BSP 752 R

Smart Power High-Side-Switch

Features Product Summary
• Overload protection Overvoltage protection Vbb(AZ) 62 V
• Current limitation Operating voltage Vbb(on) 6...52 V
• Short circuit protection On-state resistance RON 200 mΩ
• Thermal shutdown with restart Nominal load current IL(nom) 1.3 A
• Overvoltage protection (including load dump)
• Fast demagnetization of inductive loads
• Reverse battery protection with external resistor
• Open drain diagnostic output for overtemperature
and short circuit
• Open load detection in OFF - State
with external resistor
• CMOS compatible input
• Loss of GND and loss of Vbb protection
• ESD - Protection
• Very low standby current

Application
• All types of resistive, inductive and capacitive loads
• µC compatible power switch for 12 V, 24 V and 42 V DC applications
• Replaces electromechanical relays and discrete circuits

General Description
N channel vertical power FET with charge pump, ground referenced CMOS compatible input
and diagnostic feedback, monolithically integrated in Smart SIPMOS  technology.
Providing embedded protective functions.

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 BSP 752 R

Block Diagram

+ V bb

Voltage Overvoltage Current Gate

source protection limit protection
V Logic
Limit for OUT
Charge pump unclamped
Level shifter ind. loads Temperature
sensor
Rectifier
IN
Load
ESD Logic
ST


GND miniPROFET

Signal GND Load GND

Pin Symbol Function

1 GND Logic ground
2 IN Input, activates the power switch in case of logic high signal
3 OUT Output to the load
4 ST Diagnostic feedback
5 Vbb Positive power supply voltage
6 Vbb Positive power supply voltage
7 Vbb Positive power supply voltage
8 Vbb Positive power supply voltage

Pin configuration

Top view

GND 1• 8 Vbb

IN 2 7 Vbb

OUT 3 6 Vbb

ST 4 5 Vbb

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 BSP 752 R

Maximum Ratings at Tj = 25°C, unless otherwise specified

Parameter Symbol Value Unit
Supply voltage Vbb 52 V
Supply voltage for full short circuit protection Vbb(SC) 50
Continuous input voltage VIN -10 ... +16
Load current (Short - circuit current, see page 5) IL self limited A
Current through input pin (DC) I IN ±5 mA
Operating temperature Tj -40 ...+150 °C
Storage temperature T stg -55 ... +150
Power dissipation 1) Ptot 1.5 W
Inductive load switch-off energy dissipation 1)2) EAS 125 mJ
single pulse, (see page 9 )
Tj =150 °C, IL = 1 A
Load dump protection 2) VLoadDump3)= VA + VS VLoaddump V
RI=2Ω, td=400ms, VIN= low or high, VA=13,5V
RL = 13.5 Ω 73.5
RL = 27 Ω 83.5
Electrostatic discharge voltage (Human Body Model) VESD kV
according to ANSI EOS/ESD - S5.1 - 1993
ESD STM5.1 - 1998
Input pin ±1
all other pins ±5

Thermal Characteristics
Thermal resistance @ min. footprint Rth(JA) - 95 - K/W
Thermal resistance @ 6 cm2 cooling area 1) Rth(JA) - 70 83

1Device on 50mm*50mm*1.5mm epoxy PCB FR4 with 6 cm2 (one layer, 70µm thick) copper area for drain
connection. PCB is vertical without blown air. (see page 17)
2not subject to production test, specified by design
3V Loaddump is setup without the DUT connected to the generator per ISO 7637-1 and DIN 40839 .
Supply voltages higher than V bb(AZ) require an external current limit for the GND pin, e.g. with a
150Ω resistor in GND connection. A resistor for the protection of the input is integrated.

Page 3 2004-01-27
 BSP 752 R

Electrical Characteristics
Parameter and Conditions Symbol Values Unit
at Tj = -40...+150°C, V bb = 12..42V, unless otherwise specified min. typ. max.
Load Switching Capabilities and Characteristics
On-state resistance RON mΩ
T j = 25 °C, I L = 1 A, V bb = 9...52 V - 150 200
T j = 150 °C - 270 380
Nominal load current; Device on PCB 1) IL(nom) 1.3 1.7 - A
T C = 85 °C, T j ≤ 150 °C
Turn-on time to 90% V OUT ton - 80 180 µs
RL = 47 Ω
Turn-off time to 10% V OUT toff - 80 200
RL = 47 Ω
Slew rate on 10 to 30% V OUT, dV/dton - 0.7 2 V/µs
RL = 47 Ω, V bb = 13.5 V
Slew rate off 70 to 40% V OUT, -dV/dtoff - 0.9 2
RL = 47 Ω, V bb = 13.5 V

Operating Parameters
Operating voltage Vbb(on) 6 - 52 V
Undervoltage shutdown of charge pump Vbb(under)
Tj = -40...+85 °C - - 4
Tj = 150 °C - - 5.5
Undervoltage restart of charge pump Vbb(u cp) - 4 5.5
Standby current Ibb(off) µA
Tj = -40...+85 °C, VIN = low - - 15
Tj = +150 °C2), VIN = low - - 18
Leakage output current (included in Ibb(off)) IL(off) - - 5
VIN = low
Operating current IGND - 0.8 2 mA
VIN = high

1Device on 50mm*50mm*1.5mm epoxy PCB FR4 with 6 cm2 (one layer, 70µm thick) copper area for drain
connection. PCB is vertical without blown air. (see page 17)
2higher current due temperature sensor

Page 4 2004-01-27
 BSP 752 R

Electrical Characteristics
Parameter and Conditions Symbol Values Unit
at Tj = -40...+150°C, Vbb = 12..42V, unless otherwise specified min. typ. max.
Protection Functions1)
Initial peak short circuit current limit (pin 5 to 3) I L(SCp) A
Tj = -40 °C, Vbb = 20 V, tm = 150 µs - - 9
Tj = 25 °C - 6.5 -
Tj = 150 °C 4 - -
Tj = -40...+150 °C, Vbb > 40 V , ( see page 12 ) - 5 2) -
Repetitive short circuit current limit I L(SCr)
Tj = Tjt (see timing diagrams)
Vbb < 40 V - 6 -
Vbb > 40 V - 4.5 -
Output clamp (inductive load switch off) VON(CL) 59 63 - V
at VOUT = Vbb - VON(CL),
Ibb = 4 mA
Overvoltage protection 3) Vbb(AZ) 62 - -
Ibb = 4 mA
Thermal overload trip temperature T jt 150 - - °C
Thermal hysteresis ∆Tjt - 10 - K

Reverse Battery
Reverse battery 4) -Vbb - - 52 V
Drain-source diode voltage (VOUT > Vbb) -VON - 600 - mV
Tj = 150 °C

1Integrated protection functions are designed to prevent IC destruction under fault conditions
described in the data sheet. Fault conditions are considered as "outside" normal operating range.
Protection functions are not designed for continuous repetitive operation .
2not subject to production test, specified by design
3 see also VON(CL) in circuit diagram on page 8
4Requires a 150 Ω resistor in GND connection. The reverse load current through the intrinsic drain-source diode has
to be limited by the connected load. Power dissipation is higher compared to normal operating conditions due to the
voltage drop across the drain-source diode. The temperature protection is not active during reverse current operation!
Input current has to be limited (see max. ratings page 3).

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 BSP 752 R

Electrical Characteristics
Parameter Symbol Values Unit
at Tj = -40...+150°C, Vbb = 12..42V, unless otherwise specified min. typ. max.
Input and Status feedback
Input turn-on threshold voltage VIN(T+) - - 2.2 V
Input turn-off threshold voltage VIN(T-) 0.8 - -
Input threshold hysteresis ∆V IN(T) - 0.4 -
Off state input current I IN(off) 1 - 25 µA
VIN = 0.7 V
On state input current I IN(on) 3 - 25
VIN = 5 V
Status output (open drain), Zener limit voltage VST(high) 5.4 6.1 - V
IST = 1.6 mA
Status output (open drain), ST low voltage VST(low)
Tj = -40...+25 °C, IST = 1.6 mA - - 0.4
Tj = 150 °C, IST = 1.6 mA - - 0.6
Status invalid after positive input slope 1) t d(ST+) - 120 160 µs
Vbb = 20 V
Status invalid after negative input slope 1) t d(ST-) - 250 400
Input resistance (see page 8) RI 2 3.5 5 kΩ

Diagnostic Characteristics
Short circuit detection voltage VOUT(SC) - 2.8 - V
Open load detection voltage 2) VOUT(OL) - 3 4
Internal output pull down3) RO kΩ
( see page 9 and 14 )
VOUT(OL) = 4 V - 200 -

1no delay time after overtemperature switch off and short circuit in on-state
2External pull up resistor required for open load detection in off state.
3not subject to production test, specified by design

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 BSP 752 R

Input Output Status

level level
Normal L L H
operation H H H
Short circuit L L H
to GND H L* L
Short circuit to L H L
Vbb (in off-state) H H H
Overload L L H
H H ** H
Overtemperature L L H
H L L
Open Load in L Z H (L 1))
off-state H H H

*) Out ="L": VOUT < 2.8V typ.

**) Out ="H": V OUT > 2.8V typ.
Z = high impedance, potential depends on external circuit

1with external resistor between V and OUT

bb

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 BSP 752 R

Terms Inductive and overvoltage output clamp

Ibb + V bb

V
I IN Z
Vbb
IN V
ON
IL VON
PROFET OUT
I ST
OUT
ST
GND
V V ST GND
IN
V I
bb GND V OUT
R
GND
VON clamped to 59V min.

Input circuit (ESD protection) Overvoltage protection of logic part

R
I
IN

ESD- ZD I
I
I

GND

The use of ESD zener diodes as voltage clamp

at DC conditions is not recommended

Reverse battery protection

VZ1 =6.1V typ., VZ2 =Vbb(AZ) =62V min.,
± 5V - V bb
RI=3.5 kΩ typ., RGND=150Ω
R ST Logic Status output
RI
IN
ST OUT +5V
Power
Inverse
Diode

GND RST(ON)
R GND RL
ST
Signal GND Power GND

RGND=150Ω, RI=3.5kΩ typ.,

ESD-
Temperature protection is not active during ZD
inverse current GND

Page 8 2004-01-27
 BSP 752 R

Open-load detection Vbb disconnect with charged inductive

OFF-state diagnostic condition:
V OUT > 3V typ.; IN=low load

R
EXT high Vbb
IN
OFF
PROFET OUT
V
OUT
ST
Open load
GND
Logic R
O
unit detection

V
Signal GN D bb

GND disconnect

Inductive Load switch-off energy

Vbb
dissipation
IN
E bb
PROFET OUT
E AS
ST
E Load
GND
Vbb
V V V IN
bb IN ST V
GND
PROFET OUT
= L
ST

{
EL
GND
ZL
GND disconnect with GND pull up
ER
R
L

Vbb
IN Energy stored in load inductance: EL = ½ * L * IL2

PROFET OUT While demagnetizing load inductance,

the enérgy dissipated in PROFET is
ST EAS = Ebb + EL - ER = VON(CL) * iL(t) dt,
GND
with an approximate solution for RL > 0Ω:

V V V
V IN ST GND
bb IL * L IL * R L
E AS = * ( V b b + | V O U T ( C L )| ) * ln (1 + )
2 * RL | V O U T ( C L )|

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 BSP 752 R

Typ. transient thermal impedance Typ. transient thermal impedance

ZthJA=f(tp) @ 6cm 2 heatsink area Z thJA=f(tp) @ min. footprint
Parameter: D=tp/T Parameter: D=tp/T
2
10 10 2
D=0.5 D=0.5
K/W K/W
D=0.2 D=0.2

D=0.1 D=0.1
10 1 10 1
D=0.05 D=0.05

Z thJA
ZthJA

D=0.02 D=0.02

D=0.01
10 0 10 0
D=0.01

D=0
10 -1 10 -1
D=0

10 -2 -7 -6 -5 -4 -3 -2 -1 0 1 2 4 10 -2 -7 -6 -5 -4 -3 -2 -1 0 1 2 4
10 10 10 10 10 10 10 10 10 10 s 10 10 10 10 10 10 10 10 10 10 10 s 10
tp tp

Typ. on-state resistance Typ. on-state resistance

RON = f(Tj) ; Vbb = 13,5V ; Vin = high RON = f(V bb); IL = 1 A ; Vin = high

300 400

mΩ
mΩ

300 150°C
RON

RON

200
250

150 200

25°C
150
100
-40°C
100

50
50

0 0
-40 -20 0 20 40 60 80 100 120 °C 160 0 5 10 15 20 25 30 35 40 V 50
Tj Vbb

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 BSP 752 R

Typ. turn on time Typ. turn off time

ton = f(Tj ); RL = 47Ω toff = f(Tj); RL = 47Ω

160 160

µs µs

9V
120 120

13.5V

toff
t on

100 100
9...42V

80 80
42V

60 60

40 40

20 20

0 0
-40 -20 0 20 40 60 80 100 120 °C 160 -40 -20 0 20 40 60 80 100 120 °C 160

Tj Tj

Typ. slew rate on Typ. slew rate off

dV/dton = f(T j) ; RL = 47 Ω dV/dtoff = f(Tj); R L = 47 Ω

2 3.5
V/µs
V/µs
1.6
dton

dtoff
-dV

2.5
dV

1.4

1.2
2

1
42V
1.5
0.8
42V
0.6 1
13.5V
0.4
9V 13.5V
0.5
0.2 9V

0 0
-40 -20 0 20 40 60 80 100 120 °C 160 -40 -20 0 20 40 60 80 100 120 °C 160
Tj Tj

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 BSP 752 R

Typ. standby current Typ. leakage current

Ibb(off) = f(Tj ) ; Vbb = 42V ; VIN = low I L(off) = f(Tj) ; Vbb = 42V ; VIN = low

10 2.5

µA µA
I bb(off)

I L(off)
6 1.5

4 1

2 0.5

0 0
-40 -20 0 20 40 60 80 100 120 °C 160 -40 -20 0 20 40 60 80 100 120 °C 160
Tj Tj

Typ. initial peak short circuit current limit Typ. initial short circuit shutdown time
IL(SCp) = f(Vbb) toff(SC) = f(Tj,start) ; Vbb = 20V

10 4

ms
A
-40°C
3
toff(SC)
IL(SCp)

25°C
2.5
6 150°C

4
1.5

1
2

0.5

0 0
0 10 20 30 40 V 60 -40 -20 0 20 40 60 80 100 120 °C 160
Vbb Tj

Page 12 2004-01-27
 BSP 752 R

Typ. input current Typ. input current

IIN(on/off) = f(Tj); Vbb = 13,5V; VIN = low/high I IN = f(VIN); V bb = 13.5V
VINlow ≤ 0,7V; VINhigh = 5V
12 50

µA
µA
-40...25°C 150°C

8
IIN

IIN
30
on

off 20
4

10
2

0 0
-40 -20 0 20 40 60 80 100 120 °C 160 0 1 2 3 4 5 6 V 8
Tj VIN
Typ. input threshold voltage Typ. input threshold voltage
VIN(th) = f(Tj ) ; Vbb = 13,5V VIN(th) = f(V bb) ; Tj = 25°C

2 2
V V
on on

1.6 1.6

off
V IN(th)

1.4
VIN(th)

1.4

1.2 off
1.2

1 1

0.8 0.8

0.6 0.6

0.4 0.4

0.2 0.2

0 0
-40 -20 0 20 40 60 80 100 120 °C 160 0 10 20 30 50
V
Tj Vbb

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 BSP 752 R

Maximum allowable load inductance Typ. status delay time

for a single switch off td(ST) = f(V bb); T j = 25°C
L = f(IL); Tjstart =150°C, RL=0Ω
2000 300
mH µs
td(ST-)
250
1600
225

t d(ST+/-)
1400
200
1200
L

175

1000 150
td(ST+)
800 125

100
600
75
400 42V 13,5V
50
200
25

0 0
0 0.25 0.5 0.75 1 A 1.5 0 10 20 30 V 50
IL Vbb

Maximum allowable inductive switch-off Typ. internal output pull down

energy, single pulse RO = f(Vbb)
EAS = f(IL ); Tjstart = 150°C, Vbb = 13,5V
1800 800

mJ
kΩ

1400
600 150°C

1200
EAS

RO

500
1000
400
800

300
600 25°C

200
400 -40°C

200 100

0 0
0 0.25 0.5 0.75 1 A 1.5 0 10 20 30 V 50
IL Vbb

Page 14 2004-01-27
 BSP 752 R

Timing diagrams

Figure 1a: Vbb turn on: Figure 2b: Switching a lamp,

IN IN

Vbb
ST

I V
L OUT

ST IL
t

Figure 2a: Switching a resistive load, Figure 2c: Switching an inductive load
turn-on/off time and slew rate definition

IN
IN

V OUT

ST
90%
t on dV/ dtoff

dV/ dton t
off
VOUT
10%

IL

t
IL
ST

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 BSP 752 R

Figure 3a: Turn on into short circuit, Figure 3b: Short circuit in on-state
shut down by overtemperature, restart by cooling shut down by overtemperature, restart by cooling
IN
IN

V OUT V OUT

Output short to GND n o rm a l

O u tp u t s h o r t to G N D
o p e r a t io n

IL I
L( SCp )
I I
L( SCr ) L
I
L (S C r)

tm
ST
ST
t

t t
d(ST+)

Heating up of the chip may require several milliseconds, depending

on external conditions. Figure 5: Undervoltage restart of charge pump

Figure 4: Overtemperature: Vo n
Reset if Tj < Tjt

IN

ST V b b( u c p )
Vbb( under )
IL

Vbb

TJ

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 BSP 752 R

Package and ordering code

all dimensions in mm

Package: Ordering code:

P-DSO-8-6 Q67060-S7306

Printed circuit board (FR4, 1.5mm thick, one

layer 70µm, 6cm2 active heatsink area ) as
a reference for max. power dissipation Ptot
Published by nominal load current IL(nom) and thermal
Infineon Technologies AG, resistance R thja
St.-Martin-Strasse 53,
D-81669 München
© Infineon Technologies AG 2001
All Rights Reserved.

Attention please!
The information herein is given to describe certain components and shall not be considered as a guarantee
of characteristics.

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We hereby disclaim any and all warranties, including but not limited to warranties of non-infringement,
regarding circuits, descriptions and charts stated herein.

Infineon Technologies is an approved CECC manufacturer.

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For further information on technology, delivery terms and conditions and prices please contact your
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(see address list).

Warnings
Due to technical requirements components may contain dangerous substances. For information on the
types in question please contact your nearest Infineon Technologies Office.

Infineon Technologies Components may only be used in life-support devices or systems with the express
written approval of Infineon Technologies, if a failure of such components can reasonably be expected to
cause the failure of that life-support device or system, or to affect the safety or effectiveness of that device
or system. Life support devices or systems are intended to be implanted in the human body, or to support
and/or maintain and sustain and/or protect human life. If they fail, it is reasonable to assume that the health
of the user or other persons may be endangered.

Page 17 2004-01-27
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