User profiles for Avirup Dasgupta
Avirup DasguptaIndian Institute of Technology Roorkee Verified email at ece.iitr.ac.in Cited by 1237 |
A 14nm logic technology featuring 2nd-generation FinFET, air-gapped interconnects, self-aligned double patterning and a 0.0588 µm2 SRAM cell size
…, S Chouksey, A Dasgupta… - 2014 IEEE …, 2014 - ieeexplore.ieee.org
A 14nm logic technology using 2 nd -generation FinFET transistors with a novel subfin
doping technique, self-aligned double patterning (SADP) for critical patterning layers, and air-…
doping technique, self-aligned double patterning (SADP) for critical patterning layers, and air-…
BSIM compact model of quantum confinement in advanced nanosheet FETs
We propose a compact model for nanosheet FETs that take the effects of quantum confinement
into account. The model captures the nanosheet width and thickness dependence of the …
into account. The model captures the nanosheet width and thickness dependence of the …
Surface potential based modeling of thermal noise for HEMT circuit simulation
A Dasgupta, S Khandelwal… - IEEE Microwave and …, 2015 - ieeexplore.ieee.org
In this letter, an analytical surface potential based compact model for thermal noise in high
electron mobility transistors (HEMTs) is presented. The model is based on the recently …
electron mobility transistors (HEMTs) is presented. The model is based on the recently …
BSIM-CMG: Standard FinFET compact model for advanced circuit design
This work presents new compact models that capture advanced physical effects presented in
industry FinFETs. The presented models are introduced into the industry standard compact …
industry FinFETs. The presented models are introduced into the industry standard compact …
Compact modeling of temperature effects in FDSOI and FinFET devices down to cryogenic temperatures
We present compact models that capture published cryogenic temperature effects on silicon
carrier mobility and velocity saturation, as well as fully depleted silicon on insulator (FDSOI) …
carrier mobility and velocity saturation, as well as fully depleted silicon on insulator (FDSOI) …
Capacitance modeling in dual field-plate power GaN HEMT for accurate switching behavior
…, S Ghosh, K Sharma, A Dasgupta… - … on Electron Devices, 2015 - ieeexplore.ieee.org
In this paper, a surface-potential-based compact model is proposed for the capacitance of an
AlGaN/GaN high-electron mobility transistor (HEMT) dual field-plate (FP) structure, ie, with …
AlGaN/GaN high-electron mobility transistor (HEMT) dual field-plate (FP) structure, ie, with …
Deep learning-based fast BSIM-CMG parameter extraction for general input dataset
A deep learning (DL) technique to extract the set of Berkeley short-channel IGFET model-common
multigate (BSIM-CMG) compact model parameters directly from experimental …
multigate (BSIM-CMG) compact model parameters directly from experimental …
Unified compact model for nanowire transistors including quantum effects and quasi-ballistic transport
A Dasgupta, A Agarwal… - IEEE Transactions on …, 2017 - ieeexplore.ieee.org
We present a surface potential-based compact model for nanowire FETs, which considers 1-D
electrostatics along with the effect of multiple energy subbands. The model is valid for any …
electrostatics along with the effect of multiple energy subbands. The model is valid for any …
Compact modeling of cross-sectional scaling in gate-all-around FETs: 3-D to 1-D transition
We model the effects of cross-sectional radius scaling on ${C}$ – ${V}$ and ${I}$ – ${V}$
characteristics of gate-all-around FETs (GAAFETs), capturing the continuous transition from a 3-…
characteristics of gate-all-around FETs (GAAFETs), capturing the continuous transition from a 3-…
Design optimization techniques in nanosheet transistor for RF applications
Nanosheet gate-all-around transistors are analyzed for RF applications using calibrated
TCAD simulations. The effects of stack spacing and number of stacks on device performance …
TCAD simulations. The effects of stack spacing and number of stacks on device performance …