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27 pages, 7027 KiB  
Article
A Simple Methodology to Gain Insights into the Physical and Compositional Features of Ternary and Quaternary Compounds Based on the Weight Percentages of Their Constituent Elements: A Proof of Principle Using Conventional EDX Characterizations
by Luis Fernando Garrido-García, Ana Laura Pérez-Martínez, José Reyes-Gasga, María del Pilar Aguilar-Del-Valle, Yew Hoong Wong and Arturo Rodríguez-Gómez
Ceramics 2024, 7(3), 1275-1300; https://doi.org/10.3390/ceramics7030085 - 21 Sep 2024
Viewed by 383
Abstract
Ternary and quaternary compounds offer vast potential for tailoring material properties through compositional adjustments and complex interactions among their constituent elements. However, many of their compositional possibilities still need to be investigated. Energy-dispersive X-ray spectroscopy (EDX) is crucial for determining elemental composition but [...] Read more.
Ternary and quaternary compounds offer vast potential for tailoring material properties through compositional adjustments and complex interactions among their constituent elements. However, many of their compositional possibilities still need to be investigated. Energy-dispersive X-ray spectroscopy (EDX) is crucial for determining elemental composition but is inadequate for identifying chemical bonds and physical properties. This work introduces a novel methodology using a stoichiometric deviation vector (SDV) to estimate the physical and compositional feature characteristics of Si, N, and O compounds by comparing actual molar ratios with ideal stoichiometric references. We validated this method by estimating Si-O bonds in silicon oxynitride samples, demonstrating strong agreement with FTIR and refractive index results. We also extended our proof of principle for SiAlON compounds and established an adaptable procedure to analyze compounds with more than three elements. This flexible methodology will significantly value the materials research community, providing valuable compositional features and physical insights by performing elemental EDX characterizations. Full article
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Graphical abstract

Graphical abstract
Full article ">Figure 1
<p>Cross-sectional SEM micrograph of sample 9. The estimated thickness of the sample is approximately 2 μm (red lines indicate the measurements positions).</p>
Full article ">Figure 2
<p>EDX spectra of SiON films: (<b>a</b>) sample 6; (<b>b</b>) sample 7; (<b>c</b>) sample 8; (<b>d</b>) sample 9. The evaluated area is shown in the inset.</p>
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<p>Graphical representation of the stoichiometric deviation vectors (SDVs) for samples with SiO<sub>2</sub>-like characteristics. This diagram illustrates the variation of the total deviation indices (TDIs), ranging between 0 and 2.5, reflecting the stoichiometric affinity towards SiO<sub>2</sub>; and from 0 and 0.833, corresponding to the affinity towards Si<sub>3</sub>N<sub>4</sub>.</p>
Full article ">Figure 4
<p>Ternary diagram of the compositions of nitrogen, silicon, and oxygen in terms of wt%, highlighting the points corresponding to the key stoichiometric compounds (Si<sub>3</sub>N<sub>2</sub>O<sub>3</sub>, Si<sub>3</sub>N<sub>4</sub>, SiO<sub>2</sub>, and Si<sub>2</sub>N<sub>2</sub>O). The samples analyzed in our study are also located in the diagram. The green and red regions indicate oxide-like and nitride-like compositions, respectively, according to the established SDV criteria. The stoichiometric line corresponding to the formula Si<sub>3−y</sub>N<sub>4−2y</sub>O<sub>y</sub> that connects Si<sub>3</sub>N<sub>4</sub> with SiO<sub>2</sub> is also included.</p>
Full article ">Figure 5
<p>Ternary diagram of the wt% of nitrogen, silicon, and oxygen, showing the positions corresponding to important stoichiometric compounds (Si<sub>3</sub>N<sub>2</sub>O<sub>3</sub>, Si<sub>3</sub>N<sub>4</sub>, SiO<sub>2</sub>, and Si<sub>2</sub>N<sub>2</sub>O). A stoichiometric line connecting Si<sub>3</sub>N<sub>4</sub> to SiO<sub>2</sub> is highlighted, and areas formed by dioxide- and nitride-like compounds are delineated according to our sets of SDV criteria. These areas are visualized using a chromatic scale ranging from 0 to 2.5. The blank region shows values exceeding 2.5, trending towards infinity as they approach the oxygen axis (%O).</p>
Full article ">Figure 6
<p>Fourier transform infrared absorbance spectrum corresponding to our ten samples. The legends indicate the TDI (total deviation index) and the atomic weight percentages of nitrogen (N), oxygen (O), and silicon (Si) calculated from the formulas defined in this article and the data obtained by EDX. The presence of peaks at 980 cm<sup>−1</sup> associated with the absorption band of silicon–oxygen (Si-O) bonds is highlighted.</p>
Full article ">Figure 7
<p>Vector diagram of deviation from ideal stoichiometry from the reference composition (Si<sub>4</sub>Al<sub>2</sub>O<sub>2</sub>N<sub>6</sub>) to the stoichiometric compositions of Si<sub>2</sub>N<sub>2</sub>O, SiO<sub>2</sub>, Si<sub>3</sub>N<sub>4</sub>, AlN, Al<sub>23</sub>O<sub>27</sub>N<sub>5</sub>, and Al<sub>2</sub>O<sub>3</sub>. The vectors in the diagram represent the direction and magnitude of compositional changes required to achieve the ideal stoichiometry of the mentioned compounds.</p>
Full article ">Figure 8
<p>Quaternary diagram of the molecular wt% of silicon, nitrogen, oxygen, and aluminum in 4 two-dimensional views and one isometric view of the resulting tetrahedron. Points of particular interest are highlighted as a sphere, showing the reference compound (Si<sub>4</sub>Al<sub>2</sub>O<sub>2</sub>N<sub>6</sub>); as cubes, which indicate the stoichiometric positions of Si<sub>2</sub>N<sub>2</sub>O, SiO<sub>2</sub>, Si<sub>3</sub>N<sub>4</sub>, AlN, Al<sub>23</sub>O<sub>27</sub>N<sub>5</sub>, and Al<sub>2</sub>O<sub>3</sub>; and as stoichiometric lines that connect them with the reference, corresponding to the formulas in <a href="#ceramics-07-00085-t004" class="html-table">Table 4</a>.</p>
Full article ">Figure 9
<p>Quaternary diagram of SiAlON elements. The volume in red represents the region occupied by compounds with characteristics that are like the stoichiometric compounds Si<sub>2</sub>N<sub>2</sub>O, SiO<sub>2</sub>, Si<sub>3</sub>N<sub>4</sub>, AlN, Al<sub>23</sub>O<sub>27</sub>N<sub>5</sub>, and Al<sub>2</sub>O<sub>3</sub>, according to the criteria discussed in this article. The combinations classified as non-stoichiometric-like are shown in blue.</p>
Full article ">Figure 10
<p>Quaternary diagram of the molecular weight percentages of SiAlON elements in four planar views and one isometric view of the composition tetrahedron. Points of particular interest are shown, such as a sphere representing Si<sub>4</sub>Al<sub>2</sub>O<sub>2</sub>N<sub>6</sub>; cubes displaying the stoichiometric forms of Si<sub>2</sub>N<sub>2</sub>O, SiO<sub>2</sub>, Si<sub>3</sub>N<sub>4</sub>, AlN, Al<sub>23</sub>O<sub>27</sub>N<sub>5</sub>, and Al<sub>2</sub>O<sub>3</sub>; a straight line corresponding to the formula Si<sub>6−z</sub>Al<sub>z</sub>O<sub>z</sub>N<sub>8−z</sub>; and the volumes formed by small spheres that represent compounds that are “like” the stoichiometric according to the criteria discussed in this article.</p>
Full article ">Figure 11
<p>A quaternary diagram of TDIs is calculated using the formulas established in this article. The stoichiometric compounds Si<sub>2</sub>N<sub>2</sub>O, SiO<sub>2</sub>, Si<sub>3</sub>N<sub>4</sub>, AlN, Al<sub>23</sub>O<sub>27</sub>N<sub>5</sub>, and Al<sub>2</sub>O<sub>3</sub> are also displayed.</p>
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16 pages, 2783 KiB  
Article
Development of Solid-State Lithium-Ion Batteries (LIBs) to Increase Ionic Conductivity through Interactions between Solid Electrolytes and Anode and Cathode Electrodes
by Majid Monajjemi and Fatemeh Mollaamin
Energies 2024, 17(18), 4530; https://doi.org/10.3390/en17184530 - 10 Sep 2024
Viewed by 1316
Abstract
Although in general ions are not able to migrate in the solid-state position due to rigid skeletal structure, in some solid electrolytes with a low energy barrier and high ionic conductivities, these ion transition can occur. In this work, we considered several solid [...] Read more.
Although in general ions are not able to migrate in the solid-state position due to rigid skeletal structure, in some solid electrolytes with a low energy barrier and high ionic conductivities, these ion transition can occur. In this work, we considered several solid electrolytes including lithium phosphorus oxy-nitride (LIPON), a lithium super-ionic conductor (SILICON), and thio-LISICON. For the fabrication and characterization of the solid electrolyte’s fabrication, we used a single-step ball milling (SSBM) procedure. Through this research on all-solid-state rechargeable lithium-ion batteries, our target is to discuss solving several problems in solid LIBs that have recently escalated due to raised concerns relating to safety hazards such as solvent leakage and the flammability of the liquid electrolytes used for commercial LIBs. Through this research, we tested the conductivity amounts of various substrates containing amorphous glass, SSBM, and glass-ceramic samples. Obviously, the SSBM glass-ceramics increased the conductivity, and we also found that the values for conductivity attained by SSBM were higher than those values for glass-ceramics. Using an SSBM technique, silicon nanoparticles were used as an anode material and it was found that the charge and discharge curves in the battery cell cycled between 0.009 and 1.45 V versus Li+/Li at a current density of 210 mA g−1 at room temperature. Since high resistance causes degradation between the cathode material (LiCoO2) and the solid electrolyte, we added GeS2 and SiS2 to the Li2S-P2S5 system to obtain higher conductivities and better stability of the electrode–electrolyte interface. Full article
(This article belongs to the Section D2: Electrochem: Batteries, Fuel Cells, Capacitors)
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Figure 1

Figure 1
<p>XRD of crystals glass showing a general phase diagram of the 75% Li<sub>2</sub>S with %25P<sub>2</sub>S<sub>5</sub>.</p>
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<p>(<b>A</b>) Anode electrode containing acetylene black. (<b>B</b>) Multi-wall carbon nanotubes in anode. (<b>C</b>) Solid-state lithium battery including titanium.</p>
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<p>Titanium test with Li<sub>2</sub>S–GeS<sub>2</sub>–P<sub>2</sub>S<sub>5</sub> SSE, (<b>A</b>) solid electrolyte battery, and (<b>B</b>) conductivity tester.</p>
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<p>XRD patterns for all tested electrolytes, (a) Li<sub>2</sub>S, (b) P<sub>2</sub>S<sub>5</sub>, (c) x = GeS<sub>2</sub>, (d) x = 64, (f) x = 76.</p>
Full article ">Figure 5
<p>(a) Conductivity map for Li<sub>(4–x)</sub>Ge<sub>(1–x)</sub>P<sub>x</sub>S<sub>4</sub>; (b) glass, (c) glass-ceramic, (d) SSBM glass-ceramic.</p>
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<p>Comparison showing superior performance of MWCNT as a conductive additive for all solid–state lithium batteries over acetylene black in different voltages and three temperatures.</p>
Full article ">Figure 7
<p>Charge–discharge curves of all-solid-state cell fabricated with n-Si as anode material by different voltage ranges. (<b>A</b>–<b>F</b>) compare the cycling performance of solid state and liquid electrolyte systems using nano-Si. (<b>G</b>,<b>H</b>) exhibit the charge-discharge performance of ion cells, tested with lithium phosphorus oxy-nitride (LIPON) and lithium super-ionic conductor (SILICON) solid electrolyte, respectively.</p>
Full article ">Figure 7 Cont.
<p>Charge–discharge curves of all-solid-state cell fabricated with n-Si as anode material by different voltage ranges. (<b>A</b>–<b>F</b>) compare the cycling performance of solid state and liquid electrolyte systems using nano-Si. (<b>G</b>,<b>H</b>) exhibit the charge-discharge performance of ion cells, tested with lithium phosphorus oxy-nitride (LIPON) and lithium super-ionic conductor (SILICON) solid electrolyte, respectively.</p>
Full article ">Scheme 1
<p>Operating LIBs.</p>
Full article ">
10 pages, 2781 KiB  
Article
Interface and Size Effects of Amorphous Si/Amorphous Silicon Oxynitride Multilayer Structures on the Photoluminescence Spectrum
by Chao Song, Jie Song and Xiang Wang
Coatings 2024, 14(8), 977; https://doi.org/10.3390/coatings14080977 - 2 Aug 2024
Viewed by 702
Abstract
A room-temperature photoluminescence (PL) study of amorphous Si/amorphous silicon oxynitride multilayer films prepared by plasma-enhanced chemical vapor deposition is reported. The PL peak position can be tuned from 800 nm to 660 nm by adjusting the oxygen/nitride ratio in the a-SiOxN [...] Read more.
A room-temperature photoluminescence (PL) study of amorphous Si/amorphous silicon oxynitride multilayer films prepared by plasma-enhanced chemical vapor deposition is reported. The PL peak position can be tuned from 800 nm to 660 nm by adjusting the oxygen/nitride ratio in the a-SiOxNy:H sublayer. The Fourier transform infrared (FTIR) absorption spectra indicate that the shift of the PL peak position is accompanied by an increase in the Si-O-Si absorption peak’s intensity, which induces the structural disorder at the interface, resulting in an increase in band gap energy. The effects of size on the photoluminescence spectrum have been studied. As a result, it has been observed that the addition of oxygen atoms introduces a large number of localized states at the interface, causing a blue shift in the emission peak position. With an increase in oxygen atoms, the localized states tend to saturate, and the quantum phenomenon caused by the a-Si sublayer becomes more pronounced. It is found that, as the thickness of the a-Si sublayer decreases, the increase in the [O/N] ratio is more likely to cause an increase in disordered states, leading to a decrease in luminescence intensity. For a-Si/a-SiOxNy:H samples with thinner a-Si sublayers, an appropriate value of [O/N] is required to achieve luminescence enhancement. When the value of [O/N] is one, the enhanced luminescence is obtained. It is also suggested that the PL originates from the radiative recombination in the localized states’ T3- level-related negatively charged silicon dangling bond in the band tail of the a-Si:H sublayer embedded in an a-Si/a-SiOxNy:H multilayer structure. Full article
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Figure 1
<p>Cross-section TEM image of a-Si/a-SiO<sub>x</sub>N<sub>y</sub>:H multilayer film with 4 nm a-Si:H layer and 4 nm a-SiO<sub>x</sub>N<sub>y</sub>:H layer when [O/N] ratio is 0.2 (the interface between a-Si layer and a-SiO<sub>x</sub>N<sub>y</sub>:H layer is indicated by dotted line).</p>
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<p>Raman spectra of the a-Si/a-SiO<sub>x</sub>N<sub>y</sub>:H multilayer film with 4 nm a-Si:H layer and 4 nm a-SiO<sub>x</sub>N<sub>y</sub>:H layer when [O/N] ratio is 0.2.</p>
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<p>(<b>I</b>) PL spectra of the a-Si/a-SiO<sub>x</sub>N<sub>y</sub>:H multilayer samples with different values of [O/N]. (<b>II</b>) The integrated PL intensity and the PL peak positions as a function of [O/N] ratio in the barrier layer (arrows are used to indicate the coordinates corresponding to the data). (<b>III</b>) PL spectra of the a-SiO<sub>x</sub>N<sub>y</sub>:H films with different values of [O/N], which were used as the barrier layer in the multilayer structure.</p>
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<p>FTIR spectra of the a-Si/a-SiO<sub>x</sub>N<sub>y</sub>:H multilayer samples with different values of [O/N].</p>
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<p>(<b>a</b>) PL spectra of the a-Si/a-SiO<sub>x</sub>N<sub>y</sub>:H multilayer films with different a-Si sublayer thickness. (<b>b</b>) Tauc plots of the a-Si/a-SiO<sub>x</sub>N<sub>y</sub>:H multilayer films with different a-Si sublayer thickness. The inset presents the a-Si:H sublayer thickness dependence of the experimental band gap <span class="html-italic">E<sub>g</sub></span>, theoretical emission band energy <span class="html-italic">E<sub>T</sub></span>, and experimental PL peak energy <span class="html-italic">E</span>.</p>
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<p>(<b>a</b>) The [O/N] ratio dependence of the experimental band gap <span class="html-italic">E<sub>g</sub></span>, theoretical emission band energy <span class="html-italic">E<sub>T</sub></span>, and experimental PL peak energy <span class="html-italic">E</span>. (<b>b</b>) Schematic energy band diagram of the a-Si:H sublayer. The defect state T<sub>3−</sub>level of the silicon dangling bond and the exciton recombination processes are illustrated in the diagram.</p>
Full article ">Figure 7
<p>PL spectra of the a-Si/a-SiO<sub>x</sub>N<sub>y</sub>:H multilayer samples with different a-Si sublayer thickness. (<b>a</b>) [O/N] = 0. (<b>b</b>) [O/N] = 0.2. (<b>c</b>) [O/N] = 1. (<b>d</b>) [O/N] = 4. (<b>e</b>) The PL peak positions as a function of [O/N] ratio in the barrier layer for samples with different a-Si sublayer thickness. (<b>f</b>) The integrated PL intensity as a function of [O/N] ratio in the barrier layer for samples with different a-Si sublayer thickness.</p>
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20 pages, 11815 KiB  
Article
SiONx Coating Regulates Mesenchymal Stem Cell Antioxidant Capacity via Nuclear Erythroid Factor 2 Activity under Toxic Oxidative Stress Conditions
by Neelam Ahuja, Kamal Awad, Su Yang, He Dong, Antonios Mikos, Pranesh Aswath, Simon Young, Marco Brotto and Venu Varanasi
Antioxidants 2024, 13(2), 189; https://doi.org/10.3390/antiox13020189 - 1 Feb 2024
Viewed by 1490
Abstract
Healing in compromised and complicated bone defects is often prolonged and delayed due to the lack of bioactivity of the fixation device, secondary infections, and associated oxidative stress. Here, we propose amorphous silicon oxynitride (SiONx) as a coating for the fixation [...] Read more.
Healing in compromised and complicated bone defects is often prolonged and delayed due to the lack of bioactivity of the fixation device, secondary infections, and associated oxidative stress. Here, we propose amorphous silicon oxynitride (SiONx) as a coating for the fixation devices to improve both bioactivity and bacteriostatic activity and reduce oxidative stress. We aimed to study the effect of increasing the N/O ratio in the SiONx to fine-tune the cellular activity and the antioxidant effect via the NRF2 pathway under oxidative stress conditions. The in vitro studies involved using human mesenchymal stem cells (MSCs) to examine the effect of SiONx coatings on osteogenesis with and without toxic oxidative stress. Additionally, bacterial growth on SiONx surfaces was studied using methicillin-resistant Staphylococcus aureus (MRSA) colonies. NRF2 siRNA transfection was performed on the hMSCs (NRF2-KD) to study the antioxidant response to silicon ions. The SiONx implant surfaces showed a >4-fold decrease in bacterial growth vs. bare titanium as a control. Increasing the N/O ratio in the SiONx implants increased the alkaline phosphatase activity >1.5 times, and the other osteogenic markers (osteocalcin, RUNX2, and Osterix) were increased >2-fold under normal conditions. Increasing the N/O ratio in SiONx enhanced the protective effects and improved cell viability against toxic oxidative stress conditions. There was a significant increase in osteocalcin activity compared to the uncoated group, along with increased antioxidant activity under oxidative stress conditions. In NRF2-KD cells, there was a stunted effect on the upregulation of antioxidant markers by silicon ions, indicating a role for NRF2. In conclusion, the SiONx coatings studied here displayed bacteriostatic properties. These materials promoted osteogenic markers under toxic oxidative stress conditions while also enhancing antioxidant NRF2 activity. These results indicate the potential of SiONx coatings to induce in vivo bone regeneration in a challenging oxidative stress environment. Full article
(This article belongs to the Special Issue Applications and Health Benefits of Novel Antioxidant Biomaterials)
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Figure 1
<p>Bacteriostatic effect of SiON<sub>x</sub> versus Ti. All SiON<sub>x</sub> samples presented a significant decrease in the total number of bacteria at all time points: (<b>A</b>) 12 h, (<b>B</b>) 24 h, and (<b>C</b>) 48 h. At 12 h, the lowest bacterial counts were noted for SiON<sub>x</sub> (<span class="html-italic">n</span> = 1.82), while the bacterial counts on SiON<sub>x</sub> (<span class="html-italic">n</span> = 2.0) significantly decreased at 24 and 48 h. * <span class="html-italic">p</span> &lt; 0.05, ** <span class="html-italic">p</span> &lt; 0.01, and *** <span class="html-italic">p</span> &lt; 0.001 present the significance compared to Ti as a control.</p>
Full article ">Figure 2
<p>Bacteriostatic effect of SiON<sub>x</sub> coatings versus Ti-based implants. Fluorescence images show the live (green) and dead (red) bacteria on different SiON<sub>x</sub> surfaces compared to Ti-based implants after 48 h.</p>
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<p>Cell viability and proliferation assay evaluated by (<b>A</b>) fluorescent live (Calcein AM) (green stain) and dead (Ethidium homodimer) (red stain) staining along with quantitative evaluation by (<b>B</b>) MTS assay after 1, 4, and 7 days of seeding on the various SiON<sub>x</sub> surface chemistries. * <span class="html-italic">p</span> &lt; 0.05 and *** <span class="html-italic">p</span> &lt; 0.001 present the significance compared to the normal TCP as a control. Scale bar = 200µm.</p>
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<p>Alkaline phosphatase assay on days 1, 4, and 7 of osteogenic differentiation in MSCs on different SiON<sub>x</sub> chemistries. The ALP activity in SiON<sub>x</sub> <span class="html-italic">n</span> = 1.82 and <span class="html-italic">n</span> = 2 is not significantly different when compared to the control on days 1 and 4. ** <span class="html-italic">p</span> &lt; 0.01 and *** <span class="html-italic">p</span> &lt; 0.001 present the significance compared to the normal TCP as a control.</p>
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<p>Gene expression analysis (rt-PCR) shows an upregulation of osteogenic markers on SiON<sub>x</sub> as compared to the baseline control. The increase in the N/O ratio increases the osteogenic marker expression. * <span class="html-italic">p</span> &lt; 0.05 and ** <span class="html-italic">p</span> &lt; 0.01 present the significance compared to the normal TCP as a control.</p>
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<p>Gene expression analysis (rt-PCR) shows an upregulation of antioxidant markers in SiON<sub>x</sub> as compared to the baseline control. The increase in the N/O ratio increases the antioxidant marker expression.</p>
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<p>(<b>A</b>) Cell viability tested under various hydrogen peroxide concentrations; (<b>B</b>) MTS assay; (<b>C</b>) quantification of live cells using ImageJ software. * <span class="html-italic">p</span> &lt; 0.05, ** <span class="html-italic">p</span> &lt; 0.01, and *** <span class="html-italic">p</span> &lt; 0.001 present the significance compared to the normal control of 0 mM H<sub>2</sub>O<sub>2</sub> or the TCP as a control. Scale bar = 200 µm.</p>
Full article ">Figure 8
<p>Cell proliferation on various SiON<sub>x</sub> chemistries under toxic oxidative stress. Green color (stained by Calcein AM) represents the live cells, and red color (stained by Ethidium homodimer) represents the dead cells. Scale bar = 200 µm.</p>
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<p>Gene expression analysis (rt-PCR) shows a significant upregulation of osteogenic markers in SiON<sub>x</sub> <span class="html-italic">n</span> = 1.82 as compared to the baseline control in an oxidative stress environment. The osteogenic marker expression is not significantly different from the baseline with no oxidative stress involvement. *** <span class="html-italic">p</span> &lt; 0.001 presents the significance compared to the control.</p>
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<p>IHC staining representing DAPI (blue) and osteocalcin (green) on MSCs after 7 days of osteogenic differentiation. Overexpression of the osteogenic marker on the selected SiON<sub>x</sub> (<span class="html-italic">n</span> = 1.82) surface vs. the control is evident. Scale bar = 100 µm.</p>
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<p>Gene expression analysis (rt-PCR) shows a significant upregulation of antioxidant markers in SiON<sub>x</sub> <span class="html-italic">n</span> = 1.82 as compared to the baseline control in an oxidative stress environment. ** <span class="html-italic">p</span> &lt; 0.01 presents the significance compared to the baseline control (TCP).</p>
Full article ">Figure 12
<p>IHC staining representing DAPI (blue) and NRF2 (red) on MSCs after 7 days of osteogenic differentiation. There is a significant increase in the antioxidant NRF2 activity on the selected SiON<sub>x</sub> (<span class="html-italic">n</span> = 1.82) surface when compared to the control. Scale bar = 100 µm.</p>
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<p>NRF2 KD blocks the Si ion protective effect on the antioxidant expression.</p>
Full article ">Figure 14
<p>SiON<sub>x</sub> and SiONP<sub>x</sub> enhanced NRF2 and angiopoietin (ANG1) vs. control. (<b>A</b>) DAPI (blue)/NRF2 (red): IHC image shows cytosolic NRF2 expression in MSCs (exposed to ROS) on SiON<sub>x</sub> coatings. NRF2 was stained with polyclonal anti-NRF2 Ab, followed by Alexa-594 secondary Ab, while the nucleus was counterstained with DAPI. (<b>B</b>) DAPI (blue)/Keap1 (green): IHC image shows nuclear localization of Keap1 in MSCs (exposed to ROS) on SiON<sub>x</sub> coatings. SiONP<sub>x</sub> (SiONP1: P/N = 0.9, SiONP2: P/N = 1.0) enhanced NRF2 activity (<b>C</b>) and ANG1 (<b>D</b>) vs. SiON<sub>x</sub>. (<b>E</b>) Alkaline phosphatase (ALP)-stained differentiated MSCs on SiONP<sub>x</sub>-Ti. * <span class="html-italic">p</span> &lt; 0.05, ** <span class="html-italic">p</span> &lt; 0.01, *** <span class="html-italic">p</span> &lt; 0.001 present the significance compared to the control. Scale bar = 200 µm.</p>
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14 pages, 5736 KiB  
Article
Design and Optimization of a High-Efficiency 3D Multi-Tip Edge Coupler Based Lithium Niobate on Insulator Platform
by Tian Zhang, Jinye Li, Mingxuan Li and Jianguo Liu
Photonics 2024, 11(2), 134; https://doi.org/10.3390/photonics11020134 - 31 Jan 2024
Cited by 1 | Viewed by 1659
Abstract
Fiber-chip edge couplers can minimize mode mismatch in integrated lithium niobate (LiNbO3) photonics via facilitating broad optical bandwidth coupling between optical fibers and waveguide circuits. We designed a high-efficiency multi-tip edge coupler utilizing the lithium niobate on insulator (LNOI) platform for [...] Read more.
Fiber-chip edge couplers can minimize mode mismatch in integrated lithium niobate (LiNbO3) photonics via facilitating broad optical bandwidth coupling between optical fibers and waveguide circuits. We designed a high-efficiency multi-tip edge coupler utilizing the lithium niobate on insulator (LNOI) platform for achieving superior fiber-to-chip coupling. The device comprises a bilayer LN inversely tapered waveguide, three 3D inversely tapered waveguides, and a silicon oxynitride (SiON) cladding waveguide (CLDWG). Finite difference method (FDM) and eigenmode expansion (EME) simulations were utilized to simulate and optimize the edge coupler structure specifically within the 1550 nm band. This coupler demonstrates a low fiber-chip coupling loss of 0.0682/0.0958 dB/facet for TE/TM mode at 1550 nm when interfaced with a commercially cleaved single-mode fiber (SMF) with a mode field diameter (MFD) of approximately 8.2 μm. Moreover, the 1 dB bandwidth of the coupler is 270 nm for the TE mode and 288 nm for the TM mode. Notably, the coupler exhibits a relatively large tolerance for optical misalignment owing to its large mode spot size of up to 4 μm. Given its ultra-low loss, high-efficiency ultra-broadband capabilities, and substantial tolerance features, this proposed device provides a paradigm for fiber-to-chip edge coupling within lithium niobate photonics. Full article
(This article belongs to the Section Optoelectronics and Optical Materials)
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<p>(<b>a</b>) Schematic of the designed edge coupler. (<b>b</b>) Cross-section views of the edge coupler at the coupling end face. (<b>c</b>) Top and cross-sectional views of the edge coupler.</p>
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<p>(<b>a</b>–<b>e</b>) Mode field distributions at cross sections S1–S5 (TE mode). (<b>f</b>) Mode field distribution of SMF.</p>
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<p>Simulated coupling loss as a function of (<b>a</b>) <span class="html-italic">CLDWG</span> height, (<b>b</b>) <span class="html-italic">CLDWG</span> width, (<b>c</b>) <span class="html-italic">????</span><sub>4</sub>, (<b>d</b>) <span class="html-italic">h</span><sub>2</sub>, and (<b>e</b>) <span class="html-italic">????</span><sub>2</sub>. Simulation wavelength: 1550 nm.</p>
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<p>Simulated coupling efficiency versus (<b>a</b>) <span class="html-italic">????</span><sub>1</sub>, (<b>b</b>) <span class="html-italic">????</span><sub>2</sub> and <span class="html-italic">????</span><sub>1</sub>, and (<b>c</b>) <span class="html-italic">????</span><sub>3</sub> and <span class="html-italic">h</span><sub>1</sub> for the three-tip edge coupler.</p>
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<p>Coupling efficiency of the three-tip edge coupler determined via the EME method at 1550 nm by varying (<b>a</b>) <span class="html-italic">L</span><sub>1</sub>, (<b>b</b>) <span class="html-italic">L</span><sub>2</sub>, (<b>c</b>) <span class="html-italic">L</span><sub>3</sub>, and (<b>d</b>) <span class="html-italic">L</span><sub>4</sub>.</p>
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<p>Mode propagation in the three-tip edge coupler at the wavelength of 1550 nm: (<b>a</b>) XZ section and (<b>b</b>) XY section.</p>
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<p>The simulated misalignment tolerance of the designed edge couplers at the wavelength of 1550 nm: (<b>a</b>) horizontal (<span class="html-italic">y</span>-axis) and (<b>b</b>) vertical (<span class="html-italic">z</span>-axis).</p>
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<p>The simulated fabrication tolerance of the designed edge couplers at the wavelength of 1550 nm: (<b>a</b>) vertical (????<span class="html-italic">h</span>) and (<b>b</b>) horizontal (????<span class="html-italic">w</span>).</p>
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<p>Coupling efficiency of the three-tip edge coupler in wavelengths from 1.4 to 1.8 μm, calculated by EME simulations.</p>
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14 pages, 5075 KiB  
Article
Influence of Si Addition on the Chemical and Tribological Performance of TiAlCrN Coating Deposited by Co-Sputtering
by L. C. Ardila, R. Dueñas, G. Orozco, J. J. Olaya, A. F. Ordoñez, C. M. Moreno and Y. Pineda
Crystals 2023, 13(12), 1666; https://doi.org/10.3390/cryst13121666 - 7 Dec 2023
Cited by 2 | Viewed by 1054
Abstract
In this work, nanostructured TiAlCrN coatings were deposited on a WC-Co substrate using a co-sputtering process varying the silicon composition on the coatings. The influence of silicon content on the mechanical, chemical, and tribological performance of the coatings was studied. The hardness increases [...] Read more.
In this work, nanostructured TiAlCrN coatings were deposited on a WC-Co substrate using a co-sputtering process varying the silicon composition on the coatings. The influence of silicon content on the mechanical, chemical, and tribological performance of the coatings was studied. The hardness increases from 11 to 16 GPa with the Si content; also, Young’s modulus increases from 260 to 295 GPa. The H/E ratio, which is a measure of materials’ ability to take the strain before deformation, is also increased with the increase in Si content, suggesting increased toughness. XPS analysis reveals that the coatings present titanium, aluminum, chromium, and silicon nitrides. The tribological behavior of the coatings was conducted through ball-on-disc tests, in which the results show that the coefficients of friction range from 0.15 to 0.55, with the lowest for the samples with the highest Si content. This behavior is benefited by the formation of oxynitride species, identified by XPS, which acts as lubricating layers and diffusion barriers. TiAlCrSixN coating presents a potential application for severe wear owing to its tribological performance. Full article
(This article belongs to the Section Crystalline Metals and Alloys)
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<p>(<b>a</b>) Schematic representation of the co-sputtering equipment (adapted from [<a href="#B22-crystals-13-01666" class="html-bibr">22</a>]). (<b>b</b>) Pure silicon pieces located on the TiAl target race-track zone in four configurations.</p>
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<p>SEM micrographs of the morphology of the TiAlCrN coating with 4 pieces of silicon.</p>
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<p>Deconvoluted high-resolution XPS spectra of Si 2p.</p>
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<p>Deconvoluted high-resolution XPS spectra of Ti 2p (<b>a</b>), Al 2p (<b>b</b>), and Cr 2p (<b>c</b>).</p>
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<p>Oxides composition behavior obtained by XPS.</p>
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<p>Hardness and modulus behavior (<b>a</b>) and H/E and H3/E2 (<b>b</b>) relationships as a function of silicon content.</p>
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<p>Wear rate as a function of silicon content.</p>
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<p>Ball on disc wear track SEM micrographs of a sample of hardmetal coated with TiAlCrN with 0.60 at% of Si (<b>a</b>,<b>c</b>) and 1.59 at% of Si (<b>b</b>,<b>d</b>).</p>
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13 pages, 2368 KiB  
Article
Fabrication and Characterization of Narrow-Wavelength Phosphors of Tb-Doped Yttrium-Silicon-Aluminum Oxynitride Using Spray Pyrolysis
by Bramantyo Bayu Aji, Yu-Hsiuan Huang, Masatsugu Oishi, Toshihiro Moriga and Shao-Ju Shih
Ceramics 2023, 6(4), 2307-2319; https://doi.org/10.3390/ceramics6040141 - 3 Dec 2023
Viewed by 1931
Abstract
Selective emission of green light phosphor powder Y4SiAlO8N as the host material and Tb3+ as the activator was successfully achieved using spray pyrolysis (SP). Samples synthesized with various calcination temperatures and precursor concentrations indicated that the most suitable [...] Read more.
Selective emission of green light phosphor powder Y4SiAlO8N as the host material and Tb3+ as the activator was successfully achieved using spray pyrolysis (SP). Samples synthesized with various calcination temperatures and precursor concentrations indicated that the most suitable parameter for the synthesized powder is the calcination of 0.05 M Y3.92SiAlO8N:0.08Tb3+ at a temperature of 1600 °C. The effect of the selected parameters was substantiated by the high purity of the Y3.92SiAlO8N:0.08Tb3+ phase, as confirmed by X-ray diffraction (XRD) analysis. The Scherrer equation was used to calculate grain size. In addition, scanning electron microscopy (SEM) and energy-dispersive X-ray spectrometry (EDS) confirmed the presence of micron-sized particles, which matched well with the theoretical chemical composition. The specific surface area of the phosphor powder was determined using the Brunauer–Emmett–Teller method. Finally, fluorescence spectrometry was used to determine the luminescence properties. The correlation between the crystallinity of the phosphor powder and narrowing emission is also discussed. Full article
(This article belongs to the Special Issue Advances in Ceramics, 2nd Edition)
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<p>XRD patterns of as-received powder and the Y<sub>3.92</sub>SiAlO<sub>8</sub>N:0.08Tb<sup>3+</sup> powders calcined at the temperatures of 1300, 1400, 1500, 1600, and 1650 °C.</p>
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<p>Crystallite sizes of as-received powder and the Y<sub>3.92</sub>SiAlO<sub>8</sub>N:0.08Tb<sup>3+</sup> powders calcined at the temperatures of 1300, 1400, 1500, 1600, and 1650 °C.</p>
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<p>SEM images of (<b>a</b>) as-received powder and the Y<sub>3.92</sub>SiAlO<sub>8</sub>N:0.08Tb<sup>3+</sup> powders calcined at the temperatures of (<b>b</b>) 1300, (<b>c</b>) 1400, (<b>d</b>) 1500, (<b>e</b>) 1600, and (<b>f</b>) 1650 °C.</p>
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<p>EDS spectra of (<b>a</b>) as-received powder and the Y<sub>3.92</sub>SiAlO<sub>8</sub>N:0.08Tb<sup>3+</sup> powders calcined at the temperatures of (<b>b</b>) 1300, (<b>c</b>) 1400, (<b>d</b>) 1500, (<b>e</b>) 1600, and (<b>f</b>) 1650 °C.</p>
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<p>(<b>a</b>) Excitation (λem = 543 nm) and (<b>b</b>) emission spectra (λex = 251 nm) of Y<sub>3.92</sub>SiAlO<sub>8</sub>N:0.08Tb<sup>3+</sup> phosphor powders calcined at the temperatures of 1300, 1400, 1500, 1600, and 1650 °C.</p>
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<p>Correlation between photoluminescence intensity (<sup>5</sup>D<sub>4</sub> → <sup>7</sup>F<sub>5</sub>) and crystalline size for Y<sub>3.92</sub>SiAlO<sub>8</sub>N:0.08Tb<sup>3+</sup> powders.</p>
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13 pages, 6986 KiB  
Communication
Integrated Broadband Filter with Sharp Transition Edges Based on SiN and SiON Composite Waveguide Coupler
by Xiao Ma, Qiongchan Shao, Jiamei Gu, Tingting Lang, Xiang Guo and Jian-Jun He
Photonics 2023, 10(11), 1285; https://doi.org/10.3390/photonics10111285 - 20 Nov 2023
Viewed by 1252
Abstract
Broadband filters with sharp transition edges are important elements in diverse applications, including Raman and fluorescence spectral analysis, wideband wavelength-division multiplexing (WDM), and multi-octave interferometry. While the multi-layer thin-film interference broadband filter has been widely applied in various free-space optical systems, its integrated [...] Read more.
Broadband filters with sharp transition edges are important elements in diverse applications, including Raman and fluorescence spectral analysis, wideband wavelength-division multiplexing (WDM), and multi-octave interferometry. While the multi-layer thin-film interference broadband filter has been widely applied in various free-space optical systems, its integrated counterpart is still far from mature, which is also highly desired for constructing chip-scale miniature optical modules. In this article, we design, fabricate, and characterize an integrated broadband filter with sharp transition edges. An adiabatic coupler based on silicon nitride (SiN) and silicon oxynitride (SiON) composite waveguide is employed here. Long-pass, short-pass, band-pass, and band-stop filters can be realized in a single design of the composite waveguide coupler for a specific wavelength range, with only a difference in the SiN taper waveguide width. Experimental results with a roll-off value of larger than 0.7 dB nm−1 and a 15 dB extinction ratio (ER) are presented. Full article
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<p>The structural diagrams of single-core SiN waveguide (top left), single-core SiON waveguide (bottom left), three-segment SiN waveguide (top right) and five-segment SiN waveguide (bottom right).</p>
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<p>Dispersion curves of single-core SiN waveguide (1.2 μm × 0.25 μm), single-core SiON waveguide (3 μm × 1.8 μm) and (<b>a</b>) 60–90% duty cycle 3-segment SiN waveguides; (<b>b</b>) 60–90% duty cycle 5-segment SiN waveguides.</p>
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<p>(<b>a</b>) Three-dimensional schematic diagram and (<b>b</b>) top view of the broadband filter with an adiabatic coupler.</p>
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<p>Dispersion curves of SiON and SiN waveguides with different widths.</p>
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<p>Supermode filed distributions for the SiON and SiN composite waveguide with different SiN widths at a specific wavelength. In the figure, the above is a SiON waveguide with a width of 3 μm and a height of 1.8 μm. The below is a SiN waveguide with a height of 0.25 μm.</p>
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<p>Transmittance spectra of the (<b>a</b>) SiN waveguide and (<b>b</b>) SiON waveguide with different W<sub>11</sub> when light is injected into SiN waveguide. In all situations, W<sub>12</sub> equals W<sub>11</sub> + 0.2 μm.</p>
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<p>Simulated transmittance spectra of the adiabatic coupler when the SiN taper widths range from 0.9 μm to 2.1 μm. Light is injected from the SiN waveguide.</p>
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<p>(<b>a</b>) The relationship between ER and taper length L<sub>1</sub> when R<sub>2</sub> is set to 500,000 μm and (<b>b</b>) the relationship between ER and R<sub>2</sub> when L<sub>1</sub> is set to 2000 μm. W<sub>11</sub> and W<sub>12</sub> of the taper waveguide are 1 μm and 1.2 μm, respectively, and the gap between the two waveguides is 0.9 μm. The red diamond is the measured discrete points and the blue dotted line is the connecting line between them.</p>
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<p>Transmittance spectra of the SiN and SiON waveguides in the 785 nm band.</p>
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<p>Flow process diagram of the entire fabrication process.</p>
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<p>Cross-section of the composite waveguides in the approaching area after SiON etching process.</p>
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<p>Relationship between the refractive index of the developed SiON and the N<sub>2</sub>O flux when the SiH<sub>4</sub> and NH<sub>3</sub> fluxes is kept as 17.5 sccm and 190 sccm, respectively.</p>
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<p>Micrographs of the SiN waveguide after SiO<sub>2</sub> and SiON layers have been deposited when (<b>a</b>) most of the SiN film on the wafer has been etched; (<b>b</b>) only SiN film near the waveguide has been etched.</p>
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<p>Micrograph of the fabricated filter array with different parameters.</p>
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<p>SEM images of the adiabatic coupler at different positions after SiON etching.</p>
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<p>Normalized transmittance spectra in the output ends of the SiN and SiON waveguides in two adjacent filters.</p>
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14 pages, 6269 KiB  
Article
Analysis of Wear Using the Taguchi Method in TiSiNOS-Coated and Uncoated H13 Tool Steel
by Mathew Alphonse, Arun Prasad Murali, Sachin Salunkhe, Sharad Ramdas Gawade, Boddu V. S. G. Naveen Kumar, Emad Abouel Nasr and Ali Kamrani
Coatings 2023, 13(10), 1781; https://doi.org/10.3390/coatings13101781 - 17 Oct 2023
Viewed by 1114
Abstract
Titanium–silicon oxynitride sulfite (TiSiNOS) is a coating material that is deposited on H13 tool steel using the scalable pulsed power plasma (S3P) technique, where the coating deposition is a hybrid process consisting of a mix of sputtering and arc evaporation. The maximum hardness [...] Read more.
Titanium–silicon oxynitride sulfite (TiSiNOS) is a coating material that is deposited on H13 tool steel using the scalable pulsed power plasma (S3P) technique, where the coating deposition is a hybrid process consisting of a mix of sputtering and arc evaporation. The maximum hardness and coating thickness measured on TiSINOS-coated H13 tool steel are 38 GPa and 3.1 µm, respectively. After implementing the L9 orthogonal array, nine samples were coated with TiSiNOS, which consists of the same properties. The nine coated and uncoated samples were tested separately based on the L9 pattern to achieve accurate results. The experimental results indicate that the wear loss can be reduced by minimizing the load at 25 N even if the temperature rises to 250 °C. SEM analysis reveals that the uncoated sample has higher wear loss when compared with the coated samples, and material pullout is visible from the uncoated sample. Based on these results, it can be concluded that TiSINOS coating in H13 tool steel helps in improving the tool life during the drilling process. Taguchi was used in this research to evaluate the wear behavior. The data observed from the experiment were analyzed using the Minitab tool. The most crucial factor is to determine the effects of process parameters. A higher temperature influenced the wear behavior of the tool. Full article
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<p>Graph comparing the nine samples and wear loss.</p>
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<p>Coefficient of friction.</p>
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<p>Effect of process parameters on wear (signal-to-noise: smaller is better).</p>
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<p>Effect of process parameters on wear (signal-to-noise: smaller is better).</p>
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<p>Predicted vs. actual values.</p>
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<p>Surface plot of wear in coated tool. (<b>a</b>) Wear loss, load vs. temperature, (<b>b</b>) wear loss, temperature vs. spindle speed and (<b>c</b>) wear loss, load vs. spindle speed.</p>
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<p>Surface plot of wear in coated tool. (<b>a</b>) Wear loss, load vs. temperature, (<b>b</b>) wear loss, temperature vs. spindle speed and (<b>c</b>) wear loss, load vs. spindle speed.</p>
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<p>Surface morphology: 6 (<b>a</b>–<b>i</b>) coated samples (1–9) and one (<b>j</b>) uncoated sample.</p>
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<p>Surface morphology: 6 (<b>a</b>–<b>i</b>) coated samples (1–9) and one (<b>j</b>) uncoated sample.</p>
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14 pages, 6933 KiB  
Article
Silicon Carbide–Silicon Nitride Refractory Materials: Part 1 Materials Science and Processing
by Andrey Yurkov
Processes 2023, 11(7), 2134; https://doi.org/10.3390/pr11072134 - 17 Jul 2023
Cited by 3 | Viewed by 1843
Abstract
Silicon carbide and silicon nitride materials were intensively studied in the end of the past century, yet some aspects of its physical chemistry require investigation. The strength characteristics of Si3N4-SiC refractories are moderate; however, these materials sometimes demonstrate “stress–strain” [...] Read more.
Silicon carbide and silicon nitride materials were intensively studied in the end of the past century, yet some aspects of its physical chemistry require investigation. The strength characteristics of Si3N4-SiC refractories are moderate; however, these materials sometimes demonstrate “stress–strain” behavior, more typical for composite materials than for the brittle ceramics. These materials may be considered to be ceramic composites because they consist of big grains of silicon carbide surrounded by small grains of silicon nitride, with strict interfaces between them. There is no direct certainty whether Si3N4-SiC compositions may be called composite materials or brittle ceramic materials from the viewpoint of mechanics and strength. The balance of α/β modifications of silicon nitride in Si3N4-SiC composite material and, the occurrence and the role of silicon oxynitride Si2ON2 are also a matter of scientific interest in processing of Si3N4-SiC composite material. The same may be said about the particles of silicon nitride between the grains of silicon carbide—there is no direct understanding whether silicon nitride grains will be isometric grains or needle-like crystals. Full article
(This article belongs to the Special Issue Advances in Ceramic Processing and Application of Ceramic Materials)
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<p>Schematic illustration of Si<sub>3</sub>N<sub>4</sub>-SiC processing: (<b>a</b>) before and in the process of the firing, (<b>b</b>) after the firing.</p>
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<p>Structure of Si<sub>3</sub>N<sub>4</sub>-SiC ceramic refractory materials: 1—α-SiC; 2—α-Si<sub>3</sub>N<sub>4</sub>; 3—β-Si<sub>3</sub>N<sub>4</sub>.</p>
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<p>The structures of Si<sub>3</sub>N<sub>4</sub>-SiC materials: (<b>a</b>) the structure with isometrical grains of silicon nitride; (<b>b</b>) the structure with needle-like grains of silicon nitride.</p>
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<p>XRD of Si<sub>3</sub>N<sub>4</sub>-SiC materials, produced in a flowing nitrogen atmosphere.</p>
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<p>Microstructures of Si<sub>3</sub>N<sub>4</sub>-SiC material, produced in the atmosphere of flowing nitrogen (polished samples, in BSE detector): (<b>a</b>) a general view at low magnification; (<b>b</b>,<b>c</b>) Si<sub>3</sub>N<sub>4</sub>-SiC material with marked points of EDX (spectra 1–5 in <a href="#processes-11-02134-t003" class="html-table">Table 3</a>); (<b>d</b>) the Si<sub>2</sub>ON<sub>2</sub> grain (spectra 6 in <a href="#processes-11-02134-t003" class="html-table">Table 3</a>).</p>
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<p>The examples of porosity gradients in Si<sub>3</sub>N<sub>4</sub>-SiC 70 mm thick blocks: (<b>a</b>) according to Skybakmoen [<a href="#B9-processes-11-02134" class="html-bibr">9</a>,<a href="#B18-processes-11-02134" class="html-bibr">18</a>,<a href="#B19-processes-11-02134" class="html-bibr">19</a>]; and (<b>b</b>) Yurkov [<a href="#B7-processes-11-02134" class="html-bibr">7</a>,<a href="#B8-processes-11-02134" class="html-bibr">8</a>].</p>
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<p>The gradients of silicon nitride concentrations in different Si<sub>3</sub>N<sub>4</sub>-SiC blocks [<a href="#B7-processes-11-02134" class="html-bibr">7</a>].</p>
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<p>Schematic illustration of self-propagating chain process during Si<sub>3</sub>N<sub>4</sub>-SiC processing [<a href="#B8-processes-11-02134" class="html-bibr">8</a>].</p>
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<p>Pore size distribution in Si<sub>3</sub>N<sub>4</sub>-SiC material in the middle (<b>a</b>) and near the surface (<b>b</b>).</p>
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<p>The typical structures of silicon-nitride-bonded silicon carbide: (<b>a</b>) peripheral part; (<b>b</b>) in the middle.</p>
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<p>Apparent density (<b>a</b>) and cold crushing strength (<b>b</b>) of SiC-Si<sub>3</sub>N<sub>4</sub> compositions with different Si<sub>3</sub>N<sub>4</sub> content.</p>
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<p>Stress–deformation curves for Si<sub>3</sub>N<sub>4</sub>-SiC materials: (<b>a</b>) bending; (<b>b</b>) compression.</p>
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13 pages, 9199 KiB  
Article
Luminescent Amorphous Silicon Oxynitride Systems: High Quantum Efficiencies in the Visible Range
by Pengzhan Zhang, Leng Zhang, Fei Lyu, Danbei Wang, Ling Zhang, Kongpin Wu, Sake Wang and Chunmei Tang
Nanomaterials 2023, 13(7), 1269; https://doi.org/10.3390/nano13071269 - 3 Apr 2023
Cited by 1 | Viewed by 1504
Abstract
In recent years, researchers have placed great importance on the use of silicon (Si)-related materials as efficient light sources for the purpose of realizing Si-based monolithic optoelectronic integration. Previous works were mostly focused on Si nanostructured materials, and, so far, exciting results from [...] Read more.
In recent years, researchers have placed great importance on the use of silicon (Si)-related materials as efficient light sources for the purpose of realizing Si-based monolithic optoelectronic integration. Previous works were mostly focused on Si nanostructured materials, and, so far, exciting results from Si-based compounds are still lacking. In this paper, we have systematically demonstrated the high photoluminescence external quantum efficiency (PL EQE) and internal quantum efficiency (PL IQE) of amorphous silicon oxynitride (a-SiNxOy) systems. Within an integration sphere, we directly measured the PL EQE values of a-SiNxOy, which ranged from approximately 2% to 10% in the visible range at room temperature. Then, we calculated the related PL IQE through temperature-dependent PL measurements. The obtained PL IQE values (~84% at 480 nm emission peak wavelength) were very high compared with those of reported Si-based luminescent thin films. We also calculated the temperature-dependent PL EQE values of a-SiNxOy systems, and discussed the related PL mechanisms. Full article
(This article belongs to the Special Issue Nanostructured Thin Films: From Synthesis to Application)
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<p>A diagrammatic presentation of the optical paths of the emitted photons from the excitation light source and the a-SiN<sub>x</sub>O<sub>y</sub> films in the integrating sphere during PL QY measurement processes. (<b>a</b>) No a-SiN<sub>x</sub>O<sub>y</sub> samples; (<b>b</b>) the excitation light shines directly onto a-SiN<sub>x</sub>O<sub>y</sub> samples; (<b>c</b>) the excitation light shines onto a-SiN<sub>x</sub>O<sub>y</sub> samples indirectly.</p>
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<p>XPS spectra of Si 2p of both a-SiN<sub>x</sub>O<sub>y</sub> with (<b>a</b>) R = 0.3; (<b>b</b>) R = 1; (<b>c</b>) R = 5, and the controlled a-SiN<sub>x</sub> films with (<b>d</b>) R = 5, which was measured after Ar ion beam sputtering at 90 nm depth. For a-SiN<sub>x</sub>O<sub>y</sub> films with different R, the Voigt peak fitting results are also shown as a solid line.</p>
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<p>XPS spectra of N 1s of both a-SiN<sub>x</sub>O<sub>y</sub> with (<b>a</b>) R = 0.3; (<b>b</b>) R = 1; (<b>c</b>) R = 5, and the controlled a-SiN<sub>x</sub> films with (<b>d</b>) R = 5, which was measured after Ar ion beam sputtering at 90 nm depth. For a-SiN<sub>x</sub>O<sub>y</sub> films with different R, the Voigt peak fitting results are also shown as a solid line.</p>
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<p>Normalized PL spectra of the a-SiN<sub>x</sub>O<sub>y</sub> films for various R under the excitation wavelength of 325 nm at 8 K.</p>
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<p>PL and PLE spectra of a-SiN<sub>x</sub>O<sub>y</sub> and a-SiN<sub>x</sub> films with (<b>a</b>) R = 0.3 and (<b>b</b>) R = 1 at room temperature.</p>
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<p>The measured (<b>a</b>) E<sub>PL</sub> vs. E<sub>CB tail</sub>; (<b>b</b>) PL F.W.H.M. and ΔE<sub>stokes</sub> vs. E<sub>U</sub> of a-SiN<sub>x</sub>O<sub>y</sub> and a-SiN<sub>x</sub> films, respectively.</p>
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<p>The PL QY measurement processes of the a-SiN<sub>x</sub>O<sub>y</sub> films with (<b>a</b>) R = 0.5; (<b>b</b>) R = 1; (<b>c</b>) R = 1.5 (Reprinted from ref. [<a href="#B33-nanomaterials-13-01269" class="html-bibr">33</a>]); (<b>d</b>) R = 2.5. Black line: the total incident excitation photons (<b>left</b>). Red line: the unabsorbed excitation photons (<b>left</b>) and corresponding emitted photons (<b>right</b>) when the excitation source is directly shone onto samples. Blue line: the unabsorbed excitation photons (<b>left</b>) and corresponding emitted photons (<b>right</b>) when the excitation source is indirectly shone onto samples.</p>
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<p>Normalized integrated TD-SSPL intensities of a-SiN<sub>x</sub>O<sub>y</sub> thin films (R = 2) with surface etch depths (<b>a</b>) 30 nm and (<b>b</b>) 90 nm, respectively. Red line: Theoretical fitting results of the TD-SSPL intensities of a-SiN<sub>x</sub>O<sub>y</sub> thin films; Blue line: The temperature inflection points of luminescence thermal quenching. The inset shows the related measured TD-SSPL spectra.</p>
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<p>The PL QY of a-SiN<sub>x</sub>O<sub>y</sub> samples with various R under measurement temperatures of (<b>a</b>) RT; (<b>b</b>) 240 K; (<b>c</b>) 180 K; (<b>d</b>) 120 K; (<b>e</b>) 60 K; (<b>f</b>) 8 K. Red and blue lines show the error bars of the temperature-dependent PL QY values.</p>
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21 pages, 14482 KiB  
Article
Tribological Properties of Multilayer CVD Coatings Deposited on SiAlON Ceramic Milling Inserts
by Luke Osmond, Ian Cook and Tom Slatter
J. Manuf. Mater. Process. 2023, 7(2), 67; https://doi.org/10.3390/jmmp7020067 - 15 Mar 2023
Cited by 3 | Viewed by 2110
Abstract
This work characterises the structure and mechanical properties, such as adhesion, of two different chemical vapour deposition (CVD) coatings deposited onto silicon aluminium oxynitride (Si3N4 + Al2O3 + Y2O3) round (RNGN) milling cutter [...] Read more.
This work characterises the structure and mechanical properties, such as adhesion, of two different chemical vapour deposition (CVD) coatings deposited onto silicon aluminium oxynitride (Si3N4 + Al2O3 + Y2O3) round (RNGN) milling cutter tooling inserts. These inserts are often known by the trade abbreviation “SiAlON”. Wear was produced on the inserts using unidirectional sliding (pin-on-disc type) and scratch testing. Two coatings were investigated: a multilayer CVD coating (Coating A) with a composition of TiN + TiCN + Al2O3 and a bilayer coating (Coating B) with a composition of Al2O3 + TiN. Microstructural analysis was conducted after wear testing and Coating B demonstrated high stability when subjected to high alternating shear and tensile stresses, high abrasion resistance and very high adhesion to the SiAlON ceramic insert substrate when compared to Coating A. Coating A demonstrated a low capacity to distribute alternating shear and tensile stresses during the pin-on-disc and scratch testing, which led to failure. The scratch and pin-on-disc results from this study correlate highly with completed machining insert wear analysis that has used Coating A and Coating B SiAlON inserts to machine aged Inconel 718. Full article
(This article belongs to the Special Issue Advances in Metal Cutting and Cutting Tools)
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Figure 1
<p>Typical inserts before use (<b>a</b>) CTIS710 SiAlON ceramic + Type A coating—CVD 6 µm thick TiN-TiCN-Al<sub>2</sub>O<sub>3</sub> coating with α-Al<sub>2</sub>O<sub>3</sub> (black colour); (<b>b</b>) CTIS710 SiAlON ceramic + Type B coating—3–4 µm thick α- Al<sub>2</sub>O<sub>3</sub>–TiN CVD coating optimised for SiAlON ceramics (yellow colour).</p>
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<p>Cross-sectional view of the coating system’s microstructure and its mechanical characteristics.</p>
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<p>Friction coefficient plot vs. time (seconds) vs. friction force (N): (<b>a</b>) Test 1a and (<b>b</b>) Test 2a for Coating A.</p>
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<p>Friction coefficient plot vs. time (seconds) vs. friction force (N): (<b>a</b>) Test 1b and (<b>b</b>) Test 2b for Coating B.</p>
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<p>(<b>a</b>) Worn 4 mm diameter 52100 steel ball that typically represents pin-on-disc Test 1a, 1b, 2a and 2b for Coating A and Coating B; (<b>b</b>) unused 4 mm diameter 52100 steel ball.</p>
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<p>SEM images of Coating A after pin-on-disc Test 1a: (<b>a</b>) ×50 magnification, (<b>b</b>) ×800 magnification.</p>
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<p>SEM images of Coating A after pin-on-disc Test 1a: (<b>a</b>) ×1500 magnification, (<b>b</b>) ×3000 magnification.</p>
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<p>SEM images of Coating B after pin-on-disc Test 1b: (<b>a</b>) ×50 magnification, (<b>b</b>) ×800 magnification.</p>
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<p>SEM images of Coating B after pin-on-disc Test 1b: (<b>a</b>) ×1500 magnification, (<b>b</b>) ×3000 magnification.</p>
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<p>SEM images of Coating A after pin-on-disc Test 2a: (<b>a</b>) ×50 magnification, (<b>b</b>) ×800 magnification.</p>
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<p>SEM images of Coating A after pin-on-disc Test 2a: (<b>a</b>) ×1500 magnification, (<b>b</b>) ×3000 magnification.</p>
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<p>SEM images of Coating B after pin-on-disc Test 2b: (<b>a</b>) ×50 magnification, (<b>b</b>) ×800 magnification.</p>
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<p>SEM images of Coating B after pin-on-disc Test 2b: (<b>a</b>) ×1500 magnification, (<b>b</b>) ×3000 magnification.</p>
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<p>Non-contact 3D profilometer (focus—variation type) scan of (<b>a</b>,<b>c</b>) the Coating A scratch and (<b>b</b>,<b>d</b>) the Coating B scratch.</p>
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<p>Coating A scratch positions 1, 2, 3 and 4 at ×30 Mag.</p>
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<p>(<b>a</b>) Coating A scratch position 1 (initial scratch Lc1) and (<b>b</b>) Coating A scratch position 2 coating fractures and delamination positions at ×180 magnification.</p>
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<p>(<b>a</b>) Coating A scratch position 3 (continued delamination and spalling) and (<b>b</b>) Coating A scratch position 4 (end of the scratch SEM) at ×180 magnification.</p>
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<p>(<b>a</b>) Coating A scratch position 1 (initial scratch Lc1) and (<b>b</b>) Coating A scratch position 4 (end of the scratch SEM) at ×400 magnification.</p>
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<p>(<b>a</b>) Coating A scratch position 1 (initial scratch Lc1) at ×1000 magnification and (<b>b</b>) Coating A scratch position 1 (initial scratch Lc1) at ×1500 magnification.</p>
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<p>Coating B scratch positions 1, 2 and 3 at ×30 magnification.</p>
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<p>(<b>a</b>) Coating B scratch position 1, (<b>b</b>) Coating B scratch position 2 and (<b>c</b>) Coating B scratch position 3 at ×180 magnification.</p>
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<p>(<b>a</b>) Coating B scratch position 1 and (<b>b</b>) Coating B scratch position 3 at ×400 magnification.</p>
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<p>(<b>a</b>) Coating B scratch position 1 and (<b>b</b>) Coating B scratch position 3 at ×1000 magnification.</p>
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<p>Coating A RNGN insert test at (<b>a</b>) 700 m/min and (<b>b</b>) 800 m/min. Coating B RNGN insert test at (<b>c</b>) 700 m/min (<b>d</b>) 800 m/min.</p>
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<p>Nanoindentation test results for Coating A.</p>
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<p>Nanoindentation test results for Coating B.</p>
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15 pages, 2495 KiB  
Article
Charge Transport Mechanism in the Forming-Free Memristor Based on PECVD Silicon Oxynitride
by Andrei A. Gismatulin, Gennadiy N. Kamaev, Vladimir A. Volodin and Vladimir A. Gritsenko
Electronics 2023, 12(3), 598; https://doi.org/10.3390/electronics12030598 - 25 Jan 2023
Cited by 1 | Viewed by 1560
Abstract
A memristor is a new generation memory that merges dynamic random access memory and flash properties. In addition, it can be used in neuromorphic electronics. The advantage of silicon oxynitride, as an active memristor layer, over other dielectrics it is compatibility with silicon [...] Read more.
A memristor is a new generation memory that merges dynamic random access memory and flash properties. In addition, it can be used in neuromorphic electronics. The advantage of silicon oxynitride, as an active memristor layer, over other dielectrics it is compatibility with silicon technology. It is expected that SiNxOy-based memristors will combine the advantages of memristors based on nonstoichiometric silicon oxides and silicon nitrides. In the present work, the plasma-enhanced chemical vapor deposition (PECVD) method was used to fabricate a silicon oxynitride-based memristor. The memristor leakage currents determine its power consumption. To minimize the power consumption, it is required to study the charge transport mechanism in the memristor in the high-resistance state and low-resistance state. The charge transport mechanism in the PECVD silicon oxynitride-based memristor in high and low resistance states cannot be described by the Schottky effect, thermally assisted tunneling model, Frenkel effect model of Coulomb isolated trap ionization, Hill–Adachi model of overlapping Coulomb potentials, Makram–Ebeid and Lannoo model of multiphonon isolated trap ionization, Nasyrov–Gritsenko model of phonon-assisted tunneling between traps, or the Shklovskii–Efros percolation model. The charge transport in the forming-free PECVD SiO0.9N0.6-based memristor in high and low resistance states is described by the space charge limited current model. The trap parameters responsible for the charge transport in various memristor states are determined. For the high-resistance state, the trap ionization energy W is 0.35 eV, and the trap concentration Nd is 1.7 × 1019 cm−3; for the low-resistance state, the trap ionization energy W is 0.01 eV, and the trap concentration Nt is 4.6 × 1017 cm−3. Full article
(This article belongs to the Special Issue RRAM Devices: Multilevel State Control and Applications)
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<p>Schematic diagram of contact-limited models: (<b>a</b>) Schottky effect, (<b>b</b>) thermally assisted tunneling model.</p>
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<p>Schematic diagram of bulk-limited models: (<b>a</b>) Frenkel effect, (<b>b</b>) Hill–Adachi model of overlapping Coulomb potentials, (<b>c</b>) Makram–Ebeid and Lannoo multiphonon isolated trap ionization model, (<b>d</b>) Nasyrov–Gritsenko phonon-assisted tunneling via neighboring traps model.</p>
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<p>IV characteristics of the PECVD SiO<sub>0.9</sub>N<sub>0.6</sub>-based memristor.</p>
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<p>The IV characteristics of the PECVD SiO<sub>0.9</sub>N<sub>0.6</sub>-based memristor and simulation results by the contact-limited models: (<b>a</b>) Schottky effect in LRS; (<b>b</b>) the TAT model in LRS; (<b>c</b>) the Schottky effect in HRS; and (<b>d</b>) the TAT model in HRS.</p>
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<p>IV characteristics of the PECVD SiO<sub>0.9</sub>N<sub>0.6</sub>-based memristor and the results of simulation by the bulk-limited models in the HRS: (<b>a</b>) Frenkel effect; (<b>b</b>) Hill–Adachi model of overlapping Coulomb potentials; (<b>c</b>) Makram–Ebeid and Lannoo model of multiphonon isolated trap ionization; (<b>d</b>) Nasyrov–Gritsenko model of phonon-assisted tunneling between traps; (<b>e</b>) Shklovskii–Efros percolation model; and (<b>f</b>) SCLC model.</p>
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<p>IV characteristics of the PECVD SiO<sub>0.9</sub>N<sub>0.6</sub>-based memristor, and the results of simulation by the bulk-limited models in HRS: (<b>a</b>) Frenkel effect; (<b>b</b>) Hill–Adachi model of overlapping Coulomb potentials; (<b>c</b>) Makram–Ebeid and Lannoo multiphonon isolated trap ionization model; (<b>d</b>) Nasyrov–Gritsenko model of phonon-assisted tunneling between traps, (<b>e</b>) Shklovskii–Efros percolation model; and (<b>f</b>) the SCLC model.</p>
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10 pages, 3231 KiB  
Article
Achieving Cycling Stability in Anode of Lithium-Ion Batteries with Silicon-Embedded Titanium Oxynitride Microsphere
by Sung Eun Wang, DoHoon Kim, Min Ji Kim, Jung Hyun Kim, Yun Chan Kang, Kwang Chul Roh, Junghyun Choi, Hyung Woo Lee and Dae Soo Jung
Nanomaterials 2023, 13(1), 132; https://doi.org/10.3390/nano13010132 - 27 Dec 2022
Cited by 4 | Viewed by 2845
Abstract
Surface coating approaches for silicon (Si) have demonstrated potential for use as anodes in lithium-ion batteries (LIBs) to address the large volume change and low conductivity of Si. However, the practical application of these approaches remains a challenge because they do not effectively [...] Read more.
Surface coating approaches for silicon (Si) have demonstrated potential for use as anodes in lithium-ion batteries (LIBs) to address the large volume change and low conductivity of Si. However, the practical application of these approaches remains a challenge because they do not effectively accommodate the pulverization of Si during cycling or require complex processes. Herein, Si-embedded titanium oxynitride (Si-TiON) was proposed and successfully fabricated using a spray-drying process. TiON can be uniformly coated on the Si surface via self-assembly, which can enhance the Si utilization and electrode stability. This is because TiON exhibits high mechanical strength and electrical conductivity, allowing it to act as a rigid and electrically conductive matrix. As a result, the Si-TiON electrodes delivered an initial reversible capacity of 1663 mA h g−1 with remarkably enhanced capacity retention and rate performance. Full article
(This article belongs to the Topic Energy Storage Materials and Devices)
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<p>Physicochemical properties of TiON prepared with different nitridation temperatures. (<b>a</b>) XRD patterns and (<b>b</b>) magnified major peaks at 2-theta 42–44°. (<b>c</b>) Electrical conductivity behavior of TiON prepared at different nitridation temperatures as a function of pressure with those of a commercial carbon conductor (super-P). (<b>d</b>) Nitrogen adsorption and desorption isotherms; (Inset) surface area depends on the nitridation temperature of TiO<sub>2</sub>.</p>
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<p>(<b>a</b>) Graphical illustration for synthesis of Si-TiON composite using spray-drying and subsequent nitridation. FE-SEM images of Si-TiON composite synthesized using different molar ratios of Si and TiON: (<b>b</b>) 1:0.5 (<b>c</b>) 1:1 (<b>d</b>) 1:2. Inset represents high-resolution images.</p>
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<p>HRTEM images of Si-TiON (1:1) composite at (<b>a</b>) low and (<b>b</b>,<b>c</b>) high magnifications. Right inset shows lattice fringes within the TiON coating layer and Si core particle along directions (004) and (222), respectively. (<b>d</b>) Energy-dispersive X-ray spectra from points 1 and 2 in (<b>c</b>). (<b>e</b>) Si, Ti, O, and N elemental mapping indicating that TiON was well-distributed in the shell region.</p>
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<p>XRD patterns of (<b>a</b>) Si-TiO<sub>2</sub> prepared by the spray-drying process and (<b>b</b>) subsequently nitrided Si-TiON composite with ratios of 1:0.5, 1:1, and 1:2. (<b>c</b>,<b>d</b>) X-ray photoelectron spectra for Si-TiON (1:1) composite in the region of binding energies of Ti 2p and N 1s core levels.</p>
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<p>Voltage profiles for first and selected subsequent cycles at 0.1 A g<sup>−1</sup> and 2 A g<sup>−1</sup>, respectively: (<b>a</b>) Si NPs, (<b>b</b>) Si-TiON (1:0.5), and (<b>c</b>) Si-TiON (1:1).</p>
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<p>(<b>a</b>) Cycling performance of Si-TiON (1:1) measured at 1 A g<sup>−1</sup> and (<b>b</b>) comparison of rate performances of Si NPs and Si-TiON (1:1) at different current densities.</p>
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11 pages, 3824 KiB  
Article
High-Temperature Interactions of Silicon-Aluminum Oxynitrides (Sialons) with Sodium Fluoride
by Nailya S. Akhmadullina, Vladimir P. Sirotinkin, Nikolay A. Ovsyannikov, Anton S. Lysenkov and Yury F. Kargin
Inorganics 2022, 10(9), 140; https://doi.org/10.3390/inorganics10090140 - 16 Sep 2022
Cited by 2 | Viewed by 1695
Abstract
The high-temperature interactions of β-SiAlONs with sodium fluoride NaF at 1650 °C under a nitrogen atmosphere are described in this paper. It was found that in case of Si5AlON7 the formation of phases enriched with aluminum occurred, including Si4 [...] Read more.
The high-temperature interactions of β-SiAlONs with sodium fluoride NaF at 1650 °C under a nitrogen atmosphere are described in this paper. It was found that in case of Si5AlON7 the formation of phases enriched with aluminum occurred, including Si4Al2O2N6 at an NaF loading of 0.5 wt.% and Si4Al2O2N6 and Si3.1Al2.9O2.9N5.1 at an NaF loading of 2.0 wt.%, although Si5AlON7 still was a major phase. For Si4Al2O2N6, a kind of disproportionation was observed, and Si5AlON7 formed together with Si3Al3O3N5 and Si3.1Al2.9O2.9N5.1. Moreover, the initial phase Si4Al2O2N6 was not identified at all, while Si5AlON7 was found to be a major phase at an NaF loading of 0.5 wt.% and Si3.1Al2.9O2.9N5.1 prevailed at an NaF loading of 2.0 wt.%. All the samples showed a high degree of densification when studied with scanning electronic microscopy. Full article
(This article belongs to the Special Issue Inorganics: 10th Anniversary)
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Graphical abstract

Graphical abstract
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<p>XRD-pattern of the samples <b>SiAlON-1</b> (<b>a</b>,<b>b</b>) and <b>SiAlON-2</b> (<b>c</b>,<b>d</b>).</p>
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<p>SEM-images of the samples <b>SiAlON-1</b> (<b>a</b>) and <b>SiAlON-2</b> (<b>b</b>) and element mapping with EDX spectroscopy for the sample <b>SiAlON-1</b> (<b>c</b>–<b>f</b>).</p>
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<p>XRD-pattern of crystalline whiskers formed on the wall of the crucible after the sintering of <b>SiAlON-2:0.5%NaF</b> sample.</p>
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<p>Characteristic parts of XRD patterns of the <b>SiAlON:NaF</b> samples after sintering: (<b>a</b>) <b>SiAlON-1:0.5%NaF</b>; (<b>b</b>) <b>SiAlON-1:2.0%NaF</b>; (<b>c</b>) <b>SiAlON-2:0.5%NaF</b>; (<b>d</b>) <b>SiAlON-2:2.0%NaF</b> (the full XRD patterns can be found in the <a href="#app1-inorganics-10-00140" class="html-app">Supplementary Materials</a>).</p>
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<p>SEM images of the sample <b>SiAlON-2:2.0%NaF</b> (<b>a</b>,<b>b</b>) and element mapping with EDX spectroscopy (<b>c</b>–<b>f</b>).</p>
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<p>Mechanical and physical properties of β-SiAlONs depending on the <span class="html-italic">z</span> value (according to literature data [<a href="#B24-inorganics-10-00140" class="html-bibr">24</a>,<a href="#B40-inorganics-10-00140" class="html-bibr">40</a>,<a href="#B41-inorganics-10-00140" class="html-bibr">41</a>]).</p>
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<p>The changes in composition of Si<sub>5</sub>AlON<sub>7</sub> and Si<sub>4</sub>Al<sub>2</sub>O<sub>2</sub>N<sub>6</sub> under the high-temperature sintering with NaF.</p>
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