quality levels.
(5) Accuracy is defined as the error between the output voltage and 10 mv/°C times the case temperature of the device, at specified
conditions of voltage, current, and temperature (expressed in °C).
(6) Nonlinearity is defined as the deviation of the output-voltage-versus-temperature curve from the best-fit straight line, over the rated
temperature range of the device.
(7) Regulation is measured at constant junction temperature, using pulse testing with a low duty cycle. Changes in output due to heating
effects can be computed by multiplying the internal dissipation by the thermal resistance.

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ELECTRICAL CHARACTERISTICS(1)(2) (continued)

LM35 LM35C, LM35D
UNITS
PARAMETER TEST CONDITIONS TYP TESTED DESIGN TYP TESTED DESIGN (MAX.)
LIMIT (3) LIMIT (4) LIMIT (3) LIMIT (4)
VS = 5 V, 25°C 56 80 56 80
VS = 5 V 105 158 91 138
Quiescent current (8) µA
VS = 30 V, 25°C 56.2 82 56.2 82
VS = 30 V 105.5 161 91.5 141
Change of quiescent 4 V ≤ VS ≤ 30 V, 25°C 0.2 2 0.2 2
µA
current (9) 4 V ≤ VS ≤ 30 V 0.5 3 0.5 3
Temperature +0.39 +0.7 +0.39 +0.7
coefficient of µA/°C
quiescent current
Minimum temperature In circuit of Figure 1, IL = 0 +1.5 +2 +1.5 +2
°C
for rate accuracy
Long term stability TJ = TMAX, for 1000 hours ±0.08 ±0.08 °C

(8) Quiescent current is defined in the circuit of Figure 1.

(9) Regulation is measured at constant junction temperature, using pulse testing with a low duty cycle. Changes in output due to heating
effects can be computed by multiplying the internal dissipation by the thermal resistance.

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TYPICAL PERFORMANCE CHARACTERISTICS

THERMAL RESISTANCE
JUNCTION TO AIR THERMAL TIME CONSTANT
400 45

40
THERMAL RESISTANCE (ƒC/W)

35

TIME CONSTANT (SEC)

300
30

25
200 T0-46
20

15 T0-46
100
10
T0-92
5
T0-92
0 0
0 400 800 1200 1600 2000 0 400 800 1200 1600 2000
AIR VELOCITY (FPM) AIR VELOCITY (FPM)
C001 C002

Figure 3. Figure 4.

THERMAL RESPONSE IN STILL AIR THERMAL RESPONSE IN STIRRED OIL BATH

120 120
PERCENT OF FINAL VALUE (%)

PERCENT OF FINAL VALUE (%)

100 100

80 80 T0-46

60 60
T0-92
40 40

20 20

0 0

±20 ±20
0 2 4 6 8 0 2 4 6 8
TIME (MINUTES) TIME (SEC)
C003 C004

Figure 5. Figure 6.

QUIESCENT CURRENT
MINIMUM SUPPLY VOLTAGE vs
vs TEMPERATURE
TEMPERATURE (IN CIRCUIT OF Figure 1)
4.4 160
4.2 TYPICAL 140
IOUT = 2.0 mA
QUIESCENT CURRENT ( A)

4.0
SUPPLY VOLTAGE (V)

120
3.8
3.6 100

3.4 80
TYPICAL
3.2 IOUT = 1.0 mA 60
3.0
TYPICAL 40
2.8
IOUT = 0 A or 50 A
2.6 20

2.4 0
±75 ±25 25 75 125 175 ±75 ±25 25 75 125 175
TEMPERATURE (ƒC) TEMPERATURE (ƒC)
C005 C006

Figure 7. Figure 8.

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TYPICAL PERFORMANCE CHARACTERISTICS (continued)

QUIESCENT CURRENT
vs ACCURACY
TEMPERATURE vs
(IN CIRCUIT OF Figure 2) TEMPERATURE (ENSURED)
200 2.0

180 1.5 LM35

TEMPERATURE ERROR (ƒC)

QUIESCENT CURRENT ( A)

160 1.0

140 0.5 LM35A

TYPICAL
120 0.0

100 ±0.5 LM35A

80 ±1.0

60 ±1.5
LM35
40 ±2.0
±75 ±25 25 75 125 175 ±75 ±25 25 75 125 175
TEMPERATURE (ƒC) TEMPERATURE (ƒC)
C007 C008

Figure 9. Figure 10.

ACCURACY
vs
TEMPERATURE (ENSURED) NOISE VOLTAGE
2.5 1600
2.0 LM35D
1400
TEMPERATURE ERROR (ƒC)

1.5 LM35C
1200
1.0
Noise (nV/—Hz)

0.5 LM35CA 1000

TYPICAL
0.0 800
±0.5 600
LM35CA
±1.0
400
±1.5 LM35C
200
±2.0
±2.5 0
±75 ±25 25 75 125 175 10 100 1k 10k 100k
TEMPERATURE (ƒC) FREQUENCY (Hz)
C009 C010

Figure 11. Figure 12.

START-UP RESPONSE
6
VIN (V)

0.6

0.4
VOUT (V)

0.2

-0.2
-20 -10 0 10 20 30 40 50 60
TIME ( SEC) C011

Figure 13.

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APPLICATIONS

The LM35 is applied easily in the same way as other integrated-circuit temperature sensors. Glue or cement the
device to a surface and the temperature should be within about 0.01°C of the surface temperature.
This presumes that the ambient air temperature is almost the same as the surface temperature. If the air
temperature were much higher or lower than the surface temperature, the actual temperature of the LM35 die
would be at an intermediate temperature between the surface temperature and the air temperature, which is
especially true for the TO-92 plastic package where the copper leads are the principal thermal path to carry heat
into the device, so its temperature might be closer to the air temperature than to the surface temperature.
To minimize this problem, ensure that the wiring to the LM35, as it leaves the device, is held at the same
temperature as the surface of interest. The easiest way to do this is to cover up these wires with a bead of epoxy
which will insure that the leads and wires are all at the same temperature as the surface, and that the
temperature of the LM35 die is not affected by the air temperature.
The TO-46 metal package can also be soldered to a metal surface or pipe without damage. Of course, in that
case the V− terminal of the circuit will be grounded to that metal. Alternatively, mount the LM35 inside a sealed-
end metal tube, and then dip into a bath or screw into a threaded hole in a tank. As with any IC, the LM35 and
accompanying wiring and circuits must be kept insulated and dry, to avoid leakage and corrosion. This is
especially true if the circuit may operate at cold temperatures where condensation can occur. Printed-circuit
coatings and varnishes such as Humiseal and epoxy paints or dips are often used to insure that moisture cannot
corrode the LM35 or its connections.
These devices are sometimes soldered to a small light-weight heat fin to decrease the thermal time constant and
speed up the response in slowly-moving air. On the other hand, a small thermal mass may be added to the
sensor, to give the steadiest reading despite small deviations in the air temperature.

Table 1. Temperature Rise of LM35 Due To Self-heating (Thermal Resistance, θJA)

SOIC-8 (2),
TO, no heat TO (1), small TO-92, no heat TO-92 (2), small SOIC-8, no TO-220, no
small heat
sink heat fin sink heat fin heat sink heat sink
fin
Still air 400°C/W 100°C/W 180°C/W 140°C/W 220°C/W 110°C/W 90°C/W
Moving air 100°C/W 40°C/W 90°C/W 70°C/W 105°C/W 90°C/W 26°C/W
Still oil 100°C/W 40°C/W 90°C/W 70°C/W
Stirred oil 50°C/W 30°C/W 45°C/W 40°C/W
(Clamped to
metal, Infinite (24°C/W) (55°C/W)
heat sink)

(1) Wakefield type 201, or 1-in disc of 0.02-in sheet brass, soldered to case, or similar.
(2) TO-92 and SOIC-8 packages glued and leads soldered to 1-in square of 1/16-in printed circuit board with 2-oz foil or similar.

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TYPICAL APPLICATIONS

+ HEAVY CAPACITIVE LOAD, WIRING, ETC.

2k
LM35 TO A HIGH-IMPEDANCE LOAD
OUT
v

Figure 14. LM35 with Decoupling from Capacitive Load

+ HEAVY CAPACITIVE LOAD, WIRING, ETC.

OUT
LM35 TO A HIGH-IMPEDANCE LOAD
0.01 PF BYPASS
OPTONAL v 75

1 PF

Figure 15. LM35 with R-C Damper

CAPACITIVE LOADS
Like most micropower circuits, the LM35 has a limited ability to drive heavy capacitive loads. The LM35 alone is
able to drive 50 pf without special precautions. If heavier loads are anticipated, isolating or decoupling the load
with a resistor is easy (see Figure 14). Or you can improve the tolerance of capacitance with a series R-C
damper from output to ground (see Figure 15).
When the LM35 is applied with a 200-W load resistor as shown in Figure 16, Figure 17, or Figure 19, the device
is relatively immune to wiring capacitance because the capacitance forms a bypass from ground to input and not
on the output. However, as with any linear circuit connected to wires in a hostile environment, performance is
affected adversely by intense electromagnetic sources such as relays, radio transmitters, motors with arcing
brushes, and SCR transients, as the wiring acts as a receiving antenna and the internal junctions act as
rectifiers. For best results in such cases, a bypass capacitor from VIN to ground and a series R-C damper, such
as 75 W, in series with 0.2 or 1 μF from output to ground are often useful. These are shown in Figure 24,
Figure 24, and Figure 27.

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5V
+

VOUT = 10 mV/°C (TAMBIENT = 1 °C)

6.8 k 200 FROM + 2 °C TO + 40 °C
5% 1%
v
+
OUT
HEAT LM35
FINS TWISTED PAIR
v 200
1%

Figure 16. Two-Wire Remote Temperature Sensor

(Grounded Sensor)

5V
+
OUT
HEAT LM35
FINS TWISTED PAIR
v 200
1%
VOUT = 10 mV/°C (TAMBIENT = 1 °C)
FROM + 2 °C TO + 40 °C
6.8 k
5% 200
OR 10K RHEOSTAT 1%
FOR GAIN ADJUST

Figure 17. Two-Wire Remote Temperature Sensor

(Output Referred to Ground)

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+VS

LM35 +
VOUT
v
1N914
18 k
10%

Figure 18. Temperature Sensor, Single Supply

(−55° to +150°C)

5V
+
OUT
0.01 PF LM35
BYPASS TWISTED PAIR
OPTIONAL
2k 200
1% 1%
VOUT = 10 mV/°C (TAMBIENT = 10 °C)
FROM t 5 °C TO + 40 °C
2k 200
1% 1%

Figure 19. Two-Wire Remote Temperature Sensor

(Output Referred to Ground)

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+ 5 V TO + 30 V

4.7 k

2N2907
+ IN
OUT OUT
LM35 LM317

v 402 ADJ
1%
62.5
0.5% OFFSET
ADJUST 50

Figure 20. 4-To-20 mA Current Source

(0°C to 100°C)

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+VS
(6 V to 20 V)

LM35
45.5 kO
1%

10 kO
1%
VOUT = +1 mV/°F
26.4 kO
1%

LM385-1.2 18 kO

1 MO
1%

Figure 21. Fahrenheit Thermometer

5V

LM35

Figure 22. Centigrade Thermometer

(Analog Meter)

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9V

1k
LM35
100 A,
60 mV
FULL-
SCALE

LM385- 25.5 k
2.5

Figure 23. Fahrenheit Thermometer, Expanded Scale Thermometer

(50°F to 80°F, for Example Shown)

5V

+ 3.9 k
OUT IN
LM35 SERIAL
REF ADC08031
DATA OUTPUT
1.28 V
GND
75 100k
+
FB CLOCK
LM385
+ ENABLE
1 PF 10 k

GND
Figure 24. Temperature To Digital Converter
(Serial Output)
(128°C Full Scale)

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5V

+ 16 k
PARALLEL
OUT IN 8
LM35 DATA
OUTPUT
GND ADC0804
75 INTR
1k + VREF
0.64 V
CS
+
1 PF 2k RD
WR
GND
Figure 25. Temperature To Digital Converter
(Parallel TRI-STATE Outputs for Standard Data Bus to μP Interface.)
(128°C Full Scale)

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°F

20 k
67 68 69 70 71 72 73 74 75 76 77 78 79 80 81 82 83 84 85 86
7V
+
20 PF
20 LEDs

18 10 18 10

LM3914 LM3914

1 2 3 4 5 6 7 8 9 1 2 3 4 5 6 7 8 9
NC
7V 7V
1.2 k*
+ VA
OUT
HEAT LM35
FINS VC VB
200* 499* 499*
1.5 k* 1 k*

+ RB
1 PF 1.5 k* RC
1k 1k

RA
1k

*=1% or 2% film resistor

Trim RB for VB = 3.075 V
Trim RC for VC = 1.955 V
Trim RA for VA = 0.075 V + 100 mV/°C ×Tambient
Example, VA = 2.275 V at 22°C

Figure 26. Bar-Graph Temperature Display (Dot Mode)

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6V

6.8 k 1k

fOUT
4N28
+
100 k 8
LM35 7 5
LM131
GND 6 3

1 2 4
0.01 PF 12 k 0.01 PF
100 k 1 PF FULL
SCALE
ADJ

5k LOW TEMPCO
47

Figure 27. LM35 With Voltage-To-Frequency Converter And Isolated Output

(2°C to 150°C; 20 to 1500 Hz)

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BLOCK DIAGRAM

A1

1.38 VPTAT

+VS
nR1
Q1 Q2 +
A2
10E E
VOUT = 10 mV/°C
V0
.125 R2
nR1
8.8 mV/°C
i R2

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REVISION HISTORY

Changes from Revision B (November 2000) to Revision C Page

• Changed layout of National Data Sheet to TI format. ......................................................................................................... 18

Copyright © 1999–2013, Texas Instruments Incorporated Submit Documentation Feedback 19

Product Folder Links: LM35
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PACKAGING INFORMATION

Orderable Device Status Package Type Package Pins Package Eco Plan Lead/Ball Finish MSL Peak Temp Op Temp (°C) Device Marking Samples
(1) Drawing Qty (2) (3) (4/5)

LM35AH ACTIVE TO NDV 3 1000 TBD Call TI Call TI -55 to 150 LM35AH

LM35AH/NOPB ACTIVE TO NDV 3 1000 Green (RoHS POST-PLATE Level-1-NA-UNLIM -55 to 150 LM35AH
& no Sb/Br)
LM35CAH ACTIVE TO NDV 3 1000 TBD Call TI Call TI -40 to 110 LM35CAH

LM35CAH/NOPB ACTIVE TO NDV 3 1000 Green (RoHS POST-PLATE Level-1-NA-UNLIM -40 to 110 LM35CAH
& no Sb/Br)
LM35CAZ/LFT4 ACTIVE TO-92 LP 3 2000 Green (RoHS SNCU Level-1-NA-UNLIM LM35
& no Sb/Br) CAZ
LM35CAZ/NOPB ACTIVE TO-92 LP 3 1800 Green (RoHS SNCU Level-1-NA-UNLIM -40 to 110 LM35
& no Sb/Br) CAZ
LM35CH ACTIVE TO NDV 3 1000 TBD Call TI Call TI -40 to 110 LM35CH

LM35CH/NOPB ACTIVE TO NDV 3 1000 Green (RoHS POST-PLATE Level-1-NA-UNLIM -40 to 110 LM35CH
& no Sb/Br)
LM35CZ/LFT1 ACTIVE TO-92 LP 3 2000 TBD Call TI Call TI

LM35CZ/LFT4 ACTIVE TO-92 LP 3 2000 TBD Call TI Call TI

LM35CZ/NOPB ACTIVE TO-92 LP 3 1800 Green (RoHS SNCU Level-1-NA-UNLIM -40 to 110 LM35
& no Sb/Br) CZ
LM35DH ACTIVE TO NDV 3 1000 TBD Call TI Call TI 0 to 70 LM35DH

LM35DH/NOPB ACTIVE TO NDV 3 1000 Green (RoHS POST-PLATE Level-1-NA-UNLIM 0 to 70 LM35DH

& no Sb/Br)
LM35DM ACTIVE SOIC D 8 95 TBD Call TI Call TI 0 to 100 LM35D
M
LM35DM/NOPB ACTIVE SOIC D 8 95 Green (RoHS CU SN Level-1-260C-UNLIM 0 to 100 LM35D
& no Sb/Br) M
LM35DMX ACTIVE SOIC D 8 2500 TBD Call TI Call TI 0 to 100 LM35D
M
LM35DMX/NOPB ACTIVE SOIC D 8 2500 Green (RoHS CU SN Level-1-260C-UNLIM 0 to 100 LM35D
& no Sb/Br) M
LM35DT ACTIVE TO-220 NEB 3 45 TBD Call TI Call TI 0 to 100 LM35DT

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Orderable Device Status Package Type Package Pins Package Eco Plan Lead/Ball Finish MSL Peak Temp Op Temp (°C) Device Marking Samples
(1) Drawing Qty (2) (3) (4/5)

LM35DT/NOPB ACTIVE TO-220 NEB 3 45 Green (RoHS CU SN Level-1-NA-UNLIM 0 to 100 LM35DT

& no Sb/Br)
LM35DZ OBSOLETE TO-92 LP 3 TBD Call TI Call TI
LM35DZ/LFT1 ACTIVE TO-92 LP 3 2000 Green (RoHS SNCU Level-1-NA-UNLIM LM35
& no Sb/Br) DZ
LM35DZ/LFT2 ACTIVE TO-92 LP 3 2000 TBD Call TI Call TI

LM35DZ/LFT4 ACTIVE TO-92 LP 3 2000 Green (RoHS SNCU Level-1-NA-UNLIM LM35

& no Sb/Br) DZ
LM35DZ/LFT7 ACTIVE TO-92 LP 3 2000 Green (RoHS SNCU Level-1-NA-UNLIM LM35
& no Sb/Br) DZ
LM35DZ/NOPB ACTIVE TO-92 LP 3 1800 Green (RoHS SNCU Level-1-NA-UNLIM 0 to 100 LM35
& no Sb/Br) DZ
LM35H ACTIVE TO NDV 3 1000 TBD Call TI Call TI -55 to 150 LM35H

LM35H/NOPB ACTIVE TO NDV 3 1000 Green (RoHS POST-PLATE Level-1-NA-UNLIM -55 to 150 LM35H
& no Sb/Br)

(1)
The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.

(2)
Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability
information and additional product content details.
TBD: The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that
lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between
the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above.
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight
in homogeneous material)

(3)
MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.

(4)
There may be additional marking, which relates to the logo, the lot trace code information, or the environmental category on the device.

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(5)
Multiple Device Markings will be inside parentheses. Only one Device Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a continuation
of the previous line and the two combined represent the entire Device Marking for that device.

Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information
provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and
continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals.
TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release.

In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.

Addendum-Page 3
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www.ti.com 27-Jun-2013

TAPE AND REEL INFORMATION

*All dimensions are nominal

Device Package Package Pins SPQ Reel Reel A0 B0 K0 P1 W Pin1
Type Drawing Diameter Width (mm) (mm) (mm) (mm) (mm) Quadrant
(mm) W1 (mm)
LM35DMX SOIC D 8 2500 330.0 12.4 6.5 5.4 2.0 8.0 12.0 Q1
LM35DMX/NOPB SOIC D 8 2500 330.0 12.4 6.5 5.4 2.0 8.0 12.0 Q1

Pack Materials-Page 1
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*All dimensions are nominal

Device Package Type Package Drawing Pins SPQ Length (mm) Width (mm) Height (mm)
LM35DMX SOIC D 8 2500 367.0 367.0 35.0
LM35DMX/NOPB SOIC D 8 2500 367.0 367.0 35.0

Pack Materials-Page 2
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