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Keywords = PCB surface defect detection

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19 pages, 6599 KiB  
Article
A Lightweight Strip Steel Surface Defect Detection Network Based on Improved YOLOv8
by Yuqun Chu, Xiaoyan Yu and Xianwei Rong
Sensors 2024, 24(19), 6495; https://doi.org/10.3390/s24196495 - 9 Oct 2024
Viewed by 546
Abstract
Strip steel surface defect detection has become a crucial step in ensuring the quality of strip steel production. To address the issues of low detection accuracy and long detection times in strip steel surface defect detection algorithms caused by varying defect sizes and [...] Read more.
Strip steel surface defect detection has become a crucial step in ensuring the quality of strip steel production. To address the issues of low detection accuracy and long detection times in strip steel surface defect detection algorithms caused by varying defect sizes and blurred images during acquisition, this paper proposes a lightweight strip steel surface defect detection network, YOLO-SDS, based on an improved YOLOv8. Firstly, StarNet is utilized to replace the backbone network of YOLOv8, achieving lightweight optimization while maintaining accuracy. Secondly, a lightweight module DWR is introduced into the neck and combined with the C2f feature extraction module to enhance the model’s multi-scale feature extraction capability. Finally, an occlusion-aware attention mechanism SEAM is incorporated into the detection head, enabling the model to better capture and process features of occluded objects, thus improving performance in complex scenarios. Experimental results on the open-source NEU-DET dataset show that the improved model reduces parameters by 34.4% compared with the original YOLOv8 algorithm while increasing average detection accuracy by 1.5%. And it shows good generalization performance on the deepPCB dataset. Compared with other defect detection models, YOLO-SDS offers significant advantages in terms of parameter count and detection speed. Additionally, ablation experiments validate the effectiveness of each module. Full article
(This article belongs to the Section Fault Diagnosis & Sensors)
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<p>Architecture of the proposed YOLO-SDS.</p>
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<p>StarNet architecture overview.</p>
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<p>Diagram of the DWR module structure.</p>
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<p>Diagram of the C2f_DWR structure.</p>
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<p>Illustration of SEAM. (<b>a</b>) The architecture of SEAM. (<b>b</b>) The structure of CSMM.</p>
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<p>(<b>a</b>) Original YOLOv8 detection head; (<b>b</b>) Proposed detection head in this paper.</p>
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<p>Loss curve of YOLO-SDS.</p>
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<p>Detection outcomes for various types of defects. (<b>a</b>) Precision; (<b>b</b>) Recall; (<b>c</b>) mAP@0.5; and (<b>d</b>) mAP@0.5:0.95.</p>
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<p>P–R curve of different kinds of defects. (<b>a</b>) YOLOv8n and (<b>b</b>) YOLO–SDS.</p>
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<p>F1 score curve for different kinds of defects. (<b>a</b>) YOLOv8n and (<b>b</b>) YOLO-SDS.</p>
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<p>Confusion matrix for the validation set with defects of different classes. (<b>a</b>) Original and (<b>b</b>) YOLO-SDS.</p>
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<p>Confusion matrix for the validation set with defects of different classes. (<b>a</b>) Original and (<b>b</b>) YOLO-SDS.</p>
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<p>Detection outcomes on NEU-DET.</p>
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<p>Visual comparison between YOLO-SDS and the original YOLOv8n. (<b>a</b>) Original; (<b>b</b>) YOLOv8n; and (<b>c</b>) YOLO-SDS.</p>
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<p>Some cases of detection failures. The defects are very blurry, making it difficult for the detector to detect them accurately. (<b>a</b>) rs and (<b>b</b>) cr.</p>
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<p>Comparative experimental results on the deepPCB dataset.</p>
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19 pages, 4051 KiB  
Article
YOLO-RRL: A Lightweight Algorithm for PCB Surface Defect Detection
by Tian Zhang, Jie Zhang, Pengfei Pan and Xiaochen Zhang
Appl. Sci. 2024, 14(17), 7460; https://doi.org/10.3390/app14177460 - 23 Aug 2024
Viewed by 816
Abstract
Printed circuit boards present several challenges to the detection of defects, including targets of insufficient size and distribution, a high level of background noise, and a variety of complex types. These factors contribute to the difficulties encountered by PCB defect detection networks in [...] Read more.
Printed circuit boards present several challenges to the detection of defects, including targets of insufficient size and distribution, a high level of background noise, and a variety of complex types. These factors contribute to the difficulties encountered by PCB defect detection networks in accurately identifying defects. This paper proposes a less-parametric model, YOLO-RRL, based on the improved YOLOv8 architecture. The YOLO-RRL model incorporates four key improvement modules: The following modules have been incorporated into the proposed model: Robust Feature Downsampling (RFD), Reparameterised Generalised FPN (RepGFPN), Dynamic Upsampler (DySample), and Lightweight Asymmetric Detection Head (LADH-Head). The results of multiple performance metrics evaluation demonstrate that YOLO-RRL enhances the mean accuracy (mAP) by 2.2 percentage points to 95.2%, increases the frame rate (FPS) by 12%, and significantly reduces the number of parameters and the computational complexity, thereby achieving a balance between performance and efficiency. Two datasets, NEU-DET and APSPC, were employed to evaluate the performance of YOLO-RRL. The results indicate that YOLO-RRL exhibits good adaptability. In comparison to existing mainstream inspection models, YOLO-RRL is also more advanced. The YOLO-RRL model is capable of significantly improving production quality and reducing production costs in practical applications while also extending the scope of the inspection system to a wide range of industrial applications. Full article
(This article belongs to the Section Computing and Artificial Intelligence)
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<p>A diagrammatic representation of the YOLO-RRL network structure.</p>
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<p>Generic RFD structure after replacement with SRFD and DRFD modules.</p>
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<p>SRFD and DRFD Modules Details.</p>
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<p>RepGFPN network architecture.</p>
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<p>Sampling-based dynamic upsampling and module designs in DySample. (<b>a</b>) Sampling-based dynamic upsampling. (<b>b</b>) Sampling point generator in DySample.</p>
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<p>Network Architecture for Lightweight Asymmetric Detection Head (LADH-Head).</p>
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<p>PCB Defect Type Image. The blue boxes show specific defects: (<b>a</b>) missing hole; (<b>b</b>) mouse bite; (<b>c</b>) open circuit; (<b>d</b>) short; (<b>e</b>) spur; (<b>f</b>) spurious copper.</p>
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<p>Number of labels for different defect types before and after data enhancement.</p>
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<p>Changes in key metrics during training in YOLOv8 and YOLO-RRL.</p>
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<p>Changes in loss during YOLOv8 and YOLO-RRL training.</p>
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<p>Validation results for YOLO-RRL and YOLOv8. (<b>a</b>) Original image; (<b>b</b>) YOLOv8; (<b>c</b>) YOLO-RRL.</p>
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16 pages, 2681 KiB  
Article
Local and Global Context-Enhanced Lightweight CenterNet for PCB Surface Defect Detection
by Weixun Chen, Siming Meng and Xueping Wang
Sensors 2024, 24(14), 4729; https://doi.org/10.3390/s24144729 - 21 Jul 2024
Cited by 1 | Viewed by 829
Abstract
Printed circuit board (PCB) surface defect detection is an essential part of the PCB manufacturing process. Currently, advanced CCD or CMOS sensors can capture high-resolution PCB images. However, the existing computer vision approaches for PCB surface defect detection require high computing effort, leading [...] Read more.
Printed circuit board (PCB) surface defect detection is an essential part of the PCB manufacturing process. Currently, advanced CCD or CMOS sensors can capture high-resolution PCB images. However, the existing computer vision approaches for PCB surface defect detection require high computing effort, leading to insufficient efficiency. To this end, this article proposes a local and global context-enhanced lightweight CenterNet (LGCL-CenterNet) to detect PCB surface defects in real time. Specifically, we propose a two-branch lightweight vision transformer module with local and global attention, named LGT, as a complement to extract high-dimension features and leverage context-aware local enhancement after the backbone network. In the local branch, we utilize coordinate attention to aggregate more powerful features of PCB defects with different shapes. In the global branch, Bi-Level Routing Attention with pooling is used to capture long-distance pixel interactions with limited computational cost. Furthermore, a Path Aggregation Network (PANet) feature fusion structure is incorporated to mitigate the loss of shallow features caused by the increase in model depth. Then, we design a lightweight prediction head by using depthwise separable convolutions, which further compresses the computational complexity and parameters while maintaining the detection capability of the model. In the experiment, the LGCL-CenterNet increased the [email protected] by 2% and 1.4%, respectively, in comparison to CenterNet-ResNet18 and YOLOv8s. Meanwhile, our approach requires fewer model parameters (0.542M) than existing techniques. The results show that the proposed method improves both detection accuracy and inference speed and indicate that the LGCL-CenterNet has better real-time performance and robustness. Full article
(This article belongs to the Section Sensing and Imaging)
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<p>Six different kinds of PCB defects.</p>
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<p>The overall network architecture of the proposed local and global context-enhanced lightweight CenterNet.</p>
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<p>Ratio of PCB defect bounding box area to total image area.</p>
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<p>The structure of local coordinate attention and global self-attention.</p>
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<p>Sparse attention is used to skip computations in the most irrelevant region, and pooling is used to downsample the key and value to reduce FLOPs.</p>
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<p>Detection results of different object detection algorithms. More detection results of the other defects can be found in the <a href="#app1-sensors-24-04729" class="html-app">Supplementary Materials</a>.</p>
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14 pages, 8230 KiB  
Article
Automatic PCB Sample Generation and Defect Detection Based on ControlNet and Swin Transformer
by Yulong Liu, Hao Wu, Youzhi Xu, Xiaoming Liu and Xiujuan Yu
Sensors 2024, 24(11), 3473; https://doi.org/10.3390/s24113473 - 28 May 2024
Cited by 1 | Viewed by 898
Abstract
In order to improve the efficiency and accuracy of multitarget detection of soldering defects on surface-mounted components in Printed Circuit Board (PCB) fabrication, we propose a sample generation method using Stable Diffusion Model and ControlNet, as well as a defect detection method based [...] Read more.
In order to improve the efficiency and accuracy of multitarget detection of soldering defects on surface-mounted components in Printed Circuit Board (PCB) fabrication, we propose a sample generation method using Stable Diffusion Model and ControlNet, as well as a defect detection method based on the Swin Transformer. The method consists of two stages: First, high-definition original images collected in industrial production and the corresponding prompts are input to Stable Diffusion Model and ControlNet for automatic generation of nonindependent samples. Subsequently, we integrate Swin Transformer as the backbone into the Cascade Mask R-CNN to improve the quality of defect features extracted from the samples for accurate detection box localization and segmentation. Instead of segmenting individual components on the PCB, the method inspects all components in the field of view simultaneously over a larger area. The experimental results demonstrate the effectiveness of our method in scaling up nonindependent sample datasets, thereby enabling the generation of high-quality datasets. The method accurately recognizes targets and detects defect types when performing multitarget inspection on printed circuit boards. The analysis against other models shows that our improved defect detection and segmentation method improves the Average Recall (AR) by 2.8% and the mean Average Precision (mAP) by 1.9%. Full article
(This article belongs to the Section Electronic Sensors)
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<p>Typical surface mount components.</p>
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<p>Automatic sample generation method based on ControlNet and Stable Diffusion Model.</p>
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<p>(<b>a</b>) Swin Transformer backbone. (<b>b</b>) Two-stage Swin Transformer Block [<a href="#B13-sensors-24-03473" class="html-bibr">13</a>].</p>
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<p>Defect detection model. The red dashed box shows the backbone structure of Swin Transformer; the orange dashed box shows the Neck structure using FPN for feature fusion; the green dashed box shows the Cascade Head architecture; A represents the ROI Align pooling layer at different stages, B is the detection box at different stages, C is the classification result at different stages.</p>
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<p>Frequency of occurrence of different prompts.</p>
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<p>(<b>a</b>) Original input image; (<b>b</b>) corresponding inverse color map; (<b>c</b>) Canny feature map obtained using ControlNet; (<b>d</b>) result generated by Img2Img; (<b>e</b>) difference map obtained by subtracting (<b>a</b>) from (<b>d</b>).</p>
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<p>Some defective samples; (<b>a</b>) tombstone resistor; (<b>b</b>) shift capacitor; (<b>c</b>) missing potentiometer.</p>
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<p>The bbox_mAP of Swin Transformer-based Cascade Mask R-CNN and original Cascade Mask R-CNN during training.</p>
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<p>Comparison of detection results of different models, where (<b>a<sub>1</sub></b>–<b>a<sub>3</sub></b>) are the original images of the PCB samples; (<b>b<sub>1</sub></b>–<b>b<sub>3</sub></b>) are the test results using Cascade Mask R-CNN; (<b>c<sub>1</sub></b>–<b>c<sub>3</sub></b>) are the test results using our proposed method.</p>
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<p>Comparison of detection results of different models, where (<b>a<sub>1</sub></b>–<b>a<sub>3</sub></b>) are the original images of the PCB samples; (<b>b<sub>1</sub></b>–<b>b<sub>3</sub></b>) are the test results using Cascade Mask R-CNN; (<b>c<sub>1</sub></b>–<b>c<sub>3</sub></b>) are the test results using our proposed method.</p>
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16 pages, 6897 KiB  
Article
DSASPP: Depthwise Separable Atrous Spatial Pyramid Pooling for PCB Surface Defect Detection
by Yuhang Xu and Hua Huo
Electronics 2024, 13(8), 1490; https://doi.org/10.3390/electronics13081490 - 14 Apr 2024
Cited by 1 | Viewed by 929
Abstract
Printed circuit board (PCB) defect detection is an important and indispensable part of industrial production. PCB defects, due to the small target and similarity between classes, in the actual production of the detection process are prone to omission and false detection problems. Traditional [...] Read more.
Printed circuit board (PCB) defect detection is an important and indispensable part of industrial production. PCB defects, due to the small target and similarity between classes, in the actual production of the detection process are prone to omission and false detection problems. Traditional machine-learning-based detection methods are limited by the actual needs of industrial defect detection and do not show good results. Aiming at the problems related to PCB defect detection, we propose a PCB defect detection algorithm based on DSASPP-YOLOv5 and conduct related experiments on the PKU-Market-PCB dataset. DSASPP-YOLOv5 is an improved single-stage detection model, and we first used the K-means++ algorithm for the PKU-Market-PCB dataset to recluster the model so that the model is more in line with the characteristics of PCB small target defects. Second, we design the Depthwise Separable Atrous Spatial Pyramid Pooling (DSASPP) module, which effectively improves the correlation between local and global information by constructing atrous convolution branches with different dilated rates and a global average pooling branch. The experimental results show that our model achieves satisfactory results in both the mean average precision and detection speed metrics compared to existing models, proving the effectiveness of the proposed method. Full article
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<p>Structure of DSASPP-YOLOv5.</p>
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<p>Structure of the DSASPP module.</p>
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<p>The “Gridding Effect” of atrous convolution.</p>
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<p>Atrous convolution at a reasonable rate of dilation.</p>
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<p>Functional images of ReLU, PReLU and GELU.</p>
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<p>Structure of the depthwise separable convolution.</p>
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<p>Types of PCB surface defects.</p>
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<p>PCB defect target aspect ratio.</p>
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<p>K-means++ clustering results.</p>
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<p>Comparison of visual inspection results.</p>
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<p>Comparison of mAP change curves prior to and following improvement.</p>
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17 pages, 2228 KiB  
Article
Applying Machine Learning to Construct a Printed Circuit Board Gold Finger Defect Detection System
by Chien-Yi Huang and Pei-Xuan Tsai
Electronics 2024, 13(6), 1090; https://doi.org/10.3390/electronics13061090 - 15 Mar 2024
Cited by 1 | Viewed by 1180
Abstract
Machine vision systems use industrial cameras’ digital sensors to collect images and use computers for image pre-processing, analysis, and the measurements of various features to make decisions. With increasing capacity and quality demands in the electronic industry, incoming quality control (IQC) standards are [...] Read more.
Machine vision systems use industrial cameras’ digital sensors to collect images and use computers for image pre-processing, analysis, and the measurements of various features to make decisions. With increasing capacity and quality demands in the electronic industry, incoming quality control (IQC) standards are becoming more and more stringent. The industry’s incoming quality control is mainly based on manual sampling. Although it saves time and costs, the miss rate is still high. This study aimed to establish an automatic defect detection system that could quickly identify defects in the gold finger on printed circuit boards (PCBs) according to the manufacturer’s standard. In the general training iteration process of deep learning, parameters required for image processing and deductive reasoning operations are automatically updated. In this study, we discussed and compared the object detection networks of the YOLOv3 (You Only Look Once, Version 3) and Faster Region-Based Convolutional Neural Network (Faster R-CNN) algorithms. The results showed that the defect classification detection model, established based on the YOLOv3 network architecture, could identify defects with an accuracy of 95%. Therefore, the IQC sampling inspection was changed to a full inspection, and the surface mount technology (SMT) full inspection station was canceled to reduce the need for inspection personnel. Full article
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<p>Display of a panel comprising five PCBs (each PCB is intricately designed with 144 golden fingers).</p>
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<p>Appearance characteristics of each gold finger defect category.</p>
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<p>Gold finger image range.</p>
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<p>YOLOv3 training process diagram.</p>
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<p>Boundary box prediction diagram.</p>
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<p>Faster R-CNN framework.</p>
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<p>Position correction diagram.</p>
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<p>Data training validation.</p>
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16 pages, 9983 KiB  
Article
Advancements in Electric Vehicle PCB Inspection: Application of Multi-Scale CBAM, Partial Convolution, and NWD Loss in YOLOv5
by Hanlin Xu, Li Wang and Feng Chen
World Electr. Veh. J. 2024, 15(1), 15; https://doi.org/10.3390/wevj15010015 - 3 Jan 2024
Cited by 4 | Viewed by 2312
Abstract
In the rapidly evolving electric vehicle industry, the reliability of electronic systems is critical to ensuring vehicle safety and performance. Printed circuit boards (PCBs), serving as a cornerstone in these systems, necessitate efficient and accurate surface defect detection. Traditional PCB surface defect detection [...] Read more.
In the rapidly evolving electric vehicle industry, the reliability of electronic systems is critical to ensuring vehicle safety and performance. Printed circuit boards (PCBs), serving as a cornerstone in these systems, necessitate efficient and accurate surface defect detection. Traditional PCB surface defect detection methods, like basic image processing and manual inspection, are inefficient and error-prone, especially for complex, minute, or irregular defects. Addressing this issue, this study introduces a technology based on the YOLOv5 network structure. By integrating the Convolutional Block Attention Module (CBAM), the model’s capability in recognizing intricate and small defects is enhanced. Further, partial convolution (PConv) replaces traditional convolution for more effective spatial feature extraction and reduced redundant computation. In the network’s final stage, multi-scale defect detection is implemented. Additionally, the normalized Wasserstein distance (NWD) loss function is introduced, considering relationships between different categories, thereby effectively solving class imbalance and multi-scale defect detection issues. Training and validation on a public PCB dataset showed the model’s superior detection accuracy and reduced false detection rate compared to traditional methods. Real-time monitoring results confirm the model’s ability to accurately detect various types and sizes of PCB surface defects, satisfying the real-time detection needs of electric vehicle production lines and providing crucial technical support for electric vehicle reliability. Full article
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<p>Electric vehicle structure.</p>
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<p>The network structure of the model.</p>
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<p>Schematic diagram of CBAM structure.</p>
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<p>(<b>a</b>) Convolution with <math display="inline"><semantics> <mrow> <mi>k</mi> <mo>×</mo> <mi>k</mi> <mo>×</mo> <mi>c</mi> </mrow> </semantics></math> convolution kernels; (<b>b</b>) Partial convolution.</p>
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<p>Schematic of three different convolutions: (<b>a</b>) Schematic diagram of PConv and PWConv structure; (<b>b</b>) Schematic diagram of T-shaped Conv structure; (<b>c</b>) Schematic diagram of regular Conv structure.</p>
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<p>Loss function improvement schematic.</p>
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<p>PCB data set composition.</p>
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<p>Training results graph.</p>
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<p>Comparison of inference results.</p>
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<p>Stacked histogram of size and percentage of detection FPS.</p>
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18 pages, 42942 KiB  
Article
PCB Defect Detection via Local Detail and Global Dependency Information
by Bixian Feng and Jueping Cai
Sensors 2023, 23(18), 7755; https://doi.org/10.3390/s23187755 - 8 Sep 2023
Cited by 6 | Viewed by 2799
Abstract
Due to the impact of the production environment, there may be quality issues on the surface of printed circuit boards (PCBs), which could result in significant economic losses during the application process. As a result, PCB surface defect detection has become an essential [...] Read more.
Due to the impact of the production environment, there may be quality issues on the surface of printed circuit boards (PCBs), which could result in significant economic losses during the application process. As a result, PCB surface defect detection has become an essential step for managing PCB production quality. With the continuous advancement of PCB production technology, defects on PCBs now exhibit characteristics such as small areas and diverse styles. Utilizing global information plays a crucial role in detecting these small and variable defects. To address this challenge, we propose a novel defect detection framework named Defect Detection TRansformer (DDTR), which combines convolutional neural networks (CNNs) and transformer architectures. In the backbone, we employ the Residual Swin Transformer (ResSwinT) to extract both local detail information using ResNet and global dependency information through the Swin Transformer. This approach allows us to capture multi-scale features and enhance feature expression capabilities.In the neck of the network, we introduce spatial and channel multi-head self-attention (SCSA), enabling the network to focus on advantageous features in different dimensions. Moving to the head, we employ multiple cascaded detectors and classifiers to further improve defect detection accuracy. We conducted extensive experiments on the PKU-Market-PCB and DeepPCB datasets. Comparing our proposed DDTR framework with existing common methods, we achieved the highest F1-score and produced the most informative visualization results. Lastly, ablation experiments were performed to demonstrate the feasibility of individual modules within the DDTR framework. These experiments confirmed the effectiveness and contributions of our approach. Full article
(This article belongs to the Special Issue Deep-Learning-Based Defect Detection for Smart Manufacturing)
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<p>Some defect examples. (<b>a</b>) Missing hole, (<b>b</b>) Short, (<b>c</b>) Mouse bite, (<b>d</b>) Spur, (<b>e</b>) Open circuit, (<b>f</b>) Spurious copper.</p>
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<p>The overall architecture of DDTR. Firstly, the image is input into a dual backbone network called ResSwinT composed of Resnet and Swin Transformer to obtain the multi-scale features. In the neck, feature enhancement is performed by mixing convolutional layers and Transformer. Due to the various shapes of defects on PCBs, DDTR introduces a spatial attention mechanism to enable the network to adaptively perceive important spatial features. Additionally, the features extracted by the backbone exhibit high dimensionality in terms of channels, and DDTR will prioritize crucial channels through channel attention. Lastly, in the head of DDTR, the same cascade heads as those in Cascade R-CNN are employed to enhance the accuracy of PCB defect recognition and detection.</p>
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<p>The structure of stem layer and stage-1 in ResSwinT.</p>
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<p>The structure of stage-i in ResSwinT.</p>
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<p>The structure of SCSA. The purple background module is SSA, and the blue background module is CSA.</p>
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<p>The operation process of partition.</p>
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<p>Examples of PKU-Market-PCB datasets and DeepPCB datasets.</p>
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<p>Some visualization results on the PKU-Market-PCB dataset. (<b>a</b>) Input image, (<b>b</b>) ground truth, (<b>c</b>) YOLOv3, (<b>d</b>) SSD, (<b>e</b>) Faster R-CNN_ResNet50, (<b>f</b>) Faster R-CNN_ResNet101, (<b>g</b>) Cascade R-CNN_ResNet50, (<b>h</b>) Cascade R-CNN_ResNet101, (<b>i</b>) Cascade R-CNN_SwinT-T, (<b>j</b>) Cascade R-CNN_SwinT-S, (<b>k</b>) DDTR_ResSwinT-T, (<b>l</b>) DDTR_ResSwinT-S.</p>
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<p>Some visualization results on the DeepPCB dataset. (<b>a</b>) Input image, (<b>b</b>) ground truth, (<b>c</b>) YOLOv3, (<b>d</b>) SSD, (<b>e</b>) Faster R-CNN_ResNet50, (<b>f</b>) Faster R-CNN_ResNet101, (<b>g</b>) Cascade R-CNN_ResNet50, (<b>h</b>) Cascade R-CNN_ResNet101, (<b>i</b>) Cascade R-CNN_SwinT-T, (<b>j</b>) Cascade R-CNN_SwinT-S, (<b>k</b>) DDTR_ResSwinT-T, (<b>l</b>) DDTR_ResSwinT-S.</p>
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24 pages, 11992 KiB  
Article
YOLO-MBBi: PCB Surface Defect Detection Method Based on Enhanced YOLOv5
by Bowei Du, Fang Wan, Guangbo Lei, Li Xu, Chengzhi Xu and Ying Xiong
Electronics 2023, 12(13), 2821; https://doi.org/10.3390/electronics12132821 - 26 Jun 2023
Cited by 22 | Viewed by 3681
Abstract
Printed circuit boards (PCBs) are extensively used to assemble electronic equipment. Currently, PCBs are an integral part of almost all electronic products. However, various surface defects can still occur during mass production. An enhanced YOLOv5s network named YOLO-MBBi is proposed to detect surface [...] Read more.
Printed circuit boards (PCBs) are extensively used to assemble electronic equipment. Currently, PCBs are an integral part of almost all electronic products. However, various surface defects can still occur during mass production. An enhanced YOLOv5s network named YOLO-MBBi is proposed to detect surface defects on PCBs to address the shortcomings of the existing PCB surface defect detection methods, such as their low accuracy and poor real-time performance. YOLO-MBBi uses MBConv (mobile inverted residual bottleneck block) modules, CBAM attention, BiFPN, and depth-wise convolutions to substitute layers in the YOLOv5s network and replace the CIoU loss function with the SIoU loss function during training. Two publicly available datasets were selected for this experiment. The experimental results showed that the mAP50 and recall values of YOLO-MBBi were 95.3% and 94.6%, which were 3.6% and 2.6% higher than those of YOLOv5s, respectively, and the FLOPs were 12.8, which was much smaller than YOLOv7’s 103.2. The FPS value reached 48.9. Additionally, after using another dataset, the YOLO-MBBi metrics also achieved satisfactory accuracy and met the needs of industrial production. Full article
(This article belongs to the Special Issue Deep Learning-Based Computer Vision: Technologies and Applications)
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<p>Six types of common PCB surface defects.</p>
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<p>The structure of YOLOv5s network.</p>
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<p>The MBConv module structure.</p>
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<p>The CBAM attention structure [<a href="#B15-electronics-12-02821" class="html-bibr">15</a>].</p>
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<p>The channel attention structure [<a href="#B15-electronics-12-02821" class="html-bibr">15</a>].</p>
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<p>The spatial attention structure [<a href="#B15-electronics-12-02821" class="html-bibr">15</a>].</p>
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<p>The BiFPN network structure [<a href="#B16-electronics-12-02821" class="html-bibr">16</a>].</p>
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<p>The depth-wise convolution structure. For the input feature map, the features of each channel are separately convolved to obtain a feature map with the same number of channels, and then the number of channels in the feature map is expanded by using point-by-point convolution [<a href="#B17-electronics-12-02821" class="html-bibr">17</a>].</p>
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<p>Four sample images from PKU-Market-PCB dataset. (<b>a</b>,<b>b</b>) Images of a normally placed PCB, (<b>c</b>,<b>d</b>) images after random rotation.</p>
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<p>Two sample images from DeepPCB dataset. (<b>a</b>) PCB images without surface defects, (<b>b</b>) PCB images with surface defects.</p>
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<p>Changes in mAP50 values of the four weights during the training process when using PKU-Market-PCB dataset.</p>
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<p>Changes in mAP50 values of the four weights during the training process when using DeepPCB dataset.</p>
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<p>Comparison of the detection results of Faster-RCNN, TDD-Net, YOLOv4, YOLOv5s, YOLOv7, and YOLO-MBBi for six types of defects in the order of missing holes, mouse bites, open circuits, shorts, spurs, and spurious copper when using PKU-Market-PCB dataset.</p>
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<p>Comparison of the detection results of Faster-RCNN, TDD-Net, YOLOv4, YOLOv5s, YOLOv7, and YOLO-MBBi for six types of defects in the order of missing holes, mouse bites, open circuits, shorts, spurs, and spurious copper when using PKU-Market-PCB dataset.</p>
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<p>Comparison of the detection results of Faster-RCNN, TDD-Net, YOLOv4, YOLOv5s, YOLOv7, and YOLO-MBBi for six types of defects in the order of missing holes, mouse bites, open circuits, shorts, spurs, and spurious copper when using PKU-Market-PCB dataset.</p>
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<p>Comparison of the detection results of Faster-RCNN, TDD-Net, YOLOv4, YOLOv5s, YOLOv7, and YOLO-MBBi for six types of defects when using DeepPCB dataset.</p>
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<p>Comparison of the detection results of Faster-RCNN, TDD-Net, YOLOv4, YOLOv5s, YOLOv7, and YOLO-MBBi for six types of defects when using DeepPCB dataset.</p>
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15 pages, 7610 KiB  
Article
FM-STDNet: High-Speed Detector for Fast-Moving Small Targets Based on Deep First-Order Network Architecture
by Xinyu Hu, Defeng Kong, Xiyang Liu, Junwei Zhang and Daode Zhang
Electronics 2023, 12(8), 1829; https://doi.org/10.3390/electronics12081829 - 12 Apr 2023
Cited by 4 | Viewed by 1462
Abstract
Identifying objects of interest from digital vision signals is a core task of intelligent systems. However, fast and accurate identification of small moving targets in real-time has become a bottleneck in the field of target detection. In this paper, the problem of real-time [...] Read more.
Identifying objects of interest from digital vision signals is a core task of intelligent systems. However, fast and accurate identification of small moving targets in real-time has become a bottleneck in the field of target detection. In this paper, the problem of real-time detection of the fast-moving printed circuit board (PCB) tiny targets is investigated. This task is very challenging because PCB defects are usually small compared to the whole PCB board, and due to the pursuit of production efficiency, the actual production PCB moving speed is usually very fast, which puts higher requirements on the real-time of intelligent systems. To this end, a new model of FM-STDNet (Fast Moving Small Target Detection Network) is proposed based on the well-known deep learning detector YOLO (You Only Look Once) series model. First, based on the SPPNet (Spatial Pyramid Pooling Networks) network, a new SPPFCSP (Spatial Pyramid Pooling Fast Cross Stage Partial Network) spatial pyramid pooling module is designed to adapt to the extraction of different scale size features of different size input images, which helps retain the high semantic information of smaller features; then, the anchor-free mode is introduced to directly classify the regression prediction information and do the structural reparameterization construction to design a new high-speed prediction head RepHead to further improve the operation speed of the detector. The experimental results show that the proposed detector achieves 99.87% detection accuracy at the fastest speed compared to state-of-the-art depth detectors such as YOLOv3, Faster R-CNN, and TDD-Net in the fast-moving PCB surface defect detection task. The new model of FM-STDNet provides an effective reference for the fast-moving small target detection task. Full article
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<p>SPPFCSP network structure.</p>
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<p>RepHead network structure.</p>
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<p>FM-STDNet network structure.</p>
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<p>PCB surface defects real-time detection experimental platform.</p>
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<p>Details of the small, medium, and most defects.</p>
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<p>Comparison of YOLOX and FM-STDNet detection results. (<b>a</b>) Detection results of YOLOX model at 2 m/s moving speed; (<b>b</b>) Detection results of FMSTDNet model at 20 m/s moving speed; (<b>c</b>) Detection results of YOLOX model at 2 m/s moving speed; (<b>d</b>) Detection results of FMSTDNet model at 20 m/s moving speed.</p>
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<p>Comparison of detection performance of FM-STDNet model with Faster R-CNN, YOLOv3, and TDD-Net models on 20 m/s mobile PCB.</p>
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<p>PCB defect precise recall (PR) curve at AP@0.5.</p>
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17 pages, 40929 KiB  
Article
PCB-YOLO: An Improved Detection Algorithm of PCB Surface Defects Based on YOLOv5
by Junlong Tang, Shenbo Liu, Dongxue Zhao, Lijun Tang, Wanghui Zou and Bin Zheng
Sustainability 2023, 15(7), 5963; https://doi.org/10.3390/su15075963 - 29 Mar 2023
Cited by 41 | Viewed by 5159
Abstract
To address the problems of low network accuracy, slow speed, and a large number of model parameters in printed circuit board (PCB) defect detection, an improved detection algorithm of PCB surface defects based on YOLOv5 is proposed, named PCB-YOLO, in this paper. Based [...] Read more.
To address the problems of low network accuracy, slow speed, and a large number of model parameters in printed circuit board (PCB) defect detection, an improved detection algorithm of PCB surface defects based on YOLOv5 is proposed, named PCB-YOLO, in this paper. Based on the K-means++ algorithm, more suitable anchors for the dataset are obtained, and a small target detection layer is added to make the PCB-YOLO pay attention to more small target information. Swin transformer is embedded into the backbone network, and a united attention mechanism is constructed to reduce the interference between the background and defects in the image, and the analysis ability of the network is improved. Model volume compression is achieved by introducing depth-wise separable convolution. The EIoU loss function is used to optimize the regression process of the prediction frame and detection frame, which enhances the localization ability of small targets. The experimental results show that PCB-YOLO achieves a satisfactory balance between performance and consumption, reaching 95.97% mAP at 92.5 FPS, which is more accurate and faster than many other algorithms for real-time and high-precision detection of product surface defects. Full article
(This article belongs to the Section Sustainable Engineering and Science)
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<p>Six defects on the printed circuit board surface. (<b>a</b>) missing hole; (<b>b</b>) open circuit; (<b>c</b>) short; (<b>d</b>) spur; (<b>e</b>) spurious copper; (<b>f</b>) mouse bite.</p>
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<p>Images were obtained by using the expansion technique.</p>
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<p>PCB-YOLO network structure diagram.</p>
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<p>UAM structure diagram.</p>
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<p>Swin transformer block structure.</p>
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<p>DwConv structure.</p>
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<p>Loss curve during training.</p>
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<p>Confusion matrix of PCB-YOLO.</p>
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<p>Visualization of test results.</p>
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20 pages, 4606 KiB  
Article
YOLO-RFF: An Industrial Defect Detection Method Based on Expanded Field of Feeling and Feature Fusion
by Gang Li, Shilong Zhao, Mingle Zhou, Min Li, Rui Shao, Zekai Zhang and Delong Han
Electronics 2022, 11(24), 4211; https://doi.org/10.3390/electronics11244211 - 16 Dec 2022
Cited by 13 | Viewed by 2752
Abstract
Aiming at the problems of low efficiency, high false detection rate, and poor real-time performance of current industrial defect detection methods, this paper proposes an industrial defect detection method based on an expanded perceptual field and feature fusion for practical industrial applications. First, [...] Read more.
Aiming at the problems of low efficiency, high false detection rate, and poor real-time performance of current industrial defect detection methods, this paper proposes an industrial defect detection method based on an expanded perceptual field and feature fusion for practical industrial applications. First, to improve the real-time performance of the network, the original network structure is enhanced by using depth-separable convolution to reduce the computation while ensuring the detection accuracy, and the critical information extraction from the feature map is enhanced by using MECA (More Efficient Channel Attention) attention to the detection network. To reduce the loss of small target detail information caused by the pooling operation, the ASPF (Atrous Spatial Pyramid Fast) module is constructed using dilate convolution with different void rates to extract more contextual information. Secondly, a new feature fusion method is proposed to fuse more detailed information by introducing a shallower feature map and using a dense multiscale weighting method to improve detection accuracy. Finally, in the model optimization process, the K-means++ algorithm is used to reconstruct the prediction frame to speed up the model’s convergence and verify the effectiveness of the combination of the Mish activation function and the SIoU loss function. The NEU-DET steel dataset and PCB dataset is used to test the effectiveness of the proposed model, and compared to the original YOLOv5s, our method in terms of mAP metrics by 6.5% and 1.4%, and in F1 by 5.74% and 1.33%, enabling fast detection of industrial surface defects to meet the needs of real industry. Full article
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<p>The overall architecture of the model, DWC3 forms the backbone network with a modified ASPF at the end; the neck uses dense multi-scale fusion to introduce a shallow feature map; the target is detected by three detection heads of different sizes.</p>
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<p>DWC3 module containing DWBottleneck.</p>
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<p>(<b>a</b>) DWConv consists of depth convolution, point-by-point convolution, and MECA attention, and (<b>b</b>) DWBottleneck consists of CBM and DWConv.</p>
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<p>ASPF module, one branch passes through three series of dilate convolutions with dilate rates of 2, 4, and 6, one branch passes through the MECA attention module, and finally, the outputs of the two branches are stitched together.</p>
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<p>DBiFPN, fusing more detailed information in the feature map using the more shallow feature map P3 (160, 160), fusing more feature information using cross-layer connectivity.</p>
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<p>MECA Attention Module.</p>
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<p>Visualization of steel dataset images, with red boxes representing defective positions.</p>
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<p>Visualization of images of six types of defects in PCB boards, and the red box represents the defective position.</p>
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<p>Enhanced images of the steel dataset.</p>
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<p>Enhanced image of PCB dataset.</p>
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<p>Variation curve of IOU with anchor frame k.</p>
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<p>In the comparison of mAP and FPS values of different detectors, the horizontal axis represents different detectors, the vertical axis in the left half represents mAP values, and the vertical axis in the right half represents FPS values.</p>
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<p>Visualization of different detectors for detecting images on steel dataset.</p>
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<p>In the comparison of mAP and FPS values of different detectors, the horizontal axis represents different detectors, the left half of the vertical axis represents mAP values, and the right half of the vertical axis represents FPS values.</p>
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16 pages, 4538 KiB  
Article
Applying Deep Learning to Construct a Defect Detection System for Ceramic Substrates
by Chien-Yi Huang, I-Chen Lin and Yuan-Lien Liu
Appl. Sci. 2022, 12(5), 2269; https://doi.org/10.3390/app12052269 - 22 Feb 2022
Cited by 16 | Viewed by 3097
Abstract
Under the emerging topic of machine vision technology replacing manual examination, automatic optical inspection (AOI) technology has been adopted for the detection of defects in semi-finished/finished products and is widely used for the defect detection of printed circuit boards (PCB) in electronic industries [...] Read more.
Under the emerging topic of machine vision technology replacing manual examination, automatic optical inspection (AOI) technology has been adopted for the detection of defects in semi-finished/finished products and is widely used for the defect detection of printed circuit boards (PCB) in electronic industries where surface mount technology (SMT) is applied. In order to convert images from gray-scale to binary in the PCB process, a strict threshold value was set for AOI to prevent ‘escapes’, but this can lead to serious false alarm because of unwanted noises. Therefore, they tend to set up a Noise-Removal procedure after AOI, which increases the computational cost. By applying deep learning to circuit images of the ceramic substrates in AOI, this paper aimed to construct an automatic defect detection system that could also identify the categories as well as the locations of defects. This study proposed and evaluated three models with integrated structures: ResNeXt+YOLO v3, Inception v3+YOLO v3, and YOLO v3. The outcomes indicate that the defect detection system built on ResNeXt+YOLO v3 could most effectively detect standard images that had been misidentified as defects by AOI, categorize genuine defects, and find their location. The proposed method could not only increase the inspection accuracy to 99.2%, but also help decrease the cost of human resources generated by manual re-examination. Full article
(This article belongs to the Special Issue Artificial Intelligence in Industrial Engineering)
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<p>Flow chart of this study.</p>
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<p>Ceramic substrate.</p>
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<p>Grayscale histogram of the ceramic substrates.</p>
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<p>Image features of the ceramic substrates.</p>
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<p>ResNeXt block structure.</p>
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<p>Structure map of the Inception v3 model.</p>
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<p>Classification model training flow chart.</p>
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<p>YOLO v3 network structure map.</p>
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<p>The training process of YOLO v3.</p>
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<p>YOLO v3 training process illustration.</p>
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<p>Predicted bounding box illustration.</p>
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17 pages, 7767 KiB  
Article
YOLOv4-MN3 for PCB Surface Defect Detection
by Xinting Liao, Shengping Lv, Denghui Li, Yong Luo, Zichun Zhu and Cheng Jiang
Appl. Sci. 2021, 11(24), 11701; https://doi.org/10.3390/app112411701 - 9 Dec 2021
Cited by 48 | Viewed by 4501
Abstract
Surface defect detection for printed circuit board (PCB) is indispensable for managing PCB production quality. However, automatic detection of PCB surface defects is still a challenging task because, even within the same category of surface defect, defects present great differences in morphology and [...] Read more.
Surface defect detection for printed circuit board (PCB) is indispensable for managing PCB production quality. However, automatic detection of PCB surface defects is still a challenging task because, even within the same category of surface defect, defects present great differences in morphology and pattern. Although many computer vision-based detectors have been established to handle these problems, current detectors struggle to achieve high detection accuracy, fast detection speed and low memory consumption simultaneously. To address those issues, we propose a cost-effective deep learning (DL)-based detector based on the cutting-edge YOLOv4 to detect PCB surface defect quickly and efficiently. The YOLOv4 is improved upon with respect to its backbone network and the activation function in its neck/prediction network. The improved YOLOv4 is evaluated with a customized dataset, collected from a PCB factory. The experimental results show that the improved detector achieved a high performance, scoring 98.64% on mean average precision (mAP) at 56.98 frames per second (FPS), outperforming the other compared SOTA detectors. Furthermore, the improved YOLOv4 reduced the parameter space of YOLOv4 from 63.96 M to 39.59 M and the number of multiply-accumulate operations (Madds) from 59.75 G to 26.15 G. Full article
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<p>Framework of the proposed methodology.</p>
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<p>Depthwise separable convolution.</p>
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<p>Bneck of MobileNetV3.</p>
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<p>YOLOv4-MN3 architecture.</p>
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<p>Plots of different activation function.</p>
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<p>PCB image acquisition device. (a) dark box, (b) motion control parts, (c) platform, (d) illumination module and (e) image acquisition module.</p>
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<p>PCB surface defect instances.</p>
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<p>Five different morphologies of bumpy or broken line.</p>
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<p>Data augmentation instances.</p>
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<p>Training loss of different activation functions.</p>
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<p>Performance of different SOTA models.</p>
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<p>Detection instance obtained by different detectors.</p>
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<p>Detection instance of different defects obtained by YOLOv4-MN3.</p>
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<p>Detection instance of bumpy or broken line with different morphologies obtained by YOLOv4-MN3.</p>
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17 pages, 2905 KiB  
Article
Smoothing Complete Feature Pyramid Networks for Roll Mark Detection of Steel Strips
by Qiwu Luo, Weiqiang Jiang, Jiaojiao Su, Jiaqiu Ai and Chunhua Yang
Sensors 2021, 21(21), 7264; https://doi.org/10.3390/s21217264 - 31 Oct 2021
Cited by 9 | Viewed by 2509
Abstract
Steel strip acts as a fundamental material for the steel industry. Surface defects threaten the steel quality and cause substantial economic and reputation losses. Roll marks, always occurring periodically in a large area, are put on the top of the list of the [...] Read more.
Steel strip acts as a fundamental material for the steel industry. Surface defects threaten the steel quality and cause substantial economic and reputation losses. Roll marks, always occurring periodically in a large area, are put on the top of the list of the most serious defects by steel mills. Essentially, the online roll mark detection is a tiny target inspection task in high-resolution images captured under harsh environment. In this paper, a novel method—namely, Smoothing Complete Feature Pyramid Networks (SCFPN)—is proposed for the above focused task. In particular, the concept of complete intersection over union (CIoU) is applied in feature pyramid networks to obtain faster fitting speed and higher prediction accuracy by suppressing the vanishing gradient in training process. Furthermore, label smoothing is employed to promote the generalization ability of model. In view of lack of public surface image database of steel strips, a raw defect database of hot-rolled steel strip surface, CSU_STEEL, is opened for the first time. Experiments on two public databases (DeepPCB and NEU) and one fresh texture database (CSU_STEEL) indicate that our SCFPN yields more competitive results than several prestigious networks—including Faster R-CNN, SSD, YOLOv3, YOLOv4, FPN, DIN, DDN, and CFPN. Full article
(This article belongs to the Special Issue Intelligent Sensing and Monitoring for Industrial Process)
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<p>Characteristics of roll marks. (<b>a</b>) Two samples of roll marks, red rectangles mark the roll marks which has low contrast with the background and we make the roll marks explicit; and (<b>b</b>) three roll marks with completely distinct appearances.</p>
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<p>Structure of smoothing complete feature pyramid networks (SCFPN). Backbone: ResNet101, Neck: FPN, Head: Faster R-CNN, Bounding boxes regression: CIoU loss, Classification: Cross-entropy loss with label smoothing.</p>
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<p>Structure of feature pyramid. Orange feature pyramid is constructed by the feedforward computation of the backbone (the bottom-up pathway), blue feature pyramid is merged by top-down pathway and lateral connections. “+” indicates pixel-level addition.</p>
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<p>Figure of complete IoU. Red: ground-truth box, Blue: predicted box, <span class="html-italic">d</span>: the Euclidean distance, <span class="html-italic">c</span>: the minimum bounding rectangle diagonal length of predicted boxes and ground-truth boxes.</p>
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<p>Samples of CSU_STEEL.</p>
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<p>Total loss of Faster R-CNN. Red: FPN; blue: CFPN; green: SCFPN.</p>
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<p>Total loss of RPN. Red: FPN; blue: CFPN; green: SCFPN.</p>
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<p>Visual detection results of different detection networks on CSU_STEEL. (<b>a</b>) tiny round roll marks; (<b>b</b>) long and narrow roll marks; (<b>c</b>) irregular roll marks with discontinuous shape; (<b>d</b>) concave roll marks with tiny line shape; (<b>e</b>) blurry and inclined roll marks</p>
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<p>Visual detection results of different detection networks on rare roll marks.</p>
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