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    Delamination Repair Procedure

    Uploaded by

    gnanasekar
    Method of repairing bilster by injection of resin

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    © All Rights Reserved
    Download as PDF, TXT or read online from Scribd

    Delamination Repair Procedure

    Uploaded by

    gnanasekar
    187 views2 pages
    Method of repairing bilster by injection of resin

    Original Title

    delamination repair procedure

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    © © All Rights Reserved

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    Method of repairing bilster by injection of resin

    Copyright:

    © All Rights Reserved
    Download as PDF, TXT or read online from Scribd
    Download as pdf or txt
    187 views2 pages

    Delamination Repair Procedure

    Uploaded by

    gnanasekar
    Method of repairing bilster by injection of resin

    Copyright:

    © All Rights Reserved
    Download as PDF, TXT or read online from Scribd
    Download as pdf or txt
    of 2

    3.

    1 Delamination/Blister Repair, Injection Method

    1 of 2

    http://www.circuitrework.com/guides/3-1.shtml

    About Us

    Circuit Technology Center

    Free Newsletter

    Surgeon grade rework and repair, by the book and guaranteed.


    Home

    Services

    Guide Book

    Contact Us

    Phone: 978-374-5000
    Features

    3.1 Delamination/Blister Repair, Injection Method

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    Outline
    This method is used to repair mechanical or thermal
    blisters or delaminations in circuit board laminated
    base materials. The blister is sealed by injecting a
    low viscosity epoxy into the blister/delamination void.
    Caution
    This method can only be used when the laminate
    base material has separated sufficiently to allow the
    epoxy to flow throughout the void area.

    Precision Drilling, Grinding and Cutting


    The Micro-Drill is the ideal tool for precision drilling,
    grinding and cutting.

    Minimum Skill Level - Advanced


    Recommended for technicians with soldering and
    component rework skills and exposure to most
    repair/rework procedures, but lacking extensive
    experience.
    Conformance Level - High
    This procedure most closely duplicates the physical characteristics of the original, and most probably
    complies with all the functional, environmental and serviceability factors.
    Acceptability References
    IPC-A-600 2.0 Externally Observable Characteristics
    IPC-A-610 10.0 Laminate Conditions

    Pre-measured Epoxy for Circuit Repair


    Epoxy is packaged in two-compartment packages.
    Easy to use and no measuring.

    Procedure References
    1.0
    2.1
    2.2
    2.5
    2.7
    IPC7721 3.1

    Foreword
    Handling Electronic Assemblies
    Cleaning
    Baking And Preheating
    Epoxy Mixing and Handling
    Delamination/Blister Repair, Injection Method
    BGA Component Rework Simplified

    Tools and Materials


    Alcohol Swab
    Self-saturating Isopropyl alcohol swab. Squeeze
    handle to release alcohol.

    Ball Mills, Abrasives, Cutting Tools


    Ball mills, abrasives and cutting tools for working
    on circuit boards.

    Circuit Bond Packs


    Clear, superior strength epoxy in two-compartment
    plastic packages

    Microscope
    It is a challenge to undertake precision repair
    without a good microscope.

    Micro Drill System


    Versatile power tool for milling, drilling, grinding,
    cutting and sanding circuit boards.

    Mixing Picks
    Unique mixing sticks have a paddle shape on one
    and sharp pick on the opposite end.

    Oven
    General purpose oven for drying, baking and
    curing epoxies.

    Syringes
    Polypropylene syringe barrels with stainless steel
    dispensing tips.

    When you're confronted with tough


    BGA rework, who do you turn to?
    Discover the #1 resource used by
    military contractors.
    Circuit Technology Center

    Customer Comments
    "We've never had much luck sending our highly
    complex boards out for repair until we started using
    Circuit Technology Center. It's obvious that you
    must have the very best equipment and a highly
    qualified staff."
    N.R. Montreal, Quebec, Canada

    Send us your comments

    Wipes
    Nonabrasive, low-linting wipes for cleanup.

    Images and Figures

    3/31/2015 12:09 PM

    3.1 Delamination/Blister Repair, Injection Method

    2 of 2

    http://www.circuitrework.com/guides/3-1.shtml

    Figure 1: Drill into the delamination blister


    using a ball mill and a Micro-Drill.

    Figure 1: Drill into the delamination blister


    using a ball mill and a Micro-Drill.

    Figure 3: Completed repair.

    Figure 4: Micro-Drill System.

    Figure 2: Inject epoxy into the


    delamination blister.

    Procedure
    1. Clean the area.
    2. Drill into delamination blister with the Micro-Drill and ball mill. Drill in an area clear of circuitry or
    components. Drill at least two holes opposite each other around the perimeter of the delamination.
    (See Figure 1) Brush away all loose material.
    Caution
    Be careful not to drill too deep exposing internal circuits or planes.
    Caution
    Abrasion operations can generate electrostatic charges.
    3. Bake the circuit board to remove any entrapped moisture. Do not allow the circuit board to cool prior
    to injecting the epoxy.
    Caution
    Some components may be sensitive to high temperature.
    4. Mix the epoxy. See manufacturers instructions on how to mix epoxy without bubbles.
    Caution
    Exercise care to prevent bubbles in the epoxy mixture.
    5. Pour the epoxy into the epoxy cartridge.
    6. Inject the epoxy into one of the holes in the delamination. (See Figure 2) The heat retained in the
    circuit board will improve the flow characteristics of the epoxy and will draw the epoxy into the void
    area filling it completely.
    7. If the void does not fill completely, the following procedures may be used:
    A. Apply light local pressure on the board surface starting at the fill hole, slowly proceeding to the
    vent hole.
    B. Apply vacuum to the vent hole to draw the epoxy through the void.
    8. Cure the epoxy per Procedure 2.7 Epoxy Mixing and Handling. Scrape away any excess epoxy using
    a knife or scraper.
    Note
    If needed, apply additional thin coating to seal any scrapped areas.
    Evaluation
    1. Visual examination for texture and color match.
    2. Electrical tests to conductors around the repaired area as applicable.
    Procedure for reference only.
    Circuit Technology Center, Inc.
    22 Parkridge Road
    Haverhill, MA 01835 USA
    Copyright All rights reserved.
    ISO9000:2008 Certified

    Member Since 1986

    First-aid Kits for Circuit Boards

    3/31/2015 12:09 PM

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