Yang et al., 2023 - Google Patents
Tailored Silver Malonate Conductive Ink with Tunable Performance Formulated from Mixed Silver DicarboxylatesYang et al., 2023
- Document ID
- 5635841127828202180
- Author
- Yang W
- Dong Z
- Guo Z
- Wang C
- Publication year
- Publication venue
- ACS Applied Electronic Materials
External Links
Snippet
Advancement of printed flexible electronics provides electronic devices with a facile manufacturing process and some innovative characteristics such as bendability and flexibility. The exploitation of functional ink materials is a critical challenge for printed flexible …
Classifications
-
- H—ELECTRICITY
- H01—BASIC ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H01L51/00—Solid state devices using organic materials as the active part, or using a combination of organic materials with other materials as the active part; Processes or apparatus specially adapted for the manufacture or treatment of such devices, or of parts thereof
- H01L51/05—Solid state devices using organic materials as the active part, or using a combination of organic materials with other materials as the active part; Processes or apparatus specially adapted for the manufacture or treatment of such devices, or of parts thereof specially adapted for rectifying, amplifying, oscillating or switching, or capacitors or resistors with at least one potential- jump barrier or surface barrier multistep processes for their manufacture
- H01L51/0504—Solid state devices using organic materials as the active part, or using a combination of organic materials with other materials as the active part; Processes or apparatus specially adapted for the manufacture or treatment of such devices, or of parts thereof specially adapted for rectifying, amplifying, oscillating or switching, or capacitors or resistors with at least one potential- jump barrier or surface barrier multistep processes for their manufacture the devices being controllable only by the electric current supplied or the electric potential applied, to an electrode which does not carry the current to be rectified, amplified or swiched, e.g. three-terminal devices
- H01L51/0508—Field-effect devices, e.g. TFTs
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02E—REDUCTION OF GREENHOUSE GASES [GHG] EMISSION, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
- Y02E10/00—Energy generation through renewable energy sources
- Y02E10/50—Photovoltaic [PV] energy
- Y02E10/54—Material technologies
- Y02E10/549—Material technologies organic PV cells
Similar Documents
Publication | Publication Date | Title |
---|---|---|
Vaseem et al. | Robust design of a particle-free silver-organo-complex ink with high conductivity and inkjet stability for flexible electronics | |
Kell et al. | Versatile molecular silver ink platform for printed flexible electronics | |
Choi et al. | Metal− organic decomposition ink for printed electronics | |
Zope et al. | Reactive silver oxalate ink composition with enhanced curing conditions for flexible substrates | |
Jahn et al. | Inkjet printing of conductive silver patterns by using the first aqueous particle-free MOD ink without additional stabilizing ligands | |
Yang et al. | Metal particle-free inks for printed flexible electronics | |
Kanzaki et al. | Fabrication of conductive copper films on flexible polymer substrates by low-temperature sintering of composite Cu ink in air | |
Wu et al. | Inkjet printing of low-temperature cured silver patterns by using AgNO3/1-dimethylamino-2-propanol inks on polymer substrates | |
Karthik et al. | Conductive silver inks and their applications in printed and flexible electronics | |
Hwang et al. | Intensive plasmonic flash light sintering of copper nanoinks using a band-pass light filter for highly electrically conductive electrodes in printed electronics | |
Jabari et al. | 2D printing of graphene: a review | |
Zhang et al. | Laser-induced selective metallization on polymer substrates using organocopper for portable electronics | |
Wang et al. | Cu ion ink for a flexible substrate and highly conductive patterning by intensive pulsed light sintering | |
Farraj et al. | Plasma-induced decomposition of copper complex ink for the formation of highly conductive copper tracks on heat-sensitive substrates | |
Dharmadasa et al. | Room temperature synthesis of a copper ink for the intense pulsed light sintering of conductive copper films | |
Wu et al. | A simple and efficient approach to a printable silver conductor for printed electronics | |
Jeong et al. | Stable aqueous based Cu nanoparticle ink for printing well-defined highly conductive features on a plastic substrate | |
Dong et al. | Optimizing formulations of silver organic decomposition ink for producing highly-conductive features on flexible substrates: The case study of amines | |
Draper et al. | Fabrication of elemental copper by intense pulsed light processing of a copper nitrate hydroxide ink | |
Lee et al. | Vacuum-free, maskless patterning of Ni electrodes by laser reductive sintering of NiO nanoparticle ink and its application to transparent conductors | |
Woo et al. | Effect of carboxylic acid on sintering of inkjet-printed copper nanoparticulate films | |
Oh et al. | Newly designed Cu/Cu10Sn3 core/shell nanoparticles for liquid phase-photonic sintered copper electrodes: large-area, low-cost transparent flexible electronics | |
US20200181438A1 (en) | Silver-organo-complex ink with high conductivity and inkjet stability | |
KR101398821B1 (en) | Method of manufacturing metal nano-particle, conductive ink composition having the metal nano-particle and method of forming conductive pattern using the same | |
Deore et al. | Formulation of screen-printable Cu molecular ink for conductive/flexible/solderable Cu traces |