BS EN 50310-2010 Bonding

BS EN 50310:2010
Licensed copy:An Nhien
, 26/11/2010, Uncontrolled Copy, BSI
BSI Standards Publication
Application of equipotential
bonding and earthing in
buildings with information
technology equipment
NO COPYING WITHOUT BSI PERMISSION EXCEPT AS PERMITTED BY COPYRIGHT LAW
raising standards worldwide
BS EN 50310:2010
BRITISH STANDARD
National foreword
This British Standard is the UK implementation of EN 50310:2010.
It supersedes BS EN 50310:2006, which is withdrawn.
The UK requirements for earthing of cabinets, frames and racks
based upon the HD 60364 series are referenced in clause 7.1.6 of this
document. The relevant requirements of HD 60364 are implemented
in BS 6701.
The UK participation in its preparation was entrusted to Technical
Committee TCT/7, Telecommunications - Installation requirements.
A list of organizations represented on this committee can be
obtained on request to its secretary.
This publication does not purport to include all the necessary
provisions of a contract. Users are responsible for its correct
application.
BSI 2010
ISBN 978 0 580 68179 0
ICS 33.100.01; 35.020; 91.140.50
Licensed copy:An Nhien
Compliance with a British Standard cannot confer immunity from

legal obligations.
This British Standard was published under the authority of the
Standards Policy and Strategy Committee on 30 November 2010.
Amendments issued since publication
Date
Text affected
BS EN 50310:2010
EUROPEAN STANDARD
EN 50310
NORME EUROPENNE
October 2010
EUROPISCHE NORM
ICS 29.120.50; 91.140.50
Supersedes EN 50310:2006
English version
Application of equipotential bonding and earthing in buildings with

information technology equipment
Application de liaison quipotentielle et de

la mise la terre dans les locaux avec
quipement de technologie de
l'information
Anwendung von Manahmen fr Erdung

und Potentialausgleich in Gebuden mit
Einrichtungen der Informationstechnik
This European Standard was approved by CENELEC on 2010-10-01. CENELEC members are bound to comply
with the CEN/CENELEC Internal Regulations which stipulate the conditions for giving this European Standard
the status of a national standard without any alteration.
Up-to-date lists and bibliographical references concerning such national standards may be obtained on
application to the Central Secretariat or to any CENELEC member.
This European Standard exists in three official versions (English, French, German). A version in any other
language made by translation under the responsibility of a CENELEC member into its own language and notified
to the Central Secretariat has the same status as the official versions.
CENELEC members are the national electrotechnical committees of Austria, Belgium, Bulgaria, Croatia, Cyprus,
the Czech Republic, Denmark, Estonia, Finland, France, Germany, Greece, Hungary, Iceland, Ireland, Italy,
Latvia, Lithuania, Luxembourg, Malta, the Netherlands, Norway, Poland, Portugal, Romania, Slovakia, Slovenia,
Spain, Sweden, Switzerland and the United Kingdom.
CENELEC
Licensed copy:
European Committee for Electrotechnical Standardization

Comit Europen de Normalisation Electrotechnique
Europisches Komitee fr Elektrotechnische Normung
Management Centre: Avenue Marnix 17, B - 1000 Brussels
2010 CENELEC -
All rights of exploitation in any form and by any means reserved worldwide for CENELEC members.
Ref. No. EN 50310:2010 E
BS EN 50310:2010
EN 50310:2010
Foreword
This European Standard was prepared by the Technical Committee CENELEC TC 215,
Electrotechnical aspects of telecommunication equipment. The text of the draft was submitted to the
formal vote and was approved by CENELEC as EN 50310 on 2010-10-01.
Attention is drawn to the possibility that some of the elements of this document may be the subject of
patent rights. CEN and CENELEC shall not be held responsible for identifying any or all such patent
rights.
The following dates were fixed:
latest date by which the EN has to be implemented

at national level by publication of an identical
national standard or by endorsement
latest date by which the national standards conflicting
with the EN have to be withdrawn
(dop)
2011-10-01
(dow)
2013-10-01
Licensed copy:
This European Standard supersedes EN 50310:2006.

In the course of the revision of EN 50310:2006, some elements from EN 50174-2:2000 have been
moved to this European Standard for reasons of clarity.
This European Standard has been produced within the framework of the following considerations.
a)
With the ongoing growth of the liberalised telecommunication market, the increasing advent of
private telecommunication network operators, and the flourishing use of networking computers,
the amount of Information Technology equipment installed in buildings and the complexity of
these Information Technology installations are permanently growing.
b)
Information Technology equipment is generally installed either as stand-alone equipment (e.g.

personal or network computers, small PBXs), or held in racks, cabinets or other mechanical
structures (e.g. switching systems, transmission systems, mobile base stations).
c)
CENELEC/SC 64B Electrical installations and protection against electric shock Protection
against thermal effects had decided during their meeting in November 1997 not to harmonize
IEC 60364-5-548:1996 Electrical installations of buildings Part 5: Selection and erection of
electrical equipment Section 548: Earthing arrangements and equipotential bonding for
information technology installations.
d)
This European Standard shall give guidance to network operators, equipment providers and
building owners to agree on a standardised bonding configuration that facilitates
compliance of the Information Technology Equipment installation with functional

requirements including Electromagnetic Compatibility (EMC) aspects of emission and
immunity,
compatible building installation and equipment provisions,
installation of new equipment in buildings as well as expansion or replacement of

installations in existing buildings with equipment coming from different suppliers,
a structured installation practice,
simple maintenance rules,
contracting on a common basis,
harmonisation in development, manufacturing, installation and operation.
BS EN 50310:2010
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EN 50310:2010
Contents
Introduction . ...........................................................................................................................................5
1
Scope and conformance . ..............................................................................................................8

1.1 Scope. ....................................................................................................................................8
1.2 Conformance . ........................................................................................................................8
2
Normative references . ...................................................................................................................9
3
Terms, definitions, abbreviations and symbols . ........................................................................9

3.1 Terms and definitions . ...........................................................................................................9
3.2 Abbreviations . ......................................................................................................................11
3.3 Symbols . ..............................................................................................................................11
General requirements . .................................................................................................................12
4.1 Co-ordination . ......................................................................................................................12
4.2 Safety from electrical hazards . ............................................................................................12
4.3 Segregation between information technology cabling and power supply cabling . ..............12
4.4 Main earthing terminal (MET) . .............................................................................................12
4.5 Signal reference . .................................................................................................................12
Application of earthing networks . ..............................................................................................12
5.1 General . ...............................................................................................................................12
5.2 Requirements and recommendations . ................................................................................13
5.3 Hierarchy of earthing network performance . .......................................................................13
Earthing networks. .......................................................................................................................17
6.1 General . ...............................................................................................................................17
6.2 Star earthing networks. ........................................................................................................20
6.3 Ring earthing networks . .......................................................................................................21
6.4 Local mesh earthing networks . ............................................................................................21
6.5 Meshed earthing networks . .................................................................................................23
6.6 SRPP . ..................................................................................................................................25
Bonding . .......................................................................................................................................25
7.1 Equipotential bonding conductors . ......................................................................................25
7.2 System Reference Potential Plane (SRPP) . .......................................................................28
7.3 Corrosion . ............................................................................................................................30
DC power distribution systems . .................................................................................................30
8.1 DC distribution system of secondary supply . ......................................................................30
8.2 DC distribution system of tertiary supply . ............................................................................31
4
Licensed copy:
5
6
7
8
9
Power supply distribution systems . ..........................................................................................32
Annex A (informative) Rationale about common bonding network (CBN) co-ordination . ...........33
Annex B (informative) Rationale for the integration of DC distribution systems into the merging
of common bonding network (CBN) and meshed bonding network (MESH-BN) ..34
Bibliography . ........................................................................................................................................35
BS EN 50310:2010
EN 50310:2010
Figures
Figure 1 Schematic relationship between EN 50310 and other relevant standards . ........................... 6
Figure 2 Examples of earthing networks . ...........................................................................................15
Figure 3 Examples of area-specific earthing networks within premises . ...........................................16
Figure 4 Example of a simple common bonding network (CBN) configuration (installation of
network termination) . ....................................................................................................................17
Figure 5 Example of a common bonding network (CBN) configuration for an information
technology installation inside a building . ......................................................................................18
Figure 6 Example of an improved bonding network (CBN/MESH-BN) installation inside a building .19
Figure 7 Example of high common impedance and large loop . .........................................................20
Figure 8 Example of low common impedance and small loop ...........................................................21
Figure 9 Local mesh earthing network . ..............................................................................................22
Figure 10 Mesh earthing network (multi-floor). ...................................................................................24
Figure 11 Mesh-BN example . .............................................................................................................26
Figure 12 Example of bonding straps . ................................................................................................27
Figure 13 Example of raised floor . .....................................................................................................29
Licensed copy:
Figure 14 Example of installation details for an under floor transient suppression plate ....................29
Tables
Table 1 Contextual relationship between EN 50310 and other relevant standards . ............................ 7
Table 2 Survey of DC electricity distribution system configurations with respect to EMC ..................31
Table 3 Survey of AC electricity distribution system configurations with respect to EMC ..................32
BS EN 50310:2010
5
EN 50310:2010
Introduction
This European Standard specifies requirements and recommendations for connections (bonds) to
earthing networks in buildings in which information technology (IT) equipment is intended to be
installed in order to:
a)
minimise the risk to that equipment and interconnecting cabling from electrical hazards,
b)
provide the information technology installation with:
a reliable signal reference;
adequate immunity from electromagnetic interference carried by the earthing network.
Different minimum requirements are specified depending on the intended use of the building with
regard to information technology.
The requirements of this European Standard are applicable when information technology cabling
installations are planned (including, for example, during the refurbishment of buildings).
Licensed copy:
This document is intended for:

1)
building architects, owners and managers;
2)
designers and installers of electrical and information technology cabling installations.
Figure 1 and Table 1 show the schematic and contextual relationships between the standards
produced by TC 215 for information technology cabling, namely:
installation specification, quality assurance, planning and installation practices (EN 50174 series);
generic cabling design (EN 50173 series);
application dependent cabling design (e.g. EN 50098 series);
testing of installed cabling (EN 50346);
this European Standard (EN 50310).
BS EN 50310:2010
EN 50310:2010
EN 50098-1: Customer premises

cabling for information technology ISDN basic access
EN 50098-2: Customer premises
cabling for information technology 2048 kbit/s ISDN primary access and
leased line network interface
EN 50173-2: Information technology:

Generic cabling - Office premises
Generic cabling - Industrial premises
Generic cabling - Homes

Generic cabling - General requirements

Generic cabling - Data centres
EN 50174-1: Information technology

Cabling installation Installation
specification and quality assurance
EN 50310: Application of equipotential

bonding and earthing in buildings with
information technology equipment
Licensed copy:
EN 50174-2: Information technology Cabling installation - Installation

planning and practices inside buildings
EN 50174-3: Information technology Cabling installation - Installation

planning and practices outside buildings
EN 50346: Information technology Cabling installation Testing of installed cabling
Figure 1 Schematic relationship between EN 50310 and other relevant standards
BS EN 50310:2010
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EN 50310:2010
Table 1 Contextual relationship between EN 50310 and other relevant standards

Building design
phase
Generic cabling
design phase
Specification
phase
EN 50310
EN 50173 series
except
EN 50173-4
EN 50174-1
EN 50174-1
4 Requirements for
specifying
installations of
information
technology
cabling
4 Requirements for
specifying
installations of
information
technology
cabling
6 Earthing
networks
4 Structure
5 Channel
performance
7 Cable
requirements
8 Connecting
hardware
requirements
9 Requirements for
cords and
jumpers
Installation
phase
5 Requirements for
installers of
information
technology
cabling
A Link performance
limits
Planning
phase
and
EN 50173-4
4 and 5
Structure
6 Channel
performance
8 Cable
requirements
9 Connecting
hardware
requirements
10Requirements for
cords and
jumpers
A Link performance
limits
EN 50174-2
EN 50174-2
4 Requirements for
planning
installations of
information
technology
cabling
5 Requirements for
the installation of
information
technology
cabling
6 Segregation of
metallic
information
technology
cabling and
mains power
cabling
6 Segregation of
metallic
information
technology
cabling and
mains power
cabling
7 Electricity
distribution
systems and
lightning
protection
and
EN 50174-3
and
EN 50174-3
and
(for equipotential
bonding)
EN 50310
and
(for equipotential
bonding)
EN 50310
and
EN 50346
Licensed copy:
4 General
requirements
5 Test parameters
for balanced
cabling
6 Test parameters
for optical fibre
cabling
Operation
phase
BS EN 50310:2010
EN 50310:2010
1
1.1
Scope and conformance

Scope
This European Standard specifies minimum requirements for earthing networks and connections
(bonds) in buildings in which information technology equipment is intended to be installed to protect
that equipment and interconnecting cabling from electrical hazards.
Additionally this European Standard specifies requirements and provides recommendations for
earthing networks and connections (bonds) in order for the information technology installation to
achieve
a)
reliable signal reference,
b)
adequate immunity from electromagnetic interference carried by the earthing network.
The requirements of this European Standard are applicable to all types of buildings ranging from
residential to large commercial and industrial premises. Operator buildings are addressed by
ETSI EN 300 253.
Licensed copy:
This European standard specifies an earthing and bonding configuration that is appropriate to specific
mains and other power supply distribution systems.
NOTE For the purposes of this European Standard bonding networks are connected to earth and therefore create an earthing
network.
This European Standard does not:

1)
apply to power supply distribution of voltages over AC 1 000 V;
2)
address the specific requirements for telecommunication centres (operator buildings); these are
specified in ETSI EN 300 253.
Safety requirements for power supply installation are outside the scope of this European Standard and
are covered by other standards and regulations. However, information given in this European
Standard may be of assistance in meeting these standards and regulations.
1.2
Conformance
In order to conform to this European Standard:

a)
the general requirements of Clause 4 shall be met;
b)
earthing and bonding networks shall meet the requirements of Clause 5;
c)
bonding connections shall meet the requirements of Clause 7;
d)
the mains and other power supply distribution systems shall meet the requirements of Clause 8;
e)
the installation of information technology cabling shall be in accordance with the EN 50174 series;
f)
local regulations, including safety, shall be met.
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EN 50310:2010
Normative references
The following referenced documents are indispensable for the application of this document. For dated
references, only the edition cited applies. For undated references, the latest edition of the referenced
document (including any amendments) applies.
EN 41003, Particular safety requirements for equipment to be connected to telecommunication
networks and/or a cable distribution system
1)
EN 50083 series , Cable networks for television signals, sound signals and interactive services
EN 50162:2004, Protection against corrosion by stray current from direct current systems
EN 50174-1, Information technology Cabling installation Part 1: Installation specification and
quality assurance
EN 50174-2, Information technology Cabling installation Part 2: Installation planning and practices
inside buildings
EN 50174-3, Information technology Cabling installation Part 3: Installation planning and practices
outside buildings
EN 60079-14, Explosive atmospheres Part 14: Electrical installations design, selection and erection
(IEC 60079-14)
EN 60728 series, Cable networks for television signals, sound signals and interactive services
(IEC 60728 series)
EN 60950-1, Information technology equipment Safety Part 1: General requirements
(IEC 60950-1, mod.)
EN 61140, Protection against electric shock Common aspects for installation and equipment
(IEC 61140)
EN 62305-4, Protection against lightning Part 4: Electrical and electronic systems within structures
(IEC 62305-4)
HD 60364-4-41, Low-voltage electrical installations Part 4-41: Protection for safety Protection
against electric shock (IEC 60364-4-41:2005, mod.)
HD 60364-4-444, Low-voltage electrical installations Part 4-444: Protection for safety Protection
against voltage disturbances and electromagnetic disturbances (IEC 60364-4-44:2007, mod.)
HD 60364-5-54:2007, Low-voltage electrical installations Part 5-54: Selection and erection of
electrical equipment Earthing arrangements, protective conductors and protective bonding
conductors (IEC 60364-5-54:2002, mod.)
Terms, definitions, abbreviations and symbols
3.1
Terms and definitions
For the purposes of this document, the following terms and definitions apply.
Licensed copy:
3.1.1
bond
connection to provide equipotential between objects
1)
Being partly replaced by EN 60728 series.
BS EN 50310:2010
EN 50310:2010
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3.1.2
bonding network
BN
set of interconnected conductive structures that provide equipotential
3.1.3
bonding ring conductor
earthing bus conductor which forms a closed conducting ring
NOTE Normally the bonding ring conductor, as part of the bonding network, has multiple connections to the common bonding
network that improves its performance.
3.1.4
common bonding network
CBN
means for effective bonding and earthing inside a telecommunication building
3.1.5
earthing network
bonding network that is connected to earth
3.1.6
isolated bonding network
IBN
bonding network that has a single point of connection to either the common bonding network or
another isolated bonding network
NOTE All IBNs considered here will have a connection to earth through the single point of connection.
3.1.7
meshed bonding network
MESH-BN
bonding network in which all associated equipment frames, racks and cabinets and usually the DC
power return conductor, are bonded together as well as at multiple points to the CBN
NOTE Consequently, the MESH-BN augments the CBN.
[ETSI EN 300 253:2002, 3.1.2, mod.]

3.1.8
meshed isolated bonding network
MESH-IBN
meshed bonding network that has a single point of connection to either the common bonding network
or another isolated bonding network
3.1.9
mesh size
maximum length of conducting material between two adjacent connection points that create the grid of
the bonding network
Licensed copy:
3.1.10
system block
functional group of equipment depending in its operation and performance on its connection to the
same system reference potential plane, inherent to a MESH-BN
[ETSI EN 300 253:2002, 3.1.2]
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EN 50310:2010
3.1.11
system reference potential plane
SRPP
conductive solid plane, as an ideal goal in potential equalizing, is approached in practice by horizontal
or vertical meshes
NOTE 1 The mesh width thereof is adapted of the frequency range to be considered. Horizontal and vertical meshes may be
interconnected to form a grid structure approximating to a Faraday cage.
NOTE 2
The SRPP facilities signalling with reference to a common potential.
[ETSI EN 300 253:2002, 3.1.2]
3.2
Abbreviations
For the purposes of this document, the following abbreviations apply.

3L
Three-phase live power supply conductor
AC
Alternating Current
BN
(Earthing) Bonding Network
CATV
Community Antenna TeleVision
CBN
Common Bonding Network
d.c., DC
Direct Current
EMC
ElectroMagnetic Compatibility
EMI
ElectroMagnetic Interference
IBN
Isolated Bonding Network
IT
Information Technology
Live power supply conductor
LPS
Lightning Protection System
MESH-BN
Meshed Bonding Network
MESH-IBN
Meshed Isolated Bonding Network
MET
Main Earthing Terminal, bar or busbar
Neutral power supply conductor
PE
Protective Earth conductor
SRPP
System Reference Potential Plane
TSP
Transient Suppression Plate
3.3
Symbols
Licensed copy:
For the purposes of this document, the following symbols apply.

Bonding connection
Neutral conductor (N)
Protective earth conductor (PE)
BS EN 50310:2010
EN 50310:2010
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4.1
12
General requirements
Co-ordination
The basic purposes of earthing networks in relation to information technology equipment are:
a)
safety: touch voltage limitation and earth fault return path;
b)
electromagnetic interference (EMI): a single potential reference and voltage equalisation,

screening effect.
The design of earthing networks for information technology infrastructures inside and between
buildings shall be co-ordinated with all parties directly involved in the management of safety and EMI
(e.g. power supply, CATV, railways, tramways, lightning protection, etc).
4.2
Safety from electrical hazards
Equipment attached to information technology (IT) cabling shall be in accordance with EN 60950-1 or
EN 41003, as appropriate. The installation of protective earth conductors (PE) and equipotential
bonding conductors shall be in accordance with HD 60364-4-41, HD 60364-5-54 and EN 61140
(requirements for installations in buildings).
4.3
Segregation between information technology cabling and power supply cabling
See EN 50174-2.
4.4
Main earthing terminal (MET)
Each building shall be provided with a designated MET.

The entrance facilities for metallic information technology cables shall be placed as close as possible
to either the MET or designated points providing connections to the MET.
In order to minimize surge voltages and effects of surge currents in the building, the screens of all
cables entering the building shall be bonded to the MET via a low-impedance path, i.e. by the shortest
possible connection (see Figure 4, 5 and 6).
4.5
Signal reference
In order to maintain a good signal reference, emphasis should be placed on proper equipotential
bonding of both the information technology and the electricity distribution systems. Signalling via earth
return shall be avoided.
5
5.1
Application of earthing networks

General
Licensed copy:
This European Standard specifies requirements for earthing and bonding networks for all buildings
intended to accommodate information technology equipment within which it is recognised that:
a)
stray currents inevitably propagate in an earthing network;
b)
it is impossible to remove all sources of disturbances at a site;
c)
ground loops are inevitable (see 6.2.2);
BS EN 50310:2010
13
EN 50310:2010
d)
when an external magnetic field affects the site, e.g. a field produced by lightning, potential
differences are induced in the loops and currents flow in the earthing system and the efficacy of
the earthing network inside a building depends largely on the countermeasures taken outside the
building;
e)
currents flowing in a non-equipotential earthing network may generate electromagnetic

disturbances that affect equipment.
5.2
Requirements and recommendations
With reference to Figure 2, this European Standard recommends the implementation of a Type D,
meshed, earthing network meeting the requirements and recommendations of 6.5. However, this
European Standard addresses a range of alternative earthing networks, some of which are not
compatible with, or do not support the easy implementation of, a meshed earth network. These are
also shown in Figure 2 and described as follows:
a)
Type A: Star earthing network;
b)
Type B: Ring earthing network;
c)
Type C: Local mesh earthing network.
Licensed copy:
The minimum requirements for each type of earthing network are specified in Clause 6 as follows:
1)
Type A: Star see 6.2.1;
2)
Type B: Ring see 6.3.1;
3)
Type C: Local mesh see 6.4.1 and 6.6;
4)
Type D: Mesh see 6.5.1 and 6.6.
In addition, this European Standard provides recommendations for the improvement of these earthing
networks to protect information technology equipment and interconnecting cabling from electrical
hazards. The recommended improvements for each type of earthing network are specified in Clause 6
as follows:
Type A: Star see 6.2.2;
Type B: Ring see 6.3.2;
Type C: Local mesh see 6.4.2;
Type D: Mesh see 6.5.2.
5.3
Hierarchy of earthing network performance
Earthing networks are considered to be hierarchical as follows:

a)
an earthing network meeting the requirements of Type A is improved by the application of the
recommendations appropriate to that type of earthing network;
b)
a Type B earthing network provides better protection than a Type A earthing network and is
improved by the application of the recommendations appropriate to that type of earthing network;
c)
a Type C earthing network provides better protection than a Type B earthing network and is
improved by the application of the recommendations appropriate to that type of earthing network;
d)
a Type D earthing network provides better protection than a Type C earthing network and is
improved by the application of the recommendations appropriate to that type of earthing network.
BS EN 50310:2010
EN 50310:2010
14
For some applications, for example, in broadcast buildings, star and local mesh earthing networks
have advantages.
Licensed copy:
The solution applied in a particular building should follow a detailed risk assessment that takes the
following into consideration:
1)
the purpose of the building or specific areas of the building (noting that different parts of a building
may justify the use of different earthing network and additional bonding solutions as shown in
Figure 3);
2)
the cost (noting that subsequent improvements applied to an earthing network are more
expensive than the initial installation of solution of a higher hierarchical level).
BS EN 50310:2010
15
Earthing Name
network
type
EN 50310:2010
Minimum requirements
Recommended improvements
(thickened lines show additional bond
connections)
See 6.2.1
See 6.2.2
Star
or
Ring
See 6.3.1
See 6.3.2
Local
mesh
Bond connections at all mesh intersections
and between mesh and equipment
See 6.4.1
Licensed copy:
Figure 2 Examples of earthing networks
See 6.4.2
BS EN 50310:2010
EN 50310:2010
Earthing
network
type
Name
Mesh
16
Minimum requirements
Recommended improvements
(thickened lines show additional bond
connections)

and between mesh and equipm ent
See 6.5.1
Licensed copy:

See 6.5.2
Figure 2 Examples of earthing networks (continued)

Figure 3 Examples of area-specific earthing networks within premises
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EN 50310:2010
Earthing networks
6.1
General
It is possible to address bonding configurations at:

a)
a building level i.e. a common bonding network (CBN) or a meshed bonding network (MESH-BN);
b)
an installation level i.e. merging a CBN and MESH-BN;
c)
an equipment level i.e. MESH-BN.
Metallic components (e.g. MET, protective conductors (PE), metallic plumbing, structural steel,
reinforcement rods) shall be used, in accordance with national or local regulations, to construct a basic
CBN. Improved CBN performance is achieved by reducing the impedance and increasing the current
carrying capacity of the CBN by the use of additional conductive components either
1)
to create an improved earthing network type (see 5.3)

or
2)
implement the recommended improvements as indicated in Figure 2 and as detailed in this

clause for the existing type of earthing network.
For bonding configurations of telecommunication equipment at a building and installation level in a

subscriber's building, ETSI EN 300 253, ITU-T K.27 and ITU-T K.73 provide additional information.
For examples of simple CBN configurations for an information technology installation inside a building
see Figure 4 (for single items of equipment) and Figure 5 (for cabinets containing equipment).
Low impedance path; as short as possible (see 4.4).
Protective conductor (PE) to be routed in close proximity to signal cables to minimize loop area (see 6.2.2).
Functional earthing conductor (FE), e.g. signal earthing conductor, optional for equipment using earth return signalling.
NOTE If Network termination (NT) or Terminal equipment (TE) have non-conducting cases, then the PE is not connected to the
case.
Licensed copy:
Figure 4 Example of a simple common bonding network (CBN) configuration

(installation of network termination)
BS EN 50310:2010
Licensed copy:
EN 50310:2010
18
.
a
Optional for equipment using earth return signalling
Low impedance path; as short as possible (see 4.4)
The MET may be located in the main AC distribution board.
Figure 5 Example of a common bonding network (CBN) configuration

for an information technology installation inside a building
BS EN 50310:2010
EN 50310:2010
19
Licensed copy:
Surge protective device (SPD) in main distribution frame (MDF), if necessary
NOTE Although a -48 V supply is detailed, the principles shown may be applied to other DC supplies (voltage and polarity).
Figure 6 Example of an improved bonding network (CBN/MESH-BN)

installation inside a building
BS EN 50310:2010
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20
An extension of the information technology installation inside a building, e.g. information technology
systems situated on different floors and interconnected by metallic information technology cabling,
may require such a minimum CBN version to be augmented into a three dimensional grid structure,
approximating a Faraday cage (ETSI EN 300 253:2002, Figure 1).
A system block within an information technology system shall be provided with a bonding network
(BN) of the mesh type as shown in Figure 6. The impact EMI in an exposed location or the need for
information security may require the provision of shielded rooms as an additional requirement to the
CBN.
For a complex information technology installation a system reference potential plane (SRPP) as
shown in Figure 6 may be required to achieve satisfactory performance. Requirements for an SRPP
are specified in 6.6.
NOTE Although Figure 6 details a - 48 V supply, the principles shown may be applied to other DC supplies (voltage and
polarity).
6.2
Star earthing networks
6.2.1
Requirements
For the purposes of safety, the earthing networks shall meet national or local regulations for protective
earth (PE).
Each item of equipment shall be connected to the earth terminal by its own PE conductor as shown in
Figure 2 (minimum requirements, Type A).
6.2.2
Recommendations
Where the equipment served by the star earthing network is interconnected, the following problems
may result where the PE conductors are long or the items of equipment are some distance from each
other:
a)
a high common impedance between equipment (see Figure 7);
b)
large ground loops (see Figure 7);
c)
a poor equipotential state particularly at high frequencies.
This configuration makes electronic equipment more vulnerable to electromagnetic disturbances.

High
potential
difference
Disturbed cable
IMC
High impedance
if
PE conductor is long
Equipment
No.1
Signal
cable
High
potential
difference
Equipment
No.2
PE
Equipment
No.1
PE
z
Signal
cable
Equipment
No.2
PE
PE
Large loop
z
EM field
Licensed copy:
Figure 7 Example of high common impedance and large loop

Additional bonding conductors should be connected between the equipment in order to reduce both
the common impedance and the size, and resulting effect, of the relevant ground loop (see reduced
ground loop shown by shaded area in Figure 8). The bonding conductors to be used are specified in
7.1.2.
The recommended improvement for the star earthing network is shown in Figure 2 (Type A).
BS EN 50310:2010
21
EN 50310:2010
Low
potential
difference
Low
potential
difference
Disturbed cable
IMC
Equipment
No.1
Equipment
No.2
Equipment
No.1
PE
PE
z
Equipment
No.2
PE
PE
z
EM field
An additional bonding
conductor (C) reduces the
common impedance between
equipment
An additional bonding
conductor (C) reduces the area
of the sensitive loop
Figure 8 Example of low common impedance and small loop
6.3
Ring earthing networks
6.3.1
Requirements
Licensed copy:
earth (PE).
Each item of equipment shall be connected to the bonding ring conductor by its own PE conductor as
shown in Figure 2 (minimum requirements, Type B).
6.3.2
Recommendations
Multiple bonding conductors should not be attached to a single connection point (e.g. screw, bolt) due
to the risk of interruption of all connections during maintenance or repair. Bonding connections may
use existing or additional conductors. The bonding conductors to be used are specified in 7.1.2.
The recommended improvement for the ring earthing network is shown in Figure 2 (Type B).
In addition, it is recommended that bonding conductors should be connected between conductive
cable management systems and the bonding ring conductor. The bonding conductors to be used are
specified in 7.1.2.
6.4
Local mesh earthing networks
6.4.1
Requirements
earth (PE).
A local mesh requires all metallic parts in a restricted area within a building to be bonded to provide an
electrically continuous earthing network with low impedance and shall include:
a)
cabinets, frames and racks;
b)
conductive pathway systems;
c)
cable screens (the treatment of information technology cabling screens is specified in

EN 50174-2);
d)
bonding mats, where appropriate.
BS EN 50310:2010
EN 50310:2010
22
This shall be achieved by a combination of the following:

1)
the installation of additional bonding conductors;
2)
the improvement of finishing and fastening methods for existing bonding conductors.
Figure 9 shows a local mesh earthing network installed within both star and ring earthing networks.
Such earthing networks constitute local mesh isolated bonding networks (MESH-IBN).
There shall be a connection between the local mesh earthing network and the CBN including the main
earthing terminal.
PE
Local mesh earthing network
PE
PE
Local mesh
earthing network
PE
Bonding ring conduc tor
Figure 9 Local mesh earthing network

The maximum horizontal mesh size in each area shall be 6 m. The bonding conductors to be used are
specified in 7.1.2.
The pathways of metallic information technology cables within and between local mesh earthing
networks shall be routed along the elements of the CBN.
Specific areas within buildings may be subject to more stringent requirements that require the local
mesh earthing network to be improved either as recommended in 6.4.2 or to provide an SRPP (see
6.6).
6.4.2
Licensed copy:
PE
Recommendations
The information technology cabling at entry points to a local mesh earthing network should be located
in close proximity.
The electromagnetic interference from a local meshed earthing network reduces significantly as the
mesh size is reduced.
BS EN 50310:2010
23
EN 50310:2010
There should be multiple connections between the local mesh earthing network and the CBN including
the main earthing terminal.
Bonding connections between equipment and the earthing network should be in accordance with
7.1.5.
6.5
Meshed earthing networks
6.5.1
6.5.1.1
Requirements
General
earth (PE).
Licensed copy:
A mesh requires all metallic parts within large areas within, or all of, building to be bonded to provide a
mesh bonding network (MESH-BN) that provides an electrically continuous earthing network with low
impedance and shall include:
a)
cabinets, frames and racks;
b)
conductive pathway systems;
c)
cable screens (the treatment of information technology cabling screens is specified in

EN 50174-2);
d)
bonding mats, where appropriate.
This shall be achieved by a combination of the following:

1)
the installation of additional bonding conductors;
2)
the improvement of finishing and fastening methods for existing bonding conductors.
There shall be multiple points of connection between the MESH-BN and the CBN including the main
earthing terminal.
Figure 10 shows a mesh earthing network installed in a multi-floor building. For a detailed example of
the implementation principles of the MESH-BN concept see ETSI EN 300 253:2002, Figure 2.
BS EN 50310:2010
EN 50310:2010
24
Figure 10 Mesh earthing network (multi-floor)
The maximum horizontal mesh size in each area shall be 6 m. The bonding conductors to be used are
specified in 7.1.2.
The earthing networks on all relevant floors shall be interconnected by bonding conductors that are as
short as possible. The bonding conductors to be used are specified in 7.1.2.
The pathways of metallic information technology cables within and between local mesh earthing
networks shall be routed along the elements of the CBN.
Specific areas within buildings may be subject to more stringent requirements that require the mesh to
be improved either as recommended in 6.5.2 or to provide an SRPP (see 6.6).
6.5.1.2
Connection to other parts of equipotential bonding and earthing networks
Multiple bonding conductors should not be attached to a single connection point (e.g. screw, bolt) due
to the risk of interruption of all connections during maintenance or repair.
The merged MESH-BN and CBN in buildings shall include the interconnections to the following
installations, if present:
a)
integrated lightning protection system according to series EN 62305-4;
b)
equipotential bonding measures of antenna installations (including satellite receiving equipment

under private property) and cable networks according to series EN 60728 (and series EN 50083);
c)
equipotential bonding measures of information technology cabling according to EN 50174-2;
d)
equipotential bonding in hazardous areas, e.g. according to EN 60079-14.
6.5.2
Recommendations
Licensed copy:
The electromagnetic interference from a meshed earthing network reduces significantly as the mesh
size is reduced. The bonding conductors to be used are specified in 7.1.3.
Bonding connections between equipment and the earthing network should be in accordance with
7.1.5.
Specific areas within buildings may be subject to more stringent requirements that require the mesh to
be further improved to provide an SRPP (see 6.6).
BS EN 50310:2010
25
6.6
EN 50310:2010
SRPP
Where a complex installation (see Figure 6) is required, a reliable signal reference shall be provided
by an SRPP dedicated at least to a functional unit or a system block.
NOTE 1 Signal reference to the SRPP does not imply signal return via the SRPP.
The SRPP shall provide sufficiently low impedance up to the highest frequency considered in the
design of the equipment in order to:
a)
avoid undue functional distortion or risk of component failure;
b)
enable efficient connection of filters, cabinets and cable screens.
The frequency band to be covered shall include the spectral components of transients caused by
switching, short circuits and atmospheric discharges.
NOTE 2 Requirements for the protection against overvoltages and (or) atmospheric discharge are outside the scope of this
European Standard.
The design of the SRPP shall address the discharge of electrostatic energy.
recommendations are contained in EN 50174-1.
Requirements and
An SRPP is typically constructed using a metal plane or a meshed configuration having adequate
mesh dimensions, e.g. a bonding mat. Requirements for specific implementations of an SRPP using
raised floors and transient suppression plates are specified in 7.2.
The requirement to avoid emission of, or susceptibility to electromagnetic energy under normal
operating conditions may require properties of the SRPP beyond those stated in 4.5.
Bonding
7.1
7.1.1
7.1.1.1
Equipotential bonding conductors

General
Requirements
All protective earthing and equipotential bonding conductors shall comply with the safety requirements
according to HD 60364-5-54.
The design and installation of low impedance connections to the bonding conductors are unrestricted
but shall
a) be mechanically stable under the intended operational conditions (including inspection during
maintenance procedures);
b) protect the connection from oxidation;
Licensed copy:
c) take into account the requirements and recommendations of 7.3.

Where multiple bonding conductors are installed they shall be separated by at least 150 mm except
where physical constraints (e.g. points of connection or routes through building structures) force a
reduction of this separation. The lengths over which this separation is not provided shall be minimised.
7.1.1.2
Recommendations
Multiple bonds, including those using building structures, should be used rather than a single bond
since this reduces the impedance (inductance) of the resulting bond (see Figure 11).
BS EN 50310:2010
EN 50310:2010
26
Electrical
switchboard
Electronic
equipment
PE
Earthing
terminal
Electrical
switchboard
Recommended
Electronic
equipment
PE
Earthing
terminal
Metal beam of
building structure
Mesh bonding network
Figure 11 Mesh-BN example

7.1.2
6 m equivalent bonding conductors
The conductor (independent of cross-sectional area or shape) shall either

a)
be no greater than 6 m long, or
b)
consist of n conductors and shall be installed in accordance with 7.1.1.1.
NOTE Each design solution is assumed to provide an total inductance of 6 H maximum.
Where the conductor is used as part of a d.c. return path it shall comply with the requirements of
HD 60364-4-444.
7.1.3
3 m equivalent bonding conductors
Bonding conductors in accordance with this subclause automatically meet the requirements of 7.1.2.
Licensed copy:

a)
b)
HD 60364-4-444.
BS EN 50310:2010
27
7.1.4
7.1.4.1
EN 50310:2010
Bonding connections between information technology cabling infrastructure components

Requirements
Bonding conductors in accordance with this subclause automatically meet the requirements of 7.1.2
and 7.1.3.
a)
b)
HD 60364-4-444.
7.1.4.2
7.1.4.2.1
Recommendations
Performance
The conductor (independent of cross-sectional area or shape) should be no greater than 0,5 m long.
Where the length exceeds 0,5 m (due to the location of the points to be connected) this
recommendation is achieved by the use of n conductors where n = 2 x L (m) and the conductors are
installed in accordance with 7.1.1.1.
NOTE Each design solution is assumed to provide an total inductance of 0,5 H maximum.
Where the conductor is used as part of a d. c. return path it shall comply with the requirements of
HD 60364-4-444.
7.1.4.2.2
Construction
Suitable conductors include metal strips, metal braids or round cables may be used. However, only
metal strips or braids are recommended for high frequency performance as a circular conductor has a
higher impedance than a flat conductor with the same material cross section.
The length:width ratio of bonding conductors of the lengths specified in 7.1.4.1 and 7.1.4.2.1 should
not exceed 5:1 (see Figure 12).
a) Conformant (L < 5 W)
b) Non-conformant (L > 5 W)
Licensed copy:
Figure 12 Example of bonding straps
BS EN 50310:2010
EN 50310:2010
7.1.5
28
Bonding connections between information technology equipment and earthing networks
See 7.1.4.1 and 7.1.4.2 unless otherwise specified by the supplier of the equipment.
7.1.6
Cabinets, frames and racks
Equipotential bonding connections between the earthing network and all cabinets containing, or
intended to contain, information technology equipment or metallic information technology cable shall
be in accordance with the national or local regulation based on HD 60364.
In addition to requirements for safety, conductive items within a cabinet (e.g. doors, panels, shelves
and cable organisers) should be bonded to reduce electromagnetic interference radiating from the
cabinet, frame or rack.
In addition to the above requirements, the bonding conductor shall be in accordance with:
1)
7.1.2 for earthing networks in accordance with 6.2.2 and 6.3.2;
2)
7.1.3 for earthing networks in accordance with 6.4.2 and 6.5.2;
3)
7.1.2 for earthing networks in accordance with 6.4.1 and 6.5.1.
Licensed copy:
7.2
7.2.1
7.2.1.1
System Reference Potential Plane (SRPP)

Raised floors for SRPP
Requirements
The shielding effect provided above of a raised floor is a combination of the equipotential performance
of the designs of the frame ground grid and the raised floor.
If there is no contact between the flooring slabs (slabs with isolating or anti-static rubber seals), or if
the contact through support brackets is not guaranteed (pollution, corrosion, moisture, etc., or no
bracket at all), a frame ground grid shall be added by providing bonding the metal uprights as shown
in Figure 13.
The frame ground grid shall be installed with a maximum cell size of 2 m in each horizontal direction.
The minimum cross-sectional area of the conductors that create the frame ground grid shall be
10 mm. Spring-operated clamps may be used for connecting the metal uprights to the frame ground
grid.
The frame ground grid should be connected to the earthing network at multiple points.
If the raised floor is installed with a surface that is intended to provide protection against electrostatic
discharge, the DC resistance between the raised floor surface and the earthing grid shall be in the
range 1 M 10 M. The location and values of any DC resistance measurements made shall be
recorded for comparison with future measurements following any maintenance and/or repair activity
undertaken on the floor.
BS EN 50310:2010
29
EN 50310:2010
Raised floor
spring clamp
metal upright
10 mm
Figure 13 Example of raised floor

7.2.1.2
Recommendations
The frame ground grid should be installed with a maximum cell size of 1,5 m in each horizontal
direction.
For a floor designed to provide shielding performance, periodic maintenance is recommended to
ensure that its design performance is maintained following changes in operating environment (e.g.
levels of pollution, corrosion, moisture, etc) or following damage to the contact provided by the support
brackets.
For a floor designed to provide protection against electrostatic discharge, periodic maintenance with
proper cleaning, using selected chemicals (no wax) is recommended to ensure that:
a)
the d.c. resistance measurements already obtained and recorded as detailed in 7.2.1.1 are
maintained;
b)
any measurements at new locations are within the range detailed in 7.2.1.1.
7.2.2
Transient suppression plate (TSP)
The TSP is used as a potential reference on which all electromagnetic interference (EMI) suppression
components are bonded (filters, voltage suppressors, screens of screened cables, etc.) For example,
as shown in Figure 14, a metal plate of 1 m x 1 m (minimum) is intended to divert noise current to the
reinforcing steel in the concrete of the sub-floor under the raised floor.
Licensed copy:
Power supply cabl e

(AC or DC)
IT cable
Figure 14 Example of installation details for an under floor transient suppression plate
BS EN 50310:2010
EN 50310:2010
7.3
30
Corrosion
7.3.1
General
When surfaces of metals with different electro-chemical properties are connected together there will
be a galvanic potential between these surfaces. The rate of corrosion depends on this electrochemical potential between the two metals and the conditions under which contact is made. It is also
necessary to take into consideration the humidity and other environmental parameters in the vicinity of
the connection.
7.3.2
Requirements
EN 60950-1 contains a table that states the electro-chemical potentials for a variety of metals. Electrochemical potentials of 300 mV (maximum) maintain a low galvanic effect in a moderately corrosive
environment. However, lower potential differences are recommended in order ensure a low
impedance contact and a reliable electrical contact.
When interconnecting metal conductors, electro-chemically compatible metals shall be used to

minimise corrosion effects that may otherwise increase the impedance of the connection above its
design value. To minimise dissimilar metal corrosion, the following preventive measures shall be used:
a)
select metals which form a compatible couple (e.g. use nickel, not naval brass, in contact with
silver);
b)
interpose a metal which reduces the potential difference between the two metals (e.g. tin plate
brass to be used next to aluminium or use a tin or cadmium plated washer between a steel screw
in contact with aluminium);
c)
design the metal contact such that the relative area of the cathodic (more noble) metal is smaller
than that of the anodic metal (e.g. stainless steel screws in aluminium chassis);
d)
apply corrosion inhibitor such as zinc chromate primer or paste (e.g. use zinc chromate inhibitor
when assembling steel screws in aluminium).
When filters are used, care shall be paid to corrosion problems. The metallic filter cases shall have a
non-corroding surface in order to ensure a low contact resistance (approximately 100 ) of the case
to the interface with the victim apparatus throughout an extensive period of time.
The information technology cable termination on insulation transformers, surge protective devices or
systems shall be protected from corrosion, particularly if installed outside of a controlled environment.
Corroded contacts or cable termination affect the installed protection arrangements and increase the
impedance of the mechanical joint/connection to the building earthing arrangements.
Protection of any contact surfaces within any protection device installed in an outside environment
shall be assured.
8
8.1
8.1.1
DC power distribution systems

DC distribution system of secondary supply
General
Licensed copy:
The DC distribution system may take the form of DC-C or DC-I (see Table 2).
BS EN 50310:2010
31
EN 50310:2010
Table 2 Survey of DC electricity distribution system configurations with respect to EMC
8.1.2
No.
External distribution
Indoor installation
Remarks
DC-C
Not recommended for

EMC reasons
DC-I
Recommended for
EMC reasons
Requirements
The DC distribution system, if present, shall use L+ and L- conductors routed close together and
forming a DC-I-System. Therefore each DC return conductor serving an information technology
system shall only be connected to the L+ output of the power plant. The L+ output shall be bonded to
the CBN at least at the MET and at the service panel of the DC power plant and to the MESH-BN to at
least one point of the SRPP. The target is to avoid load currents on conductors of the equipotential
bonding system during normal operation.
The maximum DC voltage drop along each dedicated DC distribution return conductor shall be
dimensioned to be less than 1 V. The calculation shall take into account the maximum load current on
the associated supply conductor at maximum or minimum source voltage respectively under normal
operating conditions.
In practice this voltage drop will be substantially reduced in a DC-C-System by virtue of additional DC
return paths provided by the CBN. In a DC-I-System the voltage drop of DC return paths can not
cause any corrosion of a building by stray currents. It is recommended not to use the CBN or MESHBN solely as a return conductor.
NOTE 1 One purpose of this requirement is to avoid electrochemical corrosion by stray currents. In EN 50162:2004, Table 1, it
is clearly explained that corrosion of steel in buried concrete structures arises when voltage drops become 200 mV.
NOTE 2 To achieve a minimum voltage drop in spite of high currents in L+ and L- conductors, these should have sufficient
cross-sections, being important parts of the merged CBN/MESH-BN in DC-C-Systems. In DC-I-Systems the 3rd earthing
conductor achieves low impedance of the CBN/MESH-BN. In addition, since the parallel impedance of the equipment connected
to the conductors is low, the non-earthed L- conductor is further reducing the CBN/MESH-BN impedance.
NOTE 3 For the special arrangements of DC distribution of secondary supply see ETSI EN 300 253 and ETSI EG 201 147.
ETSI EG 201 147 provides guidance on all the interworking problems between DC-C/DC-C-, DC-C/DC-I-, and DC-I/DC-ISystems. As a result, there are no engineering precautions to be applied when using DC-I-Systems.
The DC return path in DC-C-Systems as well as the earthing path and the DC return path in DC-ISystems shall be capable of carrying over-currents in its entire length in the case of a fault between a
negative DC conductor of the secondary supply and the MESH-BN.
The DC return terminal of a power plant powering the information technology system(s) shall be
earthed at its DC service panel by a connection to the MET (see Figure 6).
For information about necessary agreements if, under exceptional conditions, DC return conductors of
a single equipment group cannot be integrated into the merged CBN/MESH-BN see Annex B.
Licensed copy:
8.2
DC distribution system of tertiary supply
The reference potential terminal of tertiary power supplies shall be connected to the MESH-BN at the
source only.
BS EN 50310:2010
EN 50310:2010
32
Power supply distribution systems
See HD 60364-4-444.
Table 3 provides information on the EMC characteristics of different electricity distribution systems.
Table 3 Survey of AC electricity distribution system configurations with respect to EMC
No.
External
distribution
TN-S
TN-S
Best electricity distribution system with

respect to EMC
2 a) TN-C
TN-S
Recommended
Recommended
Not recommended for EMC reasons
TN-S
TN-C
TN-C
3 a) TN-C
TN-C-S
3 b) TN-C
2 b) TN-C-S
TT
TN-C
at basement up to
main earthing
terminal
Remarks
Not recommended for EMC reasons

a
TN-S
Recommended
between floors and
at floors
TT
EMC covered for indoor installations

of information technology;
EMC not covered for interconnection
of buildings with information
technology;
to improve EMC performance a bypass equipotential bonding conductor
is required.
c
TT
An isolating transformer shall be

installed to realize TN-S.
Positive for EMC
IT
IT
This system is widely used isolated from

earth, in some installations in France,
with impedance to earth, at 230/440 V,
and in Norway, with a voltage limiter,
neutral not distributed, at 230 V line-toline.
What concerns EMC see remarks to
No. 4 (TT system).
IT
An isolating transformer shall be

installed to realize TN-S.
b
c
Licensed copy:
Indoor installation
Positive for EMC
TN-S systems for distribution purposes are used to be applied at premises between buildings or facilities where high EMC
quality is required with respect to operational necessities. Examples are groups of buildings with cable networks for
interactive services (see EN 50083 series [being partly replaced by EN 60728 series]), hospitals, broadcasting stations and
transmitters as well as telecommunication centres.
TN-C systems, in some countries, are used for public distribution systems and similar networks.
For isolating transformers (definition see EN 61558-1) a type with basic insulation between the separately arranged primary
and secondary windings is sufficient. For detailed information see EN 61558-2-1, EN 61558-2-4, EN 61558-2-5 and
EN 61558-26.
BS EN 50310:2010
33
EN 50310:2010
Annex A
(informative)
Rationale about common bonding network (CBN) co-ordination
In order to achieve adequate electromagnetic performance, the following aspects of the building
design require co-ordination:
a)
the complete extent of the building and all its ordinary metallic installations to be planned;
b)
the complete amount of information technology equipment to be installed in the building.
For new buildings, with respect to EMC, it is advantageous to provide adequate preconditions
constituting a common bonding network (CBN) by:
1)
a reliable foundation earth electrode system, i.e. a ring conductor immediately beneath the first
concrete bed;
Licensed copy:
NOTE This electrode system qualifies prior to a ring conductor along the outer perimeter of a building.
2)
welded joints of building steel or concrete reinforcement rods (see EN ISO 17660 series and
EN 62305-3) and a sufficient number of access terminals to these highly conductive elements;
3)
an enhanced outdoor lightning protection system (LPS) co-ordinated with the building structure
(see EN 62305-3);
4)
service pipes and air-conditioning ducts interconnected according to the CBN strategy, including
potential equalisation in excess of safety regulations;
5)
electricity distribution system as required for the TN-S system, i.e. without any PEN section
downstream from the MET and regardless of the distribution system principle applied to the
electricity distribution section upstream.
Information technology equipment which is designed in accordance to this European Standard can be
installed and interconnected to the CBN as outlined above.
Some existing buildings do not provide a CBN sufficient to meet the operational requirements. When a
decision is made to extend or replace existing information technology installations in such buildings,
the objective should be to move towards a CBN by enhancements.
Besides the fact that such enhancements require consultation on-site, two subjects can be addressed
in general:
an outdoor LPS may be installed at first according to EN 62305-3 including a ring conductor as an
essential member of the earthing network. The LPS may be improved with conductive roof layers,
closely spaced down conductors or application of metallic facades;
unacceptable conductive interference from the outdoor electricity distribution section can be
mitigated by a separation transformer dedicated to the building or by an equivalent measure. An
indoor installation according to the rules of the IT system or TT system can be upgraded by
additional protective conductors (PE) and dedicated equipotential bonding conductors, thereby
reducing the mesh width. A residual current protection may also be adapted if necessary.
An existing CBN can be augmented by the information technology installation regarding dedicated ring
conductors per room and floor, cable management systems and any other supporting metal work. In
contrast to the traditional practice to indulge into a restricted number of conductors with enlarged cross
sectional area, it is recommended to aim at a large conductive surface, e.g. by providing bonding at
both side bars, at joints within the run of a ladder type cable rack.
BS EN 50310:2010
EN 50310:2010
34
Annex B
(informative)
Rationale for the integration of DC distribution systems
into the merging of common bonding network (CBN) and
meshed bonding network (MESH-BN)
For the integration of the DC return conductor of DC-C-systems see 6.1 and 8.1. When existing
equipment requires replacement, it is essential that equipment design and installation conforms to a
single standard without ambiguity (e.g. only DC-C-systems or DC-I-systems). Agreement to this aim is
stated in the Foreword of this European Standard.
It is recognised that in existing DC-C-installations groups of equipment may be operated with
isolated DC return conductors, whereby isolated denotes the application of the DC-I principle
(3-wire system) addressed in Recommendation ITU-T K.27 (see also ETSI EN 300 253 and
ETSI EG 201 147).
Licensed copy:
If the design of such equipment allows for operation with isolated DC return conductors, the existing
installation should be adapted to this European Standard (DC-I-system). There are no engineering
precautions required (see ETSI EG 201 147).
If the operation of such equipment requires the existing DC-C-installation to be unchanged,
precautions have to be taken to facilitate the desired inter system signal exchange and compliance to
other EMC requirements.
Selection of such precautions shall take into account:
a)
inter system signal exchange by isolated and symmetrically operated circuitry;
b)
routing of cables with screens via a common bonding point, located as close as possible to the
MET, e.g. the main distribution frame, if transmission parameters allow for an additional length of
the transmission path;
c)
appropriate conductor arrangements in parallel to the inter system cabling route with minimized
length dictated by transmission requirements, i.e. provision of screening and potential
equalization simultaneously;
d)
upgrading of the current conducting capability of the drain path for short circuit currents, i.e.
provision of dedicated conductors without the steady state DC return function.
BS EN 50310:2010
35
EN 50310:2010
Bibliography
EN 50098-1, Customer premises cabling for Information Technology Part 1: ISDN basic access
EN 50098-2, Customer premises cabling for Information Technology Part 2: 2048 kbit/s ISDN
primary access and leased line network interface
EN 50173 (series), Information technology Generic cabling systems
EN 50346, Information technology Cabling installation Testing of installed cabling
EN 60990, Methods of measurement of touch current and protective conductor current
(IEC 60990:1999)
EN 61558-1, Safety of power transformers, power supplies, reactors and similar products
Part 1: General requirements and tests (IEC 61558-1)
EN 61558-2-1, Safety of power transformers, power supplies, reactors and similar products
Part 2-1: Particular requirements and tests for separating transformers and power supplies
incorporating separating transformers for general applications (IEC 61558-2-1)
EN 61558-2-4, Safety of transformers, reactors, power supply units and similar products for supply
voltages up to 1 100 V Part 2-4: Particular requirements and tests for isolating transformers and
power supply units incorporating isolating transformers (IEC 61558-2-4)
EN 61558-2-5, Safety of power transformers, power supply units and similar Part 2-5: Particular
requirements for shaver transformers and shaver supply units (IEC 61558-2-5)
EN 61558-2-6, Safety of transformers, reactors, power supply units and similar products for supply
voltages up to 1 100 V Part 2-6: Particular requirements and tests for safety isolating transformers
and power supply units incorporating safety isolating transformers (IEC 61558-2-6)
EN 62305-3, Protection against lightning Part 3: Physical damage to structures and life hazard
(IEC 62305-3, mod.)
ETSI EN 300 253:2002, Environmental Engineering (EE); Earthing and bonding of telecommunication
equipment in telecommunication centres
ETSI EG 201 147:1998, Equipment Engineering (EE); Interworking between Direct Current/Isolated
(DC/I) and Direct Current/Common (DC/C) electrical power systems
EN ISO 17660-1, Welding Welding of reinforcing steel Part 1: Load bearing welded joints
(ISO 17660-1)
EN ISO 17660-2, Welding Welding of reinforcing steel Part 2: Non-load bearing welded joints
(ISO 17660-2)
IEC 62368-1, Audio/video, information and communication technology equipment Part 1: Safety
requirements
ITU-T Recommendation K.27:1996, Bonding configurations and earthing inside a telecommunication
building
ITU-T Recommendation K.73:2008, Shielding and bonding for cables between buildings
Licensed copy:
ITU-T Handbook, Earthing and bonding (Geneva 2003)
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BS EN 50310-2010 Bonding

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BS EN 50310:2010

Licensed copy:An Nhien

, 26/11/2010, Uncontrolled Copy, BSI

BSI Standards Publication

NO COPYING WITHOUT BSI PERMISSION EXCEPT AS PERMITTED BY COPYRIGHT LAW

raising standards worldwide

Licensed copy:An Nhien

, 26/11/2010, Uncontrolled Copy, BSI

Compliance with a British Standard cannot confer immunity from

Application of equipotential bonding and earthing in buildings with

, 26/11/2010, Uncontrolled Copy, BSI

Application de liaison quipotentielle et de

Anwendung von Manahmen fr Erdung

European Committee for Electrotechnical Standardization

latest date by which the EN has to be implemented

, 26/11/2010, Uncontrolled Copy, BSI

This European Standard supersedes EN 50310:2006.

Information Technology equipment is generally installed either as stand-alone equipment (e.g.

compliance of the Information Technology Equipment installation with functional

compatible building installation and equipment provisions,

installation of new equipment in buildings as well as expansion or replacement of

a structured installation practice,

simple maintenance rules,

contracting on a common basis,

harmonisation in development, manufacturing, installation and operation.

Scope and conformance . ..............................................................................................................8

Normative references . ...................................................................................................................9

Terms, definitions, abbreviations and symbols . ........................................................................9

, 26/11/2010, Uncontrolled Copy, BSI

Power supply distribution systems . ..........................................................................................32

, 26/11/2010, Uncontrolled Copy, BSI

provide the information technology installation with:

a reliable signal reference;

adequate immunity from electromagnetic interference carried by the earthing network.

, 26/11/2010, Uncontrolled Copy, BSI

This document is intended for:

building architects, owners and managers;

designers and installers of electrical and information technology cabling installations.

generic cabling design (EN 50173 series);

application dependent cabling design (e.g. EN 50098 series);

testing of installed cabling (EN 50346);

this European Standard (EN 50310).

EN 50098-1: Customer premises

EN 50173-2: Information technology:

EN 50173-1: Information technology:

EN 50173-5: Information technology:

EN 50174-1: Information technology

EN 50310: Application of equipotential

, 26/11/2010, Uncontrolled Copy, BSI

EN 50174-2: Information technology Cabling installation - Installation

EN 50174-3: Information technology Cabling installation - Installation

EN 50346: Information technology Cabling installation Testing of installed cabling

Figure 1 Schematic relationship between EN 50310 and other relevant standards

Table 1 Contextual relationship between EN 50310 and other relevant standards

, 26/11/2010, Uncontrolled Copy, BSI

Scope and conformance

reliable signal reference,