WO2024024807A1 - Electronic component processing device - Google Patents

Abstract

An electronic component processing device (10) comprises: an ejector mechanism that ejects an electronic component (W) attached to a wafer sheet; a pick-up unit (13) having a component support part (12) that acquires the ejected electronic component (W); a transfer unit that transfers, by rotation of a rotating body (15) to which a component holding unit (14) that acquires the electronic component (W) from the pick-up unit (13) has been attached, the component holding part (14) to a processing position (P7-P11); and processing units (17-21) that perform prescribed processing on the electronic component (W).

Description

Electronic parts processing equipment

The present disclosure relates to an electronic component processing apparatus that performs predetermined processing on electronic components.

An electronic component processing device that performs predetermined processing on electronic components using a processing unit such as an appearance inspection unit has a pickup unit (rotary pickup mechanism) that sequentially picks up electronic components attached to the front surface of a wafer sheet using a suction nozzle (pickup nozzle). ), and a transport unit (unit consisting of a turntable, etc.) that transports electronic components obtained from the pickup unit to a processing position where a processing unit is arranged (see Patent Document 1).

The suction nozzle picks up and acquires electronic components that have been pushed out to the front side of the wafer sheet by a pin (push-up pin) on the back side of the wafer sheet. The position of the electronic component sucked by the suction nozzle with respect to the suction nozzle is influenced by the position of the ejected electronic component before suction with respect to the suction nozzle. The position of the electronic component sucked by the suction nozzle with respect to the suction nozzle influences the position of the electronic component acquired by the transport unit with respect to the transport unit.

If the position of the electronic component placed at the processing position by the transport unit with respect to the processing unit is not at a predetermined position, problems such as processing by the processing unit may not be performed appropriately may occur. Therefore, the position of the electronic component acquired by the transport unit is adjusted by the alignment unit before the electronic component is transported to the processing position. The alignment unit acquires the electronic component from the transport unit, adjusts its position, and then returns the electronic component to the transport unit.

However, adjusting the position of the electronic component by the alignment unit takes longer than processing by the processing unit, resulting in problems such as hindering efficient processing of the electronic component.

Japanese Patent Application Publication No. 2012-119494

The present disclosure sets the position and orientation of the electronic component at the processing position to a predetermined position and orientation with respect to the processing unit without using an alignment unit that acquires the electronic component from the transport unit and adjusts the position of the electronic component. The present invention relates to an electronic component processing device capable of processing.

According to the present disclosure, an electronic component processing apparatus includes a protrusion mechanism that protrudes an electronic component attached to a wafer sheet in a first direction perpendicular to the wafer sheet; A pickup unit having a component supporting section that acquires the electronic component at a pickup position facing the sheet, and a component holding section that acquires the electronic component from the pickup unit at the receiving position are attached by rotation of a rotating body. A transport unit that moves together with the component to a processing position, a processing unit that performs a predetermined process on the electronic component placed at the processing position, and a protrusion mechanism that moves along a first virtual plane parallel to the wafer sheet. a first drive mechanism; a second drive mechanism that moves the pickup unit supporting the electronic component on the component support section along a second virtual plane parallel to the wafer sheet; and a second drive mechanism that includes the wafer sheet. 3 a third drive mechanism that moves the wafer sheet within a virtual plane; a shift derivation unit that detects a shift of the electronic component from a reference position and reference orientation acquired by the component support unit; and the first drive mechanism. mechanism, the second drive mechanism, and the third drive mechanism to control the component support section disposed at the pick-up position, and then the electronic component and the protrusion mechanism to be acquired by the component support section. A control unit that adjusts the position. The pickup unit rotates 180° around the rotation axis by one or more rotational operations, thereby transferring the component support portion placed at the pickup position to the component holding portion placed at the receiving position. a rotary member that moves the component support section disposed at the transfer position to the pick-up position while moving the component support section to the opposing transfer position; It has a drive rotation unit that rotates the component support unit that has acquired the electronic component around a virtual rotation axis arranged at J. The control unit controls the second drive mechanism and the drive rotation unit based on the deviation detected by the deviation derivation unit, so that the electronic component is positioned at a predetermined position relative to the processing unit at the processing position. so that it is oriented in the same direction.

According to the present disclosure, an electronic component processing apparatus includes a protrusion mechanism that protrudes an electronic component attached to a wafer sheet in a first direction perpendicular to the wafer sheet; A pickup unit having a component supporting section that acquires the electronic component at a pickup position facing the sheet, and a component holding section that acquires the electronic component from the pickup unit at the receiving position are attached by rotation of a rotating body. A transport unit that moves together with the component to a processing position, a processing unit that performs a predetermined process on the electronic component placed at the processing position, and a protrusion mechanism that moves along a first virtual plane parallel to the wafer sheet. a first drive mechanism; a second drive mechanism that moves the pickup unit supporting the electronic component on the component support section along a second virtual plane parallel to the wafer sheet; and a second drive mechanism that includes the wafer sheet. 3 a third drive mechanism that moves the wafer sheet within a virtual plane; a shift derivation unit that detects a shift of the electronic component from a reference position and reference orientation acquired by the component support unit; and the first drive mechanism. mechanism, the second drive mechanism, and the third drive mechanism to control the component support section disposed at the pick-up position, and then the electronic component and the protrusion mechanism to be acquired by the component support section. A control unit that adjusts the position. The pickup unit rotates 180° around the rotation axis by one or more rotational operations, thereby transferring the component support portion placed at the pickup position to the component holding portion placed at the receiving position. It has a rotating member that moves to the opposing transfer position and also moves the component support section disposed at the transfer position to the pick-up position. The transport unit includes a drive rotation mechanism that rotates the component holder to adjust the orientation of the electronic component acquired by the component holder with respect to the transport unit. The control unit controls the second drive mechanism and the drive rotation mechanism based on the deviation detected by the deviation derivation unit, so that the electronic component is positioned at a predetermined position relative to the processing unit at the processing position. so that it is placed in the same direction.

According to the present disclosure, an electronic component processing apparatus includes a protrusion mechanism that protrudes an electronic component attached to a wafer sheet in a first direction perpendicular to the wafer sheet; A pickup unit having a component supporting section that acquires the electronic component at a pickup position facing the sheet, and a component holding section that acquires the electronic component from the pickup unit at the receiving position are attached by rotation of a rotating body. a transport unit that moves together with the component to a processing position, a processing unit that performs a predetermined process on the electronic component placed at the processing position, and a second direction G parallel to the wafer sheet or the second direction. a first driver that moves the electronic component in a direction opposite to G; a second driver that moves the pickup unit supporting the electronic component on the component support part in the second direction G or a direction opposite to the second direction G; a third driver that moves the wafer sheet within a third virtual plane Q that includes the wafer sheet; and a third direction K orthogonal to the direction of position adjustment of the electronic component made by movement of the pickup unit; a fourth driver that moves the processing unit in a direction opposite to K and adjusts the position of the processing unit in the third direction K with respect to the electronic component placed at the processing position; a deviation deriving unit that detects a deviation of the electronic component from a reference position and reference orientation; and a deviation derivation unit that controls the first driver, the second driver, and the third driver to support the component disposed at the pickup position. and a control section that adjusts the positions of the electronic component and the protrusion mechanism that are then acquired by the component support section. The pickup unit includes a drive rotation unit that rotates the component support unit that has acquired the electronic component around a virtual rotation axis arranged in the first direction with the component support unit disposed at the pickup position; has. The control unit controls the second driver, the fourth driver, and the drive rotation unit based on the deviation detected by the deviation derivation unit, so that the electronic component is in a predetermined position relative to the processing unit at the processing position. so that they are placed in the same position and orientation.

According to the present disclosure, an electronic component processing apparatus includes a protrusion mechanism that protrudes an electronic component attached to a wafer sheet in a first direction perpendicular to the wafer sheet; A pickup unit having a component supporting section that acquires the electronic component at a pickup position facing the sheet, and a component holding section that acquires the electronic component from the pickup unit at the receiving position are attached by rotation of a rotating body. a transport unit that moves together with the component to a processing position; a processing unit that performs a predetermined process on the electronic component placed at the processing position; a first driver that moves the electronic component in the opposite direction; a second driver that moves the pickup unit that supports the electronic component on the component support section in the second direction G or a direction opposite to the second direction G; and the wafer sheet. a third driver for moving the wafer sheet within a third virtual plane Q including a third direction K orthogonal to the direction of position adjustment of the electronic component made by movement of the pickup unit; a fourth driver that moves the processing unit in the opposite direction to adjust the position of the processing unit in the third direction K with respect to the electronic component placed at the processing position; a deviation derivation unit that detects a deviation of the electronic component from a reference position and reference orientation; and a component support unit that controls the first driver, the second driver, and the third driver and is disposed at the pickup position. Next, a control section is provided that adjusts the positions of the electronic component and the protrusion mechanism that are acquired by the component support section. The transport unit includes a drive rotation mechanism that rotates the component holding section and adjusts the orientation of the electronic component acquired by the component holding section with respect to the transport unit. The control unit controls the second driver, the fourth driver, and the drive rotation mechanism based on the deviation detected by the deviation derivation unit, so that the electronic component is in a predetermined position relative to the processing unit at the processing position. so that they are placed in the same position and orientation.

According to the present disclosure, an electronic component processing apparatus includes a protrusion mechanism that protrudes an electronic component attached to a wafer sheet in a first direction perpendicular to the wafer sheet; A pickup unit having a component supporting section that acquires the electronic component at a pickup position facing the sheet, and a component holding section that acquires the electronic component from the pickup unit at the receiving position are attached by rotation of a rotating body. A transport unit that moves together with the component to a processing position, a processing unit that performs a predetermined process on the electronic component placed at the processing position, and a protrusion mechanism that moves along a first virtual plane parallel to the wafer sheet. a first drive mechanism; a second drive mechanism that moves the pickup unit supporting the electronic component on the component support section along a second virtual plane parallel to the wafer sheet; and a second drive mechanism that includes the wafer sheet. 3 a third drive mechanism that moves the wafer sheet within a virtual plane; a shift derivation unit that detects a shift of the electronic component from a reference position and reference orientation acquired by the component support unit; and the first drive mechanism. mechanism, the second drive mechanism, and the third drive mechanism to control the component support section disposed at the pick-up position, and then the electronic component and the protrusion mechanism to be acquired by the component support section. A control unit that adjusts the position. The pickup unit includes a rotating member that moves the component support section located at the pickup position to a transfer position opposite to the component holding section located at the receiving position by one or more rotational operations; has. The transport unit includes a drive rotation mechanism that rotates the component holder to adjust the orientation of the electronic component acquired by the component holder with respect to the transport unit. The control unit controls the second drive mechanism and the drive rotation mechanism based on the deviation detected by the deviation derivation unit, so that the electronic component is positioned at a predetermined position relative to the processing unit at the processing position. so that it is placed in the same direction.

According to the present disclosure, an electronic component processing apparatus includes a protrusion mechanism that protrudes an electronic component attached to a wafer sheet in a first direction perpendicular to the wafer sheet; A pickup unit having a component supporting section that acquires the electronic component at a pickup position facing the sheet, and a component holding section that acquires the electronic component from the pickup unit at the receiving position are attached by rotation of a rotating body. a transport unit that moves together with the component to a processing position, a processing unit that performs a predetermined process on the electronic component placed at the processing position, and a pickup unit that supports the electronic component on the component support section on the wafer sheet. A second driver that moves the wafer sheet in a parallel second direction or a direction opposite to the second direction, a third driver that moves the wafer sheet within a third virtual plane that includes the wafer sheet, and a movement of the pickup unit. The processing unit is moved in a third direction perpendicular to the direction of position adjustment of the electronic component placed at the processing position, or in a direction opposite to the third direction, and A fourth driver that adjusts the position in three directions, a deviation derivation unit that detects a deviation of the electronic component acquired by the component supporter from a reference position and reference orientation, and controls the second driver and the third driver. and a control section that adjusts the position of the component support section disposed at the pickup position and the electronic component that is then acquired by the component support section. The transport unit includes a drive rotation mechanism that rotates the component holder to adjust the orientation of the electronic component acquired by the component holder with respect to the transport unit. The control unit controls the second driver, the fourth driver, and the drive rotation mechanism based on the deviation detected by the deviation derivation unit, so that the electronic component is in a predetermined position relative to the processing unit at the processing position. so that they are placed in the same position and orientation.

According to the electronic component processing apparatus of the present disclosure, the position and orientation of the electronic component can be adjusted while the electronic component is acquired (supported) by the component support section or the component holding section, and the electronic component can be acquired from the transport unit and the electronic component It is possible to set the position and orientation of the electronic component at the processing position with respect to the processing unit to a predetermined position and orientation without using an alignment unit that adjusts the position of the electronic component.

FIG. 1 is an explanatory diagram of an electronic component processing apparatus according to a first embodiment. It is an explanatory view showing arrangement of a processing unit and a pickup unit with respect to a rotating body. FIG. 3 is an explanatory diagram of acquisition and delivery of electronic components by a pickup unit. FIG. 2 is a block diagram showing connections of a control unit. FIGS. 5(A) and 5(B) are an explanatory view showing the position of the pickup unit with respect to the electronic component placed at the transfer position, and an explanatory view of the protrusion mechanism, respectively. FIG. 3 is an explanatory diagram showing rotation of a component support portion of the pickup unit. FIG. 3 is a flow diagram showing the flow of electronic component acquisition processing. FIG. 3 is a flow diagram showing the flow of electronic component delivery processing. FIG. 3 is an explanatory diagram of an electronic component processing apparatus according to a second embodiment. It is an explanatory view showing arrangement of a processing unit and a pickup unit with respect to a rotating body. FIG. 3 is an explanatory diagram of acquisition and delivery of electronic components by a pickup unit. FIG. 2 is a block diagram showing connections of a control unit. FIG. 3 is an explanatory diagram showing the direction in which the pickup unit moves. FIG. 3 is an explanatory diagram showing rotation of a component support portion of the pickup unit. FIG. 3 is a flow diagram showing the flow of electronic component acquisition processing. FIG. 3 is a flow diagram showing the flow of electronic component delivery processing. FIG. 3 is a flow diagram showing the flow of processing of electronic components by a processing unit. It is an explanatory view of a modification having a drive rotation mechanism.

Next, embodiments embodying the present invention will be described with reference to the attached drawings to provide an understanding of the present invention.

As shown in FIG. 1, FIG. 2, and FIG. It has a protrusion mechanism 11 that protrudes from the back surface (rear surface) side of the wafer sheet H in a first direction J, and a component support part 12 that acquires the electronic component W protruded in the first direction J at a pickup position P1 facing the wafer sheet H. The pickup unit 13 acquires the electronic component W from the pickup unit 13 at the receiving position P2.The rotation of the rotating body 15 to which the component holder 14 is attached causes the component holder 14 to be transferred to processing positions P7, P8, P9, P10 together with the electronic component W. , P11, and processing units 17, 18, 19, 20, and 21 that perform predetermined processing on electronic components W placed at processing positions P7, P8, P9, P10, and P11, respectively. There is. This will be explained in detail below.

As shown in FIGS. 1, 2, and 3, the pickup unit 13 includes a disk-shaped rotating member 23 that is provided below the rotating body 15, and rotates together with a rotating shaft 22 that is rotatably supported by a support 21a. It has a plurality of component support parts 12 each of which is provided so as to be movable in the radial direction with respect to the rotating member 23. There are a plurality of component support parts 12, each of which has a cylindrical shape. Each of the component support sections 12 is provided radially such that the axis thereof coincides with the advancing and retreating direction of the component support section 12, and is arranged at equal intervals along the outer edge of a virtual circle centered on the rotating shaft 22. It goes without saying that the component support portion 12 is not limited to a cylindrical shape, and may be, for example, rectangular parallelepiped or cubic.

In this embodiment, the four component support parts 12 are arranged at 90° intervals around the rotating member 23 at the 3 o'clock position, the 6 o'clock position (180° position), the 9 o'clock position, and the 12 o'clock position (0° position), respectively. It is set in. As shown in FIG. 3, a coil spring 24 is attached near each component support portion 12 to apply a force in the opposite direction to the movement direction of the component support portion 12 that has moved toward the center of the rotating member 23. It is being Note that in FIGS. 2 and 5A, the description of the coil spring 24 and the like of the component support portion 12 is omitted.

In the present embodiment, each component support section 12 is a suction nozzle that suctions the electronic component W by vacuum pressure (negative pressure) and releases the suction state of the electronic component W by opening to the atmosphere or by positive pressure. Each component support section 12 intermittently follows an arcuate path of 90 degrees as the rotating member 23 rotates intermittently due to repeated activation and stop of the motor 51 shown in FIG. 4 provided in the support body 21a. The electronic components W are moved and sequentially arranged at a pickup position P1 (6 o'clock position, 180° position) facing the wafer sheet H on which a large number (plurality) of electronic components W are pasted.

In this embodiment, the wafer sheet H is horizontally arranged at a position directly below the pickup unit 13 and at a distance from the pickup unit 13. The electronic components W are, for example, diodes, transistors, capacitors, inductors, and ICs (Integrated Circuits). As shown in FIGS. 3 and 6, the electronic component W has two parallel surfaces W1 and W2, and is attached to the wafer sheet H with the surface W1 in close contact with the surface of the wafer sheet H.

As shown in FIGS. 3 and 5A, the pickup unit 13 and the support 21a are moved parallel to the wafer sheet H (in this embodiment, horizontally) by the operation of the X-axis drive section 25 attached to the support 21a. ), and by the operation of the Y-axis drive section 26 attached to the X-axis drive section 25, the pickup unit 13 and the support body are moved together with the X-axis drive section 25. It moves (horizontal movement in this embodiment) in a direction perpendicular to the direction in which 21a moves (Y-axis direction in a plane parallel to wafer sheet H). Therefore, a virtual plane parallel to the wafer sheet H and passing through the pickup unit 13 is defined as a second virtual plane F, and in this embodiment, the pickup unit 13 is moved along the second virtual plane F (within the second virtual plane F). A second drive mechanism 27 for freely moving is configured to include an X-axis drive section 25 and a Y-axis drive section 26.

Further, as shown in FIG. 3, the wafer sheet H and the wafer ring 29 on which the wafer sheet H is attached are moved within the third virtual plane Q including the wafer sheet H by the operation of the X-axis drive section 30 that supports the wafer ring 29. (in this embodiment, horizontally) in the X-axis direction. Further, the wafer sheet H and the wafer ring 29 are moved together with the X-axis drive unit 30 by the operation of the Y-axis drive unit 31 attached to the X-axis drive unit 30, and the wafer sheet H and the wafer ring 29 are moved by the operation of the X-axis drive unit 30. It moves within the third virtual plane Q in the Y-axis direction perpendicular to the direction of movement (horizontal movement in this embodiment). In this embodiment, the third drive mechanism 35 that freely moves the wafer sheet H within the third virtual plane Q includes an X-axis drive section 30 and a Y-axis drive section 31.

Inside the cylindrical member 32 provided directly below the wafer sheet H, a drive source 33 operates to advance and retreat in a direction perpendicular to the wafer sheet H (in this embodiment, it moves in the vertical direction or in the opposite direction to the vertical direction). A pin 34 is provided. As shown in FIGS. 3 and 5B, the drive source 33 includes a cylindrical member 32, a drive source 33, and a pin 34 arranged in a plane parallel to the wafer sheet H (horizontal in this embodiment). An X-axis drive section 46 for moving in the axial direction is attached. The X-axis drive section 46 moves the cylindrical member 32, the drive source 33, and the pin 34 in the Y-axis direction perpendicular to the direction in which the cylindrical member 32, the drive source 33, and the pin 34 move due to the operation of the X-axis drive section 46. A Y-axis drive unit 47 is attached to move the wafer sheet H (parallel to the wafer sheet H) (horizontal movement in this embodiment).

In this embodiment, the protrusion mechanism 11 is formed by having a cylindrical member 32, a drive source 33, and a pin 34. Further, a virtual plane parallel to the wafer sheet H and the second virtual plane F and passing through the protrusion mechanism 11 is defined as a first virtual plane E, and the protrusion mechanism 11 is moved along the first virtual plane E (within the first virtual plane E). A first drive mechanism 49 for moving is formed having an X-axis drive section 46 and a Y-axis drive section 47. In addition, in FIG. 3, the wafer sheet H, the wafer ring 29, and the X-axis drive unit 30 are shown as a cross-sectional view, and in FIGS. Descriptions of the electronic component W, the wafer ring 29, the X-axis drive unit 30, etc. are omitted.

By the operation of the X-axis drive section 30 and the Y-axis drive section 31, one of the many electronic components W attached to the surface of the wafer sheet H is sequentially picked up at the pick-up position P1. It is arranged at a position (hereinafter referred to as a "picked up position") to be picked up by the support section 12. The pins 34 are located on the back side (in this embodiment, the lower side) of the wafer sheet H, and are moved toward the front side in the first direction J (in this embodiment, upward) to reach the pickup position. The placed electronic component W is moved to the front side of the wafer sheet H and brought into contact with the component support portion 12 placed at the pickup position P1.

The component support section 12 disposed at the pickup position P1 attracts the surface W2 of the electronic component W that has come into contact with the component support section 12, and the first direction J of the pin 34 is opposite (vertical direction in this embodiment). When the electronic component W is moved away from the wafer sheet H, the electronic component W is acquired from the wafer sheet H.

Further, in the vicinity of the pickup unit 13, an imaging unit 28 is provided which moves together with the component support unit 12 that has acquired the electronic component W at the pickup position P1 and images the surface W1 of the electronic component W placed at the 9 o'clock position. ing. Hereinafter, the position where the electronic component W is imaged by the imaging unit 28 will also be referred to as the "imaging position." The imaging unit 28 supported by a support member (not shown) images the surface W1 of the electronic component W placed at the imaging position, and obtains an image of the surface W1 of the electronic component W taken from the front. The imaging unit 28 only needs to be able to image the surface W1 of the electronic component W supported by the component support unit 12. For example, when the electronic component W temporarily stops at the 7:30 position, the imaging unit 28 is arranged at the 7:30 position. The imaging section 28 may be arranged to take an image of the surface W1 of the electronic component W.

As shown in FIG. 4, the imaging unit 28 is connected to a shift deriving unit 28a that acquires an image captured by the imaging unit 28. The shift deriving unit 28a can detect the position and orientation of the electronic component W from the image captured by the imaging unit 28. In the deviation deriving section 28a, the electronic components W placed at the processing positions P7, P8, P9, P10, and P11 are placed in predetermined positions and orientations with respect to the processing units 17, 18, 19, 20, and 21, respectively. The position and orientation of the electronic component W at the imaging position (hereinafter referred to as "reference position and reference orientation of the electronic component W") are stored.

The deviation deriving unit 28a extracts an image of the electronic component W acquired (supported) by the component support unit 12 from the image captured by the imaging unit 28 every time the imaging unit 28 captures an image of the electronic component W placed at the imaging position. The position and orientation of the electronic component W are detected, the detected position and orientation of the electronic component W are compared with the stored reference position and orientation of the electronic component W, and the reference position and orientation of the electronic component W are determined. (a deviation in the position of the electronic component W with respect to the reference position and a deviation in the orientation of the electronic component W with respect to the reference orientation) is detected, and the deviation is stored in association with the electronic component W in question.

The pickup unit 13 has a drive rotating section 56 between the center of the rotating member 23 and the component support section 12, as shown in FIG. The drive rotation section 56 can rotate the component support section 12 around a virtual rotation axis R passing through the axis of the component support section 12 . Since the axis of the component support section 12 is arranged in the first direction J when the component support section 12 is arranged at the pick-up position P1, the drive rotation section 56 In this state, the component support portion 12 is rotated about the virtual rotation axis R disposed in the first direction J.

Further, as shown in FIGS. 1 and 2, the transport unit 16 includes a motor 36 fixed to a base 45 and a plurality of component holding parts 14 attached at equal pitches along the outer periphery. It has a rotary body 15 that rotates. The motor 36 intermittently rotates the rotating body 15 to intermittently move the plurality of component holders 14. With one rotational operation of the rotating body 15, each component holding section 14 moves by the arrangement pitch of the component holding section 14.

Each component holder 14 is long in the vertical direction and is attached to the rotating body 15 so as to be movable up and down while passing through the rotating body 15. Each component holder 14 is a suction nozzle that suctions the electronic component W at its lower end, and suctions the electronic component W by vacuum pressure (negative pressure), and releases the suction state of the electronic component W by opening to the atmosphere or by positive pressure. A coil spring 37 is attached to each component holder 14 in a region above the rotating body 15 to apply an upward force to the lowered component holder 14 .

A disk-shaped plate member 39 is provided above the rotating body 15 and is fixed to a support member 38 that passes through the motor 36 and the rotating body 15. A plurality of holding members 41 each having a motor 40 fixed thereto are attached to the outer periphery of the horizontally arranged plate material 39, and a vertically arranged bar-shaped movable body 42 is attached to each holding member 41 so as to be able to rise and fall freely. There is. A coil spring 43 is provided below each motor 40 to apply an upward force to the lowered movable body 42. The motor 40 includes, as shown in FIG. 4, It is connected to the control section 57 together with the rotating section 56 .

In this embodiment, the motor 40 is connected to an output shaft 44 that moves up and down by the drive of the motor 40, and the movable body 42 is pushed down by the output shaft 44 that moves down. The rotating body 15 and the plurality of component holders 14 rotate by an angle corresponding to the arrangement pitch of the component holders 14 each time the motor 36 is driven. Each movable body 42 is disposed above the position where the component holder 14 temporarily stops, and is lowered by the operation of the corresponding motor 40, pushing down the temporarily stopped component holder 14. In addition, in FIG. 1, two each of the component holding part 14, the motor 40, the holding member 41, the movable body 42, the output shaft 44, etc. are shown, but in this embodiment, three or more of each of these are shown. It is provided.

One of the plurality of positions where the component holder 14 temporarily stops is the receiving position P2 above the pickup unit 13, as shown in FIGS. 2 and 3. The component supporting section 12 that has acquired the electronic component W from the wafer sheet H at the pickup position P1 moves intermittently together with the electronic component W by repeating the activation and stopping of the motor 51, and moves to the transfer position P3 directly below the receiving position P2. It will be in a stopped state.

In this embodiment, the passing position P3 around the rotating member 23 (rotating shaft) is the 12 o'clock position (0° position), and the rotating member 23 rotates through 90° twice (an example of multiple times). By rotating 180 degrees around the rotation axis 22, the component supporting section 12 disposed at the pickup position P1 is moved to the transfer position P3 opposite to the component holding section 14 disposed at the receiving position P3, and the transfer position P3 is also moved. The component support section 12, which was placed at , is moved to the pick-up position P1. When there are two component support sections 12, the rotation member 23 rotates 180 degrees in one rotation operation, thereby moving the component support section 12 placed at the pick-up position P1 to the transfer position P3. It is possible to move the disposed component support section 12 to the pickup position P1.

The component holder 14 placed at the receiving position P2 descends together with the movable body 42 by the operation of the motor 40, and comes into contact with the surface W1 of the electronic component W adsorbed by the component support 12 placed at the transfer position P3. Then, the surface W1 of the electronic component W is sucked. The component holding section 14 that has suctioned the electronic component W at the receiving position P2 acquires the electronic component W from the component support section 12 that has released the suction of the electronic component W, and moves up together with the movable body 42 by the operation of the motor 40.

In the vicinity of the transport unit 16, as shown in FIG. 2, there is a processing unit 17 that performs predetermined processing (appearance inspection, electrical property inspection, laser marking, etc.) on the electronic components W attracted to the component holding section 14. , 18, 19, 20, and 21 are provided. The electronic component W and the component holder 14 that have been attracted to the component holder 14 are moved intermittently by repeated activation and stop of the motor 36, and are moved to a processing position P7 where processing is performed by the processing unit 17, and to a processing position P7 where processing is performed by the processing unit 18. It sequentially stops at a processing position P8 where processing is performed, a processing position P9 where processing is performed by the processing unit 19, a processing position P10 where processing is performed by the processing unit 20, and a processing position P11 where processing is performed by the processing unit 21.

As shown in FIG. 4, the control unit 57 also controls the electronic components W attached to the wafer sheet H and arranged at or near the pickup position and the electronic components W around the electronic components W on the surface of the wafer sheet H. An imaging section 58 that captures an image from the side and a position detection section 59 that detects the position of the electronic component W placed at or near the pickup position based on the captured image of the imaging section 58 are also connected.

The control unit 57 can be configured by, for example, a CPU and a memory, and includes the X-axis drive units 25, 30, 47, the Y-axis drive units 26, 31, 46, the drive source 33, the motors 36, 40, 51, the imaging unit 28, 58 and the drive rotation section 56, and can acquire electronic data from the deviation derivation section 28a and the position detection section 59.

Here, the processing unit 17 treats the electronic component W on the premise that the electronic component W placed at the processing position P7 is placed at a predetermined position and orientation with respect to the processing unit 17. Designed to process. Therefore, if the electronic component W placed at the processing position P7 is not placed in a predetermined position and orientation with respect to the processing unit 17, there are problems such as the processing unit 17 not being able to properly process the electronic component W. occurs. In this regard, the electronic component W and the processing unit 18 placed at the processing position P8, the electronic component W and the processing unit 19 placed at the processing position P9, the electronic component W and the processing unit 20 placed at the processing position P10, and The same applies to the electronic component W and the processing unit 21 placed at the processing position P11.

Therefore, in the present embodiment, the electronic components W are placed in predetermined positions and orientations with respect to the processing units 17, 18, 19, 20, and 21 at the processing positions P7, P8, P9, P10, and P11, respectively, through the steps described below. so that it is placed in

<Preparation process> When the pickup unit 13 is placed at a predetermined standard position and all the component supports 12 are not suctioning electronic components W, the component supports 12 are moved by intermittent operation of the motor 51. The components are sequentially placed at the imaging position, and the imaging section 28 images the component support section 12 placed at the imaging position. The control section 57 derives and stores the position of the center of the component support section 12 when the component support section 12 is placed at the pickup position P1 for each component support section 12 based on the captured image of the imaging section 28 .

The reason why such processing is performed is because it has been confirmed that the center position of the component support portion 12 differs among the individual component support portions 12 due to manufacturing errors of the component support portion 12 or the like. However, since the differences in the center positions of the individual component support parts 12 are extremely small, this preparation process may be omitted depending on the requirements of the electronic component processing apparatus 10. Note that the description that the control of the motor 51, the imaging section 28, etc. in the preparation process is performed by the control section 57 is omitted. In this respect, the same may be said in the following description.

<Electronic component acquisition process> After the preparation process is completed, the pickup unit 13 picks up the electronic component W from the wafer sheet H in steps S1 to S6 shown in FIG.

Step S1: As shown in FIG. 7, the control section 57 controls the X-axis drive section 30 and the Y-axis drive section 31 to move one electronic component W to face the component support section 12 arranged at the pickup position P1. The wafer sheet H is moved together with the wafer ring 29 by a predetermined pitch in order to be placed at the pickup position, and the electronic component W is imaged by the imaging section 58 . Note that the imaging unit 58 may take an image of the electronic component W before the wafer ring 29 and the wafer sheet H move by a predetermined pitch.

Step S2: Since the positions of the individual electronic components W attached to the wafer sheet H vary to some extent, the electronic components W may not be placed at the pickup position. Therefore, the position detection unit 59 detects the position of the electronic component W based on the captured image of the imaging unit 58, and determines whether the electronic component W is placed at the pickup position. Step S3: If the position detection unit 59 determines that the electronic component W is located at the pickup position, the electronic component W is not moved.

Step S4: On the other hand, if the position detection unit 59 determines that the electronic component W is not placed at the pickup position, the control unit 57 controls the X-axis so that the electronic component W is placed at the pickup position. The drive section 30 and the Y-axis drive section 31 are controlled to move the electronic component W together with the wafer ring 29 and the wafer sheet H, so that the electronic component W is placed at a pickup position.

Step S5: The control unit 57 selects the X-axis based on the center position of the component support 12 at the pickup position P1, which is stored in association with the component support 12 heading toward the pickup position P1 (6 o'clock position). When the drive section 25 and the Y-axis drive section 26 are operated to move the pickup unit 13 placed at the standard position along the second virtual plane F, and the component support section 12 is placed at the pickup position P1, , the center of the component support section 12, the center of the electronic component W placed at the pickup position, and the center of the pin 34 are arranged on a virtual straight line (in this embodiment, a virtual straight line along the first direction J). to be done.

Note that the movement of the pickup unit 13 along the second virtual plane F may be performed with the component support section 12 disposed at the pickup position P1. In this embodiment, since the center of the electronic component W and the center of the pin 34 arranged at the pickup position are designed to be arranged on a virtual straight line along the first direction J, step S5 Although the protrusion mechanism 11 is not moved, if the center of the electronic component W and the center of the pin 34 are not arranged on the virtual straight line along the first direction J, the center of the electronic component W and the center of the pin 34 are The position of the protrusion mechanism 11 is adjusted by the operation of the X-axis drive section 46 and the Y-axis drive section 47 so that it is arranged on a virtual straight line along the first direction J.

That is, the control unit 57 controls the first drive mechanism 48, the second drive mechanism 27, and the third drive mechanism 35 (the first drive mechanism 48, the second drive mechanism 27, and the third drive mechanism 35). (operating any one or more of them) to adjust the positions of the component support section 12 disposed at the pick-up position P1, and then of the electronic component W and the ejection mechanism 11 to be acquired by the component support section 12.

Here, in steps S1 to S5, with the center of the electronic component W placed at the pickup position as a reference, the component supporting section 12 placed at the pickup position P1 is placed at the pickup position (i.e., the next component is placed at the pickup position). This is a procedure for adjusting the positions of the electronic component W (obtained by the support part 12) and the protrusion mechanism 11, but the position adjustment procedure is performed with reference to the center of the component support part 12 arranged at the pickup position P1. You can also do it. In that case, the following steps S2' to S3' are performed instead of steps S2 to S5.

Step S2': The position detection unit 59 detects the position of the electronic component W based on the captured image of the electronic component W captured by the imaging unit 58 in step S1, and stores the position of the center of the electronic component W.

Step S3': The control section 57 determines the center position of the component support section 12 at the pickup position P1, which is stored in association with the component support section 12 arranged at the pickup position P1, and the center position of the component support section 12, which is stored in the position detection section 59. Next, based on the center position of the electronic component W received by the component support section 12, the X-axis drive section 30, Y-axis drive section 31, X-axis drive section 46, and Y-axis drive section 47 are operated to pick up the electronic component W. With respect to the center of the component support section 12 placed at the pick-up position P1 with the unit 13 placed at the standard position, the center position of the electronic component W to be picked up next by the component support section 12 and the center position of the pin 34 are arranged on a virtual straight line along the first direction J.

Step S6: After the position adjustment of the component support part 12 arranged at the pickup position P1, the electronic component W arranged at the picked-up position, and the protrusion mechanism 11 is completed, the control unit 57 operates the drive source 33, The pin 34 is moved in the first direction J, and the electronic component W placed at the pickup position is brought close to and attracted to the component support part 12 placed at the pickup position P1, and the pin 34 is moved in the opposite direction to the first direction J. This movement causes the component support section 12 to acquire the electronic component W. Since the electronic component W is acquired by the component support section 12 in a state where the center of the component support section 12, the center of the electronic component W, and the center of the pin 34 are lined up linearly, the component support section 12 stabilizes the electronic component W. can be obtained.

Step S7: After the acquisition of the electronic component W by the component support unit 12 placed at the pickup position P1 is completed, if the pickup unit 13 is not placed at the standard position, the X-axis drive unit 25 and the Y-axis drive unit 26 are The pickup unit 13 is returned to the standard position by the operation, and if the wafer sheet H is not placed at the standard position, the wafer sheet H is returned to the standard position by the operation of the X-axis drive unit 30 and the Y-axis drive unit 31, and the wafer sheet H is not protruded. When the mechanism 11 is not placed at the standard position, the protrusion mechanism 11 is returned to the standard position by the operation of the X-axis drive section 46 and the Y-axis drive section 47.

Here, step S1 is performed with the pickup unit 13 and the wafer sheet H placed at standard positions.

<Electronic component delivery process> The electronic component W acquired from the wafer sheet H by the component support unit 12 disposed at the pickup position P1 is transferred from the pickup unit 13 to the transport unit 16 through steps S11 to S16 shown in FIG. It will be done.

Step S11: With the pickup unit 13 placed at the standard position, the imaging section 28 images the electronic component W that is stationary at the imaging position, as shown in FIG. Step S12: The deviation deriving unit 28a detects the position and orientation of the electronic component W imaged while being acquired (supported) by the component support unit 12 based on the captured image of the imaging unit 28, and The position and orientation of the electronic component W are compared with the stored reference position and orientation of the electronic component W to detect a deviation from the reference position and orientation of the electronic component W, and the detected deviation from the reference position and orientation is detected. It is stored in association with the electronic component W.

Step S13: The control unit 57 controls the electronic component W placed at the 12 o'clock position based on the deviation with respect to the reference position and reference orientation of the electronic component W that is stored in association with the electronic component W by the deviation derivation unit 28a. Adjust position and orientation. Specifically, the control section 57 operates the X-axis drive section 25 and the Y-axis drive section 26 to move the pickup unit 13 supporting the electronic component W on the component support section 12 along the second virtual plane F. Then, the electronic component W supported by the component support section 12 and placed at the 12 o'clock position is adjusted and placed at a predetermined position, and the drive corresponding to the component support section 12 supporting the electronic component W is adjusted. The rotating part 56 is operated to rotate the electronic component W around the virtual rotation axis R, and the orientation of the electronic component W is adjusted and arranged in a predetermined direction.

The position of the electronic component W placed at the 12 o'clock position after the position adjustment is the transfer position P3. This step S13 may be performed after step S6 or may be performed before step S6. When step S13 is performed after step S6, the orientation of the electronic component W can be adjusted by operating the drive rotation section 56 before the electronic component W is placed at the 12 o'clock position. When step S13 is performed before step S6, the position and orientation of the electronic component W is adjusted by the operation of the X-axis drive section 25, Y-axis drive section 26, and drive rotation section 56 so that the electronic component W moves toward the 12 o'clock position. It can be done at any time.

Step S14: The control unit 57 operates the motor 40 provided above the receiving position P2, lowers the component holding unit 14 that has been stationary at the receiving position P2, and supports the component that is stationary at the 12 o'clock position. The surface W1 of the electronic component W supported by the portion 12 is brought into contact with the surface W1. Step S15: The component holding section 14 suctions the surface W1 of the electronic component W, and the component support section 12 releases the suction of the surface W2 of the electronic component W. The pickup unit 13 is returned to the standard position after the component support section 12 releases the suction of the surface W2 of the electronic component W.

Step S16: The control section 57 operates the motor 40 to raise the component holding section 14, so that the component holding section 14 acquires the electronic component W from the component supporting section 12. This completes the transfer of the electronic component W from the pickup unit 13 to the transport unit 16.

As shown in FIG. 2, the component holding section 14 that has acquired the electronic component W from the component support section 12 at the receiving position P2 receives the electronic component W by the operation of the motor 36 (in this embodiment, the motor 36 is operated twice). It moves together with the part W and is placed at the processing position P7. Here, by adjusting the position and orientation of the electronic component W by the operation of the X-axis drive section 25, Y-axis drive section 26, and drive rotation section 56 in step S7, the electronic component W placed at the processing position P7 is processed. It is placed in a predetermined position and orientation relative to the unit 17. Therefore, the control unit 57 controls the second drive mechanism 27 and the drive rotation unit 56 based on the deviation detected by the deviation derivation unit 28a, so that the electronic component W is at a predetermined position with respect to the processing unit 17 at the treatment position P7. and orientation.

Thereafter, the processing unit 17 performs predetermined processing on the electronic component W placed at the processing position P7. The rotation of the rotating body 15 by the operation of the motor 36 is, in principle, performed at the same timing as the rotation of the rotating member 23.

Processing by the processing unit 18 for the electronic component W placed at the processing position P8, processing by the processing unit 19 for the electronic component W placed at the processing position P9, and processing by the processing unit 20 for the electronic component W placed at the processing position P10. The processing by the processing unit 21 on the electronic component W placed at the processing position P11 is performed at the same timing as the processing by the processing unit 17 on the electronic component W placed at the processing position P7. Some of the processing units 17, 18, 19, 20, and 21 process the electronic component W while the component holding section 14 supports the electronic component W, and the remaining processing units process the electronic component W after acquiring the electronic component W from the component holding section 14. , processes the electronic component W, and returns the electronic component W to the component holding section 14.

Next, an electronic component processing apparatus 70 according to a second embodiment of the present invention will be described with reference to FIGS. 9 to 17. In addition, in the electronic component processing apparatus 70, the same components as the electronic component processing apparatus 10 are given the same reference numerals, and detailed description thereof will be omitted. As shown in FIG. 9, FIG. 10, and FIG. A pickup unit 13 having a component support section 12 that acquires the electronic component W projected in the first direction J at a pickup position P1 facing the wafer sheet H; A transport unit 16 that moves the component holder 14 together with the electronic component W to processing positions P7, P8, P9, P10, and P11 by rotation of a rotating body 15 to which the component holder 14 that acquires the electronic component W is attached, and a processing position P7. , P8, P9, P10, and P11, respectively.

The pickup unit 13 is provided below the rotating body 15 and includes a rotating shaft 22 supported by a support 71 and four (plural) component supporting parts 12 each provided movably forward and backward relative to the rotating member 23. are doing. In this embodiment, the wafer sheet H is arranged vertically at substantially the same height as the pickup unit 13. Each component support section 12 moves 90 degrees with the intermittent rotation of the rotating member 23 due to repeated activation and stop of the motor 51 shown in FIG. It is arranged at the opposing pickup position P1 (3 o'clock position). Note that in FIGS. 10 and 13, illustrations of the coil spring 24 and the like that apply force to the component support portion 12 are omitted.

The support body 71 is movably attached to guide rails 73 and 74 provided in parallel on the base 72, as shown in FIGS. 9 and 11. In the vicinity of the support body 71, as shown in FIGS. 10 and 13, a power transmission unit 75 is actuated to apply force to the support body 71 to horizontally move the pickup unit 13 along the guide rails 73 and 74. A driving source 76 is installed.

In this embodiment, the pickup unit 13 moves in a second direction G parallel to the wafer sheet H or in a direction opposite to the second direction G. When viewed from above (viewed along the rotation axis of the rotor 15), the second direction G is a second imaginary straight line N passing through the rotation center of the rotor 15 and the receiving position P2, as shown in FIG. Vertical. A drive mechanism 77, which is an example of a second driver that moves the pickup unit 13 in the second direction G or the opposite direction to the second direction G, includes guide rails 73, 74, a power transmission section 75, and a drive source 76. has been done.

Furthermore, as shown in FIG. 11, the wafer sheet H and the wafer ring 29 on which the wafer sheet H is attached are moved to the positive and negative sides in the vertical direction by the operation of the vertical drive unit 78 that supports the wafer ring 29. Furthermore, the wafer sheet H and the wafer ring 29 are moved horizontally together with the vertical drive section 78 by the operation of a horizontal drive section 79 attached to the vertical drive section 78 . A pin 34 is provided inside the cylindrical member 32 attached to the vertical drive section 78 and moves horizontally back and forth by the operation of the drive source 33. In the present embodiment, a drive mechanism 80 (an example of a third driver) that freely moves the wafer sheet H within the third virtual plane Q containing the wafer sheet H includes a vertical drive section 78 and a horizontal drive section 79. It is configured.

Note that in FIG. 11, the wafer sheet H, wafer ring 29, and vertical drive unit 78 are shown as a cross-sectional view. By the operation of the vertical drive section 78 and the horizontal drive section 79, one of the many electronic components W attached to the surface of the wafer sheet H is sequentially moved to the component support section arranged at the pickup position P1. 12 at the picked-up position.

Inside the cylindrical member 32 provided in the vicinity of the wafer sheet H, a drive source 33 moves the inside of the cylindrical member 32 in a direction perpendicular to the wafer sheet H (horizontal direction). A pin 34 is provided that moves (moves). The pin 34 is located on the back side of the wafer sheet H, and by moving forward (moving in the first direction J), the pin 34 moves the electronic component W placed at the pickup position to the front side of the wafer sheet H (moving in the first direction J). (extrusion) and contact the component support portion 12 arranged at the pickup position P1.

As shown in FIGS. 11 and 13, the drive source 33 has a protrusion mechanism 11 formed of a cylindrical member 32, a drive source 33, and a pin 34 in a second direction G parallel to the wafer sheet H. Alternatively, a horizontal drive unit 81 (an example of a first driver) that moves in the opposite direction to the second direction G is attached.

Further, in the vicinity of the pickup unit 13, an imaging section 82 is provided which moves together with the component support section 12 that has acquired the electronic component W at the pickup position P1 and images the surface W1 of the electronic component W placed at the 6 o'clock position. ing. Hereinafter, the "6 o'clock position" will also be referred to as the "imaging position." The imaging unit 82 images the surface W1 of the electronic component W placed at the imaging position via the prism 83, and obtains an image of the surface W1 of the electronic component W taken from the front. The imaging section 82 only needs to be able to image the surface W1 of the electronic component W supported by the component support section 12. For example, the imaging section 82 may be arranged so as to image the surface W1 of the electronic component W placed at the 9 o'clock position. It's okay.

As shown in FIG. 12, the imaging unit 82 is connected to a shift deriving unit 84 that acquires an image captured by the imaging unit 82. The shift deriving unit 84 can detect the position and orientation of the electronic component W from the image captured by the imaging unit 82. The deviation deriving unit 84 stores the reference position and reference orientation of the electronic component W. Each time the imaging unit 82 images the electronic component W placed at the imaging position, the deviation deriving unit 84 calculates the position and orientation of the electronic component W detected for the imaged electronic component W and the stored electronic component W. A deviation from the reference position and reference orientation of the electronic component W is detected by comparing the reference position and reference orientation, and the detected deviation from the reference position and reference orientation is stored in association with the corresponding electronic component W.

As shown in FIG. 14, the drive rotation section 56 is capable of rotating the component support section 12 around a virtual rotation axis R disposed in the first direction J with the component support section 12 disposed at the pick-up position P1. can. In this embodiment, as shown in FIGS. 11 and 14, the passing position P3 around the rotating member 23 (rotating shaft 22) is the 12 o'clock position, and the rotating member 23 rotates 90° three times to 270°. By rotating by degrees, the component support section 12 that was placed at the pick-up position P1 is placed at the transfer position P3.

Further, as shown in FIG. 10, a virtual straight line passing through the center of the rotary body 15 and the processing position P7 in plan view (viewed along the rotation axis of the rotary body 15) is defined as a first virtual straight line M; The direction from the processing position P7 toward the center of the rotating body 15 along the straight line M is defined as a third direction K (that is, the third direction K is a direction along the first imaginary straight line M), and the processing unit 17 , a drive mechanism 87 (an example of a fourth driver) that moves in the third direction K or the opposite direction to the third direction K is connected.

Similarly, a horizontal imaginary straight line passing through the center of the rotating body 15 and the processing position P8 in plan view is defined as a first imaginary straight line M, and along the first imaginary straight line M from the processing position P8 toward the center of the rotating body 15. The direction is a third direction K, a horizontal imaginary straight line passing through the center of the rotating body 15 and the processing position P9 in plan view is a first imaginary straight line M, and the rotating body is moved from the processing position P9 along the first imaginary straight line M. 15 is a third direction K, a horizontal imaginary straight line passing through the center of the rotating body 15 and the processing position P10 in plan view is a first imaginary straight line M, and along the first imaginary straight line M A direction from the processing position P10 toward the center of the rotating body 15 is defined as a third direction K, a horizontal imaginary straight line passing through the center of the rotating body 15 and the processing position P11 in plan view is defined as a first imaginary straight line M; The direction from the processing position P11 toward the center of the rotating body 15 along the virtual straight line M is defined as the third direction K, and the processing units 18, 19, 20, and 21 each have a third direction K or a third direction K. Drive mechanisms 88, 89, 90, and 91 (each an example of a fourth driver) for moving in opposite directions are connected. In addition, in FIG. 10, description of the first virtual straight line M other than the first virtual straight line M corresponding to the processing unit 17 and the processing position P7 is omitted.

The drive mechanisms 87, 88, 89, 90, and 91, as shown in FIG. , the position detection section 59, the deviation derivation section 84, and the drive rotation section 56 are connected to the control section 57a. The control unit 57a includes drive sources 33, 76, motors 36, 40, 51, drive rotation unit 56, imaging units 58, 82, vertical drive unit 78, horizontal drive units 79, 81, drive mechanisms 87, 88, 89, 90. , 91, and can acquire electronic data from the position detecting section 59 and the deviation deriving section 84.

In this embodiment, after performing a preparation process similar to the preparation process performed on the electronic component processing apparatus 10, the electronic components W are processed at the processing positions P7, P8, P9, P10, and P11 by the processing described below. 17, 18, 19, 20, and 21, respectively, at predetermined positions and orientations.

<Electronic component acquisition process> After the preparation process is completed, the pickup unit 13 picks up the electronic component W from the wafer sheet H in steps S21 to S27 shown in FIG.

Step S21: As shown in FIG. 15, the control section 57a controls the vertical drive section 78 and the horizontal drive section 79 to move one electronic component W to be picked up facing the component support section 12 arranged at the pickup position P1. The wafer sheet H is moved together with the wafer ring 29 by a predetermined pitch in order to place the electronic component W in the position, and the image capturing unit 58 captures an image of the electronic component W. Note that the imaging unit 58 may take an image of the electronic component W before the wafer ring 29 and the wafer sheet H move by a predetermined pitch.

Step S22: The position detection unit 59 detects the position of the electronic component W based on the captured image of the imaging unit 58, and determines whether the electronic component W is placed at the pickup position. Step S23: If the position detection unit 59 determines that the electronic component W is located at the pickup position, the electronic component W is not moved.

Step S24: On the other hand, if the position detection unit 59 determines that the electronic component W is not placed at the pickup position, the control unit 57a drives the vertical drive so that the electronic component W is placed at the pickup position. unit 78 and horizontal drive unit 79 to move the electronic component W together with the wafer ring 29 and wafer sheet H, so that the electronic component W is placed at a pickup position.

Step S25: The control unit 57a uses the driving source based on the center position of the component support portion 12 at the pickup position P1, which is stored in association with the component support portion 12 heading toward the pickup position P1 (3 o'clock position). 76 is activated to move the pickup unit 13 placed at the standard position in the second direction G or the opposite direction to the second direction G, and when the component support section 12 is placed at the pickup position P1, the component is removed. The center of the support part 12, the center of the electronic component W placed at the pickup position, and the center of the pin 34 are arranged on a virtual straight line (in this embodiment, a virtual straight line along the first direction J). Make it.

Note that the movement of the pickup unit 13 in the second direction G or the opposite direction to the second direction G may be performed with the component support section 12 placed at the pickup position P1. In this embodiment, since the center of the electronic component W and the center of the pin 34 arranged at the pickup position are designed to be arranged on a virtual straight line along the first direction J, step S25 Although the protrusion mechanism 11 is not moved, if the center of the electronic component W and the center of the pin 34 are not arranged on the virtual straight line along the first direction J, the center of the electronic component W and the center of the pin 34 are The position of the protrusion mechanism 11 is adjusted by the operation of the horizontal drive unit 81 so that it is disposed on a virtual straight line along the first direction J.

That is, the control unit 57a controls the first driver, the second driver, and the third driver (operates any one or more of the first driver, the second driver, and the third driver) to place the driver at the pickup position P1. Then, the positions of the electronic component W acquired by the component support section 12 and the protrusion mechanism 11 are adjusted.

Here, in steps S21 to S25, with the center of the electronic component W placed at the pickup position as a reference, the component supporting section 12 placed at the pickup position P1 is placed at the pickup position (that is, the next component This is a procedure for adjusting the positions of the electronic component W (obtained by the support part 12) and the protrusion mechanism 11, but the position adjustment procedure is performed with reference to the center of the component support part 12 arranged at the pickup position P1. You can also do it. In that case, the following steps S22' to S23' are performed instead of steps S22 to S25.

Step S22': The position detection unit 59 detects the position of the electronic component W based on the image taken by the imaging unit 58 of the electronic component W in step S21, and stores the position of the center of the electronic component W.

Step S23': The control section 57a stores the center position of the component support section 12 at the pickup position P1, which is stored in association with the component support section 12 arranged at the pickup position P1, and the center position of the component support section 12, which is stored in the position detection section 59. Next, based on the center position of the electronic component W received by the component support section 12, the horizontal drive sections 79 and 81 are operated, and the pickup unit 13 is placed at the pickup position P1 with the pickup unit 13 placed at the standard position. With respect to the center of the component support section 12, the center position of the electronic component W to be next received by the component support section 12 and the center position of the pin 34 are arranged on an imaginary straight line along the first direction J. do.

Step S26: After completing the position adjustment of the component support section 12 placed at the pick-up position P1, the electronic component W placed at the picked-up position, and the protrusion mechanism 11, the control unit 57a operates the drive source 33, The pin 34 is moved in the first direction J, and the electronic component W placed at the pickup position is brought close to and attracted to the component support part 12 placed at the pickup position P1, and the pin 34 is moved in the opposite direction to the first direction J. This movement causes the component support section 12 to acquire the electronic component W.

Step S27: After the acquisition of the electronic component W by the component supporter 12 placed at the pickup position P1 is completed, if the pickup unit 13 is not placed at the standard position, the drive source 76 operates to move the pickup unit 13 to the standard position. If the wafer sheet H is not placed in the standard position, the wafer sheet H is returned to the standard position by the operation of the horizontal drive unit 79, and if the ejection mechanism 11 is not placed in the standard position, the horizontal drive unit 81 returns the protruding mechanism 11 to the standard position.

Here, step S21 is performed with the pickup unit 13 and the wafer sheet H placed at standard positions.

<Electronic component delivery process> The electronic component W acquired from the wafer sheet H by the component support unit 12 arranged at the pickup position P1 is transferred from the pickup unit 13 to the transport unit 16 through steps S31 to S36 shown in FIG. It will be done.

Step S31: With the pickup unit 13 placed at the standard position, the imaging unit 82 images the electronic component W that is stationary at the imaging position, as shown in FIG. Step S32: The deviation deriving unit 84 detects the position and orientation of the electronic component W imaged while being acquired (supported) by the component support unit 12 based on the captured image of the imaging unit 82, and The position and orientation of the electronic component W are compared with the stored reference position and orientation of the electronic component W, a deviation from the reference position and orientation of the electronic component W is detected, and the deviation is linked to the electronic component W. memorize it.

Step S33: The control unit 57a controls the electronic component W placed at the 12 o'clock position based on the deviation from the reference position and reference orientation of the electronic component W that is stored in association with the electronic component W by the deviation derivation unit 84. Adjust position and orientation. Specifically, the control unit 57a operates the drive source 76 to move the pickup unit 13 supporting the electronic component W in the component support unit 12 in the second direction G or in the opposite direction to the second direction G, thereby moving the component While adjusting the position in the second direction G of the electronic component W supported by the support part 12 and placed at the 12 o'clock position and placing it in a predetermined position, the part support part 12 supporting the electronic component W is adjusted. The corresponding drive rotation unit 56 is operated to rotate the electronic component W around the virtual rotation axis R, and the orientation of the electronic component W is adjusted and arranged in a predetermined direction.

The position of the electronic component W placed at the 12 o'clock position after the position adjustment is the transfer position P3. This step S33 may be performed after step S26 or may be performed before step S26. When step S33 is performed after step S26, the orientation of the electronic component W can be adjusted by operating the drive rotation section 56 before the electronic component W is placed at the 12 o'clock position. When step S33 is performed before step S26, the position and orientation of the electronic component W can be adjusted by operating the drive source 76 and the drive rotation unit 56 at the timing when the electronic component W is heading toward the 12 o'clock position. .

The electronic component W whose position and orientation have been adjusted at the 12 o'clock position is subjected to the same processing as the electronic component W by the electronic component processing apparatus 10 and transferred from the component support section 12 of the pickup unit 13 to the component holding section of the transport unit 16. 14 and supported by the component holding section 14 of the transport unit 16, the processing units 17, 18, 19, 20, and 21 perform predetermined processing on the electronic component W supported by the component holding section 14 of the transport unit 16.

<Processing of the processing unit> The component holding unit 14, which has acquired the electronic component W from the component support unit 12 at the receiving position P2, moves together with the electronic component W by the operation of the motor 36 and stops at one position upstream of the processing position P7. placed in the area. Thereafter, in steps S41 to S42 shown in FIG. 17, the positions of the electronic component W and the rotating body 15 of the processing unit 17 are adjusted in the radial direction. In principle, the rotation of the rotating body 15 and the movement of the component holder 14 due to the operation of the motor 36 are performed at the same timing as the rotation of the rotating member 23 and the movement of the component support 12.

Step S41: The control unit 57a operates the motor 36 to move the electronic component W and the component holding unit 14 to the processing position P7, and also the reference that the deviation derivation unit 84 stored in association with the electronic component W in step S26. Based on the position and the deviation from the reference orientation, it is determined whether to move the processing unit 17 in the third direction K or the opposite direction to the third direction K, and the distance of movement thereof, and the drive mechanism 87 is operated.

Due to the operation of the drive mechanism 87, the processing unit 17 moves in the third direction K or the opposite direction to the third direction K, and the processing unit 17 moves in the direction of the first imaginary straight line M to move the electrons disposed at the processing position P7. It is arranged at a predetermined position with respect to the part W. Therefore, the drive mechanism 87 is moved in the third direction K perpendicular to the direction of position adjustment of the electronic component W made by the movement of the pickup unit 13, or in the opposite direction of the third direction K, and placed at the processing position P7. The position of the processing unit 17 in the third direction K with respect to the electronic component W is adjusted.

As a result, the electronic component W placed at the processing position P7 is placed at a predetermined position and orientation with respect to the processing unit 17. Therefore, the control unit 57a controls the drive mechanisms 77, 87 and the drive rotation unit 56 based on the deviation detected by the deviation derivation unit 84, so that the electronic component W is positioned at a predetermined position relative to the processing unit 17 at the processing position P7. so that it is oriented in the same direction. In this embodiment, the movement of the processing unit 17 in the third direction K or the opposite direction to the third direction K is completed before the electronic component W is placed at the processing position P7. The movement of the processing unit 17 in the third direction K or the opposite direction to the third direction K may be completed after being placed at the processing position P7.

Here, at the timing when the position of the processing unit 17 is being adjusted for the electronic component W placed at the processing position P7, the processing unit 18 is adjusted for the electronic component W placed at the processing position P8. The position of the processing unit 19 is adjusted for the electronic component W placed at the processing position P9, and the position of the processing unit 20 is adjusted for the electronic component W placed at the processing position P10. The position adjustment is performed, and the position adjustment of the processing unit 21 is performed with respect to the electronic component W placed at the processing position P11.

Further, in this embodiment, the position adjustment of the electronic component W in the second direction G and the orientation adjustment of the electronic component W around the virtual rotation axis R are performed at the same timing by moving the pickup unit 13 in step S27. Therefore, each process performed for arranging the processing unit 17 in a predetermined position and orientation with respect to the electronic component W placed at the processing position P7 can be effectively performed, and as a result, the electronic component processing apparatus 70, it is possible to increase the number of electronic components W processed per unit time.

In addition, in plan view, there is not enough free space between the processing units 17, 18, 19, 20, 21 arranged around the motor 36, so the processing units 17, 18, 19, 21 , 21 in a direction perpendicular to the third direction K poses a problem in terms of space, but in this embodiment, the processing units 17, 18, 19, 20, and 21 are moved only in the third direction K. By moving it, you can avoid this problem.

Step S42: After the radial movement of the rotating body 15, the processing unit 17 performs predetermined processing on the stationary electronic component W placed at the processing position P7. At the same timing, the processing units 18, 19, 20, and 21 perform predetermined processing on each electronic component W placed at the processing positions P8, P9, P10, and P11, respectively.

Although the embodiments of the present invention have been described above, the present invention is not limited to the above-described embodiments, and any changes in conditions that do not depart from the gist are within the scope of the present invention. For example, the wafer sheets need not be vertically or horizontally oriented.

Further, instead of the pickup unit having a drive rotation section, the transport unit 100 has a drive rotation mechanism 102 that rotates the component holding section 101, as in a modified example shown in FIG. 18, so that the orientation of the electronic component W can be adjusted. You may also do so. As shown in FIG. 18, the drive rotation mechanism 102 rotates the component holding section 101 that has acquired the electronic component W before the component holding section 101 that has acquired the electronic component W is placed in the processing position. The orientation of the electronic component W (supported by the component support section 12) with respect to the transport unit is adjusted.

In this case, the control unit controls the second drive mechanism and the drive rotation mechanism 102 (or the second driver, the fourth driver, and the drive rotation mechanism 102) based on the deviation detected by the deviation derivation unit, and controls the electronic component W. is arranged at a predetermined position and orientation with respect to the processing unit at the processing position. When the drive rotation mechanism 102 is employed, there is no need to provide the pickup unit 103 with a drive rotation section.

Here, the most upstream processing position along the rotational direction of the rotating body is a processing unit that does not require accurate adjustment of the orientation of electronic components (for example, a processing unit that performs visual inspection of electronic components using an imaging unit). If the second processing position from the upstream side corresponds to a processing unit that requires accurate adjustment of the orientation of electronic components (for example, a processing unit that inspects the electrical characteristics of electronic components), the electronic The orientation of the component W is adjusted before it is placed at the second processing position from the upstream side (for example, at the timing when the component holding section 101 is moving from the most upstream processing position to the second processing position). Alternatively, it may be placed at the second processing position from the upstream side. Note that the drive rotation mechanism 102 can be configured to include, for example, a motor. In the modification shown in FIG. 18, the same components as those of the electronic component processing apparatuses 10 and 70 are given the same reference numerals, and detailed description thereof will be omitted.

Furthermore, the first drive mechanism only needs to have two drive parts that move the protrusion mechanism in different directions, and does not need to have an X-axis drive part and a Y-axis drive part whose directions in which the protrusion mechanism is moved are orthogonal. . This also applies to the second drive mechanism that moves the pickup unit, the third drive mechanism that moves the wafer sheet, and the third driver that moves the wafer sheet.

The rotating body of the transport unit does not need to rotate around a vertical axis of rotation; for example, the rotating body of the transport unit may rotate around a horizontal axis of rotation. When the rotating body of the transport unit rotates around a horizontal rotation axis, the first imaginary straight line M passing through the center of the rotating body and the processing position when viewed along the rotation axis of the rotating body is located at the processing position. It will be placed on a virtual vertical plane.

Furthermore, a relay unit may be provided between the pickup unit and the transport unit to acquire the electronic component from the pickup unit and provide it to the transport unit. It is not necessary to detect the position and orientation of the electronic component acquired by the component support section based on the image captured by the imaging section; for example, the detection may be performed based on the measured value of the laser sensor. Good too.

This application is based on the Japanese patent application filed on July 27, 2022 (Japanese patent application No. 2022-119662) and the Japanese patent application filed on October 21, 2022 (Japanese patent application No. 2022-169188). Incorporated into this application by reference.

10: Electronic component processing device, 11: Projection mechanism, 12: Component support section, 13: Pick-up unit, 14: Component holding section, 15: Rotating body, 16: Transport unit, 17, 18, 19, 20, 21: Processing Unit, 21a: Support body, 22: Rotating shaft, 23: Rotating member, 24: Coil spring, 25: X-axis drive section, 26: Y-axis drive section, 27: Second drive mechanism, 28: Imaging section, 28a : Misalignment deriving unit, 29: Wafer ring, 30: X-axis drive unit, 31: Y-axis drive unit, 32: Cylindrical member, 33: Drive source, 34: Pin, 35: Third drive mechanism, 36: Motor , 37: coil spring, 38: support member, 39: plate material, 40: motor, 41: holding member, 42: movable body, 43: coil spring, 44: output shaft, 45: base stand, 46: X-axis drive unit , 47: Y-axis drive unit, 49: first drive mechanism, 51: motor, 56: drive rotation unit, 57, 57a: control unit, 58: imaging unit, 59: position detection unit, 70: electronic component processing device , 71: Support, 72: Base, 73, 74: Guide rail, 75: Power transmission section, 76: Drive source, 77: Drive mechanism, 78: Vertical drive section, 79: Horizontal drive section, 80: Drive mechanism , 81: horizontal drive unit, 82: imaging unit, 83: prism, 84: deviation derivation unit, 87, 88, 89, 90, 91: drive mechanism, 100: transport unit, 101: component holding unit, 102: drive rotation Mechanism, 103: Pick-up unit, H: Wafer sheet, M, N: Virtual straight line, P1: Pick-up position, P2: Receiving position, P3: Transfer position, P7, P8, P9, P10, P11: Processing position, R: Virtual Rotating axis, W: electronic component, W1, W2: surface

Claims (15)

a protrusion mechanism that protrudes an electronic component attached to a wafer sheet in a first direction perpendicular to the wafer sheet;
a pickup unit having a component support section that acquires the electronic component protruded in the first direction at a pickup position facing the wafer sheet;
a transport unit in which the component holder moves to a processing position together with the electronic component by rotation of a rotating body to which a component holder is attached that acquires the electronic component from the pickup unit at a receiving position;
a processing unit that performs a predetermined process on the electronic component placed at the processing position;
a first drive mechanism that moves the protrusion mechanism along a first virtual plane parallel to the wafer sheet;
a second drive mechanism that moves the pickup unit supporting the electronic component on the component support section along a second virtual plane parallel to the wafer sheet;
a third drive mechanism that moves the wafer sheet within a third virtual plane that includes the wafer sheet;
a deviation derivation unit that detects a deviation from a reference position and reference orientation of the electronic component acquired by the component support unit;
The first drive mechanism, the second drive mechanism, and the third drive mechanism are controlled so that the component support section disposed at the pick-up position and the electrons that are subsequently acquired by the component support section are controlled. a control unit that adjusts the position of the component and the protrusion mechanism;
Equipped with
The pickup unit is
By rotating 180° around the rotation axis by one or more rotational movements, the component support section placed at the pick-up position is moved to a transfer position opposite to the component holding section placed at the receiving position. a rotating member that moves the component support section that has been arranged at the transfer position to the pick-up position;
a driving rotation unit that rotates the component support unit that has acquired the electronic component around a virtual rotation axis arranged in the first direction with the component support unit disposed at the pick-up position;
has
The control unit controls the second drive mechanism and the drive rotation unit based on the deviation detected by the deviation derivation unit, so that the electronic component is positioned at a predetermined position relative to the processing unit at the processing position. so that it is arranged in the direction of
Electronic component processing equipment. The electronic component processing apparatus according to claim 1, wherein the component support section includes an imaging section that captures an image of the acquired electronic component, and the shift derivation section detects the shift based on the image captured by the imaging section. Electronic component processing equipment. a protrusion mechanism that protrudes electronic components attached to a wafer sheet in a first direction perpendicular to the wafer sheet;
a pickup unit having a component support section that acquires the electronic component protruded in the first direction at a pickup position facing the wafer sheet;
a transport unit in which the component holder moves to a processing position together with the electronic component by rotation of a rotating body to which a component holder is attached that acquires the electronic component from the pickup unit at a receiving position;
a processing unit that performs a predetermined process on the electronic component placed at the processing position;
a first drive mechanism that moves the protrusion mechanism along a first virtual plane E parallel to the wafer sheet;
a second drive mechanism that moves the pickup unit that supports the electronic component on the component support section along a second virtual plane parallel to the wafer sheet;
a third drive mechanism that moves the wafer sheet within a third virtual plane that includes the wafer sheet;
a deviation derivation unit that detects a deviation from a reference position and reference orientation of the electronic component acquired by the component support unit;
The first drive mechanism, the second drive mechanism, and the third drive mechanism are controlled so that the component support section disposed at the pick-up position and the electrons that are subsequently acquired by the component support section are controlled. a control unit that adjusts the position of the component and the protrusion mechanism;
Equipped with
The pickup unit rotates 180° around the rotation axis by one or more rotational operations, thereby transferring the component support portion placed at the pickup position to the component holding portion placed at the receiving position. a rotating member that moves to the opposing transfer position and moves the component support section placed at the transfer position to the pick-up position;
The transport unit includes a drive rotation mechanism that rotates the component holder to adjust the orientation of the electronic component acquired in the component holder with respect to the transport unit,
The control unit controls the second drive mechanism and the drive rotation mechanism based on the deviation detected by the deviation derivation unit, so that the electronic component is positioned at a predetermined position relative to the processing unit at the processing position. so that it is arranged in the direction of
Electronic component processing equipment. 4. The electronic component processing apparatus according to claim 3, wherein the component supporting section includes an imaging section that captures an image of the electronic component acquired, and the shift deriving section detects the shift based on the image captured by the imaging section. do. Electronic component processing equipment. a protrusion mechanism that protrudes an electronic component attached to a wafer sheet in a first direction perpendicular to the wafer sheet;
a pickup unit having a component support section that acquires the electronic component protruded in the first direction at a pickup position facing the wafer sheet;
a transport unit in which the component holder moves to a processing position together with the electronic component by rotation of a rotating body to which a component holder is attached that acquires the electronic component from the pickup unit at a receiving position;
a processing unit that performs a predetermined process on the electronic component placed at the processing position;
a first driver that moves the protruding mechanism in a second direction parallel to the wafer sheet or in a direction opposite to the second direction;
a second driver that moves the pickup unit supporting the electronic component on the component support part in the second direction or in a direction opposite to the second direction;
a third driver that moves the wafer sheet within a third virtual plane that includes the wafer sheet;
The processing unit is moved in a third direction perpendicular to the direction in which the position of the electronic component is adjusted by the movement of the pickup unit, or in a direction opposite to the third direction, and the electronic component placed at the processing position is moved. , a fourth driver that adjusts the position of the processing unit in the third direction;
a deviation derivation unit that detects a deviation from a reference position and reference orientation of the electronic component acquired by the component support unit;
Controlling the first driver, the second driver, and the third driver, the component support section disposed at the pickup position, and the electronic component and the protrusion mechanism that are then acquired by the component support section. a control unit that adjusts the position of the
Equipped with
The pickup unit includes a drive rotation unit that rotates the component support unit that has acquired the electronic component around a virtual rotation axis arranged in the first direction with the component support unit disposed at the pickup position; has
The control unit controls the second driver, the fourth driver, and the drive rotation unit based on the deviation detected by the deviation derivation unit, so that the electronic component is in a predetermined position relative to the processing unit at the processing position. so that it is arranged in the position and orientation of
Electronic component processing equipment. 6. The electronic component processing apparatus according to claim 5, wherein when viewed along the rotation axis of the rotary body, the second direction is perpendicular to a second imaginary straight line passing through the rotation center of the rotary body and the receiving position. , wherein the third direction is a direction along a first imaginary straight line passing through the center of rotation of the rotating body and the processing position. 6. The electronic component processing apparatus according to claim 5, wherein the component supporting section includes an imaging section that captures an image of the electronic component acquired, and the shift deriving section detects the shift based on the image captured by the imaging section. do. Electronic component processing equipment. a protrusion mechanism that protrudes an electronic component attached to a wafer sheet in a first direction perpendicular to the wafer sheet;
a pickup unit having a component support section that acquires the electronic component protruded in the first direction at a pickup position facing the wafer sheet;
a transport unit in which the component holder moves to a processing position together with the electronic component by rotation of a rotating body to which a component holder is attached that acquires the electronic component from the pickup unit at a receiving position;
a processing unit that performs a predetermined process on the electronic component placed at the processing position;
a first driver that moves the protruding mechanism in a second direction parallel to the wafer sheet or in a direction opposite to the second direction;
a second driver that moves the pickup unit supporting the electronic component on the component support part in the second direction or in a direction opposite to the second direction;
a third driver that moves the wafer sheet within a third virtual plane that includes the wafer sheet;
The processing unit is moved in a third direction perpendicular to the direction in which the position of the electronic component is adjusted by the movement of the pickup unit, or in a direction opposite to the third direction, and the electronic component placed at the processing position is moved. , a fourth driver that adjusts the position of the processing unit in the third direction;
a deviation derivation unit that detects a deviation from a reference position and reference orientation of the electronic component acquired by the component support unit;
Controlling the first driver, the second driver, and the third driver, the component support section disposed at the pickup position, and the electronic component and the protrusion mechanism that are then acquired by the component support section. a control unit that adjusts the position of the
Equipped with
The transport unit includes a drive rotation mechanism that rotates the component holder to adjust the orientation of the electronic component acquired in the component holder with respect to the transport unit,
The control unit controls the second driver, the fourth driver, and the drive rotation mechanism based on the deviation detected by the deviation derivation unit, so that the electronic component is in a predetermined position relative to the processing unit at the processing position. so that it is arranged in the position and orientation of
Electronic component processing equipment. 9. The electronic component processing apparatus according to claim 8, wherein when viewed along the rotation axis of the rotary body, the second direction is perpendicular to a second imaginary straight line passing through the rotation center of the rotary body and the receiving position. , wherein the third direction is a direction along a first imaginary straight line passing through the center of rotation of the rotating body and the processing position. 9. The electronic component processing apparatus according to claim 8, wherein the component supporting section includes an imaging section that captures an image of the electronic component acquired, and the shift deriving section detects the shift based on the image captured by the imaging section. do. Electronic component processing equipment. a protrusion mechanism that protrudes an electronic component attached to a wafer sheet in a first direction perpendicular to the wafer sheet;
a pickup unit having a component support section that acquires the electronic component protruded in the first direction at a pickup position facing the wafer sheet;
a transport unit in which the component holder moves to a processing position together with the electronic component by rotation of a rotating body to which a component holder is attached that acquires the electronic component from the pickup unit at a receiving position;
a processing unit that performs a predetermined process on the electronic component placed at the processing position;
a first drive mechanism that moves the protrusion mechanism along a first virtual plane parallel to the wafer sheet;
a second drive mechanism that moves the pickup unit that supports the electronic component on the component support section along a second virtual plane parallel to the wafer sheet;
a third drive mechanism that moves the wafer sheet within a third virtual plane that includes the wafer sheet;
a deviation derivation unit that detects a deviation from a reference position and reference orientation of the electronic component acquired by the component support unit;
The first drive mechanism, the second drive mechanism, and the third drive mechanism are controlled so that the component support section disposed at the pick-up position and the electrons that are subsequently acquired by the component support section are controlled. a control unit that adjusts the position of the component and the protrusion mechanism;
Equipped with
The pickup unit includes a rotating member that moves the component support section located at the pickup position to a transfer position opposite to the component holding section located at the receiving position by one or more rotational operations; has
The transport unit includes a drive rotation mechanism that rotates the component holder to adjust the orientation of the electronic component acquired in the component holder with respect to the transport unit,
The control unit controls the second drive mechanism and the drive rotation mechanism based on the deviation detected by the deviation derivation unit, so that the electronic component is positioned at a predetermined position relative to the processing unit at the processing position. so that it is arranged in the direction of
Electronic component processing equipment. 12. The electronic component processing apparatus according to claim 11, wherein the component supporting section includes an imaging section that images the acquired electronic component, and the shift deriving section detects the shift based on the image captured by the imaging section. Electronic component processing equipment. a protrusion mechanism that protrudes an electronic component attached to a wafer sheet in a first direction perpendicular to the wafer sheet;
a pickup unit having a component support section that acquires the electronic component protruded in the first direction at a pickup position facing the wafer sheet;
a transport unit in which the component holder moves to a processing position together with the electronic component by rotation of a rotating body to which a component holder is attached that acquires the electronic component from the pickup unit at a receiving position;
a processing unit that performs a predetermined process on the electronic component placed at the processing position;
a second driver that moves the pickup unit supporting the electronic component on the component support part in a second direction parallel to the wafer sheet or in a direction opposite to the second direction;
a third driver that moves the wafer sheet within a third virtual plane that includes the wafer sheet;
The processing unit is moved in a third direction perpendicular to the direction in which the position of the electronic component is adjusted by the movement of the pickup unit, or in a direction opposite to the third direction, and the electronic component placed at the processing position is moved. , a fourth driver that adjusts the position of the processing unit in the third direction;
a deviation derivation unit that detects a deviation from a reference position and reference orientation of the electronic component acquired by the component support unit;
a control unit that controls the second driver and the third driver to adjust the position of the component supporter disposed at the pickup position and the electronic component to be subsequently acquired by the component supporter;
Equipped with
The transport unit includes a drive rotation mechanism that rotates the component holder to adjust the orientation of the electronic component acquired in the component holder with respect to the transport unit,
The control unit controls the second driver, the fourth driver, and the drive rotation mechanism based on the deviation detected by the deviation derivation unit, so that the electronic component is in a predetermined position relative to the processing unit at the processing position. so that it is arranged in the position and direction of
Electronic component processing equipment. 14. The electronic component processing apparatus according to claim 13, wherein when viewed along the rotation axis of the rotary body, the second direction is perpendicular to a second imaginary straight line passing through the rotation center of the rotary body and the receiving position. , wherein the third direction is a direction along a first imaginary straight line passing through the center of rotation of the rotating body and the processing position. 14. The electronic component processing apparatus according to claim 13, wherein the component supporting section includes an imaging section that images the electronic component acquired, and the shift deriving section detects the shift based on the image captured by the imaging section. , electronic component processing equipment.

Images