JAIGANESH A/L MURUGAN 15DKM12F2001

FINAL REPORT OF PRACTICAL

TRAINING

NAME : JAIGANESH A/L MURUGAN

MATRIX NO : 15DKM12F2001

DEPARTMENT : MECHANICAL ENGINEERING DEPARTMENT

PROGRAMME : DIPLOMA IN MECHANICAL ENGINEERING

TRAINING PERIOD : 23 JUN 2014 7 NOV 2014

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JAIGANESH A/L MURUGAN 15DKM12F2001

Approved by

NAME : FIDEL BORROMEO MARTIRES

DEPARTMENT: LEADLESS DEPARTMENT ( PM FOL 3 GROUP)

SIGNATURE :

..

DATE APPROVED: 6 NOVEMBER 2014

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JAIGANESH A/L MURUGAN 15DKM12F2001

ACKNOWLEDGMENT

(PENGHARGAAN)

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JAIGANESH A/L MURUGAN 15DKM12F2001

Acknowledgements,

First of all, I would like to thank Unisem (M) bhd for accepting upon my request to
join the company for practical training purpose and now successfully ended my
training with a good remarks. As a practical trainee , I really do appreaciate that I
was given the opportunity to work as a industrial trainee. It is the first step for me to
enter into real life working environment and I have learned on how to manage myself
during working hours. The working atmosphere in a company is totally different
from studying and its good for me to go through this lifestyle.

Thank you very much to Mr Yc Liew the supervisor of PM at F.O.L 3 for accepting
me as his trainee and giving the oppurtunity to train in the Front of Line 3
Department ( F.O.L 3 ). Its a wonderful experience for me to work in a
semiconductor company since all the high technology machines such as
esec,datacon,dieattach,sawing and many more are here whereby its a luck for me to
go through all this. There, I share my knowledge, learn new things, gain a lot of
knowledge and experience the fascinating world of work. I wish to thank my
engineer Mr.Fidel who is also another guidness for me and advising me throughout
my training session.

Besides that, not forgetten I want to thank Miss Suguna (PM), Mr Gautham(PM),
Mr Tanesh(PM), who are the one who are always there beside me ,guiding me all the
way to teach me and make myself feel comfortable and confident to carry out my
working process. Without forgetten, I would like to thank the technician and
operators too for me giving me the cooperation and even answer to my questions
without hesitating themselves.

Finally, I wish to express my deepest gratitude and appericiation to the people who

involed directly and indirectly for their support, care and contribution to the success

of my Industrial Training Session and also for my Final Report.

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JAIGANESH A/L MURUGAN 15DKM12F2001

CONTENT PAGE

Acknowledgement 3-4

Content 5-6

Chapter 1- Introduction 7-8

- Objective of Practical Training 9

Chapter 2- Company Background 10-11

- Products from Unisem(M) 12

- Vision and Mission 13

- Location of Unisem 14

- Board of directors & Management Team 15-16

- Corporate Governance 17

- Management division 18-20

- Organisational Chart 21

- Package Offering 22-24

- Unisem Ipoh 25

- Quality Policy 26-27

- Reliability Monitoring 28

- Career Opportunities 29

- 5S Concept 30-33

- Core values 33-34

- History of Unisem 35-38

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JAIGANESH A/L MURUGAN 15DKM12F2001

Chapter 3 Weekly Summary 39

- About Practical Training 40

- Practical Training Schedule 41

- Weekly summary 42-52

Chapter 4- Technical Report 53

- Overview of preventive maintenance process 54-56

- Process flow fron of line & End of line 57-60

- Grinding Machine ( Backgrinder machine) 61

- Tapping machine 62

- Second optical inspection 63

- Die attach process 64-65

- Epoxy oven 66

- Wirebond process 67-71

- Flip chip ( advantages and disadvantages) 72-73

- Third optical inspection 74-75

- Safety Precaution ( ESD basic information) 76-79

Chapter 5- Recommendation 80-81

Chapter 6- Conclusion 82-83

Appendix 84-92

Reference 93-94

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JAIGANESH A/L MURUGAN 15DKM12F2001

CHAPTER 1: ( INTRODUCTION) PENGENALAN

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JAIGANESH A/L MURUGAN 15DKM12F2001

Introduction to Industrial Training

Industry training is one of the conditions required for the Polytechnic

student to obtain a certificate / diploma in any of the Diploma level, training is for 6
months.

After the practical training for about 6 months, the students are required to
prepare a full report on industrial training exercises were conducted. The report will
be examined by the lecturer and will be given an overall score of the evaluation and
training throughout the industry. Points will be assessed and taken into account in the
final examination period. The report will also be useful to students - students upon
graduation at the Institute Evertronics (ESDC), it can be used as a reference by
prospective employers.

In addition students will be able to increase their knowledge and practical

experience of this and this could be a starting point for students to experience the
atmosphere of a real job.

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JAIGANESH A/L MURUGAN 15DKM12F2001

Objective of Practical Training

Industry training is a great opportunity where students can achieve and gain more
knowledge and creative thinking from their experience which they receive
throughout their practical training session. With a duration of 22 weeks is a perfect
and comfortable period to carry out training and students can experienced themselves
more to work given. This report presents a summary of the experience gained
throughout this 22 weeks internship at Unisem (M) Sdn Bhd company .

This report contains a section that contains the economic background of the
company, its vision, mission, quality policy, quality objectives and the organizational
structure.

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JAIGANESH A/L MURUGAN 15DKM12F2001

CHAPTER 2 : COMPANY BACKGROUND

( LATAR BELAKANG)

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JAIGANESH A/L MURUGAN 15DKM12F2001

Company background

UNISEM (M) Bhd was established in 1989 and commenced operations in 1992 as a
sub-contract free of integrated circuit (IC) packaging and testing facilities, and it is
known as a leading semiconductor packaging and test in Ipoh, Malaysia. Unisem is a
global provider of semiconductor assembly and test services for many of the worlds
most successful electronics companies. Unisem offers an integrated suite of
packaging and test services such as wafer bumping, wafer probing, wafer grinding, a
wide range of leadframe and substrate IC packaging, wafer level CSP and RF,
analog, digital and mixed-signal test services. Our turnkey services include design,
assembly, test, failure analysis, and electrical and thermal characterization. With
approximately 7,000 employees worldwide, Unisem has factory locations in Ipoh,
Malaysia; Chengdu, Peoples Republic of China; Batam, Indonesia, and Sunnyvale,
USA. The company is headquartered in Kuala Lumpur, Malaysia.

Unisem Ipoh is certified with various Quality Management Systems and

Environmental Management Systems such as ISO 9001:2008, ISO/TS 16949:2009,
ISO 14001:2004, ANSI/ESD S20.20-2007 and is a certified Sony Green Partner.

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JAIGANESH A/L MURUGAN 15DKM12F2001

Products from Unisem (M)

Unisem designs and creates both Array and Leadframe packages for the global IC
market. Our turn-key services include Electrical and Thermal Characterization,
Design, Assembly, Testing, Failure Analysis and more. And with our real-time WIP
systems and drop shipping to OEM's, Unisem offers its customers everything needed
for time-to-market wins.

Unisem offers a broad range of standard and custom leadframe and array packages
with pin counts ranging from 3 to 700+. Also offered are WLCSPs or Wafer-Level
Chip-Scale Packages which is a low cost solution that enables direct connectivity at
the substrate or board level.

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JAIGANESH A/L MURUGAN 15DKM12F2001

Vision and Mission of Unisem (M)

Vision

To be a leading global multinational company providing comprehensive turnkey

assembly and test services for the evolving needs of our customers, and a model
corporate citizen in the communities in which we operate.

Mission

In order to achieve our vision, we are committed to:

Provide total customer satisfaction.
Be a caring company and employer of choice.
Generate profits and accelerate growth.
Develop long term win-win partnership with our business associates.
Adhere to good corporate governance and support environmental, social and
economical development of the community.
Uphold and live our core values.

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JAIGANESH A/L MURUGAN 15DKM12F2001

Location

No. 1, Persiaran Pulai Jaya 9

Kawasan Perindustrian Pulai Jaya
31300 Ipoh, Perak Darul Ridzuan
Malaysia
Phone: 605-357-2800
Fax: 605-357-2600

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JAIGANESH A/L MURUGAN 15DKM12F2001

BOARD OF DIRECTORS

FROM LEFT TO RIGHT: PROF TAN SRI DATO 'DR MOHD.

RASHDAN BIN HAJI BABA, SUNDRA MOORTHI S / O V.M.
KRISHNASAMY, FRANCIS CHIA MONG TET, ANG CHYE HOCK,
JOHN CHIA SIN TET, TAN SRI DATO 'WONG SEE WAH, MARTIN
GILES MANEN, YEN WOON @ LOW SAU CHEE, TEE YEE LOH

JOHN CHIA SIN TET, Chairman/Group Managing Director, Malaysian

Mr John Chia Sin Tet, born in 1949, was appointed Chairman of the Company on 13
June 1991, Managing Director
on 11 March 1998 and the Group Managing Director on 1 November 2007. He is
also the Chairman of the Executive Committee and Remuneration Committee.
Mr John Chia Sin Tet is a Barrister at Law and a Member of the Lincolns Inn,
United Kingdom.
Mr John Chia Sin Tet is a brother to Mr Francis Chia Mong Tet.

LEE HOONG LEONG, Executive Director, Malaysian

FRANCIS CHIA MONG TET, Executive Director, Malaysian

ALEXANDER CHIA JHET-WERN, Executive Director, MalaysianMARTIN

GILES MANEN, Independent Director, Malaysian

TAN SRI DATO WONG SEE WAH, Independent Director, Malaysian

DATO GREGORY WONG GUANG SENG, Independent Director, Malaysian

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JAIGANESH A/L MURUGAN 15DKM12F2001

MANAGEMENT TEAM

SENIOR MANAGEMENT

HOONG LEONG LEE, Group Chief Operating Officer

Mr Lee Hoong Leong is the Executive Director and Group Chief Operating Officer
of the Group. He was appointed to the board on 9 August 2012.

Mr Lee brings more than 30 years of experience in the semiconductor packaging and
test business. Prior to joining Unisem, Mr Lee was the President of UTAC,
Advanced Wafer Level Interconnects. During his years with UTAC between2001 to
2011, he held various positions as Vice President, Quality and Research &
Development, Vice President of UTAC Operations, and President of UTAC
Singapore operations and President of UTAC Shanghai operations concurrently.

Mr Lee began his career at Texas Instruments, Singapore in 1980 as an automation

engineer. He held various managerial and engineering positions in Texas Instruments
Singapore between 1980 to 1986. Mr Lee subsequently joined National
Semiconductor, Singapore in 1986 and held various positions in research &
development, purchasing & logisitcs and finally as operations manager.

Mr Lee holds a Bachelor's degree in mechanical engineering from the University of

Singapore

TAN KIM HENG, Senior Vice President, Corporate Technology and

Materials
THAM ENG HUAK, Vice President of Group Finance
HO CHOON SENG, Senior Vice President, Chief Operating Officer
Unisem Ipoh, Malaysia
QUEK SUAN HONG, Chief Operating Officer Unisem Chengdu, China
ALLAN C. TORIAGA , Chief Operating Officer PT Unisem - Batam,
Indonesia
LAU SIONG CHO , General Manager - Unisem Advanced Technologies
(UAT), Malaysia
MARITA ERICKSON , General Manager - Unisem Sunnyvale Test, USA

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JAIGANESH A/L MURUGAN 15DKM12F2001

CORPORATE GOVERNANCE

The Board of Directors supports the objectives of the Malaysian Code on Corporate
Governance ("the Code") and also acknowledges its role in protecting and enhancing
shareholders' value. The Directors believe that good corporate governance results in
quantifiable long-term success and creation of long-term shareholders' value as well
as benefits for all other stakeholders. Hence, the Board affirms its policy of adhering
to the spirit of the Code.
At Unisem, the Board maintains, and ensures that Unisem management maintains,
the highest level of corporate ethics. As such, the various charters and policies
located under this Corporate Governance section will be reviewed, and where
necessary, updated, on a regular basis.

Corporate Governance Statement 2013

Board of Directors
Board Charter
Board Committees
Unisem Group Code of Conduct
Strategies on Sustainability Development
Ethics Hotline

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JAIGANESH A/L MURUGAN 15DKM12F2001

Management Division

Top Managment

Part of this is to monitor all the travel companies that Unisem administration runs
smoothly.

Marketing Department

The department is responsible for identifying new business development and

maintaining a business including matters relating to the price, the contract in the
future, production and review of the product.

R & QA Department

'Realibility and Assurance Deparment' is a department that is responsible for the

balance period of the quality of the audit system to audit the quality system and the
results are displayed as well as the correction of an error for review. It has been
entrusted with the responsibility and authority to manage the company through the
quality of the program, implementation schedule, the services provided and the
product. It is also the representative of the management company to ensure that the
quality system is implemented and maintained.

Engineering Department

Responsible for providing improvements and implementation of all products and

engineering processes including all engineering equipment and machine
maintenance.

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JAIGANESH A/L MURUGAN 15DKM12F2001

Production Depatment

Ensuring and monitoring products according to customer requirements as well as

arranging and organizing the raw materials to produce the quantity of product
production, costs and performance of the company over time.

Finance Department

The department is responsible for storing information, company accounts,

forecasting budgets, taxes, insurance, fund management, pricing, credit control and
payments to vendors.

Human Resourse Department

An integral part of human resource management is responsible for compliance with

administrative / personnel in accordance with government policy.

Material Department

Produce goods and services related to raw materials, directly or indirectly.

Facility Department

Provide facilities and equipment allocation factory maintenance.

Production Control Department

Planning schedules and provide delivery schedules.

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JAIGANESH A/L MURUGAN 15DKM12F2001

Final Test Department

The department of electrical inspection and control all production processes after
the Final Test to meet customer needs. Final Test Manager oversees the production,
maintenance and engineering operational functions Final Test.

Incoming Material Department

Incoming materials tested before use. Materials such as molding compound,

aluminum or copper lead frame and wafer treated as incoming materials.

R & QA Lab

Laboratory is divided into two parts they Reliability, Failure analysis and thermal
analysis and calibration, ESD and Environmental Control. The Reliability, Failure
analysis and thermal analysis section responsible for quality control of products
produced in UNISEM. Calibration, ESD and Environmental Control section is
responsible for the calibration of equipment at UNISEM

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JAIGANESH A/L MURUGAN 15DKM12F2001

Organisational Chart of PM

FF LEE

( SECTION MANAGER)

FIDEL BORROMEO
MARTIRES

YC LIEW

PM TECHNICIAN

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 JAIGANESH A/L MURUGAN 15DKM12F2001

PACKAGE OFFERING

One of the Semiconductor Process (Die Attach)

ARRAY PACKAGES

Unisem has vast experience with BGA assembly and manufacturing. In fact, we've
developed several in-house manufacturing capabilities that give us the flexibility
needed to for quick design and manufacture of Array products. So any manufacturing
hurdles are quickly cleared, and any specialized needs are soundly addressed by our
competent design and manufacturing crew.
List of packages that are offered at Unisem Sdn Bhd..-

PBGA
FBGA / LGA
MCM / SIP
Stacked Die BGA
SBGA

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JAIGANESH A/L MURUGAN 15DKM12F2001

LEADFRAME PACKAGES

Unisem's leadframe package assembly and manufacturing systems provide for lower
costs and higher yields of the industry's most sought-after packages. Our process
innovations in these proven technologies keep us at the forefront of the industry.

LEADLESS PACKAGES

The small size of these packages, coupled with excellent thermal and electrical
performance, make leadless leadframe packages such as the QFN and ELP ideal for
hand held and portable communications applications including cellular phones,
personal digital assistants (PDAs) and other applications where small, high
performance packages are required. This package is also available in 2 and 3 Die
configurations in Stacked Die, MCM and SIP (System-In-Package) versions which
bring enhanced functionality, package performance and integration perfectly suited
for wireless and other applications needing system integration in a single package
format.

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WAFER LEVEL PACKAGING

Unisem offers a Wafer Level CSP low cost solution that enables direct connectivity
at the substrate or board level. To help provide this service we are equipped with
latest state-of-the art Laser Mark , Laser Groove, Camtek & Rudolph Wafer 2D/3D
inspection station and high speed Muhlbauer Die Sorter. We offered a full turnkey
solution for Wafer Level CSP from WAFER BUMPING, PACKAGING , TEST SOLUTION
(probing) and full wafer map integration to handle die size from 0.2 mm 2 to 36
mm2.

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JAIGANESH A/L MURUGAN 15DKM12F2001

UNISEM IPOH

Unisem Ipoh is Unisem Groups full turnkey assembly and test operations located in
Malaysia. Unisem Ipoh offers an integrated suite of packaging and test services for
semiconductor companies such as wafer bump, wafer probe, wafer grinding, a wide
range of leadframe and substrate IC packaging, high-end radio frequency and mix-
signal test, tape & reel and drop-shipment services.
Unisem Ipoh is certified with various Quality Management Systems and
Environmental Management Systems such as ISO 9001:2008, ISO/TS 16949:2009,
ISO 14001:2004, ANSI/ESD S20.20-2007 and is a certified Sony Green Partner.

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JAIGANESH A/L MURUGAN 15DKM12F2001

QUALITY POLICY

The Company's Quality Policy is to:

produce products and provide services of the highest quality as perceived by
each and every customer
commit to on-time delivery and to be the most cost effective
This is achieved through a precisely designed and well defined system of
manufacturing excellence and concerted strength of people involvement. We are
committed to comply with requirements and continually improve the effectiveness of
the Quality Management System. The ultimate goal is TOTAL CUSTOMER
SATISFACTION.
Unisem's policy is approved and validated by the top management.
Together with a team of highly motivated and well trained employees, we shall serve
our customers with the highest standard of quality and a committed on-time delivery.

QUALITY ASSURANCE

In line with our Quality Policy, Reliability & Quality Assurance Organization is
structured to ensure that the established quality system is being implemented and
maintained, as well as to ensure services provided and finished products built per
customer's requirements.
From incoming materials to final test, packaging and shipping, quality is assured
along the manufacturing process through the usage of Quality Control Plan and
Statistical Process Control monitoring. The control plan covers the prototype build,
pre-production build and mass production to control all critical parameters and
special characters of the products along the manufacturing process.

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JAIGANESH A/L MURUGAN 15DKM12F2001

At Unisem, methods of verification for acceptance may include one or more of the
following:
Visual Inspection
Line Functional Test
Certificate of Conformance (C of C)
Certificate of Chemical / Spectrographic Analysis
Tests and/or Inspection Reports
Statistical Process Control (SPC) Data
Internal quality audits
Supplier Plant Manufacturing Process Audit

QUALITY SYSTEM MANAGEMENT

Unisem's management system is in compliance to the international and local

standards on Quality Management Systems and Environmental Management
Systems which are vital to our business globally. Each of Unisem sites is proud to
have achieved the third party certification to these standards.
ISO9001:2008 certification
ISO/TS 16949:2009 certification
ISO 14001:2004 Environmental Management System
Sony Green Partner certification
Compliance to RoHS / REACH requirements under the EU Directive 2006/1907/EC and its
subsequent amendments as verified by SGS ICP Testing annually

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JAIGANESH A/L MURUGAN 15DKM12F2001

RELIABILITY MONITORING

Unisem has fully equipped package reliability qualification & product analysis labs at
each site to support our customers' requirements for new package qualification
testing, ongoing reliability monitoring and continuous yield improvement.
The quantitative and qualitative assessments of package reliability focus on the
identification and timely elimination of processing deficiencies that degrade
product performance in a real world application.
Each Unisem site has the capability to perform the standard Package Reliability
Qualification and Reliability Audit Program test requirements in accordance with
JESD47E standard specifications or specific customer requirements.

RELIABILITY AUDIT PROGRAM (RAP)

The reliability monitoring program is performed in each site to assure our on-going
improvement in our package reliability. Unisem's standard RAP tests reference
JESD47 and Automotive RAP tests reference AEC-Q100.

PACKAGE ANALYSIS LABS

The Package Analysis Labs in each of Unisem site are well equipped with state-of-art
equipment combined along with our technical expertise to provide a full breadth of
package level analysis and capabilities support:
New package development and package qualification
Material characterization
Assembly yield loss analysis and improvement
Reliability failure analysis and improvement
Test failure analysis and improvement
Reliability Audit Program

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JAIGANESH A/L MURUGAN 15DKM12F2001

CAREER OPPORTUNITIES

CAREER
With a string of successes in the semiconductor industry, currently UNISEM has
close to 7,000 employees who contribute to our company's continuous success.
They are the ones who develop ideas and innovation and ensure highest standard in
quality products, facilities and services - under a working environment which is
dynamic, conducive and team-oriented.

INDUSTRIAL RELATIONS
In line with our Company's motto: WE CARE, WE CAN, employees at UNISEM are
acknowledged as assets to the Company. In this regards, Employees Survey and
Management-Employees dialogues are platforms to foster continuous industrial
harmony in the Company.JOBS

For the new graduate, the Qualification Requirement Chart will assist you to
forward your application.
INDUSTRIAL TRAINEES
Every year, UNISEM takes on industrial trainees and provides them placement in
various functions such as Assembly, Product Testing, Quality Assurance,
Engineering, Maintenance, Finance, Management Information Systems and Human
Resources. In additional to earning some daily allowance, trainees are provided with
opportunity in associating their academic learning with on-the-job work
requirements. Please submit your resume to the following email
address:lywong@unisemgroup.com

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JAIGANESH A/L MURUGAN 15DKM12F2001

5S CONCEPT

5S is the name of a workplace organization method that uses a list of

five Japanese words: seiri, seiton, seiso, seiketsu, and shitsuke.Transliterated or
translated into English, they all start with the letter "S".[1] The list describes how to
organize a work space for efficiency and effectiveness by identifying and storing the
items used, maintaining the area and items, and sustaining the new order.[2] The
decision-making process usually comes from a dialogue about standardization, which
builds understanding among employees of how they should do the work.

here are five primary 5S phases: They can be translated from the Japanese as "sort",
"straighten", "shine", "standardize", and "sustain". Other translations are possible.

Seiri

Remove unnecessary items and dispose of them properly

Make work easier by eliminating obstacles
Reduce chance of being disturbed with unnecessary items
Prevent accumulation of unnecessary items
Evaluate necessary items with regard to cost or other factors.
Remove all parts not in use.

Seiton

Arrange all necessary items in order so they can be easily picked for use
Prevent loss and waste of time
Make it easy to find and pick up necessary items
Ensure first-come-first-served basis
Make workflow smooth and easy
Can also be translated as "set in order" or "streamline"

Seiso

Clean your workplace completely

Use cleaning as inspection
Prevent machinery and equipment deterioration
Keep workplace safe and easy to work

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JAIGANESH A/L MURUGAN 15DKM12F2001

Seiketsu

Maintain high standards of housekeeping and workplace organization at all

times
Maintain cleanliness and orderliness
Maintain everything in order and according to its standard.
Everything in its right place

Shitsuke

To keep in working order

Also translates as "do without being told", (though this doesn't begin with S).

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JAIGANESH A/L MURUGAN 15DKM12F2001

The Origins of 5S

5S was developed in Japan and was identified as one of the techniques that
enabled Just in Time manufacturing.

Two major frameworks for understanding and applying 5S to business

environments have arisen, one proposed by Osada, the other by Hirano. Hirano
provided a structure for improvement programs with a series of identifiable steps,
each building on its predecessor. As noted by John Bicheno,Toyota's adoption of the
Hirano approach was '4S', with Seiton and Seiso combined. However, Toyota now
uses the 5S as a standard.

Although the origins of the 5S methodology are in manufacturing, it can also be

applied to knowledge-economy work, with information, software, or media in the
place of physical product.

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JAIGANESH A/L MURUGAN 15DKM12F2001

CORE VALUES

Team Work

-we value our differences and synergize to fulfil company goals and the stakeholders
requirements

-we hold responbility and accountability for all the tasks assigned to us

-we think win-win

-we practice empathic communication between all parties

-we recognize that the foundation of a great team is mutual trust of team members

COMMITMENT

-we involve ourselves in decision making

- we have courages to make promises and keep them

- we are passionate and focused in what we do

TRUST

-we show high consistency between words and deeds in our dealing with peoples

-we are committed to conduct our business with a high standard of ethics and
integrity

-we trust our people and recognize their intrinsic desire to do a good job

-we treat each other with respect and dignity

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JAIGANESH A/L MURUGAN 15DKM12F2001

PROACTIVE

-we encourage creativity and innovation in our work

-we promote a learning culture so we can continuously upgrade our skills and
process capabilities to adapt to new challenges and oppurtunities

-we do not react to changes, we iniate changes

-we take calculated risk. We believe that it is far better to try and fail than not trying
at all.

CARING

-we practice a culture of safe, clean and green.

-we recognize our social obligations to our stakeholders and the society and we
contribute positively to our communities and environment.

-we practice 7 habits in a day

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JAIGANESH A/L MURUGAN 15DKM12F2001

HISTORY OF UNISEM

Sept 1991 Commenced construction of the Phase I

factory building.
Mar 1992 Completed construction of the Phase I
factory building with a built-up area of
about 130,000 square feet.
July 1992 Commenced mass production of
semiconductor packages with about 300
employees.
Mar 1993 Awarded MS ISO 9002 quality systems
certification for quality assurance in
production, installation and servicing.
June 1993 Launched the fine-pitch packaging
operations and commenced production of
the QSOP packages.
Jan 1994 Set up the tape and reel packing
operations.
Sept 1995 Expanded the final test area to 20,000
square feet.
Mar 1996 Commenced drop-ship services.
May 1996 Upgraded and expanded the molding
capability with an automated molding
system.
May 1996 Launched the fine-pitch / miniaturised
SSOP.
Aug 1996 Completed construction of the Phase II
factory building with an additional built-
up area of 110,000 square feet.
Feb 1997 Computerised the final visual inspection
operations with an automated inspection
system.
June 1997 Converted into a public limited company.

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JAIGANESH A/L MURUGAN 15DKM12F2001

July 1998 Listed on the Kuala Lumpur Stock

Exchange (now known as Bursa Malaysia
Securities Berhad) Main Board.
Oct 1999 Commenced construction of the Phase III
factory building.
May 2000 Attained the MS ISO 14001 certification
on environmental management systems.

Sept 2000 Completed construction of the Phase III

factory building with an additional built-
up area of about 330,000 square feet.
Mar 2001 Awarded QS 9000 and ISO 9002 quality
system certification for quality assurance
in production, installation and servicing.
June 2001 Commenced wafer probe services.
Jan 2002 Launched the small leadless packages
(SLP).
June 2002 Attained the International Procurement
Centre Licence for performing
dropshipments.
Jan 2003 Re-certification of MS ISO 14001 on
environmental management systems.
June 2003 Certificate of Green Partner from Sony,
an environmental management system
that has met the requirements of the Sony
Green Partner Program
Jan 2004 Established high end mixed signal test
capability by installing Teradyne Integra-
FLEX, with Octal-site testing
Mar 2004 Awarded ISO 9001:2000 quality systems
certification for quality assurance in
production, installation and servicing.

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JAIGANESH A/L MURUGAN 15DKM12F2001

May 2004 Expanded mixed signal capability by

adding Teradyne Catalyst.
June 2004 Re-certification of QS 9000 on quality
systems certification for quality
assurance in production, installation and
servicing.
June 2004 Acquired Atlantic Technology Holdings
(UK) Limited (now known as Unisem
(Europe) Holdings Limited).
Sept 2004 Incorporation of a joint-venture company,
Unisem Technologies Sdn Bhd (now
knowns as Unisem-Advanpack
Technologies Sdn Bhd) for packaging
and bumping of semiconductor devices.
Nov 2004 Commenced construction of the wafer
bumping factory building
Dec 2004 Incorporated Unisem Chengdu Co., Ltd.,
a semiconductor packaging and test
facility in Chengdu, Sichuan, PRC.
May 2005 Received Certificate of Green Partner
from Sony, an environmental
management system that has met the
requirements of the Sony Green Partner
Program.

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JAIGANESH A/L MURUGAN 15DKM12F2001

May 2005 Expanded radio frequency test capability

from single function building block to
highly integrated radio frequency device.
Using ASL3KRF as next generation test
platform.
July 2005 Completed construction of the wafer
bumping factory building and installation
of cleanroom
Nov 2005 Change of Corporate Logo.
Mar 2006 Commenced wafer bump services.
Apr 2006 Re-certification of MS ISO 14001 on
environmental management systems.
June 2006 Established wafer-level CSP test
capability.
Oct 2006 Unisem Chengdu opens its phase one
factory in Chengdu, Sichuan, PRC.
Jan 2007 Unisem (M) Berhad certified with
ISO/TS 16949:2002.
July 2007 Acquired Advanced Interconnect
Technologies Limited (now known as
Unisem (Mauritius) Holdings Limited).
June 2008 Unisem Advanced Technologies Sdn Bhd
("UAT") (formerly known as Unisem-
Advanpack Tehcnologies Sdn Bhd)
entered into a license agreement with
FlipChip International, LLC ("FCI"). FCI
became a shareholder of UAT.

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JAIGANESH A/L MURUGAN 15DKM12F2001

CHAPTER 3 WEEKLY SUMMARY ( RINGKASAN

MINGGUAN)

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JAIGANESH A/L MURUGAN 15DKM12F2001

Practical training which I have performed throughout this 6 months really brought
me very much experience such as learn new things,new atmosphere and etc. There
are 3 phases for Front Of Line in Unisem , (F.O.L) 1, F.O.L 2 and F.O.L 3. I was
working in Phase 3 troughout my practical session. Besides that, there are 2 different
department involve inside a LINE which is the LINETECH and PREVENTIVE
MAINTANENCE (PM) . Since my field is more into mechanical I was given to
work under the Preventive Maintanence .

Preventive maintenance (PM) has the following meanings:

1. The care and servicing by personnel for the purpose of maintaining

equipment and facilities in satisfactory operating condition by providing for
systematic inspection,detection, and correction of incipient failures either
before they occur or before they develop into major defects.
2. Maintenance, including tests, measurements, adjustments, and parts
replacement, performed specifically to prevent faults from occurring.

I would proudly say that I have tried my level best to learn out about all the machines
inside the LINE such as ( ESEC wire bond, Plasma machine, Die Attach and also
Wafer Level). As a trainee I managed myself to come through the same situation
with the senior technicians so that I can learn out things more clearly and
specifically. Works that I will be doing inside the Line is to carry out the PM
Services for wirebond machines ( adjustment and etc for the machine), help the
senior technicians to solve the major down problem and many more.

Every student undergoing Industrial Training (IT) will be responsible for filing and
recording all activities performed in the daily report book has been prepared by the
Polytechnic. Each weekly report and daily report will be submitted to our supervisor
to give their opinion and to refer the work we have done throughout the practical
session.

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JAIGANESH A/L MURUGAN 15DKM12F2001

Practical Training Schedule

My training inside the Line is based on ( NORMAL SHIFT). Working hours for a
day is from 8.00 am until 5.45pm (Monday to Friday)

Here is the schedule of working hours, which are conducted Monday to Thursday: -

8.00 am 9.30 am: Training / Work

9.30 am - 10.00 am: Breakfast

10.00 am - 12.30 t / day: Training / Work

12:30 t / day - 2.00 pm: Lunch

2:00 pm - 5:45 pm: Training / Work

5:45 pm Back

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JAIGANESH A/L MURUGAN 15DKM12F2001

Weekly Summary

First week ( 23 Jun 2014 27 Jun 2014) -Get to know with the company
employees
-Get to know with the departments like
FOL 3, QC, FG STORE, RECEIVING
DEPARTMENT, HR, END OF LINE,
AND WAFER LEVEL & ETC
-Identify the regulations set by the
company and supervisor
On the first day of practical, they started
their briefing about the company
background, products and etc. Each
trainee were given a supervisor.(YC
LIEW). Procedures that should be
followed by each and every workers
inside the production Line is they should
wear their jumpsuit and facemask. For
attendance purpose, Unisem uses scanning
system which will be directly email to our
manager .
-Supervisor brought us to visit UNISEM
and thought us about the procedures on
how to behave inside the production line.
-Identifying machines that are used in
each department ( for example: ESEC
WIRE BOND KNS,DATACON,DIE
ATTACH ,FLIP CHIP MACHINE AND
ETC)

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JAIGANESH A/L MURUGAN 15DKM12F2001

2nd week ( 30 Jun 2014- 3 July 2014) -Learned basic information about the esec
wire bond machine ( carry out preventive
maintanence service when the machine
reaches its due date .PM service will be
done every 6 months once )
-Air pressure setting for the bondhead
and indexer.
-Fixing a monitor for the machine.
-Callibration which is done to establish
the adjustment of the machine.

3rd week ( 6 July 2014 10 July 2014) -Fixing Monitor ( Monitor is on of the
important part in the machine because
each and every parts which are controlled
through the power supply will be seen
through the monitor) ( Each bonding
process or work error will be shown in
the monitor)
-House keeping the PM room due to ISO
audit .
-Fixing up the new plug socket for the
power supply.
-Able to do preventice maintanence due
on my own.
- Learn how to change and fix back the
monitor on esec wire bond machine.
-To keep our PM room in a proper and
well managed way ( house keeping)

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JAIGANESH A/L MURUGAN 15DKM12F2001

4th week (14 july 2014 18 July 2014) -Replace Multiparts ( Replace Stepper
motor which allows the window clamp
top move)
-Preventive Maintanence Due ( Make
sure that the machine is perfectly cleaned
and replace with new membrane . Parts
that are not able to function should be
changed and each and every PM service
there is a checklist should be submitted to
the manager. Each checklist will be
submitted and once PM is done for the
machine, machines will be completed
under MMS and new sticker will be
changed ) (PM DUE procedure)
-Learned how to use gas soledering iron
and manage to solder the EFO wire in
proper manner.

5th week ( 22 July 2014- 26 July 2014) -Change push in assembly

-Install software on esec wire bond
machine.
- Repair and Replace the wire assembly
- Installing the PCB board on the
peripheral electronic rack.
- Able to change the machine parts such
as push in assembly by following the
proper method.
-Fixing the board on the peripheral
electronic rack according to its name and
also fix its wiring parts systematically.

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JAIGANESH A/L MURUGAN 15DKM12F2001

6th week ( 28 & 29 July 2014) Public -Receive machine parts from the
Holiday for Hari Raya. receiving department ( Get to know the
(30 July 2014 1 August 2014) procedures before sending the machine
parts to FG store and to receive repaired
parts from the receiving department
according to its procedures)
- Wrap the power supply with the bubble
pack and put it into the box before it is
send for repair at the FG store.
-Solder EFO wire using gas soldering
iron

7th week ( 4 August 2014 8 August -Preventive Maintanence due for esec
2014) wire bond machine
-House keeping in PM bay due to Internal
Audit.
- Scan ESEC wire bond checklist ( Each
and every checklist of the machine should
be scan once PM Service and attached to
the MMS . Checklist should be completed
before it is send to the supervisor for
signature.Checklist are attached for
update purpose and according to the
machine number, all the checklist were
arranged in the file.)
-Change new magazine gripper which
holds the magazine even more stronger.

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JAIGANESH A/L MURUGAN 15DKM12F2001

8th week ( 11 August 2014 -15 August -Rocker arm assembly were checked
2014) whether its working in proper manner .
-Preventive Maintanence Due Service
- Learn about sawing method at wafer
level Two types of machine 1.Blade
(DFD) 2.Laser ( DFC) (Function of the
machine is to cut the space between the
dye on the wafer. Calculation of depth
and length is set up according to
customers request.Once the processs is
finished, it is send for inspection before it
will be processed by Die Attach
Machine.

9th week ( 18 August 2014 22 August -Change wire tensioner ( Perform normal
2014) cleaning and to avoid the gold wire to
stuck into the tensioner. The old tensioner
will be soaked into soap water and will be
cleaned using ultrasonic cleaner filled
with isopropanol.)
-Change broken cuppling( Change broken
cuppling from the vacuum pump
oil.Unassembly power motor to change
the broken cuppling and new cuppling
were changed.Vacuum oils will be also
changed.
-Chamber cover shield were changed
during PM service for PLASMA cleaner
machine. (Remove the ceramics from
chamber including the electrodes.By
following the procedures , New chamber
covershield were changed To avoid
from debris and keep the machine in

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JAIGANESH A/L MURUGAN 15DKM12F2001

safety manner)
- Measure the claw using digital Vernier
calliper ( Measure the depth and width of
claw to make a similar difference
between the new designed claw and the
claw which is already from the machine.
-Able to service and clean wire parts, air
filter and wire tensioner.

10th week ( 25 August 2014 29 August -Check and fix back the M.Box.
2014) - Repair the holder on Esec wire bond
machine.
-Fix maxon motor on DA machine (
Solder the wire and service the machine
parts. Maxon motor function is to move
or push up the wafer load.)
-Repair the holder by using drill machine
and rivet process.

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JAIGANESH A/L MURUGAN 15DKM12F2001

11th week ( 1 Sept 2014 - 5 Sept 2014) -Wiring power supply for microscope
machine.
- Fix hose for BLUE M OVEN.( Fix hose
from grounding pipe to its machine due
to its major down )
-PM service for DEK machine ( DT-02)
-Able to gain more information about
other machines as well

12th week (8 Sept 2014 13 Sept 2014) -Change BSCU board ( Non-Stick
Detector = Due to wiring problem in the
board Solder the wire on the new board
using gas soldering and fix it back on the
machine .Function of BSCU board on
esec wire bond machine is to detect
whether bonding occurs in between the
bondpad and lead)
- Replace DC motor inside the feeder (
Motor which doesnt not function in the
feeder part were all changed)
- Scan checklist and attach into MMS
system.

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JAIGANESH A/L MURUGAN 15DKM12F2001

13th week ( 15 Sept 2014 19 Sept -Check Resistance for ESD purpose. ( To
2014)
measure the resistance for ESO purpose.

Equipment used Is surface resistance

meter & 5 pound testing probe)

-Fix cooler fan for wire bond machine (

Due to overheating temperate

-Fix valve for CM01 machine. ( Function

of valve is to blow out the components.

14th working start -Rebuild the hard drive for PLASMA

CLEANING MACHINE( Hard disk
damaged) ( Hard disk is rebuild so that all the
settings and software are updated and machine
will be tested)
-PM due for machine DEK-02
-Change the maxon motor of the wire spool.(
Ensure that the wire spool rotates)
- Equipment PM grounding & AC leakage (
Check the conductivity of earthing on the
machine is to make sure there is no A/C
Leakage or unwanted current to spoil the
product)
-Power supply was repaired due to major
down ( Check out the problem and service the
power supply.

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JAIGANESH A/L MURUGAN 15DKM12F2001

15th week ( 29 Sept 2014 3 Oct 2014) -PM due for machine AX-01

- Fix monitor on esec wire bond machine

( Change and replace to a new monitor

due to monitor damage)

-Fix temperature board on Die Attach

machine

-Create a object on my own ( Purpose of

the project is done is to raise up the

monitor on esec wire bond machine)

-Fix and set up blue M oven machine

(Fix the repaired machine inside the

LINE of phase 3.

16th week (7 Oct 2014 10 Oct 2014) -Change and service vacuum oil pump (

To overhauled the vacuum oil pump)

- Work out with my own project ( Drilled

and grind the project )

-Indexing problem due to 300v board

failed ( Find out the error and repair it

with the senior techinician by changing

the 300v board)

-Repair the power supply

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JAIGANESH A/L MURUGAN 15DKM12F2001

17th week ( 13 Oct 2014 17 Oct 2014) -PM due for DATACON - 05 machine.
-Change vacuum tube ( Replace with new
tubing due to air leakage)
-Fix grounding cable ( Fix grounding
cable on the trolley for ESD purpose)
-Fix the created object on the machine
(Object was created and successfully
fixed on the machine to avoid the
microscope to hit the monitor)
-Fix rail guide on E095 wire bond
machine.( To hold the lead frame and to
avoid bend frame)

18th week ( 20 Oct 2014 25 Oct 2014) -Change and service the ionizer ( Service
the ionizer by cleaning it using propanol
and change the due sticker. Ionizer will
be serviced every month once.
-PM due for MX-TNK-1 (epoxy mixer)
(Clean the epoxy)
-Design the object created with the
measurement which should be send to the
vendor to fabricate

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JAIGANESH A/L MURUGAN 15DKM12F2001

19th week ( 28 Oct 2014 1 Nov 2014) -Solder the grounding cable for wire
bond machine .

-Remove the damaged grounding cable

from the bench

-Fix grounding cable for ESD wrist strip]

-Major down problem Cooler fan

problem ( Withdraw a new set of cooler
fan from the assembly store. Solder the
wiring socket once the damaged cooler
fan is removed. Fix the cooler fan on the
machine and run the machine to test
whether the fan works in a proper
manner)

20th week ( 3 Nov 2014 7 Nov 2014) -Esec wire bond ( Hardware problem
Blue screen) ( Hardware disk were
changed and software installation takes
place to restore back the data.

-Power supply down ( Remove all the

tubing and wire before it is removed
from the machine.

-Encoder setting for wire bond machine (

Encoder adjustment occur to makesure
the encoder is in the right position)

- PM due for DA-DAC-11 machine

together with autocallibration by using (
BMC and Touchdown tool)

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JAIGANESH A/L MURUGAN 15DKM12F2001

CHAPTER 4 TECHNICAL REPORT ( LAPORAN

TEKNIKAL)

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JAIGANESH A/L MURUGAN 15DKM12F2001

Overview of Preventive Maintanence Process

Objectives

To understand the process of events in a typical preventive maintenance cycle

To set up preventive maintenance (PM) schedules for equipment
To update PM schedules with current equipment information
To track completed maintenance tasks

14.2 About the Preventive Maintenance Cycle

Use Equipment/Plant Maintenance to plan, monitor, and complete routine

maintenance operations. When you use Equipment/Plant Maintenance, you can
minimize equipment breakdowns and unscheduled repairs.

When you use Equipment/Plant Maintenance to manage your equipment

maintenance needs, you define the type and frequency of each maintenance task for
each piece of equipment in your organization. The preventive maintenance cycle
refers to the sequence of events that make up a maintenance task, from its definition
to its completion. Since most preventive maintenance tasks are commonly performed
at scheduled intervals, parts of the preventive maintenance cycle repeat, based on
those intervals.

The preventive maintenance cycle consists of the following tasks:

Creating a PM schedule
Working with meter readings
Updating PM schedule information
Changing the status of PMs to complete

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JAIGANESH A/L MURUGAN 15DKM12F2001

You define service types to describe

Service type
individual preventive maintenance tasks.
You can define as many service types as
you need. You can set up service types to
apply to a particular piece of equipment
or a class of equipment. Examples of
service types include:
250-hour inspection
Clutch adjustment
Lubricate ventilation fan
10,000-hour engine rebuild

Preventive maintenance schedule You create one preventive maintenance

schedule for each piece of equipment for
which you want to perform PMs. The
PM schedule defines which service types
should apply to a piece of equipment.
The PM schedule also defines the service
interval for each service type. A service
interval refers to the frequency at which
the service types will be performed.

PM A PM refers to one or more service types

that are scheduled to be performed for a
piece of equipment. You typically
specify that a PM be performed at a
predefined point in time. The point in
time can be based on days, date, or when
a piece of equipment accumulates a
predefined number of statistical units,
such as hours, miles, and so on. You
identify how many units have

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JAIGANESH A/L MURUGAN 15DKM12F2001

accumulated for each piece of equipment

by periodically entering equipment meter
readings.
When the system creates a record for a
PM status
PM, it assigns an initial status of
(Maintenance Task Defined). You define
other statuses to indicate the particular
steps that a PM goes through before it is
completed.
When you complete a PM, the system
assigns it a status of (Maintenance
Complete).

Image of PM in F.O.L 3

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JAIGANESH A/L MURUGAN 15DKM12F2001

Process Flow FRONT OF LINE (FOL) & END OF LINE (EOL)

FOL process starting from the wafer mount up to three optical processes after the
bond wires. While the EOL starts from the mold until the end of the process. IC FOL
responsible for processes such as wafer assembly, wafer sawing, die attach, wire
bonding and coating. EOL IC is responsible for processes such as molding, marking,
post mold cure, slurry deflash, dejunk / slurry, or cut and form and singulation. Final
Test is responsible for designing the test, using a different test program to perform
electrical tests on the device accordingly. Tape and drop operation is performed for
packaging semi-conductors in the testing department as well.

Manufacturing process flow chart can be divided into two parts: Front Line (FOL)
and End of Line (EOL). Both parts consist of several processes and is followed from
the beginning to the end. However the quality of the product safety is very important
for the process and it needs a good performance to manage production.

Generally, there are two streams of semiconductor assembly process can be divided
into: -

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JAIGANESH A/L MURUGAN 15DKM12F2001

FRONT OF LINE (FOL)

Steps at FRONT OF LINE (FOL)

Production Process Wafer (Wafer Production)

A piece of the wafer with a round or four - sided geometric figure in which each
wafer has a number of references. Wafer made as electronic components obtained
from the customer. In each wafer there are hundreds or thousands of Die and Die and
depending on the size of the wafer.

Wafer size is obtained from the customer and there is a certain size, such as 3
inches, 4 inches, 5 inches, 6 inches and 8 inches. Its size depends on the design of
integrated circuits. It is also the main ingredient for the Integrated Circuit (IC). The
diagram below shows the process of the wafer.

Dummy Dye

Work as the same pattern with Its good die

Scribe Grid

Its separate areas with each other and according to the cut.

Ink Dye

Ink on the surface of the damaged Die.

Flat Wafer

Wafer straight lines to show the position of the wafer.

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JAIGANESH A/L MURUGAN 15DKM12F2001

Rajah 3.1 : Wafer

In each wafer or Die consists of four types of layers, such as: -

Glassivation

Metallization

Passivation

Silicone

Glassivation

- Layers are very clear.

- The main objective is to protect the Die of major damage.

-Its surface area is not protected from the glassivation like:

Bond pad

Scribe grid

Test Pattern

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JAIGANESH A/L MURUGAN 15DKM12F2001

Metallization

- It is made of aluminum.

-Look in white or yellowish.

-Plating layer is formed with various patterns because it is required.

-It is also known as a very active area.

Passivation

-To identify the passivation layer is through the colors on the surface of the wafer or
Die.

-Sometimes it can be seen in the colors green or blue when using the high power
scope, but it can be seen in shades of gray if you use a low power scope.

Silicone

-The first layer in the process of making a wafer and to identify is through color
glossy black.

- It can be seen when there is a fracture Die (Die chip).

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JAIGANESH A/L MURUGAN 15DKM12F2001

The Grinding Machine (Backgrinder Machine)

This operation is to control the thickness of the wafer, depending on the thickness
of the needs of each package. Not all incoming wafer has a thickness within the
limits of the specification. If too thick wafer, the wafer surface is grind out, all sizes
of grinding in Mils, and this is usually requested by the customer. After grinding the
wafer, the next step is to wash and dry the wafer is ground. The diagram below
shows the grinding process.

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JAIGANESH A/L MURUGAN 15DKM12F2001

The Tapping Machine (Tapping Machine)

Tapping machine is a machine used for the first process in the FOL of membrane
attached to the die printed on a wafer. After this stage, it is sent to the 'backgrinder' to
ground its thickness (only necessary when the demand 'customer'). The diagram
below shows the process on a wafer adhesive membrane.

(Wafer Saw)

Wafer saw is the step that really cut the wafer into individual Die for installation in
the IC package. Wafer saw process consists of the following steps. First, the wafer
frame mounted autoDiek into position to cut in line. Then, the wafer is cut through
the thickness dimension Its programmed using a resin bonded diamond wheels rotate
at very high rpm. Finally, the wafer goes through the process of cleaning using high
pressure DI water sprayed on the workpiece to rotate and then dried by air blowing.
The diagram below shows the wafer cutting process

Sawing process

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JAIGANESH A/L MURUGAN 15DKM12F2001

The Second Optical Inspection (2ND Optical Inspection)

This inspection is to ensure that the wafer is sawed in accordance with

specifications and defect free cubes. Any damage or Die chip will be rejected or
removed. A 100% inspection will be conducted. The diagram below shows two
optical inspection process.

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JAIGANESH A/L MURUGAN 15DKM12F2001

Die Attach Process ( Die picking,epoxy dispencing,die placing,epoxy curing)

Die Picking

-Die can be directly picked from the wafer after the wafer sawing process.

-Die bonder are often equipped with ejector needle system to push against the
backside of the wafer to eject the die.

-Computer controller vacuum pick-up tools are used to lift the dies

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JAIGANESH A/L MURUGAN 15DKM12F2001

Epoxy dispencing

-Die attach epoxy is dispensed in controlled volume by dispenser to the substrate

-The viscosity of the epoxy has to be controlled.

-The location of the dispensing is controlled computer with vision control

Die Placing

-The die pick-up arm of the die attach machine will send the die to the
appropriate position and load the die on the substrate.

-Die bonding pressure has to be controlled.

-The substrate may be heated to facilitate partial curing of the epoxy die attach.

Epoxy curing

The die bonded substrate may need to send for curing in ovens to stabilize the
polymer.

There are fast curing epoxy and also UV cured epoxy to facilitate the process.

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JAIGANESH A/L MURUGAN 15DKM12F2001

Epoxy Cure Oven

After Die attach process, many of which will be sent to the oven. This
microwave oven is called the epoxy cures. Some epoxies have different
temperature and curing time. For example, ablebond 8290 epoxy cures for 1.5
hours at 175 -
the preservation and how long it takes to heal a lot in the oven. Typically,
many of which will be stored in the magazine. There are 12 magazines in the
oven. The diagram below shows the process of the epoxy cure oven.

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JAIGANESH A/L MURUGAN 15DKM12F2001

The process of binding the Golden Thread (Wire Bond Process)

Gold thread binding process aims to create electrical connections between the
contact pads are available on its connectivity with the outside of the pin (lead). Gold
ball bonding using termosinik most frequently used by industry to produce ultrasonic
bonding metallurgy.

UNISEM using gold in 99.99% purity with a diameter of 0.001 inches to go

through this process. It is note worthy that the leadframe undergoing this process
should apply heat at a temperature between 150 C to 200 C and thermal energy
sources available on the bendakerja. After the discovery of gold thread binding all
kinds of reliability tests to be carried out of the Golden Thread Tension Test, Test
and Test Shear Spun Yarn Ball in the sample, known as the Dummy Frame for a lot
of products. The diagram below shows the process of bonding with gold thread.

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JAIGANESH A/L MURUGAN 15DKM12F2001

Gold Wire Tranducer & Cappilary

1st Bond

Free Air Ball Looping

2nd Bond

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JAIGANESH A/L MURUGAN 15DKM12F2001

When the frame is moved to the indexer, there are 4 sensors that control the process
of sewing a gold wire, namely: -

- Frame Input Sensor detects entry frame to the indexer.

- Position Sensor Frame is in the 'clamp' that serves to detecting entry into the frame

'bonding wire' was correct and not the reverse. Bond Position Sensor to detect the
pad frame and chip terminals to be sewn with gold wire.

-Frame Output Sensor to detect the presence of the frame to the 'magazine output
handler 'and does not collide with any clamp.

- Frame Output Sensor to detect the presence of the frame to the 'magazine output
handler 'and does not collide with any clamp.

When the frame is in the indexer, clamp frame moves to the 'bonding'. When he
began the process of 'bonding', capillary serves as a speaker for soldering gold wires
between the chip and the bond pad. To disconnect the cord, elekrod touch with
capillary and it produces a very small spark to disconnect the wires. The diagram
below shows the gold wire solder

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JAIGANESH A/L MURUGAN 15DKM12F2001

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JAIGANESH A/L MURUGAN 15DKM12F2001

Wire
Bonding

Ultrasonic Thermocompression Thermosonic

Bond loop
contamination. -directional complex.
bonds. -
at room temperature or directional
gold bonds. bonds.

Sensitive to
crater. surface pollution.
contamination. e
-Y axis potential the
of the pad is required. crater.
required.
small pad. bond pad is
required.

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JAIGANESH A/L MURUGAN 15DKM12F2001

Flip Chip

Processing a flip chip is similar to conventional IC fabrication, with a few additional

steps. Near the end of the manufacturing process, the attachment pads are metalized
to make them more receptive to solder. This typically consists of several treatments.
A small dot of solder is then deposited on each metalized pad. The chips are then cut
out of the wafer as normal.

To attach the flip chip into a circuit, the chip is inverted to bring the solder dots down
onto connectors on the underlying electronics or circuit board. The solder is then re-
melted to produce an electrical connection, typically using a Thermosonic bonding or
alternatively reflow solder process. This also leaves a small space between the chip's
circuitry and the underlying mounting. In most cases an electrically-insulating
adhesive is then "underfilled" to provide a stronger mechanical connection, provide a
heat bridge, and to ensure the solder joints are not stressed due to differential heating
of the chip and the rest of the system. The underfill distributes the thermal expansion
mismatch between the chip and the board, preventing stress concentration in the
solder joints which would lead to premature failure.

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JAIGANESH A/L MURUGAN 15DKM12F2001

Recently, high-speed mounting methods evolved through a cooperation between

Reel Service Ltd. and Siemens AG in the development of a high speed mounting tape
known as 'MicroTape.'[1]. By adding a tape-and-reel process into the assembly
methodology, placement at high speed is possible, achieving a 99.90% pick rate and
a placement rate of 21,000 cph (components per hour), using standard PCB assembly
equipment.

Advantages of flip chip

The resulting completed flip chip assembly is much smaller than a traditional carrier-
based system; the chip sits directly on the circuit board, and is much smaller than the
carrier both in area and height. The short wires greatly reduce inductance, allowing
higher-speed signals, and also conduct heat better.

Disadvantages of flip chip

Flip chips have several disadvantages. The lack of a carrier means they are not
suitable for easy replacement, or manual installation. They also require very flat
surfaces to mount to, which is not always easy to arrange, or sometimes difficult to
maintain as the boards heat and cool. Also, the short connections are very stiff, so the
thermal expansion of the chip must be matched to the supporting board or the
connections can crack. The underfill material acts as an intermediate between the
difference in CTE of the chip and board.

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JAIGANESH A/L MURUGAN 15DKM12F2001

Opti

QA control the quality of products produced. The diagram below shows the process
of a third optical format. After each and every process are done, the chips or frames
are sent for inspection to check the whether the chips are placed as the need of
customer or any damages on the lead frame.

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JAIGANESH A/L MURUGAN 15DKM12F2001

This are types of rejected items after inspection is done.

Lead is bend

There s no
bonding

The position of
die is misplaced

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JAIGANESH A/L MURUGAN 15DKM12F2001

SAFETY PRECAUTION INSIDE THE PRODUCTION LINE

Importance of ESD at UNISEM and all the semiconductor industry

1 What is ESD and how is it caused ?

The charge at the surface of any material is generally neutral, i.e. neither positive nor
negative, unless some energy is imparted to the surface causing an imbalance of
electrons to occur producing a local charge (negative or positive depending on the
material). In a conducting material, the electrons have high mobility and the charge
will recombine preserving a balanced surface potential. However, in a non-
conducting material, a large local charge can build up in the material until it is
discharged via an external path; this is electro-static discharge and can be in the
thousands of volts.

Basic ESD Control Program

Avoid personnel charging and discharging into the device by

grounding personnel

Avoid discharges between different items by handling them

only when they are at the same potential, e.g. by using ESD

safe work surfaces

Use ESD safe packaging materials when removing

devices from the ESD safe workplace

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ESD Controls Summary

1. General ESD Control includes:

Basic ESD Control

Grounded Personal

Static Safe Workstation

Packing (Safe Packaging Materials)

CDM Control

Controlling insulators

Controlling charged boards/devices

Avoiding hard discharges

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Images

ESD checking before entering the production

Remove dust from our jumpsuit

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A cleanroom suit, clean room suit, or bunny suit, is an overall garment worn in
a cleanroom, an environment with a controlled level of contamination. One
common type is an all-in-one coverall worn
by semiconductor and nanotechnology line production workers, technicians, and
process / equipment engineers, as well as people in similar roles creating sterile
products for the medical device industry.

The suit covers the wearer to prevent skin and hair being shed into a clean room
environment. The suit may be in one piece or consist of several separate garments
worn tightly together. The suit incorporates both boots and hood. It must also
incorporate a properly fitted bouffant cap or mob cap.

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CHAPTER 5: RECOMMENDATIONS (DAPATAN DAN

CADANGAN)

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In this 20 week practical training period, it is really true that I had learnt a lot of extra
knowledge. But somehow, the training period that polytechnic offers is rather short.
Moreover, with more longer period, student can recognize more people and gain
more experience that would totally benefit them when they join back again.Student
also may be changed to other department, since there is a wide range of department
at Unisem (M) Berhad. Through this, they not only can gain more extra knowledge
which beyond their working area, they too may be able to withstand independently in
these task in the future.

Besides, in my opinion, if this practical training will only be arranged at the final
semester of study, it would convenient most of the student since they be able to
continue their work with the company as their career.

Last but not least, introduced practical training is absolety benifitting the student.
Maybe someday, every student will be given a chance for working twice of industrial
training for better improvement agains the standard and quality of Polytechnic
students.

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CHAPTER 6: CONCLUSION ( KESIMPULAN)

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Industrial Training is compulsory for Diploma Polytechnic Ministry of Higher

Education students. Industrial Training, students can not only improve their skills in
their respective fields, but students are exposed to techniques of preparation and
writing of the report. Through this experience, is expected to increase the potential to
highlight the job market in a related field after graduation

In conclusion, throughout my industrial training session at Unisem (M) Berhad, I

have learned and gain a lot of knowledge and experience myself with the working
atmosphere. Besides that, industrial training will be one of my valuable moment
whereby I have worked through for from 23rd jun until 7th of November . All the
senior technician and also together with my manager was the main reason and they
have been the backbone of mine . I have done my level best where I have satisfied all
the needs there should be in a student . I worked there as a PM technician at F..O.L 3.
It really suits for my mechanical field where I looked through many types of high
technology machines . Not only mechanical but also get the chance of learning
electronic works as well and went through with all the senior technician to learn .I
really gained a lot of knowledge and I feel proud to say I really worked there as a
technician but not as a student because I manage myself to go through all types of
machine and learn the technic to solve problems.

Deepest graditute goes to my manager & supervisor and last but not least to all my
PM technician. I have gained a lot of knowledge at Unisem (M) Berhad and Words
cant describe the atmosphere I went through in this industrial training session.

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APPENDIX ( LAMPIRAN)

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Below are the attachments regarding process and machines on work floor

Company logo

PHASE 3

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PM BAY

ESD TEST BEFORE ENTER THE LINE

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Designed a object on my own to raise up the monitor of the machine to avoid from
the microscope to hit the monitor. This object was designed together with its
measurement and sent to the vendor for fabrication.

BEFORE AFTER

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-Vacuum oil pump need to be overhauled

-Chamber cover shield were changed

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bbb B

Broken coupling were changed

Fix hose for blue m oven machine

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-Change maxon motor for the wire spool

-Change valve during PM service

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PRS 812 Resistance meter

- The PRS-812 Resistance meter is designed to measure resistance characteristic

of electrostatic discharge ( ESD) control materials and products to current ESD
industry standards.

-Power supply of esec wire bond machine

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-Grounding at the trolley for ESD purpose

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REFERENCE ( RUJUKAN)

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http://en.wikipedia.org/wiki/Preventive_maintenance

http://www.palomartechnologies.com/processes/die-bonding/die-attach

http://en.wikipedia.org/wiki/Wire_bonding

http://en.wikipedia.org/wiki/5S_(methodology)

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