Design and Materials
Selection
Lecture 2
Dr. Muslim Muhsin
Lecture 2
Engineering Materials and
Their Properties
Material Selection
It is not necessarily a material
that we seek, but a certain
profile of properties – the one
that best meets the needs of
the design
Menu of Engineering Materials
The members of a
material family have
certain features in
common: similar
properties, similar
processing routes,
and, often, similar
applications
Figure 1
Ceramics
• Stiff – high E
• Hard
• Abrasion resistant
• Good high temperature strength
• Good corrosion resistance
• Brittle
Glasses
• Hard
• Corrosion resistant
• Electrically insulating
• Transparent
• Brittle – low KIC
Polymers
• Light – low ρ
• Easily shaped
• High strength per unit weight (σ/ρ)
• Lack stiffness – low E (50X less than metals)
• Properties highly sensitive to temperature
Elastomers
• Lack stiffness – low E (500 – 5000X less than
metals)
• Able to retain initial shape after being stretched
• Relatively strong and tough
Metals
• Tough – high KIC
• Stiff – high E
• Ductile
• Wide range of strengths depending on composition and
processing
• Thermally and electrically conductive
• Reactive – low corrosion resistance
Hybrids
• Expensive
• Difficult to shape and join
• Properties dependent on combination of
materials
What type of materials information do
you need for design?
Figure 2
We are interested in the data in the center of the
schematic; structured data for design allowables and
information concerning the materials ability to be
formed, joined, and finished
Material Properties and Their Units
Each material can be
thought of as having a
set of attributes or
properties
The combination that
characterizes a given
material is its property
profile
Figure 3
Mechanical Properties
The stress-strain curve for a metal,
showing the modulus, E, the 0.2% yield
strength, σy, and the ultimate strength, σts
The strain at the
point of failure
indicates the ductility
of a material
Figure 4
Figure 5
The tensile response of a The compressive
polymer varies with
temperature – here the strength of a ceramic is
response is shown with 10-15 times greater than
respect to the glass the tensile strength
transition temperature, Tg
Figure 6
The modulus of rupture (MOR) is the
surface stress at failure in bending – it is
equal to, or slightly larger than, the failure
stress in tension
Figure 7
For many materials there exists a fatigue or
endurance limit, σe, illustrated by the Δσ – Nf
curve; it is the stress amplitude below which
fracture does not occur, or only occurs after a
very large number (Nf >107) cycles
Hardness is measured as the load, F,
divided by the projected area of contact,
A, when a diamond-shaped indenter is
forced into the surface
Figure 8
Commonly used scales of hardness
related to each other and to the yield
strength
Figure 9
Figure 10
The fracture toughness, KIC, measures the
resistance to the propagation of a crack; the
test specimen containing a crack of length 2c
fails at stress σ*; the fracture toughness is
then KIC = Yσ*(πc)1/2
Figure 11
The loss tangent η measures the
fractional energy dissipated in a stress-
strain cycle
Figure 12
Wear is the loss of material from surfaces
when they slide; the wear resistance is
measured by the Archard wear constant, KA
Thermal Properties
Figure 13
The heat capacity – the energy to
raise the temperature of 1 kg of
material by 1°C
Figure 14
The thermal conductivity λ
measures the flux of heat driven
by a temperature gradient
Figure 15
The linear-thermal expansion coefficient α
measures the change in length, per unit
length, when the sample is heated
Electrical Properties
Figure 16
Electrical resistivity, ρe, is measured as the
potential gradient, V/L, divided by the current
density, i/A; it is related to the resistance, R, by
ρe = AR/L
Dielectric Constant
Figure 17
Dielectric Loss
Figure18