Evaluation of Continuous GMA Welding Characteristics Based on the Copper-Plating Method of Solid Wire Surfaces
<p>Appearance and specifications of the welding workability evaluation system.</p> "> Figure 2
<p>Schematic of the welding current and voltage measurement.</p> "> Figure 3
<p>CT results of solid wire contact condition inside the contact tip during wire feeding.</p> "> Figure 4
<p>Surface analysis results of the solid wire according to the plating method; drawing direction: (<b>a</b>) C-wire; (<b>b</b>) E-wire; transverse direction; (<b>c</b>) C-wire; (<b>d</b>) E-wire.</p> "> Figure 5
<p>Analysis of the copper surface homogeneity of the solid wire based on the plating method: (<b>a</b>) C-wire; (<b>b</b>) E-wire.</p> "> Figure 6
<p>Results of coating adhesion: (<b>a</b>) C-wire; (<b>b</b>) E-wire.</p> "> Figure 7
<p>Arc stability evaluation for C-wire during 1 h of welding (average current/voltage and standard deviation): (<b>a</b>) C-wire #1; (<b>b</b>) C-wire #2.</p> "> Figure 8
<p>Actual welding current/voltage waveform of C-wire (10 kHz, 10 s): (<b>a</b>) stable welding section (point a); (<b>b</b>) unstable welding section (point b).</p> "> Figure 9
<p>Analysis of the contact tip and wire after 48.5 min of welding with C-wire #1: (<b>a</b>) the contact tip inside; (<b>b</b>) surface of C-wire after welding.</p> "> Figure 10
<p>Arc stability evaluation for the E-wire during 1 h of welding (average current/voltage and standard deviation): (<b>a</b>) C-wire #1; (<b>b</b>) C-wire #2.</p> "> Figure 11
<p>Weld appearance during continuous welding: (<b>a</b>) C-wire #1; (<b>b</b>) C-wire #2; (<b>c</b>) E-wire #1; (<b>d</b>) E-wire #2.</p> "> Figure 12
<p>Appearance of the contact tip end during continuous welding.</p> "> Figure 13
<p>Nozzle spatter adhesion state by welding time for each solid wire during continuous welding.</p> ">
Abstract
:1. Introduction
2. Experimental Procedure
2.1. Welding Wire and Contact Tip
2.2. Analysis of Copper Coating on Welding Wire
2.3. Configuration of the Welding Workability System and Welding Conditions
2.4. Welding Workability Evaluation Methods
3. Results and Discussion
3.1. Analysis of Coating State and Adhesion of the Solid Wire
3.2. Evaluation of Arc Stability Based on Copper Coating Methods
3.3. Evaluation of Contact Tip Wear Rate Based on the Copper Plating Method
3.4. Amount of Spatter Adhered to the Nozzle Based on the Copper Plating Method
4. Conclusions
- (1)
- The surface of the copper plating on the E-wire was smoother and more homogeneous than that on the C-wire, and the adhesion of the plating on the E-wire was superior to that on the C-wire.
- (2)
- Continuous welding was performed twice using the C-wire and E-wire for 60 min. The welding current and voltage were measured, and the standard deviations were calculated to evaluate arc stability. The E-wire exhibited better arc stability than the C-wire during 60 min of continuous welding, as confirmed by its lower standard deviation. In C-wire #2, E-wire #1, and E-wire #2, the welding voltage remained stable for 60 min, whereas the welding current decreased because of the wear on the contact tip. In the first continuous welding session with the C-wire, in which the plating adhesion was relatively poor, welding was interrupted at 48.5 min owing to arc instability, and electrical erosion was observed.
- (3)
- Although the copper-plated surface of the E-wire was smoother than that of the C-wire, the contact tip wear was higher in the E-wire than in the C-wire. The increased contact tip wear rate during welding with the E-wire occurred because the rate of change in the cast helix values before and after welding was greater for the E-wire than for the C-wire. These variations in cast and helix sizes contributed to a higher wear rate on the contact tip.
- (4)
- The weight of the spatter that adhered to the nozzle was measured to compare the welding spatter generation rates of the C- and E-wires. After 60 min of welding, the spatter weight of E-wire was approximately half that of C-wire. This lower amount of spatter indicated that the E-wire had better arc stability than the C-wire.
Author Contributions
Funding
Data Availability Statement
Conflicts of Interest
References
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Marking | Plating Method | Chemical Composition [wt.%] | Mechanical Properties | ||||||
---|---|---|---|---|---|---|---|---|---|
C | Si | Mn | P | S | TS [MPa] | YS [MPa] | EL [%] | ||
C-wire | Chemical | 0.07 | 0.65 | 1.14 | 0.015 | 0.010 | 440 | 560 | 28 |
E-wire | Electro |
Contact Tip | UNS No. | Chemical Composition [wt.%] | Hardness (HV) | Strengthening Method | Applicable Electrode | |||
---|---|---|---|---|---|---|---|---|
Cu | Cr | Zr | P | |||||
Cu–P | C12200 (ASTM B280) | Min. 99.9 | - | - | 0.015–0.040 | 115–140 | Work hardening | Arc welding |
Welding Time (min) | 0 | 30 | 48.5 | 60 | |
---|---|---|---|---|---|
C-wire | #1 | 0% | 5.9% | 12.3% | - |
#2 | 0% | 11.1% | - | 17.3% | |
E-wire | #1 | 0% | 13.6% | - | 23.5% |
#2 | 0% | 14.9% | - | 26.6% |
Cast | Helix | ||||||
---|---|---|---|---|---|---|---|
Start Point | End Point | Variation Rate | Start Point | End Point | Variation Rate | ||
C-wire | #1 | 530 mm | 510 mm (48.5 min) | 3.8% | 7.0 mm | 10.0 mm (48.5 min) | 42% |
#2 | 550 mm | 520 mm | 5.5% | 7.0 mm | 12.0 mm | 71% | |
E-wire | #1 | 710 mm | 630 mm | 11.3% | 6.0 mm | 24.0 mm | 300% |
#2 | 800 mm | 670 mm | 16.3% | 9.0 mm | 20.0 mm | 122% |
Welding Time (min) | 0 | 30 | 48.5 | 60 | |
---|---|---|---|---|---|
C-wire | #1 | 0 g | 4.8 g | 11.8 g | - |
#2 | 0 g | 5.1 g | - | 12.6 g | |
E-wire | #1 | 0 g | 2.9 g | - | 6.2 g |
#2 | 0 g | 2.6 g | - | 5.5 g |
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Kim, D.-Y.; Yu, J. Evaluation of Continuous GMA Welding Characteristics Based on the Copper-Plating Method of Solid Wire Surfaces. Metals 2024, 14, 1300. https://doi.org/10.3390/met14111300
Kim D-Y, Yu J. Evaluation of Continuous GMA Welding Characteristics Based on the Copper-Plating Method of Solid Wire Surfaces. Metals. 2024; 14(11):1300. https://doi.org/10.3390/met14111300
Chicago/Turabian StyleKim, Dong-Yoon, and Jiyoung Yu. 2024. "Evaluation of Continuous GMA Welding Characteristics Based on the Copper-Plating Method of Solid Wire Surfaces" Metals 14, no. 11: 1300. https://doi.org/10.3390/met14111300