WO2025050533A1 - Jig device for marking backside of compatible wafer - Google Patents

Abstract

The present invention relates to a jig device for marking a backside of a compatible wafer, said device comprising a support stage baseplate, a suction jig platform, and a platform rotating device, the platform rotating device being mounted on the support stage baseplate, and the suction jig platform being mounted on the platform rotating device. A lifting material receiving stage and a material pressing stage are sequentially arranged from the bottom to the top above the suction jig platform, and a material pressing stage lifting device used for lifting or lowering the material pressing stage is arranged on the lifting material receiving stage. It is possible to select different machining platforms on the basis of product size, achieving rapid replacement without tedious detaching and mounting. The device is compatible with machining products of various sizes and various series, facilitating switching between equipment and machining models. After calibrating the perpendicularity of a platform relative to light path cutting once, a series of issues such as subsequently re-calibrating perpendicularity are not necessary, thus avoiding poor batch processing performance of product machining. For a suction function with respect to a warped product, two non-contact suction discs suction the warped product on a jig mounting baseplate, and a pressing ring presses downwards on the periphery of said product to completely flatten the product.

Description

A compatible wafer backside marking fixture device Technical Field

The present invention relates to the technical field related to wafer processing, and in particular to a compatible wafer backside marking fixture device.

Background Art

With the development of advanced packaging technology, chips are packaged as a whole wafer before being cut, so wafer backside marking has become an indispensable step in semiconductor advanced packaging. It is mainly to mark each chip on each wafer with customer trademarks, direction marks, customer-specified text information, etc.

After massive searches, it was found that the prior art publication number is CN216413023U, which discloses a contactless wafer marking device comprising: a first support frame, a second support frame, a truss, a vacuum suction cup, a positioning mechanism, and a laser; wherein, the first support frame and the second support frame are arranged in parallel; a wafer box placement area is formed between the first support frame and the second support frame; the truss is slidably arranged above the first support frame and the second support frame; the vacuum suction cup is located above the wafer box placement area and is connected to the truss; the truss is provided with the positioning mechanism on one side of the truss along the sliding direction of the first support frame and the second support frame; the laser is arranged above the first support frame and the second support frame and close to the side of the positioning mechanism.

There are several different sizes of wafers on the market, ranging from 6 to 12 inches. Therefore, when designing the equipment, it is necessary to make corresponding fixtures for several products. This requires ensuring easy operation and high stability. Therefore, the above method has the following problems:

When replacing the carrier according to products of different sizes, due to the strict requirements of wafer product processing technology, the verticality between the processing optical path and the processing carrier device is less than 0.01mm, and the flatness will change after the processing carrier device is disassembled and assembled, and there will be an angle with the calibrated cutting optical path. This requires the product to be tested and cut, and the actual size is measured according to the imaging system, and then the flatness of the processing carrier device and the verticality of the processing optical path are recalibrated. Therefore, when switching between different models or series of wafer products during the production process, the time for disassembly and assembly of the device is long, the calibration workload is relatively large, and the operator may make omissions or mistakes, which will cause product processing batch defects.

In view of the above defects, the designer actively conducts research and innovation in order to create a compatible crystal The round back marking fixture device makes it more valuable for industrial use.

Summary of the invention

In order to solve the above technical problems, an object of the present invention is to provide a compatible wafer back side marking fixture device.

To achieve the above object, the present invention adopts the following technical solution:

A compatible wafer backside marking fixture device comprises a support platform bottom plate, an adsorption fixture carrier and a carrier rotating device, wherein the carrier rotating device is mounted on the support platform bottom plate, and the adsorption fixture carrier is mounted on the carrier rotating device;

A lifting material receiving platform and a material pressing platform are arranged in sequence from bottom to top above the adsorption fixture carrier, and a material pressing lifting device for lifting and lowering the material pressing platform is arranged on the lifting material receiving platform;

The adsorption fixture carrier includes an adsorption plate, a 1/4 marking area is opened on the adsorption plate, and at least one suction cup is installed on the adsorption plate;

The lifting material receiving platform comprises a material receiving plate fixing plate, a material receiving plate and a lifting material receiving power motor. The material receiving plate is installed in the middle cavity on the material receiving plate fixing plate. The bottom of the material receiving plate fixing plate is lifted and lowered on the support platform bottom plate below through lifting material receiving guide rods. The top of the lifting material receiving guide rod is installed on the bottom of the material receiving plate fixing plate through lifting material receiving linear bearings. Lifting material receiving power motors are installed on the support platform bottom plates below both sides of the material receiving plate fixing plate along the X-axis direction. The lifting material receiving power motor can drive the lifting material receiving cam to contact the upper large plate end contact bearing installed on the material receiving plate fixing plate.

The press table includes a press table bottom plate and a press ring. The bottom of the press table bottom plate is lifted and installed on the fixed large plate of the receiving plate below through lifting guide pillars and guide bearings. The press ring is installed in the middle cavity of the press table bottom plate.

The material pressing and lifting device comprises a material pressing and lifting power motor, a multi-stage transmission mechanism and a driven lifting device. The material pressing and lifting power motor installed on one side of the material receiving plate fixing plate can be connected to the driven lifting devices located on both sides of the material pressing table bottom plate along the X-axis direction through the multi-stage transmission mechanism.

The driven lifting device includes a driven lifting bearing seat, a transmission bearing fixing seat, a transmission bearing and an installation angle seat. The driven lifting bearing seat is installed on the large plate fixed with the material receiving plate through the installation angle seat. The driven lifting bearing seat is connected to the multi-stage transmission mechanism. The transmission bearing fixing seat is a cam structure and is installed on the driven lifting bearing seat. A transmission bearing is installed on the inner top or bottom side of the transmission bearing fixing seat, and the transmission bearing can contact the lifting partition on the bottom side of the inner pressing table bottom plate.

As a further improvement of the present invention, the carrier rotation device includes a jig mounting base plate, a carrier rotation power motor, a synchronous belt transmission mechanism, a platform rotation synchronous wheel, a platform rotation shaft and a rotating bearing. The carrier rotation power motor installed on the support platform base plate can be connected to the platform rotation shaft through a synchronous belt transmission mechanism. The platform rotation shaft is installed on the support platform base plate below through a rotating bearing. The platform rotation shaft is connected to the jig mounting base plate above through the platform rotation synchronous wheel, and the adsorption plate is positioned on the jig mounting base plate.

As a further improvement of the present invention, the fixture mounting base is provided with positioning pins for positioning the adsorption plate and adsorption magnets for adsorption of the adsorption plate, and at least one vacuum supply device is installed on the inner side of the platform rotation axis.

As a further improvement of the present invention, the synchronous belt transmission mechanism includes a synchronous wheel, a belt tensioning device and a carrier rotation synchronous belt. The driving end of the carrier rotation power motor is connected to the synchronous wheel, and the carrier rotation synchronous belt is installed between the synchronous wheel and the platform rotation shaft.

As a further improvement of the present invention, at least one belt tensioning wheel for tensioning the rotating synchronous belt of the carrier is installed on the side close to the synchronous wheel.

As a further improvement of the present invention, at least one of the pressing rings is provided with a notch, and a quick-change buckle ring block is installed on the bottom plate of the pressing table on at least one side of the pressing ring along the X-axis direction.

As a further improvement of the present invention, the multi-stage transmission mechanism includes a connecting rod shaft, a primary synchronous pulley, a press-pushing lifting synchronous belt and a secondary synchronous pulley. The driving end of the press-pushing lifting power motor is connected to the transmission bearing fixing seat of the driven lifting device along the positive direction of the X-axis through the coupling and via the press-pushing lifting synchronous belt and the secondary synchronous pulley; the driving end of the press-pushing lifting power motor is connected to the transmission bearing fixing seat of the driven lifting device along the negative direction of the X-axis through the connecting rod shaft, the primary synchronous pulley, the press-pushing lifting synchronous belt and the secondary synchronous pulley, and the connecting rod shaft is installed on the large plate fixed with the material receiving plate on both sides along the X-axis direction through the press-pushing lifting bearing seat.

By means of the above scheme, the present invention has at least the following advantages:

The present invention can select different processing platforms according to the product size, and can be quickly replaced without complicated disassembly and assembly;

The present invention is compatible with multiple sizes and multiple series of product processing, which is convenient for switching equipment processing and changing models, saving labor costs;

The present invention can realize a one-time correction of the verticality between the carrier and the optical path cutting, and there is no need to re-correct the verticality and a series of other problems later, thereby avoiding poor batch processing of products and causing unnecessary property losses.

In order to cope with the adsorption function of warped products, two non-contact suction cups adsorb the warped products onto the fixture mounting base, and the pressure ring presses down on all sides of the product to completely flatten the product.

The above description is only an overview of the technical solution of the present invention. In order to more clearly understand the technical means of the present invention and implement it according to the contents of the specification, the following is a detailed description of the preferred embodiments of the present invention in conjunction with the accompanying drawings.

BRIEF DESCRIPTION OF THE DRAWINGS

In order to more clearly illustrate the technical solutions of the embodiments of the present invention, the drawings required for use in the embodiments are briefly introduced below. It should be understood that the following drawings only show certain embodiments of the present invention and therefore should not be regarded as limiting the scope. For ordinary technicians in this field, other related drawings can be obtained based on these drawings without creative work.

FIG1 is a schematic structural diagram of a compatible wafer backside marking fixture device according to the present invention;

FIG2 is a schematic diagram of the structure of the support platform bottom plate, the adsorption fixture carrier and the carrier rotating device in FIG1;

FIG3 is a schematic diagram of the structure of the adsorption fixture carrier in FIG2 ;

FIG4 is a schematic structural diagram of the front side of the lifting receiving platform in FIG1;

FIG5 is a schematic structural diagram of the back side of the jacking receiving platform in FIG1 when it is jacked up;

FIG6 is a schematic structural diagram of the back side of the jacking receiving platform in FIG1 when it is lowered;

FIG7 is a schematic structural diagram of the stage rotating device in FIG1 ;

FIG8 is a schematic structural diagram of the material pressing table in FIG1;

FIG9 is a schematic structural diagram of the material pressing and lifting device in FIG1 ;

FIG. 10 is a schematic structural diagram of the driven lifting device in FIG. 9 .

The meanings of the various reference numerals in the figures are as follows.
Support platform bottom plate Ⅰ, adsorption fixture carrier Ⅱ, lifting material receiving platform Ⅲ, carrier rotating device Ⅳ, pressing platform Ⅴ, pressing material lifting device Ⅵ;
Adsorption plate Ⅱ-1, suction cup Ⅱ-2, 1/4 marking area Ⅱ-3;
The receiving plate fixes the large plate Ⅲ-1, the receiving plate Ⅲ-2, the lifting receiving power motor Ⅲ-3, the lifting receiving cam Ⅲ-4, the large plate end contact bearing Ⅲ-5, the lifting receiving guide rod Ⅲ-6, and the lifting receiving linear bearing Ⅲ-7;
Fixture installation base plate Ⅳ-1, stage rotation power motor Ⅳ-2, synchronous wheel Ⅳ-3, belt tensioner Ⅳ-4,
Stage rotation synchronous belt IV-5, platform rotation synchronous wheel IV-6, positioning pin IV-7, adsorption magnet IV-8, platform rotation shaft IV-9, vacuum supply device IV-10, rotating bearing IV-11;
Pressing table bottom plate V-1, lifting partition plate V-2, quick-change buckle ring block V-3, lifting guide column V-4, guide bearing V-5, press ring V-6;
Pressing material lifting power motor VI-1, coupling VI-2, connecting rod shaft VI-3, pressing material lifting bearing seat VI-4,
Primary synchronous pulley VI-5, pressing and lifting synchronous belt VI-6, secondary synchronous pulley VI-7, driven lifting device VI-8;
Driven lifting bearing seat VI-8-1, transmission bearing fixing seat VI-8-2, transmission bearing VI-8-3, installation angle seat VI-8-4.

DETAILED DESCRIPTION

The specific implementation of the present invention is further described in detail below in conjunction with the accompanying drawings and examples. The following examples are used to illustrate the present invention, but are not intended to limit the scope of the present invention.

In order to enable those skilled in the art to better understand the scheme of the present invention, the technical scheme in the embodiment of the present invention will be clearly and completely described below in conjunction with the drawings in the embodiment of the present invention. Obviously, the described embodiment is only a part of the embodiment of the present invention, rather than all the embodiments. The components of the embodiment of the present invention generally described and shown in the drawings here can be arranged and designed in various different configurations. Therefore, the following detailed description of the embodiment of the present invention provided in the drawings is not intended to limit the scope of the invention claimed for protection, but merely represents the selected embodiment of the present invention. Based on the embodiments of the present invention, all other embodiments obtained by those skilled in the art without making creative work belong to the scope of protection of the present invention.

Example

As shown in Figures 1 to 10:

A compatible wafer backside marking fixture device comprises a support platform bottom plate I, an adsorption fixture carrier II and a carrier rotating device IV, wherein the carrier rotating device IV is mounted on the support platform bottom plate I, and the adsorption fixture carrier II is mounted on the carrier rotating device IV;

Above the adsorption fixture carrier II, a lifting material receiving platform III and a material pressing platform V are arranged in sequence from bottom to top, and a material pressing lifting device VI for lifting and lowering the material pressing platform V is arranged on the lifting material receiving platform III;

The adsorption fixture carrier II includes an adsorption plate II-1, on which a 1/4 marking area II-3 is provided. At least one suction cup II-2 is installed on the adsorption plate II-1;

The lifting material receiving platform III includes a material receiving plate fixed large plate III-1, a material receiving plate III-2 and a lifting material receiving power motor III-3. The material receiving plate III-2 is installed in the middle cavity on the material receiving plate fixed large plate III-1. The bottom of the material receiving plate fixed large plate III-1 is lifted and lowered on the supporting platform bottom plate I below through lifting material receiving guide rods III-6. The top of the lifting material receiving guide rod III-6 is installed on the bottom of the material receiving plate fixed large plate III-1 through a lifting material receiving linear bearing III-7. Lifting material receiving power motors III-3 are installed on the supporting platform bottom plate I below both sides of the material receiving plate fixed large plate III-1 along the X-axis direction. The lifting material receiving power motor III-3 can drive the lifting material receiving cam III-4 to contact the large plate end contact bearing III-5 installed on the upper and fixed large plate III-1;

The press table V comprises a press table bottom plate V-1 and a press ring V-6. The four sides of the bottom of the press table bottom plate V-1 are all lifted and installed on the fixed large plate III-1 of the receiving plate below through lifting guide pillars V-4 and guide bearings V-5. The press ring V-6 is installed in the middle cavity of the press table bottom plate V-1.

The material pressing and lifting device VI comprises a material pressing and lifting power motor VI-1, a multi-stage transmission mechanism and a driven lifting device VI-8. The material pressing and lifting power motor VI-1 installed on one side of the material receiving plate fixing large plate III-1 can be connected to the driven lifting devices VI-8 located on both sides of the material pressing table bottom plate V-1 along the X-axis direction through the multi-stage transmission mechanism;

The driven lifting device VI-8 includes a driven lifting bearing seat VI-8-1, a transmission bearing fixing seat VI-8-2, a transmission bearing VI-8-3 and an installation angle seat VI-8-4. The driven lifting bearing seat VI-8-1 is installed on the receiving plate fixing plate III-1 through the installation angle seat VI-8-4. The driven lifting bearing seat VI-8-1 is connected to the multi-stage transmission mechanism. The transmission bearing fixing seat VI-8-2 is a cam structure and is installed on the driven lifting bearing seat VI-8-1. A transmission bearing VI-8-3 is installed on the inner top or bottom side of the transmission bearing fixing seat VI-8-2. The transmission bearing VI-8-3 can contact the lifting partition plate V-2 on the bottom side of the inner pressing table bottom plate V-1.

Preferably, the carrier rotating device IV includes a fixture mounting base plate IV-1, a carrier rotating power motor IV-2, a synchronous belt transmission mechanism, a platform rotating synchronous wheel IV-6, a platform rotating shaft IV-9 and a rotating bearing IV-11. The carrier rotating power motor IV-2 installed on the support platform base plate I can be connected to the platform rotating shaft IV-9 through a synchronous belt transmission mechanism. The platform rotating shaft IV-9 is installed on the lower support platform base plate I through a rotating bearing IV-11. The platform rotating shaft IV-9 is connected to the upper fixture mounting base plate IV-1 through the platform rotating synchronous wheel IV-6. The adsorption plate II-1 is positioned on the fixture mounting base plate IV-1.

Preferably, the fixture mounting base plate IV-1 is provided with a positioning pin for positioning the adsorption plate II-1. IV-7 and the adsorption magnet IV-8 for adsorption treatment of the adsorption plate II-1, and at least one vacuum supply device IV-10 is installed on the inner side of the platform rotation shaft IV-9.

Preferably, the synchronous belt transmission mechanism includes a synchronous wheel IV-3, a belt tensioning device IV-4 and a carrier rotation synchronous belt IV-5, the driving end of the carrier rotation power motor IV-2 is connected to the synchronous wheel IV-3, and the carrier rotation synchronous belt IV-5 is installed between the synchronous wheel IV-3 and the platform rotation shaft IV-9.

Preferably, at least one belt tensioning wheel IV-4 for tensioning the rotating synchronous belt IV-5 of the carrier is installed on the side close to the synchronous wheel IV-3.

Preferably, at least one of the pressing rings V-6 is provided with a notch, and a quick-change buckle ring block V-3 is installed on the bottom plate V-1 of the pressing table on at least one side of the pressing ring V-6 along the X-axis direction.

Preferably, the multi-stage transmission mechanism includes a connecting rod shaft VI-3, a first-stage synchronous pulley VI-5, a material pressing and lifting synchronous belt VI-6 and a second-stage synchronous pulley VI-7. The driving end of the material pressing and lifting power motor VI-1 is connected to the transmission bearing fixing seat VI-8-2 of the driven lifting device VI-8 along the positive direction of the X-axis through the coupling VI-2 and the material pressing and lifting synchronous belt VI-6 and the second-stage synchronous pulley VI-7; The driving end of the power motor VI-1 passes through the coupling VI-2 and is connected to the transmission bearing fixing seat VI-8-2 of the driven lifting device VI-8 on the negative direction of the X-axis through the connecting rod shaft VI-3, the first-level synchronous pulley VI-5, the pressing and lifting synchronous belt VI-6 and the second-level synchronous pulley VI-7, and the connecting rod shaft VI-3 is installed on the receiving plate fixing large plate III-1 on both sides along the X-axis direction through the pressing and lifting bearing seat VI-4.

Referring to FIG. 1, a carrier device for back-side marking of multi-size compatible wafers includes a support base plate Ⅰ, an adsorption fixture carrier Ⅱ, a lifting material receiving platform Ⅲ, a carrier rotation device Ⅳ, a material pressing platform Ⅴ, and a material pressing lifting device Ⅵ. Its main working features are as follows: an external wafer manipulator delivers the wafer to the lifting material receiving platform Ⅲ (the initial position is a raised state). The lifting material receiving platform Ⅲ descends, and the wafer falls onto the adsorption fixture carrier Ⅱ, and is adsorbed to fix the wafer. The material pressing platform Ⅴ descends under the action of the material pressing lifting device Ⅵ, pressing the wafer (the initial position of the material pressing platform Ⅴ is a raised state). The laser starts marking (1/4 area operation). After the local marking is completed, the lifting platform III rises, driving the wafer to separate from the adsorption fixture carrier II. The carrier rotation device IV drives the adsorption fixture carrier II to rotate 90°. The lifting platform III descends and sends the wafer to the adsorption fixture carrier II. The laser starts marking (1/4 area operation). Repeat the above actions until the front area marking is completed. The lifting device III rises, and the pressing platform V rises under the action of the pressing and lifting device. The wafer robot takes out the marked wafer and puts back the wafer to be marked, and repeats the action. Adsorption treatment The carrier table II, receiving table III and pressing table V can be quickly replaced to be compatible with 8-inch and 12-inch products.

As shown in Figures 2, 3 and 7,

The adsorption fixture carrier II includes: an adsorption plate II-1, a suction cup II-2, and a 1/4 marking area II-3.

The stage rotating device IV includes: a fixture mounting base plate IV-1, a stage rotating power motor IV-2, a synchronous wheel IV-3, a belt tensioning wheel IV-4, a stage rotating synchronous belt IV-5, a platform rotating synchronous wheel IV-6, a positioning pin IV-7, an adsorption magnet IV-8, a platform rotating shaft IV-9, a vacuum supply device IV-10, and a rotating bearing IV-11.

The adsorption plate Ⅱ-1 of the adsorption fixture carrier Ⅱ is adsorbed on the fixture mounting base plate Ⅳ-1 through the positioning pin Ⅳ-7 and the adsorption magnet Ⅳ-8 (the adsorption plate Ⅱ-1 can be quickly switched according to the wafer size), and the carrier rotating device Ⅳ is locked on the support platform base plate Ⅰ.

Among them, suction cup II-2 is a non-contact suction cup. In order to cope with the adsorption function of warped products, two non-contact suction cups II-2 adsorb the warped products on the fixture mounting base IV-1, and the pressing ring V-6 presses down on all sides of the product to completely smooth the product.

The adsorption fixture II is positioned and adsorbed on the fixture mounting base plate IV-1 through the positioning pins. The rotation of the platform rotation power motor IV-2 drives the synchronous wheel IV-3 to rotate. The belt tensioning wheel IV-4 drives the platform rotation synchronous belt IV-5 to rotate (the belt tensioning wheel IV-4 can adjust the tightness of the platform rotation synchronous belt IV-5). The platform rotation synchronous belt IV-5 is locked on the platform rotation shaft IV-9. The platform rotation shaft IV-9 is connected to the support base plate I through the rotating bearing IV-11.

As shown in Figures 4 to 6:

The lifting material receiving platform III includes: a material receiving plate fixing large plate III-1, a material receiving plate III-2, a lifting material receiving power motor III-3, a lifting material receiving cam III-4, a large plate end contact bearing III-5, a lifting material receiving guide rod III-6, and a lifting material receiving linear bearing III-7.

The receiving plate III-2 is adsorbed on the receiving plate fixed large plate III-1 through a magnet (the receiving plate III-2 can be quickly replaced according to the size of the wafer), and the lifting receiving power motor III-3 drives the lifting receiving cam III-4 to rotate, and the lifting receiving cam III-4 drives the large plate end contact bearing III-5 fixed on the receiving plate fixed large plate III-1 to reciprocate up and down.

As shown in Figures 8 to 10:

The pressing table V comprises: a pressing table bottom plate V-1, a lifting partition plate V-2, a quick-change buckle ring block V-3, a lifting guide column V-4, a guide bearing V-5, and a pressing ring V-6.

The material pressing and lifting device VI comprises: a material pressing and lifting power motor VI-1, a coupling VI-2, a connecting rod shaft VI-3, a material pressing and lifting bearing seat VI-4, a primary synchronous pulley VI-5, a material pressing and lifting synchronous belt VI-6, a secondary synchronous pulley VI-7, and a driven lifting device VI-8.

The driven lifting device VI-8 includes: a driven lifting bearing seat VI-8-1, a transmission bearing fixing seat VI-8-2, a transmission bearing VI-8-3, and a mounting angle seat VI-8-4.

Material pressing and lifting device VI: The material pressing and lifting power motor VI-1 rotates through the coupling VI-2 to drive the connecting rod shaft VI-3 to rotate, and the driven lifting device VI-8 rotates through the primary synchronous pulley VI-5, the material pressing and lifting synchronous belt VI-6, and the secondary synchronous pulley VI-7, thereby driving the material pressing table V to do up and down reciprocating motion.

Pressing table V: The quick-change buckle ring block V-3 is installed on the bottom plate V-1 of the pressing table. There are notches at both ends of the pressing ring V-6. When installing, you need to align the notches with the quick-change buckle ring block V-3 and press and rotate it to achieve quick change between 8-inch and 12-inch wafers.

In the description of the present invention, it should be understood that the terms "center", "longitudinal", "lateral", "up", "down", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inside", "outside" and the like indicate positions or positional relationships based on the positions or positional relationships shown in the accompanying drawings, and are only for the convenience of describing the present invention and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore cannot be understood as limiting the present invention. In addition, the terms "first", "second", and the like are only used for descriptive purposes, and cannot be understood as indicating or implying relative importance or implicitly referring to the number of technical features indicated. Thus, features defined as "first", "second", and the like may explicitly or implicitly include one or more of the features. In the description of the present invention, unless otherwise specified, "multiple" means two or more.

In the description of the present invention, it should be noted that, unless otherwise clearly specified and limited, the terms "installed", "connected" and "connected" should be understood in a broad sense. For example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be a direct connection or an indirect connection through an intermediate medium; it can be the internal connection of two components. For ordinary technicians in this field, the specific meanings of the above terms in the present invention can be understood through specific circumstances.

The above description is only a preferred embodiment of the present invention and is not intended to limit the present invention. It should be pointed out that a person skilled in the art can make several improvements and modifications without departing from the technical principles of the present invention, and these improvements and modifications should also be regarded as within the scope of protection of the present invention.

Claims (7)

A compatible wafer backside marking fixture device comprises a support platform bottom plate (Ⅰ), an adsorption fixture carrier (Ⅱ) and a carrier rotating device (Ⅳ), wherein the carrier rotating device (Ⅳ) is mounted on the support platform bottom plate (Ⅰ), and the adsorption fixture carrier (Ⅱ) is mounted on the carrier rotating device (Ⅳ); Features: A lifting material receiving platform (III) and a material pressing platform (V) are arranged in sequence from bottom to top above the adsorption fixture carrier (II), and a material pressing lifting device (VI) for lifting and lowering the material pressing platform (V) is arranged on the lifting material receiving platform (III); The adsorption fixture carrier (II) includes an adsorption plate (II-1), a 1/4 marking area (II-3) is opened on the adsorption plate (II-1), and at least one suction cup (II-2) is installed on the adsorption plate (II-1); The lifting material receiving platform (III) comprises a material receiving plate fixing plate (III-1), a material receiving plate (III-2) and a lifting material receiving power motor (III-3). The material receiving plate (III-2) is installed in the middle cavity on the material receiving plate fixing plate (III-1). The bottom of the material receiving plate fixing plate (III-1) is lifted and installed on the bottom plate (I) of the supporting platform below through lifting material receiving guide rods (III-6). The top of the lifting material receiving guide rods (III-6) is lifted and installed on the bottom plate (I) of the supporting platform below. The lifting material receiving linear bearing (Ⅲ-7) is installed at the bottom of the material receiving plate fixed large plate (Ⅲ-1), and the lifting material receiving power motor (Ⅲ-3) is installed on the support platform bottom plate (Ⅰ) below both sides of the material receiving plate fixed large plate (Ⅲ-1) along the X-axis direction. The lifting material receiving power motor (Ⅲ-3) can drive the lifting material receiving cam (Ⅲ-4) to contact the large plate end contact bearing (Ⅲ-5) installed on the upper and fixed large plate of the material receiving plate (Ⅲ-1); The press platform (V) comprises a press platform bottom plate (V-1) and a press ring (V-6); the four sides of the bottom of the press platform bottom plate (V-1) are all installed on the lower material receiving plate fixed large plate (III-1) through lifting guide pillars (V-4) and guide bearings (V-5) so as to be liftable; the press ring (V-6) is installed in the middle cavity on the press platform bottom plate (V-1); The material pressing and lifting device (VI) comprises a material pressing and lifting power motor (VI-1), a multi-stage transmission mechanism and a driven lifting device (VI-8). The material pressing and lifting power motor (VI-1) installed on one side of the material receiving plate fixing plate (III-1) can be connected to the driven lifting devices (VI-8) located on both sides of the material pressing table bottom plate (V-1) along the X-axis direction through the multi-stage transmission mechanism; The driven lifting device (VI-8) comprises a driven lifting bearing seat (VI-8-1), a transmission bearing fixing seat (VI-8-2), a transmission bearing (VI-8-3) and a mounting angle seat (VI-8-4). The seat (VI-8-1) is installed on the receiving plate fixed plate (III-1) through the installation angle seat (VI-8-4), the driven lifting bearing seat (VI-8-1) is connected to the multi-stage transmission mechanism, the transmission bearing fixing seat (VI-8-2) is a cam structure and is installed on the driven lifting bearing seat (VI-8-1), and a transmission bearing (VI-8-3) is installed on the inner top or bottom side of the transmission bearing fixing seat (VI-8-2), and the transmission bearing (VI-8-3) can contact the lifting partition (V-2) on the bottom side of the inner pressing table bottom plate (V-1). A compatible wafer back side marking fixture device as described in claim 1 is characterized in that the carrier rotating device (Ⅳ) includes a fixture mounting base plate (Ⅳ-1), a carrier rotating power motor (Ⅳ-2), a synchronous belt transmission mechanism, a platform rotating synchronous wheel (Ⅳ-6), a platform rotating shaft (Ⅳ-9) and a rotating bearing (Ⅳ-11), the carrier rotating power motor (Ⅳ-2) installed on the support platform base plate (Ⅰ) can be connected to the platform rotating shaft (Ⅳ-9) through a synchronous belt transmission mechanism, the platform rotating shaft (Ⅳ-9) is installed on the support platform base plate (Ⅰ) below through a rotating bearing (Ⅳ-11), the platform rotating shaft (Ⅳ-9) is connected to the upper fixture mounting base plate (Ⅳ-1) through the platform rotating synchronous wheel (Ⅳ-6), and the adsorption plate (Ⅱ-1) is positioned on the fixture mounting base plate (Ⅳ-1). A compatible wafer back side marking jig device as described in claim 2, characterized in that a positioning pin (IV-7) for positioning the adsorption plate (II-1) and an adsorption magnet (IV-8) for adsorbing the adsorption plate (II-1) are provided on the jig mounting base plate (IV-1), and at least one vacuum supply device (IV-10) is installed on the inner side of the platform rotation axis (IV-9). A compatible wafer back side marking fixture device as described in claim 2, characterized in that the synchronous belt transmission mechanism includes a synchronous wheel (Ⅳ-3), a belt tensioning device (Ⅳ-4) and a carrier rotation synchronous belt (Ⅳ-5), the driving end of the carrier rotation power motor (Ⅳ-2) is connected to the synchronous wheel (Ⅳ-3), and the carrier rotation synchronous belt (Ⅳ-5) is installed between the synchronous wheel (Ⅳ-3) and the platform rotation shaft (Ⅳ-9). A compatible wafer back side marking fixture device as described in claim 4 is characterized in that at least one belt tensioning wheel (Ⅳ-4) for tensioning the carrier rotating synchronous belt (Ⅳ-5) is installed on the side close to the synchronous wheel (Ⅳ-3). A compatible wafer back side marking fixture device as described in claim 1, characterized in that at least one of the pressure rings (V-6) is provided with a notch, and a quick-change buckle ring block (V-3) is installed on the pressure table bottom plate (V-1) on at least one side of the pressure ring (V-6) along the X-axis direction. A compatible wafer backside marking fixture device as described in claim 1, characterized in that the multi-stage transmission mechanism includes a connecting rod shaft (VI-3), a primary synchronous pulley (VI-5), a material pressing and lifting synchronous belt (VI-6) and a secondary synchronous pulley (VI-7), and the driving end of the material pressing and lifting power motor (VI-1) passes through a coupling (VI-2) and is connected to a transmission bearing fixing seat (VI-8) of a driven lifting device (VI-8) on one side of the positive direction of the X-axis via the material pressing and lifting synchronous belt (VI-6) and the secondary synchronous pulley (VI-7). 8-2); the driving end of the press-lifting power motor (VI-1) is connected to the transmission bearing fixing seat (VI-8-2) of the driven lifting device (VI-8) along the negative direction of the X-axis through the coupling (VI-2) and the connecting rod shaft (VI-3), the first-level synchronous pulley (VI-5), the press-lifting synchronous belt (VI-6) and the second-level synchronous pulley (VI-7), and the connecting rod shaft (VI-3) is installed on the receiving plate fixing plate (III-1) on both sides along the X-axis direction through the press-lifting bearing seat (VI-4).