GSA Chipset Report April 2019

LTE, 5G and 3GPP IoT
Chipsets: Status Update
LTE and 5G report based on intelligence gathered as part of

GSA’s industry research programme
April 2019
©Copyright 2019 Global mobile Suppliers Association 1

Introduction
GSA continuously tracks the mobile industry and reports on adoption of 3GPP
standardised technologies and the expansion of the mobile ecosystem. This
report complements the broader Status of the LTE Ecosystem reports based
on the GSA GAMBoD devices database (which covers modules as well as end-
user devices of multiple types).
The focus of this report is discrete cellular modem chipsets, mobile processors
and platforms used in devices with LTE (and 5G) connectivity, and chipsets
designed for devices using 3GPP-defined IoT technologies.
4 commercial 5G
modem chipsets
Note that we do not include information on separate baseband processors,
and 1 commercial
processor/platform; DSP chips or separate RF front-end transceivers, nor silicon designed
more to follow soon primarily for base stations used as network infrastructure. However, we will
23 discrete cellular include chipsets designed for enterprise and residential small cells and FWA
modem chipsets applications as these can be considered devices (femtocells are included in
supporting the GAMBoD database). Nor do we track reference designs for complete
LTE (excluding
platforms or discrete components where the vendor has no involvement
5G-capable silicon)
beyond creation of IP for licensing (e.g. some designs from ARM and CEVA).
133 mobile
platforms or Technology background and definitions
processors
supporting LTE Chipset vendors use different terms to describe their products. In this report
(including 1 that we define three specific types, as follows.
also supports 5G)
29 modem or •• Discrete cellular modem A modem chipset in a single package designed
platform chipsets primarily to handle the transfer of data across the air interface. It will
supporting 3GPP contain the transceiver, filters and power amplifier, and handle signal
IoT technologies
modulation/demodulation, duplexing modes and carrier aggregation.
Modem chipsets are often – but not always – built to support specific
regional requirements, in different variants (SKUs, or stock-keeping
units): we do not systematically track all variants separately. Generally,
a cellular modem chipset will not deliver capabilities such as GNSS
positioning or powerful processors for applications or graphics.
•• Mobile processor/platform A chipset that encompasses a cellular
modem along with additional processors to deliver more functionality
in a single package. Again, region-specific variants may be produced.
Our definition includes chipsets described as ‘system on chip’ (SoC), and
‘single chip’ packages as long as they include RF and modem capabilities.
The extent of the additional capabilities varies significantly between
GSA Report |April 2019| LTE, 5G and 3GPP IoT Chipsets: Status Update
2
©Copyright 2019 Global mobile Suppliers Association
models; some, but not all, contain powerful graphics processors for
image and video applications. Mobile processors/platforms chipsets
may be designed for specific types of devices (such as automotive
components, smartphones, tablets or laptops). This category includes
chipsets designed for FWA devices (routers, gateways) as well as those
for mobile devices.
•• 3GPP IoT chipset A modem or mobile processor/platform designed
primarily for use in IoT devices and, in our database, supporting
3GPP IoT-oriented user equipment categories (specifically, LTE Cat-1,
Cat-M1 and Cat-NB1/NB2). While capabilities vary, these chipsets do
not generally support as full a range of features as other chipsets in
our database. Other chipsets may also be used for IoT applications.
Note that we do not capture information about uplink/downlink speed
separately (3GPP’s user equipment (UE) device category definitions
state the relevant maximum data rates). Again, we exclude chipsets
without RF and modem capabilities.
DL/UL data speeds and UE categories
We have collected data from vendors on stated support for 3GPP LTE UE
categories as well as stated maximum peak downlink and uplink speeds. Some,
but not all, vendors state both. We have not filled gaps in the DL/UL speeds
from stated categories where no speeds are given. UE categories have been
assigned on the basis of speeds and other information given, using our best
efforts, to ensure that the UE categories fields are as complete as possible.
Spectrum band support
We have not collected spectrum band support data for LTE chipsets in the
database; readers should refer to the vendors’ own information. However,
we do track availability of chipset support for new, emerging bands and
those being used for 5G networks. New 5G modems and mobile processors/
platforms will often support mmWave frequencies as well as sub-6 GHz
frequencies to enable multimode devices.
5G silicon status
Since our last report at the end of 2018, there has been further activity in the
5G chipset arena.
•• Hi-Silicon (Huawei) announced its first generation 5G-only Balong

5G01 cellular modem and, more recently, its second generation LTE/5G
3
Balong 5000 cellular modem. A 5G version of its Kirin processor, the
Kirin 990, has also been expected by industry commentators, though
no official announcement has been made as far as GSA is aware.
•• Intel has announced the XMM8060 and XMM8160 cellular modems.
•• Mediatek has announced the Helio M70 modem.
•• Qualcomm has announced the Snapdragon 855 mobile platform and
the Snapdragon X50 and X55 modems.
•• Samsung has announced its Exynos 5100 (S5T5100) modem.
Of these, we consider Qualcomm’s Snapdragon 855 platform and its X50
modem, the Samsung Exynos 5100 and Hi-Silicon Balong 5G01 and 5000
modems to be commercially available; all other 5G silicon listed we consider
to be at pre-commercial stage, though some samples may be shipping. Precise
commercial status of these chipsets, and of mobile platforms that integrate
these modems, is difficult to confirm. MediaTek says that devices using its
Helio M70 modem will be commercially available in 2019; Intel is expected
to ship the XMM 8060 and XMM 8160 in mid-2019 and 2H 2019 respectively.
The Qualcomm X55 modem is expected to ship in 2H 2019.
Information on performance of pre-commercial 5G chipsets is partial, but the

peak downlink speeds for the commercial modems range from 4700 Mbps (for
Mediatek’s Helio M70 to 6.5 Gbps for Hi-Silicon’s Balong 5000. Qualcomm’s
Snapdragon X55 is expected to have a peak theoretical throughput of 7 Gbps;
Intel says its XMM 8160 will have a downlink speed of 6 Gbps, likewise the
Samsung Exynos 5100. Maximum peak theoretical uplink speeds (where we
have data) range from 1.5 Gbps to 3.5 Gbps. At least half the commercially
available 5G-capable chipsets can support LTE as well as 5G services.
Discrete LTE cellular modems

Excluding 5G-capable chipsets, GSA has counted 23 commercial discrete
cellular LTE modem chipsets, from six vendors: Hi-Silicon, Intel, Qualcomm,
Samsung, Sanechips (formerly ZTE Microelectronics) and UNISOC (formerly
Spreadtrum). Other modems are produced but these are integrated with other
processors in mobile platforms; examples include MediaTek’s WorldMode
4G modem integrated within many of MediaTek’s platforms.
In terms of downlink speeds, the fastest current LTE modem chipsets are:
•• Qualcomm’s Snapdragon X20 and X24 modems (DL category 18 and

20 respectively; 1.2 Gbit/s and 2 Gbit/s respectively with 5 and 7 carrier
aggregation respectively and 256QAM on the downlink).
4
•• Intel’s XMM 7560 and 7660 modems (DL category 16 and 19 respectively;
1 Gbit/s and 1.6 Gbit/s respectively, again with 5 and 7 carrier aggregation
respectively, with 256QAM modulation on the downlink).
•• Hi-Silicon’s Balong 765 (DL category 19; 1.6 Gbit/s, with four-channel
carrier aggregation, 256QAM DL modulation and 8x8 MIMO on the DL,
which is an industry first).
Other modems are also powering fast mobile platforms such as the Samsung
Exynos 9 Series (9810 and 9820) and Hi-Silicon’s Kirin 970 and 980 which
support downlink speeds in excess of 1.2 Gbps, and in the case of the Exynos
9820, 2 Gbps.
Mobile processors/platforms
Commercially launched mobile processors/platforms comprise the largest
category of chipsets in the GSA database; we have counted 133 (other than
those specifically designed for IoT applications, see next section) from 13
vendors: Altair Semiconductor, GCT, Hi-Silicon, Innofidei, Intel, Leadcore,
MediaTek, Qualcomm, Renesas Mobile, Samsung, Sequans, UNISOC
(previously Spreadtrum) and Xiaomi.
A number of other mobile processors/platforms from GCT, Hi-Silicon,

MediaTek, Qualcomm, UNISOC, and Xiaomi are still at the pre-commercial
stage and not included in our analysis.
Our total of commercial LTE mobile processors/platforms includes some

market-specific variants (such as chipsets designed to meet automotive
industry standards), but regional/band-specific variants are not systematically
captured in the database. One of the mobile processors/platforms supports
LTE and 5G (the Qualcomm Snapdragon 855).
Downlink UE category support
Figure 1 shows the distribution of processors/platforms in our database by

downlink UE category supported, where known.
5
Figure 1: Percentage of mobile processors/platforms supporting specific UE categories
Support for advanced features is growing. We have identified 19 commercial

mobile processors/platforms that support 256QAM in the downlink (up
from 16 in our last report): GCT’s GDM7243A, Hi-Silicon’s Kirin 970 and 980,
Mediatek’s Helio P90, Qualcomm’s Snapdragon 630, 636, 660, 670, 675, 710,
712, 820, 821, 835, 845, 850 and 855, and Samsung’s Exynos 9 Series (9810
and 9820). There are 31 more that support 64QAM in the downlink and 30
that support 64QAM or better in the uplink (up from 29 in the last report).
Three processor/platforms support 256QAM in the uplink: Hi-Silicon’s Kirin
980, Qualcomm’s Snapdragon 855, and Samsung’s Exynos 9 Series (9820).
Nineteen mobile processor/platform chipsets have confirmed support for

4x4 MIMO (up from 16 in the last report): Altair Semiconductor’s Alt4800;
GCT’s GDM7243Q Quad, GDM7243QT and GDM7243A; Hi-Silicon’s Kirin 960,
970 and 980; Mediatek’s Helio P90; Qualcomm’s Snapdragon 710, 712, 820
(and automotive variant), 821, 835, 845, 850 and 855; and Samsung’s Exynos
9810 and 9820.
VoLTE, eMBMS and unlicensed spectrum support
GSA is tracking the ecosystem for specific LTE features. Figure 2 shows the
number of commercially available mobile processors/platforms and discrete
cellular modems, supporting VoLTE and eMBMS (LTE Broadcast/Multicast).
Note that Cat-1 chipsets may also support VoLTE, and LTE-M (Cat-M1) also
allows for VoLTE support. We have confirmed that 11 Cat-1 or Cat-M1 chipsets
(aimed primarily at IoT applications) explicitly state support for VoLTE (others
may also support it but this has not been confirmed by vendors).
6
Figure 2: Support for eMBMS and VoLTE
The number of mobile processors/platforms and discrete cellular modems

that support the technology predominantly used to deliver LTE using
unlicensed spectrum – LAA – has been growing and reached nine and five
respectively in April 2019.
Samsung’s new Exynos 9 Series (9820) supports Enhanced LAA (eLAA), which
enables uplink as well as downlink use of unlicensed bands.
3GPP IoT chipsets

There are 29 chipsets (modem chipsets and integrated processors/platforms)
designed specifically to address M2M and IoT applications and which support
any of LTE Cat-1, Cat-M1 and Cat-NB1/NB2 user equipment. Note that we
have removed three chipsets from our analysis that we found did not have
integrated RF and modem features.
The GSA report Evolution to NB-IoT and LTE-M tracks the ecosystem of chipsets
and modules as well as network rollouts. Figure 3 shows the percentage of
chipsets supporting UE Cat-NB1/NB2, Cat-1 and Cat-M1.
7
Figure 3: Numbers of chipsets supporting 3GPP IoT standards, with percentage of total (29)
Chipset tables
The tables below list the commercially launched 5G and LTE chipsets analysed
for this report. Tables 1 and 2 exclude chipsets designed primarily for 3GPP
IoT applications; these are shown in Table 3.
Table 1: Discrete 5G and LTE cellular modem chipsets
Vendor Model UE Category (DL) 5G?

Hi-Silicon Balong 5000 No data Yes
Hi-Silicon Balong 5G01 No data Yes
Hi-Silicon Balong 700 No data
Hi-Silicon Balong 710 4
Intel XMM 7160 4
Intel XMM 7260/7262 6
Intel XMM 7360 10
Intel XMM 7480 12
Intel XMM 7560 16
Intel XMM 7660 19
Qualcomm Snapdragon X12 12
Qualcomm Snapdragon X50 No data Yes
8
Samsung Exynos 5100 (S5T5100) 19 Yes
Samsung Exynos Modem 303 6
Samsung Exynos Modem 333 10
Sanechips Technology ZX297510 4
Sanechips Technology ZX297520 4
UNISOC (formerly Spreadtrum) SC9620 4
Table 2: LTE and 5G mobile processors/platforms

Altair Semiconductor Alt3800 4
Altair Semiconductor Alt4800 12
GCT GDM7243A 15
GCT GDM7243Q Quad 7
GCT GDM7243QT 7
GCT GDM7243S 4
GCT GDM7243ST 4
Hi-Silicon Kirin 620 4
Innofidei Warp Drive 5000 4
Intel Atom x3-M7272 6
Leadcore InnoPower LC1860 4
Leadcore InnoPower LC1860C 4
MediaTek Helio A22 4
MediaTek Helio P10 6
Mediatek Helio P90 12
MediaTek Helio X10 4
9
MediaTek MT6595 4
MediaTek MT6732 4
MediaTek MT6735 4
MediaTek MT6737 4
MediaTek MT6737T 4
MediaTek MT6738 6
MediaTek MT6739 4
MediaTek MT6750 6
MediaTek MT6752 4
MediaTek MT6753 4
MediaTek MT8735B 4
MediaTek MT8735D 4
MediaTek MT8735M 4
MediaTek MT8735P 4
MediaTek MT8783 4
MediaTek MT8785 6
Qualcomm 205 Mobile Platform 4
Qualcomm Snapdragon 210 4
10
Automotive Processor
Qualcomm Snapdragon 855 20 Yes
Qualcomm Snapdragon Wear 2100 4
Renesas Mobile MP6530 4
Renesas Mobile MP6532 4
Samsung Exynos 3 Quad (3470) 4
Samsung Exynos 5 Series (7872) 7
Samsung Exynos 7 Dual (7270) 4
Samsung Exynos 7 Octa (7580) 6
Samsung Exynos 7 Quad (7570) 4
Samsung Exynos 9 Series 9820 20
Sequans Cassiopeia LTE-Advanced 6
Platform
Sequans Colibri LTE Platform 4
Sequans Mont Blanc LTE Platform 4
Sequans Mont Blanc LTE/WiMAX 4
Platform
UNISOC (formerly Spreadtrum) SC9830A 0
11
UNISOC (formerly Spreadtrum) SC9832E 4
UNISOC (formerly Spreadtrum) SC9853I 7
UNISOC (formerly Spreadtrum) SC9860GV 7
UNISOC (formerly Spreadtrum) SC9861G-IA 7
Xiaomi Surge S1 4
Table 3: 3GPP IoT chipsets
Vendor Model Cat-NB1 Cat-M1 Cat-1

Altair Semiconductor ALT1160 Yes
Altair Semiconductor ALT1210 Yes Yes
Altair Semiconductor ALT1250 Yes Yes
CEVA CEVA-Dragonfly NB1 Yes
CEVA CEVA-Dragonfly NB2 Yes
GCT GDM7243i Yes Yes
Intel XMM 7115 Yes
Intel XMM 7120M Yes
Intel XMM 7315 Yes Yes
MediaTek MT2621 Yes
MediaTek MT2625 Yes
Neul Boudica 120 Yes
Neul Boudica 150 Yes
Nordic Semiconductor Nordic nRF9160 SiP (System in Yes Yes
Package)
Nurlink NK6010 Yes
Qualcomm 9205 Modem Yes Yes
Qualcomm MDM9206 Yes Yes
Qualcomm MDM9207-1 Yes
Qualcomm Snapdragon Wear 1100 Yes
Qualcomm Snapdragon Wear 1200 Yes Yes
RDA Microelectronics RDA8908 Yes
Samsung Exynos i S111 Yes
Sanechips Technology RoseFinch 7100 Yes
Sequans Calliope LTE Platform Yes
Sequans Monarch 2 Yes Yes
Sequans Monarch LTE Platform Yes Yes
Sequans Monarch N Yes Yes
Sequans Monarch SX Yes Yes
Sequans / STMicro CLOE LTE Tracker Platform Yes Yes
We intend to continue to update the chipset database and this report;

additions or correction are welcomed. Please contact research@gsacom.com
12
About GSA
GSA (the Global mobile Suppliers Association) is a not-for-profit industry
organisation representing companies across the worldwide mobile ecosystem
engaged in the supply of infrastructure, semiconductors, test equipment, devices,
applications and mobile
support services.
GSA actively promotes the 3GPP technology road-map – 3G; 4G; 5G – and is a
single source of information resource for industry reports and market intelligence.
GSA Members drive the GSA agenda and define the communications and
development strategy for the Association.
Membership of GSA is open to any supplier of products; systems or services

related to the mobile industry and brings many benefits including access to
the GAMBoD database. The range of benefits includes enhanced discussion,
networking and influencing opportunities on the key industry topics, and unique
promotional/visibility opportunities for your company name, capabilities,
positioning and messages. More details can be found at
https://gsacom.com/gsa-membership/
News/updates RSS Feed: https://gsacom.com/rss-feeds/

GSA LinkedIn group: www.linkedin.com/groups?gid=2313721
Twitter: www.twitter.com/gsacom
Facebook: www.facebook.com/pages/Global-mobile-Suppliers-Association-
GSA/123462771012551
NOTES:
Errors & Omissions Excepted
Contact
GSA Secretariat
Email: info@gsacom.com
Research feedback email: research@gsacom.com
Tel: +44 330 113 1572
GSA website: https://gsacom.com
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LTE, 5G and 3GPP IoT

Chipsets: Status Update

LTE and 5G report based on intelligence gathered as part of

©Copyright 2019 Global mobile Suppliers Association 1

DL/UL data speeds and UE categories

Spectrum band support

•• Hi-Silicon (Huawei) announced its first generation 5G-only Balong

Information on performance of pre-commercial 5G chipsets is partial, but the

Discrete LTE cellular modems

•• Qualcomm’s Snapdragon X20 and X24 modems (DL category 18 and

A number of other mobile processors/platforms from GCT, Hi-Silicon,

Our total of commercial LTE mobile processors/platforms includes some

Downlink UE category support

Figure 1 shows the distribution of processors/platforms in our database by

Support for advanced features is growing. We have identified 19 commercial

Nineteen mobile processor/platform chipsets have confirmed support for

VoLTE, eMBMS and unlicensed spectrum support

The number of mobile processors/platforms and discrete cellular modems

3GPP IoT chipsets

Table 1: Discrete 5G and LTE cellular modem chipsets

Vendor Model UE Category (DL) 5G?

Table 2: LTE and 5G mobile processors/platforms

Vendor Model UE Category (DL) 5G?

Table 3: 3GPP IoT chipsets

Vendor Model Cat-NB1 Cat-M1 Cat-1

We intend to continue to update the chipset database and this report;

Membership of GSA is open to any supplier of products; systems or services

News/updates RSS Feed: https://gsacom.com/rss-feeds/

GSA website: https://gsacom.com

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