TMC 249/A - Data Sheet
TMC 249/A - Data Sheet
TMC 249/A - Data Sheet
Features
The TMC249 / TMC249A (1) is a dual full bridge driver IC for bipolar stepper motor control
applications. The TMC249 is realized in a HVCMOS technology and directly drives eight external LowRDS-ON high efficiency MOSFETs. It supports more than 6000mA coil current. The low power
dissipation makes the TMC249 an optimum choice for drives, where a high reliability is desired. With
additional drivers, motor current and voltage can be increased. The integrated unique sensorless stall
detection (pat. pend.) StallGuard makes it a good choice for applications, where a reference point is
needed, but where a switch is not desired. Its ability to predict an overload makes the TMC249 an
optimum choice for drives, where a high reliability is desired. Internal DACs allow microstepping as
well as smart current control. The device can be controlled by a serial interface (SPIi) or by analog /
digital input signals. Short circuit, temperature, undervoltage and overvoltage protection are
integrated.
(1) The term TMC249 in this datasheet always refers to the TMC249A and the TMC249. The major
differences in the older TMC249 are explicitly marked with non-A-type. The TMC249A brings a
number of enhancements and is fully backward compatible to the TMC249.
FEATURES ............................................................................................................................................1
PINNING.................................................................................................................................................5
PACKAGE CODES ...................................................................................................................................5
SO28 DIMENSIONS ...............................................................................................................................6
QFN32 DIMENSIONS .............................................................................................................................6
APPLICATION CIRCUIT / BLOCK DIAGRAM .....................................................................................7
PIN FUNCTIONS .....................................................................................................................................7
SELECTING POWER TRANSISTORS .................................................................................................8
LIST OF RECOMMENDED TRANSISTORS ...................................................................................................8
LAYOUT CONSIDERATIONS ...............................................................................................................9
USING ADDITIONAL POWER DRIVERS ...........................................................................................10
CONTROL VIA THE SPI INTERFACE ................................................................................................11
SERIAL DATA WORD TRANSMITTED TO TMC249 ....................................................................................11
SERIAL DATA WORD TRANSMITTED FROM TMC249................................................................................11
TYPICAL MOTOR COIL CURRENT VALUES ...............................................................................................12
BASE CURRENT CONTROL VIA INA AND INB IN SPI MODE ......................................................................12
CONTROLLING THE POWER DOWN MODE VIA THE SPI INTERFACE ...........................................................12
OPEN LOAD DETECTION .......................................................................................................................13
STANDBY AND SHUTDOWN MODE ..........................................................................................................13
POWER SAVING ...................................................................................................................................13
STALL DETECTION ............................................................................................................................14
USING THE SENSORLESS LOAD MEASUREMENT .....................................................................................14
IMPLEMENTING SENSORLESS STALL DETECTION ....................................................................................14
PROTECTION FUNCTIONS................................................................................................................15
OVERCURRENT PROTECTION AND DIAGNOSIS ........................................................................................15
OVERTEMPERATURE PROTECTION AND DIAGNOSIS ................................................................................15
OVERVOLTAGE PROTECTION AND ENN PIN BEHAVIOR ...........................................................................15
CHOPPER PRINCIPLE........................................................................................................................16
CHOPPER CYCLE / USING THE MIXED DECAY FEATURE ...........................................................................16
BLANK TIME ........................................................................................................................................16
BLANK TIME SETTINGS .........................................................................................................................16
CLASSICAL NON-SPI CONTROL MODE (STAND ALONE MODE) ................................................17
PIN FUNCTIONS IN STAND ALONE MODE .................................................................................................17
INPUT SIGNALS FOR MICROSTEP CONTROL IN STAND ALONE MODE ..........................................................17
UNIPOLAR OPERATION ....................................................................................................................18
DIFFERENCES OF SHORT CIRCUIT BEHAVIOR IN UNIPOLAR OPERATION MODE ...........................................18
DIFFERENCES IN CHOPPER CYCLE IN UNIPOLAR OPERATION MODE .........................................................18
CALCULATION OF THE EXTERNAL COMPONENTS......................................................................19
SENSE RESISTOR ................................................................................................................................19
EXAMPLES FOR SENSE RESISTOR SETTINGS ..........................................................................................19
HIGH SIDE OVERCURRENT DETECTION RESISTOR RSH ............................................................................19
MAKING THE CIRCUIT SHORT CIRCUIT PROOF.........................................................................................20
OSCILLATOR CAPACITOR .....................................................................................................................21
TABLE OF OSCILLATOR FREQUENCIES ...................................................................................................21
PULL-UP RESISTORS ON UNUSED INPUTS ..............................................................................................21
POWER SUPPLY SEQUENCING CONSIDERATIONS....................................................................................21
SLOPE CONTROL RESISTOR ................................................................................................................22
Copyright 2005, TRINAMIC Motion Control GmbH & Co KG
VCC
20
GND
19
VS
18
VT
17
BL2
LB1
14
15
HB2
10
11
12
13
14
15
16
BL1
HB1
SPE
16
ENN
13
SCK
LB2
SRB
CSN
12
LB2
SDI
SRB
LA2
SRA
SDO
11
LB1
OSC
BL1
LA1
TMC 249-LA
10
HA2
SPE
HB2
HA1
HB1
ENN
BL2
24
21
CSN
23
INB
VT
22
22
SCK
ANN
25
21
INA
26
20
23
SDI
AGND
27
19
SLP
28
18
AGND
24
29
17
25
OSC
SDO
VS
30
GND
31
GND
INA
32
INB
ANN
VCC
HA1
26
LA2
SRA
HA2
27
28
LA1
SLP
Pinning
Top view
Note: Cooling plane on -LA type should be connected to GND or left open.
Package codes
Type
TMC249A (2)
TMC249
TMC249A (2)
Package
SO28
SO28
QFN32, 7*7mm
Temperature range
automotive (1)
automotive (1)
automotive (1)
Lead free
Yes
From date code 05/05
Yes
Code/marking
TMC249A-SA
TMC249-SA
TMC249A-LA
(1) ICs are not tested according to automotive standards, but are usable within the complete
automotive temperature range.
(2) These devices are available in a reduced offset voltage selection grade, marked with an additional
dot.
SO28 Dimensions
REF
A
B
C
D
E
F
G
H
I
K
MIN
10
17.7
7.4
MAX
10.65
18.1
7.6
1.4
2.65
0.25
0.1
0.3
0.36
0.49
0.4
1.1
1.27
0.80
A1
0.00
0.90
1.00
0.02
0.05
-B-
0.20
7.0
7.0
0.15
2
1
RADIUS
D2
5.00
5.15
5.25
E2
5.00
5.15
5.25
0.45
0.55
0.65
0.25
0.30
0.35
aaa C 2x
N N-1
TOP VIEW
ccc C
NX
0.08 C
SEATING
PLANE
SIDE VIEW
0.65
-C-
A3
0.03
D/2
INDEX AREA
(D/2 xE/2)
aaa C 2x
L1
MAX
A3
NOM
E/2
MIN
A1
REF
-A-
QFN32 Dimensions
D2
D2/2
-B-
INDEX AREA
(D/2 xE/2)
L1
2
1
N N-1
NXb
6
SEE
DETAIL B
-A-
SEE
DETAIL B
E2
E2/2
NXL
Datum A or B
ddd
BTM VIEW
bbb
e/2
C A B
C
Terminal Tip
DETAIL B
BL1
BL2
220nF
VS
TMC249
OSC
OSC
HA1
Current Controlled
Gate Drivers
PWM-CTRL
+VCC
Undervoltage
100nF
Temperature
HA2
[PHB]
SDO
Parallel
Control
[ERR]
CSN
LA1
RS
Load
mesurement
SDI
[PHA]
SPIInterface
SCK
P
Coil A
LA2
SRA
[MDBN]
RSH
VT
1nF
VCC
100F
DAC
1
INA
REFSEL
VREF
DAC
INB
SRB
RS
PWM-CTRL
Current Controlled
Gate Drivers
LB1
ENN
VCC/2
REFSEL
LB2
N
Coil B
HB2
HB1
SPE
ANN
AGND
GND
SLP
[MDAN]
stand alone mode
RSLP
[...]: function in stand alone mode
Pin Functions
Pin
Function
Pin
Function
VS
VT
VCC
AGND
INA
INB
SCK
SDO
SDI
CSN
ENN
ANN
BL1, BL2
SRA, SRB
Outputs for
transistors
low
side
N-channel
Package
(#Trans)
TO252-4
(1N,1P)
PPack
(1N,1P)
SO8
(1N,1P)
SO8
(1N,1P)
SO8
(1N,1P)
SO8
(1N,1P)
SO8
(1N,1P)
SO8
(1N,1P)
MLP
(1N,1P)
1206-8
(1N,1P)
SM8
(2N,2P)
SO8
(1N,1P)
RDSON
[Ohm]
0.023
0.045
0.035
0.055
0.023
0.050
0.023
0.050
0.040
0.060
0.055
0.080
0.075
0.130
0.075
0.280
0.120
0.250
0.090
0.170
0.120
0.250
0.045
0.120
Total gate
charge [nC]
10
10
5.5
8.0
7.0
7.0
7.0
7.0
7.5
9.0
4.5
6.5
2.9
3.0
4.5
4.0
2.8
2.5
3.0
3.2
2.8
2.5
11
10
Typical maximum
Remark
application current
6000mA
(1)
(2)
4200mA
(1)
4000mA
(1)
(2)
4000mA
(2)
3500mA
3000mA
5000mA (2 parallel)
2800mA
5000mA (2 parallel)
2500mA
(3)
(3)
2300mA
4400mA (2 parallel)
2000mA
very
small! (3)
very
small!
2000mA
only 2
packages!
3000mA
2500mA (at 48V)
(4)
(1) These P-channel transistors have a very high drain to gate capacity, which may introduce
destructive current impulses into the HA/HB outputs by forcing them above the power supply level,
depending on the low-side slope. To ensure reliability, connect one MSS1P3 or ZHCS1000 or an
SS14 1A schottky diode or similar to both HA and HB outputs against VS to protect them.
(2) Compare (1), but for N-channel transistor. Protect LA/LB outputs with one schottky diode to GND.
(3) Higher current with two devices in parallel, i.e. using 8 double transistors instead of four.
(4) See application note document for simple extension to operate at up to 58V.
Layout Considerations
For optimal operation of the circuit a careful board layout is important, because of the combination of
high current chopper operation coupled with high accuracy threshold comparators. Please pay special
attention to massive grounding. Depending on the required motor current, either a single massive
ground plane or a ground plane plus star connection of the power traces may be used. The schematic
shows how the high current paths can be routed separately, so that the chopper current does not flow
through the systems GND-plane. Tie the TMC249s AGND and GND to the GND plane. Additionally,
use enough filtering capacitors located near to the boards power supply input and small ceramic
capacitors near to the power supply connections of the TMC249. Use low inductance sense resistors,
or add a ceramic capacitor in parallel to each resistor to avoid high voltage spikes. In some
applications it may become necessary to
optional voltage
introduce additional RC-filtering into the SRA /
divider
VS
SRB line, as shown in the schematic, to prevent
spikes from triggering the short circuit
100nF
R
VT
protection or the chopper comparator. If you
+VM
100R
want to take advantage of the thermal
GND
protection and diagnosis, ensure, that the
TMC249/
Bridge A
Bridge B
optional filter
power transistors are very close to the
TMC239A
SRA
C
package, and that there is a good thermal
100R
SRB
contact between the TMC249 and the external
R
R
100R
transistors. Please be aware, that long or thin
3.3 GND
10nF
traces to the sense resistors may add
AGND
GNDsubstantial resistance and thus reduce output
Plane
current. The same is valid for the high side
shunt resistor. Place the optional shunt resistor voltage divider near the TMC249, in order to avoid
voltage drop in the VCC plane to add up to the measured voltage.
RSH
DIV
VM
SA
SB
10
1K
VS
VT
C-Pump
20kHz
ICM7555
CDHS
470p
HA1
22K
1F
2n2
12V
HS-Driver
390R
1K
TMC249/
TMC239
to other
bridges
Coil
LA1
LSDriver
390R
CDLS
470p
IR2101
SRA
RS
100R
4.7nF
opt.
SLP
Set HS and LS
current to 10mA
10K
+VS 7..15V
+VM 20..60V
VS
1K
VCC
120R
1/2 74HC244
on high side
VT
P
1K
CDHS
HA1
LM337
HV
390R
OUT
/OE
GND
VM-5.2V
IN
TMC249/
TMC239
100R
ADJ
+5V
Coil
VCC
1/2 74HC244
on low side
LA1
1K
CDLS
100R
/OE
GND
SRA
RS
SLP
15K
11
Name
Function
Remark
11
MDA
1 = mixed decay
10
CA3
MSB
CA2
CA1
CA0
LSB
PHA
polarity bridge A
MDB
1 = mixed decay
CB3
MSB
CB2
CB1
CB0
LSB
PHB
polarity bridge B
Name
Function
Remark
11
LD2
MSB
10
LD1
LD0
always 1
OT
overtemperature
UV
driver undervoltage
1 = undervoltage on VS
OCHS
OLB
OLA
OCB
OCA
LSB
1 = chip off due to overtemperature
12
0000
0%
0V
0001
6.7%
23 mV
0010
13.3%
45 mV
...
...
1110
93.3%
317 mV
1111
100%
340 mV
The current values correspond to a standard 4 Bit DAC, where 100%=15/16. The contents of all
registers is cleared to 0 on power-on reset or disable via the ENN pin, bringing the IC to a low power
standby mode. All SPI inputs have Schmitt-Trigger function.
Base current control via INA and INB in SPI mode
In SPI mode, the IC can use an external reference voltage for each DAC. This allows the adaptation to
different motors. This mode is enabled by tying pin ANN to GND. A 2.0V input voltage gives full scale
current of 100%. In this case, the typical trip voltage of the current sense comparator is determined by
the input voltage and the DAC current setting (see table above) as follows:
VTRIP,A = 0.17 VINA percentage SPI current setting A
VTRIP,B = 0.17 VINB percentage SPI current setting B
A maximum of 3.0V VIN is possible. Multiply the percentage of base current setting and the DAC table
to get the overall coil current. It is advised to operate at a high base current setting, to reduce the
effects of noise voltages. This feature allows a high resolution setting of the required motor current
using an external DAC or PWM-DAC (see schematic for examples).
using PWM signal
2 level control
INA
CPort .2
100K
R1
51K
47K
R2
INB
100nF
CPort .1
10nF
100K
51K
AGND
+VCC
CPWM
CPort .0
100K
CPort
51K
ANN
Bit
Standard
function
Control
word
function
11
10
MxA CA3 CA2 CA1 CA0 PhA MxB CB3 CB2 CB1 CB0 PhB
Programming current value 0000 for both coils at a time clears the overcurrent flags and switches
the TMC249 into a low current standby mode with coils switched off.
13
14
Stall Detection
Using the sensorless load measurement
The TMC249 provides a patented sensorless load measurement, which allows a digital read out of the
mechanical load on the motor via the serial interface. To get a readout value, just drive the motor
using sine commutation and mixed decay switched off. The load measurement then is available as a
three bit load indicator during normal motion of the motor. A higher mechanical load on the motor
results in a lower readout value. The value is updated once per fullstep.
The load detection is based on the motors back EMF, thus the level depends on several factors:
- Motor velocity: A higher velocity leads to a higher readout value
- Motor resonance: Motor resonances cause a high dynamic load on the motor, and thus
measurement may give unsatisfactory results.
- Motor acceleration: Acceleration phases also produce dynamic load on the motor.
- Mixed decay setting: For load measurement mixed decay has to be off for some time before
the zero crossing of the coil current. If mixed decay is used, and the mixed decay period is
extended towards the zero crossing, the load indicator value decreases.
Implementing sensorless stall detection
The sensorless stall detection typically is used, to detect the reference point without the usage of a
switch or photo interrupter. Therefore the actuator is driven to a mechanical stop, e.g. one end point in
a spindle type actuator. As soon as the stop is hit, the motor stalls. Without stall detection, this would
give an audible humming noise and vibrations, which could damage mechanics.
To get a reliable stall detection, follow these steps:
1. Choose a motor velocity for reference movement. Use a medium velocity which is far enough
away from mechanical resonance frequencies. In some applications even motor start / stop
frequency may be used. With this the motor can stop within one fullstep if a stall is detected.
2. Use a sine stepping pattern and switch off mixed decay (at least 1 to 3 microsteps before zero
crossing of the wave). Monitor the load indicator during movement. It should show a stable
readout value in the range 3 to 7 (LMOVE). If the readout is high (>5), the mixed decay portion
may be increased, if desired.
3. Choose a threshold value LSTALL between 0 and LMOVE - 1.
4. Monitor the load indicator during each reference search movement, as soon as the desired
velocity is reached. Readout is required at least once per fullstep. If the readout value at one
fullstep is below or equal to LSTALL, stop the motor. Attention: Do not read out the value within
one chopper period plus 8 microseconds after toggling one of the phase polarities!
5. If the motor stops during normal movement without hitting the mechanical stop, decrease
LSTALL. If the stall condition is not detected at once, when the motor stalls, increase LSTALL.
v(t)
a_
m
ax
v_max
load
indicator
acceleration
constant velocity
max
stall
LMOVE
LSTALL
stall threshold
min
acceleration
jerk
stall detected!
vibration
15
Protection Functions
Overcurrent protection and diagnosis
The TMC249 uses the current sense resistors on the low side to detect an overcurrent: Whenever a
voltage above 0.61V is detected, the PWM cycle is terminated at once and all transistors of the bridge
are switched off for the rest of the PWM cycle. The error counter is increased by one. If the error
counter reaches 3, the bridge remains switched off for 63 PWM cycles and the error flag is read as
active. The user can clear the error condition in advance by clearing the error flag. The error counter
is cleared, whenever there are more than 63 PWM cycles without overcurrent. There is one error
counter for each of the low side bridges, and one for the high side. The overcurrent detection is
inactive during the blank pulse time for each bridge, to suppress spikes which can occur during
switching.
The high side comparator detects a short to GND or an overcurrent, whenever the voltage between
VS and VT becomes higher than 0.15 V at any time, except for the blank time period which is logically
ORed for both bridges. Here all transistors become switched off for the rest of the PWM cycle,
because the bridge with the failure is unknown.
The overcurrent flags can be cleared by disabling and re-enabling the chip either via the ENN pin or
by sending a telegram with both current control words set to 0000. In high side overcurrent
conditions the user can determine which bridge sees the overcurrent, by selectively switching on only
one of the bridges with each polarity (therefore the other bridge should remain programmed to
0000).
Overtemperature protection and diagnosis
The circuit switches off all output power transistors during an overtemperature condition. The overtemperature flag should be monitored to detect this condition. The circuit resumes operation after cool
down below the temperature threshold. However, operation near the overtemperature threshold
should be avoided, if a high lifetime is desired.
Overvoltage protection and ENN pin behavior
During disable conditions the circuit switches off all output power transistors and goes into a low
current shutdown mode. All register contents is cleared to 0, and all status flags are cleared. The
circuit in this condition can also stand a higher voltage, because the voltage then is not limited by the
maximum power MOSFET voltage. The enable pin ENN provides a fixed threshold of VCC to allow a
simple overvoltage protection up to 40V using an external voltage divider (see schematic).
+VM
R1
ENN
R2
C-Port (opt.)
low=Enable,
high=Disable
16
Chopper Principle
Chopper cycle / Using the mixed decay feature
The TMC249 uses a quiet fixed frequency chopper. Both coils are chopped with a phase shift of 180
degrees. The mixed decay option is realized as a self stabilizing system (pat. fi.), by shortening the
fast decay phase, if the ON phase becomes longer. It is advised to enable the mixed decay for each
phase during the second half of each microstepping half-wave, when the current is meant to
decrease. This leads to less motor resonance, especially at medium velocities. With low velocities or
during standstill mixed decay should be switched off. In applications requiring high resolution, or using
low inductivity motors, the mixed decay mode can also be enabled continuously, to reduce the
minimum motor current which can be achieved. When mixed decay mode is continuously on or when
using high inductivity motors at low supply voltage, it is advised to raise the chopper frequency to
36kHz, because the half chopper frequency could be audible under these conditions.
target current phase A
actual current phase A
on
slow decay
on
fast decay
slow decay
oscillator clock
resp. external clock
When polarity is changed on one bridge, the PWM cycle on that bridge becomes restarted at once.
Fast decay switches off both upper transistors, while enabling the lower transistor opposite to the
selected polarity. Slow decay always enables both lower side transistors.
Blank Time
The TMC249 uses a digital blanking pulse for the current chopper comparators. This prevents current
spikes, which can occur during switching action due to capacitive loading, from terminating the
chopper cycle. The lowest possible blanking time gives the best results for microstepping: A long
blank time leads to a long minimum turn-on time, thus giving an increased lower limit for the current.
Please remark, that the blank time should cover both, switch-off time of the lower side transistors and
turn-on time of the upper side transistors plus some time for the current to settle. Thus the complete
switching duration should never exceed 1.5s. With slow external power stages it will become
necessary to add additional RC-filtering for the sense resistor inputs.
The TMC249 allows to adapt the blank time to the load conditions and to the selected slope in four
steps (the effective resulting blank times are about 200ns shorter in the non-A-type):
Blank time settings
BL2
BL1
GND
GND
0.6 s
GND
VCC
0.9 s
VCC
GND
1.2 s
VCC
VCC
1.5 s
17
Stand alone
mode name
SPE
(GND)
ANN
MDAN
SCK
MDBN
SDI
PHA
CSN
PHB
SDO
ERR
ENN
ENN
Standby mode (high active), high causes a low power mode of the device.
Setting this pin high also resets all error conditions.
INA,
INB
INA,
INB
Current control for bridge A, resp. bridge B. Refer to AGND. The sense
resistor trip voltage is 0.34V when the input voltage is 2.0V. Maximum input
voltage is 3.0V.
INA
INB
90
180
270
360
PHA
(SDI)
PHB
(CSN)
MDAN
(ANN)
MDBN
(SCK)
Use dotted line to improve performance
at medium velocities
18
Unipolar Operation
The TMC249 can also be used in an unipolar motor application with microstepping. In this
configuration, only the four upper power transistors are required.
Differences of short circuit behavior in unipolar operation mode
Since there is no possibility to disable a short to VS condition, the circuit is not completely short circuit
proof. In a low cost application a motor short would be covered, just using the bottom sense resistors
(see schematic).
Differences in chopper cycle in unipolar operation mode
In unipolar mode, one of the upper side transistors is chopped, depending on the phase polarity. Slow
decay mode always means, that both transistors are disabled. There is no difference between slow
and fast decay mode, and the mixed decay control bits are dont care. The transistors have to stand
an off voltage, which is slightly higher than the double of the supply voltage. Voltage decay in the coil
can be adapted to the application by adding additional diodes and a zener diode to feed back coil
current in flyback conditions to the supply.
+VM
HA1
HA2
TMC249/
TMC239
One coil of
the motor
LA2
LA1
SRA
RS
19
RS
0.47
0.33
0.22
0.15
0.10
However, if the user desires to use higher resistance values, a voltage divider in the range of 10 to
100 can be used for VT. This might also be desired to limit the peak short to GND current, as
described in the following chapter.
Attention: A careful PCB layout is required for the sense resistor traces and for the RSH traces.
20
VS
RDIV
RSH
100nF
VT
+VM
100R
GND
RSH=RSA=RSB
RDIV values for
Microstep:
Fullstep:
internal
reference
27R
18R
INA/INB
up to3V
18R
12R
CVM
SRA
100R
SRB
100R
RSA
RSB
GND
21
Oscillator Capacitor
The PWM oscillator frequency can be set by an external capacitor. The internal oscillator uses a 28k
resistor to charge / discharge the external capacitor to a trip voltage of 2/3 Vcc respectively 1/3 Vcc. It
can be overdriven using an external CMOS level square wave signal. Do not set the frequency higher
than 100kHz and do not leave the OSC terminal open! The two bridges are chopped with a phase shift
of 180 degrees at the positive and at the negative edge of the clock signal.
1
fOSC
40 s COSC [nF]
fOSC:
COSC:
COSC
1.5nF
1.2nF
1.0nF
820pF
680pF
560pF
Please remark, that an unnecessary high frequency leads to high switching losses in the power
transistors and in the motor. For most applications a chopper frequency slightly above audible range is
sufficient. When audible noise occurs in an application, especially with mixed decay continuously
enabled, the chopper frequency should be two times the audible range.
Pull-up resistors on unused inputs
The digital inputs all have integrated pull-up resistors, except for the ENN input, which is in fact an
analog input. Thus, there are no external pull-up resistors required for unused digital inputs which are
meant to be positive.
22
RSLP:
IOUT:
123
4.7
IOUT [mA]
The SLP-pin can directly be connected to AGND for the fastest output-voltage slope (respectively
maximum output current).
Please remark, that there is a trade off between reduced electromagnetic emissions (slow slope) and
high efficiency because of low dynamic losses (fast slope). Typical slope times range between 100ns
and 500ns. Slope times below 100ns are not recommended, because they superimpose additional
stress on the power transistors while bringing only very slight improvement in power dissipation.
For applications where electromagnetic emission is very critical, it might be necessary to add
additional LC (or capacitor only) filtering on the motor connections.
For these applications emission is lower, if only slow decay operation is used.
25
IHDON
20
15
-IHDOFF /
+/-ILD
10
0
0
10
RSLP [KOhm]
20
50
100
23
Min
Max
Unit
VS
Supply voltage
36
VSM
40
VCC
6.0
IOP
50
mA
IOC
mA
VI
-0.3
VCC+0.3V
VIA
-0.3
VCC+0.3V
IIO
+/-10
mA
VS-1V
VS+0.3V
-0.5
TJ
Junction temperature
-40
150 (1)
TSTG
Storage temperature
-55
150
Electrical Characteristics
Operational Range
Symbol Parameter
Min
Max
Unit
TAI
-25
125
TAA
-40
125
TJ
Junction temperature
-40
140
VS
34
VS
30
VCC
3.0
5.5
fCLK
100
kHz
RSLP
470
(1) The circuit can be operated up to 140C, but output power derates.
24
DC Characteristics
DC characteristics contain the spread of values guaranteed within the specified supply voltage and
temperature range unless otherwise specified. Typical characteristics represent the average value of
all parts.
Logic supply voltage: VCC = 3.0 V ... 5.5 V,
Junction temperature: TJ = -40C 140C,
Bridge supply voltage : VS = 7 V34 V
(unless otherwise specified)
Symbol
ILDON
ILDOFF5
ILDOFF3
ILDON
ILDOFF
IHDON
IHDOFF
Parameter
Conditions
Min
Typ
Max
Unit
VLD < 4V
10
15
25
mA
VLD > 3V
-15
-25
-35
mA
VLD > 3V
-10
-15
-20
mA
15
25
40
mA
VLD < 4V
-15
-25
-40
mA
VLD > 4V
-15
-25
-40
mA
15
30
40
mA
70
100
130
-5.1
-6.0
-8.0
5.1
6.0
8.0
-0.5
0.5
16
20
ISET
VGH1
VCC = 5V
VCC = 3.3V
VS > 8V
relative to VS
VGL1
VS > 8V
VGH0
relative to VS
VGL0
VGCL
-IH / IL = 20mA
VGCLI
-IH / IL = -20mA
12
-0.8
Symbol
Parameter
Conditions
25
Min
Typ
Max
Unit
VCCUV
VCC undervoltage
2.5
2.7
2.9
VCCOK
2.7
2.9
3.0
0.85
1.35
mA
0.45
0.75
mA
37
70
ICC
fosc = 25 kHz
ICCSTB
ICCSD
VSUV
VS undervoltage
5.5
5.9
6.2
VCCOK
VS voltage o.k.
6.1
6.4
6.7
ENN = 1
ISSD
28
VIH
VIL
ISSM
mA
SLP
VS = 14V
50
2.2
VCC +
0.3 V
-0.3
0.7
VIHYS
100
300
500
mV
VOH
-IOH = 1mA
VCC
0.6
VCC
0.2
VCC
VOL
IOL = 1mA
0.1
0.4
-IISL
VI = 0
VCC = 3.3V
VCC = 5.0V
70
A
A
A
10
25
VENNH
VEHYS
VOSCH
tbd
2/3 VCC
tbd
VOSCL
tbd
1/3 VCC
tbd
VVTD
VT threshold voltage
(referenced to VS)
-130
-155
-180
mV
VTRIP
315
350
385
mV
VSRS
570
615
660
mV
-10
10
mV
-6
mV
175
264
360
RINAB
1/2 VCC
0.1
VENNH
internal ref. or
2V at INA / INB
Vin 3 V
26
AC Characteristics
AC characteristics contain the spread of values guaranteed within the specified supply voltage and
temperature range unless otherwise specified. Typical characteristics represent the average value of
all parts.
Logic supply voltage: VCC = 3.3V,
Bridge supply voltage: VS = 14.0V,
Ambient temperature: TA = 27C,
External MOSFET gate charge = 3.2nC
Symbol Parameter
fOSC
Oscillator frequency
using internal oscillator
TBL
TONMIN
Conditions
Min
Typ
Max
Unit
COSC = 1nF
1%
20
25
31
kHz
1.35
1.5
1.65
BL1, BL2 =
GND
0.7
Thermal Protection
Symbol
TJOT
TJOTHYS
TJWT
TJWTHYS
Parameter
Conditions
Thermal shutdown
Min
Typ
Max
Unit
145
155
165
TJOT hysteresis
Prewarning temperature
TJWT hysteresis
15
135
145
15
C
155
C
C
27
tCL
tCH
t1
t1
SCK
tDU
bit11
SDI
tDH
bit10
bit0
tD
SDO
tZC
bit11
bit10
bit0
Propagation Times
(3.0 V VCC 5.5 V, -40C Tj 150C; VIH = 2.8V, VIL = 0.5V; tr, tf = 10ns; CL = 50pF,
unless otherwise specified)
Symbol
fSCK
Parameter
SCK frequency
Conditions
Min
ENN = 0
DC
Typ
Max
Unit
MHz
t1
50
ns
tCH
100
ns
tCL
100
ns
tDU
40
ns
tDH
50
ns
tD
tZC
tES
tPD
CSN high to LA / HA / LB / HB
output polarity change delay
tLD
CL = 50pF
*)
**)
40
100
ns
50
ns
30
ns
3
tOSC + 4
28
0V
000111
5.8 mV
000110
11.5 mV
000101
17.3 mV
000100
23 mV
...
111101
334.2 mV
111100
340 mV
SPI bit
DAC bit
SPI bit
DAC bit
15
/B1
7
A2
14
/B0
6
PHA
13
/A1
5
MDB
12
/A0
4
B5
11
MDA
3
B4
10
A5
2
B3
9
A4
1
B2
SCK
SCK
SDI
SDI
TMC236 /
TMC239
SRA
SDO
110R
4.7nF
opt.
CSN
/CS
47K
47K
RS
47K
+VCC
100K
/OE
C2
/MR
C1
DS1D
Q0
Q1
Q2
Q3
Q4
Q5
Q6
Q7
/DACA.0
/DACA.1
/DACB.0
/DACB.1
Free for
second
TMC239
Q7'
74HC595
Vcc = 5V
C
SDO
1/2 74HC74
8
A3
0
PHB
Documentation Revision
Version
Author
Comment
Description
V2.06
DW
29