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CLP Application Form

This document is an application form for the CLP Mentoring Program. The applicant, Pareen Khanna, is a first year computer science student at the University of Hong Kong with a full tuition scholarship. She provides her contact information, language skills, extracurricular activities, and expectations for the program. Pareen hopes to gain real world experience and a clearer idea of her career path through interactions with a mentor and other mentees. She commits to attending key program events.

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pareen
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177 views2 pages

CLP Application Form

This document is an application form for the CLP Mentoring Program. The applicant, Pareen Khanna, is a first year computer science student at the University of Hong Kong with a full tuition scholarship. She provides her contact information, language skills, extracurricular activities, and expectations for the program. Pareen hopes to gain real world experience and a clearer idea of her career path through interactions with a mentor and other mentees. She commits to attending key program events.

Uploaded by

pareen
Copyright
© © All Rights Reserved
We take content rights seriously. If you suspect this is your content, claim it here.
Available Formats
Download as DOC, PDF, TXT or read online on Scribd
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CONFIDENTIAL

機密文件

CLP Mentoring Program – Application Form


NAME IN ENGLISH NAME IN CHINESE PREFERRED NAME (e.g. Richard)

PAREEN KHANNA PAREEN

EMAIL ADDRESS GENDER FEMALE PASSPORT NO. / HKID NO. Z3050730

Khanna.pareen99@gmail.com

NAME OF UNIVERSITY / INSTITUTE STUDENT ID

THE UNIVERSITY OF HONG KONG 3035435577

FACULTY - ENGINEERING YEAR OF STUDY

MAJOR OF STUDY COMPUTER SCIENCE EXPECTED GRADUATION DATE

2021-06-30

CORRESPONDENCE ADDRESS ROOM 4D, BLOCK D, POKFIELD ROAD RESIDENCES


CONTACT PHONE NO.
13-21 POKFIELD ROAD, HONG KONG

+852-65230621

ACADEMIC AWARD / DISTINCTION / SCHOLARSHIP ATTAINED

NAME OF ACADEMIC AWARD / DISTINCTION / SCHOLARSHIP DATE ATTAINED

FULL TUTION FEE 1st September 2017

LANGUAGE & HOBBIES


CLP WILL MAKE PREFERENCE TO APPLICANT’S INTEREST & EXPECTATION IN MATCHING AS FAR AS POSSIBLE

LANGUAGE： WRITTEN ENGLISH

SPOKEN ENGLISH
OTHER RELEVANT SKILLS

EXTRA–CURRICULAR ACTIVITIES / ACHIEVEMENTS DATE ATTAINED

MODEL UNITED NATIONS

DEBATING

WRITING

PLEASE RANK YOUR PREFERENCE FOR THE FOLLOWING FIELDS (1=MOST PREFER; 3=LEAST PREFER)

2 ELECTRICAL ENGINEERING 2

MECHANICAL ENGINEERING

ELECTRONIC ENGINEERING

1 OTHERS, PLEASE SPECIFY: 1 COMPUTER SCIENCE

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CONFIDENTIAL
機密文件

EXPECTATION
1. WHY DO YOU WANT TO JOIN THE MENTORING PROGRAM?

I feel this mentorship program will broaden my horizon in terms of the opportunities available for Engineering
Students. Also I will get some real world experience as to what an engineer’s job entails when I go for the
Factory visit. Interacting with my mentor and other fellow mentees will help me a lot to learn new things.

2. WHAT DO YOU EXPECT TO GAIN FROM THIS PROGRAM?

I expect to gain a more clear idea of the subject I want to specialize in and help me plan about my future
prospects well in advance. I will also gain communication skills and learn about work place etiquettes.
Talking to other mentees and mentors, will help me build more connections and improve my social skills.

3. ADDITIONAL INFORMATION

1. Your personal data will be used by the CLP group (incl. CLP Holdings & its subsidiaries, associated companies and/or Joint Venture Companies) for mentoring
program – related issues. You should inform the HR unit of any changes to the above data.
2. I confirm all information given above is correct and I have no objection to verification if deemed appropriate.
3. I commit to join the key events of the program below:

y  14 November 2017: Kick off with Pledge YES


 5 January 2018: Retrospective Workshop & Company Visit (MAYBE)

 31 May 2018: Mid-program Reunion & Review YES


 31 August 2018: Company Visit YES
 16 November 2018: Closing Ceremony YES
Please tick as appropriate.

Applicant’s Signature PAREEN KHANNA Date 27 SEPTEMBER 2017

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